CN103228099A - BGA (ball grid array) bonding pad and buried hole alignment inspection structure - Google Patents

BGA (ball grid array) bonding pad and buried hole alignment inspection structure Download PDF

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Publication number
CN103228099A
CN103228099A CN 201310123444 CN201310123444A CN103228099A CN 103228099 A CN103228099 A CN 103228099A CN 201310123444 CN201310123444 CN 201310123444 CN 201310123444 A CN201310123444 A CN 201310123444A CN 103228099 A CN103228099 A CN 103228099A
Authority
CN
China
Prior art keywords
hole
buried
pcb board
pcb
bga
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 201310123444
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Chinese (zh)
Inventor
李泽清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
APCB Electronics Kunshan Co Ltd
Original Assignee
APCB Electronics Kunshan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by APCB Electronics Kunshan Co Ltd filed Critical APCB Electronics Kunshan Co Ltd
Priority to CN 201310123444 priority Critical patent/CN103228099A/en
Publication of CN103228099A publication Critical patent/CN103228099A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a BGA (Ball Grid Array) bonding pad and buried hole alignment inspection structure which comprises a PCB (printed circuit board) connecting sheet, wherein frames are arranged at the periphery of the PCB connecting sheet; the PCB connecting sheet comprises a plurality of PCB sub-sheets; a broken edge is arranged between every two adjacent PCB sub-sheets in the length direction of the PCB connecting sheet; a plurality of BGA bonding pads are arranged on the PCB sub-sheets; a buried hole type via hole corresponds to each bonding pad; a plurality of through hole type via holes are formed on the broken edges on the two sides of each PCB sub-sheet and correspond to the buried hole type via holes; and a plurality of through hole type via holes are formed in the frames. With the adoption of the structure, a function of detecting alignment among buried holes and the BGA bonding pads by X-ray can be changed to visual management, and a drift rate of the BGA bonding pads to the buried holes in a forming area of an inner layer can be shown really and visually when an outer layer of a PCB is processed and a finished product is checked and verified, so that purposes of lowering the production cost and improving the working efficiency can be achieved.

