CN113624938B - Protection device and test equipment for semiconductor micro-welding spot strength test tool - Google Patents
Protection device and test equipment for semiconductor micro-welding spot strength test tool Download PDFInfo
- Publication number
- CN113624938B CN113624938B CN202110814370.9A CN202110814370A CN113624938B CN 113624938 B CN113624938 B CN 113624938B CN 202110814370 A CN202110814370 A CN 202110814370A CN 113624938 B CN113624938 B CN 113624938B
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- module
- semiconductor micro
- head module
- test head
- test tool
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- 238000012360 testing method Methods 0.000 title claims abstract description 138
- 239000004065 semiconductor Substances 0.000 title claims abstract description 46
- 238000003466 welding Methods 0.000 title claims abstract description 18
- 229910000679 solder Inorganic materials 0.000 claims description 20
- 230000001681 protective effect Effects 0.000 claims description 11
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims 1
- 230000000903 blocking effect Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/20—Metals
- G01N33/207—Welded or soldered joints; Solderability
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Food Science & Technology (AREA)
- Medicinal Chemistry (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The invention discloses a semiconductor micro-welding spot strength test tool protection device and test equipment, wherein a semiconductor micro-welding spot strength test tool is arranged at the lower end of a test head module, the test head module is slidably arranged on a module hanging frame, the semiconductor micro-welding spot strength test tool protection device comprises a protection bracket component which is arranged below the test head module and is used for protecting the test tool, the protection bracket component can rotate relative to the test head module, a gradually thickened guide inclined plane is arranged at the bottom of the module hanging frame along the loading direction of the test head module from outside to inside, a pin used for limiting or relieving the rotation of the protection bracket component is arranged at the tail end of the guide inclined plane, and a rotation limiting groove used for limiting the rotation of the protection bracket component is arranged at the bottom of the test head module. The invention can realize effective protection of the test tool and prolong the service life of the test tool.
Description
Technical Field
The invention relates to the technical field of semiconductor micro-welding spot strength test, in particular to a protection device and test equipment for a semiconductor micro-welding spot strength test tool.
Background
The semiconductor micro-welding spot strength testing equipment is widely applied to shear force testing in the technological processes of packaging various semiconductor devices, PCB assembly manufacturing or display COB manufacturing and the like.
However, current semiconductor micro solder joint strength test equipment lacks protection measures for the test tool and is easy to damage the test tool during the test process.
Disclosure of Invention
The invention mainly aims to provide a protection device and a test device for a semiconductor micro-welding spot strength test tool, and aims to effectively protect the test tool and prolong the service life of the test tool.
In order to achieve the above object, the present invention provides a protection device for a semiconductor micro solder joint strength test tool, wherein the semiconductor micro solder joint strength test tool is mounted at the lower end of a test head module, the test head module is slidably mounted on a module rack, the semiconductor micro solder joint strength test tool protection device comprises a protection bracket assembly mounted below the test head module and used for protecting the test tool, the protection bracket assembly can rotate relative to the test head module, a guide inclined plane which is gradually thickened is arranged at the bottom of the module rack along the loading direction of the test head module from outside to inside, a pin used for limiting or releasing the rotation movement of the protection bracket assembly is arranged at the tail end of the guide inclined plane, and a rotation limiting groove used for limiting the rotation movement of the protection bracket assembly is arranged at the bottom of the test head module.
According to a further technical scheme, the tail end of the guide inclined plane is provided with a mounting hole for mounting the pin.
According to a further technical scheme, the protection support assembly comprises an L-shaped round rod, an L-shaped baffle mechanism and a spring, wherein the L-shaped baffle mechanism is fixedly connected with the L-shaped round rod, the L-shaped baffle mechanism comprises a connecting rod and a baffle positioned at the lower end of the connecting rod, the upper end of the connecting rod is fixedly connected with the L-shaped round rod, one end of the L-shaped round rod is rotatably arranged in the test head module in a penetrating mode, the spring is sleeved at one end of the L-shaped round rod, one end of the spring is abutted against the upper end of the connecting rod, and the other end of the spring is abutted against the test head module.
The test head module comprises a module bottom plate, a module shell detachably connected with the module bottom plate and a module vertical plate arranged at the bottoms of the module bottom plate and the module shell, wherein the module vertical plate is provided with the rotation limiting groove, and the rotation limiting groove comprises two step structures.
