CN101893545A - Test method and test apparatus for bonding force of PCB (Printed Circuit Board) embedded metal base - Google Patents
Test method and test apparatus for bonding force of PCB (Printed Circuit Board) embedded metal base Download PDFInfo
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- CN101893545A CN101893545A CN 201010226650 CN201010226650A CN101893545A CN 101893545 A CN101893545 A CN 101893545A CN 201010226650 CN201010226650 CN 201010226650 CN 201010226650 A CN201010226650 A CN 201010226650A CN 101893545 A CN101893545 A CN 101893545A
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Abstract
The invention discloses a method for testing bonding force of a PCB (Printed Circuit Board) embedded metal base, comprising the following steps of: a, preparing a PCB sample, a pressure sensor, a fixture and a universal material test machine; b, installing the pressure sensor; c, arranging the sample; d, starting the universal material test machine and the control software thereof to obtain the test data; and e, obtaining the thrust strength. The invention provides a test method of a three-point bending model to test the bonding force between the embedded metal base and the PCB; by mainly utilizing the load measurement and the displacement recording function of the universal material test machine, the bonding force between the large-size embedded metal base and the PCB is effectively evaluated; thereby, the invention provides a new solution for evaluating and testing the similar boards and the products with the similar structures.
Description
Technical field
The present invention relates to wiring board and make the field, relate in particular to a kind of method of testing and testing apparatus of PCB embedded metal base adhesion.
Background technology
The method of testing of existing P CB adhesion when test PCB surface pads or hole wall combine situation with substrate medium, generally adopts single-point stretch model method of testing to test, and concrete operation method is as follows:
1, the mode of welding by hand earlier is welded on a hard thin copper wire on the hole wall or pad that need test, must repeat melting welding 4-5 time, and is intact to guarantee its adhesion; The aperture must be the unsupported hole of 0.6mm-1.0mm, and pad is to paste greater than the isolated surface of 0.5mm*0.5mm;
2, will handle intact sample then and put into universal testing machine, select the 1000N sensor, and be fixed with pulling the test unit clamp, set test parameters, draw speed is 50.8mm/min, stroke limit 50mm, the spacing 900N of load, sampling interval 50ms, preload 0.9N, begin tensile test then, related datas such as the load of the automatic record of testing machine meeting breakaway poing and displacement;
3, calculate pull-off strength.
D1 is the aperture; D2 is the orifice ring diameter; L is a pulling force;
S is a bonding pad area, and F is a pulling force, and then the pad pull-off strength is=F/S.
Said method adopts welding manner that copper cash is welded on the test point, allows it form an integral body, transfers loads to hole wall or pad by the stretching copper cash then, makes it that fracture failure take place; It can effectively weld for the pad and the hole of small size, but for having the larger area embedded metal base, then can't effectively weld suitable copper cash, so can't adopt the single-point stretch model to carry out this class testing.
Summary of the invention
The technical matters that the present invention solves provides a kind of method of testing and the testing apparatus that can test the adhesion of large-area embedded metal base and pcb board.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of method of testing of PCB embedded metal base adhesion is provided, may further comprise the steps:
A, the PCB sample that is ready to contain embedded metal base, pressure transducer, three-point bending test fixture and universal testing machine, described three-point bending test fixture comprise two strong points and a distance rod;
B, setting pressure sensor, pressure transducer is arranged on the end of the distance rod of three-point bending test fixture, described pressure transducer is connected with the pressure acquisition end of universal testing machine, and described distance rod is fixedlyed connected with the load output terminal of universal testing machine;
C, placement sample, the PCB sample that will contain embedded metal base is fixed on the three-point bending test fixture, adjust PCB sample position all around, make embedded metal base just be positioned in the middle of two strong points of three-point bending test fixture, and guarantee that the vertical projection of three-point bending test fixture distance rod is positioned on the embedded metal base diagonal line intersection point; Adjust the upper-lower position of three-point bending test fixture distance rod, make the three-point bending test fixture distance rod near but do not contact the embedded metal base of PCB sample;
D, the load and the displacement data of universal testing machine made zero, described universal testing machine is by the embedded metal base imposed load of distance rod to described PCB sample, when distance rod contacts with embedded metal base, pressure transducer is used for gathering the suffered pressure data of embedded metal base, the pressure acquisition end of universal testing machine is collected the pressure data that pressure transducer sends, and the Control Software of described universal testing machine is noted the displacement data of this pressure data and distance rod;
E, draw thrust strength, can analyze the adhesion that obtains PCB embedded metal base and this PCB according to thrust strength and displacement data in conjunction with the pressure data of described Control Software record and the area of embedded metal base.
