JP5349979B2 - Connected device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connecting device which is further compact in the height direction, can further reduce breakage of a contact member in a state where the device is connected to a substrate, and can further ensure electric connection of a terminal of an integrated circuit with a terminal on the substrate. <P>SOLUTION: In a socket 20, a contact 23 is fixed to an opening part 22 of a support member 21 on a fixed end 23a side, and the support member 21 is disposed between a package 50 and a substrate 10 and fixed while pressing them by a retainer 30. The contact 23 contacts with a substrate-side terminal 12 on a moving end 23b side, and includes a contact part 23c contacting with a solder ball 52 between the end parts, the moving end 23b being formed toward the substrate 10. Since the contact 23 is fixed within the opening of the support member 21, the package 50 and the substrate 10 can be easily disposed adjacently to each other. Since the moving end 23b contacts with the substrate 10 side, the contact 23 is hardly caught from the outside and hardly break. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a connection device.

  Conventionally, as a connecting device, two or more conductive cantilevers (contacts) fixed to an insulating sheet at one end are formed upward and downward and pressed by a spherical terminal of an integrated circuit. For example, a spherical terminal, two or more cantilever beams, and a terminal formed on a substrate disposed below are electrically connected (see, for example, Patent Document 1). Further, in Patent Document 1, a free end of a conductive cantilever fixed to an insulating sheet at one end is formed upward, and is formed downward by being pushed down by a spherical terminal of an integrated circuit. Also described are those that are also electrically connected to terminals on the substrate. In addition, there has been proposed one in which conductive bumps are provided on the upper and lower surfaces of an insulating film to electrically connect the terminals of the integrated circuit and the terminals on the substrate (for example, see Patent Document 2). In addition, the spring contacts that connect with the free ends formed in the diagonally upward direction are fixed to the conductive parts formed upward from the spherical terminals that connect to the contacts on the board, and the contacts are arranged at high density. What can be done has been proposed (see, for example, Patent Document 3). Further, the contact formed in a J-shape is fixed, the lower end of the J-shape is connected to the terminal on the substrate, and the upper end of the J-shape is electrically connected to the spherical terminal of the integrated circuit, thereby increasing the height of the contact. A device for increasing the density has been proposed (see, for example, Patent Document 4).

JP 2001-167857 A (FIGS. 14 and 16) JP-A-11-111889 JP 2005-019284 A JP 2003-123924 A

  However, in the connector disclosed in Patent Document 1, Patent Document 3, 4 or the like, in a state where the connector is disposed on the substrate, the contact portion forms a free end upward so that an integrated circuit or the like can be attached. Because the free end of the connector is exposed, the related parts, jigs, tools, etc. that exist around it are caught and damaged during the work from the manufacture of the connector to the precise installation of the integrated circuit. There was a problem. For example, when used as a test socket, the integrated circuit is removed and used many times, and when the electrical connectivity deteriorates after multiple use, the electrical connectivity is restored by cleaning the contact portion. However, since a brush or the like is used, there is a problem that the brush tip and the free end contact are caught and the contact is damaged. Further, in the connection device of Patent Document 2, the problem that the number of contacts per connection is large and the resistance is high, and the insulating film that is thinly processed to reduce the height (compact in the vertical direction) has a mechanical strength. There was a problem of durability against environmental aspects such as surface and temperature changes. Further, the connection device disclosed in Patent Document 3 has a problem that the contact has a long shape upward, is not suitable for low profile, and the contact has a complicated shape.

  The present invention has been made in view of the above problems, and further reduces the height direction, further suppresses damage to the contact member in a state where the contact member is connected to the substrate, and the terminals and the substrate of the integrated circuit. A main object is to provide a connection device that can more reliably electrically connect the upper terminal.

  The present invention adopts the following means in order to achieve the above-mentioned object.

