CN111707608A - Test method for detecting interlayer bonding strength of insulating paperboard - Google Patents
Test method for detecting interlayer bonding strength of insulating paperboard Download PDFInfo
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- CN111707608A CN111707608A CN202010448446.6A CN202010448446A CN111707608A CN 111707608 A CN111707608 A CN 111707608A CN 202010448446 A CN202010448446 A CN 202010448446A CN 111707608 A CN111707608 A CN 111707608A
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- test
- bonding strength
- interlayer bonding
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
- G01N3/04—Chucks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/20—Investigating strength properties of solid materials by application of mechanical stress by applying steady bending forces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0014—Type of force applied
- G01N2203/0023—Bending
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0058—Kind of property studied
- G01N2203/006—Crack, flaws, fracture or rupture
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/06—Indicating or recording means; Sensing means
- G01N2203/067—Parameter measured for estimating the property
- G01N2203/0676—Force, weight, load, energy, speed or acceleration
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- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The invention provides a test method for detecting interlayer bonding strength of an insulating paperboard, and relates to the technical field of insulating paperboard detection. The test method for detecting the interlayer bonding strength of the insulating paperboard comprises the following specific steps: s1, connecting the designed test tool to the lower end of the universal material testing machine, connecting the test fixture to the upper end of the universal material testing machine, and fixing the test tool and the test fixture; s2, adjusting software connected with the universal material testing machine, setting the descending speed of the test fixture, setting the real-time force value to be less than the maximum value 70, and reading the real-time force value data of the test fixture at the PC end. The invention changes the former method of visually fluffing by hand feeling of old hand tearing, and thoroughly avoids the hidden trouble that the quality of the interlayer bonding product of the insulating paper boards is relatively uncontrollable; the invention uses the force value data to quantify the interlayer bonding strength of the insulating paperboard, forms a quantitative judgment standard in the production process and improves the delivery quality of the insulating paperboard.
Description
Technical Field
The invention relates to the technical field of insulating paperboard detection, in particular to a test method for detecting interlayer bonding strength of an insulating paperboard.
Background
The main specification of the insulating paperboard is 1.0mm-10.0mm, wherein the interlayer bonding strength of the high-thickness (3.0mm-10.0mm) paperboard is an extremely important index which is relatively concerned by paperboard manufacturers and transformer manufacturers, the smoothness of subsequent machining, rollers and other working procedures can be directly influenced by the quality of the interlayer bonding strength of the insulating paperboard, but the quality of the interlayer bonding strength of the high-thickness insulating paperboard in the existing insulating paperboard industry is judged by visually observing the fluffing and layer breaking conditions among paperboard layers after being torn by hands; therefore, the method for judging the interlayer bonding strength by adopting a quantitative method is crucial to paperboard manufacturers, and the current situation in the industry is as follows:
1. the method described in IEC is tested in the industry at present, but data results cannot be obtained, and the method is simply described as no actual operability; at present, a method of observing after hand tearing is adopted, and the interlayer bonding quality of the paperboard can be judged only by the hand feeling in the hand tearing process and the experience of visual fluffing condition.
2. An authoritative detection mechanism in the industry has been actively searching for a method capable of quantifying interlayer bonding for many years, and a force value type data is used for judging the interlayer bonding strength of the high-thickness insulating paperboard, but the authoritative detection mechanism has not been broken through in the insulating paperboard industry so far.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects in the prior art, the invention provides a test method for detecting the interlayer bonding strength of an insulating paperboard, and the defects in the prior art are overcome.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: a test method for detecting interlayer bonding strength of insulating paper boards comprises the following specific steps:
s1, connecting the designed test tool to the lower end of the universal material testing machine, connecting the test fixture to the upper end of the universal material testing machine, and fixing the test tool and the test fixture;
s2, adjusting software connected with the universal material testing machine, setting the descending speed of the test fixture, setting the real-time force value to be less than the maximum value 70, and reading the real-time force value data of the test fixture at the PC end;
s3, placing a sample to be tested into a testing hole on a testing tool, exposing the end part of the sample to be tested for a fixed distance, additionally arranging a metal base plate between the sample to be tested and a fastening bolt, keeping the position of the metal base plate flush with the edge of the testing tool, and tightening the fastening bolt to clamp the sample to be tested;
s4, starting the electronic universal material testing machine to descend, resetting the force value after lightly contacting the sample to be tested, starting the testing program, descending the testing clamp at a certain speed until the lateral force of the sample to be tested is increased to a certain value, the PC end real-time force value has a yield point, and the end face of the sample to be tested has a cracking phenomenon;
s5, taking the highest force value obtained by the PC end in the step 4 as a final force value, wherein the calculation formula is as follows:
wherein p is interlayer bonding strength (Mpa);
f is the yield point force value (N) of the sample to be measured;
c1end exposure dimension A (mm);
c2end exposure dimension B (mm);
six groups of data are recorded, and the experimental result takes an intermediate value.
