CN114994449A - Electronic material compatibility testing device and method and computer equipment - Google Patents
Electronic material compatibility testing device and method and computer equipment Download PDFInfo
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- CN114994449A CN114994449A CN202210839763.XA CN202210839763A CN114994449A CN 114994449 A CN114994449 A CN 114994449A CN 202210839763 A CN202210839763 A CN 202210839763A CN 114994449 A CN114994449 A CN 114994449A
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- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
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Abstract
The application relates to a device and a method for testing compatibility of electronic materials and computer equipment. The electronic material is prepared on the cleaned electrode plate, the electrode plate comprises comb-shaped electrodes with multiple space types, the conduction bandwidths of the comb-shaped electrodes with different space types are different, the conduction band gaps of the comb-shaped electrodes with different space types are different, and the conduction bandwidth of at least one comb-shaped electrode in the comb-shaped electrodes with multiple space types is smaller than a preset standard bandwidth and the conduction band gap is smaller than the preset standard band gap; the compatibility testing device comprises a cleaned electrode plate and a gold finger; and the cleaned electrode plate is connected with the golden finger and used for carrying out compatibility test on the electronic material so as to obtain a compatibility test result of the electronic material. The device can be used for carrying out compatibility test on electronic materials in the printed circuit.
Description
Technical Field
The present disclosure relates to printed circuit technologies, and in particular, to a device and a method for testing compatibility of electronic materials, and a computer device.
Background
With the development of electronic products, printed circuits are also becoming more miniaturized and intensive. Various types of electronic materials, including interconnect materials, process materials, bonding materials, protective materials, and component materials, are fabricated onto the electrode plates during the assembly of the printed circuit. The printed circuit reliability is reduced due to incompatibility of physical and chemical properties between various electronic materials. For example, the incompatibility of the chemical properties between the flux from manufacturer a and the solder paste from manufacturer B may cause failure of the printed circuit, such as corrosion, burning, leakage, or open circuit. Therefore, how to perform compatibility tests on electronic materials in printed circuits is a technical problem to be solved in the field.
Disclosure of Invention
In view of the above, it is necessary to provide an electronic material compatibility testing apparatus, method and computer device capable of performing compatibility testing on electronic materials in printed circuits.
In a first aspect, the present application provides an apparatus for testing compatibility of electronic materials. The electronic material is prepared on a cleaned electrode plate, the electrode plate comprises comb-shaped electrodes with multiple space types, the conduction bandwidths of the comb-shaped electrodes with different space types are different, the conduction band gaps of the comb-shaped electrodes with different space types are different, and the conduction bandwidth of at least one comb-shaped electrode in the comb-shaped electrodes with multiple space types is smaller than a preset standard bandwidth and the conduction band gap is smaller than a preset standard band gap; the compatibility testing device comprises the cleaned electrode plate and a golden finger;
the cleaned electrode plate is connected with the golden finger and used for carrying out compatibility test on the electronic material so as to obtain a compatibility test result of the electronic material.
In one embodiment, the compatibility testing apparatus further includes a cover plate for covering the comb-shaped electrode on the electrode plate.
In one embodiment, the compatibility testing apparatus further includes a connection medium for detachably connecting the electrode plate and the cover plate.
In one embodiment, the two ends of the electrode plate are provided with tenon-and-mortise structures, and the cover plate covers the comb-shaped electrode on the electrode plate through the tenon-and-mortise structures.
In one embodiment, the thickness of the electrode plate is adjusted by the thickness of the mortise and tenon structure.
In a second aspect, the present application further provides a method for testing compatibility of an electronic material. The method comprises the following steps:
the method further includes the step of supplying power to the golden finger in the compatibility testing device for a preset time period so as to perform compatibility testing on the electronic material, and obtain a compatibility testing result of the electronic material.
In one embodiment, the performing the compatibility test on the electronic material to obtain the compatibility test result of the electronic material includes:
performing compatibility test on the electronic material to determine the insulation between the electronic materials of the electrode plate prepared with the electronic material, the corrosion degree of the comb-shaped electrode on the electrode plate prepared with the electronic material and the dendritic crystal growth condition;
obtaining the compatibility test result according to the insulation property, the corrosion degree and the dendritic crystal growth condition.
In one embodiment, the determining the dendritic growth of the comb-shaped electrode on the electrode plate prepared with the electronic material includes:
and determining the dendritic growth of the comb-shaped electrode on the electrode plate prepared with the electronic material by using X rays.
In a third aspect, the application also provides a computer device. The computer device comprises a memory storing a computer program and a processor implementing the steps of any of the above methods when the processor executes the computer program.
