CN205693970U - Printed circuit board (PCB) - Google Patents

Printed circuit board (PCB) Download PDF

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Publication number
CN205693970U
CN205693970U CN201620558216.4U CN201620558216U CN205693970U CN 205693970 U CN205693970 U CN 205693970U CN 201620558216 U CN201620558216 U CN 201620558216U CN 205693970 U CN205693970 U CN 205693970U
Authority
CN
China
Prior art keywords
layer
pcb
printed circuit
circuit board
installing hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201620558216.4U
Other languages
Chinese (zh)
Inventor
卢涛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanchang Hangkong University
Original Assignee
Nanchang Hangkong University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanchang Hangkong University filed Critical Nanchang Hangkong University
Priority to CN201620558216.4U priority Critical patent/CN205693970U/en
Application granted granted Critical
Publication of CN205693970U publication Critical patent/CN205693970U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of printed circuit board (PCB), relating to electronic device field, the circuit layer of this printed circuit board (PCB) is zigzag with the contact surface of dielectric layer and welding resisting layer, and circuit layer is provided with installing hole, installing hole is drum, and the height of installing hole is more than the thickness of circuit layer.The pin of electronic component welds on a printed circuit in can be inserted into installing hole again.What the installing hole of jagged circuit layer and protrusion can increase circuit layer and dielectric layer and welding resisting layer contacts tightness degree, improves the compactness of this printed circuit board (PCB).

Description

Printed circuit board (PCB)
Technical field
This utility model relates to electronic device field, particularly to a kind of printed circuit board (PCB).
Background technology
Printed circuit board (PCB) is one of internal indispensable parts of electronic installation, and semiconductor integrated circuit core is distributed on it The multiple electronic component relevant to device running such as sheet, above-mentioned electronic component is certain by the wiring composition on printed circuit board (PCB) Application circuit, so that electronic installation is able to normal operation.Printed circuit board (PCB) can be divided into dielectric layer, circuit layer, welding resisting layer.But The circuit layer of existing printed circuit board (PCB) and dielectric layer, the contact surface of welding resisting layer are plane, and contact tightness degree is limited, cause holding Easily there is loose or dislocation, affect printed circuit board (PCB) and normally use.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of printed circuit board (PCB), circuit layer upper surface and under Surface configuration cross section indention structure, improves circuit layer and dielectric layer and the contact area of welding resisting layer, improves printed circuit The compactness of plate.
For achieving the above object, this utility model provides following technical scheme: a kind of printed circuit board (PCB), its feature exists The welding resisting layer that includes being pasted together the most successively in: described printed circuit board (PCB), circuit layer, dielectric layer, circuit layer and Jie The contact surface of electric layer and welding resisting layer is zigzag, and circuit layer is provided with installing hole, and installing hole is drum, the height of installing hole Thickness more than circuit layer.
Preferably, described dielectric layer is manufactured by polyflon material.
Preferably, described circuit layer is manufactured by pyrite.
Preferably, described welding resisting layer is manufactured by polyimide resin film.
Above technical scheme is used to provide the benefit that: connecing of the circuit layer of this printed circuit board (PCB) and dielectric layer and welding resisting layer Contacting surface is zigzag, and circuit layer is provided with installing hole, and installing hole is drum, and the height of installing hole is more than the thickness of circuit layer Degree.The pin of electronic component welds on a printed circuit in can be inserted into installing hole again.Jagged circuit layer and protrusion What installing hole can increase circuit layer and dielectric layer and welding resisting layer contacts tightness degree, improves the compactness of this printed circuit board (PCB).
Accompanying drawing explanation
Below in conjunction with the accompanying drawings detailed description of the invention of the present utility model is described in further detail.
Fig. 1 is the structure sectional view of a kind of printed circuit board (PCB) of this utility model.
Wherein, 1--dielectric layer, 2--circuit layer, 3--welding resisting layer, 4 installing holes.
Detailed description of the invention
Describe the preferred implementation of a kind of printed circuit board (PCB) of this utility model below in conjunction with the accompanying drawings in detail.
Fig. 1 shows the detailed description of the invention of a kind of printed circuit board (PCB) of this utility model: this printed circuit board (PCB) include to Under be pasted together successively welding resisting layer 3, circuit layer 2, dielectric layer 1, circuit layer 2 is equal with the contact surface of dielectric layer 1 and welding resisting layer 3 For zigzag, increase circuit layer 2 and dielectric layer 1 and the contact area of welding resisting layer 3.Circuit layer 2 is provided with installing hole 4, installing hole 4 For drum, the height of installing hole 4 is more than the thickness of circuit layer 2.
As it is shown in figure 1, dielectric layer 1 is manufactured by polyflon material, there is enough hardness and insulating properties, it is possible to Function well as supporting role.Circuit layer 2 is manufactured by pyrite, conducts electricity very well, and circuit layer 2 is as conducting between electronic component Instrument.Welding resisting layer 3 is manufactured by polyimide resin film, polyimide resin film have high temperature resistant, shielding good, Solder resistance height The advantage strong with ductility.
The pin of electronic component welds on a printed circuit in can be inserted into installing hole 4 again.The top of jagged circuit layer 2 What the installing hole 4 of face and bottom surface and protrusion can increase circuit layer 2 and dielectric layer 1 and welding resisting layer 3 contacts tightness degree, improves The compactness of this printed circuit board (PCB).
Above is only preferred implementation of the present utility model, it is noted that for those of ordinary skill in the art For, on the premise of creating design without departing from this utility model, it is also possible to make some deformation and improvement, these broadly fall into this The protection domain of utility model.

Claims (4)

1. a printed circuit board (PCB), it is characterised in that: described printed circuit board (PCB) includes that be pasted together the most successively prevents Layer (3), circuit layer (2), dielectric layer (1), circuit layer (2) is sawtooth with the contact surface of dielectric layer (1) and welding resisting layer (3) Shape, circuit layer (2) is provided with installing hole (4), and installing hole (4) is drum, and the height of installing hole (4) is more than circuit layer (2) Thickness.
Printed circuit board (PCB) the most according to claim 1, it is characterised in that: described dielectric layer (1) is by polyflon Material manufactures.
Printed circuit board (PCB) the most according to claim 1, it is characterised in that: described circuit layer (2) is manufactured by pyrite.
Printed circuit board (PCB) the most according to claim 1, it is characterised in that: described welding resisting layer (3) is by polyimide resin film Manufacture.
CN201620558216.4U 2016-06-12 2016-06-12 Printed circuit board (PCB) Expired - Fee Related CN205693970U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620558216.4U CN205693970U (en) 2016-06-12 2016-06-12 Printed circuit board (PCB)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620558216.4U CN205693970U (en) 2016-06-12 2016-06-12 Printed circuit board (PCB)

Publications (1)

Publication Number Publication Date
CN205693970U true CN205693970U (en) 2016-11-16

Family

ID=57260301

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620558216.4U Expired - Fee Related CN205693970U (en) 2016-06-12 2016-06-12 Printed circuit board (PCB)

Country Status (1)

Country Link
CN (1) CN205693970U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20161116

Termination date: 20170612

CF01 Termination of patent right due to non-payment of annual fee