CN110191297A - A kind of manufacture craft of ultra high-definition smart television - Google Patents
A kind of manufacture craft of ultra high-definition smart television Download PDFInfo
- Publication number
- CN110191297A CN110191297A CN201910386172.XA CN201910386172A CN110191297A CN 110191297 A CN110191297 A CN 110191297A CN 201910386172 A CN201910386172 A CN 201910386172A CN 110191297 A CN110191297 A CN 110191297A
- Authority
- CN
- China
- Prior art keywords
- pcba
- circuit board
- manufacture craft
- ultra high
- smart television
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000012360 testing method Methods 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 17
- 239000011521 glass Substances 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000000523 sample Substances 0.000 claims description 9
- 238000001514 detection method Methods 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 7
- 239000006260 foam Substances 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 claims description 5
- 239000003990 capacitor Substances 0.000 claims description 4
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 238000012423 maintenance Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 238000004804 winding Methods 0.000 claims description 4
- 206010003830 Automatism Diseases 0.000 claims description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 3
- 239000003599 detergent Substances 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 3
- 238000011056 performance test Methods 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims 1
- 239000002699 waste material Substances 0.000 abstract description 3
- 238000004891 communication Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000013442 quality metrics Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N17/00—Diagnosis, testing or measuring for television systems or their details
- H04N17/04—Diagnosis, testing or measuring for television systems or their details for receivers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/64—Constructional details of receivers, e.g. cabinets or dust covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Biomedical Technology (AREA)
- General Health & Medical Sciences (AREA)
- Testing, Inspecting, Measuring Of Stereoscopic Televisions And Televisions (AREA)
Abstract
A kind of manufacture craft of ultra high-definition smart television, the machine assembly technique carried out by the PCBA manufacture craft that first carries out and afterwards form.Yields can be improved in technical solution provided by the invention, reduces the waste of material, to reduce cost.
Description
Technical field
The present invention relates to production technologies, and in particular to a kind of manufacture craft of ultra high-definition smart television.
Background technique
Ultra high-definition smart television is with its outstanding Picture Showing power or intelligentized control increasingly as future television
Mainstream, since the PCBA in ultra high-definition smart television is extremely complex, and the quantity of PCBA is more, so giving ultra high-definition smart television
Manufacture the very big challenge of bring, according to the technique of traditional fabrication television set to being caused more defective products, so as to cause
The rising of cost.
Summary of the invention
In view of the deficiencies of the prior art, the present invention provides a kind of manufacture crafts of ultra high-definition smart television, can be improved
Yields, reduces the waste of material, to reduce cost.To achieve the goals above, present invention employs following technologies
Scheme.
A kind of manufacture craft of ultra high-definition smart television, the machine assembly carried out by the PCBA manufacture craft that first carries out and afterwards
Technique composition, the PCBA manufacture craft include:
Material prepares, by circuit board, the quantity of chip and other horizontal components and vertical component that need to mount and insert into
The overall inspection of row;
On circuit boards by electronic component installation, including SMT patch, automatic inserting and artificial inserting, the SMT patch are adopted
The element chip of the element of several English systems 0402 or a 5*5CM is fitted in a thickness of 0.2 ~ 5.0MM, outside with chip mounter
On circuit board of the shape having a size of 50 * of * 50MM ~ 510 460MM, the automatic inserting, using automatism card machine by rivet, jump
Line, horizontal component and vertical component are inserted into circuit board automatically, and the artificial inserting is referred to complete S MT patch and oneself
The circuit board of dynamic inserting, is placed on special fixture, using manually inserting remaining complicated component on circuit boards;
The test of circuit board automatic on-line;
The machine assembly technological work includes:
Optical display subass embly is installed, diaphragm, reflector plate, light guide plate and its relevant components component successively assemble and form optics display group
Part, is then fixed in the side of center, while pre-setting screen line;
Installation glass panel is sterilized glass panel using detergent, then sticks double-sided adhesive in the corresponding position of glass panel
Glass panel, is then fixed on frame by foam or pressure sensitive adhesive, and the glass panel is on the optical module;
PCBA is installed, the PCBA that assembly is completed utilizes double-sided adhesive foam close to the other side of the center, by its each PCBA
Between carry out wiring connection, while screen line being inserted into corresponding PCBA interface.
