JP2012243857A - Printed board and manufacturing method of printed board - Google Patents
Printed board and manufacturing method of printed board Download PDFInfo
- Publication number
- JP2012243857A JP2012243857A JP2011110504A JP2011110504A JP2012243857A JP 2012243857 A JP2012243857 A JP 2012243857A JP 2011110504 A JP2011110504 A JP 2011110504A JP 2011110504 A JP2011110504 A JP 2011110504A JP 2012243857 A JP2012243857 A JP 2012243857A
- Authority
- JP
- Japan
- Prior art keywords
- transmission line
- dielectric material
- printed circuit
- circuit board
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
本発明は、プリント基板及びプリント基板の製造方法に係り、特に、高周波成分を含む電気信号を伝送するためのシールド付き伝送線路を多層プリント配線基板内に構成したプリント基板及びプリント基板の製造方法に関する。 The present invention relates to a printed circuit board and a method for manufacturing the printed circuit board, and more particularly, to a printed circuit board in which a shielded transmission line for transmitting an electrical signal including a high-frequency component is configured in a multilayer printed wiring board, and a method for manufacturing the printed circuit board. .
近年、半導体集積回路の処理速度の向上やプリント基板に搭載されるコネクターの高速伝送性能の向上に伴い、プリント基板に設けられた伝送線路に１ＧＨｚ以上の高周波成分を含む高速な電気信号が伝送されるようになってきた。その結果、プリント基板に設けられた伝送線路から意図せざる高周波電磁界が発生し、高周波電磁界により周辺にある電子機器等を誤動作させたり、人体・隣接電子機器に悪影響を与える可能性が懸念されるようになってきている。このため、１ＧＨｚ以上の高周波帯でも電磁ノイズの発生を規制する動きが広がっており、伝送線路部分での不要電磁界の発生を抑制する技術が必要になっている。 In recent years, with the improvement of the processing speed of semiconductor integrated circuits and the improvement of the high-speed transmission performance of connectors mounted on printed circuit boards, high-speed electrical signals including high-frequency components of 1 GHz or higher are transmitted to transmission lines provided on the printed circuit boards. It has come to be. As a result, an unintended high-frequency electromagnetic field is generated from the transmission line provided on the printed circuit board, and there is concern that the high-frequency electromagnetic field may cause malfunctions in nearby electronic devices, or adversely affect the human body or adjacent electronic devices. It has come to be. For this reason, the movement which regulates generation | occurrence | production of electromagnetic noise has spread also in the high frequency band of 1 GHz or more, and the technique which suppresses generation | occurrence | production of the unnecessary electromagnetic field in a transmission line part is needed.
図４はプリント基板の伝送線路からの不要電磁界の発生を抑えることを可能とした従来技術によるプリント基板の構成を示す図である。 FIG. 4 is a diagram showing a configuration of a printed circuit board according to the prior art that can suppress generation of an unnecessary electromagnetic field from a transmission line of the printed circuit board.
図４に示す従来技術は、誘電材１、５を積層したプリント基板の内部に設けた伝送線路３の水平方向隣接部に機器の接地線に接続したいわゆるグランドパターン４を設置すると共に、伝送線路３の上下に同じく機器の接地線に接続したいわゆるグランドパターン４を設けてプリント基板を構成するというものである。この従来技術は、このような構成を有することにより、伝送線路３を流れる電流によって発生する電磁界をグランドパターン４で囲まれた範囲または近傍に閉じ込めることができ、周辺機器に悪影響を与えないようにすることができる。 The prior art shown in FIG. 4 installs a so-called ground pattern 4 connected to a ground line of a device at a horizontal adjacent portion of a transmission line 3 provided inside a printed circuit board in which dielectric materials 1 and 5 are laminated, and a transmission line. A so-called ground pattern 4 is also provided above and below 3 and connected to the ground line of the device to constitute a printed circuit board. With this configuration, this conventional technology can confine an electromagnetic field generated by a current flowing through the transmission line 3 in a range surrounded by the ground pattern 4 or in the vicinity thereof, so that peripheral devices are not adversely affected. Can be.
また、前述の技術を改良した従来技術として、例えば、特許文献１等に記載された技術が知られている。この従来技術は、プリント基板内層における差動配線において、誘電損失と抵抗損失による高周波成分の減衰とそれによるデジタル信号の波形歪を低減し良好な高速信号の伝送特性と低コストとを両立させることを可能としたものである。すなわち、この従来技術は、プリント基板内の差動配線対の上部を低誘電率の誘電体層で覆い、これらを通常の安価な非低誘電率の誘電体で上下から挟み、さらに、上の層の上面及び下の層下面に電源層を設けたものである。なお、特許文献１には、高周波用の伝送線路のシールド層を導電率が異なる複数の導体により構成することも開示されている。 Further, as a conventional technique obtained by improving the above technique, for example, a technique described in Patent Document 1 is known. This conventional technology achieves both high-speed signal transmission characteristics and low cost by reducing the attenuation of high-frequency components due to dielectric loss and resistance loss and the resulting digital signal waveform distortion in differential wiring in the printed circuit board inner layer. Is possible. That is, in this prior art, the upper part of the differential wiring pair in the printed circuit board is covered with a dielectric layer having a low dielectric constant, and these are sandwiched from above and below by a normal inexpensive non-low dielectric constant dielectric material. The power supply layer is provided on the upper surface of the layer and the lower surface of the lower layer. Patent Document 1 also discloses that the shield layer of the high-frequency transmission line is constituted by a plurality of conductors having different conductivities.
