CN111312883A - Method for packaging diode - Google Patents
Method for packaging diode Download PDFInfo
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- CN111312883A CN111312883A CN202010142227.5A CN202010142227A CN111312883A CN 111312883 A CN111312883 A CN 111312883A CN 202010142227 A CN202010142227 A CN 202010142227A CN 111312883 A CN111312883 A CN 111312883A
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- baking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention belongs to the technical field of diode production, and particularly relates to a diode packaging method.A baking device used in the method comprises a bottom plate, wherein a baking oven, a bracket and a fixing frame are fixed at the top end of the bottom plate, a circular groove is formed in one side of the baking oven facing the fixing frame, a push rod motor is fixed at the top end of the fixing frame, a sealing disc is fixed at the output shaft end of the push rod motor, the sealing disc and the circular groove are in clearance fit, more than two placing pipes are rotatably arranged on one side of the sealing disc far away from the push rod motor, a telescopic rod is fixed in the circular groove, the free end of the telescopic rod is fixed on the sealing disc, and a driving motor is fixed at one end; the rotating sealing disc drives the placing tube to rotate along the axis of the sealing disc, so that the position of the light-emitting diode placed in the placing tube is changed continuously, and the heat absorbed by the light-emitting diode is uniform.
Description
Technical Field
The invention belongs to the technical field of diode production, and particularly relates to a diode packaging method.
Background
The diode is an electronic device made of semiconductor materials (silicon, selenium, germanium and the like), is the first semiconductor device in the world, and has unidirectional conductivity and rectification functions. Diodes are of a wide variety and are used primarily in electronic circuits and industrial products. After many years of continuous efforts of scientists, the application of the light emitting of the semiconductor diode is gradually popularized, the application range of the light emitting diode is gradually expanded, and the light emitting diode is a light source which meets the requirement of green illumination and is incomparable to common light emitting devices.
The direct-insert LED needs to use an NP light-emitting diode, the light-emitting diode needs to be subjected to steps of die bonding, baking and the like during production, and the problem of glue crack of the diode due to poor hardening is often caused by uneven baking temperature or long baking time during baking, so that the production efficiency of the diode is reduced.
Disclosure of Invention
In order to make up for the defects of the prior art, the baking device used in the method drives the placing tube to rotate along the axis of the sealing disc through the rotating sealing disc, so that the light-emitting diode placed in the placing tube continuously changes the position, the heat absorbed by the light-emitting diode is uniform, the heat absorption of the light-emitting diode is uniform, the baking effect of the light-emitting diode is consistent, the hardening effect of the light-emitting diode is ensured, the problem of glue crack caused by nonuniform baking temperature of glue is avoided, and the production efficiency of the light-emitting diode is improved.
The technical scheme adopted by the invention for solving the technical problems is as follows: the invention relates to a method for packaging a diode, which comprises the following steps:
s1: inspecting the bracket, wherein main test items comprise appearance size, thickness of an electroplating layer and oxidation phenomenon; baking the bracket, mainly removing residual water vapor in the injection molding process of the bracket; after the baking is finished and the cooling is finished, the support is subjected to plasma cleaning, wherein the plasma cleaning mainly comprises the steps of forming an electric arc by hydrogen and oxygen in the equipment, removing organic matters remained on the surface of the support and improving the bonding force of die bonding;
s2: bonding the chip on the bracket processed in the step S1 by using die bonding glue for an automatic die bonder, drying the die bonding glue to form good bonding between the chip and the bracket, and performing die bonding thrust test after the chip and the bracket are baked to ensure the effectiveness of die bonding;
s3: welding a bonding pad on a chip in the S2 and a conductive area on a bracket by using a metal wire, measuring the size and welding tension of a welding point after welding is finished, wherein most of LED dead lamps are caused by welding problems, and the probability of LED dead lamps is reduced by measuring the welding point;
s4: filling a cup-shaped area formed by the bracket in S3 with packaging glue, wherein a proper amount of fluorescent powder needs to be added into the glue, and the step is a step of generating white light and also a step of determining color temperature, color rendering index and color blocks;
s5: curing the packaging glue in the step S4 through a baking device, adjusting the temperature inside the baking device, and holding the baking time, so that the problem of poor hardening is avoided, and the phenomenon of color change of the glue is reduced;
