CN110842385A - Test apparatus and control method of test apparatus - Google Patents
Test apparatus and control method of test apparatus Download PDFInfo
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- CN110842385A CN110842385A CN201911112143.0A CN201911112143A CN110842385A CN 110842385 A CN110842385 A CN 110842385A CN 201911112143 A CN201911112143 A CN 201911112143A CN 110842385 A CN110842385 A CN 110842385A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a test device and a control method of the test device, wherein the test device comprises a solder assembly, a clamp, a welding test assembly, a heating assembly and a feeding assembly; the solder assembly is used for providing solder; the clamp is used for fixing the sample piece; the welding test assembly comprises a welding pin and a tension sensor, and the tension sensor is connected with the welding pin; the heating assembly is connected with the welding pin during welding; the feeding assembly is connected with the welding test assembly and used for driving the welding needle to move between the welding flux assembly and the clamp. The strength of the bonding pad is tested through the testing equipment, the strength of the bonding pad is ensured to meet the design requirement, errors generated by manual testing can be reduced, and the testing result is more accurate. Welding pin and pad welding through test equipment can promote the welding strength between welding pin and the pad, ensures that the welding pin can drive the pad and break away from the base plate, promotes experimental success rate.
Description
Technical Field
The invention relates to the technical field of printed circuit board testing, in particular to testing equipment and a control method of the testing equipment.
Background
At present, the halogen-free substrate used for the printed circuit board is the development direction of the microelectronic manufacturing industry, and the halogen-free substrate causes the toughness of the printed circuit board to be reduced and the phenomenon of crater cracking of a pad is easy to generate. In order to secure the strength of the pad of the printed circuit board, a strength test of the pad is required.
In the related art, the method for testing the strength of the pad is mainly manual, but the manual test results in increased test errors and affects the test results.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art or the related art.
To this end, a first aspect of the invention proposes a test device.
A second aspect of the present invention provides a control method of a test apparatus.
In view of this, a first aspect of the present invention provides a test apparatus including a solder assembly, a jig, a soldering test assembly, a heating assembly, and a feeding assembly; the solder assembly is used for providing solder; the clamp is used for fixing the sample piece; the welding test assembly comprises a welding pin and a tension sensor, and the tension sensor is connected with the welding pin; the heating assembly is connected with the welding pin during welding; the feeding assembly is connected with the welding test assembly and used for driving the welding needle to move between the welding flux assembly and the clamp.
The testing equipment provided by the invention is characterized in that a sample to be tested is arranged on a clamp, a welding needle is controlled to slide to a welding flux assembly to dip welding flux, the welding needle slides to the clamp after dipping the welding flux and is aligned with the position of a welding pad on the sample, the welding needle moves towards the welding pad and is heated after contacting with the welding pad to weld the welding needle and the welding pad, after welding is finished, the welding needle slides upwards to drive the welding pad to be separated from a substrate of the sample, and in the process that the welding pad is separated from the substrate, the tensile force required by the welding pad to be separated from the substrate is tested through a tensile force sensor, so that whether the strength of the welding pad is qualified is judged. The strength of the bonding pad is tested through the testing equipment, the strength of the bonding pad is ensured to meet the design requirement, errors generated by manual testing can be reduced, and the testing result is more accurate. Welding pin and pad welding through test equipment can promote the welding strength between welding pin and the pad, ensures that the welding pin can drive the pad and break away from the base plate, promotes experimental success rate.
The clamp is a vice or a pressure plate.
The sample is a printed circuit board.
The solder is solder paste.
The welding pin is made of metal materials, and therefore heat conduction is facilitated.
The testing apparatus further comprises a microscope, which is arranged towards the fixture.
In addition, the test equipment in the above technical solution provided by the present invention may also have the following additional technical features:
in one technical scheme of the invention, the testing equipment further comprises a cooling assembly, and the cooling assembly is arranged on the side of the welding pin and used for cooling the welding flux on the welding pin.