また、近年、３ＧＨｚ以上の高周波成分を含む高速な電気信号の送信受信を行おうという要求が高まっており、そのため、使用する伝送線路の垂直断面の全方位を導体で覆い、この導体を機器の接地線に接続してシールドを構成したシールド付ケーブルをプリント基板に設置する構造が検討されている。このシールドケーブルの第１の例は、伝送線路を構成する導線の外側に、伝送線路を構成する導線とは別な導体からなるシールドを追加して構成したものである。このシールドケーブルは、これによって、伝送線路を構成する導線で発生する電磁界を、シールドの近傍または内部に閉じ込めることができる。また、シールドケーブルの第２の例は、シールド層として新たな導体を追加するのではなく、伝送線路を構成する導線のうちの一部の導線が、他の導線の一部または全部を覆う構造としたものである。このシールドケーブルは、これによって、前述の一部の導線がシールドとしての機能を持ち、他の導線で発生する電磁界を一部の導線の近傍または内部に閉じ込めることができる。 In recent years, there has been an increasing demand for transmission / reception of high-speed electrical signals containing high-frequency components of 3 GHz or higher. Therefore, all the vertical sections of the transmission line to be used are covered with a conductor, and this conductor is covered with equipment. A structure in which a shielded cable that is connected to a ground wire to form a shield is installed on a printed circuit board has been studied. In the first example of the shielded cable, a shield made of a conductor different from the conductor constituting the transmission line is added to the outside of the conductor constituting the transmission line. Thus, the shielded cable can confine an electromagnetic field generated by the conducting wire constituting the transmission line in the vicinity of or inside the shield. In addition, in the second example of the shielded cable, a new conductor is not added as a shield layer, but a part of the conductors constituting the transmission line covers a part or all of the other conductors. It is what. With this shielded cable, the above-described part of the conductors have a function as a shield, and the electromagnetic field generated by the other conductors can be confined in the vicinity of or inside the part of the conductors.
なお、前述の第１の例によるシールドケーブルとしては、例えば、シールド付きペアケーブル（ＴｗｉｎＡｘ）、シールド付きカッドケーブル、シールド付きツイストペアケーブル（ＦＴＰ）、シールド付きフラットケーブル（ＦＦＣ）等があり、また、第２の例によるシールドケーブルとしては、特許文献２等に記載されているような同軸ケーブル等がある。 Examples of the shielded cable according to the first example include a shielded pair cable (TwinAx), a shielded quad cable, a shielded twisted pair cable (FTP), and a shielded flat cable (FFC). As a shielded cable according to the second example, there is a coaxial cable as described in Patent Document 2 and the like.
図４により説明した前述の従来技術及び特許文献１に記載の従来技術によるプリント基板は、いずれも、プリント基板の伝送線路の水平方向の隣接部に機器の接地線に接続したグランドパターンを設置すると共に、伝送線路の上下に同じく機器の接地線に接続したグランドパターンを設けたものである。このような構成を持つプリント基板は、伝送線路を流れる電流によって発生する電磁界をグランドパターンで囲まれた範囲または近傍に閉じ込めることを可能としたものであるが、伝送線路の垂直断面の全方位を導体で覆ってシールドを構成しているものではないため、十分なシールド効果を得ることができないとい問題点を有している。 In the printed circuit board according to the above-described conventional technique described in FIG. 4 and the conventional technique described in Patent Document 1, the ground pattern connected to the ground line of the device is installed in the horizontal adjacent portion of the transmission line of the printed circuit board. In addition, a ground pattern connected to the ground line of the device is provided above and below the transmission line. The printed circuit board having such a configuration can confine the electromagnetic field generated by the current flowing in the transmission line within the range surrounded by the ground pattern or in the vicinity of the vertical cross section of the transmission line. Since the shield is not constituted by covering with a conductor, there is a problem that a sufficient shielding effect cannot be obtained.
また、前述で、第１、第２の例として説明したシールドケーブルをプリント基板に設置するという従来技術による方法は、一般的なプリント基板の製造技術によりプリント基板を製造することが困難な上、ホトリソグラフィー技術を応用した一般的な伝送線路と比較して、伝送線の設置密度が低くなってしまうという問題点を生じさせる。 In addition, the above-described conventional method of installing the shielded cable described as the first and second examples on the printed circuit board is difficult to manufacture the printed circuit board by a general printed circuit board manufacturing technique. As compared with a general transmission line to which photolithography technology is applied, there is a problem that the installation density of the transmission line is lowered.