That is, the connection device of the present invention is
A connection device for connecting an integrated circuit having terminals and a substrate having terminals,
One end side is fixed so as to be positioned between the integrated circuit and the substrate, and the other end is a moving end that contacts a terminal on the substrate, and the integration is between the fixed end and the moving end. One or more contact members having electrical conductivity formed from the fixed end to the terminal side on the substrate through the terminal side of the integrated circuit from the fixed end;
A support member provided with one or more openings, and fixing a fixed end of the contact member to an opening edge of the openings;
A holding member for fixing the integrated circuit and the substrate at an appropriate position in a state where the support member is disposed between the integrated circuit and the substrate;
It is equipped with.

  In this connection device, the contact member is fixed to the opening of the support member, and the support member is disposed between the integrated circuit and the substrate and is fixed in a state where they are pressed by the holding member. The contact member is fixed to the support member on the fixed end side, contacts the terminal on the substrate on the moving end side, a contact portion that contacts the terminal of the integrated circuit is formed between the end portions, and the moving end is It is formed toward the substrate side. Thus, since the contact member is fixed inside the opening of the support member, it is easy to arrange the integrated circuit and the substrate close to each other. Further, since the moving end side of the contact member faces the substrate side facing the integrated circuit, when the integrated circuit is mounted or the contact member is cleaned in a state where the connection device is connected to the substrate, etc. It is difficult for the contact member to be caught, and bending or breakage of the contact member can be suppressed. Therefore, it is possible to make the height direction more compact, to further prevent damage to the contact member in a state where it is connected to the substrate, and to more reliably electrically connect the terminal of the integrated circuit and the terminal on the substrate. Can do.

  In the connection device of the present invention, the integrated circuit may include a spherical terminal, and the contact member may be formed with a contact hole into which the spherical terminal fits in the contact portion. If it carries out like this, a contact member and the spherical terminal of an integrated circuit will be easy to contact more reliably.

  In the connection device of the present invention, the contact member may be configured such that the contact portion is formed with a width larger than the fixed end and the moving end. If it carries out like this, a contact member and the spherical terminal of an integrated circuit will be easy to contact more reliably. Moreover, it is easy to form a contact hole in a contact part.

  In the connection device of the present invention, the contact member may be formed of a flexible leaf spring. In this way, when the integrated circuit and the substrate are fixed to each other at appropriate positions, the terminals of the integrated circuit and the terminals on the substrate can be more reliably electrically connected. At this time, the connection device of the present invention is disposed between the holding member and the substrate and is inserted into a communication hole provided in the support member, and the support member is connected to the integrated circuit side and the substrate side. A guide member that leads to the integrated circuit, a space in which a terminal of the integrated circuit and the contact member are in contact with each other, a first spacer disposed between the integrated circuit and the support member, the contact member and the substrate It is good also as what was provided with the 2nd spacer arrange | positioned between the said supporting member and the said board | substrate provided in the space which contacts this terminal. In this way, the support member can move between the integrated circuit side and the substrate side, and the first and second spacers can suppress the support member from contacting the integrated circuit or the substrate, It is possible to more reliably electrically connect the terminals of the integrated circuit and the terminals on the substrate by suppressing the occurrence of breakage of the contact member due to excessive displacement.

The block diagram which shows the outline of a structure of the socket 20. FIG. Explanatory drawing of the contact 23. FIG. Explanatory drawing of the 1st spacer 41. FIG. Explanatory drawing of the socket 20 which mounted | wore with the package 50. FIG. Explanatory drawing of the package 50. FIG. FIG. The explanatory view which fixed socket 20 to substrate 10. FIG.

  Next, modes for carrying out the present invention will be described with reference to the drawings. FIG. 1 is a configuration diagram showing an outline of the configuration of a socket 20 according to an embodiment of the present invention, and FIG. 2 is an explanatory diagram of the contact 23 (viewed in A of FIG. 1). 3 is an explanatory view of the first spacer 41 (viewed in B of FIG. 1), FIG. 4 is an explanatory view of the socket 20 in which the package 50 is mounted, and FIG. 5 is an explanatory view of the package 50. It is. The socket 20 of the present embodiment is configured as a BGA (Ball Grid Array) type connection device that electrically connects a package 50 having solder balls 52 as spherical terminals and a substrate 10 having substrate-side terminals 12. ing. The socket 20 includes a support member 21 disposed between the substrate 10 and the package 50 to which a contact 23 for electrical connection is fixed, and a first spacer disposed between the support member 21 and the substrate 10. 41, the second spacer 42 disposed between the support member 21 and the package 50, and the fixing bolt 31 to fix the substrate 10, the support member 21, the first spacer 41, and the second spacer 42 in a pressed state. And a retainer 30. The socket 20 can be used as a connection device for mounting the package 50, for example, as a connection device for high-frequency testing of the package 50.