s6: cutting the baked bracket in the S5 into independent small units of LED lamp beads from a plurality of connected sheets; sorting the cut small lamp beads through various parameters, and braiding and packaging the lamp beads with the same parameters;
the baking device used in the S5 comprises a bottom plate, wherein a baking oven, a bracket and a fixing frame are fixed at the top end of the bottom plate, a circular groove is formed in one side, facing the fixing frame, of the baking oven, a push rod motor is fixed at the top end of the fixing frame, a sealing disc is fixed at the output shaft end of the push rod motor, the sealing disc and the circular groove are in clearance fit, more than two placing pipes are rotatably installed on one side, away from the push rod motor, of the sealing disc, a telescopic rod is fixed in the circular groove, the free end of the telescopic rod is fixed on the sealing disc, a driving motor is fixed at one end, away from the push rod motor, of the baking oven, the output shaft of the driving motor is fixedly connected with the telescopic rod; when the LED is used, the NP light-emitting diode is needed by the direct-insert LED, the light-emitting diode needs to be subjected to steps of die bonding, baking and the like during production, and the problem of glue crack of the diode due to poor hardening is often caused by uneven baking temperature or long baking time during baking, so that the production efficiency of the diode is reduced; through the arrangement of the placing tube, an LED (light emitting diode) to be baked is placed into the placing tube, and then the work of the push rod motor is controlled through the controller, so that the push rod motor drives the sealing disc to move at the top end of the bracket, and the sealing disc enters the baking oven; the sealing disc and the circular groove are in clearance fit, so that the temperature of the baking oven cannot leak, and the controller starts the driving motor after the sealing disc enters the baking oven, so that the driving motor drives the telescopic rod to rotate, and the sealing disc rotates; the rotating sealing disc drives the placing tube to rotate along the axis of the sealing disc, so that the position of the light-emitting diode placed in the placing tube is continuously changed, and the heat absorbed by the light-emitting diode is uniform; the heat absorption of the light-emitting diode is uniform, so that the baking effect of the light-emitting diode is consistent, the hardening effect of the light-emitting diode is ensured, the problem of glue cracking caused by uneven baking temperature of glue is avoided, and the production efficiency of the light-emitting diode is improved; placing the pipe and rotating the setting and making place the pipe can not take place the rotation at the pivoted in-process, avoid placing the rotatory emitting diode collision condition that leads to of pipe and take place to the outward appearance deformation condition of having avoided emitting diode takes place.
Preferably, the side wall of the placing pipe is provided with more than two vent holes, and the placing pipe is of an eccentric structure; when the baking oven is used, the side wall of the placing tube is provided with the vent holes, so that hot air in the baking oven uniformly enters the placing tube, and the heating uniformity of the light-emitting diode is ensured; the placing pipe is set to be of an eccentric structure, so that the weight of the lower part of the placing pipe is large, the placing pipe keeps an initial position under the action of gravity, the placing pipe is prevented from deflecting under the action of rolling friction force, and the stability of the light emitting diode is guaranteed.
Preferably, a first telescopic cylinder and a second telescopic cylinder are fixed on the side wall of the inner cavity of the baking oven, which is far away from the push rod motor, the first telescopic cylinder is communicated with the second telescopic cylinder through a guide pipe, a heat preservation cover is movably mounted in the circular groove, the first telescopic cylinder penetrates through the heat preservation cover, the free end of the second telescopic cylinder is fixed on the side wall of the heat preservation cover, and a temperature sensor is arranged on the sealing disc; when the baking oven is used, the hardening speed of the colloid of the light-emitting diode is too high when the temperature in the baking oven is too high, so that the colloid is easy to crack; by arranging the first telescopic cylinder, when the temperature sensor on the sealing disc senses that the baking temperature is too high, the push rod motor is controlled to work through the controller, so that the push rod motor drives the sealing disc to move towards the inside of the circular groove, and the sealing disc extrudes the first telescopic cylinder; the first telescopic cylinder enables gas to enter the second telescopic cylinder in the process of being extruded, so that the second telescopic cylinder extends to drive the heat-preservation cover to move; the distance between the moving heat-insulating cover and the sealing disc is shortened, so that the sealing disc and the heat-insulating cover form a closed space, and redundant heat in the baking oven cannot enter the heat-insulating cover; the sealed space formed by the sealing disc and the heat-insulating cover enables the light-emitting diode on the placing tube to be in a relatively constant temperature range, and the problem of glue crack caused by overhigh temperature is avoided, so that the baking efficiency of the light-emitting diode is ensured.
