JP2020161741A - Wiring board, and manufacturing method for wiring board - Google Patents

Abstract

To provide a wiring board capable of applying electromagnetic shield to wiring provided for a base material having flexibility, and a manufacturing method for the wiring board.SOLUTION: A wiring board is configured to include: a base material having flexibility; a support base material positioned on a first surface side of the base material; wiring provided above the support base material; a side surface side shield wire provided above the support base material and arranged in parallel to the wiring; an insulation part covering the wiring; and a coated shield part coating the insulation part. The coated shield part and the side surface side shield wire are in contact at least partially. In the wiring and the side surface side shield wire, a mountain part and a valley part in a normal direction of the first surface of the base material have bellows shape repeatedly appearing along an in-plane direction of the first surface of the base material.SELECTED DRAWING: Figure 1

Description

An embodiment of the present disclosure relates to a wiring board including a stretchable base material and wiring, and a method for manufacturing the same.

In recent years, research has been conducted on wiring boards having deformability such as elasticity. For example, there are known ones in which elastic silver wiring is formed on an elastic base material and one in which horseshoe-shaped wiring is formed on an elastic base material (for example, Patent Document 1). Further, Patent Document 2 discloses a method for manufacturing a wiring board having elasticity. The manufacturing method described in Patent Document 2 employs a step of providing a circuit on a base material in a pre-stretched state, forming the circuit, and then relaxing the base material.

Japanese Unexamined Patent Publication No. 2013-187308 JP-A-2007-281406

The wiring through which the electric signal flows is preferably shielded (electromagnetic shield) so as not to be affected by an electromagnetic field or an electrostatic field from the outside and to prevent electric noise from leaking to the outside. Such a structure includes, for example, a shielded cable or a coaxial cable, which is electromagnetically shielded in the form of a wire mesh surrounding an internal core wire.
However, in order to apply an electromagnetic shield to the wiring provided on the stretchable base material, a configuration capable of adapting to deformation such as stretching is required.

An object of the present disclosure is to provide a wiring board and a method for manufacturing a wiring board that can effectively solve such a problem.

One embodiment of the present disclosure includes a first surface and a second surface located on the opposite side of the first surface, a stretchable substrate and a support group located on the first surface side of the substrate. The wiring provided on the upper side of the support base material and the support when the direction from the second surface to the first surface in the normal direction of the first surface of the base material is the upper side. A side shield wire provided on the upper side of the base material and arranged in parallel with the wiring, an insulating portion covering the wiring, and a covering shield portion covering the insulating portion are provided, and the covering shield portion and the side surface thereof are provided. At least a part of the side shielded wire is connected, and the wiring and the side shielded wire have peaks and valleys in the normal direction of the first surface of the base material as the first of the base material. It is a wiring board having a bellows shape that repeatedly appears along the in-plane direction of one surface.

In the wiring board according to the embodiment of the present disclosure, the wiring and the side shield wire may be made of the same material.

In the wiring board according to the embodiment of the present disclosure, the wiring and the side shield wire may have the same thickness.

The wiring board according to the embodiment of the present disclosure includes two wirings in which the wirings are paired, and includes bridge wirings provided above the insulating portion and connected to each of the two wirings in the pair. The insulating portion around the bridge wiring has an exposed region of the insulating portion exposed from the covering shield portion, and the bridge wiring is viewed along the normal direction of the first surface of the base material. A through hole is provided in the insulating portion in the region where each of the pair of two wirings overlaps with each other, and each of the pair of two wirings and the bridge wiring are connected through the through hole. You may be doing it.

In the wiring board according to the embodiment of the present disclosure, the bridge wiring has peaks and valleys in the normal direction of the first surface of the base material along the in-plane direction of the first surface of the base material. It may have a bellows shape that appears repeatedly.

In the wiring board according to the embodiment of the present disclosure, the bridge wiring and the covering shield portion may be made of the same material.

In the wiring board according to the embodiment of the present disclosure, the bridge wiring and the covering shield portion may have the same thickness.

In the wiring board according to the embodiment of the present disclosure, the base material has conductivity, the support base material has a penetrating portion, and the base material and the side surface side shielded wire are connected through the penetrating portion. You may be.

The wiring board according to the embodiment of the present disclosure includes a conductive layer located between the base material and the supporting base material, the supporting base material has a penetrating portion, and the conductive layer and the conductive layer pass through the penetrating portion. The side shield wire may be connected.

In the wiring board according to the embodiment of the present disclosure, the conductive layer has peaks and valleys in the normal direction of the first surface of the base material along the in-plane direction of the first surface of the base material. It may have a bellows shape that appears repeatedly.

Further, one embodiment of the present disclosure includes a first surface and a second surface located on the opposite side of the first surface, and is located on a stretchable base material and the first surface side of the base material. The support base material, and the wiring provided on the upper side of the support base material when the direction from the second surface to the first surface in the normal direction of the first surface of the base material is the upper side. An insulating portion that covers the wiring and a covering shield portion that covers the insulating portion are provided, the base material has conductivity, the supporting base material has a penetrating portion, and the base material is passed through the penetrating portion. And the covering shield portion are connected, and in the wiring, the peaks and valleys in the normal direction of the first surface of the base material are along the in-plane direction of the first surface of the base material. A wiring board having a bellows shape that appears repeatedly.

Further, one embodiment of the present disclosure includes a first surface and a second surface located on the opposite side of the first surface, and is located on a stretchable base material and the first surface side of the base material. The supporting base material, and the wiring provided on the upper side of the supporting base material when the direction from the second surface to the first surface in the normal direction of the first surface of the base material is set as the upper side. An insulating portion that covers the wiring, a covering shield portion that covers the insulating portion, and a conductive layer located between the base material and the supporting base material are provided, and the supporting base material has a penetrating portion. The covering shield portion and the conductive layer are connected through the penetrating portion, and in the wiring, the peaks and valleys in the normal direction of the first surface of the base material are the first of the base material. A wiring substrate having a bellows shape that repeatedly appears along the in-plane direction of the surface.

In the wiring board according to the embodiment of the present disclosure, the conductive layer has peaks and valleys in the normal direction of the first surface of the base material along the in-plane direction of the first surface of the base material. It may have a bellows shape that appears repeatedly.

In the wiring board according to the embodiment of the present disclosure, the covering shield portion has peaks and valleys in the normal direction of the first surface of the base material along the in-plane direction of the first surface of the base material. It may have a bellows shape that appears repeatedly.

In the wiring board according to the embodiment of the present disclosure, the supporting base material has peaks and valleys in the normal direction of the first surface of the base material along the in-plane direction of the first surface of the base material. It may have a bellows shape that appears repeatedly.

In the wiring board according to the embodiment of the present disclosure, the insulating portion has peaks and valleys in the normal direction of the first surface of the base material along the in-plane direction of the first surface of the base material. It may have a bellows shape that appears repeatedly.

Further, one embodiment of the present disclosure is a method for manufacturing a wiring substrate, wherein the wiring substrate includes a first surface and a second surface located on the opposite side of the first surface, and has an elastic base material. When the support base material located on the first surface side of the base material and the direction from the second surface to the first surface in the normal direction of the first surface of the base material are set as the upper side. , The wiring provided on the upper side of the supporting base material, the side shield wire provided on the upper side of the supporting base material and arranged in parallel with the wiring, the insulating portion covering the wiring, and the insulating portion. A wiring forming step of forming the wiring and the side surface side shield wire having a covering shield portion, an insulating portion forming step of forming the insulating portion, and a covering shield portion forming step of forming the covering shield portion. A base material stretching step of applying tensile stress to the base material to extend the base material, and a supporting base material joining step of joining the supporting base material to the first surface side of the stretched base material. A base material shrinkage step of removing the tensile stress from the base material to which the support base material is bonded is provided, and in the coating shield portion forming step, at least a part of the coating shield portion and the side surface side shield wire are provided. In the base material shrinkage step, the wiring and the side surface side shielded wire are connected, and the peaks and valleys in the normal direction of the first surface of the base material are formed on the first surface of the base material. This is a method for manufacturing a wiring substrate, which has a bellows shape that repeatedly appears along the in-plane direction.

The method for manufacturing a wiring board according to an embodiment of the present disclosure includes two wirings in which the wirings are paired, the wiring board is provided on the insulating portion, and the pairing of two wirings is provided. A bridge wiring for connecting is provided, and in the insulating portion forming step, a through hole is provided in the insulating portion in a region where each of the bridge wiring and the pair of two wirings overlaps, and in the covering shield portion forming step, While forming the coated shield portion and the bridge wiring, the insulating portion around the bridge wiring forms an insulated portion exposed region exposed from the coated shield portion, and the pair of two wires pass through the through hole. Each of the wirings of the above and the bridge wiring may be connected.

In the method for manufacturing a wiring board according to an embodiment of the present disclosure, the base material has conductivity, the support base material has a through portion, and in the wiring forming step, the side surface side shield wire is formed in the through portion. In the supporting base material joining step, the base material and a part of the side surface side shield wire formed in the penetrating portion may be connected to each other.

In the method for manufacturing a wiring board according to an embodiment of the present disclosure, the wiring board has a conductive layer located between the base material and the support base material, and the support base material has a through portion. In the wiring forming step, a part of the side surface side shielded wire is formed in the penetrating portion, and the first surface of the base material in a stretched state between the base material extending step and the supporting base material joining step. A conductive layer forming step for forming the conductive layer may be provided on the side, and the conductive layer and a part of the side surface side shield wire formed in the penetrating portion may be connected in the supporting base material joining step.

In the method for manufacturing a wiring board according to an embodiment of the present disclosure, the wiring board has a conductive layer located between the base material and the support base material, and the support base material has a through portion. Prior to the wiring forming step, a conductive layer forming step of forming the conductive layer on the lower surface of the supporting base material is provided, and in the wiring forming step, a part of the side surface side shield wire is formed in the penetrating portion. Then, a part of the side shield wire formed in the penetrating portion may be connected to the conductive layer.

In the method for manufacturing a wiring board according to an embodiment of the present disclosure, the wiring board has a conductive layer located between the base material and the support base material, and the support base material has a through portion. In the wiring forming step, a part of the side surface side shielded wire is formed in the penetrating portion, and after the wiring forming step and before the supporting base material joining step, the lower surface of the supporting base material is formed. May be provided with a conductive layer forming step of forming the conductive layer on the surface and connecting a part of the side surface side shield wire formed in the penetrating portion to the conductive layer.

Further, one embodiment of the present disclosure is a method for manufacturing a wiring substrate, wherein the wiring substrate includes a first surface and a second surface located on the opposite side of the first surface, and has an elastic base material. When the support base material located on the first surface side of the base material and the direction from the second surface to the first surface in the normal direction of the first surface of the base material are set as the upper side. A wiring forming step of having a wiring provided on the upper side of the supporting base material, an insulating portion covering the wiring, and a covering shield portion covering the insulating portion, and the insulating portion. An insulating portion forming step to be formed, a covering shield portion forming step to form the covering shield portion, a base material stretching step of applying tensile stress to the base material to extend the base material, and the base in an elongated state. The base material comprises a support base material joining step of joining the support base material to the first surface side of the material and a base material shrinkage step of removing the tensile stress from the base material to which the support base material is joined. It has conductivity, the supporting base material has a penetrating portion, a part of the covering shield portion is formed in the penetrating portion in the covering shield portion forming step, and the base is formed in the supporting base material joining step. The material and a part of the covering shield portion formed in the penetrating portion are connected, and in the base material shrinkage step, the form of the wiring is changed into peaks and valleys in the normal direction of the first surface of the base material. This is a method for manufacturing a wiring substrate, in which a portion has a bellows shape that repeatedly appears along the in-plane direction of the first surface of the base material.

