JPH04167498A - Shield type flexible printed-circuit board and its manufacture - Google Patents
Shield type flexible printed-circuit board and its manufactureInfo
- Publication number
- JPH04167498A JPH04167498A JP29418990A JP29418990A JPH04167498A JP H04167498 A JPH04167498 A JP H04167498A JP 29418990 A JP29418990 A JP 29418990A JP 29418990 A JP29418990 A JP 29418990A JP H04167498 A JPH04167498 A JP H04167498A
- Authority
- JP
- Japan
- Prior art keywords
- shield electrode
- electrode layer
- layer
- base material
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000010410 layer Substances 0.000 claims abstract description 99
- 239000004020 conductor Substances 0.000 claims abstract description 25
- 239000012790 adhesive layer Substances 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 4
- 238000011298 ablation treatment Methods 0.000 claims description 2
- 238000011282 treatment Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 11
- 239000013039 cover film Substances 0.000 abstract description 11
- 239000011889 copper foil Substances 0.000 abstract description 7
- 238000009413 insulation Methods 0.000 abstract 6
- 238000003475 lamination Methods 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 229920001721 polyimide Polymers 0.000 description 8
- 239000004642 Polyimide Substances 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 239000011888 foil Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000002679 ablation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
・７ 「産業上の利用分野」
本発明はプリント配線基板に於いてクロストークを防止
すると共に、回路導体を同軸ケーブル状に完全にシール
ド可能に構成したシールド型方式の可撓性回路基板及び
その製造法に関する。[Detailed Description of the Invention] ・7 "Field of Industrial Application" The present invention is a shield type system that prevents crosstalk in a printed wiring board and completely shields the circuit conductor in the form of a coaxial cable. This invention relates to a flexible circuit board and its manufacturing method.
「従来技術とその問題点」
この種の可撓性回路基板に於けるシールド構造としては
、第３図の如（、シールド電極層ｌと、絶縁フィルム層
２とからなるベース基板の上面に所要数の配線パターン
３を被着形成し、これらの配線パターン３の上面に接着
剤４を介して絶縁フィルム層５を配設し、更にこの絶縁
フィルム層５の表面に他のシールド電極層６を被覆した
構造のものがある。このような構造は、両面可撓性銅張
積層板等からなる一方の銅箔に片面可撓性銅張積層板等
を接着剤４で接合するという簡便な製作上の手法を採用
できるので好都合である。``Prior art and its problems'' The shield structure in this type of flexible circuit board is as shown in Fig. A number of wiring patterns 3 are deposited, an insulating film layer 5 is provided on the upper surface of these wiring patterns 3 via an adhesive 4, and another shield electrode layer 6 is formed on the surface of this insulating film layer 5. There is a coated structure.Such a structure can be easily manufactured by bonding a single-sided flexible copper-clad laminate or the like to one copper foil made of a double-sided flexible copper-clad laminate or the like using adhesive 4. This is convenient because the above method can be adopted.
しかし、斯かる従来構造からなるシールド手段では、図
の如くシールド電極層１．６の配置により上下方向のノ
イズに対してはシールド効果を奏しても隣接する配線パ
ターン３間には接着剤４と絶縁フィルム層５が介在して
おり、また、シールド電極層１．６の双方の距離は大き
いので、特に高周波回路に於いてインピーダンス整合を
図ることは出来ず、更に相互の配線パターン３間にクロ
ストークを生ずるという問題があった。However, with the shielding means having such a conventional structure, even though the arrangement of the shield electrode layer 1.6 as shown in the figure provides a shielding effect against noise in the vertical direction, the adhesive 4 and Since the insulating film layer 5 is interposed and the distance between the shield electrode layers 1 and 6 is large, it is impossible to achieve impedance matching especially in high frequency circuits, and furthermore, there is no cross between the wiring patterns 3. There was a problem that talk occurred.
「発明の目的及び構成」
そこで、本発明は、この種のシールド型可撓性回路基板
に於いて、インピーダンス整合の容易なものであって且
つクロストークをも好適に防止できるような所謂同軸ケ
ーブル状の完全なシールド型可撓性回路基板とその好適
な製造法を提供するものである。``Object and Structure of the Invention'' Therefore, the present invention provides a so-called coaxial cable that facilitates impedance matching and suitably prevents crosstalk in this type of shielded flexible circuit board. The present invention provides a completely shielded flexible circuit board and a suitable manufacturing method thereof.