In a fourth aspect, the present application further provides a computer-readable storage medium. The computer-readable storage medium having stored thereon a computer program which, when executed by a processor, implements the steps of any of the methods described above.
The compatibility testing device comprises the cleaned electrode plate and the golden finger, and the cleaned electrode plate is connected with the golden finger and used for carrying out compatibility testing on the electronic material so as to obtain a compatibility testing result of the electronic material. Wherein, this electronic material prepares on the plate electrode after wasing, because this plate electrode includes the comb shape electrode of multiple interval type, the conducting band width between the comb shape electrode of different interval types is different, the conducting band gap between the comb shape electrode of different interval types is different, and the conducting band width of at least one comb shape electrode in the comb shape electrode of this multiple interval type is less than predetermineeing standard bandwidth and the conducting band gap is less than predetermineeing standard band gap, consequently, the compatibility testing arrangement that this application provided can be applicable to miniaturation, intensification printed circuit, thereby carry out the compatibility test to the electronic material in the printed circuit, in order to obtain this electronic material's compatibility test result.
Drawings
FIG. 1 is a schematic diagram of an apparatus for testing compatibility of electronic materials in an embodiment of the present application;
FIG. 2 is a schematic flow chart of wave soldering;
FIG. 3 is a schematic flow chart of reflow soldering;
FIG. 4 is a schematic view of a cover plate in an embodiment of the present application;
FIG. 5 is a sample schematic view of a printed circuit in an embodiment of the present application;
FIG. 6 is a diagram illustrating a compatibility testing apparatus according to an embodiment of the present application;
FIG. 7 is a schematic side view of an electrode plate in an embodiment of the present application;
FIG. 8 is a schematic diagram of a mortise and tenon structure in the embodiment of the application;
fig. 9 is an application environment diagram of a compatibility testing method for an electronic material according to an embodiment of the present application;
FIG. 10 is a schematic flowchart illustrating a process of obtaining a compatibility test result of an electronic material according to an embodiment of the present application;
FIG. 11 is a schematic view of dendrite growth;
fig. 12 is an internal structural diagram of a computer device in the embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
Along with the continuous development of the functions of electronic products towards the direction of integration, intellectualization and precision, the sizes of electronic components and electronic assemblies are also continuously developed towards the direction of miniaturization and intensification. In the integrated circuit assembly process, i.e., in the assembly of printed circuits, various electronic materials are used, including interconnect materials, process materials, adhesive materials, protective materials, electronic component materials, and the like.
On one hand, the printed circuit usually uses different electronic materials from multiple manufacturers during the assembly process, so that the final printed circuit fails due to incompatibility of physical and/or chemical properties between various electronic materials, and the reliability of the printed circuit is reduced. For example, stresses resulting from physical property mismatches in electronic materials can cause the components of the printed circuit to weaken, delaminate, and even crack; due to the incompatibility of the chemical properties of the electronic materials, chemical reactions between the electronic materials can cause the electronic materials to be denatured, and further cause a series of safety and quality problems of corrosion, board burning, leakage, open circuit and the like of printed circuits. For example, if the flux from manufacturer a and the solder paste from manufacturer B are not chemically compatible, corrosion, burning, leakage, open circuit, and cracking of the printed circuit may be less reliable.
On the other hand, the integration, intelligence and precision of integrated circuits lead to an increasing trend of high density and narrow pitch layouts on printed circuits, and also to the problem of lower reliability due to incompatibility of electronic materials.
To avoid such phenomena, compatibility tests have to be performed on the electronic materials in the printed circuit before the printed circuit is put into production. However, at present, technical research on compatibility test of electronic materials is still lacked, and a system evaluation method and standard for developing compatibility test on electronic materials of printed circuits are also lacked, so that potential quality hidden troubles caused by compatibility problems cannot be avoided when enterprises screen electronic materials.
In summary, how to perform compatibility testing on electronic materials in printed circuits is an urgent technical problem to be solved in the field, so as to help enterprises screen electronic materials and identify electronic materials with poor compatibility.
In view of the above, it is necessary to provide an electronic material compatibility testing apparatus, method and computer device capable of performing compatibility testing on electronic materials in printed circuits.
The compatibility testing device provided by the embodiment comprises the cleaned electrode plate and the golden finger, wherein the cleaned electrode plate is connected with the golden finger and used for carrying out compatibility testing on the electronic material so as to obtain a compatibility testing result of the electronic material. The electronic material is prepared on the cleaned electrode plate, the electrode plate comprises comb-shaped electrodes with multiple spacing types, the conducting bandwidths between the comb-shaped electrodes with different spacing types are different, the conducting band gaps between the comb-shaped electrodes with different spacing types are different, and the conducting bandwidth of at least one comb-shaped electrode in the comb-shaped electrodes with multiple spacing types is smaller than a preset standard bandwidth and the conducting band gap is smaller than the preset standard band gap.
