CN110842385A - Test equipment and control method of test equipment - Google Patents

Abstract

The invention provides a test equipment and a control method of the test equipment. The test equipment includes a solder component, a fixture, a welding test component, a heating component and a feeding component; the solder component is used for providing solder; the fixture is used for fixing a sample; welding The test assembly includes a solder pin and a tension sensor, and the tension sensor is connected with the solder pin; the heating element is connected with the solder pin during soldering; the feeding component is connected with the solder test component for driving the solder pin between the solder component and the fixture sports. The strength of the pad is tested by the test equipment to ensure that the strength of the pad meets the design requirements, and the error caused by manual testing can be reduced, so that the test result is more accurate. Soldering the solder pins to the pads through the test equipment can improve the welding strength between the solder pins and the solder pads, ensure that the solder pins can drive the solder pads away from the substrate, and improve the success rate of the test.

Description

Test equipment and control method of test equipment

technical field

The invention relates to the technical field of printed circuit board testing, and in particular, to a testing device and a control method of the testing device.

Background technique

At present, the use of halogen-free substrates for printed circuit boards is the development direction of the microelectronics manufacturing industry. The use of halogen-free substrates reduces the toughness of printed circuit boards and is prone to pad cracking. In order to ensure the strength of the pads of the printed circuit board, the pads need to be tested for strength.

In the related art, the method of testing the strength of the pads is mainly manual, but manual testing will lead to an increase in test errors and affect the test results.

SUMMARY OF THE INVENTION

The present invention aims to solve at least one of the technical problems existing in the prior art or related technologies.

To this end, a first aspect of the present invention proposes a testing device.

A second aspect of the present invention provides a control method of a testing device.

In view of this, a first aspect of the present invention provides a test equipment, including a solder component, a fixture, a solder test component, a heating component and a feed component; the solder component is used for providing solder; the fixture is used for fixing the sample; The component includes a solder pin and a tension sensor, the tension sensor is connected with the solder pin; the heating component is connected with the solder pin during soldering; the feed component is connected with the solder test component, which is used to drive the solder pin to move between the solder component and the fixture .

In the testing equipment provided by the present invention, the sample to be tested is mounted on the fixture, and the soldering pin is controlled to slide to the solder assembly to dip the solder. After dipping the solder, the soldering pin slides to the fixture and aligns the specimen with The position of the pad, the solder pin moves to the pad, and the solder pin is heated after contact with the pad to weld the solder pin and the pad. During the process that the pad is separated from the substrate, the tensile force required for the pad to be separated from the substrate is tested by the tension sensor, and then the strength of the pad is judged whether it is qualified. The strength of the pad is tested by the test equipment to ensure that the strength of the pad meets the design requirements, and the error caused by manual testing can be reduced, so that the test result is more accurate. Soldering the solder pins and the pads through the testing equipment can improve the welding strength between the solder pins and the solder pads, ensure that the solder pins can drive the solder pads away from the substrate, and improve the success rate of the test.

The fixture is a vise or a pressure plate.

The prototype is a printed circuit board.

The solder is solder paste.

The soldering pin is a metallic soldering pin, which facilitates heat conduction.

The test equipment also includes a microscope, which is positioned towards the fixture.

In addition, the test equipment in the above-mentioned technical solution provided by the present invention may also have the following additional technical features:

In one technical solution of the present invention, the testing equipment further includes a cooling component, which is disposed on the side of the soldering pin and is used for cooling the solder on the soldering pin.

In this technical solution, the testing equipment is provided with a cooling component, in the process of soldering the solder pins and the pads, the cooling speed of the solder is accelerated, the testing speed is increased, and the welding strength between the solder pins and the solder pads is improved.

In a technical solution of the present invention, the cooling assembly includes a hose, one end of the hose is connected to the gas source, and the other end faces the welding needle.

In this technical solution, the cooling component is provided with a hose, and the hose obtains high-pressure gas from an air source, and then blows the solder joint, thereby cooling the solder. This cooling method is simple, convenient and easy to control.

