CN206292352U - Stacking-type test interface plate - Google Patents

Stacking-type test interface plate Download PDF

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Publication number
CN206292352U
CN206292352U CN201621186325.4U CN201621186325U CN206292352U CN 206292352 U CN206292352 U CN 206292352U CN 201621186325 U CN201621186325 U CN 201621186325U CN 206292352 U CN206292352 U CN 206292352U
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CN
China
Prior art keywords
over panel
spacing change
spacing
contacts
several
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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CN201621186325.4U
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Chinese (zh)
Inventor
林承锐
李文聪
邓元玱
谢开杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHINA FINE MEASURING TECHNOLOGY STOCK Co Ltd
Chunghwa Precision Test Tech Co Ltd
Original Assignee
CHINA FINE MEASURING TECHNOLOGY STOCK Co Ltd
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Priority to TW105206205U priority patent/TWM529169U/en
Application filed by CHINA FINE MEASURING TECHNOLOGY STOCK Co Ltd filed Critical CHINA FINE MEASURING TECHNOLOGY STOCK Co Ltd
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Publication of CN206292352U publication Critical patent/CN206292352U/en
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Abstract

The utility model proposes a kind of stacking-type test interface plate, including:One spacing change-over panel and a printed circuit board (PCB), the spacing change-over panel are made up of a micro- spacing change-over panel with a spacing change-over panel wide, and the side of micro- spacing change-over panel has several first contacts for being electrically connected with semiconductor semi-finished product or finished semiconductor.The side of the spacing change-over panel wide has several second contacts.The side of the printed circuit board (PCB) is electrically connected to several second contacts.Micro- spacing change-over panel it is vertical with the spacing change-over panel wide to storehouse constituting the spacing change-over panel.The opposite side of micro- spacing change-over panel is provided with several 3rd contacts to be electrically connected to the opposite side of the spacing change-over panel wide, and then several second contacts described in electrical communication respectively.

