JPH04199790A - Shield type flexible circuit board and manufacture thereof - Google Patents
Shield type flexible circuit board and manufacture thereofInfo
- Publication number
- JPH04199790A JPH04199790A JP33288090A JP33288090A JPH04199790A JP H04199790 A JPH04199790 A JP H04199790A JP 33288090 A JP33288090 A JP 33288090A JP 33288090 A JP33288090 A JP 33288090A JP H04199790 A JPH04199790 A JP H04199790A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- shield electrode
- electrode layer
- base material
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000463 material Substances 0.000 claims abstract description 41
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 16
- 238000005530 etching Methods 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 55
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000012790 adhesive layer Substances 0.000 description 9
- 239000011888 foil Substances 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 3
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000000608 laser ablation Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 238000011298 ablation treatment Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
Landscapes
- Structure Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明は電磁シールド構造を有する可撓性回路基板及び
その製造法に関する。更に具体的には、本発明はエキシ
マレーザ光によるフォトアブレーション手段等を併用し
て完全な同軸ケーブル状に構成可能なシールド構造を有
する可撓性回路基板及びその為の製造法に関する。DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a flexible circuit board having an electromagnetic shielding structure and a method for manufacturing the same. More specifically, the present invention relates to a flexible circuit board having a shield structure that can be configured into a complete coaxial cable using photoablation means using excimer laser light, and a manufacturing method therefor.
「従来の技術」
可撓性回路基板に於けるこの種のシールド構造としては
、第２図のように可撓性絶縁ベース材１の外面に銅箔等
の導電部材からなる一様な第一のシールド電極層３を設
け、また、絶縁ベース材１の表面には銅箔等で適宜形成
した所要の回路配線パターン２を有し、更にこの回路配
線パターン２の表面側には適当な接着層４を介してこの
接着層４の側に絶縁フィルム５を備えた銅箔等からなる
第二のシールド電極層６を接合被着したものが知られて
いる。ここで、絶縁ベース材１と回路配線パターン２と
及び第一のシールド電極層３とは、例えば可撓性両面銅
張積層板等の材料を使用してその銅箔の一方に上記回路
配線パターン２を形成することにより構成することが容
易であり、また絶縁フィルム５及び第二のシールド層６
は片面型可撓性銅張積層板等をそのまま使用することが
できる。このようなシールド構造では、第−並びに第二
の両シールド層３．６を接地処理することにより所要の
シールド機能を発揮できる。``Prior Art'' As shown in FIG. 2, this type of shield structure in a flexible circuit board includes a uniform first layer made of a conductive material such as copper foil on the outer surface of a flexible insulating base material 1. A shield electrode layer 3 is provided on the surface of the insulating base material 1, and a required circuit wiring pattern 2 appropriately formed of copper foil or the like is provided on the surface of the insulating base material 1, and a suitable adhesive layer is further provided on the surface side of the circuit wiring pattern 2. It is known that a second shield electrode layer 6 made of copper foil or the like having an insulating film 5 is bonded to the side of the adhesive layer 4 via the adhesive layer 4. Here, the insulating base material 1, the circuit wiring pattern 2, and the first shield electrode layer 3 are made of a material such as a flexible double-sided copper-clad laminate, and the circuit wiring pattern is formed on one side of the copper foil. It is easy to configure by forming the insulating film 5 and the second shield layer 6.
A single-sided flexible copper-clad laminate or the like can be used as is. In such a shield structure, the required shielding function can be achieved by grounding both the first and second shield layers 3.6.
「発明が解決しようとする課題」
しかし、第２図の如き可撓性回路基板のシールド構造で
は、隣接する回路配線パターン２の間には接着層４及び
絶縁フィルム５の一部が介在するだけの構造であるから
、上下方向から来る電磁ノイズには有効なシールド作用
を発揮するが、この回路基板の側面乃至は端面からのノ
イズにはシールド機能を果たさせることは出来ない。同
様に、回路配線パターン２の間にはシールド部材が存在
しない為、隣接する回路配線パターン２間のクロストー
クを防止することもできず、また、機器とのインピーダ
ンス整合を図ることも困難である。"Problem to be Solved by the Invention" However, in the shield structure of a flexible circuit board as shown in FIG. Because of this structure, it exhibits an effective shielding effect against electromagnetic noise coming from above and below, but it cannot perform a shielding function against noise coming from the sides or end faces of this circuit board. Similarly, since there is no shielding member between the circuit wiring patterns 2, it is impossible to prevent crosstalk between adjacent circuit wiring patterns 2, and it is also difficult to achieve impedance matching with equipment. .