Preferably, the heat-insulating cover is divided into an inner cover and an outer cover, the outer cover is made of iron metal materials, and the inner cover is made of heat-insulating plates; when the push rod motor is used, the light-emitting diode is hermetically heated after the heat-insulating cover and the sealing disc form a closed space, the light-emitting diode absorbs heat all the time to reduce the temperature of the closed space, and the sealing disc needs to be continuously moved to enable hot air to enter the closed space, so that the load of the push rod motor is increased; the outer cover absorbs heat generated by the baking oven through the matching of the inner cover and the outer cover, the outer cover conveys the absorbed heat to the inner cover, and the heat value transferred to the closed space is reduced through the heat insulation of the inner cover, so that the heat absorbed by the light-emitting diode and the heat transferred by the heat-insulating plate form balance, the sealing disc does not need to move frequently, and the burden of a push rod motor is reduced; meanwhile, the heat insulation plate is used for carrying out heat transmission on the closed space, so that the uniform heating of the light emitting diode is ensured, and the baking effect of the light emitting diode is improved.
Preferably, the side wall of the circular groove is provided with an annular groove, a limit ring is rotatably mounted in the annular groove, flow deflectors are fixed on the side wall of the limit ring, which is far away from the push rod motor, along the circumferential direction of the side wall at equal intervals, and more than two limit springs are fixed on one side of the seal disc, which faces the limit ring; when the sealing disc is used, the limiting spring on the sealing disc is in contact with the limiting ring, and the friction force of the limiting spring is utilized to drive the limiting ring to rotate while the sealing disc rotates, so that the flow deflector on the limiting ring rotates; the rotation of the flow deflector stirs the gas in the baking oven, so that the temperature of the gas in the baking oven is more uniform, and the hardening effect of the light-emitting diode is ensured; the limiting spring is arranged, so that transmission between the sealing disc and the limiting ring is guaranteed, and meanwhile, the sealing disc is not influenced in movement, so that the baking is guaranteed to be normally carried out.
Preferably, the flow deflector is of a triangular structure, the working surface of the flow deflector is obliquely arranged, and the working surface of the flow deflector is provided with an inclined groove; when the LED lamp is used, the flow deflector is obliquely arranged, so that the flow deflector drives gas to slightly rotate, and the phenomenon that the gas impacts the LED due to too high flow speed is avoided, and the position stability of the LED is ensured; the chute is arranged on the working surface of the flow deflector, so that the gas is driven to deflect in the rotating process of the flow deflector, the gas is exchanged in the baking furnace, the gas temperature in the baking furnace is kept consistent, and the baking effect of the light-emitting diode is improved.
The invention has the following beneficial effects:
1. according to the packaging method of the diode, the baking device used in the method drives the placing tube to rotate along the axis of the sealing disc through the rotating sealing disc, so that the position of the light-emitting diode placed in the placing tube is continuously changed, the heat absorbed by the light-emitting diode is uniform, the heat absorption of the light-emitting diode is uniform, the baking effect of the light-emitting diode is consistent, the hardening effect of the light-emitting diode is ensured, the problem of glue crack caused by nonuniform baking temperature of glue is avoided, and the production efficiency of the light-emitting diode is improved.