According to a further technical scheme, the rear end of the module vertical plate is provided with a protection bracket assembly for avoiding gaps.
According to a further technical scheme, a round rod rotating hole of a protection support is formed in the middle of the lower end of the module shell, and one end of the L-shaped round rod is arranged in the round rod rotating hole in a penetrating mode.
According to a further technical scheme, a rotary retaining groove of the protective bracket component is formed in the middle of the lower end of the module bottom plate.
According to a further technical scheme, a sensor is arranged at the lower end of the test head module, and the semiconductor micro-welding spot strength testing tool is arranged at the lower end of the sensor.
In order to achieve the above purpose, the invention also provides a semiconductor micro-welding spot strength testing device, which comprises the semiconductor micro-welding spot strength testing tool protection device.
The protection device and the testing equipment for the semiconductor micro-welding spot strength testing tool have the beneficial effects that: according to the technical scheme, the test head module comprises the protection bracket assembly which is arranged below the test head module and used for protecting the test tool, the protection bracket assembly can rotate relative to the test head module, a gradually thickened guide inclined plane is arranged at the bottom of the module hanging frame from outside to inside along the loading direction of the test head module, a pin used for limiting or relieving the rotation of the protection bracket assembly is arranged at the tail end of the guide inclined plane, and a rotation limiting groove which is formed by two step positions and used for limiting the rotation of the protection bracket assembly is arranged at the bottom of the test head module, so that the test tool can be effectively protected, and the service life of the test tool can be prolonged.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a semiconductor micro-pad strength test apparatus;
FIG. 2 is a schematic diagram of a semiconductor micro solder joint strength test tool protection device according to the present invention;
FIG. 3 is a schematic view of the structure of a test head module and module rack;
FIG. 4 is a side view of a semiconductor micro-pad strength test apparatus;
FIG. 5 is a top view of a semiconductor micro-pad strength test apparatus;
FIG. 6 is a schematic view of the structure of the guide ramp;
FIG. 7 is a schematic view of a modular hanger;
FIG. 8 is a schematic structural view of a protective bracket assembly;
FIG. 9 is a schematic view of the structure of a modular riser;
FIG. 10 is a schematic structural view of a module housing;
FIG. 11 is a schematic structural view of a module base plate;
FIG. 12 is a schematic representation of the attitude of the protective cradle assembly after loading of the test head module into the module rack;
fig. 13 is a schematic diagram of the structure of the portion a in fig. 12.
Reference numerals illustrate:
a semiconductor micro solder joint strength test device 1; a test head module 2; a module hanger 3; a module locking screw 4; copper briquettes 5; an electrical connection block 6; a test tool 7; a protective bracket assembly 8; a rotation restricting groove 9; a guide slope 10; a pin 11; a mounting hole 12; a sensor 13; an L-shaped round bar 14; a spring 15; a connecting rod 16; a baffle 17; a module base plate 18; a module housing 19; a module riser 20; a avoidance space 21; a rotation hole 22; the holding groove 23 is rotated.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present invention, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" as it appears throughout includes three parallel schemes, for example "A and/or B", including the A scheme, or the B scheme, or the scheme where A and B are satisfied simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
Referring to fig. 1 to 13, the present invention provides a protection device for a semiconductor micro solder joint strength test tool, which is applied to a semiconductor micro solder joint strength test apparatus 1, wherein the semiconductor micro solder joint strength test apparatus 1 comprises a test head module 2 and a module hanger 3, a copper pressing block 5 is mounted on the top of the module hanger 3 through a module locking screw 4, and an electrical connection block 6 is disposed on one side of the test head module 2.
The semiconductor micro solder joint strength testing tool 7 is mounted at the lower end of the testing head module 2, the testing head module 2 is slidably mounted on the module hanging frame 3, the preferred embodiment of the semiconductor micro solder joint strength testing tool protecting device comprises a protecting bracket component 8 which is mounted below the testing head module 2 and used for protecting the testing tool 7, the protecting bracket component 8 can rotate relative to the testing head module 2, a rotation limiting groove 9 used for limiting the rotating motion of the protecting bracket component 8 is arranged at the bottom of the testing head module 2, a gradually thickened guide inclined plane 10 is arranged at the bottom of the module hanging frame 3 from outside to inside along the loading direction of the testing head module 2, and a pin 11 used for limiting or releasing the rotating motion of the protecting bracket component 8 is arranged at the tail end of the guide inclined plane 10, wherein the pin 11 is preferably cylindrical.
