WO2020166633A1 - Wiring board, and method for manufacturing wiring board - Google Patents

Wiring board, and method for manufacturing wiring board Download PDF

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Publication number
WO2020166633A1
WO2020166633A1 PCT/JP2020/005421 JP2020005421W WO2020166633A1 WO 2020166633 A1 WO2020166633 A1 WO 2020166633A1 JP 2020005421 W JP2020005421 W JP 2020005421W WO 2020166633 A1 WO2020166633 A1 WO 2020166633A1
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WO
WIPO (PCT)
Prior art keywords
expansion
base material
wiring
contraction
contraction suppressing
Prior art date
Application number
PCT/JP2020/005421
Other languages
French (fr)
Japanese (ja)
Inventor
徹 三好
麻紀子 坂田
小川　健一
直子 沖本
充孝 永江
Original Assignee
大日本印刷株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大日本印刷株式会社 filed Critical 大日本印刷株式会社
Priority to JP2020542927A priority Critical patent/JP6941311B2/en
Publication of WO2020166633A1 publication Critical patent/WO2020166633A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern

Definitions

  • Embodiments of the present disclosure relate to a wiring board including a stretchable base material and wiring, and a method for manufacturing the wiring board.
  • a stretchable base material is provided with stretchable silver wiring
  • a stretchable base material is provided with horseshoe-shaped wiring (for example, JP2013-187308A).
  • JP2007-281406A discloses a method for manufacturing an electronic device of this kind.
  • the manufacturing method of Patent Document 2 employs a step in which a circuit is provided on a base material that has been stretched in advance, and the base material is relaxed after the circuit is formed.
  • the wiring is typically connected to a terminal portion of a connected member represented by an electronic component, typically by a connecting portion.
  • a connected member represented by an electronic component
  • the wiring board and the wiring provided therein expands and contracts. Stress tends to concentrate at the end of the wiring. Therefore, in the connecting portion, the electrical connection between the connected member and the wiring may be impaired, and the connection may be peeled off or broken. Further, when the wiring expands and contracts, stress sometimes concentrates at the end portion of the wiring, the branch portion, and a part of the direction changing portion, and the wiring may be broken.
  • connection peeling or disconnection in a part of wiring where stress may be concentrated due to expansion and contraction of a base material, or a connection portion connected to the wiring.
  • the present disclosure is a wiring board, which has a stretchable base material including a first surface and a second surface located on the opposite side of the first surface, a wiring located on the first surface side of the base material, and a substrate.
  • a plurality of first expansion/contraction suppressing members for suppressing expansion/contraction of the material and a second expansion/contraction suppressing member for fixing the plurality of first expansion/contraction suppressing members are provided, and the base material is viewed along the normal direction of the first surface.
  • at least a part of the wiring is a virtual region that circumscribes the plurality of first expansion/contraction suppressing members and surrounds the first expansion/contraction suppressing member so that the peripheral length thereof is the shortest.
  • the wiring board exists in a region that does not overlap with the expansion-contraction suppressing member.
  • the second expansion/contraction suppressing member may be the first expansion/contraction suppressing member.
  • the above wiring board may have a connected member mounted on the wiring board, and the second expansion-contraction suppressing member may be the connected member.
  • the present disclosure is a wiring board, which has a stretchable base material including a first surface and a second surface located on the opposite side of the first surface, and wiring positioned on the first surface side of the base material.
  • a first expansion and contraction suppressing member for suppressing expansion and contraction of the base material, and when the base material is viewed along the normal direction of the first surface, at least a part of the wiring is circumscribed to the first expansion and contraction suppressing member.
  • the wiring board is present in a region that does not overlap with the first expansion/contraction suppressing member in the expansion/contraction suppressing region that is a virtual region that surrounds the first expansion/contraction suppressing member so that the perimeter thereof becomes the shortest.
  • At least a part of the wiring is at least one of an end portion of the wiring, a branch portion of the wiring, and a direction changing portion of the wiring when the base material is viewed along the normal direction of the first surface.
  • the above-mentioned wiring board further includes a connecting member mounted on the wiring board, and further includes a connecting portion that is located between the connecting member and the wiring and electrically connects the connecting member and the wiring.
  • the at least one of the connecting portions may be present in a region that does not overlap the first stretch suppressing member in the stretch suppressing region.
  • the wiring board may include a plurality of first expansion/contraction suppressing members, and the plurality of first expansion/contraction suppressing members may be adjacent to each other in the wiring extending direction.
  • the wiring board may further include a support substrate, and the first expansion-contraction suppressing member may be in contact with the base material indirectly via the support substrate.
  • At least one of the first expansion and contraction suppressing members may penetrate the base material.
  • the base material may include a plurality of peaks arranged in the direction in which the wiring extends.
  • the wiring may include a plurality of peaks arranged in the direction in which the wiring extends.
  • the present disclosure is a device in which a member to be connected is connected to the wiring board.
  • the present disclosure is an electronic product including the above device.
  • the present disclosure discloses a stretching step of stretching a base material by applying tension to a stretchable base material, and a first stretch suppressing member for stretching the base material on the first surface side of the base material in a state of being stretched by the stretching step. And a shrinking step for removing tension from the base material, and a wiring line connected to a connected member mounted on the wiring board, and a shrinking step for removing tension from the base material.
  • at least a part of the wiring is an imaginary region that circumscribes the first expansion-contraction suppressing member and surrounds the first expansion-contraction suppressing member so that its circumference is the shortest.
  • it is a method of manufacturing a wiring board existing in a region that does not overlap with the first expansion-contraction suppressing member.
  • the present disclosure provides an extension step of applying tension to a stretchable base material to extend the base material, and a connected member mounted on a wiring board on the first surface side of the base material in a state of being extended by the extension step.
  • a first installation step of providing wiring to be connected a contraction step of removing tension from the base material, and a second expansion and contraction suppressing member provided on the base material from which tension has been removed in the contraction step to suppress expansion and contraction of the base material.
  • the base material is viewed along the direction normal to the first surface, at least part of the wiring is circumscribed on the first expansion-contraction suppressing member and the first expansion-contraction suppressing member is surrounded by the installation step.
  • This is a method for manufacturing a wiring board that exists in a region that does not overlap with the first expansion/contraction suppressing member in the expansion/contraction suppressing region that is an imaginary region that is enclosed so as to have the shortest length.
  • the present disclosure includes a first surface and a second surface located on the opposite side of the first surface, and at least one of the first surface, the second surface, and the inside is provided with a first expansion and contraction suppressing member.
  • An installation process in which a tension is applied to a base material having an extension to extend the base material, and a wiring connected to a connected member mounted on the wiring board is provided on the first surface side of the base material in the extension state by the extension step.
  • another disclosure is a wiring board, which includes a first surface and a second surface located on the opposite side of the first surface, and has a stretchable base material, and the first surface side of the base material. And a reinforcing member that reinforces the base material, the reinforcing member being located along a line connected to an electronic component mounted on the wiring board, and the reinforcing member being arranged along the normal line direction of the first surface.
  • the wiring board includes a first reinforcing member extending so as to project from the electronic component when the base material is viewed, and the wiring is the first reinforcing member when the base material is viewed along a normal direction of the first surface.
  • 1 is a wiring board that intersects at least one of the straight lines virtually connecting the reinforcing member and the electronic component.
  • a wiring board according to another disclosure may further include a support substrate that is located between the first surface and the wiring and supports the wiring.
  • a wiring board which has a first surface and a second surface opposite to the first surface, and at least the first surface in the surface directions along the first surface and the second surface.
  • a reinforcing member that reinforces the base material, wherein at least a part of the reinforcing member is the first end in the first direction from the position of the first end of the electronic component in the first direction.
  • the reinforcing member is a wiring board that extends at least to the position of the second end portion that faces the end portion, and the reinforcing member has a shape that surrounds the electronic component when viewed from the normal direction of the first surface.
  • a wiring board and a method for manufacturing a wiring board which can suppress connection peeling or disconnection in a part of the wiring or a connection portion connected to the wiring due to expansion and contraction of the base material. Can be provided.
  • FIG. 1 is a plan view illustrating a first embodiment of a wiring board according to the present disclosure.
  • 4A is a sectional view taken along line AA of FIG. 4B is a sectional view taken along line BB of FIG. 4a.
  • 8A is a sectional view taken along line AA of FIG. 8B is a sectional view taken along line BB of FIG. 8a.
  • 9A is a sectional view taken along line AA of FIG. 9A.
  • FIG. 9B is a sectional view taken along line BB of FIG. 9a.
  • FIG. 10A is a sectional view taken along line AA of FIG. 10B is a sectional view taken along line BB of FIG.
  • 11A is a sectional view taken along line AA of FIG.
  • FIG. 11b is a sectional view taken along line BB of FIG. 11a.
  • 12A is a sectional view taken along line AA of FIG. 12B is a sectional view taken along line BB of FIG. 12A.
  • FIG. 13A is a sectional view taken along line AA of FIG. 13B is a sectional view taken along line BB of FIG.
  • FIG. 14A is a sectional view taken along line AA.
  • 14B is a sectional view taken along line BB of FIG. 14a.
  • 15A is a sectional view taken along line AA of FIG. 15B is a sectional view taken along line BB of FIG.
  • 16A is a sectional view taken along line AA of FIG. 16B is a sectional view taken along line BB of FIG. 16a.
  • 18A is a sectional view taken along line AA of FIG. 18B is a sectional view taken along line BB of FIG. 18a.
  • 19A is a sectional view taken along line AA of FIG. 19B is a sectional view taken along line BB of FIG. 19A.
  • FIG. 20A is a sectional view taken along line AA of FIG. 20B is a sectional view taken along line BB of FIG. 20a.
  • FIG. 21a is a sectional view taken along line AA of FIG.
  • FIG. 21b is a sectional view taken along line BB of FIG. 21a.
  • FIG. 22a is a sectional view taken along line AA of FIG. 22a.
  • FIG. 22b is a sectional view taken along line BB of FIG. 22a.
  • Figure 23a is a sectional view taken along line AA.
  • FIG. 23b is a sectional view taken along line BB of FIG. 23a.
  • FIG. 23C is a cross-sectional view corresponding to AA in FIG. 23A, illustrating the position of the expansion/contraction suppressing member in the modification of the fourth embodiment of the wiring board according to the present disclosure.
  • FIG. 23B is a cross-sectional view corresponding to BB in FIG. 23A for explaining the position of the expansion-contraction suppressing member in the modification of the fourth embodiment of the wiring board according to the present disclosure.
  • FIG. 23C is a cross-sectional view corresponding to AA in FIG. 23A, illustrating the position of the expansion/contraction suppressing member in the modification of the fourth embodiment of the wiring board according to the present disclosure.
  • FIG. 23B is a cross-sectional view corresponding to BB in FIG. 23A for explaining the position of the expansion-contraction suppressing member in the modification of the fourth embodiment of the wiring board according to the present disclosure.
  • FIG. 23C is a cross-sectional view corresponding to AA in FIG. 23A, illustrating the position of the expansion/contraction suppressing member in the modification of the fourth embodiment of the wiring board according to the present disclosure.
  • FIG. 23B is a cross-sectional view corresponding to BB in FIG.
  • FIG. 23A for explaining the position of the expansion-contraction suppressing member in the modification of the fourth embodiment of the wiring board according to the present disclosure.
  • FIG. 25A is a sectional view taken along line AA of FIG. 25b is a sectional view taken along line BB of FIG. 25a.
  • 26A is a sectional view taken along line AA of FIG. 26B is a sectional view taken along line BB of FIG. 26a.
  • FIG. 27a is a sectional view taken along line AA of FIG. 27a.
  • FIG. 27b is a sectional view taken along line BB of FIG. 27a.
  • 28A is a sectional view taken along line AA of FIG. 28a.
  • 28B is a sectional view taken along line BB of FIG. 28a.
  • 29a is a sectional view taken along line AA of FIG. 29a.
  • 29B is a sectional view taken along line BB of FIG. 29a.
  • FIG. 30A is a sectional view taken along line AA of FIG. 30B is a sectional view taken along line BB of FIG. 30a.
  • FIG. 31a is a sectional view taken along line AA of FIG. 31a.
  • FIG. 31b is a sectional view taken along line BB of FIG. 31a.
  • FIG. 32A is a sectional view taken along line AA of FIG. 32B is a sectional view taken along line BB of FIG. 32a.
  • FIG. 33a is a sectional view taken along the line AA of FIG. 33a.
  • FIG. 33a is a sectional view taken along line BB of FIG. 33a.
  • FIG. 34a is a sectional view taken along line EE of FIG.
  • 34A is a cross-sectional view taken along line FF of FIG. 34a.
  • FIG. 6 is a cross-sectional view illustrating the method of manufacturing the wiring board according to the present disclosure.
  • 4A to 4C are cross-sectional views illustrating a method for manufacturing a wiring board according to the present disclosure.
  • 4A to 4C are cross-sectional views illustrating a method for manufacturing a wiring board according to the present disclosure.
  • 4A to 4C are cross-sectional views illustrating a method for manufacturing a wiring board according to the present disclosure. Sectional drawing explaining the 1st modification of the manufacturing method of the wiring board which concerns on this indication. Sectional drawing explaining the 1st modification of the manufacturing method of the wiring board which concerns on this indication.
  • FIG. 39a is a sectional view taken along line AA of FIG. 39a.
  • FIG. 39a is a sectional view taken along line BB of FIG. 39a.
  • FIG. 41a is a sectional view taken along the line AA of FIG.
  • FIG. 41a is a sectional view taken along line BB of FIG. 41a.
  • 42A is a sectional view taken along the line AA of FIG. 42b is a sectional view taken along line BB of FIG. 42a.
  • FIG. 45a is a sectional view taken along line AA of FIG. 45a.
  • FIG. 45a is a sectional view taken along line BB of FIG. 45a.
  • FIG. 47B is a sectional view taken along line EE of FIG. 47a.
  • FIG. 47F is a cross-sectional view taken along line FF of FIG. 47a.
  • FIG. 54A is a sectional view taken along line AA of FIG. 54a.
  • FIG. 54B is a sectional view taken along line BB of FIG. 54a.
  • FIG. 6 is a plan view showing a wiring board according to another embodiment of the present disclosure.
  • FIG. 56 is a cross-sectional view showing a case where the wiring board in FIG. 55 is cut along a line II-II.
  • FIG. 57 is an enlarged cross-sectional view of the wiring board shown in FIG. 56.
  • FIG. 57B is an enlarged view of FIG. 57A.
  • It is sectional drawing which shows the modification of the wiring board of FIG.
  • It is sectional drawing which shows the modification of the wiring board of FIG.
  • It is a figure for demonstrating the manufacturing method of the wiring board shown in FIG.
  • FIG. is a figure for demonstrating the manufacturing method of the wiring board shown in FIG.
  • FIG. is a figure for demonstrating the manufacturing method of the wiring board shown in FIG.
  • FIG. is a figure for demonstrating the manufacturing method of the wiring board shown in FIG.
  • FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55.
  • FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55.
  • FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55.
  • FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55.
  • FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55.
  • FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55.
  • FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55.
  • FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55.
  • FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55.
  • FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55.
  • FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55.
  • FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55.
  • FIG. 56 is a diagram for explaining a modified example of the wiring board of FIG. 55.
  • FIG. 56 is a diagram for explaining a modified example of the method for manufacturing the wiring board in FIG. 55.
  • FIG. 56 is a diagram for explaining a modified example of the method for manufacturing the wiring board in FIG. 55.
  • FIG. 56 is a diagram for explaining a modified example of the method for manufacturing the wiring board in FIG. 55.
  • FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55.
  • FIG. 10 is a plan view showing a wiring board according to still another embodiment of the present disclosure.
  • FIG. 77 is a cross-sectional view showing a case where the wiring board in FIG. 76 is cut along a line II-II.
  • FIG. 77 is a plan view showing a modified example of the wiring board of FIG. 76.
  • FIG. 77 is a plan view showing a modified example of the wiring board of FIG. 76.
  • the configuration of the wiring board and the manufacturing method thereof according to the embodiment of the present disclosure will be described in detail with reference to the drawings.
  • the embodiments described below are examples of the embodiments of the present disclosure, and the present disclosure should not be construed as being limited to these embodiments.
  • terms such as “substrate”, “base material”, “sheet”, and “film” are not distinguished from each other based only on the difference in designation.
  • the "base material” is a concept including members such as substrates, sheets and films.
  • terms such as “parallel” and “orthogonal” and values of length and angle, etc. that specify shapes and geometric conditions and their degrees are bound to strict meanings.
  • the same function should be interpreted including the range to the extent that it can be expected.
  • the term "contact” used in the present specification is a concept including direct contact and indirect contact, and for example, when only direct contact is specified, it is explicitly " The expression "to directly contact” is used.
  • the same portions or portions having similar functions are denoted by the same reference numerals or similar reference numerals, and repeated description thereof may be omitted.
  • the dimensional ratios in the drawings may be different from the actual ratios for convenience of description, or a part of the configuration may be omitted from the drawings.
  • FIG. 1a is a plan view showing the wiring board 10. A sectional view taken along the line AA is shown in FIG. 1b, and a sectional view taken along the line BB is shown in FIG. 1c.
  • the wiring board 10 includes a base material 20, wiring 52, a first expansion/contraction suppressing member 31, and a second expansion/contraction suppressing member 32.
  • a base material 20 wiring 52
  • a first expansion/contraction suppressing member 31 a first expansion/contraction suppressing member
  • a second expansion/contraction suppressing member 32 a second expansion/contraction suppressing member 32.
  • the connected member 51 may be illustrated for the purpose of making it easier to recognize the operation and effect.
  • the connected member 51 is not an essential component of the wiring board 10.
  • the first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member 32 may be collectively referred to as the expansion/contraction suppressing member 30.
  • the base material 20 is a member configured to have elasticity.
  • the base material 20 includes a first surface 21 located on the wiring 52 side and a second surface 22 located on the opposite side of the first surface 21.
  • the base material 20 has a thickness of, for example, 10 ⁇ m or more and 10 mm or less, and more preferably 20 ⁇ m or more and 3 mm or less.
  • the thickness of the base material 20 By setting the thickness of the base material 20 to 10 ⁇ m or more, the durability of the base material 20 can be ensured.
  • the thickness of the base material 20 it is possible to secure the wearing comfort of the wiring board 10. If the thickness of the base material 20 is too small, the elasticity of the base material 20 may be impaired.
  • the stretchability of the base material 20 means that the base material 20 can expand and contract, that is, it can be expanded from a non-expanded state which is a normal state, and can be restored when released from this expanded state. A property that can be done.
  • the non-stretched state is the state of the base material 20 when no tensile stress is applied.
  • the stretchable substrate is preferably capable of stretching 1% or more from an unstretched state without breaking, more preferably 20% or more, and further preferably 75%. The above can be extended. By using the base material 20 having such an ability, the wiring board 10 can have stretchability as a whole.
  • the wiring board 10 can be used in products and applications that require high expansion and contraction, such as being attached to a part of the body such as a person's arm. It is generally said that a product attached to a person's armpit must have a stretchability of 72% in the vertical direction and 27% in the horizontal direction. Further, it is said that a product attached to a person's knees, elbows, buttocks, ankles, and armpits needs to have elasticity of 26% or more and 42% or less in the vertical direction. Further, it is said that a product attached to other parts of a person needs elasticity of less than 20%.
  • the difference between the shape of the base material 20 in the non-stretched state and the shape of the base material 20 when it is stretched from the non-stretched state and then returned to the non-stretched state is small.
  • This difference is also referred to as a shape change in the following description.
  • the shape change of the base material 20 is, for example, 20% or less in area ratio, more preferably 10% or less, and further preferably 5% or less.
  • the elastic coefficient of the base material 20 can be given as an example of the parameter indicating the elasticity of the base material 20.
  • the elastic modulus of the base material 20 is, for example, 10 MPa or less, and more preferably 1 MPa or less. By using the base material 20 having such an elastic coefficient, the entire wiring board 10 can be made to have elasticity.
  • the elastic coefficient of the base material 20 is also referred to as a first elastic coefficient.
  • the first elastic modulus of the base material 20 may be 1 kPa or more.
  • the first elastic modulus of the base material 20 As a method of calculating the first elastic modulus of the base material 20, it is possible to use a method of performing a tensile test in accordance with JIS K6251 using a sample of the base material 20. It is also possible to employ a method in which the elastic coefficient of the sample of the base material 20 is measured by the nanoindentation method according to ISO14577. A nano indenter can be used as a measuring device used in the nano indentation method.
  • a method of preparing a sample of the base material 20 a method of taking out a part of the base material 20 from the wiring board 10 as a sample or a method of taking out a part of the base material 20 before forming the wiring board 10 as a sample is considered.
  • the material forming the base material 20 is analyzed, and the first elastic coefficient of the base material 20 is calculated based on the existing database of the material. It is also possible to adopt the method.
  • the elastic modulus in the present disclosure is an elastic coefficient under an environment of 25°C.
  • the bending rigidity of the base material 20 can be given as another example of the parameter indicating the elasticity of the base material 20.
  • the bending rigidity is the product of the second moment of area of the target member and the elastic modulus of the material forming the target member, and the unit is N ⁇ m 2 or Pa ⁇ m 4 .
  • the geometrical moment of inertia of the base material 20 is calculated based on the cross section when the portion of the base material 20 overlapping the wiring 52 is cut by the plane orthogonal to the expansion/contraction direction of the wiring board 10.
  • an elastomer can be cited. Further, as the material of the base material 20, for example, cloth such as woven fabric, knitted fabric, and non-woven fabric can be used.
  • a general thermoplastic elastomer and a thermosetting elastomer can be used, and specifically, a polyurethane elastomer, a styrene elastomer, a nitrile elastomer, an olefin elastomer, a vinyl chloride elastomer, an ester elastomer, Amide elastomer, 1,2-BR elastomer, fluorine elastomer, silicone rubber, urethane rubber, fluorine rubber, polybutadiene, polyisobutylene, polystyrene butadiene, polychloroprene and the like can be used.
  • the base material 20 may include silicone. Silicone has excellent heat resistance, chemical resistance, and flame retardancy, and is preferable as a material for the base material 20.
  • the wiring 52 is a member which is located on the first surface 21 side of the base material 20 and which is connected to the connected member 51 mounted on the wiring substrate 10 via the connecting portion 51a and has conductivity.
  • the end portion of the wiring 52 is connected to the connected member 51 via the connecting portion 51a.
  • a plurality of wirings 52 are provided on both sides (left and right in FIG. 1b) of the connected member 51, but the number of wirings 52 is not particularly limited.
  • the wiring 52 may be provided with a branch portion, a direction changing portion, a wiring width changing portion in which the width of the wiring changes, and the like, where the outer shape of the wiring in plan view changes in the extending direction of the wiring.
  • 40A and 40B are schematic views showing the end portion 52t, the branch portion 52b, and the direction changing portion 52h of the wiring 52 for the sake of explanation.
  • FIG. 40b is an enlarged schematic view of the end portion 52t, the branch portion 52b, and the direction changing portion 52h portion in FIG. 40a.
  • the end portion 52t of the wiring 52 is one end of the wiring, and is normally connected to the connected member 51 via the connection portion 51a at the end portion 52t. It does not need to be connected to the connected member 51 via the connecting portion 51a.
  • the wiring branch portion 52b is a portion where the wiring branches.
  • the angle of branching and the width of each wiring 52 connected to the branching portion 52b are arbitrary.
  • the wiring direction changing portion 52h is a portion where the direction of the wiring is changed.
  • the turning angle of the direction is 90° in FIGS. 40a and 40b, but the turning angle is not limited to this and may be any turning angle.
  • the direction is changed at a right angle in FIGS. 40a and 40b, it is not limited to this.
  • the turning portion may be a part of a circular arc or a part of a circular arc of various radii. If the radius of the smallest circular arc is 20 times the wiring width or less, it is the direction changing portion 52h.
  • the wiring 52 is provided on the base material 20 stretched by tension.
  • the wiring 52 deforms into a bellows shape and has the bellows-shaped portion 57, as shown in FIG.
  • FIG. 2 is an enlarged view schematically showing the CC cross section of FIG. 1a.
  • the expansion suppressing member 30 which does not originally appear in the CC cross section and is present behind is also illustrated.
  • the bellows-shaped portion 57 includes a peak portion and a valley portion in the normal direction of the first surface 21 of the base material 20.
  • reference numeral 53 represents a mountain portion appearing on the front surface of the wiring 52
  • reference numeral 54 represents a mountain portion appearing on the back surface of the wiring 52.
  • reference numeral 55 represents a valley portion appearing on the front surface of the wiring 52
  • reference numeral 56 represents a valley portion appearing on the back surface of the wiring 52.
  • the front surface is a surface of the surface of the wiring 52 that is located on the side farther from the base material 20
  • the back surface is the surface of the surface of the wiring 52 that is located on the side closer to the base material 20. Further, in FIG.
  • reference numerals 26 and 27 represent peaks and valleys appearing on the first surface 21 of the base material 20.
  • the wiring 52 is deformed into a bellows shape and has the bellows-shaped portion 57.
  • the crests 26 of the first surface 21 of the base material 20 correspond to the crests 53 and 54 of the bellows-shaped portion 57 of the wiring 52
  • the valleys 27 of the first surface 21 of the base material 20 are the bellows shape of the wiring 52. It corresponds to the valley portions 55 and 56 of the portion 57.
  • the direction in which the peaks and valleys of the bellows-shaped portion 57 appear repeatedly is also referred to as the first direction D1.
  • the wiring 52 extends parallel to the first direction D1.
  • the wiring 52 has a bellows-shaped portion 57 at a position displaced in the first direction D1 with respect to the connected member 51 and the expansion/contraction suppressing member 30.
  • the base material 20 has a rectangular shape including long sides parallel to the first direction D1.
  • the wiring board 10 may include a wiring 52 extending in a direction different from the first direction D1.
  • the direction in which the long sides extend may be different from the first direction D1.
  • FIG. 2 shows an example in which the plurality of peaks and valleys of the bellows-shaped portion 57 are arranged at a constant cycle, the present invention is not limited to this.
  • the plurality of peaks and troughs of the bellows-shaped portion 57 may be arranged irregularly along the first direction D1. For example, the interval between two peaks adjacent to each other in the first direction D1 may not be constant.
  • the base material 20 includes a plurality of peaks arranged in the direction in which the wiring 52 extends (first direction D1), and the wiring 52 includes a plurality of peaks arranged in the direction in which the wiring 52 extends. It is a waste. That is, the bellows-shaped portion 57 is formed on the base material 20 and the wiring 52.
  • symbol S1 represents the amplitude of the bellows-shaped portion 57 on the surface of the wiring 52 in the normal direction of the base material 20.
  • the amplitude S1 is, for example, 1 ⁇ m or more, and more preferably 10 ⁇ m or more. By setting the amplitude S1 to 10 ⁇ m or more, the wiring 52 is easily deformed following the expansion of the base material 20. Further, the amplitude S1 may be, for example, 500 ⁇ m or less.
  • the distance in the normal direction of the first surface 21 between the adjacent peaks 53 and valleys 55 is measured over a certain range in the length direction of the wiring 52, and the average thereof is calculated. It is calculated by obtaining.
  • the “certain range in the length direction of the wiring 52” is, for example, 10 mm.
  • a measuring device for measuring the distance between the adjacent crests 53 and valleys 55 a non-contact measuring device using a laser microscope or the like may be used, or a contact measuring device may be used. ..
  • the distance between the adjacent ridges 53 and valleys 55 may be measured based on an image such as a cross-sectional photograph. The same applies to the method of calculating the amplitudes S2 and S3 described later.
  • symbol S2 represents the amplitude of the bellows-shaped portion 57 on the back surface of the wiring 52.
  • the amplitude S2 is, for example, 1 ⁇ m or more, and more preferably 10 ⁇ m or more. Further, the amplitude S2 may be, for example, 500 ⁇ m or less.
  • symbol S3 represents the amplitudes of the peaks 26 and the valleys 27 that appear on the first surface 21 of the base material 20 in the portion that overlaps the bellows-shaped portion 57. As shown in FIG.
  • FIG. 2 shows an example in which the bellows-shaped portion does not appear on the second surface 22 of the base material 20, the present invention is not limited to this, and the second surface 22 of the base material 20 has the bellows-shaped portion. May appear.
  • the peaks of the second surface 22 may appear at positions overlapping the valleys 27 of the first surface 21, and the valleys of the second surface 22 may appear at positions overlapping the peaks 26 of the first surface 21.
  • the positions of the peaks and valleys of the second surface 22 of the base material 20 do not have to overlap the valleys 27 and peaks 26 of the first surface 21.
  • the number or cycle of the peaks and valleys of the second surface 22 of the base material 20 may be the same as or different from the number or cycle of the peaks 26 and valleys 27 of the first surface 21. Good.
  • the amplitude of the peaks and valleys appearing on the second surface 22 of the base material 20 may be the same as or different from the amplitude S3 of the first surface 21.
  • the ratio of the amplitude of the second surface 22 to the amplitude S3 of the first surface 21 tends to increase.
  • the material of the wiring 52 may be any material that can follow the expansion and contraction of the base material 20 by utilizing the elimination and generation of the bellows-shaped portion 57.
  • the material of the wiring 52 may or may not have elasticity itself. Examples of the material that does not have elasticity by itself that can be used for the wiring 52 include metals such as gold, silver, copper, aluminum, platinum, and chromium, and alloys containing these metals. When the material of the wiring 52 itself does not have elasticity, a metal film can be used as the wiring 52. When the material itself used for the wiring 52 has elasticity, the elasticity of the material is similar to that of the base material 20, for example. Examples of the material having elasticity which can be used for the wiring 52 include a conductive composition containing conductive particles and an elastomer.
  • the wiring 52 has a structure having resistance to deformation.
  • the wiring 52 has a base material and a plurality of conductive particles dispersed in the base material.
  • the wiring 52 can also be deformed according to the expansion and contraction of the base material 20.
  • the conductivity of the wiring 52 can be maintained by setting the distribution and shape of the conductive particles so that the contact between the plurality of conductive particles is maintained even when deformation occurs. ..
  • a general thermoplastic elastomer and a thermosetting elastomer can be used as a material forming the base material of the wiring 52.
  • a styrene elastomer, an acrylic elastomer, an olefin elastomer, a urethane elastomer, a silicone rubber, Urethane rubber, fluororubber, nitrile rubber, polybutadiene, polychloroprene and the like can be used.
  • resins and rubbers containing urethane-based or silicone-based structures are preferably used from the viewpoint of stretchability and durability.
  • the material forming the conductive particles of the wiring 52 for example, particles of silver, copper, gold, nickel, palladium, platinum, carbon or the like can be used. Among them, silver particles are preferably used.
  • the wiring 52 may have any thickness as long as it can withstand the expansion and contraction of the base material 20, and is appropriately selected according to the material of the wiring 52 and the like.
  • the thickness of the wiring 52 can be in the range of 25 nm or more and 50 ⁇ m or less, preferably in the range of 50 nm or more and 10 ⁇ m or less, and 100 nm or more. More preferably, it is in the range of 5 ⁇ m or less.
  • the thickness of the wiring 52 can be set in the range of 5 ⁇ m or more and 60 ⁇ m or less, preferably in the range of 10 ⁇ m or more and 50 ⁇ m or less, and 20 ⁇ m or more and 40 ⁇ m or less. Is more preferably within the range.
  • the width of the wiring 52 is, for example, 50 ⁇ m or more and 10 mm or less.
  • the method of forming the wiring 52 is appropriately selected according to the material and the like. For example, there is a method of forming a metal film on the base material 20 or on a support substrate 40 described later by a vapor deposition method, a sputtering method, a plating method, particularly a Cu plating method, and then patterning the metal film by a photolithography method.
  • the material of the wiring 52 itself has elasticity, for example, the conductive composition containing the conductive particles and the elastomer is formed in a pattern on the base material 20 or the support substrate 40 by a general printing method.
  • There is a method of printing There is a method of printing. Among these methods, a printing method that can be manufactured with high material efficiency and at low cost can be preferably used.
  • an insulating film that integrally covers the base material 20 or the support substrate 40 and the wiring 52 is provided on the base material 20 or the support substrate 40 described below and the wiring 52 provided on the base material 20 or the support substrate 40. It may be provided. However, the insulating film is not provided on the connection portion of the wiring 52 with the connected member 51.
  • Such an insulating film can be formed by heating and hardening a thermosetting insulating resin or the like.
  • the thickness of the insulating film may be, for example, 0.1 ⁇ m or more and 500 ⁇ m or less. Further, the insulating film may be formed by screen printing or the like.
  • the connecting portion 51a may be made of, for example, a conductive adhesive, may be made of a solder material, or may be a terminal integrated with the connected member 51.
  • the base material 20 has an elastic modulus of 10 MPa or less. Therefore, when tensile stress is applied to the wiring board 10, the base material 20 can expand due to elastic deformation.
  • the wiring 52 is similarly expanded by elastic deformation, the total length of the wiring 52 increases and the cross-sectional area of the wiring 52 decreases, so that the resistance value of the wiring 52 increases. It is also conceivable that the elastic deformation of the wiring 52 may cause damage such as cracks in the wiring 52.
  • the wiring 52 since the base material 20 has the bellows-shaped portion 57, the wiring 52 also has the bellows-shaped portion 57. Therefore, when the base material 20 extends, the wiring 52 can follow the extension of the base material 20 by deforming so as to reduce the undulations of the bellows-shaped portion 57, that is, by eliminating the bellows shape. it can. Therefore, it is possible to suppress an increase in the total length of the wiring 52 and a decrease in the cross-sectional area of the wiring 52 as the base material 20 extends. This can prevent the resistance value of the wiring 52 from increasing due to the expansion of the wiring board 10. Further, it is possible to prevent the wiring 52 from being damaged such as cracks.
  • the heights of the crests 53 and 54 and the depths of the troughs 55 and 56 of the wiring 52 are caused by variations in the thickness of the base material 20, differences in the distribution density of the wirings 52 provided on the base material 20, and the like. Then, it may vary depending on the position. If the heights of the peaks 53 and 54 and the depths of the valleys 55 and 56 vary depending on the position, the degree of bending or bending of the wiring 52 locally increases, and the wiring 52 may be damaged. .. Further, regardless of whether the heights of the crests 53 and 54 and the depths of the troughs 55 and 56 are large or small, the connecting portion for connecting the connected member 51 and the wiring 52 to each other.
  • the base material 20 is provided with the first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member 32 (expansion/contraction suppressing member 30). Controlling, especially mitigating, the deformation of the end portion 52t of the wiring 52, the branching portion 52b, the direction changing portion 52h, etc. of the wiring 52 on the base material 20 where the outer shape in plan view changes in the wiring extending direction as shown in FIGS. It becomes possible to do.
  • the electrical connection between the member to be connected and the wiring is impaired at the connection portion located at the end portion 52t of the wiring 52, peeling of the connection or disconnection is suppressed, or the wiring branching portion, the direction changing portion, or the like It is possible to suppress disconnection at a portion where the outer shape in plan view changes in the extending direction of the wiring.
  • the wiring board according to the present disclosure includes a first expansion/contraction suppressing member 31 and a second expansion/contraction suppressing member 32, as in the example illustrated in FIGS.
  • the second expansion/contraction suppressing member 32 fixes the plurality of first expansion/contraction suppressing members 31.
  • “fixed” means suppressing a change in mutual positional relationship. That is, the second expansion/contraction suppressing member 32 suppresses a change in the mutual positional relationship of the plurality of first expansion/contraction suppressing members 31.
  • the plurality of first expansion/contraction suppressing members 31 are preferably connected to each other by the second expansion/contraction suppressing members 32, but the invention is not limited to this.
  • the first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member 32 may have an elastic coefficient larger than the first elastic coefficient of the base material 20.
  • the elastic coefficient of the first expansion/contraction suppressing member 31 and the elastic coefficient of the second expansion/contraction suppressing member 32 may be the same or different, and can be appropriately determined as follows. In the following description, the elastic coefficient of the first expansion/contraction suppressing member 31 and the elastic coefficient of the second expansion/contraction suppressing member 32 will be referred to as the elastic coefficient of the expansion/contraction suppressing member 30 without particular distinction, and will also be referred to as the second elastic coefficient. ..
  • the second elastic modulus is, for example, 0.1 GPa or more and 500 GPa or less, and more preferably 0.1 GPa or more and 100 GPa or less.
  • expansion/contraction suppressing member 30 By providing such an expansion/contraction suppressing member 30 on the base material 20, expansion/contraction in the expansion/contraction suppressing region 70 described later can be suppressed.
  • the base material 20 can be divided into a portion that easily expands and contracts and a portion that does not easily expand and contract, that is, the expansion and contraction suppressing region 70. If the second elastic modulus is too low, it may be difficult to control expansion and contraction.
  • the second elastic modulus may be 1.1 times or more and 1,000,000 times or less, and more preferably 100,000 times or less the first elastic coefficient of the base material 20.
  • the method of calculating the second elastic coefficient of the expansion/contraction suppressing member 30 is appropriately determined according to the form of the expansion/contraction suppressing member 30.
  • the method of calculating the second elastic coefficient of the expansion and contraction suppressing member 30 may be the same as or different from the method of calculating the elastic coefficient of the base material 20 described above. The same applies to the elastic modulus of the support substrate 40 described later.
  • a method of calculating the elastic coefficient of the expansion/contraction suppressing member 30 or the support substrate 40 a method of performing a tensile test in accordance with ASTM D882 using a sample of the expansion/contraction suppressing member 30 or the support substrate 40 should be adopted. You can
  • the second elastic coefficient of the expansion and contraction suppressing member 30 is larger than the first elastic coefficient of the base material 20.
  • a metal material can be used as the material forming the expansion and contraction suppressing member 30.
  • metal materials include copper, aluminum, stainless steel and the like.
  • a solder material may be used as the metal material.
  • a general thermoplastic elastomer, an oligomer, a polymer such as an acrylic type, a urethane type, an epoxy type, a polyester type, an epoxy type, a vinyl ether type, a polyene/thiol type, or a silicone type is used as a material forming the expansion and contraction suppressing member 30, a general thermoplastic elastomer, an oligomer, a polymer such as an acrylic type, a urethane type, an epoxy type, a polyester type, an epoxy type, a vinyl ether type, a polyene/thiol type, or a silicone type is used. Etc.
  • the expansion/contraction suppressing member 30 may have transparency. Further, the expansion/contraction suppressing member 30 may have a light blocking property, for example, a property of blocking ultraviolet rays. For example, the expansion/contraction suppressing member 30 may be black. Further, the color of the expansion and contraction suppressing member 30 and the color of the base material 20 may be the same. In the present embodiment, the thickness of the expansion/contraction suppressing member 30 is, for example, 1 ⁇ m or more and 1 mm or less.
  • the second elastic coefficient of the expansion/contraction suppressing member 30 is equal to or lower than the first elastic coefficient of the base material 20
  • the second elastic coefficient of the expansion/contraction suppressing member 30 is, for example, 10 MPa or less, and may be 1 MPa or less. ..
  • the second elastic modulus of the expansion-contraction suppressing member 30 may be 1 time or less, or 0.8 times or less than the first elastic coefficient of the base material 20.
  • a general thermoplastic elastomer and a thermosetting elastomer can be used as the material forming the expansion/contraction suppressing member 30.
  • examples thereof include styrene elastomer, acrylic elastomer, olefin elastomer, urethane elastomer, silicone rubber, urethane rubber, fluororubber, nitrile rubber, polybutadiene and polychloroprene.
  • the thickness of the expansion/contraction suppressing member 30 is, for example, 1 ⁇ m or more and 100 ⁇ m or less in the present embodiment.
  • the thickness of the expansion and contraction suppressing member 30 is several mm, for example, 1 mm or more and 5 mm or less. In some cases,
  • the characteristics of the expansion/contraction suppressing member 30 may be expressed by bending rigidity instead of the elastic coefficient.
  • the second moment of area of the expansion/contraction suppressing member 30 is calculated based on the cross section when the expansion/contraction suppressing member 30 is cut by a plane orthogonal to the expansion/contraction direction of the wiring board 10.
  • the flexural rigidity of the expansion/contraction suppressing member 30 may be 1.1 times or more, more preferably 2 times or more, and further preferably 10 times or more, of the bending rigidity of the base material 20.
  • the flexural rigidity of the expansion-contraction suppressing member 30 may be equal to or less than the flexural rigidity of the base material 20.
  • the bending rigidity of the expansion-contraction suppressing member 30 may be 1 time or less, or 0.8 times or less that of the base material 20.
  • the connected member 51 contributes to the suppression of expansion/contraction of the base material 20 as a main factor. Therefore, the method of connecting the expansion suppressing member 30 and the connected member 51 is arbitrary.
  • the connected member 51 may be fixed to the base material 20 with the adhesive Bo. As described above, when the adhesive Bo is separately provided and the connected member 51 is not fixed to the base material 20 by the expansion/contraction suppressing member 30, the expansion/contraction suppressing member 30 only needs to suppress the expansion/contraction of the base material 20.
  • the position of the expansion/contraction suppressing member 30 in the thickness direction of the base material 20 can be arbitrary.
  • the expansion and contraction suppressing member 30 is formed on the surface of the first surface 21 of the base material 20, as in the configurations shown in FIGS.
  • the configuration shown in FIGS. 8a to 8c is different from the configuration shown in FIG. 4 and the like in that the expansion suppressing member 30 and the connected member 51 are not in direct contact (connected) with each other.
  • at least one of the expansion and contraction suppressing member 30 or the base material 20 and the connected member 51 have a separate adhesive Bo.
  • Expansion/contraction of the base material 20 is suppressed by the expansion/contraction suppressing member 30 formed on the surface of the first surface 21 of the base material 20, which is circumscribed to each first expansion/contraction suppressing member 31 in plan view, and the first expansion/contraction suppressing member 31. It is possible to favorably secure a region that does not overlap with the first expansion/contraction suppressing member 31 in the expansion/contraction suppressing region 70 that is an imaginary region that surrounds the expansion/contraction length so as to have the shortest circumference. Therefore, in the connection portion 51a, it is possible to prevent the electrical connection between the member to be connected and the wiring from being spoiled, the occurrence of connection peeling and the disconnection, or the prevention of the disconnection at the branch portion or the direction changing portion of the wiring. it can.
  • the expansion and contraction suppressing member 30 is provided in the concave portion provided in the first surface 21 of the base material 20. Further, in the configurations shown in FIGS. 10A to 10C, the expansion and contraction suppressing member 30 is provided inside the base material 20 and is not exposed to the outside from the base material 20. Further, in the configurations shown in FIGS. 11A to 11C, the expansion-contraction suppressing member 30 is provided on the surface of the second surface 22 of the base material 20. Although not shown, the expansion and contraction suppressing member 30 may be provided in the concave portion provided in the second surface 22 of the base material 20. In the configuration shown in FIG. 9c as well, similar to the configurations shown in FIGS.
  • the expansion suppressing member 30 and the connected member 51 are not directly connected (contacted) to each other, and at least the expansion suppressing member 30 or the base member is not connected.
  • An adhesive Bo is separately provided to connect either one of the members 20 and the connected member 51.
  • An adhesive Bo is separately provided to connect the base member 20 and the connected member 51.
  • the expansion/contraction of the base material 20 is suppressed by the expansion/contraction suppressing member 30 formed at any position in the thickness direction of the base material 20, and each first expansion/contraction in plan view.
  • a region that does not overlap with the first expansion/contraction suppressing member 31 is good in the expansion/contraction suppressing region 70 that is inside the virtual region that is circumscribed to the suppressing member 31 and surrounds the first expansion/contraction suppressing member 31 so that its circumferential length is the shortest. Can be secured.
  • connection portion 51a it is possible to prevent the electrical connection between the connected member and the wiring from being impaired, the occurrence of connection peeling or disconnection, or the wiring branching portion, the direction changing portion, or the like in plan view of the wiring. It is possible to suppress disconnection at a location where the outer shape of the wire changes in the extending direction of the wiring.
  • the expansion and contraction suppressing member 30 can be formed at an arbitrary position in the thickness direction of the base material 20. From this, depending on the formation position of the expansion/contraction suppressing member 30 in the thickness direction of the base material 20 or the material of the expansion/contraction suppressing member 30, as shown in FIGS. The part 51a and the expansion and contraction suppressing member 30 may overlap. Even when the wiring 52 or the connecting portion 51a and the expansion/contraction suppressing member 30 overlap each other in plan view, when the expansion/contraction suppressing member 30 is provided inside the base material 20 (FIGS.
  • the expansion/contraction suppressing member 30 is If provided on the surface of the second surface 22 of the base material 20 (FIGS. 15a to 15c) or in the concave portion (not shown) provided in the second surface 22, the expansion suppressing member 30 is made of a conductive material. Even if there is, it is applicable.
  • the wiring 52 is formed so as to ride on the expansion and contraction suppressing member 30 formed on the surface of the first surface 21 of the base material 20, in other words, the expansion and contraction suppressing member 30 is , Located closer to the first surface 21 side of the base material 20 than the wiring 52.
  • the connecting portion 51a exists inside the expansion suppressing region 70, but also the connection in plan view. Since the expansion/contraction suppressing member 30 is present in the immediate vicinity of or overlapped with the portion 51a, it is considered that there is almost no expansion/contraction of the base material 20 in the connection portion 51a. Therefore, in the connection portion 51a, it is possible to more reliably suppress the occurrence of connection peeling and disconnection that damage the electrical connection between the connected member and the wiring.
  • the wiring 52 is connected to the expansion/contraction suppressing member 30 through a region of the expansion/contraction suppressing region 70 that does not overlap with the expansion/contraction suppressing member 30 in plan view. It reaches the connecting portion 51a formed at the end portion 52t of the wiring in the overlapping region. In other words, the wiring 52 does not abruptly transition from an area outside the expansion/contraction suppression area 70 where expansion/contraction is not suppressed to an area where expansion/contraction overlapping with the expansion/contraction suppression member 30 in the expansion/contraction suppression area 70 is almost zero in plan view.
  • the expansion/contraction suppressing member 30 does not overlap with the expansion/contraction suppressing member 30.
  • the wiring 52 passes through a region between which the expansion and contraction is suppressed without passing through the boundary between the region where expansion and contraction is not suppressed and the region where expansion and contraction is almost absent, in which stress is considered to be concentrated. Therefore, that is, the disconnection can be suppressed.
  • the method for forming the first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member 32, that is, the expansion/contraction suppressing member 30 is appropriately selected according to the material and the like.
  • a method of forming a metal film on the base material 20 or a support substrate 40 described later by a vapor deposition method, a sputtering method, or the like and then patterning the metal film by a photolithography method can be mentioned.
  • a resin film such as an organic layer is formed on the entire surface of the base material 20 or the supporting substrate 40 by a printing method such as a spin coating method, and then the resin film is patterned by a photolithography method.
  • a method of printing the material of the expansion and contraction suppressing member 30 in a pattern on the base material 20 or the support substrate 40 by a general printing method can be mentioned.
  • a printing method that can be manufactured with high material efficiency and at low cost can be preferably used.
  • Screen printing or printing with a dispenser can be used as the printing method.
  • the expansion/contraction suppressing member 30 can be formed more efficiently by printing with a dispenser.
  • the above description of the expansion/contraction suppressing member 30 also applies to expansion/contraction suppressing members 130 and 230 described later.
  • the connected member 51 is not an essential component except for the third embodiment described later. However, in carrying out the present disclosure, which of the wiring boards 10 according to the first to third embodiments to be described later is appropriate depends on the elasticity of the connected member 51 and the like. Therefore, the connected member 51 will be described below.
  • the connected member 51 is electrically connected to the wiring 52 by the connecting portion 51 a located between the connected member 51 and the wiring 52.
  • the connecting portion 51a includes the lower surface of the connected member 51, that is, the surface of the connected member 51 facing the first surface 21 side of the base material 20, and the base material 20, especially on the base material 20. Is located between the surface of the wiring 52 and.
  • the surface of the wiring 52 is a surface of the surface of the wiring 52 located on the side farther from the base material 20. Further, in FIG. 1a, some of the wirings 52 and the expansion/contraction suppressing member 30 located below the connected member 51 are not originally shown in the plan view, but are connected to facilitate the understanding of the present disclosure. The member 51 is shown in a transparent manner. The same applies to the subsequent plan views.
  • the connecting portion 51 a is connected to the lower surface of the connected member 51 and the surface of the wiring 52.
  • the connecting portion 51 a may be located on the side surface of the connected member 51.
  • the connecting portion 51 a may be connected to the side surface of the wiring 52.
  • the connected member 51 is not particularly limited as long as it is electrically connected to the wiring 52 provided on the base material 20 in the wiring board 10.
  • An electronic component can be typically mentioned, and such an electronic component may be an active component, a passive component, or a mechanical component.
  • Other examples of the connected member 51 include a cable for electric wiring, a connector as a connecting portion thereof, and a case for accommodating the electronic component or the connector.
  • Examples of electronic components include transistors, LSIs (Large-Scale Integration), MEMSs (Micro Electro Mechanical Systems), relays, light emitting devices such as LEDs, OLEDs, LCDs, sounding components such as sensors and buzzers, and vibration components that generate vibration.
  • Examples include cold heat generating parts such as Peltier elements and heating wires for controlling heat generation by cooling, resistors, capacitors, inductors, piezoelectric elements, and switches.
  • sensors are preferably used.
  • a temperature sensor for example, a temperature sensor, a pressure sensor, an optical sensor, a photoelectric sensor, a proximity sensor, a shear force sensor, a biological sensor, a laser sensor, a microwave sensor, a humidity sensor, a strain sensor, a gyro sensor, an acceleration sensor, a displacement sensor
  • Examples thereof include magnetic sensors, gas sensors, GPS sensors, ultrasonic sensors, odor sensors, brain wave sensors, current sensors, vibration sensors, pulse wave sensors, electrocardiographic sensors, and luminous intensity sensors.
  • biosensors are particularly preferred.
  • the biometric sensor can measure biometric information such as heartbeat, pulse rate, electrocardiogram, blood pressure, body temperature, and blood oxygen concentration. It can be said that most of such electronic components are the connected members 51 that are difficult to expand and contract.
  • An example of a cable for electric wiring is a flexible printed circuit board (FPC (Flexible Printed Circuits)).
  • FPC Flexible Printed Circuits
  • the wiring board 10 has elasticity except for the portion where the connected member 51 or the expansion suppressing member 30 which is difficult to expand and contract and the periphery thereof are provided.
  • a flexible FPC can be preferably used. It can be said that a cable for electric wiring represented by an FPC is a connected member 51 that is flexible against bending as in the wiring board 10 according to the present disclosure but is difficult to expand and contract.
  • various well-known connectors such as various mating type connectors and FPC connectors can be cited as an example.
  • a connector that can be inserted and removed a plurality of times but also a so-called direct-attach type connector that is not planned to be separated after connection is included. It can be said that such a connector is the connected member 51 that is hard to expand and contract if it is a connector that can be inserted and removed, and that some of the direct-attaching type connectors are the connected members 51 that are easily expanded and contracted. Some can be done.
  • the above-mentioned case for example, in order to protect the above-mentioned electronic parts, connectors, etc., there can be mentioned a case that covers the electronic parts, connectors, etc. except for the terminal part or the part where the terminal part exists.
  • the case according to the present description is not limited to the above, but is a combination of a plurality of the above-mentioned electronic components integrated as a module, a terminal portion for protecting the electronic components, etc. or a resin or the like except a portion where the terminal portion exists.
  • the form covered with is also included. It can be said that most of such cases are the connected members 51 that are difficult to expand and contract.
  • the member in which the connected member 51 is connected to the wiring board 10 of the present disclosure as described above is referred to as a device using the wiring board. Further, an electronic product including the device is referred to as an electronic product including the device.
  • the wiring board 10 has the stretchable base material 20 including the first surface 21 and the second surface 22 located on the opposite side, and the first surface 21 side of the base material 20.
  • the wiring 52 located, the 1st expansion-contraction suppressing member 31 which suppresses expansion-contraction of the base material 20, and the 2nd expansion-contraction suppressing member 32 which fixes the 1st expansion-contraction suppressing member 31 are provided.
  • the connected member 51 is not an essential component of the wiring board 10.
  • the connected member 51 may be appropriately included in the description below.
  • the wiring board 10 according to the first embodiment there is only one expansion/contraction member 30 made up of a plurality of first expansion/contraction members 31 fixed by the second expansion/contraction members 32.
  • the first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member 32 according to the first embodiment that is, the expansion/contraction suppressing member 30 will be described.
  • the first expansion/contraction suppressing member 31 is a member provided on the wiring board 10 for suppressing expansion/contraction of the base material 20.
  • FIG. 1a shows a plan view, and AA and BB cross sections in FIG. 1a are shown in FIGS. 1b and 1c, respectively.
  • the expansion/contraction suppressing member 30 is located on the first surface 21 of the base material 20 and is usually flat.
  • the expansion and contraction suppressing member 30 according to the first embodiment shown in FIG. 1 has one member when the base material 20 is viewed along the normal direction of the first surface 21 (may be expressed as “plan view”). It has a closed shape.
  • the expansion/contraction suppressing member 30 there are no plural expansion/contraction suppressing members 30 that are not connected to each other or are not in contact with each other.
  • the first expansion/contraction suppressing members 31 arranged at four locations independently of each other so as to include the vicinity of the four corners of the connected member 51 are mutually connected by the second expansion/contraction suppressing member 32 having a substantially X shape.
  • the expansion and contraction suppressing member 30 is fixed by being connected.
  • the expansion/contraction suppressing member 30 forms one closed figure in a plan view (Fig. 1a).
  • the expansion and contraction suppressing member 30 also functions as an adhesive for fixing the connected member 51 to the base material 20.
  • first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member 32 are described separately, but in the first embodiment, it is not important to clearly distinguish them.
  • the second expansion-contraction member that fixes the plurality of first expansion-contraction members that suppress expansion and contraction also plays a part in the effect of suppressing expansion and contraction. Therefore, the distinction between the first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member 32 is not clear, but there is no point in clearly distinguishing them, and the first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member 32 are combined. It may be considered as the expansion/contraction suppressing member 30.
  • the second expansion/contraction suppressing member can also be expressed as the first expansion/contraction suppressing member.
  • the wiring board 10 according to the first embodiment has the stretchable base material 20 including the first surface 21 and the second surface 22 located on the opposite side, and the first surface 21 of the base material 20. It can also be expressed as including the wiring 52 located on the side and the first expansion/contraction suppressing member 31 for suppressing expansion/contraction of the base material 20.
  • the first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member 32 may be different materials, or may be the same material. Further, each one of the first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member 32 may be composed of a plurality of different materials, or may be composed of a single material. In other words, the expansion/contraction suppressing member 30 may be made of a plurality of different materials, or may be made of a single material.
  • the base material 20 When the base material 20 is viewed along the normal direction of the first surface (that is, in a plan view), it is circumscribed to the first expansion/contraction suppressing member 31 and the circumference of the first expansion/contraction suppressing member 31 is the shortest. In the inside of such a virtual area (hereinafter, also referred to as “expansion/contraction suppressing area”), expansion/contraction of the base material 20 is suppressed by the expansion/contraction suppressing member 30.
  • the expansion/contraction suppressing region is a region surrounded by a broken line indicated by 70 in FIG. 1A and the like. Then, in the wiring board 10 according to the first embodiment, at least a part of the wiring 52 exists in a region of the expansion/contraction suppressing region 70 that does not overlap with the first expansion/contraction suppressing member 31.
  • the area close to the outer periphery of the expansion/contraction suppression area may be affected by the expansion/contraction of the base material 20 in the vicinity outside the expansion/contraction suppression area and may expand or contract to some extent. Therefore, inside the expansion and contraction suppressing region, a region far from the outer periphery of the expansion and contraction suppressing region, that is, a region near the center of the expansion and contraction suppressing region is less susceptible to the expansion and contraction of the base material 20.
  • the degree of expansion and contraction of the base material 20 in the expansion and contraction suppressing region, its distribution, and the like are considered to depend on the material of the base material 20, the degree of expansion and contraction, the position and shape of the expansion and contraction suppressing member 30, and so it is difficult to quantify. ..
  • At least a part of the wiring 52 exists in a region that does not overlap with the first stretch suppressing member 31 in the stretch suppressing region 70 in which the stretch of the base material 20 is suppressed.
  • 70 it is more preferable to be located in a region closer to the center in a region that does not overlap the first expansion-contraction suppressing member 31.
  • the wiring 52 is present in at least the area that does not overlap the first expansion/contraction suppressing member 31 in the expansion/contraction suppressing area 70, it is located between the connected member 51 and the wiring 52, and the connected member 51 and the wiring 52 It is possible to allow at least one of the connecting portions 51a for electrically connecting the first expansion control member 131 to exist in a region of the expansion control region 70 that does not overlap with the first expansion control member 131.
  • connection portions 51 a is the first of the expansion and contraction suppression regions 70. It is preferably present in a region that does not overlap with the expansion and contraction suppressing member 31.
  • the connecting portion 51a is present in the expansion/contraction suppressing region 70 in a region that does not overlap the first expansion/contraction suppressing member 31, the inside of the expansion/contraction suppressing region 70 in which the connection portion 51a is located expands/contracts the base material 20. Therefore, the relative position between the connected member 51 and the wiring 52 is unlikely to change in the connecting portion 51a. Therefore, it is possible to obtain an effect that it is possible to prevent the electrical connection between the connected member 51 and the wiring 52 in the connection portion 51a from being damaged, and the occurrence of connection peeling and disconnection.
  • the wiring branch portion 52b or the wiring direction changing portion 52h is provided in a region of the expansion/contraction suppressing region 70 that does not overlap the first expansion/contraction suppressing member 31, the branch portion 52b or the direction changing portion 52h. It is possible to suppress disconnection at 52h.
  • the second expansion/contraction suppressing member 32 is present separately from the connected member 51, and the expansion/contraction suppressing member 30 (the first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member) does not depend on the connected member 51. Since the expansion and contraction suppressing function can be obtained only by 32), the connected member 51 is not limited to a member that is difficult to expand and contract, and may be a member that easily expands and contracts.
  • the expansion/contraction suppressing member 30 may protrude from the connected member 51, or the expansion/contraction suppressing member 30 may entirely overlap the connected member 51 without protruding.
  • the connected member 51 mounted on the wiring board 10 may project from the expansion/contraction suppressing region 70 in a plan view, and all the connected members 51 of the expansion/contraction suppressing region 70 do not protrude. It may be one that fits inside.
  • the connected member 51 an example in which it protrudes from the expansion/contraction suppressing region 70 in plan view is illustrated as the connected member 51L, and an example in which all of it is inside the expansion/contraction suppressing region 70 is illustrated as the connected member 51S. The same applies to each of the following figures.
  • the expansion/contraction suppressing region 70 can be set wider than that of the connected member 51. It becomes easy to arrange the connecting portion 51a in a region that is less likely to be affected by the expansion and contraction of the material 20. Further, as will be described later, since the expansion/contraction suppressing member 30 can be formed so as to wrap around to the side surface of the connected member 51 or further to the upper surface of the connected member 51, the expansion/contraction suppressing member 30 and the connected member. It is possible to make the connection with 51 stronger.
  • the expansion and contraction suppressing region 70 is set narrower than the connected member 51. Therefore, a region that is not the expansion/contraction suppressing region 70, that is, a region in which the expansion/contraction of the base material 20 is not suppressed can be set wide. Thereby, the advantage that the wiring board 10 has elasticity can be more exerted. Compared with the case where the expansion/contraction suppressing member 30 projects from the connected member 51, the area of the expansion/contraction suppressing member 30 in plan view can be reduced, and the wiring board 10 as a whole can be made lightweight. ..
  • the wiring 52 more preferably the connecting portion 51a, can be provided in a region of the expansion/contraction suppressing region 70 that does not overlap the first expansion/contraction suppressing member 31, or the branching part 52b of the wiring or the wiring
  • the direction changing portion 52h can be provided, and the above effect of the present disclosure can be obtained.
  • the first expansion/contraction suppressing members 31 arranged at four locations independently of each other so as to include the vicinity of the four corners of the connected member 51 are mutually connected by the second expansion/contraction suppressing member 32 having a substantially X shape.
  • the expansion/contraction suppressing member 30 forms one closed figure in a plan view, and at least one of the wirings 52 is arranged in a region that does not overlap the first expansion/contraction suppressing member 31 in the expansion/contraction suppressing region 70 determined by the closed graphic. If the section exists, it is not limited to the above example. For example, as shown in FIG.
  • first expansion/contraction suppressing members 31 are fixed by being connected to each other by a second expansion/contraction suppressing member 32 having a substantially square shape, in other words, a rectangular frame shape, and thus one expansion/contraction suppressing member. It may be 30. Further, the shape of the expansion and contraction suppressing member 30 as shown in FIGS. 4a to 4c and 5 in plan view is also conceivable. In each figure, the expansion/contraction suppressing region 70 is as illustrated.
  • the outer shape of the expansion and contraction suppressing member 30 in plan view is a closed figure surrounded by line segments.
  • the shape is not limited to this, and the outer shape of the expansion-contraction suppressing member 30 in plan view may be surrounded by a curve as shown in FIGS. 6 and 7.
  • the outer shape of the expansion-contraction suppressing member 30 in plan view has symmetry, but it may have no symmetry. Absent.
  • the shape of the expansion/contraction suppressing member 30 various types of plan view shapes other than the above can be considered.
  • the expansion/contraction suppressing member 30 forms one closed figure in a plan view, and at least one of the wirings 52 is arranged in a region that does not overlap with the first expansion/contraction suppressing member 31 in the expansion/contraction suppressing region 70 determined by the expansion/contraction suppressing member 30. If the portion exists, the following effects can be obtained regardless of the shape in plan view. That is, it is possible to prevent the electrical connection between the connected member 51 and the wiring 52 in the connecting portion 51a from being spoiled, the occurrence of connection peeling or disconnection, or the wiring branch portion 52b or the wiring direction changing portion 52h. In such a case, it is possible to obtain the effect that the disconnection at the branch portion 52b or the direction changing portion 52h can be suppressed.
  • the wiring board 110 has the stretchable base material 20 including the first surface 21 and the second surface 22 located on the opposite side, and the first surface 21 side of the base material 20.
  • the wiring 52 located, the some 1st expansion-contraction suppressing member 131 which suppresses expansion-contraction of the base material 20, and the 2nd expansion-contraction suppressing member 132 which fixes a some 1st expansion-contraction suppressing member 131 are provided.
  • the connected member 51 is not an essential component of the wiring board 110.
  • the connected member 51 may be appropriately included in the description below.
  • the wiring board 110 according to the second embodiment there are two or more expansion/contraction suppressing members 130 in which the plurality of first expansion/contraction suppressing members 131 are fixed by the second expansion/contraction suppressing members 132, and thus the first embodiment described above.
  • the first expansion/contraction suppressing member 131 and the second expansion/contraction suppressing member 132 according to the second embodiment that is, the expansion/contraction suppressing member 130 will be described.
  • the expansion/contraction suppressing member 130 according to the second embodiment includes a plurality of first expansion/contraction suppressing members 131 fixed by the second expansion/contraction suppressing member 132.
  • the expansion/contraction suppressing member 130 is a member provided on the wiring board 110 for suppressing expansion/contraction of the base material 20.
  • FIG. 16a shows a plan view
  • FIG. 16a shows a cross section taken along the line AA in FIG. 16a
  • FIG. 16c shows a cross section taken along the line BB.
  • the expansion-contraction suppressing member 130 is located on the first surface 21 of the base material 20 and is usually flat.
  • the expansion and contraction suppressing member 130 according to the second embodiment is composed of two or more closed figures when the base material 20 is viewed along the normal direction of the first surface 21 (in plan view). As is clear from the AA cross section shown in FIG. 16b and the BB cross section shown in FIG. 16c, the expansion and contraction suppressing member 130 also functions as an adhesive for fixing the connected member 51 to the base member 20.
  • FIG. 16a the left two (131-1) of the first expansion and contraction suppressing members 131 arranged at four locations independently of each other so as to include the vicinity of the four corners of the connected member 51 are shown.
  • the second expansion/contraction suppressing members 132-1 in the vertical direction are connected to each other to form one expansion/contraction suppressing member 130-1
  • the right two (131-2) are the second expansion/contraction suppressing members 132 in the vertical direction in the figure. -2, which are mutually connected to each other to form the other expansion-contraction suppressing member 130-2.
  • the one expansion/contraction suppressing member 130-1 and the other expansion/contraction suppressing member 130-2 are not directly connected to each other but independent from each other.
  • the expansion/contraction suppressing member 130 according to the second embodiment shown in FIG. 16 includes two expansion/contraction suppressing members 130-1 and 130-2 that are not directly connected to each other.
  • the expansion/contraction suppressing member 130 includes two expansion/contraction suppressing members 130-1 and 130-2 that are not directly connected to each other, but three or more expansion/contraction suppressing members 130-1 that are not directly connected to each other. , 130-2,...
  • the two or more expansion/contraction suppressing members 130 may be made of different materials or may be made of the same material.
  • the first expansion/contraction suppressing member 131 and the second expansion/contraction suppressing member 132 may be composed of a plurality of different materials, or may be composed of a single material. Good. Further, each one of the first expansion/contraction suppressing member 131 and the second expansion/contraction suppressing member 132 may be composed of a plurality of different materials, or may be composed of a single material.
  • the expansion suppressing member 130 according to the second embodiment may be made of a plurality of different materials, or may be made of a single material.
  • the first expansion/contraction suppressing member according to one expansion/contraction suppressing member 130 for each of two or more expansion/contraction suppressing members 130.
  • An imaginary region that is circumscribed with 131 and surrounds the first expansion/contraction suppressing member 131 so that its peripheral length is the shortest is referred to as an individual expansion/contraction suppressing region 71. Then, the same number of individual expansion/contraction suppressing regions 71 as the expansion/contraction suppressing members 130 of two or more are set. In FIG.
  • two individual expansion/contraction suppressing regions 71 set by two expansion/contraction suppressing members 130-1 and 130-2 that are not directly connected to each other are shown as 71-1 and 71-2. Inside each individual expansion/contraction suppressing area 71, expansion/contraction of the base material 20 is suppressed by the corresponding expansion/contraction suppressing member 130.
  • a set of the plurality of individual expansion/contraction suppressing areas 71 set as described above is referred to as an expansion/contraction suppressing area 70.
  • At least a part of the wiring 52 be present in any of the areas that do not overlap the first expansion/contraction suppressing member 131 in the expansion/contraction suppressing area 70 that is a set of a plurality of individual expansion/contraction suppressing areas 71.
  • at least one of the connecting portions 51a that is located between the connected member 51 and the wiring 52 and electrically connects the connected member 51 and the wiring 52 to the expansion suppressing region 70. It is possible to allow the first expansion and contraction suppressing member 131 to exist in a region that does not overlap with the first expansion and contraction suppressing member 131.
  • connection portions 51 a is the first of the expansion and contraction suppression regions 70. It is preferably present in a region that does not overlap with the expansion and contraction suppressing member 131.
  • the connecting portion 51a exists in the expansion/contraction suppressing area 70 in a region that does not overlap the first expansion/contraction suppressing member 131, the expansion/contraction suppressing area 70 in which the connecting portion 51a is located, that is, each individual expansion/contraction suppressing area 71. Since the expansion and contraction of the base material 20 is suppressed inside, the relative position between the connected member 51 and the wiring 52 is unlikely to change in the connecting portion 51a. Therefore, it is possible to obtain an effect that it is possible to prevent the electrical connection between the connected member 51 and the wiring 52 in the connection portion 51a from being damaged, and the occurrence of connection peeling and disconnection.
  • the wiring branch portion 52b or the wiring direction changing portion 52h is provided in a region of the expansion/contraction suppressing region 70 that does not overlap the first expansion/contraction suppressing member 31, the branch portion 52b or the direction changing portion 52h. It is possible to suppress disconnection at 52h (see FIGS. 40a and 40b).
  • the connected member 51 is a member that easily expands and contracts and the plurality of expansion and contraction suppressing members 130 are adjacent to each other in the wiring extending direction, that is, the expansion and contraction direction D1
  • the two expansion/contraction suppressing members 130-1 and 130-2 are adjacent to each other in the wiring extending direction.
  • the two expansion/contraction suppressing members 130-1 and 130-2 near the center in the left-right direction in the wiring board 110 of FIG. 16a
  • there is a region that is not the expansion/contraction suppressing region 70 that is, a region where expansion/contraction is not suppressed. ..
  • the connected member 51 When the connected member 51 is a member that easily expands and contracts, the connected member 51 can expand and contract in the region where the expansion and contraction is not suppressed without being hindered by the two expansion and contraction suppressing members 130-1 and 130-2. It is possible. Therefore, the wiring board 110 can have a certain degree of elasticity even in the area where the connected member 51 exists in plan view, that is, it can have a higher elasticity than that of the first embodiment.
  • the wiring board 110 having high elasticity can provide a good wearing feeling when applied to the body, for example.
  • the expansion suppressing member 30 separates in the first embodiment, that is, the first direction D1, that is, the expansion and contraction direction of the wiring board 110. It can have higher flexibility than the non-fitted form, and in this case as well, when applied to the body, for example, a good wearing feeling can be obtained.
  • the expansion/contraction suppressing members 130 may each project from the connected member 51, or all the expansion/contraction suppressing members 130 may not overlap and overlap the connected member 51.
  • the expansion/contraction suppressing member 130 projects from the connected member 51S, and if the connected member 51 has a shape indicated by 51L, the expansion/contraction suppressing member 130 is connected. It does not project from the member 51L, and the entire expansion-contraction suppressing member 130 overlaps the connected member 51L.
  • the shape of the expansion suppressing member 130 in the second embodiment in plan view is not limited to the example of FIG. 16a.
  • a plan view shape as shown in FIG. 17 is also conceivable.
  • the shape of the expansion-contraction suppressing member 130 in plan view may be a closed figure surrounded by a curved line.
  • the distribution of each expansion/contraction suppressing member 130 may not have symmetry, and each expansion/contraction suppressing member 130 may be a closed figure having no symmetry.
  • a variety of plan view shapes other than the above can be considered.
  • Each expansion/contraction member 130 forms one closed figure in a plan view, and in each individual expansion/contraction suppressing region 71 (expansion/contraction suppressing region 70) determined by the expansion/contraction suppressing member 130, the expansion/contraction suppressing member 131 does not overlap with the first expansion/contraction suppressing member 131. If at least a part of the wiring 52 is present, the electrical connection between the connected member 51 and the wiring 52 is impaired at the connecting portion 51a, regardless of the shape of each expansion-contraction suppressing member 130 in plan view. It is possible to obtain the above-described effect that it is possible to suppress the occurrence of connection peeling and disconnection.
  • the wiring branch portion 52b or the wiring direction changing portion 52h is provided in a region of the expansion/contraction suppressing region 70 that does not overlap the first expansion/contraction suppressing member 31, the branch portion 52b or the direction changing portion 52h. It is possible to suppress disconnection at 52h.
  • the wiring board 210 has a stretchable base material 20 including a first surface 21 and a second surface 22 located on the opposite side, and a first base material 20.
  • the wiring 52 located on the first surface 21 side, a plurality of first expansion/contraction suppressing members 231 for suppressing expansion/contraction of the base material 20, and a second expansion/contraction suppressing member 232 for fixing the plurality of first expansion/contraction suppressing members 231 are provided,
  • the third embodiment further includes a connected member 51 mounted on the wiring board 210.
  • the connected member 51 in the third embodiment is preferably a member that is difficult to expand and contract.
  • the wiring board 210 according to the third embodiment is different from the first embodiment in that it has the connected member 51, and the second expansion suppressing member 232 is the connected member 51.
  • the first expansion/contraction suppressing member 231 and the second expansion/contraction suppressing member 232 according to the third embodiment, that is, the expansion/contraction suppressing member 230 will be described.
  • the expansion/contraction suppressing member 230 according to the third embodiment is configured such that the plurality of first expansion/contraction suppressing members 231 are fixed by the second expansion/contraction suppressing member 232, and the connected member 51 is the second expansion/contraction suppressing member. It plays the role of 232. That is, in the third embodiment, it can be said that the second expansion/contraction suppressing member 232 is the connected member 51.
  • the expansion/contraction suppressing member 230 is a member provided on the wiring board 210 for suppressing expansion/contraction of the base material 20.
  • FIG. 18a shows a plan view, and AA and BB cross sections in FIG. 18a are shown in FIGS.
  • the first expansion/contraction suppressing member 231 is located on the first surface 21 of the base material 20.
  • the first expansion/contraction suppressing member 231 is usually flat.
  • the expansion suppressing member 230 according to the third embodiment shown in FIGS. 18a to 18c includes two or more expansion suppressing members 230-1, 230-2,... Which are not directly connected to each other.
  • the expansion and contraction suppressing member 230 according to the third embodiment is formed of two or more closed figures when the base material 20 is viewed along the normal direction of the first surface 21 (in plan view).
  • the first expansion/contraction suppressing member 231 also serves as an adhesive for fixing the connected member 51 to the base material 20.
  • the first expansion and contraction suppressing members 231 arranged at four places so as to include the vicinity of the four corners of the connected member 51 are not directly connected to each other but independent from each other. That is, the first expansion/contraction suppressing member 231 according to the third embodiment shown in FIG. 18 includes four first expansion/contraction suppressing members 231-1, 231-2, 231-3, 231-4 which are not directly connected to each other. ing.
  • the two or more first expansion suppressing members 231 are in contact with or overlap with the connected members 51, respectively.
  • the first expansion/contraction suppressing member 231-1 is connected to the connected member 51
  • the first expansion/contraction suppressing member 231-2 is connected to the connected member 51
  • the first expansion/contraction suppressing member 231- 3 is connected to the connected member 51
  • the first expansion-contraction suppressing member 231-4 is connected to the connected member 51.
  • the four first expansion/contraction suppressing members 231-1, 231-2, 231-3, 231-4 do not overlap each other, that is, are not directly connected to each other.
  • the four first expansion/contraction suppressing members 231-1, 231-2, 231-3, 231-4 are connected to each other via the connected member 51, and the four first expansion/contraction suppressing members 231 are connected by the connection. Changes in the mutual positional relationship are suppressed. That is, the connected member 51 fixes the plurality of first expansion/contraction suppressing members 231. Then, in the third embodiment, it can be said that the second expansion/contraction suppressing member 232 is the connected member 51.
  • the expansion/contraction suppressing member 230 is composed of four first expansion/contraction suppressing members 231, but the invention is not limited to this, and any natural number of two or more first elastic members is not directly connected to each other.
  • the expansion and contraction suppressing member 231 may be included.
  • the distribution and each shape of the first expansion/contraction suppressing member 231 in plan view are arbitrary, that is, the expansion/contraction suppressing member including the first expansion/contraction suppressing member 231 and the connected member 51 connected to each other via the connected member 51.
  • the shape of 230 is arbitrary. Whether or not the first expansion/contraction suppressing member 231 projects from the connected member 51 in plan view is also arbitrary.
  • the two or more first expansion/contraction suppressing members 231 may be made of different materials or may be made of the same material. Further, each of the first expansion/contraction suppressing members 231 constituting the expansion/contraction suppressing member 230 may be made of a plurality of different materials, or may be made of a single material.
  • the two or more first expansion/contraction suppressing members 231 are in contact with or overlap with the connected member 51, respectively, so that the rigidity between the first expansion/contraction suppressing member 231 and the connected member 51 is increased. It is possible to connect.
  • the connected member 51 in the third embodiment is preferably a member that is difficult to expand and contract.
  • each of the two or more first expansion suppressing members 231 is connected to the connected member 51 made of a material that is difficult to expand and contract with high rigidity, so that the two or more first expansion suppressing members 231 are difficult to expand and contract.
  • the members 51 are connected to each other with high rigidity.
  • the expansion/contraction suppressing member 230 according to the third embodiment which includes a set of two or more first expansion/contraction suppressing members 231 that are not directly connected to each other, can be considered as one member having a certain degree of rigidity as a whole. ..
  • the connected member 51 according to the third embodiment preferably functions as the second expansion/contraction suppressing member 232 and is therefore made of a member that is difficult to expand/contract.
  • the base material 20 When the base material 20 is viewed along the normal direction of the first surface 21 (that is, in a plan view), it is circumscribed to the first expansion-contraction suppressing member 231, and the first expansion suppressing member 231 has the shortest perimeter.
  • An imaginary area surrounded by the above is defined as an expansion/contraction suppressing area 72.
  • the expansion/contraction suppressing region 72 is a region indicated by reference numeral 72 in FIG. 18a. In the expansion/contraction suppressing region 72, expansion/contraction of the base material 20 is suppressed by the expansion/contraction suppressing member 230. Therefore, in the wiring board 210 according to the third embodiment, it is preferable that at least a part of the wiring 52 exists in the expansion/contraction suppressing region 72 in a region that does not overlap with the first expansion/contraction suppressing member 231.
  • the wiring 52 existing in a region that does not overlap with the first expansion/contraction suppressing member 231 in the expansion/contraction suppressing region 72 according to the third embodiment among the expansion/contraction suppressing regions 70 according to the first embodiment, It is possible to obtain the same effect as that of the wiring 52 existing in the region that does not overlap with the first expansion/contraction suppressing member 31. That is, in the expansion/contraction suppressing area 72 in which at least a part of the wiring 52 is located, expansion/contraction of the base material 20 is suppressed in an area that does not overlap with the first expansion/contraction suppressing member 231, so that the connection target member 51 and the wiring 52 are connected in the connecting portion 51a. The relative position with is difficult to change.
  • connection portion 51a it is possible to obtain an effect that it is possible to prevent the electrical connection between the connected member 51 and the wiring 52 in the connection portion 51a from being damaged, and the occurrence of connection peeling and disconnection.
  • the wiring branch portion 52b or the wiring direction changing portion 52h is provided in a region of the expansion/contraction suppressing region 72 that does not overlap with the first expansion/contraction suppressing member 231, the branch portion 52b or the direction changing portion 52h. It is possible to suppress disconnection at 52h (see FIGS. 40a and 40b).
  • the expansion suppressing member 30 is separated in the first embodiment, that is, the first direction D1, that is, the expansion and contraction direction of the wiring board 210. It can have higher flexibility than the non-existing form, and when applied to the body, for example, a good wearing feeling can be obtained.
  • the two or more first expansion/contraction suppressing members 231 are in contact with or overlap with the connected member 51 in plan view.
  • FIG. 18c as a BB cross section of FIG. 18a
  • each of the first expansion/contraction suppressing members 231 overlaps with the connected member 51 in plan view, and each of the first expansion/contraction suppressing members 231 of the connected member 51 respectively. Only in contact with the bottom surface.
  • the invention is not limited to this as long as the first expansion suppressing member 231 and the connected member 51 can be connected with high rigidity.
  • FIG. 19c as a BB cross section of FIG.
  • the restraint members 231 are overlapped with the connected members 51, respectively, and the first expansion-contraction restraint members 231 are also in contact with the other side surface of the lower surface of the connected members 51.
  • the first expansion suppressing member 231 and the connected member 51 can be connected to each other with higher rigidity, especially in the expansion and contraction direction D1, as compared with the embodiment of FIGS. 18a to 18c.
  • each first expansion/contraction suppressing member 231 is in contact with the connected member 51 without overlapping in plan view, that is, each first expansion/contraction suppressing member 231. May contact only the side surface of each connected member 51.
  • each of the first expansion/contraction suppressing members 231 overlaps with the connected member 51 in plan view, and each of the first expansion/contraction suppressing members 231 is connected to the connected member. It may be in contact with the upper surface and the side surface of 51. In this case, the first expansion/contraction suppressing member 231 may cover the entire upper surface of the connected member 51.
  • the respective first expansion and contraction suppressing members 231 are connected to each other on the upper surface of the connected member 51, and as a result, it can be considered as one expansion and contraction suppressing member 230. Therefore, it is considered as one form of the first embodiment.
  • the relative position between the first expansion/contraction suppressing member 231 (expansion/contraction suppressing member 230) and the connected member 51, and the relative position between the first expansion/contraction suppressing member 231 and the base material 20 are set. It is premised that neither changes.
  • the connected member 51 is fixed to the base material 20 via the first expansion/contraction suppressing member 231. That is, it can be considered that the first expansion/contraction suppressing member 231 also serves as an adhesive for fixing the connected member 51 to the base material 20.
  • an adhesive Bo for fixing the connected member 51 to the base material 20 may be provided separately from the first expansion/contraction suppressing member 231.
  • the first expansion-contraction suppressing member 231 projects from the connected member 51 in a plan view. It was However, the present invention is not limited to this, and the first expansion/contraction suppressing member 231 may not protrude from the connected member 51, and the entire first expansion/contraction suppressing member 231 may overlap the connected member 51.
  • the first expansion/contraction suppressing member 231 does not protrude from the connected member 51, all of the first expansion/contraction suppressing member 231 overlaps with the connected member 51, and the first expansion/contraction suppressing member 231 does not penetrate the base material 20. Even in this embodiment, it is naturally possible to allow at least a part of the wiring 52 to exist in the expansion/contraction suppressing region 72 in a region that does not overlap the first expansion/contraction suppressing member 231. Therefore, the following effects similar to the effects according to the third embodiment can be obtained.
  • expansion/contraction suppressing area 72 in which at least a part of the wiring 52 is located expansion/contraction of the base material 20 is suppressed in an area that does not overlap with the first expansion/contraction suppressing member 231, so that the connection target member 51 and the wiring are connected in the connecting portion 51a. It is difficult for the relative position with 52 to change. Therefore, it is possible to obtain an effect that it is possible to prevent the electrical connection between the connected member 51 and the wiring 52 in the connection portion 51a from being damaged, and the occurrence of connection peeling and disconnection.
  • the branch portion 52b or the wiring direction changing portion 52h is provided in a region of the expansion/contraction suppressing region 72 that does not overlap with the first expansion/contraction suppressing member 231, the branch portion 52b or the direction changing portion 52h. It is possible to suppress disconnection at 52h.
  • the wiring board 310 according to the fourth embodiment includes a base material 20, an expansion/contraction suppressing member 30, a support substrate 40, a connected member 51, and a wiring 52.
  • the expansion and contraction suppressing member 30 indirectly contacts the base material 20 via the support substrate 40.
  • FIG. 23a is a plan view showing a wiring substrate 310 according to the fourth embodiment. A sectional view taken along the line AA is shown in FIG. 23b, and a sectional view taken along the line BB is shown. Shown in Figure 23c.
  • the support substrate 40 is a plate-shaped member configured to have a stretchability lower than that of the base material 20.
  • the support substrate 40 includes a second surface 42 located on the base material 20 side and a first surface 41 located on the opposite side of the second surface 42.