2. According to the packaging method of the diode, the baking device used in the method stirs the gas in the baking oven with the guide vanes, so that the temperature of the gas in the baking oven is kept consistent, and the baking effect of the diode is improved.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a flow chart of the present invention;
FIG. 2 is a three-dimensional view of a toasting apparatus for use in the present invention;
FIG. 3 is a partial cross-sectional view of a toasting apparatus for use in the present invention;
FIG. 4 is an enlarged view of a portion of FIG. 3 at A;
FIG. 5 is a three-dimensional view of a placement tube;
FIG. 6 is a schematic view of the position relationship between the guide vane and the stop collar;
in the figure: the device comprises a bottom plate 1, a baking oven 2, a bracket 3, a fixing frame 4, a circular groove 5, a push rod motor 6, a sealing disc 7, a placing pipe 8, a telescopic rod 9, a driving motor 10, a vent hole 11, a first telescopic cylinder 12, a second telescopic cylinder 13, a heat-insulating cover 14, a limiting ring 15, a flow deflector 16, a limiting spring 17 and a chute 18.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1 to 6, the method for packaging a diode according to the present invention includes the following steps:
s1: inspecting the bracket, wherein main test items comprise appearance size, thickness of an electroplating layer and oxidation phenomenon; baking the bracket, mainly removing residual water vapor in the injection molding process of the bracket; after the baking is finished and the cooling is finished, the support is subjected to plasma cleaning, wherein the plasma cleaning mainly comprises the steps of forming an electric arc by hydrogen and oxygen in the equipment, removing organic matters remained on the surface of the support and improving the bonding force of die bonding;
s2: bonding the chip on the bracket processed in the step S1 by using die bonding glue for an automatic die bonder, drying the die bonding glue to form good bonding between the chip and the bracket, and performing die bonding thrust test after the chip and the bracket are baked to ensure the effectiveness of die bonding;
s3: welding a bonding pad on a chip in the S2 and a conductive area on a bracket by using a metal wire, measuring the size and welding tension of a welding point after welding is finished, wherein most of LED dead lamps are caused by welding problems, and the probability of LED dead lamps is reduced by measuring the welding point;
s4: filling a cup-shaped area formed by the bracket in S3 with packaging glue, wherein a proper amount of fluorescent powder needs to be added into the glue, and the step is a step of generating white light and also a step of determining color temperature, color rendering index and color blocks;
s5: curing the packaging glue in the step S4 through a baking device, adjusting the temperature inside the baking device, and holding the baking time, so that the problem of poor hardening is avoided, and the phenomenon of color change of the glue is reduced;
s6: cutting the baked bracket in the S5 into independent small units of LED lamp beads from a plurality of connected sheets; sorting the cut small lamp beads through various parameters, and braiding and packaging the lamp beads with the same parameters;
the baking device used in the S5 comprises a bottom plate 1, wherein a baking oven 2, a bracket 3 and a fixing frame 4 are fixed at the top end of the bottom plate 1, a circular groove 5 is formed in one side, facing the fixing frame 4, of the baking oven 2, a push rod motor 6 is fixed at the top end of the fixing frame 4, a sealing disc 7 is fixed at the output shaft end of the push rod motor 6, the sealing disc 7 is in clearance fit with the circular groove 5, more than two placing pipes 8 are rotatably installed on one side, away from the push rod motor 6, of the sealing disc 7, a telescopic rod 9 is fixed in the circular groove 5, the free end of the telescopic rod 9 is fixed on the sealing disc 7, a driving motor 10 is fixed at one end, away from the push rod motor 6, of the baking oven 2, the output shaft of the driving motor 10 is fixedly connected with the telescopic rod 9; when the LED is used, the NP light-emitting diode is needed by the direct-insert LED, the light-emitting diode needs to be subjected to steps of die bonding, baking and the like during production, and the problem of glue crack of the diode due to poor