CN207099435U - Rigid Flex - Google Patents

Rigid Flex Download PDF

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Publication number
CN207099435U
CN207099435U CN201621476174.6U CN201621476174U CN207099435U CN 207099435 U CN207099435 U CN 207099435U CN 201621476174 U CN201621476174 U CN 201621476174U CN 207099435 U CN207099435 U CN 207099435U
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CN
China
Prior art keywords
circuit board
flexible pcb
hard circuit
line layer
hole
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Application number
CN201621476174.6U
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Chinese (zh)
Inventor
胡先钦
何明展
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongqisheng Precision Electronics Qinhuangdao Co Ltd
Avary Holding Shenzhen Co Ltd
Original Assignee
Hongqisheng Precision Electronics Qinhuangdao Co Ltd
Avary Holding Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongqisheng Precision Electronics Qinhuangdao Co Ltd, Avary Holding Shenzhen Co Ltd filed Critical Hongqisheng Precision Electronics Qinhuangdao Co Ltd
Priority to CN201621476174.6U priority Critical patent/CN207099435U/en
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Publication of CN207099435U publication Critical patent/CN207099435U/en
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Abstract

A kind of Rigid Flex, including an individual layer or multi-layer flexible circuit board with conducting wire, it is respectively arranged at the first hard circuit board of the flexible PCB both side surface, second hard circuit board, first hard circuit board includes the first basic unit and the first line layer being arranged in first basic unit, second hard circuit board includes the second basic unit and the second line layer being arranged in second basic unit, first hard circuit board is bonded in by adhesive in the conducting wire of the flexible PCB side, second hard circuit board is bonded in by adhesive in the conducting wire of the flexible PCB opposite side.

