KR101397269B1 - Holder unit of semiconductor device and apparatus for testing the same - Google Patents

Holder unit of semiconductor device and apparatus for testing the same Download PDF

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Publication number
KR101397269B1
KR101397269B1 KR1020130022590A KR20130022590A KR101397269B1 KR 101397269 B1 KR101397269 B1 KR 101397269B1 KR 1020130022590 A KR1020130022590 A KR 1020130022590A KR 20130022590 A KR20130022590 A KR 20130022590A KR 101397269 B1 KR101397269 B1 KR 101397269B1
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KR
South Korea
Prior art keywords
semiconductor element
holder unit
shaft
moving part
moving
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KR1020130022590A
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Korean (ko)
Inventor
박태혁
Original Assignee
세메스 주식회사
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Priority to KR1020130022590A priority Critical patent/KR101397269B1/en
Application granted granted Critical
Publication of KR101397269B1 publication Critical patent/KR101397269B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices

Abstract

The semiconductor element holder unit includes a supporting portion, a moving portion, a guide portion, and an elastic portion. The supporting portion supports one side of the semiconductor element. The moving part is arranged to be movable in a horizontal direction connecting one side surface and the other side surface at another side surface position opposite to one side surface of the semiconductor element. The guide part is coupled to the moving part along the horizontal direction in which the moving part moves to guide the movement of the moving part. The resilient portion is mounted to the guide portion, and the movable portion provides elasticity to the movable portion to push the other side of the semiconductor element supported on one side by the support portion.

Figure R1020130022590

Description

TECHNICAL FIELD [0001] The present invention relates to a semiconductor device holder unit and a test apparatus including the semiconductor device holder unit.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor element holder unit and a test apparatus including the same, and more particularly, to a holder unit for holding a semiconductor device for performing a test and an apparatus for practically performing a test including the holder unit.

Generally, a semiconductor element is one of electronic components having a structure in which a chip is connected to a substrate. The semiconductor device may include, for example, a memory device such as DRAM (DRAM), SRAM (SRAM) and the like.

The semiconductor device is fabricated on the basis of a wafer made of a thin monocrystalline substrate made of a silicon material. Specifically, the semiconductor device includes a fab process for forming a plurality of chips on which a circuit pattern is patterned on the wafer, a bonding process for electrically connecting each of the chips formed in the fab process to each of the substrates, A molding process for protecting the substrate from the outside, and the like. The semiconductor devices thus manufactured are tested for their electrical characteristics through a separate test apparatus.

At this time, semiconductor devices, which are common in the manufacturing process, are inserted and fixed in the inserts collectively mounted on the test tray, and then the test tray is tested by contacting the test board of the test apparatus with the high fix board. On the other hand, re-performing the test process by inserting and fixing to the insert of the test tray as described above for some abnormal semiconductor elements that have been determined to be defective in this general test process, or that have been corrected, Therefore, a method is used in which a holder is separately held in a separate holder unit, and then the test board is brought into direct contact with the test board. In addition, the holder unit can be used to individually hold semiconductor devices of good products and connect them to a test apparatus to test whether the electrical performance of the high fix board is abnormal.

Specifically, the holder unit holds the semiconductor element by utilizing the latch through the elasticity of the elastic part arranged in the vertical direction, and then the semiconductor element is held by a separate metallic cover member so that the held semiconductor element is not separated. So that the terminals are exposed.

However, when the number of semiconductor elements held at one time increases, the terminals may be short-circuited due to the metallic cover member due to accumulation of tolerances between the metallic cover member and the terminals of the semiconductor element. In addition, since the metallic cover member is managed separately, there is a concern that it is not only lost but also unnecessary time is wasted to replace the metallic cover member.

It is an object of the present invention to provide a semiconductor element holder unit capable of holding the semiconductor element while preventing a short circuit between terminals of the semiconductor element.

Another object of the present invention is to provide a semiconductor device test apparatus including the above-described semiconductor element holder unit.

According to an aspect of the present invention, there is provided a semiconductor device holder unit including a support, a moving part, a guide part, and an elastic part.

The supporting portion supports one side of the semiconductor element. The moving unit is disposed to be movable in a horizontal direction connecting the one side surface and the other side surface at another side surface position opposite to one side surface of the semiconductor element. The guide part is coupled to the moving part along the horizontal direction in which the moving part moves, and guides the movement of the moving part. The elastic portion is mounted to the guide portion, and the moving portion provides elasticity to the moving portion to push the other side of the semiconductor element supported by the one side by the supporting portion.