「課題を解決するための手段」
そこで本発明によるシールド型可撓性回路基板では、上
下方向からの電磁ノイズのみならず横から乃至は端面方
向からのノイズに対しても十分なシールド効果を発揮で
き且つ隣接する回路配線パターン間のクロストークも阻
止可能であって機器とのインピーダンス整合も容易に図
、ることの可能な完全な同軸ケーブル状のシールド型可
撓性回路５一
基板とその為の製造法を提供するものである。``Means for Solving the Problems'' Therefore, the shielded flexible circuit board according to the present invention exhibits a sufficient shielding effect not only against electromagnetic noise from above and below, but also against noise from the sides and end faces. A complete coaxial cable-shaped shielded flexible circuit 5-board and its board that can prevent crosstalk between adjacent circuit wiring patterns and easily match impedance with equipment. The present invention provides a method for manufacturing.
その為に本発明では、隣接する回路配線パターン間にも
シールド部材が配置されるように各々の ・回路配線パ
ターンを上下のシールド電極層で完全に包囲するように
構成したものである。それぞれの回路配線パターンを上
下のシールド電極層により確実に包囲させる為の手法と
しては、隣接する回路配線パターンの間に存在する絶縁
ベース材、絶縁層或いは接着層などを溝状にエキシマレ
ーザ光によるフォトアブレーション処理等で除去し、こ
の溝の部位に於いて上下のシールド電極層が互いに電気
的に接合するような手段が採用される。Therefore, in the present invention, each circuit wiring pattern is completely surrounded by upper and lower shield electrode layers so that a shield member is also arranged between adjacent circuit wiring patterns. In order to ensure that each circuit wiring pattern is surrounded by the upper and lower shield electrode layers, the insulating base material, insulating layer, adhesive layer, etc. that exist between adjacent circuit wiring patterns are groove-shaped using excimer laser light. A method is adopted in which the upper and lower shield electrode layers are removed by photoablation or the like, and the upper and lower shield electrode layers are electrically connected to each other at the groove portion.
また、上記相互のシールド電極層の接合用溝を形成する
際の手法としては、各回路配線パターンの上方部位に絶
縁状態で遮光マスクの為の金属層を配設することにより
、上記の溝を形成する為のフォトアブレーション処理を
容易迅速に施すことが出来る。このようにして構成され
たシールド型可撓性回路基板は完全に同軸ケーブル状の
構造上なるので、高機能の製品を提供できる。In addition, as a method for forming the grooves for bonding the mutual shield electrode layers, a metal layer for a light-shielding mask is provided in an insulating state above each circuit wiring pattern, thereby forming the grooves. Photoablation processing for forming the film can be easily and quickly performed. Since the shielded flexible circuit board constructed in this manner has a completely coaxial cable-like structure, it is possible to provide a highly functional product.
、−６−
「実 施 例」
以下、図示の実施例を参照しながら本発明を更に説明す
る。, -6- "Examples" The present invention will be further described below with reference to illustrated embodiments.
