JP7326810B2 - Wiring board and method for manufacturing wiring board - Google Patents

Description

An embodiment of the present disclosure relates to a wiring board including a stretchable base material and wiring, and a manufacturing method thereof.

In recent years, research has been conducted on wiring boards having deformability such as stretchability. For example, it is known to form elastic silver wiring on an elastic base material or to form horseshoe-shaped wiring on an elastic base material (for example, Patent Document 1). Further, Patent Document 2 discloses a method for manufacturing a wiring board having stretchability. The manufacturing method described in Patent Document 2 employs a step of forming a circuit on a pre-stretched base material, and relaxing the base material after forming the circuit.

JP 2013-187308 A Japanese Patent Application Laid-Open No. 2007-281406

Wiring through which electric signals flow is preferably shielded (electromagnetic shield) so as not to be affected by an external electromagnetic field or electrostatic field and to prevent electric noise from leaking to the outside. Such structures include, for example, shielded cables and coaxial cables, in which electromagnetic shielding is provided in the form of a wire mesh surrounding the internal core wires.
However, in order to apply electromagnetic shielding to wiring provided on a stretchable base material, a structure capable of coping with deformation such as expansion and contraction is required.

An object of the embodiments of the present disclosure is to provide a wiring board and a wiring board manufacturing method that can effectively solve such problems.

One embodiment of the present disclosure includes a first surface and a second surface located on the opposite side of the first surface, a stretchable base material, and a support base located on the first surface side of the base material. wiring provided on the upper side of the supporting base material when the direction from the second surface to the first surface in the normal direction of the first surface of the base material is the upper side; A side-side shield wire provided on an upper side of a base material and arranged in parallel with the wiring, an insulating portion covering the wiring, and a covering shield portion covering the insulating portion, wherein the covering shield portion and the side surface The side shield wire is connected at least partially, and the wiring and the side shield wire have peaks and valleys in the normal direction of the first surface of the base material. The wiring substrate has a bellows shape that repeatedly appears along the in-plane direction of one surface.

In the wiring board according to an embodiment of the present disclosure, the wiring and the side shield line may be made of the same material.

In the wiring board according to an embodiment of the present disclosure, the wiring and the side shield wire may have the same thickness.

A wiring board according to an embodiment of the present disclosure includes two wirings forming a pair of the wirings, and a bridge wiring provided on the upper side of the insulating section and connected to each of the two wirings forming the pair. , the insulating portion around the bridge wiring has an insulating portion exposed region exposed from the covering shield portion, and when viewed along the normal direction of the first surface of the base material, the bridge wiring A through hole is provided in the insulating portion in a region in which each of the pair of wires and the pair of wires overlap each other, and each of the pair of two wires and the bridge wire are connected through the through hole. You may have

In the wiring board according to one embodiment of the present disclosure, the bridge wiring has peaks and valleys in the normal direction of the first surface of the base material along the in-plane direction of the first surface of the base material. It may have a repeating bellows shape.

In the wiring board according to an embodiment of the present disclosure, the bridge wiring and the covering shield portion may be made of the same material.

In the wiring board according to an embodiment of the present disclosure, the bridge wiring and the covering shield part may have the same thickness.

In the wiring board according to an embodiment of the present disclosure, the base material has conductivity, the support base material has a through portion, and the base material and the side shield wire are connected through the through portion. may be

A wiring board according to an embodiment of the present disclosure includes a conductive layer positioned between the base material and the support base material, the support base material having a through portion, and the conductive layer and the conductive layer through the through portion. It may be connected to the side shield wire.

In the wiring board according to one embodiment of the present disclosure, the conductive layer has peaks and valleys in the normal direction of the first surface of the base material along the in-plane direction of the first surface of the base material. It may have a repeating bellows shape.

Further, one embodiment of the present disclosure includes a first surface and a second surface located on the opposite side of the first surface, a base material having elasticity, and a base material located on the first surface side of the base material a supporting base material, wiring provided on the upper side of the supporting base material when the direction from the second surface to the first surface in the normal direction of the first surface of the base material is defined as the upper side; an insulating portion covering the wiring; and a covering shield portion covering the insulating portion; and the covering shield portion are connected to each other, and the wiring has peaks and valleys in the normal direction of the first surface of the base material along the in-plane direction of the first surface of the base material. The wiring board has a repetitive bellows shape.

Further, one embodiment of the present disclosure includes a first surface and a second surface located on the opposite side of the first surface, a base material having elasticity, and a base material located on the first surface side of the base material a supporting base material, wiring provided on the upper side of the supporting base material when the direction from the second surface to the first surface in the normal direction of the first surface of the base material is defined as the upper side; An insulating portion covering the wiring, a covering shield portion covering the insulating portion, and a conductive layer positioned between the base material and the supporting base material, wherein the supporting base material has a through portion, The covering shield portion and the conductive layer are connected to each other through the penetrating portion, and the wiring is configured such that the peaks and valleys in the normal direction of the first surface of the base material correspond to the first surface of the base material. The wiring substrate has a bellows shape that repeatedly appears along the in-plane direction of the surface.

In the wiring board according to one embodiment of the present disclosure, the conductive layer has peaks and valleys in the normal direction of the first surface of the base material along the in-plane direction of the first surface of the base material. It may have a repeating bellows shape.

In the wiring board according to one embodiment of the present disclosure, the covering shield part has peaks and valleys in the normal direction of the first surface of the base material along the in-plane direction of the first surface of the base material. It may have a bellows shape that repeats itself.

In the wiring board according to one embodiment of the present disclosure, the supporting base has peaks and valleys in the normal direction of the first surface of the base along the in-plane direction of the first surface of the base. It may have a bellows shape that repeats itself.

In the wiring board according to one embodiment of the present disclosure, the insulating part has peaks and valleys in the normal direction of the first surface of the base material along the in-plane direction of the first surface of the base material. It may have a repeating bellows shape.

Further, an embodiment of the present disclosure is a method for manufacturing a wiring board, wherein the wiring board includes a first surface and a second surface located on the opposite side of the first surface, and has a stretchable base material. and a support substrate located on the first surface side of the substrate, and a direction from the second surface to the first surface in the normal direction of the first surface of the substrate is the upper side , a wiring provided on the upper side of the supporting base material, a side-side shielding wire provided on the upper side of the supporting base material and arranged in parallel with the wiring, an insulating portion covering the wiring, and the insulating portion. a wiring forming step of forming the wiring and the side shield line; an insulating portion forming step of forming the insulating portion; and a covering shield portion forming step of forming the covering shield portion. a base material elongation step of applying a tensile stress to the base material to extend the base material; and a support base material bonding process of bonding the support base material to the first surface side of the base material in the elongated state. and a base material shrinking step of removing the tensile stress from the base material to which the support base material is joined, wherein in the covering shield portion forming step, at least a part of the covering shield portion and the side shield wire are separated from each other. In the base material shrinking step, the wiring and the side shield line are adjusted such that the peaks and valleys in the normal direction of the first surface of the base material are in the direction of the first surface of the base material. This is a method of manufacturing a wiring board in which the form has a bellows shape that repeatedly appears along the in-plane direction.

In the method for manufacturing a wiring board according to an embodiment of the present disclosure, the wiring includes two wirings forming a pair, the wiring board is provided on the insulating section, and the wirings forming the pair are formed on the wiring board. A connecting bridge wiring is provided, in the insulating section forming step, a through hole is provided in the insulating section in a region where the bridge wiring and each of the two wirings forming a pair overlap, and in the covering shield section forming step, While forming the covering shield part and the bridge wiring, the insulating part around the bridge wiring forms an insulating part exposed region where the insulating part is exposed from the covering shield part, and the two wires forming a pair are passed through the through hole. and the bridge wiring may be connected.

In the method for manufacturing a wiring board according to an embodiment of the present disclosure, the base material has conductivity, the support base material has a through portion, and in the wiring forming step, the side shield wire is attached to the through portion. may be formed, and in the step of joining the supporting base material, the base material and a part of the side shield wire formed in the through portion may be connected.

A method for manufacturing a wiring board according to an embodiment of the present disclosure, wherein the wiring board has a conductive layer positioned between the base material and the supporting base material, the supporting base material has a through portion, In the wiring forming step, a part of the side shield wire is formed in the through portion, and between the base elongating step and the support base bonding step, the first surface of the base in a stretched state. A conductive layer forming step of forming the conductive layer on the side may be provided, and in the supporting base bonding step, the conductive layer may be connected to a portion of the side shield line formed in the through portion.

A method for manufacturing a wiring board according to an embodiment of the present disclosure, wherein the wiring board has a conductive layer positioned between the base material and the supporting base material, the supporting base material has a through portion, A conductive layer forming step of forming the conductive layer on the lower surface of the supporting base is provided before the wiring forming step, and in the wiring forming step, a part of the side shield wire is formed in the penetrating portion. A portion of the side shield wire formed in the penetrating portion may be connected to the conductive layer.

A method for manufacturing a wiring board according to an embodiment of the present disclosure, wherein the wiring board has a conductive layer positioned between the base material and the supporting base material, the supporting base material has a through portion, In the wiring forming step, part of the side shield wire is formed in the penetrating portion, and after the wiring forming step and before the supporting base bonding step, the lower surface of the supporting base is formed. a conductive layer forming step of forming the conductive layer on the inner surface of the through portion and connecting a portion of the side shield line formed in the through portion to the conductive layer.

Further, an embodiment of the present disclosure is a method for manufacturing a wiring board, wherein the wiring board includes a first surface and a second surface located on the opposite side of the first surface, and has a stretchable base material. and a support substrate located on the first surface side of the substrate, and a direction from the second surface to the first surface in the normal direction of the first surface of the substrate is the upper side , a wiring provided on the upper side of the supporting base material, an insulating portion covering the wiring, and a covering shield portion covering the insulating portion; a wiring forming step of forming the wiring; a covering shield forming step of forming the covering shield portion; a base elongating step of applying a tensile stress to the base to elongate the base; a supporting base material bonding step of bonding the supporting base material to the first surface side of the material; and a base material shrinking process of removing the tensile stress from the base material to which the supporting base material is bonded, wherein the base material is It has conductivity, the supporting base material has a penetrating part, in the covering shield part forming step, a part of the covering shield part is formed in the penetrating part, and in the supporting base bonding step, the base material The material and a part of the covering shield part formed in the through part are connected, and in the base material shrinking step, the form of the wiring is changed into peaks and valleys in the normal direction of the first surface of the base material. In the wiring board manufacturing method, the portion has a bellows shape that repeatedly appears along the in-plane direction of the first surface of the base material.