Wherein, before steps d, also comprise: the step of universal testing machine being carried out electric calibration.
Wherein, described pressure transducer is the 1000N pressure transducer.
Wherein, the distance rod of described three-point bending test fixture is last anchor clamps, and the strong point is a lower clamp.
Wherein, among the described step e, thrust is F, PCB and embedded metal base bonded area S, thrust strength=F/S.
For solving the problems of the technologies described above, another technical solution used in the present invention is: the testing apparatus that a kind of PCB embedded metal base adhesion is provided, comprise pressure transducer, three-point bending test fixture and universal testing machine, described three-point bending test fixture comprises two strong points and a distance rod, described distance rod is fixedlyed connected with the load output terminal of universal testing machine, two strong points of described three-point bending test fixture are fixed the described embedded metal base PCB that contains, and the distance rod of described three-point bending test fixture is to the embedded metal base imposed load of described PCB sample; Described pressure transducer places the distance rod end of three-point bending test fixture, is used to gather the suffered pressure data of embedded metal base of the PCB sample that contains embedded metal base; Described universal material testing machine is in exporting quantitative load and collecting the data that pressure transducer sends; The Control Software of described universal testing machine is noted the displacement data of this pressure data and distance rod.
Wherein, described pressure transducer is the 1000N pressure transducer.
Wherein, the distance rod of described three-point bending test fixture is last anchor clamps, and the strong point is a lower clamp.
The invention has the beneficial effects as follows: the single-point stretch model method of testing that is different from prior art is tested and can't be suitable for the situation with larger area embedded metal base, the present invention proposes a kind of three-point bending model measurement method the adhesion of embedded metal base and PCB is tested, wherein mainly utilize the load measurement and the displacement record function of universal testing machine, effective adhesion between large-scale embedded metal base of assessment and the PCB is for the product of estimating and test such plate and have an analog structure provides a kind of new solution.
Description of drawings
Fig. 1 is the testing apparatus synoptic diagram of PCB embedded metal base adhesion of the present invention;
Fig. 2 is the process flow diagram of method of testing one embodiment of PCB embedded metal base adhesion of the present invention;
Fig. 3 is the process flow diagram of another embodiment of method of testing of PCB embedded metal base adhesion of the present invention;
Fig. 4 is the method for testing synoptic diagram of PCB embedded metal base adhesion of the present invention.
Embodiment
By describing technology contents of the present invention, structural attitude in detail, realized purpose and effect, give explanation below in conjunction with embodiment and conjunction with figs. are detailed.
Being explained as follows of relational language is described:
1, PCB: printed circuit board, mainly form by copper wire figure and resin medium.
2, pad: a kind of line pattern on the circuit board is mainly used to welding electronic component etc.
3, embedded metal base: a kind of new product that in PCB, embeds Metal Substrate (be mainly copper billet, play thermolysis).
4, single-point stretches: refer to sample one end is fixed, imposed load and tensile sample on the other end allow it that distortion of extending takes place.
5, three-point bending: the materials physics noun, refer to support samples (generally below sample, playing a supportive role) with two points, go up imposed load at thirdly (generally above sample, and in the middle of two strong points), allow sample occur bending and deformation.
The testing apparatus embodiment of PCB embedded metal base adhesion of the present invention comprises pressure transducer, three-point bending test fixture and universal testing machine, described three-point bending test fixture comprises two strong points and a distance rod, described distance rod is fixedlyed connected with the load output terminal of universal testing machine, two strong points of described three-point bending test fixture are fixed the described embedded metal base PCB that contains, and the distance rod of described three-point bending test fixture is to the embedded metal base imposed load of described PCB sample; Described pressure transducer places the distance rod end of three-point bending test fixture, is used to gather the suffered pressure data of embedded metal base of the PCB sample that contains embedded metal base; Described universal material testing machine is in exporting quantitative load and collecting the data that pressure transducer sends; The Control Software of described universal testing machine is noted the displacement data of this pressure data and distance rod.
See also Fig. 1, there is shown universal testing machine 1, pressure transducer 2, distance rod 3, embedded metal base 4, contain embedded metal base PCB 5, the strong point 6, testing table 7 and data acquisition display device 8.Testing table 7 is provided with universal testing machine 1 and data acquisition display device 8,3 test fixtures are installed on the middle part of universal testing machine 1,4 effects of 3 pairs of embedded metal bases of its distance rod, and two strong point 6 fixing described embedded metal base PCB5 that contain, pressure transducer 2 places distance rod 3 ends of three-point bending test fixture, is used to gather the suffered pressure data of embedded metal base 4 that contains embedded metal base PCB5.