EMC test carries out EMC detection to the PCBA that winding displacement is completed;
Backboard is installed, double-sided adhesive is set in the groove of the frame, the stepped part is then inserted into groove, it will using double-sided adhesive
The two is fixed, and is completed complete machine and is tentatively assembled;
Overall performance test.
Preferably, the horizontal component includes ceramic capacitor, varistor, NTC thermistor, PTC thermistor, institute
Stating vertical component includes vertical resistance, capacitor, inductance
Preferably, the artificial inserting can use wave-soldering unit, on circuit boards by remaining complicated component welding, shape
At substrate, cooling have passed through after the completion of wave soldering, then transfer to artificial.Observation detection is carried out, maintenance of doing over again if finding the problem,
If not finding to carry out the test of circuit board automatic on-line.
Preferably, substrate is is put into the jig of automatic on-line test equipment by the circuit board automatic on-line test, institute
Stating on jig has several probes, and when test starts at that time, test equipment can be powered to substrate, the real work shape of analog baseplate
State, the probe can contact with each other with the interface of several electronic components on circuit board, can be to primary electron member device on substrate
The voltage of part, electric current or other running parameters are tested, and numerical value are formed, then by the numerical value arrived and automatic on-line of test
The standard figures of test equipment internal reservoir compare, and carry out whole assembly technology if comparison is consistent, if comparison is inconsistent
Side is done over again maintenance.
Preferably, it if EMC test testing result is found the problem, comes back for reconnecting, if testing result is
It is good, then continue that backboard is installed.
Of the invention can effectively provide yields, reduce the waste of material, to reduce cost.
Detailed description of the invention
Attached drawing 1 is a kind of overall flow figure of the manufacture craft of ultra high-definition smart television;
Attached drawing 2 is a kind of flow chart of the PCBA manufacture craft of the manufacture craft of ultra high-definition smart television;
Attached drawing 3 is a kind of flow chart of the machine assembly technique of the manufacture craft of ultra high-definition smart television.
Specific embodiment:
Hereinafter, the specific embodiment that present invention will be described in detail with reference to the accompanying.Those skilled in the art are according to the note of this specification
Load can be easily realized by the present invention.In addition, structure depicted in definition that this specification is given and attached drawing, ratio, size,
Direction etc., for the purpose convenient for explanation, for skilled in the art realises that the present invention, being not intended to limit the invention can
The qualifications of implementation, therefore do not have technical essential meaning.In addition, the modification of any structure, the change of proportionate relationship or
The adjustment etc. of size should all fall in institute of the present invention as long as not influencing the effect of the invention that can be generated and the purpose that can reach
In the range of the technology contents of announcement can be covered.
Figure is as shown in 1 and 2, a kind of aligning method of smart television channel list, comprising:
A kind of manufacture craft of ultra high-definition smart television, including PCBA manufacture craft 100 and machine assembly technique 200
The PCBA manufacture craft 100 includes:
Step 101: material prepares, by circuit board, chip and other horizontal components and vertical component for needing to mount and insert
Quantity carry out overall inspection.
Step 102: installation electronic component, including SMT patch, automatic inserting and artificial inserting, the SMT patch and from
Dynamic inserting in no particular order, i.e., both can first carry out SMT patch, then inserted automatically, can also first be inserted automatically, then into
Row SMT patch, the SMT patch, using chip mounter by the element of several English systems 0402 or the element chip of a 5*5CM
It being fitted in a thickness of 0.2 ~ 5.0MM, outer dimension is the automatic inserting on the circuit board of 50 * of * 50MM ~ 510 460MM,
Refer to using automatism card machine by rivet, wire jumper, horizontal component such as ceramic capacitor, varistor, NTC thermistor,
The component of PTC thermistor and such as vertical resistance, capacitor, the inductance of vertical component etc., is inserted into circuit board automatically, described
Artificial inserting refers to the circuit board inserted by complete S MT patch and automatically, is placed on special fixture, is incited somebody to action using artificial
Remaining complexity component is inserted on circuit boards, and scaling powder is then coated with, using wave-soldering unit, by remaining complicated first device
Part welds on circuit boards, forms substrate, have passed through cooling after the completion of wave soldering, then transfer to manually to carry out observation detection, good
Product flow into step 103, carry out cutting to defective products, after repair welding and cleaning, then carry out observation detection, after meeting non-defective unit, flow into step
Rapid 103.