  As shown in FIG. 1, the substrate 10 is a circuit substrate provided with an electronic circuit (not shown), and a plurality of substrate-side terminals 12 electrically connected to the electronic circuit are disposed on the surface thereof. . A socket 20 for passing an electrical signal from the package 50 to the board-side terminal 12 is fixed to the board 10. A communication hole 14 into which the guide pin 36 is inserted is formed in the substrate 10.

  As shown in FIG. 2, the support member 21 is a flat plate member that fixes the contact 23, and is formed of an insulating member. In the support member 21, a plurality of inclined rectangular openings 22 are formed in a lattice shape, and a fixed end 23 a of a contact 23 is sandwiched and fixed to an opening edge of the opening 22. The support member 21 is disposed by the retainer 30 so as to be positioned between the package 50 and the substrate 10, and will be described later in detail, but is guided by the guide pins 36 and moved to the package 50 side and the substrate 10 side. Supported as possible. The contact 23 is formed of a conductive and flexible leaf spring, and is a member that electrically connects the solder ball 52 and the board-side terminal 12. One contact 23 is fixed to each opening 22 of the support member 21 so as to be positioned between the package 50 and the substrate 10. The contact 23 is a fixed end 23 a fixed at one end to the support member 21, and the other end is a moving end 23 b in contact with the board-side terminal 12 on the substrate 10, and between the fixed end 23 a and the moving end 23 b. Have a contact portion 23 c that contacts the solder ball 52. The contact 23 is formed to be bent from the fixed end 23a to the board side terminal 12 side through the solder ball 52 side. The contact 23 is in a state where the contact portion 23 c protrudes from the upper surface of the support member 21, and is fixed to the opening edge of the opening portion 22 with the moving end 23 b protruding from the lower surface of the support member 21. Further, the contact 23 has a contact portion 23c formed with a width larger than the fixed end 23a and the moving end 23b, and a contact hole 23d into which the solder ball 52 is fitted is formed in the contact portion 23c (the middle part of FIG. 2). Refer to the figure below). Thus, since the contact part 23c is wide, it is easy to form the contact hole 23d, and the solder ball 52 easily contacts the opening edge of the contact hole 23d.

  The retainer 30 is configured as a holding member that presses the package 50 and the substrate 10 and fixes them in an appropriate position with the support member 21 disposed between the package 50 and the substrate 10. The retainer 30 is formed with a mounting opening 30 a for mounting the package 50. The retainer 30 includes a through hole 30b into which the columnar portion 32 of the fixing bolt 31 is inserted, a communication hole 33 into which the guide pin 36 is inserted, the support member 21 and the second spacer 42 on the package 50 side and the substrate 10 side. A moving space 34, which is a space used when moving to, is formed. Further, as shown in FIG. 5, the retainer 30 is provided with a biasing portion 37 that is a spring mechanism that abuts against the package 50 and biases toward the locking portion 38, and a protruding locking portion 38 faces each other. Thus, a plurality of openings are formed in the opening of the mounting opening 30a. In the retainer 30, when the package 50 is inserted into the mounting opening 30 a and pushed into the substrate 10, the urging portion 37 urges the package 50 toward the locking portion 38, and the package 50 is pushed to a predetermined fixed position. Then, the outer peripheral portion of the package 50 is locked to the locking portion 38, so that the package 50 is fixed in a state of being pressed to the substrate 10 side. The guide pin 36 is disposed between the retainer 30 and the substrate 10 and is inserted into a communication hole 21 a provided in the support member 21 to guide the support member 21 to the package 50 side and the substrate 10 side. It is configured as. The guide pin 36 is formed in a shape in which two cylindrical bodies having different radii are connected, and a through hole 36a into which the columnar portion 32 of the fixing bolt 31 is inserted is formed at the center thereof. The guide pins 36 are inserted into the communication holes 21a of the support member 21 and the communication holes 42c of the second spacer 42, and guide these members along the outer peripheral surface to the package 50 side and the substrate 10 side (vertical direction).