Further, an embodiment of the present disclosure is a method for manufacturing a wiring board, wherein the wiring board includes a first surface and a second surface located on the opposite side of the first surface, and has a stretchable base material. and a support substrate located on the first surface side of the substrate, and a direction from the second surface to the first surface in the normal direction of the first surface of the substrate is the upper side , a wiring provided on the supporting substrate, an insulating portion covering the wiring, a covering shield portion covering the insulating portion, and a conductive layer positioned between the substrate and the supporting substrate; A wiring forming step of forming the wiring, an insulating portion forming step of forming the insulating portion, a covering shield portion forming step of forming the covering shield portion, and applying a tensile stress to the base material, A base material elongating step of elongating the base material, a supporting base material bonding process of bonding the supporting base material to the first surface side of the base material in the extended state, and from the base material to which the supporting base material is bonded a substrate shrinking step for removing the tensile stress, wherein the supporting substrate has a penetration portion, and in the covering shield portion forming step, a part of the covering shield portion is formed in the penetration portion; A conductive layer forming step of forming the conductive layer on the first surface side of the base material in the extended state is provided between the material elongating step and the supporting substrate bonding step, and in the supporting substrate bonding step, the The conductive layer is connected to a part of the covering shield portion formed in the through portion, and in the base material shrinking step, the wiring is changed into peaks and peaks in the normal direction of the first surface of the base material. In the method of manufacturing a wiring board, the troughs have a bellows shape that repeatedly appears along the in-plane direction of the first surface of the base material.

Further, an embodiment of the present disclosure is a method for manufacturing a wiring board, wherein the wiring board includes a first surface and a second surface located on the opposite side of the first surface, and has a stretchable base material. and a support substrate located on the first surface side of the substrate, and a direction from the second surface to the first surface in the normal direction of the first surface of the substrate is the upper side , a wiring provided on the supporting substrate, an insulating portion covering the wiring, a covering shield portion covering the insulating portion, and a conductive layer positioned between the substrate and the supporting substrate; A wiring forming step of forming the wiring, an insulating portion forming step of forming the insulating portion, a covering shield portion forming step of forming the covering shield portion, and applying a tensile stress to the base material, A base material elongating step of elongating the base material, a supporting base material bonding process of bonding the supporting base material to the first surface side of the base material in the extended state, and from the base material to which the supporting base material is bonded a substrate shrinking step to remove the tensile stress, wherein the supporting substrate has a through portion, and the conductive layer is formed on the lower surface of the supporting substrate before the covering shield portion forming step. a conductive layer forming step, wherein in the covering shield portion forming step, a part of the covering shield portion is formed in the penetrating portion, and the part of the covering shield portion formed in the penetrating portion and the conductive layer are connected to each other; and, in the base material shrinking step, the shape of the wiring is such that peaks and valleys in the normal direction of the first surface of the base material are repeated along the in-plane direction of the first surface of the base material. It is a method of manufacturing a wiring board in which the form has a bellows shape that appears.

Further, an embodiment of the present disclosure is a method for manufacturing a wiring board, wherein the wiring board includes a first surface and a second surface located on the opposite side of the first surface, and has a stretchable base material. and a support substrate located on the first surface side of the substrate, and a direction from the second surface to the first surface in the normal direction of the first surface of the substrate is the upper side , a wiring provided on the supporting substrate, an insulating portion covering the wiring, a covering shield portion covering the insulating portion, and a conductive layer positioned between the substrate and the supporting substrate; A wiring forming step of forming the wiring, an insulating portion forming step of forming the insulating portion, a covering shield portion forming step of forming the covering shield portion, and applying a tensile stress to the base material, A base material elongating step of elongating the base material, a supporting base material bonding process of bonding the supporting base material to the first surface side of the base material in the extended state, and from the base material to which the supporting base material is bonded a substrate shrinking step for removing the tensile stress, wherein the supporting substrate has a penetration portion, and in the covering shield portion forming step, a part of the covering shield portion is formed in the penetration portion, and the covering shield portion is formed in the penetration portion; After the step of forming the shield portion and before the step of bonding the supporting base material, the conductive layer is formed on the lower surface of the supporting base material so as to form part of the covering shield part formed in the through portion. A conductive layer forming step for connecting the conductive layer to the conductive layer is provided, and in the base material shrinking step, the form of the wiring is such that the peaks and valleys in the normal direction of the first surface of the base material are formed on the base material. In the method of manufacturing a wiring board, the form has a bellows shape that repeatedly appears along the in-plane direction of the first surface.

According to the embodiments of the present disclosure, it is possible to provide a wiring substrate capable of applying electromagnetic shielding to wiring provided on a stretchable base material.

1 is a diagram showing an example of a wiring board according to a first embodiment of the present disclosure, (a) is a plan view, (b) is a cross-sectional view along line AA of (a), and (c) is B of (a). -B line sectional view FIG. 2 is a view showing an example of a layered structure on the upper side of the supporting base material of the wiring board shown in FIG. 1; 1. Diagrams showing an example of a method for manufacturing the wiring board shown in FIG. A diagram showing an example of a wiring board according to a second embodiment of the present disclosure A diagram showing an example of a wiring board according to a third embodiment of the present disclosure A diagram showing an example of a wiring board according to a fourth embodiment of the present disclosure A diagram showing an example of a wiring board according to a fifth embodiment of the present disclosure A diagram showing an example of a wiring board according to a sixth embodiment of the present disclosure

Hereinafter, a configuration of a wiring board and a method for manufacturing the same according to embodiments of the present disclosure will be described in detail with reference to the drawings.

<First embodiment>
First, a first embodiment of the present disclosure will be described with reference to FIGS. 1 to 3. FIG.
Here, FIG. 1 is a diagram showing an example of a wiring board according to the first embodiment of the present disclosure, (a) is a plan view, (b) is a cross-sectional view along line AA of (a), (c ) is a cross-sectional view taken along line BB of (a).
2A and 2B are diagrams showing an example of a laminated structure on the upper side of the supporting base material of the wiring board shown in FIG. 1, and FIGS. 3A and 3B are diagrams showing an example of a method of manufacturing the wiring board shown in FIG.

As shown in FIG. 1, the wiring board 10 includes at least a base material 20, a support base material 30, wirings 40, side shield wires 50a and 50b, an insulating portion 60, and a covering shield portion 70. there is
The stretchable substrate 20 includes a first surface 20a and a second surface 20b located opposite the first surface 20a, and the support substrate 30 is located on the first surface 20a side of the substrate 20. there is
When the direction from the second surface 20b toward the first surface 20a in the normal direction of the first surface 20a of the base material 20 (the Z direction in the drawing) is defined as the upper side, the upper side of the supporting base material 30 has: Wiring 40 and side shield wires 50a and 50b are provided.

From here on, in order to facilitate understanding, FIG. 2 will be used in addition to FIG. 1 for explanation. FIG. 2 is a diagram showing an example of the laminated structure above the supporting base material 30 of the wiring board 10 shown in FIG. 1. In the wiring board 10 shown in FIG. The laminated structure will be explained.

Here, FIG. 2(a) is a plan view showing the arrangement relationship between the wiring 40 provided on the upper side of the supporting base material 30 and the side shield wires 50a and 50b. FIG. 2B is a plan view showing the arrangement relationship between the insulating portion 60 provided above the wiring 40 and the wiring 40 and the side shield wires 50a and 50b. FIG. 2(c) is a plan view showing the arrangement of the covering shield part 70 provided on the upper side of the insulating part 60. As shown in FIG.

2(a), 2(b), and 2(c), the wiring 40, the side shield wires 50a and 50b, the insulating portion 60, and the covering shield portion. 70 is formed.

As shown in FIGS. 1(b) and 2(a), the side shield lines 50a and 50b are arranged in parallel with the wiring 40. As shown in FIG. In the examples shown in FIGS. 1B and 2A, the side shield lines 50a and 50b are arranged in parallel with the wiring 40 with the wiring 40 interposed therebetween. The side shield wires 50 a and 50 b mainly serve as electromagnetic shields in the side direction of the wiring 40 . As will be described later, the side shield wires 50a and 50b also act as ground wires for electrical grounding in the wiring board 10. As shown in FIG.

Here, in the present embodiment, the wiring 40 and the side shield wires 50a and 50b can be made of the same material. In this case, the wiring 40 and the side shield wires 50a and 50b can be formed in the same manufacturing process, which is effective in shortening the manufacturing process and reducing the cost. In this case, the wiring 40 and the side shield lines 50a and 50b usually have the same thickness.
In this embodiment, the wiring 40 and the side shield wires 50a and 50b may be made of different materials.

Moreover, as shown in FIGS. 1(b) and 2(b), the insulating portion 60 is formed so as to cover the wiring 40. As shown in FIG. At least a portion of the side shield wires 50 a and 50 b is exposed from the insulating portion 60 .

In the examples shown in FIGS. 1(b) and 2(b), for the sake of convenience, the insulating portion 60 is in contact with the side surfaces of the side shield wires 50a and 50b on the wiring 40 side. However, the present embodiment is not limited to this. For example, the insulating portion 60 may also be formed above the side shield wires 50a and 50b. In addition, it is preferable that the space between the wiring 40 and the side shield wires 50a and 50b is filled with the insulating portion 60 without providing a gap. Therefore, in actual manufacturing, the insulating portion 60 is normally formed also on the upper sides of the side shield wires 50a and 50b. The main reason is that the alignment accuracy when arranging the insulating portion 60 is relaxed.
However, the side-side shield wires 50 a and 50 b are configured such that at least a portion thereof is exposed from the insulating portion 60 . This is for electrically connecting the covering shield portion 70 to be provided next and the side shield wires 50a and 50b.

Moreover, as shown in FIGS. 1B and 2C, a covering shield portion 70 is formed so as to cover the insulating portion 60 . The covering shield part 70 mainly serves as an electromagnetic shield above the wiring 40 .

In the examples shown in FIGS. 1(b) and 2(c), the covering shield part 70 is also formed on the upper surface of the side shield wires 50a and 50b, and the covering shield part 70 and the side shield wires are separated from each other. 50a and 50b are electrically connected.
In the examples shown in FIGS. 1(b) and 2(c), the covering shield portion 70 continuously extends from the upper surface of the side shield wires 50a and 50b in the extending direction of the side shield wires 50a and 50b. However, the present embodiment is not limited to this. At least a portion of the covering shield portion 70 and the side shield wires 50a and 50b may be connected.

Since the wiring board 10 has the laminated structure as described above, the wiring 40 can be electromagnetically shielded.

Here, the wiring 40 is provided on the base material 20 having elasticity, and can cope with deformation such as expansion and contraction.
For example, in a state where the base material 20 is contracted, as shown in FIG. It has a bellows shape that repeatedly appears along the in-plane direction of the first surface 20 a of the material 20 .

Note that in the example shown in FIG. It has a bellows shape in which peaks M and valleys V in the linear direction appear repeatedly along the in-plane direction of the first surface 20a of the base material 20 .

That is, all of the supporting base material 30, the wiring 40, the insulating part 60, and the covering shield part 70 shown in FIG. has a bellows shape that repeatedly appears along the in-plane direction of the first surface 20 a of the base material 20 .

Incidentally, although not shown in FIG. Similarly, peaks M and valleys V in the normal direction of the first surface 20a of the substrate 20 have a bellows shape that repeatedly appears along the in-plane direction of the first surface 20a of the substrate 20. FIG.