Description

Stacking-type test interface plate
【Technical field】
The utility model is to be related to a kind of test interface plate, and more particularly to a kind of stacking-type test interface plate.
【Background technology】
Refer to Figure 1A and 1B, Figure 1A is a kind of side schematic view of existing test interface plate, typically unencapsulated half Conductor semi-finished product such as wafer 4 yield test, can using test interface plate as between wafer and tester table difference spacing (Pitch) translation interface, the main composition structure of such as test interface plate includes:One integrally formed spacing conversion (Space Transformer, ST) plate 1 have to should tested wafer 4 input/output projection (I/O Bump) spacing (Pitch), it belongs to the specification compared with thin space;And one printed circuit board (PCB) (PCB) such as probe test support plate 3 have correspondence test The spacing of the probe contact of board, its specification for belonging to spacing wider, the spacing change-over panel 1 and the printed circuit board (PCB) 3 both it Between the spacing of (Ball grid array, BGA) is encapsulated by appropriate ball bar array again, interface includes ST metal gaskets 7 and PCB Metal pad 6, is welded with tin ball 8, and then reaches the effect of both signal interconnections between tested wafer 4 and tester table.Figure 1B It is the side schematic view of another existing test interface plate, for the yield test of the finished semiconductor for typically having encapsulated, has One multilayer support plate (Loadboard PCB) 5, tin ball 8, probe 2.
Only, process capability is limited to, the configuration of power supply (Power) and ground connection (GND), Power Integrity (Power is reduced Integration, PI) quality can be deteriorated.The configuration for being fanned out to (fan out) circuit in addition concentrates on the 1 of the test carrier plate structure In~2 layers, interfering for signal between circuit can be increased.
It is, therefore, desirable to provide electrical quality can be lifted, test interface plate and its manufacture of the problem of low signal interference are dropped Method.
【Utility model content】
To solve above-mentioned problem of the prior art, a purpose of the present utility model is to provide a kind of stacking-type test interface Plate, makes the test interface plate to shorten Production Time by point plate, reduces the number of plies, lifts yield.And by profit The problem of low signal interference is dropped with grading design, therefore increased line width, improved the unstable problem of characteristic impedance, lifting transmission matter Amount.
Stacking-type test interface plate according to a preferred embodiment of the present utility model includes:One spacing change-over panel and One printed circuit board (PCB), the spacing change-over panel is made up of a micro- spacing change-over panel with a spacing change-over panel wide, micro- spacing The side of change-over panel has several first contacts for being electrically connected with semiconductor semi-finished product or finished semiconductor, the spacing wide The side of change-over panel has several second contacts.The side of the printed circuit board (PCB) is electrically connected to the spacing change-over panel wide Described several second contacts.Micro- spacing change-over panel is vertical with both spacing change-over panels wide to change described in composition to storehouse Spacing change-over panel, and several first contacts the spacing for being smaller than several second contacts, the micro- spacing conversion The opposite side of plate is provided with several 3rd contacts, and several 3rd contacts are used to be electrically connected to the another of the spacing change-over panel wide Side, and then several second contacts described in electrical communication respectively.
According to preferred embodiment of the present utility model, each 3rd contact is a metal coupling and is welded using scolding tin Weld pad on to the opposite side of the spacing change-over panel wide is being electrically connected.
According to preferred embodiment of the present utility model, each second contact is a metal coupling and is welded using scolding tin Weld pad on to the side of the printed circuit board (PCB) is being electrically connected.
According to preferred embodiment of the present utility model, the printed circuit board (PCB) is a probe clamp (Probe card PCB), it is used to be electrically connected with a tester table for testing the half-finished semiconductor products and its opposite side.
According to preferred embodiment of the present utility model, the printed circuit board (PCB) is a test carrier plate (Loadboard PCB), It is used to be electrically connected with a tester table for testing the finished semiconductor and its opposite side.
According to preferred embodiment of the present utility model, the probe clamp is distinguished with the edge of both spacing change-over panels Formation at least one is lateral opening for fixed screw insertion, and then is fixed with hold-doun nut.
According to preferred embodiment of the present utility model, the test carrier plate is distinguished with the edge of both spacing change-over panels Formation at least one is lateral opening for fixed screw insertion, and then is fixed with hold-doun nut.
According to preferred embodiment of the present utility model, each metal coupling is copper bump.
According to preferred embodiment of the present utility model, described several first contacts of micro- spacing change-over panel are fan-ins (fan-in) configure, and through hole or blind hole are provided with the first junction described in wherein at least one.
According to preferred embodiment of the present utility model, described several second contacts of the spacing change-over panel wide are to be fanned out to (fan-out) configure, and through hole or blind hole are provided with the second junction described in wherein at least one.
The technical scheme of another preferred embodiment of the present utility model describes a kind of system of stacking-type test interface plate Method is made, is comprised the following steps:A micro- spacing change-over panel and a spacing change-over panel wide are independently made, wherein described micro- Side away from change-over panel forms several first contacts for being electrically connected between semiconductor semi-finished product or finished semiconductor, the width Side away from change-over panel forms several second contacts, and several first contacts are smaller than several second contacts Spacing.By micro- spacing change-over panel it is vertical with both spacing change-over panels wide to storehouse to constitute a spacing change-over panel, its Described in the opposite side of micro- spacing change-over panel be provided with several 3rd contacts, several 3rd contacts are used to being electrically connected to described The opposite side of spacing change-over panel wide, and then several second contacts described in electrical communication respectively.Assemble the spacing change-over panel to Printed circuit board (PCB), and the side of the printed circuit board (PCB) is electrically connected to described several the second of the spacing change-over panel wide and connects Point.
Stacking-type test interface plate of the present utility model is made using point plate, and in spacing change-over panel wide and micro- spacing Indivedual being reached using through hole or blind hole is fanned out to the grading design of (fan-out) and fan-in (fan- in) and shortens on change-over panel Therefore production room reduces the number of plies away from the time needed for change-over panel, and lifting yield and reliability, and improvement line width line-spacing are smaller When detection, the problem that is difficult of maintenance, can also lift transmission efficiency.
【Brief description of the drawings】
Figure 1A is a kind of side schematic view of existing test interface plate;
Figure 1B is the side schematic view of another existing test interface plate;
Fig. 2 is a kind of side schematic view of the micro- spacing pinboard according to a first preferred embodiment of the present utility model;
