CN105977363B - A kind of method of LED substandard products lamp bead recycling - Google Patents
A kind of method of LED substandard products lamp bead recycling Download PDFInfo
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- CN105977363B CN105977363B CN201610522322.1A CN201610522322A CN105977363B CN 105977363 B CN105977363 B CN 105977363B CN 201610522322 A CN201610522322 A CN 201610522322A CN 105977363 B CN105977363 B CN 105977363B
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- led
- lamp bead
- die bond
- led support
- bonding
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- 239000011324 bead Substances 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000004064 recycling Methods 0.000 title claims abstract description 14
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000007789 sealing Methods 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims description 16
- 238000001035 drying Methods 0.000 claims description 8
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000010981 drying operation Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 241000218202 Coptis Species 0.000 claims description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 3
- 230000004907 flux Effects 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000005088 metallography Methods 0.000 claims description 3
- 239000005416 organic matter Substances 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 238000009864 tensile test Methods 0.000 claims 1
- 238000011084 recovery Methods 0.000 abstract description 6
- 241001419253 Spathiphyllum cochlearispathum Species 0.000 abstract description 3
- 239000004411 aluminium Substances 0.000 abstract description 3
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 230000007774 longterm Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- JTYRXXKXOULVAP-UHFFFAOYSA-N 1,2-dibromo-3-phenoxybenzene Chemical compound BrC1=CC=CC(OC=2C=CC=CC=2)=C1Br JTYRXXKXOULVAP-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 150000004074 biphenyls Chemical class 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
A kind of method of LED substandard products lamp bead recycling, method and step are：LED support is examined；LED support toasts；Die bond；Baking；Bonding wire；Data record；Sealing；Baking；Cutting；Sorting.Although LED, to environmental protection, can not have been used up as white flag light bulb and lost, the influence caused by LED may be long-term than conventional lights.LED also contains a large amount of aluminium, causes to may is that the energy used when manufacture and resource the reason of influence than general light bulb bigger.In view of increasing in recent years to the demand of LED light, recycling is come using LED than the service life of extension LED more important.Recovery method through the invention can avoid the above problem significantly.
Description
Technical field
The present invention relates to circuit field, especially a kind of method of LED substandard products lamp bead recycling.
Background technology
The product scope of LED applications is more and more extensive, including：TV screen, laboratory equipment, mobile phone, wrist-watch, calculating
The brake lamp of machine, home lighting, retailer's electric lighting, traffic sign and car.These are the certain applications of LED, and LED persistently takes
For tengsten lamp, it will there is more LED light in daily life
The characteristics of LED light source：In the product life cycle, LED is very environmentally friendly always, but if can recycle again sharp
With that will be more environmentally friendly.All it is recuperable more than 95% LED, waste recovery company can use recycling purchase at a low price old
LED illumination product.When LED do not include any harmful substance, just be classified meet RoHS.RoHS is in January, 2006 in Britain
Pass through, limits electric appliance and electronic equipment uses harmful substance.This limitation, which has been taken precautions against, sells mercurous, lead, cadmium, polybrominated biphenyls, more
The product of dibromodiphenyl ether and Cr VI.Due to meeting this standard, LED can carry out the processing as general light bulb and return
It receives.
Invention content
Present invention mainly solves the technical issues of be to provide a kind of method of LED substandard products lamp bead recycling.
A kind of method of LED substandard products lamp bead recycling, the method step are：
A.LED holders are examined:The size and record that LED support is measured by using Quadratic Finite Element measuring instrument, are surveyed using film thickness
Thickness and record that instrument measures holder electroplated layer are tried, whether has oxidative phenomena using metallography microscope sem observation holder and records；
B.LED holders toast:LED support is toasted using dryer, until holder is remained in injection moulding process
Steam completely remove, the organic matter of LED support remained on surface is removed using plasma-based cleaning machine, lifting bracket is in die bond
The bonding force of die bond in operation.
C. die bond:LED chip is bonded in LED crystal-bonding adhesives on LED support by automatic bonder and prevents from drying
Drying operation is carried out in room.
D. it toasts:Crystal-bonding adhesive is put into dryer and carries out secondary drying, until die bond is fully cured, then uses pulling force
Tester tests the thrust of die bond, and records test data, and the die bond for not meeting thrust requirements repeats step c.
E. bonding wire:Conductive region on pad and LED support in LED chip is welded using metal wire.It uses
Spun gold ball-shaped welded or wedge bonding are subjected to, and the wire is gold thread, aluminum steel, alloy wire or copper wire；
F. the size of pad is measured after the completion of welding and welds pulling force and the data of measurement is recorded, and is not met
Size requires and the pad of pulling tension requirements repeats step e；
G. sealing:Cup-shaped region is formed by LED support to be filled using LED encapsulation glue；When making white light LEDs
When lamp bead, the fluorescent powder that respective component is added according to required colour temperature, aobvious finger and each color lump is needed inside glue；
H. it toasts:LED is encapsulated into glue, drying operation is carried out by drying box, until glue is dried completely；
I. it cuts:According to the size of required LED lamp bead and lamp bead quantity, LED support is cut, obtains required ruler
Very little and quantity independent LED lamp bead unit.