Since the wiring 40 has the bellows shape as described above, in the wiring board 10, even if the base material 20 expands and contracts, the wiring 40 can be prevented from breaking or the like.
In addition, as described above, the side shield wires 50a and 50b also have a bellows shape like the wiring 40. Therefore, in the wiring board 10, even if the base material 20 expands and contracts, the side shield wires 50a and 50b do not move. It is possible to avoid disconnection or the like. As described above, at least a portion of the covering shield portion 70 and the side shield wires 50a and 50b are connected to each other.
Therefore, by electrically grounding the side shield wires 50a and 50b, it is possible to provide the wiring board 10 in which the wiring 40 provided on the elastic base material 20 is electromagnetically shielded.

Each component of the wiring board 10 will be described in detail below.
[Base material]
The base material 20 is a member configured to have elasticity. The substrate 20 includes a first surface 20a located on the side of the supporting substrate 30 and a second surface 20b located on the opposite side of the first surface 20a. In the following description, viewing the wiring board 10 or components of the wiring board 10 along the normal direction of the first surface 20a as shown in FIG.

The thickness of the base material 20 is, for example, 10 μm or more and 10 mm or less, more preferably 20 μm or more and 3 mm or less. By setting the thickness of the base material 20 to 10 μm or more, the durability of the base material 20 can be ensured. Also, by setting the thickness of the base material 20 to 10 mm or less, the wearing comfort of the wiring board 10 can be ensured. Note that if the thickness of the base material 20 is too small, the stretchability of the base material 20 may be impaired.

The stretchability of the base material 20 refers to the ability of the base material 20 to expand and contract, that is, the ability to extend from the normal non-stretched state, and the ability to restore when released from the stretched state. It refers to the nature of being able to The non-stretched state is the state of substrate 20 when no tensile stress is applied. In this embodiment, the stretchable substrate can preferably be stretched by 1% or more from an unstretched state without breaking, more preferably by 20% or more, and even more preferably by 75%. It can be extended more than By using the base material 20 having such ability, the wiring board 10 can have elasticity as a whole. Furthermore, the wiring board 10 can be used in products and applications that require high expansion and contraction, such as attachment to a part of the body such as a human arm.

An example of a parameter representing the stretchability of the base material 20 is the elastic modulus of the base material 20 . The elastic modulus of the base material 20 is, for example, 10 MPa or less, more preferably 1 MPa or less. By using the base material 20 having such an elastic modulus, the wiring board 10 as a whole can be made stretchable.

As a method of calculating the elastic modulus of the base material 20, a method of performing a tensile test in accordance with JIS K6251 using a sample of the base material 20 can be adopted. A method of measuring the elastic modulus of a sample of the base material 20 by a nanoindentation method in compliance with ISO14577 can also be adopted. A nanoindenter can be used as a measuring instrument used in the nanoindentation method. As a method of preparing a sample of the base material 20, a method of taking out a part of the base material 20 from the wiring board 10 as a sample and a method of taking out a part of the base material 20 before forming the wiring board 10 as a sample are considered. be done. In addition, as a method of calculating the elastic modulus of the base material 20, adopting a method of analyzing the materials constituting the base material 20 and calculating the elastic modulus of the base material 20 based on an existing material database. can also In addition, the elastic modulus in this application is an elastic modulus in a 25 degreeC environment.

Examples of materials that constitute the base material 20 include elastomers. Also, as the material of the base material 20, for example, cloth such as woven fabric, knitted fabric, and non-woven fabric can be used. As the elastomer, general thermoplastic elastomers and thermosetting elastomers can be used. Specifically, polyurethane-based elastomers, styrene-based elastomers, nitrile-based elastomers, olefin-based elastomers, vinyl chloride-based elastomers, ester-based elastomers, Amide elastomers, 1,2-BR elastomers, fluorine elastomers, silicone rubbers, urethane rubbers, fluorine rubbers, polybutadiene, polyisobutylene, polystyrene butadiene, polychloroprene and the like can be used. Considering mechanical strength and abrasion resistance, it is preferable to use a urethane-based elastomer. Base material 20 may also contain silicone such as polydimethylsiloxane. Silicone is excellent in heat resistance, chemical resistance, and flame resistance, and is preferable as a material for the base material 20 .

[Support base material]
The support base material 30 is a plate-like member configured to have lower stretchability than the base material 20 .
In the example shown in FIG. 1, when the direction from the second surface 20b to the first surface 20a in the normal direction of the first surface 20a of the base material 20 is the upper side, the supporting base material 30 has the wiring 40 on the upper side. support. In addition, the support base material 30 is joined to the first surface 20a side of the base material 20 at its lower side.

Although not shown, for example, an adhesive layer containing an adhesive may be provided between the base material 20 and the support base material 30 . As a material for forming the adhesive layer, for example, an acrylic adhesive, a silicone adhesive, or the like can be used. The thickness of the adhesive layer is, for example, 5 μm or more and 200 μm or less. Although not shown, the lower surface of the support substrate 30 may be joined to the first surface 20a of the substrate 20 by molecularly modifying the non-adhesive surface and bonding with molecules. In this case, an adhesive layer may not be provided between the substrate 20 and the supporting substrate 30 .

The supporting base material 30 has an elastic modulus greater than that of the base material 20 . For example, it is 100 MPa or more, more preferably 1 GPa or more. Further, the elastic modulus of the support base material 30 may be 100 times or more and 50000 times or less, preferably 1000 times or more and 10000 times or less, that of the base material 20 .
If the modulus of elasticity of the supporting base material 30 is too low, the supporting base material 30 is likely to be deformed during the process of forming the wirings 40 and the like. becomes difficult. Further, if the elastic modulus of the supporting base material 30 is too high, it becomes difficult to restore the base material 20 when relaxed, and the base material 20 is likely to crack or break.

Moreover, the thickness of the support base material 30 is, for example, 500 nm or more and 10 μm or less, and more preferably 1 μm or more and 5 μm or less. If the thickness of the supporting base material 30 is too small, it becomes difficult to handle the supporting base material 30 in the process of manufacturing the supporting base material 30 and the process of forming members on the supporting base material 30 . If the thickness of the support base material 30 is too large, it becomes difficult to restore the base material 20 when relaxed, and the target expansion and contraction of the base material 20 cannot be obtained.

As a material for forming the support base material 30, for example, polyethylene terephthalate, polyethylene naphthalate, polyimide, polycarbonate, acrylic resin, or the like can be used.

[wiring]
The wiring 40 is a member having conductivity and having an elongated shape in plan view.
A material that can follow the expansion and contraction of the base material 20 is used as the material of the wiring 40 . The material of the wiring 40 itself may or may not have elasticity.

Examples of materials that can be used for the wiring 40 and that do not have elasticity per se include metals such as gold, silver, copper, aluminum, platinum, and chromium, and alloys containing these metals. A metal film can be used as the wiring 40 when the material of the wiring 40 itself does not have elasticity.

When the material itself used for the wiring 40 has elasticity, the elasticity of the material is the same as that of the base material 20, for example. A material having stretchability itself that can be used for the wiring 40 includes, for example, a conductive composition containing conductive particles and an elastomer.
The conductive particles may be those that can be used for wiring, and examples thereof include particles of gold, silver, copper, nickel, palladium, platinum, carbon, and the like. Among them, silver particles are preferably used.

Preferably, the wiring 40 comprises a structure that is resistant to deformation. For example, line 40 has a base material and a plurality of conductive particles dispersed within the base material. In this case, by using a deformable material such as resin as the base material, the wiring 40 can also be deformed according to the expansion and contraction of the base material 20 . In addition, the conductivity of the wiring 40 can be maintained by setting the distribution and shape of the conductive particles so that the contact between the plurality of conductive particles is maintained even when deformation occurs. .

General thermoplastic elastomers and thermosetting elastomers can be used as the material constituting the base material of the wiring 40. For example, styrene elastomers, acrylic elastomers, olefin elastomers, urethane elastomers, silicone rubbers, Urethane rubber, fluororubber, nitrile rubber, polybutadiene, polychloroprene, and the like can be used. Among them, resins and rubbers containing urethane-based or silicone-based structures are preferably used in terms of stretchability and durability.

The thickness of the wiring 40 may be any thickness that can withstand expansion and contraction of the base material 20, and is appropriately selected according to the material of the wiring 40 and the like.
For example, when the material of the wiring 40 does not have stretchability, the thickness of the wiring 40 can be in the range of 25 nm or more and 100 μm or less, preferably 50 nm or more and 50 μm or less, and 100 nm or more and 5 μm. It is more preferable to be within the following range.
In addition, when the material of the wiring 40 has elasticity, the thickness of the wiring 40 can be in the range of 5 μm or more and 60 μm or less, preferably in the range of 10 μm or more and 50 μm or less, and 20 μm or more and 40 μm or less. It is more preferable to be within the range.

The width of the wiring 40 is appropriately selected according to the resistance value required for the wiring 40 . In this embodiment, the width of the wiring 40 is, for example, 1 μm or more, preferably 50 μm or more. Also, the width of the wiring 40 is, for example, 10 mm or less, preferably 1 mm or less.

A method for forming the wiring 40 is appropriately selected according to the material and the like. For example, there is a method of forming a metal film on the support base material 30 by vapor deposition, sputtering, or the like, and then patterning the metal film by photolithography. Further, when the material of the wiring 40 itself has stretchability, for example, a method of printing the conductive composition containing the above-described conductive particles and elastomer on the support substrate 30 in a pattern by a general printing method. is mentioned. Alternatively, a plating method may be used.

[Side shield wire]
The side-side shield wires 50 a and 50 b are conductive, are provided above the support base 30 and are arranged in parallel with the wiring 40 in the example shown in FIG. 1 .

As a material for the side shield wires 50a and 50b, a material that can follow the expansion and contraction of the base material 20 is used, like the wiring 40 described above. In this embodiment, the wiring 40 and the side shield wires 50a and 50b are preferably made of the same material. In this case, the wiring 40 and the side shield wires 50a and 50b can be formed in the same manufacturing process, which is effective in shortening the manufacturing process and reducing the cost. In this case, the wiring 40 and the side shield lines 50a and 50b usually have the same thickness.

In this embodiment, the wiring 40 and the side shield wires 50a and 50b may be made of different materials. Since the wiring 40 transmits an electric signal, it is required to have reliability and the like. Any material may be used.

In the example shown in FIG. 1, the side shield wires 50a and 50b may have a width that acts as an electromagnetic shield on the side of the wiring 40, and is, for example, 1 μm or more, preferably 50 μm or more. The width of the side shield wires 50a and 50b is, for example, 10 mm or less, preferably 1 mm or less.

A method for forming the side shield wires 50a and 50b is appropriately selected according to the material and the like. For example, there is a method of forming a metal film on the support base material 30 by vapor deposition, sputtering, or the like, and then patterning the metal film by photolithography. In addition, when the material of the side shield lines 50a and 50b itself has elasticity, for example, a conductive composition containing the above-described conductive particles and an elastomer is patterned on the supporting substrate 30 by a general printing method. a method of printing in a shape. Alternatively, a plating method may be used.