In the testing apparatus of above-mentioned PCB embedded metal base adhesion, pressure transducer 2 is the 1000N pressure transducer.
In the testing apparatus of above-mentioned PCB embedded metal base adhesion, the distance rod 3 of three-point bending test fixture is last anchor clamps, and the strong point 6 is a lower clamp.
See also Fig. 2, the method for testing of PCB embedded metal base adhesion disclosed by the invention may further comprise the steps:
A, the PCB sample that is ready to contain embedded metal base, pressure transducer, three-point bending test fixture and universal testing machine, described three-point bending test fixture comprise two strong points and a distance rod;
B, setting pressure sensor, pressure transducer is arranged on the end of the distance rod of three-point bending test fixture, described pressure transducer is connected with the pressure acquisition end of universal testing machine, and described distance rod is fixedlyed connected with the load output terminal of universal testing machine;
C, placement sample, the PCB sample that will contain embedded metal base is fixed on the three-point bending test fixture, adjust PCB sample position all around, make embedded metal base just be positioned in the middle of two strong points of three-point bending test fixture, and guarantee that the vertical projection of three-point bending test fixture distance rod is positioned on the embedded metal base diagonal line intersection point; Adjust the upper-lower position of three-point bending test fixture distance rod, make the three-point bending test fixture distance rod near but do not contact the embedded metal base of PCB sample;
D, the load and the displacement data of universal testing machine made zero, described universal testing machine is by the embedded metal base imposed load of distance rod to described PCB sample, when distance rod contacts with embedded metal base, pressure transducer is used for gathering the suffered pressure data of embedded metal base, the pressure acquisition end of universal testing machine is collected the pressure data that pressure transducer sends, and the Control Software of described universal testing machine is noted the displacement data of this pressure data and distance rod;
E, draw thrust strength, can analyze the adhesion that obtains PCB embedded metal base and this PCB according to thrust strength and displacement data in conjunction with the pressure data of described Control Software record and the area of embedded metal base.
Referring to Fig. 3, in another embodiment of the present invention, before above-mentioned steps d, also comprise: the step of universal testing machine being carried out electric calibration.When using universal testing machine, should carry out electric calibration at every turn, can operate as normal also can access correct experimental data to guarantee universal testing machine to universal testing machine.
In an embodiment, pressure transducer can be the pressure transducer of plurality of specifications, and preferably pressure transducer is the 1000N pressure transducer.
Consult Fig. 4, in the synoptic diagram of three-point bending test fixture to the pcb board effect, the A point is the distance rod application point, last anchor clamps as the three-point bending test fixture, the B point is first strong point, and the C point is second strong point, and this B point and C point are altogether as the lower clamp of this three-point bending test fixture.Under the effect of the distance rod and the strong point, pcb board can be by three-point bending model crooked test, to draw thrust strength according to thrust and PCB and embedded metal base bonded area S.But in the use of reality, the three-point bending test fixture also can be provided with like this: the last anchor clamps of three-point bending test fixture are the strong point, and lower clamp is a distance rod.
In step e, can carry out like this analysis of experimental data: thrust is F, PCB and embedded metal base bonded area S, then thrust strength=F/S.And the computing method of PCB and embedded metal base bonded area S are: 2* Metal Substrate thickness D* (Metal Substrate length L+Metal Substrate width W).
In above-mentioned testing procedure d, the preload of universal testing machine is 0.9KN, and spacing load is 0.9KN, stroke limit: 50mm, sampling interval: 50ms, pushing speed V1:50.8mm/min.
The present invention surveys method of testing can obtain more accurate thrust magnitude, also can directly obtain thrust strength by correlation parameter is set, specific as follows:
Represent thrust with F, S represents PCB and embedded metal base bonded area, then thrust strength=F/S.
Generally, Metal Substrate mostly is square structure, and its S=2* Metal Substrate thickness D* (Metal Substrate length L+Metal Substrate width W) is a circular configuration as if Metal Substrate, then S=Metal Substrate thickness D* Metal Substrate girth C.
The present invention passes through reverse thinking, substitute the single-point stretch model with the three-point bending model, the extension test that the change stroke makes progress is the downward pushing test of stroke, utilize the load measurement and the displacement record function of universal testing machine, solved the problem that adhesion can't effectively be assessed between large-scale embedded metal base and the PCB, for such plate and product with analog structure provide a cover complete and effective solution.