Further, one embodiment of the present disclosure is a method for manufacturing a wiring substrate, wherein the wiring substrate includes a first surface and a second surface located on the opposite side of the first surface, and has an elastic base material. When the support base material located on the first surface side of the base material and the direction from the second surface to the first surface in the normal direction of the first surface of the base material are set as the upper side. A wiring provided on the supporting base material, an insulating portion covering the wiring, a covering shield portion covering the insulating portion, and a conductive layer located between the base material and the supporting base material. A wiring forming step for forming the wiring, an insulating portion forming step for forming the insulating portion, a covering shield portion forming step for forming the covering shield portion, and a tensile stress are applied to the base material. From the base material stretching step of stretching the base material, the support base material joining step of joining the support base material to the first surface side of the stretched base material, and the base material to which the support base material is joined. A base material shrinkage step for removing the tensile stress is provided, and the supporting base material has a penetrating portion, and in the covering shield portion forming step, a part of the covering shield portion is formed in the penetrating portion, and the base is formed. Between the material stretching step and the supporting base material joining step, a conductive layer forming step of forming the conductive layer on the first surface side of the stretched base material is provided, and in the supporting base material joining step, the said The conductive layer and a part of the covering shield portion formed in the penetrating portion are connected, and in the base material shrinkage step, the form of the wiring is changed to the mountain portion in the normal direction of the first surface of the base material and the mountain portion. This is a method for manufacturing a wiring substrate, in which the valley portion has a bellows shape that repeatedly appears along the in-plane direction of the first surface of the base material.

Further, one embodiment of the present disclosure is a method for manufacturing a wiring substrate, wherein the wiring substrate includes a first surface and a second surface located on the opposite side of the first surface, and has an elastic base material. When the support base material located on the first surface side of the base material and the direction from the second surface to the first surface in the normal direction of the first surface of the base material are set as the upper side. , The wiring provided on the supporting base material, the insulating portion covering the wiring, the covering shield portion covering the insulating portion, and the conductive layer located between the base material and the supporting base material. A wiring forming step for forming the wiring, an insulating portion forming step for forming the insulating portion, a covering shield portion forming step for forming the covering shield portion, and a tensile stress are applied to the base material. From the base material stretching step of stretching the base material, the support base material joining step of joining the support base material to the first surface side of the stretched base material, and the base material to which the support base material is joined. A base material shrinkage step for removing the tensile stress is provided, the support base material has a penetrating portion, and the conductive layer is formed on the lower surface of the support base material before the coating shield portion forming step. A conductive layer forming step is provided, and in the covering shield portion forming step, a part of the covering shield portion is formed in the penetrating portion, and a part of the covering shield portion formed in the penetrating portion is connected to the conductive layer. Then, in the base material shrinkage step, the form of the wiring is repeated along the in-plane direction of the first surface of the base material with peaks and valleys in the normal direction of the first surface of the base material. This is a method for manufacturing a wiring board having a bellows shape that appears.

Further, one embodiment of the present disclosure is a method for manufacturing a wiring substrate, wherein the wiring substrate includes a first surface and a second surface located on the opposite side of the first surface, and has an elastic base material. When the support base material located on the first surface side of the base material and the direction from the second surface to the first surface in the normal direction of the first surface of the base material are set as the upper side. , The wiring provided on the supporting base material, the insulating portion covering the wiring, the covering shield portion covering the insulating portion, and the conductive layer located between the base material and the supporting base material. A wiring forming step for forming the wiring, an insulating portion forming step for forming the insulating portion, a covering shield portion forming step for forming the covering shield portion, and a tensile stress are applied to the base material. From the base material stretching step of stretching the base material, the support base material joining step of joining the support base material to the first surface side of the stretched base material, and the base material to which the support base material is joined. A base material shrinkage step of removing the tensile stress is provided, and the supporting base material has a penetrating portion, and in the covering shield portion forming step, a part of the covering shield portion is formed in the penetrating portion, and the coating is provided. After the shield portion forming step and before the supporting base material joining step, the conductive layer is formed on the lower surface of the supporting base material, and a part of the covering shield portion formed in the penetrating portion is formed. A conductive layer forming step for connecting to the conductive layer is provided, and in the base material shrinkage step, the form of the wiring is such that the peaks and valleys in the normal direction of the first surface of the base material are the base material. This is a method for manufacturing a wiring substrate, which has a bellows shape that repeatedly appears along the in-plane direction of the first surface.

According to the embodiment of the present disclosure, it is possible to provide a wiring board capable of applying an electromagnetic shield to wiring provided on a stretchable base material.

It is a figure which shows an example of the wiring board which concerns on 1st Embodiment of this disclosure, (a) is a plan view, b) is a sectional view taken along line AA of (a), (c) is B of (a). -B line sectional view The figure which shows an example of the laminated structure of the upper side of the support base material of the wiring board shown in FIG. The figure which shows an example of the manufacturing method of the wiring board shown in FIG. The figure which shows an example of the wiring board which concerns on 2nd Embodiment of this disclosure. The figure which shows an example of the wiring board which concerns on 3rd Embodiment of this disclosure. The figure which shows an example of the wiring board which concerns on 4th Embodiment of this disclosure. The figure which shows an example of the wiring board which concerns on 5th Embodiment of this disclosure. The figure which shows an example of the wiring board which concerns on 6th Embodiment of this disclosure.

Hereinafter, the configuration of the wiring board and the manufacturing method thereof according to the embodiment of the present disclosure will be described in detail with reference to the drawings.

<First Embodiment>
First, the first embodiment of the present disclosure will be described with reference to FIGS. 1 to 3.
Here, FIG. 1 is a diagram showing an example of a wiring board according to the first embodiment of the present disclosure, (a) is a plan view, b) is a sectional view taken along line AA of (a), and (c). ) Is a sectional view taken along line BB in (a).
Further, FIG. 2 is a diagram showing an example of a laminated structure on the upper side of the support base material of the wiring board shown in FIG. 1, and FIG. 3 is a diagram showing an example of a method for manufacturing the wiring board shown in FIG.

As shown in FIG. 1, the wiring board 10 includes at least a base material 20, a support base material 30, a wiring 40, side shield wires 50a and 50b, an insulating portion 60, and a covering shield portion 70 as its configuration. There is.
The elastic base material 20 includes a first surface 20a and a second surface 20b located on the opposite side of the first surface 20a, and the support base material 30 is located on the first surface 20a side of the base material 20. There is.
Then, when the direction from the second surface 20b to the first surface 20a (Z direction in the drawing) in the normal direction of the first surface 20a of the base material 20 is set as the upper side, the upper side of the supporting base material 30 is The wiring 40 and the side shield wires 50a and 50b are provided.

From now on, in order to facilitate understanding, FIG. 2 will be described in addition to FIG. Note that FIG. 2 is a diagram showing an example of the upper laminated configuration of the support base material 30 of the wiring board 10 shown in FIG. 1, and is hidden by the covering shield portion 70 in the wiring board 10 shown in FIG. 1A. This is a description of the laminated structure.

Here, FIG. 2A is a plan view showing the arrangement relationship between the wiring 40 provided on the upper side of the support base material 30 and the side shield wires 50a and 50b. Further, FIG. 2B is a plan view showing the arrangement relationship between the insulating portion 60 provided on the upper side of the wiring 40, the wiring 40, and the side shield wires 50a and 50b. Further, FIG. 2C is a plan view showing the arrangement of the covering shield portion 70 provided on the upper side of the insulating portion 60.

In the method of manufacturing the wiring board 10, the wiring 40, the side shielded wires 50a and 50b, the insulating portion 60, and the covering shielded portion are arranged in the order of FIGS. 2 (a), 2 (b), and 2 (c). 70 is formed.

As shown in FIGS. 1 (b) and 2 (a), the side shield wires 50a and 50b are arranged in parallel with the wiring 40. In the examples shown in FIGS. 1B and 2A, the side shield wires 50a and 50b are arranged in parallel with the wiring 40 so as to sandwich the wiring 40 in between. The side shield wires 50a and 50b mainly serve as an electromagnetic shield in the side surface direction of the wiring 40. Further, as will be described later, the side shield wires 50a and 50b also act as ground wires for electrical grounding on the wiring board 10.

Here, in the present embodiment, the wiring 40 and the side shield wires 50a and 50b can be made of the same material. In this case, since the wiring 40 and the side shield wires 50a and 50b can be formed in the same manufacturing process, it is effective in shortening the manufacturing process and reducing the cost. In this case, the wiring 40 and the side shield wires 50a and 50b usually have the same thickness.
In the present embodiment, the wiring 40 and the side shield wires 50a and 50b may be made of different materials.

Further, as shown in FIGS. 1 (b) and 2 (b), the insulating portion 60 is formed so as to cover the wiring 40. At least a part of the side shield wires 50a and 50b is exposed from the insulating portion 60.

In the examples shown in FIGS. 1 (b) and 2 (b), for convenience, the insulating portion 60 is in contact with the side shield wires 50a and 50b on the side surfaces of the wiring 40, respectively. However, the present embodiment is not limited to this. For example, the insulating portion 60 may be formed on the upper side of the side shield wires 50a and 50b. It is preferable that the wiring 40 and the side shield wires 50a and 50b are filled with an insulating portion 60 without providing a gap. Therefore, in actual manufacturing, the insulating portion 60 is usually formed on the upper side of the side shield wires 50a and 50b. The main reason is that the alignment accuracy when arranging the insulating portion 60 is relaxed.
However, at least a part of the side shield wires 50a and 50b is exposed from the insulating portion 60. This is because the covering shield portion 70 provided next and the side shield wires 50a and 50b are electrically connected.

Further, as shown in FIGS. 1 (b) and 2 (c), the covering shield portion 70 is formed so as to cover the insulating portion 60. The covering shield portion 70 mainly serves as an electromagnetic shield on the upper side of the wiring 40.

In the examples shown in FIGS. 1B and 2C, the covering shield portion 70 is also formed on the upper surfaces of the side surface side shield wires 50a and 50b, and the covering shield portion 70 and the side surface side shield wire are also formed. 50a and 50b are electrically connected.
In the examples shown in FIGS. 1 (b) and 2 (c), the covering shield portion 70 is the upper surface of the side shield wires 50a and 50b continuously in the extending direction of the side shield wires 50a and 50b. However, the present embodiment is not limited to this. At least a part of the covering shield portion 70 and the side surface side shield wires 50a and 50b may be connected.