Step 103: substrate is put into the jig of automatic on-line test equipment by the test of circuit board automatic on-line, described to control
There are several probes on tool, when test starts at that time, test equipment can be powered to substrate, the real work state of analog baseplate, institute
Stating probe can contact with each other with the interface of several electronic components on circuit board, can be to the electricity of primary electron component on substrate
Pressure, electric current or other running parameters form numerical value, then will store up inside the data of test arrived and automatic on-line test equipment
The standard figures deposited compare, thus detect on substrate the working condition of primary electron component and each electronic component it
Between communication state it is whether normal, for example, the probe can and the power supply interface of CPU be in contact, for detecting the upper surface of substrate
Power supply circuit can give CPU normal power supply, for example, the probe communication interface can contact with each other between CPU and GPU, be used for
Detection CPU and GPU bus communication whether can work normally, for example, the probe can the communication between CPU and flash memory connect
Mouth contacts with each other, for detecting whether CPU can be read out the data in flash memory.When the numerical value and criterion numeral that test obtains
When value is not inconsistent, test equipment will form corresponding error code, and different error code counterpart substrate different problems are retouched
It states, for example, the voltage value that 001A corresponds to the power supply interface of CPU is less than standard figures, such as 001B corresponds to the power supply interface of CPU
Voltage value be greater than standard figures, then thoroughly do away with different problems description, carry out artificial repair welding or grafting again, can also be with
Substrate is returned into second step and carries out grafting, if there is not error code after through automatic on-line test equipment in substrate, that
It will form mean for subsequent assembly PCBA.
The machine assembly technique 200 includes:
Step 201, optical display subass embly is installed, diaphragm, reflector plate, light guide plate and its relevant components component successively assemble and form light
Display component is learned, is then fixed in the side of center, while pre-setting screen line
Step 202, installation glass panel is sterilized glass panel using detergent, is then pasted in the corresponding position of glass panel
Glass panel, is then fixed on frame by upper double-sided adhesive foam or pressure sensitive adhesive, and the glass panel is in the optical module
On.
Step 203, PCBA is installed, the PCBA that assembly is completed using double-sided adhesive foam close to the other side of the center,
Wiring connection will be carried out before its each PCBA, while screen line being inserted into corresponding PCBA.
Step 204, EMC test, to winding displacement complete PCBA carry out EMC detection, if testing result be it is bad, return
Step 203 carries out winding displacement again, if testing result be it is good, continue in next step.
Step 205, backboard is installed, double-sided adhesive is set in the groove of the frame, the stepped part is then inserted into groove,
The two is fixed using double-sided adhesive, complete machine is completed and tentatively assembles
Step 206, overall performance is tested, and complete machine is put into the jig of performance test apparatus, and jig possesses multiple outsides and inserts
Head, such as the attaching plug of energization, user transmits the USB plug of video, for the HDMI plug of Video Quality Metric, and its uses
In the backboard plug etc. of test complete machine problem, for the true service condition of analog subscriber, when test starts, the external plug
It is inserted into the interface of complete machine and is powered, by pre-stored film in the test equipment, be passed in complete machine by USB plug, into
8 hours of row loop play, while backboard plug does not work for the problem of recording complete machine when there is optical display subass embly, it can not
It plays film or temperature is excessively high, its entirety is dismantled, while returning to machine assembly step 201 and being re-assemblied,
For those skilled in the art, revealed structure and principle various other corresponding changes can be obtained according to the present invention
And deformation, and all these change and deformation belongs to protection category of the invention.
