CN114994449B - Compatibility testing device and method for electronic material and computer equipment - Google Patents
Compatibility testing device and method for electronic material and computer equipment Download PDFInfo
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- CN114994449B CN114994449B CN202210839763.XA CN202210839763A CN114994449B CN 114994449 B CN114994449 B CN 114994449B CN 202210839763 A CN202210839763 A CN 202210839763A CN 114994449 B CN114994449 B CN 114994449B
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- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
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Abstract
The application relates to a compatibility testing device and method of electronic materials and computer equipment. The electronic material is prepared on the cleaned electrode plate, the electrode plate comprises comb-shaped electrodes with various interval types, the conducting bandwidths among the comb-shaped electrodes with different interval types are different, the conducting band gaps among the comb-shaped electrodes with different interval types are different, and the conducting bandwidth of at least one comb-shaped electrode with various interval types is smaller than a preset standard bandwidth and the conducting band gap is smaller than a preset standard band gap; the compatibility testing device comprises a cleaned electrode plate and a golden finger; the cleaned electrode plate is connected with the golden finger and used for carrying out compatibility test on the electronic material so as to obtain a compatibility test result of the electronic material. The device can be used for carrying out compatibility test on electronic materials in the printed circuit.
Description
Technical Field
The present disclosure relates to the field of printed circuits, and in particular, to a device and method for testing compatibility of electronic materials, and a computer device.
Background
Along with the development of electronic products, the printed circuits are also continuously developed in the direction of miniaturization and intensification. Various electronic materials including interconnect materials, process materials, adhesive materials, protective materials, component materials, and the like are prepared onto the electrode plates during the assembly of the printed circuit. Because of incompatibility of physical properties and chemical properties among various electronic materials, the reliability of the printed circuit is reduced. For example, the incompatibility of the chemical properties between the flux from manufacturer a and the solder paste from manufacturer B may lead to failure such as corrosion, board burn, leakage, and open circuit of the printed circuit. Therefore, how to perform compatibility test on electronic materials in a printed circuit is a technical problem to be solved in the art.
Disclosure of Invention
In view of the foregoing, it is desirable to provide a compatibility testing apparatus, method, and computer device for electronic materials that are capable of performing compatibility testing on electronic materials in printed circuits.
In a first aspect, the present application provides a compatibility testing apparatus for electronic materials. The electronic material is prepared on a cleaned electrode plate, the electrode plate comprises comb-shaped electrodes with multiple interval types, the conducting bandwidths among the comb-shaped electrodes with different interval types are different, the conducting band gaps among the comb-shaped electrodes with different interval types are different, and the conducting bandwidth of at least one comb-shaped electrode with multiple interval types is smaller than a preset standard bandwidth and the conducting band gap is smaller than a preset standard band gap; the compatibility testing device comprises the cleaned electrode plate and a golden finger;
the cleaned electrode plate is connected with the golden finger and used for carrying out compatibility test on the electronic material so as to obtain a compatibility test result of the electronic material.
In one embodiment, the compatibility testing device further includes a cover plate for covering the comb-shaped electrodes on the electrode plate.
In one embodiment, the compatibility testing apparatus further includes a connection medium for detachably connecting the electrode plate and the cover plate.
In one embodiment, the two ends of the electrode plate are provided with mortise and tenon structures, and the cover plate covers the comb-shaped electrode on the electrode plate through the mortise and tenon structures.
In one embodiment, the thickness of the electrode plate is adjusted by the thickness of the mortise and tenon structure.
In a second aspect, the present application further provides a method for testing compatibility of an electronic material. The method comprises the following steps:
and supplying power to the golden finger in the compatibility testing device according to any one of the above to preset time so as to perform compatibility testing on the electronic material, thereby obtaining a compatibility testing result of the electronic material.
In one embodiment, the performing a compatibility test on the electronic material to obtain a compatibility test result of the electronic material includes:
compatibility testing is carried out on the electronic materials so as to determine the insulativity between the electronic materials of the electrode plate with the electronic materials, the corrosion degree of the comb-shaped electrode on the electrode plate with the electronic materials and the dendrite growth condition;
and obtaining the compatibility test result according to the insulativity, the corrosion degree and the dendrite growth condition.
In one embodiment, the determining dendrite growth of comb electrodes on the electrode plate with the electronic material prepared includes:
and determining dendrite growth of comb-shaped electrodes on the electrode plate provided with the electronic material by using X-rays.
In a third aspect, the present application also provides a computer device. The computer device comprises a memory storing a computer program and a processor implementing the steps of any of the methods described above when the processor executes the computer program.
In a fourth aspect, the present application also provides a computer-readable storage medium. The computer readable storage medium having stored thereon a computer program which, when executed by a processor, performs the steps of any of the methods described above.