In one technical solution of the present invention, the solder assembly includes a support, a needle tube and a piston; the needle tube is arranged on the support for holding solder, and one end of the needle tube is provided with a discharge port; the piston is inserted into the needle tube from the other end of the needle tube , used to extrude the solder in the needle tube from the outlet.

In this technical solution, the solder is placed in the needle tube, and the piston can push the solder in the needle tube to be extruded from the discharge port, thereby facilitating the soldering needle to pick up the solder.

In a technical solution of the present invention, the welding test assembly includes a support column and a heat insulation component; the support column is connected with the feeding component; the heat insulation component is connected with the lower end of the support column and connected with the tension sensor, and the welding pin is inserted into the spacer on hot parts.

In this technical solution, the heat-insulating component separates the welding pin from the pillar, preventing heat from being transferred from the welding pin to the tension sensor, preventing the heat from affecting the test accuracy of the tension sensor, and allowing the heat to concentrate on the welding pin, improving the efficiency of the heating assembly .

The heat insulating component is a heat insulating pipe, the heat insulating pipe is sleeved on the pillar, the welding pin is inserted on the pillar, and the tension sensor is connected with the outer wall of the heat insulating pipe.

In a technical solution of the present invention, the testing equipment further includes a base and a support; the base is provided with a working platform, and the solder assembly and the fixture are arranged on the working platform; the support is connected with the base, and the feeding assembly is connected with the support.

In this technical solution, by arranging the base and the bracket, the support of each component is realized, so as to facilitate the positioning of each component, and to facilitate the control of the movement position of the welding needle.

In one technical solution of the present invention, the feeding assembly includes a transverse sliding rail and a transverse sliding block; the transverse sliding rail is connected with the bracket; the transverse sliding block is sleeved on the transverse sliding rail and can slide along the transverse sliding rail.

In this technical solution, the horizontal sliding rail and the horizontal sliding block are matched, so that the solder pins can slide horizontally, thereby facilitating the testing of the printed circuit board.

In a technical solution of the present invention, the feeding assembly further includes a longitudinal sliding rail and a longitudinal sliding block; the longitudinal sliding rail is connected with the transverse sliding block; the longitudinal sliding block is sleeved on the longitudinal sliding rail and is connected with the welding test assembly , which can slide along the longitudinal rail.

In this technical solution, the longitudinal slide rail and the longitudinal slider are matched, so that the solder pins can slide longitudinally, which facilitates the movement of the solder pins to the pads and drives the pads away from the substrate.

In one technical solution of the present invention, the testing equipment further includes a drive assembly, and the drive assembly includes at least two drive components, which respectively drive the transverse slider and the longitudinal slider to slide.

In one technical solution of the present invention, the testing equipment further includes a cleaning assembly, the cleaning assembly and the solder assembly are arranged in parallel, the cleaning assembly includes a casing, a roller brush and a driving part, the roller brush is inserted into the casing and can rotate relative to the casing , the driving part is connected with the roller brush to drive the roller brush to rotate.

In this technical solution, the cleaning component can be used to clean and recover the residual material on the solder pins, so as to prevent the solder remaining on the solder pins from affecting the next test of the printed circuit board.

When it is necessary to clean the solder pins, first heat the solder pins to melt the residual material on the solder pins, and then remove the solder on the solder pins with a roller brush, so that the solder falls into the housing. The housing is a detachable structure, that is, the housing includes The main body and the dismantling part, the dismantling part is clamped on the main body, and the dismantling part can be dismantled when cleaning the recovered residual materials, so as to facilitate the cleaning of the residual materials in the shell.

A second aspect of the present invention provides a method for controlling testing equipment, including: controlling the movement of a solder pin to a solder component to pick up solder; controlling the solder pin to move to a fixture, and controlling the solder pin and the pad positioning of the sample; Control the movement of the solder pins to the pads so that the solder pins contact the pads; heat the solder pins to weld the solder pins and the solder pads; control the solder pins to move upward to drive the solder pads away from the substrate of the sample, and pass the tension The sensor measures the pulling force required to separate the pad from the substrate.