Description

Rigid Flex
Technical field
A kind of circuit board is the utility model is related to, more particularly to a kind of Rigid Flex.
Background technology
Circuit board includes the circuit that flexible PCB, hard circuit board and flexible PCB are combined with hard circuit board Plate.
Normally, circuit board is by processes such as bonding, pressings, and according to phase by flexible PCB and hard circuit board Technological requirement is closed to be grouped together into.The circuit board has had flexible PCB and flexible PCB characteristic concurrently, its practicality By force, have a wide range of application.Existing plate is generally all to press fine copper by using direct on the basis of flexible PCB, further Expose internal layer flexible PCB in the local location perforate of the plate.But involve flexible PCB and hard in existing plate processing procedure Property circuit board processing procedure and material, not only manufacturing process is complicated, and in manufactured plate flexible PCB with hard circuit board The problems such as being uneven often is had, influences the quality of plate.
Utility model content
In view of this, the utility model provides the Rigid Flex that a kind of processing procedure is simple, quality is good.
A kind of Rigid Flex, including one have the individual layer of conducting wire or multi-layer flexible circuit board, be respectively arranged at The first hard circuit board, the second hard circuit board of the flexible PCB both side surface, first hard circuit board include First basic unit and the first line layer being arranged in first basic unit, second hard circuit board include the second basic unit with And the second line layer in second basic unit is arranged at, first hard circuit board is bonded in the flexibility by adhesive In the conducting wire of circuit board side, second hard circuit board is bonded in the flexible PCB opposite side by adhesive In conducting wire, in addition to it is opened in first hard circuit board, the first exclusion region on the second hard circuit board and described Second exclusion region and the through hole and blind hole positioned at first exclusion region and the second exclusion region both sides, the First Line Road floor, second circuit floor are electrically connected by the through hole, blind hole with the conducting wire of flexible PCB, the flexible PCB one End extend beyond first hard circuit board, the second hard circuit board and form weld pad, the adhesive coats the weld pad Outer peripheral edge, the adhesive further form the protection flexibility exposed to first exclusion region, the part of the second exclusion region The overcoat of circuit board.
Further, the flexible PCB includes a basic unit, is respectively arranged at the conductive layer of basic unit's both side surface, The conductive layer further patterns and forms conducting wire, and the adhesive is insulating materials, described in the adhesive bonding Flexible PCB and first hard circuit board and the second hard circuit board, while be filled in the conducting wire.
Further, the through hole sequentially passes through first hard circuit board, flexible PCB and second from top to bottom Hard circuit board, the aperture of the through hole is from first hard circuit board towards the second hard circuit board direction size phase Together.
Further, the first line layer be sticked the through-hole wall and along the through-hole wall extension be connected to institute State the second line layer, the first line layer connected with second line layer in the through hole and with the flexible circuit The conductive layer of plate is electrically connected.
Further, the blind hole is respectively formed on first hard circuit board and the second hard circuit board, described Blind hole is located at the flexible PCB both sides and is oppositely arranged, and the blind hole on first hard circuit board is from first line layer indent Extend to the conductive layer of the flexible PCB, the blind hole on second hard circuit board since second line layer in The recessed conductive layer for extending to the flexible PCB, the blind hole longitudinal section is trapezoidal, and its aperture is from the first line layer, Two line layers are gradually reduced towards the flexible PCB direction, and the first line layer, the second line layer are sticked the blind hole Inwall extends the conductive layer for being connected to first flexible PCB.
Further, in addition to a protective layer and a weld pad, the protective layer are graphite, protective layer covering described the The first line layer of one hard circuit board, the second line layer of the second hard circuit board, and it is filled in the through hole and described In blind hole, the weld pad is the flexible PCB side beyond first hard circuit board, the second hard circuit board and shape Into.
Further, the flexible PCB includes being sequentially stacked the first flexible PCB, the second flexible PCB, the Three flexible PCBs, the 4th flexible PCB, first flexible PCB, the second flexible PCB, the 3rd flexible PCB And the 4th between flexible PCB by adhesive, first, second, third, fourth flexible PCB include basic unit, It is arranged at the conductive layer of the side surface of basic unit one.