The compatibility testing device comprises the cleaned electrode plate and the golden finger, wherein the cleaned electrode plate is connected with the golden finger and used for carrying out compatibility testing on the electronic material so as to obtain a compatibility testing result of the electronic material. The electronic material is prepared on the cleaned electrode plate, and because the electrode plate comprises comb-shaped electrodes with multiple spacing types, the conductive bandwidths among the comb-shaped electrodes with different spacing types are different, the conductive band gaps among the comb-shaped electrodes with different spacing types are different, and the conductive bandwidth of at least one comb-shaped electrode in the comb-shaped electrodes with multiple spacing types is smaller than a preset standard bandwidth and the conductive band gap is smaller than the preset standard band gap, therefore, the compatibility testing device provided by the application can be suitable for miniaturized and intensive printed circuits, and therefore compatibility testing is conducted on the electronic material in the printed circuits, and the compatibility testing result of the electronic material is obtained.
Drawings
FIG. 1 is a schematic diagram of a device for testing compatibility of electronic materials according to an embodiment of the present application;
FIG. 2 is a schematic flow chart of wave soldering;
FIG. 3 is a schematic flow chart of reflow soldering;
FIG. 4 is a schematic view of a cover plate according to an embodiment of the present application;
FIG. 5 is a schematic diagram of a printed circuit sample in an embodiment of the present application;
FIG. 6 is a schematic diagram of a compatibility testing apparatus according to an embodiment of the present application;
FIG. 7 is a schematic side view of an electrode plate in an embodiment of the present application;
FIG. 8 is a schematic view of a mortise and tenon joint structure in an embodiment of the present application;
FIG. 9 is an application environment diagram of a method for testing compatibility of electronic materials according to an embodiment of the present application;
FIG. 10 is a flow chart of a method for obtaining a compatibility test result of an electronic material according to an embodiment of the present application;
FIG. 11 is a schematic illustration of dendrite growth;
fig. 12 is an internal structural diagram of the computer device in the embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
Along with the continuous development of functions of electronic products in the direction of integration, intellectualization and precision, the continuous development of sizes of electronic components and electronic assemblies in the direction of miniaturization and intensification is also carried out. Various electronic materials are used in the process of assembling integrated circuits, i.e., printed circuits, including interconnect materials, process materials, adhesive materials, protective materials, and electronic component materials.
On the one hand, the printed circuit generally uses different electronic materials of a plurality of manufacturers in the assembly process, so that the final printed circuit is invalid due to incompatibility of physical and/or chemical properties among various electronic materials, and the reliability of the printed circuit is reduced. For example, stresses resulting from mismatch in physical properties of electronic materials can lead to reduced component strength, delamination, and even cracking of printed circuits; because of the incompatibility of the chemical properties of the electronic materials, chemical reactions between the electronic materials can cause the electronic materials to be denatured, thereby causing a series of safety and quality problems such as corrosion, board burning, electric leakage, open circuit and the like of a printed circuit. For example, if the chemical properties of the flux from manufacturer a and the solder paste from manufacturer B are not compatible, the reliability of the printed circuit may be reduced due to corrosion, burning, leakage, open circuit, breakage, etc.
On the other hand, integration, intellectualization and refinement of integrated circuits have led to an increasing trend in layout on printed circuits towards high density and narrow pitch, while also being more prone to problems of lower reliability due to incompatibility of electronic materials.
In order to avoid such phenomena, compatibility tests are performed on the electronic materials in the printed circuit before the printed circuit is formally put into production. However, at present, technical researches on compatibility testing of electronic materials are still lacking, and a system evaluation method and a standard for developing the compatibility testing of the electronic materials of the printed circuit are not available, so that potential quality hidden trouble caused by the compatibility problem cannot be avoided when enterprises screen the electronic materials.
In summary, how to perform compatibility test on electronic materials in a printed circuit is a technical problem to be solved in the art, so as to help enterprises to screen electronic materials and identify electronic materials with poor compatibility.
In view of the foregoing, it is desirable to provide a compatibility testing apparatus, method, and computer device for electronic materials that are capable of performing compatibility testing on electronic materials in printed circuits.
The compatibility testing device provided by the embodiment comprises a cleaned electrode plate and a golden finger, wherein the cleaned electrode plate is connected with the golden finger and used for carrying out compatibility testing on the electronic material so as to obtain a compatibility testing result of the electronic material. The electronic material is prepared on the cleaned electrode plate, the electrode plate comprises comb-shaped electrodes with multiple spacing types, the conducting bandwidths among the comb-shaped electrodes with different spacing types are different, the conducting band gaps among the comb-shaped electrodes with different spacing types are different, and the conducting bandwidth of at least one comb-shaped electrode with multiple spacing types is smaller than a preset standard bandwidth and the conducting band gap is smaller than a preset standard band gap.
