CN104837301A - Flexible circuit board possessing shielding structure and manufacturing method of flexible circuit board - Google Patents
Flexible circuit board possessing shielding structure and manufacturing method of flexible circuit board Download PDFInfo
- Publication number
- CN104837301A CN104837301A CN201410048437.2A CN201410048437A CN104837301A CN 104837301 A CN104837301 A CN 104837301A CN 201410048437 A CN201410048437 A CN 201410048437A CN 104837301 A CN104837301 A CN 104837301A
- Authority
- CN
- China
- Prior art keywords
- layer
- copper
- layers
- conductive circuit
- flexible pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
Abstract
Disclosed is a flexible circuit board possessing a shielding structure. The flexible circuit board comprises a flexible circuit base board composed of a base layer, a first conducting circuit layer and a second conducting circuit layer formed on the base board, and a first covering layer and a second covering layer formed on the first conducting circuit layer and the second conducting circuit layer, respectively. The flexible circuit board also comprises an electromagnetic shielding structure formed on the surface of the first covering layer and comprising a first copper layer formed on the first covering layer and a copper-plated layer formed on the first copper layer. The flexible circuit board also comprises conductive holes, each of which includes an inner layer of the first copper layer and an outer layer of the copper plating layer, and is in electrical connection with the first conducting circuit layer and the electromagnetic shielding structure. The invention also relates to a manufacturing method of the flexible circuit board.
Description
Technical field
The present invention relates to circuit board making field, particularly relate to a kind of flexible PCB with electromagnetic armouring structure and preparation method thereof.
Background technology
Along with the conducting wire in flexible PCB is more and more intensive, conducting wire can produce a large amount of electromagnetic fields and affect other electronic equipment; In addition, the electromagnetic radiation that other electronic equipment produces also may have influence on flexible PCB, thus produces the interference of spuious signal, and it is unfavorable to bring to the use of electronic product, so, flexible PCB can design electromagnetic armouring structure usually.At present, in prior art, include at described electro-magnetic screen layer and the conductive hole that is electrically connected on the first conductive circuit layer the change layers of copper and plating layers of copper that adopt electroless plating and electric plating method to be formed respectively, form electromagnetic armouring structure with this.And in actual production, carrying out copper wiring on the cover layer that common polyimide material is formed, the phenomenon that easy appearanceization layers of copper is peeled off mutually with cover layer.
Summary of the invention
Therefore, be necessary that providing a kind of has the change layers of copper of stronger adhesion and the flexible PCB of tectal electromagnetic armouring structure and preparation method thereof.
A kind of manufacture method with the flexible PCB of electromagnetic armouring structure, comprise step: provide a flexible PCB, described flexible PCB comprises basalis, is formed at basalis relative to the first conductive circuit layer of both sides and the second conductive circuit layer and the first cover layer be formed at respectively in described first conductive circuit layer and the second conductive circuit layer and the second cover layer respectively, and described first and second cover layers are photosensitive type insulation film; Described first cover layer offers blind hole, to expose described first conductive circuit layer; Form first at described first cover layer and change layers of copper; And change layers of copper surface formation copper plate to form electromagnetic armouring structure described first, and fill described blind hole to form the conductive hole of the described electro-magnetic screen layer of electrical connection and described first conductive circuit layer, thus form flexible PCB.
A kind of flexible PCB with electromagnetic armouring structure, comprise: flexible circuit board, described flexible circuit board comprises basalis, be formed at basalis relative to the first conductive circuit layer of both sides and the second conductive circuit layer and the first cover layer be formed in described first conductive circuit layer and the second conductive circuit layer and the second cover layer, and described first and second cover layers are photosensitive type insulation film; Electromagnetic armouring structure, is formed at the electromagnetic armouring structure of described first cover surface, and described electromagnetic armouring structure comprises the copper plate being formed at the first tectal first change layers of copper and being formed at described first change layers of copper; And conductive hole, described conductive hole comprises first of internal layer and changes layers of copper and outer field copper plate, and is electrically connected described first conductive circuit layer and electromagnetic armouring structure.
Relative to prior art, the electromagnetic armouring structure of the present embodiment and the conductive hole being electrically connected on the first conductive circuit layer include adopt electroless copper and electric plating method to be formed respectively first change layers of copper and copper plate, when carrying out copper wiring forms the first change layers of copper on the cover layer, adopt sensing optical activity coverlay as cover layer, the surface of described sensing optical activity coverlay is very easy to form colory first and changes layers of copper, described first adhesion changed between layers of copper and cover layer is stronger, effectively can prevent peeling.