Since the wiring board 10 has the above-mentioned laminated structure, the wiring 40 can be electromagnetically shielded.

Here, the wiring 40 is provided on the elastic base material 20, and can cope with deformation such as expansion and contraction.
For example, in a state where the base material 20 is contracted, as shown in FIG. 1C, the wiring 40 is based on the mountain portion M and the valley portion V in the normal direction of the first surface 20a of the base material 20. It has a bellows shape that repeatedly appears along the in-plane direction of the first surface 20a of the material 20.

In the example shown in FIG. 1C, the support base material 30 and the respective components constituting the upper laminated structure of the support base material 30 are the methods of the first surface 20a of the base material 20. The mountain portion M and the valley portion V in the linear direction have a bellows shape that repeatedly appears along the in-plane direction of the first surface 20a of the base material 20.

That is, all of the supporting base material 30, the wiring 40, the insulating portion 60, and the covering shield portion 70 shown in FIG. 1 (c) have peaks M and valleys V in the normal direction of the first surface 20a of the base material 20. Has a bellows shape that repeatedly appears along the in-plane direction of the first surface 20a of the base material 20.

Although not shown in FIG. 1C, the side shield wires 50a and 50b provided on the upper side of the support base material 30 and arranged in parallel with the wiring 40 as well as the wiring 40 are also wiring 40. Similarly, the mountain portion M and the valley portion V in the normal direction of the first surface 20a of the base material 20 have a bellows shape that repeatedly appears along the in-plane direction of the first surface 20a of the base material 20.

Since the wiring 40 has the bellows shape as described above, it is possible to prevent the wiring 40 from being broken even if the base material 20 expands and contracts in the wiring board 10.
Further, as described above, since the side shield wires 50a and 50b also have a bellows shape like the wiring 40, in the wiring board 10, even if the base material 20 expands and contracts, the side shield wires 50a and 50b It is possible to avoid disconnection and the like. Then, as described above, at least a part of the covering shield portion 70 and the side surface side shield wires 50a and 50b are connected.
Therefore, by electrically grounding the side shield wires 50a and 50b, it is possible to provide the wiring board 10 in which the wiring 40 provided on the elastic base material 20 is electromagnetically shielded.

Hereinafter, each component of the wiring board 10 will be described in detail.
[Base material]
The base material 20 is a member configured to have elasticity. The base material 20 includes a first surface 20a located on the support base material 30 side and a second surface 20b located on the opposite side of the first surface 20a. In the following description, viewing the wiring board 10 or the components of the wiring board 10 along the normal direction of the first surface 20a as shown in FIG. 1A is also simply referred to as "plan view".

The thickness of the base material 20 is, for example, 10 μm or more and 10 mm or less, and more preferably 20 μm or more and 3 mm or less. By setting the thickness of the base material 20 to 10 μm or more, the durability of the base material 20 can be ensured. Further, by reducing the thickness of the base material 20 to 10 mm or less, the mounting comfort of the wiring board 10 can be ensured. If the thickness of the base material 20 is made too small, the elasticity of the base material 20 may be impaired.

The elasticity of the base material 20 means that the base material 20 can expand and contract, that is, it can be expanded from a normal non-extended state and can be restored when released from this extended state. The property that can be done. The non-extended state is the state of the base material 20 when no tensile stress is applied. In the present embodiment, the stretchable substrate can preferably be stretched by 1% or more from the non-stretched state without being destroyed, more preferably 20% or more, and further preferably 75%. It can be extended as described above. By using the base material 20 having such an ability, the wiring board 10 can have elasticity as a whole. Further, the wiring board 10 can be used in products and applications that require high expansion and contraction, such as being attached to a part of the body such as a human arm.

An example of a parameter representing the elasticity of the base material 20 is the elastic modulus of the base material 20. The elastic modulus of the base material 20 is, for example, 10 MPa or less, more preferably 1 MPa or less. By using the base material 20 having such an elastic modulus, the entire wiring board 10 can be made elastic.

As a method for calculating the elastic modulus of the base material 20, a method of carrying out a tensile test in accordance with JIS K6251 using a sample of the base material 20 can be adopted. It is also possible to adopt a method in which the elastic modulus of the sample of the base material 20 is measured by the nanoindentation method in accordance with ISO14577. A nanoindenter can be used as the measuring instrument used in the nanoindentation method. As a method of preparing a sample of the base material 20, a method of taking out a part of the base material 20 from the wiring board 10 as a sample and a method of taking out a part of the base material 20 before forming the wiring board 10 as a sample can be considered. Be done. In addition, as a method of calculating the elastic modulus of the base material 20, a method of analyzing the materials constituting the base material 20 and calculating the elastic modulus of the base material 20 based on the existing database of the materials is adopted. You can also. The elastic modulus in the present application is an elastic modulus in an environment of 25 ° C.

Examples of the material constituting the base material 20 include an elastomer. Further, as the material of the base material 20, for example, a cloth such as a woven fabric, a knitted fabric, or a non-woven fabric can be used. As the elastomer, general thermoplastic elastomers and thermosetting elastomers can be used, and specifically, polyurethane-based elastomers, styrene-based elastomers, nitrile-based elastomers, olefin-based elastomers, vinyl chloride-based elastomers, ester-based elastomers, etc. Amid-based elastomers, 1,2-BR-based elastomers, fluoroelastomers, silicone rubbers, urethane rubbers, fluororubbers, polybutadienes, polyisobutylenes, polystyrene butadienes, polychloroprenes and the like can be used. Considering mechanical strength and abrasion resistance, it is preferable to use a urethane-based elastomer. Further, the base material 20 may contain silicone such as polydimethylsiloxane. Silicone is excellent in heat resistance, chemical resistance, and flame retardancy, and is preferable as a material for the base material 20.

[Supporting base material]
The support base material 30 is a plate-shaped member configured to have lower elasticity than the base material 20.
In the example shown in FIG. 1, when the direction from the second surface 20b to the first surface 20a in the normal direction of the first surface 20a of the base material 20 is the upper side, the support base material 30 is the wiring 40 on the upper side thereof. Supports. Further, the support base material 30 is joined to the first surface 20a side of the base material 20 on the lower side thereof.

Although not shown, for example, an adhesive layer containing an adhesive may be provided between the base material 20 and the support base material 30. As the material constituting the adhesive layer, for example, an acrylic adhesive, a silicone adhesive, or the like can be used. The thickness of the adhesive layer is, for example, 5 μm or more and 200 μm or less. Further, although not shown, the lower surface of the support base material 30 may be bonded to the first surface 20a of the base material 20 by a method in which the non-adhesive surface is molecularly modified and molecularly adhered and bonded. In this case, the adhesive layer may not be provided between the base material 20 and the support base material 30.

The supporting base material 30 has an elastic modulus larger than that of the base material 20. For example, it is 100 MPa or more, more preferably 1 GPa or more. The elastic modulus of the supporting base material 30 may be 100 times or more and 50,000 times or less, preferably 1000 times or more and 10000 times or less of the elastic modulus of the base material 20.
If the elastic modulus of the support base material 30 is too low, the support base material 30 is likely to be deformed during the process of forming the wiring 40 or the like, and the handling of the support base material 30 in the step of forming a member on the support base material 30 Becomes difficult. Further, if the elastic modulus of the supporting base material 30 is too high, it becomes difficult to restore the base material 20 at the time of relaxation, and the base material 20 is likely to be cracked or broken.

The thickness of the supporting base material 30 is, for example, 500 nm or more and 10 μm or less, more preferably 1 μm or more and 5 μm or less. If the thickness of the support base material 30 is too small, it becomes difficult to handle the support base material 30 in the process of manufacturing the support base material 30 and the process of forming a member on the support base material 30. If the thickness of the supporting base material 30 is too large, it becomes difficult to restore the base material 20 at the time of relaxation, and the target base material 20 cannot be expanded or contracted.

As the material constituting the support base material 30, for example, polyethylene terephthalate, polyethylene naphthalate, polyimide, polycarbonate, acrylic resin and the like can be used.

[wiring]
The wiring 40 is a member that has conductivity and has an elongated shape in a plan view.
As the material of the wiring 40, a material capable of following the expansion and contraction of the base material 20 is used. The material of the wiring 40 may or may not have elasticity by itself.

Examples of the material that can be used for the wiring 40 and does not have elasticity by itself include metals such as gold, silver, copper, aluminum, platinum, and chromium, and alloys containing these metals. When the material of the wiring 40 itself does not have elasticity, a metal film can be used as the wiring 40.

When the material itself used for the wiring 40 has elasticity, the elasticity of the material is similar to, for example, the elasticity of the base material 20. Examples of the material that can be used for the wiring 40 and has elasticity by itself include a conductive composition containing conductive particles and an elastomer.
The conductive particles may be any particles that can be used for wiring, and examples thereof include particles of gold, silver, copper, nickel, palladium, platinum, carbon and the like. Of these, silver particles are preferably used.

Preferably, the wiring 40 has a structure that is resistant to deformation. For example, the wiring 40 has a base material and a plurality of conductive particles dispersed in the base material. In this case, by using a deformable material such as resin as the base material, the wiring 40 can also be deformed according to the expansion and contraction of the base material 20. Further, the conductivity of the wiring 40 can be maintained by setting the distribution and shape of the conductive particles so that the contact between the plurality of conductive particles is maintained even when the deformation occurs. ..

As a material constituting the base material of the wiring 40, general thermoplastic elastomers and thermocurable elastomers can be used. For example, styrene-based elastomers, acrylic-based elastomers, olefin-based elastomers, urethane-based elastomers, silicone rubbers, etc. Elastomer rubber, fluororubber, nitrile rubber, polybutadiene, polychloroprene and the like can be used. Among them, resins and rubbers containing urethane-based and silicone-based structures are preferably used in terms of their elasticity and durability.

The thickness of the wiring 40 may be a thickness that can withstand the expansion and contraction of the base material 20, and is appropriately selected depending on the material of the wiring 40 and the like.
For example, when the material of the wiring 40 does not have elasticity, the thickness of the wiring 40 can be in the range of 25 nm or more and 100 μm or less, preferably in the range of 50 nm or more and 50 μm or less, and preferably 100 nm or more and 5 μm. It is more preferably within the following range.
When the material of the wiring 40 has elasticity, the thickness of the wiring 40 can be in the range of 5 μm or more and 60 μm or less, preferably in the range of 10 μm or more and 50 μm or less, and 20 μm or more and 40 μm or less. It is more preferable that it is within the range.

The width of the wiring 40 is appropriately selected according to the resistance value required for the wiring 40. In the present embodiment, the width of the wiring 40 is, for example, 1 μm or more, preferably 50 μm or more. The width of the wiring 40 is, for example, 10 mm or less, preferably 1 mm or less.

The method for forming the wiring 40 is appropriately selected depending on the material and the like. For example, a method of forming a metal film on the support base material 30 by a vapor deposition method, a sputtering method, or the like and then patterning the metal film by a photolithography method can be mentioned. When the material of the wiring 40 itself has elasticity, for example, a method of printing the conductive composition containing the above-mentioned conductive particles and elastomer in a pattern on the support base material 30 by a general printing method. Can be mentioned. Moreover, you may use a plating method.