Referring to fig. 1, fig. 1 is a schematic diagram of a device for testing compatibility of electronic materials according to an embodiment of the disclosure. In this embodiment, the compatibility testing device for electronic materials includes 5 pitch types of comb-shaped electrodes A, B, C, D, E. Of course, the number of comb-shaped electrodes of various pitch types is not limited in this embodiment.
The comb-shaped electrodes of different pitch types have different conductive bandwidths, the comb-shaped electrodes of different pitch types have different conductive band gaps, and the conductive bandwidth of at least one comb-shaped electrode of the plurality of pitch types is smaller than a preset standard bandwidth and the conductive band gap is smaller than the preset standard band gap. The conductive tape is understood to be a bonding wire on the electrode plate, i.e. a copper wire on the electrode plate. Here, the preset standard bandwidth and the preset standard band gap are both 0.318mm, and the current conductive bandwidth and the conductive band gap of the conventional printed circuit are usually above 0.318mm, that is, the conductive bandwidth and the conductive band gap of at least one comb-shaped electrode, such as the comb-shaped electrode E, in the application are smaller than 0.318mm, so as to meet the requirement of smaller and smaller space in the current printed circuit, so as to adapt to the printed circuit with narrow space and high density, and thus complete the compatibility test of electronic materials in the intensive and miniaturized printed circuit.
Specifically, please continue to refer to fig. 1, the electrode plate is made of FR4.0 epoxy resin glass fiber board, the thickness of the electrode plate is 1.5 mm ±0.1mm, the copper wire covered on the surface is a bare copper surface without any treatment, and the whole electrode plate is subjected to organic solder mask (OrganicSolderabilityPreservatives, OSP) treatment.
Illustratively, the comb electrode a in fig. 1 has a conductive bandwidth of 0.4mm, a conductive band gap of 0.5mm, a conductive band length of 17.75mm±0.05mm, and a conductive band overlap length of 15.60mm±0.05mm. The comb-shaped electrode B in FIG. 1 has a conductive bandwidth of 0.318mm, a conductive band gap of 0.318mm, a conductive band length of 17.75 mm.+ -. 0.05mm, and a conductive band overlap length of 15.60 mm.+ -. 0.05mm. The comb-shaped electrode C in FIG. 1 has a conductive band width of 0.2mm, a conductive band gap of 0.2mm, a conductive band length of 17.75 mm.+ -. 0.05mm, and a conductive band overlap length of 15.60 mm.+ -. 0.05mm. The comb-shaped electrode D in FIG. 1 had a conduction band width of 0.15mm, a conduction band gap of 0.15mm, a conduction band length of 8.87 mm.+ -. 0.05mm, and a conduction band overlap length of 7.80 mm.+ -. 0.05mm. The comb-shaped electrode E in FIG. 1 had a conduction band width of 0.1mm, a conduction band gap of 0.1mm, a conduction band length of 8.87 mm.+ -. 0.05mm, and a conduction band overlap length of 7.80 mm.+ -. 0.05mm.
The conductive band width refers to the diameter width of the conductive band, the conductive band gap refers to the distance between two adjacent conductive bands, the conductive band length refers to the length of the conductive band, and the conductive band overlapping part length refers to the overlapping length between the two adjacent conductive bands.
It can be seen that the conductive bandwidth, the conductive band gap, the conductive band length, and the conductive band overlap length of the comb electrode A, B, C, D, E are all sequentially reduced, and the conductive bandwidth and the conductive band gap of the comb electrode C, D, E are both less than 0.318mm. That is, the conductive bandwidths between the comb-shaped electrodes of different pitch types are different, the conductive band gaps between the comb-shaped electrodes of different pitch types are different, and the conductive bandwidth of at least one of the comb-shaped electrodes of multiple pitch types is smaller than a preset standard bandwidth and the conductive band gap is smaller than the preset standard band gap.
With continued reference to fig. 1, each comb-shaped electrode includes a plurality of first electrodes and a plurality of second electrodes. Taking the comb-shaped electrode A as an example, the comb-shaped electrode A comprises a first electrode 1, a first electrode 3 and a first electrode 5, and the first electrode 1, the first electrode 3 and the first electrode 5 can be understood as the positive electrode of the comb-shaped electrode A; the comb-shaped electrode a further comprises a second electrode 2, a second electrode 4, and the second electrode 2, the second electrode 4 can be understood as the negative electrode of the comb-shaped electrode a. In this case, for the comb-shaped electrode a, one electrode of the first electrodes and one electrode of the second electrodes may be sequentially electrified, so as to collect multiple sets of power data between the first electrode 1 and the second electrode 2, the first electrode 1 and the second electrode 4, the first electrode 3 and the second electrode 2, the first electrode 3 and the second electrode 4, the first electrode 5 and the second electrode 2, and the first electrode 5 and the second electrode 4, and perform compatibility test on the electronic material, so as to obtain a compatibility test result of the electronic material, and improve accuracy of the compatibility test result.