Specifically, the end of the guide slope 10 is provided with a mounting hole 12 for mounting the pin 11. The pin 11 is mounted in the mounting hole 12.
In this embodiment, the sensor 13 is mounted at the lower end of the test head module 2, and the semiconductor micro solder joint strength test tool 7 is mounted at the lower end of the sensor 13.
Specifically, in this embodiment, the protection bracket assembly 8 includes an L-shaped round bar 14, an L-shaped blocking piece mechanism fixedly connected with the L-shaped round bar 14, and a spring 15, where the L-shaped blocking piece mechanism includes a connecting bar 16 and a blocking piece 17 located at the lower end of the connecting bar 16, the upper end of the connecting bar 16 is fixedly connected with the L-shaped round bar 14, one end of the L-shaped round bar 14 rotates and penetrates through the inside of the test head module 2, the spring 15 is sleeved at one end of the L-shaped round bar 14, one end of the spring 15 is abutted with the upper end of the connecting bar 16, and the other end of the spring is abutted with the test head module 2.
The test head module 2 comprises a module bottom plate 18, a module shell 19 detachably connected with the module bottom plate 18, and a module vertical plate 20 arranged at the bottoms of the module bottom plate 18 and the module shell 19, wherein the module vertical plate 20 is provided with the rotation limiting groove 9, and the rotation limiting groove 9 comprises two step structures.
In this embodiment, the rear end of the module riser 20 is provided with a protective bracket assembly 8 to avoid the space 21.
The middle part of the lower end of the module shell 19 is provided with a rotary hole 22 for protecting the round rod 14 of the support, and one end of the L-shaped round rod 14 is arranged in the rotary hole 22 of the round rod 14 in a penetrating way.
In this embodiment, a rotation holding groove 23 for protecting the bracket assembly 8 is provided at the middle part of the lower end of the module bottom plate 18.
The principle of the protection device for the semiconductor micro-welding spot strength testing tool of the invention is explained in detail below.
In the initial state, the test head module 2 is not inserted into the module hanging frame 3, the blocking piece 17 of the protection bracket assembly 8 is opened downwards, the protruding blocking piece 17 can protect the sensor 13 protruding from the test head module 2 and the test tool 7 mounted on the sensor 13, and at the moment, the L-shaped round bar 14 is clamped at the low step position of the rotation limiting groove 9, at the moment, the rotation actions of the protection bracket assembly 8 and the blocking piece 17 are limited, so that the protection of the sensor 13 protruding from the test head module 2 and the test tool 7 mounted on the sensor 13 can be realized.
When the test head module 2 is used, the test head module 2 is inserted along the guide groove of the module hanging frame 3, during the insertion process, the end face of the L-shaped round rod 14 rubs against the guide inclined plane 10 at the lower end of the module hanging frame 3, and along with the whole entering of the test head module 2, the whole protection bracket assembly 8 is jacked up, so that the L-shaped round rod 14 is separated from the bottom of the rotation limiting groove 9, the rotation limitation of the protection bracket assembly 8 is released, and at the moment, one end of the L-shaped round rod 14 contacts the pin 11 arranged at the middle part of the lower end of the module hanging frame 3; as the test head module 2 continues to be inserted, the protective L-shaped round bar 14 is blocked by the pin 11, and the protective bracket assembly 8 rotates around the pin 11 because the rotation restriction of the protective bracket assembly 8 is released at this time, when the test head module 2 is fully inserted into place, the protective bracket assembly 8 also rotates into place and is in a pressed state, and at this time the blocking piece 17 also rotates into place, and the protruding blocking piece 17 thereof is retracted into the avoidance space 21; so that the protective cradle assembly 8 does not interfere with the proper operation of the test head module 2;
when the test head module 2 is ready to be pulled out, the test head module 2 is pulled out along the guide groove of the module hanging frame 3, during the pulling out process, the protection bracket component 8 in a pressed state rebounds, and the action of the spring 15 is added, during the pulling out process of the test head module 2, the L-shaped round rod 14 reversely rotates around the pin 11, when the protection bracket component 8 is positioned to the guide inclined surface 10 at the lower end of the module hanging frame 3, the protection bracket component 8 is in a downward state, and as the test head module 2 is completely and slowly separated from the guide inclined surface 10, the L-shaped round rod 14 is also slowly clamped into the rotation limiting groove 9, and when the test head module 2 is completely pulled out, the L-shaped round rod 14 is completely clamped into the rotation limiting groove 9. Thereby achieving protection of the sensor 13 and the test tool 7 mounted on the sensor 13.
