CN205454257U - Reflow soldering temperature measurement board - Google Patents
Reflow soldering temperature measurement board Download PDFInfo
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- CN205454257U CN205454257U CN201521142871.3U CN201521142871U CN205454257U CN 205454257 U CN205454257 U CN 205454257U CN 201521142871 U CN201521142871 U CN 201521142871U CN 205454257 U CN205454257 U CN 205454257U
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- reflow soldering
- region
- plate body
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- thermometric plate
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Abstract
The utility model discloses a reflow soldering temperature measurement board, including the temperature measurement plate body, it has two at least regions, difference to divide on the temperature measurement plate body the interconnection condition is different between regional inlayer stromatolite design and/or layer. The design condition of most PCB boards can be represented to the interconnection condition between each regional inlayer stromatolite design of temperature measurement plate body and layer. When actually carrying out temperature test, only need carry out once test contrast to this temperature measurement plate body, can comprehensively reflect just that most PCB boards at the temperature difference of the various feature structures of reflow soldering process medium plate body, and then can be conveniently carry out assay to reflow soldering technology, furnace temperature setting, provide certain reference for the furnace temperature setting. Reflow soldering temperature measurement board is applicable in the furnace temperature debugging of the PCB of not same batch, different grade type production board, and the commonality is high, the furnace temperature debugging is efficient.
Description
Technical field
This utility model relates to temperature test field, particularly relates to a kind of Reflow Soldering thermometric plate.
Background technology
Along with electronic product develops rapidly to the direction of miniaturization, densification, high integration and multifunction, more and more higher to printed wiring board (PrintedCircuitBoard, PCB) requirement.When pcb board carries out Reflow Soldering, along with its number of plies, thickness of slab, the increase of internal layer copper content, pcb board surface temperature is all increasing further with arranging the interregional temperature difference of temperature difference or plate face.Due to the restriction of above 2, the work difficulty that reflow soldering process is arranged is higher, and furnace temperature is difficult to arrange.Traditional, when a collection of product is carried out Reflow Soldering, in this is with batch product, to choose one or more carries out temperature test to set reflow soldering process, different pcb boards need to be chosen for different batches product and test, versatility is the highest and testing efficiency is low.
Summary of the invention
Based on this, this utility model is to overcome the defect of prior art, it is provided that the Reflow Soldering thermometric plate that a kind of versatility is high, testing efficiency is high.
Its technical scheme is as follows:
A kind of Reflow Soldering thermometric plate, including thermometric plate body, described thermometric plate body divides and has at least two region, and the internal layer stack-design in different described regions and/or interlayer interconnection situation are different.
Wherein in an embodiment, described thermometric plate body is provided with four regions, it is respectively first area, second area, the 3rd region and the 4th region, the internal layer of described first area is all containing internal layer copper, and each layer is connected by plated-through hole, the internal layer of described second area is all without internal layer copper, and each layer is connected without plated-through hole, the internal layer in described 3rd region is all without internal layer copper, and each layer is connected by plated-through hole, described four-range internal layer is all containing internal layer copper, and each layer is connected without plated-through hole.
Wherein in an embodiment, described first area includes two regions, the respectively first subregion and the second subregion, and described first subregion is different with the aperture of the second subregional plated-through hole.
Wherein in an embodiment, described 3rd region includes two regions, the respectively the 3rd subregion and the 4th subregion, and described 3rd subregion is different with the aperture of the 4th subregional plated-through hole.
Wherein in an embodiment, it is equipped with top layer figure on the upper epidermis in each described region and layer, the top layer figure in each described region all contains BGA (BallGridArray, ball grid array structure), SMT (SurfaceMountTechnology, surface mounting technology) and/or QFP (PlasticQuadFlatPackage, Quad Flat formula encapsulation technology) typical surface attachment figure.
Wherein in an embodiment, the top layer graphic designs in each described region is identical.
Wherein in an embodiment, the top layer figure in each described region adds test components and parts.
Wherein in an embodiment, the periphery of the top layer figure in each described region is provided with additional pad.
The beneficial effects of the utility model are:
Thermometric plate body is divided at least two region, and the internal layer stack-design of zones of different and/or interlayer interconnection situation are different.The internal layer stack-design in the described each region of thermometric plate body and interlayer interconnection situation can represent the design conditions of most pcb board.Actual when carrying out temperature test, PCB for different batches produces panel products, only need this thermometric plate body is carried out a test comparison, just most pcb board temperature contrast of the various feature structure of plate body in reflow process can comprehensive be reflected, and then easily reflow soldering process, furnace temperature can be arranged and be analyzed, for furnace temperature, the certain reference of offer is set.Described Reflow Soldering thermometric plate is applicable to different batches, the furnace temperature debugging of different types of PCB production plate, and versatility is high, furnace temperature debugging efficiency is high.