Claims (5)
1. a kind of manufacture craft of ultra high-definition smart television, which is characterized in that made by the PCBA first carried out
Technique and the machine assembly technique carried out afterwards composition,
The PCBA manufacture craft includes:
Material prepares, by circuit board, the quantity of chip and other horizontal components and vertical component that need to mount and insert into
The overall inspection of row;
On circuit boards by electronic component installation, including SMT patch, automatic inserting and artificial inserting, the SMT patch are
The element chip of the element of several English systems 0402 or a 5*5CM is fitted in a thickness of 0.2 ~ 5.0MM using chip mounter,
Outer dimension is the automatic inserting on the circuit board of 50 * of * 50MM ~ 510 460MM, is to use automatism card machine by riveting
Nail, wire jumper, horizontal component and vertical component are inserted into circuit board automatically, the artificial inserting, be by complete S MT patch and
Automatically the circuit board inserted, is placed on special fixture, using manually inserting remaining complicated component on circuit boards;
The test of circuit board automatic on-line;
The machine assembly technological work includes:
Optical display subass embly is installed, diaphragm, reflector plate, light guide plate and its relevant components component successively assemble and form optics display group
Part, is then fixed in the side of center, while pre-setting screen line;
Installation glass panel is sterilized glass panel using detergent, then sticks double-sided adhesive in the corresponding position of glass panel
Glass panel, is then fixed on frame by foam or pressure sensitive adhesive, and the glass panel is on the optical module;
PCBA is installed, the PCBA that assembly is completed utilizes double-sided adhesive foam close to the other side of the center, by it each
Wiring connection is carried out between PCBA, while screen line being inserted into corresponding PCBA interface;
EMC test carries out EMC detection to the PCBA that winding displacement is completed;
Backboard is installed, double-sided adhesive is set in the groove of the frame, the stepped part is then inserted into groove, it will using double-sided adhesive
The two is fixed, and is completed complete machine and is tentatively assembled;
Overall performance test.
2. a kind of manufacture craft of ultra high-definition smart television as described in right 1, it is characterised in that: the horizontal component includes ceramics
Capacitor, varistor, NTC thermistor, PTC thermistor, the vertical component include vertical resistance, capacitor, inductance.
3. a kind of manufacture craft of ultra high-definition smart television as described in right 2, it is characterised in that: the artificial inserting can use
Wave-soldering unit on circuit boards by remaining complicated component welding forms substrate, have passed through after the completion of wave soldering cold
But, it then transfers to manually to carry out observation detection, maintenance of doing over again if finding the problem, if not finding to carry out the survey of circuit board automatic on-line
Examination.
4. a kind of manufacture craft of ultra high-definition smart television as described in right 3, it is characterised in that: the circuit board automatic on-line is surveyed
Examination has several probes, when test starts at that time, surveys to be put into substrate in the jig of automatic on-line test equipment on the jig
Examination equipment can be powered to substrate, and the real work state of analog baseplate, the probe can be with several electronics member devices on circuit board
The interface of part contacts with each other, and can be formed to the voltage of primary electron component on substrate, electric current or the test of other running parameters
Then numerical value compares the numerical value tested and the standard figures of automatic on-line test equipment internal reservoir, if comparison one
Cause then carries out whole assembly technology, does over again maintenance if comparing inconsistent side.