第１図は本発明の一実施例に従って構成されたシールド
型可撓性回路基板の概念的な要部拡大断面構成図を示し
、図中、１２は銅箔又はアルミニウム箔等の導電箔から
なる一様な第一のシールド電極層であり、その上面には
所定の間隔を置いて形成され所要の幅に分離した絶縁ベ
ース材１０Ａを設けである。１１はこの絶縁ベース材１
０Ａの′上面にその幅より僅かに狭い幅で形成された所
要の回路配線パターンを示し、この回路配線パターン１
１の上面及び側面には例えばポリイミドワニスをコーテ
ィングしキュアーして形成した適宜な厚さの絶縁層１３
Ａを備えている。絶縁ベース材１０Ａはポリイミドフィ
ルム、ポリエステルフィルム或いはカラスエポキシ樹脂
等からなる適当な絶縁樹脂シート材料を用いることが出
来、また、回路配線パターン１１の材料としては、銅箔
又はアルミニウム箔等の導電箔やその他の導電性ペース
ト等を使用することが可能である。FIG. 1 shows a conceptual enlarged sectional view of essential parts of a shielded flexible circuit board constructed according to an embodiment of the present invention, and in the figure, reference numeral 12 is made of conductive foil such as copper foil or aluminum foil. The first shield electrode layer is uniform, and on its upper surface are provided insulating base materials 10A formed at predetermined intervals and separated into required widths. 11 is this insulating base material 1
A required circuit wiring pattern formed on the upper surface of 0A with a width slightly narrower than that width is shown, and this circuit wiring pattern 1
1, an insulating layer 13 of an appropriate thickness is formed by coating and curing polyimide varnish, for example.
It has A. As the insulating base material 10A, an appropriate insulating resin sheet material such as polyimide film, polyester film, or glass epoxy resin can be used, and as the material for the circuit wiring pattern 11, conductive foil such as copper foil or aluminum foil, or conductive foil such as copper foil or aluminum foil can be used. It is possible to use other conductive pastes and the like.
」１記のような絶縁ベース材１０Ａ、回路配線パターン
１１及び絶縁層１．３ Ａの積層状の配設態様によれば
、隣接するそれら構成部材の間に第一のシールド電極層
１２を部分的に露出させる溝】４を形成することとなる
ので、この溝Ｉ４の部位に露出する第一のシールド電極
層■２に接合し且つ上記絶縁層１３Ａの上面及びその側
面並びに絶縁ベース材１０Ａの側面に及ぶように例えば
銅メツキ、銅蒸着やアルミニウム蒸着等の導電膜の被着
手段で第二のシールド電極層１５を形成することにより
、各回路配線パターン１１を個別的に上下から完全に包
囲した形態であって所謂同軸ケーブル状の完全シールド
型可撓性回路基板を構成することが出来る。According to the laminated arrangement mode of the insulating base material 10A, the circuit wiring pattern 11, and the insulating layer 1.3A as described in 1. Since a groove I4 is formed to expose the groove I4, it is bonded to the first shield electrode layer I2 exposed at the groove I4, and the upper surface and side surfaces of the insulating layer 13A, as well as the insulating base material 10A. By forming the second shield electrode layer 15 using a conductive film deposition method such as copper plating, copper evaporation, or aluminum evaporation so as to cover the sides, each circuit wiring pattern 11 is individually completely surrounded from above and below. With this configuration, a completely shielded flexible circuit board in the form of a so-called coaxial cable can be constructed.
第３図（１）〜（４）はその為の一製造工程図を示すも
のであって、接着層の介在するもの又は無接着剤型の可
撓性両面銅張積層板等の材料を予め用意し、斯かる材料
の一方の導電箔はそのまま第一のシールド電極層１２に
使用し、また他方の導電箔に対してはフォトエツチング
処理を施して可撓性の絶縁ベース材ＩＯ上に所要の回路
配線パターン１１を同図（１）の如く形成する。次に、
同図（２）のように回路配線パターン１１の上面及びそ
の端面と露出する絶縁ベース材ＩＯの個所に一様に例え
ばポリイミドワニスをコーチインクしキュアーして適当
な厚さの絶縁層１３を形成することとなる。そこで、同
図（３）に示す如（、各回路配線パターン１１の端面を
露出させない幅で隣接する回路配線パターン１１の間に
位置する絶縁層１３及び絶縁ベース材１０の部位をエキ
シマレーザ光Ａによるフォトアブレーション処理で部分
的に除去することにより第一のシールド電極層１２を部
分的に露出させるように溝１４を形成する。このレーザ
アブレーション処理によって、各回路配線パターン１１
の上下にはそのパターンの幅に対応してそれぞれ分離さ
れた絶縁層１３Ａと同幅の絶縁ベース材１０Ａが形成さ
れる。次いで、同図（４）の如く、分離された絶縁層１
３Ａの上面とその端面及び絶縁ベース材１０Ａの端面並
びに溝１４の個所に露出している第一のシールド電極層
１２の部分に無電解銅メツキとその厚付は手段の他、銅