  As shown in FIG. 3, the first spacer 41 is a flat plate member having an insulating property in which a plurality of insertion holes 41 a as a space where the contact 23 and the substrate-side terminal 12 come into contact are formed in a lattice shape. The first spacer 41 has an outer shape that is slightly larger than the support member 21 and is fixed on the substrate 10 by being sandwiched by the retainer 30 (see the lower diagram of FIG. 1). In the first spacer 41, when the support member 21 moves up and down by the spring force of the contact 23, the lower surface of the support member 21 contacts the upper surface 41 b of the first spacer 41, so that the support member 21 contacts the substrate 10. It is a member which prevents. The first spacer 41 can protect the support member 21 and the contact 23. The first spacer 41 is formed with a communication hole 41c into which the guide pin 36 is inserted (see the lower diagram in FIG. 1).

  The second spacer 42 is an insulative flat plate member provided with an insertion port 42 a as a space where the solder ball 52 and the contact 23 come into contact. The second spacer 42 has the same outer shape as the support member 21 and is supported by the guide pin 36 so as to move up and down the moving space 34 together with the support member 21 (also with the package 50). Between the two. In the second spacer 42, when the support member 21 moves up and down by the spring force of the contact 23, the upper surface 42 b of the second spacer 42 contacts the upper surface of the moving space 34 of the retainer 30, so that the support member 21 moves to the package 50. It is a member that prevents contact. The second spacer 42 can protect the support member 21 and the contact 23. The second spacer 42 is formed with a communication hole 42c into which the guide pin 36 is inserted (see the lower diagram in FIG. 1).

  As shown in FIGS. 4 and 5, the package 50 is configured as a BGA type integrated circuit in which solder balls 52 arranged in a lattice shape are arranged on the bottom surface. The package 50 is formed in an outer shape slightly smaller than the size of the mounting opening 30a, and is mounted on the socket 20 in a removable state.

  Next, the operation when the socket 20 is attached to the substrate 10 and the package 50 is attached to the attached socket 20 will be described. FIG. 6 is an exploded view of the socket 20, and FIG. 7 is an explanatory diagram in which the socket 20 is fixed to the substrate 10. First, as shown in FIG. 6, guide pins 36 are inserted into the communication holes 14 of the substrate 10, and the communication holes 41 c of the first spacer 41, the communication holes 21 a of the support member 21, and the second spacers 42 are inserted into the guide pins 36. The communication hole 42c and the communication hole 33 of the retainer 30 are inserted, and the substrate 10, the first spacer 41, the support member 21, the second spacer 42, and the retainer 30 are placed in this order from the bottom. Then, the insertion hole 41a of the first spacer 41 is disposed above the substrate side terminal 12, the contact 23 can come into contact with the substrate side terminal 12, and the insertion port 42a of the second spacer 42 is formed above the contact portion 23c of the contact 23. In addition, the mounting port 30a of the retainer 30 is disposed, and the solder ball 52 can come into contact with the contact portion 23c. Next, the columnar portion 32 of the fixing bolt 31 is inserted into the through hole 36a of the guide pin 36, and the substrate 10, the first spacer 41, the support member 21, the second spacer 42, and the retainer 30 are fixed by the fixing bolt 31 ( (See FIG. 7). At this time, the moving end 23 b of the contact 23 comes into contact with the substrate-side terminal 12, and the support member 21 and the second spacer 42 are guided and held by the guide pin 36 in a state where the support member 21 and the second spacer 42 are lifted by the contact 23. Note that the height X of the moving space 34 (see FIG. 7) is formed larger than the thickness of the support member 21 and the second spacer 42, and the support member 21 and the second spacer 42 are guided by the guide pins 36. It can move up and down.

