CN205596447U - Be difficult for exploding ALL copper face PCB board of board - Google Patents
Be difficult for exploding ALL copper face PCB board of board Download PDFInfo
- Publication number
- CN205596447U CN205596447U CN201620412997.6U CN201620412997U CN205596447U CN 205596447 U CN205596447 U CN 205596447U CN 201620412997 U CN201620412997 U CN 201620412997U CN 205596447 U CN205596447 U CN 205596447U
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- Prior art keywords
- pcb board
- copper face
- board
- difficult
- utility
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Abstract
The utility model relates to a PCB board technical field especially relates to a be difficult for exploding ALL copper face PCB board of board, including the PCB board the one side of PCB board sets up for the ALL copper face, non - hole on the copper face and the non - department of windowing are provided with the explosion -proof pad dish of non - copper product matter, it is provided with the solder mask to cover on copper face and the pad dish. The utility model discloses an invention aim at provides a be difficult for exploding ALL copper face PCB board of board, adopts the utility model provides a technical scheme is favorable to releasing the thermal stress of PCB board, has reduced the PCB board and has exploded the board risk.
Description
Technical field
This utility model relates to pcb board technical field, particularly relates to a kind of full copper face PCB being difficult to plate bursting
Plate.
Background technology
Along with electronic product is to high density, high accuracy development, the requirement to wiring board is more and more higher.And
Improving pcb board density most efficient method is to reduce the quantity of through hole, and accurately arranges blind hole and buried via hole
Realize.The higher HDI plate of the circuit distribution density that uses micro-blind buried via hole technology to make is increasingly by extensively
Be applied to all trades and professions.How to ensure the high-quality requirement of HDI plate, the important pass of Ye Shige PCB producer
The problem of note. wherein cause HDI plate bursting problem to happen occasionally because of design factor, mainly show as buried via hole close
Collection big copper face position, region goes out the layering plate bursting of occurrence outer layer.
Under the carefully studying and verify of inventor, find that prior art the reason of plate bursting situation occurs such as
Under:
1, the distribution area of pcb board design double-side copper differs greatly, and the opposite of components and parts close quarters is general
Being designed as full copper face (if top face is component side, bottom face is then full copper face), pcb board is at high temperature
PCB itself can be made after test and patch to produce a large amount of thermal stress, and a stress of big copper face design is difficult to
Release；
2, it is the most intensive that the local buried via hole that components and parts are intensive designs, the position that buried via hole design is the most intensive
Put, the situation that relatively easy generation filler is bad during producing PCB, and the local appearance that filler is bad
It is easily generated layering plate bursting.
Utility model content
Goal of the invention of the present utility model is to provide a kind of full copper face pcb board being difficult to plate bursting, uses this
The technical scheme that utility model provides is conducive to discharging the thermal stress of pcb board, reduces pcb board plate bursting wind
Danger.
In order to solve above-mentioned technical problem, this utility model provides a kind of full copper face pcb board being difficult to plate bursting,
Including pcb board, the one side at described pcb board is that full copper face is arranged；Non-hole on described copper face and non-
The place of windowing is provided with the explosion-proof pad dish of non-copper material；Described copper face and pad dish cover and is provided with resistance
Layer.
Therefore, the technical scheme of application this utility model embodiment, have the advantages that:
This utility model is provided with non-copper explosion-proof pad dish by having in the one side of copper face at pcb board,
The position that blind hole in added region avoided by pad dish simultaneously and through hole and welding resistance are windowed, this pad dish is at PCB
Plate is conducive to Stress Release when there is thermal stress, greatly reduces plate bursting risk, thus reduces defective products
Occur.
As further improvement of the utility model, described pcb board offers ground connection buried via hole and via；
Described ground connection buried via hole is arranged near described via, and this structure can avoid the buried via hole that local is the most intensive as far as possible
Design conditions, contributes to PCB manufacturing process and guarantees filler quality, the generation of effective pre-bursting diaphragm.
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, below will
The accompanying drawing used required in this utility model embodiment or description of the prior art is briefly described.Aobvious
And easy insight, the accompanying drawing in describing below is only a part of embodiment of the present utility model, for ability
From the point of view of the those of ordinary skill of territory, on the premise of not paying creative work, it is also possible to attached according to these
Figure obtains other accompanying drawing.
