CN206100595U - Electromagnetic wave shielding film - Google Patents
Electromagnetic wave shielding film Download PDFInfo
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- CN206100595U CN206100595U CN201620668891.2U CN201620668891U CN206100595U CN 206100595 U CN206100595 U CN 206100595U CN 201620668891 U CN201620668891 U CN 201620668891U CN 206100595 U CN206100595 U CN 206100595U
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- shielding film
- electromagnetic wave
- film
- wave shielding
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Abstract
The utility model discloses main metal thin film layer to among the electromagnetic wave shielding film increases porous design to avoid the surface blistering phenomenon among the prior art. Compared with the prior art, the utility model, this electromagnetic wave shielding film is at in adhesive process and other processing procedures yin gaowen and in time discharge in the steam that produces and other accessibles metallic film's air guide hole with FPC to can not produce the metal thin film layer separation, bad problem such as surface blistering.
Description
Technical field
The present invention relates to electronic technology field, more particularly to electronic circuit board.
Background technology
Current flexible electronic circuit boards（FPC）, it will usually adopt polyimides or polyester film to be processed for base material,
Such material is hygroscopic materials, under normal conditions, can contain a certain amount of moisture.
FPC circuits can produce electromagnetic interference in each frequency band because of the space radiation of clutter, and these electromagnetic interferences are not only
Impact can be produced on other circuits, while also result in the performance and function of product itself reduce, and Electro Magnetic Compatibility cannot
Reach the requirement of relevant criterion.At this time, it may be necessary to increase patch electromagnetic shielding film on its surface, shield typically by screened film
Metallic film realizes that in prior art, metallic film is continuous sheet metal structure, does not have gas permeability and water penetration.
FPC and shielding material need high-temperature heating to realize operation purpose, in height in the technical process of bonding and paster
During temperature heating, the moisture meeting heat of the absorption in FPC base materials polyimides or polyester film flashes to vapor, and water steams
Accumulation will be produced when gas reaches metallic film, it is difficult to scatter, thus easily form bubble on screened film surface, while vapor meeting
Cause metal film layer and conductive adhesive layer to separate, be so both unfavorable for attractive in appearance, electrical property and shield effectiveness can be also affected, so as to shadow
Ring product quality.
The content of the invention
It is an object of the present invention to overcome screen layer present in prior art not have the problem of gas permeability and water penetration,
So as to provide it is a kind of the internal steam for producing and/or other gases can be discharged, and while ensureing shielding film properties and function
Method.
In the present invention, the metal level of screened film increases gas port in design and manufacture, and steam is arranged using gas port
Go out, so as to realize ventilative purpose.Gas port is intensive on metal foil, be uniformly distributed, but does not affect its shield effectiveness.Steam vent to
The two sides connection of metallic film, its structure can be such that gas effectively passes through.
Compared with prior art, screened film of the invention adopts porous metallic layers, and gas port is increased on metallic film, makes
Electromagnetic shielding film is obtained on the premise of shield effectiveness and every electricity index do not decline, vapor is arranged in bonding heating process
Go out, so as to avoid the phenomenon of surface blistering of the prior art.
Description of the drawings
Accompanying drawing 1 is metal layer plane schematic diagram
Accompanying drawing 2 is this electromagnetic shielding film structure chart
The description of symbols of accompanying drawing 2
1st, transfer film
2nd, insulating barrier
3rd, metal forming
4th, conductive adhesive layer
5th, mould release membrance
Specific embodiment
The purpose of the present invention is achieved through the following technical solutions, during the making of electromagnetic shielding film, no
Continuous level thin metal layer is reused, is changed and is used porous metal film layer.Script continuous level metal film layer is vapor
The fundamental cause of accumulation, thus be the basic method of solve problem vapor through discharging.The air guide bore dia of thin metal layer
And dense degree, vapor produced in each operation can be completely exhausted out.
Compared with prior art, it is an advantage of the current invention that：Compared with prior art, this electromagnetic shielding film exists the present invention
Can pass through metal with the vapor and/or other gases produced because of high temperature in the process and other processing procedures of FPC bondings
The gas port of film is discharged in time, is separated so as to produce metal film layer, the bad problem such as surface blistering.
Present invention is generally directed to the metal film layer in electromagnetic shielding film carries out increasing porous design, it is existing so as to avoid
Surface blistering phenomenon in technology.
Metal film layer can shield electromagnetic signal and be because that they constitute the screened room of closing with the metal of surrounding, but
Shielding it is not absolutely required to continuous sealing surface, when shielded film has hole, due to the guide properties of electromagnetic wave aperture, in aperture
In the case of sufficiently small, shield effectiveness is had no effect on.A certain amount of electromagnetic wave can pass through thin metal layer, but through later meeting
Generation destruction interference, produces attenuation, so can still shield electromagnetic wave.On thin metal layer air-vent aperture less than λ/
The wavelength of 4, the λ main frequency range ripples shielded by electromagnetic shielding film, in the screened film of different concrete models, λ is with actual need
It is foundation to ask.
Compared with prior art, this electromagnetic shielding film is in the process bonded with FPC and other processing procedures for the present invention
The middle steam produced because of high temperature and other gas ports that can pass through metallic film be discharged in time, so as to produce metallic film
Layer is separated, the bad problem such as surface blistering.