Fig. 3 A are a kind of spacing pinboards wide of the double-decker according to the first preferred embodiment of the present utility model Side schematic view;
Fig. 3 B are according to the sandwich construction spacing pinboard schematic diagram wide of of the present utility model 1 second preferred embodiment;
Fig. 4 is that the side of the spacing change-over panel after the combination according to the first preferred embodiment of the present utility model is illustrated Figure;
Fig. 5 is the storehouse for being used for unencapsulated half-finished semiconductor products according to the first preferred embodiment of the present utility model Side schematic view after formula test interface plates assembled;
Fig. 6 is that the stacking-type of the finished semiconductor for being used for encapsulation according to the first preferred embodiment of the present utility model is surveyed Try the side schematic view after mouthful plates assembled;And
Fig. 7 is a kind of manufacture method stream of the stacking-type test interface plate according to a preferred embodiment of the present utility model Cheng Tu.
【Specific embodiment】
The explanation of following embodiment is refer to the attached drawing, is used to illustrate the particular implementation that the utility model may be used to implement Example.
Fig. 2 and Fig. 3 A are refer to, Fig. 2 is a kind of micro- spacing pinboard according to a first embodiment of the present utility model Side schematic view, Fig. 3 A are a kind of sides of the spacing pinboard wide of the double-decker according to the first embodiment of the present utility model Face schematic diagram, stacking-type test interface plate of the present utility model, mainly includes:One printed circuit board (PCB) 10 and a spacing change-over panel 11, the spacing change-over panel 11 is by each independently making the spacing change-over panel 111 wide of a micro- spacing change-over panel 110 and for being formed Constituted, the side of micro- spacing change-over panel 110 has several first contacts 112 for being electrically connected with semiconductor semi-finished product (such as wafer) or finished semiconductor (such as chip), the side of the spacing change-over panel 111 wide has several second contacts 312.In In the present embodiment, micro- spacing change-over panel 110 and the spacing change-over panel 111 wide both it is vertical to storehouse between described in constituting Away from change-over panel 11, and several first contacts 112 the spacing for being smaller than several second contacts 312, described micro- Opposite side away from change-over panel 110 is provided with several 3rd contacts 112 ', and several 3rd contacts 112 ' are for distinguishing electrical communication To described several second contacts 312 of the spacing change-over panel 111 wide.
Preferably, each 3rd contact 112 ' is soldered to the width for a metal coupling (Bump) and using scolding tin Weld pad on the opposite side of spacing change-over panel 111 is being electrically connected.Between the in office two adjacent metal couplings With one every layer 113, and as shown in Fig. 2 arrow marks the transmission of each metal coupling in micro- spacing change-over panel 110 Path 114.
Fig. 3 B are according to the sandwich construction schematic diagram of spacing pinboard 111 ' wide of a second embodiment of the present utility model;
Preferably, each second contact 312 is a metal coupling.Between the in office two adjacent metal couplings With one every layer 313, and as shown in Fig. 3 A, 3B, arrow is the biography of each metal coupling in the spacing change-over panel 111 wide Defeated path 314.
Preferably, above-mentioned each metal coupling is copper bump.
Fig. 4 is refer to, Fig. 4 is the side of the spacing change-over panel after the combination according to the first embodiment of the present utility model Face schematic diagram, the spacing change-over panel 11 is made up of a micro- spacing change-over panel 110 with a spacing change-over panel 111 wide, and centre adds Mat material 40 and tin cream 41.
Fig. 5 is refer to, Fig. 5 is to be used for unencapsulated half-finished semiconductor products according to the first embodiment of the present utility model Stacking-type test interface plates assembled after side schematic view.Each second contact 312 is soldered to the printing electricity Weld pad on the side of road plate 10 is being electrically connected.The printed circuit board (PCB) 10 is a probe clamp (Probe card PCB), it is used to be electrically connected with a tester table for testing the half-finished semiconductor products and its opposite side.
Preferably, both edges of the printed circuit board (PCB) 10 and the spacing change-over panel 11 are formed at least on one side respectively Hole 1100,1110 is fixed for the insertion of fixed screw 14 with hold-doun nut 15.
Fig. 6 is refer to, Fig. 6 is the heap of the finished semiconductor for being used for encapsulation according to the first embodiment of the present utility model Side schematic view after stack test interface plates assembled.Each second contact 312 is soldered to the printed circuit board (PCB) Weld pad on the 10 ' side is being electrically connected.The printed circuit board (PCB) 10 ' is a test carrier plate (Loadboard PCB), it is used to be electrically connected with a tester table for testing the finished semiconductor and its opposite side.
Preferably, both edges of the printed circuit board (PCB) 10 ' and the spacing change-over panel 11 form at least one respectively Lateral opening 1100 ', 1110 ' for the insertion of fixed screw 14, and then is fixed with hold-doun nut 15.
Preferably, described several first contacts 112 of micro- spacing change-over panel 110 are fan-in (fan-in) configurations, And through hole or blind hole 30 are provided with the first contact 112 described in wherein at least one.
Preferably, described several second contacts 312 of the spacing change-over panel 111 wide are fan-in (fan-in) configurations, And through hole or blind hole 30 are provided with the second contact 312 described in wherein at least one.
Fig. 7 is refer to, Fig. 7 is a kind of manufacture of the stacking-type test interface plate according to an embodiment of the present utility model Method flow diagram, the manufacture method is used to manufacture stacking-type test interface plate as shown in Figure 5 or Figure 6, including following step Suddenly:
S600:Independently made using photolithography in semiconductor manufacturing and electroplating process between a micro- spacing change-over panel and a width Away from change-over panel, wherein micro- spacing change-over panel is to be same as shown in Figure 5 or Figure 6 with the thin portion structure of the spacing change-over panel wide Each structure, therefore be not repeated below;Between " independently making " referred herein is included at the same time or under different time Indivedual independent making;
S601:By the several metal couplings between micro- spacing change-over panel and the spacing change-over panel wide, make described Both micro- spacing change-over panel and described spacing change-over panel wide be electrically connected with merge it is vertical to storehouse to constitute a spacing change-over panel;And
S602:The spacing change-over panel is fixed by fixed screw and hold-doun nut is assembled to a printed circuit board (PCB) (such as The one probe clamp or the test carrier plate of Fig. 6 of Fig. 5) and it is electrically connected with both.
Make to shorten production room away from change-over panel institute using point plate according to stacking-type test interface plate of the present utility model The time for needing, and therefore reduce the number of plies, lift yield and reliability, and improve line width line-spacing it is smaller when detection, maintenance be difficult Problem, can also lift transmission efficiency.
In sum, although the utility model is illustrated as above with preferred embodiment, but above preferred embodiment is not used To limit the utility model, one of ordinary skill in the art is not departing from spirit and scope of the present utility model, can make Various changes are defined with retouching, therefore protection domain of the present utility model by the scope that claim is defined.