Description

BGA pad and buried via hole are to the bit trial structure
Technical field
The present invention relates to a kind of printed substrate, be specifically related to a kind of BGA pad and buried via hole the bit trial structure with BGA pad and buried via hole.
Background technology
BGA(Ball Grid Array, being BGA Package) technology is a kind of surface attaching type encapsulation technology of integrated circuit, it replaces traditional lead-in wire by producing spherical salient point at the back side of substrate by array arrangement, makes that the integrated level of semiconductor device is higher, performance is better.The BGA encapsulation technology can significantly increase electronic device the I/O number of pins, reduce solder pad space length, and then dwindle the size of packaging part, the footprint of saving encapsulation, thereby make the microminiaturization of high density such as PC chipset, microprocessor, high-performance, many pin package device become possibility.
BGA can form the buried via hole corresponding with the BGA pad usually for realizing being electrically connected or fixing as device between each layer of printed substrate (pcb board) in pcb board, qualified pcb board finished product requirement BGA pad and buried via hole contraposition are accurate.But from the angle of buried via hole formation and BGA making workflow, buried via hole generally is made up of the boring of centre and the orifice ring around the boring.Usually the orifice ring width is less than boring aperture, and behind the pcb board internal layer processing procedure, the pad of BGA may deflect away from and design BGA pad scope originally, causes this pcb board material to be scrapped.Therefore, after the internal layer processing procedure is finished or when finished product inspection is verified, need to detect the drift rate of BGA pad and buried via hole usually, to determine the quality of pcb board.In the prior art, in pcb board behind the formable layer, the drift condition of screening BGA pad and buried via hole by the mode that adopts X ray to detect, and use X ray to detect the testing agency that need be contracted out to specialty usually, testing cost is higher, therefore, certainly will increase the production cost of pcb board, it is lower to reduce production work efficient.
Summary of the invention
In order to solve the problems of the technologies described above, the present invention proposes a kind of BGA pad and the outer check of buried via hole contraposition structure, the function of using X ray to detect buried via hole and the contraposition of BGA pad can be converted into visual management, when outer processing procedure of pcb board and finished product inspection checking, the true drift rate that reflects interior BGA pad of internal layer shaping area and buried via hole intuitively, thus reach the purpose that reduces production costs and increase work efficiency.
Technical scheme of the present invention is achieved in that
A kind of BGA pad and buried via hole be to the bit trial structure, comprises pcb board that periphery has a frame in flakes, and described pcb board comprises the sub-sheet of several pcb boards in flakes, along described pcb board length direction in flakes, has the break edge between adjacent two sub-sheets of pcb board; The sub-sheet of described pcb board is provided with several BGA pads, and corresponding each pad is provided with buried via hole type via hole; Corresponding described buried via hole type via hole, the described break edge on the sub-sheet of described pcb board both sides is provided with several through hole type via holes, and described frame is provided with several through hole type via holes.
As a further improvement on the present invention, described pcb board is square plate in flakes, states near described pcb board place, four angles in flakes and is respectively equipped with a described through hole type via hole on the frame.
As a further improvement on the present invention, the sub-sheet of described pcb board is a square plate, is respectively equipped with a described through hole type via hole on the described break edge at the place, four angles of the close sub-sheet of described pcb board.
The invention has the beneficial effects as follows: the invention provides the outer check of a kind of BGA pad and buried via hole contraposition structure, by pcb board in flakes around the through hole type via hole consistent with the BGA pad is set on the break edge on frame and the adjacent both sides of the sub-sheet of pcb board, by the alignment situation of BGA pad in the shaping area in the skew situation of orifice ring in the through hole type via hole real reaction internal layer processing procedure directly perceived, thereby reach the purpose of the precision of judgement PCB production and processing technology with buried via hole type via hole.Promptly when outer processing procedure and product inspection checking, the skew situation of orifice ring in the through hole type via hole only need seen on the pcb board break edge can be known the BGA pad in the pcb board and the alignment situation of buried via hole type via hole.Therefore, the present invention can be converted into visual management with the function of using X ray to detect buried via hole and the contraposition of BGA pad, when outer processing procedure of pcb board and finished product inspection checking, the true drift rate that reflects interior BGA pad of internal layer shaping area and buried via hole intuitively, thus reach the purpose that reduces production costs and increase work efficiency.
Description of drawings
Fig. 1 is a structural representation of the present invention.
In conjunction with the accompanying drawings, make the following instructions:
1---pcb board in flakes 11---frame
12---the sub-sheet 13 of pcb board---break edge
14---buried via hole type via hole 15---through hole type via hole
Embodiment
As shown in Figure 1, a kind of BGA pad and buried via hole be to the bit trial structure, comprises pcb board that periphery has a frame 11 in flakes 1, and described pcb board comprises the sub-sheet 12 of several pcb boards in flakes, along described pcb board length direction in flakes, has break edge 13 between adjacent two sub-sheets of pcb board; The sub-sheet of described pcb board is provided with several BGA pads, and corresponding each pad is provided with buried via hole type via hole 14; Corresponding described buried via hole type via hole, the described break edge on the sub-sheet of described pcb board both sides is provided with several through hole type via holes 15, and described frame is provided with several through hole type via holes 15.By pcb board in flakes around the through hole type via hole consistent with the BGA pad is set on the break edge on frame and the adjacent both sides of the sub-sheet of pcb board, by the alignment situation of BGA pad in the shaping area in the skew situation of orifice ring in the through hole type via hole real reaction internal layer processing procedure directly perceived, thereby reach the purpose of the precision of judgement PCB production and processing technology with buried via hole type via hole.Promptly when outer processing procedure and product inspection checking, the skew situation of orifice ring in the through hole type via hole only need seen on the pcb board break edge can be known the BGA pad in the pcb board and the alignment situation of buried via hole type via hole.
Preferably, described pcb board is square plate in flakes, states near described pcb board place, four angles in flakes and is respectively equipped with a described through hole type via hole on the frame.
Preferably, the sub-sheet of described pcb board is a square plate, is respectively equipped with a described through hole type via hole on the described break edge at the place, four angles of the close sub-sheet of described pcb board.
The present invention by pcb board in flakes around the through hole type via hole consistent with the BGA pad is set on the break edge on frame and the adjacent both sides of the sub-sheet of pcb board, by the alignment situation of BGA pad in the shaping area in the skew situation of orifice ring in the through hole type via hole real reaction internal layer processing procedure directly perceived, thereby reach the purpose of the precision of judgement PCB production and processing technology with buried via hole type via hole.Promptly when outer processing procedure and product inspection checking, the skew situation of orifice ring in the through hole type via hole only need seen on the pcb board break edge can be known the BGA pad in the pcb board and the alignment situation of buried via hole type via hole.Therefore, the present invention can be converted into visual management with the function of using X ray to detect buried via hole and the contraposition of BGA pad, when outer processing procedure of pcb board and finished product inspection checking, the true drift rate that reflects interior BGA pad of internal layer shaping area and buried via hole intuitively, thus reach the purpose that reduces production costs and increase work efficiency.
Above embodiment is with reference to accompanying drawing, to a preferred embodiment of the present invention will be described in detail.Those skilled in the art is by carrying out modification or the change on the various forms to the foregoing description, but do not deviate under the situation of essence of the present invention, all drops within protection scope of the present invention.