[Side shield wire]
The side shield wires 50a and 50b have conductivity, are provided above the support base material 30 in the example shown in FIG. 1, and are arranged in parallel with the wiring 40.

As the material of the side shield wires 50a and 50b, a material capable of following the expansion and contraction of the base material 20 is used as in the wiring 40 described above. In the present embodiment, it is preferable that the wiring 40 and the side shield wires 50a and 50b are made of the same material. In this case, since the wiring 40 and the side shield wires 50a and 50b can be formed in the same manufacturing process, it is effective in shortening the manufacturing process and reducing the cost. Further, in this case, the wiring 40 and the side shield wires 50a and 50b usually have the same thickness.

In the present embodiment, the wiring 40 and the side shield wires 50a and 50b may be made of different materials. Since the wiring 40 transmits an electric signal, reliability and the like are required. However, the side shielded wires 50a and 50b may act as electromagnetic shields on the side surface of the wiring 40, and are cheaper than the wiring 40, for example. Material may be used.

In the example shown in FIG. 1, the widths of the side shield wires 50a and 50b may be any as long as they act as an electromagnetic shield on the side surface of the wiring 40, and are, for example, 1 μm or more, preferably 50 μm or more. The width of the side shield wires 50a and 50b is, for example, 10 mm or less, preferably 1 mm or less.

The method for forming the side shield wires 50a and 50b is appropriately selected depending on the material and the like. For example, a method of forming a metal film on the support base material 30 by a vapor deposition method, a sputtering method, or the like and then patterning the metal film by a photolithography method can be mentioned. When the materials of the side shield wires 50a and 50b themselves have elasticity, for example, a conductive composition containing the above-mentioned conductive particles and elastomer is patterned on the supporting base material 30 by a general printing method. There is a method of printing in a form. Moreover, you may use a plating method.

[Insulation part]
The insulating portion 60 mainly has an action of electrically insulating the wiring 40 and the covering shield portion 70.
Further, in the present embodiment, the insulating portion 60 also has an action of preventing the wiring 40, which is deformed due to expansion and contraction of the base material 20, from being broken, that is, an action of reinforcing the mechanical strength of the wiring 40.
The insulating portion 60 is positioned so as to overlap at least the wiring 40 in a plan view. In addition, "overlapping" means that the two components overlap when viewed along the normal direction of the first surface 20a of the base material 20.

The insulating portion 60 may have an elastic modulus larger than that of the base material 20. The elastic modulus of the insulating portion 60 is, for example, 10 GPa or more and 500 GPa or less, and more preferably 1 GPa or more and 300 GPa or less.
If the elastic modulus of the insulating portion 60 is too low, it may not be possible to prevent the wiring 40, which is deformed due to the expansion and contraction of the base material 20, from being broken. Further, if the elastic modulus of the insulating portion 60 is too high, the insulating portion 60 may be damaged in structure such as cracks and cracks when the base material 20 expands and contracts.
The elastic modulus of the insulating portion 60 may be 1.1 times or more and 5000 times or less of the elastic modulus of the base material 20, and more preferably 10 times or more and 3000 times or less.

The method for calculating the elastic modulus of the insulating portion 60 is appropriately determined according to the form of the insulating portion 60. For example, the method of calculating the elastic modulus of the insulating portion 60 may be the same as or different from the method of calculating the elastic modulus of the base material 20 described above. For example, as a method of calculating the elastic modulus of the insulating portion 60, a method of performing a tensile test in accordance with ASTM D882 using a sample of the insulating portion 60 can be adopted.

The characteristic of the insulating portion 60 may be expressed by flexural rigidity instead of the elastic modulus. The moment of inertia of area of the insulating portion 60 is calculated based on the cross section when the insulating portion 60 is cut by a plane orthogonal to the expansion / contraction direction of the wiring board 10. The bending rigidity of the insulating portion 60 may be 1.1 times or more, more preferably 2 times or more, and further preferably 10 times or more the bending rigidity of the base material 20.

As a material constituting the insulating portion 60, a general thermoplastic elastomer, an acrylic-based, urethane-based, epoxy-based, polyester-based, epoxy-based, vinyl ether-based, polyene-thiol-based or silicone-based oligomer, polymer, or the like is used. You may.
The thickness of the insulating portion 60 is, for example, 1 μm or more and 3 mm or less, and more preferably 10 μm or more and 500 μm or less.

The method for forming the insulating portion 60 is appropriately selected depending on the material and the like. For example, a method of forming the wiring 40 on the support base material 30 and then printing the material constituting the insulating portion 60 on the wiring 40 by a printing method can be mentioned.

[Covered shield]
The covering shield portion 70 mainly serves as an electromagnetic shield on the upper side of the wiring 40.
The covering shield portion 70 has conductivity and is formed so as to cover the insulating portion 60 in the example shown in FIG. Further, in the example shown in FIG. 1, the covering shield portion 70 is also formed on the upper surface of the side surface side shield wires 50a and 50b, and the covering shield portion 70 and the side surface side shield wires 50a and 50b are electrically connected to each other. Is connected to.

As the material of the covering shield portion 70, a material capable of following the expansion and contraction of the base material 20 is used as in the case of the wiring 40 described above.
Here, when the covering shield portion 70 and the side surface side shield wires 50a and 50b are made of the same metal material, for example, as shown in FIGS. 1 (a) and 1 (b), the side surface side shield wires 50a, The upper surface of 50b is covered with the covering shield portion 70. This is because the side shield wires 50a and 50b are also etched when the coated shield portion 70 is formed into a desired form by etching.

In the present embodiment, the covering shield portion 70 and the side shield wires 50a and 50b may be made of different materials.
For example, the wiring 40 is required to have reliability because it transmits an electric signal. As described above, forming the wiring 40 and the side shield wires 50a and 50b in the same manufacturing process shortens the manufacturing process. Since it is effective in reducing costs, the wiring 40 and the side shield wires 50a and 50b are often made of the same material.
On the other hand, since the covering shield portion 70 is formed in a different process from the wiring 40, it is not necessary to use the same material as the wiring 40. Further, the covering shield portion 70 may act as an electromagnetic shield on the upper side of the wiring 40, and for example, a material cheaper than the wiring 40 may be used.

The thickness of the covering shield portion 70 may act as an electromagnetic shield on the upper side of the wiring 40 and may be thick enough to withstand the expansion and contraction of the base material 20, and is appropriately suitable depending on the material of the covering shield portion 70 and the like. Be selected.
For example, when the material of the covering shield portion 70 does not have elasticity, the thickness of the covering shield portion 70 can be in the range of 25 nm or more and 100 μm or less, and preferably in the range of 50 nm or more and 50 μm or less. , 100 nm or more and 5 μm or less is more preferable.
When the material of the covering shield portion 70 has elasticity, the thickness of the covering shield portion 70 can be in the range of 5 μm or more and 60 μm or less, preferably in the range of 10 μm or more and 50 μm or less, and is preferably 20 μm. It is more preferably within the range of 40 μm or more.

The method for forming the covering shield portion 70 is appropriately selected depending on the material and the like. For example, a method of forming a metal film by a vapor deposition method, a sputtering method, or the like and then patterning the metal film by a photolithography method can be mentioned. When the material of the coating shield portion 70 itself has elasticity, for example, a method of printing the conductive composition containing the above-mentioned conductive particles and elastomer in a pattern by a general printing method can be mentioned. Moreover, you may use a plating method.

(Manufacturing method of wiring board 10)
Hereinafter, a method for manufacturing the wiring board 10 will be described with reference to FIGS. 1, 2 and 3 (a) to 3 (d).

First, as shown in FIG. 2A, the support base material 30 is prepared, and a wiring formation step of forming the wiring 40 and the side shield wires 50a and 50b on the upper side of the support base material 30 is carried out.
Next, as shown in FIG. 2 (b), an insulating portion forming step of forming the insulating portion 60 covering the wiring 40 is performed, and then, as shown in FIG. 2 (c), a covering shield covering the insulating portion 60 is performed. A coating shield portion forming step for forming the portion 70 is carried out.
In this way, as shown in FIG. 3A, the laminated structure on the upper side of the support base material 30 is obtained.

Subsequently, as shown in FIG. 3B, a base material stretching step of applying tensile stress T to the separately prepared base material 20 to stretch the base material 20 is carried out. The elongation rate of the base material 20 is, for example, 10% or more and 200% or less. The base material stretching step may be carried out in a state where the base material 20 is heated, or may be carried out at room temperature. When the base material 20 is heated, the temperature of the base material 20 is, for example, 50 ° C. or higher and 100 ° C. or lower.

Subsequently, as shown in FIG. 3C, the supporting base material 30 provided with the laminated structure shown in FIG. 3A on the first surface 20a side of the base material 20 in a state of being stretched by the tensile stress T. The support base material joining step of joining is carried out. At this time, an adhesive layer may be provided between the base material 20 and the support base material 30.

Then, a base material shrinkage step of removing the tensile stress T from the base material 20 is carried out. As a result, as shown in FIG. 3D, the base material 20 contracts in the direction indicated by the arrow C (the direction opposite to the tensile direction of the tensile stress T applied to the base material 20 in FIG. 3B). To do.
As the base material 20 shrinks, the support base material 30 and the respective components constituting the upper laminated body of the support base material 30 are all in the normal direction of the first surface 20a of the base material 20. The mountain portion M and the valley portion V have a bellows shape that repeatedly appears along the in-plane direction of the first surface 20a of the base material 20.
The wiring board 10 can be obtained by going through the above steps.

<Second embodiment>
Next, a second embodiment of the present disclosure will be described.
The wiring board of the second embodiment of the present disclosure has a configuration in which, for example, in the wiring board of the first embodiment described above, the wirings intersect and one wiring straddles the upper side of the other wiring. This is the form of the case.

That is, the wiring board of the second embodiment of the present disclosure includes two wirings 40a and 40b in which the wirings 40 are a pair in the wiring board of the first embodiment described above, and is provided above the insulating portion 60. A bridge wiring 80 for connecting the two pairs of wirings 40a and 40b is provided, and the insulating portion 60 around the bridge wiring 80 has an insulating portion exposed region 63 exposed from the covering shield portion 70, and is a base. When viewed along the normal direction of the first surface 20a of the material 20, through holes 62a and 62b are formed in the insulating portion 60 in the region where each of the pair of two wirings 40a and 40b and the bridge wiring 80 overlap. Is provided, and the bridge wiring 80 is connected to each of the pair of two wirings 40a and 40b through the through holes 62a and 62b.

FIG. 4 is a diagram showing an example of a wiring board according to a second embodiment of the present disclosure, and is mainly a plan view showing a configuration of a portion where wiring intersects.
Here, FIG. 4 also describes a laminated structure hidden by the covering shield portions 70 (70a, 70b, 70c, 70d), as in FIG. 2 in the first embodiment.
That is, FIG. 4A is a plan view showing the arrangement relationship between the wirings 40 (40a, 40b), 41 provided on the upper side of the support base material and the side shield wires 51, 52, 53, 54.
Further, FIG. 4B shows the insulating portion 60 provided on the upper side of the wiring 40 (40a, 40b), 41, the wiring 40 (40a, 40b), 41, and the side shield wires 51, 52, 53, 54. It is a top view which shows the arrangement relation with.
Further, FIG. 4C is a plan view showing the arrangement relationship of the covering shield portion 70 (70a, 70b, 70c, 70d) provided on the upper side of the insulating portion 60, the bridge wiring 80, and the insulating portion exposed region 63. ..