Accompanying drawing explanation
Fig. 1 is the flexible circuit board cutaway view that the embodiment of the present invention provides.
Fig. 2 is the cutaway view after the flexible circuit board of Fig. 1 offers multiple blind hole.
Fig. 3 is the cutaway view after the flexible circuit board of Fig. 2 forms the first and second change layers of copper.
Fig. 4 is the cutaway view form the first and second photoresist oxidant layer in the first and second change layers of copper of the flexible circuit board of Fig. 3 after.
Fig. 5 be remove in Fig. 4 be formed with the part photoresist oxidant layer of blind hole side after expose the cutaway view after the first change layers of copper.
Fig. 6 is the cutaway view after expose first of Fig. 5 changes layers of copper surface and plating forms copper plate.
Fig. 7 is the cutaway view after removing the remaining first and second photoresist oxidant layer in Fig. 6.
Fig. 8 is the cutaway view after forming electromagnetic armouring structure after the first and second change layers of copper exposed in removal Fig. 7.
Fig. 9 is the cutaway view of the flexible PCB formed after electromagnetic armouring structure in fig. 8 forms welding resisting layer.
Main element symbol description
| Flexible PCB | 10 |
| Flexible circuit board | 100 |
| Blind zone | 101 |
| Basalis | 110 |
| First conductive circuit layer | 111 |
| Second conductive circuit layer | 112 |
| First cover layer | 121 |
| Second cover layer | 122 |
| Blind hole | 123 |
| Electromagnetic armouring structure | 130 |
| First changes layers of copper | 131 |
| Second changes layers of copper | 132 |
| Copper plate | 133 |
| Conductive hole | 134 |
| First photoresist oxidant layer | 141 |
| Second photoresist oxidant layer | 142 |
| Solder mask | 150 |
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
Refer to Fig. 1 to Fig. 9, the embodiment of the present invention provides a kind of manufacture method with the flexible PCB 10 of shielding construction, comprises the steps:
The first step, refers to Fig. 1, provides a flexible circuit board 100.
Described flexible circuit board 100 comprises basalis 110, is formed at the first conductive circuit layer 111 and second conductive circuit layer 112 of the relative both sides of described basalis 110, is formed at the first cover layer 121 of the first conductive circuit layer 111 and is formed at the second cover layer 122 of the second conductive circuit layer 112.
In the present embodiment, described basalis 110 is flexible resin layer, as polyimides (Polyimide, PI), PETG (Polyethylene Terephthalate, or PEN (Polyethylene Naphthalate PET), PEN), can be also multilager base plate, comprise the multi-layer resinous layer and multilayer conductive circuit layer that are alternately arranged.Namely described flexible PCB 10 can be more than or equal to two-layer flexible PCB for conductive circuit layer, and wherein, described first conductive circuit layer 12 and the second conductive circuit layer 13 are the outermost layer conductive circuit layer of relative both sides.
Described first cover layer 121 and the second cover layer 122 are photosensitive type insulation film, are a kind of insulation films scribbling adhesive.
Described flexible circuit board 100 has a blind zone 101, and described blind zone 101 is positioned at the part surface of described first cover layer 121, and described blind zone 101 is for the formation of electromagnetic armouring structure.
Second step, refers to Fig. 2, and the first cover layer 121 in the blind zone 101 of described flexible circuit board 100 offers multiple blind hole 123, to expose described first conductive circuit layer 111.
In the present embodiment, described first cover layer 121 is photosensitive insulation film, can be exposed on described first cover layer 121 form blind hole 123 with photic method UV light.And described first conductive circuit layer 121 is exposed to described blind hole 123 part is earth connection.
Be appreciated that the number of described blind hole 123 may also be only one, be not limited with the present embodiment.
3rd step, carries out pre-treatment to the flexible circuit board 100 in described blind zone 101.
In the present embodiment, gas ions process or sand-blast is adopted to carry out pre-treatment to the flexible circuit board 100 in blind zone 101, clean the pollutant of described first cover layer 121 surface and described multiple blind hole 123 hole wall, and carry out activation processing, to increase the adhesion of change layers of copper and the first cover layer 121 and blind hole 123 hole wall formed in follow-up electroless plating step.