hardening is often caused by uneven baking temperature or long baking time during baking, so that the production efficiency of the diode is reduced; through the arrangement of the placing tube 8, an LED (light emitting diode) to be baked is placed in the placing tube 8, and then the push rod motor 6 is controlled by the controller to work, so that the push rod motor 6 drives the sealing disc 7 to move at the top end of the bracket 3, and the sealing disc 7 enters the baking oven 2; the sealing disc 7 is in clearance fit with the circular groove 5, so that the temperature of the baking oven 2 cannot leak, and after the sealing disc 7 enters the baking oven 2, the controller starts the driving motor 10, so that the driving motor 10 drives the telescopic rod 9 to rotate, and the sealing disc 7 rotates; the rotating sealing disc 7 drives the placing tube 8 to rotate along the axis of the sealing disc 7, so that the position of the light-emitting diode placed in the placing tube 8 is changed continuously, and the heat absorbed by the light-emitting diode is uniform; the heat absorption of the light-emitting diode is uniform, so that the baking effect of the light-emitting diode is consistent, the hardening effect of the light-emitting diode is ensured, the problem of glue cracking caused by uneven baking temperature of glue is avoided, and the production efficiency of the light-emitting diode is improved; placing pipe 8 and rotating the setting and making place pipe 8 can not take place the rotation at the pivoted in-process, avoid placing the rotatory emitting diode collision condition that leads to of pipe 8 and take place to the outward appearance deformation condition of having avoided emitting diode takes place.
As a specific embodiment of the present invention, the sidewall of the placing tube 8 is provided with more than two vent holes 11, and the placing tube 8 has an eccentric structure; when in use, the side wall of the placing tube 8 is provided with the vent holes 11, so that hot air in the baking oven 2 can uniformly enter the placing tube 8, and the heating uniformity of the light emitting diode is ensured; to place pipe 8 and establish to eccentric structure and make the weight of placing 8 lower parts of pipe great, place pipe 8 and keep initial position under the action of gravity, avoid placing pipe 8 and take place to deflect under the effect of rolling friction power to light emitting diode's stability has been guaranteed.
As a specific embodiment of the invention, a first telescopic cylinder 12 and a second telescopic cylinder 13 are fixed on the side wall of the inner cavity of the baking oven 2 far away from the push rod motor 6, the first telescopic cylinder 12 is communicated with the second telescopic cylinder 13 through a conduit, a heat-insulating cover 14 is movably mounted in the circular groove 5, the first telescopic cylinder 12 penetrates through the heat-insulating cover 14, the free end of the second telescopic cylinder 13 is fixed on the side wall of the heat-insulating cover 14, and a temperature sensor is arranged on the sealing disc 7; when the baking oven is used, the hardening speed of the colloid of the light-emitting diode is too high when the temperature in the baking oven 2 is too high, so that the colloid is easy to crack; by arranging the first telescopic cylinder 12, when the temperature sensor on the sealing disc 7 senses that the baking temperature is too high, the push rod motor 6 is controlled to work through the controller, so that the push rod motor 6 drives the sealing disc 7 to move towards the inside of the circular groove 5, and the sealing disc 7 extrudes the first telescopic cylinder 12; the first telescopic cylinder 12 enables gas to enter the second telescopic cylinder 13 in the process of being extruded, so that the second telescopic cylinder 13 extends to drive the heat-insulating cover 14 to move; the distance between the moving heat preservation cover 14 and the sealing disc 7 is shortened, so that the sealing disc 7 and the heat preservation cover 14 form a closed space, and therefore redundant heat in the baking oven 2 cannot enter the heat preservation cover 14; the sealed space formed by the sealing disc 7 and the heat-insulating cover 14 enables the light-emitting diode on the placing tube 8 to be in a relatively constant temperature range, so that the problem of glue crack caused by overhigh temperature is avoided, and the baking efficiency of the light-emitting diode is ensured.
