CN205491444U - Power circuit board - Google Patents
Power circuit board Download PDFInfo
- Publication number
- CN205491444U CN205491444U CN201620059185.8U CN201620059185U CN205491444U CN 205491444 U CN205491444 U CN 205491444U CN 201620059185 U CN201620059185 U CN 201620059185U CN 205491444 U CN205491444 U CN 205491444U
- Authority
- CN
- China
- Prior art keywords
- pad
- circuit board
- insulating barrier
- power supply
- supply circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model relates to a power circuit board, include: a circuit board bod, be provided with a plurality of pads on the circuit edition of books body, the pad includes first pad, second pad and a plurality of third pad, the third pad respectively with first pad reaches the phase separation of second pad still includes bonding conductor and insulating layer, first pad passes through bonding conductor with the 2nd solder connection, the insulating layer covers at least the bonding conductor surface. The utility model discloses an insulating layer will be connected in the bonding conductor cover of first pad with the second pad, make bonding conductor surface insulation for soldering tin can't cover in bonding conductor surface, thereby has avoided being connected of third pad and first pad or second pad, leads to the condition of short circuit, has just reduced the defective rate of product.
Description
Technical field
This utility model relates to circuit board technology field, particularly relates to power supply circuit board.
Background technology
In order to power for FPC (flexible PCB: Flexible Printed Circuit), in general, on FPC
Having external power supply circuit, power circuit is linked on FPC by welding manner, and is fixed on FPC, by
There is on FPC multiple pad, and be by scolding tin, the pad of FPC and power circuit to be carried out even when welding
Connect, and the stitch connection that each pad is corresponding with power circuit respectively, owing to scolding tin is liquid when welding
State, easily flows, then, careless slightly, pad is easily connected by scolding tin with other pads, so, leads
Cause product fraction defective higher, after FPC energising, it will cause FPC short circuit, cause FPC to damage.
Utility model content
Based on this, it is necessary to easily cause weldering due to the misconnection of scolding tin for existing power supply circuit board when welding
The defect of dish short circuit, it is provided that power supply circuit board, is prevented effectively from owing to scolding tin causes pad short circuit, causes product
The problem that fraction defective is high.
A kind of power supply circuit board, including:
Circuit board body, described circuit board body is provided with multiple pad, described pad include the first pad,
Second pad and multiple 3rd pad, described 3rd pad respectively with described first pad and described second pad
Being separated, also include connecting conductor and insulating barrier, described first pad is by described connection conductor and described the
Two pads connect, and described insulating barrier at least covers described connection conductive surface.
In one embodiment, described insulating barrier is covered in the surface of described connection conductor and extended.
In one embodiment, described insulating barrier is prolonged by both sides to described connection conductor on described connection conductor
Stretch formation flank section.
In one embodiment, described insulating barrier and the distance of described first pad are equal to described insulating barrier and institute
State the distance of the second pad.
In one embodiment, described first pad is the first ground pad, and described second pad is second to connect
Ground pad.
In one embodiment, multiple described 3rd pads are respectively arranged at described first pad both sides.
In one embodiment, multiple described 3rd pads are respectively parallel to described first pad.
In one embodiment, described first pad is mutually perpendicular to described second pad.
In one embodiment, the thickness of described insulating barrier is set to 0.03mm～0.06mm.
In one embodiment, described insulating barrier is silk-screen layer.
Above-mentioned power supply circuit board, is covered the connection conductor being connected to the first pad and the second pad by insulating barrier
Lid, makes connection conductor surface insulation so that scolding tin cannot be covered in connection conductive surface, thus avoids the
Three pads and the first pad or the connection of the second pad, cause the situation of short circuit, and reduce the bad of product
Rate.
Accompanying drawing explanation
Fig. 1 is the structural representation of the power supply circuit board of this utility model one embodiment.
Detailed description of the invention
For the ease of understanding this utility model, below with reference to relevant drawings, this utility model is carried out more comprehensively
Description.Accompanying drawing gives better embodiment of the present utility model.But, this utility model can be with
Many different forms realize, however it is not limited to embodiments described herein.On the contrary, provide these
The purpose of embodiment be make disclosure of the present utility model is understood more thorough comprehensively.
It should be noted that when element is referred to as " being arranged at " another element, and it can be directly at another
On individual element or element placed in the middle can also be there is.When an element is considered as " connection " another yuan
Part, it can be directly to another element or may be simultaneously present centering elements.Used herein
Term " vertical ", " level ", "left", "right" and similar statement simply to illustrate that mesh
, being not offered as is unique embodiment.
Unless otherwise defined, all of technology used herein and scientific terminology with belong to of the present utility model
The implication that those skilled in the art are generally understood that is identical.Institute in description of the present utility model herein
The term used is intended merely to describe the purpose of specific embodiment, it is not intended that in limiting this utility model.