At least one of the supporting portion and the moving portion according to an embodiment may have an insertion groove into which the one side or the other side is inserted and fixed so as to prevent the semiconductor element from being separated.

According to an embodiment, the guide portion includes a shaft having a structure elongated along the one lateral direction from a portion different from the portion facing the other surface of the moving portion, and a guide plate coupled to the extended end of the shaft . In this case, the elastic portion may include a spring that is mounted while surrounding the outer surface of the shaft.

The holder unit according to an embodiment may further include a fixing unit fixed to an outer body at an intermediate portion thereof so that the shaft can be moved. The spring may be mounted on the shaft so as to be positioned between the fixing portion and the guide plate.

According to another aspect of the present invention, a semiconductor device testing apparatus includes a board holder unit and an element holder unit.

The board holder unit holds the test board around a test board having a test terminal for testing electrical characteristics of the semiconductor device. The element holder unit is coupled to the upper portion of the board holder unit such that terminals of the semiconductor element come into contact with the test terminals while holding the semiconductor element. In this case, the element holder unit may include a support for supporting a side surface of the semiconductor element, a movable member disposed movably in a horizontal direction connecting the one side surface and the other side surface at another side surface position opposite to the one side surface of the semiconductor element, A guide part coupled to the moving part so as to guide movement of the moving part along a horizontal direction in which the moving part moves, and a guide part mounted on the guide part, And an elastic portion for providing elasticity to the moving portion to push the other side of the movable portion.

According to the semiconductor element holder unit and the test apparatus including the semiconductor element holder unit, the support portion is supported on one side of the semiconductor element, and the movable portion is pushed by the elasticity provided from the elastic portion on the other side opposite to the one side surface, The possibility of a short-circuiting between the terminals of the semiconductor element is eliminated as a result of the removal of the metallic cover member, which is a concern of short-circuiting between the terminals of the semiconductor element.

Accordingly, it is possible to reliably and stably perform the electrical performance of the semiconductor device or the electrical performance of a test board, for example, a high fix board, using semiconductor devices of good quality.

1 is a schematic diagram of a semiconductor device testing apparatus according to an embodiment of the present invention.
Fig. 2 is a perspective view showing the element holder unit of the test apparatus shown in Fig. 1 in detail.
3 is a perspective view showing a structure for holding a semiconductor element of the element holder unit shown in FIG. 2 in detail.
Fig. 4 is a view showing a part cut along the line I-I 'in Fig.
5 is an enlarged view of a portion A in Fig.

Hereinafter, a semiconductor device holder unit and a test apparatus including the semiconductor device holder unit according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the present invention in order to clarify the present invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

FIG. 1 is a schematic view of a semiconductor device testing apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view of a device holder unit of the test apparatus shown in FIG. 1, FIG. 4 is a cross-sectional view taken along the line I-I 'of FIG. 1 and showing a part thereof. FIG. 4 is a perspective view showing a structure for holding a semiconductor element of the element holder unit.

1 to 4, a semiconductor device testing apparatus 100 according to an embodiment of the present invention includes a board holder unit 200 and an element holder unit 300.

The board holder unit 200 holds it around the test board 10. The test board 10 has a plurality of test terminals 12 for testing the electrical performance of the semiconductor device 20. The test board 10 includes a test fixture (not shown) serving as an interface between a test handler (not shown) for transferring the semiconductor device 20 to be tested and a test device Hi-Fix) board.

The element holder unit 300 is coupled to the upper portion of the board holder unit 200. Specifically, the element holder unit 300 is coupled such that the terminals 22 of the semiconductor element 20 contact the test terminals 12 in order to hold the semiconductor element 20 and test its electrical performance. The element holder unit 300 includes a body 310, a supporting portion 320, a moving portion 330, a guide portion 340, and an elastic portion 350.

The body 310 forms the outer structure of the element holder unit 300 for holding the semiconductor element 20. The body 310 may have a structure in which a plurality of bodies 310 are arranged at regular intervals according to the arrangement of the test boards 10 and mounted on a separate tray (not shown). In addition, a plurality of mounting portions 312 may be formed on one body 310 so that a plurality of semiconductor devices 20 can be held. For example, four mounting portions 312 may be formed in a rectangular shape in one body 310.