J. it sorts:Each small lamp bulb of incision is classified by the parameter of voltage, colour temperature and luminous flux；Then will
Lamp bead with identical parameters carries out tape package.
Further, the dust-proof grade of operating environment carried out in the step g is ten thousand grades dust-proof.
Further, it is subjected to using automatic bonding equipment in the step e, automatic point is used in the step g
Glue machine is packaged glue padding.
Beneficial effects of the present invention are：
The LED substandard products lamp bead recovery and reuse technology projects that the present invention studies use Reflow Soldering skill equipment SMT-300, in addition
Panasonic Japan high speed refiner TTU-600, decomposes light source key technology, and the standard operation of compounding technique personnel can expire completely
LED recovering effects needed for sufficient company.
Most LED light contains a high proportion of nickel, and color LED lamp then contains a large amount of lead.In addition to this, arsenic content
It is exceeded.These substances are not only harmful to environment, can also influence the health of the mankind.Although LED than conventional lights to environmental protection, simultaneously
It cannot use up as white flag light bulb and lose, the influence caused by LED may be long-term.LED also contains a large amount of aluminium, causes
The reason of being influenced than general light bulb bigger, may is that the energy used when manufacture and resource.In view of in recent years to the need of LED light
It asks and increases, recycling is come using LED than the service life of extension LED more important.Recovery method through the invention can avoid significantly
The above problem.
Specific implementation mode
A kind of method of LED substandard products lamp bead recycling, method and step are：
A.LED holders are examined:The size and record that LED support is measured by using Quadratic Finite Element measuring instrument, are surveyed using film thickness
Thickness and record that instrument measures holder electroplated layer are tried, whether has oxidative phenomena using metallography microscope sem observation holder and records；
B.LED holders toast:LED support is toasted using dryer, until holder is remained in injection moulding process
Steam completely remove, the organic matter of LED support remained on surface is removed using plasma-based cleaning machine, lifting bracket is in die bond
The bonding force of die bond in operation.
C. die bond:LED chip is bonded in LED crystal-bonding adhesives on LED support by automatic bonder and prevents from drying
Drying operation is carried out in room.
D. it toasts:Crystal-bonding adhesive is put into dryer and carries out secondary drying, until die bond is fully cured, then uses pulling force
Tester tests the thrust of die bond, and records test data, and the die bond for not meeting thrust requirements repeats step c.
E. bonding wire:Conductive region on pad and LED support in LED chip is welded using metal wire.It uses
Spun gold ball-shaped welded or wedge bonding are subjected to, and the wire is gold thread, aluminum steel, alloy wire or copper wire；
F. the size of pad is measured after the completion of welding and welds pulling force and the data of measurement is recorded, and is not met
Size requires and the pad of pulling tension requirements repeats step e；
G. sealing:Cup-shaped region is formed by LED support to be filled using LED encapsulation glue；When making white light LEDs
When lamp bead, the fluorescent powder that respective component is added according to required colour temperature, aobvious finger and each color lump is needed inside glue；
H. it toasts:LED is encapsulated into glue, drying operation is carried out by drying box, until glue is dried completely；
I. it cuts:According to the size of required LED lamp bead and lamp bead quantity, LED support is cut, obtains required ruler
Very little and quantity independent LED lamp bead unit.
J. it sorts:Each small lamp bulb of incision is classified by the parameter of voltage, colour temperature and luminous flux；Then will
Lamp bead with identical parameters carries out tape package.
The dust-proof grade of operating environment carried out in step g is ten thousand grades dust-proof.
It is subjected to using automatic bonding equipment in step e, glue is packaged using automatic dispensing machine in the step g
Water padding.
Most LED light contains a high proportion of nickel, and color LED lamp then contains a large amount of lead.In addition to this, arsenic content
It is exceeded.These substances are not only harmful to environment, can also influence the health of the mankind.Although LED than conventional lights to environmental protection, simultaneously
It cannot use up as white flag light bulb and lose, the influence caused by LED may be long-term.LED also contains a large amount of aluminium, causes
The reason of being influenced than general light bulb bigger, may is that the energy used when manufacture and resource.In view of in recent years to the need of LED light
It asks and increases, recycling is come using LED than the service life of extension LED more important.Recovery method through the invention can avoid significantly
The above problem.
The LED substandard products lamp bead recovery and reuse technology projects that the present invention studies use Reflow Soldering skill equipment SMT-300, in addition
Panasonic Japan high speed refiner TTU-600, decomposes light source key technology, and the standard operation of compounding technique personnel can expire completely
LED recovering effects needed for sufficient company.