In this embodiment, the electrode plate is cleaned to clean dirt, oil film, etc. on the electrode plate, and interference of the dirt, oil film, etc. on the subsequent compatibility test is eliminated. One way this can be accomplished is to clean the electrode plate according to the standard requirements of IPC-TM-650.2.6.3.3. Specifically, the electrode plate can be cleaned according to the following processes S1-S9. It should be noted that, the actual cleaning process of the electrode plate may not be completely according to the flow of S1 to S9, which is not limited in this embodiment.
S1, placing the electrode plate into a beaker, and pouring isopropanol into the beaker to soak the electrode plate for 10-15 minutes.
S2, brushing the electrode plate by using a brush and isopropanol after the soaking is finished. And in the process of brushing the electrode plate, the back and forth brushing times of the brush are not less than 5-6 times, and the electrode plate is continuously put into isopropanol after the brushing is finished.
S3, after brushing the electrode plate by using isopropanol, washing the electrode plate by using a large amount of tap water.
S4, washing the electrode plate by using tap water until the electrode plate is primarily clean, pouring washing powder, and washing the electrode plate by using a brush. And in the process of cleaning the electrode plate by using the washing powder, the times of back and forth brushing by the brush are not less than 5-6 times, then the electrode plate after brushing is put into a clean beaker, and a large amount of tap water is used for flushing the electrode plate until the washing powder on the electrode plate is flushed cleanly.
S5, preparing 3 beakers, washing the beakers with deionized water (pure water), and pouring 300mL of deionized water into the beakers respectively.
S6, placing the electrode plate after the cleaning of the step S4 into 3 beakers containing deionized water in sequence for back and forth swashing.
S7, placing the electrode plate cleaned in the step S6 into a beaker containing absolute ethyl alcohol for dehydration.
S8, placing the dehydrated electrode plate into a baking oven for baking, wherein the baking temperature is 85 ℃, and the baking time is 30min.
S9, placing the baked electrode plate into a dryer for preservation, and cooling for later use.
Further, the electronic material needs to be prepared on the electrode plate after cleaning. The preparation process is a process for preparing a sample based on the cleaned electrode plate to obtain a printed circuit sample. That is, the assembly process flow of the printed circuit in actual production is simulated, and the required electronic materials are sequentially prepared on the electrode plates by using a surface mount technology (Surface Mounted Technology, SMT) or a through hole technology (Through Hole Technology, THT). It will be appreciated that the printed circuit sample is the electrode plate from which the electronic material is prepared.
Specifically, a steel mesh matched with the electrode plate is used for printing lead-free solder paste on the electrode plate, and the soldering flux is directly sprayed on the electrode plate, and then wave soldering or reflow soldering is carried out according to requirements. Fig. 2 is a schematic flow chart of wave soldering, and fig. 3 is a schematic flow chart of reflow soldering. The process of preparing the electronic material on the cleaned electrode plate is not particularly limited in this example, and may be prepared as needed.
It should be noted that, before the compatibility test is actually started, the prepared printed circuit sample needs to be subjected to a pretreatment. Specifically, the prepared printed circuit sample was placed under baseline conditions for 24 hours. Wherein, the reference condition is that the temperature is 20 ℃ to 30 ℃ and the relative humidity is as follows: 45% RH to 55% RH. The preprocessing is to eliminate the influence of the environment on the compatibility test and improve the accuracy of the compatibility test.
With continued reference to fig. 1, the "black keys" on the upper and lower parts of the electrode plates in fig. 1 are gold fingers (edge connectors) used for connecting the electrode plates, which can connect circuits and transmit signals, and the cleaned electrode plates are connected with the gold fingers. Specifically, the comb-shaped electrodes A, B, C, D, E are all connected with the golden fingers, and the golden fingers can be inserted into the corresponding slots to test the golden fingers after being powered, so that the compatibility test is performed on the electronic material, and the compatibility test result of the electronic material is obtained.
The compatibility testing device comprises the electrode plate and the golden finger after cleaning, wherein the electrode plate and the golden finger after cleaning are connected and used for carrying out compatibility testing on the electronic material so as to obtain a compatibility testing result of the electronic material. The electronic material is prepared on the cleaned electrode plate, the electrode plate comprises comb-shaped electrodes of various pitch types, the conductive bandwidths among the comb-shaped electrodes of different pitch types are different, the conductive band gaps among the comb-shaped electrodes of different pitch types are different, and the conductive bandwidth of at least one comb-shaped electrode among the comb-shaped electrodes of various pitch types is smaller than a preset standard bandwidth and the conductive band gap is smaller than the preset standard band gap.