Referring to fig. 1, fig. 1 is a schematic diagram of a compatibility testing apparatus for electronic materials according to an embodiment of the present disclosure. In the present embodiment, the electronic material compatibility test device includes 5 pitch types of comb electrodes A, B, C, D, E. Of course, the present embodiment does not limit the number of comb-shaped electrodes with multiple pitch types.
The comb-shaped electrodes with different space types have different conductive bandwidths, the conductive band gaps between the comb-shaped electrodes with different space types are different, and the conductive bandwidth of at least one comb-shaped electrode in the comb-shaped electrodes with multiple space types is smaller than a preset standard bandwidth and the conductive band gap is smaller than the preset standard band gap. The conductive tape can be understood as a bonding wire on the electrode plate, i.e., a copper wire on the electrode plate. Here, the preset standard bandwidth and the preset standard band gap are both 0.318mm as an example, the conductive bandwidth and the conductive band gap of the conventional printed circuit are usually more than 0.318mm at present, that is, the conductive bandwidth and the conductive band gap of at least one comb-shaped electrode, such as the comb-shaped electrode E, in the present application are smaller than 0.318mm, so as to meet the requirement of a smaller and smaller pitch in the present printed circuit, so as to adapt to a narrow-pitch and high-density printed circuit, thereby completing the compatibility test of electronic materials in the intensive and miniaturized printed circuit.
Specifically, with continuing reference to fig. 1, the electrode plate in the present application is made of FR4.0 epoxy glass fiber board, the thickness of the electrode plate is 1.5 mm ± 0.1mm, the copper wire covered on the surface is a bare copper surface without any treatment, and the whole electrode plate is subjected to organic solder mask (OSP) treatment.
Illustratively, the width of the conductive strip of the comb-shaped electrode a in fig. 1 is 0.4mm, the gap of the conductive strip is 0.5mm, the length of the conductive strip is 17.75mm ± 0.05mm, and the length of the overlapped part of the conductive strips is 15.60mm ± 0.05 mm. The width of the conductive strip of the comb-shaped electrode B in FIG. 1 is 0.318mm, the gap of the conductive strip is 0.318mm, the length of the conductive strip is 17.75mm + -0.05 mm, and the length of the overlapped part of the conductive strips is 15.60mm + -0.05 mm. The width of the conductive strip of the comb-shaped electrode C in fig. 1 is 0.2mm, the gap of the conductive strip is 0.2mm, the length of the conductive strip is 17.75mm ± 0.05mm, and the length of the overlapped part of the conductive strips is 15.60mm ± 0.05 mm. The width of the conductive strip of the comb-shaped electrode D in fig. 1 is 0.15mm, the gap of the conductive strip is 0.15mm, the length of the conductive strip is 8.87mm ± 0.05mm, and the length of the overlapped part of the conductive strips is 7.80mm ± 0.05 mm. The width of the conductive strip of the comb-shaped electrode E in fig. 1 is 0.1mm, the gap of the conductive strip is 0.1mm, the length of the conductive strip is 8.87mm ± 0.05mm, and the length of the overlapped part of the conductive strips is 7.80mm ± 0.05 mm.
The width of each conductive strip refers to the diameter width of each conductive strip, the gap of each conductive strip refers to the distance between two adjacent conductive strips, the length of each conductive strip refers to the length of each conductive strip, and the length of the overlapping part of each conductive strip refers to the overlapping length between two adjacent conductive strips.
It can be seen that the conductive bandwidth, the conductive strip gap, the conductive strip length, and the conductive strip overlap length of comb-shaped electrode A, B, C, D, E are all sequentially reduced, and the conductive bandwidth and the conductive strip gap of comb-shaped electrode C, D, E are both less than 0.318 mm. That is, the conduction bandwidths between the comb-shaped electrodes with different pitch types are different, the conduction band gaps between the comb-shaped electrodes with different pitch types are different, and the conduction bandwidth of at least one comb-shaped electrode in the comb-shaped electrodes with multiple pitch types is smaller than the preset standard bandwidth and the conduction band gap is smaller than the preset standard band gap.
