JP6666674B2 - socket - Google Patents

Description

  The present invention relates to a socket for mounting an electronic component, and more particularly, to a socket for preventing contact pins of the socket from being damaged.

  In recent years, a user or an OEM (Original Equipment Manufacturer) vendor often mounts electronic components such as a CPU (Central Processing Unit) for each application on a motherboard or a barebone product of an information processing apparatus. For this reason, the contact pin of the socket is often damaged due to a mismatch between the shape of the electronic component and the socket on which the electronic component is mounted (hereinafter, simply referred to as a “socket”), a mistake during operation, or the like. In a normal socket, a plastic cover for protecting a contact pin is often attached to a cover of the socket for holding down an electronic component. However, when an electronic component is mounted on the socket, the operation is performed by opening the cover of the socket. Therefore, there is a problem that the contact pins are exposed and are not protected during the period from when the socket lid is opened to when the electronic component is mounted.

  In many cases, the socket is fixedly mounted on the circuit board. For this reason, there is a problem that a large amount of cost and a large amount of time are required for repairing or replacing the circuit board due to breakage of the contact pins of the socket.

  Patent Document 1 discloses an example of a socket technology for preventing a contact of an electronic device from being damaged. The socket of Patent Literature 1 houses an electronic device on which electronic components are mounted and which has a case, in a cavity defined by a main body and a lid. The main body is provided with a pedestal on which the electronic device is mounted, and a probe pin as a terminal contact unit connected to a terminal of the electronic device. The lid has a first head connected to the lid upper member via a first spring, and a second head connected to the first head via a second spring. Then, the first head presses the peripheral portion of the circuit board of the electronic device, while the second head presses the upper wall surface of the case. As a result of the above configuration, the socket of Patent Document 1 prevents deformation and breakage of an electronic device such as an electronic component package when the electronic device is connected to the terminal contact unit.

  Patent Document 2 discloses an example of a socket technology for preventing breakage of an electric component. The socket of Patent Literature 2 includes a socket body in which a package having a plurality of solder balls on the lower surface of the package body is housed on a housing surface portion, and a contact pin provided in the socket body. The tip of the contact pin is located in the floating plate and is vertically movable by a plunger mechanism. In the socket of Patent Literature 2, a ball guide for positioning a downwardly protruding positioning ball formed on the lower surface of the package is formed on the housing surface portion. In the socket of Patent Literature 2, when the package is positioned, the side surface formed around the package comes into contact with another component. As a result of the above configuration, the socket of Patent Literature 2 positions the electric component at a predetermined position without damaging the side surface around the electric component.

  Patent Document 3 discloses an example of a socket technology for preventing breakage of a contact of an electric circuit. In the socket of Patent Document 3, when the package mounted on the socket is pressed downward, the external contact contacts the upper terminal portion of the upper contact terminal, and the upper contact terminal moves down against the elastic force of the coil spring. . The upper terminal portion of the upper contact terminal is located in the elevating plate, and is vertically movable by a plunger mechanism. Then, the left and right elastic pieces are expanded by the tapered contact pieces against their own elastic force. At this time, since the left and right elastic pieces firmly hold the tapered contact piece by their resilient restoring force, conduction between the upper contact terminal and the lower contact terminal is reliably ensured. As a result of the above configuration, the socket of Patent Document 3 performs stable contact with a simple structure while minimizing the contact pressure on the external contact of the package.

  In the techniques of Literature 2 and Literature 3, the upper ends of the contact pins of the socket are located in the plate, so that they are protected from lateral bending.

JP 2013-008499 A JP 2007-317365 A JP 2006-310025 A

However, the techniques of Literature 2 and Literature 3 employ a plunger mechanism including a spring in order to move the upper end of the contact pin of the socket in the vertical direction, and have a problem that the structure of the socket is complicated. is there.
(Object of the invention)
A main object of the present invention is to provide a socket having a simple structure and capable of preventing breakage of a contact pin.