本発明の目的は、前述したような従来技術の問題点を解決し、一般的なプリント基板の製造技術を使用して製造可能な、伝送線路の垂直断面の全方位を導体で覆い、この導体を機器の接地線であるグランドパターンに接続し構成したシールド付き伝送線路を備えたプリント基板及びその製造方法を提供することにある。 The object of the present invention is to solve the problems of the prior art as described above, and to cover all the directions of the vertical cross section of the transmission line with a conductor, which can be manufactured using a general printed circuit board manufacturing technique. It is intended to provide a printed circuit board including a shielded transmission line configured by connecting a cable to a ground pattern which is a ground line of a device and a method for manufacturing the same.
本発明によれば前記目的は、シールド付き伝送線路を多層プリント配線基板内に構成したプリント基板において、前記プリント基板内に、基板である誘電材上に形成された伝送線路と、前記基板である誘電材の対面に設けられたグランドパターンと、前記伝送線路を覆うように形成された誘電材と、前記伝送線路の垂直断面の側面側の前記基板である誘電材に前記グランドパターンにまで届くように施された溝と、前記伝送線路を覆うように形成された誘電材及び前記基板である誘電材に施された溝の内壁の全表面に金属鍍金により形成されたシールドとを有して構成されたシールド付伝送線路を備えることにより達成される。 According to the present invention, the object is a printed circuit board in which a shielded transmission line is configured in a multilayer printed wiring board, the transmission line formed on a dielectric material as the substrate in the printed circuit board, and the substrate. A ground pattern provided on the opposite side of the dielectric material, a dielectric material formed so as to cover the transmission line, and a dielectric material that is the substrate on a side surface of the vertical section of the transmission line so as to reach the ground pattern And a dielectric material formed so as to cover the transmission line, and a shield formed by metal plating on the entire surface of the inner wall of the groove provided on the dielectric material as the substrate. This is achieved by providing a shielded transmission line.
また、前記目的は、シールド付き伝送線路を多層プリント配線基板内に構成したプリント基板の製造方法において、基板となる誘電材の上面及び裏面に金属箔が張り付けられている金属張り積層板の上面及び裏面の金属箔の上面に伝送線路、下面にグランドパターンを形成する工程と、記伝送線路を覆うような形状で誘電材を形成する工程と、前記伝送線路を覆うように誘電材を形成したプリント基板に対して、前記伝送線路から離れた最適な距離の前記伝送線路の両側の基板を構成する誘電材に溝を形成する工程と、前記基板を構成する誘電材に溝を形成したプリント基板に対して、前記形成した誘電材の上面と基板である誘電材に設けた溝の内壁に金属鍍金処理を施すことにより、シールドを形成する工程とを有することにより達成される。 Further, in the printed circuit board manufacturing method in which the shielded transmission line is configured in the multilayer printed wiring board, the object is to provide an upper surface of a metal-clad laminate in which metal foil is attached to the upper surface and the back surface of the dielectric material to be the substrate, and A step of forming a transmission line on the upper surface of the metal foil on the back surface, a step of forming a ground pattern on the lower surface, a step of forming a dielectric material so as to cover the transmission line, and a print in which a dielectric material is formed so as to cover the transmission line Forming a groove in a dielectric material constituting the substrate on both sides of the transmission line at an optimum distance away from the transmission line, and a printed circuit board having a groove formed in the dielectric material constituting the substrate On the other hand, it is achieved by including a step of forming a shield by performing metal plating on the upper surface of the formed dielectric material and the inner wall of the groove provided in the dielectric material as the substrate. .
本発明によれば、高周波領域において電磁界ノイズの発生量が少なく、かつ、高密度にシールド付き伝送線路を設置可能なプリント基板を提供することができ、また、このようなプリント基板を低コストで製造することができる。 According to the present invention, it is possible to provide a printed circuit board that generates a small amount of electromagnetic noise in a high-frequency region and that can be installed with a shielded transmission line at a high density. Can be manufactured.
以下、本発明によるプリント基板及びプリント基板の製造方法の実施形態を図面により詳細に説明する。 Embodiments of a printed circuit board and a printed circuit board manufacturing method according to the present invention will be described below in detail with reference to the drawings.
図１は本発明の第１の実施形態によるプリント基板の製造方法を説明する製造工程毎のプリント基板の断面図である。 FIG. 1 is a cross-sectional view of a printed circuit board for each manufacturing process for explaining a printed circuit board manufacturing method according to the first embodiment of the present invention.
（１）まず、図１（ａ）に示しているような基板となる誘電材１の上面及び裏面に銅箔２が張り付けられている銅張り積層板を用意する。なお、銅張り積層板は、銅張りでなく金、アルミニウム等の金属張り積層板であってよい。 (1) First, a copper-clad laminate in which a copper foil 2 is adhered to the upper surface and the rear surface of a dielectric material 1 to be a substrate as shown in FIG. The copper-clad laminate may be a metal-clad laminate such as gold or aluminum instead of copper.
（２）次に、図１（ａ）に示す銅張り積層板の上面及び裏面の銅箔２のそれぞれにホトリソグラフィー技術を用いて、図１（ｂ）に示すように、上面に伝送線路３とグランドパターン４を形成すると共に、裏面にグランドパターン４を形成する。 (2) Next, as shown in FIG. 1B, the transmission line 3 is formed on the upper surface of the copper clad laminate shown in FIG. And the ground pattern 4 are formed, and the ground pattern 4 is formed on the back surface.
