CN207802535U - Prevent the flexible circuit board that soldered elements fall off - Google Patents
Prevent the flexible circuit board that soldered elements fall off Download PDFInfo
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- CN207802535U CN207802535U CN201721852591.0U CN201721852591U CN207802535U CN 207802535 U CN207802535 U CN 207802535U CN 201721852591 U CN201721852591 U CN 201721852591U CN 207802535 U CN207802535 U CN 207802535U
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- circuit board
- flexible circuit
- pore structure
- aperture
- component pads
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Abstract
The utility model discloses a kind of flexible circuit board for preventing soldered elements from falling off, including at least one layer of flexible base board and at least one layer of line layer, the line layer is equipped with the component pads for installing soldered elements, the flexible circuit board is internally corresponding to the component pads and is equipped with pore structure, the aperture at the pore structure both ends is different, it is less than its aperture far from described component pads one end close to the aperture of described component pads one end, there is the pore structure metallization inner wall, the metallization inner wall to connect the component pads.The utility model embodiment has the following advantages：By the way that the pore structure being connect with component pads is arranged in flexible circuit board, and the aperture at pore structure both ends is different, can increase the binding force with flexible circuit board, improve the fastness of soldered elements, it avoids falling off from flexible circuit board, and then increases the service life of flexible circuit board.
Description
Technical field
The utility model is related to wiring board technology fields, and in particular to a kind of flexible circuitry for preventing soldered elements from falling off
Plate.
Background technology
Wiring board is important the supporter of electronic unit and electronic component and the offer of electronic element circuit connection
Person.With the development of electronic manufacturing technology, more and more electronic products use SMT（Surface mount process）To complete wiring board
Production.SMT can improve production efficiency, but also bring the shortcomings that can not be ignored, for example electronic component not prison welding is asked
Topic.
Utility model content
The utility model embodiment provides a kind of flexible circuit board for preventing soldered elements from falling off, for improving soldered elements
Fastness, avoid falling off from flexible circuit board.
The technical solution adopted in the utility model is：
A kind of flexible circuit board for preventing soldered elements from falling off, including at least one layer of flexible base board and at least one layer of circuit
Layer, the line layer are equipped with the component pads for installing soldered elements, and the flexible circuit board is internally corresponding to the member
Part pad is equipped with pore structure, and the aperture at the pore structure both ends is different, is less than it close to the aperture of described component pads one end
There is metallization inner wall, the metallization inner wall to connect the member for aperture far from described component pads one end, the pore structure
Part pad.
As can be seen from the above technical solutions, the utility model embodiment has the following advantages：
By the way that the pore structure being connect with component pads is arranged in flexible circuit board, and the aperture at pore structure both ends is different,
The binding force with flexible circuit board can be increased, improve the fastness of soldered elements, avoid falling off from flexible circuit board, in turn
Increase the service life of flexible circuit board.
Description of the drawings
It, below will be to embodiment and description of the prior art in order to illustrate more clearly of the utility model embodiment technical solution
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only the utility model
Some embodiments for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other attached drawings.
Fig. 1 is a kind of structure for flexible circuit board for preventing soldered elements from falling off that the utility model one embodiment provides
Schematic diagram；
Fig. 2 is a kind of structure for flexible circuit board for preventing soldered elements from falling off that another embodiment of the utility model provides
Schematic diagram.
Specific implementation mode
In order to make those skilled in the art more fully understand the utility model, below in conjunction with the utility model reality
The attached drawing in example is applied, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that described
Embodiment is only the embodiment of the utility model part, instead of all the embodiments.Based on the reality in the utility model
Example is applied, every other embodiment obtained by those of ordinary skill in the art without making creative efforts is all answered
When the range for belonging to the utility model protection.
Term " first " in the specification and claims of the utility model and above-mentioned attached drawing, " second ", " third "
Etc. being for distinguishing different objects, rather than for describing particular order.In addition, term " comprising " and " having " and they
Any deformation, it is intended that cover and non-exclusive include.Such as contain the process of series of steps or unit, method, system,
The step of product or equipment are not limited to list or unit, but further include the steps that optionally not listing or unit,
Or optionally further include for these processes, method, product or equipment intrinsic other steps or unit.
Below by specific embodiment, it is described in detail respectively.
Referring to FIG. 1, one embodiment of the utility model, provides a kind of flexible circuit board for preventing soldered elements from falling off
10.The flexible circuit board 10 includes at least one layer of flexible base board 11 and at least one layer of line layer 12, to include soft two layers in Fig. 1
For property substrate 11 and three sandwich circuit layers 12.
Wherein one layer of line layer 12 is equipped with the component pads 14 for installing soldered elements 13, the flexible circuitry
Plate 10 is internally corresponding to the component pads 14 and is equipped with pore structure 15, and the aperture at 15 both ends of the pore structure is different, close to institute
The aperture for stating 14 one end of component pads is less than its aperture far from described component pads one end, and the pore structure 15 has metallization
Inner wall 16, the metallization inner wall 16 connect the component pads 14.