[Insulator]
The insulating portion 60 mainly serves to electrically insulate the wiring 40 and the covering shield portion 70 .
In addition, in the present embodiment, the insulating portion 60 also has the function of preventing disconnection or the like from occurring in the wiring 40 that deforms with the expansion and contraction of the base material 20 , that is, the function of reinforcing the mechanical strength of the wiring 40 .
The insulating portion 60 is positioned so as to overlap at least the wiring 40 in plan view. Note that “overlapping” means that two components overlap when viewed along the normal direction of the first surface 20 a of the base material 20 .

The insulating part 60 may have an elastic modulus greater than that of the base material 20 . The elastic modulus of the insulating portion 60 is, for example, 10 GPa or more and 500 GPa or less, more preferably 1 GPa or more and 300 GPa or less.
If the elastic modulus of the insulating portion 60 is too low, it may not be possible to prevent disconnection or the like from occurring in the wiring 40 that deforms as the base material 20 expands and contracts. Further, if the elastic modulus of the insulating portion 60 is too high, the insulating portion 60 may suffer structural damage such as cracks and cracks when the base material 20 expands and contracts.
The elastic modulus of the insulating part 60 may be 1.1 times or more and 5000 times or less, more preferably 10 times or more and 3000 times or less, that of the base material 20 .

A method for calculating the elastic modulus of the insulating portion 60 is appropriately determined according to the form of the insulating portion 60 . For example, the method for calculating the elastic modulus of the insulating portion 60 may be the same as or different from the method for calculating the elastic modulus of the base material 20 described above. For example, as a method of calculating the elastic modulus of the insulating portion 60, a method of performing a tensile test in accordance with ASTM D882 using a sample of the insulating portion 60 can be adopted.

The characteristics of the insulating portion 60 may be represented by bending stiffness instead of the elastic modulus. The geometrical moment of inertia of the insulating part 60 is calculated based on a cross section of the insulating part 60 cut along a plane orthogonal to the direction of expansion and contraction of the wiring board 10 . The bending rigidity of the insulating portion 60 may be 1.1 times or more, more preferably 2 times or more, and still more preferably 10 times or more that of the base material 20 .

As a material for forming the insulating portion 60, a general thermoplastic elastomer, an acrylic, urethane, epoxy, polyester, epoxy, vinyl ether, polyene/thiol, or silicone oligomer or polymer is used. may
The thickness of the insulating portion 60 is, for example, 1 μm or more and 3 mm or less, and more preferably 10 μm or more and 500 μm or less.

A method for forming the insulating portion 60 is appropriately selected according to the material and the like. For example, after forming the wiring 40 on the support base material 30, the method of printing the material which comprises the insulating part 60 on the wiring 40 by the printing method is mentioned.

[Coating shield part]
The covering shield part 70 mainly serves as an electromagnetic shield above the wiring 40 .
The covering shield part 70 has conductivity, and is formed so as to cover the insulating part 60 in the example shown in FIG. In the example shown in FIG. 1, the covering shield part 70 is also formed on the upper surface of the side shield wires 50a and 50b, and the covering shield part 70 and the side shield wires 50a and 50b are electrically connected to each other. connected to.

A material that can follow the expansion and contraction of the base material 20 is used as the material of the covering shield part 70, like the wiring 40 described above.
Here, when the covering shield portion 70 and the side shield wires 50a and 50b are made of the same metal material, for example, as shown in FIGS. The upper surface of 50b is covered with the covering shield part 70. As shown in FIG. This is because the side-side shield wires 50a and 50b are also etched when the covering shield portion 70 is formed into a desired shape by etching.

In the present embodiment, covering shield portion 70 and side shield wires 50a and 50b may be made of different materials.
For example, the wiring 40 is required to be reliable because it transmits electrical signals. Since it is effective for cost reduction, the wiring 40 and the side shield wires 50a and 50b are often made of the same material.
On the other hand, since the covering shield part 70 is formed in a process different from that of the wiring 40 , it does not need to be made of the same material as the wiring 40 . In addition, the covering shield part 70 may act as an electromagnetic shield above the wiring 40, and may be made of a material that is cheaper than the wiring 40, for example.

The thickness of the covering shield part 70 acts as an electromagnetic shield on the upper side of the wiring 40, and may be any thickness that can withstand expansion and contraction of the base material 20. selected.
For example, when the material of the covering shield part 70 does not have stretchability, the thickness of the covering shield part 70 can be in the range of 25 nm or more and 100 μm or less, preferably in the range of 50 nm or more and 50 μm or less. , 100 nm or more and 5 μm or less.
In addition, when the material of the covering shield part 70 has elasticity, the thickness of the covering shield part 70 can be in the range of 5 μm to 60 μm, preferably in the range of 10 μm to 50 μm, and 20 μm. More preferably, the thickness is in the range of 40 μm or more.

A method for forming the covering shield portion 70 is appropriately selected according to the material and the like. For example, there is a method of forming a metal film by a vapor deposition method, a sputtering method, or the like, and then patterning the metal film by a photolithography method. Further, when the material of the covering shield part 70 itself has stretchability, for example, a method of printing the conductive composition containing the above-described conductive particles and elastomer in a pattern by a general printing method can be used. Alternatively, a plating method may be used.

(Manufacturing method of wiring board 10)
A method of manufacturing the wiring board 10 will be described below with reference to FIGS. 1, 2, and 3(a) to (d).

First, as shown in FIG. 2A, the supporting base material 30 is prepared, and a wiring forming step is performed to form the wiring 40 and the side shield lines 50a and 50b on the upper side of the supporting base material 30. As shown in FIG.
Next, as shown in FIG. 2B, an insulating portion forming step is performed to form an insulating portion 60 that covers the wiring 40. After that, as shown in FIG. A covering shield portion forming step for forming the portion 70 is performed.
In this way, as shown in FIG. 3(a), a laminated structure on the upper side of the supporting substrate 30 is obtained.

Subsequently, as shown in FIG. 3B, a substrate elongation step is performed in which a tensile stress T is applied to the separately prepared substrate 20 to extend the substrate 20 . The elongation rate of the base material 20 is, for example, 10% or more and 200% or less. The substrate elongation step may be performed while the substrate 20 is heated, or may be performed at room temperature. When heating the base material 20, the temperature of the base material 20 is 50 to 100 degreeC, for example.

Subsequently, as shown in FIG. 3(c), a supporting base material 30 provided with the laminated structure shown in FIG. A support substrate bonding step for bonding is performed. At this time, an adhesive layer may be provided between the substrate 20 and the supporting substrate 30 .

After that, a substrate contraction step is performed to remove the tensile stress T from the substrate 20 . As a result, as shown in FIG. 3(d), the base material 20 shrinks in the direction indicated by arrow C (the direction opposite to the tensile direction of the tensile stress T applied to the base material 20 in FIG. 3(b)). do.
With this shrinkage of the base material 20, each component constituting the supporting base material 30 and the laminated structure on the upper side of the supporting base material 30 is The peaks M and valleys V form a bellows shape that repeatedly appears along the in-plane direction of the first surface 20 a of the base material 20 .
The wiring substrate 10 can be obtained through the steps described above.

<Second embodiment>
Next, a second embodiment of the present disclosure will be described.
The wiring board of the second embodiment of the present disclosure has, for example, the wiring board of the above-described first embodiment, in which the wirings intersect and one wiring straddles the upper side of the other wiring. It is the form of the case.

That is, the wiring board of the second embodiment of the present disclosure includes two wirings 40 a and 40 b that form a pair of the wirings 40 in the wiring board of the first embodiment described above, and is provided above the insulating section 60 . and a bridge wiring 80 connecting the pair of wirings 40a and 40b. Through-holes 62a and 62b are formed in the insulating portion 60 in regions where each of the two wirings 40a and 40b forming a pair and the bridge wiring 80 overlap when viewed along the normal direction of the first surface 20a of the material 20. are provided, and each of the pair of two wirings 40a and 40b and the bridge wiring 80 are connected through the through holes 62a and 62b.

FIG. 4 is a diagram showing an example of a wiring board according to a second embodiment of the present disclosure, and is a plan view mainly showing a configuration of a portion where wirings intersect.
Here, FIG. 4 also explains the laminated structure hidden by the covering shield part 70 (70a, 70b, 70c, 70d), like FIG. 2 in the first embodiment.
That is, FIG. 4(a) is a plan view showing the arrangement relationship between the wirings 40 (40a, 40b), 41 provided on the upper side of the supporting base material and the side shield lines 51, 52, 53, 54. FIG.
FIG. 4B shows the insulating portion 60 provided on the upper side of the wirings 40 (40a, 40b), 41, the wirings 40 (40a, 40b), 41, and the side shield wires 51, 52, 53, 54. It is a plan view showing the arrangement relationship with.
4(c) is a plan view showing the arrangement relationship among the covering shield portions 70 (70a, 70b, 70c, 70d) provided on the upper side of the insulating portion 60, the bridge wiring 80, and the insulating portion exposed region 63. FIG. .

In addition, also in the wiring board of the second embodiment of the present disclosure, in the same manner as the wiring board of the first embodiment, the order of FIGS. , wires 40 (40a, 40b), 41, side shield wires 51, 52, 53, 54, an insulating portion 60, a covering shield portion 70 (70a, 70b, 70c, 70d), and a bridge wire 80 are formed.

First, as shown in FIG. 4A, in the present embodiment, the wiring 40 includes two wirings 40a and 40b forming a pair.
Since the wiring 40 intersects with the wiring 41, it is separated into two wirings 40a and 40b forming a pair, and each end of the two wirings 40a and 40b is connected by a bridge wiring 80 which will be described later.
Side shield lines 51, 52, 53, and 54 are arranged on both sides of the wiring 40 and the wiring 41, respectively.

Next, as shown in FIG. 4B, the insulating portion 60 is formed so as to cover the wirings 40 (40a, 40b) and the wirings 41. Next, as shown in FIG. At least portions of the side shield wires 51 , 52 , 53 , 54 are exposed from the insulating portion 60 .

Here, in the present embodiment, the insulating portion 60 is provided with through holes 62a and 62b. Through the through holes 62a and 62b, each of the paired two wirings 40a and 40b is connected to the bridge wiring 80.

Moreover, as shown in FIG. 4C, the covering shield part 70 is formed so as to cover the insulating part 60 . A bridge wiring 80 is formed to connect to each of the two wirings 40a and 40b through the through holes 62a and 62b.
Here, in the present embodiment, the insulating portion 60 around the bridge wiring 80 is an insulating portion exposed region 63 exposed from the covering shield portion 70 . With such a configuration, the bridge wiring 80 and the covering shield portion 70 are insulated from each other.

Here, in the present embodiment, the bridge wiring 80 and the covering shield portion 70 can be made of the same material. In this case, the bridge wiring 80 and the covering shield portion 70 can be formed in the same manufacturing process, which is effective in shortening the manufacturing process and reducing the cost.
In this case, the bridge wiring 80 and the covering shield part 70 usually have the same thickness.

In this embodiment, the bridge wiring 80 and the covering shield portion 70 may be made of different materials.