Also in the wiring board of the second embodiment of the present disclosure, similarly to the wiring board of the first embodiment described above, the order of FIGS. 4 (a), 4 (b), and 4 (c). , Wiring 40 (40a, 40b), 41, side shield wires 51, 52, 53, 54, insulating portion 60, coated shield portion 70 (70a, 70b, 70c, 70d), and bridge wiring 80 are formed.

First, as shown in FIG. 4A, in the present embodiment, the wiring 40 includes two pairs of wirings 40a and 40b.
Since the wiring 40 intersects the wiring 41, the wiring 40 is separated into a pair of two wirings 40a and 40b, and the ends of the two wirings 40a and 40b are connected by a bridge wiring 80 described later.
Corresponding side shield wires 51, 52, 53, and 54 are arranged on both sides of the wiring 40 and the wiring 41, respectively.

Next, as shown in FIG. 4B, the insulating portion 60 is formed so as to cover the wiring 40 (40a, 40b) and the wiring 41. At least a part of the side shield wires 51, 52, 53, 54 is exposed from the insulating portion 60.

Here, in the present embodiment, the insulating portion 60 is provided with through holes 62a and 62b. Then, through the through holes 62a and 62b, each of the pair of two wirings 40a and 40b and the bridge wiring 80 are connected.

Further, as shown in FIG. 4C, the covering shield portion 70 is formed so as to cover the insulating portion 60. Further, the bridge wiring 80 is formed so as to connect to each of the two wirings 40a and 40b through the through holes 62a and 62b.
Here, in the present embodiment, the insulating portion 60 around the bridge wiring 80 is an insulating portion exposed region 63 exposed from the covering shield portion 70. Since it has such a configuration, the bridge wiring 80 and the covering shield portion 70 are insulated from each other.

Here, in the present embodiment, the bridge wiring 80 and the covering shield portion 70 can be made of the same material. In this case, since the bridge wiring 80 and the covering shield portion 70 can be formed in the same manufacturing process, it is effective in shortening the manufacturing process and reducing the cost.
In this case, the bridge wiring 80 and the covering shield portion 70 usually have the same thickness.

In the present embodiment, the bridge wiring 80 and the covering shield portion 70 may be made of different materials.

Further, also in the wiring board 11 of the present embodiment, similarly to the wiring board 10 of the first embodiment described above, the support base material 30 and the respective components constituting the laminated structure on the upper side of the support base material 30 are also formed. However, both have a bellows shape in which the peaks M and valleys V in the normal direction of the first surface 20a of the base material 20 repeatedly appear along the in-plane direction of the first surface 20a of the base material 20 (). See FIG. 1 (c)).

That is, the support base material 30, the wiring 40 (40a, 40b), 41, the side shield wires 51, 52, 53, 54, the insulating portion 60, the covering shield portion 70 (70a, 70b, 70c, 70d) and the bridge wiring 80. Each of the above has a bellows shape in which the peaks M and valleys V in the normal direction of the first surface 20a of the base material 20 repeatedly appear along the in-plane direction of the first surface 20a of the base material 20. ing.

In the present embodiment, in the method for manufacturing the wiring board illustrated in FIG. 3, the base material 20 is stretched in the direction in which at least the wiring 40 and the wiring 41 are stretched, and the base material in the stretched state is stretched. The support base material 30 in which each of the above configurations is laminated is joined to 20.
Therefore, in a state where the tensile stress T is removed and the base material 20 is contracted, the bellows shape of the wiring 40 (40a, 40b) and the wiring 41 is such that the peaks M and valleys V of each wiring are the wiring. It becomes a bellows shape that appears repeatedly along the extending direction of.
The same applies to the side shield wires 51, 52, 53, 54, the insulating portion 60, the coated shield portion 70 (70a, 70b, 70c, 70d) and the bridge wiring 80.

Since it has the above configuration, even in the present embodiment, it is possible to prevent the wiring 40, 41 and the side shield wires 51, 52, 53, 54 from being disconnected even if the base material 20 expands and contracts. Then, as described above, at least a part of the covering shield portion 70 and the side surface side shield wires 51, 52, 53, 54 are connected.
Therefore, by electrically grounding the side shield wires 51, 52, 53, 54, it is possible to apply an electromagnetic shield to the wirings 40, 41.
That is, according to the present embodiment, it is possible to provide a wiring board capable of applying an electromagnetic shield to the wiring provided on the stretchable base material even in a form in which the wiring intersects.

(Manufacturing method of wiring board 11)
As a method of manufacturing the wiring board 11 shown in FIG. 4 (c), for example, in the wiring forming step in the method of manufacturing the wiring board 10 of the first embodiment described above, FIG. 4 (a) is placed above the support base material 30. ), The wirings 40, 41 including two pairs of wirings (40a, 40b) and the side shield wires 51, 52, 53, 54 are formed, and in the next insulating portion forming step, the insulating portion is formed. 60 is formed, and as shown in FIG. 4B, through holes 62a and 62b are provided in the insulating portion 60.

Then, in the subsequent coating shield portion forming step, as shown in FIG. 4C, the coating shield portion 70 (70a, 70b, 70c, 70d) and the bridge wiring 80 are formed, and the insulating portion around the bridge wiring 80 is formed. 60 forms an insulating portion exposed region 63 exposed from the covering shield portion 70 (70a, 70b, 70c, 70d), and a part of the bridge wiring 80 is formed in the through holes 62a, 62b to form a pair of 2 Each of the wirings (40a, 40b) of the book and the bridge wiring 80 are connected.

After that, the wiring board 11 is carried out by carrying out the base material extension step, the support base material joining step, and the base material shrinkage step in the same manner as the manufacturing method of the wiring board 10 of the first embodiment illustrated in FIG. Can be obtained.

In the manufacturing of the wiring board 11, in the method of manufacturing the wiring board illustrated in FIG. 3, the base material 20 is stretched in the direction in which at least the wiring 40 and the wiring 41 are stretched, and the base 20 is stretched. The support base material 30 in which each of the above configurations is laminated is joined to the material 20.

<Third embodiment>
Next, a third embodiment of the present disclosure will be described.
In the wiring board of the third embodiment of the present disclosure, the base material has conductivity, and this base material acts as an electromagnetic shield under the wiring.

That is, in the wiring board of the third embodiment of the present disclosure, in the wiring board of the first embodiment or the second embodiment described above, the base material has conductivity and the supporting base material has a penetration portion. However, it has a structure in which the base material and the side shield wire are connected through this penetrating portion.

FIG. 5 is a diagram showing an example of the wiring board according to the third embodiment of the present disclosure, and similarly to FIG. 1 (b) above, the configuration of the wiring board in a cross section perpendicular to the direction in which the wiring extends. It is sectional drawing which shows.

In the wiring board 12 shown in FIG. 5, the support base material 31 has through portions 31a and 31b, and the base material 21 and the side shield wires 55a and 55b are connected to each other through the through portions 31a and 31b. There is.
Here, at least a part of the base material 21 and the side surface side shield wires 55a and 55b may be connected. Therefore, the penetrating portions 31a and 31b need not be continuously formed with the same length as the side shield wires 55a and 55b in the extending direction of the side shield wires 55a and 55b, and are partially provided. You may. For example, the penetrating portions 31a and 31b may be provided at regular intervals in the extending direction of the side shield wires 55a and 55b.

And the base material 21 has conductivity. For example, the base material 21 contains conductive particles in the material constituting the base material 20 of the first embodiment described above. Examples of the conductive particles include particles of gold, silver, copper, nickel, palladium, platinum, carbon and the like.

Since it has the above configuration, in the wiring board 12, the base material 21 acts as an electromagnetic shield under the wiring 40.
That is, in the wiring board 12, in addition to the effect of the wiring board 10 of the first embodiment described above, an electromagnetic shield can be applied to the lower side of the wiring.

More specifically, since the wiring board 12 shown in FIG. 5 has a coated shield portion 70, side shield wires 55a and 55b, and a conductive base material 21, the wiring 40 is above and on the side surface side thereof. , Electromagnetic shielding can be applied in all directions on the lower side.

Further, also in the wiring board 12 shown in FIG. 5, similarly to the wiring board 10 of the first embodiment described above, even if the base material 21 expands and contracts, the wiring 40 and the side shield wires 55a and 55b are disconnected. You can avoid that. Further, since the base material 21 acting as an electromagnetic shield under the wiring 40 has elasticity, it is not easily damaged by its own expansion and contraction. Then, as described above, at least a part of the covering shield portion 70 and the side surface side shield wires 55a and 55b are connected, and the side surface side shield wires 55a and 55b and the base material 21 pass through the penetration portions 31a and 31b. You are connected.

Therefore, the wiring 40 can be electromagnetically shielded by electrically grounding any of the side shield wires 55a and 55b or the base material 21.
That is, also in the present embodiment, it is possible to provide a wiring board capable of applying an electromagnetic shield to the wiring provided on the elastic base material.

(Manufacturing method of wiring board 12)
As a method for manufacturing the wiring board 12 shown in FIG. 5, for example, the following method can be adopted.
First, in the same manner as in the wiring forming step in the method for manufacturing the wiring board 10 of the first embodiment, the wiring 40 and the side shield wires 55a and 55b are placed on the upper side of the support base material 31 having the through portions 31a and 31b. And a part of the side shield wires 55a and 55b are formed in the penetrating portions 31a and 31b.
Further, in the same manner as in the support base material joining step in the method for manufacturing the wiring board 10 of the first embodiment, the support base material 31 is joined to the first surface 21a side of the stretched base material 21. The base material 21 and a part of the side shield wires 55a and 55b formed in the penetrating portions 31a and 31b are connected to each other.

The wiring board 12 can be obtained by carrying out each of the other steps in the same manner as in the manufacturing method of the wiring board 10 of the first embodiment described above.

<Fourth Embodiment>
Next, a fourth embodiment of the present disclosure will be described.
In the wiring board of the fourth embodiment of the present disclosure, a conductive layer is provided between the base material and the supporting base material, and this conductive layer acts as an electromagnetic shield under the wiring.

That is, the wiring board of the fifth embodiment of the present disclosure includes a conductive layer located between the base material and the supporting base material in the wiring board of the first embodiment or the second embodiment described above. The supporting base material has a penetrating portion, and the conductive layer and the side shield wire are connected to each other through the penetrating portion.

FIG. 6 is a diagram showing an example of the wiring board according to the fourth embodiment of the present disclosure, and similarly to FIG. 1 (b) above, the configuration of the wiring board in a cross section perpendicular to the direction in which the wiring extends. It is sectional drawing which shows.