  • the support substrate 40 supports the connected member 51, the wiring 52, and the expansion/contraction suppressing member 30 on the first surface 41 side thereof.
  • the support substrate 40 is joined to the first surface of the base material 20 on the second surface 42 side.
  • an adhesive layer containing an adhesive may be provided between the base material 20 and the support substrate 40.
  • an acrylic adhesive, a silicone adhesive, or the like can be used as a material forming the adhesive layer.
  • the thickness of the adhesive layer is, for example, 5 ⁇ m or more and 200 ⁇ m or less.
  • the second surface 42 of the support substrate 40 may be bonded to the first surface 21 of the base material 20 by a method of molecularly modifying the surface to be adhered and performing molecular adhesive bonding. In this case, the adhesive layer may not be provided between the base material 20 and the support substrate 40.
  • the support substrate 40 that supports the member to be connected 51, the wiring 52, and the expansion-contraction suppressing member 30 on the base material 20 which is expanded by applying tension to the base material 20 in this way is provided.
  • the bellows-shaped portion 57 is formed on the support substrate 40 and the wiring 52.
  • the characteristics and dimensions of the support substrate 40 are set so that the bellows-shaped portion 57 is easily formed.
  • the support substrate 40 has a modulus of elasticity larger than the first modulus of elasticity of the base material 20.
  • the elastic coefficient of the support substrate 40 is also referred to as the third elastic coefficient.
  • the third elastic coefficient of the support substrate 40 is, for example, 100 MPa or more, and more preferably 1 GPa or more.
  • the third elastic modulus of the support substrate 40 may be 100 times or more and 50,000 times or less, preferably 1000 times or more and 10,000 times or less than the first elastic coefficient of the base material 20.
  • the elastic modulus of the support substrate 40 is too low, the support substrate 40 is easily deformed during the process of forming the expansion and contraction suppressing member 30, and as a result, it is difficult to align the expansion and contraction suppressing member 30 with the connected member 51 and the wiring 52. Become. If the elastic modulus of the support substrate 40 is too high, it becomes difficult to restore the base material 20 when it relaxes, and the base material 20 is likely to crack or break.
  • the thickness of the support substrate 40 is, for example, 500 nm or more and 10 ⁇ m or less, and more preferably 1 ⁇ m or more and 5 ⁇ m or less. If the thickness of the support substrate 40 is too small, it becomes difficult to handle the support substrate 40 in the process of manufacturing the support substrate 40 and the process of forming a member on the support substrate 40. If the thickness of the support substrate 40 is too large, it becomes difficult to restore the base material 20 when it is relaxed, and it becomes impossible to expand or contract the target base material 20.
  • polyethylene naphthalate, polyimide, polyethylene terephthalate, polycarbonate, acrylic resin or the like can be used as the material forming the support substrate 40.
  • polyethylene naphthalate or polyimide having good durability and heat resistance can be preferably used.
  • the third elastic coefficient of the support substrate 40 may be 100 times or less the first elastic coefficient of the base material 20.
  • the method of calculating the third elastic coefficient of the support substrate 40 is the same as the method of calculating the first elastic coefficient of the base material 20 described above.
  • the wiring board 310 includes the base material 20, the expansion/contraction suppressing member 30, the support substrate 40, the connected member 51, and the wiring 52, but the position of the expansion/contraction suppressing member 30.
  • FIG. 24a is a sectional view of a position corresponding to FIG. 23b
  • FIG. 24b is a sectional view of a position corresponding to FIG. 23c.
  • the support substrate 40 is provided on the first surface 21 of the base material 20 and the expansion/contraction suppressing member 30 provided on the first surface 21.
  • the support substrate 40 supports the connected member 51 and the wiring 52 on the first surface 41 side thereof.
  • the support substrate 40 is joined to the first surface 21 of the base material 20 and the expansion and contraction suppressing member 30 on the second surface 42 side thereof.
  • the expansion/contraction suppressing member 30 is the base material 20. It may be provided inside and not exposed to the outside from the base material 20.
  • FIG. 24c is a sectional view of a position corresponding to FIG. 23b
  • FIG. 24d is a sectional view of a position corresponding to FIG. 23c.
  • the wiring substrate 310 shown in FIGS. 24C and 24D is formed by relaxing the base material 20 after providing the wiring 52 on the stretched base material 20, the first surface of the base material 20.
  • a feature can be formed.
  • the first surface of the base material 20 is also obtained when the base material 20 on which the expansion and contraction suppressing member 30 is previously provided on the first surface 21 or the second surface 22 is stretched to provide the wiring 52 and then relaxed.
  • a bellows-shaped portion including a mountain portion and a valley portion is formed in a portion adjacent to the expansion suppressing member 30 in a plan view. obtain.
  • the expansion-contraction suppressing member 30 may be located on the second surface 22 side of the base material 20.
  • FIG. 24e is a sectional view of a position corresponding to FIG. 23b
  • FIG. 24f is a sectional view of a position corresponding to FIG. 23c.
  • the connected member 51 is not an essential component of the wiring board 310. That is, the support substrate 40 in which the connected member 51 is not mounted may be attached to the base material 20. The wiring board 310 may be shipped without the connected member 51 being mounted.
  • the expansion and contraction suppressing member 30 may be disposed so as to penetrate the base material 20. By being arranged so as to penetrate, the expansion and contraction suppressing member 30 can be arranged more firmly with respect to the base material 20.
  • the expansion and contraction suppressing member 30 arranged so as to penetrate is formed such that the portion near the second surface 22 of the base material 20 is thicker than the portion on the first surface 21 side. Therefore, the penetration portion is prevented from coming out to the first surface 21 side (upward in FIG.
  • the expansion suppressing member 30 is separated from the base material 20. That is, in the embodiment illustrated in FIGS. 25a to 25c, the expansion and contraction suppressing member 30 is more firmly arranged with respect to the base material 20. Even in this penetrating form, it is possible to obtain the above-described effect that it is possible to prevent the electrical connection between the connected member 51 and the wiring 52 in the connection portion 51a from being damaged, and the occurrence of connection peeling and disconnection. Further, in the case where the wiring branch portion 52b or the wiring direction changing portion 52h is provided in a region of the expansion/contraction suppressing region 72 that does not overlap with the first expansion/contraction suppressing member 231, the branch portion 52b or the direction changing portion 52h. It is possible to suppress disconnection at 52h (see FIGS. 40a and 40b).
  • the expansion/contraction suppressing member 30, that is, the first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member 32 can be formed at any position in the thickness direction of the substrate 20.
  • the first expansion and contraction suppressing member 31 and the second expansion and contraction suppressing member 32 are formed at the same position in the thickness direction of the base material 20.
  • the present invention is not limited to this, and the first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member 32 may be formed at different positions in the thickness direction of the base material 20. In the example shown in FIGS.
  • the first expansion/contraction suppressing member 31 is disposed on the surface of the base material 20 on the first surface 21 side, and the second expansion/contraction suppressing member 32 is on the surface of the base material 20 on the second surface 22 side.
  • the first expansion/contraction suppressing member 31 penetrates the base material 20 and is connected to the second expansion/contraction suppressing member 32.
  • the expansion and contraction of the base material 20 is suppressed by the first expansion and contraction suppressing member 31 and the second expansion and contraction suppressing member 32, that is, the expansion and contraction suppressing member 30, and is circumscribed to each first expansion and contraction suppressing member 31 in plan view, and It is possible to satisfactorily secure a region that does not overlap with the first expansion/contraction suppressing member 31 in the expansion/contraction suppressing region 70 that is inside a virtual region that surrounds the 1 expansion/contraction suppressing member 31 so that its circumference is the shortest.
  • connection portion 51a it is possible to prevent the electrical connection between the member to be connected and the wiring from being spoiled, the occurrence of connection peeling and the disconnection, or the prevention of the disconnection at the branch portion or the direction changing portion of the wiring. it can.
  • the first expansion/contraction suppressing member 31 is arranged on the surface of the base material 20 on the second surface 22 side, and the second expansion/contraction suppressing member 32 is arranged on the first surface 21 side of the base material 20.
  • the first expansion/contraction suppressing member 31 penetrates the base material 20 and is connected to the second expansion/contraction suppressing member 32.
  • the expansion and contraction of the base material 20 is suppressed by the first expansion and contraction suppressing member 31 and the second expansion and contraction suppressing member 32, that is, the expansion and contraction suppressing member 30, and is circumscribed to each first expansion and contraction suppressing member 31 in plan view, and It is possible to satisfactorily secure a region that does not overlap with the first expansion/contraction suppressing member 31 in the expansion/contraction suppressing region 70 that is inside a virtual region that surrounds the 1 expansion/contraction suppressing member 31 so that its circumference is the shortest.
  • connection portion 51a it is possible to prevent the electrical connection between the member to be connected and the wiring from being spoiled, the occurrence of connection peeling and the disconnection, or the prevention of the disconnection at the branch portion or the direction changing portion of the wiring. it can.
  • the expansion suppressing member 30 may be connected to each other by the suppressing member 32 in a plan view shape. 45a to c and FIG. 46, the expansion/contraction suppressing member 30 is not separated not only in the expansion/contraction direction of the wiring board 10 but also in the direction orthogonal to the expansion/contraction direction. That is, all parts of the expansion-contraction suppressing member 30 are connected to each other (there are no separate parts) and are integrated.
  • expansion/contraction suppressing member 30 since the expansion/contraction suppressing member 30 is integrated, expansion/contraction of the base material 20 inside the expansion/contraction suppressing region can be suppressed more reliably, and the occurrence of connection peeling and disconnection can be suppressed more reliably. be able to.
  • FIGS. 47a to 47c show a plan view, the EE section of which is shown in FIG. 47b and the FF section which is shown in FIG. 47c.
  • the flexible printed circuit board 60 is connected to the upper surface side (the first surface 21 side of the base material 20) of the wiring board.
  • the FPC wiring 62 is sandwiched between the front and back sides by the FPC insulating layer 61.
  • the FPC wiring 62 is exposed from the FPC insulating layer 61 only in a portion (so-called terminal portion) electrically connected to the wiring 52 of the wiring board, and is electrically connected to the connection portion 51a made of an anisotropic conductive film or the like. Has been done.
  • the expansion/contraction direction (first direction D1) of the wiring board in the preferable example and the direction in which the wiring 52 extends are the same.
  • the expansion-contraction suppressing member 30 has a U shape in plan view and is not separated from each other in the first direction D1. Therefore, as described above, not only when the connected member 51, that is, the flexible printed circuit board 60 is a member that is difficult to expand and contract, but also when it is a member that easily expands and contracts, the expansion and contraction suppressing member 30 causes the inside of the expansion and contraction suppressing region 70 to be a base. Expansion and contraction of the material 20 is suppressed.
  • the flexible printed circuit board 60 is a member that easily expands and contracts, it is possible to suppress the occurrence of connection peeling and disconnection and to achieve the advantage of the wiring board 210 having elasticity. It is possible to make it preferable.
  • the adhesive Bo may be separately provided, and at least one of the expansion and contraction suppressing member 30 and the base member 20 and the connected member 51 may be connected by the adhesive Bo.
  • the expansion and contraction suppressing member 30 includes the recess provided in the first surface 21 of the base material 20, the inside of the base material 20, the surface of the second surface 22 of the base material 20, and the second surface 22 of the base material 20. It can be provided in any of the recesses provided in the.
  • the adhesive Bo may be separately provided, and the wiring 52 or the connection portion 51a and the expansion suppressing member 30 may overlap each other in a plan view.
  • the expansion/contraction suppressing member 30 includes the recess provided in the first surface 21 of the base material 20, the inside of the base material 20, the surface of the second surface 22 of the base material 20, and the second surface 22 of the base material 20. It can be provided in any of the recesses provided in the.
  • the first expansion/contraction suppressing member 131 (expansion/contraction suppressing member 130) may be disposed so as to penetrate the base material 20. By being arranged so as to penetrate, the first expansion-contraction suppressing member 131 can be arranged more firmly with respect to the base material 20.
  • the portion near the second surface 22 of the base material 20 is formed thicker than the portion on the first surface 21 side.
  • the penetrating portion is pulled out to the first surface 21 side (upward in FIG. 26c) and the first expansion-contraction suppressing member 131 is separated from the base material 20. That is, in the embodiment illustrated in FIGS. 26 a to 26 c, the first expansion/contraction suppressing member 131 is more firmly arranged with respect to the base material 20. Even in this penetrating form, it is possible to obtain the above-described effect that it is possible to prevent the electrical connection between the connected member 51 and the wiring 52 in the connection portion 51a from being damaged, and the occurrence of connection peeling and disconnection.
  • the branch portion 52b of the wiring or the direction changing portion 52h of the wiring is provided in an area of the expansion/contraction suppressing area 72 which does not overlap with the first expansion/contraction suppressing member 231, the branch portion 52b or the direction changing portion 52h. It is possible to suppress disconnection at 52h.
  • the first expansion/contraction suppressing member 231 may be disposed so as to penetrate the base material 20.
  • An example in which the first expansion-contraction suppressing member 231 is arranged to penetrate the base material 20 in the form shown in FIGS. 19a to 19c is shown in FIGS. 27a to 27c.
  • the first expansion-contraction suppressing member 231 can be arranged more firmly with respect to the base material 20.
  • FIGS. 27a to 27c as shown in FIG.
  • the first expansion-contraction suppressing member 231 that is disposed so as to penetrate is formed such that the portion near the second surface 22 of the base material 20 is thicker than the portion on the first surface 21 side. Therefore, it is prevented that the penetrating portion is pulled out to the first surface 21 side (upward in FIG. 27c) and the first expansion suppressing member 231 is separated from the base material 20. That is, in the embodiment illustrated in FIGS. 27 a to 27 c, the first expansion/contraction suppressing member 231 is more firmly arranged with respect to the base material 20.
  • the form in which the first expansion-contraction suppressing member 231 penetrates the base material 20 is not limited to the above, and various forms are possible.
  • the first expansion and contraction suppressing member 231 may penetrate in a form such that the base material 20 is caulked.
  • the first expansion suppressing member 231 can be more firmly arranged on the base material 20 than in the configurations of FIGS. 27a to 27c, and more particularly in the expansion and contraction direction D1. it can. Also in this mode, the above-described effects according to the third embodiment can be obtained.
  • the first expansion and contraction suppressing member 231 may be arranged on the base material 20 by screwing through the base material 20.
  • the screw member 231n used for screwing can also be considered as a part of the first expansion-contraction suppressing member 231.
  • the connected member 51 can be easily fixed to the base material 20 by screwing.
  • the connection of the connected member 51 to the connection terminal portion of the connected member 51 is preferably a simple contact, not by adhesion, it is easy to loosen the screw of the connected member 51 once fixed to the base material 20. It can be removed.
  • connection terminals are common to the plurality of connected members 51, the connected members 51 can be easily replaced. If the connected member 51 is an electronic component or the like, it is particularly useful when it needs to be replaced due to a failure or the like, or when it is replaced with another electronic component having a different function. Also in this mode, the above-described effects according to the third embodiment can be obtained.
  • FIG. 30a is a plan view, and the AA cross section and the BB cross section in FIG. 30a are shown in FIGS. 30b and 30c, respectively.
  • FIG. 30c as a BB cross section of FIG. 30a
  • the expansion and contraction suppressing member 230 includes an upper case 230t on the first surface 21 side of the substrate 20, a lower case 230b on the second surface 22 side, and the first case.
  • One case 230k is formed of a side surface case 230s in a direction normal to the surface 21, that is, in a direction of penetrating the base material 20.
  • the connected member 51 is an image of being contained in one case 230k.
  • the upper case 230t, the lower case 230b, and the side surface case 230s are all members that are usually difficult to expand and contract.
  • the side cases 230s corresponding to the first expansion/contraction suppressing member 231 are not directly connected to each other, they are connected via the upper case 230t and the lower case 230b.
  • the upper case 230t and the lower case 230b are usually difficult to expand and contract.
  • the side case 230s penetrating the base material 20 can be regarded as the first expansion/contraction suppressing member 231, and the upper case 230t and the lower case 230b can be regarded as the second expansion/contraction suppressing member 232, and the form of FIG. 30 is the same as that of the third embodiment. It can be called a form.
  • the expansion-contraction suppressing region 72 may be a virtual region that circumscribes the side surface case 230s and surrounds the side surface case 230s so as to have the shortest perimeter in plan view. it can.
  • At least a part of the wiring 52 in plan view exists in a region of the expansion/contraction suppressing region 72 that does not overlap with the first expansion/contraction suppressing member 231. ..
  • the expansion/contraction suppressing region 72 in which at least a part of the wiring 52 exists the expansion/contraction of the base material 20 is suppressed in the region that does not overlap with the first expansion/contraction suppressing member 231, so that the connection target member 51 and the wiring 52 are connected in the connecting portion 51a. It is difficult for the relative position to change.
  • connection portion 51a it is possible to obtain an effect that it is possible to prevent the electrical connection between the connected member 51 and the wiring 52 in the connection portion 51a from being damaged, and the occurrence of connection peeling and disconnection.
  • the wiring branch portion 52b or the wiring direction changing portion 52h is provided in a region of the expansion/contraction suppressing region 72 that does not overlap with the first expansion/contraction suppressing member 231, the branch portion 52b or the direction changing portion 52h. It is possible to suppress disconnection at 52h.
  • the connected member 51 has an image of being contained in one case 230k. Therefore, the connected member 51 typified by electronic components can be protected by the case. Since the wiring board 210 according to the present disclosure is preferably applied to the body, the present embodiment in which the connected member 51 such as an electronic component is protected by the case 230k is one of the preferred embodiments. .. Further, the case 230k is usually designed so that the upper case 230t and the lower case 230b can be easily attached and detached via the side case 230s. Since the upper case 230t and the lower case 230b can be easily attached and detached, the upper case 230t and the lower case 230b can be easily attached to and detached from the base material 20 through the side case 230s. Further, for example, the connected member 51 included in the upper case 230t also has an advantage that it can be easily attached to and detached from the base material 20.
  • the case 230k is generally difficult to expand and contract as a whole, and in that case, the connected member 51 included in the case 230k needs to be a material that is difficult to expand and contract. I don't.
  • the connected member 51 is a member that is difficult to expand and contract
  • the upper case 230t functions as a member that is difficult to expand and contract. Therefore, the same effect as in the case where the case 230k is difficult to expand and contract as a whole can be obtained.
  • the first expansion-contraction suppressing member 231 is projected from the connected member 51 in plan view.
  • the present invention is not limited to this, and the first expansion/contraction suppressing member 231 may not protrude from the connected member 51, and the entire first expansion/contraction suppressing member 231 may overlap the connected member 51.
  • the first expansion/contraction suppressing member 231 does not project from the connected member 51, all the first expansion/contraction suppressing members 231 overlap the connected member 51, and the first expansion/contraction suppressing The member 231 has a form that does not penetrate the base material 20.
  • the first expansion/contraction suppressing member 231 may penetrate the base material 20.
  • An example in which the first expansion-contraction suppressing member 231 is arranged so as to penetrate the base material 20 is shown in FIGS. 31a to 31c. By arranging it so as to penetrate therethrough, the first expansion/contraction suppressing member 231 can be arranged more firmly with respect to the base material 20.
  • the first expansion-contraction suppressing member 231 formed so as to penetrate therethrough is formed so that the portion near the second surface 22 of the base material 20 is thicker than the portion on the first surface 21 side.
  • the penetrating portion is pulled out to the first surface 21 side (upward in FIG. 31c) and the first expansion and contraction suppressing member 231 is separated from the base material 20. That is, in the embodiment illustrated in FIGS. 31 a to 31 c, the first expansion/contraction suppressing member 231 is more firmly arranged with respect to the base material 20. Even in this penetrating form, the above-described effects according to the third embodiment can be obtained.
  • the form in which the first expansion and contraction suppressing member 231 penetrates the base material 20 is not limited to the form shown in FIGS. 31a to 31c, and various forms are conceivable.
  • the first expansion/contraction suppressing member 231 may penetrate in a form such that the base material 20 is caulked.
  • the first expansion-contraction suppressing member 231 can be more firmly arranged on the base material 20 than in the configurations of FIGS. 21a to 21c, and more particularly in the expansion and contraction direction D1. it can. Also in this mode, the above-described effects according to the third embodiment can be obtained.
  • the first expansion and contraction suppressing member 231 may be arranged on the base material 20 by screwing through the base material 20.
  • the screw member 231n used for screwing can also be considered as a part of the first expansion-contraction suppressing member 231.
  • the connected member 51 can be easily fixed to the base material 20 by screwing. Further, if the connection of the connected member 51 to the connection terminal portion of the connected member 51 is preferably a simple contact, not by adhesion, it is easy to loosen the screw of the connected member 51 once fixed to the base material 20. It can be removed.
  • connection terminals are common to the plurality of connected members 51, the connected members 51 can be easily replaced. If the connected member 51 is an electronic component or the like, it is particularly useful when it needs to be replaced due to a failure or the like, or when it is replaced with another electronic component having a different function. Also in this mode, the above-described effects according to the third embodiment can be obtained.
  • the first expansion and contraction suppressing members 231 are arranged at four positions independently of each other so as to include the vicinity of the four corners of the connected member 51 in plan view, and each shape is shown as a rectangle. ..
  • each shape of the first expansion and contraction suppressing member 231 does not have to be a rectangle and may be a square, and need not be a rectangle. Therefore, a circle (FIG. 48), an ellipse (FIG. 49), any other polygon, It may be a figure with rounded corners or any other closed figure.
  • the expansion and contraction suppressing member 30 may be separated into at least two regions that are not in contact with each other. In FIGS. 18a to 18c and the like, the expansion/contraction suppressing member 30 is divided into four regions that are not in contact with each other. However, the present invention is not limited to this, and may be separated into eight regions which are not in contact with each other as shown in FIG.
  • each expansion-contraction suppressing member 30 in plan view is arbitrary, and whether or not it projects from the connected member 51 in plan view is also arbitrary. With these forms, it is possible to both suppress the occurrence of connection peeling and disconnection, and exhibit the advantages of the wiring board 10 having elasticity.
  • the connected member 51 may be a member that easily expands and contracts like the base material 20. Since the expansion/contraction suppressing member 30 is not separated in the first direction D1, that is, the expansion/contraction direction of the wiring board 10, even if the connected member 51 is a member that easily expands/contracts, the expansion/contraction suppressing member 30 causes the inside of the expansion/contraction suppressing region to be small. This is because the expansion and contraction of the base material 20 is suppressed. Therefore, in the present embodiment, even if the connected member 51 is a member that easily expands and contracts, it is possible to suppress the occurrence of connection peeling and disconnection. Further, as another example of the present embodiment, the form shown in FIG. 52 may be adopted. Also in this form, the expansion/contraction suppressing member 30 is not separated in the first direction D1, so that the same effect as that of the form shown in FIG. 51 can be obtained more reliably.
  • the first direction D1 that is, the direction orthogonal to the expansion and contraction direction of the wiring board 10 (up and down in FIGS. 51 and 52).
  • the plurality of expansion-contraction members 30 are separated from each other. Therefore, the effect of suppressing expansion and contraction cannot be expected in the direction orthogonal to the expansion and contraction direction.
  • the wiring board 10 in the direction orthogonal to the expansion/contraction direction, it is not necessary for the wiring board 10 to have elasticity, and since there is no expansion/contraction suppressing member 30, flexibility can be expected, and the wiring board 10 may be attached to a part of the human body. It may be preferable in various applications.
  • the expansion suppressing member 30 may have a plan view shape in which a plurality of expansion suppressing members 30 are connected to each other. 45a to c and FIG. 46, the expansion/contraction suppressing member 30 is not separated not only in the expansion/contraction direction of the wiring board 10 but also in the direction orthogonal to the expansion/contraction direction. That is, the expansion-contraction members 30 are all connected to each other (there are no separate parts) and are integrated.
  • expansion/contraction suppressing member 30 since the expansion/contraction suppressing member 30 is integrated, expansion/contraction of the base material 20 inside the expansion/contraction suppressing region can be suppressed more reliably, and the occurrence of connection peeling and disconnection can be suppressed more reliably. be able to.
  • the wiring 52 passes between the adjacent expansion/contraction suppressing members 30.
  • the virtual closed figure defining the inside and outside of the expansion/contraction suppressing region intersects with the wiring 52. Therefore, the wiring 52 outside the expansion/contraction suppressing region in which the base material 20 is expandable/contractible can extend to the inside of the expansion/contraction suppressing region, intersecting with the virtual closed figure defining the inside and outside of the expansion/contraction suppressing region.
  • the connection portion 51a that connects the wiring 52 and the connected member 51 can be inside the expansion and contraction suppressing region. Therefore, in the connection portion 51a, it is possible to prevent the electrical connection between the connected member and the wiring from being impaired, and the occurrence of connection peeling and disconnection.
  • the expansion and contraction suppressing members 30 separated into at least two regions that are not in contact with each other are adjacent to each other in the extending direction of the wiring 52, that is, the first direction D1.
  • 18A to 18C and the like are configurations in which the connected member 51 is a member that is difficult to expand and contract, and therefore, the expansion and contraction suppressing members 30 that are adjacent to each other in the extending direction of the wiring 52 (first direction D1) are relative to each other. The change in position is suppressed, that is, the expansion/contraction suppressing region can be satisfactorily secured.
  • connection portion 51a it is possible to prevent the electrical connection between the member to be connected and the wiring from being impaired, and the occurrence of connection peeling and disconnection.
  • the expansion and contraction suppressing member 30 in the configuration shown in FIGS. 51 and 52 that is, the first direction D1, that is, the expansion and contraction direction of the wiring board 10. It has higher flexibility than the non-separated form.
  • the shape of the expansion-contraction suppressing member 30 in a plan view is a direction parallel to the extending direction of the wiring 52 rather than a length in a direction orthogonal to the extending direction (first direction D1) of the wiring 52.
  • the length of is longer. That is, when the expansion/contraction suppressing member 30 has a rectangular shape or a rounded corner as shown in FIGS. 51 and 52, its long side is parallel to the extending direction of the wiring 52.
  • a rectangle having a side circumscribing the expansion and contraction suppressing member 30 and parallel to the extending direction of the wiring 52 is assumed, In the imaginary rectangle, the long side is parallel to the extending direction of the wiring 52.
  • connection portion 51a it is possible to prevent the electrical connection between the connected member and the wiring from being impaired, and the occurrence of connection peeling and disconnection.
  • the case 230k is an upper case 230t on the first surface 21 side of the base material 20, a lower case 230b on the second surface 22 side, and a side surface case in a direction normal to the first surface 21, that is, a direction penetrating the base material 20. It consists of 230s.
  • 34a shows a plan view, the EE section of which is shown in FIG. 34b and the FF section which is shown in FIG. 34c.
  • an upper case 230t in which the electronic component 51d is stored is provided on the upper surface side (the first surface 21 side of the base material 20) of the wiring board 410.
  • a conductive material penetrating the upper case 230t is provided in a portion of the lower surface of the upper case 230t that faces the connection portion 51a on the lower surface side (the side that faces the wiring substrate 410), and electrically connects the connection portion 51a and the electronic component 51d. Connected.
  • the side case 230s forming the side surface of the case 230k is partially connected to the lower case 230b forming the lower surface of the case 230k by penetrating the base material 20.
  • the upper case 230t and the side case 230s are designed with a detachable mechanism and dimensions, and both are fixed except when detaching. Further, the lower case 230b and the side case 230s are fixed.
  • the upper case 230t, the lower case 230b, and the side case 230s are all formed of members that are difficult to expand and contract.
  • the side case 230s fixed by the upper case 230t and the lower case 230b does not displace with respect to the upper case 230t and the lower case 230b. Therefore, the side case 230s penetrating the base material 20 exerts a function of suppressing expansion and contraction of the wiring board 410, that is, the case 230k functions as the expansion and contraction suppressing member 230 as a whole.
  • the side case 230s can be regarded as the first expansion/contraction suppressing member 231
  • the upper case 230t and the lower case 230b can be regarded as the second expansion/contraction suppressing member 232.
  • the side case 230s composed of four parts in plan view is each L-shaped, and is provided so as to circumscribe each of the four corners of the upper case 230t.
  • the expansion-contraction region 72 which is an imaginary region circumscribing the side surface case 230s composed of four portions and surrounding the four side surface cases 230s so as to have the shortest perimeter, is as illustrated. At least some of the six wires 52 are present in the expansion/contraction suppressing region 72 in a region that does not overlap the first expansion/contraction suppressing member 231 or the side case 230s.
  • the region that does not overlap with the first expansion/contraction suppressing member 231 suppresses the expansion/contraction of the base material 20, so that the relative position between the connected member 51 and the wiring 52 is unlikely to change in the connecting portion 51a. Therefore, it is possible to obtain an effect that it is possible to prevent the electrical connection between the connected member 51 and the wiring 52 in the connection portion 51a from being damaged, and the occurrence of connection peeling and disconnection.
  • the electronic component 51d is stored in the case 230k, so that the electronic component 51d can be protected by the case 230k. Therefore, the wiring board 410 according to an example of the present preferred embodiment can be preferably applied to the body. When applied to the body, the electronic component 51d can be protected from external contact, dirt, rain, and the like. Further, the upper case 230t storing the electronic component 51d and the side case 230s are detachable. Therefore, for example, when the electronic component 51d is replaced with an electronic component 51d having the same function when the electronic component 51d fails, or when the electronic component 51d having a different function to obtain a different function is replaced, the case where the electronic component 51d is stored It can be easily replaced every 230k.
  • the region sandwiched by the two expansion/contraction suppressing members 30 separated in the direction orthogonal to the first direction (expansion/contraction direction) D1 has expansion/contraction suppressed in the first direction (expansion/contraction direction) D1.
  • the extent to which the expansion and contraction is suppressed depends largely on the relationship between the direction in which the expansion and contraction suppressing member 30 is arranged separately and the expansion and contraction direction, and is therefore defined as the partial expansion and contraction suppressing region here.
  • the region sandwiched between the two expansion/contraction suppressing members 30 can be the partial expansion/contraction suppressing region.
  • the branch portion 52b and the direction changing portion 52h of the wiring are present in the uneven expansion and contraction suppressing region, it is considered that the occurrence of disconnection can be suppressed.
  • expansion and contraction is suppressed in a portion closer to the center in the expansion and contraction direction. Therefore, in the example of FIG. 43, which is separated in the direction orthogonal to the expansion/contraction direction and has two expansion/contraction suppressing members 30 of the same shape located at the same position in the expansion/contraction direction, protection from expansion/contraction in the vicinity of the center of the expansion/contraction suppressing member 30 in the expansion/contraction direction. It is preferable to dispose the target (the wiring branch portion 52b and the direction changing portion 52h). If the direction in which the two expansion/contraction suppressing members 30 are separated is close to the expansion/contraction direction, it is considered that the partial expansion/contraction suppressing region does not exist.
  • FIG. 44 If further expanded, the form shown in FIG. 44 is also conceivable.
  • the form of FIG. 44 only one expansion suppressing member 30 which is long in the expansion direction exists.
  • the uneven expansion/contraction suppressing region can also be considered.
  • the form of FIG. 44 is an example in which a wiring branch portion 52b and a direction changing portion 52h are present in the uneven expansion and contraction region. Also in the example of FIG. 44, it is preferable to dispose the objects (branching portion 52b of the wiring and the direction changing portion 52h) protected from expansion and contraction near the center of the expansion and contraction suppressing member 30 in the expansion and contraction direction.
  • Wiring boards are used as the above-mentioned devices and electronic products in the healthcare field, medical field, nursing field, electronics field, sports/fitness field, beauty field, mobility field, livestock/pet field, amusement field, fashion/apparel field. , Security field, military field, distribution field, education field, building materials/furniture/decoration field, environmental energy field, agriculture, forestry and fisheries field, robot field, etc.
  • a product attached to a part of the body such as a human arm is configured using the wiring board according to the present embodiment. Since the wiring board can be stretched, the wiring board can be brought into closer contact with a part of the body by, for example, attaching the wiring board to the body in a stretched state. Therefore, a good wearing feeling can be realized.
  • the wiring board can be extended, it can be installed or incorporated along a curved surface or a three-dimensional shape as well as a living body such as a person.
  • Examples of such devices and products include vital sensors, masks, hearing aids, toothbrushes, adhesive plasters, compresses, contact lenses, artificial hands, artificial legs, artificial eyes, catheters, gauze, liquid medicine packs, bandages, disposable bioelectrodes, diapers, home appliances, Sportswear, wristbands, hamaki, gloves, swimwear, supporters, balls, rackets, beauty masks for chemical penetration, electrostimulation diet products, pocket furnaces, automobile interiors, seats, instrument panels, strollers, drones, wheelchairs, tires, collars, leads, haps.
  • Tix device place mat, hat, clothes, glasses, shoes, insoles, socks, stockings, innerwear, muffler, ear pads, bags, accessories, rings, artificial nails, watches, personal ID recognition devices, helmets, packages, IC tags , PET bottles, stationery, books, carpets, sofas, bedding, lighting, door knobs, vases, beds, mattresses, cushions, wireless power feeding antennas, batteries, vinyl houses, robot hands, robot exteriors.
  • FIGS. 35a to 35d are schematic cross-sectional views of a portion corresponding to the AA cross section of FIG. 4a and are cross-sectional views corresponding to FIG. 4b.
  • a base material preparing step of preparing a base material 20 having elasticity is performed.
  • a stretching step of stretching the substrate 20 by applying tensile stress T to the substrate 20 is performed.
  • the expansion and contraction suppressing member 30 is provided on the first surface 21 side of the base material 20 in the state of being stretched by the tensile stress T, and further, as shown in FIG. An installation process of providing the wiring 52 on the first surface 21 side is performed.
  • a shrinking process for removing the tensile stress T from the base material 20 is performed.
  • the base material 20 contracts, and the wiring 52 provided on the base material 20 is also deformed.
  • the step of mounting the connected member 51 as shown in FIG. 35c may be included, but the step of mounting the connected member 51 is not limited to this and may be performed after the contracting step. ..
  • connection portion 51a that connects the wiring 52 and the connected member 51 can be arranged in the expansion/contraction suppressing region 70 in a region that does not overlap the expansion/contraction suppressing member 30.
  • connection portion 51a it is possible to prevent the electrical connection between the connected member and the wiring from being impaired, and the occurrence of connection peeling and disconnection. Further, in the case where the wiring branch portion 52b or the wiring direction changing portion 52h is provided in an area of the expansion and contraction suppressing area 70 that does not overlap with the expansion and contraction suppressing member 30, the branch portion 52b or the direction changing portion 52h is provided. It is possible to suppress disconnection (see FIG. 40).
  • FIGS. 36a to 36d are schematic cross-sectional views of a portion corresponding to the AA cross section of FIG. 27a and are cross-sectional views corresponding to FIG. 27b.
  • a base material preparing step of preparing a base material 20 having elasticity is performed.
  • an extension step of applying a tensile stress T to the base material 20 to extend the base material 20 is performed.
  • the 1st installation process which provides the wiring 52 on the 1st surface 21 side of the base material 20 in the state extended by the tensile stress T is implemented.
  • a shrinking step for removing the tensile stress T from the base material 20 is performed.
  • the base material 20 contracts as shown by the arrow LT, and the wiring 52 provided on the base material 20 is also deformed.
  • a second installation step of providing the expansion and contraction suppressing member 30 on the first surface 21 of the base material 20 from which the tensile stress T has been removed is performed.
  • a step of mounting the connected member 51 as shown in FIG. 36d may be included if necessary.
  • the expansion/contraction suppressing member 30 can be located in the region of the first surface 21 of the base material 20 in which the mountain portion 53 is formed. Also in this manufacturing method, the expansion/contraction suppressing region 70 is defined by providing the expansion/contraction suppressing member 30.
  • connection portion 51a that connects the wiring 52 and the connected member 51 can be arranged in the expansion/contraction suppressing region 70 in a region that does not overlap the expansion/contraction suppressing member 30.
  • connection portion 51a it is possible to prevent the electrical connection between the connected member and the wiring from being impaired, and the occurrence of connection peeling and disconnection. Further, in the case where the wiring branch portion 52b or the wiring direction changing portion 52h is provided in an area of the expansion and contraction suppressing area 70 that does not overlap with the expansion and contraction suppressing member 30, the branch portion 52b or the direction changing portion 52h is provided. It is possible to suppress disconnection.
  • FIGS. 37a to 37c are schematic cross-sectional views of a portion corresponding to the AA cross section of FIG. 24a.
  • the expansion and contraction suppressing member 30 includes the first surface 21 and the second surface 22 located on the opposite side of the first surface 21, and at least one of the first surface 21, the second surface 22 and the inside.
  • An elastic base material 20 provided with is prepared.
  • the expansion/contraction suppressing member 30 is provided on the first surface 21.
  • a stretching step of stretching the substrate 20 by applying tensile stress T to the substrate 20 is performed.
  • an installation step is performed in which the wiring 52 connected to the connected member 51 mounted on the wiring board 10 is provided on the first surface 21 side of the base material 20 that has been expanded by the expansion step.
  • a shrinking process for removing the tensile stress T from the base material 20 is performed.
  • the base material 20 contracts, and the wiring 52 provided on the base material 20 is also deformed.
  • a step of mounting the connected member 51 after the installation step may be included if necessary.
  • connection portion 51a that connects the wiring 52 and the connected member 51 can be arranged in the expansion/contraction suppressing region 70 in a region that does not overlap the expansion/contraction suppressing member 30.
  • connection portion 51a it is possible to prevent the electrical connection between the connected member and the wiring from being impaired, and the occurrence of connection peeling and disconnection. Further, in the case where the wiring branch portion 52b or the wiring direction changing portion 52h is provided in an area of the expansion and contraction suppressing area 70 that does not overlap with the expansion and contraction suppressing member 30, the branch portion 52b or the direction changing portion 52h is provided. It is possible to suppress disconnection (see FIGS. 40a and 40b).
  • the expansion/contraction suppressing member 30 has a stretchable substrate in which a stretchable silver wiring is provided on a stretchable substrate having no bellows shape, or a stretchable substrate as shown in FIG. 38 in a plan view. It may also be applied to a stretchable substrate on which the horseshoe-shaped wiring 52 is formed.
  • the wiring 52 can be arranged in the expansion suppressing region 70 in a region that does not overlap with the first expansion suppressing member 31. Therefore, in the connection portion 51a, it is possible to prevent the electrical connection between the member to be connected and the wiring from being impaired, and the occurrence of connection peeling and disconnection. Further, in the case where the wiring branch portion 52b or the wiring direction changing portion 52h is provided in a region of the expansion/contraction suppressing region 70 that does not overlap the first expansion/contraction suppressing member 31, the branch portion 52b or the direction changing portion 52h. It is possible to suppress disconnection at 52h.
  • a stretchable substrate in which stretchable silver wiring is provided on a stretchable base material that does not have a bellows shape, or a stretchable substrate in which horseshoe-shaped wiring is formed on a stretchable base material is, for example, stretched at all. It may be produced by forming stretchable silver wiring or horseshoe-shaped wiring on a base material that is not allowed to be formed, and then providing the component and the stretch suppressing member 30, but the manufacturing method is not particularly limited.
  • the wiring 52 extends parallel to the first direction D1
  • the wiring 52 extends parallel to the first direction D1 and the wiring 52 extends in a direction intersecting the first direction D1. Things may be included.
  • the expansion suppressing member 30 is It may be provided in a region that does not overlap with the expansion/contraction suppressing member 30 in the expansion/contraction suppressing region 70 that is a virtual region that is circumscribed and surrounds the expansion/contraction suppressing member 30 so that its circumferential length is the shortest.
  • FIGS. 1a to 34c a part of the present disclosure (FIGS. 1a to 34c) described above will be described more specifically by way of examples, but the present disclosure is limited to the description of the following examples unless it exceeds the gist. Not something.
  • Example 1 As the wiring board 510, the wiring 52, the expansion/contraction suppressing member 30 (the first expansion/contraction suppressing member 31, the second expansion/contraction suppressing member 32), and the connected member 51 on the first surface 21 of the base material 20 as shown in FIGS. was prepared.
  • 39a is a plan view showing a wiring substrate 510 according to an example, a cross-sectional view taken along the line AA of FIG. 39b, and a cross-sectional view taken along the line BB of FIG. 39c. Shown in.
  • the wiring 52, the expansion/contraction suppressing member 30, and the connected member 51 were attached to the base material 20 via the adhesive layer while being provided on the support substrate 40.
  • the base material 20 was formed by curing a two-component addition-condensation polydimersiloxane (hereinafter referred to as PDMS) so as to have a thickness of 1.5 mm.
  • the elastic coefficient of the base material 20 was 0.05 MPa.
  • a pressure-sensitive adhesive sheet 8146 (manufactured by 3M) was used as an adhesive layer for bonding the support substrate 40 to the base material 20.
  • the supporting substrate 40 is a PEN (polyethylene naphthalate) film having a thickness of 1 ⁇ m, and the elastic coefficient is set to 2.2 GPa.
  • the wiring 52 is Cu, and is formed by forming a film on the supporting substrate 40 by a vapor deposition method and then patterning it by photolithography. The wiring width was 200 ⁇ m, and the interval between adjacent wirings was 400 ⁇ m. After forming the wiring 52, an insulating film that integrally covers the wiring 52 and the support substrate 40 was formed. The connecting portion of the wiring 52 with the connected member 51 was not covered with an insulating film.
  • the insulating film was formed by printing a thermosetting insulating resin on the wiring 52 and the support substrate 40 by screen printing and then heating and curing the resin. The thickness of the insulating film was set to be about 50 ⁇ m on the wiring 52.
  • the connecting portion 51a for connecting the wiring 52 and the member 51 to be connected was formed on the end portion of the wiring 52 by screen printing a conductive adhesive (CL-3160 manufactured by Kaken Tech Co., Ltd.). Then, the connected member 51 was soldered to the connecting portion 51a. Further, the expansion-contraction suppressing member 30 was formed by applying a thermosetting epoxy resin at a predetermined position with a dispenser and thermosetting it. In the plan view, the expansion/contraction suppressing member 30 has the expansion/contraction suppressing member 30 in the four directions of the connected member 51 in which the wiring 52 extends, that is, in the expansion/contraction direction of the wiring substrate 510 (first direction D1) and in the direction orthogonal thereto. It was formed so as to project from the connected member 51 by 2 mm.
  • the support substrate 40 on which the wiring 52, the connected member 51 and the like are supported as described above is attached to the base material 20 by an adhesive layer. Then, the wiring board 510 according to the example was manufactured.
  • the wiring board 510 according to this example was expanded 10,000 times in the first direction D1 10,000 times, but the wiring 52 was not broken.
  • a comparative example in which the expansion and contraction suppressing member 30 is not provided in the wiring board 510 according to the embodiment is manufactured and is stretched 1.3 times in the first direction D1 10,000 times, the connection is peeled off at the connection portion 51a. It was happening. From this result, the usefulness of the expansion and contraction suppressing member 30, that is, the usefulness of the wiring board 510 according to the present embodiment was confirmed.
  • Example 2 the wiring board 510-2 in which the expansion/contraction suppressing member 30 (first expansion/contraction suppressing member 31, second expansion/contraction suppressing member 32) as shown in FIG. 53 was embedded inside the base material 20 was produced. Specifically, the first direction D1 from the outer peripheral edge of the first expansion suppressing member 31 to the outer peripheral edge of the second expansion suppressing member 32 with respect to the distance W between the mutually facing surfaces of the first expansion suppressing members 31 adjacent to each other or in plan view.
  • a wiring board 510-2 including the three types of expansion/contraction suppressing members 30 with the distance L changed in the direction orthogonal to the above was manufactured.
  • the three types of wiring boards 510-2 are referred to as Example 2-1, Example 2-2, and Example 2-3, respectively. Note that, for convenience of explanation, the expansion-contraction suppressing member 30 is shown by a solid line in FIG.
  • the expansion/contraction suppressing member 30 was cut out from a polyimide film (Ube Industries, Upilex, film having a thickness of 125 ⁇ m).
  • the base material 20 is formed by curing the resin while burying the expansion and contraction suppressing member 30 with polydimethylsiloxane (PDMS-1, elastic modulus 0.02 MPa) of liquid two-liquid addition condensation, and its thickness. Is 1 mm.
  • the distance W is common to the respective examples and is 12 mm.
  • the distance X between the outer end portions of the first expansion/contraction suppressing members 31 adjacent to each other in the first direction D1 is 15.6 mm, and the first expansion/contraction suppressing members adjacent to each other in the direction orthogonal to the first direction D1 in plan view.
  • Example 2-1 was formed such that the distance L/distance W was 0.15.
  • Example 2-2 was formed such that the distance L/distance W was 0.25.
  • Example 2-3 was formed such that the distance L/distance W was 0.50.
  • a wiring board including a rectangular expansion/contraction suppressing member having a distance L of 0 was prepared. And each Example prescribed
  • a grid-like scale having a pitch of 0.5 mm was provided in the rectangular area (AR in FIG. 53) on each of the base materials of Comparative Example and Comparative Example.
  • the comparative example was elongated by 150% in the first direction D1 and in the biaxial directions perpendicular to the first direction D1 to identify the position of the scale on the base material after the expansion.
  • each example was extended with the same force as when the comparative example was extended, and the position of the scale on the base material 20 of each example after extension was specified.
  • the expansion rate for the comparative example for each example is obtained.
  • the position of the scale after extension was specified using a CNC image measuring instrument “NEVIX VMR-H330” manufactured by Nikon Corporation.
  • Example 2 it was confirmed that as the second expansion/contraction suppressing member 32 is positioned deeper behind the first expansion/contraction suppressing member 31, the expansion/contraction suppressing effect of the base material 20 by the expansion/contraction suppressing member 30 is higher.
  • Example 3 As the wiring board 610, as shown in FIGS. 54a to 54c, the one in which the wiring 52, the expansion suppressing member 30 and the connected member 51 are provided on the first surface 21 of the base material 20 was manufactured.
  • 54a is a plan view showing a wiring board 610 according to an embodiment
  • FIG. 54b shows a sectional view taken along the line AA
  • FIG. 54c shows a sectional view taken along the line BB. Shown in.
  • the wiring 52, the expansion/contraction suppressing member 30, and the connected member 51 were attached to the base material 20 via the adhesive layer while being provided on the support substrate 40.
  • the base material 20 was formed by curing a two-component addition-condensation polydimersiloxane (hereinafter referred to as PDMS) so as to have a thickness of 1.5 mm.
  • the elastic coefficient of the base material 20 was 0.05 MPa.
  • a pressure-sensitive adhesive sheet 8146 (manufactured by 3M) was used as an adhesive layer for bonding the support substrate 40 to the base material 20.
  • the supporting substrate 40 is a PEN (polyethylene naphthalate) film having a thickness of 1 ⁇ m, and the elastic coefficient is set to 2.2 GPa.
  • the wiring 52 is Cu, and is formed by forming a film on the supporting substrate 40 by a vapor deposition method and then patterning it by photolithography. The wiring width was 200 ⁇ m, and the interval between adjacent wirings was 400 ⁇ m. After forming the wiring 52, an insulating film that integrally covers the wiring 52 and the support substrate 40 was formed. The connecting portion of the wiring 52 with the connected member 51 was not covered with an insulating film.
  • the insulating film was formed by printing a thermosetting insulating resin on the wiring 52 and the support substrate 40 by screen printing and then heating and curing the resin. The thickness of the insulating film was set to be about 50 ⁇ m on the wiring 52.
  • the connecting portion 51a for connecting the wiring 52 and the member 51 to be connected was formed on the end portion of the wiring 52 by screen printing a conductive adhesive (CL-3160 manufactured by Kaken Tech Co., Ltd.). Then, the connected member 51 was soldered to the connecting portion 51a. Further, the expansion-contraction suppressing member 30 was formed by applying a thermosetting epoxy resin at a predetermined position with a dispenser and thermosetting it. In the plan view, the expansion/contraction suppressing member 30 has the connected member 51 in any of the directions in which the wiring 52 extends at the four corners of the connected member 51, that is, in the expansion/contraction direction of the wiring board 310 (first direction D1) and the direction orthogonal thereto. The expansion and contraction suppressing member 30 was formed so as to protrude by 2 mm.
  • the support substrate 40 on which the wiring 52, the connected member 51 and the like are supported as described above is attached to the base material 20 by an adhesive layer. Then, the wiring board 310 according to the example was manufactured.
  • the wiring board 610 according to this example was expanded 10,000 times in the first direction D1 10,000 times, but the wiring 52 was not broken.
  • the comparative example in which the expansion and contraction suppressing member 30 is not provided in the wiring board 310 according to the example is manufactured and is stretched 1.3 times in the first direction D1 10,000 times, the connection is peeled off at the connection portion 51a. It was happening. From this result, the usefulness of the expansion and contraction suppressing member 30 was confirmed.
  • 55 and 56 are a plan view and a cross-sectional view showing the wiring board 710, respectively.
  • the cross-sectional view shown in FIG. 56 is a view when the wiring board 710 of FIG. 55 is cut along the line II-II.
  • the wiring board 710 includes a base material 20, electronic components 51, wirings 52, and reinforcing members 30.
  • each component of the wiring board 710 will be described.
  • the configuration referred to as the “expansion/contraction suppressing member 30” in the above-described embodiment is referred to as the reinforcing member 30.
  • the electronic component 51 has a configuration referred to as the “connected member 51”.
  • the base material 20 is a member configured to have elasticity.
  • the base material 20 includes a first surface 21 located on the electronic component 51 and wiring 52 sides and a second surface 22 located on the opposite side of the first surface 21.
  • the thickness of the base material 20 is, for example, 10 ⁇ m or more and 10 mm or less, and more preferably 20 ⁇ m or more and 3 mm or less. By setting the thickness of the base material 20 to 10 ⁇ m or more, the durability of the base material 20 can be ensured. Further, by setting the thickness of the base material 20 to 10 mm or less, it is possible to ensure the comfort of mounting the wiring board 710. If the thickness of the base material 20 is too small, the elasticity of the base material 20 may be impaired.
  • the stretchability of the base material 20 means that the base material 20 can expand and contract, that is, it can be expanded from a non-expanded state which is a normal state, and can be restored when released from this expanded state. A property that can be done.
  • the non-stretched state is the state of the base material 20 when no tensile stress is applied.
  • the stretchable substrate is preferably capable of stretching 1% or more from an unstretched state without breaking, more preferably 20% or more, and further preferably 75%. The above can be extended.
  • the wiring board 710 can have elasticity as a whole.
  • the wiring board 710 can be used in products and applications that require high expansion and contraction, such as being attached to a part of the body such as a human arm. It is generally said that a product attached to a person's armpit must have a stretchability of 72% in the vertical direction and 27% in the horizontal direction. Further, it is said that a product attached to a person's knees, elbows, buttocks, ankles, and armpits needs to have elasticity of 26% or more and 42% or less in the vertical direction. Further, it is said that a product attached to other parts of a person needs elasticity of less than 20%.
  • the difference between the shape of the base material 20 in the non-stretched state and the shape of the base material 20 when it is stretched from the non-stretched state and then returned to the non-stretched state is small.
  • This difference is also referred to as a shape change in the following description.
  • the shape change of the base material 20 is, for example, 20% or less in area ratio, more preferably 10% or less, and further preferably 5% or less.
  • the elastic coefficient of the base material 20 can be given as an example of the parameter indicating the elasticity of the base material 20.
  • the elastic modulus of the base material 20 is, for example, 10 MPa or less, and more preferably 1 MPa or less.
  • the entire wiring board 710 can be made elastic.
  • the elastic coefficient of the base material 20 is also referred to as a first elastic coefficient.
  • the first elastic modulus of the base material 20 may be 1 kPa or more.
  • the first elastic coefficient of the base material 20 As a method of calculating the first elastic coefficient of the base material 20, it is possible to adopt a method of performing a tensile test in accordance with JIS K6251 using a sample of the base material 20. It is also possible to employ a method in which the elastic coefficient of the sample of the base material 20 is measured by the nanoindentation method according to ISO14577. A nano indenter can be used as a measuring device used in the nano indentation method.
  • a method of preparing a sample of the base material 20 a method of taking out a part of the base material 20 from the wiring board 710 as a sample, or a method of taking out a part of the base material 20 before forming the wiring board 710 as a sample are considered.
  • the material forming the base material 20 is analyzed, and the first elastic coefficient of the base material 20 is calculated based on the existing database of the material. It is also possible to adopt the method.
  • the elastic modulus in the present application is an elastic coefficient under an environment of 25°C.
  • the bending rigidity of the base material 20 can be given as another example of the parameter indicating the elasticity of the base material 20.
  • the bending rigidity is the product of the second moment of area of the target member and the elastic modulus of the material forming the target member, and the unit is N ⁇ m 2 or Pa ⁇ m 4 .
  • the geometrical moment of inertia of the base material 20 is calculated based on the cross section when the portion of the base material 20 overlapping the wiring 52 is cut by the plane orthogonal to the expansion/contraction direction of the wiring board 710.
  • an elastomer can be cited. Further, as the material of the base material 20, for example, cloth such as woven fabric, knitted fabric, and non-woven fabric can be used.
  • a general thermoplastic elastomer and a thermosetting elastomer can be used, and specifically, a polyurethane elastomer, a styrene elastomer, a nitrile elastomer, an olefin elastomer, a vinyl chloride elastomer, an ester elastomer, Amide elastomer, 1,2-BR elastomer, fluorine elastomer, silicone rubber, urethane rubber, fluorine rubber, polybutadiene, polyisobutylene, polystyrene butadiene, polychloroprene and the like can be used.
  • the base material 20 may include silicone. Silicone has excellent heat resistance, chemical resistance, and flame retardancy, and is preferable as a material for the base material 20.
  • the electronic component 51 is connected to the wiring 52 by a connecting portion 51 a located between the electronic component 51 and the wiring 52.
  • the connecting portion 51 a includes the lower surface of the electronic component 51, in other words, the surface of the electronic component 51 facing the first surface 21 side of the base material 20, and the base material 20, particularly the wiring 52 on the base material 20.
  • the surface of the wiring 52 is a surface of the surface of the wiring 52 located on the side farther from the base material 20.
  • the connecting portion 51a is connected to the lower surface of the electronic component 51 and the surface of the wiring 52.
  • the connecting portion 51 a may be located on the side surface of the electronic component 51.
  • the connecting portion 51 a may be connected to the side surface of the wiring 52.
  • Such an electronic component 51 may be an active component, a passive component, or a mechanical component.
  • Examples of the electronic component 51 include transistors, LSIs (Large-Scale Integration), MEMS (Micro Electro Mechanical Systems), relays, light emitting elements such as LEDs, OLEDs, LCDs, sounding components such as sensors and buzzers, and vibrations that generate vibrations. Examples include components, cold heat generating components such as Peltier elements and heating wires for controlling heat generation by cooling, resistors, capacitors, inductors, piezoelectric elements, switches, and connectors. Of the above examples of the electronic component 51, the sensor is preferably used.
  • a temperature sensor for example, a temperature sensor, a pressure sensor, an optical sensor, a photoelectric sensor, a proximity sensor, a shear force sensor, a biological sensor, a laser sensor, a microwave sensor, a humidity sensor, a strain sensor, a gyro sensor, an acceleration sensor, a displacement sensor
  • Examples thereof include magnetic sensors, gas sensors, GPS sensors, ultrasonic sensors, odor sensors, brain wave sensors, current sensors, vibration sensors, pulse wave sensors, electrocardiographic sensors, and luminous intensity sensors.
  • biosensors are particularly preferred.
  • the biometric sensor can measure biometric information such as heartbeat, pulse rate, electrocardiogram, blood pressure, body temperature, and blood oxygen concentration.
  • the wiring 52 is a conductive member that is connected to the connecting portion 51 a of the electronic component 51.
  • the end portion of the wiring 52 is connected to the connecting portion 51 a of the electronic component 51.
  • a plurality of wirings 52 are provided on both sides of the electronic component 51, but the number of wirings 52 is not particularly limited.
  • the wiring 52 is provided on the base material 20 stretched by tension. In this case, when the tensile stress is removed from the base material 20 and the base material 20 contracts, the wiring 52 is deformed into a bellows shape and has the bellows-shaped portion 57, as shown in FIG. 57A.
  • the bellows-shaped portion 57 includes a peak portion and a valley portion in the normal direction of the first surface 21 of the base material 20.
  • reference numeral 53 represents a mountain portion appearing on the front surface of the wiring 52
  • reference numeral 54 represents a mountain portion appearing on the back surface of the wiring 52.
  • reference numeral 55 represents a valley portion appearing on the front surface of the wiring 52
  • reference numeral 56 represents a valley portion appearing on the back surface of the wiring 52.
  • the front surface is a surface of the surface of the wiring 52 that is located on the side farther from the base material 20
  • the back surface is the surface of the surface of the wiring 52 that is located on the side closer to the base material 20. Further, in FIG.
  • reference numerals 26 and 27 represent peaks and valleys that appear on the first surface 21 of the base material 20.
  • the wiring 52 is deformed into a bellows shape and has the bellows-shaped portion 57.
  • the crests 26 of the first surface 21 of the base material 20 correspond to the crests 53 and 54 of the bellows-shaped portion 57 of the wiring 52
  • the valleys 27 of the first surface 21 of the base material 20 are the bellows shape of the wiring 52. It corresponds to the valley portions 55 and 56 of the portion 57.
  • the direction in which the peaks and valleys of the bellows-shaped portion 57 appear repeatedly is also referred to as the first direction D1.
  • the wiring 52 extends parallel to the first direction D1.
  • the wiring 52 has a bellows-shaped portion 57 at a position displaced from the electronic component 51 and the reinforcing member 30 in the first direction D1.
  • the base material 20 has a rectangular shape including long sides parallel to the first direction D1.
  • the wiring board 710 may include the wiring 52 extending in a direction different from the first direction D1.
  • the direction in which the long sides extend may be different from the first direction D1.
  • the present invention is not limited to this.
  • the plurality of peaks and troughs of the bellows-shaped portion 57 may be arranged irregularly along the first direction D1.
  • the interval between two peaks adjacent to each other in the first direction D1 may not be constant.
  • symbol S1 represents the amplitude of the bellows-shaped portion 57 on the surface of the wiring 52 in the normal direction of the base material 20.
  • the amplitude S1 is, for example, 1 ⁇ m or more, and more preferably 10 ⁇ m or more. By setting the amplitude S1 to 10 ⁇ m or more, the wiring 52 is easily deformed following the expansion of the base material 20. Further, the amplitude S1 may be, for example, 500 ⁇ m or less.
  • the distance in the normal direction of the first surface 21 between the adjacent peaks 53 and valleys 55 is measured over a certain range in the length direction of the wiring 52, and the average thereof is calculated. It is calculated by obtaining.
  • the “certain range in the length direction of the wiring 52” is, for example, 10 mm.
  • a measuring device for measuring the distance between the adjacent crests 53 and valleys 55 a non-contact measuring device using a laser microscope or the like may be used, or a contact measuring device may be used. ..
  • the distance between the adjacent ridges 53 and valleys 55 may be measured based on an image such as a cross-sectional photograph. The same applies to the method of calculating the amplitudes S2, S3, and S4, which will be described later.
  • symbol S2 represents the amplitude of the bellows-shaped portion 57 on the back surface of the wiring 52.
  • the amplitude S2 is, for example, 1 ⁇ m or more, and more preferably 10 ⁇ m or more. Further, the amplitude S2 may be, for example, 500 ⁇ m or less.
  • the symbol S3 represents the amplitude of the peak portion 26 and the valley portion 27 that appear on the first surface 21 of the base material 20 in the portion overlapping the bellows-shaped portion 57. As shown in FIG.
  • the amplitude S3 of the peak portion 26 and the valley portion 27 of the first surface 21 of the base material 20 is the wiring 52. Is equal to the amplitude S2 of the bellows-shaped portion 57 on the back surface of the.
  • FIG. 57A shows an example in which the bellows-shaped portion does not appear on the second surface 22 of the base material 20, the present invention is not limited to this.
  • a bellows-shaped portion may appear on the second surface 22 of the base material 20.
  • reference numerals 28 and 29 represent peaks and valleys that appear on the second surface 22 of the base material 20.
  • the crests 28 of the second surface 22 appear at positions overlapping the troughs 27 of the first surface 21, and the troughs 29 of the second surface 22 correspond to the crests 26 of the first surface 21. They appear in overlapping positions.
  • the positions of the crests 28 and the troughs 29 of the second surface 22 of the base material 20 may not overlap the troughs 27 and the crests 26 of the first surface 21.
  • the number or cycle of the peaks 28 and valleys 29 of the second surface 22 of the base material 20 may be the same as or different from the number or cycle of the peaks 26 and valleys 27 of the first surface 21. May be.
  • the cycle of the crests 28 and the valleys 29 of the second surface 22 of the base material 20 may be longer than the cycle of the crests 26 and the valleys 27 of the first surface 21.
  • the cycle of the crests 28 and the valleys 29 of the second surface 22 of the base material 20 may be 1.1 times or more the cycle of the crests 26 and the valleys 27 of the first surface 21. 0.2 times or more, 1.5 times or more, or 2.0 times or more.
  • the cycle of the crests 28 and the valleys 29 of the second surface 22 of the base material 20 is larger than the cycle of the crests 26 and the valleys 27 of the first surface 21” means that the second surface of the base material 20 is the second. This is a concept including the case where the peaks and valleys do not appear on the surface 22. In FIG.
  • symbol S4 represents the amplitudes of the peaks 28 and the valleys 29 that appear on the second surface 22 of the base material 20 in the portion that overlaps the bellows-shaped portion 57.
  • the amplitude S4 of the second surface 22 may be the same as or different from the amplitude S3 of the first surface 21.
  • the amplitude S4 of the second surface 22 may be smaller than the amplitude S3 of the first surface 21.
  • the amplitude S4 of the second surface 22 may be 0.9 times or less, 0.8 times or less, or 0.6 times or less of the amplitude S3 of the first surface 21. Good.
  • the amplitude S4 of the second surface 22 may be 0.1 times or more, or 0.2 times or more of the amplitude S3 of the first surface 21.
  • the ratio of the amplitude S4 of the second surface 22 to the amplitude S3 of the first surface 21 tends to be large.
  • the amplitudes of the peaks 28 and the valleys 29 of the second surface 22 of the base material 20 are smaller than the amplitudes of the peaks 26 and the valleys 27 of the first surface 21” means that This is a concept including the case where the peaks and valleys do not appear on the surface 22.
  • FIG. 58A shows an example in which the positions of the crests 28 and the valleys 29 of the second surface 22 match the positions of the troughs 27 and the peaks 26 of the first surface 21, but the present invention is not limited to this. There is no such thing.
  • the material of the wiring 52 may be any material that can follow the expansion and contraction of the base material 20 by utilizing the elimination and generation of the bellows-shaped portion 57.
  • the material of the wiring 52 may or may not have elasticity itself. Examples of the material that does not have elasticity by itself that can be used for the wiring 52 include metals such as gold, silver, copper, aluminum, platinum, and chromium, and alloys containing these metals. When the material of the wiring 52 itself does not have elasticity, a metal film can be used as the wiring 52. When the material itself used for the wiring 52 has elasticity, the elasticity of the material is similar to that of the base material 20, for example.
  • Examples of the material having elasticity which can be used for the wiring 52 include a conductive composition containing conductive particles and an elastomer.
  • the conductive particles may be any particles that can be used for wiring, and examples thereof include particles of gold, silver, copper, nickel, palladium, platinum, carbon and the like. Among them, silver particles are preferably used.
  • the wiring 52 has a structure having resistance to deformation.
  • the wiring 52 has a base material and a plurality of conductive particles dispersed in the base material.
  • the wiring 52 can also be deformed according to the expansion and contraction of the base material 20.
  • the conductivity of the wiring 52 can be maintained by setting the distribution and shape of the conductive particles so that the contact between the plurality of conductive particles is maintained even when deformation occurs. ..
  • a general thermoplastic elastomer and a thermosetting elastomer can be used as a material forming the base material of the wiring 52.
  • a styrene elastomer, an acrylic elastomer, an olefin elastomer, a urethane elastomer, a silicone rubber, Urethane rubber, fluororubber, nitrile rubber, polybutadiene, polychloroprene and the like can be used.
  • resins and rubbers containing urethane-based or silicone-based structures are preferably used from the viewpoint of stretchability and durability.
  • the material forming the conductive particles of the wiring 52 for example, particles of silver, copper, gold, nickel, palladium, platinum, carbon or the like can be used. Among them, silver particles are preferably used.
  • the wiring 52 may have any thickness as long as it can withstand the expansion and contraction of the base material 20, and is appropriately selected according to the material of the wiring 52 and the like.
  • the thickness of the wiring 52 can be in the range of 25 nm or more and 50 ⁇ m or less, preferably in the range of 50 nm or more and 10 ⁇ m or less, and 100 nm or more and 5 ⁇ m or less. More preferably, it is within the following range.
  • the thickness of the wiring 52 may be in the range of 5 ⁇ m or more and 60 ⁇ m or less, preferably in the range of 10 ⁇ m or more and 50 ⁇ m or less, and 20 ⁇ m or more and 40 ⁇ m or less. It is more preferably within the range.
  • the width of the wiring 52 is, for example, 50 ⁇ m or more and 10 mm or less.
  • the method of forming the wiring 52 is appropriately selected according to the material and the like. For example, there is a method of forming a metal film on the base material 20 or on a support substrate 40 described later by a vapor deposition method, a sputtering method, a plating method, particularly a Cu plating method, and then patterning the metal film by a photolithography method.
  • the material of the wiring 52 itself has elasticity, for example, the conductive composition containing the conductive particles and the elastomer is formed in a pattern on the base material 20 or the support substrate 40 by a general printing method.
  • There is a method of printing There is a method of printing. Among these methods, a printing method that can be manufactured with high material efficiency and at low cost can be preferably used.
  • an insulating film that integrally covers the base material 20 or the support substrate 40 and the wiring 52 is provided on the base material 20 or the support substrate 40 described below and the wiring 52 provided on the base material 20 or the support substrate 40. It may be provided. However, the insulating film is not provided on the connection portion of the wiring 52 with the electronic component 51.
  • Such an insulating film can be formed by heating and hardening a thermosetting insulating resin or the like. The thickness of the insulating film may be, for example, 0.1 ⁇ m or more and 500 ⁇ m or less. Further, the insulating film may be formed by screen printing or the like.
  • the connecting portion 51a may be formed of, for example, a conductive adhesive, may be formed of a solder material, or may be a terminal integrated with the electronic component 51.
  • the base material 20 has an elastic modulus of 10 MPa or less. Therefore, when tensile stress is applied to the wiring board 710, the base material 20 can expand due to elastic deformation.
  • the wiring 52 is similarly expanded by elastic deformation, the total length of the wiring 52 increases and the cross-sectional area of the wiring 52 decreases, so that the resistance value of the wiring 52 increases. It is also conceivable that the elastic deformation of the wiring 52 may cause damage such as cracks in the wiring 52.
  • the wiring 52 has the bellows-shaped portion 57. Therefore, when the base material 20 extends, the wiring 52 can follow the extension of the base material 20 by deforming so as to reduce the undulations of the bellows-shaped portion 57, that is, by eliminating the bellows shape. it can. Therefore, it is possible to suppress an increase in the total length of the wiring 52 and a decrease in the cross-sectional area of the wiring 52 as the base material 20 extends. This can prevent the resistance value of the wiring 52 from increasing due to the expansion of the wiring board 710. Further, it is possible to prevent the wiring 52 from being damaged such as cracks.
  • the heights of the peaks 53 and 54 and the depths of the valleys 55 and 56 of the wiring 52 are caused by variations in the thickness of the base material 20, differences in distribution density of the wirings 52 provided on the base material 20, and the like. Therefore, it may vary depending on the position. If the heights of the crests 53 and 54 and the depths of the troughs 55 and 56 vary depending on the position, the degree of bending and bending of the wiring 52 locally increases, and the wiring 52 may be damaged. ..
  • the portion of the wiring 52 located around the electronic component 51 is A large stress is likely to occur at the time of expansion and contraction, and the electronic component 51 is likely to be caught below the electronic component 51, which may increase the risk of breakage.
  • the reinforcing member 30 on the base material 20
  • the reinforcing member 30 is a mechanism provided on the wiring board 710 to relieve the deformation of the base material 20 by reinforcing the base material 20.
  • the reinforcing member 30 is located between the first surface 21 and the lower surface of the electronic component 51 in the normal direction of the first surface 21 of the base material 20.
  • the reinforcing member 30 has a flat shape.
  • the reinforcing member 30 partially covers the portion of the wiring 52 that is close to the electronic component 51.
  • first reinforcing member 31 that extends so as to project from the electronic component 51 and is in contact with the base material 20 when the base material 20 is viewed along the normal direction of the first surface 21.
  • the member 31 and the second reinforcing member 32 located around the electronic component 51 and in contact with the base material 20 are included.
  • the first reinforcing member 31 extends from the second reinforcing member 32
  • the second reinforcing member 32 has a rectangular frame shape in a plan view and a rectangular electronic shape in a plan view. It is located all around the four sides of the component 51.
  • reinforcing members 31, 32 when the items common to the first reinforcing member 31 and the second reinforcing member 32 are described, they may be referred to as “reinforcing members 31, 32”.
  • the reinforcing member 30 includes four first reinforcing members 31, and each first reinforcing member 31 extends so as to project from each of the four corners of the second reinforcing member 32 that is rectangular in plan view. .. Specifically, each of the first reinforcing members 31 extends and extends from each of the four corners of the second reinforcing member 32 in both the first direction D1 and the direction orthogonal to the first direction D1 in plan view.
  • the shape of the first reinforcing member 31 is not particularly limited, but in the example shown in FIG. 55, it is rectangular in plan view. One of the four sides of the four sides of the first reinforcing member 31 facing each other is parallel to the first direction D1, and the other pair of sides is parallel to the direction orthogonal to the first direction D1. ing.
  • the wiring 52 includes the first reinforcing member 31 and the electronic component 51. Intersect with at least one straight line that virtually connects Specifically, in FIG. 55, on one side of the electronic component 51 in the first direction D1, in other words, on the left side, wiring is performed with respect to a straight line L1 that virtually connects the first reinforcing member 31 located on the upper left side and the electronic component 51. 52 intersects with each other, and the wiring 52 intersects with a straight line L2 virtually connecting the first reinforcing member 31 and the electronic component 51 located on the lower left side.
  • the wiring 52 intersects with a straight line L3 virtually connecting the first reinforcing member 31 located on the upper right side and the electronic component 51.
  • the wiring 52 intersects a straight line L4 that virtually connects the first reinforcing member 31 and the electronic component 51 located on the lower right side.
  • the wiring 52 runs between the first reinforcing members 31 that are adjacent to each other in the direction orthogonal to the first direction D1.
  • the wiring 52 intersects the straight lines L1 to L4.
  • the straight lines L1 to L4 virtually connect the first reinforcing member 31 and the electronic component 51. Needless to say, the wiring 52 intersects a myriad of straight lines different from.
  • the first reinforcing member 31 is in contact with at least one of the electronic component 51 and the connecting portion 51a via the second reinforcing member 32, and the base material 20. Touch.
  • part of the second reinforcing member 32 is inserted below the electronic component 51 and is in contact with the lower surface of the electronic component 51 and the side surface of the connecting portion 51a. Therefore, the first reinforcing member 31 is the second reinforcing member. It comes into contact with both the electronic component 51 and the connecting portion 51 a via 32.
  • the second reinforcing member 32 is bonded to the lower surface of the electronic component 51 and the side surface of the connecting portion 51 a by curing, so that the first reinforcing member 31 causes the second reinforcing member 32 to intervene.
  • the base material 20 is also bonded.
  • the reinforcing member 30 causes a part of the second reinforcing member 32 to enter below a part of the lower surface of the electronic component 51. May be located below the entire lower surface of the.
  • the base material 20 is defined by determining the positional relationship between the first reinforcing member 31 and the wiring 52 and the positional relationship between the first reinforcing member 31 and the electronic component 51 or the connecting portion 51a as described above.
  • stress concentrates on the first reinforcing member 31 and the electronic component 51 located at both ends of the straight line L1, so that the stress is more concentrated than the straight line L1 on the base material 20.
  • the shrinkage on the electronic component 51 side is alleviated.
  • the first reinforcing member 31 and the electronic component 51 located at both ends of the straight line L1 have a resistance against the extension of the base material 20. It is applied to the material 20. As a result, the deformation of the portion of the base material 20 around the electronic component 51 is relaxed, so that a large stress is locally generated in the portion of the wiring 52 on the base material 20 around the electronic component 51, and It is possible to prevent the 52 from being caught below the electronic component 51.
  • the wiring 52 passes between the adjacent first reinforcing members 31.
  • the base material 20 shrinks in a direction intersecting the straight line L1
  • the first reinforcing members 31 located on both sides of the wiring 52 give the base material 20 a resistance force against the extension of the base material 20. .. Accordingly, the deformation of the portion of the base material 20 around the electronic component 51 is relieved in a wide range, so that the wiring 52 can be effectively protected.
  • the first reinforcing member 31 is the first expansion/contraction suppressing member and the electronic component 51 is the second expansion/contraction suppressing member
  • “along the normal direction of the first surface 21” When the base material 20 is viewed, at least a part of the wiring 52 is circumscribed to the plurality of first expansion/contraction suppressing members (first reinforcing members 31), and the first expansion/contraction suppressing member has the shortest circumferential length. It exists in a region that does not overlap with the first expansion-contraction suppressing member, among the expansion-contraction suppressing regions that are virtual regions surrounded by.
  • first reinforcing member 31 is the first expansion/contraction suppressing member and the second reinforcing member 52 is the second expansion/contraction suppressing member
  • first reinforcing member 31 is the first expansion/contraction suppressing member
  • second reinforcing member 52 is the second expansion/contraction suppressing member
  • “along the normal direction of the first surface 21” When the base material 20 is viewed from above, at least a part of the wiring 52 circumscribes the plurality of first expansion/contraction suppressing members (first reinforcing members 31), and the first expansion/contraction suppressing member has the shortest perimeter. It can be said that it exists in a region that does not overlap with the first expansion-contraction suppressing member, among the expansion-contraction suppressing regions that are imaginary regions that are enclosed as described above.
  • the wiring 52 intersects with the straight line L1 virtually connecting the first reinforcing member 31 located on the upper left side and the electronic component 51, and the first reinforcing member 31 located on the lower left side.
  • the wiring 52 intersects a straight line L2 that virtually connects the electronic component 51 with the electronic component 51.
  • the wiring 52 only intersects the straight line L1 virtually connecting the first reinforcing member 31 located on the upper left side and the electronic component 51.
  • the wiring 52 is effectively protected. Even if only the first reinforcing member 31 located on the lower left side is provided without providing the first reinforcing member 31 located on the upper left side, the wiring 52 is effectively protected. This also applies to the first reinforcing member 31 located on the right side in the first direction D1 in FIG. 55.
  • the first reinforcing member 31 continuously extends from the second reinforcing member 32, but the first reinforcing member 31 extends in the direction in which the wiring 52 extends, that is, in the first direction D1. It may be divided.
  • the electronic component 51 and the reinforcing member 30 are provided on the base material 20 at positions displaced from the bellows-shaped portion 57 of the wiring 52 in the first direction D1.
  • the electronic component 51 and the reinforcing member 30 are provided in a state where the base material 20 is stretched by applying tension, in the first surface 21 or the wiring 52 of the base material 20 after the tension is removed.
  • the peak portion and the valley portion of the bellows-shaped portion 57 57B, peaks 71, 81 and valleys 72, 82 having a large cycle and a small amplitude may be formed. That is, in the part where the wiring 52 is located in the base material 20, the part where the electronic component 51 and the reinforcing member 30 are located, and in the direction orthogonal to the first direction D1, it is adjacent to the first reinforcing member 31 in plan view.
  • a peak portion and a valley portion may be formed in each of the regions including the portion.
  • the peaks 71 and 81 and the valleys 72 and 82 tend to gradually increase in cycle and decrease in amplitude as they approach the electronic component 51.
  • the electronic component 51 and the reinforcing member 30 are provided in a state where the base member 20 is stretched by applying tension, the electronic component 51 and the reinforcing member 30 in the first surface 21 and the wiring 52 of the base member 20 are positioned. There may be a case where the peak portion and the valley portion are not formed in the portion to be formed.
  • the reinforcing member 30 when the reinforcing member 30 is provided by removing the tension after providing the electronic component 51 and the wiring 52 in the state where the substrate 20 is stretched by applying the tension, the first surface 21 of the substrate 20 In some cases, the peaks and troughs having the same period and amplitude as the peaks and troughs of the bellows-shaped portion 57 may be formed in the portion of the wiring 52 where the reinforcing member 30 is located.
  • the electronic component 51 and the reinforcing member 30 are provided in a state where the base material 20 is stretched by applying a tension, and then the tension is removed, as shown in FIG. 58B, the electronic component 51 in the base material 20.
  • the portion where the reinforcing member 30 is located is in an expanded state, and the thickness may be smaller than the portion where the bellows-shaped portion 57 is provided in the wiring 52 of the base material 20.
  • it is preferable to apply a rubber material 90 for example, to make the thickness of the base material 20 uniform, as shown in FIG. 58B.
  • the wiring board 710 may further include an adhesive layer located on the surface of the reinforcing members 31 and 32 opposite to the base material 20.
  • the adhesive layer is provided to attach the wiring board 710 to an object such as a human body.
  • the adhesive layer may be located on the surface of the wiring 52 opposite to the base material 20, the surface of the electronic component 51 opposite to the base material 20, or the like.
  • a general adhesive can be used and is appropriately selected according to the application of the wiring board 710 and the like.
  • acrylic adhesives, silicone adhesives, urethane adhesives, rubber adhesives and the like can be mentioned.
  • the thickness of the adhesive layer is appropriately selected according to the application of the elastic circuit substrate so that the adhesive layer can expand and contract and the wiring board 710 can be attached to an object.
  • the thickness of the adhesive layer is, for example, in the range of 10 ⁇ m or more and 100 ⁇ m or less.
  • the reinforcing members 31 and 32 may have a modulus of elasticity larger than the first modulus of elasticity of the base material 20.
  • the elastic coefficients of the reinforcing members 31 and 32 are, for example, 0.1 GPa or more and 500 GPa or less, and more preferably 0.1 GPa or more and 100 GPa or less.
  • the elastic coefficients of the reinforcing members 31 and 32 are too low, it may be difficult to control expansion and contraction. In addition, if the elastic coefficients of the reinforcing members 31 and 32 are too high, the reinforcing members 31 and 32 may suffer structural damage such as cracks or cracks when the base material 20 expands and contracts.
  • the elastic coefficients of the reinforcing members 31 and 32 may be 1.1 times or more and 1,000,000 times or less, and more preferably 100,000 times or less the first elastic coefficient of the base material 20. In the following description, the elastic coefficients of the reinforcing members 31 and 32 are also referred to as second elastic coefficients. Note that “overlapping” means that the two constituent elements overlap when viewed along the normal direction of the first surface 21 of the base material 20.
  • the method of calculating the second elastic modulus of the reinforcing members 31 and 32 is appropriately determined according to the form of the reinforcing members 31 and 32.
  • the method of calculating the second elastic coefficient of the reinforcing members 31 and 32 may be the same as or different from the method of calculating the elastic coefficient of the base material 20 described above.
  • the elastic modulus of the support substrate 40 described later is also the same.
  • a method of calculating the elastic coefficient of the reinforcing members 31 and 32 or the supporting substrate 40 a method of performing a tensile test according to ASTM D882 using a sample of the reinforcing members 31 and 32 or the supporting substrate 40 is adopted. can do.
  • a metal material can be used as the material forming the reinforcing members 31 and 32.
  • metal materials include copper, aluminum, stainless steel and the like.
  • a solder material may be used as the metal material.
  • a general thermoplastic elastomer an acrylic-based, urethane-based, epoxy-based, polyester-based, epoxy-based, vinyl ether-based, polyene-thiol-based, or silicone-based oligomer, A polymer or the like may be used as a material for forming the reinforcing members 31 and 32.
  • the reinforcing members 31 and 32 may have transparency. Further, the reinforcing members 31 and 32 may have a light blocking property, for example, a property of blocking ultraviolet rays. For example, the reinforcing members 31 and 32 may be black. Further, the colors of the reinforcing members 31 and 32 and the color of the base material 20 may be the same. In the present embodiment, the thickness of the reinforcing members 31 and 32 is, for example, 1 ⁇ m or more and 100 ⁇ m or less. However, in the case of the structure shown in FIGS. 60 and 61 described later, the thickness of the reinforcing members 31 and 32 may be several mm, for example, 1 mm or more and 5 mm or less.
  • the second elastic coefficients of the reinforcing members 31 and 32 may be equal to or lower than the first elastic coefficient of the base material 20.
  • the second elastic modulus of the reinforcing members 31 and 32 is, for example, 10 MPa or less, and may be 1 MPa or less.
  • the second elastic modulus of the reinforcing members 31 and 32 may be 1 time or less, or 0.8 times or less that of the first elastic coefficient of the base material 20.
  • the second elastic coefficients of the reinforcing members 31 and 32 are equal to or lower than the first elastic coefficient of the base material 20
  • a general thermoplastic elastomer and a thermosetting elastomer are used as the material forming the reinforcing members 31 and 32.
  • examples thereof include styrene elastomer, acrylic elastomer, olefin elastomer, urethane elastomer, silicone rubber, urethane rubber, fluororubber, nitrile rubber, polybutadiene and polychloroprene.
  • the thickness of the reinforcing members 31 and 32 is, for example, 1 ⁇ m or more and 100 ⁇ m or less in the present embodiment. However, in the case of the structure shown in FIGS. 60 and 61 described later, the thickness of the reinforcing members 31 and 32 may be several mm, for example, 1 mm or more and 5 mm or less.
  • the elastic coefficient of the first reinforcing member 31 and the elastic coefficient of the second reinforcing member 32 may be the same. In this case, since the first reinforcing member 31 and the second reinforcing member 32 can be simultaneously formed in the same step, the step of forming the reinforcing members 31 and 32 becomes simple. Further, the elastic coefficient of the first reinforcing member 31 and the elastic coefficient of the second reinforcing member 32 may be different. In this case, the elastic coefficient of the first reinforcing member 31 is preferably higher than the elastic coefficient of the second reinforcing member 32.
  • the material and thickness of the first reinforcing member 31 and the material and thickness of the second reinforcing member 32 may be the same. In this case, the step of forming the reinforcing members 31 and 32 becomes simple. The material and thickness of the first reinforcing member 31 and the material and thickness of the second reinforcing member 32 may be different.