蒸着やアルミニウム蒸着等の導電膜形成手段か又はその
他の導電性ペーストの塗布手段で一様な厚さに第二のシ
ールド電極層１５を形成することにより、溝１４の個所
で上下の両ンールド電極層１２．１５が電気的に接合さ
れると共に、分離された絶縁層１３Ａ及び絶縁ベース祠
１０Ａを介して各回路配線パターン１１を第−及び第二
の両シールド電極層１２．１５で上下からその周囲を完
全に包囲した形態の所謂同軸ケーブル状の完全シールド
方式の可撓性回路基板を構成することが可能となり、こ
れにより第１図に示した構造の製品を得ることができる
。Figures 3 (1) to (4) show a manufacturing process diagram for this purpose, in which materials such as those with an intervening adhesive layer or non-adhesive type flexible double-sided copper-clad laminates are prepared in advance. One of the conductive foils made of such material is used as it is for the first shield electrode layer 12, and the other conductive foil is photo-etched to form the required layers on the flexible insulating base material IO. A circuit wiring pattern 11 is formed as shown in FIG. 1 (1). next,
As shown in FIG. 2 (2), for example, polyimide varnish is uniformly coach-inked on the upper surface of the circuit wiring pattern 11, its end surface, and the exposed portion of the insulating base material IO, and cured to form an insulating layer 13 of an appropriate thickness. I will do it. Therefore, as shown in FIG. 3 (3), the parts of the insulating layer 13 and the insulating base material 10 located between adjacent circuit wiring patterns 11 are scanned with excimer laser beam A with a width that does not expose the end faces of each circuit wiring pattern 11. Grooves 14 are formed so as to partially expose the first shield electrode layer 12 by partially removing the first shield electrode layer 12 with a photo ablation process.By this laser ablation process, each circuit wiring pattern 11
An insulating base material 10A having the same width as the insulating layer 13A is formed above and below the insulating layer 13A, which are separated according to the width of the pattern. Next, as shown in FIG. 4, the separated insulating layer 1 is
In addition to electroless copper plating and thickening, the upper surface and end surfaces of the insulating base material 10A, the end surfaces of the insulating base material 10A, and the portions of the first shield electrode layer 12 exposed in the grooves 14 are coated with copper vapor deposition or aluminum. By forming the second shield electrode layer 15 to a uniform thickness using a conductive film forming means such as vapor deposition or other conductive paste coating means, both the upper and lower rolled electrode layers 12. 15 are electrically connected, and each circuit wiring pattern 11 is completely surrounded from above and below by both the first and second shield electrode layers 12 and 15 through the separated insulating layer 13A and the insulating base 10A. It becomes possible to construct a completely shielded flexible circuit board in the form of a so-called coaxial cable, which is surrounded by a coaxial cable, and thereby a product having the structure shown in FIG. 1 can be obtained.
上記に於いて、溝１４を形成して第一のシールド電極層
１２を部分的に露出させる為の手法としては上記の如き
フォトアブレーション処理の他、適当なマスク用レジス
ト膜の併用によるアルカリエツチングやヒドラジンエツ
チング等の樹脂エツチング手段を採用することも可能で
ある。In the above, methods for forming the grooves 14 and partially exposing the first shield electrode layer 12 include, in addition to the photoablation treatment described above, alkaline etching using a suitable resist film for a mask. It is also possible to employ resin etching means such as hydrazine etching.