In this technical solution, the sample to be tested is installed on the fixture, and the solder pin is controlled to slide to the solder component to pick up the solder. After the solder is picked up, the solder pin slides to the fixture and aligns the pad on the sample. position, the solder pin moves to the pad, and after contact with the pad, the solder pin is heated to weld the solder pin and the pad. In the process of separating from the substrate, the tensile force required for the pad to be separated from the substrate is tested by the tension sensor, and then the strength of the pad is judged whether it is qualified. The strength of the pad is tested by the control method of the test equipment, so as to ensure that the strength of the pad meets the design requirements, and the error caused by manual testing can be reduced, so that the test result is more accurate. Soldering the solder pins to the pads through the control method of the test equipment can improve the welding strength between the solder pins and the solder pads, ensure that the solder pins can drive the solder pads away from the substrate, and improve the success rate of the test.

In one technical solution of the present invention, after heating the solder pins to weld the solder pins and the pads, the control method of the testing equipment further includes: controlling the cooling component to blow air to the solder pins.

In this technical solution, in the process of soldering the solder pins and the pads, the cooling speed of the solder is accelerated, the test rate is increased, and the soldering strength between the solder pins and the solder pads is improved.

In a technical solution of the present invention, after controlling the upward movement of the soldering pins to drive the soldering pads away from the substrate of the prototype, and testing the tensile force required for the soldering pads to be separated from the substrate through the tensile force sensor, the control method of the testing equipment is further Including: controlling the movement of the soldering pin to the cleaning component; heating the soldering pin so that the residual material on the soldering pin falls into the cleaning component.

In this technical solution, the residual material on the solder pins is recovered to prevent the solder remaining on the solder pins from affecting the next test of the printed circuit board.

In a technical solution of the present invention, before controlling the movement of the solder pins to the solder component to pick up the solder, the control method of the testing equipment further includes: controlling the solder pins and the fixture to reset.

In this technical solution, before the sample is tested, the solder pins and the fixture are reset to facilitate the control of the solder pins, so that the solder pins and the pads can be positioned more accurately, thereby improving the accuracy of the printed circuit board test.

Additional aspects and advantages of the present invention will be set forth, in part, from the following description, and in part will be apparent from the following description, or may be learned by practice of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of embodiments taken in conjunction with the accompanying drawings, wherein:

1 shows a schematic structural diagram of a testing device according to an embodiment of the present invention;

FIG. 2 is a partial enlarged view of the test equipment at A according to an embodiment of the present invention shown in FIG. 1;

FIG. 3 shows a schematic structural diagram of a solder assembly according to an embodiment of the present invention;

FIG. 4 shows a schematic structural diagram of a welding test assembly according to an embodiment of the present invention;

FIG. 5 shows a schematic structural diagram of a testing device according to another embodiment of the present invention;

FIG. 6 shows a schematic structural diagram of a cleaning assembly according to another embodiment of the present invention;

Figure 7 shows an exploded view of a cleaning assembly according to another embodiment of the present invention;

FIG. 8 shows a flowchart of a control method of a testing device according to an embodiment of the present invention;

Fig. 9 shows the flow chart of the control method of the test equipment according to another embodiment of the present invention;

10 shows a flowchart of a control method of a testing device according to yet another embodiment of the present invention;

FIG. 11 shows a flowchart of a control method of a testing device according to still another embodiment of the present invention.

Wherein, the corresponding relationship between the reference numerals and component names in Fig. 1 to Fig. 7 is:

1 Solder Assembly, 12 Stands, 14 Needle Tubes, 16 Pistons, 18 Outlets, 2 Fixtures, 3 Solder Test Components, 32 Solder Pins, 34 Tension Sensors, 36 Posts, 4 Feed Components, 5 Samples, 6 Cooling Components , 7 drive components, 8 cleaning components, 82 housing, 822 body, 824 disassembly, 84 roller brush.