As shown in FIG. 6, the wiring board 13 includes a conductive layer 90 between the base material 20 and the support base material 31, and the support base material 31 has through portions 31a and 31b, and the through portions 31a, Through 31b, the conductive layer 90 and the side shield wires 55a and 55b are connected.
Here, at least a part of the conductive layer 90 and the side shield wires 55a and 55b may be connected. Therefore, the penetrating portions 31a and 31b need not be continuously formed with the same length as the side shield wires 55a and 55b in the extending direction of the side shield wires 55a and 55b, and are partially provided. You may. For example, the penetrating portions 31a and 31b may be provided at regular intervals in the extending direction of the side shield wires 55a and 55b.

Since it has the above configuration, the conductive layer 90 acts as an electromagnetic shield under the wiring 40 in the wiring board 13.
That is, in the wiring board 13, in addition to the effect of the wiring board 10 of the first embodiment described above, an electromagnetic shield can be applied to the lower side of the wiring.

More specifically, since the wiring board 13 shown in FIG. 6 has a coated shield portion 70, side shield wires 55a and 55b, and a conductive layer 90, the wiring 40 is on the upper side, the side surface side, and the lower side of the wiring 40. Electromagnetic shielding can be applied in all directions.

Further, also in the wiring board 13 shown in FIG. 6, similarly to the wiring board 10 of the first embodiment described above, even if the base material 20 expands and contracts, the wiring 40 and the side shield wires 55a and 55b are broken. You can avoid that.

Further, in the conductive layer 90 of the wiring board 13, the peaks M and valleys V in the normal direction of the first surface 20a of the base material 20 repeatedly appear along the in-plane direction of the first surface 20a of the base material 20. It can be in the form of having a shape. Therefore, it is possible to prevent the conductive layer 90 from being damaged even if the base material 20 expands and contracts.

Further, since the conductive layer 90 has a larger area than the wiring 40 and the side shield wires 55a and 55b, even if a part of the conductive layer 90 is damaged, the other undamaged part can be sufficiently effective as an electromagnetic shield. Is. Further, the conductive layer 90 may be made of a material having conductivity and acting as an electromagnetic shield, and may be made of a material having higher elasticity than the material constituting the wiring 40.

Then, as described above, at least a part of the covering shield portion 70 and the side surface side shield wires 55a and 55b are connected, and the side surface side shield wires 55a and 55b and the conductive layer 90 pass through the through portions 31a and 31b. You are connected.

Therefore, the wiring 40 can be electromagnetically shielded by electrically grounding any of the side shield wires 55a and 55b or the conductive layer 90.
That is, also in the present embodiment, it is possible to provide a wiring board capable of applying an electromagnetic shield to the wiring provided on the elastic base material.

As the material of the conductive layer 90, a material capable of following the expansion and contraction of the base material 20 is used. The material of the conductive layer 90 may or may not have elasticity by itself.

Examples of the material that can be used for the conductive layer 90 and does not have elasticity by itself include metals such as gold, silver, copper, aluminum, platinum, and chromium, and alloys containing these metals. When the material of the conductive layer 90 itself does not have elasticity, a metal film can be used as the conductive layer 90.

When the material itself used for the conductive layer 90 has elasticity, the elasticity of the material is similar to, for example, the elasticity of the base material 20. Examples of the material that can be used for the conductive layer 90 and has elasticity by itself include a conductive composition containing conductive particles and an elastomer. The conductive particles may be any particles that can be used for wiring, and examples thereof include particles of gold, silver, copper, nickel, palladium, platinum, carbon and the like. Of these, silver particles are preferably used.

Preferably, the conductive layer 90 has a structure that is resistant to deformation. For example, the conductive layer 90 has a base material and a plurality of conductive particles dispersed in the base material. In this case, by using a deformable material such as resin as the base material, the conductive layer 90 can also be deformed according to the expansion and contraction of the base material 20. Further, the conductivity of the conductive layer 90 can be maintained by setting the distribution and shape of the conductive particles so that the contact between the plurality of conductive particles is maintained even when deformation occurs. it can.

As a material constituting the base material of the conductive layer 90, general thermoplastic elastomers and thermosetting elastomers can be used. For example, styrene-based elastomers, acrylic-based elastomers, olefin-based elastomers, urethane-based elastomers, and silicone rubbers. , Elastomer rubber, fluororubber, nitrile rubber, polybutadiene, polychloroprene and the like can be used. Among them, resins and rubbers containing urethane-based and silicone-based structures are preferably used in terms of their elasticity and durability.

The thickness of the conductive layer 90 may be a thickness that can withstand the expansion and contraction of the base material 20, and is appropriately selected depending on the material of the conductive layer 90 and the like.
For example, when the material of the conductive layer 90 does not have elasticity, the thickness of the conductive layer 90 can be in the range of 25 nm or more and 100 μm or less, preferably in the range of 50 nm or more and 50 μm or less, preferably 100 nm. It is more preferably within the range of 5 μm or less.
When the material of the conductive layer 90 has elasticity, the thickness of the conductive layer 90 can be in the range of 5 μm or more and 60 μm or less, preferably in the range of 10 μm or more and 50 μm or less, and 20 μm or more and 40 μm. It is more preferably within the following range.

The method for forming the conductive layer 90 is appropriately selected depending on the material and the like. For example, a method of forming a metal film on the first surface 20a of the base material 20 or the lower surface of the support base material 31 by a vapor deposition method, a sputtering method, or the like can be mentioned. When the material of the conductive layer 90 itself has elasticity, for example, the above-mentioned conductive particles and elastomer are applied to the first surface 20a of the base material 20 or the lower surface of the support base material 31 by a general printing method. Examples thereof include a method of printing the conductive composition contained therein. Moreover, you may use a plating method.

(Manufacturing method of wiring board 13)
As a method for manufacturing the wiring board 13 shown in FIG. 6, for example, the following method can be adopted.
First, in the wiring forming step in the method for manufacturing the wiring board 10 of the first embodiment, the wiring 40 and the side shield wires 55a and 55b are formed, and the side shield wires 55a and 55b are formed in the through portions 31a and 31b. Form a part of.
Further, between the base material stretching step and the supporting base material joining step in the method for manufacturing the wiring board 10 of the first embodiment, the conductive layer 90 is provided on the first surface 20a side of the stretched base material 20. The conductive layer forming step to be formed is carried out.
Then, in the support base material joining step in the method for manufacturing the wiring board 10 of the first embodiment, the conductive layer 90 and the support base material 31 formed on the first surface 20a side of the stretched base material 20 are formed. At the same time as joining, the conductive layer 90 and a part of the side shield wires 55a and 55b formed in the penetrating portions 31a and 31b are connected.

The wiring board 13 can be obtained by carrying out each of the other steps in the same manner as in the manufacturing method of the wiring board 10 of the first embodiment described above.

Further, as another manufacturing method, the following method may be adopted.
First, the conductive layer forming step of forming the conductive layer 90 on the lower surface of the support base material 31 is carried out before the wiring forming step in the method of manufacturing the wiring board 10 of the first embodiment.
Further, in the wiring forming step in the method for manufacturing the wiring board 10 of the first embodiment, the wiring 40 and the side shield wires 55a and 55b are formed, and the side shield wires 55a and 55b are formed in the through portions 31a and 31b. A part of the side shield wires 55a and 55b formed in the penetrating portions 31a and 31b is connected to the conductive layer 90.
Then, in the support base material joining step in the method for manufacturing the wiring board 10 of the first embodiment, the support base material 31 having the conductive layer 90 formed on the first surface 20a side of the stretched base material 20. The conductive layer 90 side is joined.

The wiring board 13 can be obtained by carrying out each of the other steps in the same manner as in the manufacturing method of the wiring board 10 of the first embodiment described above.

Further, as another manufacturing method, the following method may be adopted.
First, in the wiring forming step in the method for manufacturing the wiring board 10 of the first embodiment, the wiring 40 and the side shield wires 55a and 55b are formed, and the side shield wires 55a and 55b are formed in the through portions 31a and 31b. Form a part of.
Further, after this wiring forming step and before the supporting base material joining step in the manufacturing method of the wiring substrate 10 of the first embodiment described above, the conductive layer 90 is formed on the lower surface of the supporting base material 31. Then, a conductive layer forming step of connecting a part of the side shield wires 55a and 55b formed in the penetrating portions 31a and 31b to the conductive layer 90 is carried out.
Then, in the support base material joining step in the method for manufacturing the wiring board 10 of the first embodiment, the support base material 31 having the conductive layer 90 formed on the first surface 20a side of the stretched base material 20. The conductive layer 90 side is joined.

The wiring board 13 can be obtained by carrying out each of the other steps in the same manner as in the manufacturing method of the wiring board 10 of the first embodiment described above.

<Fifth Embodiment>
Next, a fifth embodiment of the present disclosure will be described.
The wiring board of the fifth embodiment of the present disclosure is the wiring board of the third embodiment described above, in which the covering shield portion and the base material are directly connected to each other without passing through the side shield wire.

That is, the wiring board of the fifth embodiment of the present disclosure includes a first surface and a second surface located on the opposite side of the first surface, and has an elastic base material and the first surface of the base material. Provided on the upper side of the support base material when the support base material located on the surface side and the direction from the second surface to the first surface in the normal direction of the first surface of the base material are on the upper side. The wiring is provided, an insulating portion covering the wiring, and a covering shield portion covering the insulating portion are provided, the substrate has conductivity, the supporting base material has a penetrating portion, and the penetrating portion is passed through. , The base material and the coating shield portion are connected, and in the wiring, the peaks and valleys in the normal direction of the first surface of the base material are in the plane of the first surface of the base material. A wiring board having a bellows shape that repeatedly appears along the direction.

FIG. 7 is a diagram showing an example of the wiring board of the fifth embodiment of the present disclosure, and similarly to FIG. 1 (b) above, the configuration of the wiring board in the cross section perpendicular to the direction in which the wiring extends is configured. It is sectional drawing which shows.

The difference between the wiring board 14 shown in FIG. 7 and the wiring board 12 shown in FIG. 5 is that the wiring board 14 shown in FIG. 7 is provided with the side shield wires 55a and 55b of the wiring board 12 shown in FIG. The point is that the base material 21 and the covering shield portion 71 are directly connected to each other through the penetrating portions 31a and 31b.
Here, at least a part of the base material 21 and the covering shield portion 71 may be connected. Therefore, also in the wiring board 14 shown in FIG. 7, the penetrating portions 31a and 31b are continuous in the extending direction of the covering shield portion 71 with the same length as the covering shield portion 71, as in the wiring board 12 shown in FIG. It does not have to be formed in, and may be partially provided. For example, the penetrating portions 31a and 31b may be provided at regular intervals in the extending direction of the covering shield portion 71.

As described above, in the wiring board 14 shown in FIG. 7, the base material 21 and the covering shield portion 71 are connected to each other through the penetrating portions 31a and 31b. Therefore, by electrically grounding the base material 21, the wiring board 14 shown in FIG. 7 can be electromagnetically shielded as well as the wiring board 12 shown in FIG.
Further, in the wiring board 14 shown in FIG. 7, similarly to the wiring board 12 shown in FIG. 5, it is possible to prevent the wiring 40 from being broken even if the base material 21 expands and contracts.
That is, also in the present embodiment, it is possible to provide a wiring board capable of applying an electromagnetic shield to the wiring provided on the elastic base material.