Accompanying drawing explanation
Fig. 1 is the structural representation of the Reflow Soldering thermometric plate described in this utility model embodiment；
Fig. 2 is the sectional view of the first area described in this utility model embodiment；
Fig. 3 is the sectional view of the second area described in this utility model embodiment；
Fig. 4 is the sectional view in the 3rd region described in this utility model embodiment；
Fig. 5 is the four-range sectional view described in this utility model embodiment；
Fig. 6 is the structural representation of the top layer figure described in this utility model embodiment.
Description of reference numerals:
10, thermometric plate body, 110, base material, 120, top layer copper, 130, welding resistance, 140, internal layer copper, 150, plated-through hole, 10a, first area, 10b, second area, 10c, the 3rd region, 10d, the 4th region, 20, top layer figure.
Detailed description of the invention
Below embodiment of the present utility model is described in detail:
As shown in Figure 1 and Figure 2, a kind of Reflow Soldering thermometric plate, including thermometric plate body 10, described thermometric plate body 10 divides and has at least two region, the internal layer stack-design in different described regions and/or interlayer interconnection situation are different.Described thermometric plate body 10 is PCB multilayer board, and thermometric plate body 10 main body is made up of base material 110, and the upper and lower surface of thermometric plate body 10 is coated with top layer copper 120 and welding resistance 130.Thermometric plate body 10 is divided at least two region, and the internal layer stack-design of zones of different and/or interlayer interconnection situation are different, and the internal layer stack-design in the described each region of thermometric plate body 10 and interlayer interconnection situation can represent the design conditions of most pcb board.Actual when carrying out temperature test, PCB for different batches produces panel products, only need this thermometric plate body 10 is carried out a test comparison, just most pcb board temperature contrast of the various feature structure of plate body in reflow process can comprehensive be reflected, and then easily reflow soldering process, furnace temperature can be arranged and be analyzed, for furnace temperature, the certain reference of offer is set.Described Reflow Soldering thermometric plate is applicable to different batches, the furnace temperature debugging of different types of PCB production plate, and versatility is high, furnace temperature debugging efficiency is high.
Preferably, such as Fig. 2, Fig. 3, Fig. 4, shown in Fig. 5, described thermometric plate body 10 is provided with four regions, it is respectively first area 10a, second area 10b, 3rd region 10c and the 4th region 10d, the internal layer of described first area 10a is all containing internal layer copper 140, and each layer is connected by plated-through hole 150, the internal layer of described second area 10b is all without internal layer copper 140, and each layer is connected without plated-through hole 150, the internal layer of described 3rd region 10c is all without internal layer copper 140, and each layer is connected by plated-through hole 150, the internal layer of described 4th region 10d is all containing internal layer copper 140, and each layer is connected without plated-through hole 150.Described thermometric plate body 10 is divided into 4 regions and is correspondingly arranged into aforesaid way, described thermometric plate body 10 is on the basis of structure design is simple, easy to make, and the design conditions of most of pcb board can be represented, can comprehensively reflect most pcb board temperature contrast of the various feature structure of plate body in reflow process, offer reference is set for reflow soldering process.
Preferably, described first area 10a includes two regions, the respectively first subregion and the second subregion (not shown), and described first subregion is different with the aperture of the second subregional plated-through hole 150.Described 3rd region 10c includes two regions, the respectively the 3rd subregion and the 4th subregion (not shown), and described 3rd subregion is different with the aperture of the 4th subregional plated-through hole 150.By first area 10a and the 3rd region 10c is segmented further, the aperture making plated-through hole 150 is different, the scope of the pcb board of representative, the range of application of increase Reflow Soldering thermometric plate described in the present embodiment can be expanded further, improve the accuracy that reflow soldering process is arranged instruction.
As shown in Figure 6, the upper epidermis in each described region and layer being equipped with top layer figure 20, the top layer figure 20 in each described region all contains BGA, SMT and/or QFP typical surface attachment figure.It is designed to the top layer figure 20 in each region contain BGA, SMT and/or QFP typical surface attachment figure, consistent with most of pcb board top layers figure, Reflow Soldering thermometric plate described in the present embodiment can the most comprehensively reflect most pcb board temperature contrast of the various feature structure of plate body in reflow process, it is possible to arrange the reference information providing certain for furnace temperature.Preferably, the top layer figure 20 in each described region designs identical, and the Reflow Soldering thermometric plate design described in the present embodiment is simple, easily manufactured.Preferably, the top layer figure 20 in each described region adds test components and parts, actual when carrying out temperature test, can across comparison test components and parts temperature-responsive situation under each feature structure further, for furnace temperature, the reliable reference of offer is set.The periphery of the top layer figure 20 in each described region is additionally provided with additional pad, is used for holing.