Further, in the wiring board 11 of the present embodiment, as in the wiring board 10 of the first embodiment, each component constituting the supporting base material 30 and the laminated structure on the upper side of the supporting base material 30 However, both have a bellows shape in which peaks M and valleys V in the normal direction of the first surface 20a of the base material 20 repeatedly appear along the in-plane direction of the first surface 20a of the base material 20 ( See FIG. 1(c)).

That is, the support base material 30, the wirings 40 (40a, 40b), 41, the side-side shielded wires 51, 52, 53, 54, the insulating part 60, the covering shield part 70 (70a, 70b, 70c, 70d), and the bridge wiring 80 , each has a bellows shape in which peaks M and valleys V in the normal direction of the first surface 20a of the base material 20 repeatedly appear along the in-plane direction of the first surface 20a of the base material 20. ing.

In this embodiment, in the wiring board manufacturing method illustrated in FIG. A support base material 30 in which each of the above components is laminated is joined to the base material 20 .
Therefore, when the tensile stress T is removed and the base material 20 is contracted, the wires 40 (40a, 40b) and the wires 41 have a bellows shape in which the peaks M and valleys V of each wire It becomes a bellows shape that appears repeatedly along the direction in which the .
The same applies to the side shield wires 51, 52, 53, 54, the insulating portion 60, the covering shield portion 70 (70a, 70b, 70c, 70d) and the bridge wiring 80.

With the configuration as described above, even in the present embodiment, even if the base material 20 expands and contracts, the wirings 40 and 41 and the side shield lines 51, 52, 53, and 54 can be prevented from breaking. As described above, the covering shield part 70 and the side shield wires 51, 52, 53, 54 are at least partially connected.
Therefore, by electrically grounding the side shield wires 51 , 52 , 53 , 54 , the wirings 40 , 41 can be electromagnetically shielded.
In other words, according to the present embodiment, it is possible to provide a wiring board capable of providing electromagnetic shielding to the wiring provided on the stretchable base material even in a form in which the wiring crosses.

(Manufacturing method of wiring board 11)
As the method for manufacturing the wiring substrate 11 shown in FIG. ), wirings 40, 41 including two wirings (40a, 40b) that form a pair and side-side shielding wires 51, 52, 53, 54 are formed. 60 is formed, and through holes 62a and 62b are provided in the insulating portion 60 as shown in FIG. 4(b).

Then, in the subsequent step of forming the covering shield portion, as shown in FIG. 60 forms an insulating portion exposed region 63 exposed from the covering shield portion 70 (70a, 70b, 70c, 70d), and forms a part of the bridge wiring 80 in the through holes 62a, 62b to form a pair of 2 Each of the main wirings (40a, 40b) and the bridge wiring 80 are connected.

After that, in the same manner as in the method of manufacturing the wiring board 10 of the first embodiment illustrated in FIG. can be obtained.

In manufacturing the wiring board 11, in the manufacturing method of the wiring board illustrated in FIG. A support base material 30 having the components described above laminated is joined to the material 20 .

<Third Embodiment>
Next, a third embodiment of the present disclosure will be described.
In the wiring board of the third embodiment of the present disclosure, the base material has conductivity and acts as an electromagnetic shield below the wiring.

That is, the wiring board of the third embodiment of the present disclosure is the wiring board of the first embodiment or the second embodiment, in which the base material has conductivity and the supporting base material has a penetrating portion. However, the substrate and the shield wire on the side face are connected through the penetrating portion.

FIG. 5 is a diagram showing an example of a wiring board according to the third embodiment of the present disclosure, and like FIG. It is a cross-sectional view showing the.

In the wiring board 12 shown in FIG. 5, the support base material 31 has through portions 31a and 31b, and the base material 21 and the side shield wires 55a and 55b are connected through the through portions 31a and 31b. there is
Here, the substrate 21 and the side shield wires 55a and 55b may be connected at least partially. Therefore, the penetrating portions 31a and 31b do not have to be formed continuously in the extending direction of the side shield wires 55a and 55b with the same length as the side shield wires 55a and 55b, and are partially provided. may For example, the through portions 31a and 31b may be provided at regular intervals in the extending direction of the side shield wires 55a and 55b.

And the base material 21 has electroconductivity. For example, the base material 21 contains conductive particles in the material constituting the base material 20 of the first embodiment. Examples of conductive particles include particles of gold, silver, copper, nickel, palladium, platinum, carbon, and the like.

Due to the configuration as described above, in the wiring board 12 , the base material 21 acts as an electromagnetic shield below the wiring 40 .
That is, in the wiring board 12, in addition to the effects of the wiring board 10 of the first embodiment, electromagnetic shielding can also be applied to the lower side of the wiring.

More specifically, since the wiring board 12 shown in FIG. , can be electromagnetically shielded in all directions underneath.

Also in the wiring substrate 12 shown in FIG. 5, as in the wiring substrate 10 of the first embodiment, even if the base material 21 expands and contracts, the wiring 40 and the side shield wires 55a and 55b are broken. can be avoided. Further, the base material 21 acting as an electromagnetic shield on the lower side of the wiring 40 has stretchability, so it is less likely to be damaged by its own expansion and contraction. As described above, the covering shield portion 70 and the side shield wires 55a and 55b are at least partially connected, and the side shield wires 55a and 55b and the base material 21 are connected through the penetrating portions 31a and 31b. Connected.

Therefore, by electrically grounding either the side shield wires 55a and 55b or the base material 21, the wiring 40 can be electromagnetically shielded.
That is, also in the present embodiment, it is possible to provide a wiring board capable of providing electromagnetic shielding to the wiring provided on the elastic base material.

(Manufacturing method of wiring board 12)
As a method for manufacturing the wiring board 12 shown in FIG. 5, for example, the following method can be adopted.
First, in the same manner as in the wiring forming step in the method for manufacturing the wiring board 10 of the first embodiment, the wiring 40 and the side shield wires 55a and 55b are formed on the upper side of the supporting base material 31 having the penetrating portions 31a and 31b. are formed, and part of the side shield wires 55a and 55b are formed in the penetrating portions 31a and 31b.
In addition, in the same manner as the supporting base material bonding step in the method for manufacturing the wiring board 10 of the first embodiment, the supporting base material 31 is bonded to the first surface 21a side of the base material 21 in the extended state, The base material 21 and part of the side shield wires 55a and 55b formed in the through portions 31a and 31b are connected.

The wiring board 12 can be obtained by performing the other steps in the same manner as in the method for manufacturing the wiring board 10 of the first embodiment.

<Fourth Embodiment>
Next, a fourth embodiment of the present disclosure will be described.
The wiring board of the fourth embodiment of the present disclosure includes a conductive layer between the base material and the supporting base material, and this conductive layer acts as an electromagnetic shield below the wiring.

That is, the wiring board of the fifth embodiment of the present disclosure includes a conductive layer positioned between the base material and the supporting base material in the wiring board of the first embodiment or the second embodiment, The supporting base material has a through portion, and has a configuration in which the conductive layer and the side shield wire are connected through the through portion.

FIG. 6 is a diagram showing an example of a wiring board according to the fourth embodiment of the present disclosure, and like FIG. It is a cross-sectional view showing the.

As shown in FIG. 6, the wiring board 13 includes a conductive layer 90 between a base material 20 and a support base material 31. The support base material 31 has through portions 31a and 31b. The conductive layer 90 and the side shield wires 55a and 55b are connected through the wires 31b.
Here, the conductive layer 90 and the side shield lines 55a and 55b may be connected at least partially. Therefore, the penetrating portions 31a and 31b do not have to be formed continuously in the extending direction of the side shield wires 55a and 55b with the same length as the side shield wires 55a and 55b, and are partially provided. may For example, the through portions 31a and 31b may be provided at regular intervals in the extending direction of the side shield wires 55a and 55b.

Due to the configuration as described above, the conductive layer 90 of the wiring board 13 acts as an electromagnetic shield below the wiring 40 .
That is, in the wiring board 13, in addition to the effects of the wiring board 10 of the first embodiment, electromagnetic shielding can also be applied to the lower side of the wiring.

More specifically, since the wiring board 13 shown in FIG. Electromagnetic shielding can be applied in all directions.

Also in the wiring substrate 13 shown in FIG. 6, as in the wiring substrate 10 of the first embodiment, even if the base material 20 expands and contracts, the wiring 40 and the side shield wires 55a and 55b are broken. can be avoided.

Moreover, the conductive layer 90 of the wiring board 13 also has a bellows shape in which peaks M and valleys V in the normal direction of the first surface 20a of the base material 20 repeatedly appear along the in-plane direction of the first surface 20a of the base material 20 . It can be a form having a shape. Therefore, it is possible to avoid damage to the conductive layer 90 even when the base material 20 expands and contracts.

In addition, since the conductive layer 90 has a larger area than the wiring 40 and the side shield wires 55a and 55b, even if a part of the conductive layer 90 is damaged, the other undamaged parts can be sufficiently effective as an electromagnetic shield. is. Moreover, the conductive layer 90 may be of any material as long as it has electrical conductivity and acts as an electromagnetic shield, and may be made of a material that is more stretchable than the material that constitutes the wiring 40 .

As described above, the covering shield portion 70 and the side shield wires 55a and 55b are at least partially connected, and the side shield wires 55a and 55b and the conductive layer 90 are connected through the penetrating portions 31a and 31b. Connected.

Therefore, by electrically grounding either the side shield wires 55a and 55b or the conductive layer 90, the wiring 40 can be electromagnetically shielded.
That is, also in the present embodiment, it is possible to provide a wiring board capable of providing electromagnetic shielding to the wiring provided on the elastic base material.

A material that can follow the expansion and contraction of the base material 20 is used as the material of the conductive layer 90 . The material of the conductive layer 90 itself may or may not have elasticity.

Examples of materials that can be used for the conductive layer 90 and that do not have elasticity per se include metals such as gold, silver, copper, aluminum, platinum, and chromium, and alloys containing these metals. If the material of the conductive layer 90 itself does not have stretchability, the conductive layer 90 may be a metal film.

When the material itself used for the conductive layer 90 has elasticity, the elasticity of the material is similar to that of the base material 20, for example. Examples of materials that can be used for the conductive layer 90 and that have elasticity in themselves include a conductive composition that contains conductive particles and an elastomer. The conductive particles may be those that can be used for wiring, and examples thereof include particles of gold, silver, copper, nickel, palladium, platinum, carbon, and the like. Among them, silver particles are preferably used.

Preferably, conductive layer 90 comprises a structure that is resistant to deformation. For example, conductive layer 90 includes a base material and a plurality of conductive particles dispersed within the base material. In this case, by using a deformable material such as resin as the base material, the conductive layer 90 can also be deformed according to the expansion and contraction of the base material 20 . Further, the conductivity of the conductive layer 90 can be maintained by setting the distribution and shape of the conductive particles so that the contact between the plurality of conductive particles is maintained even when deformation occurs. can.

As the material constituting the base material of the conductive layer 90, general thermoplastic elastomers and thermosetting elastomers can be used. , urethane rubber, fluororubber, nitrile rubber, polybutadiene, polychloroprene, and the like can be used. Among them, resins and rubbers containing urethane-based or silicone-based structures are preferably used in terms of stretchability and durability.