  The socket of the present invention is a contact pin having elasticity and conductivity, which is electrically connected to each terminal of the electronic component, a pedestal to which the lower end of the contact pin is fixed, and an individual through which each contact pin can pass. A protective cover which is a plate-shaped insulator having a hole, and when the protective cover is not pressed downward, the contact pin extends and the upper end of the contact pin is located in the hole, and the upper end of the contact pin is An elastic body that holds the protective cover on the pedestal so that the protective cover is pushed upward when the protective cover is pressed downward by the electronic component so as to contact the terminal.

  ADVANTAGE OF THE INVENTION According to this invention, there exists an effect that a socket has a simple structure and can prevent damage of a contact pin.

It is a sectional view showing an example of the composition of the socket of a 1st embodiment of the present invention. It is sectional drawing which shows an example of a structure of the socket of 2nd Embodiment of this invention. It is sectional drawing which shows an example of a structure of the socket of 3rd Embodiment of this invention. It is sectional drawing which shows an example of a structure of the socket of 4th Embodiment of this invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In all the drawings, the same components are denoted by the same reference numerals, and description thereof will not be repeated.
(First embodiment)
The configuration in the present embodiment will be described.

  FIG. 1 is a sectional view showing an example of the configuration of the socket 100 according to the first embodiment of the present invention. FIG. 1A is a cross-sectional view illustrating an example of the configuration of the socket 100 in a state where no electronic component is mounted. FIG. 1B is a cross-sectional view illustrating an example of a configuration of the socket 100 in a state where electronic components are mounted.

  The socket 100 of the present embodiment is installed on an external circuit board 200, and detachably mounts an external electronic component 300. The electronic component 300 is any electric circuit element having a terminal on the bottom surface. The electronic component 300 includes, for example, a CPU, an LSI (Large Scale Integration), and a small circuit board. The socket 100 includes a pedestal 120, a contact pin 110, a protective cover 130, and an elastic body 150.

  The pedestal 120 is a plate-shaped member and is installed on the circuit board 200. The lower end of the contact pin 110 is fixed to the pedestal 120. In the present embodiment, the angle at which the lower end of the contact pin 110 is fixed to the pedestal 120 is not limited. The angle at which the lower end of the contact pin 110 is fixed to the pedestal 120 may be vertical or oblique. The pedestal 120 may have a side surface surrounding the edge of the plate above the plate-shaped member.

  Contact pins 110 electrically connect terminals 310 and circuit board 200. The contact pin 110 is a linear member having elasticity and conductivity. The contact pins 110 are, for example, metal wires. The contact pin 110 is in an extended state when the electronic component 300 is not mounted on the socket 100. When the electronic component 300 is mounted on the socket 100, the contact pin 110 contacts the terminal 310 at an upper end in a bent state. In the present embodiment, the angle at which the upper end of the contact pin 110 contacts the electronic component 300 is not limited. The angle at which the upper end of the contact pin 110 contacts the electronic component 300 may be vertical or oblique.

  The protective cover 130 is a plate-shaped insulator and protects the contact pins 110 from external physical impact. The protective cover 130 has individual holes 140 through which each contact pin 110 can pass. Note that the protective cover 130 has a sufficient thickness to protect the upper end of the contact pin 110. The direction in which the hole 140 penetrates is substantially parallel to the direction of the contact pin 110.

  The elastic body 150 is connected to the protective cover 130 and the pedestal 120. The elastic body 150 holds the protective cover 130 so that the upper end of the contact pin 110 is located inside the hole 140 when the electronic component 300 is not mounted on the socket 100. When pressed from above, the protective cover 130 moves in a direction substantially parallel to the contact pins 110. The elastic body 150 positions the upper end of the contact pin 110 in the hole 140 of the protective cover 130 when the protective cover 130 is not pressed downward. When the protective cover 130 is pressed downward by the electronic component 300 such that the upper end of the contact pin 110 contacts the terminal 310, the elastic body 150 generates a repulsive force that pushes the protective cover 130 upward. The elastic body 150 includes a spring, resin, rubber, and the like.

  Next, the operation of the present embodiment will be described.

  As shown in FIG. 1A, when the electronic component 300 is not mounted, since the protective cover 130 is held by the elastic body 150, the upper end of the contact pin 110 is in the hole 140 of the protective cover 130. Located inside. Therefore, the contact pin 110 is protected from external physical impact.