Wherein, the pore structure 15 different by the way that both ends aperture is arranged can increase the metallization inner wall 16 of pore structure 15
Area, to increase the binding force with flexible circuit board 10.Further, one end aperture close to component pads of pore structure
Small, other end aperture is big, in this way, can be stuck in the inside of pore structure 15 not easily to fall off for metallization inner wall 16, and then with metallization
The component pads 14 and soldered elements 13 that inner wall 16 connects just preferably are fixed, not easily to fall off.
In some embodiments, it is plated filling inside the pore structure 15, becomes solid hole, it is empty internal for metal column and member
As soon as part pad 14 is linked to be entirety and one end aperture of separate component pads 14 is big, firmly it is fixed in pore structure 15
Portion prevents soldered elements from falling off.
In other embodiments, it can also be filled by insulating materials inside the pore structure 15.The insulating materials can be with
Using epoxy resin etc..
Optionally, the pore structure 15 can be tapered, as shown in fig. 1, a specifically frustum.
Optionally, as shown in Fig. 2, the pore structure 15 can also be by the first blind hole 151 and the second blind hole 152 that are connected
It constitutes, first blind hole 151 is the blind hole close to 14 one end of the component pads, and second blind hole 152 is far from described
The blind hole of 14 one end of component pads, the aperture of first blind hole 151 are less than the aperture of second blind hole 152.In this way, hole is tied
A step is formed among structure 15, metallization inner wall 16 and 10 binding force of flexible circuit board are more preferable, can preferably fix member
Part pad 14.
As can be seen from the above technical solutions, the utility model embodiment has the following advantages：
By the way that the pore structure being connect with component pads is arranged in flexible circuit board, and the aperture at pore structure both ends is different,
The binding force with flexible circuit board can be increased, improve the fastness of soldered elements, avoid falling off from flexible circuit board, in turn
Increase the service life of flexible circuit board.
In the above-described embodiments, it all emphasizes particularly on different fields to the description of each embodiment, is not described in some embodiment
Part, may refer to the associated description of other embodiments.
Above-described embodiment is only to illustrate the technical solution of the utility model, rather than its limitations；The common skill of this field
Art personnel should understand that：It can still modify to the technical solution recorded in the various embodiments described above, or to its middle part
Technical characteristic is divided to carry out equivalent replacement；And these modifications or replacements, this practicality that it does not separate the essence of the corresponding technical solution
The spirit and scope of novel each embodiment technical solution.
Claims (6)
1. a kind of flexible circuit board for preventing soldered elements from falling off, including at least one layer of flexible base board and at least one layer of line layer,
It is characterized in that,
The line layer is equipped with the component pads for installing soldered elements, and the flexible circuit board is internally corresponding to the member
Part pad is equipped with pore structure, and the aperture at the pore structure both ends is different, is less than it close to the aperture of described component pads one end
There is metallization inner wall, the metallization inner wall to connect the member for aperture far from described component pads one end, the pore structure
Part pad.
2. flexible circuit board according to claim 1, which is characterized in that be plated filling inside the pore structure.
3. flexible circuit board according to claim 1, which is characterized in that filled by insulating materials inside the pore structure.
4. flexible circuit board according to claim 3, which is characterized in that the insulating materials is epoxy resin.
5. flexible circuit board according to claim 1, which is characterized in that the pore structure is tapered.
6. flexible circuit board according to claim 1, which is characterized in that
The pore structure is made of the first blind hole being connected and the second blind hole, and first blind hole is close to the component pads
The blind hole of one end, second blind hole are the blind hole far from described component pads one end, and the aperture of first blind hole is less than institute
State the aperture of the second blind hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721852591.0U CN207802535U (en) | 2017-12-26 | 2017-12-26 | Prevent the flexible circuit board that soldered elements fall off |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721852591.0U CN207802535U (en) | 2017-12-26 | 2017-12-26 | Prevent the flexible circuit board that soldered elements fall off |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207802535U true CN207802535U (en) | 2018-08-31 |
Family
ID=63279146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721852591.0U Active CN207802535U (en) | 2017-12-26 | 2017-12-26 | Prevent the flexible circuit board that soldered elements fall off |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207802535U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996513A (en) * | 2019-10-31 | 2020-04-10 | 苏州浪潮智能科技有限公司 | Method, equipment and medium for designing PCB (printed Circuit Board) bonding pad |
-
2017
- 2017-12-26 CN CN201721852591.0U patent/CN207802535U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996513A (en) * | 2019-10-31 | 2020-04-10 | 苏州浪潮智能科技有限公司 | Method, equipment and medium for designing PCB (printed Circuit Board) bonding pad |
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