その為に、本発明に係るシールド型可撓性回路基板では
、第一のシールド電極層上に所要の配線パターンに従っ
て該シールド電極層と同一幅に形成した絶縁基材と、該
絶縁基材上に設けられ上記第一のシールド電極層より幅
狭の回路導体と、該回路導体を覆う絶縁層と、該絶縁層
の上方に配設された第二のシールド電極層と、及び上記
第一のシールド電極層、絶縁基材並びに絶縁層を覆い且
つ上記第二のシールド電極層と電気的に導通する第三の
シールド電極層とを具備するように構成したものであり
、ここで、上記絶縁層はフィルム状絶縁基材と接着剤層
とで構成することも勿論可能である。Therefore, in the shield type flexible circuit board according to the present invention, an insulating base material is formed on the first shield electrode layer according to a required wiring pattern to have the same width as the shield electrode layer, and the insulating base material is a circuit conductor provided in the circuit conductor and having a width narrower than the first shield electrode layer; an insulating layer covering the circuit conductor; a second shield electrode layer disposed above the insulating layer; It is configured to include a shield electrode layer, an insulating base material, and a third shield electrode layer that covers the insulating layer and is electrically conductive with the second shield electrode layer, wherein the insulating layer Of course, it is also possible to configure it with a film-like insulating base material and an adhesive layer.
また、斯かるシールド型可撓性回路基板の製造手法とし
て、本発明では、可撓性両面銅張積層板の一方の導電層
を第一のシールド電極層に用いながら該積層板の他方の
導電層に所要の回路導体を形成し、この回路導体側に絶
縁層と第二のシールド電極層とを形成し、上記第一のシ
ールド電極層間に形成される開口部に位置する部位の上
記両面銅張積層板の絶縁基材と上記絶縁層とをエキシマ
レーザによるアブレーション処理で除去した後、上記第
一のシールド電極層、絶縁基材及び絶縁層を覆い且つ上
記第二のシールド電極層と電気的に導通するように第三
のシールド電極層を形成する各工程を含む方法が採用さ
れる。斯かる製造法に於いて、前記絶縁層をフィルム状
絶縁基材と接着剤層とで形成することも可能であり、ま
た、第一のシールド電極層をアブレーション処理工程後
にエツチング処理で除去することに゛よって、第一のシ
ールド電極層を有しないように構成した構造も容易に提
供することが可能である。In addition, as a manufacturing method of such a shielded flexible circuit board, the present invention uses one conductive layer of a flexible double-sided copper-clad laminate as the first shield electrode layer while the other conductive layer of the laminate is used as the first shield electrode layer. A required circuit conductor is formed on the layer, an insulating layer and a second shield electrode layer are formed on the circuit conductor side, and the double-sided copper layer is formed at a portion located in the opening formed between the first shield electrode layers. After removing the insulating base material of the stretched laminate and the above-mentioned insulating layer by an ablation process using an excimer laser, the first shield electrode layer, the insulating base material, and the insulating layer are covered and the second shield electrode layer is electrically connected. A method including steps of forming a third shield electrode layer so as to be electrically conductive to each other is employed. In such a manufacturing method, it is also possible to form the insulating layer with a film-like insulating base material and an adhesive layer, and also to remove the first shield electrode layer by etching after the ablation process. Accordingly, it is possible to easily provide a structure that does not include the first shield electrode layer.