（３）次に、図１（ｃ）に示すように伝送線路３を覆うような形状で、上面のグランドパターン４の間に誘電材５を形成する。この際の誘電材の形成方法としては、プリント基板の製造工程で一般的に採用されているスクリーン印刷やディスペンサーによる形成が好適である。なお、誘電材５の材料は、誘電材１と同等の誘電特性を備えた材料に限定されるものではない。 (3) Next, a dielectric material 5 is formed between the ground patterns 4 on the upper surface so as to cover the transmission line 3 as shown in FIG. In this case, the dielectric material is preferably formed by screen printing or a dispenser generally employed in the printed circuit board manufacturing process. The material of the dielectric material 5 is not limited to a material having the same dielectric characteristics as the dielectric material 1.
（４）続いて、図１（ｃ）に示すような伝送線路３を覆うように誘電材５を形成したプリント基板に対して、その断面方向の全周に銅鍍金処理を施すことにより、図１（ｄ）に示しているようにシールドパターン６を形成する。この際の銅鍍金処理は、誘電材への直接膜形成が可能な厚付け無電解銅鍍金が好適であるが、無電解銅鍍金による薄膜形成後に電解銅鍍金処理を施すことによっても実現可能である。 (4) Subsequently, a copper plating process is applied to the entire circumference in the cross-sectional direction of the printed circuit board in which the dielectric material 5 is formed so as to cover the transmission line 3 as shown in FIG. A shield pattern 6 is formed as shown in FIG. In this case, the copper plating treatment is preferably a thick electroless copper plating capable of forming a film directly on a dielectric material, but can also be realized by performing an electrolytic copper plating treatment after forming a thin film by electroless copper plating. is there.
前述で説明した本発明の第１の実施形態によるプリント基板の製造方法は、プリント基板の一部分の製造方法及びそれにより製造されるプリント基板の構造を説明したものであり、図１（ｄ）に示すように構成された構造部品を複数積層することにより、伝送線路の垂直断面の全方位をグランドパターンで覆ったシールド付き伝送線路を備えた多層プリント基板を製造することも可能である。但し、この本発明の第１の実施形態は、図１の横方向に広いプリント基板の基板内の一部の領域に構成されている伝送線路に対して適用することは困難である。また、図１に示す本発明の第１の実施形態では、伝送線路３を一対のペア配線としているが、本発明は、伝送線路を単独の伝送線路あるいは３本以上の集合配線とすることも可能である。 The printed circuit board manufacturing method according to the first embodiment of the present invention described above describes a method of manufacturing a part of the printed circuit board and the structure of the printed circuit board manufactured by the method, and FIG. By laminating a plurality of structural components configured as shown, it is possible to manufacture a multilayer printed circuit board having a shielded transmission line in which all directions of a vertical section of the transmission line are covered with a ground pattern. However, it is difficult to apply the first embodiment of the present invention to a transmission line configured in a partial region in the substrate of the printed circuit board wide in the lateral direction in FIG. In the first embodiment of the present invention shown in FIG. 1, the transmission line 3 is a pair of wiring lines. However, in the present invention, the transmission line may be a single transmission line or three or more collective wirings. Is possible.
図２は本発明の第２の実施形態によるプリント基板の製造方法を説明する製造工程毎のプリント基板の断面図である。 FIG. 2 is a cross-sectional view of a printed circuit board for each manufacturing process for explaining a printed circuit board manufacturing method according to the second embodiment of the present invention.
（１）まず、本発明の第１の実施形態の場合と同様に、図２（ａ）に示しているような基板となる誘電材１の上面及び裏面に銅箔２が張り付けられている銅張り積層板を用意する。なお、銅張り積層板は、銅張りでなく金、アルミニウム等の金属張り積層板であってよい。 (1) First, as in the case of the first embodiment of the present invention, copper having a copper foil 2 attached to the top and back surfaces of a dielectric material 1 serving as a substrate as shown in FIG. Prepare a stretched laminate. The copper-clad laminate may be a metal-clad laminate such as gold or aluminum instead of copper.
（２）次に、図２（ａ）に示す銅張り積層板の上面及び裏面の銅箔２のそれぞれにホトリソグラフィー技術を用いて、図２（ｂ）に示すように、上面に伝送線路３、下面にグランドパターン４を形成する。 (2) Next, as shown in FIG. 2B, the transmission line 3 is formed on the upper surface of the copper clad laminate shown in FIG. The ground pattern 4 is formed on the lower surface.
（３）次に、図２（ｃ）に示すように伝送線路３を覆うような形状で誘電材５を形成する。この際の誘電材の形成方法としては、プリント基板の製造工程で一般的に採用されているスクリーン印刷やディスペンサーによる形成が好適である。なお、誘電材５の材料は、誘電材１と同等の誘電特性を備えた材料に限定されるものではない。 (3) Next, as shown in FIG. 2C, the dielectric material 5 is formed in a shape that covers the transmission line 3. In this case, the dielectric material is preferably formed by screen printing or a dispenser generally employed in the printed circuit board manufacturing process. The material of the dielectric material 5 is not limited to a material having the same dielectric characteristics as the dielectric material 1.