Claims (10)

1. a kind of stacking-type test interface plate, it is characterised in that including:
One spacing change-over panel, is made up of, the side of micro- spacing change-over panel a micro- spacing change-over panel with a spacing change-over panel wide It is used to be electrically connected with semiconductor semi-finished product or finished semiconductor, the side of the spacing change-over panel wide with several first contacts With several second contacts;And
One printed circuit board (PCB), its side is electrically connected to described several second contacts of the spacing change-over panel wide;
Wherein described micro- spacing change-over panel is vertical with both spacing change-over panels wide to constitute the spacing change-over panel to storehouse, and The spacing for being smaller than several second contacts of several first contacts, the opposite side of micro- spacing change-over panel is provided with Several 3rd contacts, several 3rd contacts are used to be electrically connected to the opposite side of the spacing change-over panel wide, and then respectively Several second contacts described in electrical communication.
2. stacking-type test interface plate as claimed in claim 1, it is characterised in that each 3rd contact is a metal Projection is simultaneously soldered to the weld pad on the opposite side of the spacing change-over panel wide to be electrically connected with scolding tin.
3. stacking-type test interface plate as claimed in claim 1, it is characterised in that each second contact is a metal Projection simultaneously is soldered to the weld pad on the side of the printed circuit board (PCB) to be electrically connected with scolding tin.
4. stacking-type test interface plate as claimed in claim 1, it is characterised in that the printed circuit board (PCB) is a probe card Plate (Probe card PCB), is used to be electrically connected with a tester table for testing the half-finished semiconductor products and its opposite side.
5. stacking-type test interface plate as claimed in claim 1, it is characterised in that the printed circuit board (PCB) is that a test is carried Plate (Loadboard PCB), is used to be electrically connected with a tester table for testing the finished semiconductor and its opposite side.
6. stacking-type test interface plate as claimed in claim 4, it is characterised in that the probe clamp and the spacing turn The edge for changing both plates forms at least one lateral opening for fixed screw insertion respectively, and then is fixed with hold-doun nut.
7. stacking-type test interface plate as claimed in claim 5, it is characterised in that the test carrier plate and the spacing turn The edge for changing both plates forms at least one lateral opening for fixed screw insertion respectively, and then is fixed with hold-doun nut.
8. stacking-type test interface plate as claimed in claim 2 or claim 3, it is characterised in that each metal coupling is copper Projection.
9. stacking-type test interface plate as claimed in claim 1, it is characterised in that the number of micro- spacing change-over panel Individual first contact is fan-in (fan-in) configuration, and is provided with through hole or blind hole in the first junction described in wherein at least one.
10. stacking-type test interface plate as claimed in claim 1, it is characterised in that the spacing change-over panel wide it is described Several second contacts are to be fanned out to (fan-out) configuration, and are provided with through hole or blind hole in the second junction described in wherein at least one.
CN201621186325.4U 2016-04-29 2016-11-04 Stacking-type test interface plate Active CN206292352U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW105206205 2016-04-29
TW105206205U TWM529169U (en) 2016-04-29 2016-04-29 Stack type test interface board assembly

Publications (1)

Publication Number Publication Date
CN206292352U true CN206292352U (en) 2017-06-30

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CN201621186325.4U Active CN206292352U (en) 2016-04-29 2016-11-04 Stacking-type test interface plate

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TW (1) TWM529169U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107340464A (en) * 2016-04-29 2017-11-10 中华精测科技股份有限公司 Stacking-type test interface plate and its manufacture method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107340464A (en) * 2016-04-29 2017-11-10 中华精测科技股份有限公司 Stacking-type test interface plate and its manufacture method

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Publication number Publication date
TWM529169U (en) 2016-09-21

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