Further, first exclusion region is through first hard circuit board, the first flexible PCB, the second flexibility Circuit board, second exclusion region is through second hard circuit board, the 4th flexible PCB, first exclusion region and institute The second exclusion region face is stated, and by the 3rd flexible PCB and is filled in cohering in the 3rd flexible PCB Agent separates.
Further, through hole is stated from top to bottom through first hard circuit board, flexible PCB and the second hardness Circuit board, the first line layer be sticked the through-hole wall and along the through-hole wall extension be connected to second circuit Layer, the conductive layer of the first line layer, second line layer with the flexible PCB connect, the aperture of the through hole It is identical from first hard circuit board towards the second hard circuit board direction size.
Further, the blind hole is respectively formed in first hard circuit board, is located on the second hard circuit board The flexible PCB both sides, the first line layer of blind hole on first hard circuit board from first hard circuit board Conductive layer initially towards the first flexible PCB direction indent to first flexible PCB, the blind hole longitudinal section Trapezoidal, its aperture is gradually reduced from the first line layer towards the conductive layer direction, and the first line layer is sticked institute State blind hole and extend and be connected to the conductive layer, the court since the first line layer of the blind hole on second hard circuit board To the 4th flexible PCB direction indent to the conductive layer of the 4th flexible PCB, second line layer is sticked institute State blind hole and extend and be connected to the conductive layer, the blind hole longitudinal section is trapezoidal, and its aperture is from the second line layer described in Conductive layer direction is gradually reduced, and the maximum diameter of hole of the blind hole is not more than the aperture of the through hole.
Flexible PCB described in Rigid Flex described in the utility model, with first hard circuit board, second hard Between property circuit board by adhesive together, possess after the adhesive heat cure with PL similar characteristics, add described soft Intensity, adaptation between property circuit board and first hard circuit board, the second hard circuit board, can also protect conductor wire Road so that Rigid Flex quality is good.Further, described this case form the weld pad can be with other pcb boards, screen ITO Or other soft boards connect, the practicality of the Rigid Flex is further increased.
Brief description of the drawings
Fig. 1 show Rigid Flex sectional view described in the utility model first embodiment.
Fig. 2 show the sectional view of Rigid Flex described in the utility model second embodiment.
Main element symbol description
Rigid Flex 100、100a
Flexible PCB 10
First flexible PCB 10a
Second flexible PCB 10b
3rd flexible PCB 10c
4th flexible PCB 10d
First hard circuit board 20
Second hard circuit board 30
Adhesive 40
Protective layer 50
Basic unit 11、11a、11b、11c、11d
Conductive layer 12、12a、12b、12c、12d
Weld pad 13
First basic unit 21
First line layer 22
Second basic unit 31
Second line layer 32
First exclusion region 101、101a
Second exclusion region 102、102a
Through hole 110、110a
Blind hole 120、120a
Above-mentioned accompanying drawing is further illustrated the utility model by following embodiment.
Embodiment
Below by the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out Clearly and completely describing, it is clear that described embodiment is only a part of embodiment of the utility model, rather than entirely The embodiment in portion.Based on the embodiment in the utility model, those of ordinary skill in the art are not making creative labor The every other embodiment obtained under the premise of dynamic, belong to the scope of the utility model protection.
The noun of locality " first " used herein, " second " are the position definition so that first substrate described in the used time, And do not limit.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to technology of the present utility model The implication that the technical staff in domain is generally understood that is identical.It is simply in term used in the description of the present utility model herein The purpose of description specific embodiment, it is not intended that in limitation the utility model.
As shown in figure 1, Rigid Flex 100 described in the utility model first embodiment includes a flexible PCB 10, divided The first hard circuit board 20 and the second hard circuit board 30 of the both side surface of flexible PCB 10 are not arranged at.Described first Hard circuit board 20 and second hard circuit board 30 are linked together by adhesive 40 and the flexible PCB 10.