  When mounting the electronic component 300, the electronic component 300 is placed on the protective cover 130 of the socket 100. Even in this state, since the protective cover 130 is held by the elastic body 150, the upper end of the contact pin 110 is located inside the hole 140 of the protective cover 130.

  Next, as shown in FIG. 1B, in order to mount the electronic component 300 in the socket 106, the electronic component 300 is pressed and fixed downward. At this time, since the electronic component 300 presses the protective cover 130, the protective cover 130 is pressed down. Therefore, the upper end of the contact pin 110 contacts the terminal 310. As a result, the contact pin 110 bends and reliably contacts the terminal 310.

  As described above, in the socket 100 of the present embodiment, the protective cover 130 for protecting the contact pins 110 is held on the pedestal 120 by the elastic body 150. Therefore, when the electronic component 300 is not mounted on the socket 100, the contact pins 110 are protected by the protection cover 130. On the other hand, when the electronic component 300 is mounted on the socket 100, the contact pins 110 and the terminals 310 come into contact with each other in a state where the contact pins 110 are protected by the protective cover 130. In the socket 100 of the present embodiment, the contact pins 110 are linear members (metal wires or the like) having elasticity and conductivity. That is, in the socket 100 of the present embodiment, it is not necessary to use a complicated structure such as a plunger for the contact pin. Therefore, the socket 100 of the present embodiment has an effect that it has a simple structure and can prevent damage to the contact pins.

  Further, in the socket 100 of the present embodiment, the protective cover 130 protects the contact pins 110 of the socket 100. Therefore, the socket 100 of the present embodiment has an effect that a plastic cover attached to a cover of a normal socket is unnecessary.

  In addition, in the socket 100 of the present embodiment, a plastic cover that is attached to a cover of a normal socket is unnecessary, so that there is no need to remove the plastic cover when the electronic component 300 is attached. Therefore, the socket 100 of the present embodiment has an effect that the work of mounting the electronic component 300 is easy.

In the present embodiment, the electronic component 300 may be pressed and fixed downward, and the means is not limited. The electronic component 300 is pressed and fixed, for example, by limiting the height of the electronic component 300 while being pressed from above. Alternatively, the electronic component 300 may be pressed and fixed by fixing the height of the electronic component 300 while being pressed from above. Further, in order to press and fix the electronic component 300 downward, for example, the electronic component 300 may be connected to the pedestal 120 or the circuit board 200. Alternatively, a member (hereinafter, referred to as a “socket cover”) that presses the electronic component 300 downward may be connected to the base 120 or the circuit board 200 in order to press and fix the electronic component 300 downward. Further, the socket cover may also serve as a radiator, for example. Alternatively, the socket cover may be capable of pressing the electronic component 300 downward on the outer periphery of the upper surface of the electronic component 300 and installing a radiator at the center of the upper surface of the electronic component 300.
(Second embodiment)
Next, a socket according to a second embodiment of the present invention based on the socket according to the first embodiment will be described. In the socket of this embodiment, the electronic component is pressed and fixed to the socket by the socket cover connected to the circuit board or the pedestal of the socket by at least one screw. In the following description, the same components as those in the first embodiment are denoted by the same reference numerals, and the description will be appropriately omitted.

  The configuration in the present embodiment will be described.

  FIG. 2 is a cross-sectional view illustrating an example of the configuration of the socket 105 according to the second embodiment of the present invention. FIG. 2A is a cross-sectional view illustrating an example of a configuration of the socket 105 in a state where no electronic component is mounted. FIG. 2B is a cross-sectional view illustrating an example of a configuration of the socket 105 in a state where electronic components are mounted.

  The socket 105 of the present embodiment further includes a socket cover 160, a through hole 180, and a screw hole 190 in addition to the components of the socket 100 of the first embodiment of the present invention.

  The socket cover 160 presses and fixes the electronic component 300 to the socket 105. Socket cover 160 includes screws 170.

  The through hole 180 is a hole through which the screw 170 passes, and is provided in the socket cover 160.

  The screw hole 190 is a screw hole into which the screw 170 is fitted, and is provided on the circuit board 205 or the pedestal 125.