（４）続いて、図２（ｃ）に示すような伝送線路３を覆うように誘電材５を形成したプリント基板に対して、図２（ｄ）に示すように、伝送線路３から離れた最適な距離の伝送線路３の両側の基板を構成する誘電材１に溝７を形成する。この際、溝７の加工法としては、プリント基板製造工程で一般的な数値制御ルーター加工やレーザ加工を用いるのが好適である。なお、図２に示す例において、溝７を形成する位置を、誘電材５の両サイドとなる位置としているが、溝７を形成する位置は、誘電材５の上方から溝７を形成しなければならないような位置であってもよい。 (4) Subsequently, as shown in FIG. 2 (d), the printed circuit board on which the dielectric material 5 is formed so as to cover the transmission line 3 as shown in FIG. 2 (c) is separated from the transmission line 3. Grooves 7 are formed in the dielectric material 1 constituting the substrates on both sides of the transmission line 3 having an optimum distance. At this time, as a processing method of the groove 7, it is preferable to use general numerical control router processing or laser processing in the printed circuit board manufacturing process. In the example shown in FIG. 2, the positions where the grooves 7 are formed are the positions on both sides of the dielectric material 5, but the positions where the grooves 7 are formed must be formed from above the dielectric material 5. It may be a position that must be.
（５）続いて、図２（ｄ）に示すような伝送線路３の両側の基板を構成する誘電材１に溝７を形成したプリント基板に対して、形成した誘電材５の上面と基板である誘電材１に設けた溝７の内壁に銅鍍金処理を施すことにより、図２（ｅ）に示すように、シールドパターン６を形成する。この際の銅鍍金処理は、誘電材への直接膜形成が可能な厚付け無電解銅鍍金が好適であるが、無電解銅鍍金による薄膜形成後に電解銅鍍金処理を施すことによっても実現可能である。 (5) Subsequently, with respect to the printed circuit board in which the groove 7 is formed in the dielectric material 1 constituting the substrate on both sides of the transmission line 3 as shown in FIG. By applying copper plating to the inner wall of the groove 7 provided in a certain dielectric material 1, a shield pattern 6 is formed as shown in FIG. In this case, the copper plating treatment is preferably a thick electroless copper plating capable of forming a film directly on a dielectric material, but can also be realized by performing an electrolytic copper plating treatment after forming a thin film by electroless copper plating. is there.
前述で説明した本発明の第２の実施形態によるプリント基板の製造方法は、プリント基板の一部分の製造方法及びそれにより製造されるプリント基板の構造を説明したものであり、図２（ｅ）に示すように構成された構造部品を複数積層することにより、伝送線路とその伝送線路をシールドする銅鍍金層との距離を伝送特性を鑑みて好適な距離として、伝送線路の垂直断面の全方位をグランドパターンで覆ったシールド付き伝送線路を備えた多層プリント基板を製造することも可能である。また、図２に示す本発明の第２の実施形態では、伝送線路３を一対のペア配線としているが、本発明は、伝送線路を単独の伝送線路あるいは３本以上の集合配線とすることも可能である。 The method for manufacturing a printed circuit board according to the second embodiment of the present invention described above describes a method for manufacturing a part of the printed circuit board and the structure of the printed circuit board manufactured by the method, and is shown in FIG. By laminating a plurality of structural components configured as shown, the distance between the transmission line and the copper plating layer that shields the transmission line is set as a suitable distance in view of transmission characteristics, and the omnidirectional vertical section of the transmission line is It is also possible to manufacture a multilayer printed board having a shielded transmission line covered with a ground pattern. In the second embodiment of the present invention shown in FIG. 2, the transmission line 3 is a pair of wiring lines. However, in the present invention, the transmission line may be a single transmission line or three or more collective wirings. Is possible.
図３は本発明の第３の実施形態によるプリント基板の製造方法を説明する製造工程毎のプリント基板の断面図である。 FIG. 3 is a cross-sectional view of a printed circuit board for each manufacturing process for explaining a printed circuit board manufacturing method according to a third embodiment of the present invention.
（１）まず、本発明の第１の実施形態の場合と同様に、図３（ａ）に示しているような基板となる誘電材１の上面及び裏面に銅箔２が張り付けられている銅張り積層板を用意する。なお、銅張り積層板は、銅張りでなく金、アルミニウム等の金属張り積層板であってよい。 (1) First, as in the case of the first embodiment of the present invention, copper in which a copper foil 2 is attached to the upper surface and the back surface of a dielectric material 1 that becomes a substrate as shown in FIG. Prepare a stretched laminate. The copper-clad laminate may be a metal-clad laminate such as gold or aluminum instead of copper.