Detailed ways

In order to understand the above objects, features and advantages of the present invention more clearly, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present invention and the features in the embodiments may be combined with each other under the condition of no conflict.

Many specific details are set forth in the following description to facilitate a full understanding of the present invention. However, the present invention can also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited by the specific details disclosed below. Example limitations.

The test equipment and the control method of the test equipment according to some embodiments of the present invention will be described below with reference to FIGS. 1 to 11 .

In the embodiment of the first aspect of the present invention, as shown in FIG. 1 and FIG. 2 , the present invention provides a test equipment, including a solder component 1, a fixture 2, a solder test component 3, a heating component and a feeding component 4; a solder component The component 1 is used to supply solder; the fixture 2 is used to fix the sample 5; the welding test component 3 includes a solder pin 32 and a tension sensor 34, and the tension sensor 34 is connected with the solder pin 32; the heating component is connected with the solder pin 32 during soldering ; The feeding component 4 is connected with the soldering test component 3 for driving the soldering pin 32 to move between the soldering component 1 and the fixture 2 .

In this embodiment, the test equipment installs the sample 5 to be tested on the fixture 2, and controls the solder pins 32 to slide to the solder assembly 1 to pick up the solder, and after the solder is picked up, the solder pins 32 slide to the fixture 2, And align the position of the pad on the sample 5, the solder pin 32 moves to the pad, and after contact with the pad, the solder pin 32 is heated to weld the solder pin 32 and the solder pad. After the soldering is completed, the solder pin 32 slides up , to drive the pads off the substrate of the sample 5. During the process of the pads being separated from the substrate, the tensile force required for the pads to be separated from the substrate is tested by the tensile force sensor 34, and then the strength of the pads is judged to be qualified. The strength of the pad is tested by the test equipment to ensure that the strength of the pad meets the design requirements, and the error caused by manual testing can be reduced, so that the test result is more accurate. Soldering the solder pins 32 and the pads through the testing equipment can improve the welding strength between the solder pins 32 and the solder pads, ensure that the solder pins 32 can drive the solder pads away from the substrate, and improve the success rate of the test.

The fixture 2 is a vice, a pressing plate, a suction cup or a sticking plate, and the fixing form includes clamping, pressing, sucking or gluing, etc.

Sample 5 is a printed circuit board.

Solder forms include solid and liquid solder or solder paste.

The soldering pins 32 are soldering pins 32 made of metal material, so as to facilitate heat conduction.

The test equipment also includes a microscope, which is positioned towards the fixture 2 .

In one embodiment of the present invention, as shown in FIG. 1 and FIG. 2 , the testing equipment further includes a cooling assembly 6 , which is disposed on the side of the solder pins 32 for cooling the solder on the solder pins 32 .

In this embodiment, the testing equipment is provided with a cooling assembly 6, which accelerates the cooling rate of the solder, increases the testing rate, and increases the welding strength between the solder pins 32 and the solder pads during the process of soldering the solder pins 32 and the solder pads.

In one embodiment of the present invention, as shown in FIG. 1 , the cooling assembly 6 includes a hose, one end of the hose is connected to the gas source, and the other end faces the welding needle 32 .

In this embodiment, the cooling assembly 6 is provided with a hose, and the hose obtains high-pressure gas from the air source, and then blows the solder joint, thereby cooling the solder. This cooling method is simple, convenient and easy to control.

In an embodiment of the present invention, as shown in FIG. 3 , the solder assembly 1 includes a support 12 , a needle tube 14 and a piston 16 ; the needle tube 14 is arranged on the support 12 and is used for holding solder, and one end of the needle tube 14 is provided with a The discharge port 18; the piston 16 is inserted into the needle tube 14 from the other end of the needle tube 14, and is used to extrude the solder in the needle tube 14 from the discharge port 18.

In this embodiment, the solder is placed in the needle tube 14 , and the piston 16 can push the solder in the needle tube 14 to extrude from the discharge port 18 , thereby facilitating the solder pins 32 to pick up the solder.