With continued reference to fig. 1, each comb-shaped electrode includes a plurality of first electrodes and a plurality of second electrodes. Taking the comb-shaped electrode a as an example, the comb-shaped electrode a includes a first electrode 1, a first electrode 3, and a first electrode 5, and the first electrode 1, the first electrode 3, and the first electrode 5 can be understood as positive electrodes of the comb-shaped electrode a; the comb-shaped electrode a further includes a second electrode 2 and a second electrode 4, and the second electrode 2 and the second electrode 4 may be understood as a negative electrode of the comb-shaped electrode a. In this case, for the comb-shaped electrode a, one of the first electrode and one of the second electrode may be sequentially energized, so as to acquire a plurality of sets of power data between the first electrode 1 and the second electrode 2, between the first electrode 1 and the second electrode 4, between the first electrode 3 and the second electrode 2, between the first electrode 3 and the second electrode 4, between the first electrode 5 and the second electrode 2, and between the first electrode 5 and the second electrode 4, and perform a compatibility test on the electronic material, so as to obtain a compatibility test result of the electronic material, and improve accuracy of the compatibility test result.
In this embodiment, the cleaning of the electrode plate is to clean dirt, an oil film, and the like on the electrode plate, and eliminate interference of the dirt, the oil film, and the like on a subsequent compatibility test. One way this can be achieved is by cleaning the electrode plates as required by IPC-TM-6502.6.3.3 standards. Specifically, the electrode plate can be cleaned according to the following procedures S1-S9. It should be noted that, the actual cleaning process of the electrode plate may not completely follow the flow of S1 to S9, and this embodiment is not limited.
S1, the electrode plate is placed into a beaker, and isopropanol is poured into the beaker to soak the electrode plate for 10-15 minutes.
And S2, after soaking, brushing the electrode plate by using a brush and isopropanol. In the process of brushing the electrode plate, the number of times of brushing the brush back and forth is not less than 5-6 times, and the electrode plate is continuously put into isopropanol after the brushing is finished.
And S3, washing the electrode plate by using a large amount of tap water after the electrode plate is brushed by using isopropanol.
And S4, washing the electrode plate by using tap water until the electrode plate is preliminarily cleaned, pouring washing powder and washing the electrode plate by using a brush. In the process of cleaning the electrode plate by using washing powder, the number of times of brushing back and forth by the brush is not less than 5-6 times, then the electrode plate after being brushed is put into a clean beaker, and a large amount of tap water is used for washing the electrode plate until the washing powder on the electrode plate is washed clean.
S5, prepare 3 beakers, rinse the beakers clean with deionized water (pure water), and pour 300mL of deionized water into each beaker.
And S6, putting the electrode plates washed cleanly by the S4 into 3 beakers filled with deionized water in sequence, and washing back and forth.
And S7, placing the electrode plate cleaned by the S6 into a beaker filled with absolute ethyl alcohol for dehydration.
And S8, baking the dehydrated electrode plate in an oven at 85 ℃ for 30 min.
And S9, storing the baked electrode plate in a dryer, and cooling for later use.
Further, an electronic material needs to be prepared on the cleaned electrode plate. The preparation process is a process for preparing a sample based on the cleaned electrode plate so as to obtain a printed circuit sample. That is, the assembly process flow of the printed circuit in the actual production is simulated, and the desired electronic materials are sequentially prepared on the electrode plate using Surface Mount Technology (SMT) or Through Hole Technology (THT). It is understood that the printed circuit sample is an electrode plate prepared with an electronic material.
Specifically, a steel mesh matched with the electrode plate is used for printing lead-free solder paste on the electrode plate, soldering flux is directly sprayed on the electrode plate, and wave soldering or reflow soldering is carried out according to requirements. Fig. 2 is a schematic flow chart of wave soldering, and fig. 3 is a schematic flow chart of reflow soldering. The process of preparing the electronic material on the cleaned electrode plate is not particularly limited in this embodiment, and may be prepared as needed.
It should be noted that the prepared printed circuit sample needs to be pre-processed before the compatibility test is actually started. Specifically, the prepared printed circuit sample was placed under reference conditions for 24 h. Wherein the reference conditions are that the temperature is 20-30 ℃, and the relative humidity is as follows: 45% RH-55% RH. The pretreatment is to eliminate the influence of the environment on the compatibility test and improve the accuracy of the compatibility test.
Referring to fig. 1, the black keys on the upper and lower portions of the electrode plates in fig. 1 are gold fingers (edge connectors), the gold fingers are used for connecting the electrode plates, and can connect circuits and transmit signals, and the cleaned electrode plates are connected with the gold fingers. Specifically, the electrodes of the comb-shaped electrode A, B, C, D, E are all connected with the gold finger, and the gold finger can be inserted into the corresponding slot to test the gold finger after power is supplied to the gold finger, so that the compatibility test is performed on the electronic material to obtain the compatibility test result of the electronic material.