The thickness of the conductive layer 90 may be any thickness that can withstand expansion and contraction of the base material 20, and is appropriately selected according to the material of the conductive layer 90 and the like.
For example, when the material of the conductive layer 90 does not have stretchability, the thickness of the conductive layer 90 can be in the range of 25 nm to 100 μm, preferably in the range of 50 nm to 50 μm, and 100 nm. More preferably, the thickness is in the range of 5 μm or more.
Further, when the material of the conductive layer 90 has stretchability, the thickness of the conductive layer 90 can be in the range of 5 μm to 60 μm, preferably in the range of 10 μm to 50 μm, and more preferably 20 μm to 40 μm. It is more preferable to be within the following range.

A method for forming the conductive layer 90 is appropriately selected according to the material and the like. For example, a method of forming a metal film on the first surface 20a of the base material 20 or the lower surface of the support base material 31 by a vapor deposition method, a sputtering method, or the like can be used. Further, when the material of the conductive layer 90 itself has stretchability, for example, the conductive particles and the elastomer are applied to the first surface 20a of the base material 20 or the lower surface of the support base material 31 by a general printing method. A method of printing the containing conductive composition can be mentioned. Alternatively, a plating method may be used.

(Manufacturing method of wiring board 13)
As a method for manufacturing the wiring board 13 shown in FIG. 6, for example, the following method can be adopted.
First, in the wiring forming step in the method for manufacturing the wiring board 10 of the first embodiment, the wiring 40 and the side shield wires 55a and 55b are formed, and the side shield wires 55a and 55b are formed in the penetrating portions 31a and 31b. forms part of
In addition, the conductive layer 90 is formed on the first surface 20a side of the elongated base material 20 between the base material elongating step and the supporting base material bonding step in the manufacturing method of the wiring board 10 of the first embodiment. A step of forming a conductive layer is carried out.
Then, in the support base bonding step in the method for manufacturing the wiring board 10 of the first embodiment, the conductive layer 90 formed on the side of the first surface 20a of the base 20 in a stretched state and the support base 31 are bonded together. At the same time, the conductive layer 90 is connected to part of the side shield wires 55a and 55b formed in the penetrating portions 31a and 31b.

The wiring board 13 can be obtained by performing the other steps in the same manner as in the method for manufacturing the wiring board 10 of the first embodiment.

Moreover, as another manufacturing method, the following method may be adopted.
First, the conductive layer forming step of forming the conductive layer 90 on the lower surface of the supporting base material 31 is carried out before the wiring forming step in the manufacturing method of the wiring board 10 of the first embodiment.
In addition, in the wiring formation step in the method for manufacturing the wiring board 10 of the first embodiment, the wiring 40 and the side shield wires 55a and 55b are formed, and the side shield wires 55a and 55b are formed in the penetrating portions 31a and 31b. , and part of the side shield wires 55 a and 55 b formed in the through portions 31 a and 31 b are connected to the conductive layer 90 .
Then, in the supporting base material joining step in the method for manufacturing the wiring board 10 of the first embodiment, the supporting base material 31 having the conductive layer 90 formed on the first surface 20a side of the base material 20 in the elongated state. The conductive layer 90 side is joined.

The wiring board 13 can be obtained by performing the other steps in the same manner as in the method for manufacturing the wiring board 10 of the first embodiment.

Moreover, as another manufacturing method, the following method may be employed.
First, in the wiring forming step in the method for manufacturing the wiring board 10 of the first embodiment, the wiring 40 and the side shield wires 55a and 55b are formed, and the side shield wires 55a and 55b are formed in the penetrating portions 31a and 31b. forms part of
Further, after this wiring forming step and before the supporting base bonding step in the method for manufacturing the wiring board 10 of the first embodiment, a conductive layer 90 is formed on the lower surface of the supporting base 31. Then, a conductive layer forming step is performed to connect part of the side shield lines 55a and 55b formed in the penetrating portions 31a and 31b to the conductive layer 90. Next, as shown in FIG.
Then, in the supporting base material joining step in the method for manufacturing the wiring board 10 of the first embodiment, the supporting base material 31 having the conductive layer 90 formed on the first surface 20a side of the base material 20 in the elongated state. The conductive layer 90 side is joined.

The wiring board 13 can be obtained by performing the other steps in the same manner as in the method for manufacturing the wiring board 10 of the first embodiment.

<Fifth Embodiment>
Next, a fifth embodiment of the present disclosure will be described.
A wiring board according to a fifth embodiment of the present disclosure is a wiring board according to the third embodiment described above, in which the covering shield part and the base material are directly connected without passing through the side-side shield wire.

That is, a wiring board according to a fifth embodiment of the present disclosure includes a first surface and a second surface located on the opposite side of the first surface, a stretchable base material, and the first surface of the base material. provided on the upper side of the support base positioned on the surface side and the support base when the direction from the second surface to the first surface in the normal direction of the first surface of the base is defined as the upper side; an insulating portion that covers the wiring; and a covering shield portion that covers the insulating portion; the substrate has conductivity; the support base has a through portion; , the base material and the covering shield part are connected to each other, and the wiring is such that the peaks and valleys in the normal direction of the first surface of the base material are in-plane of the first surface of the base material. The wiring board has a bellows shape that repeatedly appears along the direction.

FIG. 7 is a diagram showing an example of a wiring board according to the fifth embodiment of the present disclosure, and, like FIG. It is a sectional view showing.

The difference between the wiring board 14 shown in FIG. 7 and the wiring board 12 shown in FIG. 5 is that the wiring board 14 shown in FIG. First, the substrate 21 and the covering shield portion 71 are directly connected through the penetrating portions 31a and 31b.
Here, the base material 21 and the covering shield part 71 need only be connected at least partially. Therefore, also in the wiring substrate 14 shown in FIG. 7, the penetrating portions 31a and 31b are continuous with the same length as the covering shield portion 71 in the direction in which the covering shield portion 71 extends, similarly to the wiring substrate 12 shown in FIG. It does not have to be formed on the entire surface, and may be partially provided. For example, the penetrating portions 31a and 31b may be provided at regular intervals in the direction in which the covering shield portion 71 extends.

As described above, in the wiring board 14 shown in FIG. 7, the base material 21 and the cover shield portion 71 are connected through the through portions 31a and 31b. Therefore, by electrically grounding the base material 21, the wiring 40 can be electromagnetically shielded in the wiring board 14 shown in FIG. 7 as well as in the wiring board 12 shown in FIG.
Also in the wiring board 14 shown in FIG. 7, as in the wiring board 12 shown in FIG.
That is, also in the present embodiment, it is possible to provide a wiring board capable of providing electromagnetic shielding to the wiring provided on the elastic base material.

(Manufacturing method of wiring board 14)
As a method for manufacturing the wiring board 14 shown in FIG. 7, for example, the following method can be adopted.
First, the supporting base material 31 having the penetrating portions 31 a and 31 b is prepared, and the wiring forming step of forming the wiring 40 on the upper side of the supporting base material 31 is performed.
Next, an insulating portion forming step is performed to form the insulating portion 60 that covers the wiring 40. After that, while forming the covering shield portion 71 that covers the insulating portion 60, part of the covering shield portion 71 is formed in the penetrating portions 31a and 31b. is performed.

Subsequently, a substrate elongation step is performed in which a tensile stress T is applied to the separately prepared substrate 21 to elongate the substrate 21 . The elongation rate of the base material 21 is, for example, 10% or more and 200% or less. The substrate elongation step may be performed while the substrate 21 is heated, or may be performed at room temperature. When heating the base material 21, the temperature of the base material 21 is 50 degreeC or more and 100 degrees C or less, for example.

Subsequently, the support base material 31 subjected to the covering shield portion forming step is joined to the first surface 21a side of the base material 21 stretched by the tensile stress T, and the base material 21 and the penetrating portions 31a and 31b are bonded together. A supporting base material bonding step is performed to connect a part of the covering shield part 71 formed in the above.

After that, a substrate contraction step is performed to remove the tensile stress T from the substrate 21 . Along with the shrinkage of the base material 21, the support base material 31 and the constituent elements constituting the laminated structure on the upper side of the support base material 31 are both The peaks M and valleys V form a bellows shape that repeatedly appears along the in-plane direction of the first surface 21 a of the base material 21 .
The wiring substrate 14 can be obtained through the above steps.

<Sixth embodiment>
Next, a sixth embodiment of the present disclosure will be described.
The wiring board according to the sixth embodiment of the present disclosure is the wiring board according to the fourth embodiment, in which the covering shield part and the conductive layer 90 are directly connected without passing through the side shield wire. .

That is, a wiring board according to a sixth embodiment of the present disclosure includes a first surface and a second surface located on the opposite side of the first surface, and includes a stretchable base material and the first surface of the base material. provided on the upper side of the supporting substrate located on the surface side and the supporting substrate when the direction from the second surface to the first surface in the normal direction of the first surface of the substrate is the upper side; an insulating portion covering the wiring; a covering shield portion covering the insulating portion; and a conductive layer positioned between the base material and the supporting base material, the supporting base material penetrating through The covering shield portion and the conductive layer are connected through the penetrating portion, and the wiring has a peak portion and a valley portion in the normal direction of the first surface of the base material. The wiring board has a bellows shape that repeatedly appears along the in-plane direction of the first surface of the material.

FIG. 8 is a diagram showing an example of a wiring board according to the sixth embodiment of the present disclosure, and like FIG. It is a cross-sectional view showing the.

The difference between the wiring board 15 shown in FIG. 8 and the wiring board 13 shown in FIG. 6 is that the wiring board 15 shown in FIG. First, the conductive layer 90 and the covering shield portion 71 are connected through the penetrating portions 31a and 31b.
Here, the conductive layer 90 and the covering shield part 71 need only be connected at least partially. Therefore, in the wiring substrate 15 shown in FIG. 8 as well, the penetrating portions 31a and 31b are continuous with the same length as the covering shield portion 71 in the extending direction of the covering shield portion 71, similarly to the wiring substrate 13 shown in FIG. It does not have to be formed on the entire surface, and may be partially provided. For example, the penetrating portions 31a and 31b may be provided at regular intervals in the direction in which the covering shield portion 71 extends.

As described above, in the wiring board 15 shown in FIG. 8, the conductive layer 90 and the covering shield portion 71 are connected through the penetrating portions 31a and 31b. Therefore, by electrically grounding the conductive layer 90, the wiring 40 can be electromagnetically shielded in the wiring board 15 shown in FIG. 8 as well as in the wiring board 13 shown in FIG.
Also in the wiring board 15 shown in FIG. 8, as in the wiring board 13 shown in FIG.
That is, also in the present embodiment, it is possible to provide a wiring board capable of providing electromagnetic shielding to the wiring provided on the elastic base material.

(Manufacturing method of wiring board 15)
As a method for manufacturing the wiring board 15 shown in FIG. 8, for example, the following method can be adopted.
First, the supporting base material 31 having the penetrating portions 31 a and 31 b is prepared, and the wiring forming step of forming the wiring 40 on the upper side of the supporting base material 31 is performed.
Next, an insulating portion forming step is performed to form the insulating portion 60 that covers the wiring 40. After that, while forming the covering shield portion 71 that covers the insulating portion 60, part of the covering shield portion 71 is formed in the penetrating portions 31a and 31b. is performed.