−１０＝
第４図は本発明の他の実施例に従って構成されたシール
ド型可撓性回路基板の概念的な要部拡大断面構成図であ
って、第１図と同一符号はそれらと同一の構成要素を示
し、この実施例の場合には各回路配線パターン１１と第
二のシールド層１５との間に各々分離された接着層１６
と絶縁フィルム１７Ａからなる絶縁層を介して第二のシ
ールド層１５の下面に金属層１８を介装した構造に特徴
がある。金属層１８は以下の説明の如くエキシマレーザ
光によるフォトアブレーション処理の際の遮光マスクと
して有効に機能するものであって、完全同軸シールド型
の可撓性回路基板をフォトアブレーション処理で迅速に
構成する為の手法に極めて有効である。-10= FIG. 4 is a conceptual enlarged cross-sectional configuration diagram of main parts of a shielded flexible circuit board constructed according to another embodiment of the present invention, and the same reference numerals as in FIG. Components are shown, and in this embodiment, adhesive layers 16 are separated between each circuit wiring pattern 11 and the second shield layer 15.
The structure is characterized in that a metal layer 18 is interposed on the lower surface of the second shield layer 15 via an insulating layer consisting of an insulating film 17A. As explained below, the metal layer 18 effectively functions as a light shielding mask during photoablation processing using excimer laser light, and a completely coaxial shield type flexible circuit board can be quickly constructed by photoablation processing. This is an extremely effective method for
即ち、第５図（１）〜（３）にその製造工程を順次示す
とおり、同図（１）の如く第３図（１）の工程終了後、
先ず例えば可撓性片面銅張積層板等の材料を用意し、こ
の材料に好ましくは予めその導電箔側に溝孔１９を形成
して分離された金属層１８を形成しておく。溝孔１９は
隣接する回路配線パターン１１の間の所定個所に対応す
る態様で設けられるので、回路配線パターン１１の」二
面側に接着層１６を用いてその絶縁フィルム１７が位置
し且つ分離された金属層１８が外面に位置するように接
合することにより、溝孔１９は隣接する回路配線パター
ン１１の間の中間部に配設されることとなる。金属層１
８は外面に位置した状態で配設されているので、同図（
２）に示すようにこの金属層１８の上面方向からエキシ
マレーザ光Ａを照射することにより、溝孔１９の幅に対
応した幅で絶縁フィルム１７、接着層１６及び絶縁ベー
ス材１０の部分をフォトアブレーション処理で除去する
と、その部位には上記実施例と同等な溝１４が容易且つ
迅速に形成される。そこで、第３図（４）と同様な手法
に従って既述の第二のシールド電極層１５を同図（３）
に示すように容易に形成することが可能となる。この手
法は、金属層１８をエキシマレーザ光Ａの照射の際の遮
光マスクとして機能させ、また、これをこの回路基板の
構成要素として残すことが出来る構造となる。That is, as shown in FIGS. 5(1) to 5(3) in sequence, after the process in FIG. 3(1) is completed as in FIG. 5(1),
First, a material such as a flexible single-sided copper-clad laminate is prepared, and a separated metal layer 18 is preferably formed in advance by forming slots 19 on the conductive foil side of the material. Since the slot holes 19 are provided in a manner corresponding to predetermined locations between adjacent circuit wiring patterns 11, the insulating film 17 is positioned and separated using the adhesive layer 16 on the two sides of the circuit wiring patterns 11. By bonding the metal layer 18 so as to be located on the outer surface, the groove hole 19 is disposed at an intermediate portion between adjacent circuit wiring patterns 11. metal layer 1
8 is located on the outside surface, so the same figure (
As shown in 2), by irradiating excimer laser light A from the upper surface direction of this metal layer 18, the portions of the insulating film 17, adhesive layer 16, and insulating base material 10 are photo-photographed with a width corresponding to the width of the groove hole 19. When removed by ablation treatment, a groove 14 similar to that of the above embodiment is easily and quickly formed at that location. Therefore, the above-mentioned second shield electrode layer 15 was formed using the same method as shown in FIG. 3 (4).
It can be easily formed as shown in FIG. This method allows the metal layer 18 to function as a light-shielding mask during irradiation with the excimer laser beam A, and also allows the metal layer 18 to remain as a component of the circuit board.