The flexible PCB 10 is individual layer or multi-layer flexible circuit board.It is described soft in the utility model embodiment Property circuit board 10 include a basic unit 11, be respectively arranged at the conductive layer 12 of the both side surface of basic unit 11.On the conductive layer 12 Conducting wire is formed by forming diversified pattern.The material of the basic unit 11 is polyimides (polyimide, PI), The material of the conductive layer 12 is copper.
First hard circuit board 20 includes the first basic unit 21 and is arranged at the first of the surface of the first basic unit 21 Line layer 22.First basic unit 21 of first hard circuit board 20 is bonded in the flexible PCB by the adhesive 40 On 10 conductive layer 12.
Second hard circuit board 30 includes the second basic unit 31 and is arranged at the second of the surface of the second basic unit 31 Line layer 32.Second basic unit 31 of second hard circuit board 30 is bonded in the flexible PCB by the adhesive 40 On 10 conductive layer 12.
In the utility model embodiment, the adhesive 40 is insulating materials.The adhesive 40 bonds the flexibility Circuit board 10 is with outside the hard circuit board of the first hard circuit board 20 and second, being further filled into the flexible PCB In 10 conductive layer 12.
Further, the Rigid Flex 100 opens up to form the first exclusion region 101 and the second exclusion region 102.Described One exclusion region 101 runs through first hard circuit board 20.Second exclusion region 102 runs through second hard circuit board 30.The exclusion region 102 of first exclusion region 101 and second does not wear the adhesive 40 and the flexible PCB 10, from And by the flexible PCB 10 and it is filled in the adhesive 40 therein and separates.First exclusion region 101 and institute It is located at the both sides of the flexible PCB 10 with stating the face of the second exclusion region 102.The adhesive 40 exposed to described first every The part of the disconnected exclusion region 102 of area 101 and second is further used as overcoat and protects the flexible PCB 10.
Further, the Rigid Flex 100 also opens up formed with through hole 110, is spaced with the through hole 110 Blind hole 120.The through hole 110 is located at the two of the exclusion region 102 of the first exclusion region 101 and second respectively with the blind hole 120 Side.
It is hard that the through hole 110 sequentially passes through first hard circuit board 20, flexible PCB 10 and second from top to bottom Property circuit board 30.The aperture of the through hole 110 is from first hard circuit board 20 towards the side of the second hard circuit board 30 It is identical to size.The first line layer 22 be sticked the inwall of through hole 110 and along the inwall of through hole 110 extension be connected to Second line layer 32.In this way, the first line layer 22 and second line layer 32 in the through hole 110 and institute The conductive layer 12 for stating flexible PCB 10 is electrically connected.
The blind hole 120 is respectively formed on the hard circuit board 30 of the first hard circuit board 20 and second.It is described blind Hole 120 is located at the both sides of flexible PCB 10 and is oppositely arranged.Blind hole 120 on first hard circuit board 20 is from First Line The indent of road floor 22 extends to the conductive layer 12 of the flexible PCB 10.Blind hole 120 on second hard circuit board 30 is certainly Second line layer 32 starts the conductive layer 12 that indent extends to the flexible PCB 10.The blind hole 120 does not run through The flexible PCB 10.The longitudinal section of blind hole 120 is trapezoidal, and its aperture is from the first line layer 22, the second line layer 32 are gradually reduced towards the direction of flexible PCB 10.The maximum diameter of hole of the blind hole 120 is not more than the hole of the through hole 110 Footpath.The inwall of blind hole 120 extension that is sticked of the first line layer 22, the second line layer 32 is connected to the conductive layer 12.
Further, in addition to a protective layer 50.The material of the protective layer 50 is graphite.The protective layer 50 covers institute First line layer 22, the second line layer 32 of the second hard circuit board 30 of the first hard circuit board 20 are stated, and is filled in institute State in through hole 110 and the blind hole 120.
Further, described one end of flexible PCB 10 extends beyond the hardness of the first hard circuit board 20, second electricity Road plate 30 and formed a weld pad 13.The weld pad 13 to be attached with other pcb boards, screen ITO or other soft boards, from And add the practicality of the Rigid Flex 100.The adhesive 40 coats the outer peripheral edge of weld pad 13.
Flexible PCB 10 described in Rigid Flex 100 described in the utility model, with first hard circuit board 20, Between second hard circuit board 30 by adhesive together, possess after the adhesive heat cure and PL similar characteristics, increase Intensity, adaptation between the flexible PCB 10 and first hard circuit board 20, the second hard circuit board 30, may be used also To protect conducting wire so that Rigid Flex quality is good.Further, described this case form the weld pad can be with other Pcb board, screen ITO or the connection of other soft boards, further increase the practicality of the Rigid Flex.