  • the characteristics of the reinforcing members 31 and 32 may be expressed by bending rigidity instead of elastic modulus.
  • the second moment of area of the reinforcing members 31 and 32 is calculated based on the cross section when the reinforcing members 31 and 32 are cut by the plane orthogonal to the expansion/contraction direction of the wiring board 710.
  • the bending rigidity of the reinforcing members 31 and 32 may be 1.1 times or more of the bending rigidity of the base material 20, more preferably 2 times or more, and further preferably 10 times or more.
  • the bending rigidity of the reinforcing members 31 and 32 may be equal to or less than the bending rigidity of the base material 20.
  • the bending rigidity of the reinforcing members 31 and 32 may be 1 time or less, or 0.8 times or less that of the base material 20.
  • the method of forming the reinforcing members 31 and 32 is appropriately selected according to the material and the like.
  • a method of forming a metal film on the base material 20 or a supporting substrate 40 described later by a vapor deposition method, a sputtering method, or the like and then patterning the metal film by a photolithography method can be mentioned.
  • a Cu wiring 52 and a part of the Cu first reinforcing member 31 are formed on the base material 20 or a support substrate 40 described later, and then, on a part of the Cu first reinforcing member 31.
  • another portion of the first reinforcing member 31 may be formed of a solder material by printing a metal mask.
  • the first reinforcing member 31 made of a solder material may be formed at the same time as the connecting portion 51a made of a solder material for connection with the electronic component 51 formed on the wiring 52. Then, after that, at the time of reflow for melting the solder material, the first reinforcing member 31 made of the solder material may spread on the surface of the first reinforcing member 31 made of Cu. Further, a method of forming a resin film such as an organic layer on the entire surface of the base material 20 or the supporting substrate 40 by a printing method such as a spin coating method or the like and then patterning the resin film by a photolithography method may be mentioned.
  • a method of printing the material of the reinforcing members 31 and 32 in a pattern on the base material 20 or the support substrate 40 by a general printing method there is a method of printing the material of the reinforcing members 31 and 32 in a pattern on the base material 20 or the support substrate 40 by a general printing method.
  • a printing method that can be manufactured with high material efficiency and at low cost can be preferably used.
  • screen printing or printing with a dispenser can be used. After components such as electronic components are mounted on the base material 20 or the support substrate 40, printing with a dispenser can form the reinforcing members 31 and 32 more efficiently.
  • a base material preparing step of preparing a base material 20 having elasticity is performed.
  • a stretching step of stretching the substrate 20 by applying tensile stress T to the substrate 20 is performed.
  • a step of providing the electronic component 51 and the wiring 52 on the first surface 21 of the base material 20 which is stretched by the tensile stress T is performed.
  • the step of providing the reinforcing member 30 including the first reinforcing member 31 and the second reinforcing member 32 on the first surface 21 of the base material 20 in the state of being elongated by the tensile stress T is performed.
  • the wiring and the electronic component are usually connected.
  • the wiring may be caught below the electronic component, in other words, on the base material side of the electronic component.
  • a large stress may locally occur in the wiring.
  • the wiring 52 on the wiring board 710 intersects at least one straight line virtually connecting the first reinforcing member 31 and the electronic component 51.
  • the wiring board 710 is used in the healthcare field, medical field, nursing field, electronics field, sports field, fitness field, beauty field, mobility field, livestock/pet field, amusement field, fashion/apparel field, security field, military field. , Distribution field, education field, building materials/furniture/decoration field, environmental energy field, agriculture, forestry and fisheries field, robot field, etc.
  • a product to be attached to a part of the body such as a human arm is configured using the wiring board 710 according to the present embodiment. Since the wiring board 710 can be expanded, the wiring board 710 can be brought into closer contact with a part of the body by, for example, attaching the wiring board 710 to the body in an expanded state. Therefore, a good wearing feeling can be realized.
  • the wiring board 710 can be extended, the wiring board 710 can be installed or incorporated along a curved surface or a three-dimensional shape, not limited to a living body such as a person.
  • Examples of such products include vital sensors, masks, hearing aids, toothbrushes, bandages, compresses, contact lenses, artificial hands, artificial legs, artificial eyes, catheters, gauze, drug packs, bandages, disposable bioelectrodes, diapers, home appliances, sportswear.
  • Wristbands Wristbands, hemaki, gloves, swimwear, supporters, balls, rackets, liquid medicine beauty masks, electrostimulation diet products, pocket furnaces, automobile interiors, seats, instrument panels, strollers, drones, wheelchairs, tires, collars, leads, haptics devices , Place mats, hats, clothes, glasses, shoes, insoles, socks, stockings, innerwear, mufflers, ear pads, bags, accessories, rings, artificial nails, watches, personal ID recognition devices, helmets, packages, IC tags, pets
  • Examples include bottles, stationery, books, carpets, sofas, bedding, lighting, door knobs, vases, beds, mattresses, cushions, wireless power feeding antennas, batteries, vinyl houses, robot hands, and robot exteriors.
  • the first reinforcing member 31 and the second reinforcing member 32 of the reinforcing member 30 cross the electronic component 51 from the first surface 21 in the normal direction of the first surface 21 of the base material 20.
  • the surface of the first reinforcing member 31 and the surface of the second reinforcing member 32 are at the same position as the surface of the electronic component 51 in the normal direction of the first surface 21 of the base material 20 or at a position not exceeding the surface of the electronic component 51.
  • Located in. The surface is a surface of the surface of the first reinforcing member 31, the surface of the second reinforcing member 32, or the surface of the electronic component 51, which is located farther from the base material 20.
  • the surface of the first reinforcing member 31 and the surface of the second reinforcing member 32 are continuous.
  • the thickness of the first reinforcing member 31 and the thickness of the second reinforcing member 32 may be different from each other.
  • the thickness of the second reinforcing member 32 may be smaller than the thickness of the first reinforcing member 31.
  • the thickness of the first reinforcing member 31 may not be constant, and the thickness of the second reinforcing member 32 may not be constant.
  • the thickness of the first reinforcing member 31 may decrease as the distance from the electronic component 51 increases.
  • the surface of the first reinforcing member 31 and the surface of the second reinforcing member 32 may be located between the front surface and the back surface of the electronic component 51.
  • the first reinforcing member 31 and the second reinforcing member 32 of the reinforcing member 30 are arranged so as to cross the electronic component 51 from the first surface 21 in the normal direction of the first surface 21 of the base material 20. Extend to. The surface of the first reinforcing member 31 and the surface of the second reinforcing member 32 exceed the surface of the electronic component 51 in the normal direction of the first surface 21 of the base material 20. The surface of the first reinforcing member 31 and the surface of the second reinforcing member 32 are continuous. The second reinforcing member 32 is located not only on the periphery of the electronic component 51 but also on the surface of the electronic component 51.
  • the thickness of the first reinforcing member 31 and the thickness of the second reinforcing member 32 may be different from each other.
  • the thickness of the second reinforcing member 32 may be smaller than the thickness of the first reinforcing member 31.
  • the thickness of the first reinforcing member 31 may not be constant, and the thickness of the second reinforcing member 32 may not be constant.
  • the thickness of the first reinforcing member 31 may decrease as the distance from the electronic component 51 increases.
  • the surface of the first reinforcing member 31 may be located between the front surface and the back surface of the electronic component 51.
  • the first reinforcing member 31 and the second reinforcing member 32 of the reinforcing member 30 are located closer to the first surface 21 side of the base material 20 than the wiring 52. More specifically, the first reinforcing member 31 and the second reinforcing member 32 may be located between the wiring 52 and the base material 20. In this case, the first reinforcing member 31 and the second reinforcing member 32 may be located on the first surface 21 of the base material 20, or may be located in the recess provided in the first surface 21 of the base material 20. You may have. Further, as shown in FIG.
  • a part of the wiring 52 is formed so as to ride on the first reinforcing member 31 and the second reinforcing member 32, so that the first reinforcing member 31 and the second reinforcing member 31 of the reinforcing member 30 are formed.
  • the reinforcing member 32 may be located closer to the first surface 21 side of the base material 20 than the wiring 52.
  • the first reinforcing member 31 and the second reinforcing member 32 of the reinforcing member 30 may be provided inside the base material 20 and not exposed from the base material 20 to the outside. .. Further, as shown in FIG. 62C, the first reinforcing member 31 and the second reinforcing member 32 of the reinforcing member 30 may be located on the second surface 22 side of the base material 20. When the base material 20 is stretched by applying tension, the electronic component 51 and the wiring 52 are provided on the first surface 21, the reinforcing member 30 is provided on the second surface 22, and then the tension is removed. A bellows-shaped portion 57 (see FIG.
  • peaks and troughs having a larger cycle and smaller amplitude than the peaks and troughs of the bellows-shaped portion 57 are formed. There are cases.
  • the wiring board 710 includes the base material 20, the reinforcing member 30, the support substrate 40, the electronic component 51, and the wiring 52. Then, the reinforcing member 30 indirectly contacts the base material 20 via the support substrate 40.
  • the support substrate 40 is a plate-shaped member configured to have a stretchability lower than that of the base material 20.
  • the support substrate 40 includes a second surface 42 located on the base material 20 side and a first surface 41 located on the opposite side of the second surface 42.
  • the support substrate 40 supports the electronic component 51, the wiring 52, and the reinforcing member 30 on the first surface 41 side thereof.
  • the support substrate 40 is joined to the first surface of the base material 20 on the second surface 42 side.
  • an adhesive layer containing an adhesive may be provided between the base material 20 and the support substrate 40.
  • an acrylic adhesive, a silicone adhesive, or the like can be used as a material forming the adhesive layer.
  • the thickness of the adhesive layer is, for example, 5 ⁇ m or more and 200 ⁇ m or less.
  • the second surface 42 of the support substrate 40 may be bonded to the first surface 21 of the base material 20 by a method of molecularly modifying the non-adhesive surface and performing molecular adhesive bonding. In this case, the adhesive layer may not be provided between the base material 20 and the support substrate 40.
  • the support substrate 40 supporting the electronic component 51, the wiring 52, and the reinforcing member 30 is bonded to the base material 20 thus extended. It When the tensile stress is removed from the base material 20 bonded to the support substrate 40 and the base material 20 contracts, the bellows-shaped portion 57 is formed on the support substrate 40 and the wiring 52.
  • the characteristics and dimensions of the support substrate 40 are set so that the bellows-shaped portion 57 is easily formed.
  • the support substrate 40 has a modulus of elasticity larger than the first modulus of elasticity of the base material 20.
  • the elastic coefficient of the support substrate 40 is also referred to as the third elastic coefficient.
  • the third elastic coefficient of the support substrate 40 is, for example, 100 MPa or more, and more preferably 1 GPa or more.
  • the third elastic modulus of the support substrate 40 may be 100 times or more and 50,000 times or less, preferably 1000 times or more and 10,000 times or less than the first elastic coefficient of the base material 20.
  • the elastic modulus of the support substrate 40 is too low, the support substrate 40 is likely to be deformed during the step of forming the reinforcing members 31 and 32, and as a result, the positioning of the reinforcing members 31 and 32 with respect to the electronic component 51 and the wiring 52 is performed. It gets harder. If the elastic modulus of the support substrate 40 is too high, it becomes difficult to restore the base material 20 when it relaxes, and the base material 20 is likely to crack or break.
  • the thickness of the support substrate 40 is, for example, 500 nm or more and 10 ⁇ m or less, and more preferably 1 ⁇ m or more and 5 ⁇ m or less. If the thickness of the support substrate 40 is too small, it becomes difficult to handle the support substrate 40 in the process of manufacturing the support substrate 40 and the process of forming a member on the support substrate 40. If the thickness of the support substrate 40 is too large, it becomes difficult to restore the base material 20 when it relaxes, and the target expansion and contraction of the base material 20 cannot be obtained.
  • polyethylene naphthalate, polyimide, polyethylene terephthalate, polycarbonate, acrylic resin or the like can be used as the material forming the support substrate 40.
  • polyethylene naphthalate or polyimide having good durability and heat resistance can be preferably used.
  • the third elastic coefficient of the support substrate 40 may be 100 times or less the first elastic coefficient of the base material 20.
  • the method of calculating the third elastic coefficient of the support substrate 40 is the same as that of the base material 20.
  • the wiring board 710 includes the base material 20, the reinforcing member 30, the supporting board 40, the electronic component 51, and the wiring 52, but the position of the supporting board 40 is different from the example shown in FIG. 63.
  • the support substrate 40 is provided on the first surface 21 of the base material 20 and the reinforcing member 30 provided on the first surface 21.
  • the support substrate 40 supports the electronic component 51 and the wiring 52 on the first surface 41 side thereof.
  • the support substrate 40 is joined to the first surface 21 of the base material 20 and the reinforcing member 30 on the second surface 42 side thereof.
  • the reinforcing member 30 when the wiring board 710 includes the base material 20, the reinforcing member 30, the support substrate 40, the electronic component 51, and the wiring 52, the reinforcing member 30 is provided inside the base material 20. Alternatively, the substrate 20 may not be exposed to the outside.
  • the wiring board 710 shown in FIG. 64B is formed by relaxing the base material 20 after providing the wiring 52 on the stretched base material 20, the first surface 21 of the base material 20 and / Or, in the direction orthogonal to the first direction D1 on the second surface 22, a portion that is adjacent to the first reinforcing member 31 in a plan view and a portion that faces the reinforcing member 30 include bellows including a peak portion and a valley portion. A feature can be formed.
  • the first surface 21 of the base material 20 is also relaxed.
  • a bellows-shaped portion including a mountain portion and a valley portion may be formed in a portion adjacent to the first reinforcing member 31 in a plan view.
  • the first reinforcing member 31 and the second reinforcing member 32 of the reinforcing member 30 may be located on the second surface 22 side of the base material 20.
  • the reinforcing member 30 includes one first reinforcing member 31 having a rectangular shape in plan view, which is provided on one side of the electronic component 51 in the first direction D1, and the electronic component 51 in the first direction D1. It is composed of one first reinforcing member 31 provided on the other side and having a rectangular shape in plan view, and a second reinforcing member 32 connected to these. Regarding the direction orthogonal to the first direction D1 in plan view, the two first reinforcing members 31 are located on one side and the other side with the electronic component 51 interposed therebetween, but the two first reinforcing members 31 are flat. They may be located on the same side with respect to the direction orthogonal to the first direction D1 when viewed.
  • each of the four corners of the second reinforcing member 32 which has a rectangular shape in a plan view, has a side portion parallel to the first direction D1 among the four sides of the second reinforcing member 32.
  • the first reinforcing member 31 extending on the extension line and the first reinforcing member 31 extending on the extension line of the side portion parallel to the direction orthogonal to the first direction D1 of the four sides of the second reinforcing member 32 are connected.
  • the first reinforcing member 31 that extends on the extension line of the side portion parallel to the direction orthogonal to the first direction D1 may not be provided.
  • the second reinforcing member 32 is not provided in the reinforcing member 30 shown in FIG.
  • the first reinforcing member 31 is in direct contact with at least one of the electronic component 51 and the connecting portion 51a and is in contact with the base material 20.
  • the reinforcing member 30 includes a first reinforcing member 31 extending in a direction intersecting both the first direction D1 and the direction orthogonal to the first direction D1 in plan view.
  • the first reinforcing member 31 extends so as to project from the four corners of the electronic component 51.
  • the first reinforcing member 31 makes 45 degrees with respect to both the first direction D1 and the direction orthogonal to the first direction D1 in plan view, but such an angle is not particularly limited. ..
  • the reinforcing member 30 does not include the second reinforcing member 32, but the reinforcing member 30 may include the second reinforcing member 32.
  • the reinforcing member 30 includes a pair of first reinforcing members 31 on one side and the other side of the electronic component 51 in the first direction D1.
  • the wiring 52 passes between the pair of first reinforcing members 31.
  • each 1st reinforcement member 31 has 31 A of main bodies extended along the 1st direction D1, and the convex part 31B which becomes convex toward the wiring 52 side from 31 A of main bodies.
  • the reinforcing member 30 includes three or more reinforcing members 30 extending in one direction on the one side and the other side of the electronic component 51 so as to project from one side of the rectangular electronic component 51.
  • the first reinforcing member 31 is provided.
  • the reinforcing member 30 is provided on one side of the electronic component 51 in the first direction D1 and on the other side of the electronic component 51 in the first direction D1. And one first reinforcing member 31.
  • the first reinforcing member 31 extends so as to project from one side portion of the electronic component 51 facing the one side or the other side in the first direction D1.
  • the first reinforcing member 31 extends from between both ends of one side of the electronic component 51 facing the one side or the other side in the first direction D1.
  • the reinforcing member 30 is provided on one side of the electronic component 51 in the first direction D1 and on the other side of the electronic component 51 in the first direction D1. And one first reinforcing member 31.
  • the first reinforcing member 31 extends so as to project from one side portion of the electronic component 51 facing the one side or the other side in the first direction D1.
  • the first reinforcing member 31 extends from the end of one side of the electronic component 51 that faces one side or the other side in the first direction D1.
  • the reinforcing member 30 is provided on the one side of the electronic component 51 in the first direction D1 and the two first reinforcing members 31 on the other side of the electronic component 51 in the first direction D1.
  • Two first reinforcing members 31 are provided.
  • the first reinforcing member 31 extends so as to project from one side portion of the electronic component 51 facing the one side or the other side in the first direction D1.
  • the two first reinforcing members 31 on one side of the first direction D1 extend from both ends of one side of the electronic component 51 facing the one side in the first direction D1.
  • the two first reinforcing members 31 on the other side in the first direction D1 extend from both ends of one side of the electronic component 51 facing the other side in the first direction D1.
  • the reinforcing member 30 is provided on the one side of the electronic component 51 in the first direction D1 and the two first reinforcing members 31 are provided on the other side of the electronic component 51 in the first direction D1. Two first reinforcing members 31 are provided.
  • the reinforcing member 30 includes a second reinforcing member 32 located between the two first reinforcing members 31 on one side of the first direction D1 and two first reinforcing members 31 on the other side of the first direction D1. It further comprises a second reinforcing member 32 located between them.
  • the reinforcing member 30 includes the same first reinforcing member 31 and the second reinforcing member 32 as in the example shown in FIG. 73C, but each first reinforcing member 31 has the first direction D1. It extends outward from the electronic component 51 in the orthogonal direction.
  • the wiring board 710 includes the electronic component 51 mounted on the first surface 21 side of the base material 20 is shown.
  • the present invention is not limited to this, and the wiring board 710 may not include the electronic component 51.
  • the bellows-shaped portion 57 may be formed on the base material 20 in a state where the electronic component 51 is not mounted.
  • the support substrate 40 in a state where the electronic component 51 is not mounted may be attached to the base material 20.
  • the wiring board 710 may be shipped in a state where the electronic component 51 is not mounted.
  • a base material preparing step of preparing a base material 20 having elasticity is performed.
  • a stretching step of stretching the substrate 20 by applying tensile stress T to the substrate 20 is performed.
  • the 1st installation process which provides the electronic component 51 and the wiring 52 in the 1st surface 21 of the base material 20 in the state extended by the tensile stress T is implemented.
  • a shrinking step for removing the tensile stress T from the base material 20 is performed.
  • the base material 20 contracts as shown by arrow C, and the wiring 52 provided on the base material 20 is also deformed.
  • a second installation step of providing the reinforcing member 30 including the first reinforcing member 31 and the second reinforcing member 32 on the first surface 21 of the base material 20 from which the tensile stress T is removed is performed. carry out.
  • the reinforcing member 30 can be located in the region of the first surface 21 of the base material 20 in which the mountain portion 53 is formed.
  • the wiring board 710 may be manufactured by extending the base material 20, providing the reinforcing member 30, the wiring 52, and the electronic component 51 in this order, and then releasing the extended state.
  • the reinforcing member 30 is a stretchable substrate in which stretchable silver wiring is provided on a stretchable base material having no bellows shape or a stretchable substrate in which horseshoe-shaped wiring is formed on the stretchable base material. May also be applied.
  • a stretchable substrate in which stretchable silver wiring is provided on a stretchable base material that does not have a bellows shape, or a stretchable substrate in which horseshoe-shaped wiring is formed on a stretchable base material is, for example, stretched at all. It may be manufactured by forming stretchable silver wiring or horseshoe-shaped wiring on a base material that is not allowed to be formed, and then providing the component and the reinforcing member 30, but the manufacturing method is not particularly limited.
  • the wiring 52 extends parallel to the first direction D1.
  • the wiring 52 extends parallel to the first direction D1 and the wiring 52 extends parallel to the first direction D1.
  • those extending in a direction intersecting D1 may be included.
  • the wiring board is configured such that the wiring 52 extending in the direction intersecting the first direction D1 intersects at least one of the straight lines virtually connecting the first reinforcing member 31 and the electronic component 51. Good.
  • a bellows-shaped portion may be formed on the wiring 52 extending in a direction intersecting the first direction D1.
  • Such a wiring board may be formed, for example, by extending the base material 20 in the biaxial direction of the first direction D1 and a direction intersecting the first direction D1, and forming the wiring 52 and the like in this state.
  • the wirings 52 extending in different directions are not limited to the illustrated example.
  • FIGS. 55 to 75 will be described more specifically by way of examples, but the present disclosure is not limited to the description of the following examples as long as the gist thereof is not exceeded.
  • Example 1 As the wiring board 710, as shown in FIG. 73B, the one in which the wiring 52, the reinforcing member 30, and the electronic component 51 were provided on the first surface 21 of the base material 20 was produced. The wiring 52, the reinforcing member 30, and the electronic component 51 were attached to the base material 20 via the adhesive layer while being provided on the support substrate 40.
  • the base material 20 was formed by curing a two-component addition-condensation polydimersiloxane (hereinafter referred to as PDMS) so as to have a thickness of 1.5 mm.
  • the elastic modulus of the base material 20 was 0.05 MPa.
  • a pressure-sensitive adhesive sheet 8146 (manufactured by 3M) was used as an adhesive layer for bonding the support substrate 40 to the base material 20.
  • the supporting substrate 40 is a PEN (polyethylene naphthalate) film having a thickness of 1 ⁇ m, and the elastic coefficient is set to 2.2 GPa.
  • the wiring 52 is Cu, and is formed by forming a film on the supporting substrate 40 by a vapor deposition method and then patterning it by photolithography. The wiring width was 200 ⁇ m, and the interval between adjacent wirings was 400 ⁇ m. After forming the wiring 52, an insulating film that integrally covers the wiring 52 and the support substrate 40 was formed. The connecting portion of the wiring 52 with the electronic component 51 was not covered with an insulating film.
  • the insulating film was formed by printing a thermosetting insulating resin on the wiring 52 and the support substrate 40 by screen printing and then heating and curing the resin. The thickness of the insulating film was set to be about 50 ⁇ m on the wiring 52.
  • a connecting portion 51a for connecting the wiring 52 and the electronic component 51 was formed by screen-printing a conductive adhesive (CL-3160 manufactured by Kaken Tech Co., Ltd.) on the end of the wiring 52. Then, the electronic component 51 was soldered to the connecting portion 51a. Further, the reinforcing member 30 was formed by applying a thermosetting epoxy resin at a predetermined position with a dispenser and thermosetting it. The reinforcing member 30 has only the first reinforcing member 31, is formed so that the first reinforcing member 31 projects from the electronic component 51 by 2 mm in a plan view, and the first reinforcing member 31 has a distance of 2 mm between the adjacent first reinforcing members 31. The gap is set.
  • the support substrate 40 on which the wiring 52, the electronic component 51, and the like are supported as described above is provided with an adhesive layer on the base material 20. Then, the wiring board 710 according to Example 1 was manufactured.
  • the wiring board 710 according to Example 1 was stretched 1.3 times in the first direction D1 10,000 times, but the wiring 52 was not broken.
  • a comparative example in which the reinforcing member 30 is not provided in the wiring board 710 according to the example 1 is manufactured and is stretched 1.3 times in the first direction D1 10,000 times, wiring is provided around the electronic component 51. 52 breaks had occurred. From this result, the usefulness of the reinforcing member 30 was confirmed.
  • Example 2 As the wiring board 710, one in which the wiring 52, the reinforcing member 30, and the electronic component 51 were provided on the first surface 21 of the base material 20 as shown in FIG. 73C was produced.
  • Example 2 is made of the same material and the same manufacturing procedure as those described in Example 1, but the shape of the reinforcing member 30 is different from that of Example 1.
  • the wiring board 710 according to Example 2 was also stretched 1.3 times in the first direction D1 10,000 times, but the wiring 52 was not broken.
  • Example 3 As the wiring board 710, one in which the wiring 52, the reinforcing member 30, and the electronic component 51 were provided on the first surface 21 of the base material 20 as shown in FIG. 73D was manufactured.
  • Example 3 was made of the same material and the same manufacturing procedure as those described in Example 1, but the shape of the reinforcing member 30 was different from that of Example 1.
  • the first reinforcing member 31 projects 2 mm from the electronic component 51 in the first direction D1, but the distance between the adjacent first reinforcing members 31 in the direction orthogonal to the first direction D1 was 4 mm. ..
  • the wiring board 710 according to Example 3 was also stretched 1.3 times in the first direction D1 10,000 times, but the wiring 52 was not broken.
  • Example 4 As the wiring board 710, one in which the wiring 52, the reinforcing member 30, and the electronic component 51 were provided on the first surface 21 of the base material 20 as shown in FIG. 75 was produced.
  • Example 4 uses the same material as that described in Example 1 and the manufacturing procedure is basically the same as that of Example 1, except that the base material 20 is extended biaxially to provide the wiring 52. This is different from the first embodiment, and the shape of the reinforcing member 30 is also different from the first embodiment.
  • the wiring board 710 according to Example 4 was also stretched 1.3 times in the first direction D1 10,000 times, but the wiring 52 was not broken.
  • FIG. 76 is a plan view showing the wiring board 810 according to the present embodiment. 77 is a cross-sectional view of the wiring board 810 of FIG. 76 taken along the line II-II.
  • the configuration referred to as the "expansion/contraction suppressing member 30" in the above-described embodiment is referred to as the reinforcing member 30.
  • the electronic component 51 has a configuration referred to as the “connected member 51”.
  • the reinforcing member 30 is provided on the wiring board 10 in order to relieve the stress of the connecting portion 51a due to the expansion and contraction of the wiring board 10 by reinforcing the base material 20.
  • the reinforcing member 30 is located away from the electronic component 51 in the surface direction. At least a part of the reinforcing member 30 extends at least from the position of the first end 511 of the electronic component 51 to the position of the second end 512.
  • the reinforcing member 30 is arranged in the first direction from the first end 511 side of the electronic component 51 in the first direction D1 with respect to the first end 511 of the electronic component 51 and in the first direction from the second end 512 of the electronic component 51. It is continuously provided up to the second end 512 side of D1.
  • the reinforcing member 30 has a shape surrounding the electronic component 51 when viewed from the direction normal to the first surface 21, that is, in a plan view. More specifically, the reinforcing member 30 has a circular shape surrounding the entire circumference of the electronic component 51 in a plan view. The reinforcing member 30 is located on the wiring 52 or the first surface 21.
  • the separation distance between the electronic component 51 and the reinforcing member 30 in the surface direction a suitable distance is adopted to relieve the stress acting on the connecting portion 51 a between the wiring 52 and the electronic component 51 as the base material 20 expands and contracts. can do.
  • the distance between the electronic component 51 and the reinforcing member 30 in the surface direction is 0.1 mm or more and 5 mm or less.
  • the reinforcing member 30 may have an elastic coefficient larger than that of the base material 20.
  • the elastic coefficient of the reinforcing member 30 is, for example, 10 GPa or more and 500 GPa or less, and more preferably 1 GPa or more and 300 GPa or less. If the elastic coefficient of the reinforcing member 30 is too low, it may be difficult to control the expansion and contraction of the base material 20. Further, if the elastic coefficient of the reinforcing member 30 is too high, when the base material 20 expands or contracts, the reinforcing member 30 may suffer structural damage such as cracks or cracks.
  • the elastic coefficient of the reinforcing member 30 may be 1.1 times or more and 1,000,000 times or less, and more preferably 10 times or more and 300,000 times or less than that of the base material 20.
  • the expansion/contraction suppressing region A is a region of the base material 20 that is adjacent to the reinforcing member 30 in the direction intersecting the direction in which the reinforcing member 30 extends and that includes the region where the electronic component 51 is located.
  • the expansion/contraction suppressing region A is a region surrounded by the reinforcing member 30.
  • JP2013-187308A and JP2007-281406A no actual proposal has been made to alleviate the stress acting on the connecting portion between the wiring and the electronic component as the wiring board expands and contracts.
  • By suppressing the expansion/contraction of the expansion/contraction suppressing region A it is possible to relieve the stress acting on the connecting portion 51 a between the wiring 52 and the electronic component 51 as the wiring board 10 expands/contracts.
  • By alleviating the stress acting on the connection portion 51a it is possible to prevent disconnection of the wiring 52 and poor connection between the wiring 52 and the electronic component 51.
  • the reinforcing member 30 so as to surround the entire circumference of the electronic component 51, even when the base material 20 expands and contracts in a plurality of directions of the surface direction, the wiring 52 and the electronic components can be expanded and contracted in each direction. The stress acting on the connecting portion 51a with the component 51 can be effectively relieved.
  • the reinforcing member 30 may have a shape that partially surrounds the electronic component 51 in a plan view.
  • the reinforcing member 30 has a substantially rectangular shape with a portion above the wiring 52 missing.
  • the wiring board and the method of manufacturing the wiring board according to the present disclosure have been described above while showing the embodiments.
  • the present disclosure is not limited to the above embodiment or the description thereof.
  • the above-described embodiment is an exemplification, and a configuration having substantially the same configuration as the technical idea described in the claims of the present disclosure and exhibiting the same operational effect is not limited to the case of the present disclosure. It is included in the technical scope.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

This wiring board is provided with: a base material which is stretchable and includes a first surface and a second surface positioned opposite the first surface; a wire positioned on the first surface side of the base material; a plurality of first stretch-reducing members for reducing stretching of the base material; and a second stretch-reducing member for securing the plurality of first stretch-reducing members. When the base material is viewed along a direction normal to the first surface, at least a part of the wire circumscribes the plurality of first stretch-reducing members and is present in a region of a stretch-reducing region that does not overlap the first stretch-reducing members, the stretch-reducing region being a virtual region surrounding the first stretch-reducing members with a minimum circumference.

Description

配線基板及び配線基板の製造方法Wiring board and method of manufacturing wiring board
　この出願は、２０１９年２月１２日に出願した日本国特願２０１９－０２２７２６号および日本国特願２０１９－０２２７２９号、ならびに、２０１９年１２月２６に出願した日本国特願２０１９－２３７５２９号および日本国特願２０１９－２３７５４９号のそれぞれに基づくとともに、それぞれの優先権を主張するものであり、それぞれの全体の内容は、参照によって、ここに引用される。
　本開示の実施形態は、伸縮性を有する基材と、配線とを備える配線基板及びその製造方法に関する。 This application includes Japanese Patent Application Nos. 2019-022726 and 2019-022729 filed on February 12, 2019, and Japanese Patent Application No. 2019-237529 filed on December 26, 2019. It is based on each of Japanese Patent Application No. 2019-237549 and claims the priority of each, and the entire content of each is hereby incorporated by reference.
Embodiments of the present disclosure relate to a wiring board including a stretchable base material and wiring, and a method for manufacturing the wiring board.
　近年、伸縮性などの変形性を有する電子デバイスの研究がおこなわれている。例えば、伸縮性を有する基材に伸縮性を有する銀配線を形成したものや、伸縮性を有する基材に馬蹄形の配線を形成したものが知られている（例えばＪＰ２０１３－１８７３０８Ａ）。また、ＪＰ２００７－２８１４０６Ａは、この種の電子デバイスの製造方法を開示している。特許文献２の製造方法は、予め伸長させた状態の基材に回路を設け、回路を形成した後に基材を弛緩させる、という工程を採用している。 -Recently, research on electronic devices having deformability such as elasticity has been conducted. For example, it is known that a stretchable base material is provided with stretchable silver wiring, and a stretchable base material is provided with horseshoe-shaped wiring (for example, JP2013-187308A). Further, JP2007-281406A discloses a method for manufacturing an electronic device of this kind. The manufacturing method of Patent Document 2 employs a step in which a circuit is provided on a base material that has been stretched in advance, and the base material is relaxed after the circuit is formed.
　伸縮性を有する配線基板では、通常、配線と、電子部品に代表される被接続部材の端子部とが典型的には接続部によって接続される。この構成において、電子部品の様に被接続部材がほとんど伸縮しない場合には、配線基板およびそれに設けられた配線は伸縮するため、被接続部材と配線とが接続される接続部や接続部と接続する配線の端部に応力が集中し易い。そのため接続部において被接続部材と配線との電気的な接続が損なわれる、接続剥がれや断線が生じることがあった。
　また、配線が伸縮する際に、配線の端部や分岐部、方向転換部の一部においては応力が集中し断線することがあった。 In a stretchable wiring board, the wiring is typically connected to a terminal portion of a connected member represented by an electronic component, typically by a connecting portion. In this configuration, when the connected member hardly expands or contracts like an electronic component, the wiring board and the wiring provided therein expands and contracts. Stress tends to concentrate at the end of the wiring. Therefore, in the connecting portion, the electrical connection between the connected member and the wiring may be impaired, and the connection may be peeled off or broken.
Further, when the wiring expands and contracts, stress sometimes concentrates at the end portion of the wiring, the branch portion, and a part of the direction changing portion, and the wiring may be broken.
　以上から、本開示の目的は、基材の伸縮により、応力が集中することがある配線の一部、あるいは配線に接続される接続部において、接続剥がれや断線を抑制することができる、配線基板、および配線基板の製造方法を提供することである。 From the above, it is an object of the present disclosure to prevent connection peeling or disconnection in a part of wiring where stress may be concentrated due to expansion and contraction of a base material, or a connection portion connected to the wiring. , And a method for manufacturing a wiring board.
　本開示は、配線基板であって、第１面及び第１面の反対側に位置する第２面を含み伸縮性を有する基材と、基材の第１面側に位置する配線と、基材の伸縮を抑制する複数の第１伸縮抑制部材と、複数の第１伸縮抑制部材を固定する第２伸縮抑制部材とを備え、第１面の法線方向に沿って基材を見た場合に、配線の少なくとも一部は、複数の第１伸縮抑制部材に外接し、かつ第１伸縮抑制部材をその周長が最短となるように囲う仮想の領域である伸縮抑制領域のうち、第１伸縮抑制部材と重ならない領域に存在している配線基板である。 The present disclosure is a wiring board, which has a stretchable base material including a first surface and a second surface located on the opposite side of the first surface, a wiring located on the first surface side of the base material, and a substrate. When a plurality of first expansion/contraction suppressing members for suppressing expansion/contraction of the material and a second expansion/contraction suppressing member for fixing the plurality of first expansion/contraction suppressing members are provided, and the base material is viewed along the normal direction of the first surface. In addition, at least a part of the wiring is a virtual region that circumscribes the plurality of first expansion/contraction suppressing members and surrounds the first expansion/contraction suppressing member so that the peripheral length thereof is the shortest. The wiring board exists in a region that does not overlap with the expansion-contraction suppressing member.
　上記配線基板において、第２伸縮抑制部材は第１伸縮抑制部材であってもよい。 In the wiring board, the second expansion/contraction suppressing member may be the first expansion/contraction suppressing member.
　上記配線基板において、配線基板に搭載される被接続部材を有し、第２伸縮抑制部材は被接続部材であってもよい。 The above wiring board may have a connected member mounted on the wiring board, and the second expansion-contraction suppressing member may be the connected member.
　本開示は、配線基板であって、第１面及び前記第１面の反対側に位置する第２面を含み伸縮性を有する基材と、基材の第１面側に位置する配線と、基材の伸縮を抑制する第１伸縮抑制部材と、を備え、第１面の法線方向に沿って基材を見た場合に、配線の少なくとも一部は、第１伸縮抑制部材に外接し、かつ第１伸縮抑制部材をその周長が最短となるように囲う仮想の領域である伸縮抑制領域のうち、第１伸縮抑制部材と重ならない領域に存在している配線基板である。 The present disclosure is a wiring board, which has a stretchable base material including a first surface and a second surface located on the opposite side of the first surface, and wiring positioned on the first surface side of the base material. A first expansion and contraction suppressing member for suppressing expansion and contraction of the base material, and when the base material is viewed along the normal direction of the first surface, at least a part of the wiring is circumscribed to the first expansion and contraction suppressing member. Further, the wiring board is present in a region that does not overlap with the first expansion/contraction suppressing member in the expansion/contraction suppressing region that is a virtual region that surrounds the first expansion/contraction suppressing member so that the perimeter thereof becomes the shortest.
　上記配線基板において、配線の少なくとも一部が、第１面の法線方向に沿って基材を見た場合における、配線の端部、配線の分岐部、配線の方向転換部のうちの少なくともいずれかであってもよい。 In the above wiring board, at least a part of the wiring is at least one of an end portion of the wiring, a branch portion of the wiring, and a direction changing portion of the wiring when the base material is viewed along the normal direction of the first surface. May be
　上記配線基板において、配線基板に搭載される被接続部材を有し、被接続部材と配線との間に位置し被接続部材と配線とを電気的に接続する接続部をさらに備え、第１面の法線方向に沿って基材を見た場合に、接続部のうち少なくとも１つは伸縮抑制領域のうち第１伸縮抑制部材と重ならない領域に存在していてもよい。 The above-mentioned wiring board further includes a connecting member mounted on the wiring board, and further includes a connecting portion that is located between the connecting member and the wiring and electrically connects the connecting member and the wiring. When the base material is viewed along the normal direction, the at least one of the connecting portions may be present in a region that does not overlap the first stretch suppressing member in the stretch suppressing region.
　上記配線基板において、第１伸縮抑制部材を複数備え、複数の第１伸縮抑制部材は配線の延びる方向に隣り合っていてもよい。 The wiring board may include a plurality of first expansion/contraction suppressing members, and the plurality of first expansion/contraction suppressing members may be adjacent to each other in the wiring extending direction.
　上記配線基板において、さらに支持基板を備え、第１伸縮抑制部材は基材に支持基板を介して間接的に接していてもよい。 The wiring board may further include a support substrate, and the first expansion-contraction suppressing member may be in contact with the base material indirectly via the support substrate.
　上記配線基板において、第１伸縮抑制部材の少なくとも１つは、基材を貫通していてもよい。 In the above wiring board, at least one of the first expansion and contraction suppressing members may penetrate the base material.
　上記配線基板において、基材は、配線が延びる方向に並ぶ複数の山部を含んでいてもよい。 In the above wiring board, the base material may include a plurality of peaks arranged in the direction in which the wiring extends.
　上記配線基板において、配線は、配線が延びる方向に並ぶ複数の山部を含んでいてもよい。 In the above wiring board, the wiring may include a plurality of peaks arranged in the direction in which the wiring extends.
　本開示は、上記配線基板に被接続部材を接続してなるデバイスである。 The present disclosure is a device in which a member to be connected is connected to the wiring board.
　本開示は、上記デバイスを有する電子製品である。 The present disclosure is an electronic product including the above device.
　本開示は、伸縮性を有する基材に張力を加えて基材を伸長させる伸長工程と、伸長工程によって伸長した状態の基材の第１面側に、第１伸縮抑制部材を基材の伸縮を抑制するために設けるとともに、配線基板に搭載される被接続部材に接続される配線を設ける設置工程と、基材から張力を取り除く収縮工程と、を備え、第１面の法線方向に沿って基材を見た場合に、配線の少なくとも一部は、第１伸縮抑制部材に外接し、かつ第１伸縮抑制部材をその周長が最短となるように囲う仮想の領域である伸縮抑制領域のうち、第１伸縮抑制部材と重ならない領域に存在している配線基板の製造方法である。 The present disclosure discloses a stretching step of stretching a base material by applying tension to a stretchable base material, and a first stretch suppressing member for stretching the base material on the first surface side of the base material in a state of being stretched by the stretching step. And a shrinking step for removing tension from the base material, and a wiring line connected to a connected member mounted on the wiring board, and a shrinking step for removing tension from the base material. When looking at the base material, at least a part of the wiring is an imaginary region that circumscribes the first expansion-contraction suppressing member and surrounds the first expansion-contraction suppressing member so that its circumference is the shortest. Among these, it is a method of manufacturing a wiring board existing in a region that does not overlap with the first expansion-contraction suppressing member.
　本開示は、伸縮性を有する基材に張力を加えて基材を伸長させる伸長工程と、伸長工程によって伸長した状態の基材の第１面側に、配線基板に搭載される被接続部材に接続される配線を設ける第１設置工程と、基材から張力を取り除く収縮工程と、収縮工程で張力を取り除いた基材に第１伸縮抑制部材を基材の伸縮を抑制するために設ける第２設置工程と、を備え、第１面の法線方向に沿って基材を見た場合に、配線の少なくとも一部は、第１伸縮抑制部材に外接し、かつ第１伸縮抑制部材をその周長が最短となるように囲う仮想の領域である伸縮抑制領域のうち、第１伸縮抑制部材と重ならない領域に存在している配線基板の製造方法である。 The present disclosure provides an extension step of applying tension to a stretchable base material to extend the base material, and a connected member mounted on a wiring board on the first surface side of the base material in a state of being extended by the extension step. A first installation step of providing wiring to be connected, a contraction step of removing tension from the base material, and a second expansion and contraction suppressing member provided on the base material from which tension has been removed in the contraction step to suppress expansion and contraction of the base material. When the base material is viewed along the direction normal to the first surface, at least part of the wiring is circumscribed on the first expansion-contraction suppressing member and the first expansion-contraction suppressing member is surrounded by the installation step. This is a method for manufacturing a wiring board that exists in a region that does not overlap with the first expansion/contraction suppressing member in the expansion/contraction suppressing region that is an imaginary region that is enclosed so as to have the shortest length.
　本開示は、第１面及び第１面の反対側に位置する第２面を含み、第１面、第２面及び内部のうちの少なくともいずれかに第１伸縮抑制部材が設けられた伸縮性を有する基材に張力を加えて基材を伸長させる伸長工程と、伸長工程によって伸長した状態の基材の第１面側に配線基板に搭載される被接続部材に接続される配線を設ける設置工程と、基材から張力を取り除く収縮工程と、を備え、第１面の法線方向に沿って基材を見た場合に、配線の少なくとも一部は、第１伸縮抑制部材に外接し、かつ第１伸縮抑制部材をその周長が最短となるように囲う仮想の領域である伸縮抑制領域のうち、第１伸縮抑制部材と重ならない領域に存在している配線基板の製造方法である。 The present disclosure includes a first surface and a second surface located on the opposite side of the first surface, and at least one of the first surface, the second surface, and the inside is provided with a first expansion and contraction suppressing member. An installation process in which a tension is applied to a base material having an extension to extend the base material, and a wiring connected to a connected member mounted on the wiring board is provided on the first surface side of the base material in the extension state by the extension step. And a shrinking step of removing tension from the base material, and when the base material is viewed along the normal direction of the first surface, at least a part of the wiring circumscribes the first expansion and contraction suppressing member, Further, it is a method of manufacturing a wiring board which is present in a region which does not overlap with the first expansion/contraction suppressing member in an expansion/contraction suppressing region which is a virtual region that surrounds the first expansion/contraction suppressing member so as to have a shortest perimeter.
　また、他の開示は、配線基板であって、第１面及び前記第１面の反対側に位置する第２面を含み、伸縮性を有する基材と、前記基材の前記第１面側に位置し、前記配線基板に搭載される電子部品に接続される配線と、前記基材を補強する補強部材と、を備え、前記補強部材は、前記第１面の法線方向に沿って前記基材を見た場合に、前記電子部品から突出するように延びる第１補強部材を含み、前記配線は、前記第１面の法線方向に沿って前記基材を見た場合に、前記第１補強部材と前記電子部品とを仮想的に結ぶ少なくともいずれかの直線に対して交差する、配線基板である。
　他の開示にかかる配線基板は、前記第１面と前記配線との間に位置し、前記配線を支持する支持基板を更に備えてもよい。 Further, another disclosure is a wiring board, which includes a first surface and a second surface located on the opposite side of the first surface, and has a stretchable base material, and the first surface side of the base material. And a reinforcing member that reinforces the base material, the reinforcing member being located along a line connected to an electronic component mounted on the wiring board, and the reinforcing member being arranged along the normal line direction of the first surface. The wiring board includes a first reinforcing member extending so as to project from the electronic component when the base material is viewed, and the wiring is the first reinforcing member when the base material is viewed along a normal direction of the first surface. 1 is a wiring board that intersects at least one of the straight lines virtually connecting the reinforcing member and the electronic component.
A wiring board according to another disclosure may further include a support substrate that is located between the first surface and the wiring and supports the wiring.
　また、他の開示は、配線基板であって、第１面および前記第１面と反対側の第２面を有し、前記第１面および前記第２面に沿った面方向のうち少なくとも第１方向に伸縮性を有する基材と、前記第１面側に位置し、前記配線基板に搭載される少なくとも１つの電子部品に接続される配線と、前記電子部品に対して前記面方向に離れて位置し、前記基材を補強する補強部材と、を備え、前記補強部材の少なくとも一部は、前記第１方向における前記電子部品の第１端部の位置から前記第１方向において前記第１端部に対向する第２端部の位置まで少なくとも延びており、前記補強部材は、前記第１面の法線方向から見た場合に前記電子部品を囲む形状を有する、配線基板である。 Further, another disclosure is a wiring board, which has a first surface and a second surface opposite to the first surface, and at least the first surface in the surface directions along the first surface and the second surface. A base material having elasticity in one direction, a wiring located on the side of the first surface and connected to at least one electronic component mounted on the wiring board, and separated from the electronic component in the surface direction. And a reinforcing member that reinforces the base material, wherein at least a part of the reinforcing member is the first end in the first direction from the position of the first end of the electronic component in the first direction. The reinforcing member is a wiring board that extends at least to the position of the second end portion that faces the end portion, and the reinforcing member has a shape that surrounds the electronic component when viewed from the normal direction of the first surface.
　本開示によれば、例えば、基材の伸縮により、配線の一部や配線に接続される接続部等において、接続剥がれや断線を抑制することができる、配線基板、および配線基板の製造方法を提供することができる。 According to the present disclosure, for example, a wiring board and a method for manufacturing a wiring board, which can suppress connection peeling or disconnection in a part of the wiring or a connection portion connected to the wiring due to expansion and contraction of the base material. Can be provided.
本開示に係る配線基板の第１実施形態を説明する平面図。1 is a plan view illustrating a first embodiment of a wiring board according to the present disclosure. 図１ａのＡ－Ａ断面図。AA sectional view of FIG. 1a. 図１ａのＢ－Ｂ断面図。BB sectional drawing of FIG. 1a. 図１ａのＣ－Ｃ断面の拡大断面図。The expanded sectional view of CC section of FIG. 1a. 本開示に係る配線基板の第１実施形態における伸縮抑制部材の形状を説明する平面図。The top view explaining the shape of the expansion-contraction suppressing member in 1st Embodiment of the wiring board concerning this indication. 本開示に係る配線基板の第１実施形態における伸縮抑制部材の形状を説明する平面図。The top view explaining the shape of the expansion-contraction suppressing member in 1st Embodiment of the wiring board concerning this indication. 図４ａのＡ－Ａ断面図。4A is a sectional view taken along line AA of FIG. 図４ａのＢ－Ｂ断面図。4B is a sectional view taken along line BB of FIG. 4a. 本開示に係る配線基板の第１実施形態における伸縮抑制部材の形状を説明する平面図。The top view explaining the shape of the expansion-contraction suppressing member in 1st Embodiment of the wiring board concerning this indication. 本開示に係る配線基板の第１実施形態における伸縮抑制部材の形状を説明する平面図。The top view explaining the shape of the expansion-contraction suppressing member in 1st Embodiment of the wiring board concerning this indication. 本開示に係る配線基板の第１実施形態における伸縮抑制部材の形状を説明する平面図。The top view explaining the shape of the expansion-contraction suppressing member in 1st Embodiment of the wiring board concerning this indication. 本開示に係る配線基板の実施形態における伸縮抑制部材を説明する平面図。The top view explaining the expansion-contraction suppression member in the embodiment of the wiring board concerning this indication. 図８ａのＡ－Ａ断面図。8A is a sectional view taken along line AA of FIG. 図８ａのＢ－Ｂ断面図。8B is a sectional view taken along line BB of FIG. 8a. 本開示に係る配線基板の実施形態における伸縮抑制部材を説明する平面図。The top view explaining the expansion-contraction suppression member in the embodiment of the wiring board concerning this indication. 図９ａのＡ－Ａ断面図。9A is a sectional view taken along line AA of FIG. 9A. FIG. 図９ａのＢ－Ｂ断面図。9B is a sectional view taken along line BB of FIG. 9a. 本開示に係る配線基板の実施形態における伸縮抑制部材を説明する平面図。The top view explaining the expansion-contraction suppression member in the embodiment of the wiring board concerning this indication. 図１０ａのＡ－Ａ断面図。FIG. 10A is a sectional view taken along line AA of FIG. 図１０ａのＢ－Ｂ断面図。10B is a sectional view taken along line BB of FIG. 本開示に係る配線基板の実施形態における伸縮抑制部材を説明する平面図。The top view explaining the expansion-contraction suppression member in the embodiment of the wiring board concerning this indication. 図１１ａのＡ－Ａ断面図。11A is a sectional view taken along line AA of FIG. 図１１ａのＢ－Ｂ断面図。FIG. 11b is a sectional view taken along line BB of FIG. 11a. 本開示に係る配線基板の実施形態における伸縮抑制部材を説明する平面図。The top view explaining the expansion-contraction suppression member in the embodiment of the wiring board concerning this indication. 図１２ａのＡ－Ａ断面図。12A is a sectional view taken along line AA of FIG. 図１２ａのＢ－Ｂ断面図。12B is a sectional view taken along line BB of FIG. 12A. 本開示に係る配線基板の実施形態における伸縮抑制部材を説明する平面図。The top view explaining the expansion-contraction suppression member in the embodiment of the wiring board concerning this indication. 図１３ａのＡ－Ａ断面図。13A is a sectional view taken along line AA of FIG. 図１３ａのＢ－Ｂ断面図。13B is a sectional view taken along line BB of FIG. 本開示に係る配線基板の実施形態における伸縮抑制部材を説明する平面図。The top view explaining the expansion-contraction suppression member in the embodiment of the wiring board concerning this indication. 図１４ａのＡ－Ａ断面図。FIG. 14A is a sectional view taken along line AA. 図１４ａのＢ－Ｂ断面図。14B is a sectional view taken along line BB of FIG. 14a. 本開示に係る配線基板の実施形態における伸縮抑制部材を説明する平面図。The top view explaining the expansion-contraction suppression member in the embodiment of the wiring board concerning this indication. 図１５ａのＡ－Ａ断面図。15A is a sectional view taken along line AA of FIG. 図１５ａのＢ－Ｂ断面図。15B is a sectional view taken along line BB of FIG. 本開示に係る配線基板の第２実施形態を説明する平面図。The top view explaining 2nd Embodiment of the wiring board concerning this indication. 図１６ａのＡ－Ａ断面図。16A is a sectional view taken along line AA of FIG. 図１６ａのＢ－Ｂ断面図。16B is a sectional view taken along line BB of FIG. 16a. 本開示に係る配線基板の第２実施形態における伸縮抑制部材の形状を説明する平面図。The top view explaining the shape of the expansion-contraction suppression member in 2nd Embodiment of the wiring board concerning this indication. 本開示に係る配線基板の第３実施形態を説明する平面図。The top view explaining the 3rd embodiment of the wiring board concerning this indication. 図１８ａのＡ－Ａ断面図。18A is a sectional view taken along line AA of FIG. 図１８ａのＢ－Ｂ断面図。18B is a sectional view taken along line BB of FIG. 18a. 本開示に係る配線基板の第３実施形態における被接続部材と伸縮抑制部材との接続を説明する平面図。The top view explaining the connection of the connected member and expansion control member in a 3rd embodiment of the wiring board concerning this indication. 図１９ａのＡ－Ａ断面図。19A is a sectional view taken along line AA of FIG. 図１９ａのＢ－Ｂ断面図。19B is a sectional view taken along line BB of FIG. 19A. 本開示に係る配線基板の第３実施形態における被接続部材と伸縮抑制部材との接続を説明する平面図。The top view explaining the connection of the connected member and expansion control member in a 3rd embodiment of the wiring board concerning this indication. 図２０ａのＡ－Ａ断面図。FIG. 20A is a sectional view taken along line AA of FIG. 図２０ａのＢ－Ｂ断面図。20B is a sectional view taken along line BB of FIG. 20a. 本開示に係る配線基板の第３実施形態における被接続部材と伸縮抑制部材との接続を説明する平面図。The top view explaining the connection of the connected member and expansion control member in a 3rd embodiment of the wiring board concerning this indication. 図２１ａのＡ－Ａ断面図。FIG. 21a is a sectional view taken along line AA of FIG. 図２１ａのＢ－Ｂ断面図。FIG. 21b is a sectional view taken along line BB of FIG. 21a. 本開示に係る配線基板の第３実施形態の他の例を説明する平面図。The top view explaining the other example of 3rd Embodiment of the wiring board concerning this indication. 図２２ａのＡ－Ａ断面図。FIG. 22a is a sectional view taken along line AA of FIG. 22a. 図２２ａのＢ－Ｂ断面図。FIG. 22b is a sectional view taken along line BB of FIG. 22a. 本開示に係る配線基板の第４実施形態を説明する平面図。The top view explaining the 4th embodiment of the wiring board concerning this indication. 図２３ａのＡ－Ａ断面図。Figure 23a is a sectional view taken along line AA. 図２３ａのＢ－Ｂ断面図。FIG. 23b is a sectional view taken along line BB of FIG. 23a. 本開示に係る配線基板の第４実施形態の変形例における伸縮抑制部材の位置を説明する図２３ａのＡ－Ａに相当する断面図。FIG. 23C is a cross-sectional view corresponding to AA in FIG. 23A, illustrating the position of the expansion/contraction suppressing member in the modification of the fourth embodiment of the wiring board according to the present disclosure. 本開示に係る配線基板の第４実施形態の変形例における伸縮抑制部材の位置を説明する図２３ａのＢ－Ｂに相当する断面図。FIG. 23B is a cross-sectional view corresponding to BB in FIG. 23A for explaining the position of the expansion-contraction suppressing member in the modification of the fourth embodiment of the wiring board according to the present disclosure. 本開示に係る配線基板の第４実施形態の変形例における伸縮抑制部材の位置を説明する図２３ａのＡ－Ａに相当する断面図。FIG. 23C is a cross-sectional view corresponding to AA in FIG. 23A, illustrating the position of the expansion/contraction suppressing member in the modification of the fourth embodiment of the wiring board according to the present disclosure. 本開示に係る配線基板の第４実施形態の変形例における伸縮抑制部材の位置を説明する図２３ａのＢ－Ｂに相当する断面図。FIG. 23B is a cross-sectional view corresponding to BB in FIG. 23A for explaining the position of the expansion-contraction suppressing member in the modification of the fourth embodiment of the wiring board according to the present disclosure. 本開示に係る配線基板の第４実施形態の変形例における伸縮抑制部材の位置を説明する図２３ａのＡ－Ａに相当する断面図。FIG. 23C is a cross-sectional view corresponding to AA in FIG. 23A, illustrating the position of the expansion/contraction suppressing member in the modification of the fourth embodiment of the wiring board according to the present disclosure. 本開示に係る配線基板の第４実施形態の変形例における伸縮抑制部材の位置を説明する図２３ａのＢ－Ｂに相当する断面図。FIG. 23B is a cross-sectional view corresponding to BB in FIG. 23A for explaining the position of the expansion-contraction suppressing member in the modification of the fourth embodiment of the wiring board according to the present disclosure. 本開示に係る配線基板の第１実施形態の変形例における伸縮抑制部材の形状を説明する平面図。The top view explaining the shape of the expansion-contraction suppression member in the modification of a 1st embodiment of the wiring board concerning this indication. 図２５ａのＡ－Ａ断面図。FIG. 25A is a sectional view taken along line AA of FIG. 図２５ａのＢ－Ｂ断面図。25b is a sectional view taken along line BB of FIG. 25a. 本開示に係る配線基板の第２実施形態の変形例における伸縮抑制部材の形状を説明する平面図。The top view explaining the shape of the expansion-contraction suppressing member in the modification of a 2nd embodiment of the wiring board concerning this indication. 図２６ａのＡ－Ａ断面図。26A is a sectional view taken along line AA of FIG. 図２６ａのＢ－Ｂ断面図。26B is a sectional view taken along line BB of FIG. 26a. 本開示に係る配線基板の第３実施形態の変形例における伸縮抑制部材の形状を説明する平面図。The top view explaining the shape of the expansion-contraction suppressing member in the modification of 3rd Embodiment of the wiring board concerning this indication. 図２７ａのＡ－Ａ断面図。FIG. 27a is a sectional view taken along line AA of FIG. 27a. 図２７ａのＢ－Ｂ断面図。FIG. 27b is a sectional view taken along line BB of FIG. 27a. 本開示に係る配線基板の第３実施形態の変形例における伸縮抑制部材の形状を説明する平面図。The top view explaining the shape of the expansion-contraction suppression member in the modification of 3rd Embodiment of the wiring board concerning this indication. 図２８ａのＡ－Ａ断面図。28A is a sectional view taken along line AA of FIG. 28a. 図２８ａのＢ－Ｂ断面図。28B is a sectional view taken along line BB of FIG. 28a. 本開示に係る配線基板の第３実施形態の変形例における伸縮抑制部材の形状を説明する平面図。The top view explaining the shape of the expansion-contraction suppressing member in the modification of 3rd Embodiment of the wiring board concerning this indication. 図２９ａのＡ－Ａ断面図。FIG. 29a is a sectional view taken along line AA of FIG. 29a. 図２９ａのＢ－Ｂ断面図。29B is a sectional view taken along line BB of FIG. 29a. 本開示に係る配線基板の第３実施形態の変形例における伸縮抑制部材の形状を説明する平面図。The top view explaining the shape of the expansion-contraction suppressing member in the modification of 3rd Embodiment of the wiring board concerning this indication. 図３０ａのＡ－Ａ断面図。FIG. 30A is a sectional view taken along line AA of FIG. 図３０ａのＢ－Ｂ断面図。30B is a sectional view taken along line BB of FIG. 30a. 本開示に係る配線基板の第３実施形態の他の例における変形例において伸縮抑制部材の形状を説明する平面図。The top view explaining the shape of the expansion-contraction suppressing member in the modification in the other example of 3rd Embodiment of the wiring board concerning this indication. 図３１ａのＡ－Ａ断面図。FIG. 31a is a sectional view taken along line AA of FIG. 31a. 図３１ａのＢ－Ｂ断面図。FIG. 31b is a sectional view taken along line BB of FIG. 31a. 本開示に係る配線基板の第３実施形態の他の例における変形例において伸縮抑制部材の形状を説明する平面図。The top view explaining the shape of the expansion-contraction suppressing member in the modification in the other example of 3rd Embodiment of the wiring board concerning this indication. 図３２ａのＡ－Ａ断面図。32A is a sectional view taken along line AA of FIG. 図３２ａのＢ－Ｂ断面図。32B is a sectional view taken along line BB of FIG. 32a. 本開示に係る配線基板の第３実施形態の他の例における変形例において伸縮抑制部材の形状を説明する平面図。The top view explaining the shape of the expansion-contraction suppressing member in the modification in the other example of 3rd Embodiment of the wiring board concerning this indication. 図３３ａのＡ－Ａ断面図。FIG. 33a is a sectional view taken along the line AA of FIG. 33a. 図３３ａのＢ－Ｂ断面図。FIG. 33a is a sectional view taken along line BB of FIG. 33a. 本開示に係る配線基板の好ましい形態の一例を説明する平面図。The top view explaining an example of the desirable form of the wiring board concerning this indication. 図３４ａのＥ－Ｅ断面図。FIG. 34a is a sectional view taken along line EE of FIG. 34a. 図３４ａのＦ－Ｆ断面図。34A is a cross-sectional view taken along line FF of FIG. 34a. 本開示に係る配線基板の製造方法を説明する断面図。FIG. 6 is a cross-sectional view illustrating the method of manufacturing the wiring board according to the present disclosure. 本開示に係る配線基板の製造方法を説明する断面図。4A to 4C are cross-sectional views illustrating a method for manufacturing a wiring board according to the present disclosure. 本開示に係る配線基板の製造方法を説明する断面図。4A to 4C are cross-sectional views illustrating a method for manufacturing a wiring board according to the present disclosure. 本開示に係る配線基板の製造方法を説明する断面図。4A to 4C are cross-sectional views illustrating a method for manufacturing a wiring board according to the present disclosure. 本開示に係る配線基板の製造方法の第１変形例を説明する断面図。Sectional drawing explaining the 1st modification of the manufacturing method of the wiring board which concerns on this indication. 本開示に係る配線基板の製造方法の第１変形例を説明する断面図。Sectional drawing explaining the 1st modification of the manufacturing method of the wiring board which concerns on this indication. 本開示に係る配線基板の製造方法の第１変形例を説明する断面図。Sectional drawing explaining the 1st modification of the manufacturing method of the wiring board which concerns on this indication. 本開示に係る配線基板の製造方法の第１変形例を説明する断面図。Sectional drawing explaining the 1st modification of the manufacturing method of the wiring board which concerns on this indication. 本開示に係る配線基板の製造方法の第２変形例を説明する断面図。Sectional drawing explaining the 2nd modification of the manufacturing method of the wiring board which concerns on this indication. 本開示に係る配線基板の製造方法の第２変形例を説明する断面図。Sectional drawing explaining the 2nd modification of the manufacturing method of the wiring board which concerns on this indication. 本開示に係る配線基板の製造方法の第２変形例を説明する断面図。Sectional drawing explaining the 2nd modification of the manufacturing method of the wiring board which concerns on this indication. 本開示に係る配線基板の配線の変形例を説明する平面図。The top view explaining the modification of the wiring of the wiring substrate concerning this indication. 本開示に係る配線基板の実施例を説明する平面図。The top view explaining the example of the wiring board concerning this indication. 図３９ａのＡ－Ａ断面図。FIG. 39a is a sectional view taken along line AA of FIG. 39a. 図３９ａのＢ－Ｂ断面図。FIG. 39a is a sectional view taken along line BB of FIG. 39a. 本開示に係る配線基板における配線を説明する平面図。The top view explaining wiring in the wiring board concerning this indication. 図４０ａの拡大模式図。The enlarged schematic diagram of FIG. 40a. 本開示に係る配線基板の第１実施形態の他の変形例を説明する平面図。The top view explaining the other modification of a 1st embodiment of a wiring board concerning this indication. 図４１ａのＡ－Ａ断面図。FIG. 41a is a sectional view taken along the line AA of FIG. 図４１ａのＢ－Ｂ断面図。FIG. 41a is a sectional view taken along line BB of FIG. 41a. 本開示に係る配線基板の第１実施形態の他の変形例を説明する平面図。The top view explaining the other modification of a 1st embodiment of a wiring board concerning this indication. 図４２ａのＡ－Ａ断面図。42A is a sectional view taken along the line AA of FIG. 図４２ａのＢ－Ｂ断面図。42b is a sectional view taken along line BB of FIG. 42a. 本開示に係る配線基板の拡張形態を説明する平面図。The top view explaining the expansion form of the wiring board concerning this indication. 本開示に係る配線基板の拡張形態を説明する平面図。The top view explaining the expansion form of the wiring board concerning this indication. 本開示に係る配線基板の第１実施形態の他の変形例を説明する平面図。The top view explaining the other modification of a 1st embodiment of a wiring board concerning this indication. 図４５ａのＡ－Ａ断面図。FIG. 45a is a sectional view taken along line AA of FIG. 45a. 図４５ａのＢ－Ｂ断面図。FIG. 45a is a sectional view taken along line BB of FIG. 45a. 本開示に係る配線基板の第１実施形態の他の変形例を説明する平面図。The top view explaining the other modification of a 1st embodiment of a wiring board concerning this indication. 本開示に係る配線基板の第１実施形態の他の変形例を説明する平面図。The top view explaining the other modification of a 1st embodiment of a wiring board concerning this indication. 図４７ａのＥ－Ｅ断面図。FIG. 47B is a sectional view taken along line EE of FIG. 47a. 図４７ａのＦ－Ｆ断面図。FIG. 47F is a cross-sectional view taken along line FF of FIG. 47a. 本開示に係る配線基板の第３実施形態の他の変形例を説明する平面図。The top view explaining the other modification of a 3rd embodiment of a wiring board concerning this indication. 本開示に係る配線基板の第３実施形態の他の変形例を説明する平面図。The top view explaining the other modification of a 3rd embodiment of a wiring board concerning this indication. 本開示に係る配線基板の第３実施形態の他の変形例を説明する平面図。The top view explaining the other modification of a 3rd embodiment of a wiring board concerning this indication. 本開示に係る配線基板の第３実施形態の他の変形例を説明する平面図。The top view explaining the other modification of a 3rd embodiment of a wiring board concerning this indication. 本開示に係る配線基板の第３実施形態の他の変形例を説明する平面図。The top view explaining the other modification of a 3rd embodiment of a wiring board concerning this indication. 本開示に係る配線基板の実施例を説明する平面図。The top view explaining the example of the wiring board concerning this indication. 本開示に係る配線基板の実施例を説明する平面図。The top view explaining the example of the wiring board concerning this indication. 図５４ａのＡ－Ａ断面図。54A is a sectional view taken along line AA of FIG. 54a. FIG. 図５４ａのＢ－Ｂ断面図。54B is a sectional view taken along line BB of FIG. 54a. 本開示に係る他の実施形態に係る配線基板を示す平面図である。FIG. 6 is a plan view showing a wiring board according to another embodiment of the present disclosure. 図５５の配線基板を線II－IIに沿って切断した場合を示す断面図である。FIG. 56 is a cross-sectional view showing a case where the wiring board in FIG. 55 is cut along a line II-II. 図５６に示す配線基板を拡大して示す断面図である。FIG. 57 is an enlarged cross-sectional view of the wiring board shown in FIG. 56. 図５７Ａの拡大図である。FIG. 57B is an enlarged view of FIG. 57A. 図５５の配線基板の一変形例を示す断面図である。It is sectional drawing which shows the modification of the wiring board of FIG. 図５５の配線基板の一変形例を示す断面図である。It is sectional drawing which shows the modification of the wiring board of FIG. 図５５に示す配線基板の製造方法を説明するための図である。It is a figure for demonstrating the manufacturing method of the wiring board shown in FIG. 図５５に示す配線基板の製造方法を説明するための図である。It is a figure for demonstrating the manufacturing method of the wiring board shown in FIG. 図５５に示す配線基板の製造方法を説明するための図である。It is a figure for demonstrating the manufacturing method of the wiring board shown in FIG. 図５５に示す配線基板の製造方法を説明するための図である。It is a figure for demonstrating the manufacturing method of the wiring board shown in FIG. 図５５の配線基板の一変形例を示す断面図である。It is sectional drawing which shows the modification of the wiring board of FIG. 図５５の配線基板の一変形例を示す断面図である。It is sectional drawing which shows the modification of the wiring board of FIG. 図５５の配線基板の一変形例を示す断面図である。It is sectional drawing which shows the modification of the wiring board of FIG. 図５５の配線基板の一変形例を示す断面図である。It is sectional drawing which shows the modification of the wiring board of FIG. 図５５の配線基板の一変形例を示す断面図である。It is sectional drawing which shows the modification of the wiring board of FIG. 図５５の配線基板の一変形例を示す断面図である。It is sectional drawing which shows the modification of the wiring board of FIG. 図５５の配線基板の一変形例を示す断面図である。It is sectional drawing which shows the modification of the wiring board of FIG. 図５５の配線基板の一変形例を示す断面図である。It is sectional drawing which shows the modification of the wiring board of FIG. 図５５の配線基板の一変形例を示す断面図である。It is sectional drawing which shows the modification of the wiring board of FIG. 図５５の配線基板の一変形例を示す断面図である。It is sectional drawing which shows the modification of the wiring board of FIG. 図５５の配線基板の一変形例を示す平面図である。FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55. 図５５の配線基板の一変形例を示す平面図である。FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55. 図５５の配線基板の一変形例を示す平面図である。FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55. 図５５の配線基板の一変形例を示す平面図である。FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55. 図５５の配線基板の一変形例を示す平面図である。FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55. 図５５の配線基板の一変形例を示す平面図である。FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55. 図５５の配線基板の一変形例を示す平面図である。FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55. 図５５の配線基板の一変形例を示す平面図である。FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55. 図５５の配線基板の一変形例を示す平面図である。FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55. 図５５の配線基板の一変形例を示す平面図である。FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55. 図５５の配線基板の一変形例を示す平面図である。FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55. 図５５の配線基板の一変形例を示す平面図である。FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55. 図５５の配線基板の製造方法の一変形例を説明するための図である。FIG. 56 is a diagram for explaining a modified example of the method for manufacturing the wiring board in FIG. 55. 図５５の配線基板の製造方法の一変形例を説明するための図である。FIG. 56 is a diagram for explaining a modified example of the method for manufacturing the wiring board in FIG. 55. 図５５の配線基板の製造方法の一変形例を説明するための図である。FIG. 56 is a diagram for explaining a modified example of the method for manufacturing the wiring board in FIG. 55. 図５５の配線基板の製造方法の一変形例を説明するための図である。FIG. 56 is a diagram for explaining a modified example of the method for manufacturing the wiring board in FIG. 55. 図５５の配線基板の一変形例を示す平面図である。FIG. 56 is a plan view showing a modified example of the wiring board of FIG. 55. 本開示に係るさらに他の実施形態に係る配線基板を示す平面図である。FIG. 10 is a plan view showing a wiring board according to still another embodiment of the present disclosure. 図７６の配線基板を線II－IIに沿って切断した場合を示す断面図である。FIG. 77 is a cross-sectional view showing a case where the wiring board in FIG. 76 is cut along a line II-II. 図７６の配線基板の一変形例を示す平面図である。FIG. 77 is a plan view showing a modified example of the wiring board of FIG. 76. 図７６の配線基板の一変形例を示す平面図である。FIG. 77 is a plan view showing a modified example of the wiring board of FIG. 76.
　以下、本開示の実施形態に係る配線基板の構成及びその製造方法について、図面を参照しながら詳細に説明する。なお、以下に示す実施形態は本開示の実施形態の一例であって、本開示はこれらの実施形態に限定して解釈されるものではない。また、本明細書において、「基板」、「基材」、「シート」や「フィルム」などの用語は、呼称の違いのみに基づいて、互いから区別されるものではない。例えば、「基材」は、基板、シートやフィルムと呼ばれ得るような部材も含む概念である。更に、本明細書において用いる、形状や幾何学的条件並びにそれらの程度を特定する、例えば、「平行」や「直交」等の用語や長さや角度の値等については、厳密な意味に縛られることなく、同様の機能を期待し得る程度の範囲を含めて解釈することとする。また、本明細書において用いられる「接する」という用語は、直接的に接すること及び間接的に接することを含む概念であり、例えば直接的に接することだけを特定する場合には、明示的に「直接的に接する」という表現が用いられる。また、本実施形態で参照する図面において、同一部分または同様な機能を有する部分には同一の符号または類似の符号を付し、その繰り返しの説明は省略する場合がある。また、図面の寸法比率は説明の都合上実際の比率とは異なる場合や、構成の一部が図面から省略される場合がある。 Hereinafter, the configuration of the wiring board and the manufacturing method thereof according to the embodiment of the present disclosure will be described in detail with reference to the drawings. The embodiments described below are examples of the embodiments of the present disclosure, and the present disclosure should not be construed as being limited to these embodiments. Further, in the present specification, terms such as “substrate”, “base material”, “sheet”, and “film” are not distinguished from each other based only on the difference in designation. For example, the "base material" is a concept including members such as substrates, sheets and films. Further, as used in the present specification, terms such as “parallel” and “orthogonal” and values of length and angle, etc. that specify shapes and geometric conditions and their degrees are bound to strict meanings. Instead, the same function should be interpreted including the range to the extent that it can be expected. In addition, the term "contact" used in the present specification is a concept including direct contact and indirect contact, and for example, when only direct contact is specified, it is explicitly " The expression "to directly contact" is used. Further, in the drawings referred to in this embodiment, the same portions or portions having similar functions are denoted by the same reference numerals or similar reference numerals, and repeated description thereof may be omitted. Further, the dimensional ratios in the drawings may be different from the actual ratios for convenience of description, or a part of the configuration may be omitted from the drawings.
　以下、本開示の配線基板について説明する。 Hereinafter, the wiring board of the present disclosure will be described.
　（配線基板）
　まず、本実施形態に係る配線基板１０について説明する。図１ａは配線基板１０を示す平面図であり、そのＡ－Ａに沿って切断した場合の断面図を図１ｂに、Ｂ－Ｂに沿って切断した場合の断面図を図１ｃに示す。 (Wiring board)
First, the wiring board 10 according to the present embodiment will be described. FIG. 1a is a plan view showing the wiring board 10. A sectional view taken along the line AA is shown in FIG. 1b, and a sectional view taken along the line BB is shown in FIG. 1c.
　配線基板１０は、基材２０、配線５２、第１伸縮抑制部材３１、および第２伸縮抑制部材３２を備える。以下、配線基板１０の各構成要素について説明する。以降各図において、作用効果を認識し易くする目的で被接続部材５１を図示する場合がある。しかしながら被接続部材５１は配線基板１０の必須の構成要素ではない。以下第１伸縮抑制部材３１と第２伸縮抑制部材３２とをまとめて伸縮抑制部材３０と表現する場合もある。 The wiring board 10 includes a base material 20, wiring 52, a first expansion/contraction suppressing member 31, and a second expansion/contraction suppressing member 32. Hereinafter, each component of the wiring board 10 will be described. Hereinafter, in each drawing, the connected member 51 may be illustrated for the purpose of making it easier to recognize the operation and effect. However, the connected member 51 is not an essential component of the wiring board 10. Hereinafter, the first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member 32 may be collectively referred to as the expansion/contraction suppressing member 30.
　〔基材〕
　基材２０は、伸縮性を有するよう構成された部材である。基材２０は、配線５２側に位置する第１面２１と、第１面２１の反対側に位置する第２面２２と、を含む。基材２０の厚さは、例えば１０μｍ以上１０ｍｍ以下であり、より好ましくは２０μｍ以上３ｍｍ以下である。基材２０の厚さを１０μｍ以上にすることにより、基材２０の耐久性を確保することができる。また、基材２０の厚さを１０ｍｍ以下にすることにより、配線基板１０の装着快適性を確保することができる。なお、基材２０の厚さを小さくしすぎると、基材２０の伸縮性が損なわれる場合がある。 〔Base material〕
The base material 20 is a member configured to have elasticity. The base material 20 includes a first surface 21 located on the wiring 52 side and a second surface 22 located on the opposite side of the first surface 21. The base material 20 has a thickness of, for example, 10 μm or more and 10 mm or less, and more preferably 20 μm or more and 3 mm or less. By setting the thickness of the base material 20 to 10 μm or more, the durability of the base material 20 can be ensured. In addition, by setting the thickness of the base material 20 to 10 mm or less, it is possible to secure the wearing comfort of the wiring board 10. If the thickness of the base material 20 is too small, the elasticity of the base material 20 may be impaired.
　なお、基材２０の伸縮性とは、基材２０が伸び縮みすることができる性質、すなわち、常態である非伸長状態から伸長することができ、この伸長状態から解放したときに復元することができる性質をいう。非伸長状態とは、引張応力が加えられていない時の基材２０の状態である。本実施形態において、伸縮可能な基材は、好ましくは、破壊されることなく非伸長状態から１％以上伸長することができ、より好ましくは２０％以上伸長することができ、更に好ましくは７５％以上伸長することができる。このような能力を有する基材２０を用いることにより、配線基板１０が全体に伸縮性を有することができる。 The stretchability of the base material 20 means that the base material 20 can expand and contract, that is, it can be expanded from a non-expanded state which is a normal state, and can be restored when released from this expanded state. A property that can be done. The non-stretched state is the state of the base material 20 when no tensile stress is applied. In this embodiment, the stretchable substrate is preferably capable of stretching 1% or more from an unstretched state without breaking, more preferably 20% or more, and further preferably 75%. The above can be extended. By using the base material 20 having such an ability, the wiring board 10 can have stretchability as a whole.
　さらに、人の腕などの身体の一部に取り付けるという、高い伸縮が必要な製品や用途において、配線基板１０を使用することができる。一般に、人の脇の下に取り付ける製品には、垂直方向において７２％、水平方向において２７％の伸縮性が必要であると言われている。また、人の膝、肘、臀部、足首、脇部に取り付ける製品には、垂直方向において２６％以上４２％以下の伸縮性が必要であると言われている。また、人のその他の部位に取り付ける製品には、２０％未満の伸縮性が必要であると言われている。 Furthermore, the wiring board 10 can be used in products and applications that require high expansion and contraction, such as being attached to a part of the body such as a person's arm. It is generally said that a product attached to a person's armpit must have a stretchability of 72% in the vertical direction and 27% in the horizontal direction. Further, it is said that a product attached to a person's knees, elbows, buttocks, ankles, and armpits needs to have elasticity of 26% or more and 42% or less in the vertical direction. Further, it is said that a product attached to other parts of a person needs elasticity of less than 20%.
　また、非伸長状態にある基材２０の形状と、非伸長状態から伸長された後に再び非伸長状態に戻ったときの基材２０の形状との差が小さいことが好ましい。この差のことを、以下の説明において形状変化とも称する。基材２０の形状変化は、例えば面積比で２０％以下、より好ましくは１０％以下、さらに好ましくは５％以下である。形状変化の小さい基材２０を用いることにより、後述する蛇腹形状部の形成が容易になる。 Also, it is preferable that the difference between the shape of the base material 20 in the non-stretched state and the shape of the base material 20 when it is stretched from the non-stretched state and then returned to the non-stretched state is small. This difference is also referred to as a shape change in the following description. The shape change of the base material 20 is, for example, 20% or less in area ratio, more preferably 10% or less, and further preferably 5% or less. By using the base material 20 having a small shape change, it becomes easy to form a bellows-shaped portion described later.
　基材２０の伸縮性を表すパラメータの例として、基材２０の弾性係数を挙げることができる。基材２０の弾性係数は、例えば１０ＭＰａ以下であり、より好ましくは１ＭＰａ以下である。このような弾性係数を有する基材２０を用いることにより、配線基板１０全体に伸縮性を持たせることができる。以下の説明において、基材２０の弾性係数のことを、第１の弾性係数とも称する。基材２０の第１の弾性係数は、１ｋＰａ以上であってもよい。 The elastic coefficient of the base material 20 can be given as an example of the parameter indicating the elasticity of the base material 20. The elastic modulus of the base material 20 is, for example, 10 MPa or less, and more preferably 1 MPa or less. By using the base material 20 having such an elastic coefficient, the entire wiring board 10 can be made to have elasticity. In the following description, the elastic coefficient of the base material 20 is also referred to as a first elastic coefficient. The first elastic modulus of the base material 20 may be 1 kPa or more.
　基材２０の第１の弾性係数を算出する方法としては、基材２０のサンプルを用いて、ＪＩＳ　Ｋ６２５１に準拠して引張試験を実施するという方法を採用することができる。また、基材２０のサンプルの弾性係数を、ＩＳＯ１４５７７に準拠してナノインデンテーション法によって測定するという方法を採用することもできる。ナノインデンテーション法において用いる測定器としては、ナノインデンターを用いることができる。基材２０のサンプルを準備する方法としては、配線基板１０から基材２０の一部をサンプルとして取り出す方法や、配線基板１０を構成する前の基材２０の一部をサンプルとして取り出す方法が考えられる。その他にも、基材２０の第１の弾性係数を算出する方法として、基材２０を構成する材料を分析し、材料の既存のデータベースに基づいて基材２０の第１の弾性係数を算出するという方法を採用することもできる。なお、本開示における弾性係数は、２５℃の環境下における弾性係数である。 As a method of calculating the first elastic modulus of the base material 20, it is possible to use a method of performing a tensile test in accordance with JIS K6251 using a sample of the base material 20. It is also possible to employ a method in which the elastic coefficient of the sample of the base material 20 is measured by the nanoindentation method according to ISO14577. A nano indenter can be used as a measuring device used in the nano indentation method. As a method of preparing a sample of the base material 20, a method of taking out a part of the base material 20 from the wiring board 10 as a sample or a method of taking out a part of the base material 20 before forming the wiring board 10 as a sample is considered. To be In addition, as a method of calculating the first elastic coefficient of the base material 20, the material forming the base material 20 is analyzed, and the first elastic coefficient of the base material 20 is calculated based on the existing database of the material. It is also possible to adopt the method. The elastic modulus in the present disclosure is an elastic coefficient under an environment of 25°C.
　基材２０の伸縮性を表すパラメータのその他の例として、基材２０の曲げ剛性を挙げることができる。曲げ剛性は、対象となる部材の断面二次モーメントと、対象となる部材を構成する材料の弾性係数との積であり、単位はＮ・ｍ２又はＰａ・ｍ４である。基材２０の断面二次モーメントは、配線基板１０の伸縮方向に直交する平面によって、基材２０のうち配線５２と重なっている部分を切断した場合の断面に基づいて算出される。 The bending rigidity of the base material 20 can be given as another example of the parameter indicating the elasticity of the base material 20. The bending rigidity is the product of the second moment of area of the target member and the elastic modulus of the material forming the target member, and the unit is N·m 2 or Pa·m 4 . The geometrical moment of inertia of the base material 20 is calculated based on the cross section when the portion of the base material 20 overlapping the wiring 52 is cut by the plane orthogonal to the expansion/contraction direction of the wiring board 10.