Subsequently, a substrate elongation step is performed in which a tensile stress T is applied to the separately prepared substrate 20 to elongate the substrate 20 . The elongation rate of the base material 20 is, for example, 10% or more and 200% or less. The substrate elongation step may be performed while the substrate 20 is heated, or may be performed at room temperature. When heating the base material 20, the temperature of the base material 20 is 50 to 100 degreeC, for example.

Next, a conductive layer forming step of forming a conductive layer 90 on the first surface 20a side of the base material 20 in a state of being stretched by the tensile stress T is performed.

Subsequently, on the first surface 20a side of the base material 20 in a state of being stretched by the tensile stress T, that is, on the upper side of the conductive layer 90 formed in the conductive layer forming step, the covering shield portion forming step was performed. A support-substrate bonding step is performed for bonding the substrate 31 and connecting the conductive layer 90 and a part of the covering shield portion 71 formed in the through portions 31a and 31b.

After that, a substrate contraction step is performed to remove the tensile stress T from the substrate 20 . With this shrinkage of the base material 20, the conductive layer 90, the support base material 31, and the constituent elements constituting the laminated structure on the upper side of the support base material 31 all shrink from the first surface 20a of the base material 20. The peaks M and valleys V in the normal direction form a bellows shape that repeatedly appears along the in-plane direction of the first surface 20 a of the base material 20 .
The wiring substrate 15 can be obtained through the steps described above.

Moreover, as another manufacturing method, the following method may be adopted.
In this method, the conductive layer forming step of forming the conductive layer 90 on the lower surface of the support base material 31 is performed before the covering shield portion forming step.

For example, first, the support base material 31 is prepared, and the conductive layer forming step of forming the conductive layer 90 on the lower surface of the support base material 31 is performed.
Next, a wiring forming step is performed to form the wiring 40 on the upper side of the supporting base material 31 .
Next, an insulating portion forming step is performed to form the insulating portion 60 that covers the wiring 40. After that, while forming the covering shield portion 71 that covers the insulating portion 60, part of the covering shield portion 71 is formed in the penetrating portions 31a and 31b. are formed, and a covering shield portion forming step is performed to connect a portion of the covering shield portion 71 formed in the through portions 31 a and 31 b and the conductive layer 90 .

Next, a substrate elongation step is performed in which a tensile stress T is applied to the separately prepared substrate 20 to elongate the substrate 20 . Subsequently, a supporting base material bonding step of bonding the supporting base material 31 having the conductive layer 90 formed thereon to the first surface 20a side of the base material 20 stretched by the tensile stress T is carried out. After that, a substrate contraction step is performed to remove the tensile stress T from the substrate 20 .
The wiring substrate 15 can be obtained through the steps described above.

Moreover, as another manufacturing method, the following method may be employed.
In this method, the conductive layer 90 is formed on the lower surface of the supporting base material 31 after the covering shield portion forming step and before the supporting base bonding step, and the covering shields formed on the through portions 31a and 31b are formed. A portion of the portion 71 and the conductive layer 90 are connected.

For example, first, the supporting base material 31 is prepared, and the wiring forming step of forming the wiring 40 on the upper side of the supporting base material 31 is performed.
Next, an insulating portion forming step is performed to form the insulating portion 60 that covers the wiring 40. After that, while forming the covering shield portion 71 that covers the insulating portion 60, part of the covering shield portion 71 is formed in the penetrating portions 31a and 31b. is performed.
Next, a conductive layer 90 is formed on the lower surface of the supporting base material 31 on which the covering shield part 71 is formed, and the part of the covering shield part 71 formed in the penetrating parts 31a and 31b and the conductive layer 90 are separated. A conductive layer forming step for connection is carried out.

Next, a substrate elongation step is performed in which a tensile stress T is applied to the separately prepared substrate 20 to elongate the substrate 20 . Subsequently, a supporting base material bonding step of bonding the supporting base material 31 having the conductive layer 90 formed thereon to the first surface 20a side of the base material 20 stretched by the tensile stress T is carried out. After that, a substrate contraction step is performed to remove the tensile stress T from the substrate 20 .
The wiring substrate 15 can be obtained through the steps described above.

10, 11, 12, 13, 14, 15 Wiring boards 20, 21 Base materials 20a, 21a First surfaces 20b, 21b Second surfaces 30, 31 Support base materials 31a, 31b Penetrating parts 40, 40a, 40b, 41 Wiring 50a , 50b, 51, 52, 53, 54, 55a, 55b side shield wire 60 insulating portions 62a, 62b through hole 63 insulating portion exposed regions 70, 70a, 70b, 70c, 70d, 71 covering shield portion 80 bridge wiring 90 conductive Layer M Peak V Valley

Claims (25)