In one embodiment of the present invention, as shown in FIG. 4 , the welding test assembly 3 includes a support column 36 and a heat insulation part; the support column 36 is connected with the feeding assembly 4 ; the heat insulation part is connected with the lower end of the support column 36 and is connected with The tension sensor 34 is connected, and the welding pin 32 is inserted into the heat insulating member.

In this embodiment, the heat insulating member separates the solder pins 32 from the pillars 36 , preventing heat from being transferred from the solder pins 32 to the tension sensor 34 , preventing the heat from affecting the test accuracy of the tension sensor 34 , and allowing the heat to concentrate on the solder pins 32 , to improve the efficiency of heating components.

The heat insulating component is a heat insulating tube, the heat insulating tube is sleeved on the support column 36, the welding pin 32 is inserted into the support column 36, and the tensile force sensor 34 is connected with the outer wall of the heat insulating tube.

In one embodiment of the present invention, the test equipment further includes a base and a support; the base is provided with a working platform, and the solder assembly 1 and the fixture 2 are set on the working platform; the support is connected with the base, and the feeding assembly 4 is connected with the support connected.

In this embodiment, by arranging the base and the bracket, each component is supported, so as to facilitate the positioning of each component, and to facilitate the control of the movement position of the welding pin 32 .

In one embodiment of the present invention, the feeding assembly 4 includes a transverse sliding rail and a transverse sliding block; the transverse sliding rail is connected with the bracket; the transverse sliding block is sleeved on the transverse sliding rail and can slide along the transverse sliding rail.

In this embodiment, the lateral sliding rail and the lateral sliding block are matched, so that the solder pins 32 can slide laterally, thereby facilitating the testing of the printed circuit board.

In an embodiment of the present invention, the feeding assembly 4 further includes a longitudinal sliding rail and a longitudinal sliding block; the longitudinal sliding rail is connected with the transverse sliding block; the longitudinal sliding block is sleeved on the longitudinal sliding rail, and is connected with the welding test assembly 3 Connected to slide along longitudinal rails.

In this embodiment, the longitudinal slide rail and the longitudinal slider are matched, so that the solder pins 32 can slide longitudinally, which facilitates the solder pins 32 to move toward the pads and drive the pads to separate from the substrate.

In an embodiment of the present invention, as shown in FIG. 4 and FIG. 5 , the testing device further includes a drive assembly 7 , and the drive assembly 7 includes at least two drive components, respectively driving the transverse slider and the longitudinal slider to slide.

The drive assembly 7 is an air cylinder or a motor.

In one embodiment of the present invention, as shown in FIG. 5 , the testing equipment further includes a cleaning assembly 8 , which is arranged in parallel with the solder assembly, and the cleaning assembly 8 includes a housing 82 , a roller brush 84 and a driving part. The roller brush 84 It is inserted into the casing 82 and can be rotated relative to the casing 82 , and the driving component is connected with the rolling brush 84 to drive the rolling brush 84 to rotate.

In this embodiment, the cleaning component 8 can be used to clean and recover the residual material on the solder pins 32 to prevent the solder remaining on the solder pins 32 from affecting the next test of the printed circuit board.

As shown in FIG. 6 and FIG. 7 , when the solder pins 32 need to be cleaned, the solder pins 32 are first heated to melt the residual material on the solder pins 32 , and then the solder on the solder pins 32 is removed by the roller brush 84 so that the solder falls into the Inside the casing 82, the casing 82 is a detachable structure, that is, the casing 82 includes a main body 822 and a disassembly part 824, the disassembly part 824 is clamped on the main body 822, and the disassembly part 824 can be removed when cleaning the recovered residual materials, In order to clean the residual material in the casing 82 .