The application provides a compatibility testing arrangement, compatibility testing arrangement include plate electrode, golden finger after the washing, the plate electrode after the washing is connected with the golden finger for carry out the compatibility test to electronic material, in order to obtain electronic material's compatibility test result. The electronic material is prepared on the cleaned electrode plate, the electrode plate comprises comb-shaped electrodes with various spacing types, the conduction bandwidths between the comb-shaped electrodes with different spacing types are different, the conduction band gaps between the comb-shaped electrodes with different spacing types are different, and the conduction bandwidth of at least one comb-shaped electrode in the comb-shaped electrodes with various spacing types is smaller than a preset standard bandwidth and the conduction band gap is smaller than the preset standard band gap.
Fig. 4 is a schematic view of a cover plate in an embodiment of the present application. As shown in fig. 4, optionally, the compatibility testing apparatus further includes a cover plate, and the cover plate is used to cover the comb-shaped electrode on the electrode plate.
In the present embodiment, a glass cover plate is used for description, but it is needless to say that the cover plate may be made of other materials, for example, ceramics, plastics, and the like. The glass cover plate is placed on the electrode plate, and the size of the glass cover plate can just cover the comb-shaped electrode A, B, C, D, E in fig. 1, but can not cover the golden finger in fig. 1.
In this embodiment, the comb-shaped electrodes on the electrode plate are covered by the glass cover plate, so as to simulate the situation that the chemical substances such as flux are not completely volatilized in the production process of the printed circuit in the integrated circuit, and the result of the compatibility test performed on the basis is more accurate.
The compatibility testing device in the embodiment further comprises a cover plate, wherein the cover plate is used for covering the comb-shaped electrodes on the electrode plate, the situation that high-residue electronic materials exist in an integrated circuit is simulated, namely the situation that chemical substances such as welding flux are not completely volatilized in the production process of a printed circuit is simulated, and the accuracy of the compatibility testing result is improved.
FIG. 5 is a sample schematic of a printed circuit in an embodiment of the present application. In this embodiment, a schematic diagram of a printed circuit sample is shown in fig. 5, and various electronic materials, such as soldering flux, solder wires, cleaning agent, conformal coating, and fixing glue, are sequentially prepared on the electrode plate according to the sequence requirement, and are fully cured, and then the glass cover plate is covered on the electrode plate.
Fig. 6 is a schematic diagram of a compatibility testing apparatus in an embodiment of the present application. As shown in fig. 6, optionally, the compatibility testing apparatus further includes a connection medium, and the connection medium is used for detachably connecting the electrode plate and the cover plate.
In this embodiment, the compatibility testing apparatus further includes a connection medium, such as a high temperature adhesive tape. The electrode plate and the cover plate are fixed by the high-temperature adhesive tape so as to complete detachable connection between the electrode plate and the cover plate. The outermost circle region in fig. 5 is a schematic view of the high temperature adhesive tape, and two dotted line regions in fig. 6 are a schematic view of the connection of the high temperature adhesive tape.
Compatibility testing arrangement still includes the connecting media in this embodiment, and the connecting media is used for carrying out the dismantlement with connecting between electrode plate and the apron and is connected, has improved compatibility testing arrangement's stability and detachability.
Optionally, the two ends of the electrode plate are provided with tenon-and-mortise structures, and the cover plate covers the comb-shaped electrode on the electrode plate through the tenon-and-mortise structures. Fig. 7 is a schematic side view of an electrode plate in the embodiment of the present application, and fig. 8 is a schematic view of a mortise and tenon structure in the embodiment of the present application.
Referring to fig. 5 to 8, in this embodiment, the protruding parts are disposed on the left and right sides of the electrode plate shown in fig. 6, and the protruding parts are in a tenon-and-mortise structure. It can be understood that the glass cover plate covers the electrode plate through the tenon-and-mortise structure, and then is wound with a circle of high-temperature adhesive tape for fixing.
On one hand, the tenon-and-mortise structure is detachable, and the use is convenient and easy to operate. On the other hand, the tenon fourth of twelve earthly branches structure at plate electrode both ends makes the glass apron can flat cover on the plate electrode, avoids electronic material to prepare the unevenness to lead to the glass apron can't cover the condition on the plate electrode.
Consequently, the both ends of plate electrode are provided with tenon fourth of twelve earthly branches structure among this embodiment, and the apron covers the comb shape electrode on the plate electrode through tenon fourth of twelve earthly branches structure, has improved compatibility testing arrangement's maneuverability.
Optionally, the thickness of the electrode plate can be adjusted through the thickness of the mortise and tenon structure. In this embodiment, the thickness of mortise and tenon structure can be adjusted, and the part that can change mortise and tenon structure adjusts the height that the plate electrode left and right sides has protruding part to adjust the plate electrode thickness, in order to adapt to different system appearance scenes. For example, in the scene 1, the electronic material is more, and the tenon-and-mortise structure with the larger thickness can be replaced. It can be understood that the thickness of the mortise and tenon structure is preferably higher than the height of the prepared electronic material, so as to facilitate the covering of the glass cover plate on the electrode plate.