Preferably, the distance from the edge of the test tool to the central line of the test fixture is 11.0 mm.
Preferably, the fixed distance of the end of the sample to be measured exposed in the step 3 is 11.0 mm.
Preferably, the width of the sample to be tested in the step 3 is 28mm +/-2 mm, and the preferred width dimension is 28 mm.
Preferably, the test hole size on the test tool is 69mm 30mm 15 mm.
Preferably, the speed of the test fixture in descending at a certain speed is 5 mm/min.
(III) advantageous effects
The invention provides a test method for detecting interlayer bonding strength of an insulating paperboard. The method has the following beneficial effects:
the invention changes the former method of visually fluffing by hand feeling of old hand tearing, and thoroughly avoids the hidden trouble that the quality of the interlayer bonding product of the insulating paper boards is relatively uncontrollable; the invention uses the force value data to quantify the interlayer bonding strength of the insulating paperboard, forms a quantitative judgment standard in the production process and improves the delivery quality of the insulating paperboard.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic structural diagram of the test fixture of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example (b):
as shown in fig. 1-2, an embodiment of the present invention provides a test method for detecting interlayer bonding strength of an insulating paperboard, including the following specific steps:
s1, connecting the designed test tool 2 to the lower end of the universal material testing machine 1, connecting the test fixture 3 to the upper end of the universal material testing machine 1, and fixing the test tool 2 and the test fixture 3;
s2, adjusting software connected with the universal material testing machine 1, setting the descending speed of the test fixture 3 to be 5mm/min, and setting the test end point to stop running, wherein the PC end can read real-time force value data of the test fixture 2;
s3, placing a 3.0mm sample 4 to be tested with the size of 28mm x 70mm into a test hole 5 on a test tool 2, exposing the end part of the sample 4 to be tested (an insulating paperboard) for a fixed distance, wherein the fixed distance is 11.0mm, additionally installing a metal base plate between the sample 4 to be tested and a fastening bolt 6 (wherein, the fastening bolt 6 is installed at the top of the test tool 2 and corresponds to the position of the test hole 5), keeping the position of the metal base plate flush with the edge (position c in figure 1) of the test tool 2, and screwing the fastening bolt 6 to clamp the sample 4 to be tested;
wherein the distance from the edge c of the test tool 2 to the central line of the test fixture 3 is 11.0 mm;
s4, starting the electronic universal material testing machine 1 to descend, resetting the force value after lightly contacting the sample 4 to be tested, starting the testing program, and descending the testing clamp 3 at a certain speed until the PC end real-time force value has a yield point and the end face of the sample 4 to be tested has a cracking phenomenon after the lateral force of the sample 4 to be tested is increased to a certain value;
s5, taking the highest force value obtained by the PC end in the step 4 as a final force value, wherein the calculation formula is as follows:
wherein p is interlayer bonding strength (Mpa);
f is the yield point force value (N) of the sample to be measured;
c1end exposure dimension A (mm);
c2end exposure dimension B (mm);
six groups of data are recorded, and the experimental result takes an intermediate value.
Assuming that the yield point value of the sample 4 to be tested is 985.42N, the end exposure dimension A is 26.71mm, and the end exposure dimension B is 11mm, the interlayer bonding strength (Mpa) is calculated as follows:
the interlayer bonding strength (Mpa) is 985.42/(26.71 × 11) is 335.31 Mpa.
In the present invention, the results of the test are shown in table 1 below:
TABLE 1
The invention changes the former method of visually fluffing by hand feeling of old hand tearing, and thoroughly avoids the hidden trouble that the quality of the interlayer bonding product of the insulating paper boards is relatively uncontrollable; the invention uses the force value data to quantify the interlayer bonding strength of the insulating paperboard, forms a quantitative judgment standard in the production process and improves the delivery quality of the insulating paperboard.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A test method for detecting interlayer bonding strength of an insulating paperboard is characterized by comprising the following steps: the test method comprises the following specific steps:
s1, connecting the designed test tool to the lower end of the universal material testing machine, connecting the test fixture to the upper end of the universal material testing machine, and fixing the test tool and the test fixture;
s2, adjusting software connected with the universal material testing machine, setting the descending speed of the test fixture, setting the real-time force value to be less than the maximum value 70, and reading the real-time force value data of the test fixture at the PC end;
s3, placing a sample to be tested into a testing hole on a testing tool, exposing the end part of the sample to be tested for a fixed distance, additionally arranging a metal base plate between the sample to be tested and a fastening bolt, keeping the position of the metal base plate flush with the edge of the testing tool, and tightening the fastening bolt to clamp the sample to be tested;
s4, starting the electronic universal material testing machine to descend, resetting the force value after lightly contacting the sample to be tested, starting the testing program, descending the testing clamp at a certain speed until the lateral force of the sample to be tested is increased to a certain value, the PC end real-time force value has a yield point, and the end face of the sample to be tested has a cracking phenomenon;
s5, taking the highest force value obtained by the PC end in the step 4 as a final force value, wherein the calculation formula is as follows:
wherein p is interlayer bonding strength (Mpa);
f is the yield point force value (N) of the sample to be measured;
c1end exposure dimension A (mm);
c2end exposure dimension B (mm);
six groups of data are recorded, and the experimental result takes an intermediate value.