Embodiments of the present invention are not limited by the above, and others are without departing from spirit of the invention and principle
Done modification, modification, replacement, combination, simplification are descended, equivalent substitute mode is should be, the protection of the present invention is included in
Within the scope of.
Claims (2)
1. a kind of electromagnetic shielding film, it is characterised in that：Comprising metal level, the metal level is metal forming, is provided with metal foil
Steam vent, steam vent connects the two sides of metal forming.
2. electromagnetic shielding film according to claim 1, the steam vent is distributed on metal foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620668891.2U CN206100595U (en) | 2016-06-30 | 2016-06-30 | Electromagnetic wave shielding film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620668891.2U CN206100595U (en) | 2016-06-30 | 2016-06-30 | Electromagnetic wave shielding film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206100595U true CN206100595U (en) | 2017-04-12 |
Family
ID=58464771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620668891.2U Active CN206100595U (en) | 2016-06-30 | 2016-06-30 | Electromagnetic wave shielding film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206100595U (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107567175A (en) * | 2016-06-30 | 2018-01-09 | 蔡见明 | A kind of electromagnetic shielding film |
| JP2019220620A (en) * | 2018-06-21 | 2019-12-26 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic wave shield sheet and printed wiring board |
| CN110691500A (en) * | 2018-07-06 | 2020-01-14 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110691503A (en) * | 2018-07-06 | 2020-01-14 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110784988A (en) * | 2018-11-26 | 2020-02-11 | 广州方邦电子股份有限公司 | Free grounding film, circuit board and preparation method of free grounding film |
| CN110784985A (en) * | 2018-11-26 | 2020-02-11 | 广州方邦电子股份有限公司 | Free grounding film, circuit board and preparation method of free grounding film |
| CN110784991A (en) * | 2018-11-26 | 2020-02-11 | 广州方邦电子股份有限公司 | Free grounding film, circuit board and preparation method of free grounding film |
| CN110996504A (en) * | 2019-12-31 | 2020-04-10 | 深圳市弘海电子材料技术有限公司 | High-frequency electromagnetic shielding film capable of being quickly pressed for FPC (Flexible printed Circuit) and manufacturing method thereof |
| CN111447819A (en) * | 2020-04-20 | 2020-07-24 | 昆山博益鑫成高分子材料有限公司 | Electromagnetic shielding film |
| CN112437598A (en) * | 2019-08-26 | 2021-03-02 | 昆山雅森电子材料科技有限公司 | High-shielding electromagnetic interference shielding film of multi-aperture copper foil and preparation method thereof |
| JP7558384B2 (en) | 2021-09-09 | 2024-09-30 | タツタ電線株式会社 | Electromagnetic wave shielding film |
-
2016
- 2016-06-30 CN CN201620668891.2U patent/CN206100595U/en active Active
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107567175A (en) * | 2016-06-30 | 2018-01-09 | 蔡见明 | A kind of electromagnetic shielding film |
| JP2019220620A (en) * | 2018-06-21 | 2019-12-26 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic wave shield sheet and printed wiring board |
| CN110691500A (en) * | 2018-07-06 | 2020-01-14 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110691503A (en) * | 2018-07-06 | 2020-01-14 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110691500B (en) * | 2018-07-06 | 2024-04-26 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110691503B (en) * | 2018-07-06 | 2024-04-26 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110784991A (en) * | 2018-11-26 | 2020-02-11 | 广州方邦电子股份有限公司 | Free grounding film, circuit board and preparation method of free grounding film |
| CN110784985A (en) * | 2018-11-26 | 2020-02-11 | 广州方邦电子股份有限公司 | Free grounding film, circuit board and preparation method of free grounding film |
| CN110784988A (en) * | 2018-11-26 | 2020-02-11 | 广州方邦电子股份有限公司 | Free grounding film, circuit board and preparation method of free grounding film |
| CN112437598A (en) * | 2019-08-26 | 2021-03-02 | 昆山雅森电子材料科技有限公司 | High-shielding electromagnetic interference shielding film of multi-aperture copper foil and preparation method thereof |
| TWI749612B (en) * | 2019-08-26 | 2021-12-11 | 亞洲電材股份有限公司 | Electromagnetic interference shielding film comprising porous metal and methods thereof |
| CN110996504A (en) * | 2019-12-31 | 2020-04-10 | 深圳市弘海电子材料技术有限公司 | High-frequency electromagnetic shielding film capable of being quickly pressed for FPC (Flexible printed Circuit) and manufacturing method thereof |
| CN110996504B (en) * | 2019-12-31 | 2020-10-16 | 深圳市弘海电子材料技术有限公司 | High-frequency electromagnetic shielding film capable of being quickly pressed for FPC (Flexible printed Circuit) and manufacturing method thereof |
| CN111447819A (en) * | 2020-04-20 | 2020-07-24 | 昆山博益鑫成高分子材料有限公司 | Electromagnetic shielding film |
| JP7558384B2 (en) | 2021-09-09 | 2024-09-30 | タツタ電線株式会社 | Electromagnetic wave shielding film |
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