The thickness of mortise and tenon structure in this embodiment is adjustable, has further improved compatibility testing arrangement's maneuverability.
Based on the same inventive concept, the embodiment of the application also provides an electronic material compatibility test method for realizing the electronic material compatibility test device. The solution provided by the method is similar to the solution described in the above method, so the specific definitions in the following embodiments of the compatibility testing method for one or more electronic materials may also refer to the above definitions of the compatibility testing method for electronic materials.
Fig. 9 is an application environment diagram of a method for testing compatibility of an electronic material in the embodiment of the present application, and the method for testing compatibility of an electronic material provided in the embodiment of the present application may be applied to the application environment shown in fig. 1. Wherein the compatibility testing apparatus 102 is electrically connected to the computer device 104. The data storage system may store data that computer device 104 needs to process. The data storage system may be integrated on the computer device 104, or may be located on the cloud or other network server. The computer device 104 may be, but not limited to, various personal computers, notebook computers, smart phones, tablet computers, and the like, and certainly, the computer device 104 may also be implemented by an independent server or a server cluster formed by a plurality of servers.
In this embodiment, the gold finger in the compatibility testing apparatus needs to be powered for a preset time period to perform compatibility testing on the electronic material, so as to obtain a compatibility testing result of the electronic material. For example, the computer device may send an instruction to the compatibility test apparatus according to a fixed period, and then supply power to a gold finger in the compatibility test apparatus for a preset time.
Specifically, the gold finger in the compatibility testing device may be powered for a preset time according to the IPC-TM-6502.6.3.3 b and/or IPC-TM-6502.6.3.7 standards. Wherein, the test conditions specified in IPC-TM-6502.6.3.3 b are as follows: 85 ℃ (temperature), 85% RH (humidity), and the preset power supply time is 336H; the test conditions specified in IPC-TM-6502.6.3.7 were: and the power supply is carried out at 40 ℃, 93% RH (humidity) and is carried out for a preset time length of 336H, so that power is supplied to the golden finger. The power supply voltage may be 1V DC, 2V DC, 5V DC, 10 DC V, 50V DC, 100V DC, etc., and the embodiment is not limited.
Further, the computer device may collect the insulation resistance between the comb-shaped electrodes on the printed circuit sample according to a fixed period, so as to perform a compatibility test on the electronic material, so as to obtain a compatibility test result of the electronic material. For example, if the insulation resistance is always greater than 10 8 And ohm, the computer equipment determines that the compatibility test result of the electronic material is good.
In this embodiment, the golden finger in the compatibility testing apparatus is powered for a preset time to perform compatibility testing on the electronic material, so as to obtain a compatibility testing result of the electronic material, thereby completing the compatibility testing on the electronic material in the printed circuit.
Fig. 10 is a schematic flowchart of a process for obtaining a compatibility test result of an electronic material in an embodiment of the present application, and referring to fig. 10, this embodiment relates to an alternative implementation of how to obtain the compatibility test result of the electronic material. On the basis of the above embodiment, the compatibility test of the electronic material to obtain the compatibility test result of the electronic material includes the following steps:
and S1001, performing compatibility test on the electronic material to determine the insulation between the electronic materials of the electrode plate prepared with the electronic material, the corrosion degree of the comb-shaped electrode on the electrode plate prepared with the electronic material and the dendritic crystal growth condition.
In this embodiment, after the golden finger is powered for the preset duration, the power with the electronic material can be determinedThe insulation between the electronic materials of the polar plate, the corrosion degree of the comb-shaped electrode on the polar plate prepared with the electronic materials and the growth condition of the dendritic crystal. The insulation property can be determined by periodically obtaining the insulation resistance of each comb-shaped electrode on the printed circuit sample, for example, when the insulation resistance of each comb-shaped electrode is greater than 10 8 Good insulation property in ohm, and insulation resistance of each comb-shaped electrode is not more than 10 8 The insulation is poor at ohm. The degree of corrosion and dendrite growth needs to be captured by visual sensors, such as a microscope. One way that can be realized is that the computer device obtains the enlarged picture of the printed circuit sample by using the vision sensor, so as to obtain the corrosion degree and the dendrite growth condition of the printed circuit sample. For example, the computer device may identify an enlarged picture of the printed circuit sample by using a trained model, to obtain the corrosion degree and the dendrite growth condition of the printed circuit sample, where the trained model may be a Convolutional Neural Network (CNN), a Recurrent Neural Network (RNN), or another deep learning Network, a machine learning Network, or the like.