Rigid Flex 100a described in the utility model second embodiment is illustrated in figure 2, itself and the utility model The structure of Rigid Flex 100 described in one embodiment is similar, including flexible PCB 10 and is respectively arranged at the flexible electrical The first hard circuit board 20, the second hard circuit board 30 of the both side surface of road plate 10, first hard circuit board 20 with it is described Second hard circuit board 30 passes through adhesive 40 and the flexible PCB 10.Described in the embodiment of the utility model first, second Rigid Flex 100,100a structures difference are that the flexible PCB 10 includes the first flexible PCB being sequentially stacked 10a, the second flexible PCB 10b, the 3rd flexible PCB 10c, the 4th flexible PCB 10d.First flexible PCB Pass through adhesive 40 between 10a, the second flexible PCB 10b, the 3rd flexible PCB 10c and the 4th flexible PCB 10d.
Further, the first flexible PCB 10a includes basic unit 11a, is arranged at the side surfaces of basic unit 11a mono- Conductive layer 12a.The second flexible PCB 10b includes basic unit 11b, is arranged at the conductive layer of the side surfaces of basic unit 11b mono- 12b.The 3rd flexible PCB 10c includes basic unit 11c, is arranged at the conductive layer 12c of the basic unit 11c both side surfaces.Institute Stating the 4th flexible PCB 10d includes basic unit 11d, is arranged at the conductive layer 12d of the side surfaces of basic unit 11d mono-.
Further, the Rigid Flex 100a forms the first exclusion region 101a and the second exclusion region 102a.Described One exclusion region 101a is through first hard circuit board 20, the first flexible PCB 10a, the second flexible PCB 10b.It is described Second exclusion region 102a is through second hard circuit board 30, the 4th flexible PCB 10d.The first exclusion region 101a and The second exclusion region 102a is by the 3rd flexible PCB 10c and is filled in the 3rd flexible PCB 10c Adhesive 40 separate.It is located at the flexible PCB to the first exclusion region 101a and the second exclusion region 102a faces 10c both sides.
Further, the Rigid Flex 100b is also opened up and to be formed through hole 110a, is arranged at intervals with the through hole 110a Blind hole 120a.The through hole 110a and blind hole 120a is respectively positioned at the first exclusion region 101a and second cut-off Area 102a both sides.
The through hole 110a is from top to bottom through first hard circuit board 20, the hardness of flexible PCB 10 and second Circuit board 30.The first line layer 22 be sticked the through hole 110a inwalls and along the inwall of through hole 110 extension be connected to Second line layer 32.In this way, the first line layer 22, second line layer 32 with the flexible PCB 10 Conductive layer 12a, 12b, 12c, 12d are connected.The aperture of the through hole 110a is from first hard circuit board 20 towards described The direction size of two hard circuit board 30 is identical.
The blind hole 120a is respectively formed in first hard circuit board 20, is located at institute on the second hard circuit board 30 State the both sides of flexible PCB 10.Blind hole 120a on first hard circuit board 20 is from the of first hard circuit board 20 Conduction of one line layer 22 initially towards the first flexible PCB 10a direction indents to the first flexible PCB 10a Layer 12a.The blind hole 120a longitudinal sections are trapezoidal, and its aperture is from the first line layer 22 towards the conductive layer 12a directions It is gradually reduced.The first line layer 22 be sticked the blind hole 120a and extend be connected to the conductive layer 12a.Described second is hard Blind hole 120a on property circuit board 30 is from the first line layer 22 initially towards the 4th flexible PCB 10d directions indent To the conductive layer 12c of the 4th flexible PCB 10d.Second line layer 32, which is sticked, the blind hole 120a and extends connection To the conductive layer 12d.The blind hole 120a longitudinal sections are trapezoidal, and its aperture is from the second line layer 32 towards the conductive layer 12d directions are gradually reduced.The maximum diameter of hole of the blind hole 120a is not more than the aperture of the through hole 110a.
Further, the Rigid Flex 100a also includes a protective layer 50.The protective layer 50 covers described first Second line layer 32 of the first line layer 22 of hard circuit board 20, the second hard circuit board 30, and it is filled in the through hole In 110a and the blind hole 120a.
Further, the 3rd flexible PCB 10c sides extend beyond the first flexible PCB 10a, second Flexible PCB 10b, the 4th flexible PCB 10d, the first hard circuit board 20, the second hard circuit board 30 and form weld pad 13。
It is understood that for the person of ordinary skill of the art, can be according to technology structure of the present utility model Think of makes other various corresponding changes and deformation, and all these changes and deformation should all belong to right of the present utility model and want The protection domain asked.