「実 施 例」
以下、図示の実施例を参照しながら本発明を更に説明す
ると、第１図に於いて、１］は銅箔やアルミニウム箔等
の金属箔膜からなる第一のシールド電極層を示し、その
上面にはポリイミド、ポリエステル又はガラスエポキシ
樹脂等の可撓性絶縁シート材からなり且つ第一のシール
ド電極層１１と同一幅の絶縁基材１２を有し、該絶縁基
材１２の上部には銅箔又はアルミニウム箔等の導電箔か
らなる幅狭の回路導体１３を形成して配線パターンを構
成しである。そして、絶縁基材１２の上の回路導体１３
の面上には、接着剤層１４を介してポリイミド樹脂フィ
ルムからなるカバーフィルム１５が貼着されており、こ
れら接着剤層１４及びカバーフィルム１５は第一のシー
ルド電極層１１と同一の幅に形成されている。斯して、
これらの第一のシールド電極層１１．絶縁基材１２、回
路導体１３、接着剤層１４及びカバーフィルム１５は所
要の配線パターン部１０を形成することとなり、斯かる
配線パターン部１０が所定の間隔を以って所要数配設さ
れている。１６はそれらの配線パターン部１０のカバー
フィルム１５上面に共通に被着した第二のシールド電極
層を示す。また、これらの配線パターン部ＩＯは、銅メ
ツキ或いは銅蒸着やアルミニウム蒸着等の導電性膜又は
その他の導電性ペースト等からなる第三のシールド電極
層１７によってその外面に密着した状態で被覆されてお
り、そして、この第三のシールド電極層１７は、図の如
く第三位のシールド電極層１６と配線パターン部１０の
間で電気的に導通するように密着して配装されており、
斯してこのシールド型可撓性回路基板は所謂同軸ケーブ
ル状に完全なシールド構造に構成されている。"Example" The present invention will be further explained below with reference to the illustrated example. In FIG. 1, 1] is a first shield electrode layer made of a metal foil film such as copper foil or aluminum foil. , and has an insulating base material 12 on its upper surface made of a flexible insulating sheet material such as polyimide, polyester, or glass epoxy resin and having the same width as the first shield electrode layer 11, A narrow circuit conductor 13 made of conductive foil such as copper foil or aluminum foil is formed on the upper part to form a wiring pattern. Then, the circuit conductor 13 on the insulating base material 12
A cover film 15 made of a polyimide resin film is pasted on the surface of the electrode layer 14 with an adhesive layer 14 interposed therebetween. It is formed. Thus,
These first shield electrode layers 11. The insulating base material 12, the circuit conductor 13, the adhesive layer 14, and the cover film 15 form a required wiring pattern section 10, and a required number of such wiring pattern sections 10 are arranged at predetermined intervals. There is. Reference numeral 16 denotes a second shield electrode layer commonly deposited on the upper surface of the cover film 15 of these wiring pattern sections 10. Further, these wiring pattern portions IO are covered with a third shield electrode layer 17 made of copper plating, a conductive film such as copper evaporation, aluminum evaporation, or other conductive paste, in close contact with the outer surface thereof. As shown in the figure, the third shield electrode layer 17 is disposed in close contact with the third shield electrode layer 16 and the wiring pattern section 10 so as to be electrically conductive therebetween.
Thus, this shielded flexible circuit board has a completely shielded structure similar to a so-called coaxial cable.
従って、上記構成に於いて、両シールド電極層１６．１
７をアース処理すると、各配線パターン部ｌＯの回路導
体１３は、上下方向にのみ限らず隣接する配線パターン
部１０の回路導体１３をも第三のシールド電極層１７で
完全にシールドされることとなるので、隣接する回路導
体１３の間に於けるクロストークも確実に防止できるよ
うになるものである。Therefore, in the above configuration, both shield electrode layers 16.1
7 is grounded, the circuit conductor 13 of each wiring pattern portion 10 is completely shielded not only in the vertical direction but also the circuit conductor 13 of the adjacent wiring pattern portion 10 by the third shield electrode layer 17. Therefore, crosstalk between adjacent circuit conductors 13 can be reliably prevented.
上記構成に於いて、接着剤層１４及びカバーフィルム１
５は例えば接着性ポリイミドフェス等の絶縁性接着剤を
用いて銅箔やアルミニウム箔等からなる第二のシールド
電極層１６を接合するような構成も適宜採用できる。ま
た、第一のシールド電極層１１は、後述のエキシマレー
ザによるアブレーション処理工程後にエツチング処理等
で適宜除去してこの可撓性回路基板の７レキシビリテイ
を向上させるように構成することも同様に可能である。In the above configuration, the adhesive layer 14 and the cover film 1
For example, a structure in which the second shield electrode layer 16 made of copper foil, aluminum foil, or the like is bonded to the second shield electrode layer 16 using an insulating adhesive such as an adhesive polyimide film can also be adopted as appropriate. Furthermore, the first shield electrode layer 11 may be appropriately removed by an etching process or the like after an ablation process using an excimer laser, which will be described later, to improve the flexibility of this flexible circuit board. be.
第２図（１）〜（４）は、上記構造からなるシールド型
可撓性回路基板の一製造工程図を示すものであって、先
ず同図（１）の如く絶縁基材１２の一方面に幅狭の回路
導体１３を設けると共に、該絶縁基材１２の他方面に幅
広の第一のシールド電極層１１を形成する手段は、例え
ばポリイミド可撓性両面無接着剤銅張積層板を用いてエ
ツチング処理手法で常法の如く容易に形成採用できる。FIGS. 2(1) to 2(4) show a manufacturing process diagram of a shielded flexible circuit board having the above structure. First, as shown in FIG. 2(1), one side of the insulating base material 12 is The means for providing the narrow circuit conductor 13 on the side and forming the wide first shield electrode layer 11 on the other side of the insulating base material 12 is, for example, using a polyimide flexible double-sided non-adhesive copper-clad laminate. It can be easily formed and adopted using a conventional etching method.