The supporting portion 320 is formed on the mounting portion 312 of the body 310 so as to support one side of the semiconductor element 20. At this time, the supporting portion 320 supports one side of the semiconductor element 20 in a state in which the terminals 22 of the semiconductor element 20 are exposed downward so as to contact the test terminals 12 of the test board 10. The support portion 320 may be formed in a rectangular shape at four positions, for example, at four positions corresponding to the sides of the body 310 in each of the four mounting portions 312. The supporting portion 320 may have a structure fixed to the body 310 to stably support one side of the semiconductor element 20. [

The moving part 330 is arranged to be movable in the horizontal direction connecting the one side surface and the other side surface at the other side position of the semiconductor element 20 opposed to the one side surface. That is, the moving unit 330 may support the other side surface of the semiconductor device 20 while being moved in the horizontal direction, or may be separated from the other side surface. Since the moving part 330 is located at a position facing the supporting part 320, when four supporting parts 320 are formed at a position where the supporting part 320 is in contact with the side of the body 310 in a rectangular shape, four pieces are arranged in the center direction of the rectangular . In this case, a moving hole 314 may be formed in the center of the body 310 so that the four moving parts 330 can move.

The guide part 340 is coupled to the moving part 330 to guide the movement of the moving part 330 along the horizontal direction in which the moving part 330 moves. The guide portion 340 includes a shaft 342 having a structure elongated along the one lateral direction from a portion opposite to the other surface of the moving portion 330, As shown in FIG. The moving part 330 can support the other side of the semiconductor element 20 or can be separated from the other side by moving the guide plate 344 connected to the moving part 330 through the shaft 342 .

The elastic portion 350 is mounted on the guide portion 340. The elastic part 350 provides elasticity to the moving part 330 through the guide part 340 so that the moving part 330 pushes and holds the other side supported by the supporting part 320 by the supporting part 320.

One end of the elastic portion 350 is coupled to the moving portion 330 and the other end of the elastic portion 350 opposite to the one end of the elastic portion 350 is coupled to the guide plate 344 And may have a combined spring structure. In this case, since the elastic part 350 must exert a force to pull the one side direction from the other side of the structurally moving part 330 in which the shaft 342 is coupled to the moving part 330, Lt; / RTI >

3 and 4, the holder unit may further include a fixing portion 360 fixed to the body 310 at an intermediate portion thereof such that the shaft 342 is movable, The elastic part 350 may be positioned between the fixing part 360 and the guide plate 344 to provide elasticity to the moving part 330. [ The urging force of the resilient portion 350 in the direction opposite to the fixing portion 360 is applied to the guide plate 344 by the fixing portion 360 coupled to the intermediate portion of the shaft 342. Therefore, Lt; / RTI > In this structure, when the guide plate 344 is pushed in the other side direction from the one side, the elastic part 350 formed of the compression spring is compressed, and the moving part 330 is separated from the other side of the semiconductor element 20 So that the semiconductor element 20 can be easily separated from the outside.

Hereinafter, a structure for more stably holding the semiconductor element 20 will be described with reference to FIG. 5 additionally.

5 is an enlarged view of a portion A in Fig.

5, an insertion groove 332 is formed on one surface of the moving part 330, which is in contact with the other side of the semiconductor element 20, so that the other side is inserted and fixed so that the held semiconductor element 20 is not separated from the moving part 330 do. At this time, an inclined surface 334 may be formed around the insertion groove 332 of the guide plate 344 so as to guide the other side of the guide plate 344 to the insertion groove 332 accurately.

Similarly, a second insertion groove (not shown) in which the one side is inserted and fixed so that the semiconductor device 20 held on the other side of the support portion 320 contacting the one side of the semiconductor device 20 is not stably released, Can be additionally formed. The moving part 330 and the supporting part 320 each have the insertion groove 332 and the second insertion groove formed therein. However, in some cases, only one of the insertion groove 332 and the second insertion groove Can be formed.

The supporting portion 320 is supported on one side of the semiconductor element 20 and the moving portion 330 is pushed by the elasticity provided from the elastic portion 350 on the other side opposite to the one side, The possibility of a short circuit between the terminals 22 of the semiconductor element 20 is removed in the technical part of the background art of the invention by holding the metallic cover member 20, .