Claims (3)

1. BGA pad and buried via hole are to the bit trial structure, it is characterized in that: comprise pcb board that periphery has a frame (11) (1) in flakes, described pcb board comprises the sub-sheet of several pcb boards (12) in flakes, along described pcb board length direction in flakes, has break edge (13) between adjacent two sub-sheets of pcb board; The sub-sheet of described pcb board is provided with several BGA pads, and corresponding each pad is provided with buried via hole type via hole (14); Corresponding described buried via hole type via hole, the described break edge on the sub-sheet of described pcb board both sides is provided with several through hole type via holes (15), and described frame is provided with several through hole type via holes (15).
2. BGA pad according to claim 1 and buried via hole is characterized in that the bit trial structure: described pcb board is square plate in flakes, states near described pcb board place, four angles in flakes and is respectively equipped with a described through hole type via hole on the frame.
3. BGA pad according to claim 1 and buried via hole is characterized in that the bit trial structure: the sub-sheet of described pcb board is a square plate, is respectively equipped with a described through hole type via hole on the described break edge at the place, four angles of the close sub-sheet of described pcb board.
CN 201310123444 2013-04-10 2013-04-10 BGA (ball grid array) bonding pad and buried hole alignment inspection structure Pending CN103228099A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201310123444 CN103228099A (en) 2013-04-10 2013-04-10 BGA (ball grid array) bonding pad and buried hole alignment inspection structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201310123444 CN103228099A (en) 2013-04-10 2013-04-10 BGA (ball grid array) bonding pad and buried hole alignment inspection structure

Publications (1)

Publication Number Publication Date
CN103228099A true CN103228099A (en) 2013-07-31

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201310123444 Pending CN103228099A (en) 2013-04-10 2013-04-10 BGA (ball grid array) bonding pad and buried hole alignment inspection structure

Country Status (1)

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CN (1) CN103228099A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104244590A (en) * 2014-08-28 2014-12-24 广州兴森快捷电路科技有限公司 Control method of outer layer deviation of circuit boards
CN106132076A (en) * 2016-08-23 2016-11-16 竞陆电子(昆山)有限公司 It is beneficial to check the inspection structure of PCB plate through hole conduction

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104244590A (en) * 2014-08-28 2014-12-24 广州兴森快捷电路科技有限公司 Control method of outer layer deviation of circuit boards
CN106132076A (en) * 2016-08-23 2016-11-16 竞陆电子(昆山)有限公司 It is beneficial to check the inspection structure of PCB plate through hole conduction

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C06 Publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130731

C02 Deemed withdrawal of patent application after publication (patent law 2001)