In the embodiment of the second aspect of the present invention, as shown in FIG. 8 , the present invention provides a control method of a test equipment, including:

Step 102, controlling the movement of the solder pins to the solder components to pick up solder;

Step 104, controlling the soldering pin to move to the fixture, and controlling the soldering pin and the pad positioning of the sample;

Step 106, controlling the soldering pin to move toward the pad, so that the soldering pin is in contact with the soldering pad;

Step 108, heating the soldering pins, so that the soldering pins and the pads are welded;

Step 110 , control the upward movement of the solder pins to drive the pads away from the substrate of the prototype, and test the tensile force required for the pads to be separated from the substrate through a tension sensor.

In this embodiment, the sample to be tested is mounted on the fixture, and the solder pins are controlled to slide to the solder component to pick up the solder. After the solder is picked up, the solder pins slide to the fixture and align with the pads on the sample. position, the solder pin moves to the pad, and after contact with the pad, the solder pin is heated to weld the solder pin and the pad. In the process of separating from the substrate, the tensile force required for the pad to be separated from the substrate is tested by the tension sensor, and then the strength of the pad is judged whether it is qualified. The strength of the pad is tested by the control method of the test equipment, so as to ensure that the strength of the pad meets the design requirements, and the error caused by manual testing can be reduced, so that the test result is more accurate. Soldering the solder pins to the pads through the control method of the test equipment can improve the welding strength between the solder pins and the solder pads, ensure that the solder pins can drive the solder pads away from the substrate, and improve the success rate of the test.

In one embodiment of the present invention, as shown in FIG. 9 , the control method of the test equipment includes:

Step 202, controlling the movement of the solder pins to the solder components to pick up solder;

Step 204, control the soldering pin to move to the fixture, and control the soldering pin and the pad positioning of the sample;

Step 206, controlling the soldering pin to move toward the pad, so that the soldering pin is in contact with the soldering pad;

Step 208, heating the soldering pins, so that the soldering pins and the pads are welded;

Step 210, controlling the cooling assembly to blow air to the welding pin;

Step 212 , controlling the upward movement of the solder pins to drive the pads away from the substrate of the prototype, and testing the tensile force required for the pads to separate from the substrate through a tension sensor.

In this embodiment, in the process of soldering the solder pins and the pads, the cooling rate of the solder is accelerated, the testing rate is increased, and the soldering strength between the solder pins and the solder pads is improved.

In an embodiment of the present invention, as shown in FIG. 10 , the control method of the test equipment includes:

Step 302, controlling the movement of the solder pin to the solder component to pick up solder;

Step 304, control the soldering pin to move to the fixture, and control the soldering pin and the pad positioning of the sample;

Step 306, controlling the soldering pin to move toward the pad, so that the soldering pin is in contact with the soldering pad;

Step 308 , heating the solder pins to weld the solder pins and the pads;

Step 310 , controlling the upward movement of the solder pins to drive the pads away from the substrate of the sample, and testing the tensile force required for the pads to be separated from the substrate through a tension sensor;

Step 312, controlling the movement of the welding needle to the cleaning component;

Step 314 , heating the solder pins, so that the residual material on the solder pins falls into the cleaning assembly.

In this embodiment, the residual material on the solder pins is recovered to prevent the solder remaining on the solder pins from affecting the next test of the printed circuit board. After heating the soldering pin, the solder on the soldering pin falls into the cleaning component under the action of gravity; or through the roller brush, the solder on the soldering pin of the soldering pin falls into the cleaning component, or the solder on the soldering pin can be cleaned manually.

In one embodiment of the present invention, as shown in FIG. 11 , the control method of the test equipment includes:

Step 402, controlling the reset of the welding pin and the fixture;

Step 404, controlling the movement of the solder pins to the solder components to pick up solder;

Step 406, control the soldering pin to move to the fixture, and control the soldering pin and the pad positioning of the sample;

Step 408, controlling the solder pins to move toward the pads, so that the solder pins are in contact with the solder pads;

Step 410, heating the soldering pins, so that the soldering pins and the pads are welded;

Step 412 , control the upward movement of the solder pins to drive the pads away from the substrate of the prototype, and test the tensile force required for the pads to separate from the substrate through the tension sensor.