次に、同図（２）の如く、幅狭の回路導体１３が形成さ
れている面には接着剤層１４を介してカバーフィルム１
５及び第二のシールド電極層１６を構成する為のポリイ
ミド可撓性片面銅張積層板がその銅箔面を外面に向くよ
うに接合される。ここで、銅箔としての第二のシールド
電極層１６は上記の如きポリイミド可撓性片面銅張積層
板を用いることなく接着性ポリイミドワニス等の接着性
絶縁物を用いて回路導体１３の側に直接的に接合するこ
とも可能である。Next, as shown in FIG. 2 (2), a cover film 1 is placed on the surface on which the narrow circuit conductor 13 is formed via an adhesive layer 14.
Polyimide flexible single-sided copper-clad laminates for forming the second shield electrode layer 5 and the second shield electrode layer 16 are bonded with their copper foil surfaces facing outward. Here, the second shield electrode layer 16 as a copper foil is formed on the side of the circuit conductor 13 by using an adhesive insulator such as adhesive polyimide varnish, without using the polyimide flexible single-sided copper-clad laminate as described above. It is also possible to join directly.
そこで、同図（３）に示すように、各第−のシー、ルド
電極層１１をエキシマレーザの為の遮光マスクの如く作
用させながらエキシマレーザ光Ａによるフォトアブレー
ション処理工程を施すことによって、隣接する各第−の
シールド電極層１１の間に開口部として位置している絶
縁基材１２、接着剤層１４及びカバーフィルム１５の部
位をアブレージジン作用で適宜溝状に除去することとな
る。Therefore, as shown in FIG. 3(3), by performing a photoablation process using excimer laser light A while using each of the first and second shield electrode layers 11 as a light-shielding mask for the excimer laser, the adjacent The portions of the insulating base material 12, the adhesive layer 14, and the cover film 15 located as openings between the respective second shield electrode layers 11 are removed in an appropriate groove shape by an abrasive action.
次いで、同図（４）の如く、第一のシールド電極層１１
、絶縁基材１２、接着剤層１４及びカバーフィルム１５
からなる配線パターン部１０を被覆すると共に、第二の
シールド電極層１６と電気的に導通するように第三のシ
ールド電極層１７を形成することによって、本発明のシ
ールド型可撓性回路基板を能率よく製作することが可能
となる。Next, as shown in FIG. 4, the first shield electrode layer 11 is
, an insulating base material 12, an adhesive layer 14, and a cover film 15
The shield type flexible circuit board of the present invention can be manufactured by forming the third shield electrode layer 17 so as to cover the wiring pattern portion 10 consisting of It becomes possible to manufacture efficiently.
なお、本発明に係るシールド型可撓性回路基板を製作す
る為に使用する材料としては、上記の如きポリイミド可
撓性両面無接着剤銅張積層板に限らず、接着剤を介在さ
せた一般的な可撓性両面型の銅張積層板も同様に使用す
ることが出来る。The materials used to manufacture the shielded flexible circuit board according to the present invention are not limited to the polyimide flexible double-sided non-adhesive copper-clad laminate described above, but also general materials with an adhesive interposed. Flexible double-sided copper clad laminates can be used as well.
「発明の効果」
本発明に係るシールド型可撓性回路基板によれば、上記
の如き構成を採用したので、第二のシールド電極層と第
三のシールド電極層は、配線パターンの存在する箇所で
は薄い絶縁層を介するだけで各回路導体に対接し、それ
らの配線パターンの存在する箇所以外では、相互にシー
ルド電極層が密接する所謂同軸ケーブル状の構造である
ので、隣接する配線パターン間にはシールド層が確実に
存在して各配線パターンの上下方向のノイズシールド作
用のみならず、各配線パターン間のクロストークをも確
実に防止することが可能である。"Effects of the Invention" According to the shielded flexible circuit board according to the present invention, since the above configuration is adopted, the second shield electrode layer and the third shield electrode layer Since it has a so-called coaxial cable-like structure in which each circuit conductor is in contact with each circuit conductor only through a thin insulating layer, and the shield electrode layers are in close contact with each other except where those wiring patterns exist, there is no space between adjacent wiring patterns. Since the shield layer is reliably present, it is possible not only to provide noise shielding in the vertical direction of each wiring pattern, but also to reliably prevent crosstalk between each wiring pattern.