a stretchable base material including a first surface and a second surface located on the opposite side of the first surface;
a supporting substrate positioned on the first surface side of the substrate;
When the direction from the second surface to the first surface in the normal direction of the first surface of the base material is the upper side,
wiring provided on the upper side of the supporting base;
a side-side shield line provided on the upper side of the supporting base material and arranged in parallel with the wiring;
an insulating portion covering the wiring;
a covering shield portion that covers the insulating portion;
with
At least a part of the covering shield part and the side shield wire are connected,
The wiring and the side shield line have a bellows shape in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material. and
The covering shield portion is a metal film made of a non-stretchable material,
The non-stretchable material contains at least one of gold, silver, copper, aluminum, platinum, and chromium,
The covering shield part has a bellows shape in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material. wiring board. a stretchable base material including a first surface and a second surface located on the opposite side of the first surface;
a supporting substrate positioned on the first surface side of the substrate;
When the direction from the second surface to the first surface in the normal direction of the first surface of the base material is the upper side,
wiring provided on the upper side of the supporting base;
a side-side shield line provided on the upper side of the supporting base material and arranged in parallel with the wiring;
an insulating portion covering the wiring;
a covering shield portion that covers the insulating portion;
with
At least a part of the covering shield part and the side shield wire are connected,
The wiring and the side shield line have a bellows shape in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material. and
The wiring includes two wirings that form a pair,
A bridge wiring provided on the upper side of the insulating part and connected to each of the two wirings that form a pair,
The insulating portion around the bridge wiring has an insulating portion exposed region exposed from the covering shield portion,
When viewed along the normal direction of the first surface of the base material,
a through hole is provided in the insulating portion in a region where the bridge wiring and each of the two wirings forming a pair overlap,
A wiring board , wherein each of the pair of two wirings and the bridge wiring are connected through the through hole . The bridge wiring has a bellows shape in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material. Item 3. The wiring board according to item 2 . 4. The wiring board according to claim 2 , wherein said bridge wiring and said covering shield portion are made of the same material. 5. The wiring board according to claim 2 , wherein said bridge wiring and said covering shield part have the same thickness. 6. The wiring board according to claim 1, wherein said wiring and said side shield wire are made of the same material. 7. The wiring board according to claim 1, wherein said wiring and said side shield wire have the same thickness. The base material has conductivity,
The supporting base material has a penetrating part,
The wiring board according to any one of claims 1 to 7, wherein the base material and the side shield wire are connected through the through portion. a conductive layer positioned between the substrate and the supporting substrate;
The supporting base material has a penetrating part,
8. The wiring board according to claim 1, wherein said conductive layer and said side shield wire are connected through said through portion. The conductive layer has a bellows shape in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material. Item 9. The wiring board according to item 9. a stretchable base material including a first surface and a second surface located on the opposite side of the first surface;
a supporting substrate positioned on the first surface side of the substrate;
When the direction from the second surface to the first surface in the normal direction of the first surface of the base material is the upper side,
wiring provided on the upper side of the supporting base;
an insulating portion covering the wiring;
a covering shield portion that covers the insulating portion;
with
The base material has conductivity,
The supporting base material has a penetrating part,
The base material and the covering shield part are connected through the penetration part,
the wiring has a bellows shape in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material ;
The covering shield portion is a metal film made of a non-stretchable material,
The non-stretchable material contains at least one of gold, silver, copper, aluminum, platinum, and chromium,
The covering shield part has a bellows shape in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material. wiring board. a stretchable base material including a first surface and a second surface located on the opposite side of the first surface;
a supporting substrate positioned on the first surface side of the substrate;
When the direction from the second surface to the first surface in the normal direction of the first surface of the base material is the upper side,
wiring provided on the upper side of the supporting base;
an insulating portion covering the wiring;
a covering shield portion that covers the insulating portion;
a conductive layer positioned between the substrate and the supporting substrate;
with
The supporting base material has a penetrating part,
The covering shield portion and the conductive layer are connected through the penetrating portion,
the wiring has a bellows shape in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material ;
The covering shield portion is a metal film made of a non-stretchable material,
The non-stretchable material contains at least one of gold, silver, copper, aluminum, platinum, and chromium,
The covering shield part has a bellows shape in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material. wiring board. The conductive layer has a bellows shape in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material. Item 13. The wiring board according to item 12. The supporting substrate has a bellows shape in which peaks and valleys in the normal direction of the first surface of the substrate repeatedly appear along the in-plane direction of the first surface of the substrate. The wiring board according to any one of claims 1 to 13 . The insulating portion has a bellows shape in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material. The wiring board according to any one of claims 1 to 14 . A method for manufacturing a wiring board,
The wiring board is
a stretchable base material including a first surface and a second surface located on the opposite side of the first surface;
a supporting substrate positioned on the first surface side of the substrate;
When the direction from the second surface to the first surface in the normal direction of the first surface of the base material is the upper side,
wiring provided on the upper side of the supporting base;
a side-side shield line provided on the upper side of the supporting base material and arranged in parallel with the wiring;
an insulating portion covering the wiring;
a covering shield portion that covers the insulating portion;
has
The covering shield portion is a metal film made of a non-stretchable material,
The non-stretchable material contains at least one of gold, silver, copper, aluminum, platinum, and chromium,
a wiring forming step of forming the wiring and the side shield line;
an insulating portion forming step of forming the insulating portion;
a covering shield portion forming step of forming the covering shield portion;
A substrate elongation step of applying a tensile stress to the substrate to elongate the substrate;
a supporting base material bonding step of bonding the supporting base material to the first surface side of the base material in an extended state;
a base material contraction step of removing the tensile stress from the base material to which the support base material is joined;
with
In the covering shield portion forming step, connecting at least a portion of the covering shield portion and the side shield wire,
In the base shrinking step, the wiring , the side-side shield line , and the covering shield part are arranged such that the peaks and valleys in the normal direction of the first surface of the base are the same as those of the base. A method of manufacturing a wiring substrate, wherein the first surface has a bellows shape that repeatedly appears along the in-plane direction. A method for manufacturing a wiring board,
The wiring board is
a stretchable base material including a first surface and a second surface located on the opposite side of the first surface;
a supporting substrate positioned on the first surface side of the substrate;
When the direction from the second surface to the first surface in the normal direction of the first surface of the base material is the upper side,
wiring provided on the upper side of the supporting base;
a side-side shield line provided on the upper side of the supporting base material and arranged in parallel with the wiring;
an insulating portion covering the wiring;
a covering shield portion that covers the insulating portion;
has
The wiring includes two wirings that form a pair,
The wiring board further comprises
A bridge wiring provided on the insulating part and connecting the two wirings that form a pair,
a wiring forming step of forming the wiring and the side shield line;
an insulating portion forming step of forming the insulating portion;
a covering shield portion forming step of forming the covering shield portion;
A substrate elongation step of applying a tensile stress to the substrate to elongate the substrate;
a supporting base material bonding step of bonding the supporting base material to the first surface side of the base material in an extended state;
a base material contraction step of removing the tensile stress from the base material to which the support base material is joined;
with
In the step of forming the insulating portion, a through hole is provided in the insulating portion in a region where the bridge wiring and each of the two wirings forming a pair overlap,
In the covering shield portion forming step, while forming the covering shield portion and the bridge wiring, the insulating portion around the bridge wiring forms an insulating portion exposed region where the insulating portion is exposed from the covering shield portion, and the through hole through, connecting each of the pair of two wirings to the bridge wiring,
In the covering shield portion forming step, connecting at least a portion of the covering shield portion and the side shield wire,
In the base material shrinking step, the wiring and the side shield line are configured such that the peaks and valleys in the normal direction of the first surface of the base material are in the in-plane direction of the first surface of the base material. A method of manufacturing a wiring board, wherein the form has a bellows shape that repeatedly appears along a line. The base material has conductivity,
The supporting base material has a penetrating part,
forming part of the side shield wire in the through portion in the wiring forming step;
18. The method of manufacturing a wiring board according to claim 17 , wherein in said supporting base material bonding step, said base material and part of said side shield wire formed in said through portion are connected. The wiring board is
having a conductive layer positioned between the substrate and the supporting substrate;
The supporting base material has a penetrating part,
forming part of the side shield wire in the through portion in the wiring forming step;
A conductive layer forming step of forming the conductive layer on the first surface side of the extended base material between the base material elongating step and the supporting base material bonding step,
19. The method of manufacturing a wiring board according to claim 17, wherein in said supporting base material bonding step, said conductive layer and a part of said side shield wire formed in said through portion are connected. A method for manufacturing a wiring board,
The wiring board is
a stretchable base material including a first surface and a second surface located on the opposite side of the first surface;
a supporting substrate positioned on the first surface side of the substrate;
When the direction from the second surface to the first surface in the normal direction of the first surface of the base material is the upper side,
wiring provided on the upper side of the supporting base;
a side-side shield line provided on the upper side of the supporting base material and arranged in parallel with the wiring;
an insulating portion covering the wiring;
a covering shield portion that covers the insulating portion;
has
The wiring board further comprises
having a conductive layer positioned between the substrate and the supporting substrate;
The supporting base material has a penetrating part,
a wiring forming step of forming the wiring and the side shield line;
an insulating portion forming step of forming the insulating portion;
a covering shield portion forming step of forming the covering shield portion;
A substrate elongation step of applying a tensile stress to the substrate to elongate the substrate;
a supporting base material bonding step of bonding the supporting base material to the first surface side of the base material in an extended state;
a base material contraction step of removing the tensile stress from the base material to which the support base material is joined;
A conductive layer forming step of forming the conductive layer on the lower surface of the supporting base before the wiring forming step;
with
forming a portion of the side shield wire in the through portion and connecting a portion of the side shield wire formed in the through portion to the conductive layer in the wiring forming step;
In the covering shield portion forming step, connecting at least a portion of the covering shield portion and the side shield wire,
In the base material shrinking step, the wiring and the side shield line are configured such that the peaks and valleys in the normal direction of the first surface of the base material are in the in-plane direction of the first surface of the base material. A method of manufacturing a wiring board, wherein the form has a bellows shape that repeatedly appears along a line. A method for manufacturing a wiring board,
The wiring board is
a stretchable base material including a first surface and a second surface located on the opposite side of the first surface;
a supporting substrate positioned on the first surface side of the substrate;
When the direction from the second surface to the first surface in the normal direction of the first surface of the base material is the upper side,
wiring provided on the upper side of the supporting base;
a side-side shield line provided on the upper side of the supporting base material and arranged in parallel with the wiring;
an insulating portion covering the wiring;
a covering shield portion that covers the insulating portion;
has
The wiring board further comprises
having a conductive layer positioned between the substrate and the supporting substrate;
The supporting base material has a penetrating part,
a wiring forming step of forming the wiring and the side shield line;
an insulating portion forming step of forming the insulating portion;
a covering shield portion forming step of forming the covering shield portion;
A substrate elongation step of applying a tensile stress to the substrate to elongate the substrate;
a supporting base material bonding step of bonding the supporting base material to the first surface side of the base material in an extended state;
a base material contraction step of removing the tensile stress from the base material to which the support base material is joined;
with
forming part of the side shield wire in the through portion in the wiring forming step;
After the wiring forming step and before the supporting substrate bonding step, the conductive layer is formed on the lower surface of the supporting substrate, and part of the side shield wire formed in the through portion. and a conductive layer forming step for connecting the conductive layer,
In the covering shield portion forming step, connecting at least a portion of the covering shield portion and the side shield wire,
In the base material shrinking step, the wiring and the side shield line are configured such that the peaks and valleys in the normal direction of the first surface of the base material are in the in-plane direction of the first surface of the base material. A method of manufacturing a wiring board, wherein the form has a bellows shape that repeatedly appears along a line. A method for manufacturing a wiring board,
The wiring board is
a stretchable base material including a first surface and a second surface located on the opposite side of the first surface;
a supporting substrate positioned on the first surface side of the substrate;
When the direction from the second surface to the first surface in the normal direction of the first surface of the base material is the upper side,
wiring provided on the upper side of the supporting base;
an insulating portion covering the wiring;
a covering shield portion that covers the insulating portion;
has
The covering shield portion is a metal film made of a non-stretchable material,
The non-stretchable material contains at least one of gold, silver, copper, aluminum, platinum, and chromium,
a wiring forming step of forming the wiring;
an insulating portion forming step of forming the insulating portion;
a covering shield portion forming step of forming the covering shield portion;
A substrate elongation step of applying a tensile stress to the substrate to elongate the substrate;
a supporting base material bonding step of bonding the supporting base material to the first surface side of the base material in an extended state;
a base material contraction step of removing the tensile stress from the base material to which the support base material is joined;
with
The base material has conductivity, the supporting base material has a through portion,
forming a part of the covering shield portion in the penetrating portion in the covering shield portion forming step;
In the supporting base material bonding step, connecting the base material and a part of the covering shield part formed in the through part,
In the base material shrinking step, the wiring and the covering shield part are adjusted so that peaks and valleys in the normal direction of the first surface of the base material are in the in-plane direction of the first surface of the base material. A method of manufacturing a wiring board, in which a form having a bellows shape repeatedly appearing along a line. A method for manufacturing a wiring board,
The wiring board is
a stretchable base material including a first surface and a second surface located on the opposite side of the first surface;
a supporting substrate positioned on the first surface side of the substrate;
When the direction from the second surface to the first surface in the normal direction of the first surface of the base material is the upper side,
wiring provided on the supporting substrate;
an insulating portion covering the wiring;
a covering shield portion that covers the insulating portion;
a conductive layer positioned between the substrate and the supporting substrate;
has
The covering shield portion is a metal film made of a non-stretchable material,
The non-stretchable material contains at least one of gold, silver, copper, aluminum, platinum, and chromium,
a wiring forming step of forming the wiring;
an insulating portion forming step of forming the insulating portion;
a covering shield portion forming step of forming the covering shield portion;
A substrate elongation step of applying a tensile stress to the substrate to elongate the substrate;
a supporting base material bonding step of bonding the supporting base material to the first surface side of the base material in an extended state;
a base material contraction step of removing the tensile stress from the base material to which the support base material is joined;
with
The supporting base material has a penetrating part,
forming a part of the covering shield portion in the penetrating portion in the covering shield portion forming step;
A conductive layer forming step of forming the conductive layer on the first surface side of the extended base material between the base material elongating step and the supporting base material bonding step,
In the supporting base material bonding step, connecting the conductive layer and a part of the covering shield portion formed in the through portion,
In the base material shrinking step, the wiring and the covering shield part are adjusted so that peaks and valleys in the normal direction of the first surface of the base material are in the in-plane direction of the first surface of the base material. A method of manufacturing a wiring board, in which a form having a bellows shape repeatedly appearing along a line. A method for manufacturing a wiring board,
The wiring board is
a stretchable base material including a first surface and a second surface located on the opposite side of the first surface;
a supporting substrate positioned on the first surface side of the substrate;
When the direction from the second surface to the first surface in the normal direction of the first surface of the base material is the upper side,
wiring provided on the supporting substrate;
an insulating portion covering the wiring;
a covering shield portion that covers the insulating portion;
a conductive layer positioned between the substrate and the supporting substrate;
has
a wiring forming step of forming the wiring;
an insulating portion forming step of forming the insulating portion;
a covering shield portion forming step of forming the covering shield portion;
A substrate elongation step of applying a tensile stress to the substrate to elongate the substrate;
a supporting base material bonding step of bonding the supporting base material to the first surface side of the base material in an extended state;
a base material contraction step of removing the tensile stress from the base material to which the support base material is joined;
with
The supporting base material has a penetrating part,
A conductive layer forming step of forming the conductive layer on the lower surface of the supporting base before the covering shield portion forming step,
forming a portion of the covering shield portion in the through portion in the covering shield portion forming step, connecting a portion of the covering shield portion formed in the through portion and the conductive layer;
In the base material contraction step, the wiring is formed in a bellows shape in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material. A method of manufacturing a wiring board, the form having a shape. A method for manufacturing a wiring board,
The wiring board is
a stretchable base material including a first surface and a second surface located on the opposite side of the first surface;
a supporting substrate positioned on the first surface side of the substrate;
When the direction from the second surface to the first surface in the normal direction of the first surface of the base material is the upper side,
wiring provided on the supporting substrate;
an insulating portion covering the wiring;
a covering shield portion that covers the insulating portion;
a conductive layer positioned between the substrate and the supporting substrate;
has
a wiring forming step of forming the wiring;
an insulating portion forming step of forming the insulating portion;
a covering shield portion forming step of forming the covering shield portion;
A substrate elongation step of applying a tensile stress to the substrate to elongate the substrate;
a supporting base material bonding step of bonding the supporting base material to the first surface side of the base material in an extended state;
a base material contraction step of removing the tensile stress from the base material to which the support base material is joined;
with
The supporting base material has a penetrating part,
forming a part of the covering shield portion in the penetrating portion in the covering shield portion forming step;
After the covering shield part forming step and before the supporting base bonding step, the conductive layer is formed on the lower surface of the supporting base material, and one part of the covering shield part formed in the through part is formed. A conductive layer forming step for connecting the part and the conductive layer,
In the base material contraction step, the wiring is formed in a bellows shape in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material. A method of manufacturing a wiring board, the form having a shape.

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