In this embodiment, before testing the sample, the solder pins and the fixture are reset to facilitate the control of the solder pins, so that the solder pins and the pads can be positioned more accurately, thereby improving the accuracy of the printed circuit board test.

In the description of the present invention, the term "plurality" refers to two or more than two, unless otherwise expressly defined, the orientation or positional relationship indicated by the terms "upper", "lower" etc. is based on the drawings. The orientation or positional relationship is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention; The terms "connected", "installed", "fixed", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or through the middle media are indirectly connected. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

In the description of the present invention, the terms "one embodiment," "some embodiments," "a specific embodiment," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in the present invention. at least one embodiment or example of . In the present invention, schematic representations of the above terms do not necessarily refer to the same embodiment or instance. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims (10)

1. A test apparatus, comprising:

a solder assembly for providing solder;

the clamp is used for fixing the sample piece;

the welding test assembly comprises a welding pin and a tension sensor, and the tension sensor is connected with the welding pin;

the heating assembly is connected with the welding pin during welding;

and the feeding assembly is connected with the welding test assembly and is used for driving the welding needle to move between the welding flux assembly and the clamp.

2. The test apparatus of claim 1, further comprising:

and the cooling component is arranged on the side of the welding pin and used for cooling the welding flux on the welding pin.

3. The test apparatus of claim 2, wherein the cooling assembly comprises:

and one end of the hose is connected with an air source, and the other end of the hose faces the welding needle.

4. The test apparatus of claim 1, wherein the solder assembly comprises:

a support;

the needle tube is arranged on the support and used for containing welding flux, and a discharge hole is formed in one end of the needle tube;

and the piston is inserted into the needle tube from the other end of the needle tube and is used for extruding the solder in the needle tube from the discharge hole.

5. The test apparatus of claim 1, wherein the weld test assembly comprises:

a post coupled with the feed assembly;

the heat insulation component is connected with the lower end of the support column and connected with the tension sensor, and the welding pins are inserted into the heat insulation component or the support column.

6. The test apparatus of any one of claims 1 to 5, further comprising:

the base is provided with a working platform, and the solder assembly and the clamp are arranged on the working platform;

the support, the support with the base is connected, the subassembly that feeds with the support is connected.

7. The test apparatus of any one of claims 1 to 5, further comprising:

the cleaning assembly and the welding flux assembly are arranged in parallel, the cleaning assembly comprises a shell, a rolling brush and a driving part, the rolling brush is inserted in the shell and can rotate relative to the shell, and the driving part is connected with the rolling brush to drive the rolling brush to rotate.

8. A control method of a test apparatus, comprising:

controlling the welding needle to move to the position of the welding flux assembly to pick up the welding flux;

controlling the welding pin to move to the clamp and controlling the welding pin and a bonding pad of the sample piece to be positioned;

controlling the welding needle to move towards the welding pad so that the welding needle is in contact with the welding pad;

heating the welding pin to weld the welding pin and the welding pad;

and controlling the welding needle to move upwards so as to drive the welding disc to be separated from the substrate of the sample piece, and testing the tensile force required for separating the welding disc from the substrate through a tensile force sensor.

9. The method of controlling a test apparatus according to claim 8, wherein after said heating the bonding pin to bond the bonding pin and the pad, the method further comprises:

and controlling the cooling assembly to blow air to the welding pins.

10. The control method of a test apparatus according to claim 8 or 9,

after controlling the welding needle to move upwards to drive the welding pad to be separated from the substrate of the sample piece and testing the tensile force required by the separation of the welding pad and the substrate through the tensile force sensor, the control method of the test equipment further comprises the following steps: controlling the welding needle to move to the cleaning assembly; heating the welding pin to enable the residual materials on the welding pin to fall into the cleaning assembly;

before the control welding pin moves to the solder assembly to pick up the solder, the control method of the test equipment further comprises the following steps: and controlling the welding needle and the clamp to reset.

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