　基材２０を構成する材料の例としては、例えば、エラストマーを挙げることができる。また、基材２０の材料として、例えば、織物、編物、不織布などの布を用いることもできる。エラストマーとしては、一般的な熱可塑性エラストマーおよび熱硬化性エラストマーを用いることができ、具体的には、ポリウレタン系エラストマー、スチレン系エラストマー、ニトリル系エラストマー、オレフィン系エラストマー、塩ビ系エラストマー、エステル系エラストマー、アミド系エラストマー、１，２－ＢＲ系エラストマー、フッ素系エラストマー、シリコーンゴム、ウレタンゴム、フッ素ゴム、ポリブタジエン、ポリイソブチレン、ポリスチレンブタジエン、ポリクロロプレン等を用いることができる。機械的強度や耐磨耗性を考慮すると、ウレタン系エラストマーを用いることが好ましい。また、基材２０がシリコーンを含んでいてもよい。シリコーンは、耐熱性・耐薬品性・難燃性に優れており、基材２０の材料として好ましい。 As an example of the material forming the base material 20, for example, an elastomer can be cited. Further, as the material of the base material 20, for example, cloth such as woven fabric, knitted fabric, and non-woven fabric can be used. As the elastomer, a general thermoplastic elastomer and a thermosetting elastomer can be used, and specifically, a polyurethane elastomer, a styrene elastomer, a nitrile elastomer, an olefin elastomer, a vinyl chloride elastomer, an ester elastomer, Amide elastomer, 1,2-BR elastomer, fluorine elastomer, silicone rubber, urethane rubber, fluorine rubber, polybutadiene, polyisobutylene, polystyrene butadiene, polychloroprene and the like can be used. Considering mechanical strength and abrasion resistance, it is preferable to use urethane elastomer. Further, the base material 20 may include silicone. Silicone has excellent heat resistance, chemical resistance, and flame retardancy, and is preferable as a material for the base material 20.
　〔配線〕
　配線５２は、基材２０の第１面２１側に位置し、配線基板１０に搭載される被接続部材５１に接続部５１ａを介して接続される、導電性を有する部材である。例えば図１ｂに示すように、配線５２の端部が、接続部５１ａを介して被接続部材５１に接続されている。図１ｂに示す例では、被接続部材５１に対して両側（図１ｂにおける左右）のそれぞれに、複数の配線５２が設けられるが、配線５２の数は特に限定されるものではない。 〔wiring〕
The wiring 52 is a member which is located on the first surface 21 side of the base material 20 and which is connected to the connected member 51 mounted on the wiring substrate 10 via the connecting portion 51a and has conductivity. For example, as shown in FIG. 1b, the end portion of the wiring 52 is connected to the connected member 51 via the connecting portion 51a. In the example shown in FIG. 1b, a plurality of wirings 52 are provided on both sides (left and right in FIG. 1b) of the connected member 51, but the number of wirings 52 is not particularly limited.
　また配線５２には、分岐部や方向転換部、配線の幅が変化する配線幅変化部等の配線の平面視上の外形が配線の延伸方向において変化する箇所が設けられていてもよい。図４０ａおよびｂは説明のために配線５２の端部５２ｔ、分岐部５２ｂ、および方向転換部５２ｈを表した模式図である。図４０ａにおける端部５２ｔ、分岐部５２ｂ、および方向転換部５２ｈ部分を拡大した模式図を図４０ｂに示す。配線５２の端部５２ｔは配線の一端であり、通常は該端部５２ｔにおいては接続部５１ａを介して被接続部材５１に接続される。接続部５１ａを介して被接続部材５１に接続されていなくても構わない。配線の分岐部５２ｂは、配線が分岐する部分である。分岐の角度や分岐部５２ｂに接続される各配線５２の幅などは任意である。配線の方向転換部５２ｈは配線の方向が転換される部分である。方向の転換角度は図４０ａおよびｂにおいては９０°であるが、これに限らず転換角度任意である。また図４０ａおよびｂにおいては直角に方向転換しているがこれに限らない。方向転換部は円弧の一部であっても、様々な半径の円弧の一部が連続してものであっても良い。一番小さな円弧の半径が配線幅の２０倍以下であれば方向転換部５２ｈである。 Further, the wiring 52 may be provided with a branch portion, a direction changing portion, a wiring width changing portion in which the width of the wiring changes, and the like, where the outer shape of the wiring in plan view changes in the extending direction of the wiring. 40A and 40B are schematic views showing the end portion 52t, the branch portion 52b, and the direction changing portion 52h of the wiring 52 for the sake of explanation. FIG. 40b is an enlarged schematic view of the end portion 52t, the branch portion 52b, and the direction changing portion 52h portion in FIG. 40a. The end portion 52t of the wiring 52 is one end of the wiring, and is normally connected to the connected member 51 via the connection portion 51a at the end portion 52t. It does not need to be connected to the connected member 51 via the connecting portion 51a. The wiring branch portion 52b is a portion where the wiring branches. The angle of branching and the width of each wiring 52 connected to the branching portion 52b are arbitrary. The wiring direction changing portion 52h is a portion where the direction of the wiring is changed. The turning angle of the direction is 90° in FIGS. 40a and 40b, but the turning angle is not limited to this and may be any turning angle. Moreover, although the direction is changed at a right angle in FIGS. 40a and 40b, it is not limited to this. The turning portion may be a part of a circular arc or a part of a circular arc of various radii. If the radius of the smallest circular arc is 20 times the wiring width or less, it is the direction changing portion 52h.
　後述するように、一実施形態では、配線５２が、引張によって伸長した状態の基材２０に設けられる。この場合、基材２０から引張応力が取り除かれて基材２０が収縮するとき、配線５２は、図２に示すように、蛇腹状に変形して蛇腹形状部５７を有するようになる。図２は図１ａのＣ－Ｃ断面を示す模式的に表した拡大図である。理解を助けるために、Ｃ－Ｃ断面には本来現れず背後に存在する伸縮抑制部材３０も図示している。 As will be described later, in one embodiment, the wiring 52 is provided on the base material 20 stretched by tension. In this case, when the tensile stress is removed from the base material 20 and the base material 20 contracts, the wiring 52 deforms into a bellows shape and has the bellows-shaped portion 57, as shown in FIG. FIG. 2 is an enlarged view schematically showing the CC cross section of FIG. 1a. For the sake of understanding, the expansion suppressing member 30 which does not originally appear in the CC cross section and is present behind is also illustrated.
　蛇腹形状部５７は、基材２０の第１面２１の法線方向における山部及び谷部を含む。図２において、符号５３は、配線５２の表面に現れる山部を表し、符号５４は、配線５２の裏面に現れる山部を表す。また、符号５５は、配線５２の表面に現れる谷部を表し、符号５６は、配線５２の裏面に現れる谷部を表す。表面とは、配線５２の面のうち基材２０から遠い側に位置する面であり、裏面とは、配線５２の面のうち基材２０に近い側に位置する面である。また、図２において、符号２６及び２７は、基材２０の第１面２１に現れる山部及び谷部を表す。第１面２１に山部２６及び谷部２７が現れるように基材２０が変形することにより、配線５２が蛇腹状に変形して蛇腹形状部５７を有するようになる。基材２０の第１面２１の山部２６が、配線５２の蛇腹形状部５７の山部５３、５４に対応し、基材２０の第１面２１の谷部２７が、配線５２の蛇腹形状部５７の谷部５５、５６に対応している。 The bellows-shaped portion 57 includes a peak portion and a valley portion in the normal direction of the first surface 21 of the base material 20. In FIG. 2, reference numeral 53 represents a mountain portion appearing on the front surface of the wiring 52, and reference numeral 54 represents a mountain portion appearing on the back surface of the wiring 52. Further, reference numeral 55 represents a valley portion appearing on the front surface of the wiring 52, and reference numeral 56 represents a valley portion appearing on the back surface of the wiring 52. The front surface is a surface of the surface of the wiring 52 that is located on the side farther from the base material 20, and the back surface is the surface of the surface of the wiring 52 that is located on the side closer to the base material 20. Further, in FIG. 2, reference numerals 26 and 27 represent peaks and valleys appearing on the first surface 21 of the base material 20. When the base material 20 is deformed so that the peaks 26 and the valleys 27 appear on the first surface 21, the wiring 52 is deformed into a bellows shape and has the bellows-shaped portion 57. The crests 26 of the first surface 21 of the base material 20 correspond to the crests 53 and 54 of the bellows-shaped portion 57 of the wiring 52, and the valleys 27 of the first surface 21 of the base material 20 are the bellows shape of the wiring 52. It corresponds to the valley portions 55 and 56 of the portion 57.
　以下の説明において、蛇腹形状部５７の山部及び谷部が繰り返し現れる方向、すなわち配線基板１０の伸縮方向のことを、第１方向Ｄ１とも称する。図２に示す例において、配線５２は、第１方向Ｄ１に平行に延びている。ここで、配線５２は、被接続部材５１及び伸縮抑制部材３０に対し、第１方向Ｄ１でずれた位置に、蛇腹形状部５７を有する。また、基材２０は、第１方向Ｄ１に平行な長辺を含む長方形の形状を有している。図示はしないが、配線基板１０は、第１方向Ｄ１とは異なる方向に延びる配線５２を含んでいてもよい。また、図示はしないが、基材２０が長方形の形状を有する場合に、長辺が延びる方向が第１方向Ｄ１とは異なっていてもよい。なお、図２においては、蛇腹形状部５７の複数の山部及び谷部が一定の周期で並ぶ例が示されているが、これに限られることはない。図示はしないが、蛇腹形状部５７の複数の山部及び谷部は、第１方向Ｄ１に沿って不規則に並んでいてもよい。例えば、第１方向Ｄ１において隣り合う２つの山部の間の間隔が一定でなくてもよい。 In the following description, the direction in which the peaks and valleys of the bellows-shaped portion 57 appear repeatedly, that is, the direction of expansion and contraction of the wiring board 10, is also referred to as the first direction D1. In the example shown in FIG. 2, the wiring 52 extends parallel to the first direction D1. Here, the wiring 52 has a bellows-shaped portion 57 at a position displaced in the first direction D1 with respect to the connected member 51 and the expansion/contraction suppressing member 30. In addition, the base material 20 has a rectangular shape including long sides parallel to the first direction D1. Although not shown, the wiring board 10 may include a wiring 52 extending in a direction different from the first direction D1. Further, although not shown, when the base material 20 has a rectangular shape, the direction in which the long sides extend may be different from the first direction D1. Note that, although FIG. 2 shows an example in which the plurality of peaks and valleys of the bellows-shaped portion 57 are arranged at a constant cycle, the present invention is not limited to this. Although not shown, the plurality of peaks and troughs of the bellows-shaped portion 57 may be arranged irregularly along the first direction D1. For example, the interval between two peaks adjacent to each other in the first direction D1 may not be constant.
　上記の通り、基材２０は、配線５２が延びる方向（第１方向Ｄ１）に並ぶ複数の山部を含むものであり、また配線５２は、配線５２が延びる方向に並ぶ複数の山部を含むものである。すなわち基材２０、および配線５２には蛇腹形状部５７が形成されている。 As described above, the base material 20 includes a plurality of peaks arranged in the direction in which the wiring 52 extends (first direction D1), and the wiring 52 includes a plurality of peaks arranged in the direction in which the wiring 52 extends. It is a waste. That is, the bellows-shaped portion 57 is formed on the base material 20 and the wiring 52.
　図２において、符号Ｓ１は、配線５２の表面における蛇腹形状部５７の、基材２０の法線方向における振幅を表す。振幅Ｓ１は、例えば１μｍ以上であり、より好ましくは１０μｍ以上である。振幅Ｓ１を１０μｍ以上とすることにより、基材２０の伸張に追従して配線５２が変形し易くなる。また、振幅Ｓ１は、例えば５００μｍ以下であってもよい。 In FIG. 2, symbol S1 represents the amplitude of the bellows-shaped portion 57 on the surface of the wiring 52 in the normal direction of the base material 20. The amplitude S1 is, for example, 1 μm or more, and more preferably 10 μm or more. By setting the amplitude S1 to 10 μm or more, the wiring 52 is easily deformed following the expansion of the base material 20. Further, the amplitude S1 may be, for example, 500 μm or less.
　振幅Ｓ１は、例えば、配線５２の長さ方向における一定の範囲にわたって、隣り合う山部５３と谷部５５との間の、第１面２１の法線方向における距離を測定し、それらの平均を求めることにより算出される。「配線５２の長さ方向における一定の範囲」は、例えば１０ｍｍである。隣り合う山部５３と谷部５５との間の距離を測定する測定器としては、レーザー顕微鏡などを用いた非接触式の測定器を用いてもよく、接触式の測定器を用いてもよい。また、断面写真などの画像に基づいて、隣り合う山部５３と谷部５５との間の距離を測定してもよい。後述する振幅Ｓ２、Ｓ３の算出方法も同様である。 For the amplitude S1, for example, the distance in the normal direction of the first surface 21 between the adjacent peaks 53 and valleys 55 is measured over a certain range in the length direction of the wiring 52, and the average thereof is calculated. It is calculated by obtaining. The “certain range in the length direction of the wiring 52” is, for example, 10 mm. As a measuring device for measuring the distance between the adjacent crests 53 and valleys 55, a non-contact measuring device using a laser microscope or the like may be used, or a contact measuring device may be used. .. Further, the distance between the adjacent ridges 53 and valleys 55 may be measured based on an image such as a cross-sectional photograph. The same applies to the method of calculating the amplitudes S2 and S3 described later.
　図２において、符号Ｓ２は、配線５２の裏面における蛇腹形状部５７の振幅を表す。振幅Ｓ２は、振幅Ｓ１と同様に、例えば１μｍ以上であり、より好ましくは１０μｍ以上である。また、振幅Ｓ２は、例えば５００μｍ以下であってもよい。また、図２において、符号Ｓ３は、蛇腹形状部５７に重なる部分において基材２０の第１面２１に現れる山部２６及び谷部２７の振幅を表す。図２に示すように配線５２の裏面が基材２０の第１面２１上に位置している場合、基材２０の第１面２１の山部２６及び谷部２７の振幅Ｓ３は、配線５２の裏面における蛇腹形状部５７の振幅Ｓ２に等しい。 In FIG. 2, symbol S2 represents the amplitude of the bellows-shaped portion 57 on the back surface of the wiring 52. Like the amplitude S1, the amplitude S2 is, for example, 1 μm or more, and more preferably 10 μm or more. Further, the amplitude S2 may be, for example, 500 μm or less. Further, in FIG. 2, symbol S3 represents the amplitudes of the peaks 26 and the valleys 27 that appear on the first surface 21 of the base material 20 in the portion that overlaps the bellows-shaped portion 57. As shown in FIG. 2, when the back surface of the wiring 52 is located on the first surface 21 of the base material 20, the amplitude S3 of the peak portion 26 and the valley portion 27 of the first surface 21 of the base material 20 is equal to the wiring 52. Is equal to the amplitude S2 of the bellows-shaped portion 57 on the back surface of the.
　なお、図２においては、基材２０の第２面２２には蛇腹形状部が現れない例を示したが、これに限られることはなく、基材２０の第２面２２にも蛇腹形状部が現れていてもよい。第２面２２の山部は、第１面２１の谷部２７に重なる位置に現れ、第２面２２の谷部は、第１面２１の山部２６に重なる位置に現れていても良いし、基材２０の第２面２２の山部及び谷部の位置は、第１面２１の谷部２７及び山部２６に重なっていなくてもよい。また、基材２０の第２面２２の山部及び谷部の数又は周期は、第１面２１の山部２６及び谷部２７の数又は周期と同一であってもよく、異なっていてもよい。
　また、基材２０の第２面２２に現れる山部及び谷部の振幅は、第１面２１の振幅Ｓ３と同一であってもよく、異なっていてもよい。基材２０の厚さが小さい場合、第１面２１の振幅Ｓ３に対する第２面２２の振幅の比率が大きくなり易い。 Note that, although FIG. 2 shows an example in which the bellows-shaped portion does not appear on the second surface 22 of the base material 20, the present invention is not limited to this, and the second surface 22 of the base material 20 has the bellows-shaped portion. May appear. The peaks of the second surface 22 may appear at positions overlapping the valleys 27 of the first surface 21, and the valleys of the second surface 22 may appear at positions overlapping the peaks 26 of the first surface 21. The positions of the peaks and valleys of the second surface 22 of the base material 20 do not have to overlap the valleys 27 and peaks 26 of the first surface 21. The number or cycle of the peaks and valleys of the second surface 22 of the base material 20 may be the same as or different from the number or cycle of the peaks 26 and valleys 27 of the first surface 21. Good.
Moreover, the amplitude of the peaks and valleys appearing on the second surface 22 of the base material 20 may be the same as or different from the amplitude S3 of the first surface 21. When the thickness of the base material 20 is small, the ratio of the amplitude of the second surface 22 to the amplitude S3 of the first surface 21 tends to increase.
　配線５２の材料としては、蛇腹形状部５７の解消及び生成を利用して基材２０の伸張及び収縮に追従することができる材料であればよい。配線５２の材料は、それ自体が伸縮性を有していてもよく、伸縮性を有していなくてもよい。
　配線５２に用いられ得る、それ自体は伸縮性を有さない材料としては、例えば、金、銀、銅、アルミニウム、白金、クロム等の金属や、これらの金属を含む合金が挙げられる。配線５２の材料自体が伸縮性を有さない場合、配線５２としては、金属膜を用いることができる。
　配線５２に用いられる材料自体が伸縮性を有する場合、材料の伸縮性は、例えば、基材２０の伸縮性と同様である。配線５２に用いられ得る、それ自体が伸縮性を有する材料としては、例えば、導電性粒子およびエラストマーを含有する導電性組成物が挙げられる。 The material of the wiring 52 may be any material that can follow the expansion and contraction of the base material 20 by utilizing the elimination and generation of the bellows-shaped portion 57. The material of the wiring 52 may or may not have elasticity itself.
Examples of the material that does not have elasticity by itself that can be used for the wiring 52 include metals such as gold, silver, copper, aluminum, platinum, and chromium, and alloys containing these metals. When the material of the wiring 52 itself does not have elasticity, a metal film can be used as the wiring 52.
When the material itself used for the wiring 52 has elasticity, the elasticity of the material is similar to that of the base material 20, for example. Examples of the material having elasticity which can be used for the wiring 52 include a conductive composition containing conductive particles and an elastomer.
　好ましくは、配線５２は、変形に対する耐性を有する構造を備える。例えば、配線５２は、ベース材と、ベース材の中に分散された複数の導電性粒子とを有する。この場合、ベース材として、樹脂などの変形可能な材料を用いることにより、基材２０の伸縮に応じて配線５２も変形することができる。また、変形が生じた場合であっても複数の導電性粒子の間の接触が維持されるように導電性粒子の分布や形状を設定することにより、配線５２の導電性を維持することができる。 Preferably, the wiring 52 has a structure having resistance to deformation. For example, the wiring 52 has a base material and a plurality of conductive particles dispersed in the base material. In this case, by using a deformable material such as resin as the base material, the wiring 52 can also be deformed according to the expansion and contraction of the base material 20. Further, the conductivity of the wiring 52 can be maintained by setting the distribution and shape of the conductive particles so that the contact between the plurality of conductive particles is maintained even when deformation occurs. ..
　配線５２のベース材を構成する材料としては、一般的な熱可塑性エラストマーおよび熱硬化性エラストマーを用いることができ、例えば、スチレン系エラストマー、アクリル系エラストマー、オレフィン系エラストマー、ウレタン系エラストマー、シリコーンゴム、ウレタンゴム、フッ素ゴム、ニトリルゴム、ポリブタジエン、ポリクロロプレン等を用いることができる。中でも、ウレタン系、シリコーン系構造を含む樹脂やゴムが、その伸縮性や耐久性などの面から好ましく用いられる。また、配線５２の導電性粒子を構成する材料としては、例えば銀、銅、金、ニッケル、パラジウム、白金、カーボン等の粒子を用いることができる。中でも、銀粒子が好ましく用いられる。 As a material forming the base material of the wiring 52, a general thermoplastic elastomer and a thermosetting elastomer can be used. For example, a styrene elastomer, an acrylic elastomer, an olefin elastomer, a urethane elastomer, a silicone rubber, Urethane rubber, fluororubber, nitrile rubber, polybutadiene, polychloroprene and the like can be used. Of these, resins and rubbers containing urethane-based or silicone-based structures are preferably used from the viewpoint of stretchability and durability. Further, as the material forming the conductive particles of the wiring 52, for example, particles of silver, copper, gold, nickel, palladium, platinum, carbon or the like can be used. Among them, silver particles are preferably used.
　配線５２の厚さは、基材２０の伸縮に耐え得る厚さであればよく、配線５２の材料等に応じて適宜選択される。
　例えば、配線５２の材料が伸縮性を有さない場合、配線５２の厚さは、２５ｎｍ以上５０μｍ以下の範囲内とすることができ、５０ｎｍ以上１０μｍ以下の範囲内であることが好ましく、１００ｎｍ以上５μｍ以下の範囲内であることがより好ましい。
　また、配線５２の材料が伸縮性を有する場合、配線５２の厚さは、５μｍ以上６０μｍ以下の範囲内とすることができ、１０μｍ以上５０μｍ以下の範囲内であることが好ましく、２０μｍ以上４０μｍ以下の範囲内であることがより好ましい。
　配線５２の幅は、例えば５０μｍ以上且つ１０ｍｍ以下である。 The wiring 52 may have any thickness as long as it can withstand the expansion and contraction of the base material 20, and is appropriately selected according to the material of the wiring 52 and the like.
For example, when the material of the wiring 52 does not have elasticity, the thickness of the wiring 52 can be in the range of 25 nm or more and 50 μm or less, preferably in the range of 50 nm or more and 10 μm or less, and 100 nm or more. More preferably, it is in the range of 5 μm or less.
When the material of the wiring 52 has elasticity, the thickness of the wiring 52 can be set in the range of 5 μm or more and 60 μm or less, preferably in the range of 10 μm or more and 50 μm or less, and 20 μm or more and 40 μm or less. Is more preferably within the range.
The width of the wiring 52 is, for example, 50 μm or more and 10 mm or less.
　配線５２の形成方法は、材料等に応じて適宜選択される。例えば、基材２０上または後述する支持基板４０上に蒸着法やスパッタリング法、メッキ法、特にＣｕメッキ法等により金属膜を形成した後、フォトリソグラフィ法により金属膜をパターニングする方法が挙げられる。また、配線５２の材料自体が伸縮性を有する場合、例えば、基材２０上または支持基板４０上に一般的な印刷法により上記の導電性粒子およびエラストマーを含有する導電性組成物をパターン状に印刷する方法が挙げられる。これらの方法のうち、材料効率がよく安価に製作できる印刷法が好ましく用いられ得る。 The method of forming the wiring 52 is appropriately selected according to the material and the like. For example, there is a method of forming a metal film on the base material 20 or on a support substrate 40 described later by a vapor deposition method, a sputtering method, a plating method, particularly a Cu plating method, and then patterning the metal film by a photolithography method. When the material of the wiring 52 itself has elasticity, for example, the conductive composition containing the conductive particles and the elastomer is formed in a pattern on the base material 20 or the support substrate 40 by a general printing method. There is a method of printing. Among these methods, a printing method that can be manufactured with high material efficiency and at low cost can be preferably used.
　また、基材２０上または後述する支持基板４０上及びこれら基材２０または支持基板４０に設けられた配線５２には、基材２０または支持基板４０と配線５２とを一体的に覆う絶縁膜が設けられてもよい。ただし、絶縁膜は、配線５２における被接続部材５１との接続部分上には設けられない。このような絶縁膜は、熱硬化性の絶縁樹脂等を加熱硬化することで構成され得る。絶縁膜の厚さは、例えば０．１μｍ以上５００μｍ以下でもよい。また、絶縁膜の形成は、スクリーン印刷等で行われてもよい。また、接続部５１ａは、例えば導電性接着剤から構成されてもよいし、半田材料で形成されてもよいし、被接続部材５１と一体の端子であってもよい。 In addition, an insulating film that integrally covers the base material 20 or the support substrate 40 and the wiring 52 is provided on the base material 20 or the support substrate 40 described below and the wiring 52 provided on the base material 20 or the support substrate 40. It may be provided. However, the insulating film is not provided on the connection portion of the wiring 52 with the connected member 51. Such an insulating film can be formed by heating and hardening a thermosetting insulating resin or the like. The thickness of the insulating film may be, for example, 0.1 μm or more and 500 μm or less. Further, the insulating film may be formed by screen printing or the like. The connecting portion 51a may be made of, for example, a conductive adhesive, may be made of a solder material, or may be a terminal integrated with the connected member 51.
　蛇腹形状部５７が配線５２に形成されていることの利点について説明する。上述のように、基材２０は、１０ＭＰａ以下の弾性係数を有する。このため、配線基板１０に引張応力を加えた場合、基材２０は、弾性変形によって伸長することができる。ここで、仮に配線５２も同様に弾性変形によって伸長すると、配線５２の全長が増加し、配線５２の断面積が減少するので、配線５２の抵抗値が増加してしまう。また、配線５２の弾性変形に起因して配線５２にクラックなどの破損が生じてしまうことも考えられる。 The advantages of forming the bellows-shaped portion 57 on the wiring 52 will be described. As described above, the base material 20 has an elastic modulus of 10 MPa or less. Therefore, when tensile stress is applied to the wiring board 10, the base material 20 can expand due to elastic deformation. Here, if the wiring 52 is similarly expanded by elastic deformation, the total length of the wiring 52 increases and the cross-sectional area of the wiring 52 decreases, so that the resistance value of the wiring 52 increases. It is also conceivable that the elastic deformation of the wiring 52 may cause damage such as cracks in the wiring 52.
　これに対して、本実施形態においては、基材２０が蛇腹形状部５７を有しているため、配線５２も蛇腹形状部５７を有している。このため、基材２０が伸張する際、配線５２は、蛇腹形状部５７の起伏を低減するように変形することによって、すなわち蛇腹形状を解消することによって、基材２０の伸張に追従することができる。このため、基材２０の伸張に伴って配線５２の全長が増加することや、配線５２の断面積が減少することを抑制することができる。このことにより、配線基板１０の伸張に起因して配線５２の抵抗値が増加することを抑制することができる。また、配線５２にクラックなどの破損が生じてしまうことを抑制することができる。 On the other hand, in the present embodiment, since the base material 20 has the bellows-shaped portion 57, the wiring 52 also has the bellows-shaped portion 57. Therefore, when the base material 20 extends, the wiring 52 can follow the extension of the base material 20 by deforming so as to reduce the undulations of the bellows-shaped portion 57, that is, by eliminating the bellows shape. it can. Therefore, it is possible to suppress an increase in the total length of the wiring 52 and a decrease in the cross-sectional area of the wiring 52 as the base material 20 extends. This can prevent the resistance value of the wiring 52 from increasing due to the expansion of the wiring board 10. Further, it is possible to prevent the wiring 52 from being damaged such as cracks.
　ところで、配線５２の山部５３、５４の高さ及び谷部５５、５６の深さは、基材２０の厚さのばらつきや、基材２０に設けられる配線５２の分布密度の差などに起因して、位置によってばらつくことがある。山部５３、５４の高さ及び谷部５５、５６の深さが位置によってばらつくと、配線５２に生じる湾曲や屈曲の程度が局所的に大きくなり、配線５２が破損してしまうことが考えられる。また、山部５３、５４の高さ及び谷部５５、５６の深さのばらつきが大きい場合であっても、小さい場合であっても、被接続部材５１と配線５２とが接続される接続部５１ａや接続部５１ａに接続される配線５２の端部に応力が集中し易くなり、接続部５１ａや配線５２の端部において被接続部材５１と配線５２との電気的な接続が損なわれる、接続剥がれや断線が発生することがあった。また、配線が伸縮する際に、配線の分岐部や方向転換部等の配線の平面視上の外形が配線の延伸方向において変化する箇所においては応力が集中し断線することがあった。 By the way, the heights of the crests 53 and 54 and the depths of the troughs 55 and 56 of the wiring 52 are caused by variations in the thickness of the base material 20, differences in the distribution density of the wirings 52 provided on the base material 20, and the like. Then, it may vary depending on the position. If the heights of the peaks 53 and 54 and the depths of the valleys 55 and 56 vary depending on the position, the degree of bending or bending of the wiring 52 locally increases, and the wiring 52 may be damaged. .. Further, regardless of whether the heights of the crests 53 and 54 and the depths of the troughs 55 and 56 are large or small, the connecting portion for connecting the connected member 51 and the wiring 52 to each other. Stress is likely to be concentrated at the end of the wiring 52 connected to the connection portion 51a and the connection portion 51a, and the electrical connection between the connected member 51 and the wiring 52 is impaired at the end portion of the connection portion 51a and the wiring 52. There were cases where peeling or disconnection occurred. Further, when the wiring expands and contracts, stress sometimes concentrates and breaks at locations where the outer shape of the wiring in plan view changes in the extending direction of the wiring, such as branching portions and direction changing portions of the wiring.
　ここで本実施形態によれば、図１ａ～ｃに示す例のように、基材２０に第１伸縮抑制部材３１および第２伸縮抑制部材３２（伸縮抑制部材３０）を設けることにより、図４０ａおよびｂのように基材２０における配線５２の端部５２ｔ、分岐部５２ｂ、あるいは方向転換部５２ｈ等の配線の平面視上の外形が配線の延伸方向において変化する箇所の変形を制御、特に緩和することが可能となる。これにより、配線５２の端部５２ｔに位置する接続部において被接続部材と配線との電気的な接続が損なわれる、接続剥がれや断線を抑制したり配線の分岐部や方向転換部等の配線の平面視上の外形が配線の延伸方向において変化する箇所における断線を抑制したりすることができる。 Here, according to the present embodiment, as in the example shown in FIGS. 1a to 1c, the base material 20 is provided with the first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member 32 (expansion/contraction suppressing member 30). Controlling, especially mitigating, the deformation of the end portion 52t of the wiring 52, the branching portion 52b, the direction changing portion 52h, etc. of the wiring 52 on the base material 20 where the outer shape in plan view changes in the wiring extending direction as shown in FIGS. It becomes possible to do. As a result, the electrical connection between the member to be connected and the wiring is impaired at the connection portion located at the end portion 52t of the wiring 52, peeling of the connection or disconnection is suppressed, or the wiring branching portion, the direction changing portion, or the like It is possible to suppress disconnection at a portion where the outer shape in plan view changes in the extending direction of the wiring.
　〔第１伸縮抑制部材および第２伸縮抑制部材（伸縮抑制部材）〕
　本開示に係る配線基板は、図１ａ～ｃに示す例のように、第１伸縮抑制部材３１および第２伸縮抑制部材３２を備える。第２伸縮抑制部材３２は複数の第１伸縮抑制部材３１を固定するものである。ここで、固定するとは、相互の位置関係が変化することを抑制するという意味である。すなわち第２伸縮抑制部材３２は、複数の第１伸縮抑制部材３１の相互の位置関係が変化することを抑制するものである。複数の第１伸縮抑制部材３１は第２伸縮抑制部材３２により相互に接続されていることが好ましいが、これに限らない。 [First expansion and contraction suppressing member and second expansion and contraction suppressing member (expansion and contraction suppressing member)]
The wiring board according to the present disclosure includes a first expansion/contraction suppressing member 31 and a second expansion/contraction suppressing member 32, as in the example illustrated in FIGS. The second expansion/contraction suppressing member 32 fixes the plurality of first expansion/contraction suppressing members 31. Here, “fixed” means suppressing a change in mutual positional relationship. That is, the second expansion/contraction suppressing member 32 suppresses a change in the mutual positional relationship of the plurality of first expansion/contraction suppressing members 31. The plurality of first expansion/contraction suppressing members 31 are preferably connected to each other by the second expansion/contraction suppressing members 32, but the invention is not limited to this.
　第１伸縮抑制部材３１および第２伸縮抑制部材３２、すなわち伸縮抑制部材３０は、基材２０の第１の弾性係数よりも大きい弾性係数を有してもよい。第１伸縮抑制部材３１の弾性係数と第２伸縮抑制部材３２の弾性係数とは同じであっても良く異なっていても良く以下の通り適宜定めることができる。以下の説明において、第１伸縮抑制部材３１の弾性係数と第２伸縮抑制部材３２の弾性係数とは特に区別せずに伸縮抑制部材３０の弾性係数と称し、これを第２の弾性係数とも称する。第２の弾性係数は、例えば０．１ＧＰａ以上５００ＧＰａ以下であり、より好ましくは０．１ＧＰａ以上１００ＧＰａ以下である。このような伸縮抑制部材３０を基材２０に設けることにより、後述する伸縮抑制領域７０における伸縮を抑制することができる。これにより、基材２０を、伸縮が生じやすい部分と、伸縮が生じにくい部分すなわち伸縮抑制領域７０とに区画することができる。第２の弾性係数が低すぎると、伸縮の制御がし難い場合がある。また、第２の弾性係数が高すぎると、基材２０が伸縮した際に、割れやひびなど構造の破壊が伸縮抑制部材３０に起こる場合がある。第２の弾性係数は、基材２０の第１の弾性係数の１．１倍以上１００００００倍以下であってもよく、より好ましくは１０００００倍以下である。 The first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member 32, that is, the expansion/contraction suppressing member 30 may have an elastic coefficient larger than the first elastic coefficient of the base material 20. The elastic coefficient of the first expansion/contraction suppressing member 31 and the elastic coefficient of the second expansion/contraction suppressing member 32 may be the same or different, and can be appropriately determined as follows. In the following description, the elastic coefficient of the first expansion/contraction suppressing member 31 and the elastic coefficient of the second expansion/contraction suppressing member 32 will be referred to as the elastic coefficient of the expansion/contraction suppressing member 30 without particular distinction, and will also be referred to as the second elastic coefficient. .. The second elastic modulus is, for example, 0.1 GPa or more and 500 GPa or less, and more preferably 0.1 GPa or more and 100 GPa or less. By providing such an expansion/contraction suppressing member 30 on the base material 20, expansion/contraction in the expansion/contraction suppressing region 70 described later can be suppressed. As a result, the base material 20 can be divided into a portion that easily expands and contracts and a portion that does not easily expand and contract, that is, the expansion and contraction suppressing region 70. If the second elastic modulus is too low, it may be difficult to control expansion and contraction. Further, if the second elastic modulus is too high, when the base material 20 expands or contracts, the expansion/contraction suppressing member 30 may suffer structural damage such as cracks or cracks. The second elastic modulus may be 1.1 times or more and 1,000,000 times or less, and more preferably 100,000 times or less the first elastic coefficient of the base material 20.
　伸縮抑制部材３０の第２の弾性係数を算出する方法は、伸縮抑制部材３０の形態に応じて適宜定められる。例えば、伸縮抑制部材３０の第２の弾性係数を算出する方法は、上述の基材２０の弾性係数を算出する方法と同様であってもよく、異なっていてもよい。後述する支持基板４０の弾性係数についても同様である。例えば、伸縮抑制部材３０又は支持基板４０の弾性係数を算出する方法として、伸縮抑制部材３０又は支持基板４０のサンプルを用いて、ＡＳＴＭ　Ｄ８８２に準拠して引張試験を実施するという方法を採用することができる。 The method of calculating the second elastic coefficient of the expansion/contraction suppressing member 30 is appropriately determined according to the form of the expansion/contraction suppressing member 30. For example, the method of calculating the second elastic coefficient of the expansion and contraction suppressing member 30 may be the same as or different from the method of calculating the elastic coefficient of the base material 20 described above. The same applies to the elastic modulus of the support substrate 40 described later. For example, as a method of calculating the elastic coefficient of the expansion/contraction suppressing member 30 or the support substrate 40, a method of performing a tensile test in accordance with ASTM D882 using a sample of the expansion/contraction suppressing member 30 or the support substrate 40 should be adopted. You can
　本開示の効果を効果的に得るためには、伸縮抑制部材３０の第２の弾性係数が基材２０の第１の弾性係数よりも大きいことが好ましい。この場合、伸縮抑制部材３０を構成する材料として、金属材料を用いることができる。金属材料の例としては、銅、アルミニウム、ステンレス鋼等を挙げることができる。また、金属材料として、半田材料が用いられてもよい。また、伸縮抑制部材３０を構成する材料として、一般的な熱可塑性エラストマーや、アクリル系、ウレタン系、エポキシ系、ポリエステル系、エポキシ系、ビニルエーテル系、ポリエン・チオール系又はシリコーン系等のオリゴマー、ポリマーなどを用いてもよい。伸縮抑制部材３０を構成する材料がこれらの樹脂である場合、伸縮抑制部材３０は、透明性を有していてもよい。また、伸縮抑制部材３０は、遮光性、例えば紫外線を遮蔽する特性を有していてもよい。例えば、伸縮抑制部材３０は黒色であってもよい。また、伸縮抑制部材３０の色と基材２０の色とが同一であってもよい。伸縮抑制部材３０の厚さは、本実施の形態において、例えば１μｍ以上１ｍｍ以下である。 In order to effectively obtain the effect of the present disclosure, it is preferable that the second elastic coefficient of the expansion and contraction suppressing member 30 is larger than the first elastic coefficient of the base material 20. In this case, a metal material can be used as the material forming the expansion and contraction suppressing member 30. Examples of metal materials include copper, aluminum, stainless steel and the like. Further, a solder material may be used as the metal material. In addition, as a material forming the expansion and contraction suppressing member 30, a general thermoplastic elastomer, an oligomer, a polymer such as an acrylic type, a urethane type, an epoxy type, a polyester type, an epoxy type, a vinyl ether type, a polyene/thiol type, or a silicone type is used. Etc. may be used. When the material forming the expansion/contraction suppressing member 30 is any of these resins, the expansion/contraction suppressing member 30 may have transparency. Further, the expansion/contraction suppressing member 30 may have a light blocking property, for example, a property of blocking ultraviolet rays. For example, the expansion/contraction suppressing member 30 may be black. Further, the color of the expansion and contraction suppressing member 30 and the color of the base material 20 may be the same. In the present embodiment, the thickness of the expansion/contraction suppressing member 30 is, for example, 1 μm or more and 1 mm or less.
　伸縮抑制部材３０の第２の弾性係数が基材２０の第１の弾性係数以下である場合における伸縮抑制部材３０の第２の弾性係数は、例えば１０ＭＰａ以下であり、１ＭＰａ以下であってもよい。伸縮抑制部材３０の第２の弾性係数は、基材２０の第１の弾性係数の１倍以下であってもよく、０．８倍以下であってもよい。 When the second elastic coefficient of the expansion/contraction suppressing member 30 is equal to or lower than the first elastic coefficient of the base material 20, the second elastic coefficient of the expansion/contraction suppressing member 30 is, for example, 10 MPa or less, and may be 1 MPa or less. .. The second elastic modulus of the expansion-contraction suppressing member 30 may be 1 time or less, or 0.8 times or less than the first elastic coefficient of the base material 20.
　伸縮抑制部材３０の第２の弾性係数が基材２０の第１の弾性係数以下の場合、伸縮抑制部材３０を構成する材料として、一般的な熱可塑性エラストマーおよび熱硬化性エラストマーを用いることができ、例えば、スチレン系エラストマー、アクリル系エラストマー、オレフィン系エラストマー、ウレタン系エラストマー、シリコーンゴム、ウレタンゴム、フッ素ゴム、ニトリルゴム、ポリブタジエン、ポリクロロプレンが挙げられる。この場合、伸縮抑制部材３０の厚さは、本実施の形態において、例えば１μｍ以上１００μｍ以下である。しかし、後述する基材２０を貫通する形態や図１９ａ～図２１ｃ、図２７ａ～図２９ｃに例示したような構造であるときは、伸縮抑制部材３０の厚さが数ｍｍ、例えば１ｍｍ以上５ｍｍ以下となる場合もある。 When the second elastic coefficient of the expansion/contraction suppressing member 30 is equal to or lower than the first elastic coefficient of the base material 20, a general thermoplastic elastomer and a thermosetting elastomer can be used as the material forming the expansion/contraction suppressing member 30. Examples thereof include styrene elastomer, acrylic elastomer, olefin elastomer, urethane elastomer, silicone rubber, urethane rubber, fluororubber, nitrile rubber, polybutadiene and polychloroprene. In this case, the thickness of the expansion/contraction suppressing member 30 is, for example, 1 μm or more and 100 μm or less in the present embodiment. However, in the case of a configuration of penetrating the base material 20 described later or the structure illustrated in FIGS. 19a to 21c and 27a to 29c, the thickness of the expansion and contraction suppressing member 30 is several mm, for example, 1 mm or more and 5 mm or less. In some cases,
　伸縮抑制部材３０の特性を、弾性係数に替えて曲げ剛性によって表してもよい。伸縮抑制部材３０の断面二次モーメントは、配線基板１０の伸縮方向に直交する平面によって伸縮抑制部材３０を切断した場合の断面に基づいて算出される。伸縮抑制部材３０の曲げ剛性は、基材２０の曲げ剛性の１．１倍以上であってもよく、より好ましくは２倍以上であり、更に好ましくは１０倍以上である。 The characteristics of the expansion/contraction suppressing member 30 may be expressed by bending rigidity instead of the elastic coefficient. The second moment of area of the expansion/contraction suppressing member 30 is calculated based on the cross section when the expansion/contraction suppressing member 30 is cut by a plane orthogonal to the expansion/contraction direction of the wiring board 10. The flexural rigidity of the expansion/contraction suppressing member 30 may be 1.1 times or more, more preferably 2 times or more, and further preferably 10 times or more, of the bending rigidity of the base material 20.
　若しくは、伸縮抑制部材３０の曲げ剛性は、基材２０の曲げ剛性以下であってもよい。例えば、伸縮抑制部材３０の曲げ剛性は、基材２０の曲げ剛性の１倍以下であってもよく、０．８倍以下であってもよい。 Alternatively, the flexural rigidity of the expansion-contraction suppressing member 30 may be equal to or less than the flexural rigidity of the base material 20. For example, the bending rigidity of the expansion-contraction suppressing member 30 may be 1 time or less, or 0.8 times or less that of the base material 20.
　〔伸縮抑制部材の第１変形例〕
　後述する第１実施形態（図４参照）の様に、第２伸縮抑制部材３２が被接続部材５１ではない形態においては、被接続部材５１は基材２０の伸縮の抑制に主要因としては寄与しないため、伸縮抑制部材３０と被接続部材５１との接続の方法は任意である。例えば被接続部材５１は接着剤Ｂｏにより基材２０に固定されていてもよい。このように接着剤Ｂｏを別途有し、被接続部材５１が伸縮抑制部材３０により基材２０に固定されるのではない場合には、伸縮抑制部材３０は基材２０の伸縮を抑制できればよいため、基材２０の厚さ方向（第１面２１に垂直な方向）における伸縮抑制部材３０の位置は任意とすることができる。 [First Modification of Stretch Control Member]
In a mode in which the second expansion/contraction suppressing member 32 is not the connected member 51 as in the first embodiment (see FIG. 4) described later, the connected member 51 contributes to the suppression of expansion/contraction of the base material 20 as a main factor. Therefore, the method of connecting the expansion suppressing member 30 and the connected member 51 is arbitrary. For example, the connected member 51 may be fixed to the base material 20 with the adhesive Bo. As described above, when the adhesive Bo is separately provided and the connected member 51 is not fixed to the base material 20 by the expansion/contraction suppressing member 30, the expansion/contraction suppressing member 30 only needs to suppress the expansion/contraction of the base material 20. The position of the expansion/contraction suppressing member 30 in the thickness direction of the base material 20 (direction perpendicular to the first surface 21) can be arbitrary.
　図８ａ～ｃに示す形態においては図４ａ～ｃなどに示した形態と同様に、基材２０の第１面２１の表面上に伸縮抑制部材３０が形成されている。図８ａ～ｃに示す形態が図４などに示した形態と異なる点は、伸縮抑制部材３０と被接続部材５１とが直接的には接して（接続されて）いない点であり、図８ａ～ｃにおいては少なくとも伸縮抑制部材３０あるいは基材２０のいずれか一方と被接続部材５１とを接続するために別途接着剤Ｂｏを有している。基材２０の第１面２１の表面上に形成された伸縮抑制部材３０により基材２０の伸縮が抑制され、平面視上各第１伸縮抑制部材３１に外接し、かつ第１伸縮抑制部材３１をその周長が最短となるように囲う仮想の領域である伸縮抑制領域７０のうち、第１伸縮抑制部材３１と重ならない領域を良好に確保することができる。そしてそのため接続部５１ａにおいて被接続部材と配線との電気的な接続が損なわれる、接続剥がれや断線の発生を抑制することができ、あるいは配線の分岐部や方向転換部における断線を抑制することができる。 In the configurations shown in FIGS. 8a to 8c, the expansion and contraction suppressing member 30 is formed on the surface of the first surface 21 of the base material 20, as in the configurations shown in FIGS. The configuration shown in FIGS. 8a to 8c is different from the configuration shown in FIG. 4 and the like in that the expansion suppressing member 30 and the connected member 51 are not in direct contact (connected) with each other. In c, at least one of the expansion and contraction suppressing member 30 or the base material 20 and the connected member 51 have a separate adhesive Bo. Expansion/contraction of the base material 20 is suppressed by the expansion/contraction suppressing member 30 formed on the surface of the first surface 21 of the base material 20, which is circumscribed to each first expansion/contraction suppressing member 31 in plan view, and the first expansion/contraction suppressing member 31. It is possible to favorably secure a region that does not overlap with the first expansion/contraction suppressing member 31 in the expansion/contraction suppressing region 70 that is an imaginary region that surrounds the expansion/contraction length so as to have the shortest circumference. Therefore, in the connection portion 51a, it is possible to prevent the electrical connection between the member to be connected and the wiring from being spoiled, the occurrence of connection peeling and the disconnection, or the prevention of the disconnection at the branch portion or the direction changing portion of the wiring. it can.
　図９ａ～ｃに示す形態においては、基材２０の第１面２１に設けられた凹部に伸縮抑制部材３０が設けられている。また図１０ａ～ｃに示す形態においては、伸縮抑制部材３０が基材２０の内部に設けられ、基材２０から外部に露出しない状態となっている。また図１１ａ～ｃに示す形態においては、伸縮抑制部材３０が基材２０の第２面２２の表面上に設けられている。図示しないが基材２０の第２面２２に設けられた凹部に伸縮抑制部材３０が設けられていてもよい。
　図９ｃに示す形態においても図８ａ～ｃに示す形態と同様に、伸縮抑制部材３０と被接続部材５１とが直接的に接続されて（接触して）おらず、少なくとも伸縮抑制部材３０あるいは基材２０のいずれか一方と被接続部材５１とを接続するために別途接着剤Ｂｏを有している。図１０ａ～ｃおよび図１１ａ～ｃに示す形態においても図８ａ～ｃに示す形態と同様に、伸縮抑制部材３０と被接続部材５１とが直接的に接続されて（接触して）おらず、基材２０と被接続部材５１とを接続するために別途接着剤Ｂｏを有している。 In the embodiment shown in FIGS. 9a to 9c, the expansion and contraction suppressing member 30 is provided in the concave portion provided in the first surface 21 of the base material 20. Further, in the configurations shown in FIGS. 10A to 10C, the expansion and contraction suppressing member 30 is provided inside the base material 20 and is not exposed to the outside from the base material 20. Further, in the configurations shown in FIGS. 11A to 11C, the expansion-contraction suppressing member 30 is provided on the surface of the second surface 22 of the base material 20. Although not shown, the expansion and contraction suppressing member 30 may be provided in the concave portion provided in the second surface 22 of the base material 20.
In the configuration shown in FIG. 9c as well, similar to the configurations shown in FIGS. 8a to 8c, the expansion suppressing member 30 and the connected member 51 are not directly connected (contacted) to each other, and at least the expansion suppressing member 30 or the base member is not connected. An adhesive Bo is separately provided to connect either one of the members 20 and the connected member 51. In the configurations shown in FIGS. 10a to 10c and 11a to 11c, as in the configurations shown in FIGS. 8a to 8c, the expansion suppressing member 30 and the connected member 51 are not directly connected (contacted), An adhesive Bo is separately provided to connect the base member 20 and the connected member 51.
　図８ａ～図１１ｃに示すいずれの形態においても、基材２０の厚さ方向のいずれかの位置に形成された伸縮抑制部材３０により基材２０の伸縮が抑制され、平面視上各第１伸縮抑制部材３１に外接し、かつ第１伸縮抑制部材３１をその周長が最短となるように囲う仮想の領域内部である伸縮抑制領域７０のうち、第１伸縮抑制部材３１と重ならない領域を良好に確保することができる。そしてそのため接続部５１ａにおいて被接続部材と配線との電気的な接続が損なわれる、接続剥がれや断線の発生を抑制することができ、あるいは配線の分岐部や方向転換部等の配線の平面視上の外形が配線の延伸方向において変化する箇所における断線を抑制することができる。 In any of the configurations shown in FIGS. 8a to 11c, the expansion/contraction of the base material 20 is suppressed by the expansion/contraction suppressing member 30 formed at any position in the thickness direction of the base material 20, and each first expansion/contraction in plan view. A region that does not overlap with the first expansion/contraction suppressing member 31 is good in the expansion/contraction suppressing region 70 that is inside the virtual region that is circumscribed to the suppressing member 31 and surrounds the first expansion/contraction suppressing member 31 so that its circumferential length is the shortest. Can be secured. Therefore, in the connection portion 51a, it is possible to prevent the electrical connection between the connected member and the wiring from being impaired, the occurrence of connection peeling or disconnection, or the wiring branching portion, the direction changing portion, or the like in plan view of the wiring. It is possible to suppress disconnection at a location where the outer shape of the wire changes in the extending direction of the wiring.
　〔伸縮抑制部材の第２変形例〕
　上記図８ａ～図１１ｃにより、伸縮抑制部材３０は基材２０の厚さ方向の任意の位置に形成し得ることを説明した。このことからすれば、基材２０の厚さ方向における伸縮抑制部材３０の形成位置、あるいは伸縮抑制部材３０の材料によっては、図１２ａ～図１５ｃに示す様に、平面視上、配線５２や接続部５１ａと伸縮抑制部材３０とが重なっていても構わない。
　平面視上、配線５２や接続部５１ａと伸縮抑制部材３０とが重なっていても、伸縮抑制部材３０が基材２０の内部に設けられている場合（図１４ａ～ｃ）、伸縮抑制部材３０が基材２０の第２面２２の表面上（図１５ａ～ｃ）、あるいは第２面２２に設けられた凹部（図示なし）に設けられていれば、伸縮抑制部材３０が導電性を有する材料であっても適用可能である。 [Second Modification of Stretch Control Member]
8A to 11C, it has been described that the expansion and contraction suppressing member 30 can be formed at an arbitrary position in the thickness direction of the base material 20. From this, depending on the formation position of the expansion/contraction suppressing member 30 in the thickness direction of the base material 20 or the material of the expansion/contraction suppressing member 30, as shown in FIGS. The part 51a and the expansion and contraction suppressing member 30 may overlap.
Even when the wiring 52 or the connecting portion 51a and the expansion/contraction suppressing member 30 overlap each other in plan view, when the expansion/contraction suppressing member 30 is provided inside the base material 20 (FIGS. 14a to 14c), the expansion/contraction suppressing member 30 is If provided on the surface of the second surface 22 of the base material 20 (FIGS. 15a to 15c) or in the concave portion (not shown) provided in the second surface 22, the expansion suppressing member 30 is made of a conductive material. Even if there is, it is applicable.
　一方図１２ａ～ｃ、図１３ａ～ｃに示す形態においては、伸縮抑制部材３０と配線５２とが接触するため、伸縮抑制部材３０が導電性を有さない材料からなる場合のみ適用することができる。図１２ｂおよびｃ、図１３ｂおよびｃの断面図に示す様に、平面視上、配線５２や接続部５１ａと伸縮抑制部材３０とが重なる部分については、導電性を有さない伸縮抑制部材３０上に配線５２が形成される。図１２ａ～ｃに示す形態においては、基材２０の第１面２１の表面上に形成された伸縮抑制部材３０上に乗り上げる様に配線５２が形成されており、換言すれば伸縮抑制部材３０は、配線５２よりも基材２０の第１面２１側に位置している。 On the other hand, in the configurations shown in FIGS. 12a to 12c and 13a to 13c, since the expansion/contraction suppressing member 30 and the wiring 52 are in contact with each other, it can be applied only when the expansion/contraction suppressing member 30 is made of a material having no conductivity. .. As shown in the cross-sectional views of FIGS. 12b and 12c and FIGS. 13b and 13c, in the plan view, the portion where the wiring 52 or the connection portion 51a and the expansion/contraction suppressing member 30 overlap is on the expansion/contraction suppressing member 30 having no conductivity. The wiring 52 is formed on the. In the configurations shown in FIGS. 12A to 12C, the wiring 52 is formed so as to ride on the expansion and contraction suppressing member 30 formed on the surface of the first surface 21 of the base material 20, in other words, the expansion and contraction suppressing member 30 is , Located closer to the first surface 21 side of the base material 20 than the wiring 52.
　上記説明した、平面視上、配線５２や接続部５１ａと伸縮抑制部材３０とが重なっている形態においては、接続部５１ａが伸縮抑制領域７０の内部に存在することのみならず、平面視上接続部５１ａのすぐ近傍に、あるいは重なって伸縮抑制部材３０が存在するため、接続部５１ａ部分における基材２０の伸縮はほぼ皆無となると考えられる。そのため接続部５１ａにおいて被接続部材と配線との電気的な接続が損なわれる、接続剥がれや断線の発生をより確実に抑制することができる。 In the above-described configuration in which the wiring 52 or the connecting portion 51a and the expansion suppressing member 30 overlap each other in plan view, not only the connecting portion 51a exists inside the expansion suppressing region 70, but also the connection in plan view. Since the expansion/contraction suppressing member 30 is present in the immediate vicinity of or overlapped with the portion 51a, it is considered that there is almost no expansion/contraction of the base material 20 in the connection portion 51a. Therefore, in the connection portion 51a, it is possible to more reliably suppress the occurrence of connection peeling and disconnection that damage the electrical connection between the connected member and the wiring.
　さらに配線５２は、図１３ａ～ｃ、図１４ａ～ｃおよび図１５ａ～ｃのように、平面視上、伸縮抑制領域７０のうち、伸縮抑制部材３０と重ならない領域を経て、伸縮抑制部材３０と重なる領域にある配線の端部５２ｔに形成された接続部５１ａに至ることになる。すなわち配線５２は、伸縮抑制領域７０外の伸縮が抑制されない領域から、平面視上、伸縮抑制領域７０内の伸縮抑制部材３０と重なる伸縮がほぼ皆無となる領域に急激に遷移するのではなく、途中に伸縮抑制領域７０内で伸縮抑制部材３０と重ならない伸縮が抑制される領域を経ることになる。これにより配線５２は、応力が集中すると考えられる、伸縮が抑制されない領域と伸縮がほぼ皆無となる領域との境界を通ることなく、両者の間にある伸縮が抑制される領域を経ることとなるため、すなわち断線を抑制することができる。 Further, as shown in FIGS. 13a to 13c, 14a to 14c, and 15a to 15c, the wiring 52 is connected to the expansion/contraction suppressing member 30 through a region of the expansion/contraction suppressing region 70 that does not overlap with the expansion/contraction suppressing member 30 in plan view. It reaches the connecting portion 51a formed at the end portion 52t of the wiring in the overlapping region. In other words, the wiring 52 does not abruptly transition from an area outside the expansion/contraction suppression area 70 where expansion/contraction is not suppressed to an area where expansion/contraction overlapping with the expansion/contraction suppression member 30 in the expansion/contraction suppression area 70 is almost zero in plan view. In the middle of the expansion/contraction suppressing region 70, the expansion/contraction suppressing member 30 does not overlap with the expansion/contraction suppressing member 30. As a result, the wiring 52 passes through a region between which the expansion and contraction is suppressed without passing through the boundary between the region where expansion and contraction is not suppressed and the region where expansion and contraction is almost absent, in which stress is considered to be concentrated. Therefore, that is, the disconnection can be suppressed.
　第１伸縮抑制部材３１および第２伸縮抑制部材３２、すなわち伸縮抑制部材３０の形成方法は、材料等に応じて適宜選択される。例えば、基材２０上または後述する支持基板４０上に蒸着法やスパッタリング法等により金属膜を形成した後、フォトリソグラフィ法により金属膜をパターニングする方法が挙げられる。また、基材２０上または支持基板４０上にスピンコート法などの印刷法等により全面に有機層などの樹脂膜を形成した後、フォトリソグラフィ法により樹脂膜をパターニングする方法が挙げられる。また、例えば、基材２０上または支持基板４０上に一般的な印刷法により伸縮抑制部材３０の材料をパターン状に印刷する方法が挙げられる。これらの方法のうち、材料効率がよく安価に製作できる印刷法が好ましく用いられ得る。印刷法としては、スクリーン印刷や、ディスペンサによる印刷が用いられ得る。基材２０上または支持基板４０上に電子部品等の部品が実装された後においては、ディスペンサによる印刷の方が効率的に伸縮抑制部材３０を形成し得る。
　なお、伸縮抑制部材３０の上記記載については、後述の伸縮抑制部材１３０、２３０においても同様である。 The method for forming the first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member 32, that is, the expansion/contraction suppressing member 30 is appropriately selected according to the material and the like. For example, a method of forming a metal film on the base material 20 or a support substrate 40 described later by a vapor deposition method, a sputtering method, or the like and then patterning the metal film by a photolithography method can be mentioned. Further, there is a method in which a resin film such as an organic layer is formed on the entire surface of the base material 20 or the supporting substrate 40 by a printing method such as a spin coating method, and then the resin film is patterned by a photolithography method. Further, for example, a method of printing the material of the expansion and contraction suppressing member 30 in a pattern on the base material 20 or the support substrate 40 by a general printing method can be mentioned. Among these methods, a printing method that can be manufactured with high material efficiency and at low cost can be preferably used. Screen printing or printing with a dispenser can be used as the printing method. After components such as electronic components are mounted on the base material 20 or the support substrate 40, the expansion/contraction suppressing member 30 can be formed more efficiently by printing with a dispenser.
The above description of the expansion/contraction suppressing member 30 also applies to expansion/ contraction suppressing members 130 and 230 described later.
　〔被接続部材〕
　本開示の配線基板１０においては、後述する第３実施形態を除き被接続部材５１は必須の構成要素ではない。しかし本開示を実施するにあたり、後述する第１実施形態～第３実施形態に係る配線基板１０のうち、いずれの形態が適当であるかについては、被接続部材５１の伸縮性などにも依存するため、以下被接続部材５１について説明する。
　被接続部材５１は、被接続部材５１と配線５２との間に位置する接続部５１ａにより配線５２に電気的に接続されている。図１ａ～ｃに示す例において、接続部５１ａは、被接続部材５１の下面、すなわち被接続部材５１における基材２０の第１面２１側を向く面と、基材２０、特に基材２０上の配線５２の表面と、の間に位置する。なお、配線５２の表面とは、配線５２の面のうち基材２０から遠い側に位置する面である。また図１ａにおいては、被接続部材５１の下方に位置する一部の配線５２や伸縮抑制部材３０は、本来平面図には現れないものであるが、本開示の理解を容易にするため被接続部材５１を透過させ図示している。以降の平面図についても同様である。 [Connected member]
In the wiring board 10 of the present disclosure, the connected member 51 is not an essential component except for the third embodiment described later. However, in carrying out the present disclosure, which of the wiring boards 10 according to the first to third embodiments to be described later is appropriate depends on the elasticity of the connected member 51 and the like. Therefore, the connected member 51 will be described below.
The connected member 51 is electrically connected to the wiring 52 by the connecting portion 51 a located between the connected member 51 and the wiring 52. In the example shown in FIGS. 1a to 1c, the connecting portion 51a includes the lower surface of the connected member 51, that is, the surface of the connected member 51 facing the first surface 21 side of the base material 20, and the base material 20, especially on the base material 20. Is located between the surface of the wiring 52 and. The surface of the wiring 52 is a surface of the surface of the wiring 52 located on the side farther from the base material 20. Further, in FIG. 1a, some of the wirings 52 and the expansion/contraction suppressing member 30 located below the connected member 51 are not originally shown in the plan view, but are connected to facilitate the understanding of the present disclosure. The member 51 is shown in a transparent manner. The same applies to the subsequent plan views.
　この例においては、接続部５１ａは、被接続部材５１の下面に接続されるとともに、配線５２の表面に接続される。しかしながら、図１に示す例に代えて、接続部５１ａは、被接続部材５１の側面に位置してもよい。また、接続部５１ａは、配線５２の側面に接続されてもよい。
　被接続部材５１は、配線基板１０において基材２０に設けられた配線５２と電気的に接続されるものであれば特に限定されない。典型的には電子部品を挙げることができ、このような電子部品は、能動部品であってもよく、受動部品であってもよく、機構部品であってもよい。被接続部材５１の他の例として、電気配線に係るケーブル、その接続部としてのコネクタ、更には上記電子部品あるいは上記コネクタなどを収容するケースなどを挙げることができる。 In this example, the connecting portion 51 a is connected to the lower surface of the connected member 51 and the surface of the wiring 52. However, instead of the example shown in FIG. 1, the connecting portion 51 a may be located on the side surface of the connected member 51. Further, the connecting portion 51 a may be connected to the side surface of the wiring 52.
The connected member 51 is not particularly limited as long as it is electrically connected to the wiring 52 provided on the base material 20 in the wiring board 10. An electronic component can be typically mentioned, and such an electronic component may be an active component, a passive component, or a mechanical component. Other examples of the connected member 51 include a cable for electric wiring, a connector as a connecting portion thereof, and a case for accommodating the electronic component or the connector.
　電子部品の例としては、トランジスタ、ＬＳＩ（Ｌａｒｇｅ－Ｓｃａｌｅ　Ｉｎｔｅｇｒａｔｉｏｎ）、ＭＥＭＳ（Ｍｉｃｒｏ　Ｅｌｅｃｔｒｏ　Ｍｅｃｈａｎｉｃａｌ　Ｓｙｓｔｅｍｓ）、リレー、ＬＥＤ、ＯＬＥＤ、ＬＣＤなどの発光素子、センサ、ブザー等の発音部品、振動を発する振動部品、冷却発熱をコントロールするペルチェ素子や電熱線などの冷発熱部品、抵抗器、キャパシタ、インダクタ、圧電素子、スイッチなどを挙げることができる。電子部品の上述の例のうち、センサが好ましく用いられる。センサとしては、例えば、温度センサ、圧力センサ、光センサ、光電センサ、近接センサ、せん断力センサ、生体センサ、レーザーセンサ、マイクロ波センサ、湿度センサ、歪みセンサ、ジャイロセンサ、加速度センサ、変位センサ、磁気センサ、ガスセンサ、ＧＰＳセンサ、超音波センサ、臭いセンサ、脳波センサ、電流センサ、振動センサ、脈波センサ、心電センサ、光度センサ等を挙げることができる。これらのセンサのうち、生体センサが特に好ましい。生体センサは、心拍や脈拍、心電、血圧、体温、血中酸素濃度等の生体情報を測定することができる。このような電子部品は、その多くは伸縮し難い被接続部材５１であるということができる。 Examples of electronic components include transistors, LSIs (Large-Scale Integration), MEMSs (Micro Electro Mechanical Systems), relays, light emitting devices such as LEDs, OLEDs, LCDs, sounding components such as sensors and buzzers, and vibration components that generate vibration. Examples include cold heat generating parts such as Peltier elements and heating wires for controlling heat generation by cooling, resistors, capacitors, inductors, piezoelectric elements, and switches. Of the above examples of electronic components, sensors are preferably used. As the sensor, for example, a temperature sensor, a pressure sensor, an optical sensor, a photoelectric sensor, a proximity sensor, a shear force sensor, a biological sensor, a laser sensor, a microwave sensor, a humidity sensor, a strain sensor, a gyro sensor, an acceleration sensor, a displacement sensor, Examples thereof include magnetic sensors, gas sensors, GPS sensors, ultrasonic sensors, odor sensors, brain wave sensors, current sensors, vibration sensors, pulse wave sensors, electrocardiographic sensors, and luminous intensity sensors. Of these sensors, biosensors are particularly preferred. The biometric sensor can measure biometric information such as heartbeat, pulse rate, electrocardiogram, blood pressure, body temperature, and blood oxygen concentration. It can be said that most of such electronic components are the connected members 51 that are difficult to expand and contract.
　電気配線に係るケーブルの例としては、フレキシブルプリント基板（ＦＰＣ（Ｆｌｅｘｉｂｌｅ　Ｐｒｉｎｔｅｄ　Ｃｉｒｃｕｉｔｓ））を挙げることができる。上記の通り本開示に係る基材２０は伸縮性を有するものであるため、配線基板１０は、伸縮し難い被接続部材５１あるいは伸縮抑制部材３０が設けられた部分およびその周辺を除き伸縮性を有する。すなわち、本開示に係る配線基板１０はその大部分において伸縮性を有し、そのため通常は曲げに対しても柔軟であるため、外部と電気的に接続する場合には、同様に曲げに対して柔軟であるＦＰＣを好適に用いることができる。ＦＰＣに代表されるような電気配線に係るケーブルは、本開示に係る配線基板１０と同様に曲げに対しても柔軟ではあるものの伸縮し難い被接続部材５１であるということができる。 An example of a cable for electric wiring is a flexible printed circuit board (FPC (Flexible Printed Circuits)). As described above, since the base material 20 according to the present disclosure has elasticity, the wiring board 10 has elasticity except for the portion where the connected member 51 or the expansion suppressing member 30 which is difficult to expand and contract and the periphery thereof are provided. Have. That is, since the wiring board 10 according to the present disclosure has elasticity for the most part, and is therefore usually flexible even against bending, when electrically connected to the outside, the wiring board 10 is similarly bent against bending. A flexible FPC can be preferably used. It can be said that a cable for electric wiring represented by an FPC is a connected member 51 that is flexible against bending as in the wiring board 10 according to the present disclosure but is difficult to expand and contract.
　上記コネクタとしては、一例として、各種嵌合タイプのコネクタやＦＰＣ用のコネクタなど各種周知のコネクタを挙げることができる。また複数回の抜き差し可能なコネクタのみならず、接続後の分離を予定していないいわゆる直付けタイプのコネクタも含まれる。このようなコネクタは、抜き差し可能なコネクタであれば伸縮し難い被接続部材５１であるということができ、また一部の直付けタイプのコネクタについては伸縮し易い被接続部材５１であるということができるものもある。 As the above-mentioned connector, various well-known connectors such as various mating type connectors and FPC connectors can be cited as an example. Further, not only a connector that can be inserted and removed a plurality of times but also a so-called direct-attach type connector that is not planned to be separated after connection is included. It can be said that such a connector is the connected member 51 that is hard to expand and contract if it is a connector that can be inserted and removed, and that some of the direct-attaching type connectors are the connected members 51 that are easily expanded and contracted. Some can be done.
　また上記ケースとしては、一例として、上記電子部品やコネクタなどを保護するために、端子部あるいは端子部が存在する部分を除き電子部品やコネクタなどを覆うケースを挙げることができる。本説明に係るケースとは上記のみならず、複数の上記電子部品を組み合わせてモジュールとして一体化されたものや、電子部品などを保護するために端子部あるいは端子部が存在する部分を除き樹脂等で覆う様な形態も含まれるものとする。このようなケースは、その多くは伸縮し難い被接続部材５１であるということができる。 As the above-mentioned case, for example, in order to protect the above-mentioned electronic parts, connectors, etc., there can be mentioned a case that covers the electronic parts, connectors, etc. except for the terminal part or the part where the terminal part exists. The case according to the present description is not limited to the above, but is a combination of a plurality of the above-mentioned electronic components integrated as a module, a terminal portion for protecting the electronic components, etc. or a resin or the like except a portion where the terminal portion exists. The form covered with is also included. It can be said that most of such cases are the connected members 51 that are difficult to expand and contract.
　以上のように、本開示の配線基板１０に被接続部材５１を接続した部材を、配線基板を用いたデバイスと称する。さらに、当該デバイスを具備する電子製品を、デバイスを有する電子製品と称する。 The member in which the connected member 51 is connected to the wiring board 10 of the present disclosure as described above is referred to as a device using the wiring board. Further, an electronic product including the device is referred to as an electronic product including the device.
　（第１実施形態）
　以下、本開示の第１実施形態について、図１ａ～ｃ、および図３～図７を用いて説明する。
　第１実施形態に係る配線基板１０は上述の通り、第１面２１及びその反対側に位置する第２面２２を含み伸縮性を有する基材２０と、基材２０の第１面２１側に位置する配線５２と、基材２０の伸縮を抑制する複数の第１伸縮抑制部材３１と、複数の第１伸縮抑制部材３１を固定する第２伸縮抑制部材３２とを備えている。上述の通り、被接続部材５１は配線基板１０の必須の構成要素ではない。しかし、特に効果面については、被接続部材５１が存在しているものとして説明した方が理解が容易であるため、以下の説明において適宜被接続部材５１も含めて説明する場合もある。
　第１実施形態に係る配線基板１０においては、複数の第１伸縮抑制部材３１が第２伸縮抑制部材３２により固定されてなす伸縮抑制部材３０は１つのみ存在している。以下、第１実施形態に係る第１伸縮抑制部材３１および第２伸縮抑制部材３２、すなわち伸縮抑制部材３０について説明する。 (First embodiment)
Hereinafter, a first embodiment of the present disclosure will be described with reference to FIGS. 1a to 1c and FIGS. 3 to 7.
As described above, the wiring board 10 according to the first embodiment has the stretchable base material 20 including the first surface 21 and the second surface 22 located on the opposite side, and the first surface 21 side of the base material 20. The wiring 52 located, the 1st expansion-contraction suppressing member 31 which suppresses expansion-contraction of the base material 20, and the 2nd expansion-contraction suppressing member 32 which fixes the 1st expansion-contraction suppressing member 31 are provided. As described above, the connected member 51 is not an essential component of the wiring board 10. However, especially regarding the effect side, it is easier to understand that the connected member 51 is present, and therefore, the connected member 51 may be appropriately included in the description below.
In the wiring board 10 according to the first embodiment, there is only one expansion/contraction member 30 made up of a plurality of first expansion/contraction members 31 fixed by the second expansion/contraction members 32. Hereinafter, the first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member 32 according to the first embodiment, that is, the expansion/contraction suppressing member 30 will be described.
　〔第１実施形態に係る伸縮抑制部材〕
　第１伸縮抑制部材３１は、基材２０の伸縮を抑制するために配線基板１０に設けられた部材である。図１ａは平面図を、図１ａにおけるＡ－Ａ断面およびＢ－Ｂ断面をそれぞれ図１ｂおよび図１ｃに示す。
　図１に示す例において、伸縮抑制部材３０は、基材２０の第１面２１上に位置し、通常扁平状である。図１に示す第１実施形態に係る伸縮抑制部材３０は、第１面２１の法線方向に沿って基材２０を見た場合（「平面視」と表現する場合もある）に、１つの閉図形をなしている。換言すれば第１実施形態に係る伸縮抑制部材３０においては、相互に接続されていない、あるいは相互に接触していない複数の伸縮抑制部材３０は存在しないと言うことができる。図１ａにおいては、被接続部材５１の４隅付近を含む様に相互に独立して４箇所に配されている第１伸縮抑制部材３１が略Ｘ字形状の第２伸縮抑制部材３２により相互に連結されることにより固定され、１つの伸縮抑制部材３０をなしている。換言すれば伸縮抑制部材３０は、平面視上（図１ａ）１つの閉図形をなしている。
　図１ｂに示すＡ－Ａ断面、および図１ｃに示すＢ－Ｂ断面からも明らかな様に、伸縮抑制部材３０は、被接続部材５１を基材２０に固定する接着剤の役目も果たしている。 [Expansion/contraction member according to the first embodiment]
The first expansion/contraction suppressing member 31 is a member provided on the wiring board 10 for suppressing expansion/contraction of the base material 20. FIG. 1a shows a plan view, and AA and BB cross sections in FIG. 1a are shown in FIGS. 1b and 1c, respectively.
In the example shown in FIG. 1, the expansion/contraction suppressing member 30 is located on the first surface 21 of the base material 20 and is usually flat. The expansion and contraction suppressing member 30 according to the first embodiment shown in FIG. 1 has one member when the base material 20 is viewed along the normal direction of the first surface 21 (may be expressed as “plan view”). It has a closed shape. In other words, it can be said that, in the expansion/contraction suppressing member 30 according to the first embodiment, there are no plural expansion/contraction suppressing members 30 that are not connected to each other or are not in contact with each other. In FIG. 1A, the first expansion/contraction suppressing members 31 arranged at four locations independently of each other so as to include the vicinity of the four corners of the connected member 51 are mutually connected by the second expansion/contraction suppressing member 32 having a substantially X shape. The expansion and contraction suppressing member 30 is fixed by being connected. In other words, the expansion/contraction suppressing member 30 forms one closed figure in a plan view (Fig. 1a).
As is clear from the AA cross section shown in FIG. 1b and the BB cross section shown in FIG. 1c, the expansion and contraction suppressing member 30 also functions as an adhesive for fixing the connected member 51 to the base material 20.
　上記説明において、伸縮抑制部材３０は１つのみである点を強調しているが、これは後述する第２実施形態との差異を明確とするためである。後述する、第１実施形態に係る配線基板１０の効果を得ながら、本開示の第１実施形態の実施を回避するために、実質的にはほとんど意味をなさない伸縮抑制部材を追加することで伸縮抑制部材３０を形式的に複数としたとしても、後述の本開示の第１実施形態に係る効果を得られるものであれは、本開示の第１実施形態に当然に含まれる。 In the above description, it is emphasized that there is only one expansion/contraction suppressing member 30, but this is to clarify the difference from the second embodiment described later. While adding the effect of the wiring board 10 according to the first embodiment, which will be described later, in order to avoid the implementation of the first embodiment of the present disclosure, by adding a stretch suppressing member that makes substantially no sense. Even if the expansion and contraction suppressing member 30 is formally provided in plural, it is naturally included in the first embodiment of the present disclosure as long as the effect according to the first embodiment of the present disclosure described later can be obtained.
　また上記説明において、第１伸縮抑制部材３１と第２伸縮抑制部材３２とを区別して説明しているが、第１実施形態においては両者を明確に区別することは重要ではない。例えば、伸縮を抑制する複数の第１伸縮抑制部材を固定する第２伸縮抑制部材についても伸縮を抑制する効果の一端を担っている。そのため第１伸縮抑制部材３１と第２伸縮抑制部材３２との区別は明確ではないが、両者を明確に区別する意味もなく、第１伸縮抑制部材３１と第２伸縮抑制部材３２とを併せて伸縮抑制部材３０と考えればよい。
　すなわち第１実施形態においては、第２伸縮抑制部材は第１伸縮抑制部材であると表現することもできる。
　このことからすれば第１実施形態に係る配線基板１０は、第１面２１及びその反対側に位置する第２面２２を含み伸縮性を有する基材２０と、基材２０の第１面２１側に位置する配線５２と、基材２０の伸縮を抑制する第１伸縮抑制部材３１とを備えている、と表現することもできる。 Further, in the above description, the first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member 32 are described separately, but in the first embodiment, it is not important to clearly distinguish them. For example, the second expansion-contraction member that fixes the plurality of first expansion-contraction members that suppress expansion and contraction also plays a part in the effect of suppressing expansion and contraction. Therefore, the distinction between the first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member 32 is not clear, but there is no point in clearly distinguishing them, and the first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member 32 are combined. It may be considered as the expansion/contraction suppressing member 30.
That is, in the first embodiment, the second expansion/contraction suppressing member can also be expressed as the first expansion/contraction suppressing member.
From this, the wiring board 10 according to the first embodiment has the stretchable base material 20 including the first surface 21 and the second surface 22 located on the opposite side, and the first surface 21 of the base material 20. It can also be expressed as including the wiring 52 located on the side and the first expansion/contraction suppressing member 31 for suppressing expansion/contraction of the base material 20.
　伸縮抑制部材３０の材料について、第１伸縮抑制部材３１と第２伸縮抑制部材３２とは異なる材料であっても良く、また同じ材料であってもよい。さらに、第１伸縮抑制部材３１、あるいは第２伸縮抑制部材３２の各々の各１つについても、複数の異なる材料から構成されていても良く、また単一の材料から構成されていてもよい。換言すれば伸縮抑制部材３０は、複数の異なる材料からなるものであっても良く、単一の材料からなるものであってよい。 Regarding the material of the expansion/contraction suppressing member 30, the first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member 32 may be different materials, or may be the same material. Further, each one of the first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member 32 may be composed of a plurality of different materials, or may be composed of a single material. In other words, the expansion/contraction suppressing member 30 may be made of a plurality of different materials, or may be made of a single material.
　第１面の法線方向に沿って基材２０を見た場合に（すなわち平面視において）、第１伸縮抑制部材３１に外接し、かつ第１伸縮抑制部材３１をその周長が最短となるように囲う仮想の領域（以下「伸縮抑制領域」ともいう）の内部においては、伸縮抑制部材３０により基材２０の伸縮が抑制される。伸縮抑制領域は、図１ａなどにおいて、７０で示される破線により囲まれる領域である。
　そして第１実施形態に係る配線基板１０においては、配線５２の少なくとも一部は、伸縮抑制領域７０のうち、第１伸縮抑制部材３１と重ならない領域に存在している。 When the base material 20 is viewed along the normal direction of the first surface (that is, in a plan view), it is circumscribed to the first expansion/contraction suppressing member 31 and the circumference of the first expansion/contraction suppressing member 31 is the shortest. In the inside of such a virtual area (hereinafter, also referred to as “expansion/contraction suppressing area”), expansion/contraction of the base material 20 is suppressed by the expansion/contraction suppressing member 30. The expansion/contraction suppressing region is a region surrounded by a broken line indicated by 70 in FIG. 1A and the like.
Then, in the wiring board 10 according to the first embodiment, at least a part of the wiring 52 exists in a region of the expansion/contraction suppressing region 70 that does not overlap with the first expansion/contraction suppressing member 31.
　伸縮抑制領域の内部であっても伸縮抑制領域の外周に近い領域については、伸縮抑制領域外の近傍における基材２０の伸縮の影響を受け、多少は伸縮する可能性がある。そのため、伸縮抑制領域の内部においては伸縮抑制領域の外周から遠い領域、すなわち伸縮抑制領域の中心に近い領域の方が基材２０の伸縮の影響を受け難い。伸縮抑制領域の中における基材２０の伸縮の程度、その分布などは、基材２０の材料、伸縮の度合い、伸縮抑制部材３０の位置や形状などに依存すると考えられ、定量化は困難である。 Even inside the expansion/contraction suppression area, the area close to the outer periphery of the expansion/contraction suppression area may be affected by the expansion/contraction of the base material 20 in the vicinity outside the expansion/contraction suppression area and may expand or contract to some extent. Therefore, inside the expansion and contraction suppressing region, a region far from the outer periphery of the expansion and contraction suppressing region, that is, a region near the center of the expansion and contraction suppressing region is less susceptible to the expansion and contraction of the base material 20. The degree of expansion and contraction of the base material 20 in the expansion and contraction suppressing region, its distribution, and the like are considered to depend on the material of the base material 20, the degree of expansion and contraction, the position and shape of the expansion and contraction suppressing member 30, and so it is difficult to quantify. ..
　上記からすれば配線５２の少なくとも一部は、基材２０の伸縮が抑制される伸縮抑制領域７０のうち、第１伸縮抑制部材３１と重ならない領域に存在していることが好ましく、伸縮抑制領域７０のうち、第１伸縮抑制部材３１と重ならない領域における中心により近い領域に位置することがより好ましい。配線５２が少なくとも伸縮抑制領域７０のうち、第１伸縮抑制部材３１と重ならない領域に存在していれば、被接続部材５１と配線５２との間に位置し、被接続部材５１と配線５２とを電気的に接続する接続部５１ａのうち少なくとも１つを伸縮抑制領域７０のうち、第１伸縮抑制部材１３１と重ならない領域に存在させることが可能となる。 From the above, it is preferable that at least a part of the wiring 52 exists in a region that does not overlap with the first stretch suppressing member 31 in the stretch suppressing region 70 in which the stretch of the base material 20 is suppressed. Of 70, it is more preferable to be located in a region closer to the center in a region that does not overlap the first expansion-contraction suppressing member 31. If the wiring 52 is present in at least the area that does not overlap the first expansion/contraction suppressing member 31 in the expansion/contraction suppressing area 70, it is located between the connected member 51 and the wiring 52, and the connected member 51 and the wiring 52 It is possible to allow at least one of the connecting portions 51a for electrically connecting the first expansion control member 131 to exist in a region of the expansion control region 70 that does not overlap with the first expansion control member 131.
　上記の通り、配線基板１０に搭載される被接続部材５１をさらに有する場合には、被接続部材５１と配線５２との間に位置し、被接続部材５１と配線５２とを電気的に接続する接続部５１ａをさらに備え、第１面２１の法線方向に沿って基材２０を見た場合に（平面視上）、接続部５１ａのうち少なくとも１つは伸縮抑制領域７０のうち、第１伸縮抑制部材３１と重ならない領域に存在していることが好ましい。 As described above, when the connected member 51 mounted on the wiring board 10 is further provided, it is located between the connected member 51 and the wiring 52, and electrically connects the connected member 51 and the wiring 52. When the base material 20 is further viewed along the normal line direction of the first surface 21 (in plan view), at least one of the connection portions 51 a is the first of the expansion and contraction suppression regions 70. It is preferably present in a region that does not overlap with the expansion and contraction suppressing member 31.
　上記の通り、接続部５１ａが伸縮抑制領域７０のうち、第１伸縮抑制部材３１と重ならない領域に存在していれば、接続部５１ａが位置する伸縮抑制領域７０の内部は基材２０の伸縮が抑制されるため、接続部５１ａにおいて被接続部材５１と配線５２との相対位置が変化し難い。そのため接続部５１ａにおいて被接続部材５１と配線５２との電気的な接続が損なわれる、接続剥がれや断線が発生することを抑制できるという効果を得ることができる。また、伸縮抑制領域７０のうち、第１伸縮抑制部材３１と重ならない領域に、配線の分岐部５２ｂあるいは配線の方向転換部５２ｈが設けられている場合においては、該分岐部５２ｂあるいは方向転換部５２ｈにおける断線を抑制することができる。
　第１実施形態においては、被接続部材５１とは別途に第２伸縮抑制部材３２が存在し、被接続部材５１に依存せず伸縮抑制部材３０（第１伸縮抑制部材３１および第２伸縮抑制部材３２）のみによって伸縮抑制機能を得ることができるため、被接続部材５１は、伸縮し難い部材に限定されることなく伸縮し易い部材であってもよい。 As described above, if the connecting portion 51a is present in the expansion/contraction suppressing region 70 in a region that does not overlap the first expansion/contraction suppressing member 31, the inside of the expansion/contraction suppressing region 70 in which the connection portion 51a is located expands/contracts the base material 20. Therefore, the relative position between the connected member 51 and the wiring 52 is unlikely to change in the connecting portion 51a. Therefore, it is possible to obtain an effect that it is possible to prevent the electrical connection between the connected member 51 and the wiring 52 in the connection portion 51a from being damaged, and the occurrence of connection peeling and disconnection. Further, in the case where the wiring branch portion 52b or the wiring direction changing portion 52h is provided in a region of the expansion/contraction suppressing region 70 that does not overlap the first expansion/contraction suppressing member 31, the branch portion 52b or the direction changing portion 52h. It is possible to suppress disconnection at 52h.