The protection device for the semiconductor micro-welding spot strength testing tool has the beneficial effects that: according to the technical scheme, the test head module comprises the protection bracket assembly which is arranged below the test head module and used for protecting the test tool, the protection bracket assembly can rotate relative to the test head module, a gradually thickened guide inclined plane is arranged at the bottom of the module hanging frame from outside to inside along the loading direction of the test head module, a pin used for limiting or relieving the rotation of the protection bracket assembly is arranged at the tail end of the guide inclined plane, and a rotation limiting groove which is formed by two step positions and used for limiting the rotation of the protection bracket assembly is arranged at the bottom of the test head module, so that the test tool can be effectively protected, and the service life of the test tool can be prolonged.
In order to achieve the above objective, the present invention further provides a semiconductor micro solder joint strength testing device, which includes the semiconductor micro solder joint strength testing tool protection device as described above, and the structure and the function principle of the semiconductor micro solder joint strength testing tool protection device are described in detail above, and are not repeated here.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the specification and drawings of the present invention or direct/indirect application in other related technical fields are included in the scope of the present invention.
Claims (7)
1. The semiconductor micro-welding spot strength test tool protection device is characterized in that a semiconductor micro-welding spot strength test tool is arranged at the lower end of a test head module, the test head module is slidably arranged on a module hanging frame, the semiconductor micro-welding spot strength test tool protection device comprises a protection bracket component which is arranged below the test head module and is used for protecting the test tool, the protection bracket component can rotate relative to the test head module, a gradually thickened guide inclined plane is arranged at the bottom of the module hanging frame along the loading direction of the test head module from outside to inside, a pin used for limiting or relieving the rotation of the protection bracket component is arranged at the tail end of the guide inclined plane, and a rotation limiting groove used for limiting the rotation of the protection bracket component is arranged at the bottom of the test head module;
the protection bracket assembly comprises an L-shaped round rod, an L-shaped baffle mechanism and a spring, wherein the L-shaped baffle mechanism is fixedly connected with the L-shaped round rod, the L-shaped baffle mechanism comprises a connecting rod and a baffle positioned at the lower end of the connecting rod, the upper end of the connecting rod is fixedly connected with the L-shaped round rod, one end of the L-shaped round rod is rotatably arranged in the test head module in a penetrating manner, the spring is sleeved at one end of the L-shaped round rod, one end of the spring is abutted with the upper end of the connecting rod, and the other end of the spring is abutted with the test head module;
the test head module comprises a module bottom plate, a module shell detachably connected with the module bottom plate and a module vertical plate arranged at the bottoms of the module bottom plate and the module shell, wherein the module vertical plate is provided with a rotation limiting groove, and the rotation limiting groove comprises two step structures.
2. The semiconductor micro solder joint strength test tool protection device according to claim 1, wherein a distal end of the guide slope is provided with a mounting hole for mounting the pin.
3. The semiconductor micro solder joint strength test tool protection device of claim 1, wherein the rear end of the module riser is provided with a protective bracket assembly to avoid voids.
4. The protection device for the semiconductor micro-soldering point strength test tool according to claim 3, wherein a protection bracket round bar rotating hole is formed in the middle of the lower end of the module housing, and one end of the L-shaped round bar is inserted into the round bar rotating hole.
5. The semiconductor micro solder joint strength test tool protection device according to claim 4, wherein a protection bracket assembly rotation holding groove is provided at a lower middle portion of the module base plate.
6. The semiconductor micro solder joint strength test tool protection device according to any one of claims 1 to 5, wherein a sensor is mounted at a lower end of the test head module, and the semiconductor micro solder joint strength test tool is mounted at a lower end of the sensor.