In the present embodiment, activation processing is the particle making cover surface adsorb one deck activity, as Metal Palladium particle.
4th step, refer to Fig. 3, by the method for electroless copper on the described surface of the first cover layer 121, the inwall of described blind hole 123 and described first conductive circuit layer 111 surface of exposing described multiple blind hole 123 forms continuous print first and changes layers of copper 131, and form continuous print second on described second cover layer 122 surface and change layers of copper 132.
Electroless copper is on the surface with catalytic activity, by the effect of reducing agent, copper ion is reduced and separates out:
Reduction (negative electrode) reaction: Cu
2+l+2e
-→ Cu+L
Oxidation (anode) reaction: R → O+2e
-
Namely form first by redox reaction and change layers of copper 131 and the second change layers of copper 132.
5th step, refer to Fig. 4 and Fig. 5, change in layers of copper 131 and the second change layers of copper 132 described first and form the first photoresist oxidant layer 141 and the second photoresist oxidant layer 142 respectively, and exposure imaging is carried out to remove the first photoresist oxidant layer 141 being covered in the first change layers of copper 131 to the first photoresist oxidant layer 141, change layers of copper 131 to expose described first.
In the present embodiment, described first changes the part corresponding to described blind zone 101 in layers of copper 131 is not covered by described first photoresist oxidant layer 141, and described second changes layers of copper 132 is covered completely by described second photoresist oxidant layer 142.In the present embodiment, the material of described first photoresist oxidant layer 141 and the second photoresist oxidant layer 142 is dry-film type photoresist.
6th step, refers to Fig. 6, adopt electric plating method be exposed in described blind zone 101 first change layers of copper 131 surface formed copper plate 133.
In the present embodiment, described copper plate 133 fills up described multiple blind hole 123.
7th step, refers to Fig. 7, removes described first photoresist oxidant layer 141 and the second photoresist oxidant layer 142.
8th step, refer to Fig. 8, remove first outside the described blind zone 101 on described second change layers of copper 132 and described first cover layer 121 surface and change layers of copper 131, thus in described blind zone 101, form the electromagnetic armouring structure 140 be jointly made up of described first change layers of copper 131 and copper plate 133.
In the present embodiment, change layers of copper 131 by first beyond the described second change layers of copper 132 of method removal of microetch and the described blind zone 101 on described first cover layer 121 surface, thus in described blind zone 101, form the electromagnetic armouring structure 140 be jointly made up of described first change layers of copper 131 and copper plate 133.Wherein, described electromagnetic armouring structure 140 comprises the electromagnetic armouring structure 140 that is formed at described first cover layer 121 surface and is formed in described first cover layer 121 and is electrically connected the conductive hole 134 of described first conductive circuit layer 111.
It should be noted that, the present embodiment also provides a microstrip line, it is a kind of planar structure transmission line of applicable making microwave integrated circuit, and there is radiation loss in microstrip line, therefore flexible circuit panel products reduces its radiation loss when microstrip design usually through laminating electromagnetic shielding material, increases its electromagnetism interference simultaneously.By net point instrument to the test of electromagnetic armouring structure 140 described in traditional electrical magnetic shielding material and the present embodiment, draw following data:
Obviously can draw, the electromagnetic armouring structure 140 that the present embodiment provides is at 1Gbps, 3Gbps, the Jitter P.P that 5Gbps, 10Gbps survey, Rise time, the indexs such as Jitter RMS, Open factor all can reach or the performance of beyond tradition electromagnetic armouring structure.
9th step, refers to Fig. 9, and described electromagnetic armouring structure 140 forms welding resisting layer 150, to protect described electromagnetic armouring structure 140, thus forms flexible PCB 100.In the present embodiment, the surface of the complete coated described electromagnetic armouring structure 140 of described welding resisting layer 150.
In the present embodiment, described flexible PCB 100 comprises basalis 11, be formed at described basalis 110 first conductive circuit layer 111 of both sides and the second conductive circuit layer 112, the first cover layer 121 being formed at described first conductive circuit layer 111 and the second conductive circuit layer 112 respectively and the second cover layer 122 and the electromagnetic armouring structure 140 be formed on described first cover layer 121 and welding resisting layer 150 relatively.Described electromagnetic armouring structure 140 is covered in the part surface of described first cover layer 121, and be electrically connected with the earth connection of described first conductive circuit layer 111 by conductive hole 25, described electromagnetic armouring structure 140 comprises the copper plate 133 being formed at first of described first cover layer 121 surface and changing layers of copper 131 and be formed at the first change layers of copper 131 surface.