In the technical scheme, the test equipment is provided with the cooling assembly, so that the cooling speed of the solder is accelerated in the process of welding the welding pin and the welding pad, the test speed is increased, and the welding strength between the welding pin and the welding pad is increased.
In one aspect of the invention, the cooling assembly includes a hose having one end connected to the air supply and the other end facing the welding pin.
In the technical scheme, the cooling assembly is provided with a hose, the hose obtains high-pressure gas from a gas source and then blows a welding spot, and therefore cooling of the welding flux is achieved. The cooling mode is simple and convenient and is convenient to control.
In one technical scheme of the invention, the welding flux assembly comprises a support, a needle tube and a piston; the needle tube is arranged on the support and used for containing welding flux, and a discharge hole is formed in one end of the needle tube; the piston is inserted into the needle tube from the other end of the needle tube and is used for extruding the solder in the needle tube out of the discharge hole.
In the technical scheme, the solder is placed in the needle tube, and the piston can push the solder in the needle tube to be extruded out of the discharge hole, so that the solder is conveniently taken by the welding needle.
In one aspect of the present invention, a weld testing assembly includes a support column and a thermal insulation member; the strut is connected with the feeding assembly; the heat insulation component is connected with the lower end of the support and connected with the tension sensor, and the welding needle is inserted in the heat insulation component.
In this technical scheme, heat-insulating part separates welding pin and pillar, avoids the heat to transmit to force sensor by the welding pin, avoids heat influence force sensor's measuring accuracy to can make the heat concentrate on the welding pin, promote heating element's efficiency.
The heat insulation component is a heat insulation pipe, the heat insulation pipe is sleeved on the support, the welding needle is inserted on the support, and the tension sensor is connected with the outer wall of the heat insulation pipe.
In one technical scheme of the invention, the test equipment further comprises a base and a bracket; the base is provided with a working platform, and the solder assembly and the clamp are arranged on the working platform; the support is connected with the base, and the feeding assembly is connected with the support.
In this technical scheme, through setting up base and support, realize the support to each subassembly to in fixing a position each part, be convenient for control to welding pin motion position.
In one technical scheme of the invention, the feeding assembly comprises a transverse slide rail and a transverse slide block; the transverse sliding rail is connected with the bracket; the transverse sliding block is sleeved on the transverse sliding rail and can slide along the transverse sliding rail.
In the technical scheme, the transverse sliding rail is matched with the transverse sliding block, so that the welding pins can transversely slide, and the printed circuit board is convenient to test.
In one technical scheme of the invention, the feeding assembly further comprises a longitudinal slide rail and a longitudinal slide block; the longitudinal slide rail is connected with the transverse slide block; the longitudinal sliding block is sleeved on the longitudinal sliding rail, is connected with the welding test assembly and can slide along the longitudinal sliding rail.
In the technical scheme, the longitudinal slide rail is matched with the longitudinal slide block, so that the welding needle can longitudinally slide, the welding needle can conveniently move towards the welding pad, and the welding pad is driven to be separated from the substrate.
In one technical scheme of the invention, the testing equipment further comprises a driving assembly, and the driving assembly comprises at least two driving parts which respectively drive the transverse slide block and the longitudinal slide block to slide.
In one technical scheme of the invention, the testing equipment further comprises a cleaning assembly, the cleaning assembly and the solder assembly are arranged in parallel, the cleaning assembly comprises a shell, a rolling brush and a driving part, the rolling brush is inserted in the shell and can rotate relative to the shell, and the driving part is connected with the rolling brush to drive the rolling brush to rotate.
In this technical scheme, clean subassembly can be used to clean and retrieve the defective material on the welding pin, avoids remaining the solder influence on the welding pin next test to printed circuit board.
When the welding needle is cleaned, the welding needle is heated firstly, so that the residual materials on the welding needle are melted, the welding flux on the welding needle is removed through the rolling brush, the welding flux falls into the shell, the shell is of a detachable structure, namely, the shell comprises a body and a detaching part, the detaching part is clamped on the body, and when the residual materials are recovered, the detaching part can be detached, so that the residual materials in the shell can be cleaned conveniently.