And S1002, obtaining a compatibility test result according to the insulativity, the corrosion degree and the dendritic crystal growth condition.
In this embodiment, the computer device may obtain the compatibility test result according to the insulation property, the corrosion degree, and the dendrite growth condition. For example, the compatibility test results in this application include pass and fail, when the insulation resistance of each comb electrode is greater than 10 8 When ohm, no corrosion and no dendrite growth, the compatibility test result is passed, and under other conditions, the compatibility test result is not passed. Of course, the total score can also be calculated by setting weights for the insulation property, the corrosion degree and the dendritic crystal growth condition of the electrode plate, so that the compatibility test result can be obtained according to the calculated total score.
In this embodiment, a compatibility test is performed on the electronic material to determine insulation between the electronic materials of the electrode plate with the electronic material, corrosion degree of the comb-shaped electrode on the electrode plate with the electronic material, and dendritic crystal growth condition, and a compatibility test result is obtained according to the insulation, the corrosion degree, and the dendritic crystal growth condition.
Optionally, the above step S1001 of determining the dendritic growth condition of the comb-shaped electrode on the electrode plate prepared with the electronic material may also be implemented by:
the dendrite growth of a comb electrode on an electrode plate prepared with an electronic material is determined using X-rays.
In this embodiment, an X-Ray (X-Ray) is used to observe the dendritic crystal growth condition of the comb-shaped electrode on the electrode plate made of the electronic material, and it is not necessary to pull out coatings such as conformal coating and fixing glue, i.e. the electrode plate made of the electronic material is not damaged, and the generated dendritic crystal growth condition is not affected, so that the obtained compatibility test result is relatively accurate.
FIG. 11 is a schematic diagram of dendrite growth. As shown in fig. 11, the growth of dendrites of the electrode plate prepared with the electronic material can be directly observed by X-Ray, and the irregular pattern at the top of the conductive band width in the right enlarged view of fig. 11 is the grown dendrites.
After the compatibility test is completed on the electronic material in the printed circuit, if the compatibility test result is passed, the printed circuit can be put into production formally, so that an integrated circuit is obtained, and the requirement of a high-reliability electronic product is met.
In summary, the present application provides a compatibility testing apparatus with high density, narrow pitch characteristics for printed circuits in integrated circuits, and a method for performing compatibility testing of electronic materials in printed circuits. The electrode plate in the compatibility testing device is convenient to manufacture, can realize mass production, can be popularized in a large scale and generates social and economic benefits, so that the electronic material compatibility testing method and the electronic material compatibility testing device can effectively solve the problem of poor compatibility in the assembly process of the printed circuit, reduce the probability of compatibility failure of electronic products in an application stage, restrain the failure problem in a material selection stage or a product research and development stage, effectively screen out electronic materials with poor compatibility, improve the efficiency of enterprises and reduce the loss.
It should be understood that, although the steps in the flowcharts related to the embodiments as described above are sequentially displayed as indicated by arrows, the steps are not necessarily performed sequentially as indicated by the arrows. The steps are not limited to being performed in the exact order illustrated and, unless explicitly stated herein, may be performed in other orders. Moreover, at least a part of the steps in the flowcharts related to the embodiments described above may include multiple steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, and the execution order of the steps or stages is not necessarily sequential, but may be rotated or alternated with other steps or at least a part of the steps or stages in other steps.
Fig. 12 is an internal structural diagram of a computer device in an embodiment of the present application, and in the embodiment of the present application, a computer device is provided, where the computer device may be a server, and an internal structural diagram of the computer device may be as shown in fig. 12. The computer device includes a processor, a memory, and a network interface connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program, and a database. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The database of the computer device is used for storing relevant data. The network interface of the computer device is used for communicating with an external terminal through a network connection. The computer program is executed by a processor to implement a method for compatibility testing of electronic materials.
Those skilled in the art will appreciate that the architecture shown in fig. 12 is merely a block diagram of some of the structures associated with the disclosed aspects and is not intended to limit the computing devices to which the disclosed aspects apply, as particular computing devices may include more or less components than those shown, or may combine certain components, or have a different arrangement of components.
In one embodiment, a computer device is provided, comprising a memory having a computer program stored therein and a processor that when executing the computer program performs the steps of:
and supplying power to the golden finger in the compatibility testing device for a preset time to perform compatibility testing on the electronic material to obtain a compatibility testing result of the electronic material.
In one embodiment, the processor, when executing the computer program, further performs the steps of:
performing compatibility test on the electronic material to determine the insulation between the electronic materials of the electrode plate prepared with the electronic material, the corrosion degree of the comb-shaped electrode on the electrode plate prepared with the electronic material and the dendritic crystal growth condition;
and obtaining the compatibility test result according to the prepared insulativity, the corrosion degree and the dendritic crystal growth condition.