（２）次に、図３（ａ）に示す銅張り積層板の上面及び裏面の銅箔２にホトリソグラフィー技術を用いて、図３（ｂ）に示すように、上面に伝送線路３、下面にグランドパターン４を形成する。 (2) Next, using the photolithography technique for the copper foil 2 on the upper surface and the back surface of the copper-clad laminate shown in FIG. 3A, the transmission line 3 and the lower surface are formed on the upper surface as shown in FIG. 3B. A ground pattern 4 is formed.
（３）次に、図３（ｃ）に示すように伝送線路３を覆うような形状で誘電材５を半円形状に形成する。この際の誘電材形成方法は、ディスペンサーによる形成が好適である。また、半円形状を形成するためにエキシマレーザによるトリミング加工を実施してもよい。なお、誘電材５の材料は、誘電材１と同等の誘電特性を備えた材料に限定されるものではない。 (3) Next, the dielectric material 5 is formed in a semicircular shape so as to cover the transmission line 3 as shown in FIG. In this case, the dielectric material forming method is preferably formed by a dispenser. In addition, trimming with an excimer laser may be performed to form a semicircular shape. The material of the dielectric material 5 is not limited to a material having the same dielectric characteristics as the dielectric material 1.
（４）続いて、図３（ｃ）に示すような伝送線路３を覆うように誘電材５を形成したプリント基板に対して、図３（ｄ）に示すように、伝送線路３からほぼ等距離の軌跡で誘電材５の半円形状を円形に延長するような壁面形状となるように、伝送線路３側に壁面を有する溝７を伝送線路３の両側の基板である誘電材１に形成する。この際、溝７の加工法としては、プリント基板製造工程で一般的な数値制御ルーター加工やレーザ加工を用いるのが好適である。 (4) Subsequently, as shown in FIG. 3D, the printed circuit board on which the dielectric material 5 is formed so as to cover the transmission line 3 as shown in FIG. A groove 7 having a wall surface on the transmission line 3 side is formed in the dielectric material 1 which is a substrate on both sides of the transmission line 3 so that the semicircular shape of the dielectric material 5 extends in a circular shape along the path of distance. To do. At this time, as a processing method of the groove 7, it is preferable to use general numerical control router processing or laser processing in the printed circuit board manufacturing process.
（５）続いて、図３（ｄ）に示すような伝送線路３の両側の基板を構成する誘電材１に溝７を形成したプリント基板に対して、形成した誘電材５の上面と基板である誘電材１に設けた溝７の内壁に銅鍍金処理を施すことにより、図３（ｅ）に示すように、シールドパターン６を形成する。この際の銅鍍金処理は、誘電材への直接膜形成が可能な厚付け無電解銅鍍金が好適であるが、無電解銅鍍金による薄膜形成後に電解銅鍍金処理を施すことによっても実現可能である。 (5) Subsequently, with respect to the printed circuit board in which the groove 7 is formed in the dielectric material 1 constituting the substrate on both sides of the transmission line 3 as shown in FIG. By applying a copper plating treatment to the inner wall of the groove 7 provided in a certain dielectric material 1, a shield pattern 6 is formed as shown in FIG. In this case, the copper plating treatment is preferably a thick electroless copper plating capable of forming a film directly on a dielectric material, but can also be realized by performing an electrolytic copper plating treatment after forming a thin film by electroless copper plating. is there.
前述で説明した本発明の第３の実施形態によるプリント基板の製造方法は、プリント基板の一部分の製造方法及びそれにより製造されるプリント基板の構造を説明したものであり、図３（ｅ）に示すように構成された構造部品を複数積層することにより、伝送線路の垂直断面全方位を円形グランドパターンで覆ったシールド付き伝送線路を備えた多層プリント基板を製造することも可能である。また、図３に示す本発明の第３の実施形態では、伝送線路３を一対のペア配線としているが、本発明は、伝送線路を単独の伝送線路あるいは３本以上の集合配線とすることも可能である。 The printed circuit board manufacturing method according to the third embodiment of the present invention described above describes a method for manufacturing a part of the printed circuit board and the structure of the printed circuit board manufactured by the method, and is shown in FIG. By laminating a plurality of structural parts configured as shown, it is possible to manufacture a multilayer printed board having a shielded transmission line in which the entire vertical cross section of the transmission line is covered with a circular ground pattern. Further, in the third embodiment of the present invention shown in FIG. 3, the transmission line 3 is a pair of wiring lines. However, in the present invention, the transmission line may be a single transmission line or three or more collective wirings. Is possible.
なお、前述した本発明の各実施形態は、誘電材等への鍍金を銅鍍金であるとして説明したが、本発明は、銅鍍金に限らず他の金属の鍍金、例えば、電気導電率の高い、金、アルミニウム等の鍍金であってもよい。 In addition, although each embodiment of this invention mentioned above demonstrated the plating to a dielectric material etc. as a copper plating, this invention is not limited to a copper plating, For example, the plating of other metals, for example, high electrical conductivity is high. , Gold, aluminum or the like may be used.