Thermometric plate body 10 is divided at least two region by the Reflow Soldering thermometric plate described in the present embodiment, the internal layer stack-design of zones of different and/or interlayer interconnection situation are different, the internal layer stack-design in the most each region and interlayer interconnection situation can be mutually combined design, and then make thermometric plate body 10 can represent the design conditions of most pcb board.When carrying out temperature test, only need this thermometric plate body 10 is carried out a test comparison, just most pcb board temperature contrast of the various feature structure of plate body in reflow process can comprehensive be reflected, and then easily and accurately reflow soldering process, furnace temperature can be arranged and be analyzed, for furnace temperature, the certain reference of offer is set.The top layer figure 20 in each region all contains BGA, SMT and/or QFP typical surface attachment figure, consistent with most of pcb board top layers figure, and then can represent most of pcb board.When reality manufactures the Reflow Soldering thermometric plate described in the present embodiment, a series of different number of plies, this Reflow Soldering thermometric plate of different thickness of slab can be produced, select before producing and produce the close thermometric plate of the panel products number of plies, thickness of slab with PCB and carry out specific aim furnace temperature debugging, testing efficiency height.Described Reflow Soldering thermometric plate is applicable to different batches, the furnace temperature debugging of different types of PCB production plate, and simple in construction, versatility are high, furnace temperature debugging efficiency is high.
Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, all it is considered to be the scope that this specification is recorded.
Embodiment described above only have expressed several embodiments of the present utility model, and it describes more concrete and detailed, but therefore can not be interpreted as the restriction to utility model patent scope.It should be pointed out that, for the person of ordinary skill of the art, without departing from the concept of the premise utility, it is also possible to make some deformation and improvement, these broadly fall into protection domain of the present utility model.Therefore, the protection domain of this utility model patent should be as the criterion with claims.
Claims (8)
1. a Reflow Soldering thermometric plate, it is characterised in that include thermometric plate body, described thermometric plate body divides and has at least two region, and the internal layer stack-design in different described regions and/or interlayer interconnection situation are different.
Reflow Soldering thermometric plate the most according to claim 1, it is characterized in that, described thermometric plate body is provided with four regions, it is respectively first area, second area, the 3rd region and the 4th region, the internal layer of described first area is all containing internal layer copper, and each layer is connected by plated-through hole, the internal layer of described second area is all without internal layer copper, and each layer is connected without plated-through hole, the internal layer in described 3rd region is all without internal layer copper, and each layer is connected by plated-through hole, described four-range internal layer is all containing internal layer copper, and each layer is connected without plated-through hole.
Reflow Soldering thermometric plate the most according to claim 2, it is characterised in that described first area includes two regions, the respectively first subregion and the second subregion, and described first subregion is different with the aperture of the second subregional plated-through hole.
Reflow Soldering thermometric plate the most according to claim 2, it is characterised in that described 3rd region includes two regions, the respectively the 3rd subregion and the 4th subregion, and described 3rd subregion is different with the aperture of the 4th subregional plated-through hole.
5., according to the Reflow Soldering thermometric plate described in any one of claim 1-4, it is characterised in that be equipped with top layer figure on the upper epidermis in each described region and layer, the top layer figure in each described region all contains BGA, SMT and/or QFP typical surface attachment figure.
Reflow Soldering thermometric plate the most according to claim 5, it is characterised in that the top layer graphic designs in each described region is identical.
Reflow Soldering thermometric plate the most according to claim 5, it is characterised in that add test components and parts on the top layer figure in each described region.
Reflow Soldering thermometric plate the most according to claim 5, it is characterised in that the periphery of the top layer figure in each described region is provided with additional pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521142871.3U CN205454257U (en) | 2015-12-30 | 2015-12-30 | Reflow soldering temperature measurement board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521142871.3U CN205454257U (en) | 2015-12-30 | 2015-12-30 | Reflow soldering temperature measurement board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205454257U true CN205454257U (en) | 2016-08-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521142871.3U Expired - Fee Related CN205454257U (en) | 2015-12-30 | 2015-12-30 | Reflow soldering temperature measurement board |
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| CN (1) | CN205454257U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107645847A (en) * | 2017-08-31 | 2018-01-30 | 郑州云海信息技术有限公司 | A kind of thermometric plate and temp measuring system |
| CN108106745A (en) * | 2017-05-24 | 2018-06-01 | 郑州云海信息技术有限公司 | It is a kind of to bury point methods for BGA repair thermometric plates |
| CN111781232A (en) * | 2020-06-30 | 2020-10-16 | 伟凯美(深圳)自动化技术有限公司 | Performance evaluation device building method for reflow soldering equipment |
-
2015
- 2015-12-30 CN CN201521142871.3U patent/CN205454257U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108106745A (en) * | 2017-05-24 | 2018-06-01 | 郑州云海信息技术有限公司 | It is a kind of to bury point methods for BGA repair thermometric plates |
| CN107645847A (en) * | 2017-08-31 | 2018-01-30 | 郑州云海信息技术有限公司 | A kind of thermometric plate and temp measuring system |
| CN111781232A (en) * | 2020-06-30 | 2020-10-16 | 伟凯美(深圳)自动化技术有限公司 | Performance evaluation device building method for reflow soldering equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160810 Termination date: 20201230 |