In one embodiment, the processor, when executing the computer program, further performs the steps of:
and determining the dendritic growth condition of the comb-shaped electrode on the electrode plate prepared with the electronic material by utilizing X rays.
In one embodiment, a computer-readable storage medium is provided, having a computer program stored thereon, which when executed by a processor, performs the steps of:
and supplying power to the golden finger in the compatibility testing device for a preset time length so as to perform compatibility testing on the electronic material and obtain a compatibility testing result of the electronic material.
In one embodiment, the computer program when executed by the processor further performs the steps of:
performing compatibility test on the electronic material to determine the insulation between the electronic materials of the electrode plate prepared with the electronic material, the corrosion degree of the comb-shaped electrode on the electrode plate prepared with the electronic material and the dendritic crystal growth condition;
and obtaining the compatibility test result according to the prepared insulativity, the corrosion degree and the dendritic crystal growth condition.
In one embodiment, the computer program when executed by the processor further performs the steps of:
and determining the dendritic growth condition of the comb-shaped electrode on the electrode plate prepared with the electronic material by utilizing X rays.
It should be noted that, the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data for analysis, stored data, presented data, etc.) referred to in the present application are information and data authorized by the user or sufficiently authorized by each party.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, database, or other medium used in the embodiments provided herein may include at least one of non-volatile and volatile memory. The nonvolatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical Memory, high-density embedded nonvolatile Memory, resistive Random Access Memory (ReRAM), Magnetic Random Access Memory (MRAM), Ferroelectric Random Access Memory (FRAM), Phase Change Memory (PCM), graphene Memory, and the like. Volatile Memory can include Random Access Memory (RAM), external cache Memory, and the like. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM), among others. The databases referred to in various embodiments provided herein may include at least one of relational and non-relational databases. The non-relational database may include, but is not limited to, a block chain based distributed database, and the like. The processors referred to in the embodiments provided herein may be general purpose processors, central processing units, graphics processors, digital signal processors, programmable logic devices, quantum computing based data processing logic devices, etc., without limitation.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is specific and detailed, but not construed as limiting the scope of the present application. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.
Claims (10)
1. The electronic material compatibility testing device is characterized in that the electronic material is prepared on a cleaned electrode plate, the electrode plate comprises comb-shaped electrodes with multiple space types, the conduction bandwidths of the comb-shaped electrodes with different space types are different, the conduction band gaps of the comb-shaped electrodes with different space types are different, and the conduction bandwidth of at least one comb-shaped electrode in the comb-shaped electrodes with multiple space types is smaller than a preset standard bandwidth and the conduction band gap is smaller than a preset standard band gap; the compatibility testing device comprises the cleaned electrode plate and the golden finger;
and the cleaned electrode plate is connected with the golden finger and is used for carrying out compatibility test on the electronic material so as to obtain a compatibility test result of the electronic material.
2. The device of claim 1, wherein the compatibility testing device further comprises a cover plate for covering the comb-shaped electrodes on the electrode plate.
3. The device of claim 2, wherein the compatibility testing device further comprises a connecting medium for detachably connecting the electrode plate and the cover plate.
4. The device of claim 3, wherein the two ends of the electrode plate are provided with tenon-and-mortise structures, and the cover plate covers the comb-shaped electrodes on the electrode plate through the tenon-and-mortise structures.
5. The device according to claim 4, characterized in that the thickness of the electrode plate is adjusted by the thickness of the mortise and tenon structure.
6. A method for testing the compatibility of an electronic material, the method comprising:
the compatibility testing apparatus of any one of claims 1 to 5, wherein the gold finger is powered for a preset time period to perform compatibility testing on the electronic material, so as to obtain a compatibility testing result of the electronic material.
7. The method of claim 6, wherein the performing the compatibility test on the electronic material to obtain the compatibility test result of the electronic material comprises:
performing compatibility test on the electronic material to determine the insulation between the electronic materials of the electrode plate prepared with the electronic material, the corrosion degree of the comb-shaped electrode on the electrode plate prepared with the electronic material and the dendritic crystal growth condition;
and obtaining the compatibility test result according to the insulativity, the corrosion degree and the dendritic crystal growth condition.
8. The method of claim 6, wherein determining dendritic growth of the comb electrode on the electrode plate prepared with the electronic material comprises:
and determining the dendritic growth condition of the comb-shaped electrode on the electrode plate prepared with the electronic material by using X rays.
9. A computer device comprising a memory and a processor, the memory storing a computer program, characterized in that the processor realizes the steps of the method of any one of claims 6 to 8 when executing the computer program.
10. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the method of any one of claims 6 to 8.
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