In the first embodiment, the second expansion/contraction suppressing member 32 is present separately from the connected member 51, and the expansion/contraction suppressing member 30 (the first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member) does not depend on the connected member 51. Since the expansion and contraction suppressing function can be obtained only by 32), the connected member 51 is not limited to a member that is difficult to expand and contract, and may be a member that easily expands and contracts.
　平面視上、伸縮抑制部材３０は被接続部材５１から突出していても良く、また突出しておらず伸縮抑制部材３０のすべてが被接続部材５１と重なっていても良い。換言すれば、配線基板１０に搭載される被接続部材５１は、平面視上伸縮抑制領域７０から突出するものであっても良く、突出せずに被接続部材５１の全てが伸縮抑制領域７０の内部に収まるものであってもよい。図１ａにおいては、被接続部材５１について、平面視上伸縮抑制領域７０から突出する例を被接続部材５１Ｌとして、全てが伸縮抑制領域７０の内部に収まる例を被接続部材５１Ｓとして例示しており、以降の各図においても同様である。 In a plan view, the expansion/contraction suppressing member 30 may protrude from the connected member 51, or the expansion/contraction suppressing member 30 may entirely overlap the connected member 51 without protruding. In other words, the connected member 51 mounted on the wiring board 10 may project from the expansion/contraction suppressing region 70 in a plan view, and all the connected members 51 of the expansion/contraction suppressing region 70 do not protrude. It may be one that fits inside. In FIG. 1 a, regarding the connected member 51, an example in which it protrudes from the expansion/contraction suppressing region 70 in plan view is illustrated as the connected member 51L, and an example in which all of it is inside the expansion/contraction suppressing region 70 is illustrated as the connected member 51S. The same applies to each of the following figures.
　被接続部材５１から伸縮抑制部材３０が突出している場合には、被接続部材５１に比して伸縮抑制領域７０を広めに設定することができるため、伸縮抑制領域の外周から遠い領域、すなわち基材２０の伸縮の影響をより受け難い領域に接続部５１ａを配置することが容易になる。また後述の様に、伸縮抑制部材３０を被接続部材５１の側面にまで、あるいは更に被接続部材５１の上面にまで回り込む様に形成することが可能となるため、伸縮抑制部材３０と被接続部材５１との接続をより強固なものとすることが可能となる。 When the expansion/contraction suppressing member 30 projects from the connected member 51, the expansion/contraction suppressing region 70 can be set wider than that of the connected member 51. It becomes easy to arrange the connecting portion 51a in a region that is less likely to be affected by the expansion and contraction of the material 20. Further, as will be described later, since the expansion/contraction suppressing member 30 can be formed so as to wrap around to the side surface of the connected member 51 or further to the upper surface of the connected member 51, the expansion/contraction suppressing member 30 and the connected member. It is possible to make the connection with 51 stronger.
　被接続部材５１から伸縮抑制部材３０が突出しておらず、伸縮抑制部材３０のすべてが被接続部材５１と重なっている場合には、被接続部材５１に比して伸縮抑制領域７０が狭めに設定されるため、伸縮抑制領域７０ではない領域、すなわち基材２０の伸縮が抑制されない領域を広く設定することができる。これにより配線基板１０が伸縮性を有することの利点をより発揮することができる。被接続部材５１から伸縮抑制部材３０が突出している場合と比較するならば、伸縮抑制部材３０の平面視上の面積を少なくすることができ、配線基板１０全体として軽量なものとすることができる。
　いずれの形態であっても伸縮抑制領域７０のうち、第１伸縮抑制部材３１と重ならない領域に配線５２を、より好ましくは接続部５１ａを設けることができ、あるいは配線の分岐部５２ｂあるいは配線の方向転換部５２ｈが設けることができ、本開示の上記効果を得ることできる。 When the expansion and contraction suppressing member 30 does not project from the connected member 51 and all of the expansion and contraction suppressing members 30 overlap the connected member 51, the expansion and contraction suppressing region 70 is set narrower than the connected member 51. Therefore, a region that is not the expansion/contraction suppressing region 70, that is, a region in which the expansion/contraction of the base material 20 is not suppressed can be set wide. Thereby, the advantage that the wiring board 10 has elasticity can be more exerted. Compared with the case where the expansion/contraction suppressing member 30 projects from the connected member 51, the area of the expansion/contraction suppressing member 30 in plan view can be reduced, and the wiring board 10 as a whole can be made lightweight. ..
In any of the forms, the wiring 52, more preferably the connecting portion 51a, can be provided in a region of the expansion/contraction suppressing region 70 that does not overlap the first expansion/contraction suppressing member 31, or the branching part 52b of the wiring or the wiring The direction changing portion 52h can be provided, and the above effect of the present disclosure can be obtained.
　図１ａにおいては、被接続部材５１の４隅付近を含む様に相互に独立して４箇所に配されている第１伸縮抑制部材３１が略Ｘ字形状の第２伸縮抑制部材３２により相互に連結されることにより固定され、１つの伸縮抑制部材３０をなしている例であった。しかしこれに限らず、伸縮抑制部材３０は、平面視上１つの閉図形をなしており、それにより定まる伸縮抑制領域７０のうち、第１伸縮抑制部材３１と重ならない領域に配線５２の少なくとも一部が存在していれば上記例に限らない。例えば図３に示す様に、４つの第１伸縮抑制部材３１が略ロ字形状、換言すると矩形枠形状の第２伸縮抑制部材３２により相互に連結されることにより固定され、１つの伸縮抑制部材３０をなしていても良い。さらに図４ａ～ｃ、および図５に示す様な伸縮抑制部材３０の平面視上の形状も考えられる。各図において、伸縮抑制領域７０は図示の通りである。 In FIG. 1A, the first expansion/contraction suppressing members 31 arranged at four locations independently of each other so as to include the vicinity of the four corners of the connected member 51 are mutually connected by the second expansion/contraction suppressing member 32 having a substantially X shape. This is an example in which one expansion and contraction suppressing member 30 is fixed by being connected. However, not limited to this, the expansion/contraction suppressing member 30 forms one closed figure in a plan view, and at least one of the wirings 52 is arranged in a region that does not overlap the first expansion/contraction suppressing member 31 in the expansion/contraction suppressing region 70 determined by the closed graphic. If the section exists, it is not limited to the above example. For example, as shown in FIG. 3, four first expansion/contraction suppressing members 31 are fixed by being connected to each other by a second expansion/contraction suppressing member 32 having a substantially square shape, in other words, a rectangular frame shape, and thus one expansion/contraction suppressing member. It may be 30. Further, the shape of the expansion and contraction suppressing member 30 as shown in FIGS. 4a to 4c and 5 in plan view is also conceivable. In each figure, the expansion/contraction suppressing region 70 is as illustrated.
　上記図１ａ～、および図３ａ～図５においては、伸縮抑制部材３０の平面視における外形形状は線分により囲まれた閉図形であった。しかしこれに限らず、伸縮抑制部材３０の平面視における外形形状は、図６および図７に示す様に曲線により囲まれるものであっても構わない。さらに上記図１ａ～ｃ、および図３ａ～図７に示す例においては、伸縮抑制部材３０の平面視における外形形状は対称性を有するものであるが、対称性を有さないものであって構わない。伸縮抑制部材３０の形状について、上記以外にも多種多様な平面視形状が考えられる。第１実施形態においては、伸縮抑制部材３０が平面視上１つの閉図形をなしており、それにより定まる伸縮抑制領域７０のうち、第１伸縮抑制部材３１と重ならない領域に配線５２の少なくとも一部が存在していれば、どのような平面視形状であっても下記効果を得ることができる。すなわち、接続部５１ａにおいて被接続部材５１と配線５２との電気的な接続が損なわれる、接続剥がれや断線が発生することを抑制できる、あるいは配線の分岐部５２ｂあるいは配線の方向転換部５２ｈが設けられている場合においては、該分岐部５２ｂあるいは方向転換部５２ｈにおける断線を抑制することができる、という効果を得ることができる。 In FIGS. 1a to 3 and 5 to 5 described above, the outer shape of the expansion and contraction suppressing member 30 in plan view is a closed figure surrounded by line segments. However, the shape is not limited to this, and the outer shape of the expansion-contraction suppressing member 30 in plan view may be surrounded by a curve as shown in FIGS. 6 and 7. Further, in the examples shown in FIGS. 1a to 3c and FIGS. 3a to 7, the outer shape of the expansion-contraction suppressing member 30 in plan view has symmetry, but it may have no symmetry. Absent. As for the shape of the expansion/contraction suppressing member 30, various types of plan view shapes other than the above can be considered. In the first embodiment, the expansion/contraction suppressing member 30 forms one closed figure in a plan view, and at least one of the wirings 52 is arranged in a region that does not overlap with the first expansion/contraction suppressing member 31 in the expansion/contraction suppressing region 70 determined by the expansion/contraction suppressing member 30. If the portion exists, the following effects can be obtained regardless of the shape in plan view. That is, it is possible to prevent the electrical connection between the connected member 51 and the wiring 52 in the connecting portion 51a from being spoiled, the occurrence of connection peeling or disconnection, or the wiring branch portion 52b or the wiring direction changing portion 52h. In such a case, it is possible to obtain the effect that the disconnection at the branch portion 52b or the direction changing portion 52h can be suppressed.
　（第２実施形態）
　以下、本開示の第２実施形態について、図１６ａ～ｃ、および図１７を用いて説明する。
　第２実施形態に係る配線基板１１０は上述の通り、第１面２１及びその反対側に位置する第２面２２を含み伸縮性を有する基材２０と、基材２０の第１面２１側に位置する配線５２と、基材２０の伸縮を抑制する複数の第１伸縮抑制部材１３１と、複数の第１伸縮抑制部材１３１を固定する第２伸縮抑制部材１３２とを備えている。上述の通り、被接続部材５１は配線基板１１０の必須の構成要素ではない。しかし、特に効果面については、被接続部材５１が存在しているものとして説明した方が理解が容易であるため、以下の説明において適宜被接続部材５１も含めて説明する場合もある。
　第２実施形態に係る配線基板１１０においては、複数の第１伸縮抑制部材１３１が第２伸縮抑制部材１３２により固定されてなす伸縮抑制部材１３０が２以上存在している点において上記第１実施形態と異なっている。以下、第２実施形態に係る第１伸縮抑制部材１３１および第２伸縮抑制部材１３２、すなわち伸縮抑制部材１３０について説明する。 (Second embodiment)
Hereinafter, the second embodiment of the present disclosure will be described with reference to FIGS. 16a to 16c and FIG.
As described above, the wiring board 110 according to the second embodiment has the stretchable base material 20 including the first surface 21 and the second surface 22 located on the opposite side, and the first surface 21 side of the base material 20. The wiring 52 located, the some 1st expansion-contraction suppressing member 131 which suppresses expansion-contraction of the base material 20, and the 2nd expansion-contraction suppressing member 132 which fixes a some 1st expansion-contraction suppressing member 131 are provided. As described above, the connected member 51 is not an essential component of the wiring board 110. However, especially regarding the effect side, it is easier to understand that the connected member 51 is present, and therefore, the connected member 51 may be appropriately included in the description below.
In the wiring board 110 according to the second embodiment, there are two or more expansion/contraction suppressing members 130 in which the plurality of first expansion/contraction suppressing members 131 are fixed by the second expansion/contraction suppressing members 132, and thus the first embodiment described above. Is different from Hereinafter, the first expansion/contraction suppressing member 131 and the second expansion/contraction suppressing member 132 according to the second embodiment, that is, the expansion/contraction suppressing member 130 will be described.
　〔第２実施形態に係る伸縮抑制部材〕
　第２実施形態に係る伸縮抑制部材１３０は、上記の通り、複数の第１伸縮抑制部材１３１が第２伸縮抑制部材１３２により固定されてなるものである。伸縮抑制部材１３０は、基材２０の伸縮を抑制するために配線基板１１０に設けられた部材である。図１６ａは平面図を、図１６ａにおけるＡ－Ａ断面およびＢ－Ｂ断面をそれぞれ図１６ｂおよび図１６ｃに示す。
　図１６に示す例において、伸縮抑制部材１３０は、基材２０の第１面２１上に位置し、通常扁平状である。図１６に示す第２実施形態に係る伸縮抑制部材１３０は、相互に直接連結されていない２以上の伸縮抑制部材１３０－１、１３０－２、・・・からなる。第２実施形態に係る伸縮抑制部材１３０は、第１面２１の法線方向に沿って基材２０を見た場合に（平面視において）、２以上の閉図形からなっている。
　図１６ｂに示すＡ－Ａ断面、および図１６ｃに示すＢ－Ｂ断面からも明らかな様に、伸縮抑制部材１３０は、被接続部材５１を基材２０に固定する接着剤の役目も果たしている。 [Expansion/contraction member according to the second embodiment]
As described above, the expansion/contraction suppressing member 130 according to the second embodiment includes a plurality of first expansion/contraction suppressing members 131 fixed by the second expansion/contraction suppressing member 132. The expansion/contraction suppressing member 130 is a member provided on the wiring board 110 for suppressing expansion/contraction of the base material 20. FIG. 16a shows a plan view, and FIG. 16a shows a cross section taken along the line AA in FIG. 16a and FIG. 16c shows a cross section taken along the line BB.
In the example shown in FIG. 16, the expansion-contraction suppressing member 130 is located on the first surface 21 of the base material 20 and is usually flat. The expansion suppressing member 130 according to the second embodiment shown in FIG. 16 includes two or more expansion suppressing members 130-1, 130-2,... Which are not directly connected to each other. The expansion and contraction suppressing member 130 according to the second embodiment is composed of two or more closed figures when the base material 20 is viewed along the normal direction of the first surface 21 (in plan view).
As is clear from the AA cross section shown in FIG. 16b and the BB cross section shown in FIG. 16c, the expansion and contraction suppressing member 130 also functions as an adhesive for fixing the connected member 51 to the base member 20.
　図１６ａにおいては、被接続部材５１の４隅付近を含む様に相互に独立して４箇所に配されている第１伸縮抑制部材１３１のうち、左側の２つ（１３１－１）が図示における縦方向の第２伸縮抑制部材１３２－１により相互に連結され一方の伸縮抑制部材１３０－１をなしており、右側の２つ（１３１－２）が図示における縦方向の第２伸縮抑制部材１３２－２により相互に連結され他方の伸縮抑制部材１３０－２をなしている。そして一方の伸縮抑制部材１３０－１と他方の伸縮抑制部材１３０－２とは相互に直接連結されておらず互いに独立している。すなわち図１６に示す第２実施形態に係る伸縮抑制部材１３０は、相互に直接連結されていない２つの伸縮抑制部材１３０－１、１３０－２からなる。図１６の例において伸縮抑制部材１３０は、相互に直接連結されていない２つの伸縮抑制部材１３０－１、１３０－２からなるが、相互に直接連結されていない３以上の伸縮抑制部材１３０－１、１３０－２、・・・からなっていてもよい。 In FIG. 16a, the left two (131-1) of the first expansion and contraction suppressing members 131 arranged at four locations independently of each other so as to include the vicinity of the four corners of the connected member 51 are shown. The second expansion/contraction suppressing members 132-1 in the vertical direction are connected to each other to form one expansion/contraction suppressing member 130-1, and the right two (131-2) are the second expansion/contraction suppressing members 132 in the vertical direction in the figure. -2, which are mutually connected to each other to form the other expansion-contraction suppressing member 130-2. Further, the one expansion/contraction suppressing member 130-1 and the other expansion/contraction suppressing member 130-2 are not directly connected to each other but independent from each other. That is, the expansion/contraction suppressing member 130 according to the second embodiment shown in FIG. 16 includes two expansion/contraction suppressing members 130-1 and 130-2 that are not directly connected to each other. In the example of FIG. 16, the expansion/contraction suppressing member 130 includes two expansion/contraction suppressing members 130-1 and 130-2 that are not directly connected to each other, but three or more expansion/contraction suppressing members 130-1 that are not directly connected to each other. , 130-2,...
　２以上の伸縮抑制部材１３０は、相互に異なる材料からなるものであっても良いし、同一の材料からなるものであってよい。また伸縮抑制部材１３０の各々の材料について、第１伸縮抑制部材１３１と第２伸縮抑制部材１３２とは、複数の異なる材料からなるものであっても良く、単一の材料からなるものであってよい。さらに、第１伸縮抑制部材１３１、あるいは第２伸縮抑制部材１３２の各々の各１つについても、複数の異なる材料から構成されていても良く、また単一の材料から構成されていてもよい。換言すれば第２実施形態に係る伸縮抑制部材１３０は、複数の異なる材料からなるものであっても良く、単一の材料からなるものであってよい。 The two or more expansion/contraction suppressing members 130 may be made of different materials or may be made of the same material. Regarding each material of the expansion/contraction suppressing member 130, the first expansion/contraction suppressing member 131 and the second expansion/contraction suppressing member 132 may be composed of a plurality of different materials, or may be composed of a single material. Good. Further, each one of the first expansion/contraction suppressing member 131 and the second expansion/contraction suppressing member 132 may be composed of a plurality of different materials, or may be composed of a single material. In other words, the expansion suppressing member 130 according to the second embodiment may be made of a plurality of different materials, or may be made of a single material.
　第１面２１の法線方向に沿って基材２０を見た場合に（すなわち平面視において）、２以上の伸縮抑制部材１３０の各々について、１つの伸縮抑制部材１３０に係る第１伸縮抑制部材１３１に外接し、かつ第１伸縮抑制部材１３１をその周長が最短となるように囲う仮想の領域を個別伸縮抑制領域７１とする。そうすると２以上の伸縮抑制部材１３０と同数の個別伸縮抑制領域７１が設定される。図１６ａにおいては、相互に直接連結されていない２つの伸縮抑制部材１３０－１、１３０－２により設定される２つの個別伸縮抑制領域７１を７１－１、および７１－２として示している。各個別伸縮抑制領域７１の内部においては、対応する伸縮抑制部材１３０により基材２０の伸縮が抑制される。上記にように設定される複数の個別伸縮抑制領域７１の集合を伸縮抑制領域７０とする。 When the base material 20 is viewed along the normal direction of the first surface 21 (that is, in a plan view), the first expansion/contraction suppressing member according to one expansion/contraction suppressing member 130 for each of two or more expansion/contraction suppressing members 130. An imaginary region that is circumscribed with 131 and surrounds the first expansion/contraction suppressing member 131 so that its peripheral length is the shortest is referred to as an individual expansion/contraction suppressing region 71. Then, the same number of individual expansion/contraction suppressing regions 71 as the expansion/contraction suppressing members 130 of two or more are set. In FIG. 16a, two individual expansion/contraction suppressing regions 71 set by two expansion/contraction suppressing members 130-1 and 130-2 that are not directly connected to each other are shown as 71-1 and 71-2. Inside each individual expansion/contraction suppressing area 71, expansion/contraction of the base material 20 is suppressed by the corresponding expansion/contraction suppressing member 130. A set of the plurality of individual expansion/contraction suppressing areas 71 set as described above is referred to as an expansion/contraction suppressing area 70.
　ここで配線５２の少なくとも一部は、複数の個別伸縮抑制領域７１の集合である伸縮抑制領域７０のうち、第１伸縮抑制部材１３１と重ならない領域のいずれかに存在していることが好ましい。
　上記好ましい形態であれば、被接続部材５１と５２配線との間に位置し、被接続部材５１と配線５２とを電気的に接続する接続部５１ａのうち少なくとも１つを伸縮抑制領域７０のうち、第１伸縮抑制部材１３１と重ならない領域に存在させることが可能となる。 Here, it is preferable that at least a part of the wiring 52 be present in any of the areas that do not overlap the first expansion/contraction suppressing member 131 in the expansion/contraction suppressing area 70 that is a set of a plurality of individual expansion/contraction suppressing areas 71.
According to the preferred embodiment, at least one of the connecting portions 51a that is located between the connected member 51 and the wiring 52 and electrically connects the connected member 51 and the wiring 52 to the expansion suppressing region 70. It is possible to allow the first expansion and contraction suppressing member 131 to exist in a region that does not overlap with the first expansion and contraction suppressing member 131.
　上記の通り、配線基板１１０に搭載される被接続部材５１をさらに有する場合には、被接続部材５１と配線５２との間に位置し、被接続部材５１と配線５２とを電気的に接続する接続部５１ａをさらに備え、第１面２１の法線方向に沿って基材２０を見た場合に（平面視上）、接続部５１ａのうち少なくとも１つは伸縮抑制領域７０のうち、第１伸縮抑制部材１３１と重ならない領域に存在していることが好ましい。 As described above, when the connected member 51 mounted on the wiring board 110 is further provided, it is located between the connected member 51 and the wiring 52, and electrically connects the connected member 51 and the wiring 52. When the base material 20 is further viewed along the normal line direction of the first surface 21 (in plan view), at least one of the connection portions 51 a is the first of the expansion and contraction suppression regions 70. It is preferably present in a region that does not overlap with the expansion and contraction suppressing member 131.
　上記の通り、接続部５１ａが伸縮抑制領域７０のうち、第１伸縮抑制部材１３１と重ならない領域に存在していれば、接続部５１ａが位置する伸縮抑制領域７０すなわち各個別伸縮抑制領域７１の内部は基材２０の伸縮が抑制されるため、接続部５１ａにおいて被接続部材５１と配線５２との相対位置が変化し難い。そのため接続部５１ａにおいて被接続部材５１と配線５２との電気的な接続が損なわれる、接続剥がれや断線が発生することを抑制できるという効果を得ることができる。また、伸縮抑制領域７０のうち、第１伸縮抑制部材３１と重ならない領域に、配線の分岐部５２ｂあるいは配線の方向転換部５２ｈが設けられている場合においては、該分岐部５２ｂあるいは方向転換部５２ｈにおける断線を抑制することができる（図４０ａおよびｂ参照）。 As described above, if the connecting portion 51a exists in the expansion/contraction suppressing area 70 in a region that does not overlap the first expansion/contraction suppressing member 131, the expansion/contraction suppressing area 70 in which the connecting portion 51a is located, that is, each individual expansion/contraction suppressing area 71. Since the expansion and contraction of the base material 20 is suppressed inside, the relative position between the connected member 51 and the wiring 52 is unlikely to change in the connecting portion 51a. Therefore, it is possible to obtain an effect that it is possible to prevent the electrical connection between the connected member 51 and the wiring 52 in the connection portion 51a from being damaged, and the occurrence of connection peeling and disconnection. Further, in the case where the wiring branch portion 52b or the wiring direction changing portion 52h is provided in a region of the expansion/contraction suppressing region 70 that does not overlap the first expansion/contraction suppressing member 31, the branch portion 52b or the direction changing portion 52h. It is possible to suppress disconnection at 52h (see FIGS. 40a and 40b).
　次に、被接続部材５１が伸縮し易い部材であり、かつ複数の伸縮抑制部材１３０が配線の延びる方向すなわち伸縮方向Ｄ１に隣り合っている場合において、更に得ることができる効果について説明する。
　図１６ａにおいては、２つの伸縮抑制部材１３０－１、および１３０－２が配線の延びる方向に隣り合っている。該２つの伸縮抑制部材１３０－１、および１３０－２の間（図１６ａの配線基板１１０おける左右方向の中央付近）には、伸縮抑制領域７０ではない領域、すなわち伸縮が抑制されない領域が存在する。被接続部材５１が伸縮し易い部材である場合には、該伸縮が抑制されない領域において、被接続部材５１は２つの伸縮抑制部材１３０－１、１３０－２に阻害されることなく伸縮することが可能である。そのため配線基板１１０は、平面視上被接続部材５１が存在する領域においてもある程度の伸縮性を有することができ、すなわち第１実施形態より高い伸縮性を有するものとすることができる。高い伸縮性を有する配線基板１１０は、例えば身体に対して適用した場合には良好な装着感を得ることができる。
　さらに、被接続部材５１が伸縮し易く、かつ曲げに対する柔軟性がある部材である場合においては、第１実施形態すなわち第１方向Ｄ１すなわち配線基板１１０の伸縮方向においては伸縮抑制部材３０が分離していない形態に比べ、高い柔軟性を持つことができ、この場合にも例えば身体に対して適用した場合には良好な装着感を得ることができる。 Next, the effect that can be further obtained when the connected member 51 is a member that easily expands and contracts and the plurality of expansion and contraction suppressing members 130 are adjacent to each other in the wiring extending direction, that is, the expansion and contraction direction D1 will be described.
In FIG. 16a, the two expansion/contraction suppressing members 130-1 and 130-2 are adjacent to each other in the wiring extending direction. Between the two expansion/contraction suppressing members 130-1 and 130-2 (near the center in the left-right direction in the wiring board 110 of FIG. 16a), there is a region that is not the expansion/contraction suppressing region 70, that is, a region where expansion/contraction is not suppressed. .. When the connected member 51 is a member that easily expands and contracts, the connected member 51 can expand and contract in the region where the expansion and contraction is not suppressed without being hindered by the two expansion and contraction suppressing members 130-1 and 130-2. It is possible. Therefore, the wiring board 110 can have a certain degree of elasticity even in the area where the connected member 51 exists in plan view, that is, it can have a higher elasticity than that of the first embodiment. The wiring board 110 having high elasticity can provide a good wearing feeling when applied to the body, for example.
Further, in the case where the connected member 51 is a member that easily expands and contracts and is flexible against bending, the expansion suppressing member 30 separates in the first embodiment, that is, the first direction D1, that is, the expansion and contraction direction of the wiring board 110. It can have higher flexibility than the non-fitted form, and in this case as well, when applied to the body, for example, a good wearing feeling can be obtained.
　平面視上、伸縮抑制部材１３０は各々被接続部材５１から突出していても良く、また突出しておらず伸縮抑制部材１３０のすべてが被接続部材５１と重なっていても良い。図１６ａにおいては、被接続部材５１を５１Ｓで示す形状とすれば伸縮抑制部材１３０は被接続部材５１Ｓから突出しており、被接続部材５１を５１Ｌで示す形状とすれば伸縮抑制部材１３０は被接続部材５１Ｌから突出しておらず、伸縮抑制部材１３０のすべてが被接続部材５１Ｌと重なっている。次に説明する図１７においても同様である。 In a plan view, the expansion/contraction suppressing members 130 may each project from the connected member 51, or all the expansion/contraction suppressing members 130 may not overlap and overlap the connected member 51. In FIG. 16a, if the connected member 51 has a shape indicated by 51S, the expansion/contraction suppressing member 130 projects from the connected member 51S, and if the connected member 51 has a shape indicated by 51L, the expansion/contraction suppressing member 130 is connected. It does not project from the member 51L, and the entire expansion-contraction suppressing member 130 overlaps the connected member 51L. The same applies to FIG. 17 described next.
　第２実施形態のおける伸縮抑制部材１３０の平面視上の形状は図１６ａの例に限らない。例えば図１７に示す様な平面視の形状も考えられる。さらに第１実施形態において説明した様に、伸縮抑制部材１３０の平面視上の形状は、曲線により囲まれる閉図形であっても構わない。また、各伸縮抑制部材１３０の分布が対称性を有さないものであってもよく、また各伸縮抑制部材１３０は対称性を有さない閉図形であって構わない。各伸縮抑制部材１３０の分布および形状について、上記以外にも多種多様な平面視形状が考えられる。各伸縮抑制部材１３０が平面視上１つの閉図形をなしており、それにより定まる各個別伸縮抑制領域７１（伸縮抑制領域７０）のうち、第１伸縮抑制部材１３１と重ならない領域のいずれかに配線５２の少なくとも一部が存在していれば、各伸縮抑制部材１３０がどのような平面視形状であっても、接続部５１ａにおいて被接続部材５１と配線５２との電気的な接続が損なわれる、接続剥がれや断線が発生することを抑制できるという上記効果を得ることができる。また、伸縮抑制領域７０のうち、第１伸縮抑制部材３１と重ならない領域に、配線の分岐部５２ｂあるいは配線の方向転換部５２ｈが設けられている場合においては、該分岐部５２ｂあるいは方向転換部５２ｈにおける断線を抑制することができる。 The shape of the expansion suppressing member 130 in the second embodiment in plan view is not limited to the example of FIG. 16a. For example, a plan view shape as shown in FIG. 17 is also conceivable. Further, as described in the first embodiment, the shape of the expansion-contraction suppressing member 130 in plan view may be a closed figure surrounded by a curved line. Further, the distribution of each expansion/contraction suppressing member 130 may not have symmetry, and each expansion/contraction suppressing member 130 may be a closed figure having no symmetry. Regarding the distribution and shape of each expansion and contraction suppressing member 130, a variety of plan view shapes other than the above can be considered. Each expansion/contraction member 130 forms one closed figure in a plan view, and in each individual expansion/contraction suppressing region 71 (expansion/contraction suppressing region 70) determined by the expansion/contraction suppressing member 130, the expansion/contraction suppressing member 131 does not overlap with the first expansion/contraction suppressing member 131. If at least a part of the wiring 52 is present, the electrical connection between the connected member 51 and the wiring 52 is impaired at the connecting portion 51a, regardless of the shape of each expansion-contraction suppressing member 130 in plan view. It is possible to obtain the above-described effect that it is possible to suppress the occurrence of connection peeling and disconnection. Further, in the case where the wiring branch portion 52b or the wiring direction changing portion 52h is provided in a region of the expansion/contraction suppressing region 70 that does not overlap the first expansion/contraction suppressing member 31, the branch portion 52b or the direction changing portion 52h. It is possible to suppress disconnection at 52h.
　（第３実施形態）
　以下、本開示の第３実施形態について、図１８ａ～ｃを用いて説明する。
　第３実施形態に係る配線基板２１０は、第１実施形態と同様に、第１面２１及びその反対側に位置する第２面２２を含み伸縮性を有する基材２０と、基材２０の第１面２１側に位置する配線５２と、基材２０の伸縮を抑制する複数の第１伸縮抑制部材２３１と、複数の第１伸縮抑制部材２３１を固定する第２伸縮抑制部材２３２とを備え、第３実施形態においてはさらに配線基板２１０に搭載される被接続部材５１を有している。そして第３実施形態における被接続部材５１は伸縮し難い部材であることが好ましい。
　第３実施形態に係る配線基板２１０においては、被接続部材５１を有し、第２伸縮抑制部材２３２が被接続部材５１である点において上記第１実施形態と異なっている。以下、第３実施形態に係る第１伸縮抑制部材２３１および第２伸縮抑制部材２３２、すなわち伸縮抑制部材２３０について説明する。 (Third Embodiment)
Hereinafter, the third embodiment of the present disclosure will be described with reference to FIGS.
Like the first embodiment, the wiring board 210 according to the third embodiment has a stretchable base material 20 including a first surface 21 and a second surface 22 located on the opposite side, and a first base material 20. The wiring 52 located on the first surface 21 side, a plurality of first expansion/contraction suppressing members 231 for suppressing expansion/contraction of the base material 20, and a second expansion/contraction suppressing member 232 for fixing the plurality of first expansion/contraction suppressing members 231 are provided, The third embodiment further includes a connected member 51 mounted on the wiring board 210. The connected member 51 in the third embodiment is preferably a member that is difficult to expand and contract.
The wiring board 210 according to the third embodiment is different from the first embodiment in that it has the connected member 51, and the second expansion suppressing member 232 is the connected member 51. Hereinafter, the first expansion/contraction suppressing member 231 and the second expansion/contraction suppressing member 232 according to the third embodiment, that is, the expansion/contraction suppressing member 230 will be described.
　〔第３実施形態に係る伸縮抑制部材〕
　第３実施形態に係る伸縮抑制部材２３０は、上記の通り、複数の第１伸縮抑制部材２３１が第２伸縮抑制部材２３２により固定されてなるものであり、被接続部材５１が第２伸縮抑制部材２３２の役目を果たしている。すなわち第３実施形態においては第２伸縮抑制部材２３２は被接続部材５１であるということができる。伸縮抑制部材２３０は、基材２０の伸縮を抑制するために配線基板２１０に設けられた部材である。図１８ａは平面図を、図１８ａにおけるＡ－Ａ断面およびＢ－Ｂ断面をそれぞれ図１８ｂおよび図１８ｃに示す。
　図１８に示す例において、第１伸縮抑制部材２３１は、基材２０の第１面２１上に位置している。第１伸縮抑制部材２３１は通常扁平状である。図１８ａ～ｃに示す第３実施形態に係る伸縮抑制部材２３０は、相互に直接連結されていない２以上の伸縮抑制部材２３０－１、２３０－２、・・・からなる。第３実施形態に係る伸縮抑制部材２３０は、第１面２１の法線方向に沿って基材２０を見た場合に（平面視において）、２以上の閉図形からなっている。
　図１８ｃに示すＢ－Ｂ断面からも明らかな様に、第１伸縮抑制部材２３１は、被接続部材５１を基材２０に固定する接着剤の役目も果たしている。 [Expansion-and-reduction member according to the third embodiment]
As described above, the expansion/contraction suppressing member 230 according to the third embodiment is configured such that the plurality of first expansion/contraction suppressing members 231 are fixed by the second expansion/contraction suppressing member 232, and the connected member 51 is the second expansion/contraction suppressing member. It plays the role of 232. That is, in the third embodiment, it can be said that the second expansion/contraction suppressing member 232 is the connected member 51. The expansion/contraction suppressing member 230 is a member provided on the wiring board 210 for suppressing expansion/contraction of the base material 20. FIG. 18a shows a plan view, and AA and BB cross sections in FIG. 18a are shown in FIGS. 18b and 18c, respectively.
In the example shown in FIG. 18, the first expansion/contraction suppressing member 231 is located on the first surface 21 of the base material 20. The first expansion/contraction suppressing member 231 is usually flat. The expansion suppressing member 230 according to the third embodiment shown in FIGS. 18a to 18c includes two or more expansion suppressing members 230-1, 230-2,... Which are not directly connected to each other. The expansion and contraction suppressing member 230 according to the third embodiment is formed of two or more closed figures when the base material 20 is viewed along the normal direction of the first surface 21 (in plan view).
As is clear from the BB cross section shown in FIG. 18c, the first expansion/contraction suppressing member 231 also serves as an adhesive for fixing the connected member 51 to the base material 20.
　図１８ａにおいては、被接続部材５１の４隅付近を含む様に４箇所に配されている第１伸縮抑制部材２３１は、相互に直接連結されておらず互いに独立している。すなわち図１８に示す第３実施形態に係る第１伸縮抑制部材２３１は、相互に直接連結されていない４つの第１伸縮抑制部材２３１－１、２３１－２、２３１－３、２３１－４からなっている。 In FIG. 18a, the first expansion and contraction suppressing members 231 arranged at four places so as to include the vicinity of the four corners of the connected member 51 are not directly connected to each other but independent from each other. That is, the first expansion/contraction suppressing member 231 according to the third embodiment shown in FIG. 18 includes four first expansion/contraction suppressing members 231-1, 231-2, 231-3, 231-4 which are not directly connected to each other. ing.
　そして第１面２１の法線方向に沿って基材２０を見た場合に（平面視において）、２以上の第１伸縮抑制部材２３１は各々被接続部材５１と接触しあるいは重なっている。そうすることで、第１伸縮抑制部材２３１と被接続部材５１とを直接的に、あるいは接着剤などを介して間接的に接続する際に、両者間を剛性高く接続することが可能となる。
　図１８ａにおいては、第１伸縮抑制部材２３１－１は被接続部材５１と接続されており、第１伸縮抑制部材２３１－２は被接続部材５１と接続されており、第１伸縮抑制部材２３１－３は被接続部材５１と接続されており、第１伸縮抑制部材２３１－４は被接続部材５１と接続されている。また４つの第１伸縮抑制部材２３１－１、２３１－２、２３１－３、２３１－４は、相互に重なっておらず、すなわち相互に直接連結されていない。
　ここで、４つの第１伸縮抑制部材２３１－１、２３１－２、２３１－３、２３１－４は、被接続部材５１を介して相互に接続され、該接続により４つの第１伸縮抑制部材２３１相互の位置関係が変化することが抑制されている。すなわち被接続部材５１は複数の第１伸縮抑制部材２３１を固定している。そうすると第３実施形態においては、第２伸縮抑制部材２３２は被接続部材５１であるということができる。 Then, when the base material 20 is viewed along the normal direction of the first surface 21 (in plan view), the two or more first expansion suppressing members 231 are in contact with or overlap with the connected members 51, respectively. By doing so, when connecting the first expansion-contraction suppressing member 231 and the connected member 51 directly or indirectly via an adhesive or the like, it is possible to connect them with high rigidity.
In FIG. 18a, the first expansion/contraction suppressing member 231-1 is connected to the connected member 51, the first expansion/contraction suppressing member 231-2 is connected to the connected member 51, and the first expansion/contraction suppressing member 231- 3 is connected to the connected member 51, and the first expansion-contraction suppressing member 231-4 is connected to the connected member 51. Further, the four first expansion/contraction suppressing members 231-1, 231-2, 231-3, 231-4 do not overlap each other, that is, are not directly connected to each other.
Here, the four first expansion/contraction suppressing members 231-1, 231-2, 231-3, 231-4 are connected to each other via the connected member 51, and the four first expansion/contraction suppressing members 231 are connected by the connection. Changes in the mutual positional relationship are suppressed. That is, the connected member 51 fixes the plurality of first expansion/contraction suppressing members 231. Then, in the third embodiment, it can be said that the second expansion/contraction suppressing member 232 is the connected member 51.
　図１８ａ～ｃの例においては、伸縮抑制部材２３０は４つの第１伸縮抑制部材２３１からなるものであるが、これに限らず相互に直接連結されていない２以上の任意の自然数個の第１伸縮抑制部材２３１からなるものであってもよい。第１伸縮抑制部材２３１の平面視上の分布および各形状は任意であり、すなわち被接続部材５１を介して相互に接続された第１伸縮抑制部材２３１および被接続部材５１とからなる伸縮抑制部材２３０の形状は任意である。第１伸縮抑制部材２３１が平面視上被接続部材５１から突出するか否かも各任意である。これらの形態であれば、接続剥がれや断線の発生を抑制できるという上記効果を得ることができる。また、伸縮抑制領域７０のうち、第１伸縮抑制部材２３１と重ならない領域に、配線の分岐部５２ｂあるいは配線の方向転換部５２ｈが設けられている場合においては、該分岐部５２ｂあるいは方向転換部５２ｈにおける断線を抑制することができる。 In the example of FIGS. 18a to 18c, the expansion/contraction suppressing member 230 is composed of four first expansion/contraction suppressing members 231, but the invention is not limited to this, and any natural number of two or more first elastic members is not directly connected to each other. The expansion and contraction suppressing member 231 may be included. The distribution and each shape of the first expansion/contraction suppressing member 231 in plan view are arbitrary, that is, the expansion/contraction suppressing member including the first expansion/contraction suppressing member 231 and the connected member 51 connected to each other via the connected member 51. The shape of 230 is arbitrary. Whether or not the first expansion/contraction suppressing member 231 projects from the connected member 51 in plan view is also arbitrary. With these forms, it is possible to obtain the above-described effect that it is possible to suppress the occurrence of connection peeling and disconnection. Further, in the case where the wiring branch portion 52b or the wiring direction changing portion 52h is provided in a region of the expansion/contraction suppressing region 70 that does not overlap with the first expansion/contraction suppressing member 231, the branch portion 52b or the direction changing portion 52h. It is possible to suppress disconnection at 52h.
　２以上の第１伸縮抑制部材２３１は、相互に異なる材料からなるものであっても良いし、同一の材料からなるものであってよい。また伸縮抑制部材２３０を構成する各第１伸縮抑制部材２３１の各々は、複数の異なる材料からなるものであっても良く、単一の材料からなるものであってよい。 The two or more first expansion/contraction suppressing members 231 may be made of different materials or may be made of the same material. Further, each of the first expansion/contraction suppressing members 231 constituting the expansion/contraction suppressing member 230 may be made of a plurality of different materials, or may be made of a single material.
　上記の通り、平面視において、２以上の第１伸縮抑制部材２３１は各々被接続部材５１と接触しあるいは重なっていることにより、第１伸縮抑制部材２３１と被接続部材５１との間を剛性高く接続することが可能となっている。ここで上記の通り、第３実施形態における被接続部材５１は伸縮し難い部材であることが好ましい。そうすると、２以上の第１伸縮抑制部材２３１は各々、伸縮し難い部材からなる被接続部材５１に剛性高く接続されることにより、結果的に２以上の第１伸縮抑制部材２３１は伸縮し難い部材からなる被接続部材５１を介して相互に剛性高く接続されることとなる。その結果、相互に直接連結されていない２以上の第１伸縮抑制部材２３１の集合からなる第３実施形態に係る伸縮抑制部材２３０は、全体としてある程度の剛性を持つ１つの部材と考えることができる。第３実施形態に係る被接続部材５１は、第２伸縮抑制部材２３２として機能し、それゆえ伸縮し難い部材からなることが好ましい。 As described above, in plan view, the two or more first expansion/contraction suppressing members 231 are in contact with or overlap with the connected member 51, respectively, so that the rigidity between the first expansion/contraction suppressing member 231 and the connected member 51 is increased. It is possible to connect. Here, as described above, the connected member 51 in the third embodiment is preferably a member that is difficult to expand and contract. Then, each of the two or more first expansion suppressing members 231 is connected to the connected member 51 made of a material that is difficult to expand and contract with high rigidity, so that the two or more first expansion suppressing members 231 are difficult to expand and contract. The members 51 are connected to each other with high rigidity. As a result, the expansion/contraction suppressing member 230 according to the third embodiment, which includes a set of two or more first expansion/contraction suppressing members 231 that are not directly connected to each other, can be considered as one member having a certain degree of rigidity as a whole. .. The connected member 51 according to the third embodiment preferably functions as the second expansion/contraction suppressing member 232 and is therefore made of a member that is difficult to expand/contract.
　第１面２１の法線方向に沿って基材２０を見た場合に（すなわち平面視において）、第１伸縮抑制部材２３１に外接し、かつ第１伸縮抑制部材２３１をその周長が最短となるように囲う仮想の領域を伸縮抑制領域７２とする。伸縮抑制領域７２は図１８ａにおいて符号７２で示す領域である。該伸縮抑制領域７２においては、伸縮抑制部材２３０により基材２０の伸縮が抑制される。そのため第３実施形態に係る配線基板２１０においては、配線５２の少なくとも一部は、伸縮抑制領域７２のうち、第１伸縮抑制部材２３１と重ならない領域に存在していることが好ましい。 When the base material 20 is viewed along the normal direction of the first surface 21 (that is, in a plan view), it is circumscribed to the first expansion-contraction suppressing member 231, and the first expansion suppressing member 231 has the shortest perimeter. An imaginary area surrounded by the above is defined as an expansion/contraction suppressing area 72. The expansion/contraction suppressing region 72 is a region indicated by reference numeral 72 in FIG. 18a. In the expansion/contraction suppressing region 72, expansion/contraction of the base material 20 is suppressed by the expansion/contraction suppressing member 230. Therefore, in the wiring board 210 according to the third embodiment, it is preferable that at least a part of the wiring 52 exists in the expansion/contraction suppressing region 72 in a region that does not overlap with the first expansion/contraction suppressing member 231.
　上記の通り、第３実施形態に係る伸縮抑制領域７２のうち、第１伸縮抑制部材２３１と重ならない領域に存在している配線５２についても、第１実施形態に係る伸縮抑制領域７０のうち、第１伸縮抑制部材３１と重ならない領域に存在している配線５２と同様の効果を得ることができる。すなわち配線５２の少なくとも一部が位置する伸縮抑制領域７２のうち、第１伸縮抑制部材２３１と重ならない領域は基材２０の伸縮が抑制されるため、接続部５１ａにおいて被接続部材５１と配線５２との相対位置が変化し難い。そのため接続部５１ａにおいて被接続部材５１と配線５２との電気的な接続が損なわれる、接続剥がれや断線が発生することを抑制できるという効果を得ることができる。また、伸縮抑制領域７２のうち、第１伸縮抑制部材２３１と重ならない領域に、配線の分岐部５２ｂあるいは配線の方向転換部５２ｈが設けられている場合においては、該分岐部５２ｂあるいは方向転換部５２ｈにおける断線を抑制することができる（図４０ａおよびｂ参照）。
　さらに、被接続部材５１が伸縮し難いが曲げに対する柔軟性がある部材である場合においては、第１実施形態すなわち第１方向Ｄ１すなわち配線基板２１０の伸縮方向においては伸縮抑制部材３０が分離していない形態に比べ、高い柔軟性を持つことができ、例えば身体に対して適用した場合には良好な装着感を得ることができる。 As described above, regarding the wiring 52 existing in a region that does not overlap with the first expansion/contraction suppressing member 231 in the expansion/contraction suppressing region 72 according to the third embodiment, among the expansion/contraction suppressing regions 70 according to the first embodiment, It is possible to obtain the same effect as that of the wiring 52 existing in the region that does not overlap with the first expansion/contraction suppressing member 31. That is, in the expansion/contraction suppressing area 72 in which at least a part of the wiring 52 is located, expansion/contraction of the base material 20 is suppressed in an area that does not overlap with the first expansion/contraction suppressing member 231, so that the connection target member 51 and the wiring 52 are connected in the connecting portion 51a. The relative position with is difficult to change. Therefore, it is possible to obtain an effect that it is possible to prevent the electrical connection between the connected member 51 and the wiring 52 in the connection portion 51a from being damaged, and the occurrence of connection peeling and disconnection. Further, in the case where the wiring branch portion 52b or the wiring direction changing portion 52h is provided in a region of the expansion/contraction suppressing region 72 that does not overlap with the first expansion/contraction suppressing member 231, the branch portion 52b or the direction changing portion 52h. It is possible to suppress disconnection at 52h (see FIGS. 40a and 40b).
Further, in the case where the connected member 51 is a member that is difficult to expand and contract but has flexibility against bending, the expansion suppressing member 30 is separated in the first embodiment, that is, the first direction D1, that is, the expansion and contraction direction of the wiring board 210. It can have higher flexibility than the non-existing form, and when applied to the body, for example, a good wearing feeling can be obtained.
　上述の通り、平面視において２以上の第１伸縮抑制部材２３１は各々被接続部材５１と接触しあるいは重なっている。図１８ａのＢ－Ｂ断面として図１８ｃに示す様に、平面視上各第１伸縮抑制部材２３１は各々被接続部材５１と重なっており、各第１伸縮抑制部材２３１は各々被接続部材５１の下面とのみ接触している。しかし各第１伸縮抑制部材２３１と被接続部材５１とを剛性高く接続することができればこれに限らない、例えば図１９ａのＢ－Ｂ断面として図１９ｃに示す様に、平面視上各第１伸縮抑制部材２３１は各々被接続部材５１と重なっており、各第１伸縮抑制部材２３１は各々被接続部材５１の下面の他側面においても接触している。図１９ａ～ｃの形態例においては図１８ａ～ｃの形態例に対し、各第１伸縮抑制部材２３１と被接続部材５１との接続において特に伸縮方向Ｄ１について一層剛性高く接続することができる。 As described above, the two or more first expansion/contraction suppressing members 231 are in contact with or overlap with the connected member 51 in plan view. As shown in FIG. 18c as a BB cross section of FIG. 18a, each of the first expansion/contraction suppressing members 231 overlaps with the connected member 51 in plan view, and each of the first expansion/contraction suppressing members 231 of the connected member 51 respectively. Only in contact with the bottom surface. However, the invention is not limited to this as long as the first expansion suppressing member 231 and the connected member 51 can be connected with high rigidity. For example, as shown in FIG. 19c as a BB cross section of FIG. The restraint members 231 are overlapped with the connected members 51, respectively, and the first expansion-contraction restraint members 231 are also in contact with the other side surface of the lower surface of the connected members 51. 19a to 19c, the first expansion suppressing member 231 and the connected member 51 can be connected to each other with higher rigidity, especially in the expansion and contraction direction D1, as compared with the embodiment of FIGS. 18a to 18c.
　また、図２０ａのＢ－Ｂ断面として図２０ｃに示す様に、平面視上各第１伸縮抑制部材２３１は各々被接続部材５１と重ならず接触しており、すなわち各第１伸縮抑制部材２３１は各々被接続部材５１の側面とのみ接触していてもよい。更に、図２１ａのＢ－Ｂ断面として図２１ｃに示す様に、平面視上各第１伸縮抑制部材２３１は各々被接続部材５１と重なっており、各第１伸縮抑制部材２３１は各々被接続部材５１の上面および側面とで接触していてもよい。この場合、第１伸縮抑制部材２３１が被接続部材５１の上面を全て覆うものであってもよい。その場合には各第１伸縮抑制部材２３１は被接続部材５１の上面において相互に接続され、結果的に１つの伸縮抑制部材２３０と考えることができるため、第１実施形態の１形態と考えることもできる。 Further, as shown in FIG. 20c as a BB cross section of FIG. 20a, each first expansion/contraction suppressing member 231 is in contact with the connected member 51 without overlapping in plan view, that is, each first expansion/contraction suppressing member 231. May contact only the side surface of each connected member 51. Further, as shown in FIG. 21c as a BB cross section of FIG. 21a, each of the first expansion/contraction suppressing members 231 overlaps with the connected member 51 in plan view, and each of the first expansion/contraction suppressing members 231 is connected to the connected member. It may be in contact with the upper surface and the side surface of 51. In this case, the first expansion/contraction suppressing member 231 may cover the entire upper surface of the connected member 51. In that case, the respective first expansion and contraction suppressing members 231 are connected to each other on the upper surface of the connected member 51, and as a result, it can be considered as one expansion and contraction suppressing member 230. Therefore, it is considered as one form of the first embodiment. Can also
　伸縮抑制領域７２を良好に確保するために、第１伸縮抑制部材２３１（伸縮抑制部材２３０）と被接続部材５１との相対位置、および第１伸縮抑制部材２３１と基材２０との相対位置がともに変動しないことが前提となる。第３実施形態においては、被接続部材５１は第１伸縮抑制部材２３１を介して基材２０に固定されていることとなる。これはすなわち、第１伸縮抑制部材２３１が被接続部材５１を基材２０に固定する接着剤の役割も兼ねていると考えることができる。しかしこれに限らず、第３実施形態においても第１伸縮抑制部材２３１とは別途に、被接続部材５１を基材２０に固定するための接着剤Ｂｏを有していても良い。 In order to properly secure the expansion/contraction suppressing region 72, the relative position between the first expansion/contraction suppressing member 231 (expansion/contraction suppressing member 230) and the connected member 51, and the relative position between the first expansion/contraction suppressing member 231 and the base material 20 are set. It is premised that neither changes. In the third embodiment, the connected member 51 is fixed to the base material 20 via the first expansion/contraction suppressing member 231. That is, it can be considered that the first expansion/contraction suppressing member 231 also serves as an adhesive for fixing the connected member 51 to the base material 20. However, not limited to this, also in the third embodiment, an adhesive Bo for fixing the connected member 51 to the base material 20 may be provided separately from the first expansion/contraction suppressing member 231.
　第３実施形態の以上の説明に用いた各図（図１８ａ～図２１ｃ）、および後述する図２７ａ～図３０ｃにおいては、平面視上、第１伸縮抑制部材２３１は被接続部材５１から突出していた。しかしこれに限らず、第１伸縮抑制部材２３１が被接続部材５１から突出しておらず、第１伸縮抑制部材２３１のすべてが被接続部材５１と重なっていても良い。 In each of the drawings (FIGS. 18a to 21c) used in the above description of the third embodiment and FIGS. 27a to 30c described later, the first expansion-contraction suppressing member 231 projects from the connected member 51 in a plan view. It was However, the present invention is not limited to this, and the first expansion/contraction suppressing member 231 may not protrude from the connected member 51, and the entire first expansion/contraction suppressing member 231 may overlap the connected member 51.
　図２２ａおよび図２２ｃに示す通り、第１伸縮抑制部材２３１が被接続部材５１から突出しておらず、第１伸縮抑制部材２３１のすべてが被接続部材５１と重なっており、また第１伸縮抑制部材２３１は基材２０を貫通していない。この形態においても当然に配線５２の少なくとも一部を伸縮抑制領域７２うち、第１伸縮抑制部材２３１と重ならない領域に存在させることが可能である。そのため上記第３実施形態に係る効果と同様の下記効果を得ることができる。すなわち、配線５２の少なくとも一部が位置する伸縮抑制領域７２のうち、第１伸縮抑制部材２３１と重ならない領域は基材２０の伸縮が抑制されるため、接続部５１ａにおいて被接続部材５１と配線５２との相対位置が変化し難い。そのため接続部５１ａにおいて被接続部材５１と配線５２との電気的な接続が損なわれる、接続剥がれや断線が発生することを抑制できるという効果を得ることができる。また、伸縮抑制領域７２のうち、第１伸縮抑制部材２３１と重ならない領域に、配線の分岐部５２ｂあるいは配線の方向転換部５２ｈが設けられている場合においては、該分岐部５２ｂあるいは方向転換部５２ｈにおける断線を抑制することができる。 As shown in FIGS. 22a and 22c, the first expansion/contraction suppressing member 231 does not protrude from the connected member 51, all of the first expansion/contraction suppressing member 231 overlaps with the connected member 51, and the first expansion/contraction suppressing member 231 does not penetrate the base material 20. Even in this embodiment, it is naturally possible to allow at least a part of the wiring 52 to exist in the expansion/contraction suppressing region 72 in a region that does not overlap the first expansion/contraction suppressing member 231. Therefore, the following effects similar to the effects according to the third embodiment can be obtained. That is, in the expansion/contraction suppressing area 72 in which at least a part of the wiring 52 is located, expansion/contraction of the base material 20 is suppressed in an area that does not overlap with the first expansion/contraction suppressing member 231, so that the connection target member 51 and the wiring are connected in the connecting portion 51a. It is difficult for the relative position with 52 to change. Therefore, it is possible to obtain an effect that it is possible to prevent the electrical connection between the connected member 51 and the wiring 52 in the connection portion 51a from being damaged, and the occurrence of connection peeling and disconnection. Further, in the case where the wiring branch portion 52b or the wiring direction changing portion 52h is provided in a region of the expansion/contraction suppressing region 72 that does not overlap with the first expansion/contraction suppressing member 231, the branch portion 52b or the direction changing portion 52h. It is possible to suppress disconnection at 52h.
　（第４実施形態）
　以下、本開示の第４実施形態について、図２３ａ～ｃを用いて説明する。
　第４実施形態に係る配線基板３１０は、基材２０、伸縮抑制部材３０、支持基板４０、被接続部材５１、配線５２を備える。そして、伸縮抑制部材３０は、基材２０に支持基板４０を介して間接的に接する。図２３ａは第４実施形態に係る配線基板３１０を示す平面図であり、そのＡ－Ａに沿って切断した場合の断面図を図２３ｂに、Ｂ－Ｂに沿って切断した場合の断面図を図２３ｃに示す。 (Fourth Embodiment)
Hereinafter, the fourth embodiment of the present disclosure will be described with reference to FIGS. 23a to 23c.
The wiring board 310 according to the fourth embodiment includes a base material 20, an expansion/contraction suppressing member 30, a support substrate 40, a connected member 51, and a wiring 52. The expansion and contraction suppressing member 30 indirectly contacts the base material 20 via the support substrate 40. FIG. 23a is a plan view showing a wiring substrate 310 according to the fourth embodiment. A sectional view taken along the line AA is shown in FIG. 23b, and a sectional view taken along the line BB is shown. Shown in Figure 23c.
　支持基板４０は、基材２０よりも低い伸縮性を有するよう構成された板状の部材である。支持基板４０は、基材２０側に位置する第２面４２と、第２面４２の反対側に位置する第１面４１と、を含む。図２３ａ～ｃに示す例において、支持基板４０は、その第１面４１側において被接続部材５１、配線５２及び伸縮抑制部材３０を支持している。また、支持基板４０は、その第２面４２側において基材２０の第１面に接合されている。例えば、基材２０と支持基板４０との間に、接着剤を含む接着層が設けられていてもよい。この場合、接着層を構成する材料としては、例えばアクリル系接着剤、シリコーン系接着剤等を用いることができる。接着層の厚さは、例えば５μｍ以上且つ２００μｍ以下である。また、図示はしないが、被接着表面を分子修飾させて、分子接着結合させる方法によって支持基板４０の第２面４２が基材２０の第１面２１に接合されていてもよい。この場合、基材２０と支持基板４０との間に接着層が設けられていなくてもよい。 The support substrate 40 is a plate-shaped member configured to have a stretchability lower than that of the base material 20. The support substrate 40 includes a second surface 42 located on the base material 20 side and a first surface 41 located on the opposite side of the second surface 42. In the example shown in FIGS. 23A to 23C, the support substrate 40 supports the connected member 51, the wiring 52, and the expansion/contraction suppressing member 30 on the first surface 41 side thereof. The support substrate 40 is joined to the first surface of the base material 20 on the second surface 42 side. For example, an adhesive layer containing an adhesive may be provided between the base material 20 and the support substrate 40. In this case, as a material forming the adhesive layer, for example, an acrylic adhesive, a silicone adhesive, or the like can be used. The thickness of the adhesive layer is, for example, 5 μm or more and 200 μm or less. Although not shown, the second surface 42 of the support substrate 40 may be bonded to the first surface 21 of the base material 20 by a method of molecularly modifying the surface to be adhered and performing molecular adhesive bonding. In this case, the adhesive layer may not be provided between the base material 20 and the support substrate 40.
　また、本実施形態においては、基材２０に張力を加えて伸長させて、このように伸長させた基材２０に、被接続部材５１、配線５２及び伸縮抑制部材３０を支持した支持基板４０が接合される。支持基板４０と接合された基材２０から引張応力が取り除かれて基材２０が収縮するとき、支持基板４０及び配線５２に蛇腹形状部５７が形成される。支持基板４０の特性や寸法は、このような蛇腹形状部５７が形成され易くなるよう設定されている。例えば、支持基板４０は、基材２０の第１の弾性係数よりも大きい弾性係数を有する。以下の説明において、支持基板４０の弾性係数のことを、第３の弾性係数とも称する。 Further, in the present embodiment, the support substrate 40 that supports the member to be connected 51, the wiring 52, and the expansion-contraction suppressing member 30 on the base material 20 which is expanded by applying tension to the base material 20 in this way is provided. To be joined. When the tensile stress is removed from the base material 20 bonded to the support substrate 40 and the base material 20 contracts, the bellows-shaped portion 57 is formed on the support substrate 40 and the wiring 52. The characteristics and dimensions of the support substrate 40 are set so that the bellows-shaped portion 57 is easily formed. For example, the support substrate 40 has a modulus of elasticity larger than the first modulus of elasticity of the base material 20. In the following description, the elastic coefficient of the support substrate 40 is also referred to as the third elastic coefficient.
　支持基板４０の第３の弾性係数は、例えば１００ＭＰａ以上であり、より好ましくは１ＧＰａ以上である。また、支持基板４０の第３の弾性係数は、基材２０の第１の弾性係数の１００倍以上５００００倍以下であってもよく、好ましくは１０００倍以上１００００倍以下である。このように支持基板４０の第３の弾性係数を設定することにより、蛇腹形状部５７の周期が小さくなり過ぎることを抑制することができる。また、蛇腹形状部５７において局所的な折れ曲がりが生じることを抑制することができる。
　なお、支持基板４０の弾性係数が低すぎると、伸縮抑制部材３０の形成工程中に支持基板４０が変形し易く、この結果、被接続部材５１及び配線５２に対する伸縮抑制部材３０の位置合わせが難しくなる。また、支持基板４０の弾性係数が高すぎると、弛緩時の基材２０の復元が難しくなり、また基材２０の割れや折れが発生し易くなる。 The third elastic coefficient of the support substrate 40 is, for example, 100 MPa or more, and more preferably 1 GPa or more. The third elastic modulus of the support substrate 40 may be 100 times or more and 50,000 times or less, preferably 1000 times or more and 10,000 times or less than the first elastic coefficient of the base material 20. By setting the third elastic coefficient of the support substrate 40 in this way, it is possible to prevent the cycle of the bellows-shaped portion 57 from becoming too small. Further, it is possible to suppress the local bending in the bellows-shaped portion 57.
If the elastic modulus of the support substrate 40 is too low, the support substrate 40 is easily deformed during the process of forming the expansion and contraction suppressing member 30, and as a result, it is difficult to align the expansion and contraction suppressing member 30 with the connected member 51 and the wiring 52. Become. If the elastic modulus of the support substrate 40 is too high, it becomes difficult to restore the base material 20 when it relaxes, and the base material 20 is likely to crack or break.
　また、支持基板４０の厚さは、例えば５００ｎｍ以上１０μｍ以下であり、より好ましくは１μｍ以上５μｍ以下である。支持基板４０の厚さが小さすぎると、支持基板４０の製造工程や、支持基板４０上に部材を形成する工程における、支持基板４０のハンドリングが難しくなる。支持基板４０の厚さが大きすぎると、弛緩時の基材２０の復元が難しくなり、目標の基材２０の伸縮が得られなくなる。 The thickness of the support substrate 40 is, for example, 500 nm or more and 10 μm or less, and more preferably 1 μm or more and 5 μm or less. If the thickness of the support substrate 40 is too small, it becomes difficult to handle the support substrate 40 in the process of manufacturing the support substrate 40 and the process of forming a member on the support substrate 40. If the thickness of the support substrate 40 is too large, it becomes difficult to restore the base material 20 when it is relaxed, and it becomes impossible to expand or contract the target base material 20.
　支持基板４０を構成する材料としては、例えば、ポリエチレンナフタレート、ポリイミド、ポリエチレンテレフタレート、ポリカーボネート、アクリル樹脂等を用いることができる。その中でも、耐久性や耐熱性がよいポリエチレンナフタレートかポリイミドが好ましく用いられ得る。 As the material forming the support substrate 40, for example, polyethylene naphthalate, polyimide, polyethylene terephthalate, polycarbonate, acrylic resin or the like can be used. Among them, polyethylene naphthalate or polyimide having good durability and heat resistance can be preferably used.
　支持基板４０の第３の弾性係数は、基材２０の第１の弾性係数の１００倍以下であってもよい。支持基板４０の第３の弾性係数を算出する方法は、前述の基材２０に係る第１の弾性係数を算出する方法と同様である。 The third elastic coefficient of the support substrate 40 may be 100 times or less the first elastic coefficient of the base material 20. The method of calculating the third elastic coefficient of the support substrate 40 is the same as the method of calculating the first elastic coefficient of the base material 20 described above.
　（第４実施形態の変形例）
　図２４ａおよびｂに示す第４実施形態の変形例では、配線基板３１０が、基材２０、伸縮抑制部材３０、支持基板４０、被接続部材５１、配線５２を備えるが、伸縮抑制部材３０の位置が図２３ａ～ｃに示す例とは異なる。図２４ａは図２３ｂに相当する位置の断面図であり、図２４ｂは図２３ｃに相当する位置の断面図である。詳しくは、支持基板４０は、基材２０の第１面２１及び第１面２１上に設けられた伸縮抑制部材３０上に設けられている。支持基板４０は、その第１面４１側において被接続部材５１及び配線５２を支持している。また、支持基板４０は、その第２面４２側において基材２０の第１面２１及び伸縮抑制部材３０に接合されている。 (Modification of Fourth Embodiment)
In the modification of the fourth embodiment shown in FIGS. 24A and 24B, the wiring board 310 includes the base material 20, the expansion/contraction suppressing member 30, the support substrate 40, the connected member 51, and the wiring 52, but the position of the expansion/contraction suppressing member 30. Is different from the example shown in FIGS. FIG. 24a is a sectional view of a position corresponding to FIG. 23b, and FIG. 24b is a sectional view of a position corresponding to FIG. 23c. Specifically, the support substrate 40 is provided on the first surface 21 of the base material 20 and the expansion/contraction suppressing member 30 provided on the first surface 21. The support substrate 40 supports the connected member 51 and the wiring 52 on the first surface 41 side thereof. The support substrate 40 is joined to the first surface 21 of the base material 20 and the expansion and contraction suppressing member 30 on the second surface 42 side thereof.
　また、図２４ｃおよびｄに示すように、配線基板３１０が、基材２０、伸縮抑制部材３０、支持基板４０、被接続部材５１、配線５２を備える場合においては、伸縮抑制部材３０が基材２０の内部に設けられ、基材２０から外部に露出しない状態になっていてもよい。図２４ｃは図２３ｂに相当する位置の断面図であり、図２４ｄは図２３ｃに相当する位置の断面図である。ここで、図２４ｃおよびｄに示す配線基板３１０が、伸長させた基材２０に配線５２を設けた後、基材２０を弛緩させることで形成される場合には、基材２０の第１面２１、および第２面２２の少なくともいずれか一方における、第１方向Ｄ１と直交する方向において、平面視で伸縮抑制部材３０と隣接する部分、および対向する部分に、山部及び谷部を含む蛇腹形状部が形成され得る。
　また、第１面２１又は第２面２２に予め伸縮抑制部材３０が設けられた基材２０を伸長させて、配線５２を設けた後、弛緩させた場合にも、基材２０の第１面２１、および第２面２２の少なくともいずれか一方における、第１方向Ｄ１と直交する方向において、平面視で伸縮抑制部材３０と隣接する部分に、山部及び谷部を含む蛇腹形状部が形成され得る。 Further, as shown in FIGS. 24C and 24D, when the wiring board 310 includes the base material 20, the expansion/contraction suppressing member 30, the support substrate 40, the connected member 51, and the wiring 52, the expansion/contraction suppressing member 30 is the base material 20. It may be provided inside and not exposed to the outside from the base material 20. FIG. 24c is a sectional view of a position corresponding to FIG. 23b, and FIG. 24d is a sectional view of a position corresponding to FIG. 23c. Here, when the wiring substrate 310 shown in FIGS. 24C and 24D is formed by relaxing the base material 20 after providing the wiring 52 on the stretched base material 20, the first surface of the base material 20. 21 and the second surface 22 in a direction orthogonal to the first direction D1 in a direction orthogonal to the first direction D1, a bellows including a mountain portion and a valley portion in a portion adjacent to the expansion and contraction suppressing member 30 in a plan view and a portion facing each other. A feature can be formed.
The first surface of the base material 20 is also obtained when the base material 20 on which the expansion and contraction suppressing member 30 is previously provided on the first surface 21 or the second surface 22 is stretched to provide the wiring 52 and then relaxed. In at least one of 21 and the second surface 22, in a direction orthogonal to the first direction D1, a bellows-shaped portion including a mountain portion and a valley portion is formed in a portion adjacent to the expansion suppressing member 30 in a plan view. obtain.
　さらに、図２４ｅおよびｆに示すように、伸縮抑制部材３０は基材２０の第２面２２側に位置してもよい。図２４ｅは図２３ｂに相当する位置の断面図であり、図２４ｆは図２３ｃに相当する位置の断面図である。
　上記形態においても、被接続部材５１は配線基板３１０の必須の構成要素ではない。すなわち、被接続部材５１が搭載されていない状態の支持基板４０が基材２０に貼り合わされてもよい。また、配線基板３１０は、被接続部材５１が搭載されていない状態で出荷されてもよい。 Further, as shown in FIGS. 24e and 24f, the expansion-contraction suppressing member 30 may be located on the second surface 22 side of the base material 20. FIG. 24e is a sectional view of a position corresponding to FIG. 23b, and FIG. 24f is a sectional view of a position corresponding to FIG. 23c.
Also in the above-mentioned form, the connected member 51 is not an essential component of the wiring board 310. That is, the support substrate 40 in which the connected member 51 is not mounted may be attached to the base material 20. The wiring board 310 may be shipped without the connected member 51 being mounted.
　（第１実施形態の変形例）
　次に上記第１実施形態の変形例について図２５ａ～ｃを用いて説明する。
　図２５ａ～ｃに示す通り、伸縮抑制部材３０は、基材２０を貫通して配置されていても構わない。貫通して配置されることにより、基材２０に対し伸縮抑制部材３０をより強固に配置することができる。図２５ａ～ｃの例示では図２５ｃに示す通り、貫通して配置される伸縮抑制部材３０は、基材２０の第２面２２付近部分がそれより第１面２１側の部分より太く形成されており、貫通部分が第１面２１側（図２５ｃにおける上方向）に抜けて基材２０から伸縮抑制部材３０が分離してしまうことを予防している。すなわち図２５ａ～ｃに例示の形態においては、伸縮抑制部材３０は基材２０に対しより強固に配置されている。この貫通形態においても、接続部５１ａにおいて被接続部材５１と配線５２との電気的な接続が損なわれる、接続剥がれや断線が発生することを抑制できるという上記効果を得ることができる。また、伸縮抑制領域７２のうち、第１伸縮抑制部材２３１と重ならない領域に、配線の分岐部５２ｂあるいは配線の方向転換部５２ｈが設けられている場合においては、該分岐部５２ｂあるいは方向転換部５２ｈにおける断線を抑制することができる（図４０ａおよびｂ参照）。 (Modification of the first embodiment)
Next, a modification of the first embodiment will be described with reference to FIGS.
As shown in FIGS. 25a to 25c, the expansion and contraction suppressing member 30 may be disposed so as to penetrate the base material 20. By being arranged so as to penetrate, the expansion and contraction suppressing member 30 can be arranged more firmly with respect to the base material 20. In the example of FIGS. 25a to 25c, as shown in FIG. 25c, the expansion and contraction suppressing member 30 arranged so as to penetrate is formed such that the portion near the second surface 22 of the base material 20 is thicker than the portion on the first surface 21 side. Therefore, the penetration portion is prevented from coming out to the first surface 21 side (upward in FIG. 25c) and the expansion suppressing member 30 is separated from the base material 20. That is, in the embodiment illustrated in FIGS. 25a to 25c, the expansion and contraction suppressing member 30 is more firmly arranged with respect to the base material 20. Even in this penetrating form, it is possible to obtain the above-described effect that it is possible to prevent the electrical connection between the connected member 51 and the wiring 52 in the connection portion 51a from being damaged, and the occurrence of connection peeling and disconnection. Further, in the case where the wiring branch portion 52b or the wiring direction changing portion 52h is provided in a region of the expansion/contraction suppressing region 72 that does not overlap with the first expansion/contraction suppressing member 231, the branch portion 52b or the direction changing portion 52h. It is possible to suppress disconnection at 52h (see FIGS. 40a and 40b).
　（第１実施形態の他の変形例）
　上記図８ａ～図１５ｃにより、伸縮抑制部材３０すなわち第１伸縮抑制部材３１および第２伸縮抑制部材３２は、基材２０の厚さ方向の任意の位置に形成し得ることを説明した。図８ａ～図１５ｃの各例においてはいずれも、第１伸縮抑制部材３１と第２伸縮抑制部材３２とを基材２０の厚さ方向の同じ位置に形成した形態であった。しかしこれに限らず、第１伸縮抑制部材３１と第２伸縮抑制部材３２とを基材２０の厚さ方向の異なる位置に形成してもよい。
　図４１ａ～ｃに示す例においては、第１伸縮抑制部材３１を基材２０の第１面２１側の表面に配し、第２伸縮抑制部材３２を基材２０の第２面２２側の表面に配し、第１伸縮抑制部材３１が基材２０を貫通し第２伸縮抑制部材３２に接続されている例である。この形態においても、第１伸縮抑制部材３１および第２伸縮抑制部材３２、すなわち伸縮抑制部材３０により基材２０の伸縮が抑制され、平面視上各第１伸縮抑制部材３１に外接し、かつ第１伸縮抑制部材３１をその周長が最短となるように囲う仮想の領域内部である伸縮抑制領域７０のうち、第１伸縮抑制部材３１と重ならない領域を良好に確保することができる。そしてそのため接続部５１ａにおいて被接続部材と配線との電気的な接続が損なわれる、接続剥がれや断線の発生を抑制することができ、あるいは配線の分岐部や方向転換部における断線を抑制することができる。 (Other Modifications of First Embodiment)
8A to 15C, it has been described that the expansion/contraction suppressing member 30, that is, the first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member 32 can be formed at any position in the thickness direction of the substrate 20. In each of the examples of FIGS. 8a to 15c, the first expansion and contraction suppressing member 31 and the second expansion and contraction suppressing member 32 are formed at the same position in the thickness direction of the base material 20. However, the present invention is not limited to this, and the first expansion/contraction suppressing member 31 and the second expansion/contraction suppressing member 32 may be formed at different positions in the thickness direction of the base material 20.
In the example shown in FIGS. 41a to 41c, the first expansion/contraction suppressing member 31 is disposed on the surface of the base material 20 on the first surface 21 side, and the second expansion/contraction suppressing member 32 is on the surface of the base material 20 on the second surface 22 side. In this example, the first expansion/contraction suppressing member 31 penetrates the base material 20 and is connected to the second expansion/contraction suppressing member 32. Also in this form, the expansion and contraction of the base material 20 is suppressed by the first expansion and contraction suppressing member 31 and the second expansion and contraction suppressing member 32, that is, the expansion and contraction suppressing member 30, and is circumscribed to each first expansion and contraction suppressing member 31 in plan view, and It is possible to satisfactorily secure a region that does not overlap with the first expansion/contraction suppressing member 31 in the expansion/contraction suppressing region 70 that is inside a virtual region that surrounds the 1 expansion/contraction suppressing member 31 so that its circumference is the shortest. Therefore, in the connection portion 51a, it is possible to prevent the electrical connection between the member to be connected and the wiring from being spoiled, the occurrence of connection peeling and the disconnection, or the prevention of the disconnection at the branch portion or the direction changing portion of the wiring. it can.
　同様に図４２ａ～ｃに示す例においては、第１伸縮抑制部材３１を基材２０の第２面２２側の表面に配し、第２伸縮抑制部材３２を基材２０の第１面２１側にはあるものの基材２０の第１面２１とは接触せずに被接続部材５１における基材２０の第１面２１と対向する面（図４２ｂ、図４２ｃにおける下面）の表面に配し、第１伸縮抑制部材３１が基材２０を貫通し第２伸縮抑制部材３２に接続されている例である。この形態においても、第１伸縮抑制部材３１および第２伸縮抑制部材３２、すなわち伸縮抑制部材３０により基材２０の伸縮が抑制され、平面視上各第１伸縮抑制部材３１に外接し、かつ第１伸縮抑制部材３１をその周長が最短となるように囲う仮想の領域内部である伸縮抑制領域７０のうち、第１伸縮抑制部材３１と重ならない領域を良好に確保することができる。そしてそのため接続部５１ａにおいて被接続部材と配線との電気的な接続が損なわれる、接続剥がれや断線の発生を抑制することができ、あるいは配線の分岐部や方向転換部における断線を抑制することができる。 Similarly, in the example shown in FIGS. 42a to 42c, the first expansion/contraction suppressing member 31 is arranged on the surface of the base material 20 on the second surface 22 side, and the second expansion/contraction suppressing member 32 is arranged on the first surface 21 side of the base material 20. Although not in contact with the first surface 21 of the base material 20, it is arranged on the surface of the surface (the lower surface in FIGS. 42b and 42c) of the connected member 51 that faces the first surface 21 of the base material 20, In this example, the first expansion/contraction suppressing member 31 penetrates the base material 20 and is connected to the second expansion/contraction suppressing member 32. Also in this form, the expansion and contraction of the base material 20 is suppressed by the first expansion and contraction suppressing member 31 and the second expansion and contraction suppressing member 32, that is, the expansion and contraction suppressing member 30, and is circumscribed to each first expansion and contraction suppressing member 31 in plan view, and It is possible to satisfactorily secure a region that does not overlap with the first expansion/contraction suppressing member 31 in the expansion/contraction suppressing region 70 that is inside a virtual region that surrounds the 1 expansion/contraction suppressing member 31 so that its circumference is the shortest. Therefore, in the connection portion 51a, it is possible to prevent the electrical connection between the member to be connected and the wiring from being spoiled, the occurrence of connection peeling and the disconnection, or the prevention of the disconnection at the branch portion or the direction changing portion of the wiring. it can.
　伸縮方向と直交する方向における柔軟性があまり必要でない場合などは、図４５ａ～ｃおよび図４６に示す様に、伸縮方向と直交する方向に分離した複数の第１伸縮抑制部材３１が第２伸縮抑制部材３２によって相互に接続されるような伸縮抑制部材３０の平面視形状としても良い。図４５ａ～ｃおよび図４６においては、伸縮抑制部材３０は配線基板１０の伸縮方向において分離していないのみならず、伸縮方向と直交する方向においても分離していない。すなわち伸縮抑制部材３０は各部がすべて相互に連結され（分離した部分はなく）一体となっている。
　この形態においては、伸縮抑制部材３０は一体となっているため、伸縮抑制領域の内部における基材２０の伸縮をより確実に抑制することができ、接続剥がれや断線の発生をより確実に抑制することができる。 When the flexibility in the direction orthogonal to the expansion/contraction direction is not required so much, as shown in FIGS. 45a to 45c and FIG. The expansion suppressing member 30 may be connected to each other by the suppressing member 32 in a plan view shape. 45a to c and FIG. 46, the expansion/contraction suppressing member 30 is not separated not only in the expansion/contraction direction of the wiring board 10 but also in the direction orthogonal to the expansion/contraction direction. That is, all parts of the expansion-contraction suppressing member 30 are connected to each other (there are no separate parts) and are integrated.
In this mode, since the expansion/contraction suppressing member 30 is integrated, expansion/contraction of the base material 20 inside the expansion/contraction suppressing region can be suppressed more reliably, and the occurrence of connection peeling and disconnection can be suppressed more reliably. be able to.
　次に配線基板の好ましい一例として、被接続部材５１がフレキシブルプリント基板（ＦＰＣ）である場合の形態について図４７ａ～ｃを参照して説明する。図４７ａは平面図を示し、そのＥ－Ｅ断面を図４７ｂに、Ｆ－Ｆ断面を図４７ｃに示す。図４７ｂに示す様に、配線基板の上面側（基材２０の第１面２１側）にフレキシブルプリント基板６０が接続されている。フレキシブルプリント基板６０は、ＦＰＣ配線６２が表裏からＦＰＣ絶縁層６１で挟み込まれている。ＦＰＣ配線６２は、配線基板の配線５２と電気的に接続される部分（いわゆる端子部）のみＦＰＣ絶縁層６１から露出しており、異方性導電フィルムなどからなる接続部５１ａと電気的に接続されている。 Next, as a preferable example of the wiring board, a case where the connected member 51 is a flexible printed circuit board (FPC) will be described with reference to FIGS. 47a to 47c. 47a shows a plan view, the EE section of which is shown in FIG. 47b and the FF section which is shown in FIG. 47c. As shown in FIG. 47b, the flexible printed circuit board 60 is connected to the upper surface side (the first surface 21 side of the base material 20) of the wiring board. In the flexible printed board 60, the FPC wiring 62 is sandwiched between the front and back sides by the FPC insulating layer 61. The FPC wiring 62 is exposed from the FPC insulating layer 61 only in a portion (so-called terminal portion) electrically connected to the wiring 52 of the wiring board, and is electrically connected to the connection portion 51a made of an anisotropic conductive film or the like. Has been done.
　該好ましい一例における配線基板の伸縮方向（第１方向Ｄ１）と、配線５２が延びる方向とは同じである。図４７ａに示す通り、該好ましい一例において、伸縮抑制部材３０は平面視上コの字形状となっており、第１方向Ｄ１に相互に分離していない。そのため上述の様に、被接続部材５１すなわちフレキシブルプリント基板６０が伸縮し難い部材である場合のみならず仮に伸縮し易い部材である場合においても、伸縮抑制部材３０により伸縮抑制領域７０の内部は基材２０の伸縮が抑制される。そのため該好ましい一例においてはフレキシブルプリント基板６０が仮に伸縮し易い部材であったとしても接続剥がれや断線の発生を抑制すること、および配線基板２１０が伸縮性を有することの利点を発揮することを両立させることができ好ましい。 The expansion/contraction direction (first direction D1) of the wiring board in the preferable example and the direction in which the wiring 52 extends are the same. As shown in FIG. 47a, in the preferred example, the expansion-contraction suppressing member 30 has a U shape in plan view and is not separated from each other in the first direction D1. Therefore, as described above, not only when the connected member 51, that is, the flexible printed circuit board 60 is a member that is difficult to expand and contract, but also when it is a member that easily expands and contracts, the expansion and contraction suppressing member 30 causes the inside of the expansion and contraction suppressing region 70 to be a base. Expansion and contraction of the material 20 is suppressed. Therefore, in the preferable example, even if the flexible printed circuit board 60 is a member that easily expands and contracts, it is possible to suppress the occurrence of connection peeling and disconnection and to achieve the advantage of the wiring board 210 having elasticity. It is possible to make it preferable.
　また、上記好ましい一例において別途接着剤Ｂｏを有し、少なくとも伸縮抑制部材３０あるいは基材２０のいずれか一方と被接続部材５１とが接着剤Ｂｏにより接続されていてもよい。この場合には伸縮抑制部材３０は、基材２０の第１面２１に設けられた凹部、基材２０の内部、基材２０の第２面２２の表面上、基材２０の第２面２２に設けられた凹部のいずれかに設けることができる。
　また、上記好ましい一例において別途接着剤Ｂｏを有し、平面視上、配線５２や接続部５１ａと伸縮抑制部材３０とが重なっていても構わない。この場合においても伸縮抑制部材３０は、基材２０の第１面２１に設けられた凹部、基材２０の内部、基材２０の第２面２２の表面上、基材２０の第２面２２に設けられた凹部のいずれかに設けることができる。 Further, in the above preferred example, the adhesive Bo may be separately provided, and at least one of the expansion and contraction suppressing member 30 and the base member 20 and the connected member 51 may be connected by the adhesive Bo. In this case, the expansion and contraction suppressing member 30 includes the recess provided in the first surface 21 of the base material 20, the inside of the base material 20, the surface of the second surface 22 of the base material 20, and the second surface 22 of the base material 20. It can be provided in any of the recesses provided in the.
In addition, in the preferred example described above, the adhesive Bo may be separately provided, and the wiring 52 or the connection portion 51a and the expansion suppressing member 30 may overlap each other in a plan view. Also in this case, the expansion/contraction suppressing member 30 includes the recess provided in the first surface 21 of the base material 20, the inside of the base material 20, the surface of the second surface 22 of the base material 20, and the second surface 22 of the base material 20. It can be provided in any of the recesses provided in the.