Fig. 4 is a schematic view of a cover plate in an embodiment of the present application. As shown in fig. 4, the compatibility testing device may further include a cover plate, where the cover plate is used to cover the comb-shaped electrode on the electrode plate.
In the present embodiment, the cover plate is described as a glass cover plate, but the cover plate may be made of other materials, such as ceramics, plastics, and the like. A glass cover plate is placed over the electrode plates, the glass cover plate being sized to cover just the comb-shaped electrodes A, B, C, D, E in fig. 1, but not the gold fingers in fig. 1.
In this embodiment, the comb-shaped electrode on the electrode plate is covered by the glass cover plate, so as to simulate the situation that chemical substances such as flux volatilizes incompletely in the production process of the printed circuit in the integrated circuit, and the result of the compatibility test can be more accurate on the basis.
The compatibility testing device in this embodiment further includes a cover plate, and the cover plate is used for covering the comb-shaped electrode on the electrode plate, so that the situation that high residual electronic materials exist in the integrated circuit, namely, the situation that chemical substances such as welding flux volatilize thoroughly in the production process of the printed circuit, are not generated is simulated, and the accuracy of the compatibility testing result is improved.
Fig. 5 is a schematic diagram of a printed circuit sample in an embodiment of the present application. In this embodiment, as shown in fig. 5, various electronic materials, such as soldering flux, solder wires, cleaning agent, three-proofing paint, and fixing adhesive, are sequentially prepared on the electrode plate according to the sequence requirements according to the steps of wave soldering or reflow soldering, and then fully cured, and then the glass cover plate is covered on the electrode plate.
Fig. 6 is a schematic diagram of a compatibility testing apparatus according to an embodiment of the present application. As shown in fig. 6, the compatibility testing apparatus may further include a connection medium for detachably connecting the electrode plate and the cover plate.
In this embodiment, the compatibility testing device further includes a connection medium, such as a high-temperature adhesive tape. The high-temperature adhesive tape is used for fixing the electrode plate and the cover plate so as to finish detachable connection between the electrode plate and the cover plate. The outermost area in fig. 5 is a schematic view of the high-temperature adhesive tape, and the two dotted areas in fig. 6 are schematic views of the connection of the high-temperature adhesive tape.
The compatibility testing device in the embodiment further comprises a connecting medium, wherein the connecting medium is used for detachably connecting the electrode plate and the cover plate, and stability and detachability of the compatibility testing device are improved.
Optionally, the both ends of electrode plate are provided with mortise and tenon structure, and the apron passes through the comb electrode on the mortise and tenon structure cover electrode plate. Fig. 7 is a schematic side view of an electrode plate in an embodiment of the present application, and fig. 8 is a schematic view of a mortise and tenon joint structure in an embodiment of the present application.
Referring to fig. 5 to 8, in this embodiment, the left and right sides of the electrode plate shown in fig. 6 have protruding members, and the protruding members have a mortise and tenon structure. It can be understood that the glass cover plate is covered on the electrode plate through the mortise and tenon structure, and then a circle of high-temperature adhesive tape is wound for fixing.
On the one hand, the mortise and tenon joint structure is detachable, and the mortise and tenon joint structure is convenient to use and easy to operate. On the other hand, the mortise and tenon structures at the two ends of the electrode plate enable the glass cover plate to be smoothly covered on the electrode plate, and the situation that the glass cover plate cannot be covered on the electrode plate due to uneven preparation of electronic materials is avoided.
Therefore, in this embodiment, the both ends of the electrode plate are provided with mortise and tenon structures, and the cover plate covers the comb-shaped electrode on the electrode plate through the mortise and tenon structures, so that the operability of the compatibility testing device is improved.
Optionally, the thickness of the electrode plate can be adjusted through the thickness of the mortise and tenon structure. In this embodiment, the thickness of mortise and tenon structure can be adjusted, can change the part of mortise and tenon structure and adjust the height that there is protruding part in the electrode plate left and right sides to adjust the thickness of electrode plate, in order to adapt to different system appearance scenes. For example, in scene 1, the electronic materials are more, and the mortise and tenon structure with larger thickness can be replaced. It is understood that the thickness of the mortise and tenon structure is preferably higher than the height of the prepared electronic material, so that the glass cover plate can be conveniently covered on the electrode plate.
The thickness of mortise and tenon structure is adjustable in this embodiment, has further improved compatibility testing arrangement's maneuverability.
Based on the same inventive concept, the embodiment of the application also provides a compatibility testing method of the electronic material for realizing the compatibility testing device of the electronic material. The implementation of the solution provided by this method is similar to that described in the above method, so that the specific limitations in the embodiments of the compatibility testing method for one or more electronic materials provided below can also be seen in the limitations of the compatibility testing method for electronic materials above.