斯かる同軸ケーブル状のシールド型可撓性回路基板は、
また本発明のエキシマレーザによるアブレーション処理
工程の採用により簡便に製作できるという利点がある。Such a coaxial cable-like shielded flexible circuit board is
Further, by employing the ablation treatment process using an excimer laser according to the present invention, there is an advantage that it can be manufactured easily.
第１図は本発明の一実施例に従ったシールド型可撓性回
路基板の要部を概念的に示す断面構成図であり、
第２図（１）〜（４）は本発明に従ってエキシマレーザ
によるアブレーション処理工程を含む上記の実施例の為
の製造工程図、そして、
第３図は従来例のシールド型可撓性回路基板の概念的要
部断面構成図である。
１０： 配線パターン部
Ｉｌ： 第一のシールド電極層
１２ ： 絶 縁 基 材
ｌ ３ ： 回 路 導 体
ｌ ４ ： 接 着 剤 層
１５： カバーフィルム
１６： 第二のシールド電極層
１７： 第三のシールド電極層
出願人 日本メクトロン株式会社
第２図FIG. 1 is a cross-sectional diagram conceptually showing the main parts of a shielded flexible circuit board according to an embodiment of the present invention, and FIGS. 2 (1) to (4) are excimer laser FIG. 3 is a conceptual cross-sectional configuration diagram of essential parts of a conventional shield type flexible circuit board. 10: Wiring pattern part Il: First shield electrode layer 12: Insulating base material l3: Circuit conductor l4: Adhesive layer 15: Cover film 16: Second shield electrode layer 17: Third Shield electrode layer applicant Nippon Mectron Co., Ltd. Figure 2
Claims (6)
従って該シールド電極層と同一幅に形成した絶縁基材と
、該絶縁基材上に設けられ上記第一のシールド電極層よ
り幅狭の回路導体と、該回路導体を覆う絶縁層と、該絶
縁層の上方に配設された第二のシールド電極層と、及び
上記第一のシールド電極層、絶縁基材並びに絶縁層を覆
い且つ上記第二のシールド電極層と電気的に導通する第
三のシールド電極層とを具備するように構成したことを
特徴とするシールド型可撓性回路基板。(1) An insulating base material formed on the first shield electrode layer according to a required wiring pattern to have the same width as the shield electrode layer, and an insulating base material formed on the insulating base material and having a width narrower than the first shield electrode layer. a circuit conductor, an insulating layer that covers the circuit conductor, a second shield electrode layer disposed above the insulating layer, and a second shield electrode layer that covers the first shield electrode layer, the insulating base material, and the insulating layer, and 1. A shielded flexible circuit board comprising a third shielding electrode layer that is electrically connected to the second shielding electrode layer.
構成した請求項（１）のシールド型可撓性回路基板。(2) The shielded flexible circuit board according to claim 1, wherein the insulating layer is composed of a film-like insulating base material and an adhesive layer.
ールド電極層に用いながら該積層板の他方の導電層に所
要の回路導体を形成し、この回路導体側に絶縁層と第二
のシールド電極層とを形成し、上記第一のシールド電極
層間に形成される開口部に位置する部位の上記両面銅張
積層板の絶縁基材と上記絶縁層とをエキシマレーザによ
るアブレーション処理で除去した後、上記第一のシール
ド電極層、絶縁基材及び絶縁層を覆い且つ上記第二のシ
ールド電極層と電気的に導通するように第三のシールド
電極層を形成する各工程を含むシールド型可撓性回路基
板の製造法。(3) While using one conductive layer of a flexible double-sided copper-clad laminate as the first shield electrode layer, a required circuit conductor is formed on the other conductive layer of the laminate, and an insulating layer is formed on the circuit conductor side. and a second shield electrode layer, and the insulating base material of the double-sided copper-clad laminate and the insulating layer are ablated with an excimer laser at a portion located in the opening formed between the first shield electrode layer. After removal by treatment, each step of forming a third shield electrode layer so as to cover the first shield electrode layer, the insulating base material, and the insulating layer and to be electrically conductive with the second shield electrode layer. A method for manufacturing a shielded flexible circuit board, including:
形成する請求項（３）のシールド型可撓性回路基板の製
造法。(4) The method for manufacturing a shielded flexible circuit board according to claim (3), wherein the insulating layer is formed of a film-like insulating base material and an adhesive layer.