  Subsequently, the package 50 is inserted from the mounting opening 30a. When the package 50 is moved to the substrate 10 side, the urging portion 37 provided at the opening of the mounting opening 30a urges the package 50 to the locking portion 38 side. When the package 50 continues to move to the substrate 10 side, the solder ball 52 contacts the contact portion 23c, the contact 23 is pushed down by the solder ball 52, and the support member 21 moves to the substrate 10 side. At this time, the outer peripheral surface of the solder ball 52 contacts the opening edge of the contact hole 23d with a relatively large contact area. When the package 50 moves to the fixing position, the outer peripheral portion of the package 50 is locked by the locking portion 38 and the package 50 and the substrate 10 are fixed in a pressed state. Further, the support member 21 and the second spacer 42 are disposed at a substantially neutral position in the moving space 34 by the pressing by the package 50 and the pressing by the contact 23 (see FIG. 4). In the socket 20, when the biasing force of the biasing portion 37 is released using a jig (not shown), the locking state of the locking portion 38 can be released, and the package 50 can be easily removed from the socket 20. .

  Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The socket 20 of this embodiment corresponds to the connection device of the present invention, the package 50 corresponds to an integrated circuit, the solder ball 52 corresponds to a terminal and a spherical terminal of the integrated circuit, and the board side terminal 12 corresponds to a terminal of the board. The contact 23 corresponds to the contact member, the retainer 30 and the fixing bolt 31 correspond to the holding member, the guide pin 36 corresponds to the guide member, and the insertion hole 41a is a space in which the contact member and the terminal on the substrate are in contact with each other. The insertion port 42a corresponds to a space where the terminal of the integrated circuit and the contact member are in contact with each other.

  According to the socket 20 of this embodiment described in detail above, the contact 23 is fixed to the opening 22 of the support member 21, and the support member 21 is disposed between the package 50 and the substrate 10 and is retained by the retainer 30. Is fixed in a pressed state. The contact 23 is fixed to the support member 21 on the fixed end 23a side, contacts the substrate-side terminal 12 on the moving end 23b side, and a contact portion 23c that contacts the solder ball 52 is formed between these ends, and The moving end 23b is bent toward the substrate 10 side. Thus, since the contact 23 is fixed inside the opening of the support member 21, the package 50 and the substrate 10 can be easily placed close to each other. Further, since the moving end 23b side of the contact 23 faces the board 10 side facing the package 50, the connector 20 is connected to the board 10 when the package 50 is mounted or the inside of the socket 20 is brushed or the like. It is difficult for the contact 23 to be caught during cleaning or the like, and bending or breakage of the contact 23 can be suppressed. Therefore, the height direction can be further reduced, and the solder ball 52 and the board-side terminal 12 can be more reliably electrically connected.

  In addition, since the contact hole 23d into which the solder ball 52 is fitted is formed in the contact portion 23c, the contact 23 and the solder ball 52 of the package 50 can be more reliably in contact with each other. Furthermore, since the contact portion 23c is formed with a width larger than the fixed end 23a and the moving end 23b, the contact 23 and the solder ball 52 of the package 50 are more likely to come into contact with each other. Moreover, it is easy to form the contact hole 23d in the contact portion 23c. Furthermore, since the contact 23 is formed of a flexible leaf spring, when the package 50 and the substrate 10 are pressed and fixed, the solder ball 52 and the substrate-side terminal 12 are more reliably electrically connected. Can be connected. The contact 23 is bent to the solder ball 52 side and the substrate side terminal 12 side, and the contact 23 can be formed by relatively easy processing. In addition, the first spacer 41 and the second spacer 42 are disposed between the substrate 10, the support member 21 and the package 50, and the support member 21 and the second spacer 42 are guided to the guide pins 36 and are connected to the substrate 10 side. Since it can be moved to the package 50 side, it is possible to suppress the support member 21 from coming into contact with the package 50 or the substrate 10 by these spacers, and the contact 23 is further protected, and the solder balls 52 and The board-side terminal 12 can be electrically connected more reliably. Further, since the contact 23 has flexibility, the support member 21 can be easily disposed at the neutral position by the spring force of the contact 23.