Anchor clamps among the present invention can replace with other supporters and the tension tester with identical or similar functions with universal testing machine, only need to guarantee that equivalent supporting role is arranged and can accurately measure its pulling force size to get final product.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes instructions of the present invention and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (8)
1. the method for testing of a PCB embedded metal base adhesion is characterized in that: may further comprise the steps:
A, the PCB sample that is ready to contain embedded metal base, pressure transducer, three-point bending test fixture and universal testing machine, described three-point bending test fixture comprise two strong points and a distance rod;
B, setting pressure sensor, pressure transducer is arranged on the end of the distance rod of three-point bending test fixture, described pressure transducer is connected with the pressure acquisition end of universal testing machine, and described distance rod is fixedlyed connected with the load output terminal of universal testing machine;
C, placement sample, the PCB sample that will contain embedded metal base is fixed on the three-point bending test fixture, adjust PCB sample position all around, make embedded metal base just be positioned in the middle of two strong points of three-point bending test fixture, and guarantee that the vertical projection of three-point bending test fixture distance rod is positioned on the embedded metal base diagonal line intersection point; Adjust the upper-lower position of three-point bending test fixture distance rod, make the three-point bending test fixture distance rod near but do not contact the embedded metal base of PCB sample;
D, the load and the displacement data of universal testing machine made zero, described universal testing machine is by the embedded metal base imposed load of distance rod to described PCB sample, when distance rod contacts with embedded metal base, pressure transducer is used for gathering the suffered pressure data of embedded metal base, the pressure acquisition end of universal testing machine is collected the pressure data that pressure transducer sends, and described universal testing machine is noted the displacement data of this pressure data and distance rod;
E, draw thrust strength, obtain the adhesion of PCB embedded metal base and this PCB according to thrust strength and displacement data analysis in conjunction with the pressure data of described Control Software record and the area of embedded metal base.
2. the method for testing of PCB embedded metal base adhesion according to claim 1 is characterized in that: before steps d, also comprise: the step of universal testing machine being carried out electric calibration.
3. the method for testing of PCB embedded metal base adhesion according to claim 1 is characterized in that: described pressure transducer is the 1000N pressure transducer.
4. the method for testing of PCB embedded metal base adhesion according to claim 1 is characterized in that: the distance rod of described three-point bending test fixture is last anchor clamps, and the strong point is a lower clamp.
5. the method for testing of PCB embedded metal base adhesion according to claim 1, it is characterized in that: in above-mentioned testing procedure d, the preload of universal testing machine is set at 0.9KN, spacing load is set at 0.9KN, stroke limit is set at 50mm, sampling interval is set at 50ms, and pushing speed V1 is set at 50.8mm/min.
6. the testing apparatus of a PCB embedded metal base adhesion, it is characterized in that, comprise pressure transducer, three-point bending test fixture and universal testing machine, described three-point bending test fixture comprises two strong points and a distance rod, described distance rod is fixedlyed connected with the load output terminal of universal testing machine, two strong points of described three-point bending test fixture are used for fixing the described embedded metal base PCB that contains, and the distance rod of described three-point bending test fixture is to the embedded metal base imposed load of described PCB sample; Described pressure transducer places the distance rod end of three-point bending test fixture, is used to gather the suffered pressure data of embedded metal base of the PCB sample that contains embedded metal base; Described universal material testing machine is in exporting quantitative load and collecting the data that pressure transducer sends; Described universal testing machine is noted the displacement data of this pressure data and distance rod.
7. the testing apparatus of PCB embedded metal base adhesion as claimed in claim 6 is characterized in that, described pressure transducer is the 1000N pressure transducer.
8. the testing apparatus of PCB embedded metal base adhesion as claimed in claim 6 is characterized in that, the distance rod of described three-point bending test fixture is last anchor clamps, and the strong point is a lower clamp.
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| CN102207447A (en) * | 2011-02-16 | 2011-10-05 | 立邦涂料（中国）有限公司 | Method and device for testing painting construction performance |
| CN103091247A (en) * | 2013-01-15 | 2013-05-08 | 广东生益科技股份有限公司 | Method and equipment for testing binding force of pad and base material |
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| CN103196828A (en) * | 2013-04-17 | 2013-07-10 | 北京工业大学 | Testing method for measuring interfacial strength of copper filling TSV |
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| KR20190044645A (en) * | 2016-08-26 | 2019-04-30 | 광저우 패스트프린트 서킷 테크 컴퍼니 리미티드 | Circuit adhesion test board and test method of integrated circuit products |
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| CN114813356A (en) * | 2022-07-01 | 2022-07-29 | 江铃汽车股份有限公司 | Method for detecting welding quality of packaged chip welding leg |
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