　（第２実施形態の変形例）
　次に上記第２実施形態の変形例について図２６ａ～ｃを用いて説明する。
　図２６ａ～ｃに示す通り、第１伸縮抑制部材１３１（伸縮抑制部材１３０）は、基材２０を貫通して配置されていても構わない。貫通して配置されることにより、基材２０に対し第１伸縮抑制部材１３１をより強固に配置することができる。図２６ａ～ｃの例示では図２６ｃに示す通り、貫通して配置される第１伸縮抑制部材１３１は、基材２０の第２面２２付近部分がそれより第１面２１側の部分より太く形成されており、貫通部分が第１面２１側（図２６ｃにおける上方向）に抜けて基材２０から第１伸縮抑制部材１３１が分離してしまうことを予防している。すなわち図２６ａ～ｃに例示の形態においては、第１伸縮抑制部材１３１は基材２０に対しより強固に配置されている。この貫通形態においても、接続部５１ａにおいて被接続部材５１と配線５２との電気的な接続が損なわれる、接続剥がれや断線が発生することを抑制できるという上記効果を得ることができる。また、伸縮抑制領域７２のうち、第１伸縮抑制部材２３１と重ならない領域に、配線の分岐部５２ｂあるいは配線の方向転換部５２ｈが設けられている場合においては、該分岐部５２ｂあるいは方向転換部５２ｈにおける断線を抑制することができる。 (Modification of the second embodiment)
Next, a modified example of the second embodiment will be described with reference to FIGS.
As shown in FIGS. 26 a to 26 c, the first expansion/contraction suppressing member 131 (expansion/contraction suppressing member 130) may be disposed so as to penetrate the base material 20. By being arranged so as to penetrate, the first expansion-contraction suppressing member 131 can be arranged more firmly with respect to the base material 20. In the example of FIGS. 26a to 26c, as shown in FIG. 26c, in the first expansion-contraction suppressing member 131 that is arranged so as to penetrate therethrough, the portion near the second surface 22 of the base material 20 is formed thicker than the portion on the first surface 21 side. Therefore, it is prevented that the penetrating portion is pulled out to the first surface 21 side (upward in FIG. 26c) and the first expansion-contraction suppressing member 131 is separated from the base material 20. That is, in the embodiment illustrated in FIGS. 26 a to 26 c, the first expansion/contraction suppressing member 131 is more firmly arranged with respect to the base material 20. Even in this penetrating form, it is possible to obtain the above-described effect that it is possible to prevent the electrical connection between the connected member 51 and the wiring 52 in the connection portion 51a from being damaged, and the occurrence of connection peeling and disconnection. Further, in the case where the branch portion 52b of the wiring or the direction changing portion 52h of the wiring is provided in an area of the expansion/contraction suppressing area 72 which does not overlap with the first expansion/contraction suppressing member 231, the branch portion 52b or the direction changing portion 52h. It is possible to suppress disconnection at 52h.
　（第３実施形態の変形例）
　上記第３実施形態における第１伸縮抑制部材２３１の各形態においても、第１伸縮抑制部材２３１は、基材２０を貫通して配置されていても構わない。図１９ａ～ｃに示した形態において、第１伸縮抑制部材２３１が基材２０を貫通して配置された一例を図２７ａ～ｃに示す。貫通して配置することにより、基材２０に対し第１伸縮抑制部材２３１をより強固に配置することができる。図２７ａ～ｃの例示では図２７ｃに示す通り、貫通して配置される第１伸縮抑制部材２３１は、基材２０の第２面２２付近部分がそれより第１面２１側の部分より太く形成されており、貫通部分が第１面２１側（図２７ｃにおける上方向）に抜けて基材２０から第１伸縮抑制部材２３１が分離してしまうことを予防している。すなわち図２７ａ～ｃに例示の形態においては、第１伸縮抑制部材２３１は基材２０に対しより強固に配置されている。この貫通形態においても、接続部５１ａにおいて被接続部材５１と配線５２との電気的な接続が損なわれる、接続剥がれや断線が発生することを抑制できるという上記効果を得ることができる。また、伸縮抑制領域７２のうち、第１伸縮抑制部材２３１と重ならない領域に、配線の分岐部５２ｂあるいは配線の方向転換部５２ｈが設けられている場合においては、該分岐部５２ｂあるいは方向転換部５２ｈにおける断線を抑制することができる。 (Modification of Third Embodiment)
In each form of the first expansion/contraction suppressing member 231 according to the third embodiment, the first expansion/contraction suppressing member 231 may be disposed so as to penetrate the base material 20. An example in which the first expansion-contraction suppressing member 231 is arranged to penetrate the base material 20 in the form shown in FIGS. 19a to 19c is shown in FIGS. 27a to 27c. By arranging so as to penetrate, the first expansion-contraction suppressing member 231 can be arranged more firmly with respect to the base material 20. In the example illustrated in FIGS. 27a to 27c, as shown in FIG. 27c, the first expansion-contraction suppressing member 231 that is disposed so as to penetrate is formed such that the portion near the second surface 22 of the base material 20 is thicker than the portion on the first surface 21 side. Therefore, it is prevented that the penetrating portion is pulled out to the first surface 21 side (upward in FIG. 27c) and the first expansion suppressing member 231 is separated from the base material 20. That is, in the embodiment illustrated in FIGS. 27 a to 27 c, the first expansion/contraction suppressing member 231 is more firmly arranged with respect to the base material 20. Even in this penetrating form, it is possible to obtain the above-described effect that it is possible to prevent the electrical connection between the connected member 51 and the wiring 52 in the connection portion 51a from being damaged, and the occurrence of connection peeling and disconnection. Further, in the case where the branch portion 52b of the wiring or the direction changing portion 52h of the wiring is provided in an area of the expansion/contraction suppressing area 72 which does not overlap with the first expansion/contraction suppressing member 231, the branch portion 52b or the direction changing portion 52h. It is possible to suppress disconnection at 52h.
　上記第３実施形態の変形例において、第１伸縮抑制部材２３１が基材２０を貫通する形態は上記に限らず様々な形態が考えられる。図２８ａのＢ－Ｂ断面として図２８ｃに示す様に、第１伸縮抑制部材２３１が基材２０をかしめる様な形態で貫通していても良い。図２８ａ～ｃの形態おいては図２７ａ～ｃの形態に対し、第１伸縮抑制部材２３１を基材２０に更に強固に配置することができ、特に伸縮方向Ｄ１について一層強固に配置することができる。この形態においても第３実施形態に係る上記効果を得ることができる。 In the modified example of the third embodiment, the form in which the first expansion-contraction suppressing member 231 penetrates the base material 20 is not limited to the above, and various forms are possible. As shown in FIG. 28c as a BB cross section of FIG. 28a, the first expansion and contraction suppressing member 231 may penetrate in a form such that the base material 20 is caulked. In the configurations of FIGS. 28a to 28c, the first expansion suppressing member 231 can be more firmly arranged on the base material 20 than in the configurations of FIGS. 27a to 27c, and more particularly in the expansion and contraction direction D1. it can. Also in this mode, the above-described effects according to the third embodiment can be obtained.
　また、図２９ａのＢ－Ｂ断面として図２９ｃに示す様に、第１伸縮抑制部材２３１が基材２０を貫通するねじ留めにより基材２０に配置されていても良い。この形態ではねじ留めに用いられるねじ部材２３１ｎも第１伸縮抑制部材２３１の一部と考えることができる。この形態においては、基材２０に対し被接続部材５１をねじ留めにより容易に固定することができる。また接続部５１ａにおける、被接続部材５１の接続端子部との接続が好ましくは接着によらない単なる接触であれば、一度基材２０に対し固定された被接続部材５１についてねじを緩めることにより容易に取り外すことができる。複数の被接続部材５１について、その外形や接続端子部位置などを共通化しておけば、被接続部材５１を容易に交換することができる。被接続部材５１が電子部品などであれば、それが故障などで交換が必要となった場合、あるいは異なる機能を有する他の電子部品に交換するような場合には特に有用である。この形態においても第３実施形態に係る上記効果を得ることができる。 Further, as shown in FIG. 29c as a BB cross section of FIG. 29a, the first expansion and contraction suppressing member 231 may be arranged on the base material 20 by screwing through the base material 20. In this form, the screw member 231n used for screwing can also be considered as a part of the first expansion-contraction suppressing member 231. In this form, the connected member 51 can be easily fixed to the base material 20 by screwing. Further, if the connection of the connected member 51 to the connection terminal portion of the connected member 51 is preferably a simple contact, not by adhesion, it is easy to loosen the screw of the connected member 51 once fixed to the base material 20. It can be removed. If the outer shapes and the positions of the connection terminals are common to the plurality of connected members 51, the connected members 51 can be easily replaced. If the connected member 51 is an electronic component or the like, it is particularly useful when it needs to be replaced due to a failure or the like, or when it is replaced with another electronic component having a different function. Also in this mode, the above-described effects according to the third embodiment can be obtained.
　また、伸縮抑制部材２３０が、被接続部材５１を内包するケースの様な形態である場合について図３０ａ～ｃを参照して説明する。図３０ａは平面図を、図３０ａにおけるＡ－Ａ断面およびＢ－Ｂ断面をそれぞれ図３０ｂおよび図３０ｃに示す。
　図３０ａのＢ－Ｂ断面として図３０ｃに示す様に、伸縮抑制部材２３０が、基材２０の第１面２１側の上ケース２３０ｔと、第２面２２側の下ケース２３０ｂと、および第１面２１の法線方向すなわち基材２０を貫通する方向の側面ケース２３０ｓとからなる１つのケース２３０ｋの形態をなしている。この形態において被接続部材５１は１つのケース２３０ｋ内に包含されているようなイメージである。 Further, a case where the expansion and contraction suppressing member 230 has a form like a case that encloses the connected member 51 will be described with reference to FIGS. FIG. 30a is a plan view, and the AA cross section and the BB cross section in FIG. 30a are shown in FIGS. 30b and 30c, respectively.
As shown in FIG. 30c as a BB cross section of FIG. 30a, the expansion and contraction suppressing member 230 includes an upper case 230t on the first surface 21 side of the substrate 20, a lower case 230b on the second surface 22 side, and the first case. One case 230k is formed of a side surface case 230s in a direction normal to the surface 21, that is, in a direction of penetrating the base material 20. In this form, the connected member 51 is an image of being contained in one case 230k.
　ケース２３０ｋは全体として通常は伸縮し難いものであるため、上ケース２３０ｔ、下ケース２３０ｂ、および側面ケース２３０ｓはいずれも通常は伸縮し難い部材である。この形態例においては、第１伸縮抑制部材２３１に相当する側面ケース２３０ｓが相互に直接連結されていなかったとしても、それらは上ケース２３０ｔや下ケース２３０ｂを介して連結されている。そして上述の通り、上ケース２３０ｔや下ケース２３０ｂは通常伸縮し難いものである。従って基材２０を貫通する側面ケース２３０ｓを第１伸縮抑制部材２３１と、上ケース２３０ｔや下ケース２３０ｂを第２伸縮抑制部材２３２と見なすことができ、図３０の形態は第３実施形態の１形態ということができる。以上より、図３０ａ～ｃの形態においては、平面視上、側面ケース２３０ｓに外接し、かつ側面ケース２３０ｓをその周長が最短となるように囲う仮想の領域について伸縮抑制領域７２とすることができる。 Since the case 230k is generally difficult to expand and contract as a whole, the upper case 230t, the lower case 230b, and the side surface case 230s are all members that are usually difficult to expand and contract. In this embodiment, even if the side cases 230s corresponding to the first expansion/contraction suppressing member 231 are not directly connected to each other, they are connected via the upper case 230t and the lower case 230b. As described above, the upper case 230t and the lower case 230b are usually difficult to expand and contract. Therefore, the side case 230s penetrating the base material 20 can be regarded as the first expansion/contraction suppressing member 231, and the upper case 230t and the lower case 230b can be regarded as the second expansion/contraction suppressing member 232, and the form of FIG. 30 is the same as that of the third embodiment. It can be called a form. As described above, in the configurations of FIGS. 30a to 30c, the expansion-contraction suppressing region 72 may be a virtual region that circumscribes the side surface case 230s and surrounds the side surface case 230s so as to have the shortest perimeter in plan view. it can.
　図３０ａ～ｃの形態においても、図３０ａおよび図３０ｂに示す通り、平面視上配線５２の少なくとも一部は伸縮抑制領域７２のうち、第１伸縮抑制部材２３１と重ならない領域に存在している。そして配線５２の少なくとも一部が存在する伸縮抑制領域７２のうち、第１伸縮抑制部材２３１と重ならない領域は基材２０の伸縮が抑制されるため、接続部５１ａにおいて被接続部材５１と配線５２との相対位置が変化し難い。そのため接続部５１ａにおいて被接続部材５１と配線５２との電気的な接続が損なわれる、接続剥がれや断線が発生することを抑制できるという効果を得ることができる。また、伸縮抑制領域７２のうち、第１伸縮抑制部材２３１と重ならない領域に、配線の分岐部５２ｂあるいは配線の方向転換部５２ｈが設けられている場合においては、該分岐部５２ｂあるいは方向転換部５２ｈにおける断線を抑制することができる。 Also in the configurations of FIGS. 30a to 30c, as shown in FIGS. 30a and 30b, at least a part of the wiring 52 in plan view exists in a region of the expansion/contraction suppressing region 72 that does not overlap with the first expansion/contraction suppressing member 231. .. In the expansion/contraction suppressing region 72 in which at least a part of the wiring 52 exists, the expansion/contraction of the base material 20 is suppressed in the region that does not overlap with the first expansion/contraction suppressing member 231, so that the connection target member 51 and the wiring 52 are connected in the connecting portion 51a. It is difficult for the relative position to change. Therefore, it is possible to obtain an effect that it is possible to prevent the electrical connection between the connected member 51 and the wiring 52 in the connection portion 51a from being damaged, and the occurrence of connection peeling and disconnection. Further, in the case where the wiring branch portion 52b or the wiring direction changing portion 52h is provided in a region of the expansion/contraction suppressing region 72 that does not overlap with the first expansion/contraction suppressing member 231, the branch portion 52b or the direction changing portion 52h. It is possible to suppress disconnection at 52h.
　本形態においては上記の通り、被接続部材５１は１つのケース２３０ｋ内に包含されているようなイメージである。そのため電子部品などに代表される被接続部材５１をケースにより保護することができる。本開示に係る配線基板２１０は、好適には身体に対し適用することも想定されるため、ケース２３０ｋにより電子部品などの被接続部材５１が保護される本形態は好ましい実施形態の一つである。
　また通常、ケース２３０ｋは、側面ケース２３０ｓを介した上ケース２３０ｔと下ケース２３０ｂとの着脱が容易な様に設計されている。上ケース２３０ｔと下ケース２３０ｂとの着脱が容易であるため、基材２０に対し、側面ケース２３０ｓを介した上ケース２３０ｔと下ケース２３０ｂとの着脱が容易である。そして、例えば上ケース２３０ｔに包含されている被接続部材５１についても、基材２０に対し着脱が容易であるという利点もある。 In the present embodiment, as described above, the connected member 51 has an image of being contained in one case 230k. Therefore, the connected member 51 typified by electronic components can be protected by the case. Since the wiring board 210 according to the present disclosure is preferably applied to the body, the present embodiment in which the connected member 51 such as an electronic component is protected by the case 230k is one of the preferred embodiments. ..
Further, the case 230k is usually designed so that the upper case 230t and the lower case 230b can be easily attached and detached via the side case 230s. Since the upper case 230t and the lower case 230b can be easily attached and detached, the upper case 230t and the lower case 230b can be easily attached to and detached from the base material 20 through the side case 230s. Further, for example, the connected member 51 included in the upper case 230t also has an advantage that it can be easily attached to and detached from the base material 20.
　図３０ａ～ｃの形態においては、ケース２３０ｋは全体として通常は伸縮し難いものであるため、その場合にはケース２３０ｋ内に包含される被接続部材５１については伸縮し難い部材であることを要さない。
　反対に、被接続部材５１が伸縮し難い部材である場合には、仮にケース２３０ｋが全体として伸縮し難いものでない場合であっても、伸縮し難い部材である被接続部材５１が、例えば上ケース２３０ｔに固定されていることにより上ケース２３０ｔが伸縮し難い部材として機能することとなる。そのため上記、ケース２３０ｋが全体として伸縮し難いものである場合と同様の上記効果を得ることができる。 In the configurations of FIGS. 30a to 30c, the case 230k is generally difficult to expand and contract as a whole, and in that case, the connected member 51 included in the case 230k needs to be a material that is difficult to expand and contract. I don't.
On the contrary, in the case where the connected member 51 is a member that is difficult to expand and contract, even if the case 230k is not difficult to expand and contract as a whole, the connected member 51 that is a member that is difficult to expand and contract is, for example, the upper case. By being fixed to 230t, the upper case 230t functions as a member that is difficult to expand and contract. Therefore, the same effect as in the case where the case 230k is difficult to expand and contract as a whole can be obtained.
　第３実施形態の以上の説明に用いた各図（図１８ａ～図２１ｃ、図２７ａ～２９ｃ）においては、平面視上、第１伸縮抑制部材２３１は被接続部材５１から突出していた。しかしこれに限らず、第１伸縮抑制部材２３１が被接続部材５１から突出しておらず、第１伸縮抑制部材２３１のすべてが被接続部材５１と重なっていても良い。 In each of the drawings (FIGS. 18a to 21c and FIGS. 27a to 29c) used for the above description of the third embodiment, the first expansion-contraction suppressing member 231 is projected from the connected member 51 in plan view. However, the present invention is not limited to this, and the first expansion/contraction suppressing member 231 may not protrude from the connected member 51, and the entire first expansion/contraction suppressing member 231 may overlap the connected member 51.
　図２２ａおよび図２２ｃに示す形態は、第１伸縮抑制部材２３１が被接続部材５１から突出しておらず、第１伸縮抑制部材２３１のすべてが被接続部材５１と重なっており、また第１伸縮抑制部材２３１は基材２０を貫通していない形態である。 In the configurations shown in FIGS. 22a and 22c, the first expansion/contraction suppressing member 231 does not project from the connected member 51, all the first expansion/contraction suppressing members 231 overlap the connected member 51, and the first expansion/contraction suppressing The member 231 has a form that does not penetrate the base material 20.
　図２２ａ～ｃの形態において、第１伸縮抑制部材２３１が基材２０を貫通するものであっても構わない。第１伸縮抑制部材２３１が基材２０を貫通して配置された一例を図３１ａ～ｃに示す。貫通して配置することにより、基材２０に対し第１伸縮抑制部材２３１をより強固に配置することができる。図３１ａ～ｃの例示では図３１ｃに示す通り、貫通して配置される第１伸縮抑制部材２３１は、基材２０の第２面２２付近部分がそれより第１面２１側の部分より太く形成されており、貫通部分が第１面２１側（図３１ｃにおける上方向）に抜けて基材２０から第１伸縮抑制部材２３１が分離してしまうことを予防している。すなわち図３１ａ～ｃに例示の形態においては、第１伸縮抑制部材２３１は基材２０に対しより強固に配置されている。この貫通形態においても第３実施形態に係る上記効果を得ることができる。 22A to 22C, the first expansion/contraction suppressing member 231 may penetrate the base material 20. An example in which the first expansion-contraction suppressing member 231 is arranged so as to penetrate the base material 20 is shown in FIGS. 31a to 31c. By arranging it so as to penetrate therethrough, the first expansion/contraction suppressing member 231 can be arranged more firmly with respect to the base material 20. In the example of FIGS. 31a to 31c, as shown in FIG. 31c, the first expansion-contraction suppressing member 231 formed so as to penetrate therethrough is formed so that the portion near the second surface 22 of the base material 20 is thicker than the portion on the first surface 21 side. Therefore, it is prevented that the penetrating portion is pulled out to the first surface 21 side (upward in FIG. 31c) and the first expansion and contraction suppressing member 231 is separated from the base material 20. That is, in the embodiment illustrated in FIGS. 31 a to 31 c, the first expansion/contraction suppressing member 231 is more firmly arranged with respect to the base material 20. Even in this penetrating form, the above-described effects according to the third embodiment can be obtained.
　第１伸縮抑制部材２３１が基材２０を貫通する形態は図３１ａ～ｃの形態に限らず様々な形態が考えられる。図３２ａのＢ－Ｂ断面として図３２ｃに示す様に、第１伸縮抑制部材２３１が基材２０をかしめる様な形態で貫通していても良い。図３２ａ～ｃの形態おいては図２１ａ～ｃの形態に対し、第１伸縮抑制部材２３１を基材２０に更に強固に配置することができ、特に伸縮方向Ｄ１について一層強固に配置することができる。この形態においても第３実施形態に係る上記効果を得ることができる。 The form in which the first expansion and contraction suppressing member 231 penetrates the base material 20 is not limited to the form shown in FIGS. 31a to 31c, and various forms are conceivable. As shown in FIG. 32c as a BB cross section of FIG. 32a, the first expansion/contraction suppressing member 231 may penetrate in a form such that the base material 20 is caulked. In the configurations of FIGS. 32a to 32c, the first expansion-contraction suppressing member 231 can be more firmly arranged on the base material 20 than in the configurations of FIGS. 21a to 21c, and more particularly in the expansion and contraction direction D1. it can. Also in this mode, the above-described effects according to the third embodiment can be obtained.
　また、図３３ａのＢ－Ｂ断面として図３３ｃに示す様に、第１伸縮抑制部材２３１が基材２０を貫通するねじ留めにより基材２０に配置されていても良い。この形態では、ねじ留めに用いられるねじ部材２３１ｎも第１伸縮抑制部材２３１の一部と考えることができる。この形態においては、基材２０に対し被接続部材５１をねじ留めにより容易に固定することができる。また接続部５１ａにおける、被接続部材５１の接続端子部との接続が好ましくは接着によらない単なる接触であれば、一度基材２０に対し固定された被接続部材５１についてねじを緩めることにより容易に取り外すことができる。複数の被接続部材５１について、その外形や接続端子部位置などを共通化しておけば、被接続部材５１を容易に交換することができる。被接続部材５１が電子部品などであれば、それが故障などで交換が必要となった場合、あるいは異なる機能を有する他の電子部品に交換するような場合には特に有用である。この形態においても第３実施形態に係る上記効果を得ることができる。 Also, as shown in FIG. 33c as a BB cross section of FIG. 33a, the first expansion and contraction suppressing member 231 may be arranged on the base material 20 by screwing through the base material 20. In this form, the screw member 231n used for screwing can also be considered as a part of the first expansion-contraction suppressing member 231. In this form, the connected member 51 can be easily fixed to the base material 20 by screwing. Further, if the connection of the connected member 51 to the connection terminal portion of the connected member 51 is preferably a simple contact, not by adhesion, it is easy to loosen the screw of the connected member 51 once fixed to the base material 20. It can be removed. If the outer shapes and the positions of the connection terminals are common to the plurality of connected members 51, the connected members 51 can be easily replaced. If the connected member 51 is an electronic component or the like, it is particularly useful when it needs to be replaced due to a failure or the like, or when it is replaced with another electronic component having a different function. Also in this mode, the above-described effects according to the third embodiment can be obtained.
　図１８ａ～ｃにおいては、第１伸縮抑制部材２３１は平面視上、被接続部材５１の４隅付近を含む様に相互に独立して４箇所に配され、各形状は長方形として示されている。しかし第１伸縮抑制部材２３１の各形状は長方形である必要はなく正方形であっても良く、矩形である必要もないため、円（図４８）、楕円（図４９）、その他任意多角形、それらの角に丸みを帯びた図形、その他任意の閉図形であって良い。 18A to 18C, the first expansion and contraction suppressing members 231 are arranged at four positions independently of each other so as to include the vicinity of the four corners of the connected member 51 in plan view, and each shape is shown as a rectangle. .. However, each shape of the first expansion and contraction suppressing member 231 does not have to be a rectangle and may be a square, and need not be a rectangle. Therefore, a circle (FIG. 48), an ellipse (FIG. 49), any other polygon, It may be a figure with rounded corners or any other closed figure.
　上記の通り、被接続部材５１が伸縮し難い部材である場合には、伸縮抑制部材３０が第１方向Ｄ１すなわち配線基板１０の伸縮方向において分離している形態であっても伸縮抑制領域の内部は基材２０の伸縮が抑制されるため、接続剥がれや断線が発生を抑制することができる。すなわち伸縮抑制部材３０は、相互に接触していない少なくとも２つの領域に分離していてもよい。
　図１８ａ～ｃ等においては、伸縮抑制部材３０はいずれも、相互に接触していない４つの領域に分離している。しかしこれに限定されることなく、図５０に示す様に相互に接触していない８つの領域に分離していても良いし、図５１に示す様に相互に接触していない２つの領域に分離していても良いし、図示しないが２以上の自然数個の領域に分離していても良い。各伸縮抑制部材３０の平面視上の形状は任意であり、平面視上被接続部材５１から突出するか否かも各任意である。これらの形態であれば、接続剥がれや断線の発生を抑制すること、および配線基板１０が伸縮性を有することの利点を発揮することを両立させることができる。 As described above, when the connected member 51 is a member that is difficult to expand and contract, even if the expansion and contraction suppressing member 30 is separated in the first direction D1, that is, the expansion and contraction direction of the wiring board 10, the inside of the expansion and contraction suppressing region. Since the expansion and contraction of the base material 20 is suppressed, it is possible to suppress the occurrence of connection peeling and disconnection. That is, the expansion/contraction suppressing member 30 may be separated into at least two regions that are not in contact with each other.
In FIGS. 18a to 18c and the like, the expansion/contraction suppressing member 30 is divided into four regions that are not in contact with each other. However, the present invention is not limited to this, and may be separated into eight regions which are not in contact with each other as shown in FIG. 50, or may be separated into two regions which are not in contact with each other as shown in FIG. Alternatively, although not shown, it may be divided into two or more natural number regions. The shape of each expansion-contraction suppressing member 30 in plan view is arbitrary, and whether or not it projects from the connected member 51 in plan view is also arbitrary. With these forms, it is possible to both suppress the occurrence of connection peeling and disconnection, and exhibit the advantages of the wiring board 10 having elasticity.
　ところで図５１に示す形態においては、被接続部材５１が基材２０の様に伸縮し易い部材であってもよい。第１方向Ｄ１すなわち配線基板１０の伸縮方向においては伸縮抑制部材３０が分離していないため、被接続部材５１が伸縮し易い部材であったとしても、伸縮抑制部材３０により伸縮抑制領域の内部は基材２０の伸縮が抑制されるからである。そのため本形態においては、被接続部材５１が伸縮し易い部材であっても接続剥がれや断線の発生を抑制することができる。また本形態の他の一例としては図５２に示す形態であっても良い。この形態においても伸縮抑制部材３０は第１方向Ｄ１において分離していないため、図５１に示す形態と同様な効果をより確実に得ることができる。 Incidentally, in the form shown in FIG. 51, the connected member 51 may be a member that easily expands and contracts like the base material 20. Since the expansion/contraction suppressing member 30 is not separated in the first direction D1, that is, the expansion/contraction direction of the wiring board 10, even if the connected member 51 is a member that easily expands/contracts, the expansion/contraction suppressing member 30 causes the inside of the expansion/contraction suppressing region to be small. This is because the expansion and contraction of the base material 20 is suppressed. Therefore, in the present embodiment, even if the connected member 51 is a member that easily expands and contracts, it is possible to suppress the occurrence of connection peeling and disconnection. Further, as another example of the present embodiment, the form shown in FIG. 52 may be adopted. Also in this form, the expansion/contraction suppressing member 30 is not separated in the first direction D1, so that the same effect as that of the form shown in FIG. 51 can be obtained more reliably.
　被接続部材５１が伸縮し易い部材である場合における図５１および図５２に示す形態においては、平面視上第１方向Ｄ１すなわち配線基板１０の伸縮方向と直交する方向（図５１、図５２における上下方向）において、複数の伸縮抑制部材３０は相互に分離している。そのため伸縮方向と直交する方向においては、伸縮を抑制する効果は期待できない。しかし、伸縮方向と直交する方向については、配線基板１０として伸縮性を有する必要はなく、伸縮抑制部材３０が存在しないため柔軟性が期待でき、配線基板１０を人の身体の一部に取り付けるような用途などにおいては好ましい場合もある。 51 and 52 in the case where the connected member 51 is a member that easily expands and contracts, in the plan view, the first direction D1, that is, the direction orthogonal to the expansion and contraction direction of the wiring board 10 (up and down in FIGS. 51 and 52). Direction), the plurality of expansion-contraction members 30 are separated from each other. Therefore, the effect of suppressing expansion and contraction cannot be expected in the direction orthogonal to the expansion and contraction direction. However, in the direction orthogonal to the expansion/contraction direction, it is not necessary for the wiring board 10 to have elasticity, and since there is no expansion/contraction suppressing member 30, flexibility can be expected, and the wiring board 10 may be attached to a part of the human body. It may be preferable in various applications.
　上記図５１、および図５２に示す形態において、伸縮方向と直交する方向における柔軟性があまり必要でない場合などは、図４５ａ～ｃおよび図４６に示す様に、伸縮方向と直交する方向に分離した複数の伸縮抑制部材３０が相互に接続されるような伸縮抑制部材３０の平面視形状としても良い。図４５ａ～ｃおよび図４６においては、伸縮抑制部材３０は配線基板１０の伸縮方向において分離していないのみならず、伸縮方向と直交する方向においても分離していない。すなわち伸縮抑制部材３０はすべて相互に連結され（分離した部分はなく）一体となっている。
　この形態においては、伸縮抑制部材３０は一体となっているため、伸縮抑制領域の内部における基材２０の伸縮をより確実に抑制することができ、接続剥がれや断線の発生をより確実に抑制することができる。 In the configurations shown in FIGS. 51 and 52 described above, when flexibility in a direction orthogonal to the expansion/contraction direction is not required so much, as shown in FIGS. 45a to 45c and FIG. 46, separation is performed in a direction orthogonal to the expansion/contraction direction. The expansion suppressing member 30 may have a plan view shape in which a plurality of expansion suppressing members 30 are connected to each other. 45a to c and FIG. 46, the expansion/contraction suppressing member 30 is not separated not only in the expansion/contraction direction of the wiring board 10 but also in the direction orthogonal to the expansion/contraction direction. That is, the expansion-contraction members 30 are all connected to each other (there are no separate parts) and are integrated.
In this mode, since the expansion/contraction suppressing member 30 is integrated, expansion/contraction of the base material 20 inside the expansion/contraction suppressing region can be suppressed more reliably, and the occurrence of connection peeling and disconnection can be suppressed more reliably. be able to.
　図１８ａ～ｃ等の各図において、相互に接触していない少なくとも２つの領域に分離している伸縮抑制部材３０において、配線５２は、隣り合う伸縮抑制部材３０の間を通っている。換言すれば、伸縮抑制領域の内外を画定する仮想の閉図形と配線５２とが交差している。そのため、基材２０が伸縮自在である伸縮抑制領域の外部の配線５２が、伸縮抑制領域の内外を画定する仮想の閉図形と交差して、伸縮抑制領域の内部にまで延在することができ、配線５２と被接続部材５１とを接続する接続部５１ａを伸縮抑制領域の内部とすることができる。そのため接続部５１ａにおいて被接続部材と配線との電気的な接続が損なわれる、接続剥がれや断線の発生を抑制することができる。 In each of FIGS. 18a to 18c and the like, in the expansion/contraction suppressing member 30 separated into at least two regions that are not in contact with each other, the wiring 52 passes between the adjacent expansion/contraction suppressing members 30. In other words, the virtual closed figure defining the inside and outside of the expansion/contraction suppressing region intersects with the wiring 52. Therefore, the wiring 52 outside the expansion/contraction suppressing region in which the base material 20 is expandable/contractible can extend to the inside of the expansion/contraction suppressing region, intersecting with the virtual closed figure defining the inside and outside of the expansion/contraction suppressing region. The connection portion 51a that connects the wiring 52 and the connected member 51 can be inside the expansion and contraction suppressing region. Therefore, in the connection portion 51a, it is possible to prevent the electrical connection between the connected member and the wiring from being impaired, and the occurrence of connection peeling and disconnection.
　図１８ａ～ｃ等の各図において、相互に接触していない少なくとも２つの領域に分離している各伸縮抑制部材３０は、配線５２の延びる方向すなわち第１方向Ｄ１に隣り合っている。図１８ａ～ｃ等は、被接続部材５１が伸縮し難い部材である場合の形態であるため、配線５２の延びる方向（第１方向Ｄ１）に隣り合っている各伸縮抑制部材３０は相互の相対位置の変化が抑制され、すなわち伸縮抑制領域を良好に確保することができる。そのため接続部５１ａにおいて被接続部材と配線との電気的な接続が損なわれる、接続剥がれや断線の発生を抑制することができる。
　さらに、被接続部材５１が伸縮し難いが曲げに対する柔軟性がある部材である場合においては、図５１および図５２に示す形態すなわち第１方向Ｄ１すなわち配線基板１０の伸縮方向においては伸縮抑制部材３０が分離していない形態に比べ、高い柔軟性を持つことができる。 In each of FIGS. 18A to 18C and the like, the expansion and contraction suppressing members 30 separated into at least two regions that are not in contact with each other are adjacent to each other in the extending direction of the wiring 52, that is, the first direction D1. 18A to 18C and the like are configurations in which the connected member 51 is a member that is difficult to expand and contract, and therefore, the expansion and contraction suppressing members 30 that are adjacent to each other in the extending direction of the wiring 52 (first direction D1) are relative to each other. The change in position is suppressed, that is, the expansion/contraction suppressing region can be satisfactorily secured. Therefore, in the connection portion 51a, it is possible to prevent the electrical connection between the member to be connected and the wiring from being impaired, and the occurrence of connection peeling and disconnection.
Further, in the case where the connected member 51 is a member that is hard to expand and contract but has flexibility against bending, the expansion and contraction suppressing member 30 in the configuration shown in FIGS. 51 and 52, that is, the first direction D1, that is, the expansion and contraction direction of the wiring board 10. It has higher flexibility than the non-separated form.
　図５１、図５２の各図においては、平面視における伸縮抑制部材３０の形状は、配線５２の延びる方向（第１方向Ｄ１）に直交する方向の長さより、配線５２の延びる方向に平行な方向の長さの方が長いものとなっている。すなわち図５１、図５２の様に伸縮抑制部材３０の形状が長方形、あるいはその角が丸みを帯びたものである場合には、その長辺が配線５２の延びる方向と平行になっている。また図４９の様に矩形状ではないために長辺、短辺を観念し難い場合には、伸縮抑制部材３０に外接し、かつ配線５２の延びる方向と平行な辺を持つ長方形を仮想し、その仮想の長方形において、長辺が配線５２の延びる方向と平行になっている。 In each of FIGS. 51 and 52, the shape of the expansion-contraction suppressing member 30 in a plan view is a direction parallel to the extending direction of the wiring 52 rather than a length in a direction orthogonal to the extending direction (first direction D1) of the wiring 52. The length of is longer. That is, when the expansion/contraction suppressing member 30 has a rectangular shape or a rounded corner as shown in FIGS. 51 and 52, its long side is parallel to the extending direction of the wiring 52. When it is difficult to think of the long side and the short side because they are not rectangular as shown in FIG. 49, a rectangle having a side circumscribing the expansion and contraction suppressing member 30 and parallel to the extending direction of the wiring 52 is assumed, In the imaginary rectangle, the long side is parallel to the extending direction of the wiring 52.
　この形態においては、特に被接続部材５１が伸縮し易い部材である場合であってもて適用可能な図５１、図５２に示す形態においては、配線５２の延びる方向（第１方向Ｄ１）について基材２０の伸縮を効果的に抑制することができ、すなわち伸縮抑制領域を良好に確保することができる。そのため接続部５１ａにおいて被接続部材と配線との電気的な接続が損なわれる、接続剥がれや断線の発生を抑制することができる。 In this configuration, particularly in the configuration shown in FIGS. 51 and 52, which is applicable even when the connected member 51 is a member that easily expands and contracts, in the direction in which the wiring 52 extends (first direction D1) The expansion and contraction of the material 20 can be effectively suppressed, that is, the expansion and contraction suppression region can be satisfactorily secured. Therefore, in the connection portion 51a, it is possible to prevent the electrical connection between the connected member and the wiring from being impaired, and the occurrence of connection peeling and disconnection.
　（配線基板の好ましい形態の一例）
　次に本開示に係る配線基板の好ましい形態の一例として、伸縮抑制部材２３０がケース２３０ｋであり、被接続部材５１が電子部品５１ｄである場合の形態について図３４ａ～ｃを参照して説明する。ケース２３０ｋは、基材２０の第１面２１側の上ケース２３０ｔと、第２面２２側の下ケース２３０ｂと、および第１面２１の法線方向すなわち基材２０を貫通する方向の側面ケース２３０ｓとからなっている。図３４ａは平面図を示し、そのＥ－Ｅ断面を図３４ｂに、Ｆ－Ｆ断面を図３４ｃに示す。図３４ｂに示す様に、配線基板４１０の上面側（基材２０の第１面２１側）に電子部品５１ｄが格納された上ケース２３０ｔが設けられている。上ケース２３０ｔの下面側（配線基板４１０と対向する側）の接続部５１ａと対向する部分には、上ケース２３０ｔを貫通する導電材料が設けられ、接続部５１ａと電子部品５１ｄとを電気的に接続している。 (Example of preferable form of wiring board)
Next, as an example of a preferred form of the wiring board according to the present disclosure, a form in which the expansion and contraction suppressing member 230 is the case 230k and the connected member 51 is the electronic component 51d will be described with reference to FIGS. 34a to 34c. The case 230k is an upper case 230t on the first surface 21 side of the base material 20, a lower case 230b on the second surface 22 side, and a side surface case in a direction normal to the first surface 21, that is, a direction penetrating the base material 20. It consists of 230s. 34a shows a plan view, the EE section of which is shown in FIG. 34b and the FF section which is shown in FIG. 34c. As shown in FIG. 34b, an upper case 230t in which the electronic component 51d is stored is provided on the upper surface side (the first surface 21 side of the base material 20) of the wiring board 410. A conductive material penetrating the upper case 230t is provided in a portion of the lower surface of the upper case 230t that faces the connection portion 51a on the lower surface side (the side that faces the wiring substrate 410), and electrically connects the connection portion 51a and the electronic component 51d. Connected.
　図３４ｂ、および図３４ｃに示す様に、ケース２３０ｋの側面を構成する側面ケース２３０ｓは、その一部が基材２０を貫通してケース２３０ｋの下面を構成する下ケース２３０ｂと接続される。上ケース２３０ｔと側面ケース２３０ｓとは着脱可能な機構および寸法で設計されており、着脱時以外は両者は固定されている。また下ケース２３０ｂと側面ケース２３０ｓとは固定されているものとする。上ケース２３０ｔ、下ケース２３０ｂ、および側面ケース２３０ｓはいずれも伸縮し難い部材で形成されている。そのため配線基板４１０が伸縮方向Ｄ１に伸縮したとしても、上ケース２３０ｔ、および下ケース２３０ｂにより固定された側面ケース２３０ｓは、上ケース２３０ｔ、および下ケース２３０ｂに対し変位しない。そのため基材２０を貫通する側面ケース２３０ｓは配線基板４１０の伸縮を抑制する機能を発揮し、すなわちケース２３０ｋは全体として伸縮抑制部材２３０として機能している。この例においては、側面ケース２３０ｓを第１伸縮抑制部材２３１と、上ケース２３０ｔや下ケース２３０ｂを第２伸縮抑制部材２３２と見なすことができる。 As shown in FIGS. 34b and 34c, the side case 230s forming the side surface of the case 230k is partially connected to the lower case 230b forming the lower surface of the case 230k by penetrating the base material 20. The upper case 230t and the side case 230s are designed with a detachable mechanism and dimensions, and both are fixed except when detaching. Further, the lower case 230b and the side case 230s are fixed. The upper case 230t, the lower case 230b, and the side case 230s are all formed of members that are difficult to expand and contract. Therefore, even if the wiring board 410 expands and contracts in the expansion/contraction direction D1, the side case 230s fixed by the upper case 230t and the lower case 230b does not displace with respect to the upper case 230t and the lower case 230b. Therefore, the side case 230s penetrating the base material 20 exerts a function of suppressing expansion and contraction of the wiring board 410, that is, the case 230k functions as the expansion and contraction suppressing member 230 as a whole. In this example, the side case 230s can be regarded as the first expansion/contraction suppressing member 231, and the upper case 230t and the lower case 230b can be regarded as the second expansion/contraction suppressing member 232.
　図３４ａに示す様に、平面視上、４箇所の部分からなる側面ケース２３０ｓは各Ｌ字型であり、上ケース２３０ｔの４隅に各外接する様に設けられている。そして４箇所の部分からなる側面ケース２３０ｓに外接し、かつ該４箇所の側面ケース２３０ｓをその周長が最短となるように囲う仮想の領域である伸縮抑制領域７２は図示の通りとなる。そして６本の配線５２少なくとも一部はいずれも伸縮抑制領域７２のうち、第１伸縮抑制部材２３１すなわち側面ケース２３０ｓと重ならない領域に存在している。伸縮抑制領域７２のうち、第１伸縮抑制部材２３１と重ならない領域は基材２０の伸縮が抑制されるため、接続部５１ａにおいて被接続部材５１と配線５２との相対位置が変化し難い。そのため接続部５１ａにおいて被接続部材５１と配線５２との電気的な接続が損なわれる、接続剥がれや断線が発生することを抑制できるという効果を得ることができる。 As shown in FIG. 34a, the side case 230s composed of four parts in plan view is each L-shaped, and is provided so as to circumscribe each of the four corners of the upper case 230t. The expansion-contraction region 72, which is an imaginary region circumscribing the side surface case 230s composed of four portions and surrounding the four side surface cases 230s so as to have the shortest perimeter, is as illustrated. At least some of the six wires 52 are present in the expansion/contraction suppressing region 72 in a region that does not overlap the first expansion/contraction suppressing member 231 or the side case 230s. In the expansion/contraction suppressing region 72, the region that does not overlap with the first expansion/contraction suppressing member 231 suppresses the expansion/contraction of the base material 20, so that the relative position between the connected member 51 and the wiring 52 is unlikely to change in the connecting portion 51a. Therefore, it is possible to obtain an effect that it is possible to prevent the electrical connection between the connected member 51 and the wiring 52 in the connection portion 51a from being damaged, and the occurrence of connection peeling and disconnection.
　本好ましい形態の一例においては、電子部品５１ｄはケース２３０ｋ内に格納されているため電子部品５１ｄをケース２３０ｋにより保護することができる。そのため本好ましい形態の一例に係る配線基板４１０は、好適には身体に対し適用することができる。身体に適用した場合においては、外部との接触や、汚れ、雨などから電子部品５１ｄ保護することができる。
　また、電子部品５１ｄを格納した上ケース２３０ｔと、側面ケース２３０ｓとは着脱可能である。そのため例えば、電子部品５１ｄが故障した際に同機能の電子部品５１ｄに交換する際や、異なる機能を得るために異なる機能を有する電子部品５１ｄに交換する際などは、電子部品５１ｄを格納したケース２３０ｋごと容易に交換することができる。 In the example of the present preferred embodiment, the electronic component 51d is stored in the case 230k, so that the electronic component 51d can be protected by the case 230k. Therefore, the wiring board 410 according to an example of the present preferred embodiment can be preferably applied to the body. When applied to the body, the electronic component 51d can be protected from external contact, dirt, rain, and the like.
Further, the upper case 230t storing the electronic component 51d and the side case 230s are detachable. Therefore, for example, when the electronic component 51d is replaced with an electronic component 51d having the same function when the electronic component 51d fails, or when the electronic component 51d having a different function to obtain a different function is replaced, the case where the electronic component 51d is stored It can be easily replaced every 230k.
　以上いくつかの実施形態およびそれらの変形形態などにより様々な形態を例示してきた。本開示の主要な形態は以上の通りある。しかしながら、上記各形態の考えを拡張するならば、伸縮抑制部材３０の近傍領域においては伸縮が抑制されていることを利用して、以下のような形態も考えられる。
　図４３に示した例においては、平面視において、第１方向（伸縮方向）Ｄ１と直交する方向に離間した、２つの伸縮抑制部材３０により挟まれた領域に、配線の分岐部５２ｂ、および方向転換部５２ｈが存在している例である。該第１方向（伸縮方向）Ｄ１と直交する方向に離間した、２つの伸縮抑制部材３０により挟まれた領域は、第１方向（伸縮方向）Ｄ１については伸縮が抑制されている。伸縮が抑制される程度は、伸縮抑制部材３０が離間して配置される方向と伸縮方向との関係に大きく依存することから、ここでは偏伸縮抑制領域とする。図４３の例においては、２つの伸縮抑制部材３０により挟まれた領域を偏伸縮抑制領域とすることができる。配線の分岐部５２ｂ、および方向転換部５２ｈは該偏伸縮抑制領域に存在するため、断線の発生を抑制できると考えられる。偏伸縮抑制領域においては、伸縮方向における中心に近い部分ほど伸縮が抑制される。そのため伸縮方向と直交する方向に離間し、伸縮方向には同位置にある同形状の２つの伸縮抑制部材３０による図４３の例においては、伸縮方向における伸縮抑制部材３０の中心付近に伸縮から保護される対象（配線の分岐部５２ｂ、および方向転換部５２ｈ）を配置することが好ましい。仮に２つの伸縮抑制部材３０が離間する方向と伸縮方向とが近ければ偏伸縮抑制領域は存在しないと考えられる。 Various forms have been illustrated by the several embodiments and their modifications. The main forms of the present disclosure are as described above. However, if the idea of each of the above-mentioned modes is expanded, the following modes can be considered by utilizing the fact that expansion and contraction are suppressed in the region near the expansion and contraction suppressing member 30.
In the example shown in FIG. 43, in a plan view, in a region sandwiched by two expansion/contraction suppressing members 30 separated in a direction orthogonal to the first direction (expansion/contraction direction) D1, the wiring branch portion 52b and the direction. This is an example in which the conversion unit 52h exists. The region sandwiched by the two expansion/contraction suppressing members 30 separated in the direction orthogonal to the first direction (expansion/contraction direction) D1 has expansion/contraction suppressed in the first direction (expansion/contraction direction) D1. The extent to which the expansion and contraction is suppressed depends largely on the relationship between the direction in which the expansion and contraction suppressing member 30 is arranged separately and the expansion and contraction direction, and is therefore defined as the partial expansion and contraction suppressing region here. In the example of FIG. 43, the region sandwiched between the two expansion/contraction suppressing members 30 can be the partial expansion/contraction suppressing region. Since the branch portion 52b and the direction changing portion 52h of the wiring are present in the uneven expansion and contraction suppressing region, it is considered that the occurrence of disconnection can be suppressed. In the non-uniform expansion and contraction region, expansion and contraction is suppressed in a portion closer to the center in the expansion and contraction direction. Therefore, in the example of FIG. 43, which is separated in the direction orthogonal to the expansion/contraction direction and has two expansion/contraction suppressing members 30 of the same shape located at the same position in the expansion/contraction direction, protection from expansion/contraction in the vicinity of the center of the expansion/contraction suppressing member 30 in the expansion/contraction direction. It is preferable to dispose the target (the wiring branch portion 52b and the direction changing portion 52h). If the direction in which the two expansion/contraction suppressing members 30 are separated is close to the expansion/contraction direction, it is considered that the partial expansion/contraction suppressing region does not exist.
　さらに拡張するならば、図４４に示す形態も考えられる。図４４の形態においては、伸縮方向に長い伸縮抑制部材３０が１つのみ存在している。この形態においても伸縮抑制部材３０に対し、伸縮方向と直交する方向における近傍領域においては伸縮が抑制されるため、やはり偏伸縮抑制領域を観念することができる。図４４の形態は該偏伸縮抑制領域に配線の分岐部５２ｂ、および方向転換部５２ｈが存在している例である。図４４の例においても、伸縮方向における伸縮抑制部材３０の中心付近に伸縮から保護される対象（配線の分岐部５２ｂ、および方向転換部５２ｈ）を配置することが好ましい。 If further expanded, the form shown in FIG. 44 is also conceivable. In the form of FIG. 44, only one expansion suppressing member 30 which is long in the expansion direction exists. Also in this form, since the expansion/contraction is suppressed in the vicinity region in the direction orthogonal to the expansion/contraction direction with respect to the expansion/contraction suppressing member 30, the uneven expansion/contraction suppressing region can also be considered. The form of FIG. 44 is an example in which a wiring branch portion 52b and a direction changing portion 52h are present in the uneven expansion and contraction region. Also in the example of FIG. 44, it is preferable to dispose the objects (branching portion 52b of the wiring and the direction changing portion 52h) protected from expansion and contraction near the center of the expansion and contraction suppressing member 30 in the expansion and contraction direction.
　配線基板の用途は、上述のデバイスや電子製品として、ヘルスケア分野、医療分野、介護分野、エレクトロニクス分野、スポーツ・フィットネス分野、美容分野、モビリティ分野、畜産・ペット分野、アミューズメント分野、ファッション・アパレル分野、セキュリティ分野、ミリタリー分野、流通分野、教育分野、建材・家具・装飾分野、環境エネルギー分野、農林水産分野、ロボット分野などを挙げることができる。例えば、人の腕などの身体の一部に取り付ける製品を、本実施形態による配線基板を用いて構成する。配線基板は伸張することができるので、例えば配線基板を伸長させた状態で身体に取り付けることにより、配線基板を身体の一部により密着させることができる。このため、良好な着用感を実現することができる。また、配線基板が伸張した場合に配線５２の抵抗値が低下することを抑制することができるので、配線基板の良好な電気特性を実現することができる。他にも配線基板は伸長することができるので、人などの生体に限らず曲面や立体形状に沿わせて設置や組込むことが可能である。 Wiring boards are used as the above-mentioned devices and electronic products in the healthcare field, medical field, nursing field, electronics field, sports/fitness field, beauty field, mobility field, livestock/pet field, amusement field, fashion/apparel field. , Security field, military field, distribution field, education field, building materials/furniture/decoration field, environmental energy field, agriculture, forestry and fisheries field, robot field, etc. For example, a product attached to a part of the body such as a human arm is configured using the wiring board according to the present embodiment. Since the wiring board can be stretched, the wiring board can be brought into closer contact with a part of the body by, for example, attaching the wiring board to the body in a stretched state. Therefore, a good wearing feeling can be realized. Further, it is possible to prevent the resistance value of the wiring 52 from being lowered when the wiring board is expanded, so that good electrical characteristics of the wiring board can be realized. In addition, since the wiring board can be extended, it can be installed or incorporated along a curved surface or a three-dimensional shape as well as a living body such as a person.
　それらのデバイスや製品の一例としては、バイタルセンサ、マスク、補聴器、歯ブラシ、絆創膏、湿布、コンタクトレンズ、義手、義足、義眼、カテーテル、ガーゼ、薬液パック、包帯、ディスポーザブル生体電極、おむつ、家電製品、スポーツウェア、リストバンド、はちまき、手袋、水着、サポーター、ボール、ラケット、薬液浸透美容マスク、電気刺激ダイエット用品、懐炉、自動車内装、シート、インパネ、ベビーカー、ドローン、車椅子、タイヤ、首輪、リード、ハプティクスデバイス、ランチョンマット、帽子、服、メガネ、靴、インソール、靴下、ストッキング、インナーウェア、マフラー、耳あて、鞄、アクセサリー、指輪、付け爪、時計、個人ＩＤ認識デバイス、ヘルメット、パッケージ、ＩＣタグ、ペットボトル、文具、書籍、カーペット、ソファ、寝具、照明、ドアノブ、花瓶、ベッド、マットレス、座布団、ワイヤレス給電アンテナ、電池、ビニールハウス、ロボットハンド、ロボット外装を挙げることができる。 Examples of such devices and products include vital sensors, masks, hearing aids, toothbrushes, adhesive plasters, compresses, contact lenses, artificial hands, artificial legs, artificial eyes, catheters, gauze, liquid medicine packs, bandages, disposable bioelectrodes, diapers, home appliances, Sportswear, wristbands, hamaki, gloves, swimwear, supporters, balls, rackets, beauty masks for chemical penetration, electrostimulation diet products, pocket furnaces, automobile interiors, seats, instrument panels, strollers, drones, wheelchairs, tires, collars, leads, haps. Tix device, place mat, hat, clothes, glasses, shoes, insoles, socks, stockings, innerwear, muffler, ear pads, bags, accessories, rings, artificial nails, watches, personal ID recognition devices, helmets, packages, IC tags , PET bottles, stationery, books, carpets, sofas, bedding, lighting, door knobs, vases, beds, mattresses, cushions, wireless power feeding antennas, batteries, vinyl houses, robot hands, robot exteriors.
　（配線基板の製造方法）
　以下、図３５ａ～ｄを参照して、配線基板１０の製造方法について説明する。なお図３５ａ～ｄは、図４ａのＡ－Ａ断面に相当する部分の模式断面図であり、図４ｂに相当する断面図である。
　まず、図３５ａに示すように、伸縮性を有する基材２０を準備する基材準備工程を実施する。続いて、図３５ｂに示すように、基材２０に引張応力Ｔを加えて基材２０を伸長させる伸長工程を実施する。続いて、引張応力Ｔによって伸長した状態の基材２０の第１面２１側に伸縮抑制部材３０を設け、さらに、図３５ｃに示すように、引張応力Ｔによって伸長した状態の基材２０の第１面２１側に、配線５２を設ける設置工程を実施する。 (Method of manufacturing wiring board)
Hereinafter, a method of manufacturing the wiring board 10 will be described with reference to FIGS. Note that FIGS. 35a to 35d are schematic cross-sectional views of a portion corresponding to the AA cross section of FIG. 4a and are cross-sectional views corresponding to FIG. 4b.
First, as shown in FIG. 35a, a base material preparing step of preparing a base material 20 having elasticity is performed. Subsequently, as shown in FIG. 35b, a stretching step of stretching the substrate 20 by applying tensile stress T to the substrate 20 is performed. Subsequently, the expansion and contraction suppressing member 30 is provided on the first surface 21 side of the base material 20 in the state of being stretched by the tensile stress T, and further, as shown in FIG. An installation process of providing the wiring 52 on the first surface 21 side is performed.
　その後、基材２０から引張応力Ｔを取り除く収縮工程を実施する。これにより、図３５ｄにおいて矢印ＬＴで示すように、基材２０が収縮し、基材２０に設けられている配線５２にも変形が生じる。また必要に応じ図３５ｃのように被接続部材５１を実装する工程を含んでいても良いが、被接続部材５１を実装する工程はこれに限らず収縮工程の後であってもよい場合もある。 After that, a shrinking process for removing the tensile stress T from the base material 20 is performed. As a result, as shown by the arrow LT in FIG. 35d, the base material 20 contracts, and the wiring 52 provided on the base material 20 is also deformed. If necessary, the step of mounting the connected member 51 as shown in FIG. 35c may be included, but the step of mounting the connected member 51 is not limited to this and may be performed after the contracting step. ..
　以上に説明した本実施形態においては、図４ａの平面図に示す通り、第１面２１の法線方向に沿って２０基材を見た場合に（平面視上）、配線５２の少なくとも一部は、伸縮抑制部材３０に外接し、かつ伸縮抑制部材３０をその周長が最短となるように囲う仮想の領域である伸縮抑制領域７０のうち、伸縮抑制部材３０と重ならない領域に存在している。そのため、配線５２と被接続部材５１とを接続する接続部５１ａを伸縮抑制領域７０のうち、伸縮抑制部材３０と重ならない領域に配置することができる。そのため接続部５１ａにおいて被接続部材と配線との電気的な接続が損なわれる、接続剥がれや断線の発生を抑制することができる。また、伸縮抑制領域７０のうち、伸縮抑制部材３０と重ならない領域に、配線の分岐部５２ｂあるいは配線の方向転換部５２ｈが設けられている場合においては、該分岐部５２ｂあるいは方向転換部５２ｈにおける断線を抑制することができる（図４０参照）。 In the present embodiment described above, as shown in the plan view of FIG. 4A, at least a part of the wiring 52 is seen when 20 base materials are viewed along the normal direction of the first surface 21 (in plan view). Exists in a region which does not overlap with the expansion/contraction suppressing member 30 in the expansion/contraction suppressing region 70 which is a virtual region which is circumscribed to the expansion/contraction suppressing member 30 and surrounds the expansion/contraction suppressing member 30 so that the circumference thereof is the shortest. There is. Therefore, the connection portion 51a that connects the wiring 52 and the connected member 51 can be arranged in the expansion/contraction suppressing region 70 in a region that does not overlap the expansion/contraction suppressing member 30. Therefore, in the connection portion 51a, it is possible to prevent the electrical connection between the connected member and the wiring from being impaired, and the occurrence of connection peeling and disconnection. Further, in the case where the wiring branch portion 52b or the wiring direction changing portion 52h is provided in an area of the expansion and contraction suppressing area 70 that does not overlap with the expansion and contraction suppressing member 30, the branch portion 52b or the direction changing portion 52h is provided. It is possible to suppress disconnection (see FIG. 40).
　（配線基板の製造方法の第１変形例）
　以下においては、配線基板１０の製造方法の第１変形例を図３６ａ～ｄを参照しつつ説明する。なお図３６ａ～ｄは、図２７ａのＡ－Ａ断面に相当する部分の模式断面図であり、図２７ｂに相当する断面図である。
　この変形例では、まず、図３６ａに示すように、伸縮性を有する基材２０を準備する基材準備工程を実施する。続いて、図３６ｂに示すように、基材２０に引張応力Ｔを加えて基材２０を伸長させる伸長工程を実施する。続いて、引張応力Ｔによって伸長した状態の基材２０の第１面２１側に、配線５２を設ける第１設置工程を実施する。 (First Modification of Wiring Board Manufacturing Method)
In the following, a first modified example of the method for manufacturing the wiring board 10 will be described with reference to FIGS. Note that FIGS. 36a to 36d are schematic cross-sectional views of a portion corresponding to the AA cross section of FIG. 27a and are cross-sectional views corresponding to FIG. 27b.
In this modification, first, as shown in FIG. 36a, a base material preparing step of preparing a base material 20 having elasticity is performed. Subsequently, as shown in FIG. 36b, an extension step of applying a tensile stress T to the base material 20 to extend the base material 20 is performed. Then, the 1st installation process which provides the wiring 52 on the 1st surface 21 side of the base material 20 in the state extended by the tensile stress T is implemented.
　その後、図３６ｃに示すように、基材２０から引張応力Ｔを取り除く収縮工程を実施する。これにより、矢印ＬＴに示すように基材２０が収縮し、基材２０に設けられている配線５２にも変形が生じる。その後、図３６ｄに示すように、引張応力Ｔを取り除いた状態の基材２０の第１面２１に、伸縮抑制部材３０を設ける第２設置工程を実施する。その後、必要に応じ図３６ｄのように被接続部材５１を実装する工程を含んでいても良い。このような工程で製造された配線基板１０では、伸縮抑制部材３０が、基材２０の第１面２１の山部５３が形成された領域に位置し得る。この製造方法においても、伸縮抑制部材３０を設けることにより伸縮抑制領域７０が画定される。 Thereafter, as shown in FIG. 36c, a shrinking step for removing the tensile stress T from the base material 20 is performed. As a result, the base material 20 contracts as shown by the arrow LT, and the wiring 52 provided on the base material 20 is also deformed. Then, as shown in FIG. 36d, a second installation step of providing the expansion and contraction suppressing member 30 on the first surface 21 of the base material 20 from which the tensile stress T has been removed is performed. Thereafter, a step of mounting the connected member 51 as shown in FIG. 36d may be included if necessary. In the wiring board 10 manufactured by such a process, the expansion/contraction suppressing member 30 can be located in the region of the first surface 21 of the base material 20 in which the mountain portion 53 is formed. Also in this manufacturing method, the expansion/contraction suppressing region 70 is defined by providing the expansion/contraction suppressing member 30.
　以上に説明した本実施形態においては、図２７ａの平面図に示す通り、第１面２１の法線方向に沿って２０基材を見た場合に（平面視上）、配線５２の少なくとも一部は、伸縮抑制部材３０に外接し、かつ伸縮抑制部材３０をその周長が最短となるように囲う仮想の領域である伸縮抑制領域７０のうち、伸縮抑制部材３０と重ならない領域に存在している。そのため、配線５２と被接続部材５１とを接続する接続部５１ａを伸縮抑制領域７０のうち、伸縮抑制部材３０と重ならない領域に配置することができる。そのため接続部５１ａにおいて被接続部材と配線との電気的な接続が損なわれる、接続剥がれや断線の発生を抑制することができる。また、伸縮抑制領域７０のうち、伸縮抑制部材３０と重ならない領域に、配線の分岐部５２ｂあるいは配線の方向転換部５２ｈが設けられている場合においては、該分岐部５２ｂあるいは方向転換部５２ｈにおける断線を抑制することができる。 In the present embodiment described above, as shown in the plan view of FIG. 27a, when 20 base materials are viewed along the normal direction of the first surface 21 (in plan view), at least a part of the wiring 52 is formed. Exists in a region which does not overlap with the expansion/contraction suppressing member 30 in the expansion/contraction suppressing region 70 which is a virtual region which is circumscribed to the expansion/contraction suppressing member 30 and surrounds the expansion/contraction suppressing member 30 so that the circumference thereof is the shortest. There is. Therefore, the connection portion 51a that connects the wiring 52 and the connected member 51 can be arranged in the expansion/contraction suppressing region 70 in a region that does not overlap the expansion/contraction suppressing member 30. Therefore, in the connection portion 51a, it is possible to prevent the electrical connection between the connected member and the wiring from being impaired, and the occurrence of connection peeling and disconnection. Further, in the case where the wiring branch portion 52b or the wiring direction changing portion 52h is provided in an area of the expansion and contraction suppressing area 70 that does not overlap with the expansion and contraction suppressing member 30, the branch portion 52b or the direction changing portion 52h is provided. It is possible to suppress disconnection.
　（配線基板の製造方法の第２変形例）
　以下においては、配線基板１０の製造方法の第２変形例を図３７ａ～ｃを参照しつつ説明する。なお図３７ａ～ｃは、図２４ａのＡ－Ａ断面に相当する部分の模式断面図である。
　この変形例ではまず、第１面２１及び第１面２１の反対側に位置する第２面２２を含み、第１面２１、第２面２２及び内部のうちの少なくともいずれかに伸縮抑制部材３０が設けられた、伸縮性を有する基材２０を準備する。図３７ａにおいては伸縮抑制部材３０は第１面２１に設けられている。次に図３７ｂに示すように、基材２０に引張応力Ｔを加えて基材２０を伸長させる伸長工程を実施する。続いて、伸長工程によって伸長した状態の基材２０の第１面２１側に、配線基板１０に搭載される被接続部材５１に接続される配線５２を設ける設置工程を実施する。 (Second Modification of Wiring Board Manufacturing Method)
In the following, a second modification of the method for manufacturing the wiring board 10 will be described with reference to FIGS. 37a to 37c. 37a to 37c are schematic cross-sectional views of a portion corresponding to the AA cross section of FIG. 24a.
In this modified example, first, the expansion and contraction suppressing member 30 includes the first surface 21 and the second surface 22 located on the opposite side of the first surface 21, and at least one of the first surface 21, the second surface 22 and the inside. An elastic base material 20 provided with is prepared. In FIG. 37 a, the expansion/contraction suppressing member 30 is provided on the first surface 21. Next, as shown in FIG. 37b, a stretching step of stretching the substrate 20 by applying tensile stress T to the substrate 20 is performed. Subsequently, an installation step is performed in which the wiring 52 connected to the connected member 51 mounted on the wiring board 10 is provided on the first surface 21 side of the base material 20 that has been expanded by the expansion step.
　その後、基材２０から引張応力Ｔを取り除く収縮工程を実施する。これにより、図３７ｃにおいて矢印ＬＴで示すように、基材２０が収縮し、基材２０に設けられている配線５２にも変形が生じる。なお図示しないが、必要に応じ設置工程以降に被接続部材５１を実装する工程を含んでいても良い。 After that, a shrinking process for removing the tensile stress T from the base material 20 is performed. As a result, as shown by the arrow LT in FIG. 37c, the base material 20 contracts, and the wiring 52 provided on the base material 20 is also deformed. Although not shown, a step of mounting the connected member 51 after the installation step may be included if necessary.
　以上に説明した本実施形態においては、図２４ａの平面図に示す通り、第１面２１の法線方向に沿って基材２０を見た場合に（平面視上）、配線５２の少なくとも一部は、伸縮抑制部材３０に外接し、かつ伸縮抑制部材３０をその周長が最短となるように囲う仮想の領域である伸縮抑制領域７０のうち、伸縮抑制部材３０と重ならない領域に存在している。そのため、配線５２と被接続部材５１とを接続する接続部５１ａを伸縮抑制領域７０のうち、伸縮抑制部材３０と重ならない領域に配置することができる。そのため接続部５１ａにおいて被接続部材と配線との電気的な接続が損なわれる、接続剥がれや断線の発生を抑制することができる。また、伸縮抑制領域７０のうち、伸縮抑制部材３０と重ならない領域に、配線の分岐部５２ｂあるいは配線の方向転換部５２ｈが設けられている場合においては、該分岐部５２ｂあるいは方向転換部５２ｈにおける断線を抑制することができる（図４０ａおよびｂ参照）。 In the present embodiment described above, as shown in the plan view of FIG. 24a, when the base material 20 is viewed along the normal direction of the first surface 21 (in plan view), at least a part of the wiring 52 is provided. Exists in a region which does not overlap with the expansion/contraction suppressing member 30 in the expansion/contraction suppressing region 70 which is a virtual region which is circumscribed to the expansion/contraction suppressing member 30 and surrounds the expansion/contraction suppressing member 30 so that the circumference thereof is the shortest. There is. Therefore, the connection portion 51a that connects the wiring 52 and the connected member 51 can be arranged in the expansion/contraction suppressing region 70 in a region that does not overlap the expansion/contraction suppressing member 30. Therefore, in the connection portion 51a, it is possible to prevent the electrical connection between the connected member and the wiring from being impaired, and the occurrence of connection peeling and disconnection. Further, in the case where the wiring branch portion 52b or the wiring direction changing portion 52h is provided in an area of the expansion and contraction suppressing area 70 that does not overlap with the expansion and contraction suppressing member 30, the branch portion 52b or the direction changing portion 52h is provided. It is possible to suppress disconnection (see FIGS. 40a and 40b).
　なお、上述した実施形態に対するいくつかの変形例を説明してきたが、当然に、複数の変形例を適宜組み合わせて適用することも可能である。また、上述の実施形態及び変形例では、基材２０及び配線５２が蛇腹形状部５７を有することで、伸縮可能になっている構成を説明した。しかしながら、伸縮抑制部材３０は、蛇腹形状を有さない伸縮性を有する基材に伸縮性の銀配線が設けられる伸縮性基板や、伸縮性を有する基材に平面視において図３８に示す様な馬蹄形の配線５２を形成した伸縮性基板においても適用されてもよい。これらのタイプの伸縮性基板に伸縮抑制部材３０を設けた場合にも、配線５２の少なくとも一部を伸縮抑制領域７０のうち、第１伸縮抑制部材３１と重ならない領域に配置することができる。そのため接続部５１ａにおいて被接続部材と配線との電気的な接続が損なわれる、接続剥がれや断線の発生を抑制することができる。また、伸縮抑制領域７０のうち、第１伸縮抑制部材３１と重ならない領域に、配線の分岐部５２ｂあるいは配線の方向転換部５２ｈが設けられている場合においては、該分岐部５２ｂあるいは方向転換部５２ｈにおける断線を抑制することができる。
　なお、蛇腹形状を有さない伸縮性を有する基材に伸縮性の銀配線が設けられる伸縮性基板や、伸縮性を有する基材に馬蹄形の配線を形成した伸縮性基板は、例えば、何ら伸長させない基材に、伸縮性の銀配線又は馬蹄形の配線を形成した後、部品及び伸縮抑制部材３０を設けることで作製されてもよいが、その製造方法は特に限られるものではない。 It should be noted that although some modified examples of the above-described embodiment have been described, it goes without saying that a plurality of modified examples can be appropriately combined and applied. In addition, in the above-described embodiment and modified examples, the configuration in which the base material 20 and the wiring 52 have the bellows-shaped portion 57 so that they can be expanded and contracted has been described. However, the expansion/contraction suppressing member 30 has a stretchable substrate in which a stretchable silver wiring is provided on a stretchable substrate having no bellows shape, or a stretchable substrate as shown in FIG. 38 in a plan view. It may also be applied to a stretchable substrate on which the horseshoe-shaped wiring 52 is formed. Even when the expansion suppressing member 30 is provided on these types of elastic substrates, at least a part of the wiring 52 can be arranged in the expansion suppressing region 70 in a region that does not overlap with the first expansion suppressing member 31. Therefore, in the connection portion 51a, it is possible to prevent the electrical connection between the member to be connected and the wiring from being impaired, and the occurrence of connection peeling and disconnection. Further, in the case where the wiring branch portion 52b or the wiring direction changing portion 52h is provided in a region of the expansion/contraction suppressing region 70 that does not overlap the first expansion/contraction suppressing member 31, the branch portion 52b or the direction changing portion 52h. It is possible to suppress disconnection at 52h.
A stretchable substrate in which stretchable silver wiring is provided on a stretchable base material that does not have a bellows shape, or a stretchable substrate in which horseshoe-shaped wiring is formed on a stretchable base material is, for example, stretched at all. It may be produced by forming stretchable silver wiring or horseshoe-shaped wiring on a base material that is not allowed to be formed, and then providing the component and the stretch suppressing member 30, but the manufacturing method is not particularly limited.
　また、上述した実施形態では、配線５２が第１方向Ｄ１に平行に延びる例を示したが、配線５２に、第１方向Ｄ１に平行に延びるものと、第１方向Ｄ１に交差する方向に延びるものとが含まれてもよい。そして、第１方向Ｄ１に交差する方向に延びる配線５２の少なくとも一部が、第１面２１の法線方向に沿って２０基材を見た場合に（平面視上）、伸縮抑制部材３０に外接し、かつ伸縮抑制部材３０をその周長が最短となるように囲う仮想の領域である伸縮抑制領域７０のうち、伸縮抑制部材３０と重ならない領域に設けられていてもよい。
＜実施例＞ Further, in the above-described embodiment, an example in which the wiring 52 extends parallel to the first direction D1 has been shown, but the wiring 52 extends parallel to the first direction D1 and the wiring 52 extends in a direction intersecting the first direction D1. Things may be included. Then, when at least a part of the wiring 52 extending in the direction intersecting with the first direction D1 sees the 20 base materials along the normal direction of the first surface 21 (in plan view), the expansion suppressing member 30 is It may be provided in a region that does not overlap with the expansion/contraction suppressing member 30 in the expansion/contraction suppressing region 70 that is a virtual region that is circumscribed and surrounds the expansion/contraction suppressing member 30 so that its circumferential length is the shortest.
<Example>
　次に、以上に説明した本開示（図１ａ～図３４ｃ）の一部を実施例により更に具体的に説明するが、本開示はその要旨を超えない限り、以下の実施例の記載に限定されるものではない。 Next, a part of the present disclosure (FIGS. 1a to 34c) described above will be described more specifically by way of examples, but the present disclosure is limited to the description of the following examples unless it exceeds the gist. Not something.
（実施例１）
　配線基板５１０として、図３９ａ～ｃに示すような、基材２０の第１面２１に配線５２、伸縮抑制部材３０（第１伸縮抑制部材３１、第２伸縮抑制部材３２）及び被接続部材５１が設けられたものを作製した。図３９ａは実施例に係る配線基板５１０を示す平面図であり、そのＡ－Ａに沿って切断した場合の断面図を図３９ｂに、Ｂ－Ｂに沿って切断した場合の断面図を図３９ｃに示す。配線５２、伸縮抑制部材３０及び被接続部材５１は、支持基板４０に設けられた状態で、接着層を介して基材２０に貼り合わせた。 (Example 1)
As the wiring board 510, the wiring 52, the expansion/contraction suppressing member 30 (the first expansion/contraction suppressing member 31, the second expansion/contraction suppressing member 32), and the connected member 51 on the first surface 21 of the base material 20 as shown in FIGS. Was prepared. 39a is a plan view showing a wiring substrate 510 according to an example, a cross-sectional view taken along the line AA of FIG. 39b, and a cross-sectional view taken along the line BB of FIG. 39c. Shown in. The wiring 52, the expansion/contraction suppressing member 30, and the connected member 51 were attached to the base material 20 via the adhesive layer while being provided on the support substrate 40.
　基材２０は、２液付加縮合のポリジメルシロキサン（以下、ＰＤＭＳと称する）を、厚さが１．５ｍｍとなるように硬化させて形成した。基材２０の弾性係数は、０．０５ＭＰａとした。支持基板４０を基材２０に貼り合わせるための接着層としては、粘着シート８１４６（３Ｍ社製）を用いた。 The base material 20 was formed by curing a two-component addition-condensation polydimersiloxane (hereinafter referred to as PDMS) so as to have a thickness of 1.5 mm. The elastic coefficient of the base material 20 was 0.05 MPa. A pressure-sensitive adhesive sheet 8146 (manufactured by 3M) was used as an adhesive layer for bonding the support substrate 40 to the base material 20.
　支持基板４０は、厚さ１μｍのＰＥＮ（ポリエチレンナフタレート）フィルムであり、弾性係数は、２．２ＧＰａとした。配線５２はＣｕであり、支持基板４０に蒸着法で成膜した後、フォトリソグラフィでパターニングして形成した。配線幅は、２００μｍとし、隣り合う配線の間の間隔は、４００μｍとした。また、配線５２の形成後、配線５２及び支持基板４０を一体的に覆う絶縁膜を形成した。なお、配線５２の被接続部材５１との接続部分は絶縁膜で覆わないようにした。絶縁膜は、熱硬化性絶縁樹脂をスクリーン印刷で配線５２及び支持基板４０上に印刷した後、加熱して硬化させることで形成した。絶縁膜の厚さは、配線５２上で５０μｍ程度となるように設定した。 The supporting substrate 40 is a PEN (polyethylene naphthalate) film having a thickness of 1 μm, and the elastic coefficient is set to 2.2 GPa. The wiring 52 is Cu, and is formed by forming a film on the supporting substrate 40 by a vapor deposition method and then patterning it by photolithography. The wiring width was 200 μm, and the interval between adjacent wirings was 400 μm. After forming the wiring 52, an insulating film that integrally covers the wiring 52 and the support substrate 40 was formed. The connecting portion of the wiring 52 with the connected member 51 was not covered with an insulating film. The insulating film was formed by printing a thermosetting insulating resin on the wiring 52 and the support substrate 40 by screen printing and then heating and curing the resin. The thickness of the insulating film was set to be about 50 μm on the wiring 52.
　配線５２と被接続部材５１とを接続するための接続部５１ａは、導電性接着剤（化研テック社製のＣＬ－３１６０）をスクリーン印刷にて配線５２の端部に形成した。そして、被接続部材５１は、接続部５１ａに半田付けした。また、伸縮抑制部材３０は、熱硬化性エポキシ樹脂をディスペンサで所定の位置に塗布して、熱硬化させることで形成した。伸縮抑制部材３０は平面視で、被接続部材５１の四隅において配線５２が延びる方向すなわち配線基板５１０の伸縮方向（第１方向Ｄ１）およびにそれに直交する方向にいずれについても、伸縮抑制部材３０が被接続部材５１から２ｍｍ突出するように形成した。 The connecting portion 51a for connecting the wiring 52 and the member 51 to be connected was formed on the end portion of the wiring 52 by screen printing a conductive adhesive (CL-3160 manufactured by Kaken Tech Co., Ltd.). Then, the connected member 51 was soldered to the connecting portion 51a. Further, the expansion-contraction suppressing member 30 was formed by applying a thermosetting epoxy resin at a predetermined position with a dispenser and thermosetting it. In the plan view, the expansion/contraction suppressing member 30 has the expansion/contraction suppressing member 30 in the four directions of the connected member 51 in which the wiring 52 extends, that is, in the expansion/contraction direction of the wiring substrate 510 (first direction D1) and in the direction orthogonal thereto. It was formed so as to project from the connected member 51 by 2 mm.
　そして、基材２０を第１方向Ｄ１に１．５倍、１軸伸長させた状態で、上述のように配線５２及び被接続部材５１等が支持された支持基板４０を基材２０に接着層を介して貼り合わせ、これにより、実施例に係る配線基板５１０を作製した。 Then, in a state in which the base material 20 is uniaxially stretched 1.5 times in the first direction D1, the support substrate 40 on which the wiring 52, the connected member 51 and the like are supported as described above is attached to the base material 20 by an adhesive layer. Then, the wiring board 510 according to the example was manufactured.
（評価）
　この実施例に係る配線基板５１０を、第１方向Ｄ１に１万回、１．３倍伸長させたが、配線５２は断線しなかった。なお、実施例に係る配線基板５１０において伸縮抑制部材３０を設けない比較例を製作し、第１方向Ｄ１に１万回、１．３倍伸長させた場合には、接続部５１ａにおいて接続剥がれが生じていた。この結果から、伸縮抑制部材３０の有用性、すなわち本実施例に係る配線基板５１０の有用性が確認された。 (Evaluation)
The wiring board 510 according to this example was expanded 10,000 times in the first direction D1 10,000 times, but the wiring 52 was not broken. In addition, when a comparative example in which the expansion and contraction suppressing member 30 is not provided in the wiring board 510 according to the embodiment is manufactured and is stretched 1.3 times in the first direction D1 10,000 times, the connection is peeled off at the connection portion 51a. It was happening. From this result, the usefulness of the expansion and contraction suppressing member 30, that is, the usefulness of the wiring board 510 according to the present embodiment was confirmed.
（実施例２）
　実施例２では、図５３に示すような伸縮抑制部材３０（第１伸縮抑制部材３１、第２伸縮抑制部材３２）が基材２０の内部に埋設された配線基板５１０－２を作製した。詳しくは、隣り合う第１伸縮抑制部材３１の互いに向き合う面の間の距離Ｗに対する、第１伸縮抑制部材３１の外周縁から第２伸縮抑制部材３２の外周縁までの第１方向Ｄ１又は平面視上でこれに直交する方向での距離Ｌを変化させた３種類の伸縮抑制部材３０を備える配線基板５１０－２を作製した。以下、３種類の配線基板５１０－２をそれぞれ、実施例２－１、実施例２－２、実施例２－３と呼ぶ。なお、説明の便宜上、図５３においては、伸縮抑制部材３０が実線で示されている。 (Example 2)
In Example 2, the wiring board 510-2 in which the expansion/contraction suppressing member 30 (first expansion/contraction suppressing member 31, second expansion/contraction suppressing member 32) as shown in FIG. 53 was embedded inside the base material 20 was produced. Specifically, the first direction D1 from the outer peripheral edge of the first expansion suppressing member 31 to the outer peripheral edge of the second expansion suppressing member 32 with respect to the distance W between the mutually facing surfaces of the first expansion suppressing members 31 adjacent to each other or in plan view. A wiring board 510-2 including the three types of expansion/contraction suppressing members 30 with the distance L changed in the direction orthogonal to the above was manufactured. Hereinafter, the three types of wiring boards 510-2 are referred to as Example 2-1, Example 2-2, and Example 2-3, respectively. Note that, for convenience of explanation, the expansion-contraction suppressing member 30 is shown by a solid line in FIG.
　各実施例では、伸縮抑制部材３０がポリイミドフィルム（宇部興産社製、ユーピレックス、厚さ１２５μｍのフィルム）から切り出された。そして、基材２０は、液状の２液付加縮合のポリジメチルシロキサン（ＰＤＭＳ－１、弾性率０．０２ＭＰａ）で伸縮抑制部材３０を埋設しつつ当該樹脂を硬化することで形成され、その厚さは１ｍｍである。
　距離Ｗは、各実施例で共通であり、１２ｍｍである。
　また、第１方向Ｄ１で隣り合う第１伸縮抑制部材３１の外側端部間距離Ｘは、１５．６ｍｍであり、平面視上で第１方向Ｄ１と直交する方向で隣り合う第１伸縮抑制部材３１の外側端部間距離Ｙは、１５．６ｍｍである。
　実施例２－１は、距離Ｌ／距離Ｗが、０．１５となるように形成された。
　実施例２－２は、距離Ｌ／距離Ｗが、０．２５となるように形成された。
　実施例２－３は、距離Ｌ／距離Ｗが、０．５０となるように形成された。 In each example, the expansion/contraction suppressing member 30 was cut out from a polyimide film (Ube Industries, Upilex, film having a thickness of 125 μm). The base material 20 is formed by curing the resin while burying the expansion and contraction suppressing member 30 with polydimethylsiloxane (PDMS-1, elastic modulus 0.02 MPa) of liquid two-liquid addition condensation, and its thickness. Is 1 mm.
The distance W is common to the respective examples and is 12 mm.
The distance X between the outer end portions of the first expansion/contraction suppressing members 31 adjacent to each other in the first direction D1 is 15.6 mm, and the first expansion/contraction suppressing members adjacent to each other in the direction orthogonal to the first direction D1 in plan view. The distance Y between the outer end portions of 31 is 15.6 mm.
Example 2-1 was formed such that the distance L/distance W was 0.15.
Example 2-2 was formed such that the distance L/distance W was 0.25.
Example 2-3 was formed such that the distance L/distance W was 0.50.
（評価）
　比較例として、距離Ｌが０となる矩形の伸縮抑制部材を備える配線基板が用意された。
　そして、伸縮抑制部材の平面視上の中心から第１方向Ｄ１に７０ｍｍおよび伸縮抑制部材の平面視上の中心から第１方向Ｄ１に直交する方向に７０ｍｍ、の範囲で規定される、各実施例および比較例のそれぞれの基材上の矩形領域（図５３のＡＲ）において、０．５ｍｍピッチの格子状の目盛りを付けた。
　そして、比較例を、第１方向Ｄ１および平面視上でこれに直交する方向の２軸方向で、１５０％伸長させ、基材上の目盛りの伸長後の位置を特定した。
　その後、各実施例を、比較例を伸長させた際の力と同じ力で伸長させ、各実施例の基材２０上の目盛りの伸長後の位置を特定した。そして、比較例の基材上の目盛りの伸長後の位置に対する、各実施例の基材２０上の目盛りの伸長後の位置の割合を求めることで、各実施例についての比較例に対する伸長率を特定した。なお、目盛りの伸長後の位置は、ニコン社製のＣＮＣ画像測定機“ＮＥＶＩＸ　ＶＭＲ－Ｈ３３０”を用いて特定した。 (Evaluation)
As a comparative example, a wiring board including a rectangular expansion/contraction suppressing member having a distance L of 0 was prepared.