Be appreciated that described electromagnetic armouring structure 140 also can cover the whole surface of described first cover layer 121, be not limited with the present embodiment.
Relative to prior art, the electromagnetic armouring structure 140 of the present embodiment and the conductive hole 134 being electrically connected on the first conductive circuit layer 111 include adopt electroless copper and electric plating method to be formed respectively first change layers of copper 131 and copper plate 133, when carrying out copper wiring forms the first change layers of copper 131 on the cover layer, adopt sensing optical activity coverlay as cover layer, the surface of described sensing optical activity coverlay is very easy to form colory first and changes layers of copper 131, described first adhesion changed between layers of copper 131 and cover layer is stronger, effectively can prevent peeling.
In addition, for the person of ordinary skill of the art, other various corresponding change can be made according to technical scheme of the present invention and technical conceive, and all these changes all should belong to the protection range of the claims in the present invention.
Claims (10)
1. one kind has the manufacture method of the flexible PCB of electromagnetic armouring structure, comprise step: provide a flexible PCB, described flexible PCB comprises basalis, is formed at basalis relative to the first conductive circuit layer of both sides and the second conductive circuit layer and the first cover layer be formed at respectively in described first conductive circuit layer and the second conductive circuit layer and the second cover layer respectively, and described first and second cover layers are photosensitive type insulation film;
Photic method is adopted to offer blind hole on described first cover layer, to expose described first conductive circuit layer;
Form first at described first cover layer and change layers of copper; And
Change layers of copper surface described first and form copper plate to form electromagnetic armouring structure, and fill described blind hole to form the conductive hole of the described electro-magnetic screen layer of electrical connection and described first conductive circuit layer, thus form flexible PCB.
2. the manufacture method of flexible PCB as claimed in claim 1, is characterized in that, after formation electromagnetic armouring structure and conductive hole, forms welding resisting layer further, to protect described electromagnetic armouring structure on described electromagnetic armouring structure.
3. the manufacture method of flexible PCB as claimed in claim 1, it is characterized in that, described flexible PCB has blind zone, and described blind zone is for the formation of electromagnetic armouring structure.
4. the manufacture method of flexible PCB as claimed in claim 1, is characterized in that, adopts the method for laser pit to form described multiple blind hole.
5. the manufacture method of flexible PCB as claimed in claim 1, it is characterized in that, the method forming described electromagnetic armouring structure and conductive hole also comprises step:
Adopt electroless copper method described first tectal surface, described blind hole medial surface and be exposed to described perforate the first conductive circuit layer surface formed continuous print first change layers of copper, and described second tectal surface formed continuous print second change layers of copper;
Change layers of copper surface described first and form the first photoresist oxidant layer, and change layers of copper surface formation the second photoresist oxidant layer described second, described first photoresist oxidant layer does not cover described first and changes the surface that layers of copper corresponds to blind zone, and described second photoresist oxidant layer covers the surface that whole second changes layers of copper;
Adopt electric plating method at the surface formation copper plate also plating filling described blind hole formation conductive blind hole of described first change layers of copper corresponding to described blind zone; And
Remove described first photoresist oxidant layer and the second photoresist oxidant layer, and remove the described second first of copper plate that do not cover changed layers of copper and be exposed to described first cover surface and change layers of copper, thus formed in described blind zone and change by described first the electromagnetic armouring structure that layers of copper and plating layers of copper form jointly.
6. the manufacture method of flexible PCB as claimed in claim 1, it is characterized in that, part first conductive circuit layer being exposed to described blind hole is earth connection.
7. the manufacture method of flexible PCB as claimed in claim 1, it is characterized in that, described basalis is multilager base plate, comprises the multi-layer resinous layer and multilayer conductive circuit layer that are alternately arranged.
8. one kind has the flexible PCB of electromagnetic armouring structure, comprise: flexible circuit board, described flexible circuit board comprises basalis, be formed at basalis relative to the first conductive circuit layer of both sides and the second conductive circuit layer and the first cover layer be formed in described first conductive circuit layer and the second conductive circuit layer and the second cover layer, and described first and second cover layers are photosensitive type insulation film;
Electromagnetic armouring structure, is formed at the electromagnetic armouring structure of described first cover surface, and described electromagnetic armouring structure comprises the copper plate being formed at the first tectal first change layers of copper and being formed at described first change layers of copper; And
Conductive hole, described conductive hole comprises first of internal layer and changes layers of copper and outer field copper plate, and is electrically connected described first conductive circuit layer and electromagnetic armouring structure.