「発明の効果Ｊ
本発明に係るシールド型可撓性回路基板によれば、各回
路配線パターンをその周囲から上下の両シールド電極層
で完全に包囲した構造の所謂同軸ケーブル状の完全なシ
ールド型の可撓性回路基板を構成できるので、回路基板
の上下方向の電磁ノイズのみならず横方向乃至は端面方
向からのノイズに対しても確実なシールド効果を発揮し
、また隣接する回路配線パターン間に対してもシールド
層が完全に介在する構造であるので、回路配線パターン
間のクロストークをも確実に防止できる。"Effect of the Invention J According to the shield type flexible circuit board according to the present invention, each circuit wiring pattern is completely surrounded by both the upper and lower shield electrode layers from the periphery, and is a so-called coaxial cable-like complete shield type. As a flexible circuit board can be constructed, it provides a reliable shielding effect not only against electromagnetic noise in the vertical direction of the circuit board, but also against noise from the lateral direction or end face direction, and also prevents noise between adjacent circuit wiring patterns. Since the shield layer is completely interposed in the structure, crosstalk between circuit wiring patterns can be reliably prevented.
従って、機器とのインピーダンス整合も十分に容易な構
造となるので、高周波回路に接続された場合でも十分に
対応することができる。Therefore, the structure allows impedance matching with equipment to be sufficiently easy, so that even when connected to a high frequency circuit, it can be adequately supported.
そして、このようなシールド型可撓性回路基板はレーザ
アブレーション処理工程等で簡便に製作可能であり、特
に、回路配線パターンに上方部位に金属層を具備する構
造のものでは、この金属層を遮光マスクとして機能させ
ながら迅速且つ容易なフォトアブレーション処理を実施
できる。Such a shielded flexible circuit board can be easily manufactured using a laser ablation process, etc. In particular, in a structure in which a metal layer is provided above the circuit wiring pattern, this metal layer can be shielded from light. A quick and easy photoablation process can be performed while functioning as a mask.
第１図は本発明の一実施例に従って構成されたシールド
型可撓性回路基板の概念的な要部拡大断面構成図、
第２図は従来の構造に従ったシールド型可撓性回路基板
の概念的な要部拡大断面構成図、第３図は第１図のシー
ルド型可撓性回路基板の製造工程図、
第４図は本発明の他の実施例に従って構成されたシール
ド型可撓性回路基板の概念的な要部拡大断面構成図、そ
して、
第５図は第４図のシールド型可撓性回路基板の製造工程
図である。
「符号の説明」
１０は可撓性絶縁ベース材、ＩＯＡは分離された絶縁ベ
ース材、１１は回路配線パターン、１２は第一のシール
ド電極層、１３は絶縁層、１３Ａは分離された絶縁層、
１４は溝、１５は第二のシールド電極層、１６は接着層
、１７Ａは分離された絶縁フィルム、１８は金属層、１
９は溝孔。FIG. 1 is a conceptual enlarged cross-sectional configuration diagram of main parts of a shielded flexible circuit board constructed according to an embodiment of the present invention, and FIG. 2 is a diagram of a shielded flexible circuit board according to a conventional structure. A conceptual enlarged sectional configuration diagram of the main parts, FIG. 3 is a manufacturing process diagram of the shielded flexible circuit board of FIG. 1, and FIG. 4 is a shielded flexible circuit board constructed according to another embodiment of the present invention. FIG. 5 is a schematic enlarged sectional view of the main parts of the circuit board, and FIG. 5 is a manufacturing process diagram of the shielded flexible circuit board of FIG. 4. "Explanation of symbols" 10 is a flexible insulating base material, IOA is a separated insulating base material, 11 is a circuit wiring pattern, 12 is a first shield electrode layer, 13 is an insulating layer, 13A is a separated insulating layer ,
14 is a groove, 15 is a second shield electrode layer, 16 is an adhesive layer, 17A is a separated insulating film, 18 is a metal layer, 1
9 is a slot.