Term as used herein " and/or " include the arbitrary and all of one or more relevant Listed Items
Combination.
Such as, a kind of power supply circuit board, comprising: circuit board body, described circuit board body is provided with
Multiple pads, described pad includes the first pad, the second pad and multiple 3rd pad, described 3rd pad
It is separated with described first pad and described second pad respectively, also includes connecting conductor and insulating barrier, described
First pad is connected with described second pad by described connection conductor, and described insulating barrier at least covers described company
Connect conductive surface.
As it is shown in figure 1, the power supply circuit board 10 that it is this utility model one preferred embodiment, including:
Circuit board body 100, described circuit board body 100 is provided with multiple pad 200, described pad 200
Including the first pad the 210, second pad 220 and multiple 3rd pad 230, described 3rd pad 230 is respectively
It is separated with described first pad 210 and described second pad 220, also includes connecting conductor 300 and insulation
First pad 210 described in layer 400 is connected with described second pad 220 by described connection conductor 300, example
As, described first pad 210, described second pad 220 are with described to be connected conductor 300 one-body molded, described
Insulating barrier 400 at least covers described connection conductor 300 surface.Such as, described pad 200 is copper sheet, example
As, described connection conductor 300 is copper sheet, and such as, described copper sheet exposes to described circuit board body 100
Surface forms pad 200, and such as, described circuit board body 100 is glue-free electrolytic copper plate or glue-free electrolytic copper foil,
And for example, described circuit board body 100 is rubber calendering copper coin or rubber calendering copper sheet.
Covered being connected to the first pad 210 connection conductor 300 with the second pad 220 by insulating barrier 400
Lid, makes connection conductor 300 surface insulation so that scolding tin cannot be covered in connection conductor 300 surface, thus
Avoid any one or more 3rd pad 230 and the first pad 210 or connection of the second pad 220, cause
The situation of short circuit, and reduce the fraction defective of product.Owing to described connection conductor 300 surface covers one layer
Insulating barrier 400, therefore when scolding tin, can quickly by bump described first pad 210, described second
On pad 220 and each described 3rd pad 230, and can be by any one or more 3rd pad without taking scolding tin into account
230 are connected with the first pad 210 or the second pad 220, and cause short circuit, therefore can improve the effect of scolding tin
Rate.
In order to improve the insulating properties of described insulating barrier 400, such as, referring again to Fig. 1, described insulating barrier
400 are covered in described connection conductor 300 and extended, and such as, described insulating barrier 400 is led by described connection
Extend to the both sides of described connection conductor 300 on body 300 and form flank section 410, due to other pads 200 points
Not being positioned at the both sides of described first pad 210, such as, multiple described 3rd pads 230 are respectively arranged at institute
Stating the both sides of the first pad 210, such as, multiple described 3rd pads 230 are respectively arranged at described insulating barrier
The both sides of 400, so, the described flank section 410 formed by extension makes described insulating barrier 400 in both sides
There is bigger coverage, when scolding tin, can preferably avoid being stained with on described connection conductor 300
Scolding tin, it is possible to avoid described connection conductor 300 to be connected with the plurality of described 3rd pad 230 so that weldering
Stannum process is the simplest, improves scolding tin efficiency.
Such as, described insulating barrier 400 is covered in the middle part of described connection conductor 300, such as, described insulation
Layer 400 and the distance of described first pad 210 are equal to described insulating barrier 400 and described second pad 220
Distance, it should be understood that described connection conductor 300 two ends respectively with described first pad 210, described
Two pads 220 connect, and therefore, the two ends of described connection conductor 300 need to be exposed, in order to scolding tin, and middle part
Must insulate, it is to avoid large area leaks outside so that being connected with any one or more described 3rd pad 230 during scolding tin and leading
Causing short circuit, therefore, described insulating barrier 400 is covered in the middle part of described connection conductor 300, and described insulation
The distance of one end and described first pad 210 of layer 400 is equal to described insulating barrier 400 other end and described the
The distance of two pads 220, so, it is to avoid the leaking outside of described connection conductor 300, on the other hand, reduces
The area coverage of described insulating barrier 400, thus reduce the cost of insulating barrier 400.
Such as, described first pad 210 is the first ground pad, and described second pad 220 is the second ground connection
Pad, such as, described first pad 210 is the first ground pin, and such as, described second pad 220 is
Second ground pin, described first ground pin is connected conductor 300 with described second ground pin by described
Connect, be used for as power circuit ground connection.
In one embodiment, referring again to Fig. 1, multiple described 3rd pads 230 are respectively arranged at described
First pad 210 both sides, such as, multiple described 3rd pads 230 are respectively parallel to described first pad 210,
Such as, described first pad 210 is mutually perpendicular to described second pad 220.