Claims (3)
1. a kind of method of LED substandard products lamp bead recycling, it is characterised in that：The method step is：
A. LED support is examined:The size and record that LED support is measured by using Quadratic Finite Element measuring instrument, use film thickness instrument
Whether the thickness and record for measuring holder electroplated layer, have oxidative phenomena using metallography microscope sem observation holder and record；
B. LED support toasts:LED support is toasted using dryer, until by holder in injection moulding process remaining water
Vapour completely removes, and is removed the organic matter of LED support remained on surface using plasma-based cleaning machine, and lifting bracket is operated in die bond
The bonding force of middle die bond；
C. die bond:LED chip is bonded in LED crystal-bonding adhesives on LED support by automatic bonder and is prevented in baking room
Carry out drying operation；
D. it toasts:Crystal-bonding adhesive is put into dryer and carries out secondary drying, until die bond is fully cured, then uses tensile test
Instrument tests the thrust of die bond, and records test data, and the die bond for not meeting thrust requirements repeats step c；
E. bonding wire:Conductive region on pad and LED support in LED chip is welded using metal wire；Use spun gold
Ball-shaped welded or wedge bonding are subjected to, and the wire is gold thread, aluminum steel, alloy wire or copper wire；
F. the size of pad is measured after the completion of welding and welds pulling force and the data of measurement is recorded, and does not meet size
It is required that and the pads of pulling tension requirements repeat step e；
G. sealing:Cup-shaped region is formed by LED support to be filled using LED encapsulation glue；When making white light LEDs lamp bead
When, glue the inside needs to add the fluorescent powder of respective component according to required colour temperature, aobvious finger and each color lump；
H. it toasts:LED is encapsulated into glue, drying operation is carried out by drying box, until glue is dried completely；
I. it cuts:According to the size of required LED lamp bead and lamp bead quantity, LED support is cut, obtain required size with
And the independent LED lamp bead unit of quantity；
J. it sorts:Each small lamp bulb of incision is classified by the parameter of voltage, colour temperature and luminous flux；Then will have
The lamp bead of identical parameters carries out tape package.
2. the method for LED substandard products lamp bead recycling according to claim 1, it is characterised in that：In the step g into
The dust-proof grade of capable operating environment is ten thousand grades dust-proof.
3. the method for LED substandard products lamp bead recycling according to claim 1, it is characterised in that：Make in the step e
It is subjected to automatic bonding equipment, glue padding is packaged using automatic dispensing machine in the step g.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610522322.1A CN105977363B (en) | 2016-07-01 | 2016-07-01 | A kind of method of LED substandard products lamp bead recycling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610522322.1A CN105977363B (en) | 2016-07-01 | 2016-07-01 | A kind of method of LED substandard products lamp bead recycling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105977363A CN105977363A (en) | 2016-09-28 |
| CN105977363B true CN105977363B (en) | 2018-09-21 |
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|---|---|---|---|
| CN201610522322.1A Active CN105977363B (en) | 2016-07-01 | 2016-07-01 | A kind of method of LED substandard products lamp bead recycling |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107029962A (en) * | 2017-04-26 | 2017-08-11 | 安徽欧瑞特照明有限公司 | A kind of LED support baking process |
| CN110137125B (en) * | 2018-02-08 | 2021-04-06 | 山东浪潮华光光电子股份有限公司 | Chip stripping method of LED lamp bead |
| CN110197625A (en) * | 2018-02-27 | 2019-09-03 | 王定锋 | A kind of COB display screen module separating recombinant formula |
| CN111048653A (en) * | 2019-12-26 | 2020-04-21 | 深圳市大柏光电子科技有限公司 | Process for improving brightness and output availability of LED lamp beads |
| CN111312883A (en) * | 2020-03-04 | 2020-06-19 | 孙文 | Method for packaging diode |
| CN111584701A (en) * | 2020-04-16 | 2020-08-25 | 慧明光电(深圳)有限公司 | Novel LED lamp bead packaging method |
| CN113013298B (en) * | 2021-02-26 | 2022-07-01 | 木林森股份有限公司 | Manufacturing process for assisting mounting of surface mounted lamp beads |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101532610A (en) * | 2009-04-17 | 2009-09-16 | 宋国兴 | High-power LED lamp and production process thereof |
| CN101894765B (en) * | 2010-05-24 | 2013-07-17 | 东莞市莱硕光电科技有限公司 | Manufacturing method of LED device |
| CN102339934A (en) * | 2011-10-18 | 2012-02-01 | 沈镇旭 | Practical white packaging technique implemented by preparing fluorescent powder (for heat dissipation and light attenuation resistance) from silica gel |
| CN102832317B (en) * | 2012-08-16 | 2015-12-16 | 东莞市钜晶光电有限公司 | Red-light LED method for packing |
| CN104993034B (en) * | 2015-07-21 | 2019-04-12 | 广东广晟光电科技有限公司 | A kind of LED encapsulation new process |
| CN105374921A (en) * | 2015-08-28 | 2016-03-02 | 安徽福恩光电科技有限公司 | LED lamp bead encapsulation technology |
| CN105304792A (en) * | 2015-09-30 | 2016-02-03 | 桂林健评环保节能产品开发有限公司 | Energy-saving LED manufacturing method |
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Denomination of invention: A Method for Recycling and Reusing LED Defective Beads Effective date of registration: 20231117 Granted publication date: 20180921 Pledgee: Guangde sub branch of Postal Savings Bank of China Ltd. Pledgor: ANHUI LIANGLIANG ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2023980066206 |