Claims (5)
上に所要の回路配線パターンを支持し且つこの回路配線
パターンの幅に適合した幅の絶縁べース材を備え、上記
各回路配線パターンの上面と側面には絶縁層を有し、こ
の絶縁層の外面と上記絶縁ベース材の側面に被覆形成さ
れると共にその各絶縁ベース材の隣接部位に露出する上
記第一のシールド電極層部分にも一様に接合された第二
のシールド電極層を具備するように構成したことを特徴
とするシールド型可撓性回路基板。(1) Supporting a required circuit wiring pattern on a uniform first shield electrode layer made of a conductive material, and providing an insulating base material with a width matching the width of the circuit wiring pattern, each of the above-mentioned circuits The first shield electrode layer has an insulating layer on the upper surface and side surfaces of the wiring pattern, and is formed to cover the outer surface of the insulating layer and the side surface of the insulating base material, and is exposed to adjacent portions of each of the insulating base materials. What is claimed is: 1. A shielded flexible circuit board comprising a second shielding electrode layer uniformly bonded to the entire portion of the shielded flexible circuit board.
二のシールド電極層との間に金属層を配設した請求項（
１）のシールド型可撓性回路基板。(2) Claim (2) wherein a metal layer is disposed between the insulating layer provided on the circuit wiring pattern and the second shield electrode layer.
1) Shielded flexible circuit board.
極層を形成すると共にこの絶縁ベース材の他方面には所
要の回路配線パターンを形成し、次いで上記回路配線パ
ターン及び上記絶縁ベース材の上面に一様に絶縁層を形
成した後、隣接する上記回路配線パターン間に位置する
上記絶縁層及び絶縁ベース材部分を除去して上記第一の
シールド電極層部分を溝状に露出させ、更に上記絶縁層
の上面とこの絶縁層及び上記絶縁ベース材の側面並びに
溝状に露出した上記第一のシールド電極層部分に亘って
一様に第二のシールド電極層を被着形成する各工程を含
むことを特徴とするシールド型可撓性回路基板の製造法
。(3) A uniform first shield electrode layer is formed on one side of the insulating base material, and a required circuit wiring pattern is formed on the other side of the insulating base material, and then the above circuit wiring pattern and the above insulating base are formed. After forming an insulating layer uniformly on the upper surface of the material, the insulating layer and the insulating base material portion located between the adjacent circuit wiring patterns are removed to expose the first shield electrode layer portion in a groove shape. Further, a second shield electrode layer is uniformly deposited over the upper surface of the insulating layer, the side surfaces of the insulating layer and the insulating base material, and the groove-shaped exposed portion of the first shield electrode layer. A method for manufacturing a shielded flexible circuit board, characterized by including a process.
第一のシールド電極層部分を溝状に露出させる工程は、
エキシマレーザ光によるフォトアブレーション手段で処
理されるか又は樹脂エッチング手段で処理される請求項
（３）のシールド型可撓性回路基板の製造法。(4) The step of removing the insulating layer and the insulating base material portion to expose the first shield electrode layer portion in a groove shape,
4. The method for producing a shielded flexible circuit board according to claim 3, wherein the process is carried out by photoablation means using excimer laser light or by resin etching means.
極層を形成すると共にこの絶縁ベース材の他方面には所
要の回路配線パターンを形成し、この回路配線パターン
上に絶縁層を介して金属層を形成し、この金属層には上
記各回路配線パターンの隣接する個所に上記絶縁層を露
出させる溝孔が形成され、上記金属層を遮光マスクとし
て機能させながら上記溝孔に位置する上記絶縁層及び上
記絶縁ベース材部分をエキシマレーザ光によるフォトア
ブレーション処理で除去して上記上記第一のシールド電
極層部分を溝状に露出させ、更に上記金属層の上面とこ
の金属層、上記絶縁層及び上記絶縁ベース材の側面並び
に溝状に露出した上記第一のシールド電極層部分に亘っ
て一様に第二のシールド電極層を被着形成する各工程を
含むことを特徴とするシールド型可撓性回路基板の製造
法。(5) A uniform first shield electrode layer is formed on one side of the insulating base material, a required circuit wiring pattern is formed on the other side of the insulating base material, and an insulating layer is formed on the circuit wiring pattern. A metal layer is formed through the metal layer, and grooves are formed in this metal layer to expose the insulating layer at locations adjacent to each of the circuit wiring patterns. The insulating layer and the insulating base material portion are removed by photoablation using excimer laser light to expose the first shield electrode layer portion in a groove shape, and the upper surface of the metal layer, this metal layer, and the A shield comprising the steps of uniformly depositing a