A second aspect of the present invention provides a control method of a test apparatus, including: controlling the welding needle to move to the position of the welding flux assembly to pick up the welding flux; controlling the welding needle to move to the clamp and controlling the welding needle to be positioned with the welding pad of the sample piece; controlling the welding needle to move towards the welding pad so that the welding needle is in contact with the welding pad; heating the welding pin to weld the welding pin and the welding pad; and controlling the welding needle to move upwards so as to drive the welding disc to be separated from the substrate of the sample piece, and testing the tensile force required for separating the welding disc from the substrate through the tensile force sensor.
In this technical scheme, the sample that will await measuring is installed on anchor clamps, the control welding needle slides to solder subassembly department, in order to be stained with the solder, the welding needle slides to anchor clamps department after being stained with the solder, and aim at the position of pad on the sample, the welding needle moves to the pad, with the heating welding needle after the pad contact, in order to weld welding needle and pad mutually, after the welding is accomplished, the welding needle upwards slides, drive the base plate that the pad broke away from the sample, at the in-process that the pad broke away from the base plate, break away from the required pulling force of base plate through force transducer test pad, and then judge whether qualified the intensity of pad. The strength of the bonding pad is tested by the control method of the testing equipment, the strength of the bonding pad is ensured to meet the design requirement, errors generated by manual testing can be reduced, and the testing result is more accurate. The welding pin is welded with the welding pad through the control method of the test equipment, so that the welding strength between the welding pin and the welding pad can be improved, the welding pin can drive the welding pad to be separated from the substrate, and the success rate of the test is improved.
In an aspect of the present invention, after the heating the bonding pin to bond the bonding pin and the pad, the method for controlling the test equipment further includes: and controlling the cooling assembly to blow air to the welding pins.
In the technical scheme, in the process of welding the welding pin and the welding pad, the cooling speed of the welding flux is accelerated, the testing speed is increased, and the welding strength between the welding pin and the welding pad is increased.
In one technical scheme of the invention, after controlling the welding pins to move upwards to drive the welding pads to be separated from the substrate of the sample piece and testing the tensile force required for separating the welding pads from the substrate through the tensile force sensor, the control method of the test equipment further comprises the following steps: controlling the welding needle to move to the cleaning assembly; the welding pin is heated so that the residue on the welding pin falls into the cleaning assembly.
In the technical scheme, the residual materials on the welding pins are recovered, and the influence of the solder remained on the welding pins on the next test of the printed circuit board is avoided.
In an aspect of the present invention, before controlling the soldering pin to move to the solder assembly to pick up the solder, the control method of the testing apparatus further includes: and controlling the welding needle and the clamp to reset.
In the technical scheme, before testing the sample piece, the welding pins and the clamp are reset, so that the welding pins are controlled conveniently, the welding pins and the bonding pads are positioned more accurately, and the accuracy of testing the printed circuit board is improved.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 shows a schematic structural diagram of a test apparatus according to an embodiment of the present invention;
FIG. 2 is an enlarged partial view at A of the testing apparatus shown in FIG. 1 according to one embodiment of the present invention;
FIG. 3 shows a schematic structural view of a solder assembly according to one embodiment of the present invention;
FIG. 4 illustrates a schematic structural view of a weld test assembly according to one embodiment of the present invention;
FIG. 5 shows a schematic structural diagram of a test apparatus according to another embodiment of the present invention;
FIG. 6 shows a schematic structural view of a cleaning assembly according to another embodiment of the present invention;
figure 7 shows an exploded view of a cleaning assembly according to another embodiment of the present invention;
FIG. 8 shows a flow chart of a control method of a test apparatus according to an embodiment of the invention;
FIG. 9 shows a flowchart of a control method of a test apparatus according to another embodiment of the present invention;
fig. 10 is a flowchart illustrating a control method of a test apparatus according to still another embodiment of the present invention;
fig. 11 shows a flowchart of a control method of a test apparatus according to still another embodiment of the present invention.