Fig. 1 is this utility model example structure schematic diagram；
Fig. 2 is this utility model embodiment sectional view；
Fig. 3 is enlarged drawing at A in this utility model embodiment Fig. 2.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, to the technology in this utility model embodiment
Scheme is explicitly described.Obviously, described embodiment is only that this utility model part is implemented
Example rather than whole embodiments.The technical scheme proposed based on the embodiment in this utility model, this
The every other embodiment that field those of ordinary skill is obtained under not making creative work premise,
Broadly fall into the scope of this utility model protection.
Embodiment
Owing to the distribution area of pcb board design double-side copper differs greatly, the one side one of components and parts close quarters
As be designed as full copper face, pcb board can make after high temperature test and patch PCB itself produce a large amount of thermal stress,
Big copper face design makes stress be difficult to discharge, and in turn results in plate bursting phenomenon.In order to reduce plate bursting phenomenon, as
Shown in Fig. 1-3, present embodiment discloses a kind of full copper face pcb board being difficult to plate bursting, including pcb board 10,
The back side encapsulating correspondence on described pcb board 10 is that full copper face 20 is arranged, and offers on pcb board 10
Position, hole 11 and assembly welding window, be provided with the explosion-proof pad dish 30 of non-copper material on described copper face 11, should
Pad dish 30 is avoided the position of position, hole 11 and assembly welding window and is arranged on copper face 20, at described copper face and pad
Cover on dish and be provided with solder mask 40.Owing to pad dish 30 is non-copper material, it is simultaneously located at copper face 20
On, be conducive to Stress Release when pcb board exists thermal stress, greatly reduce plate bursting risk, thus drop
The generation of low defective products.
Owing to buried via hole designs the situation that the most intensive easy generation filler is bad, in order to avoid filler is bad
Local generation is layered plate bursting, offers ground connection buried via hole and via on described pcb board 10, and described ground connection is buried
Hole is arranged near described via, reduces ground connection buried via hole quantity in the case of not changing former electric property simultaneously,
Avoid the buried via hole design conditions that local is the most intensive as far as possible, contribute to PCB manufacturing process and guarantee filler quality,
Can the generation of effective pre-bursting diaphragm.
For pcb board 10 resting period before client SMT is reached the standard grade long plate bursting situation caused, can
With increase before use once baking plate improve.
Embodiments described above, is not intended that the restriction to this technical scheme protection domain.Any
Amendment, equivalent and the improvement etc. made within the spirit of above-mentioned embodiment and principle, all should comprise
Within the protection domain of this technical scheme.
Claims (2)
1. it is difficult to a full copper face pcb board for plate bursting, including pcb board, it is characterised in that:
One side at described pcb board is that full copper face is arranged；
Non-hole on described copper face and the non-place of windowing are provided with the explosion-proof pad dish of non-copper material；
Described copper face and pad dish cover and is provided with solder mask.
A kind of full copper face pcb board being difficult to plate bursting the most according to claim 1, it is characterised in that:
Described pcb board offers ground connection buried via hole and via；
Described ground connection buried via hole is arranged near described via.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620412997.6U CN205596447U (en) | 2016-05-06 | 2016-05-06 | Be difficult for exploding ALL copper face PCB board of board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620412997.6U CN205596447U (en) | 2016-05-06 | 2016-05-06 | Be difficult for exploding ALL copper face PCB board of board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205596447U true CN205596447U (en) | 2016-09-21 |
Family
ID=56931815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620412997.6U Expired - Fee Related CN205596447U (en) | 2016-05-06 | 2016-05-06 | Be difficult for exploding ALL copper face PCB board of board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205596447U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112435998A (en) * | 2020-12-15 | 2021-03-02 | 南京工业职业技术大学 | Thermal stress management engine of GaN HEMT device |
-
2016
- 2016-05-06 CN CN201620412997.6U patent/CN205596447U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112435998A (en) * | 2020-12-15 | 2021-03-02 | 南京工业职业技术大学 | Thermal stress management engine of GaN HEMT device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160921 Termination date: 20210506 |