  Screw 170 penetrates through hole 180 and is removably fitted into screw hole 190. The screw 170 presses and fixes the electronic component 300 to the socket 105 by being tightened.

  The other configuration of the socket 105 is the same as the configuration of the socket 100 according to the first embodiment of the present invention.

  Next, the operation of the present embodiment will be described.

  As shown in FIG. 2A, when the electronic component 300 is not mounted, since the protective cover 130 is held by the elastic body 150, the upper end of the contact pin 110 is in the hole 140 of the protective cover 130. Located inside. Therefore, the contact pins 110 are protected.

  When the electronic component 300 is mounted, the electronic component 300 is placed on the protective cover 130 of the socket 105 without the socket cover 160 being installed. Even in this state, since the protective cover 130 is held by the elastic body 150, the upper end of the contact pin 110 is located inside the hole 140 of the protective cover 130.

  Next, as shown in FIG. 2B, a socket cover 160 is installed to mount the electronic component 300 on the socket 105. At this time, since the electronic component 300 presses the protective cover 130, the protective cover 130 is pressed down. Therefore, the upper end of the contact pin 110 contacts the terminal 310 of the electronic component 300. As a result, the contact pin 110 flexes and reliably contacts the terminal 310 of the electronic component 300.

  Other operations of the socket 105 are the same as those of the socket 100 according to the first embodiment of the present invention.

  As described above, the socket 105 of the present embodiment includes the socket 100 of the first embodiment of the present invention. Therefore, the socket 105 of the present embodiment has the same effect as the socket 100 of the first embodiment of the present invention.

  In the socket 105 of the present embodiment, the electronic component 300 is mounted on the socket 105 by pressing the socket cover 160 downward with a screw. Therefore, the socket 105 of the present embodiment has an effect that the electronic component can be easily mounted on the socket.

  FIG. 2 shows an example in which the socket cover 160 presses and fixes the electronic component 300 to the socket 105 using two screws. However, the socket cover 160 of the present embodiment only needs to be able to press and fix the electronic component 300, and the number of screws is not limited to two. In the socket cover 160 of the present embodiment, the electronic component 300 may be pressed and fixed to the socket 105 using three or more screws. Alternatively, in the socket cover 160 of the present embodiment, the electronic component 300 may be pressed and fixed to the socket 105 by using one screw and a guide mechanism that restricts the movable direction of the socket cover 160.

In the above description, the example in which the through hole 180 is provided in the socket cover 160 has been described. However, the through-hole 180 of the present embodiment may be provided in the electronic component 300.
(Third embodiment)
Next, a socket according to a third embodiment of the present invention based on the socket according to the first embodiment will be described. In the socket of the present embodiment, the electronic component is pressed and fixed to the socket by the socket cover connected at least at one end to the circuit board or the pedestal of the socket. In the following description, the same components as those in the first embodiment are denoted by the same reference numerals, and the description will be appropriately omitted.

  The configuration in the present embodiment will be described.

  FIG. 3 is a sectional view showing an example of the configuration of the socket 106 according to the third embodiment of the present invention. FIG. 3A is a cross-sectional view illustrating an example of a configuration of the socket 106 in a state where no electronic component is mounted. FIG. 3B is a cross-sectional view illustrating an example of the configuration of the socket 106 in a state where electronic components are mounted.

  The socket 106 of the present embodiment further includes a socket cover 165 in addition to the components of the socket 100 of the first embodiment of the present invention.

  The socket cover 165 presses and fixes the electronic component 300 to the socket 106. The socket cover 165 includes a connection point 195 and an extension 175. The connection point 195 is connected to the circuit board 200 or the pedestal 120. The extension 175 has rigidity and is fixed to one end of the main body of the socket cover 165. The extension 175 is rotatable about a connection point 195, and the connection point 195 is provided with a ratchet mechanism. The electronic component 300 is pressed and fixed to the socket 106 by the ratchet mechanism. The extension 175 has such a length that the upper end of the contact pin 110 is not exposed from the hole 140 of the protective cover 130 when the socket cover 165 is pressed in a state where the electronic component 300 is not mounted on the socket 106. Have. The extension 175 has such a length that the contact pin 110 bends when the upper end of the contact pin 110 is pressed so as to contact each terminal 310 in a state where the electronic component 300 is mounted on the socket 106. .