second shield electrode layer over the insulating layer, the side surface of the insulating base material, and the first shield electrode layer portion exposed in a groove shape. Method of manufacturing mold flexible circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2332880A JPH0693552B2 (en) | 1990-11-29 | 1990-11-29 | Shield type flexible circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2332880A JPH0693552B2 (en) | 1990-11-29 | 1990-11-29 | Shield type flexible circuit board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04199790A true JPH04199790A (en) | 1992-07-20 |
| JPH0693552B2 JPH0693552B2 (en) | 1994-11-16 |
Family
ID=18259832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2332880A Expired - Fee Related JPH0693552B2 (en) | 1990-11-29 | 1990-11-29 | Shield type flexible circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0693552B2 (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08264911A (en) * | 1995-03-24 | 1996-10-11 | Nitto Denko Corp | Printed wiring board |
| JP2001166020A (en) * | 1999-12-09 | 2001-06-22 | Nippon Soken Inc | Magnetism detecting antenna |
| JP2002043708A (en) * | 2000-07-27 | 2002-02-08 | Sony Chem Corp | Wiring board |
| JP2003249731A (en) * | 2002-02-25 | 2003-09-05 | National Institute Of Advanced Industrial & Technology | Printed circuit board of coaxial cable structure and method of manufacturing the same |
| JP2007201359A (en) * | 2006-01-30 | 2007-08-09 | Nitto Denko Corp | Wiring circuit board |
| US7465884B2 (en) | 2006-04-20 | 2008-12-16 | Nitto Denko Corporation | Wired circuit board |
| JP2009231770A (en) * | 2008-03-25 | 2009-10-08 | Nippon Mektron Ltd | Multilayer flexible printed wiring board and its manufacturing method |
| JP2011003906A (en) * | 2009-06-22 | 2011-01-06 | General Electric Co <Ge> | System and method of forming isolated shape adaptive shielding areas |
| JP2012243857A (en) * | 2011-05-17 | 2012-12-10 | Hitachi Ltd | Printed board and manufacturing method of printed board |
| JP2013021069A (en) * | 2011-07-08 | 2013-01-31 | Sumitomo Electric Printed Circuit Inc | Flexible printed wiring board with shield, manufacturing method therefor, and electronic apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5831428U (en) * | 1981-08-26 | 1983-03-01 | 日本精工株式会社 | track guide bearing |
-
1990
- 1990-11-29 JP JP2332880A patent/JPH0693552B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5831428U (en) * | 1981-08-26 | 1983-03-01 | 日本精工株式会社 | track guide bearing |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08264911A (en) * | 1995-03-24 | 1996-10-11 | Nitto Denko Corp | Printed wiring board |
| JP2001166020A (en) * | 1999-12-09 | 2001-06-22 | Nippon Soken Inc | Magnetism detecting antenna |
| JP2002043708A (en) * | 2000-07-27 | 2002-02-08 | Sony Chem Corp | Wiring board |
| JP2003249731A (en) * | 2002-02-25 | 2003-09-05 | National Institute Of Advanced Industrial & Technology | Printed circuit board of coaxial cable structure and method of manufacturing the same |
| JP2007201359A (en) * | 2006-01-30 | 2007-08-09 | Nitto Denko Corp | Wiring circuit board |
| US7465884B2 (en) | 2006-04-20 | 2008-12-16 | Nitto Denko Corporation | Wired circuit board |
| JP2009231770A (en) * | 2008-03-25 | 2009-10-08 | Nippon Mektron Ltd | Multilayer flexible printed wiring board and its manufacturing method |
| JP2011003906A (en) * | 2009-06-22 | 2011-01-06 | General Electric Co <Ge> | System and method of forming isolated shape adaptive shielding areas |
| JP2012243857A (en) * | 2011-05-17 | 2012-12-10 | Hitachi Ltd | Printed board and manufacturing method of printed board |
| JP2013021069A (en) * | 2011-07-08 | 2013-01-31 | Sumitomo Electric Printed Circuit Inc | Flexible printed wiring board with shield, manufacturing method therefor, and electronic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0693552B2 (en) | 1994-11-16 |
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