(Manufacturing method of wiring board 14)
As a method for manufacturing the wiring board 14 shown in FIG. 7, for example, the following method can be adopted.
First, the support base material 31 having the penetrating portions 31a and 31b is prepared, and a wiring formation step of forming the wiring 40 on the upper side of the support base material 31 is carried out.
Next, an insulating portion forming step of forming the insulating portion 60 covering the wiring 40 is carried out, and then a part of the covering shield portion 71 is formed in the penetrating portions 31a and 31b while forming the covering shield portion 71 covering the insulating portion 60. The step of forming the covering shield portion for forming the above is carried out.

Subsequently, a base material stretching step of applying a tensile stress T to the separately prepared base material 21 to extend the base material 21 is carried out. The elongation rate of the base material 21 is, for example, 10% or more and 200% or less. The base material stretching step may be carried out in a state where the base material 21 is heated, or may be carried out at room temperature. When the base material 21 is heated, the temperature of the base material 21 is, for example, 50 ° C. or higher and 100 ° C. or lower.

Subsequently, the supporting base material 31 subjected to the above-mentioned coating shield portion forming step is joined to the first surface 21a side of the base material 21 stretched by the tensile stress T, and the base material 21 and the penetrating parts 31a and 31b are joined. A support base material joining step for connecting a part of the covering shield portion 71 formed in the above is carried out.

Then, a base material shrinkage step of removing the tensile stress T from the base material 21 is carried out. As the base material 21 shrinks, the support base material 31 and the respective components constituting the upper laminated body of the support base material 31 are all in the normal direction of the first surface 21a of the base material 21. The mountain portion M and the valley portion V have a bellows shape that repeatedly appears along the in-plane direction of the first surface 21a of the base material 21.
The wiring board 14 can be obtained through the above steps.

<Sixth Embodiment>
Next, a sixth embodiment of the present disclosure will be described.
The wiring board of the sixth embodiment of the present disclosure is the wiring board of the fourth embodiment described above, in which the covering shield portion and the conductive layer 90 are directly connected without passing through the side shield wire. ..

That is, the wiring substrate of the sixth embodiment of the present disclosure includes a first surface and a second surface located on the opposite side of the first surface, and has an elastic base material and the first surface of the base material. Provided on the upper side of the support base material when the support base material located on the surface side and the direction from the second surface to the first surface in the normal direction of the first surface of the base material are on the upper side. The wiring is provided, an insulating portion covering the wiring, a covering shield portion covering the insulating portion, and a conductive layer located between the base material and the supporting base material, and the supporting base material penetrates the wiring. The covering shield portion and the conductive layer are connected to each other through the penetrating portion, and the wiring is based on the mountain portion and the valley portion in the normal direction of the first surface of the base material. It is a wiring substrate having a bellows shape that repeatedly appears along the in-plane direction of the first surface of the material.

FIG. 8 is a diagram showing an example of the wiring board according to the sixth embodiment of the present disclosure, and similarly to FIG. 1 (b) above, the configuration of the wiring board in a cross section perpendicular to the direction in which the wiring extends. It is sectional drawing which shows.

The difference between the wiring board 15 shown in FIG. 8 and the wiring board 13 shown in FIG. 6 is that the wiring board 15 shown in FIG. 8 is provided with the side shield wires 55a and 55b of the wiring board 13 shown in FIG. The point is that the conductive layer 90 and the covering shield portion 71 are connected to each other through the penetrating portions 31a and 31b.
Here, at least a part of the conductive layer 90 and the covering shield portion 71 may be connected. Therefore, also in the wiring board 15 shown in FIG. 8, the penetrating portions 31a and 31b are continuous with the same length as the covering shield portion 71 in the extending direction of the covering shield portion 71, similarly to the wiring board 13 shown in FIG. It does not have to be formed in, and may be partially provided. For example, the penetrating portions 31a and 31b may be provided at regular intervals in the extending direction of the covering shield portion 71.

As described above, in the wiring board 15 shown in FIG. 8, the conductive layer 90 and the covering shield portion 71 are connected to each other through the penetrating portions 31a and 31b. Therefore, by electrically grounding the conductive layer 90, it is possible to apply an electromagnetic shield to the wiring 40 in the wiring board 15 shown in FIG. 8 as well as the wiring board 13 shown in FIG.
Further, in the wiring board 15 shown in FIG. 8, similarly to the wiring board 13 shown in FIG. 6, it is possible to prevent the wiring 40 from being broken even if the base material 20 expands and contracts.
That is, also in the present embodiment, it is possible to provide a wiring board capable of applying an electromagnetic shield to the wiring provided on the elastic base material.

(Manufacturing method of wiring board 15)
As a method for manufacturing the wiring board 15 shown in FIG. 8, for example, the following method can be adopted.
First, the support base material 31 having the penetrating portions 31a and 31b is prepared, and a wiring formation step of forming the wiring 40 on the upper side of the support base material 31 is carried out.
Next, an insulating portion forming step of forming the insulating portion 60 covering the wiring 40 is carried out, and then a part of the covering shield portion 71 is formed in the penetrating portions 31a and 31b while forming the covering shield portion 71 covering the insulating portion 60. The step of forming the covering shield portion for forming the above is carried out.

Subsequently, a base material stretching step of applying a tensile stress T to the separately prepared base material 20 to extend the base material 20 is carried out. The elongation rate of the base material 20 is, for example, 10% or more and 200% or less. The base material stretching step may be carried out in a state where the base material 20 is heated, or may be carried out at room temperature. When the base material 20 is heated, the temperature of the base material 20 is, for example, 50 ° C. or higher and 100 ° C. or lower.

Next, a conductive layer forming step of forming the conductive layer 90 on the first surface 20a side of the base material 20 stretched by the tensile stress T is carried out.

Subsequently, the support in which the coating shield portion forming step is carried out is carried out on the first surface 20a side of the base material 20 in a state of being stretched by the tensile stress T, that is, on the upper side of the conductive layer 90 formed in the conductive layer forming step. A support base material joining step is carried out in which the base material 31 is joined and the conductive layer 90 and a part of the covering shield portion 71 formed in the penetrating parts 31a and 31b are connected.

Then, a base material shrinkage step of removing the tensile stress T from the base material 20 is carried out. With the shrinkage of the base material 20, the conductive layer 90, the support base material 31, and the respective components constituting the upper laminated structure of the support base material 31 are all on the first surface 20a of the base material 20. The peaks M and valleys V in the normal direction have a bellows shape that repeatedly appears along the in-plane direction of the first surface 20a of the base material 20.
The wiring board 15 can be obtained through the above steps.

Further, as another manufacturing method, the following method may be adopted.
In this method, the conductive layer forming step of forming the conductive layer 90 on the lower surface of the supporting base material 31 is carried out before the covering shield portion forming step.

For example, first, the supporting base material 31 is prepared, and the conductive layer forming step of forming the conductive layer 90 on the lower surface of the supporting base material 31 is carried out.
Next, a wiring forming step of forming the wiring 40 on the upper side of the supporting base material 31 is performed.
Next, an insulating portion forming step of forming the insulating portion 60 covering the wiring 40 is performed, and then a part of the covering shield portion 71 is formed in the penetrating portions 31a and 31b while forming the covering shield portion 71 covering the insulating portion 60. Is formed, and a step of forming a covering shield portion for connecting a part of the covering shield portion 71 formed in the penetrating portions 31a and 31b and the conductive layer 90 is carried out.

Next, a base material stretching step of applying a tensile stress T to the separately prepared base material 20 to extend the base material 20 is performed. Subsequently, a support base material joining step of joining the support base material 31 on which the conductive layer 90 is formed is carried out on the first surface 20a side of the base material 20 in a state of being stretched by the tensile stress T. Then, a base material shrinkage step of removing the tensile stress T from the base material 20 is carried out.
The wiring board 15 can be obtained through the above steps.

Further, as another manufacturing method, the following method may be adopted.
In this method, after the coating shield portion forming step and before the supporting base material joining step, the conductive layer 90 is formed on the lower surface of the supporting base material 31, and the covering shield formed on the penetrating portions 31a and 31b. A part of the portion 71 and the conductive layer 90 are connected.

For example, first, the support base material 31 is prepared, and a wiring formation step of forming the wiring 40 on the upper side of the support base material 31 is performed.
Next, an insulating portion forming step of forming the insulating portion 60 covering the wiring 40 is carried out, and then a part of the covering shield portion 71 is formed in the penetrating portions 31a and 31b while forming the covering shield portion 71 covering the insulating portion 60. The step of forming the covering shield portion for forming the above is carried out.
Next, the conductive layer 90 is formed on the lower surface of the support base material 31 on which the covering shield portion 71 is formed, and a part of the covering shield portion 71 formed on the penetrating portions 31a and 31b and the conductive layer 90 are formed. A step of forming a conductive layer to be connected is carried out.

Next, a base material stretching step of applying a tensile stress T to the separately prepared base material 20 to extend the base material 20 is performed. Subsequently, a support base material joining step of joining the support base material 31 on which the conductive layer 90 is formed is carried out on the first surface 20a side of the base material 20 in a state of being stretched by the tensile stress T. Then, a base material shrinkage step of removing the tensile stress T from the base material 20 is carried out.
The wiring board 15 can be obtained through the above steps.