Wherein, the correspondence between the reference numbers and the part names in fig. 1 to 7 is:
1 welding flux component, 12 supports, 14 needle tubes, 16 pistons, 18 discharge ports, 2 clamps, 3 welding test components, 32 welding pins, 34 tension sensors, 36 supports, 4 feeding components, 5 samples, 6 cooling components, 7 driving components, 8 cleaning components, 82 shells, 822 bodies, 824 detaching parts and 84 rolling brushes.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings. It should be noted that the embodiments of the present invention and features of the embodiments may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.
The test apparatus and the control method of the test apparatus according to some embodiments of the present invention are described below with reference to fig. 1 to 11.
In a first aspect embodiment of the present invention, as shown in fig. 1 and 2, the present invention provides a test apparatus comprising a solder assembly 1, a jig 2, a soldering test assembly 3, a heating assembly, and a feeding assembly 4; the solder assembly 1 is used for providing solder; the clamp 2 is used for fixing the sample piece 5; the welding test assembly 3 comprises a welding pin 32 and a tension sensor 34, wherein the tension sensor 34 is connected with the welding pin 32; the heating assembly is connected with the welding needle 32 during welding; the feeding assembly 4 is connected with the soldering test assembly 3 for moving the soldering pin 32 between the solder assembly 1 and the fixture 2.
In this embodiment, the testing apparatus installs the sample 5 to be tested on the fixture 2, controls the welding pin 32 to slide to the welding component 1 to pick up the welding material, the welding pin 32 slides to the fixture 2 after picking up the welding material and aligns to the position of the pad on the sample 5, the welding pin 32 moves to the pad and heats the welding pin 32 after contacting with the pad to weld the welding pin 32 and the pad, after the welding is completed, the welding pin 32 slides upwards to drive the pad to separate from the substrate of the sample 5, in the process of separating from the substrate, the pulling force required by the pad to separate from the substrate is tested by the pulling force sensor 34, and then whether the strength of the pad is qualified is judged. The strength of the bonding pad is tested through the testing equipment, the strength of the bonding pad is ensured to meet the design requirement, errors generated by manual testing can be reduced, and the testing result is more accurate. Welding pin 32 and pad welding through test equipment can promote the welding strength between welding pin 32 and the pad, ensures that welding pin 32 can drive the pad and break away from the base plate, promotes experimental success rate.
The clamp 2 is a vice, a pressing plate, a sucking disc or a pasting plate, and the fixing form comprises clamping, pressing, sucking or sticking and the like.
The sample 5 is a printed circuit board.
Solder forms include solid and liquid solder or solder paste, and the like.
The welding pins 32 are made of metal, so that heat conduction is facilitated.
The testing device further comprises a microscope, which is arranged towards the holder 2.
In one embodiment of the present invention, as shown in fig. 1 and 2, the testing apparatus further includes a cooling assembly 6, and the cooling assembly 6 is disposed at a side of the soldering pin 32 for cooling the solder on the soldering pin 32.
In this embodiment, the test apparatus is provided with the cooling member 6, accelerating the cooling speed of the solder during soldering of the bonding pin 32 and the pad, increasing the speed of the test, and increasing the soldering strength between the bonding pin 32 and the pad.
In one embodiment of the invention, as shown in FIG. 1, the cooling assembly 6 comprises a hose having one end connected to the air supply and the other end facing the welding pin 32.
In this embodiment, the cooling module 6 is provided with a hose, and the hose obtains high-pressure gas from the gas source and blows the welding spot, thereby cooling the solder. The cooling mode is simple and convenient and is convenient to control.