7. A semiconductor micro-pad strength test apparatus, characterized in that the semiconductor micro-pad strength test apparatus comprises the semiconductor micro-pad strength test tool protection device according to any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110814370.9A CN113624938B (en) | 2021-07-19 | 2021-07-19 | Protection device and test equipment for semiconductor micro-welding spot strength test tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110814370.9A CN113624938B (en) | 2021-07-19 | 2021-07-19 | Protection device and test equipment for semiconductor micro-welding spot strength test tool |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113624938A CN113624938A (en) | 2021-11-09 |
| CN113624938B true CN113624938B (en) | 2023-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110814370.9A Active CN113624938B (en) | 2021-07-19 | 2021-07-19 | Protection device and test equipment for semiconductor micro-welding spot strength test tool |
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| CN (1) | CN113624938B (en) |
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| JP2008311313A (en) * | 2007-06-12 | 2008-12-25 | Santo Technology Kk | Semiconductor testing device |
| CN102192877A (en) * | 2010-03-05 | 2011-09-21 | 诺信公司 | Improved clamping mechanism for shear testing apparatus |
| CN104280336A (en) * | 2013-07-03 | 2015-01-14 | 诺信公司 | Bond testing machine and cartridge for a bond testing machine comprising a plurality of test tools |
| CN207623158U (en) * | 2017-11-27 | 2018-07-17 | 达格测试设备（苏州）有限公司 | A kind of novel shearing force test module |
| CN108444908A (en) * | 2017-02-09 | 2018-08-24 | 诺信公司 | Engaging portion test device with integrated lighting system and engaging portion testing cassete |
| CN110631894A (en) * | 2019-10-25 | 2019-12-31 | 深圳市德瑞茵精密科技有限公司 | Multifunctional bonding point testing device |
| CN110842385A (en) * | 2019-11-14 | 2020-02-28 | 桂林电子科技大学 | Test apparatus and control method of test apparatus |
| CN113092363A (en) * | 2021-03-24 | 2021-07-09 | 深圳市德瑞茵精密科技有限公司 | Testing device and method for detecting bonding strength of semiconductor device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5060494B2 (en) * | 2006-02-17 | 2012-10-31 | デイジ プレシジョン インダストリーズ リミテッド | Shear test equipment |
-
2021
- 2021-07-19 CN CN202110814370.9A patent/CN113624938B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008311313A (en) * | 2007-06-12 | 2008-12-25 | Santo Technology Kk | Semiconductor testing device |
| CN102192877A (en) * | 2010-03-05 | 2011-09-21 | 诺信公司 | Improved clamping mechanism for shear testing apparatus |
| CN104280336A (en) * | 2013-07-03 | 2015-01-14 | 诺信公司 | Bond testing machine and cartridge for a bond testing machine comprising a plurality of test tools |
| CN108444908A (en) * | 2017-02-09 | 2018-08-24 | 诺信公司 | Engaging portion test device with integrated lighting system and engaging portion testing cassete |
| CN207623158U (en) * | 2017-11-27 | 2018-07-17 | 达格测试设备（苏州）有限公司 | A kind of novel shearing force test module |
| CN110631894A (en) * | 2019-10-25 | 2019-12-31 | 深圳市德瑞茵精密科技有限公司 | Multifunctional bonding point testing device |
| CN110842385A (en) * | 2019-11-14 | 2020-02-28 | 桂林电子科技大学 | Test apparatus and control method of test apparatus |
| CN113092363A (en) * | 2021-03-24 | 2021-07-09 | 深圳市德瑞茵精密科技有限公司 | Testing device and method for detecting bonding strength of semiconductor device |
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|---|---|
| CN113624938A (en) | 2021-11-09 |
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Effective date of registration: 20221102 Address after: 518000 604-33, 6 / F, building 1, meinian International Plaza, west of Nanhai Avenue, zhaoshang street, Nanshan District, Shenzhen City, Guangdong Province Applicant after: SHENZHEN TRY PRECISION TECHNOLOGY CO.,LTD. Address before: 518000 floor 1, building A17, Dahe silicon valley power Qinghu Park, Longhua street, Longhua new area, Shenzhen, Guangdong Applicant before: Shenzhen deruiyin Intelligent Technology Co.,Ltd. |
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