And each Example prescribed|regulated in the range of 70 mm in the 1st direction D1 from the center of the expansion-contraction suppression member in planar view, and 70 mm in the direction orthogonal to the 1st direction D1 from the center of the expansion-contraction suppression member in planar view. In the rectangular area (AR in FIG. 53) on each of the base materials of Comparative Example and Comparative Example, a grid-like scale having a pitch of 0.5 mm was provided.
Then, the comparative example was elongated by 150% in the first direction D1 and in the biaxial directions perpendicular to the first direction D1 to identify the position of the scale on the base material after the expansion.
After that, each example was extended with the same force as when the comparative example was extended, and the position of the scale on the base material 20 of each example after extension was specified. Then, by obtaining the ratio of the position of the scale on the base material 20 of each example after the expansion to the position of the scale on the base material of the comparative example, the expansion rate for the comparative example for each example is obtained. Specified. The position of the scale after extension was specified using a CNC image measuring instrument “NEVIX VMR-H330” manufactured by Nikon Corporation.
　以下の表１は、各実施例についての比較例に対する伸長率を示している。 -Table 1 below shows the expansion rate for each example with respect to the comparative example.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　以上の実施例２では、第２伸縮抑制部材３２が第１伸縮抑制部材３１に対して大きく奥まって位置する程、伸縮抑制部材３０による基材２０の伸長抑制効果が高いことが確認された。 In Example 2 described above, it was confirmed that as the second expansion/contraction suppressing member 32 is positioned deeper behind the first expansion/contraction suppressing member 31, the expansion/contraction suppressing effect of the base material 20 by the expansion/contraction suppressing member 30 is higher.
（実施例３）
　配線基板６１０として、図５４ａ～ｃに示すような、基材２０の第１面２１に配線５２、伸縮抑制部材３０及び被接続部材５１が設けられたものを作製した。図５４ａは実施例に係る配線基板６１０を示す平面図であり、そのＡ－Ａに沿って切断した場合の断面図を図５４ｂに、Ｂ－Ｂに沿って切断した場合の断面図を図５４ｃに示す。配線５２、伸縮抑制部材３０及び被接続部材５１は、支持基板４０に設けられた状態で、接着層を介して基材２０に貼り合わせた。 (Example 3)
As the wiring board 610, as shown in FIGS. 54a to 54c, the one in which the wiring 52, the expansion suppressing member 30 and the connected member 51 are provided on the first surface 21 of the base material 20 was manufactured. 54a is a plan view showing a wiring board 610 according to an embodiment, and FIG. 54b shows a sectional view taken along the line AA, and FIG. 54c shows a sectional view taken along the line BB. Shown in. The wiring 52, the expansion/contraction suppressing member 30, and the connected member 51 were attached to the base material 20 via the adhesive layer while being provided on the support substrate 40.
　基材２０は、２液付加縮合のポリジメルシロキサン（以下、ＰＤＭＳと称する）を、厚さが１．５ｍｍとなるように硬化させて形成した。基材２０の弾性係数は、０．０５ＭＰａとした。支持基板４０を基材２０に貼り合わせるための接着層としては、粘着シート８１４６（３Ｍ社製）を用いた。 The base material 20 was formed by curing a two-component addition-condensation polydimersiloxane (hereinafter referred to as PDMS) so as to have a thickness of 1.5 mm. The elastic coefficient of the base material 20 was 0.05 MPa. A pressure-sensitive adhesive sheet 8146 (manufactured by 3M) was used as an adhesive layer for bonding the support substrate 40 to the base material 20.
　支持基板４０は、厚さ１μｍのＰＥＮ（ポリエチレンナフタレート）フィルムであり、弾性係数は、２．２ＧＰａとした。配線５２はＣｕであり、支持基板４０に蒸着法で成膜した後、フォトリソグラフィでパターニングして形成した。配線幅は、２００μｍとし、隣り合う配線の間の間隔は、４００μｍとした。また、配線５２の形成後、配線５２及び支持基板４０を一体的に覆う絶縁膜を形成した。なお、配線５２の被接続部材５１との接続部分は絶縁膜で覆わないようにした。絶縁膜は、熱硬化性絶縁樹脂をスクリーン印刷で配線５２及び支持基板４０上に印刷した後、加熱して硬化させることで形成した。絶縁膜の厚さは、配線５２上で５０μｍ程度となるように設定した。 The supporting substrate 40 is a PEN (polyethylene naphthalate) film having a thickness of 1 μm, and the elastic coefficient is set to 2.2 GPa. The wiring 52 is Cu, and is formed by forming a film on the supporting substrate 40 by a vapor deposition method and then patterning it by photolithography. The wiring width was 200 μm, and the interval between adjacent wirings was 400 μm. After forming the wiring 52, an insulating film that integrally covers the wiring 52 and the support substrate 40 was formed. The connecting portion of the wiring 52 with the connected member 51 was not covered with an insulating film. The insulating film was formed by printing a thermosetting insulating resin on the wiring 52 and the support substrate 40 by screen printing and then heating and curing the resin. The thickness of the insulating film was set to be about 50 μm on the wiring 52.
　配線５２と被接続部材５１とを接続するための接続部５１ａは、導電性接着剤（化研テック社製のＣＬ－３１６０）をスクリーン印刷にて配線５２の端部に形成した。そして、被接続部材５１は、接続部５１ａに半田付けした。また、伸縮抑制部材３０は、熱硬化性エポキシ樹脂をディスペンサで所定の位置に塗布して、熱硬化させることで形成した。伸縮抑制部材３０は平面視で、被接続部材５１の四隅において配線５２が延びる方向すなわち配線基板３１０の伸縮方向（第１方向Ｄ１）およびにそれに直交する方向にいずれについても、被接続部材５１が伸縮抑制部材３０から２ｍｍ突出するように形成した。 The connecting portion 51a for connecting the wiring 52 and the member 51 to be connected was formed on the end portion of the wiring 52 by screen printing a conductive adhesive (CL-3160 manufactured by Kaken Tech Co., Ltd.). Then, the connected member 51 was soldered to the connecting portion 51a. Further, the expansion-contraction suppressing member 30 was formed by applying a thermosetting epoxy resin at a predetermined position with a dispenser and thermosetting it. In the plan view, the expansion/contraction suppressing member 30 has the connected member 51 in any of the directions in which the wiring 52 extends at the four corners of the connected member 51, that is, in the expansion/contraction direction of the wiring board 310 (first direction D1) and the direction orthogonal thereto. The expansion and contraction suppressing member 30 was formed so as to protrude by 2 mm.
　そして、基材２０を第１方向Ｄ１に１．５倍、１軸伸長させた状態で、上述のように配線５２及び被接続部材５１等が支持された支持基板４０を基材２０に接着層を介して貼り合わせ、これにより、実施例に係る配線基板３１０を作製した。 Then, in a state in which the base material 20 is uniaxially stretched 1.5 times in the first direction D1, the support substrate 40 on which the wiring 52, the connected member 51 and the like are supported as described above is attached to the base material 20 by an adhesive layer. Then, the wiring board 310 according to the example was manufactured.
（評価）
　この実施例に係る配線基板６１０を、第１方向Ｄ１に１万回、１．３倍伸長させたが、配線５２は断線しなかった。なお、実施例に係る配線基板３１０において伸縮抑制部材３０を設けない比較例を製作し、第１方向Ｄ１に１万回、１．３倍伸長させた場合には、接続部５１ａにおいて接続剥がれが生じていた。この結果から、伸縮抑制部材３０の有用性が確認された。 (Evaluation)
The wiring board 610 according to this example was expanded 10,000 times in the first direction D1 10,000 times, but the wiring 52 was not broken. In addition, when the comparative example in which the expansion and contraction suppressing member 30 is not provided in the wiring board 310 according to the example is manufactured and is stretched 1.3 times in the first direction D1 10,000 times, the connection is peeled off at the connection portion 51a. It was happening. From this result, the usefulness of the expansion and contraction suppressing member 30 was confirmed.
（他の実施形態）
　以下、本開示の他の実施形態に係る配線基板ついてさらに説明する。 (Other embodiments)
Hereinafter, a wiring board according to another embodiment of the present disclosure will be further described.
　（配線基板）
　まず、本実施形態に係る配線基板７１０について説明する。図５５及び図５６はそれぞれ、配線基板７１０を示す平面図及び断面図である。図５６に示す断面図は、図５５の配線基板７１０を線II－IIに沿って切断した場合の図である。 (Wiring board)
First, the wiring board 710 according to the present embodiment will be described. 55 and 56 are a plan view and a cross-sectional view showing the wiring board 710, respectively. The cross-sectional view shown in FIG. 56 is a view when the wiring board 710 of FIG. 55 is cut along the line II-II.
　配線基板７１０は、基材２０、電子部品５１、配線５２、補強部材３０を備える。以下、配線基板７１０の各構成要素について説明する。なお、本実施形態では、上述の実施形態において「伸縮抑制部材３０」と称していた構成のことを、補強部材３０と称している。また、上述実施形態において「被接続部材５１」と称して構成が、電子部品５１になっている。 The wiring board 710 includes a base material 20, electronic components 51, wirings 52, and reinforcing members 30. Hereinafter, each component of the wiring board 710 will be described. In the present embodiment, the configuration referred to as the “expansion/contraction suppressing member 30” in the above-described embodiment is referred to as the reinforcing member 30. In addition, in the above-described embodiment, the electronic component 51 has a configuration referred to as the “connected member 51”.
　〔基材〕
　基材２０は、伸縮性を有するよう構成された部材である。基材２０は、電子部品５１及び配線５２側に位置する第１面２１と、第１面２１の反対側に位置する第２面２２と、を含む。基材２０の厚みは、例えば１０μｍ以上１０ｍｍ以下であり、より好ましくは２０μｍ以上３ｍｍ以下である。基材２０の厚みを１０μｍ以上にすることにより、基材２０の耐久性を確保することができる。また、基材２０の厚みを１０ｍｍ以下にすることにより、配線基板７１０の装着快適性を確保することができる。なお、基材２０の厚みを小さくしすぎると、基材２０の伸縮性が損なわれる場合がある。 〔Base material〕
The base material 20 is a member configured to have elasticity. The base material 20 includes a first surface 21 located on the electronic component 51 and wiring 52 sides and a second surface 22 located on the opposite side of the first surface 21. The thickness of the base material 20 is, for example, 10 μm or more and 10 mm or less, and more preferably 20 μm or more and 3 mm or less. By setting the thickness of the base material 20 to 10 μm or more, the durability of the base material 20 can be ensured. Further, by setting the thickness of the base material 20 to 10 mm or less, it is possible to ensure the comfort of mounting the wiring board 710. If the thickness of the base material 20 is too small, the elasticity of the base material 20 may be impaired.
　なお、基材２０の伸縮性とは、基材２０が伸び縮みすることができる性質、すなわち、常態である非伸長状態から伸長することができ、この伸長状態から解放したときに復元することができる性質をいう。非伸長状態とは、引張応力が加えられていない時の基材２０の状態である。本実施形態において、伸縮可能な基材は、好ましくは、破壊されることなく非伸長状態から１％以上伸長することができ、より好ましくは２０％以上伸長することができ、更に好ましくは７５％以上伸長することができる。このような能力を有する基材２０を用いることにより、配線基板７１０が全体に伸縮性を有することができる。さらに、人の腕などの身体の一部に取り付けるという、高い伸縮が必要な製品や用途において、配線基板７１０を使用することができる。一般に、人の脇の下に取り付ける製品には、垂直方向において７２％、水平方向において２７％の伸縮性が必要であると言われている。また、人の膝、肘、臀部、足首、脇部に取り付ける製品には、垂直方向において２６％以上４２％以下の伸縮性が必要であると言われている。また、人のその他の部位に取り付ける製品には、２０％未満の伸縮性が必要であると言われている。 The stretchability of the base material 20 means that the base material 20 can expand and contract, that is, it can be expanded from a non-expanded state which is a normal state, and can be restored when released from this expanded state. A property that can be done. The non-stretched state is the state of the base material 20 when no tensile stress is applied. In this embodiment, the stretchable substrate is preferably capable of stretching 1% or more from an unstretched state without breaking, more preferably 20% or more, and further preferably 75%. The above can be extended. By using the base material 20 having such an ability, the wiring board 710 can have elasticity as a whole. Further, the wiring board 710 can be used in products and applications that require high expansion and contraction, such as being attached to a part of the body such as a human arm. It is generally said that a product attached to a person's armpit must have a stretchability of 72% in the vertical direction and 27% in the horizontal direction. Further, it is said that a product attached to a person's knees, elbows, buttocks, ankles, and armpits needs to have elasticity of 26% or more and 42% or less in the vertical direction. Further, it is said that a product attached to other parts of a person needs elasticity of less than 20%.
　また、非伸長状態にある基材２０の形状と、非伸長状態から伸長された後に再び非伸長状態に戻ったときの基材２０の形状との差が小さいことが好ましい。この差のことを、以下の説明において形状変化とも称する。基材２０の形状変化は、例えば面積比で２０％以下、より好ましくは１０％以下、さらに好ましくは５％以下である。形状変化の小さい基材２０を用いることにより、後述する蛇腹形状部の形成が容易になる。 Also, it is preferable that the difference between the shape of the base material 20 in the non-stretched state and the shape of the base material 20 when it is stretched from the non-stretched state and then returned to the non-stretched state is small. This difference is also referred to as a shape change in the following description. The shape change of the base material 20 is, for example, 20% or less in area ratio, more preferably 10% or less, and further preferably 5% or less. By using the base material 20 having a small shape change, it becomes easy to form a bellows-shaped portion described later.
　基材２０の伸縮性を表すパラメータの例として、基材２０の弾性係数を挙げることができる。基材２０の弾性係数は、例えば１０ＭＰａ以下であり、より好ましくは１ＭＰａ以下である。このような弾性係数を有する基材２０を用いることにより、配線基板７１０全体に伸縮性を持たせることができる。以下の説明において、基材２０の弾性係数のことを、第１の弾性係数とも称する。基材２０の第１の弾性係数は、１ｋＰａ以上であってもよい。 The elastic coefficient of the base material 20 can be given as an example of the parameter indicating the elasticity of the base material 20. The elastic modulus of the base material 20 is, for example, 10 MPa or less, and more preferably 1 MPa or less. By using the base material 20 having such an elastic coefficient, the entire wiring board 710 can be made elastic. In the following description, the elastic coefficient of the base material 20 is also referred to as a first elastic coefficient. The first elastic modulus of the base material 20 may be 1 kPa or more.
　基材２０の第１の弾性係数を算出する方法としては、基材２０のサンプルを用いて、ＪＩＳ Ｋ６２５１に準拠して引張試験を実施するという方法を採用することができる。また、基材２０のサンプルの弾性係数を、ＩＳＯ１４５７７に準拠してナノインデンテーション法によって測定するという方法を採用することもできる。ナノインデンテーション法において用いる測定器としては、ナノインデンターを用いることができる。基材２０のサンプルを準備する方法としては、配線基板７１０から基材２０の一部をサンプルとして取り出す方法や、配線基板７１０を構成する前の基材２０の一部をサンプルとして取り出す方法が考えられる。その他にも、基材２０の第１の弾性係数を算出する方法として、基材２０を構成する材料を分析し、材料の既存のデータベースに基づいて基材２０の第１の弾性係数を算出するという方法を採用することもできる。なお、本願における弾性係数は、２５℃の環境下における弾性係数である。 As a method of calculating the first elastic coefficient of the base material 20, it is possible to adopt a method of performing a tensile test in accordance with JIS K6251 using a sample of the base material 20. It is also possible to employ a method in which the elastic coefficient of the sample of the base material 20 is measured by the nanoindentation method according to ISO14577. A nano indenter can be used as a measuring device used in the nano indentation method. As a method of preparing a sample of the base material 20, a method of taking out a part of the base material 20 from the wiring board 710 as a sample, or a method of taking out a part of the base material 20 before forming the wiring board 710 as a sample are considered. To be In addition, as a method of calculating the first elastic coefficient of the base material 20, the material forming the base material 20 is analyzed, and the first elastic coefficient of the base material 20 is calculated based on the existing database of the material. It is also possible to adopt the method. The elastic modulus in the present application is an elastic coefficient under an environment of 25°C.
　基材２０の伸縮性を表すパラメータのその他の例として、基材２０の曲げ剛性を挙げることができる。曲げ剛性は、対象となる部材の断面二次モーメントと、対象となる部材を構成する材料の弾性係数との積であり、単位はＮ・ｍ２又はＰａ・ｍ４である。基材２０の断面二次モーメントは、配線基板７１０の伸縮方向に直交する平面によって、基材２０のうち配線５２と重なっている部分を切断した場合の断面に基づいて算出される。 The bending rigidity of the base material 20 can be given as another example of the parameter indicating the elasticity of the base material 20. The bending rigidity is the product of the second moment of area of the target member and the elastic modulus of the material forming the target member, and the unit is N·m 2 or Pa·m 4 . The geometrical moment of inertia of the base material 20 is calculated based on the cross section when the portion of the base material 20 overlapping the wiring 52 is cut by the plane orthogonal to the expansion/contraction direction of the wiring board 710.
　基材２０を構成する材料の例としては、例えば、エラストマーを挙げることができる。また、基材２０の材料として、例えば、織物、編物、不織布などの布を用いることもできる。エラストマーとしては、一般的な熱可塑性エラストマーおよび熱硬化性エラストマーを用いることができ、具体的には、ポリウレタン系エラストマー、スチレン系エラストマー、ニトリル系エラストマー、オレフィン系エラストマー、塩ビ系エラストマー、エステル系エラストマー、アミド系エラストマー、１，２－ＢＲ系エラストマー、フッ素系エラストマー、シリコーンゴム、ウレタンゴム、フッ素ゴム、ポリブタジエン、ポリイソブチレン、ポリスチレンブタジエン、ポリクロロプレン等を用いることができる。機械的強度や耐磨耗性を考慮すると、ウレタン系エラストマーを用いることが好ましい。また、基材２０がシリコーンを含んでいてもよい。シリコーンは、耐熱性・耐薬品性・難燃性に優れており、基材２０の材料として好ましい。 As an example of the material forming the base material 20, for example, an elastomer can be cited. Further, as the material of the base material 20, for example, cloth such as woven fabric, knitted fabric, and non-woven fabric can be used. As the elastomer, a general thermoplastic elastomer and a thermosetting elastomer can be used, and specifically, a polyurethane elastomer, a styrene elastomer, a nitrile elastomer, an olefin elastomer, a vinyl chloride elastomer, an ester elastomer, Amide elastomer, 1,2-BR elastomer, fluorine elastomer, silicone rubber, urethane rubber, fluorine rubber, polybutadiene, polyisobutylene, polystyrene butadiene, polychloroprene and the like can be used. Considering mechanical strength and abrasion resistance, it is preferable to use urethane elastomer. Further, the base material 20 may include silicone. Silicone has excellent heat resistance, chemical resistance, and flame retardancy, and is preferable as a material for the base material 20.
　〔電子部品〕
　電子部品５１は、電子部品５１と配線５２との間に位置する接続部５１ａにより配線５２に接続されている。図５６に示す例において、接続部５１ａは、電子部品５１の下面、言い換えると電子部品５１における基材２０の第１面２１側を向く面と、基材２０、特に基材２０上の配線５２の表面と、の間に位置する。なお、配線５２の表面とは、配線５２の面のうち基材２０から遠い側に位置する面である。 [Electronic parts]
The electronic component 51 is connected to the wiring 52 by a connecting portion 51 a located between the electronic component 51 and the wiring 52. In the example shown in FIG. 56, the connecting portion 51 a includes the lower surface of the electronic component 51, in other words, the surface of the electronic component 51 facing the first surface 21 side of the base material 20, and the base material 20, particularly the wiring 52 on the base material 20. Located between and on the surface of. The surface of the wiring 52 is a surface of the surface of the wiring 52 located on the side farther from the base material 20.
　この例においては、接続部５１ａは、電子部品５１の下面に接続されるとともに、配線５２の表面に接続される。しかしながら、図５６に示す例に代えて、接続部５１ａは、電子部品５１の側面に位置してもよい。また、接続部５１ａは、配線５２の側面に接続されてもよい。このような電子部品５１は、能動部品であってもよく、受動部品であってもよく、機構部品であってもよい。 In this example, the connecting portion 51a is connected to the lower surface of the electronic component 51 and the surface of the wiring 52. However, instead of the example shown in FIG. 56, the connecting portion 51 a may be located on the side surface of the electronic component 51. Further, the connecting portion 51 a may be connected to the side surface of the wiring 52. Such an electronic component 51 may be an active component, a passive component, or a mechanical component.
　電子部品５１の例としては、トランジスタ、ＬＳＩ(Large-Scale Integration)、ＭＥＭＳ(Micro Electro Mechanical Systems)、リレー、ＬＥＤ、ＯＬＥＤ、ＬＣＤなどの発光素子、センサ、ブザー等の発音部品、振動を発する振動部品、冷却発熱をコントロールするペルチェ素子や電熱線などの冷発熱部品、抵抗器、キャパシタ、インダクタ、圧電素子、スイッチ、コネクタなどを挙げることができる。電子部品５１の上述の例のうち、センサが好ましく用いられる。センサとしては、例えば、温度センサ、圧力センサ、光センサ、光電センサ、近接センサ、せん断力センサ、生体センサ、レーザーセンサ、マイクロ波センサ、湿度センサ、歪みセンサ、ジャイロセンサ、加速度センサ、変位センサ、磁気センサ、ガスセンサ、GPSセンサ、超音波センサ、臭いセンサ、脳波センサ、電流センサ、振動センサ、脈波センサ、心電センサ、光度センサ等を挙げることができる。これらのセンサのうち、生体センサが特に好ましい。生体センサは、心拍や脈拍、心電、血圧、体温、血中酸素濃度等の生体情報を測定することができる。 Examples of the electronic component 51 include transistors, LSIs (Large-Scale Integration), MEMS (Micro Electro Mechanical Systems), relays, light emitting elements such as LEDs, OLEDs, LCDs, sounding components such as sensors and buzzers, and vibrations that generate vibrations. Examples include components, cold heat generating components such as Peltier elements and heating wires for controlling heat generation by cooling, resistors, capacitors, inductors, piezoelectric elements, switches, and connectors. Of the above examples of the electronic component 51, the sensor is preferably used. As the sensor, for example, a temperature sensor, a pressure sensor, an optical sensor, a photoelectric sensor, a proximity sensor, a shear force sensor, a biological sensor, a laser sensor, a microwave sensor, a humidity sensor, a strain sensor, a gyro sensor, an acceleration sensor, a displacement sensor, Examples thereof include magnetic sensors, gas sensors, GPS sensors, ultrasonic sensors, odor sensors, brain wave sensors, current sensors, vibration sensors, pulse wave sensors, electrocardiographic sensors, and luminous intensity sensors. Of these sensors, biosensors are particularly preferred. The biometric sensor can measure biometric information such as heartbeat, pulse rate, electrocardiogram, blood pressure, body temperature, and blood oxygen concentration.
　〔配線〕
　配線５２は、電子部品５１の接続部５１ａに接続された、導電性を有する部材である。例えば図５６に示すように、配線５２の端側の部分が、電子部品５１の接続部５１ａに接続されている。図５５に示す例では、電子部品５１に対して両側のそれぞれに、複数の配線５２が設けられるが、配線５２の数は特に限定されるものではない。 〔wiring〕
The wiring 52 is a conductive member that is connected to the connecting portion 51 a of the electronic component 51. For example, as shown in FIG. 56, the end portion of the wiring 52 is connected to the connecting portion 51 a of the electronic component 51. In the example shown in FIG. 55, a plurality of wirings 52 are provided on both sides of the electronic component 51, but the number of wirings 52 is not particularly limited.
　後述するように、一実施形態では、配線５２が、引張によって伸長した状態の基材２０に設けられる。この場合、基材２０から引張応力が取り除かれて基材２０が収縮するとき、配線５２は、図５７Ａに示すように、蛇腹状に変形して蛇腹形状部５７を有するようになる。 As will be described later, in one embodiment, the wiring 52 is provided on the base material 20 stretched by tension. In this case, when the tensile stress is removed from the base material 20 and the base material 20 contracts, the wiring 52 is deformed into a bellows shape and has the bellows-shaped portion 57, as shown in FIG. 57A.
　蛇腹形状部５７は、基材２０の第１面２１の法線方向における山部及び谷部を含む。図５７Ａにおいて、符号５３は、配線５２の表面に現れる山部を表し、符号５４は、配線５２の裏面に現れる山部を表す。また、符号５５は、配線５２の表面に現れる谷部を表し、符号５６は、配線５２の裏面に現れる谷部を表す。表面とは、配線５２の面のうち基材２０から遠い側に位置する面であり、裏面とは、配線５２の面のうち基材２０に近い側に位置する面である。また、図５７Ａにおいて、符号２６及び２７は、基材２０の第１面２１に現れる山部及び谷部を表す。第１面２１に山部２６及び谷部２７が現れるように基材２０が変形することにより、配線５２が蛇腹状に変形して蛇腹形状部５７を有するようになる。基材２０の第１面２１の山部２６が、配線５２の蛇腹形状部５７の山部５３，５４に対応し、基材２０の第１面２１の谷部２７が、配線５２の蛇腹形状部５７の谷部５５，５６に対応している。 The bellows-shaped portion 57 includes a peak portion and a valley portion in the normal direction of the first surface 21 of the base material 20. In FIG. 57A, reference numeral 53 represents a mountain portion appearing on the front surface of the wiring 52, and reference numeral 54 represents a mountain portion appearing on the back surface of the wiring 52. Further, reference numeral 55 represents a valley portion appearing on the front surface of the wiring 52, and reference numeral 56 represents a valley portion appearing on the back surface of the wiring 52. The front surface is a surface of the surface of the wiring 52 that is located on the side farther from the base material 20, and the back surface is the surface of the surface of the wiring 52 that is located on the side closer to the base material 20. Further, in FIG. 57A, reference numerals 26 and 27 represent peaks and valleys that appear on the first surface 21 of the base material 20. When the base material 20 is deformed so that the peaks 26 and the valleys 27 appear on the first surface 21, the wiring 52 is deformed into a bellows shape and has the bellows-shaped portion 57. The crests 26 of the first surface 21 of the base material 20 correspond to the crests 53 and 54 of the bellows-shaped portion 57 of the wiring 52, and the valleys 27 of the first surface 21 of the base material 20 are the bellows shape of the wiring 52. It corresponds to the valley portions 55 and 56 of the portion 57.
　以下の説明において、蛇腹形状部５７の山部及び谷部が繰り返し現れる方向のことを、第１方向Ｄ１とも称する。図５７Ａに示す例において、配線５２は、第１方向Ｄ１に平行に延びている。ここで、配線５２は、電子部品５１及び補強部材３０に対し、第１方向Ｄ１でずれた位置に、蛇腹形状部５７を有する。また、基材２０は、第１方向Ｄ１に平行な長辺を含む長方形の形状を有している。図示はしないが、配線基板７１０は、第１方向Ｄ１とは異なる方向に延びる配線５２を含んでいてもよい。また、図示はしないが、基材２０が長方形の形状を有する場合に、長辺が延びる方向が第１方向Ｄ１とは異なっていてもよい。なお、図５７Ａにおいては、蛇腹形状部５７の複数の山部及び谷部が一定の周期で並ぶ例が示されているが、これに限られることはない。図示はしないが、蛇腹形状部５７の複数の山部及び谷部は、第１方向Ｄ１に沿って不規則に並んでいてもよい。例えば、第１方向Ｄ１において隣り合う２つの山部の間の間隔が一定でなくてもよい。 In the following description, the direction in which the peaks and valleys of the bellows-shaped portion 57 appear repeatedly is also referred to as the first direction D1. In the example shown in FIG. 57A, the wiring 52 extends parallel to the first direction D1. Here, the wiring 52 has a bellows-shaped portion 57 at a position displaced from the electronic component 51 and the reinforcing member 30 in the first direction D1. In addition, the base material 20 has a rectangular shape including long sides parallel to the first direction D1. Although not shown, the wiring board 710 may include the wiring 52 extending in a direction different from the first direction D1. Further, although not shown, when the base material 20 has a rectangular shape, the direction in which the long sides extend may be different from the first direction D1. Although FIG. 57A shows an example in which a plurality of peaks and valleys of the bellows-shaped portion 57 are arranged at a constant cycle, the present invention is not limited to this. Although not shown, the plurality of peaks and troughs of the bellows-shaped portion 57 may be arranged irregularly along the first direction D1. For example, the interval between two peaks adjacent to each other in the first direction D1 may not be constant.
　図５７Ａにおいて、符号Ｓ１は、配線５２の表面における蛇腹形状部５７の、基材２０の法線方向における振幅を表す。振幅Ｓ１は、例えば１μｍ以上であり、より好ましくは１０μｍ以上である。振幅Ｓ１を１０μｍ以上とすることにより、基材２０の伸張に追従して配線５２が変形し易くなる。また、振幅Ｓ１は、例えば５００μｍ以下であってもよい。 In FIG. 57A, symbol S1 represents the amplitude of the bellows-shaped portion 57 on the surface of the wiring 52 in the normal direction of the base material 20. The amplitude S1 is, for example, 1 μm or more, and more preferably 10 μm or more. By setting the amplitude S1 to 10 μm or more, the wiring 52 is easily deformed following the expansion of the base material 20. Further, the amplitude S1 may be, for example, 500 μm or less.
　振幅Ｓ１は、例えば、配線５２の長さ方向における一定の範囲にわたって、隣り合う山部５３と谷部５５との間の、第１面２１の法線方向における距離を測定し、それらの平均を求めることにより算出される。「配線５２の長さ方向における一定の範囲」は、例えば１０ｍｍである。隣り合う山部５３と谷部５５との間の距離を測定する測定器としては、レーザー顕微鏡などを用いた非接触式の測定器を用いてもよく、接触式の測定器を用いてもよい。また、断面写真などの画像に基づいて、隣り合う山部５３と谷部５５との間の距離を測定してもよい。後述する振幅Ｓ２、Ｓ３、Ｓ４の算出方法も同様である。 For the amplitude S1, for example, the distance in the normal direction of the first surface 21 between the adjacent peaks 53 and valleys 55 is measured over a certain range in the length direction of the wiring 52, and the average thereof is calculated. It is calculated by obtaining. The “certain range in the length direction of the wiring 52” is, for example, 10 mm. As a measuring device for measuring the distance between the adjacent crests 53 and valleys 55, a non-contact measuring device using a laser microscope or the like may be used, or a contact measuring device may be used. .. Further, the distance between the adjacent ridges 53 and valleys 55 may be measured based on an image such as a cross-sectional photograph. The same applies to the method of calculating the amplitudes S2, S3, and S4, which will be described later.
　図５７Ａにおいて、符号Ｓ２は、配線５２の裏面における蛇腹形状部５７の振幅を表す。振幅Ｓ２は、振幅Ｓ１と同様に、例えば１μｍ以上であり、より好ましくは１０μｍ以上である。また、振幅Ｓ２は、例えば５００μｍ以下であってもよい。また、図５７Ａにおいて、符号Ｓ３は、蛇腹形状部５７に重なる部分において基材２０の第１面２１に現れる山部２６及び谷部２７の振幅を表す。図５７Ａに示すように配線５２の裏面が基材２０の第１面２１上に位置している場合、基材２０の第１面２１の山部２６及び谷部２７の振幅Ｓ３は、配線５２の裏面における蛇腹形状部５７の振幅Ｓ２に等しい。 In FIG. 57A, symbol S2 represents the amplitude of the bellows-shaped portion 57 on the back surface of the wiring 52. Like the amplitude S1, the amplitude S2 is, for example, 1 μm or more, and more preferably 10 μm or more. Further, the amplitude S2 may be, for example, 500 μm or less. Further, in FIG. 57A, the symbol S3 represents the amplitude of the peak portion 26 and the valley portion 27 that appear on the first surface 21 of the base material 20 in the portion overlapping the bellows-shaped portion 57. As shown in FIG. 57A, when the back surface of the wiring 52 is located on the first surface 21 of the base material 20, the amplitude S3 of the peak portion 26 and the valley portion 27 of the first surface 21 of the base material 20 is the wiring 52. Is equal to the amplitude S2 of the bellows-shaped portion 57 on the back surface of the.
　なお、図５７Ａにおいては、基材２０の第２面２２には蛇腹形状部が現れない例を示したが、これに限られることはない。図５８Ａに示すように、基材２０の第２面２２にも蛇腹形状部が現れていてもよい。図５８Ａにおいて、符号２８及び２９は、基材２０の第２面２２に現れる山部及び谷部を表す。図５８Ａに示す例において、第２面２２の山部２８は、第１面２１の谷部２７に重なる位置に現れ、第２面２２の谷部２９は、第１面２１の山部２６に重なる位置に現れている。なお、図示はしないが、基材２０の第２面２２の山部２８及び谷部２９の位置は、第１面２１の谷部２７及び山部２６に重なっていなくてもよい。また、基材２０の第２面２２の山部２８及び谷部２９の数又は周期は、第１面２１の山部２６及び谷部２７の数又は周期と同一であってもよく、異なっていてもよい。例えば、基材２０の第２面２２の山部２８及び谷部２９の周期が、第１面２１の山部２６及び谷部２７の周期よりも大きくてもよい。この場合、基材２０の第２面２２の山部２８及び谷部２９の周期は、第１面２１の山部２６及び谷部２７の周期の１．１倍以上であってもよく、１．２倍以上であってもよく、１．５倍以上であってもよく、２．０倍以上であってもよい。なお、「基材２０の第２面２２の山部２８及び谷部２９の周期が、第１面２１の山部２６及び谷部２７の周期よりも大きい」とは、基材２０の第２面２２に山部及び谷部が現れない場合を含む概念である。
　図５８Ａにおいて、符号Ｓ４は、蛇腹形状部５７に重なる部分において基材２０の第２面２２に現れる山部２８及び谷部２９の振幅を表す。第２面２２の振幅Ｓ４は、第１面２１の振幅Ｓ３と同一であってもよく、異なっていてもよい。例えば、第２面２２の振幅Ｓ４が、第１面２１の振幅Ｓ３よりも小さくてもよい。例えば、第２面２２の振幅Ｓ４が、第１面２１の振幅Ｓ３の０．９倍以下であってもよく、０．８倍以下であってもよく、０．６倍以下であってもよい。また、第２面２２の振幅Ｓ４は、第１面２１の振幅Ｓ３の０．１倍以上であってもよく、０．２倍以上であってもよい。基材２０の厚みが小さい場合、第１面２１の振幅Ｓ３に対する第２面２２の振幅Ｓ４の比率が大きくなり易い。なお、「基材２０の第２面２２の山部２８及び谷部２９の振幅が、第１面２１の山部２６及び谷部２７の振幅よりも小さい」とは、基材２０の第２面２２に山部及び谷部が現れない場合を含む概念である。 Although FIG. 57A shows an example in which the bellows-shaped portion does not appear on the second surface 22 of the base material 20, the present invention is not limited to this. As shown in FIG. 58A, a bellows-shaped portion may appear on the second surface 22 of the base material 20. In FIG. 58A, reference numerals 28 and 29 represent peaks and valleys that appear on the second surface 22 of the base material 20. In the example shown in FIG. 58A, the crests 28 of the second surface 22 appear at positions overlapping the troughs 27 of the first surface 21, and the troughs 29 of the second surface 22 correspond to the crests 26 of the first surface 21. They appear in overlapping positions. Although not shown, the positions of the crests 28 and the troughs 29 of the second surface 22 of the base material 20 may not overlap the troughs 27 and the crests 26 of the first surface 21. The number or cycle of the peaks 28 and valleys 29 of the second surface 22 of the base material 20 may be the same as or different from the number or cycle of the peaks 26 and valleys 27 of the first surface 21. May be. For example, the cycle of the crests 28 and the valleys 29 of the second surface 22 of the base material 20 may be longer than the cycle of the crests 26 and the valleys 27 of the first surface 21. In this case, the cycle of the crests 28 and the valleys 29 of the second surface 22 of the base material 20 may be 1.1 times or more the cycle of the crests 26 and the valleys 27 of the first surface 21. 0.2 times or more, 1.5 times or more, or 2.0 times or more. Note that “the cycle of the crests 28 and the valleys 29 of the second surface 22 of the base material 20 is larger than the cycle of the crests 26 and the valleys 27 of the first surface 21” means that the second surface of the base material 20 is the second. This is a concept including the case where the peaks and valleys do not appear on the surface 22.
In FIG. 58A, symbol S4 represents the amplitudes of the peaks 28 and the valleys 29 that appear on the second surface 22 of the base material 20 in the portion that overlaps the bellows-shaped portion 57. The amplitude S4 of the second surface 22 may be the same as or different from the amplitude S3 of the first surface 21. For example, the amplitude S4 of the second surface 22 may be smaller than the amplitude S3 of the first surface 21. For example, the amplitude S4 of the second surface 22 may be 0.9 times or less, 0.8 times or less, or 0.6 times or less of the amplitude S3 of the first surface 21. Good. The amplitude S4 of the second surface 22 may be 0.1 times or more, or 0.2 times or more of the amplitude S3 of the first surface 21. When the thickness of the base material 20 is small, the ratio of the amplitude S4 of the second surface 22 to the amplitude S3 of the first surface 21 tends to be large. It should be noted that “the amplitudes of the peaks 28 and the valleys 29 of the second surface 22 of the base material 20 are smaller than the amplitudes of the peaks 26 and the valleys 27 of the first surface 21” means that This is a concept including the case where the peaks and valleys do not appear on the surface 22.
　また、図５８Ａにおいては、第２面２２の山部２８及び谷部２９の位置が、第１面２１の谷部２７及び山部２６の位置に一致する例を示したが、これに限られることはない。 In addition, FIG. 58A shows an example in which the positions of the crests 28 and the valleys 29 of the second surface 22 match the positions of the troughs 27 and the peaks 26 of the first surface 21, but the present invention is not limited to this. There is no such thing.
　配線５２の材料としては、蛇腹形状部５７の解消及び生成を利用して基材２０の伸張及び収縮に追従することができる材料であればよい。配線５２の材料は、それ自体が伸縮性を有していてもよく、伸縮性を有していなくてもよい。
　配線５２に用いられ得る、それ自体は伸縮性を有さない材料としては、例えば、金、銀、銅、アルミニウム、白金、クロム等の金属や、これらの金属を含む合金が挙げられる。配線５２の材料自体が伸縮性を有さない場合、配線５２としては、金属膜を用いることができる。
　配線５２に用いられる材料自体が伸縮性を有する場合、材料の伸縮性は、例えば、基材２０の伸縮性と同様である。配線５２に用いられ得る、それ自体が伸縮性を有する材料としては、例えば、導電性粒子およびエラストマーを含有する導電性組成物が挙げられる。導電性粒子としては、配線に使用できるものであればよく、例えば、金、銀、銅、ニッケル、パラジウム、白金、カーボン等の粒子が挙げられる。中でも、銀粒子が好ましく用いられる。 The material of the wiring 52 may be any material that can follow the expansion and contraction of the base material 20 by utilizing the elimination and generation of the bellows-shaped portion 57. The material of the wiring 52 may or may not have elasticity itself.
Examples of the material that does not have elasticity by itself that can be used for the wiring 52 include metals such as gold, silver, copper, aluminum, platinum, and chromium, and alloys containing these metals. When the material of the wiring 52 itself does not have elasticity, a metal film can be used as the wiring 52.
When the material itself used for the wiring 52 has elasticity, the elasticity of the material is similar to that of the base material 20, for example. Examples of the material having elasticity which can be used for the wiring 52 include a conductive composition containing conductive particles and an elastomer. The conductive particles may be any particles that can be used for wiring, and examples thereof include particles of gold, silver, copper, nickel, palladium, platinum, carbon and the like. Among them, silver particles are preferably used.
　好ましくは、配線５２は、変形に対する耐性を有する構造を備える。例えば、配線５２は、ベース材と、ベース材の中に分散された複数の導電性粒子とを有する。この場合、ベース材として、樹脂などの変形可能な材料を用いることにより、基材２０の伸縮に応じて配線５２も変形することができる。また、変形が生じた場合であっても複数の導電性粒子の間の接触が維持されるように導電性粒子の分布や形状を設定することにより、配線５２の導電性を維持することができる。 Preferably, the wiring 52 has a structure having resistance to deformation. For example, the wiring 52 has a base material and a plurality of conductive particles dispersed in the base material. In this case, by using a deformable material such as resin as the base material, the wiring 52 can also be deformed according to the expansion and contraction of the base material 20. Further, the conductivity of the wiring 52 can be maintained by setting the distribution and shape of the conductive particles so that the contact between the plurality of conductive particles is maintained even when deformation occurs. ..
　配線５２のベース材を構成する材料としては、一般的な熱可塑性エラストマーおよび熱硬化性エラストマーを用いることができ、例えば、スチレン系エラストマー、アクリル系エラストマー、オレフィン系エラストマー、ウレタン系エラストマー、シリコーンゴム、ウレタンゴム、フッ素ゴム、ニトリルゴム、ポリブタジエン、ポリクロロプレン等を用いることができる。中でも、ウレタン系、シリコーン系構造を含む樹脂やゴムが、その伸縮性や耐久性などの面から好ましく用いられる。また、配線５２の導電性粒子を構成する材料としては、例えば銀、銅、金、ニッケル、パラジウム、白金、カーボン等の粒子を用いることができる。中でも、銀粒子が好ましく用いられる。 As a material forming the base material of the wiring 52, a general thermoplastic elastomer and a thermosetting elastomer can be used. For example, a styrene elastomer, an acrylic elastomer, an olefin elastomer, a urethane elastomer, a silicone rubber, Urethane rubber, fluororubber, nitrile rubber, polybutadiene, polychloroprene and the like can be used. Of these, resins and rubbers containing urethane-based or silicone-based structures are preferably used from the viewpoint of stretchability and durability. Further, as the material forming the conductive particles of the wiring 52, for example, particles of silver, copper, gold, nickel, palladium, platinum, carbon or the like can be used. Among them, silver particles are preferably used.
　配線５２の厚みは、基材２０の伸縮に耐え得る厚みであればよく、配線５２の材料等に応じて適宜選択される。
　例えば、配線５２の材料が伸縮性を有さない場合、配線５２の厚みは、２５ｎｍ以上５０μｍ以下の範囲内とすることができ、５０ｎｍ以上１０μｍ以下の範囲内であることが好ましく、１００ｎｍ以上５μｍ以下の範囲内であることがより好ましい。
　また、配線５２の材料が伸縮性を有する場合、配線５２の厚みは、５μｍ以上６０μｍ以下の範囲内とすることができ、１０μｍ以上５０μｍ以下の範囲内であることが好ましく、２０μｍ以上４０μｍ以下の範囲内であることがより好ましい。
　配線５２の幅は、例えば５０μｍ以上且つ１０ｍｍ以下である。 The wiring 52 may have any thickness as long as it can withstand the expansion and contraction of the base material 20, and is appropriately selected according to the material of the wiring 52 and the like.
For example, when the material of the wiring 52 does not have elasticity, the thickness of the wiring 52 can be in the range of 25 nm or more and 50 μm or less, preferably in the range of 50 nm or more and 10 μm or less, and 100 nm or more and 5 μm or less. More preferably, it is within the following range.
When the material of the wiring 52 has elasticity, the thickness of the wiring 52 may be in the range of 5 μm or more and 60 μm or less, preferably in the range of 10 μm or more and 50 μm or less, and 20 μm or more and 40 μm or less. It is more preferably within the range.
The width of the wiring 52 is, for example, 50 μm or more and 10 mm or less.
　配線５２の形成方法は、材料等に応じて適宜選択される。例えば、基材２０上または後述する支持基板４０上に蒸着法やスパッタリング法、メッキ法、特にＣｕメッキ法等により金属膜を形成した後、フォトリソグラフィ法により金属膜をパターニングする方法が挙げられる。また、配線５２の材料自体が伸縮性を有する場合、例えば、基材２０上または支持基板４０上に一般的な印刷法により上記の導電性粒子およびエラストマーを含有する導電性組成物をパターン状に印刷する方法が挙げられる。これらの方法のうち、材料効率がよく安価に製作できる印刷法が好ましく用いられ得る。 The method of forming the wiring 52 is appropriately selected according to the material and the like. For example, there is a method of forming a metal film on the base material 20 or on a support substrate 40 described later by a vapor deposition method, a sputtering method, a plating method, particularly a Cu plating method, and then patterning the metal film by a photolithography method. When the material of the wiring 52 itself has elasticity, for example, the conductive composition containing the conductive particles and the elastomer is formed in a pattern on the base material 20 or the support substrate 40 by a general printing method. There is a method of printing. Among these methods, a printing method that can be manufactured with high material efficiency and at low cost can be preferably used.
　また、基材２０上または後述する支持基板４０上及びこれら基材２０または支持基板４０に設けられた配線５２には、基材２０または支持基板４０と配線５２とを一体的に覆う絶縁膜が設けられてもよい。ただし、絶縁膜は、配線５２における電子部品５１との接続部分上には設けられない。このような絶縁膜は、熱硬化性の絶縁樹脂等を加熱硬化することで構成され得る。絶縁膜の厚さは、例えば０．１μｍ以上５００μｍ以下でもよい。また、絶縁膜の形成は、スクリーン印刷等で行われてもよい。また、接続部５１ａは、例えば導電性接着剤から構成されてもよいし、半田材料で形成されてもよいし、電子部品５１と一体の端子であってもよい。 In addition, an insulating film that integrally covers the base material 20 or the support substrate 40 and the wiring 52 is provided on the base material 20 or the support substrate 40 described below and the wiring 52 provided on the base material 20 or the support substrate 40. It may be provided. However, the insulating film is not provided on the connection portion of the wiring 52 with the electronic component 51. Such an insulating film can be formed by heating and hardening a thermosetting insulating resin or the like. The thickness of the insulating film may be, for example, 0.1 μm or more and 500 μm or less. Further, the insulating film may be formed by screen printing or the like. Further, the connecting portion 51a may be formed of, for example, a conductive adhesive, may be formed of a solder material, or may be a terminal integrated with the electronic component 51.
　蛇腹形状部５７が配線５２に形成されていることの利点について説明する。上述のように、基材２０は、１０ＭＰａ以下の弾性係数を有する。このため、配線基板７１０に引張応力を加えた場合、基材２０は、弾性変形によって伸長することができる。ここで、仮に配線５２も同様に弾性変形によって伸長すると、配線５２の全長が増加し、配線５２の断面積が減少するので、配線５２の抵抗値が増加してしまう。また、配線５２の弾性変形に起因して配線５２にクラックなどの破損が生じてしまうことも考えられる。 The advantages of forming the bellows-shaped portion 57 on the wiring 52 will be described. As described above, the base material 20 has an elastic modulus of 10 MPa or less. Therefore, when tensile stress is applied to the wiring board 710, the base material 20 can expand due to elastic deformation. Here, if the wiring 52 is similarly expanded by elastic deformation, the total length of the wiring 52 increases and the cross-sectional area of the wiring 52 decreases, so that the resistance value of the wiring 52 increases. It is also conceivable that the elastic deformation of the wiring 52 may cause damage such as cracks in the wiring 52.
　これに対して、本実施形態においては、配線５２が蛇腹形状部５７を有している。このため、基材２０が伸張する際、配線５２は、蛇腹形状部５７の起伏を低減するように変形することによって、すなわち蛇腹形状を解消することによって、基材２０の伸張に追従することができる。このため、基材２０の伸張に伴って配線５２の全長が増加することや、配線５２の断面積が減少することを抑制することができる。このことにより、配線基板７１０の伸張に起因して配線５２の抵抗値が増加することを抑制することができる。また、配線５２にクラックなどの破損が生じてしまうことを抑制することができる。 On the other hand, in the present embodiment, the wiring 52 has the bellows-shaped portion 57. Therefore, when the base material 20 extends, the wiring 52 can follow the extension of the base material 20 by deforming so as to reduce the undulations of the bellows-shaped portion 57, that is, by eliminating the bellows shape. it can. Therefore, it is possible to suppress an increase in the total length of the wiring 52 and a decrease in the cross-sectional area of the wiring 52 as the base material 20 extends. This can prevent the resistance value of the wiring 52 from increasing due to the expansion of the wiring board 710. Further, it is possible to prevent the wiring 52 from being damaged such as cracks.
　ところで、配線５２の山部５３，５４の高さ及び谷部５５，５６の深さは、基材２０の厚みのばらつきや、基材２０に設けられる配線５２の分布密度の差などに起因して、位置によってばらつくことがある。山部５３，５４の高さ及び谷部５５，５６の深さが位置によってばらつくと、配線５２に生じる湾曲や屈曲の程度が局所的に大きくなり、配線５２が破損してしまうことが考えられる。また、山部５３，５４の高さ及び谷部５５，５６の深さのばらつきが大きい場合であっても、小さい場合であっても、配線５２における電子部品５１の周囲に位置する部分は、伸縮時に大きい応力が生じ易く、また、電子部品５１の下方に巻き込まれ易くなり、破損のリスクが高くなり得る。
　ここで本実施形態によれば、基材２０に補強部材３０を設けることにより、基材２０における電子部品５１の周囲の部分の変形を制御、特に緩和することが可能となる。これにより、配線５２に局所的に大きい応力が生じることや、配線５２が電子部品５１の下方に巻き込まれることを抑制することができる。 By the way, the heights of the peaks 53 and 54 and the depths of the valleys 55 and 56 of the wiring 52 are caused by variations in the thickness of the base material 20, differences in distribution density of the wirings 52 provided on the base material 20, and the like. Therefore, it may vary depending on the position. If the heights of the crests 53 and 54 and the depths of the troughs 55 and 56 vary depending on the position, the degree of bending and bending of the wiring 52 locally increases, and the wiring 52 may be damaged. .. In addition, regardless of whether the heights of the crests 53 and 54 and the depths of the troughs 55 and 56 are large or small, the portion of the wiring 52 located around the electronic component 51 is A large stress is likely to occur at the time of expansion and contraction, and the electronic component 51 is likely to be caught below the electronic component 51, which may increase the risk of breakage.
Here, according to the present embodiment, by providing the reinforcing member 30 on the base material 20, it is possible to control, and particularly mitigate, the deformation of the portion of the base material 20 around the electronic component 51. As a result, it is possible to prevent a large local stress from being generated in the wiring 52 and to prevent the wiring 52 from being caught below the electronic component 51.
　〔補強部材〕
　補強部材３０は、基材２０を補強することで、基材２０の変形を緩和するために配線基板７１０に設けられた機構である。図５５及び図５６に示す例において、補強部材３０は、基材２０の第１面２１の法線方向で、第１面２１と電子部品５１の下面との間に位置する。補強部材３０は扁平状である。また、補強部材３０は、その一部で、配線５２における電子部品５１に近接する部分を覆っている。図５５及び図５６に示す補強部材３０は、第１面２１の法線方向に沿って基材２０を見た場合に、電子部品５１から突出するように延び且つ基材２０に接する第１補強部材３１と、電子部品５１の周囲に位置し且つ基材２０に接する第２補強部材３２と、を含んでいる。
　図５５及び図５６に示す例では、第１補強部材３１は、第２補強部材３２から延びており、第２補強部材３２は、平面視で矩形枠状であり、平面視で矩形状の電子部品５１の四辺の周囲の全域に位置している。
　以下の説明において、第１補強部材３１及び第２補強部材３２に共通する事項に関して説明する場合は、「補強部材３１，３２」と表記することもある。 [Reinforcement member]
The reinforcing member 30 is a mechanism provided on the wiring board 710 to relieve the deformation of the base material 20 by reinforcing the base material 20. In the example shown in FIGS. 55 and 56, the reinforcing member 30 is located between the first surface 21 and the lower surface of the electronic component 51 in the normal direction of the first surface 21 of the base material 20. The reinforcing member 30 has a flat shape. In addition, the reinforcing member 30 partially covers the portion of the wiring 52 that is close to the electronic component 51. The reinforcing member 30 shown in FIGS. 55 and 56 is the first reinforcing member that extends so as to project from the electronic component 51 and is in contact with the base material 20 when the base material 20 is viewed along the normal direction of the first surface 21. The member 31 and the second reinforcing member 32 located around the electronic component 51 and in contact with the base material 20 are included.
In the example shown in FIGS. 55 and 56, the first reinforcing member 31 extends from the second reinforcing member 32, and the second reinforcing member 32 has a rectangular frame shape in a plan view and a rectangular electronic shape in a plan view. It is located all around the four sides of the component 51.
In the following description, when the items common to the first reinforcing member 31 and the second reinforcing member 32 are described, they may be referred to as “reinforcing members 31, 32”.
　図５５に示す例では、補強部材３０が４つの第１補強部材３１を含み、各第１補強部材３１は、平面視で矩形状の第２補強部材３２の四隅のそれぞれから突出するように延びる。詳しくは、各第１補強部材３１は、第１方向Ｄ１及び平面視で第１方向Ｄ１に直交する方向の両方において、第２補強部材３２の四隅のそれぞれから延び広がっている。第１補強部材３１の形状は特に限定されるものではないが、図５５に示す例では、平面視で矩形状である。第１補強部材３１の四辺のうちの互いに対向する一方の一対の辺は、第１方向Ｄ１に平行となっており、他方の一対の辺は、第１方向Ｄ１に直交する方向に平行となっている。 In the example shown in FIG. 55, the reinforcing member 30 includes four first reinforcing members 31, and each first reinforcing member 31 extends so as to project from each of the four corners of the second reinforcing member 32 that is rectangular in plan view. .. Specifically, each of the first reinforcing members 31 extends and extends from each of the four corners of the second reinforcing member 32 in both the first direction D1 and the direction orthogonal to the first direction D1 in plan view. The shape of the first reinforcing member 31 is not particularly limited, but in the example shown in FIG. 55, it is rectangular in plan view. One of the four sides of the four sides of the first reinforcing member 31 facing each other is parallel to the first direction D1, and the other pair of sides is parallel to the direction orthogonal to the first direction D1. ing.
　ここで、図５５に示すように、つまり第１面２１の法線方向に沿って基材２０を見た場合に、本実施形態では、配線５２が、第１補強部材３１と電子部品５１とを仮想的に結ぶ少なくともいずれかの直線に対して交差する。詳しくは、図５５において、第１方向Ｄ１で電子部品５１の一方側、言い換える左側においては、左上側に位置する第１補強部材３１と電子部品５１とを仮想的に結ぶ直線Ｌ１に対して配線５２が交差するとともに、左下側に位置する第１補強部材３１と電子部品５１とを仮想的に結ぶ直線Ｌ２に対して配線５２が交差している。また、第１方向Ｄ１で電子部品５１の他方側、言い換える右側においては、右上側に位置する第１補強部材３１と電子部品５１とを仮想的に結ぶ直線Ｌ３に対して配線５２が交差するとともに、右下側に位置する第１補強部材３１と電子部品５１とを仮想的に結ぶ直線Ｌ４に対して配線５２が交差している。そして、この例では、第１方向Ｄ１に直交する方向で隣り合う第１補強部材３１の間を配線５２が通っている。
　なお、図５５に示す例では、配線５２が直線Ｌ１～Ｌ４に交差する例を示したが、この図示例においては、第１補強部材３１と電子部品５１とを仮想的に結ぶ直線Ｌ１～Ｌ４とは異なる無数の直線に対し、配線５２が交差することは言うまでもない。 Here, as shown in FIG. 55, that is, when the base material 20 is viewed along the normal direction of the first surface 21, in the present embodiment, the wiring 52 includes the first reinforcing member 31 and the electronic component 51. Intersect with at least one straight line that virtually connects Specifically, in FIG. 55, on one side of the electronic component 51 in the first direction D1, in other words, on the left side, wiring is performed with respect to a straight line L1 that virtually connects the first reinforcing member 31 located on the upper left side and the electronic component 51. 52 intersects with each other, and the wiring 52 intersects with a straight line L2 virtually connecting the first reinforcing member 31 and the electronic component 51 located on the lower left side. Further, on the other side of the electronic component 51 in the first direction D1, in other words, on the right side, the wiring 52 intersects with a straight line L3 virtually connecting the first reinforcing member 31 located on the upper right side and the electronic component 51. The wiring 52 intersects a straight line L4 that virtually connects the first reinforcing member 31 and the electronic component 51 located on the lower right side. In this example, the wiring 52 runs between the first reinforcing members 31 that are adjacent to each other in the direction orthogonal to the first direction D1.
In the example shown in FIG. 55, the wiring 52 intersects the straight lines L1 to L4. However, in this example, the straight lines L1 to L4 virtually connect the first reinforcing member 31 and the electronic component 51. Needless to say, the wiring 52 intersects a myriad of straight lines different from.
　図５６及び図５７Ａに示すように、本実施形態では、第１補強部材３１が、第２補強部材３２を介して電子部品５１及び接続部５１ａのうちの少なくともいずれかに接するとともに、基材２０に接する。この例では、第２補強部材３２が、その一部を電子部品５１の下方に進入させ、電子部品５１の下面及び接続部５１ａの側面に接するため、第１補強部材３１は、第２補強部材３２を介して電子部品５１及び接続部５１ａの両方に接することになる。より詳しくは、第２補強部材３２が、硬化によって電子部品５１の下面及び接続部５１ａの側面に結合していることで、第１補強部材３１は、第２補強部材３２を介して電子部品５１及び接続部５１ａの両方に結合するとともに、基材２０にも結合した状態になっている。 As shown in FIGS. 56 and 57A, in the present embodiment, the first reinforcing member 31 is in contact with at least one of the electronic component 51 and the connecting portion 51a via the second reinforcing member 32, and the base material 20. Touch. In this example, part of the second reinforcing member 32 is inserted below the electronic component 51 and is in contact with the lower surface of the electronic component 51 and the side surface of the connecting portion 51a. Therefore, the first reinforcing member 31 is the second reinforcing member. It comes into contact with both the electronic component 51 and the connecting portion 51 a via 32. More specifically, the second reinforcing member 32 is bonded to the lower surface of the electronic component 51 and the side surface of the connecting portion 51 a by curing, so that the first reinforcing member 31 causes the second reinforcing member 32 to intervene. In addition to being bonded to both the connection portion 51a and the connection portion 51a, the base material 20 is also bonded.
　なお、図５６及び図５７Ａに示す例では、補強部材３０が、その第２補強部材３２の一部を電子部品５１の下面の一部の下方に進入させるが、補強部材３０は、電子部品５１の下面の全体の下方に位置していてもよい。 In the example shown in FIGS. 56 and 57A, the reinforcing member 30 causes a part of the second reinforcing member 32 to enter below a part of the lower surface of the electronic component 51. May be located below the entire lower surface of the.
　本実施形態においては、上述のような第１補強部材３１と配線５２との位置関係、及び、第１補強部材３１と電子部品５１又は接続部５１ａとの位置関係を定めることにより、基材２０が直線Ｌ１に対して交差する方向に縮もうとする場合に、直線Ｌ１の両端に位置する第１補強部材３１と電子部品５１とに応力が集中することで、基材２０における直線Ｌ１よりも電子部品５１側の部分での収縮が緩和される。また、基材２０が直線Ｌ１に対して交差する方向に伸びようとする場合に、直線Ｌ１の両端に位置する第１補強部材３１と電子部品５１とが、基材２０の伸びに対する抗力を基材２０に付与する。これにより、基材２０における電子部品５１の周囲の部分の変形が緩和されることで、基材２０上の配線５２における電子部品５１の周囲の部分に局所的に大きい応力が生じることや、配線５２が電子部品５１の下方に巻き込まれることを抑制することができる。 In the present embodiment, the base material 20 is defined by determining the positional relationship between the first reinforcing member 31 and the wiring 52 and the positional relationship between the first reinforcing member 31 and the electronic component 51 or the connecting portion 51a as described above. When trying to shrink in a direction intersecting with the straight line L1, stress concentrates on the first reinforcing member 31 and the electronic component 51 located at both ends of the straight line L1, so that the stress is more concentrated than the straight line L1 on the base material 20. The shrinkage on the electronic component 51 side is alleviated. Further, when the base material 20 is going to extend in a direction intersecting the straight line L1, the first reinforcing member 31 and the electronic component 51 located at both ends of the straight line L1 have a resistance against the extension of the base material 20. It is applied to the material 20. As a result, the deformation of the portion of the base material 20 around the electronic component 51 is relaxed, so that a large stress is locally generated in the portion of the wiring 52 on the base material 20 around the electronic component 51, and It is possible to prevent the 52 from being caught below the electronic component 51.
　特に本実施形態では、隣り合う第１補強部材３１の間を配線５２が通る。この場合、基材２０が直線Ｌ１に対して交差する方向に縮もうとする際に、配線５２の両側に位置する第１補強部材３１の先端に応力が集中することで、基材２０における、隣り合う第１補強部材３１で挟まれる部分の収縮が緩和される。また、基材２０が直線Ｌ１に対して交差する方向に伸びようとする場合に、配線５２の両側に位置する第１補強部材３１が、基材２０の伸びに対する抗力を基材２０に付与する。これにより、基材２０における電子部品５１の周囲の部分の変形が広範囲で緩和されることで、配線５２を効果的に保護できる。
　ここで、第１補強部材３１を第１伸縮抑制部材と想定し、電子部品５１を第２伸縮抑制部材と想定すると、本実施の形態においては、“第１面２１の法線方向に沿って基材２０を見た場合に、配線５２の少なくとも一部は、複数の第１伸縮抑制部材（第１補強部材３１）に外接し、かつ第１伸縮抑制部材をその周長が最短となるように囲う仮想の領域である伸縮抑制領域のうち、第１伸縮抑制部材と重ならない領域に存在している”と言える。
　また、第１補強部材３１を第１伸縮抑制部材と想定し、第２補強部材５２を第２伸縮抑制部材と想定すると、本実施の形態においては、“第１面２１の法線方向に沿って基材２０を見た場合に、配線５２の少なくとも一部は、複数の第１伸縮抑制部材（第１補強部材３１）に外接し、かつ第１伸縮抑制部材をその周長が最短となるように囲う仮想の領域である伸縮抑制領域のうち、第１伸縮抑制部材と重ならない領域に存在している”と言える。 Particularly, in the present embodiment, the wiring 52 passes between the adjacent first reinforcing members 31. In this case, when the base material 20 shrinks in a direction intersecting the straight line L1, stress concentrates on the tips of the first reinforcing members 31 located on both sides of the wiring 52, so that The contraction of the portion sandwiched between the adjacent first reinforcing members 31 is relieved. Further, when the base material 20 is going to extend in the direction intersecting the straight line L1, the first reinforcing members 31 located on both sides of the wiring 52 give the base material 20 a resistance force against the extension of the base material 20. .. Accordingly, the deformation of the portion of the base material 20 around the electronic component 51 is relieved in a wide range, so that the wiring 52 can be effectively protected.
Here, assuming that the first reinforcing member 31 is the first expansion/contraction suppressing member and the electronic component 51 is the second expansion/contraction suppressing member, in the present embodiment, “along the normal direction of the first surface 21” When the base material 20 is viewed, at least a part of the wiring 52 is circumscribed to the plurality of first expansion/contraction suppressing members (first reinforcing members 31), and the first expansion/contraction suppressing member has the shortest circumferential length. It exists in a region that does not overlap with the first expansion-contraction suppressing member, among the expansion-contraction suppressing regions that are virtual regions surrounded by.
Further, assuming that the first reinforcing member 31 is the first expansion/contraction suppressing member and the second reinforcing member 52 is the second expansion/contraction suppressing member, in the present embodiment, “along the normal direction of the first surface 21” When the base material 20 is viewed from above, at least a part of the wiring 52 circumscribes the plurality of first expansion/contraction suppressing members (first reinforcing members 31), and the first expansion/contraction suppressing member has the shortest perimeter. It can be said that it exists in a region that does not overlap with the first expansion-contraction suppressing member, among the expansion-contraction suppressing regions that are imaginary regions that are enclosed as described above.
　なお、図５５の例では、左上側に位置する第１補強部材３１と電子部品５１とを仮想的に結ぶ直線Ｌ１に対して配線５２が交差するとともに、左下側に位置する第１補強部材３１と電子部品５１とを仮想的に結ぶ直線Ｌ２に対して配線５２が交差する。しかしながら、例えば、左下側に位置する第１補強部材３１を設けずに、左上側に位置する第１補強部材３１と電子部品５１とを仮想的に結ぶ直線Ｌ１に対して配線５２が交差するだけであっても、配線５２は効果的に保護される。左上側に位置する第１補強部材３１を設けずに、左下側に位置する第１補強部材３１のみを設けた場合でも、配線５２は効果的に保護される。このことは、図５５において、第１方向Ｄ１で右側に位置する第１補強部材３１の場合も同様である。 In the example of FIG. 55, the wiring 52 intersects with the straight line L1 virtually connecting the first reinforcing member 31 located on the upper left side and the electronic component 51, and the first reinforcing member 31 located on the lower left side. The wiring 52 intersects a straight line L2 that virtually connects the electronic component 51 with the electronic component 51. However, for example, without providing the first reinforcing member 31 located on the lower left side, the wiring 52 only intersects the straight line L1 virtually connecting the first reinforcing member 31 located on the upper left side and the electronic component 51. However, the wiring 52 is effectively protected. Even if only the first reinforcing member 31 located on the lower left side is provided without providing the first reinforcing member 31 located on the upper left side, the wiring 52 is effectively protected. This also applies to the first reinforcing member 31 located on the right side in the first direction D1 in FIG. 55.
　なお、図５５及び図５６に示す例では、第１補強部材３１が連続して、第２補強部材３２から延びるが、第１補強部材３１は、配線５２が延びる方向、つまり第１方向Ｄ１で分断されていてもよい。 55 and 56, the first reinforcing member 31 continuously extends from the second reinforcing member 32, but the first reinforcing member 31 extends in the direction in which the wiring 52 extends, that is, in the first direction D1. It may be divided.
　また、図５７Ａに示すように、本例では、電子部品５１及び補強部材３０は、基材２０において、配線５２の蛇腹形状部５７に対し、第１方向Ｄ１でずれた位置に設けられる。後述するように、基材２０に張力を加えて伸長させた状態で、電子部品５１及び補強部材３０を設ける場合には、張力を取り除いた後の基材２０の第１面２１又は配線５２における、電子部品５１及び補強部材３０が位置する部分、および、第１方向Ｄ１と直交する方向において、平面視で第１補強部材３１と隣接する部分に、蛇腹形状部５７の山部及び谷部よりも周期が大きく且つ振幅が小さい、図５７Ｂに示すような山部７１，８１及び谷部７２，８２が形成される場合がある。すなわち、基材２０における配線５２が位置する部分、及び電子部品５１と補強部材３０とが位置する部分、及び、第１方向Ｄ１と直交する方向において、平面視で第１補強部材３１と隣接する部分を含む領域のそれぞれに、山部及び谷部が形成される場合がある。このような山部７１，８１及び谷部７２，８２は、電子部品５１に近づくに従い、次第に周期が大きくなり且つ振幅が小さくなる傾向がある。なお、基材２０に張力を加えて伸長させた状態で電子部品５１及び補強部材３０を設けた場合においては、基材２０の第１面２１及び配線５２における電子部品５１及び補強部材３０が位置する部分等に、山部及び谷部が形成されない場合もあり得る。一方で、基材２０に張力を加えて伸長させた状態で、電子部品５１及び配線５２を設けた後、張力を取り除いて、補強部材３０を設ける場合には、基材２０の第１面２１及び配線５２における補強部材３０が位置する部分等に、蛇腹形状部５７の山部及び谷部と同じ周期及び振幅の山部及び谷部が形成される場合もある。 Further, as shown in FIG. 57A, in this example, the electronic component 51 and the reinforcing member 30 are provided on the base material 20 at positions displaced from the bellows-shaped portion 57 of the wiring 52 in the first direction D1. As will be described later, in the case where the electronic component 51 and the reinforcing member 30 are provided in a state where the base material 20 is stretched by applying tension, in the first surface 21 or the wiring 52 of the base material 20 after the tension is removed. In the portion where the electronic component 51 and the reinforcing member 30 are located and in the portion that is adjacent to the first reinforcing member 31 in a plan view in the direction orthogonal to the first direction D1, the peak portion and the valley portion of the bellows-shaped portion 57 57B, peaks 71, 81 and valleys 72, 82 having a large cycle and a small amplitude may be formed. That is, in the part where the wiring 52 is located in the base material 20, the part where the electronic component 51 and the reinforcing member 30 are located, and in the direction orthogonal to the first direction D1, it is adjacent to the first reinforcing member 31 in plan view. A peak portion and a valley portion may be formed in each of the regions including the portion. The peaks 71 and 81 and the valleys 72 and 82 tend to gradually increase in cycle and decrease in amplitude as they approach the electronic component 51. When the electronic component 51 and the reinforcing member 30 are provided in a state where the base member 20 is stretched by applying tension, the electronic component 51 and the reinforcing member 30 in the first surface 21 and the wiring 52 of the base member 20 are positioned. There may be a case where the peak portion and the valley portion are not formed in the portion to be formed. On the other hand, when the reinforcing member 30 is provided by removing the tension after providing the electronic component 51 and the wiring 52 in the state where the substrate 20 is stretched by applying the tension, the first surface 21 of the substrate 20 In some cases, the peaks and troughs having the same period and amplitude as the peaks and troughs of the bellows-shaped portion 57 may be formed in the portion of the wiring 52 where the reinforcing member 30 is located.
　また、基材２０に張力を加えて伸長させた状態で、電子部品５１及び補強部材３０を設け、その後、張力を取り除いた場合には、図５８Ｂに示すように、基材２０における電子部品５１及び補強部材３０が位置する部分は伸び状態になっており、基材２０における配線５２に蛇腹形状部５７が設けられる部分よりも、厚みが小さくなる場合がある。このような厚みの減少分が比較的大きくなる場合には、図５８Ｂに示すように、例えばゴム材料９０を塗工して、基材２０の厚みを均一化するのが良い。 Further, when the electronic component 51 and the reinforcing member 30 are provided in a state where the base material 20 is stretched by applying a tension, and then the tension is removed, as shown in FIG. 58B, the electronic component 51 in the base material 20. Also, the portion where the reinforcing member 30 is located is in an expanded state, and the thickness may be smaller than the portion where the bellows-shaped portion 57 is provided in the wiring 52 of the base material 20. When such a decrease in thickness is relatively large, it is preferable to apply a rubber material 90, for example, to make the thickness of the base material 20 uniform, as shown in FIG. 58B.
　また、図示はしないが、配線基板７１０は、補強部材３１，３２のうち基材２０とは反対側の面に位置する粘着層を更に備えていてもよい。粘着層は、配線基板７１０を人の身体などの対象物に貼付するために設けられるものである。粘着層は、配線５２のうち基材２０とは反対側の面、電子部品５１のうち基材２０とは反対側の面などに位置していてもよい。 Although not shown, the wiring board 710 may further include an adhesive layer located on the surface of the reinforcing members 31 and 32 opposite to the base material 20. The adhesive layer is provided to attach the wiring board 710 to an object such as a human body. The adhesive layer may be located on the surface of the wiring 52 opposite to the base material 20, the surface of the electronic component 51 opposite to the base material 20, or the like.
　粘着層を構成する材料としては、一般的な粘着剤を用いることができ、配線基板７１０の用途等に応じて適宜選択される。例えば、アクリル系粘着剤、シリコーン系粘着剤、ウレタン系粘着剤、ゴム系粘着剤等が挙げられる。
　粘着層の厚みは、粘着層が伸縮可能であり、且つ配線基板７１０を対象物に貼付可能であるよう、伸縮性回路基材の用途等に応じて適宜選択される。粘着層の厚みは、例えば１０μｍ以上１００μｍ以下の範囲内である。 As a material forming the adhesive layer, a general adhesive can be used and is appropriately selected according to the application of the wiring board 710 and the like. For example, acrylic adhesives, silicone adhesives, urethane adhesives, rubber adhesives and the like can be mentioned.
The thickness of the adhesive layer is appropriately selected according to the application of the elastic circuit substrate so that the adhesive layer can expand and contract and the wiring board 710 can be attached to an object. The thickness of the adhesive layer is, for example, in the range of 10 μm or more and 100 μm or less.
　補強部材３１，３２は、基材２０の第１の弾性係数よりも大きい弾性係数を有してもよい。補強部材３１，３２の弾性係数は、例えば０．１ＧＰａ以上５００ＧＰａ以下であり、より好ましくは０．１ＧＰａ以上１００ＧＰａ以下である。このような補強部材３１，３２を基材２０に設けることにより、基材２０のうち補強部材３１，３２と重なる部分が伸縮することを抑制することができる。これにより、基材２０を、伸縮が生じやすい部分と、伸縮が生じにくい部分とに区画することができる。補強部材３１，３２の弾性係数が低すぎると、伸縮の制御がしにくい場合がある。また、補強部材３１，３２の弾性係数が高すぎると、基材２０が伸縮した際に、割れやひびなど構造の破壊が補強部材３１，３２に起こる場合がある。補強部材３１，３２の弾性係数は、基材２０の第１の弾性係数の１．１倍以上１００００００倍以下であってもよく、より好ましくは１０００００倍以下である。以下の説明において、補強部材３１，３２の弾性係数のことを、第２の弾性係数とも称する。なお、「重なる」とは、基材２０の第１面２１の法線方向に沿って見た場合に２つの構成要素が重なることを意味している。 The reinforcing members 31 and 32 may have a modulus of elasticity larger than the first modulus of elasticity of the base material 20. The elastic coefficients of the reinforcing members 31 and 32 are, for example, 0.1 GPa or more and 500 GPa or less, and more preferably 0.1 GPa or more and 100 GPa or less. By providing such reinforcing members 31 and 32 on the base material 20, it is possible to prevent the portion of the base material 20 that overlaps the reinforcing members 31 and 32 from expanding and contracting. As a result, the base material 20 can be divided into a portion that easily expands and contracts and a portion that hardly expands and contracts. If the elastic coefficients of the reinforcing members 31 and 32 are too low, it may be difficult to control expansion and contraction. In addition, if the elastic coefficients of the reinforcing members 31 and 32 are too high, the reinforcing members 31 and 32 may suffer structural damage such as cracks or cracks when the base material 20 expands and contracts. The elastic coefficients of the reinforcing members 31 and 32 may be 1.1 times or more and 1,000,000 times or less, and more preferably 100,000 times or less the first elastic coefficient of the base material 20. In the following description, the elastic coefficients of the reinforcing members 31 and 32 are also referred to as second elastic coefficients. Note that “overlapping” means that the two constituent elements overlap when viewed along the normal direction of the first surface 21 of the base material 20.
　補強部材３１，３２の第２の弾性係数を算出する方法は、補強部材３１，３２の形態に応じて適宜定められる。例えば、補強部材３１，３２の第２の弾性係数を算出する方法は、上述の基材２０の弾性係数を算出する方法と同様であってもよく、異なっていてもよい。後述する支持基板４０の弾性係数も同様である。例えば、補強部材３１，３２又は支持基板４０の弾性係数を算出する方法として、補強部材３１，３２又は支持基板４０のサンプルを用いて、ＡＳＴＭ　Ｄ８８２に準拠して引張試験を実施するという方法を採用することができる。 The method of calculating the second elastic modulus of the reinforcing members 31 and 32 is appropriately determined according to the form of the reinforcing members 31 and 32. For example, the method of calculating the second elastic coefficient of the reinforcing members 31 and 32 may be the same as or different from the method of calculating the elastic coefficient of the base material 20 described above. The elastic modulus of the support substrate 40 described later is also the same. For example, as a method of calculating the elastic coefficient of the reinforcing members 31 and 32 or the supporting substrate 40, a method of performing a tensile test according to ASTM D882 using a sample of the reinforcing members 31 and 32 or the supporting substrate 40 is adopted. can do.
　補強部材３１，３２の第２の弾性係数が基材２０の第１の弾性係数よりも大きい場合、補強部材３１，３２を構成する材料として、金属材料を用いることができる。金属材料の例としては、銅、アルミニウム、ステンレス鋼等を挙げることができる。また、金属材料として、半田材料が用いられてもよい。また、補強部材３１，３２を構成する材料として、一般的な熱可塑性エラストマーや、アクリル系、ウレタン系、エポキシ系、ポリエステル系、エポキシ系、ビニルエーテル系、ポリエン・チオール系又はシリコーン系等のオリゴマー、ポリマーなどを用いてもよい。補強部材３１，３２を構成する材料がこれらの樹脂である場合、補強部材３１，３２は、透明性を有していてもよい。また、補強部材３１，３２は、遮光性、例えば紫外線を遮蔽する特性を有していてもよい。例えば、補強部材３１，３２は黒色であってもよい。また、補強部材３１，３２の色と基材２０の色とが同一であってもよい。補強部材３１，３２の厚みは、本実施の形態において、例えば１μｍ以上１００μｍ以下である。しかし、後述する図６０や図６１のような構造であるときは、補強部材３１，３２の厚みが数ｍｍ、例えば１ｍｍ以上５ｍｍ以下となる場合もある。 When the second elastic coefficients of the reinforcing members 31 and 32 are larger than the first elastic coefficient of the base material 20, a metal material can be used as the material forming the reinforcing members 31 and 32. Examples of metal materials include copper, aluminum, stainless steel and the like. Further, a solder material may be used as the metal material. In addition, as a material for forming the reinforcing members 31 and 32, a general thermoplastic elastomer, an acrylic-based, urethane-based, epoxy-based, polyester-based, epoxy-based, vinyl ether-based, polyene-thiol-based, or silicone-based oligomer, A polymer or the like may be used. When the materials forming the reinforcing members 31 and 32 are these resins, the reinforcing members 31 and 32 may have transparency. Further, the reinforcing members 31 and 32 may have a light blocking property, for example, a property of blocking ultraviolet rays. For example, the reinforcing members 31 and 32 may be black. Further, the colors of the reinforcing members 31 and 32 and the color of the base material 20 may be the same. In the present embodiment, the thickness of the reinforcing members 31 and 32 is, for example, 1 μm or more and 100 μm or less. However, in the case of the structure shown in FIGS. 60 and 61 described later, the thickness of the reinforcing members 31 and 32 may be several mm, for example, 1 mm or more and 5 mm or less.
　若しくは、補強部材３１，３２の第２の弾性係数は、基材２０の第１の弾性係数以下であってもよい。補強部材３１，３２の第２の弾性係数は、例えば１０ＭＰａ以下であり、１ＭＰａ以下であってもよい。補強部材３１，３２の第２の弾性係数は、基材２０の第１の弾性係数の１倍以下であってもよく、０．８倍以下であってもよい。 Alternatively, the second elastic coefficients of the reinforcing members 31 and 32 may be equal to or lower than the first elastic coefficient of the base material 20. The second elastic modulus of the reinforcing members 31 and 32 is, for example, 10 MPa or less, and may be 1 MPa or less. The second elastic modulus of the reinforcing members 31 and 32 may be 1 time or less, or 0.8 times or less that of the first elastic coefficient of the base material 20.
　補強部材３１，３２の第２の弾性係数が基材２０の第１の弾性係数以下の場合、補強部材３１，３２を構成する材料として、一般的な熱可塑性エラストマーおよび熱硬化性エラストマーを用いることができ、例えば、スチレン系エラストマー、アクリル系エラストマー、オレフィン系エラストマー、ウレタン系エラストマー、シリコーンゴム、ウレタンゴム、フッ素ゴム、ニトリルゴム、ポリブタジエン、ポリクロロプレンが挙げられる。この場合、補強部材３１，３２の厚みは、本実施の形態において、例えば１μｍ以上１００μｍ以下である。しかし、後述する図６０や図６１のような構造であるときは、補強部材３１，３２の厚みが数ｍｍ、例えば１ｍｍ以上５ｍｍ以下となる場合もある。 When the second elastic coefficients of the reinforcing members 31 and 32 are equal to or lower than the first elastic coefficient of the base material 20, a general thermoplastic elastomer and a thermosetting elastomer are used as the material forming the reinforcing members 31 and 32. Examples thereof include styrene elastomer, acrylic elastomer, olefin elastomer, urethane elastomer, silicone rubber, urethane rubber, fluororubber, nitrile rubber, polybutadiene and polychloroprene. In this case, the thickness of the reinforcing members 31 and 32 is, for example, 1 μm or more and 100 μm or less in the present embodiment. However, in the case of the structure shown in FIGS. 60 and 61 described later, the thickness of the reinforcing members 31 and 32 may be several mm, for example, 1 mm or more and 5 mm or less.
　なお、第１補強部材３１の弾性係数と第２補強部材３２の弾性係数とは、同一であってもよい。この場合、第１補強部材３１及び第２補強部材３２を同一の工程で同時に形成することができるので、補強部材３１，３２の形成工程が簡便になる。また、第１補強部材３１の弾性係数と第２補強部材３２の弾性係数とは、異なっていてもよい。この場合、第１補強部材３１の弾性係数が、第２補強部材３２の弾性係数よりも高いことが好ましい。 The elastic coefficient of the first reinforcing member 31 and the elastic coefficient of the second reinforcing member 32 may be the same. In this case, since the first reinforcing member 31 and the second reinforcing member 32 can be simultaneously formed in the same step, the step of forming the reinforcing members 31 and 32 becomes simple. Further, the elastic coefficient of the first reinforcing member 31 and the elastic coefficient of the second reinforcing member 32 may be different. In this case, the elastic coefficient of the first reinforcing member 31 is preferably higher than the elastic coefficient of the second reinforcing member 32.
　第１補強部材３１の材料や厚みと第２補強部材３２の材料や厚みとは、同一であってもよい。この場合、補強部材３１，３２の形成工程が簡便になる。また、第１補強部材３１の材料や厚みと第２補強部材３２の材料や厚みとは、異なっていてもよい。 The material and thickness of the first reinforcing member 31 and the material and thickness of the second reinforcing member 32 may be the same. In this case, the step of forming the reinforcing members 31 and 32 becomes simple. The material and thickness of the first reinforcing member 31 and the material and thickness of the second reinforcing member 32 may be different.
　補強部材３１，３２の特性を、弾性係数に替えて曲げ剛性によって表してもよい。補強部材３１，３２の断面二次モーメントは、配線基板７１０の伸縮方向に直交する平面によって補強部材３１，３２を切断した場合の断面に基づいて算出される。補強部材３１，３２の曲げ剛性は、基材２０の曲げ剛性の１．１倍以上であってもよく、より好ましくは２倍以上であり、更に好ましくは１０倍以上である。 The characteristics of the reinforcing members 31 and 32 may be expressed by bending rigidity instead of elastic modulus. The second moment of area of the reinforcing members 31 and 32 is calculated based on the cross section when the reinforcing members 31 and 32 are cut by the plane orthogonal to the expansion/contraction direction of the wiring board 710. The bending rigidity of the reinforcing members 31 and 32 may be 1.1 times or more of the bending rigidity of the base material 20, more preferably 2 times or more, and further preferably 10 times or more.