１、５ 誘電材
２ 銅箔
３ 伝送線路
４ グランドパターン
６ シールドパターン
７ 溝
1, 5 Dielectric material 2 Copper foil 3 Transmission line 4 Ground pattern 6 Shield pattern 7 Groove
Claims (5)
前記プリント基板内に、基板である誘電材上に形成された伝送線路と、前記基板である誘電材の対面に設けられたグランドパターンと、前記伝送線路を覆うように形成された誘電材と、前記基板である誘電材及び前記伝送線路を覆うように形成された誘電材の全表面に金属鍍金により形成されたシールドとを有して構成されたシールド付伝送線路を備えることを特徴とするプリント基板。 In a printed circuit board with a shielded transmission line configured in a multilayer printed circuit board,
In the printed circuit board, a transmission line formed on a dielectric material which is a substrate, a ground pattern provided on the opposite side of the dielectric material which is the substrate, a dielectric material formed so as to cover the transmission line, A print having a shielded transmission line configured to have a dielectric material that is the substrate and a shield formed by metal plating on the entire surface of the dielectric material that is formed so as to cover the transmission line. substrate.
前記プリント基板内に、基板である誘電材上に形成された伝送線路と、前記基板である誘電材の対面に設けられたグランドパターンと、前記伝送線路を覆うように形成された誘電材と、前記伝送線路の垂直断面の側面側の前記基板である誘電材に前記グランドパターンにまで届くように施された溝と、前記伝送線路を覆うように形成された誘電材及び前記基板である誘電材に施された溝の内壁の全表面に金属鍍金により形成されたシールドとを有して構成されたシールド付伝送線路を備えることを特徴とするプリント基板。 In a printed circuit board with a shielded transmission line configured in a multilayer printed circuit board,
In the printed circuit board, a transmission line formed on a dielectric material which is a substrate, a ground pattern provided on the opposite side of the dielectric material which is the substrate, a dielectric material formed so as to cover the transmission line, A groove formed so as to reach the ground pattern in the dielectric material which is the substrate on the side surface side of the vertical section of the transmission line; a dielectric material which is formed so as to cover the transmission line; and a dielectric material which is the substrate A printed circuit board comprising a shielded transmission line configured to have a shield formed by metal plating on the entire surface of an inner wall of a groove formed on the metal plate.
基板となる誘電材の上面及び裏面に金属箔が張り付けられている金属張り積層板の上面及び裏面の金属箔の上面に伝送線路、下面にグランドパターンを形成する工程と、前記伝送線路を覆うような形状で誘電材を形成する工程と、前記伝送線路を覆うように誘電材を形成したプリント基板に対して、前記伝送線路から離れた最適な距離の前記伝送線路の両側の基板を構成する誘電材に溝を形成する工程と、前記基板を構成する誘電材に溝を形成したプリント基板に対して、前記形成した誘電材の上面と基板である誘電材に設けた溝の内壁に金属鍍金処理を施すことにより、シールドを形成する工程とを有することを特徴とするプリント基板の製造方法。 In a method for manufacturing a printed circuit board in which a transmission line with a shield is configured in a multilayer printed circuit board,
A step of forming a transmission line on the upper surface and the upper surface of the metal foil on the back surface of the metal-clad laminate, and a ground pattern on the lower surface, and covering the transmission line Forming a dielectric material in a simple shape, and a dielectric that forms substrates on both sides of the transmission line at an optimum distance away from the transmission line with respect to a printed circuit board on which the dielectric material is formed so as to cover the transmission line A metal plating process is performed on the upper surface of the formed dielectric material and the inner wall of the groove provided in the dielectric material as the substrate for the printed circuit board in which the groove is formed in the dielectric material constituting the substrate. And a step of forming a shield by applying the method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011110504A JP2012243857A (en) | 2011-05-17 | 2011-05-17 | Printed board and manufacturing method of printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011110504A JP2012243857A (en) | 2011-05-17 | 2011-05-17 | Printed board and manufacturing method of printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2012243857A true JP2012243857A (en) | 2012-12-10 |
Family
ID=47465259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011110504A Pending JP2012243857A (en) | 2011-05-17 | 2011-05-17 | Printed board and manufacturing method of printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2012243857A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019133974A (en) * | 2018-01-29 | 2019-08-08 | 矢崎総業株式会社 | Circuit body and manufacturing method thereof |
| JP2020161741A (en) * | 2019-03-28 | 2020-10-01 | 大日本印刷株式会社 | Wiring board, and manufacturing method for wiring board |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6116415A (en) * | 1984-06-30 | 1986-01-24 | 株式会社東芝 | Wiring unit |
| JPH04199790A (en) * | 1990-11-29 | 1992-07-20 | Nippon Mektron Ltd | Shield type flexible circuit board and manufacture thereof |
| JPH05160575A (en) * | 1991-12-09 | 1993-06-25 | Fujitsu Ltd | Printed circuit board |
| JPH07297590A (en) * | 1994-04-28 | 1995-11-10 | Oki Electric Ind Co Ltd | Method of forming wiring of coaxial structure |
| JP2000277975A (en) * | 1999-03-25 | 2000-10-06 | Kuraray Co Ltd | Electromagnetic wave shielding circuit board and manufacture thereof |