Accordingly, the electrical performance of the semiconductor device 20 or the electrical performance of the test board 10 using the semiconductor device 20 of good quality, for example, the high fix board can be reliably and stably performed.

By holding the semiconductor element 20 through a simple structure such as the supporting part 320, the moving part 330, the guide part 340 and the elastic part 350 as described above, the overall structure is simple It is not only easy to manufacture, but also the space in which these parts are mounted can be utilized efficiently.

The board holder unit 200 includes at least two screw holes (not shown) spaced from each other around the periphery of the test board 10 so as to more stably connect the board holder unit 200 and the element holder unit 300, 210 and the element holder unit 300 may include threaded portions 370 coupled to the body 310 to be coupled to the threaded holes 210.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

10: Test board 12: Test terminal
20: semiconductor element 22: terminal
100: semiconductor device test apparatus 200: board holder unit
210: screw hole 300: element holder unit
310: body 320: support
330: moving part 340: guide part
350: elastic part 360: fixing part
370:

Claims (6)

A support for supporting one side of the semiconductor element;
A moving part arranged to be movable in a horizontal direction connecting the one side surface and the other side surface at another side surface position opposite to one side surface of the semiconductor element;
A guiding part coupled to the moving part to guide the movement of the moving part along the horizontal direction in which the moving part moves; And
And an elastic portion which is mounted on the guide portion and which provides elasticity to the moving portion to push the other side of the semiconductor element supported by the one side by the supporting portion,
The guide portion
A shaft having a structure elongated along the one side direction from a portion different from a portion facing the other side surface of the moving portion; And
And a guide plate coupled to an extended end of the shaft,
Wherein the resilient portion includes a spring mounted around the outer surface of the shaft,
Further comprising a fixing portion fixed to an outer body at an intermediate portion thereof so that the shaft is movable,
Wherein the spring is mounted on the shaft so as to be positioned between the fixing portion and the guide plate. The semiconductor element holder unit according to claim 1, wherein at least one of the supporting portion and the moving portion has an insertion groove into which the one side surface or the other side surface is inserted and fixed so as to prevent the semiconductor element from escaping. delete delete delete A board holder unit for holding the test board around a test board having a test terminal for testing electrical characteristics of the semiconductor device; And
And an element holder unit coupled to an upper portion of the board holder unit such that terminals of the semiconductor element come into contact with the test terminals while holding the semiconductor element,
The element holder unit includes:
A support for supporting one side of the semiconductor element;
A moving part arranged to be movable in a horizontal direction connecting the one side surface and the other side surface at another side surface position opposite to one side surface of the semiconductor element;
A guiding part coupled to the moving part to guide the movement of the moving part along the horizontal direction in which the moving part moves; And
And an elastic portion which is mounted on the guide portion and which provides elasticity to the moving portion to push the other side of the semiconductor element supported by the one side by the supporting portion,
The guide portion
A shaft having a structure elongated along the one side direction from a portion different from a portion facing the other side surface of the moving portion; And
And a guide plate coupled to an extended end of the shaft,
Wherein the resilient portion includes a spring mounted around the outer surface of the shaft,
Further comprising a fixing portion fixed to an outer body at an intermediate portion thereof so that the shaft is movable,
And the spring is mounted on the shaft so as to be positioned between the fixing portion and the guide plate.
KR1020130022590A 2013-03-04 2013-03-04 Holder unit of semiconductor device and apparatus for testing the same KR101397269B1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050118886A (en) * 2004-06-15 2005-12-20 미래산업 주식회사 Structure for fixing a buffer shuttle in semiconductor test handler
KR20070113616A (en) * 2006-05-25 2007-11-29 세크론 주식회사 Structure for fixing a buffer in semiconductor test handler
KR20080086702A (en) * 2007-03-23 2008-09-26 세크론 주식회사 Test assistor for test tray
KR20080006683U (en) * 2007-06-26 2008-12-31 세크론 주식회사 Test assistor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050118886A (en) * 2004-06-15 2005-12-20 미래산업 주식회사 Structure for fixing a buffer shuttle in semiconductor test handler
KR20070113616A (en) * 2006-05-25 2007-11-29 세크론 주식회사 Structure for fixing a buffer in semiconductor test handler
KR20080086702A (en) * 2007-03-23 2008-09-26 세크론 주식회사 Test assistor for test tray
KR20080006683U (en) * 2007-06-26 2008-12-31 세크론 주식회사 Test assistor

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