So that scolding tin is the most firm, described insulating barrier 400 thickness is unsuitable blocked up, is otherwise easily caused institute
State and weld built on the sand between circuit board body 100 and power circuit, such as, the thickness of described insulating barrier 400
Degree is set to 0.03mm～0.06mm, it is preferable that the thickness of described insulating barrier 400 is set to 0.05mm,
So, owing to the thickness of described insulating barrier 400 is the least, to described circuit board body 100 and power circuit it
Between impact the least so that circuit board body 100 is welded the most firm with power circuit.
It is covered in described connection conductor 300 for the ease of described insulating barrier 400, and makes described insulating barrier 400
Thickness less, such as, described insulating barrier 400 is silk-screen layer, such as, described silk-screen layer be silk-screen oil,
Such as, at described one layer of silk-screen oil of connection conductor 300 surface-coated, such as, at described connection conductor 300
Surface laterally coats one layer of silk-screen oil, such as, laterally coats on described connection conductor 300 surface and both sides thereof
One layer of silk-screen oil, on the one hand, described silk-screen oil has good insulating properties, and it is covered in described connection
Insulating barrier 400 thickness formed after conductor 300 is the least, the most described circuit board body 100 and power supply
The welding of circuit, on the other hand, described silk-screen oil has the convenient feature of coating, it is possible to efficiently, rapidly
Described connection conductor 300 is formed insulating barrier 400, thus improves production efficiency.
Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, the most right
The all possible combination of each technical characteristic in above-described embodiment is all described, but, if these skills
There is not contradiction in the combination of art feature, is all considered to be the scope that this specification is recorded.
Embodiment described above only have expressed several embodiments of the present utility model, its describe more concrete and
In detail, but therefore can not be interpreted as the restriction to utility model patent scope.It should be pointed out that, it is right
For those of ordinary skill in the art, without departing from the concept of the premise utility, it is also possible to do
Going out some deformation and improvement, these broadly fall into protection domain of the present utility model.Therefore, this utility model is special
The protection domain of profit should be as the criterion with claims.
Claims (10)
1. a power supply circuit board, it is characterised in that including: circuit board body, in described circuit board body
Being provided with multiple pad, described pad includes the first pad, the second pad and multiple 3rd pad, described
Three pads are separated with described first pad and described second pad respectively, also include connecting conductor and insulating barrier,
Described first pad is connected with described second pad by described connection conductor, and described insulating barrier at least covers institute
State connection conductive surface.
Power supply circuit board the most according to claim 1, it is characterised in that described insulating barrier is covered in institute
State and connect the surface of conductor and extended.
Power supply circuit board the most according to claim 2, it is characterised in that described insulating barrier is by described company
Connect to extend to the both sides of described connection conductor on conductor and form flank section.
Power supply circuit board the most according to claim 2, it is characterised in that described insulating barrier and described the
The distance of one pad is equal to the distance of described insulating barrier with described second pad.
Power supply circuit board the most according to claim 1, it is characterised in that described first pad is first
Ground pad, described second pad is the second ground pad.
Power supply circuit board the most according to claim 1, it is characterised in that multiple described 3rd pads divide
It is not arranged at described first pad both sides.
Power supply circuit board the most according to claim 6, it is characterised in that multiple described 3rd pads divide
It is not parallel to described first pad.
Power supply circuit board the most according to claim 7, it is characterised in that described first pad is with described
Second pad is mutually perpendicular to.
Power supply circuit board the most according to claim 1, it is characterised in that the thickness of described insulating barrier sets
It is set to 0.03mm～0.06mm.
Power supply circuit board the most according to claim 1, it is characterised in that described insulating barrier is silk-screen
Layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620059185.8U CN205491444U (en) | 2016-01-21 | 2016-01-21 | Power circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620059185.8U CN205491444U (en) | 2016-01-21 | 2016-01-21 | Power circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205491444U true CN205491444U (en) | 2016-08-17 |
Family
ID=56638113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620059185.8U Expired - Fee Related CN205491444U (en) | 2016-01-21 | 2016-01-21 | Power circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205491444U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108260277A (en) * | 2018-01-10 | 2018-07-06 | 广东欧珀移动通信有限公司 | Backlight circuit, circuit board and electronic equipment |
-
2016
- 2016-01-21 CN CN201620059185.8U patent/CN205491444U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108260277A (en) * | 2018-01-10 | 2018-07-06 | 广东欧珀移动通信有限公司 | Backlight circuit, circuit board and electronic equipment |
| CN108260277B (en) * | 2018-01-10 | 2020-01-10 | Oppo广东移动通信有限公司 | Backlight circuit, circuit board and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160817 Termination date: 20170121 |