Fig. 9 is an application environment diagram of a method for testing compatibility of an electronic material according to an embodiment of the present application, where the method for testing compatibility of an electronic material according to the embodiment of the present application may be applied to an application environment as shown in fig. 1. Wherein the compatibility testing apparatus 102 is electrically connected to the computer device 104. The data storage system may store data that computer device 104 needs to process. The data storage system may be integrated on the computer device 104 or may be located on a cloud or other network server. The computer device 104 may be, but not limited to, various personal computers, notebook computers, smartphones, tablet computers, etc., and of course, the computer device 104 may be implemented by a stand-alone server or a server cluster composed of a plurality of servers.
In this embodiment, the golden finger in the compatibility testing device needs to be powered for a preset period of time to perform compatibility testing on the electronic material, so as to obtain a compatibility testing result of the electronic material. For example, the computer device may send an instruction to the compatibility testing device according to a fixed period, so as to power the golden finger in the compatibility testing device for a preset period of time.
Specifically, the golden finger in the compatibility testing device can be powered for a preset time according to the IPC-TM-650 2.6.3.3b and/or IPC-TM-650.6.3.7 standard. Wherein, the test conditions specified in IPC-TM-650.2.6.3.3b are: 85 ℃ and 85% RH, and the power supply preset time is 336H; the test conditions specified in IPC-TM-650 2.6.3.7 are: 40 ℃ and 93% RH, and power is supplied to the preset time length 336H to supply power to the golden finger. The power supply voltage may be 1V DC, 2V DC, 5V DC, 10 DC V, 50V DC, 100V DC, or the like, which is not limited in this embodiment.
Further, the computer device can collect insulation resistance between comb-shaped electrodes on the printed circuit sample according to a fixed period, thereby realizing the electronic materialAnd carrying out compatibility test on the material to obtain a compatibility test result of the electronic material. For example, if the insulation resistance is always greater than 10 8 Ohm, the computer device determines that the compatibility test result of the electronic material is good.
According to the embodiment, the golden finger in the compatibility testing device is powered for a preset time period to perform compatibility testing on the electronic material, so that a compatibility testing result of the electronic material is obtained, and the compatibility testing on the electronic material in the printed circuit can be completed.
Fig. 10 is a schematic flow chart of obtaining a compatibility test result of an electronic material according to an embodiment of the present application, and referring to fig. 10, this embodiment relates to an alternative implementation manner of how to obtain a compatibility test result of an electronic material. Based on the above embodiment, the above compatibility test is performed on an electronic material to obtain a compatibility test result of the electronic material, including the following steps:
s1001, performing compatibility test on the electronic material to determine insulation between the electronic materials of the electrode plate with the electronic material, corrosion degree of the comb-shaped electrode on the electrode plate with the electronic material, and dendrite growth condition.
In this embodiment, after the golden finger is powered for a preset period of time, the insulation between the electronic materials of the electrode plate with the electronic materials, the corrosion degree of the comb-shaped electrode on the electrode plate with the electronic materials, and the dendrite growth condition can be determined. Wherein the insulation property can be determined by periodically obtaining the insulation resistance of each comb-shaped electrode on the printed circuit sample, for example, when the insulation resistance of each comb-shaped electrode is more than 10 8 Good insulation in ohmic contact, and the insulation resistance of each comb-shaped electrode is not more than 10 8 The insulation is poor in ohmic contact. The extent of corrosion and dendrite growth need to be acquired by means of visual sensors, such as a microscope. One way this can be accomplished is that the computer device obtains an enlarged picture of the printed circuit sample using a vision sensor, thereby obtaining the corrosion level and dendrite growth of the printed circuit sample. For example, the computer device may use the trained model to identify printed circuit sample placementsAnd obtaining the corrosion degree and dendrite growth condition of the printed circuit sample according to the large picture, wherein the trained model can be a convolutional neural network (Convolutional Neural Networks, CNN), a cyclic neural network (Recurrent Neural Network, RNN), other deep learning networks, machine learning networks and the like.
S1002, obtaining a compatibility test result according to the insulativity, the corrosion degree and the dendrite growth condition.
In this embodiment, the computer device may obtain the compatibility test result according to the insulation, the corrosion degree, and the dendrite growth condition described above. For example, the compatibility test results in this application include pass and fail when the insulation resistance of each comb electrode is greater than 10 8 And when ohm, no corrosion and no dendrite growth occur, the compatibility test result is passed, and the compatibility test result is not passed under the other conditions. Of course, the total score may be calculated by setting weights for the three items of the insulation property, the corrosion degree and the dendrite growth condition of the electrode plate, so that the compatibility test result is obtained according to the calculated total score.