　若しくは、補強部材３１，３２の曲げ剛性は、基材２０の曲げ剛性以下であってもよい。例えば、補強部材３１，３２の曲げ剛性は、基材２０の曲げ剛性の１倍以下であってもよく、０．８倍以下であってもよい。 Alternatively, the bending rigidity of the reinforcing members 31 and 32 may be equal to or less than the bending rigidity of the base material 20. For example, the bending rigidity of the reinforcing members 31 and 32 may be 1 time or less, or 0.8 times or less that of the base material 20.
　補強部材３１，３２の形成方法は、材料等に応じて適宜選択される。例えば、基材２０上または後述する支持基板４０上に蒸着法やスパッタリング法等により金属膜を形成した後、フォトリソグラフィ法により金属膜をパターニングする方法が挙げられる。また、基材２０上または後述する支持基板４０上に、例えばＣｕの配線５２と、Ｃｕの第１補強部材３１の一部とを形成し、その後、Ｃｕの第１補強部材３１の一部上にメタルマスク印刷により半田材料で第１補強部材３１の他の一部を形成してもよい。ここで、半田材料でなる第１補強部材３１は、配線５２上に形成される電子部品５１との接続のための半田材料でなる接続部５１ａと同時に形成されてもよい。そして、その後、半田材料を溶かすためのリフロー時に、半田材料でなる第１補強部材３１が、Ｃｕの第１補強部材３１の表面に濡れ広がるようにしてもよい。また、基材２０上または支持基板４０上にスピンコート法などの印刷法等により全面に有機層などの樹脂膜を形成した後、フォトリソグラフィ法により樹脂膜をパターニングする方法が挙げられる。また、例えば、基材２０上または支持基板４０上に一般的な印刷法により補強部材３１，３２の材料をパターン状に印刷する方法が挙げられる。これらの方法のうち、材料効率がよく安価に製作できる印刷法が好ましく用いられ得る。印刷法としては、スクリーン印刷や、ディスペンサによる印刷が用いられ得る。基材２０上または支持基板４０上に電子部品等の部品が実装された後においては、ディスペンサによる印刷の方が効率的に補強部材３１，３２を形成し得る。 The method of forming the reinforcing members 31 and 32 is appropriately selected according to the material and the like. For example, a method of forming a metal film on the base material 20 or a supporting substrate 40 described later by a vapor deposition method, a sputtering method, or the like and then patterning the metal film by a photolithography method can be mentioned. Further, for example, a Cu wiring 52 and a part of the Cu first reinforcing member 31 are formed on the base material 20 or a support substrate 40 described later, and then, on a part of the Cu first reinforcing member 31. Alternatively, another portion of the first reinforcing member 31 may be formed of a solder material by printing a metal mask. Here, the first reinforcing member 31 made of a solder material may be formed at the same time as the connecting portion 51a made of a solder material for connection with the electronic component 51 formed on the wiring 52. Then, after that, at the time of reflow for melting the solder material, the first reinforcing member 31 made of the solder material may spread on the surface of the first reinforcing member 31 made of Cu. Further, a method of forming a resin film such as an organic layer on the entire surface of the base material 20 or the supporting substrate 40 by a printing method such as a spin coating method or the like and then patterning the resin film by a photolithography method may be mentioned. Further, for example, there is a method of printing the material of the reinforcing members 31 and 32 in a pattern on the base material 20 or the support substrate 40 by a general printing method. Among these methods, a printing method that can be manufactured with high material efficiency and at low cost can be preferably used. As the printing method, screen printing or printing with a dispenser can be used. After components such as electronic components are mounted on the base material 20 or the support substrate 40, printing with a dispenser can form the reinforcing members 31 and 32 more efficiently.
　（配線基板の製造方法）
　以下、図５９ａ～ｄを参照して、配線基板７１０の製造方法について説明する。 (Method of manufacturing wiring board)
Hereinafter, a method of manufacturing the wiring board 710 will be described with reference to FIGS.
　まず、図５９ａに示すように、伸縮性を有する基材２０を準備する基材準備工程を実施する。続いて、図５９ｂに示すように、基材２０に引張応力Ｔを加えて基材２０を伸長させる伸長工程を実施する。続いて、引張応力Ｔによって伸長した状態の基材２０の第１面２１に、電子部品５１及び配線５２を設ける工程を実施する。さらに、図５９ｃに示すように、引張応力Ｔによって伸長した状態の基材２０の第１面２１に、第１補強部材３１及び第２補強部材３２を含む補強部材３０を設ける工程を実施する。 First, as shown in FIG. 59a, a base material preparing step of preparing a base material 20 having elasticity is performed. Then, as shown in FIG. 59b, a stretching step of stretching the substrate 20 by applying tensile stress T to the substrate 20 is performed. Subsequently, a step of providing the electronic component 51 and the wiring 52 on the first surface 21 of the base material 20 which is stretched by the tensile stress T is performed. Further, as shown in FIG. 59c, the step of providing the reinforcing member 30 including the first reinforcing member 31 and the second reinforcing member 32 on the first surface 21 of the base material 20 in the state of being elongated by the tensile stress T is performed.
　その後、基材２０から引張応力Ｔを取り除く収縮工程を実施する。これにより、図５９ｄにおいて矢印Ｃで示すように、基材２０が収縮し、基材２０に設けられている配線５２にも変形が生じる。 After that, a shrinking process for removing the tensile stress T from the base material 20 is performed. As a result, as shown by the arrow C in FIG. 59d, the base material 20 contracts, and the wiring 52 provided on the base material 20 is also deformed.
　伸縮性を有する配線基板では、通常、配線と電子部品とが接続される。この構成では、基材の伸縮により、配線が、電子部品の下方、言い換えると電子部品の基材側に巻き込まれることがある。また、配線に局所的に大きい応力が生じたりすることがある。
　以上に説明した本実施形態においては、配線基板７１０上の配線５２が、第１補強部材３１と電子部品５１とを仮想的に結ぶ少なくともいずれかの直線に対して交差するようになっている。これにより、基材２０における電子部品５１の周囲の部分の変形が緩和されることで、基材２０上の配線５２における電子部品５１の周囲の部分に局所的に大きい応力が生じることや、配線５２が電子部品５１の下方に巻き込まれることを抑制することができる。 In a stretchable wiring board, the wiring and the electronic component are usually connected. In this configuration, due to the expansion and contraction of the base material, the wiring may be caught below the electronic component, in other words, on the base material side of the electronic component. In addition, a large stress may locally occur in the wiring.
In the present embodiment described above, the wiring 52 on the wiring board 710 intersects at least one straight line virtually connecting the first reinforcing member 31 and the electronic component 51. As a result, the deformation of the portion of the base material 20 around the electronic component 51 is relaxed, so that a large stress is locally generated in the portion of the wiring 52 on the base material 20 around the electronic component 51, and It is possible to prevent the 52 from being caught under the electronic component 51.
　配線基板７１０の用途としては、ヘルスケア分野、医療分野、介護分野、エレクトロニクス分野、スポーツ・フィットネス分野、美容分野、モビリティ分野、畜産・ペット分野、アミューズメント分野、ファッション・アパレル分野、セキュリティ分野、ミリタリー分野、流通分野、教育分野、建材・家具・装飾分野、環境エネルギー分野、農林水産分野、ロボット分野などを挙げることができる。例えば、人の腕などの身体の一部に取り付ける製品を、本実施形態による配線基板７１０を用いて構成する。配線基板７１０は伸張することができるので、例えば配線基板７１０を伸長させた状態で身体に取り付けることにより、配線基板７１０を身体の一部により密着させることができる。このため、良好な着用感を実現することができる。また、配線基板７１０が伸張した場合に配線５２の抵抗値が低下することを抑制することができるので、配線基板７１０の良好な電気特性を実現することができる。他にも配線基板７１０は伸長することができるので、人などの生体に限らず曲面や立体形状に沿わせて設置や組込むことが可能である。それらの製品の一例としては、バイタルセンサ、マスク、補聴器、歯ブラシ、絆創膏、湿布、コンタクトレンズ、義手、義足、義眼、カテーテル、ガーゼ、薬液パック、包帯、ディスポーザブル生体電極、おむつ、家電製品、スポーツウェア、リストバンド、はちまき、手袋、水着、サポーター、ボール、ラケット、薬液浸透美容マスク、電気刺激ダイエット用品、懐炉、自動車内装、シート、インパネ、ベビーカー、ドローン、車椅子、タイヤ、首輪、リード、ハプティクスデバイス、ランチョンマット、帽子、服、メガネ、靴、インソール、靴下、ストッキング、インナーウェア、マフラー、耳あて、鞄、アクセサリー、指輪、付け爪、時計、個人ID認識デバイス、ヘルメット、パッケージ、ICタグ、ペットボトル、文具、書籍、カーペット、ソファ、寝具、照明、ドアノブ、花瓶、ベッド、マットレス、座布団、ワイヤレス給電アンテナ、電池、ビニールハウス、ロボットハンド、ロボット外装を挙げることができる。 The wiring board 710 is used in the healthcare field, medical field, nursing field, electronics field, sports field, fitness field, beauty field, mobility field, livestock/pet field, amusement field, fashion/apparel field, security field, military field. , Distribution field, education field, building materials/furniture/decoration field, environmental energy field, agriculture, forestry and fisheries field, robot field, etc. For example, a product to be attached to a part of the body such as a human arm is configured using the wiring board 710 according to the present embodiment. Since the wiring board 710 can be expanded, the wiring board 710 can be brought into closer contact with a part of the body by, for example, attaching the wiring board 710 to the body in an expanded state. Therefore, a good wearing feeling can be realized. Further, it is possible to prevent the resistance value of the wiring 52 from being lowered when the wiring board 710 is expanded, and thus it is possible to realize good electrical characteristics of the wiring board 710. In addition, since the wiring board 710 can be extended, the wiring board 710 can be installed or incorporated along a curved surface or a three-dimensional shape, not limited to a living body such as a person. Examples of such products include vital sensors, masks, hearing aids, toothbrushes, bandages, compresses, contact lenses, artificial hands, artificial legs, artificial eyes, catheters, gauze, drug packs, bandages, disposable bioelectrodes, diapers, home appliances, sportswear. , Wristbands, hemaki, gloves, swimwear, supporters, balls, rackets, liquid medicine beauty masks, electrostimulation diet products, pocket furnaces, automobile interiors, seats, instrument panels, strollers, drones, wheelchairs, tires, collars, leads, haptics devices , Place mats, hats, clothes, glasses, shoes, insoles, socks, stockings, innerwear, mufflers, ear pads, bags, accessories, rings, artificial nails, watches, personal ID recognition devices, helmets, packages, IC tags, pets Examples include bottles, stationery, books, carpets, sofas, bedding, lighting, door knobs, vases, beds, mattresses, cushions, wireless power feeding antennas, batteries, vinyl houses, robot hands, and robot exteriors.
　なお、上述した実施形態に対して様々な変更を加えることが可能である。以下、必要に応じて図面を参照しながら、変形例について説明する。以下の説明および以下の説明で用いる図面では、上述した実施形態と同様に構成され得る部分について、上述の実施形態における対応する部分に対して用いた符号と同一の符号を用いることとし、重複する説明を省略する。また、上述した実施形態において得られる作用効果が変形例においても得られることが明らかである場合、その説明を省略することもある。 Note that various changes can be made to the above-described embodiment. Modifications will be described below with reference to the drawings as necessary. In the following description and the drawings used in the following description, the same reference numerals as those used for the corresponding portions in the above-described embodiment will be used for the portions that can be configured in the same manner as in the above-described embodiment, and will be duplicated. The description is omitted. Further, when it is clear that the effects obtained in the above-described embodiment can be obtained in the modified example as well, the description thereof may be omitted.
　（補強部材の変形例）
　以下、補強部材３０のいくつかの変形例について説明する。まず、補強部材３０の第１補強部材３１及び第２補強部材３２の断面構造及び平面視形状の変形例について、図６０乃至図７３Ｄを参照してそれぞれ説明する。 (Modification of the reinforcing member)
Hereinafter, some modified examples of the reinforcing member 30 will be described. First, modifications of the cross-sectional structure and the plan view shape of the first reinforcing member 31 and the second reinforcing member 32 of the reinforcing member 30 will be described with reference to FIGS. 60 to 73D.
　〔断面構造の第１変形例〕
　図６０に示す変形例では、補強部材３０の第１補強部材３１及び第２補強部材３２が、基材２０の第１面２１の法線方向で、第１面２１から電子部品５１を越えるように延びる。そして、第１補強部材３１の表面及び第２補強部材３２の表面は、基材２０の第１面２１の法線方向で電子部品５１の表面と同じ位置または電子部品５１の表面を越えない位置に位置する。なお、表面とは、第１補強部材３１の面、第２補強部材３２の面、電子部品５１の面のそれぞれのうち基材２０から遠い側に位置する面である。また、図示例では、第１補強部材３１の表面及び第２補強部材３２の表面が連続している。
　なお、図６０に示す変形例において、第１補強部材３１の厚みと第２補強部材３２の厚みは互いに異なっていてもよい。例えば、第１補強部材３１の厚みよりも第２補強部材３２の厚みが小さくもよい。また、第１補強部材３１の厚みは一定でなくてもよいし、第２補強部材３２の厚みは一定でなくてもよい。例えば、第１補強部材３１の厚みは、電子部品５１から離れるに従い小さくなってもよい。また、第１補強部材３１の表面及び第２補強部材３２の表面は、電子部品５１の表面と裏面との間に位置してもよい。 [First Modification of Sectional Structure]
In the modification shown in FIG. 60, the first reinforcing member 31 and the second reinforcing member 32 of the reinforcing member 30 cross the electronic component 51 from the first surface 21 in the normal direction of the first surface 21 of the base material 20. Extend to. The surface of the first reinforcing member 31 and the surface of the second reinforcing member 32 are at the same position as the surface of the electronic component 51 in the normal direction of the first surface 21 of the base material 20 or at a position not exceeding the surface of the electronic component 51. Located in. The surface is a surface of the surface of the first reinforcing member 31, the surface of the second reinforcing member 32, or the surface of the electronic component 51, which is located farther from the base material 20. In the illustrated example, the surface of the first reinforcing member 31 and the surface of the second reinforcing member 32 are continuous.
In the modification shown in FIG. 60, the thickness of the first reinforcing member 31 and the thickness of the second reinforcing member 32 may be different from each other. For example, the thickness of the second reinforcing member 32 may be smaller than the thickness of the first reinforcing member 31. Further, the thickness of the first reinforcing member 31 may not be constant, and the thickness of the second reinforcing member 32 may not be constant. For example, the thickness of the first reinforcing member 31 may decrease as the distance from the electronic component 51 increases. The surface of the first reinforcing member 31 and the surface of the second reinforcing member 32 may be located between the front surface and the back surface of the electronic component 51.
　〔断面構造の第２変形例〕
　図６１に示す変形例では、補強部材３０の第１補強部材３１及び第２補強部材３２が、基材２０の第１面２１の法線方向で、第１面２１から電子部品５１を越えるように延びる。そして、第１補強部材３１の表面及び第２補強部材３２の表面は、基材２０の第１面２１の法線方向で電子部品５１の表面を越えている。そして、第１補強部材３１の表面及び第２補強部材３２の表面は連続している。また、第２補強部材３２は、電子部品５１の周囲に位置するとともに、電子部品５１の表面上にも位置している。
　なお、図６１に示す変形例において、第１補強部材３１の厚みと第２補強部材３２の厚みは互いに異なっていてもよい。例えば、第１補強部材３１の厚みよりも第２補強部材３２の厚みが小さくもよい。また、第１補強部材３１の厚みは一定でなくてもよいし、第２補強部材３２の厚みは一定でなくてもよい。例えば、第１補強部材３１の厚みは、電子部品５１から離れるに従い小さくなってもよい。また、第１補強部材３１の表面は、電子部品５１の表面と裏面との間に位置してもよい。 [Second Modification of Sectional Structure]
In the modification shown in FIG. 61, the first reinforcing member 31 and the second reinforcing member 32 of the reinforcing member 30 are arranged so as to cross the electronic component 51 from the first surface 21 in the normal direction of the first surface 21 of the base material 20. Extend to. The surface of the first reinforcing member 31 and the surface of the second reinforcing member 32 exceed the surface of the electronic component 51 in the normal direction of the first surface 21 of the base material 20. The surface of the first reinforcing member 31 and the surface of the second reinforcing member 32 are continuous. The second reinforcing member 32 is located not only on the periphery of the electronic component 51 but also on the surface of the electronic component 51.
In the modification shown in FIG. 61, the thickness of the first reinforcing member 31 and the thickness of the second reinforcing member 32 may be different from each other. For example, the thickness of the second reinforcing member 32 may be smaller than the thickness of the first reinforcing member 31. Further, the thickness of the first reinforcing member 31 may not be constant, and the thickness of the second reinforcing member 32 may not be constant. For example, the thickness of the first reinforcing member 31 may decrease as the distance from the electronic component 51 increases. The surface of the first reinforcing member 31 may be located between the front surface and the back surface of the electronic component 51.
　〔断面構造の第３変形例〕
　図６２Ａに示す変形例では、補強部材３０の第１補強部材３１及び第２補強部材３２が、配線５２よりも基材２０の第１面２１側に位置する。より具体的には、第１補強部材３１及び第２補強部材３２は、配線５２と基材２０との間に位置していてもよい。この場合、第１補強部材３１及び第２補強部材３２は、基材２０の第１面２１上に位置していてもよく、若しくは、基材２０の第１面２１に設けられた凹部に位置していてもよい。また、図６２Ｄに示すように、配線５２の一部が第１補強部材３１及び第２補強部材３２上に乗り上がるように形成されることで、補強部材３０の第１補強部材３１及び第２補強部材３２が、配線５２よりも基材２０の第１面２１側に位置してもよい。 [Third Modification of Sectional Structure]
In the modification shown in FIG. 62A, the first reinforcing member 31 and the second reinforcing member 32 of the reinforcing member 30 are located closer to the first surface 21 side of the base material 20 than the wiring 52. More specifically, the first reinforcing member 31 and the second reinforcing member 32 may be located between the wiring 52 and the base material 20. In this case, the first reinforcing member 31 and the second reinforcing member 32 may be located on the first surface 21 of the base material 20, or may be located in the recess provided in the first surface 21 of the base material 20. You may have. Further, as shown in FIG. 62D, a part of the wiring 52 is formed so as to ride on the first reinforcing member 31 and the second reinforcing member 32, so that the first reinforcing member 31 and the second reinforcing member 31 of the reinforcing member 30 are formed. The reinforcing member 32 may be located closer to the first surface 21 side of the base material 20 than the wiring 52.
　また、図６２Ｂに示すように、補強部材３０の第１補強部材３１及び第２補強部材３２は、基材２０の内部に設けられ、基材２０から外部に露出しない状態になっていてもよい。また、図６２Ｃに示すように、補強部材３０の第１補強部材３１及び第２補強部材３２は、基材２０の第２面２２側に位置してもよい。基材２０に張力を加えて伸長させた状態で、電子部品５１及び配線５２を第１面２１に設け、補強部材３０を第２面２２に設け、その後、張力を取り除いた場合には、配線５２における電子部品５１が位置しない部分であって法線方向で補強部材３０と重ならない部分に蛇腹形状部５７（図５７Ａ参照）が形成され得る。この際、基材２０の第２面２２における補強部材３０が位置する部分には、蛇腹形状部５７の山部及び谷部よりも周期が大きく且つ振幅が小さい山部及び谷部が形成される場合がある。 Further, as shown in FIG. 62B, the first reinforcing member 31 and the second reinforcing member 32 of the reinforcing member 30 may be provided inside the base material 20 and not exposed from the base material 20 to the outside. .. Further, as shown in FIG. 62C, the first reinforcing member 31 and the second reinforcing member 32 of the reinforcing member 30 may be located on the second surface 22 side of the base material 20. When the base material 20 is stretched by applying tension, the electronic component 51 and the wiring 52 are provided on the first surface 21, the reinforcing member 30 is provided on the second surface 22, and then the tension is removed. A bellows-shaped portion 57 (see FIG. 57A) may be formed in a portion of 52 where the electronic component 51 is not located and does not overlap the reinforcing member 30 in the normal direction. At this time, in the portion of the second surface 22 of the base material 20 where the reinforcing member 30 is located, peaks and troughs having a larger cycle and smaller amplitude than the peaks and troughs of the bellows-shaped portion 57 are formed. There are cases.
　〔断面構造の第４変形例〕
　図６３に示す変形例では、配線基板７１０が、基材２０、補強部材３０、支持基板４０、電子部品５１、配線５２を備える。そして、補強部材３０は、基材２０に支持基板４０を介して間接的に接する。 [Fourth Modification of Sectional Structure]
In the modification shown in FIG. 63, the wiring board 710 includes the base material 20, the reinforcing member 30, the support substrate 40, the electronic component 51, and the wiring 52. Then, the reinforcing member 30 indirectly contacts the base material 20 via the support substrate 40.
　支持基板４０は、基材２０よりも低い伸縮性を有するよう構成された板状の部材である。支持基板４０は、基材２０側に位置する第２面４２と、第２面４２の反対側に位置する第１面４１と、を含む。図６３に示す例において、支持基板４０は、その第１面４１側において電子部品５１、配線５２及び補強部材３０を支持している。また、支持基板４０は、その第２面４２側において基材２０の第１面に接合されている。例えば、基材２０と支持基板４０との間に、接着剤を含む接着層が設けられていてもよい。この場合、接着層を構成する材料としては、例えばアクリル系接着剤、シリコーン系接着剤等を用いることができる。接着層の厚みは、例えば５μｍ以上且つ２００μｍ以下である。また、図示はしないが、非接着表面を分子修飾させて、分子接着結合させる方法によって支持基板４０の第２面４２が基材２０の第１面２１に接合されていてもよい。この場合、基材２０と支持基板４０との間に接着層が設けられていなくてもよい。 The support substrate 40 is a plate-shaped member configured to have a stretchability lower than that of the base material 20. The support substrate 40 includes a second surface 42 located on the base material 20 side and a first surface 41 located on the opposite side of the second surface 42. In the example shown in FIG. 63, the support substrate 40 supports the electronic component 51, the wiring 52, and the reinforcing member 30 on the first surface 41 side thereof. The support substrate 40 is joined to the first surface of the base material 20 on the second surface 42 side. For example, an adhesive layer containing an adhesive may be provided between the base material 20 and the support substrate 40. In this case, as a material forming the adhesive layer, for example, an acrylic adhesive, a silicone adhesive, or the like can be used. The thickness of the adhesive layer is, for example, 5 μm or more and 200 μm or less. Although not shown, the second surface 42 of the support substrate 40 may be bonded to the first surface 21 of the base material 20 by a method of molecularly modifying the non-adhesive surface and performing molecular adhesive bonding. In this case, the adhesive layer may not be provided between the base material 20 and the support substrate 40.
　また、本変形例においては、基材２０に張力を加えて伸長させて、このように伸長させた基材２０に、電子部品５１、配線５２及び補強部材３０を支持した支持基板４０が接合される。支持基板４０と接合された基材２０から引張応力が取り除かれて基材２０が収縮するとき、支持基板４０及び配線５２に蛇腹形状部５７が形成される。支持基板４０の特性や寸法は、このような蛇腹形状部５７が形成され易くなるよう設定されている。例えば、支持基板４０は、基材２０の第１の弾性係数よりも大きい弾性係数を有する。以下の説明において、支持基板４０の弾性係数のことを、第３の弾性係数とも称する。 Further, in the present modification, tension is applied to the base material 20 to extend the base material 20, and the support substrate 40 supporting the electronic component 51, the wiring 52, and the reinforcing member 30 is bonded to the base material 20 thus extended. It When the tensile stress is removed from the base material 20 bonded to the support substrate 40 and the base material 20 contracts, the bellows-shaped portion 57 is formed on the support substrate 40 and the wiring 52. The characteristics and dimensions of the support substrate 40 are set so that the bellows-shaped portion 57 is easily formed. For example, the support substrate 40 has a modulus of elasticity larger than the first modulus of elasticity of the base material 20. In the following description, the elastic coefficient of the support substrate 40 is also referred to as the third elastic coefficient.
　支持基板４０の第３の弾性係数は、例えば１００ＭＰａ以上であり、より好ましくは１ＧＰａ以上である。また、支持基板４０の第３の弾性係数は、基材２０の第１の弾性係数の１００倍以上５００００倍以下であってもよく、好ましくは１０００倍以上１００００倍以下である。このように支持基板４０の第３の弾性係数を設定することにより、蛇腹形状部５７の周期が小さくなり過ぎることを抑制することができる。また、蛇腹形状部５７において局所的な折れ曲がりが生じることを抑制することができる。
　なお、支持基板４０の弾性係数が低すぎると、補強部材３１，３２の形成工程中に支持基板４０が変形し易く、この結果、電子部品５１及び配線５２に対する補強部材３１，３２の位置合わせが難しくなる。また、支持基板４０の弾性係数が高すぎると、弛緩時の基材２０の復元が難しくなり、また基材２０の割れや折れが発生し易くなる。 The third elastic coefficient of the support substrate 40 is, for example, 100 MPa or more, and more preferably 1 GPa or more. The third elastic modulus of the support substrate 40 may be 100 times or more and 50,000 times or less, preferably 1000 times or more and 10,000 times or less than the first elastic coefficient of the base material 20. By setting the third elastic coefficient of the support substrate 40 in this way, it is possible to prevent the cycle of the bellows-shaped portion 57 from becoming too small. Further, it is possible to suppress the local bending in the bellows-shaped portion 57.
If the elastic modulus of the support substrate 40 is too low, the support substrate 40 is likely to be deformed during the step of forming the reinforcing members 31 and 32, and as a result, the positioning of the reinforcing members 31 and 32 with respect to the electronic component 51 and the wiring 52 is performed. It gets harder. If the elastic modulus of the support substrate 40 is too high, it becomes difficult to restore the base material 20 when it relaxes, and the base material 20 is likely to crack or break.
　また、支持基板４０の厚みは、例えば５００ｎｍ以上１０μｍ以下であり、より好ましくは１μｍ以上５μｍ以下である。支持基板４０の厚みが小さすぎると、支持基板４０の製造工程や、支持基板４０上に部材を形成する工程における、支持基板４０のハンドリングが難しくなる。支持基板４０の厚みが大きすぎると、弛緩時の基材２０の復元が難しくなり、目標の基材２０の伸縮が得られなくなる。 The thickness of the support substrate 40 is, for example, 500 nm or more and 10 μm or less, and more preferably 1 μm or more and 5 μm or less. If the thickness of the support substrate 40 is too small, it becomes difficult to handle the support substrate 40 in the process of manufacturing the support substrate 40 and the process of forming a member on the support substrate 40. If the thickness of the support substrate 40 is too large, it becomes difficult to restore the base material 20 when it relaxes, and the target expansion and contraction of the base material 20 cannot be obtained.
　支持基板４０を構成する材料としては、例えば、ポリエチレンナフタレート、ポリイミド、ポリエチレンテレフタレート、ポリカーボネート、アクリル樹脂等を用いることができる。その中でも、耐久性や耐熱性がよいポリエチレンナフタレートかポリイミドが好ましく用いられ得る。 As the material forming the support substrate 40, for example, polyethylene naphthalate, polyimide, polyethylene terephthalate, polycarbonate, acrylic resin or the like can be used. Among them, polyethylene naphthalate or polyimide having good durability and heat resistance can be preferably used.
　支持基板４０の第３の弾性係数は、基材２０の第１の弾性係数の１００倍以下であってもよい。支持基板４０の第３の弾性係数を算出する方法は、基材２０の場合と同様である。 The third elastic coefficient of the support substrate 40 may be 100 times or less the first elastic coefficient of the base material 20. The method of calculating the third elastic coefficient of the support substrate 40 is the same as that of the base material 20.
　〔断面構造の第５変形例〕
　図６４Ａに示す変形例では、配線基板７１０が、基材２０、補強部材３０、支持基板４０、電子部品５１、配線５２を備えるが、支持基板４０の位置が図６３に示す例とは異なる。詳しくは、支持基板４０は、基材２０の第１面２１及び第１面２１上に設けられた補強部材３０上に設けられている。支持基板４０は、その第１面４１側において電子部品５１及び配線５２を支持している。また、支持基板４０は、その第２面４２側において基材２０の第１面２１及び補強部材３０に接合されている。 [Fifth Modification of Sectional Structure]
In the modification shown in FIG. 64A, the wiring board 710 includes the base material 20, the reinforcing member 30, the supporting board 40, the electronic component 51, and the wiring 52, but the position of the supporting board 40 is different from the example shown in FIG. 63. Specifically, the support substrate 40 is provided on the first surface 21 of the base material 20 and the reinforcing member 30 provided on the first surface 21. The support substrate 40 supports the electronic component 51 and the wiring 52 on the first surface 41 side thereof. Further, the support substrate 40 is joined to the first surface 21 of the base material 20 and the reinforcing member 30 on the second surface 42 side thereof.
　また、図６４Ｂに示すように、配線基板７１０が、基材２０、補強部材３０、支持基板４０、電子部品５１、配線５２を備える場合においては、補強部材３０が基材２０の内部に設けられ、基材２０から外部に露出しない状態になっていてもよい。ここで、図６４Ｂに示す配線基板７１０が、伸長させた基材２０に配線５２を設けた後、基材２０を弛緩させることで形成される場合には、基材２０の第１面２１及び／又は第２面２２における、第１方向Ｄ１と直交する方向において、平面視で第１補強部材３１と隣接する部分、及び、補強部材３０と対向する部分に、山部及び谷部を含む蛇腹形状部が形成され得る。
　また、第１面２１又は第２面２２に予め補強部材３０が設けられた基材２０を伸長させて、配線５２を設けた後、弛緩させた場合にも、基材２０の第１面２１及び／又は第２面２２における、第１方向Ｄ１と直交する方向において、平面視で第１補強部材３１と隣接する部分に、山部及び谷部を含む蛇腹形状部が形成され得る。また、図６４Ｃに示すように、補強部材３０の第１補強部材３１及び第２補強部材３２は、基材２０の第２面２２側に位置してもよい。 Further, as shown in FIG. 64B, when the wiring board 710 includes the base material 20, the reinforcing member 30, the support substrate 40, the electronic component 51, and the wiring 52, the reinforcing member 30 is provided inside the base material 20. Alternatively, the substrate 20 may not be exposed to the outside. Here, when the wiring board 710 shown in FIG. 64B is formed by relaxing the base material 20 after providing the wiring 52 on the stretched base material 20, the first surface 21 of the base material 20 and / Or, in the direction orthogonal to the first direction D1 on the second surface 22, a portion that is adjacent to the first reinforcing member 31 in a plan view and a portion that faces the reinforcing member 30 include bellows including a peak portion and a valley portion. A feature can be formed.
In addition, when the base material 20 having the reinforcing member 30 provided in advance on the first surface 21 or the second surface 22 is stretched and the wiring 52 is provided and then relaxed, the first surface 21 of the base material 20 is also relaxed. And/or in the direction orthogonal to the first direction D1 on the second surface 22, a bellows-shaped portion including a mountain portion and a valley portion may be formed in a portion adjacent to the first reinforcing member 31 in a plan view. Further, as shown in FIG. 64C, the first reinforcing member 31 and the second reinforcing member 32 of the reinforcing member 30 may be located on the second surface 22 side of the base material 20.
　〔平面視形状の第１変形例〕
　図６５に示す変形例では、補強部材３０が、第１方向Ｄ１で電子部品５１の一方側に設けられる平面視矩形状の１つの第１補強部材３１と、第１方向Ｄ１で電子部品５１の他方側に設けられる平面視矩形状の１つの第１補強部材３１と、これらに接続される第２補強部材３２と、で構成される。平面視で第１方向Ｄ１に直交する方向に関しては、２つの第１補強部材３１は、電子部品５１を挟んで一方側と他方側とに位置するが、２つの第１補強部材３１は、平面視で第１方向Ｄ１に直交する方向に関して同じ側に位置してもよい。 [First Modification of Plan View Shape]
In the modification shown in FIG. 65, the reinforcing member 30 includes one first reinforcing member 31 having a rectangular shape in plan view, which is provided on one side of the electronic component 51 in the first direction D1, and the electronic component 51 in the first direction D1. It is composed of one first reinforcing member 31 provided on the other side and having a rectangular shape in plan view, and a second reinforcing member 32 connected to these. Regarding the direction orthogonal to the first direction D1 in plan view, the two first reinforcing members 31 are located on one side and the other side with the electronic component 51 interposed therebetween, but the two first reinforcing members 31 are flat. They may be located on the same side with respect to the direction orthogonal to the first direction D1 when viewed.
　〔平面視形状の第２変形例〕
　図６６に示す変形例では、補強部材３０において、平面視で矩形状の第２補強部材３２の四隅のそれぞれに、第２補強部材３２の四辺のうちの第１方向Ｄ１に平行な辺部の延長線上に延びる第１補強部材３１と、第２補強部材３２の四辺のうちの第１方向Ｄ１に直交する方向に平行な辺部の延長線上に延びる第１補強部材３１とが接続される。なお、本例においては、第１方向Ｄ１に直交する方向に平行な辺部の延長線上に延びる第１補強部材３１が設けられてなくもよい。 [Second Modification of Plan View Shape]
In the modification shown in FIG. 66, in the reinforcing member 30, each of the four corners of the second reinforcing member 32, which has a rectangular shape in a plan view, has a side portion parallel to the first direction D1 among the four sides of the second reinforcing member 32. The first reinforcing member 31 extending on the extension line and the first reinforcing member 31 extending on the extension line of the side portion parallel to the direction orthogonal to the first direction D1 of the four sides of the second reinforcing member 32 are connected. In addition, in the present example, the first reinforcing member 31 that extends on the extension line of the side portion parallel to the direction orthogonal to the first direction D1 may not be provided.
　〔平面視形状の第３変形例〕
　図６７に示す変形例では、図５５に示した補強部材３０において、第２補強部材３２が設けられていない。この例では、第１補強部材３１が、電子部品５１及び接続部５１ａのうちの少なくともいずれかに直接的に接するとともに、基材２０に接することになる。 [Third Modification of Plan View Shape]
In the modification shown in FIG. 67, the second reinforcing member 32 is not provided in the reinforcing member 30 shown in FIG. In this example, the first reinforcing member 31 is in direct contact with at least one of the electronic component 51 and the connecting portion 51a and is in contact with the base material 20.
　〔平面視形状の第４変形例〕
　図６８に示す変形例では、図６６に示した補強部材３０において、第２補強部材３２が設けられていない。 [Fourth Modification of Plan View Shape]
In the modification shown in FIG. 68, the second reinforcing member 32 is not provided in the reinforcing member 30 shown in FIG.
　〔平面視形状の第５変形例〕
　図６９に示す変形例では、補強部材３０が、第１方向Ｄ１及び平面視で第１方向Ｄ１に直交する方向の両方に交差する方向に延びる第１補強部材３１を備えている。第１補強部材３１は、電子部品５１の四隅から突出するように延びている。この例では、第１補強部材３１が、第１方向Ｄ１及び平面視で第１方向Ｄ１に直交する方向の両方に対して４５度をなすが、このような角度は特に限定されるものではない。また、この例では、補強部材３０が第２補強部材３２を備えないが、補強部材３０は第２補強部材３２を備えてもよい。 [Fifth Modification of Plan View Shape]
In the modification shown in FIG. 69, the reinforcing member 30 includes a first reinforcing member 31 extending in a direction intersecting both the first direction D1 and the direction orthogonal to the first direction D1 in plan view. The first reinforcing member 31 extends so as to project from the four corners of the electronic component 51. In this example, the first reinforcing member 31 makes 45 degrees with respect to both the first direction D1 and the direction orthogonal to the first direction D1 in plan view, but such an angle is not particularly limited. .. Further, in this example, the reinforcing member 30 does not include the second reinforcing member 32, but the reinforcing member 30 may include the second reinforcing member 32.
　〔平面視形状の第６変形例〕
　図７０に示す変形例では、補強部材３０が、第１方向Ｄ１で電子部品５１の一方側及び他方側のそれぞれに、一対の第１補強部材３１を備える。一対の第１補強部材３１の間には、配線５２が通る。そして、各第１補強部材３１は、第１方向Ｄ１に沿って延びる本体３１Ａと、本体３１Ａから配線５２側に凸となる凸部３１Ｂとを有している。 [Sixth Modification of Plan View Shape]
In the modification shown in FIG. 70, the reinforcing member 30 includes a pair of first reinforcing members 31 on one side and the other side of the electronic component 51 in the first direction D1. The wiring 52 passes between the pair of first reinforcing members 31. And each 1st reinforcement member 31 has 31 A of main bodies extended along the 1st direction D1, and the convex part 31B which becomes convex toward the wiring 52 side from 31 A of main bodies.
　〔平面視形状の第７変形例〕
　図７１に示す変形例では、補強部材３０が、第１方向Ｄ１で電子部品５１の一方側及び他方側のそれぞれにおいて、矩形状の電子部品５１の一辺部から突出するように延びる３つ以上の第１補強部材３１を備えている。 [Seventh Modification of Plan View Shape]
In the modification shown in FIG. 71, the reinforcing member 30 includes three or more reinforcing members 30 extending in one direction on the one side and the other side of the electronic component 51 so as to project from one side of the rectangular electronic component 51. The first reinforcing member 31 is provided.
　〔平面視形状の第８変形例〕
　図７２に示す変形例では、補強部材３０が、第１方向Ｄ１で電子部品５１の一方側に設けられる一つの第１補強部材３１と、第１方向Ｄ１で電子部品５１の他方側に設けられる一つの第１補強部材３１とを備える。第１補強部材３１は、第１方向Ｄ１で一方側又は他方側を向く電子部品５１の一辺部から突出するように延びる。この例では、第１補強部材３１が、第１方向Ｄ１で一方側又は他方側を向く電子部品５１の一辺部の両端の間から延びている。 [Eighth Modification of Plan View Shape]
In the modified example shown in FIG. 72, the reinforcing member 30 is provided on one side of the electronic component 51 in the first direction D1 and on the other side of the electronic component 51 in the first direction D1. And one first reinforcing member 31. The first reinforcing member 31 extends so as to project from one side portion of the electronic component 51 facing the one side or the other side in the first direction D1. In this example, the first reinforcing member 31 extends from between both ends of one side of the electronic component 51 facing the one side or the other side in the first direction D1.
　〔平面視形状の第９変形例〕
　図７３Ａに示す変形例では、補強部材３０が、第１方向Ｄ１で電子部品５１の一方側に設けられる一つの第１補強部材３１と、第１方向Ｄ１で電子部品５１の他方側に設けられる一つの第１補強部材３１とを備える。第１補強部材３１は、第１方向Ｄ１で一方側又は他方側を向く電子部品５１の一辺部から突出するように延びる。この例では、第１補強部材３１が、第１方向Ｄ１で一方側又は他方側を向く電子部品５１の一辺部の端部から延びている。 [Ninth Modification of Plan View Shape]
In the modification shown in FIG. 73A, the reinforcing member 30 is provided on one side of the electronic component 51 in the first direction D1 and on the other side of the electronic component 51 in the first direction D1. And one first reinforcing member 31. The first reinforcing member 31 extends so as to project from one side portion of the electronic component 51 facing the one side or the other side in the first direction D1. In this example, the first reinforcing member 31 extends from the end of one side of the electronic component 51 that faces one side or the other side in the first direction D1.
　〔平面視形状の第１０変形例〕
　図７３Ｂに示す変形例では、補強部材３０が、第１方向Ｄ１で電子部品５１の一方側に設けられる二つの第１補強部材３１と、第１方向Ｄ１で電子部品５１の他方側に設けられる二つの第１補強部材３１とを備える。第１補強部材３１は、第１方向Ｄ１で一方側又は他方側を向く電子部品５１の一辺部から突出するように延びる。この例では、第１方向Ｄ１の一方側の２つの第１補強部材３１が、第１方向Ｄ１で一方側を向く電子部品５１の一辺部の両端部から延びている。また、第１方向Ｄ１の他方側の２つの第１補強部材３１が、第１方向Ｄ１で他方側を向く電子部品５１の一辺部の両端部から延びている。 [Tenth Modification of Plan View Shape]
In the modification shown in FIG. 73B, the reinforcing member 30 is provided on the one side of the electronic component 51 in the first direction D1 and the two first reinforcing members 31 on the other side of the electronic component 51 in the first direction D1. Two first reinforcing members 31 are provided. The first reinforcing member 31 extends so as to project from one side portion of the electronic component 51 facing the one side or the other side in the first direction D1. In this example, the two first reinforcing members 31 on one side of the first direction D1 extend from both ends of one side of the electronic component 51 facing the one side in the first direction D1. The two first reinforcing members 31 on the other side in the first direction D1 extend from both ends of one side of the electronic component 51 facing the other side in the first direction D1.
　〔平面視形状の第１１変形例〕
　図７３Ｃに示す変形例では、補強部材３０が、第１方向Ｄ１で電子部品５１の一方側に設けられる二つの第１補強部材３１と、第１方向Ｄ１で電子部品５１の他方側に設けられる二つの第１補強部材３１とを備える。また、補強部材３０は、第１方向Ｄ１の一方側の二つの第１補強部材３１の間に位置する第２補強部材３２と、第１方向Ｄ１の他方側の二つの第１補強部材３１の間に位置する第２補強部材３２とをさらに備えている。 [Eleventh Modification of Plan View Shape]
In the modification shown in FIG. 73C, the reinforcing member 30 is provided on the one side of the electronic component 51 in the first direction D1 and the two first reinforcing members 31 are provided on the other side of the electronic component 51 in the first direction D1. Two first reinforcing members 31 are provided. The reinforcing member 30 includes a second reinforcing member 32 located between the two first reinforcing members 31 on one side of the first direction D1 and two first reinforcing members 31 on the other side of the first direction D1. It further comprises a second reinforcing member 32 located between them.
　〔平面視形状の第１２変形例〕
　図７３Ｄに示す変形例では、補強部材３０が、図７３Ｃに示した例と同様の第１補強部材３１と第２補強部材３２とを備えるが、各第１補強部材３１が第１方向Ｄ１と直交する方向で電子部品５１から外側に延び出している。 [Twelfth Modification of Plan View Shape]
In the modified example shown in FIG. 73D, the reinforcing member 30 includes the same first reinforcing member 31 and the second reinforcing member 32 as in the example shown in FIG. 73C, but each first reinforcing member 31 has the first direction D1. It extends outward from the electronic component 51 in the orthogonal direction.
　（配線基板の他の変形例）
　上述の実施の形態及び各変形例においては、配線基板７１０が、基材２０の第１面２１側に搭載された電子部品５１を備える例を示した。しかしながら、これに限られることはなく、配線基板７１０は、電子部品５１を備えていなくてもよい。例えば、電子部品５１が搭載されていない状態の基材２０に蛇腹形状部５７が生じていてもよい。また、電子部品５１が搭載されていない状態の支持基板４０が基材２０に貼り合されてもよい。また、配線基板７１０は、電子部品５１が搭載されていない状態で出荷されてもよい。 (Other modifications of wiring board)
In the above-mentioned embodiment and each modification, the example in which the wiring board 710 includes the electronic component 51 mounted on the first surface 21 side of the base material 20 is shown. However, the present invention is not limited to this, and the wiring board 710 may not include the electronic component 51. For example, the bellows-shaped portion 57 may be formed on the base material 20 in a state where the electronic component 51 is not mounted. Further, the support substrate 40 in a state where the electronic component 51 is not mounted may be attached to the base material 20. Further, the wiring board 710 may be shipped in a state where the electronic component 51 is not mounted.
　（配線基板の製造方法の変形例）
　以下においては、配線基板７１０の製造方法の変形例を図７４ａ～ｄを参照しつつ説明する。 (Modification of the wiring board manufacturing method)
Hereinafter, a modified example of the method for manufacturing the wiring board 710 will be described with reference to FIGS.
　この変形例では、まず、図７４ａに示すように、伸縮性を有する基材２０を準備する基材準備工程を実施する。続いて、図７４ｂに示すように、基材２０に引張応力Ｔを加えて基材２０を伸長させる伸長工程を実施する。続いて、引張応力Ｔによって伸長した状態の基材２０の第１面２１に、電子部品５１及び配線５２を設ける第１設置工程を実施する。 In this modified example, first, as shown in FIG. 74a, a base material preparing step of preparing a base material 20 having elasticity is performed. Subsequently, as shown in FIG. 74b, a stretching step of stretching the substrate 20 by applying tensile stress T to the substrate 20 is performed. Then, the 1st installation process which provides the electronic component 51 and the wiring 52 in the 1st surface 21 of the base material 20 in the state extended by the tensile stress T is implemented.
　その後、図７４ｃに示すように、基材２０から引張応力Ｔを取り除く収縮工程を実施する。これにより、矢印Ｃに示すように基材２０が収縮し、基材２０に設けられている配線５２にも変形が生じる。その後、図７４ｄに示すように、引張応力Ｔを取り除いた状態の基材２０の第１面２１に、第１補強部材３１及び第２補強部材３２を含む補強部材３０を設ける第２設置工程を実施する。このような工程で製造された配線基板７１０では、補強部材３０が、基材２０の第１面２１の山部５３が形成された領域に位置し得る。
　なお、配線基板７１０は、基材２０を伸長させた後、補強部材３０、配線５２、電子部品５１をこの順で設け、その後、伸長状態を解除することにより、作製されてもよい。 Thereafter, as shown in FIG. 74c, a shrinking step for removing the tensile stress T from the base material 20 is performed. As a result, the base material 20 contracts as shown by arrow C, and the wiring 52 provided on the base material 20 is also deformed. Thereafter, as shown in FIG. 74d, a second installation step of providing the reinforcing member 30 including the first reinforcing member 31 and the second reinforcing member 32 on the first surface 21 of the base material 20 from which the tensile stress T is removed is performed. carry out. In the wiring board 710 manufactured by such a process, the reinforcing member 30 can be located in the region of the first surface 21 of the base material 20 in which the mountain portion 53 is formed.
The wiring board 710 may be manufactured by extending the base material 20, providing the reinforcing member 30, the wiring 52, and the electronic component 51 in this order, and then releasing the extended state.
　なお、上述した実施形態に対するいくつかの変形例を説明してきたが、当然に、複数の変形例を適宜組み合わせて適用することも可能である。また、上述の実施形態及び変形例では、基材２０及び配線５２が蛇腹形状部５７を有することで、伸縮可能になっている構成を説明した。しかしながら、補強部材３０は、蛇腹形状を有さない伸縮性を有する基材に伸縮性の銀配線が設けられる伸縮性基板や、伸縮性を有する基材に馬蹄形の配線を形成した伸縮性基板においても適用されてもよい。これらのタイプの伸縮性基板に補強部材３０を設けた場合にも、基材上の配線が電子部品の下方に巻き込まれたり、配線に局所的に大きい応力が生じたりすることを抑制できる。
　なお、蛇腹形状を有さない伸縮性を有する基材に伸縮性の銀配線が設けられる伸縮性基板や、伸縮性を有する基材に馬蹄形の配線を形成した伸縮性基板は、例えば、何ら伸長させない基材に、伸縮性の銀配線又は馬蹄形の配線を形成した後、部品及び補強部材３０を設けることで作製されてもよいが、その製造方法は特に限られるものではない。 It should be noted that although some modified examples of the above-described embodiment have been described, it goes without saying that a plurality of modified examples can be appropriately combined and applied. In addition, in the above-described embodiment and modified examples, the configuration in which the base material 20 and the wiring 52 have the bellows-shaped portion 57 so that they can be expanded and contracted has been described. However, the reinforcing member 30 is a stretchable substrate in which stretchable silver wiring is provided on a stretchable base material having no bellows shape or a stretchable substrate in which horseshoe-shaped wiring is formed on the stretchable base material. May also be applied. Even when the reinforcing member 30 is provided on these types of stretchable substrates, it is possible to prevent the wiring on the base material from being caught under the electronic component and from locally exerting a large stress on the wiring.
A stretchable substrate in which stretchable silver wiring is provided on a stretchable base material that does not have a bellows shape, or a stretchable substrate in which horseshoe-shaped wiring is formed on a stretchable base material is, for example, stretched at all. It may be manufactured by forming stretchable silver wiring or horseshoe-shaped wiring on a base material that is not allowed to be formed, and then providing the component and the reinforcing member 30, but the manufacturing method is not particularly limited.
　また、上述した実施形態では、配線５２が第１方向Ｄ１に平行に延びる例を示したが、図７５に示すように、配線５２に、第１方向Ｄ１に平行に延びるものと、第１方向Ｄ１に交差する方向に延びるものとが含まれてもよい。そして、第１方向Ｄ１に交差する方向に延びる配線５２が、第１補強部材３１と電子部品５１とを仮想的に結ぶ少なくともいずれかの直線に対して交差するように配線基板が構成されてもよい。この際に、第１方向Ｄ１に交差する方向に延びる配線５２上に蛇腹形状部が形成されてもよい。このような配線基板は、一例として、基材２０を第１方向Ｄ１とこれに交差する方向の２軸方向に伸長させ、この状態で、配線５２等を形成することで形成されてもよい。なお、互いに異なる方向に延びる配線５２は、図示の例に限られるものではない。
＜実施例＞ In the above-described embodiment, the wiring 52 extends parallel to the first direction D1. However, as shown in FIG. 75, the wiring 52 extends parallel to the first direction D1 and the wiring 52 extends parallel to the first direction D1. And those extending in a direction intersecting D1 may be included. Even if the wiring board is configured such that the wiring 52 extending in the direction intersecting the first direction D1 intersects at least one of the straight lines virtually connecting the first reinforcing member 31 and the electronic component 51. Good. At this time, a bellows-shaped portion may be formed on the wiring 52 extending in a direction intersecting the first direction D1. Such a wiring board may be formed, for example, by extending the base material 20 in the biaxial direction of the first direction D1 and a direction intersecting the first direction D1, and forming the wiring 52 and the like in this state. The wirings 52 extending in different directions are not limited to the illustrated example.
<Example>
　次に、図５５～図７５に係る本開示を実施例により更に具体的に説明するが、本開示はその要旨を超えない限り、以下の実施例の記載に限定されるものではない。 Next, the present disclosure according to FIGS. 55 to 75 will be described more specifically by way of examples, but the present disclosure is not limited to the description of the following examples as long as the gist thereof is not exceeded.
（実施例１）
　配線基板７１０として、図７３Ｂに示すような、基材２０の第１面２１に配線５２、補強部材３０及び電子部品５１が設けられたものを作製した。配線５２、補強部材３０及び電子部品５１は、支持基板４０に設けられた状態で、接着層を介して基材２０に貼り合わせた。 (Example 1)
As the wiring board 710, as shown in FIG. 73B, the one in which the wiring 52, the reinforcing member 30, and the electronic component 51 were provided on the first surface 21 of the base material 20 was produced. The wiring 52, the reinforcing member 30, and the electronic component 51 were attached to the base material 20 via the adhesive layer while being provided on the support substrate 40.
　基材２０は、２液付加縮合のポリジメルシロキサン（以下、ＰＤＭＳと称する）を、厚さが１．５ｍｍとなるように硬化させて形成した。基材２０の弾性係数は、０．０５ＭＰaとした。支持基板４０を基材２０に貼り合わせるための接着層としては、粘着シート８１４６（３Ｍ社製）を用いた。 The base material 20 was formed by curing a two-component addition-condensation polydimersiloxane (hereinafter referred to as PDMS) so as to have a thickness of 1.5 mm. The elastic modulus of the base material 20 was 0.05 MPa. A pressure-sensitive adhesive sheet 8146 (manufactured by 3M) was used as an adhesive layer for bonding the support substrate 40 to the base material 20.
　支持基板４０は、厚さ１μｍのＰＥＮ（ポリエチレンナフタレート）フィルムであり、弾性係数は、２．２ＧＰａとした。配線５２はＣｕであり、支持基板４０に蒸着法で成膜した後、フォトリソグラフィでパターニングして形成した。配線幅は、２００μｍとし、隣り合う配線の間の間隔は、４００μｍとした。また、配線５２の形成後、配線５２及び支持基板４０を一体的に覆う絶縁膜を形成した。なお、配線５２の電子部品５１との接続部分は絶縁膜で覆わないようにした。絶縁膜は、熱硬化性絶縁樹脂をスクリーン印刷で配線５２及び支持基板４０上に印刷した後、加熱して硬化させることで形成した。絶縁膜の厚さは、配線５２上で５０μｍ程度となるように設定した。 The supporting substrate 40 is a PEN (polyethylene naphthalate) film having a thickness of 1 μm, and the elastic coefficient is set to 2.2 GPa. The wiring 52 is Cu, and is formed by forming a film on the supporting substrate 40 by a vapor deposition method and then patterning it by photolithography. The wiring width was 200 μm, and the interval between adjacent wirings was 400 μm. After forming the wiring 52, an insulating film that integrally covers the wiring 52 and the support substrate 40 was formed. The connecting portion of the wiring 52 with the electronic component 51 was not covered with an insulating film. The insulating film was formed by printing a thermosetting insulating resin on the wiring 52 and the support substrate 40 by screen printing and then heating and curing the resin. The thickness of the insulating film was set to be about 50 μm on the wiring 52.
　配線５２と電子部品５１とを接続するための接続部５１ａは、導電性接着剤（化研テック社製のＣＬ－３１６０）をスクリーン印刷にて配線５２の端部に形成した。そして、電子部品５１は、接続部５１ａに半田付けした。また、補強部材３０は、熱硬化性エポキシ樹脂をディスペンサで所定の位置に塗布して、熱硬化させることで形成した。補強部材３０は第１補強部材３１のみを有し、平面視で、第１補強部材３１が電子部品５１から２ｍｍ突出するように形成され、隣り合う第１補強部材３１の間には、２ｍｍの隙間を設定した。 A connecting portion 51a for connecting the wiring 52 and the electronic component 51 was formed by screen-printing a conductive adhesive (CL-3160 manufactured by Kaken Tech Co., Ltd.) on the end of the wiring 52. Then, the electronic component 51 was soldered to the connecting portion 51a. Further, the reinforcing member 30 was formed by applying a thermosetting epoxy resin at a predetermined position with a dispenser and thermosetting it. The reinforcing member 30 has only the first reinforcing member 31, is formed so that the first reinforcing member 31 projects from the electronic component 51 by 2 mm in a plan view, and the first reinforcing member 31 has a distance of 2 mm between the adjacent first reinforcing members 31. The gap is set.
　そして、基材２０を第１方向Ｄ１に１．５倍、１軸伸長させた状態で、上述のように配線５２及び電子部品５１等が支持された支持基板４０を基材２０に接着層を介して貼り合わせ、これにより、実施例１に係る配線基板７１０を作製した。 Then, with the base material 20 uniaxially stretched 1.5 times in the first direction D1, the support substrate 40 on which the wiring 52, the electronic component 51, and the like are supported as described above is provided with an adhesive layer on the base material 20. Then, the wiring board 710 according to Example 1 was manufactured.
　この実施例１に係る配線基板７１０を、第１方向Ｄ１に１万回、１．３倍伸長させたが、配線５２は断線しなかった。なお、実施例１に係る配線基板７１０において補強部材３０を設けない比較例を製作し、第１方向Ｄ１に１万回、１．３倍伸長させた場合には、電子部品５１の周囲において配線５２の断線が生じていた。この結果から、補強部材３０の有用性が確認された。 The wiring board 710 according to Example 1 was stretched 1.3 times in the first direction D1 10,000 times, but the wiring 52 was not broken. In addition, when a comparative example in which the reinforcing member 30 is not provided in the wiring board 710 according to the example 1 is manufactured and is stretched 1.3 times in the first direction D1 10,000 times, wiring is provided around the electronic component 51. 52 breaks had occurred. From this result, the usefulness of the reinforcing member 30 was confirmed.
（実施例２）
　配線基板７１０として、図７３Ｃに示すような、基材２０の第１面２１に配線５２、補強部材３０及び電子部品５１が設けられたものを作製した。実施例２は、実施例１で説明した材料と同じ材料及び同じ製造手順で作製されたが、補強部材３０の形状が、実施例１と異なる。 (Example 2)
As the wiring board 710, one in which the wiring 52, the reinforcing member 30, and the electronic component 51 were provided on the first surface 21 of the base material 20 as shown in FIG. 73C was produced. Example 2 is made of the same material and the same manufacturing procedure as those described in Example 1, but the shape of the reinforcing member 30 is different from that of Example 1.
　この実施例２に係る配線基板７１０も、第１方向Ｄ１に１万回、１．３倍伸長させたが、配線５２は断線しなかった。 The wiring board 710 according to Example 2 was also stretched 1.3 times in the first direction D1 10,000 times, but the wiring 52 was not broken.
（実施例３）
　配線基板７１０として、図７３Ｄに示すような、基材２０の第１面２１に配線５２、補強部材３０及び電子部品５１が設けられたものを作製した。実施例３は、実施例１で説明した材料と同じ材料及び同じ製造手順で作製されたが、補強部材３０の形状が、実施例１と異なる。なお、第１補強部材３１は、第１方向Ｄ１で電子部品５１から２ｍｍ突出するが、第１方向Ｄ１に直交する方向での、隣り合う第１補強部材３１の間の距離は、４ｍｍとした。 (Example 3)
As the wiring board 710, one in which the wiring 52, the reinforcing member 30, and the electronic component 51 were provided on the first surface 21 of the base material 20 as shown in FIG. 73D was manufactured. Example 3 was made of the same material and the same manufacturing procedure as those described in Example 1, but the shape of the reinforcing member 30 was different from that of Example 1. The first reinforcing member 31 projects 2 mm from the electronic component 51 in the first direction D1, but the distance between the adjacent first reinforcing members 31 in the direction orthogonal to the first direction D1 was 4 mm. ..
　この実施例３に係る配線基板７１０も、第１方向Ｄ１に１万回、１．３倍伸長させたが、配線５２は断線しなかった。 The wiring board 710 according to Example 3 was also stretched 1.3 times in the first direction D1 10,000 times, but the wiring 52 was not broken.
（実施例４）
　配線基板７１０として、図７５に示すような、基材２０の第１面２１に配線５２、補強部材３０及び電子部品５１が設けられたものを作製した。実施例４は、実施例１で説明した材料と同じ材料を用い、製造手順も基本的に実施例１と同様であるが、基材２０を２軸方向に伸長させて配線５２を設ける点は実施例１と異なっており、また、補強部材３０の形状も、実施例１と異なる。 (Example 4)
As the wiring board 710, one in which the wiring 52, the reinforcing member 30, and the electronic component 51 were provided on the first surface 21 of the base material 20 as shown in FIG. 75 was produced. Example 4 uses the same material as that described in Example 1 and the manufacturing procedure is basically the same as that of Example 1, except that the base material 20 is extended biaxially to provide the wiring 52. This is different from the first embodiment, and the shape of the reinforcing member 30 is also different from the first embodiment.
　この実施例４に係る配線基板７１０も、第１方向Ｄ１に１万回、１．３倍伸長させたが、配線５２は断線しなかった。 The wiring board 710 according to Example 4 was also stretched 1.3 times in the first direction D1 10,000 times, but the wiring 52 was not broken.
（さらに他の実施形態）
　以下、本開示のさらに他の実施形態に係る配線基板ついてさらに説明する。 (Still another embodiment)
Hereinafter, a wiring board according to still another embodiment of the present disclosure will be further described.
図７６は、本実施形態による配線基板８１０を示す平面図である。図７７は、図７６の配線基板８１０を線II－IIに沿って切断した場合の断面図である。なお、本実施形態においても、上述の実施形態において「伸縮抑制部材３０」と称していた構成のことを、補強部材３０と称している。また、上述実施形態において「被接続部材５１」と称して構成が、電子部品５１になっている。 FIG. 76 is a plan view showing the wiring board 810 according to the present embodiment. 77 is a cross-sectional view of the wiring board 810 of FIG. 76 taken along the line II-II. In the present embodiment as well, the configuration referred to as the "expansion/contraction suppressing member 30" in the above-described embodiment is referred to as the reinforcing member 30. In addition, in the above-described embodiment, the electronic component 51 has a configuration referred to as the “connected member 51”.
　図７６に示す形態では、補強部材３０が、基材２０を補強することで配線基板１０の伸縮にともなう接続部５１ａの応力を緩和させるために配線基板１０に設けられる。補強部材３０は、電子部品５１に対して面方向に離れて位置している。補強部材３０の少なくとも一部は、電子部品５１の第１端部５１１の位置から第２端部５１２の位置まで少なくとも延びている。 In the form shown in FIG. 76, the reinforcing member 30 is provided on the wiring board 10 in order to relieve the stress of the connecting portion 51a due to the expansion and contraction of the wiring board 10 by reinforcing the base material 20. The reinforcing member 30 is located away from the electronic component 51 in the surface direction. At least a part of the reinforcing member 30 extends at least from the position of the first end 511 of the electronic component 51 to the position of the second end 512.
　図７６に示す例において、補強部材３０は、電子部品５１の第１端部５１１よりも第１方向Ｄ１における第１端部５１１側から、電子部品５１の第２端部５１２よりも第１方向Ｄ１における第２端部５１２側まで連続して設けられている。 In the example shown in FIG. 76, the reinforcing member 30 is arranged in the first direction from the first end 511 side of the electronic component 51 in the first direction D1 with respect to the first end 511 of the electronic component 51 and in the first direction from the second end 512 of the electronic component 51. It is continuously provided up to the second end 512 side of D1.
　また、図７６に示す例において、補強部材３０は、第１面２１の法線方向から見た場合、すなわち、平面視において、電子部品５１を囲む形状を有する。より詳しくは、補強部材３０は、平面視において電子部品５１の全周を囲む円形状を有する。また、補強部材３０は、配線５２上または第１面２１上に位置する。 Further, in the example shown in FIG. 76, the reinforcing member 30 has a shape surrounding the electronic component 51 when viewed from the direction normal to the first surface 21, that is, in a plan view. More specifically, the reinforcing member 30 has a circular shape surrounding the entire circumference of the electronic component 51 in a plan view. The reinforcing member 30 is located on the wiring 52 or the first surface 21.
　電子部品５１と補強部材３０との面方向における離間距離としては、基材２０の伸縮にともなって配線５２と電子部品５１との接続部５１ａに作用する応力を緩和させるために好適な距離を採用することができる。例えば、電子部品５１と補強部材３０との面方向における離間距離は、０．１ｍｍ以上且つ５ｍｍ以下である。 As the separation distance between the electronic component 51 and the reinforcing member 30 in the surface direction, a suitable distance is adopted to relieve the stress acting on the connecting portion 51 a between the wiring 52 and the electronic component 51 as the base material 20 expands and contracts. can do. For example, the distance between the electronic component 51 and the reinforcing member 30 in the surface direction is 0.1 mm or more and 5 mm or less.
　補強部材３０は、基材２０の弾性係数よりも大きい弾性係数を有してもよい。補強部材３０の弾性係数は、例えば１０ＧＰａ以上５００ＧＰａ以下であり、より好ましくは１ＧＰａ以上３００ＧＰａ以下である。補強部材３０の弾性係数が低すぎると、基材２０の伸縮を制御しにくい場合がある。また、補強部材３０の弾性係数が高すぎると、基材２０が伸縮した際に、割れやひびなど構造の破壊が補強部材３０に起こる場合がある。補強部材３０の弾性係数は、基材２０の弾性係数の１．１倍以上１００００００倍以下であってもよく、より好ましくは１０倍以上３０００００倍以下である。 The reinforcing member 30 may have an elastic coefficient larger than that of the base material 20. The elastic coefficient of the reinforcing member 30 is, for example, 10 GPa or more and 500 GPa or less, and more preferably 1 GPa or more and 300 GPa or less. If the elastic coefficient of the reinforcing member 30 is too low, it may be difficult to control the expansion and contraction of the base material 20. Further, if the elastic coefficient of the reinforcing member 30 is too high, when the base material 20 expands or contracts, the reinforcing member 30 may suffer structural damage such as cracks or cracks. The elastic coefficient of the reinforcing member 30 may be 1.1 times or more and 1,000,000 times or less, and more preferably 10 times or more and 300,000 times or less than that of the base material 20.
　このような補強部材３０を基材２０に設けることにより、基材２０のうちの伸縮抑制領域Ａが伸縮することを抑制することができる。伸縮抑制領域Ａとは、基材２０のうち、補強部材３０が延びている方向に交差する方向において補強部材３０に隣接する領域であって、電子部品５１が位置する領域を含む領域をいう。図７６に示す例において、伸縮抑制領域Ａは、補強部材３０で囲まれた領域である。 By providing such a reinforcing member 30 on the base material 20, it is possible to suppress expansion and contraction of the expansion/contraction suppressing region A of the base material 20. The expansion/contraction suppressing region A is a region of the base material 20 that is adjacent to the reinforcing member 30 in the direction intersecting the direction in which the reinforcing member 30 extends and that includes the region where the electronic component 51 is located. In the example shown in FIG. 76, the expansion/contraction suppressing region A is a region surrounded by the reinforcing member 30.
　ＪＰ２０１３－１８７３０８ＡおよびＪＰ２００７－２８１４０６Ａにおいては、配線基板の伸縮にともなって配線と電子部品との接続部に作用する応力を緩和させることについて、何ら有効な提案がなされていないのが実情であった。
　伸縮抑制領域Ａの伸縮を抑制することにより、配線基板１０の伸縮にともなって配線５２と電子部品５１との接続部５１ａに作用する応力を緩和させることができる。接続部５１ａに作用する応力を緩和させることで、配線５２の断線および配線５２と電子部品５１との接続不良を防止することができる。 In JP2013-187308A and JP2007-281406A, no actual proposal has been made to alleviate the stress acting on the connecting portion between the wiring and the electronic component as the wiring board expands and contracts.
By suppressing the expansion/contraction of the expansion/contraction suppressing region A, it is possible to relieve the stress acting on the connecting portion 51 a between the wiring 52 and the electronic component 51 as the wiring board 10 expands/contracts. By alleviating the stress acting on the connection portion 51a, it is possible to prevent disconnection of the wiring 52 and poor connection between the wiring 52 and the electronic component 51.
　また、電子部品５１の全周を囲むように補強部材３０を設けることにより、基材２０が面方向のうち複数の方向に伸縮する場合においても、各方向への伸縮にともなって配線５２と電子部品５１との接続部５１ａに作用する応力を効果的に緩和することができる。 Further, by providing the reinforcing member 30 so as to surround the entire circumference of the electronic component 51, even when the base material 20 expands and contracts in a plurality of directions of the surface direction, the wiring 52 and the electronic components can be expanded and contracted in each direction. The stress acting on the connecting portion 51a with the component 51 can be effectively relieved.
　以下、図７６の配線基板８１０の変形例を説明する。 A modification of the wiring board 810 shown in FIG. 76 will be described below.
（第１変形例）
　図７６の例では、補強部材３０が平面視において電子部品５１の全周を囲む円形状を有する配線基板８１０の例について説明した。これに対して、図７８に示すように、補強部材３０は、平面視において電子部品５１の全周を囲む矩形状を有していてもよい。 (First modification)
In the example of FIG. 76, the example of the wiring board 810 in which the reinforcing member 30 has a circular shape surrounding the entire circumference of the electronic component 51 in a plan view has been described. On the other hand, as shown in FIG. 78, the reinforcing member 30 may have a rectangular shape surrounding the entire circumference of the electronic component 51 in a plan view.
（第２変形例）
　また、図７９に示すように、補強部材３０は、平面視において電子部品５１を部分的に囲む形状を有していてもよい。図７９に示す例において、補強部材３０は、配線５２上の部分が欠落した略矩形状を有している。 (Second modified example)
Further, as shown in FIG. 79, the reinforcing member 30 may have a shape that partially surrounds the electronic component 51 in a plan view. In the example shown in FIG. 79, the reinforcing member 30 has a substantially rectangular shape with a portion above the wiring 52 missing.
　以上、本開示に係る配線基板および配線基板の製造方法について、実施形態を示しながら各説明してきた。しかし本開示は、上記実施形態あるいはその説明に限定されるものではない。上記実施形態は例示であり、本開示の特許請求の範囲に記載された技術的思想と実質的に同一の構成を有し同様な作用効果を奏するものは、いかなる場合であっても本開示の技術的範囲に包含される。 The wiring board and the method of manufacturing the wiring board according to the present disclosure have been described above while showing the embodiments. However, the present disclosure is not limited to the above embodiment or the description thereof. The above-described embodiment is an exemplification, and a configuration having substantially the same configuration as the technical idea described in the claims of the present disclosure and exhibiting the same operational effect is not limited to the case of the present disclosure. It is included in the technical scope.

Claims (19)

  1. 　配線基板であって、
    　第１面及び前記第１面の反対側に位置する第２面を含み、伸縮性を有する基材と、
    　前記基材の前記第１面側に位置する配線と、
    　前記基材の伸縮を抑制する複数の第１伸縮抑制部材と、
    　前記複数の第１伸縮抑制部材を固定する第２伸縮抑制部材と、を備え、
    　前記第１面の法線方向に沿って前記基材を見た場合に、前記配線の少なくとも一部は、前記複数の第１伸縮抑制部材に外接し、かつ前記第１伸縮抑制部材をその周長が最短となるように囲う仮想の領域である伸縮抑制領域のうち、前記第１伸縮抑制部材と重ならない領域に存在している、配線基板。     A wiring board,
    A stretchable base material including a first surface and a second surface located on the opposite side of the first surface;
    A wiring located on the first surface side of the base material;
    A plurality of first expansion and contraction suppressing members for suppressing expansion and contraction of the base material;
    A second expansion/contraction member for fixing the plurality of first expansion/contraction members,
    When the base material is viewed along the normal direction of the first surface, at least a part of the wiring is circumscribed to the plurality of first expansion/contraction suppressing members and the first expansion/contraction suppressing member is surrounded by the periphery thereof. A wiring board, which is present in an area that does not overlap with the first expansion/contraction suppressing member in an expansion/contraction suppressing area that is a virtual area that is enclosed so as to have the shortest length.
  2. 　前記第２伸縮抑制部材は前記第１伸縮抑制部材である、請求項１に記載の配線基板。 The wiring board according to claim 1, wherein the second expansion/contraction suppressing member is the first expansion/contraction suppressing member.
  3. 　前記配線基板に搭載される被接続部材を有し、
    　前記第２伸縮抑制部材は前記被接続部材である、請求項１に記載の配線基板。     A member to be connected mounted on the wiring board,
    The wiring board according to claim 1, wherein the second expansion/contraction suppressing member is the member to be connected.
  4. 　配線基板であって、
    　第１面及び前記第１面の反対側に位置する第２面を含み、伸縮性を有する基材と、
    　前記基材の前記第１面側に位置する配線と、
    　前記基材の伸縮を抑制する第１伸縮抑制部材と、を備え、
    　前記第１面の法線方向に沿って前記基材を見た場合に、前記配線の少なくとも一部は、前記第１伸縮抑制部材に外接し、かつ前記第１伸縮抑制部材をその周長が最短となるように囲う仮想の領域である伸縮抑制領域のうち、前記第１伸縮抑制部材と重ならない領域に存在している、配線基板。     A wiring board,
    A stretchable base material including a first surface and a second surface located on the opposite side of the first surface;
    A wiring located on the first surface side of the base material;
    A first expansion and contraction suppressing member for suppressing expansion and contraction of the base material,
    When the base material is viewed along the normal direction of the first surface, at least a part of the wiring is circumscribed to the first expansion/contraction suppressing member and the circumference of the first expansion/contraction suppressing member is A wiring board that is present in a region that does not overlap with the first expansion-contraction suppressing member in the expansion-contraction suppressing region that is a virtual region that is enclosed so as to be the shortest.
  5. 　前記配線の少なくとも一部が、前記第１面の法線方向に沿って前記基材を見た場合における、配線の端部、配線の分岐部、配線の方向転換部のうちの少なくともいずれかである、請求項１乃至請求項４のいずれか一項に記載の配線基板。 At least a part of the wiring is at least one of an end portion of the wiring, a branch portion of the wiring, and a direction changing portion of the wiring when the base material is viewed along the normal direction of the first surface. The wiring board according to any one of claims 1 to 4.
  6. 　前記配線基板に搭載される被接続部材を有し、
    　前記被接続部材と前記配線との間に位置し、前記被接続部材と前記配線とを電気的に接続する接続部をさらに備え、
    　前記第１面の法線方向に沿って前記基材を見た場合に、前記接続部のうち少なくとも１つは前記伸縮抑制領域のうち、前記第１伸縮抑制部材と重ならない領域に存在している、請求項１乃至請求項５のいずれか一項に記載の配線基板。     A member to be connected mounted on the wiring board,
    Further comprising a connecting portion located between the connected member and the wiring, for electrically connecting the connected member and the wiring,
    When the base material is viewed along the normal direction of the first surface, at least one of the connecting portions exists in the expansion-contraction suppressing region in a region that does not overlap with the first expansion-contraction suppressing member. The wiring board according to any one of claims 1 to 5.
  7. 　前記第１伸縮抑制部材を複数備え、複数の前記第１伸縮抑制部材は、前記配線の延びる方向に隣り合っている、請求項１乃至請求項６のいずれか一項に記載の配線基板。 The wiring board according to any one of claims 1 to 6, further comprising a plurality of the first expansion/contraction suppressing members, wherein the plurality of first expansion/contraction suppressing members are adjacent to each other in a direction in which the wiring extends.
  8. 　さらに支持基板を備え、前記第１伸縮抑制部材は、前記基材に前記支持基板を介して間接的に接している、請求項１乃至請求項７のいずれか一項に記載の配線基板。 The wiring board according to any one of claims 1 to 7, further comprising a support substrate, wherein the first expansion/contraction suppressing member is in contact with the base material indirectly via the support substrate.
  9. 　前記第１伸縮抑制部材の少なくとも１つは、前記基材を貫通している、請求項１乃至請求項８のいずれか一項に記載の配線基板。 The wiring board according to any one of claims 1 to 8, wherein at least one of the first expansion-contraction suppressing members penetrates the base material.
  10. 　前記基材は、前記配線が延びる方向に並ぶ複数の山部を含む、請求項１乃至請求項９のいずれか一項に記載の配線基板。 The wiring board according to any one of claims 1 to 9, wherein the base material includes a plurality of peaks arranged in a direction in which the wiring extends.
  11. 　前記配線は、前記配線が延びる方向に並ぶ複数の山部を含む、請求項１乃至請求項１０のいずれか一項に記載の配線基板。 The wiring board according to any one of claims 1 to 10, wherein the wiring includes a plurality of peaks arranged in a direction in which the wiring extends.
  12. 　請求項１乃至請求項１１のいずれか一項に記載の配線基板に被接続部材を接続してなるデバイス。 A device formed by connecting a member to be connected to the wiring board according to any one of claims 1 to 11.
  13. 　請求項１２に記載のデバイスを有する電子製品。 An electronic product having the device according to claim 12.
  14. 　配線基板の製造方法であって、
    　伸縮性を有する基材に張力を加えて、前記基材を伸長させる伸長工程と、
    　前記伸長工程によって伸長した状態の前記基材の第１面側に、第１伸縮抑制部材を前記基材の伸縮を抑制するために設けるとともに、前記配線基板に搭載される被接続部材に接続される配線を設ける設置工程と、
    　前記基材から前記張力を取り除く収縮工程と、を備え、
    　前記第１面の法線方向に沿って前記基材を見た場合に、前記配線の少なくとも一部は、前記第１伸縮抑制部材に外接し、かつ前記第１伸縮抑制部材をその周長が最短となるように囲う仮想の領域である伸縮抑制領域のうち、前記第１伸縮抑制部材と重ならない領域に存在している、配線基板の製造方法。     A method of manufacturing a wiring board, comprising:
    A stretching step of stretching the substrate by applying tension to the substrate having elasticity.
    A first expansion/contraction member is provided on the first surface side of the base material in the expanded state by the expansion step to suppress expansion/contraction of the base material, and is connected to a connected member mounted on the wiring board. Installation process to provide wiring
    A shrinking step of removing the tension from the base material,
    When the base material is viewed along the normal direction of the first surface, at least a part of the wiring is circumscribed to the first expansion/contraction suppressing member, and the circumference of the first expansion/contraction suppressing member is A method for manufacturing a wiring board, which is present in a region that does not overlap with the first expansion/contraction suppressing member in an expansion/contraction suppressing region that is a virtual region that is enclosed so as to be the shortest.
  15. 　配線基板の製造方法であって、
    　伸縮性を有する基材に張力を加えて、前記基材を伸長させる伸長工程と、
    　前記伸長工程によって伸長した状態の前記基材の第１面側に、前記配線基板に搭載される被接続部材に接続される配線を設ける第１設置工程と、
    　前記基材から前記張力を取り除く収縮工程と、
    　前記収縮工程で前記張力を取り除いた前記基材に、第１伸縮抑制部材を前記基材の伸縮を抑制するために設ける第２設置工程と、を備え、
    　前記第１面の法線方向に沿って前記基材を見た場合に、前記配線の少なくとも一部は、前記第１伸縮抑制部材に外接し、かつ前記第１伸縮抑制部材をその周長が最短となるように囲う仮想の領域である伸縮抑制領域のうち、前記第１伸縮抑制部材と重ならない領域に存在している、配線基板の製造方法。     A method of manufacturing a wiring board, comprising:
    A stretching step of stretching the substrate by applying tension to the substrate having elasticity.
    A first installation step of providing wiring connected to a connected member mounted on the wiring board on the first surface side of the base material in the expanded state by the expansion step;
    A shrinking step of removing the tension from the substrate,
    A second installation step in which the base material from which the tension has been removed in the contracting step is provided with a first expansion and contraction suppressing member for suppressing expansion and contraction of the base material,
    When the base material is viewed along the normal direction of the first surface, at least a part of the wiring is circumscribed to the first expansion/contraction suppressing member, and the circumference of the first expansion/contraction suppressing member is A method for manufacturing a wiring board, which is present in a region that does not overlap with the first expansion/contraction suppressing member in an expansion/contraction suppressing region that is a virtual region that is enclosed so as to be the shortest.
  16. 　配線基板の製造方法であって、
    　第１面及び前記第１面の反対側に位置する第２面を含み、前記第１面、前記第２面及び内部のうちの少なくともいずれかに第１伸縮抑制部材が設けられた、伸縮性を有する基材に張力を加えて、前記基材を伸長させる伸長工程と、
    　前記伸長工程によって伸長した状態の前記基材の第１面側に、前記配線基板に搭載される被接続部材に接続される配線を設ける設置工程と、
    　前記基材から前記張力を取り除く収縮工程と、を備え、
    　前記第１面の法線方向に沿って前記基材を見た場合に、前記配線の少なくとも一部は、前記第１伸縮抑制部材に外接し、かつ前記第１伸縮抑制部材をその周長が最短となるように囲う仮想の領域である伸縮抑制領域のうち、前記第１伸縮抑制部材と重ならない領域に存在している、配線基板の製造方法。     A method of manufacturing a wiring board, comprising:
    Elasticity including a first surface and a second surface located on the opposite side of the first surface, and at least one of the first surface, the second surface and the interior having a first expansion and contraction suppressing member. A tensioning step for stretching the substrate by applying tension to the substrate having
    An installation step of providing wiring connected to a connected member mounted on the wiring board on the first surface side of the base material in the expanded state by the expansion step;
    A shrinking step of removing the tension from the base material,
    When the base material is viewed along the normal direction of the first surface, at least a part of the wiring is circumscribed to the first expansion/contraction suppressing member, and the circumference of the first expansion/contraction suppressing member is A method for manufacturing a wiring board, which is present in a region that does not overlap with the first expansion/contraction suppressing member in an expansion/contraction suppressing region that is a virtual region that is enclosed so as to be the shortest.
  17. 　配線基板であって、
    　第１面及び前記第１面の反対側に位置する第２面を含み、伸縮性を有する基材と、
    　前記基材の前記第１面側に位置し、前記配線基板に搭載される電子部品に接続される配線と、
    　前記基材を補強する補強部材と、を備え、
    　前記補強部材は、前記第１面の法線方向に沿って前記基材を見た場合に、前記電子部品から突出するように延びる第１補強部材を含み、
    　前記配線は、前記第１面の法線方向に沿って前記基材を見た場合に、前記第１補強部材と前記電子部品とを仮想的に結ぶ少なくともいずれかの直線に対して交差する、配線基板。     A wiring board,
    A stretchable base material including a first surface and a second surface located on the opposite side of the first surface;
    Wiring that is located on the first surface side of the base material and that is connected to electronic components mounted on the wiring board;
    A reinforcing member for reinforcing the base material,
    The reinforcing member includes a first reinforcing member extending so as to protrude from the electronic component when the base material is viewed along a direction normal to the first surface,
    The wiring intersects with at least one straight line that virtually connects the first reinforcing member and the electronic component when the base material is viewed along a direction normal to the first surface, Wiring board.
  18. 　前記第１面と前記配線との間に位置し、前記配線を支持する支持基板を更に備える、請求項１７に記載の配線基板。 The wiring board according to claim 17, further comprising a support substrate that is located between the first surface and the wiring and supports the wiring.
  19. 　配線基板であって、
    　第１面および前記第１面と反対側の第２面を有し、前記第１面および前記第２面に沿った面方向のうち少なくとも第１方向に伸縮性を有する基材と、
    　前記第１面側に位置し、前記配線基板に搭載される少なくとも１つの電子部品に接続される配線と、
    　前記電子部品に対して前記面方向に離れて位置し、前記基材を補強する補強部材と、を備え、
    　前記補強部材の少なくとも一部は、前記第１方向における前記電子部品の第１端部の位置から前記第１方向において前記第１端部に対向する第２端部の位置まで少なくとも延びており、
    　前記補強部材は、前記第１面の法線方向から見た場合に前記電子部品を囲む形状を有する、配線基板。     A wiring board,
    A base material having a first surface and a second surface opposite to the first surface, and having stretchability in at least a first direction among surface directions along the first surface and the second surface;
    Wiring located on the first surface side and connected to at least one electronic component mounted on the wiring board,
    Positioned away from the electronic component in the surface direction, a reinforcing member for reinforcing the base material,
    At least a part of the reinforcing member extends at least from a position of a first end of the electronic component in the first direction to a position of a second end facing the first end in the first direction,
    The wiring board, wherein the reinforcing member has a shape that surrounds the electronic component when viewed from a direction normal to the first surface.
PCT/JP2020/005421 2019-02-12 2020-02-12 Wiring board, and method for manufacturing wiring board WO2020166633A1 (en)

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