  The other configuration of the socket 106 is the same as the configuration of the socket 100 according to the first embodiment of the present invention.

  Next, the operation of the present embodiment will be described.

  As shown in FIG. 3A, when the electronic component 300 is not mounted, since the protective cover 130 is held by the elastic body 150, the upper end of the contact pin 110 is in the hole 140 of the protective cover 130. Located inside. Therefore, the contact pins 110 are protected.

  When the electronic component 300 is mounted, the electronic component 300 is placed on the protective cover 130 of the socket 106 with the socket cover 165 opened. Even in this state, since the protective cover 130 is held by the elastic body 150, the upper end of the contact pin 110 is located inside the hole 140 of the protective cover 130.

  Next, as shown in FIG. 3B, the socket cover 165 is closed to mount the electronic component 300 on the socket 106. At this time, since the electronic component 300 presses the protective cover 130, the protective cover 130 is pressed down. Therefore, the upper end of the contact pin 110 contacts the terminal 310 of the electronic component 300. As a result, the contact pin 110 flexes and reliably contacts the terminal 310 of the electronic component 300.

  Other operations of the socket 106 are the same as those of the socket 100 according to the first embodiment of the present invention.

  As described above, the socket 106 of the present embodiment includes the socket 100 of the first embodiment of the present invention. Therefore, the socket 106 of the present embodiment has the same effect as the socket 100 of the first embodiment of the present invention.

  In the socket 106 of the present embodiment, the electronic component 300 is mounted on the socket 106 by moving the socket cover 165 to an appropriate position. Therefore, the socket 106 of the present embodiment has an effect that the electronic component can be easily mounted on the socket.

In the above description, an example has been described in which the socket cover 165 presses and fixes the electronic component 300 to the socket 106 using a ratchet mechanism. However, the socket cover 165 of the present embodiment only needs to be able to press and fix the electronic component 300, and is not limited to a socket cover using a ratchet mechanism. In the socket cover 165 of the present embodiment, for example, two extension portions 175 may be connected to both ends of the main body of the socket cover 165, and may be connected to the circuit board 200 or the pedestal 120 at two connection points 195. Further, at least one of the two connection points 195 may be detachably connected to the circuit board 200 or the pedestal 120. Further, at least one of the two extension portions 175 may be a flexible member such as an elastic body, plastic, a chain, or a spring.
(Fourth embodiment)
Next, a socket according to a fourth embodiment of the present invention based on the socket according to the first embodiment will be described. In the socket of the present embodiment, the contact pins are obliquely fixed to the pedestal of the socket. In the following description, the same components as those in the first embodiment are denoted by the same reference numerals, and the description will be appropriately omitted.

  The configuration in the present embodiment will be described.

  FIG. 4 is a sectional view showing an example of the configuration of the socket 107 according to the fourth embodiment of the present invention. FIG. 4A is a cross-sectional view illustrating an example of a configuration of the socket 107 in a state where no electronic component is mounted. FIG. 4B is a cross-sectional view illustrating an example of a configuration of the socket 107 in a state where electronic components are mounted.

  The socket 107 of the present embodiment includes a pedestal 120, a contact pin 115, a protective cover 135, and an elastic body 155.

  The contact pin 115 is the same as the contact pin 110 of the first embodiment of the present invention, except that the angle at which the upper end of the contact pin 115 contacts the electronic component 300 is oblique.

  The protection cover 135 is the same as the protection cover 130 according to the first embodiment of the present invention, except that the direction of the hole 145 of the protection cover 135 is oblique.

  The elastic body 155 is the same as the elastic body 150 of the first embodiment of the present invention, except that the moving direction of the upper end of the elastic body 155 is oblique.

  The other configuration of the socket 107 is the same as the configuration of the socket 100 according to the first embodiment of the present invention.

  Next, the operation of the present embodiment will be described.