2. The test method for detecting the interlayer bonding strength of the insulating paperboard according to claim 1, characterized in that: the distance from the edge of the test tool to the central line of the test fixture is 11.0 mm.
3. The test method for detecting the interlayer bonding strength of the insulating paperboard according to claim 1, characterized in that: and in the step 3, the exposed fixed distance of the end part of the sample to be detected is 11.0 mm.
4. The test method for detecting the interlayer bonding strength of the insulating paperboard according to claim 1, characterized in that: the width of the sample to be detected in the step 3 is 28mm +/-2 mm, and the preferred width dimension is 28 mm.
5. The test method for detecting the interlayer bonding strength of the insulating paperboard according to claim 1, characterized in that: the test hole size on the experimental tooling was 69mm 30mm 15 mm.
6. The test method for detecting the interlayer bonding strength of the insulating paperboard according to claim 1, characterized in that: the speed of the test fixture in descending at a certain speed is 5 mm/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010448446.6A CN111707608A (en) | 2020-05-25 | 2020-05-25 | Test method for detecting interlayer bonding strength of insulating paperboard |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010448446.6A CN111707608A (en) | 2020-05-25 | 2020-05-25 | Test method for detecting interlayer bonding strength of insulating paperboard |
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| Publication Number | Publication Date |
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| CN111707608A true CN111707608A (en) | 2020-09-25 |
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| CN202010448446.6A Pending CN111707608A (en) | 2020-05-25 | 2020-05-25 | Test method for detecting interlayer bonding strength of insulating paperboard |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6386027B1 (en) * | 1998-02-25 | 2002-05-14 | Ab Lorentzen & Wettre | Method and device for measuring z-directional tensile strength of paper or board |
| CN101819135A (en) * | 2010-05-13 | 2010-09-01 | 长沙理工大学 | Method for measuring bond strength between high-intensity glass fiber rib and concrete |
| CN101893545A (en) * | 2010-07-14 | 2010-11-24 | 深南电路有限公司 | Test method and test apparatus for bonding force of PCB (Printed Circuit Board) embedded metal base |
| CN103604745A (en) * | 2013-11-25 | 2014-02-26 | 常州市产品质量监督检验所 | Device and method for testing internal bonding strength of wood floor |
| CN208076292U (en) * | 2018-03-29 | 2018-11-09 | 辽宁德尔新材料有限公司 | A kind of beaver board cupping machine |
| CN209400398U (en) * | 2019-01-24 | 2019-09-17 | 李健 | A kind of corrugated paperboard adhesion intensity test bracket |
| CN209589670U (en) * | 2019-01-17 | 2019-11-05 | 潍坊汇胜绝缘技术有限公司 | A kind of fixture for testing insulating board interfacial bonding strength |
| CN110940630A (en) * | 2018-09-21 | 2020-03-31 | 扬州华青电子有限公司 | Bonding strength and bending strength testing device of flexible circuit board |
-
2020
- 2020-05-25 CN CN202010448446.6A patent/CN111707608A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6386027B1 (en) * | 1998-02-25 | 2002-05-14 | Ab Lorentzen & Wettre | Method and device for measuring z-directional tensile strength of paper or board |
| CN101819135A (en) * | 2010-05-13 | 2010-09-01 | 长沙理工大学 | Method for measuring bond strength between high-intensity glass fiber rib and concrete |
| CN101893545A (en) * | 2010-07-14 | 2010-11-24 | 深南电路有限公司 | Test method and test apparatus for bonding force of PCB (Printed Circuit Board) embedded metal base |
| CN103604745A (en) * | 2013-11-25 | 2014-02-26 | 常州市产品质量监督检验所 | Device and method for testing internal bonding strength of wood floor |
| CN208076292U (en) * | 2018-03-29 | 2018-11-09 | 辽宁德尔新材料有限公司 | A kind of beaver board cupping machine |
| CN110940630A (en) * | 2018-09-21 | 2020-03-31 | 扬州华青电子有限公司 | Bonding strength and bending strength testing device of flexible circuit board |
| CN209589670U (en) * | 2019-01-17 | 2019-11-05 | 潍坊汇胜绝缘技术有限公司 | A kind of fixture for testing insulating board interfacial bonding strength |
| CN209400398U (en) * | 2019-01-24 | 2019-09-17 | 李健 | A kind of corrugated paperboard adhesion intensity test bracket |
Non-Patent Citations (1)
| Title |
|---|
| 中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会: "《中华人民共和国国家标准》", 3 September 2014 * |
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Application publication date: 20200925 |
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