As a specific embodiment of the invention, the heat-insulating cover 14 is divided into an inner cover and an outer cover, the outer cover is made of iron metal material, and the inner cover is made of heat-insulating plate; when the push rod motor 6 is used, after the heat-insulating cover 14 and the sealing disc 7 form a closed space, the light-emitting diode is sealed and heated, the light-emitting diode absorbs heat all the time to reduce the temperature of the closed space, and the sealing disc 7 needs to be moved continuously to enable hot air to enter the closed space, so that the burden of the push rod motor 6 is increased; the outer cover absorbs heat generated by the baking oven 2 through the matching of the inner cover and the outer cover, the outer cover conveys the absorbed heat to the inner cover, and the heat value transferred to the closed space is reduced through the heat insulation of the inner cover, so that the heat absorbed by the light-emitting diode and the heat transferred by the heat-insulating plate form balance, the sealing disc 7 does not need to move frequently, and the burden of the push rod motor 6 is reduced; meanwhile, the heat insulation plate is used for carrying out heat transmission on the closed space, so that the uniform heating of the light emitting diode is ensured, and the baking effect of the light emitting diode is improved.
As a specific embodiment of the present invention, the side wall of the circular groove 5 is provided with an annular groove, a limit ring 15 is rotatably installed in the annular groove, flow deflectors 16 are equidistantly fixed on the side wall of the limit ring 15 away from the push rod motor 6 along the circumferential direction of the side wall, and more than two limit springs 17 are fixed on one side of the seal disc 7 facing the limit ring 15; when the sealing disc 7 is used, the limiting spring 17 on the sealing disc 7 is in contact with the limiting ring 15, and the limiting ring 15 is driven to rotate by using the friction force of the limiting spring 17 while the sealing disc 7 rotates, so that the flow deflector 16 on the limiting ring 15 rotates; the rotation of the flow deflector 16 stirs the gas in the baking oven 2, so that the temperature of the gas in the baking oven 2 is more uniform, and the hardening effect of the light emitting diode is ensured; the arrangement of the limiting spring 17 not only ensures the transmission between the sealing disc 7 and the limiting ring 15, but also ensures that the movement of the sealing disc 7 is not influenced, thereby ensuring the normal baking.
As a specific embodiment of the present invention, the flow deflector 16 is a triangular structure, the working surface of the flow deflector 16 is installed in an inclined manner, and the working surface of the flow deflector 16 is provided with an inclined groove 18; when the LED lamp is used, the flow deflector 16 is obliquely arranged, so that the flow deflector 16 drives gas to slightly rotate, and the phenomenon that the gas impacts the LED due to too high flow speed is avoided, and the position stability of the LED is ensured; the working surface of the flow deflector 16 is provided with the chute 18 to drive the gas to deflect in the rotating process of the flow deflector 16, so that the gas is exchanged in the baking oven 2, the gas temperature in the baking oven 2 is kept consistent, and the baking effect of the light emitting diode is improved.
When the LED is used, the NP light-emitting diode is needed by the direct-insert LED, the light-emitting diode needs to be subjected to steps of die bonding, baking and the like during production, and the problem of glue crack of the diode due to poor hardening is often caused by uneven baking temperature or long baking time during baking, so that the production efficiency of the diode is reduced; through the arrangement of the placing tube 8, an LED (light emitting diode) to be baked is placed in the placing tube 8, and then the push rod motor 6 is controlled by the controller to work, so that the push rod motor 6 drives the sealing disc 7 to move at the top end of the bracket 3, and the sealing disc 7 enters the baking oven 2; the sealing disc 7 is in clearance fit with the circular groove 5, so that the temperature of the baking oven 2 cannot leak, and after the sealing disc 7 enters the baking oven 2, the controller starts the driving motor 10, so that the driving motor 10 drives the telescopic rod 9 to rotate, and the sealing disc 7 rotates; the rotating sealing disc 7 drives the placing tube 8 to rotate along the axis of the sealing disc 7, so that the position of the light-emitting diode placed in the placing tube 8 is changed continuously, and the heat absorbed by the light-emitting diode is uniform; the heat absorption of the light-emitting diode is uniform, so that the baking effect of the light-emitting diode is consistent, the hardening effect of the light-emitting diode is ensured, the problem of glue cracking caused by uneven baking temperature of glue is avoided, and the production efficiency of the light-emitting diode is improved; placing pipe 8 and rotating the setting and making place pipe 8 can not take place the rotation at the pivoted in-process, avoid placing the rotatory emitting diode collision condition that leads to of pipe 8 and take place to the outward appearance deformation condition of having avoided emitting diode takes place.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A method for packaging a diode is characterized by comprising the following steps:
s1: inspecting the bracket, wherein main test items comprise appearance size, thickness of an electroplating layer and oxidation phenomenon; baking the bracket, mainly removing residual water vapor in the injection molding process of the bracket; after the baking is finished and the cooling is finished, the bracket is cleaned by plasma;
s2: bonding the chip on the bracket processed in the step S1 by using die bonding glue for an automatic die bonder, drying the die bonding glue to form good bonding between the chip and the bracket, and performing die bonding thrust test after the chip and the bracket are baked;
s3: welding a pad on the chip in the S2 and a conductive area on the bracket by using a metal wire, and measuring the size and welding tension of a welding point after welding;
s4: filling a cup-shaped area formed by the bracket in the S3 with packaging glue, wherein a proper amount of fluorescent powder needs to be added into the glue;
s5: curing the packaging glue in the step S4 through a baking device, adjusting the temperature inside the baking device, and holding the baking time to avoid the problem of poor hardening;
s6: cutting the baked bracket in the S5 into independent small units of LED lamp beads from a plurality of connected sheets; sorting the cut small lamp beads through various parameters, and braiding and packaging the lamp beads with the same parameters;
wherein, the baking equipment who uses among S5 includes bottom plate (1), bottom plate (1) top is fixed with toast stove (2), bracket (3) and mount (4), toast stove (2) and be equipped with circular recess (5) towards one side of mount (4), mount (4) top is fixed with push rod motor (6), the output shaft end of push rod motor (6) is fixed with sealed dish (7), sealed dish (7) are clearance fit with circular recess (5), one side rotation that push rod motor (6) were kept away from to sealed dish (7) is installed and is placed pipe (8) more than two, circular recess (5) internal fixation has telescopic link (9), the free end of telescopic link (9) is fixed on sealed dish (7), the one end that toast stove (2) kept away from push rod motor (6) is fixed with driving motor (10), the output shaft and telescopic link (9) fixed connection of driving motor (10), the base plate (1) is provided with a controller, and the controller is used for controlling the baking device to work.
2. The method of claim 1, wherein: the side wall of the placing pipe (8) is provided with more than two vent holes (11), and the placing pipe (8) is of an eccentric structure.
3. The method of claim 1, wherein: bake out furnace (2) inner chamber and be fixed with a telescopic tube (12) and No. two telescopic tube (13) on keeping away from the lateral wall of push rod motor (6), telescopic tube (12) and No. two telescopic tube (13) pass through the pipe intercommunication, movable mounting has heat preservation cover (14) in circular slot (5), telescopic tube (12) pass heat preservation cover (14), the free end of No. two telescopic tube (13) is fixed on heat preservation cover (14) lateral wall, be equipped with temperature sensor on sealed dish (7).
4. A method for packaging a diode according to claim 3, wherein: the heat-insulating cover (14) is divided into an inner cover and an outer cover, the outer cover is made of iron metal materials, and the inner cover is made of heat-insulating plates.
5. A method for packaging a diode according to claim 3, wherein: the lateral wall of circular recess (5) is equipped with the ring channel, and spacing ring (15) are installed to the ring channel internal rotation, be fixed with water conservancy diversion piece (16) along its circumference equidistance on the lateral wall of push rod motor (6) is kept away from in spacing ring (15), sealed dish (7) are fixed with spacing spring (17) more than two towards one side of spacing ring (15).
6. The method for packaging a diode according to claim 5, wherein: the flow deflector (16) is of a triangular structure, the working surface of the flow deflector (16) is obliquely arranged, and the working surface of the flow deflector (16) is provided with a chute (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010142227.5A CN111312883A (en) | 2020-03-04 | 2020-03-04 | Method for packaging diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010142227.5A CN111312883A (en) | 2020-03-04 | 2020-03-04 | Method for packaging diode |
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