In one embodiment of the present invention, as shown in FIG. 3, the solder assembly 1 includes a holder 12, a needle cannula 14 and a plunger 16; the needle tube 14 is arranged on the support 12 and used for containing welding flux, and one end of the needle tube 14 is provided with a discharge hole 18; the plunger 16 is inserted into the needle cannula 14 from the other end of the needle cannula 14 for extruding solder within the needle cannula 14 out of the discharge port 18.
In this embodiment, solder is placed in the needle tube 14, and the plunger 16 pushes the solder in the needle tube 14 to be extruded from the discharge hole 18, thereby facilitating the solder pick-up of the soldering tip 32.
In one embodiment of the present invention, as shown in FIG. 4, the weld test assembly 3 includes a support 36 and a thermal insulation member; the strut 36 is connected with the feeding assembly 4; the heat insulating member is connected to the lower end of the column 36 and to the tension sensor 34, and the welding pin 32 is inserted into the heat insulating member.
In this embodiment, the heat insulation component separates the welding pin 32 from the pillar 36, prevents heat from being transferred from the welding pin 32 to the tension sensor 34, prevents the heat from affecting the testing accuracy of the tension sensor 34, and can concentrate the heat on the welding pin 32, thereby improving the efficiency of the heating assembly.
The heat insulation component is a heat insulation pipe, the heat insulation pipe is sleeved on the support 36, the welding needle 32 is inserted on the support 36, and the tension sensor 34 is connected with the outer wall of the heat insulation pipe.
In one embodiment of the invention, the test apparatus further comprises a base and a stand; the base is provided with a working platform, and the solder assembly 1 and the clamp 2 are arranged on the working platform; the support is connected with the base, and the feeding assembly 4 is connected with the support.
In this embodiment, the support of each component is realized by providing a base and a support, so as to position each component and control the movement position of the welding pin 32.
In one embodiment of the invention, the feeding assembly 4 comprises a transverse slide and a transverse slide; the transverse sliding rail is connected with the bracket; the transverse sliding block is sleeved on the transverse sliding rail and can slide along the transverse sliding rail.
In this embodiment, the lateral slide rails and the lateral slide blocks cooperate to allow the soldering pins 32 to slide laterally, thereby facilitating the testing of the printed circuit board.
In one embodiment of the invention, the feeding assembly 4 further comprises a longitudinal slide and a longitudinal slider; the longitudinal slide rail is connected with the transverse slide block; the longitudinal sliding block is sleeved on the longitudinal sliding rail, is connected with the welding test assembly 3 and can slide along the longitudinal sliding rail.
In this embodiment, the longitudinal slide rail and the longitudinal slide block are engaged to allow the bonding pin 32 to slide longitudinally, so that the bonding pin 32 can move towards the bonding pad and drive the bonding pad to separate from the substrate.
In one embodiment of the present invention, as shown in fig. 4 and 5, the testing apparatus further includes a driving assembly 7, and the driving assembly 7 includes at least two driving members for driving the transverse slider and the longitudinal slider to slide, respectively.
The driving component 7 is a cylinder or a motor.
In one embodiment of the present invention, as shown in fig. 5, the testing apparatus further includes a cleaning assembly 8, the cleaning assembly 8 is juxtaposed with the solder assembly, the cleaning assembly 8 includes a housing 82, a rolling brush 84, and a driving member, the rolling brush 84 is inserted into the housing 82 and can rotate relative to the housing 82, and the driving member is connected with the rolling brush 84 to drive the rolling brush 84 to rotate.
In this embodiment, the cleaning assembly 8 can be used to clean and recycle the residue on the soldering pins 32 to avoid the solder remaining on the soldering pins 32 from affecting the next testing of the printed circuit board.
As shown in fig. 6 and 7, when the soldering pin 32 needs to be cleaned, the soldering pin 32 is heated first to melt the residue on the soldering pin 32, and then the rolling brush 84 is used to remove the solder on the soldering pin 32, so that the solder falls into the housing 82, the housing 82 is a detachable structure, that is, the housing 82 comprises a body 822 and a detaching part 824, the detaching part 824 is clamped on the body 822, and when the recovered residue is cleaned, the detaching part 824 can be detached to clean the residue in the housing 82.