  As shown in FIG. 4A, when the electronic component 300 is not mounted, since the protection cover 135 is held by the elastic body 155, the upper end of the contact pin 115 is in contact with the hole 145 of the protection cover 135. Located inside. Therefore, the contact pins 115 are protected from external physical impact.

  When the electronic component 300 is mounted, the electronic component 300 is placed on the protective cover 135 of the socket 107. Even in this state, since the protective cover 135 is held by the elastic body 155, the upper end of the contact pin 115 is located inside the hole 145 of the protective cover 135.

  Next, as shown in FIG. 4B, in order to mount the electronic component 300 on the socket 107, the electronic component 300 is pressed and fixed diagonally downward. At this time, since the electronic component 300 presses the protective cover 135, the protective cover 135 is pressed obliquely downward. Therefore, the upper end of the contact pin 115 contacts the terminal 310 from obliquely below. As a result, the plurality of contact pins 115 bend in a specific direction and contact the terminal 310.

  Other operations of the socket 107 are the same as those of the socket 100 according to the first embodiment of the present invention.

  As described above, in the socket 107 of the present embodiment, since the contact pins 115 are installed to be inclined in a specific direction, when the protective cover 135 is pressed obliquely downward, the contact pins 115 are in a specific direction. Easy to bend. On the other hand, if the contact pins are installed vertically on the pedestal, the direction in which the contact pins bend when the protective cover is pushed down is likely to be random. That is, in the present embodiment, the bending directions of the plurality of contact pins 115 are likely to be uniform. However, the elasticity of the contact pin 115 deteriorates due to repeated insertion and removal, and the bending of the contact pin 115 may remain even when the electronic component 300 is not mounted. In other words, even if the bending of the contact pins 115 remains, the relative positional relationship is maintained uniformly by the plurality of contact pins 115, so that the terminal 310 of the electronic component 300 can be compared with the case where the bending directions are random. Poor contact with hardly occurs. Therefore, the socket 107 of the present embodiment has an effect that the contact pins are less likely to be damaged than the effect of preventing the contact pins of the socket 100 of the first embodiment of the present invention from being damaged.

  Although the present invention has been described with reference to the exemplary embodiments, the present invention is not limited to the above exemplary embodiments. Various changes that can be understood by those skilled in the art can be made to the configuration and details of the present invention within the scope of the present invention. For example, in the above embodiment, a material other than metal may be used for the contact pin as long as it has elasticity and conductivity.

  INDUSTRIAL APPLICABILITY The present invention can be used in information processing devices such as personal computers and servers, and electronic devices.

100, 105, 106, 107 Socket 110, 115 Contact Pin 120, 125 Pedestal 130 Protective Cover 140, 145 Hole 150, 155 Elastic Body 160, 165 Socket Cover 170 Screw 175 Extension 180 Through Hole 190 Screw Hole 195 Connection Point 200, 205 circuit board 300 electronic component 310 terminal

Claims (5)

A contact pin having elasticity and conductivity, which is electrically connected by contacting each terminal of the electronic component,
A pedestal to which the lower end of the contact pin is fixed,
A protective cover which is a plate-shaped insulator having individual holes through which the contact pins can pass,
When the protective cover is not pressed downward, the contact pins extend and the upper ends of the contact pins are located in the holes, and the protective pins are so arranged that the upper ends of the contact pins contact the respective terminals. A socket comprising: an elastic body that holds the protective cover on the pedestal so as to push up the protective cover when the cover is pressed downward by the electronic component,
A socket cover for pressing the electronic component downward so that the protective cover is pressed downward by the electronic component such that an upper end of the contact pin contacts the terminal;
A screw tip is fitted in a screw hole provided in the pedestal or the circuit board to which the pedestal is fixed, penetrates a through-hole provided in the socket cover, and rotates the head to rotate the head. A socket further comprising a screw for holding the position. The socket according to claim 1, wherein the contact pin is obliquely contacted with the electronic component. The socket cover, the electronic component radiator socket according to claim 1 or 2 in. The socket cover, the presses the electronic part downward in the outer periphery of the upper surface of the electronic component, the socket according to claim 1 or 2 radiator is capable placed in the center of the upper surface of the electronic component. The contact pin socket according to any one of claims 1 to 4 which is a metal wire.

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