10, 11, 12, 13, 14, 15 Wiring board 20, 21 Base material 20a, 21a First surface 20b, 21b Second surface 30, 31 Support base material 31a, 31b Penetration 40, 40a, 40b, 41 Wiring 50a , 50b, 51, 52, 53, 54, 55a, 55b Side shield wire 60 Insulation part 62a, 62b Through hole 63 Insulation part exposed area 70, 70a, 70b, 70c, 70d, 71 Covered shield part 80 Bridge wiring 90 Conductive Layer M Yamabe V Tanibe

Claims (26)

A stretchable substrate including a first surface and a second surface located on the opposite side of the first surface,
A support base material located on the first surface side of the base material and
When the direction from the second surface to the first surface in the normal direction of the first surface of the base material is the upper side,
The wiring provided on the upper side of the supporting base material and
A side shield wire provided on the upper side of the support base material and arranged in parallel with the wiring,
The insulating part that covers the wiring and
A covering shield portion that covers the insulating portion and
With
At least a part of the covering shield portion and the side surface side shield wire is connected.
The wiring and the side shield wire have a bellows shape in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material. Wiring board. The wiring board according to claim 1, wherein the wiring and the side shield wire are made of the same material. The wiring board according to claim 1 or 2, wherein the wiring and the side shield wire have the same thickness. Includes two wires in which the wires are paired
A bridge wiring provided on the upper side of the insulating portion and connecting to each of the two pairs of wirings is provided.
The insulating portion around the bridge wiring has an insulating portion exposed region exposed from the covering shield portion.
When viewed along the normal direction of the first surface of the base material,
A through hole is provided in the insulating portion in the region where the bridge wiring and each of the two pairs of wirings overlap.
The wiring board according to any one of claims 1 to 3, wherein each of the pair of two wirings and the bridge wiring are connected through the through hole. Claimed that the bridge wiring has a bellows shape in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material. Item 4. The wiring board according to item 4. The wiring board according to claim 4 or 5, wherein the bridge wiring and the covering shield portion are made of the same material. The wiring board according to any one of claims 4 to 6, wherein the bridge wiring and the covering shield portion have the same thickness. The substrate has conductivity and
The supporting base material has a penetration portion and
The wiring board according to any one of claims 1 to 7, wherein the base material and the side surface side shielded wire are connected through the penetrating portion. A conductive layer located between the base material and the supporting base material is provided.
The supporting base material has a penetration portion and
The wiring board according to any one of claims 1 to 7, wherein the conductive layer and the side shield wire are connected through the penetrating portion. Claimed that the conductive layer has a bellows shape in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material. Item 9. The wiring board according to Item 9. A stretchable substrate including a first surface and a second surface located on the opposite side of the first surface,
A support base material located on the first surface side of the base material and
When the direction from the second surface to the first surface in the normal direction of the first surface of the base material is the upper side,
The wiring provided on the upper side of the supporting base material and
The insulating part that covers the wiring and
A covering shield portion that covers the insulating portion and
With
The substrate has conductivity and
The supporting base material has a penetration portion and
The base material and the covering shield portion are connected through the penetrating portion.
The wiring board has a bellows shape in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material. .. A stretchable substrate including a first surface and a second surface located on the opposite side of the first surface,
A support base material located on the first surface side of the base material and
When the direction from the second surface to the first surface in the normal direction of the first surface of the base material is the upper side,
The wiring provided on the upper side of the supporting base material and
The insulating part that covers the wiring and
A covering shield portion that covers the insulating portion and
A conductive layer located between the base material and the supporting base material,
With
The supporting base material has a penetration portion and
Through the penetrating portion, the coating shield portion and the conductive layer are connected to each other.
The wiring board has a bellows shape in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material. .. Claimed that the conductive layer has a bellows shape in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material. Item 12. The wiring board according to Item 12. The covering shield portion has a bellows shape in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material. The wiring board according to any one of claims 1 to 13. The supporting base material has a bellows shape in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material. The wiring board according to any one of claims 1 to 14. Claims that the insulating portion has a bellows shape in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material. The wiring board according to any one of items 1 to 15. It is a method of manufacturing a wiring board.
The wiring board
A stretchable substrate including a first surface and a second surface located on the opposite side of the first surface,
A support base material located on the first surface side of the base material and
When the direction from the second surface to the first surface in the normal direction of the first surface of the base material is the upper side,
The wiring provided on the upper side of the supporting base material and
A side shield wire provided on the upper side of the support base material and arranged in parallel with the wiring,
The insulating part that covers the wiring and
A covering shield portion that covers the insulating portion and
Have,
The wiring forming step of forming the wiring and the side shield wire, and
Insulation part forming step for forming the insulation part and
The step of forming the covering shield portion for forming the covering shield portion and
A base material stretching step of applying tensile stress to the base material to stretch the base material, and
A support base material joining step of joining the support base material to the first surface side of the stretched base material,
A base material shrinkage step of removing the tensile stress from the base material to which the support base material is bonded, and
With
In the coating shield portion forming step, at least a part of the coating shield portion and the side surface side shield wire are connected.
In the base material shrinkage step, the form of the wiring and the side surface side shield wire is changed so that the peaks and valleys in the normal direction of the first surface of the base material are in-plane directions of the first surface of the base material. A method for manufacturing a wiring board, which has a bellows shape that repeatedly appears along the above. Includes two wires in which the wires are paired
The wiring board
A bridge wiring provided on the insulating portion and connecting the two pairs of wirings is provided.
In the insulating portion forming step, a through hole is provided in the insulating portion in a region where the bridge wiring and each of the two paired wirings overlap.
In the covering shield portion forming step, while forming the covering shield portion and the bridge wiring, the insulating portion around the bridge wiring forms an insulating portion exposed region exposed from the covering shield portion, and the through hole is formed. The method for manufacturing a wiring board according to claim 17, wherein each of the pair of two wirings is connected to the bridge wiring through the wiring. The substrate has conductivity and
The supporting base material has a penetration portion and
In the wiring forming step, a part of the side shield wire is formed in the penetrating portion.
The method for manufacturing a wiring board according to claim 17 or 18, wherein in the supporting base material joining step, the base material and a part of the side surface side shield wire formed in the penetrating portion are connected. The wiring board
It has a conductive layer located between the base material and the support base material, and has a conductive layer.
The supporting base material has a penetration portion and
In the wiring forming step, a part of the side shield wire is formed in the penetrating portion.
Between the base material stretching step and the supporting base material joining step, a conductive layer forming step of forming the conductive layer on the first surface side of the stretched base material is provided.
The method for manufacturing a wiring board according to claim 17 or 18, wherein in the support base material joining step, the conductive layer and a part of the side surface side shield wire formed in the penetrating portion are connected. The wiring board
It has a conductive layer located between the base material and the support base material, and has a conductive layer.
The supporting base material has a penetration portion and
A conductive layer forming step of forming the conductive layer on the lower surface of the supporting base material is provided before the wiring forming step.
17 or claim, wherein in the wiring forming step, a part of the side surface side shielded wire is formed in the penetrating portion, and a part of the side surface side shielded wire formed in the penetrating portion is connected to the conductive layer. Item 18. The method for manufacturing a wiring board according to Item 18. The wiring board
It has a conductive layer located between the base material and the support base material, and has a conductive layer.
The supporting base material has a penetration portion and
In the wiring forming step, a part of the side shield wire is formed in the penetrating portion.
After the wiring forming step and before the supporting base material joining step, the conductive layer is formed on the lower surface of the supporting base material, and a part of the side surface side shield wire formed in the penetrating portion. The method for manufacturing a wiring substrate according to claim 17 or 18, further comprising a conductive layer forming step for connecting the conductive layer and the conductive layer. It is a method of manufacturing a wiring board.
The wiring board
A stretchable substrate including a first surface and a second surface located on the opposite side of the first surface,
A support base material located on the first surface side of the base material and
When the direction from the second surface to the first surface in the normal direction of the first surface of the base material is the upper side,
The wiring provided on the upper side of the supporting base material and
The insulating part that covers the wiring and
A covering shield portion that covers the insulating portion and
Have,
The wiring forming process for forming the wiring and
Insulation part forming step for forming the insulation part and
The step of forming the covering shield portion for forming the covering shield portion and
A base material stretching step of applying tensile stress to the base material to stretch the base material, and
A support base material joining step of joining the support base material to the first surface side of the stretched base material,
A base material shrinkage step of removing the tensile stress from the base material to which the support base material is bonded, and
With
The base material has conductivity, and the support base material has a penetration portion.
In the coating shield portion forming step, a part of the coating shield portion is formed in the penetration portion.
In the supporting base material joining step, the base material and a part of the covering shield portion formed in the penetrating portion are connected to each other.
In the base material shrinkage step, the form of the wiring is a bellows in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material. A method for manufacturing a wiring board having a shape. It is a method of manufacturing a wiring board.
The wiring board
A stretchable substrate including a first surface and a second surface located on the opposite side of the first surface,
A support base material located on the first surface side of the base material and
When the direction from the second surface to the first surface in the normal direction of the first surface of the base material is the upper side,
The wiring provided on the support base material and
The insulating part that covers the wiring and
A covering shield portion that covers the insulating portion and
A conductive layer located between the base material and the supporting base material,
Have,
The wiring forming process for forming the wiring and
Insulation part forming step for forming the insulation part and
The step of forming the covering shield portion for forming the covering shield portion and
A base material stretching step of applying tensile stress to the base material to stretch the base material, and
A support base material joining step of joining the support base material to the first surface side of the stretched base material,
A base material shrinkage step of removing the tensile stress from the base material to which the support base material is bonded, and
With
The supporting base material has a penetration portion and
In the coating shield portion forming step, a part of the coating shield portion is formed in the penetration portion.
Between the base material stretching step and the supporting base material joining step, a conductive layer forming step of forming the conductive layer on the first surface side of the stretched base material is provided.
In the supporting base material joining step, the conductive layer and a part of the covering shield portion formed in the penetrating portion are connected to each other.
In the base material shrinkage step, the form of the wiring is a bellows in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material. A method for manufacturing a wiring board having a shape. It is a method of manufacturing a wiring board.
The wiring board
A stretchable substrate including a first surface and a second surface located on the opposite side of the first surface,
A support base material located on the first surface side of the base material and
When the direction from the second surface to the first surface in the normal direction of the first surface of the base material is the upper side,
The wiring provided on the support base material and
The insulating part that covers the wiring and
A covering shield portion that covers the insulating portion and
A conductive layer located between the base material and the supporting base material,
Have,
The wiring forming process for forming the wiring and
Insulation part forming step for forming the insulation part and
The step of forming the covering shield portion for forming the covering shield portion and
A base material stretching step of applying tensile stress to the base material to stretch the base material, and
A support base material joining step of joining the support base material to the first surface side of the stretched base material,
A base material shrinkage step of removing the tensile stress from the base material to which the support base material is bonded, and
With
The supporting base material has a penetration portion and
A conductive layer forming step of forming the conductive layer on the lower surface of the supporting base material is provided before the covering shield portion forming step.
In the coating shield portion forming step, a part of the coating shield portion is formed in the penetration portion, and a part of the coating shield portion formed in the penetration portion is connected to the conductive layer.
In the base material shrinkage step, the form of the wiring is a bellows in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material. A method for manufacturing a wiring board having a shape. It is a method of manufacturing a wiring board.
The wiring board
A stretchable substrate including a first surface and a second surface located on the opposite side of the first surface,
A support base material located on the first surface side of the base material and
When the direction from the second surface to the first surface in the normal direction of the first surface of the base material is the upper side,
The wiring provided on the support base material and
The insulating part that covers the wiring and
A covering shield portion that covers the insulating portion and
A conductive layer located between the base material and the supporting base material,
Have,
The wiring forming process for forming the wiring and
Insulation part forming step for forming the insulation part and
The step of forming the covering shield portion for forming the covering shield portion and
A base material stretching step of applying tensile stress to the base material to stretch the base material, and
A support base material joining step of joining the support base material to the first surface side of the stretched base material,
A base material shrinkage step of removing the tensile stress from the base material to which the support base material is bonded, and
With
The supporting base material has a penetration portion and
In the coating shield portion forming step, a part of the coating shield portion is formed in the penetration portion.
One of the coated shield portions formed in the penetrating portion by forming the conductive layer on the lower surface of the supporting base material after the covering shield portion forming step and before the supporting base material joining step. A conductive layer forming step for connecting the portion and the conductive layer is provided.
In the base material shrinkage step, the form of the wiring is a bellows in which peaks and valleys in the normal direction of the first surface of the base material repeatedly appear along the in-plane direction of the first surface of the base material. A method for manufacturing a wiring board having a shape.

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