Claims (10)

1. a kind of Rigid Flex, including one has the individual layer of conducting wire or multi-layer flexible circuit board, is respectively arranged at institute State the first hard circuit board, the second hard circuit board of flexible PCB both side surface, first hard circuit board includes the One basic unit and the first line layer being arranged in first basic unit, second hard circuit board include the second basic unit and The second line layer being arranged in second basic unit, it is characterised in that:First hard circuit board is bonded by adhesive In in the conducting wire of the flexible PCB side, second hard circuit board is bonded in the flexible circuit by adhesive In the conducting wire of plate opposite side, in addition to be opened in first hard circuit board, first on the second hard circuit board every Disconnected area and the second exclusion region and the through hole and blind hole positioned at first exclusion region and the second exclusion region both sides, it is described First line layer, second circuit layer are electrically connected by the through hole, blind hole with the conducting wire of flexible PCB, the flexible electrical Road plate one end extend beyond first hard circuit board, the second hard circuit board and form weld pad, the adhesive coats institute Weld pad outer peripheral edge is stated, the adhesive further forms protection institute exposed to first exclusion region, the part of the second exclusion region State the overcoat of flexible PCB.
2. Rigid Flex as claimed in claim 1, it is characterised in that:The flexible PCB includes a basic unit, set respectively In the conductive layer of basic unit's both side surface, the conductive layer further patterns and forms conducting wire, and the adhesive is Insulating materials, the adhesive bond the flexible PCB and first hard circuit board and the second hard circuit board, together When be filled in the conducting wire.
3. Rigid Flex as claimed in claim 2, it is characterised in that:It is hard that the through hole sequentially passes through described first from top to bottom Property circuit board, flexible PCB and the second hard circuit board, the aperture of the through hole is from first hard circuit board towards institute It is identical to state the second hard circuit board direction size.
4. Rigid Flex as claimed in claim 2, it is characterised in that:The first line layer is sticked the through-hole wall and edge The through-hole wall extension and be connected to second line layer, the first line layer is with second line layer described logical Connected in hole and the conductive layer with the flexible PCB is electrically connected.
5. Rigid Flex as claimed in claim 2, it is characterised in that:The blind hole is respectively formed in first rigid circuit On plate and the second hard circuit board, the blind hole is located at the flexible PCB both sides and is oppositely arranged, first rigid circuit Blind hole on plate extends to the conductive layer of the flexible PCB from first line layer indent, on second hard circuit board Blind hole indent since second line layer extends to the conductive layer of the flexible PCB, and the blind hole longitudinal section is in ladder Shape, its aperture are gradually reduced from the first line layer, the second line layer towards the flexible PCB direction, the First Line The blind hole inwall extension that is sticked of road floor, the second line layer is connected to the conductive layer of the flexible PCB.
6. Rigid Flex as claimed in claim 2, it is characterised in that:Also include a protective layer and a weld pad, the protective layer For graphite, the protective layer covers first line layer, the second circuit of the second hard circuit board of first hard circuit board Layer, and be filled in the through hole and the blind hole, the weld pad is that the flexible PCB side is hard beyond described first Property circuit board, the second hard circuit board and formed.
7. Rigid Flex as claimed in claim 1, it is characterised in that:The flexible PCB includes being sequentially stacked first soft Property circuit board, the second flexible PCB, the 3rd flexible PCB, the 4th flexible PCB, first flexible PCB, second By adhesive between flexible PCB, the 3rd flexible PCB and the 4th flexible PCB, described first, second, third, 4th flexible PCB includes basic unit, is arranged at the conductive layer of the side surface of basic unit one.
8. Rigid Flex as claimed in claim 7, it is characterised in that:First exclusion region runs through first rigid circuit Plate, the first flexible PCB, the second flexible PCB, second exclusion region is through second hard circuit board, the 4th soft Property circuit board, first exclusion region and the second exclusion region face, and pass through the 3rd flexible PCB and filling Adhesive in the 3rd flexible PCB separates.
9. Rigid Flex as claimed in claim 7, it is characterised in that:The through hole is from top to bottom through the described first hardness electricity Road plate, flexible PCB and the second hard circuit board, the first line layer are sticked the through-hole wall and along described logical Inwall extension in hole is connected to second line layer, the first line layer, second line layer with the flexible circuit The conductive layer connection of plate, the aperture of the through hole are big from first hard circuit board towards the second hard circuit board direction It is small identical.
10. Rigid Flex as claimed in claim 7, it is characterised in that:The blind hole is respectively formed in the first hardness electricity It is located at the flexible PCB both sides on road plate, the second hard circuit board, the blind hole on first hard circuit board is from institute The first line layer of the first hard circuit board is stated initially towards the first flexible PCB direction indent to the described first flexibility The conductive layer of circuit board, the blind hole longitudinal section is trapezoidal, and its aperture is from the first line layer towards the conductive layer direction Be gradually reduced, the first line layer be sticked the blind hole and extend be connected to the conductive layer, second hard circuit board On blind hole from the first line layer initially towards the 4th flexible PCB direction indent to the 4th flexible circuit The conductive layer of plate, second line layer be sticked the blind hole and extend be connected to the conductive layer, the blind hole longitudinal section is in Trapezoidal, its aperture is gradually reduced from the second line layer towards the conductive layer direction, and the maximum diameter of hole of the blind hole is not more than institute State the aperture of through hole.
CN201621476174.6U 2016-12-29 2016-12-29 Rigid Flex Active CN207099435U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621476174.6U CN207099435U (en) 2016-12-29 2016-12-29 Rigid Flex

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621476174.6U CN207099435U (en) 2016-12-29 2016-12-29 Rigid Flex

Publications (1)

Publication Number Publication Date
CN207099435U true CN207099435U (en) 2018-03-13

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201621476174.6U Active CN207099435U (en) 2016-12-29 2016-12-29 Rigid Flex

Country Status (1)

Country Link
CN (1) CN207099435U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110876226A (en) * 2018-08-31 2020-03-10 鹏鼎控股(深圳)股份有限公司 Rigid-flexible circuit board and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110876226A (en) * 2018-08-31 2020-03-10 鹏鼎控股(深圳)股份有限公司 Rigid-flexible circuit board and manufacturing method thereof

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