した構造を有する請求項（１）又は（２）のシールド型
可撓性回路基板。(5) The shield type flexible circuit board according to claim (1) or (2), having a structure in which the first shield electrode layer is not included.
処理工程後にエッチング処理で除去する工程を更に含む
ことを特徴とする請求項（３）又は（４）のいずれかに
記載したシールド型可撓性回路基板の製造法。(6) The shield type flexible device according to claim 3 or 4, further comprising a step of removing the first shield electrode layer by etching treatment after the ablation treatment step. Method of manufacturing circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2294189A JPH0691338B2 (en) | 1990-10-31 | 1990-10-31 | Shield type flexible circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2294189A JPH0691338B2 (en) | 1990-10-31 | 1990-10-31 | Shield type flexible circuit board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04167498A true JPH04167498A (en) | 1992-06-15 |
| JPH0691338B2 JPH0691338B2 (en) | 1994-11-14 |
Family
ID=17804470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2294189A Expired - Fee Related JPH0691338B2 (en) | 1990-10-31 | 1990-10-31 | Shield type flexible circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0691338B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003249731A (en) * | 2002-02-25 | 2003-09-05 | National Institute Of Advanced Industrial & Technology | Printed circuit board of coaxial cable structure and method of manufacturing the same |
| CN107696644A (en) * | 2017-09-30 | 2018-02-16 | 广东欧珀移动通信有限公司 | Copper foil component and there is its metal shell component, mobile terminal |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5831428U (en) * | 1981-08-26 | 1983-03-01 | 日本精工株式会社 | track guide bearing |
-
1990
- 1990-10-31 JP JP2294189A patent/JPH0691338B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5831428U (en) * | 1981-08-26 | 1983-03-01 | 日本精工株式会社 | track guide bearing |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003249731A (en) * | 2002-02-25 | 2003-09-05 | National Institute Of Advanced Industrial & Technology | Printed circuit board of coaxial cable structure and method of manufacturing the same |
| CN107696644A (en) * | 2017-09-30 | 2018-02-16 | 广东欧珀移动通信有限公司 | Copper foil component and there is its metal shell component, mobile terminal |
| CN107696644B (en) * | 2017-09-30 | 2020-07-10 | Oppo广东移动通信有限公司 | Copper foil assembly, metal shell assembly with copper foil assembly and mobile terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0691338B2 (en) | 1994-11-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3002539B2 (en) | Circuit board with lateral conductive pattern and shielding area and method of manufacturing the circuit board | |
| JPH08125380A (en) | Shielded flexible wiring-board and manufacturing method thereof | |
| JPH07135376A (en) | Composite printed-circuit board and its manufacture | |
| JPH0423485A (en) | Printed wiring board and manufacture thereof | |
| JPH08125342A (en) | Flexible multilayered wiring board and its manufacture | |
| JPH04151899A (en) | Manufacture of electromagnetic wave shielded printed wiring boards | |
| US5262596A (en) | Printed wiring board shielded from electromagnetic wave | |
| EP0312682B1 (en) | Printed circuit board | |
| JPH0693552B2 (en) | Shield type flexible circuit board and manufacturing method thereof | |
| JPH08242078A (en) | Printed board | |
| JPH05191056A (en) | Printed wiring board | |
| JPH1168313A (en) | Printed wiring board | |
| JPH04167498A (en) | Shield type flexible printed-circuit board and its manufacture | |
| JP2004119604A (en) | Shield version circuit board and method for manufacturing the same | |
| TWI706518B (en) | Wiring board | |
| JPH04139799A (en) | Shield type flexible circuit board and its manufacture | |
| JPH04139783A (en) | Flexible circuit board for ic mounting and its manufacture | |
| JP2003273516A (en) | Successive multilayer wiring board and method for manufacturing the same | |
| JP3573352B2 (en) | Multi-layer wiring TAB tape carrier | |
| JPH05243738A (en) | Flexible rigid printed wiring board | |
| KR100279112B1 (en) | How to Form Electrically Conductive Contacts on Substrate | |
| JPH03104293A (en) | Printed circuit board | |
| JP3010672B2 (en) | Aperture electrode and method of manufacturing the same | |
| JPH09181453A (en) | Multilayer wiring board and its manufacturing method | |
| JPH0774475A (en) | Mesh pattern structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081114 Year of fee payment: 14 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081114 Year of fee payment: 14 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091114 Year of fee payment: 15 |
|
| LAPS | Cancellation because of no payment of annual fees |