| JP2000323846A (en) * | 1999-05-07 | 2000-11-24 | Shinko Electric Ind Co Ltd | Manufacture of wiring circuit board provided with pseudo coaxial line |
| JP2002111233A (en) * | 2000-10-03 | 2002-04-12 | Victor Co Of Japan Ltd | Printed-wiring board and its manufacturing method |
| JP2003249731A (en) * | 2002-02-25 | 2003-09-05 | National Institute Of Advanced Industrial & Technology | Printed circuit board of coaxial cable structure and method of manufacturing the same |
| JP2008227147A (en) * | 2007-03-13 | 2008-09-25 | National Institute Of Advanced Industrial & Technology | Conduction line path structure, its production method, and wiring substrate |
| JP2010080716A (en) * | 2008-09-26 | 2010-04-08 | Toshiba Hokuto Electronics Corp | Printed circuit board and manufacturing method thereof |
-
2011
- 2011-05-17 JP JP2011110504A patent/JP2012243857A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6116415A (en) * | 1984-06-30 | 1986-01-24 | 株式会社東芝 | Wiring unit |
| JPH04199790A (en) * | 1990-11-29 | 1992-07-20 | Nippon Mektron Ltd | Shield type flexible circuit board and manufacture thereof |
| JPH05160575A (en) * | 1991-12-09 | 1993-06-25 | Fujitsu Ltd | Printed circuit board |
| JPH07297590A (en) * | 1994-04-28 | 1995-11-10 | Oki Electric Ind Co Ltd | Method of forming wiring of coaxial structure |
| JP2000277975A (en) * | 1999-03-25 | 2000-10-06 | Kuraray Co Ltd | Electromagnetic wave shielding circuit board and manufacture thereof |
| JP2000323846A (en) * | 1999-05-07 | 2000-11-24 | Shinko Electric Ind Co Ltd | Manufacture of wiring circuit board provided with pseudo coaxial line |
| JP2002111233A (en) * | 2000-10-03 | 2002-04-12 | Victor Co Of Japan Ltd | Printed-wiring board and its manufacturing method |
| JP2003249731A (en) * | 2002-02-25 | 2003-09-05 | National Institute Of Advanced Industrial & Technology | Printed circuit board of coaxial cable structure and method of manufacturing the same |
| JP2008227147A (en) * | 2007-03-13 | 2008-09-25 | National Institute Of Advanced Industrial & Technology | Conduction line path structure, its production method, and wiring substrate |
| JP2010080716A (en) * | 2008-09-26 | 2010-04-08 | Toshiba Hokuto Electronics Corp | Printed circuit board and manufacturing method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019133974A (en) * | 2018-01-29 | 2019-08-08 | 矢崎総業株式会社 | Circuit body and manufacturing method thereof |
| JP2020161741A (en) * | 2019-03-28 | 2020-10-01 | 大日本印刷株式会社 | Wiring board, and manufacturing method for wiring board |
| JP7326810B2 (en) | 2019-03-28 | 2023-08-16 | 大日本印刷株式会社 | Wiring board and method for manufacturing wiring board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI528871B (en) | Method and structure for coaxial via routing in printed circuit boards for improved signal integrity | |
| TWI643334B (en) | High frequency signal transmission structure and manufacturing method thereof | |
| TWI484875B (en) | Circuit board and method for manufacturing same | |
| CN104837301A (en) | Flexible circuit board possessing shielding structure and manufacturing method of flexible circuit board | |
| KR102447839B1 (en) | Circuit board and electronic device including the same | |
| TW201918125A (en) | Printed circuit board having EMI shielding function and method for manufacturing of the same, and flat cable using the same | |
| US8987608B2 (en) | Circuit structure and manufacturing method thereof | |
| CN107801296A (en) | The printed circuit board (PCB) and terminal device of fringe radiation can be reduced | |
| JP5146267B2 (en) | Manufacturing method of wiring board and printed wiring board | |
| US9210795B2 (en) | Conformal reference planes in substrates | |
| US10687414B2 (en) | Circuit board | |
| JP2013004728A (en) | Wiring circuit board and manufacturing method therefor | |
| JP5638808B2 (en) | Flexible printed circuit board | |
| JP2012243857A (en) | Printed board and manufacturing method of printed board | |
| JP5354589B2 (en) | Shield flexible printed circuit board and manufacturing method thereof | |
| JPH1168313A (en) | Printed wiring board | |
| KR100573494B1 (en) | Method of embedding a coaxial line in printed circuit board | |
| US10292259B2 (en) | Electrical shielding using bar vias and associated methods | |
| JP5787605B2 (en) | Multilayer board | |
| CN101483971B (en) | Circuit board and manufacturing method thereof | |
| CN220711716U (en) | Circuit board and electronic equipment | |
| JP6016376B2 (en) | Wiring board, electronic unit, and method of manufacturing wiring board | |
| JP4496721B2 (en) | High speed signal circuit board and method for improving signal transmission characteristics thereof. | |
| JP2008172015A (en) | Electromagnetic shield tape and electronic apparatus using the same | |
| JP2023144235A (en) | Electronic device and manufacturing method of electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130628 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140214 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140225 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20140708 |