In an embodiment of the second aspect of the present invention, as shown in fig. 8, the present invention provides a control method of a test apparatus, including:
step 102, controlling the welding pins to move to the welding flux assembly to pick up welding fluxes;
104, controlling the welding pins to move to the clamp and controlling the welding pins and the welding pads of the sample piece to be positioned;
106, controlling the welding pins to move towards the bonding pads so that the welding pins are in contact with the bonding pads;
step 108, heating the welding pins to weld the welding pins and the welding pads;
and step 110, controlling the welding pins to move upwards to drive the welding pads to be separated from the substrate of the sample piece, and testing the tensile force required by the separation of the welding pads and the substrate through a tensile force sensor.
In the embodiment, a sample to be tested is installed on a clamp, a welding pin is controlled to slide to a welding flux assembly to pick up welding fluxes, the welding pin slides to the clamp after being picked up with the welding fluxes and is aligned to the position of a welding pad on the sample, the welding pin moves towards the welding pad and is heated after being contacted with the welding pad to be welded with the welding pad, after welding is completed, the welding pin slides upwards to drive the welding pad to be separated from a substrate of the sample, and in the process that the welding pad is separated from the substrate, the tensile force required by the welding pad to be separated from the substrate is tested through a tensile force sensor, so that whether the strength of the welding pad is qualified is judged. The strength of the bonding pad is tested by the control method of the testing equipment, the strength of the bonding pad is ensured to meet the design requirement, errors generated by manual testing can be reduced, and the testing result is more accurate. The welding pin is welded with the welding pad through the control method of the test equipment, so that the welding strength between the welding pin and the welding pad can be improved, the welding pin can drive the welding pad to be separated from the substrate, and the success rate of the test is improved.
In one embodiment of the present invention, as shown in fig. 9, a control method of a test apparatus includes:
and 212, controlling the welding pins to move upwards to drive the welding pads to be separated from the substrate of the sample piece, and testing the tensile force required by the separation of the welding pads and the substrate through the tensile force sensor.
In this embodiment, the cooling speed of the solder is accelerated, the speed of the test is increased, and the soldering strength between the bonding pin and the pad is increased in the process of bonding the bonding pin and the pad.
In one embodiment of the present invention, as shown in fig. 10, a control method of a test apparatus includes:
308, heating the welding pin to weld the welding pin and the welding pad;
in step 314, the welding pins are heated so that the residue on the welding pins falls into the cleaning assembly.
In this embodiment, the residual material on the soldering pins is recovered to avoid the influence of the solder remaining on the soldering pins on the next test of the printed circuit board. After the welding pins are heated, the welding flux on the welding pins falls into the cleaning assembly under the action of gravity; or the welding flux on the welding pin falls into the cleaning component through the rolling brush, and the welding flux on the welding pin can also be cleaned manually.
In one embodiment of the present invention, as shown in fig. 11, a control method of a test apparatus includes:
and step 412, controlling the welding pins to move upwards to drive the welding pads to be separated from the substrate of the sample piece, and testing the tensile force required by the separation of the welding pads and the substrate through the tensile force sensor.
In this embodiment, before testing the sample, earlier reset welding pin and anchor clamps, be convenient for control the welding pin for the welding pin is more accurate with the pad location, and then promotes the accuracy of printed circuit board test.
In the description of the present invention, the terms "plurality" or "a plurality" refer to two or more, and unless otherwise specifically limited, the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention; the terms "connected," "mounted," "secured," and the like are to be construed broadly and include, for example, fixed connections, removable connections, or integral connections; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description of the present invention, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In the present invention, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A test apparatus, comprising:
a solder assembly for providing solder;
the clamp is used for fixing the sample piece;
the welding test assembly comprises a welding pin and a tension sensor, and the tension sensor is connected with the welding pin;
the heating assembly is connected with the welding pin during welding;
and the feeding assembly is connected with the welding test assembly and is used for driving the welding needle to move between the welding flux assembly and the clamp.