9. flexible PCB as claimed in claim 8, it is characterized in that, described flexible PCB comprises welding resisting layer further, and described welding resisting layer is formed on described electromagnetic armouring structure, to protect described electromagnetic armouring structure.
10. flexible PCB as claimed in claim 8, it is characterized in that, described basalis is multilager base plate, comprises the multi-layer resinous layer and multilayer conductive circuit layer that are alternately arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410048437.2A CN104837301A (en) | 2014-02-12 | 2014-02-12 | Flexible circuit board possessing shielding structure and manufacturing method of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410048437.2A CN104837301A (en) | 2014-02-12 | 2014-02-12 | Flexible circuit board possessing shielding structure and manufacturing method of flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104837301A true CN104837301A (en) | 2015-08-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410048437.2A Pending CN104837301A (en) | 2014-02-12 | 2014-02-12 | Flexible circuit board possessing shielding structure and manufacturing method of flexible circuit board |
Country Status (1)
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106817836A (en) * | 2015-12-02 | 2017-06-09 | 富葵精密组件(深圳)有限公司 | Circuit board and preparation method thereof |
| TWI637662B (en) * | 2016-01-28 | 2018-10-01 | 鵬鼎科技股份有限公司 | Printed circuit board and method for manufacturing same |
| CN108738226A (en) * | 2018-05-04 | 2018-11-02 | 华显光电技术（惠州）有限公司 | Flexible circuit board structure, backlight assembly and mobile terminal |
| CN109219329A (en) * | 2017-06-30 | 2019-01-15 | 鹏鼎控股(深圳)股份有限公司 | The manufacturing method of circuit board |
| CN109429420A (en) * | 2017-08-22 | 2019-03-05 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and preparation method thereof with electro-magnetic screen function |
| CN110798966A (en) * | 2019-11-19 | 2020-02-14 | 江苏上达电子有限公司 | Method for implementing novel electromagnetic shielding for circuit board |
| CN111836456A (en) * | 2019-12-20 | 2020-10-27 | 深圳科诺桥科技股份有限公司 | Circuit board combined with electromagnetic shielding film and preparation method thereof |
| CN112654129A (en) * | 2019-10-10 | 2021-04-13 | 庆鼎精密电子（淮安）有限公司 | Anti-electromagnetic interference circuit board and manufacturing method thereof |
| CN112868220A (en) * | 2018-10-19 | 2021-05-28 | 三星电子株式会社 | Electronic device comprising a conductive member arranged with a separation space along a conductor line, which separation space is fillable with a dielectric |
| CN113707433A (en) * | 2021-10-28 | 2021-11-26 | 广东力王高新科技股份有限公司 | Miniaturized planar transformer |
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| CN106817836A (en) * | 2015-12-02 | 2017-06-09 | 富葵精密组件(深圳)有限公司 | Circuit board and preparation method thereof |
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| CN112868220A (en) * | 2018-10-19 | 2021-05-28 | 三星电子株式会社 | Electronic device comprising a conductive member arranged with a separation space along a conductor line, which separation space is fillable with a dielectric |
| CN112654129A (en) * | 2019-10-10 | 2021-04-13 | 庆鼎精密电子（淮安）有限公司 | Anti-electromagnetic interference circuit board and manufacturing method thereof |
| CN112654129B (en) * | 2019-10-10 | 2021-11-16 | 庆鼎精密电子（淮安）有限公司 | Anti-electromagnetic interference circuit board and manufacturing method thereof |
| CN110798966A (en) * | 2019-11-19 | 2020-02-14 | 江苏上达电子有限公司 | Method for implementing novel electromagnetic shielding for circuit board |
| CN111836456A (en) * | 2019-12-20 | 2020-10-27 | 深圳科诺桥科技股份有限公司 | Circuit board combined with electromagnetic shielding film and preparation method thereof |
| CN113707433A (en) * | 2021-10-28 | 2021-11-26 | 广东力王高新科技股份有限公司 | Miniaturized planar transformer |
| CN113707433B (en) * | 2021-10-28 | 2021-12-21 | 广东力王高新科技股份有限公司 | Miniaturized planar transformer |
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