In this embodiment, the compatibility test is performed on the electronic material to determine the insulation between the electronic materials of the electrode plate with the electronic material, the corrosion degree of the comb-shaped electrode on the electrode plate with the electronic material, and the dendrite growth condition, and the compatibility test result is obtained according to the insulation, the corrosion degree, and the dendrite growth condition.
Optionally, the determining the dendrite growth condition of the comb-shaped electrode on the electrode plate provided with the electronic material in S1001 may be further implemented by:
and determining dendrite growth of comb-shaped electrodes on the electrode plate provided with the electronic material by utilizing X-rays.
In this embodiment, the dendrite growth condition of the comb-shaped electrode on the electrode plate prepared with the electronic material is observed by using X-Ray (X-Ray), and there is no need to pull out coating layers such as three-proofing paint and fixing glue, i.e. the electrode plate prepared with the electronic material is not damaged, and the dendrite growth condition is not affected, so that the obtained compatibility test result is more accurate.
Fig. 11 is a schematic diagram of dendrite growth. As shown in FIG. 11, the X-Ray can directly observe the dendrite growth of the electrode plate with the electronic material, and the irregular pattern at the top of the conductive bandwidth in the enlarged view on the right side of FIG. 11 is the grown dendrite.
After the compatibility test is finished on the electronic materials in the printed circuit, if the result of the compatibility test is passed, the printed circuit can be formally put into production, so that the integrated circuit is obtained, and the requirement of high-reliability electronic products is met.
In summary, the present application provides a compatibility test apparatus for printed circuits with high density and narrow pitch characteristics in integrated circuits, and provides a method for developing compatibility tests on electronic materials in the printed circuits. The electrode plate in the compatibility testing device is convenient to manufacture, mass production can be achieved, the electrode plate can be popularized in a large quantity, and social and economic benefits are generated.
It should be understood that, although the steps in the flowcharts related to the embodiments described above are sequentially shown as indicated by arrows, these steps are not necessarily sequentially performed in the order indicated by the arrows. The steps are not strictly limited to the order of execution unless explicitly recited herein, and the steps may be executed in other orders. Moreover, at least some of the steps in the flowcharts described in the above embodiments may include a plurality of steps or a plurality of stages, which are not necessarily performed at the same time, but may be performed at different times, and the order of the steps or stages is not necessarily performed sequentially, but may be performed alternately or alternately with at least some of the other steps or stages.
Fig. 12 is an internal structural diagram of a computer device in an embodiment of the present application, and in an embodiment of the present application, a computer device may be a server, and the internal structural diagram may be as shown in fig. 12. The computer device includes a processor, a memory, and a network interface connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, computer programs, and a database. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The database of the computer device is for storing relevant data. The network interface of the computer device is used for communicating with an external terminal through a network connection. The computer program, when executed by a processor, implements a method for testing the compatibility of electronic materials.
It will be appreciated by those skilled in the art that the structure shown in fig. 12 is merely a block diagram of some of the structures associated with the present application and is not limiting of the computer device to which the present application may be applied, and that a particular computer device may include more or fewer components than shown, or may combine certain components, or have a different arrangement of components.
In one embodiment, a computer device is provided comprising a memory and a processor, the memory having stored therein a computer program, the processor when executing the computer program performing the steps of:
and supplying power to the golden finger in the compatibility testing device for a preset time period to perform compatibility testing on the electronic material, so as to obtain a compatibility testing result of the electronic material.
In one embodiment, the processor when executing the computer program further performs the steps of:
performing compatibility test on the electronic materials to determine insulation between the electronic materials of the electrode plates provided with the electronic materials, corrosion degree of comb-shaped electrodes on the electrode plates provided with the electronic materials and dendrite growth condition;
and obtaining the compatibility test result according to the insulation property, the corrosion degree and the dendrite growth condition.
In one embodiment, the processor when executing the computer program further performs the steps of:
and determining dendrite growth of comb-shaped electrodes on the electrode plate provided with the electronic material by using X-rays.
In one embodiment, a computer readable storage medium is provided having a computer program stored thereon, which when executed by a processor, performs the steps of:
and supplying power to the golden finger in the compatibility testing device for a preset time period to perform compatibility testing on the electronic material, so as to obtain a compatibility testing result of the electronic material.
In one embodiment, the computer program when executed by the processor further performs the steps of:
performing compatibility test on the electronic materials to determine insulation between the electronic materials of the electrode plates provided with the electronic materials, corrosion degree of comb-shaped electrodes on the electrode plates provided with the electronic materials and dendrite growth condition;
and obtaining the compatibility test result according to the insulation property, the corrosion degree and the dendrite growth condition.