2. The test apparatus of claim 1, further comprising:
and the cooling component is arranged on the side of the welding pin and used for cooling the welding flux on the welding pin.
3. The test apparatus of claim 2, wherein the cooling assembly comprises:
and one end of the hose is connected with an air source, and the other end of the hose faces the welding needle.
4. The test apparatus of claim 1, wherein the solder assembly comprises:
a support;
the needle tube is arranged on the support and used for containing welding flux, and a discharge hole is formed in one end of the needle tube;
and the piston is inserted into the needle tube from the other end of the needle tube and is used for extruding the solder in the needle tube from the discharge hole.
5. The test apparatus of claim 1, wherein the weld test assembly comprises:
a post coupled with the feed assembly;
the heat insulation component is connected with the lower end of the support column and connected with the tension sensor, and the welding pins are inserted into the heat insulation component or the support column.
6. The test apparatus of any one of claims 1 to 5, further comprising:
the base is provided with a working platform, and the solder assembly and the clamp are arranged on the working platform;
the support, the support with the base is connected, the subassembly that feeds with the support is connected.
7. The test apparatus of any one of claims 1 to 5, further comprising:
the cleaning assembly and the welding flux assembly are arranged in parallel, the cleaning assembly comprises a shell, a rolling brush and a driving part, the rolling brush is inserted in the shell and can rotate relative to the shell, and the driving part is connected with the rolling brush to drive the rolling brush to rotate.
8. A control method of a test apparatus, comprising:
controlling the welding needle to move to the position of the welding flux assembly to pick up the welding flux;
controlling the welding pin to move to the clamp and controlling the welding pin and a bonding pad of the sample piece to be positioned;
controlling the welding needle to move towards the welding pad so that the welding needle is in contact with the welding pad;
heating the welding pin to weld the welding pin and the welding pad;
and controlling the welding needle to move upwards so as to drive the welding disc to be separated from the substrate of the sample piece, and testing the tensile force required for separating the welding disc from the substrate through a tensile force sensor.
9. The method of controlling a test apparatus according to claim 8, wherein after said heating the bonding pin to bond the bonding pin and the pad, the method further comprises:
and controlling the cooling assembly to blow air to the welding pins.
10. The control method of a test apparatus according to claim 8 or 9,
after controlling the welding needle to move upwards to drive the welding pad to be separated from the substrate of the sample piece and testing the tensile force required by the separation of the welding pad and the substrate through the tensile force sensor, the control method of the test equipment further comprises the following steps: controlling the welding needle to move to the cleaning assembly; heating the welding pin to enable the residual materials on the welding pin to fall into the cleaning assembly;
before the control welding pin moves to the solder assembly to pick up the solder, the control method of the test equipment further comprises the following steps: and controlling the welding needle and the clamp to reset.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911112143.0A CN110842385A (en) | 2019-11-14 | 2019-11-14 | Test apparatus and control method of test apparatus |
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| CN201911112143.0A CN110842385A (en) | 2019-11-14 | 2019-11-14 | Test apparatus and control method of test apparatus |
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Cited By (3)
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| CN113624938A (en) * | 2021-07-19 | 2021-11-09 | 深圳市德瑞茵智能科技有限公司 | Protection device and test equipment for semiconductor micro-welding point strength test tool |
| CN114608738A (en) * | 2022-04-14 | 2022-06-10 | 珠海格力电器股份有限公司 | Tension detection device and tension test system |
| CN117309602A (en) * | 2023-11-28 | 2023-12-29 | 深圳市赛美精密仪器有限公司 | Pad drawing test mechanism |
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| CN117309602A (en) * | 2023-11-28 | 2023-12-29 | 深圳市赛美精密仪器有限公司 | Pad drawing test mechanism |
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