  It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

  For example, in the above-described embodiment, the package 50 is a BGA type integrated circuit, but is not particularly limited, and may be an LGA type integrated circuit. Even if it does in this way, while achieving the downsizing of the height direction more, the terminal of a package and the terminal of a board | substrate side can be electrically connected more reliably. At this time, the contact hole 23d may not be formed in the contact portion 23c.

  In the embodiment described above, the contact 23 has the contact portion 23c formed with a larger width than the fixed end 23a and the moving end 23b. However, the present invention is not limited to this, and for example, the fixed end 23a and the moving end 23b and the contact portion 23c may be formed with the same width, or the moving end 23b and the contact portion 23c may be formed with the same width. The contact 23 is formed of a flexible leaf spring. However, the contact 23 is not particularly limited to this, and may not have flexibility, and the cross-sectional area of the contact in the longitudinal direction. The shape may not be constant.

  In the embodiment described above, the support member 21 is guided to the guide pin 36 and moves to the package 50 side and the substrate 10 side. However, such a guide member is omitted and the support member 21 is not movable. May be. At this time, the first spacer 41 and the second spacer 42 may be omitted.

  10 substrate, 12 substrate side terminal, 14 communication hole, 20 socket, 21 support member, 21a communication hole, 22 opening, 23 contact, 23a fixed end, 23b moving end, 23c contact portion, 23d contact hole, 30 retainer, 30a Mounting port, 30b Through hole, 31 Fixing bolt, 32 Columnar part, 33 Communication hole, 34 Moving space, 36 Guide pin, 36a Through hole, 37 Energizing part, 38 Locking part, 41 First spacer, 41a Insertion hole, 41b upper surface, 41c communication hole, 42 second spacer, 42a insertion port, 42b upper surface, 42c communication hole, 50 package, 52 solder ball.

Claims (7)

A connection device for connecting an integrated circuit having terminals and a substrate having terminals,
One end side is fixed so as to be positioned between the integrated circuit and the substrate, and the other end is a moving end that contacts a terminal on the substrate, and the integration is between the fixed end and the moving end. One or more contact members having electrical conductivity formed from the fixed end to the terminal side on the substrate through the terminal side of the integrated circuit from the fixed end;
A support member provided with one or more openings, and fixing a fixed end of the contact member to an opening edge of the openings;
In a state where the supporting member is disposed between the substrate and the integrated circuit, and a holding member for fixing the said integrated circuit and the substrate in a proper position of the other,
The contact device is formed by bending from the fixed end to the terminal side of the integrated circuit and further to the terminal side of the substrate . The integrated circuit includes a spherical terminal;
The connection device according to claim 1, wherein the contact member has a contact hole into which the spherical terminal fits in the contact portion.   The connection device according to claim 1, wherein the contact member has a width larger than the fixed end and the moving end of the contact portion.   The connection device according to claim 1, wherein the contact member is formed of a flexible leaf spring. The connection device according to claim 4,
A guide member disposed between the holding member and the substrate and inserted into a communication hole provided in the support member to guide the support member to the integrated circuit side and the substrate side;
A first spacer disposed between the support member and the substrate in which a space in which the contact member and a terminal on the substrate are in contact is provided;
A space in which a terminal of the integrated circuit and the contact member are in contact with each other, and a second spacer disposed between the integrated circuit and the support member;
A connection device comprising:   The contact member is in a state where the contact portion protrudes from an upper surface of the support member, and is fixed to an opening edge of the opening portion in a state where the moving end protrudes from a lower surface of the support member. The connection apparatus of any one of -5.   The plurality of inclined rectangular openings are formed in a lattice shape on the support member, and a fixed end of the contact member is sandwiched and fixed to an opening edge of the opening. The connection apparatus of any one of -6.

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