In one embodiment, the computer program when executed by the processor further performs the steps of:
and determining dendrite growth of comb-shaped electrodes on the electrode plate provided with the electronic material by using X-rays.
It should be noted that, user information (including but not limited to user equipment information, user personal information, etc.) and data (including but not limited to data for analysis, stored data, presented data, etc.) referred to in the present application are information and data authorized by the user or sufficiently authorized by each party.
Those skilled in the art will appreciate that implementing all or part of the above described methods may be accomplished by way of a computer program stored on a non-transitory computer readable storage medium, which when executed, may comprise the steps of the embodiments of the methods described above. Any reference to memory, database, or other medium used in the various embodiments provided herein may include at least one of non-volatile and volatile memory. The nonvolatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical Memory, high density embedded nonvolatile Memory, resistive random access Memory (ReRAM), magnetic random access Memory (Magnetoresistive Random Access Memory, MRAM), ferroelectric Memory (Ferroelectric Random Access Memory, FRAM), phase change Memory (Phase Change Memory, PCM), graphene Memory, and the like. Volatile memory can include random access memory (Random Access Memory, RAM) or external cache memory, and the like. By way of illustration, and not limitation, RAM can be in the form of a variety of forms, such as static random access memory (Static Random Access Memory, SRAM) or dynamic random access memory (Dynamic Random Access Memory, DRAM), and the like. The databases referred to in the various embodiments provided herein may include at least one of relational databases and non-relational databases. The non-relational database may include, but is not limited to, a blockchain-based distributed database, and the like. The processors referred to in the embodiments provided herein may be general purpose processors, central processing units, graphics processors, digital signal processors, programmable logic units, quantum computing-based data processing logic units, etc., without being limited thereto.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the present application. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application shall be subject to the appended claims.
Claims (6)
1. The compatibility testing device for the electronic material is characterized in that the electronic material is prepared on a cleaned electrode plate, the electrode plate comprises comb-shaped electrodes with multiple spacing types, the comb-shaped electrodes with different spacing types have different conductive bandwidths, the comb-shaped electrodes with different spacing types have different conductive band gaps, and the conductive bandwidth of at least one comb-shaped electrode with the multiple spacing types is smaller than a preset standard bandwidth and the conductive band gap is smaller than the preset standard band gap; the preset standard bandwidth and the preset standard band gap are 0.318 millimeter; the electrode plate comprises a comb-shaped electrode with the conducting band gap smaller than or equal to 0.15 mm; the compatibility testing device comprises the cleaned electrode plate, golden fingers distributed at two ends of the electrode plate, a cover plate and a connecting medium; the electronic material comprises an electronic element material, and each comb-shaped electrode comprises a plurality of first electrodes and a plurality of second electrodes;
the cleaned electrode plate is connected with the golden finger and is used for carrying out compatibility test on the electronic material so as to obtain a compatibility test result of the electronic material;
the cover plate is used for covering the comb-shaped electrode on the electrode plate; the cover plate comprises a glass cover plate;
the two ends of the electrode plate are provided with mortise and tenon structures, the cover plate covers comb-shaped electrodes on the electrode plate through the mortise and tenon structures, and the thickness of the electrode plate is adjusted through the thickness of the mortise and tenon structures;
the connecting medium is used for detachably connecting the electrode plate and the cover plate; the connecting medium is a high-temperature adhesive tape;
wherein the compatibility test result is a result obtained according to insulation between electronic materials of the electrode plate with the electronic material prepared, corrosion degree of comb-shaped electrodes on the electrode plate with the electronic material prepared, and dendrite growth condition;
and identifying the picture of the electrode plate with the electronic material by using the trained model according to the corrosion degree and the dendrite growth condition.
2. The device of claim 1, wherein the electrode plate is made of FR4.0 epoxy fiberglass board.
3. A method for testing compatibility of an electronic material, the method comprising:
the golden finger in the compatibility testing device according to claim 1 or 2 is powered for a preset period of time to perform compatibility testing on the electronic material, so as to obtain a compatibility testing result of the electronic material.
4. A method according to claim 3, wherein said performing a compatibility test on said electronic material results in a compatibility test result of said electronic material, comprises:
performing compatibility test on the electronic materials to determine insulation between the electronic materials of the electrode plates provided with the electronic materials, corrosion degree of comb-shaped electrodes on the electrode plates provided with the electronic materials and dendrite growth condition;
and obtaining the compatibility test result according to the insulativity, the corrosion degree and the dendrite growth condition.
5. A computer device comprising a memory and a processor, the memory storing a computer program, characterized in that the processor implements the steps of the method of claim 3 or 4 when executing the computer program.
6. A computer readable storage medium, on which a computer program is stored, characterized in that the computer program, when being executed by a processor, implements the steps of the method of claim 3 or 4.
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