5. a kind of manufacture craft of ultra high-definition smart television as described in right 4, it is characterised in that: if EMC tests testing result
Find the problem, then come back for reconnecting, if testing result be it is good, continue install backboard.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910386172.XA CN110191297A (en) | 2019-05-09 | 2019-05-09 | A kind of manufacture craft of ultra high-definition smart television |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910386172.XA CN110191297A (en) | 2019-05-09 | 2019-05-09 | A kind of manufacture craft of ultra high-definition smart television |
Publications (1)
Publication Number | Publication Date |
---|---|
CN110191297A true CN110191297A (en) | 2019-08-30 |
Family
ID=67716025
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910386172.XA Pending CN110191297A (en) | 2019-05-09 | 2019-05-09 | A kind of manufacture craft of ultra high-definition smart television |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110191297A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111542218A (en) * | 2020-04-23 | 2020-08-14 | 国网浙江省电力有限公司电力科学研究院 | Electric energy meter credible production patch link acquisition verification method and system |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101360257A (en) * | 2008-09-03 | 2009-02-04 | 嘉兴闻泰通讯科技有限公司 | Test apparatus and method for mobile phone television PCBA |
CN102866514A (en) * | 2011-07-04 | 2013-01-09 | 同方国际有限公司 | Liquid crystal display and assembling method thereof |
CN204389848U (en) * | 2014-12-29 | 2015-06-10 | 深圳市世纪联合创新科技有限公司 | Back light module unit structure and there is the display of this back light module unit structure |
CN205378069U (en) * | 2016-01-19 | 2016-07-06 | 四川长虹电器股份有限公司 | Glass light guide plate LCD TV structure |
CN105791725A (en) * | 2016-03-14 | 2016-07-20 | 东莞康佳电子有限公司 | Ultra-high-definition man-machine interaction television production line process |
CN206349112U (en) * | 2016-12-30 | 2017-07-21 | 深圳市赛维商显科技开发有限公司 | A kind of hanging type advertising machine |
CN206878973U (en) * | 2017-06-28 | 2018-01-12 | 四川长虹电器股份有限公司 | A kind of LCD TV of narrow shape superthin structure |
CN207354817U (en) * | 2017-09-08 | 2018-05-11 | 天津威佳美甫电子有限公司 | A kind of new SMT chip mounters |
CN108319053A (en) * | 2018-02-05 | 2018-07-24 | 深圳市中深光电股份有限公司 | LCD module production methods |
CN109188741A (en) * | 2018-10-30 | 2019-01-11 | 内蒙古创维智能科技有限公司 | A kind of LCD TV packaging technology |
-
2019
- 2019-05-09 CN CN201910386172.XA patent/CN110191297A/en active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101360257A (en) * | 2008-09-03 | 2009-02-04 | 嘉兴闻泰通讯科技有限公司 | Test apparatus and method for mobile phone television PCBA |
CN102866514A (en) * | 2011-07-04 | 2013-01-09 | 同方国际有限公司 | Liquid crystal display and assembling method thereof |
CN204389848U (en) * | 2014-12-29 | 2015-06-10 | 深圳市世纪联合创新科技有限公司 | Back light module unit structure and there is the display of this back light module unit structure |
CN205378069U (en) * | 2016-01-19 | 2016-07-06 | 四川长虹电器股份有限公司 | Glass light guide plate LCD TV structure |
CN105791725A (en) * | 2016-03-14 | 2016-07-20 | 东莞康佳电子有限公司 | Ultra-high-definition man-machine interaction television production line process |
CN206349112U (en) * | 2016-12-30 | 2017-07-21 | 深圳市赛维商显科技开发有限公司 | A kind of hanging type advertising machine |
CN206878973U (en) * | 2017-06-28 | 2018-01-12 | 四川长虹电器股份有限公司 | A kind of LCD TV of narrow shape superthin structure |
CN207354817U (en) * | 2017-09-08 | 2018-05-11 | 天津威佳美甫电子有限公司 | A kind of new SMT chip mounters |
CN108319053A (en) * | 2018-02-05 | 2018-07-24 | 深圳市中深光电股份有限公司 | LCD module production methods |
CN109188741A (en) * | 2018-10-30 | 2019-01-11 | 内蒙古创维智能科技有限公司 | A kind of LCD TV packaging technology |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111542218A (en) * | 2020-04-23 | 2020-08-14 | 国网浙江省电力有限公司电力科学研究院 | Electric energy meter credible production patch link acquisition verification method and system |
CN111542218B (en) * | 2020-04-23 | 2021-07-20 | 国网浙江省电力有限公司营销服务中心 | Electric energy meter credible production patch link acquisition verification method and system |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7473568B2 (en) | Memory-module manufacturing method with memory-chip burn-in and full functional testing delayed until module burn-in | |
US6873927B2 (en) | Control method of an automatic integrated circuit full testing system | |
US5838568A (en) | Heated circuit assembly tester and method | |
CN104181456A (en) | Method for testing printed circuit board | |
CN110191297A (en) | A kind of manufacture craft of ultra high-definition smart television | |
US5777841A (en) | Method of qualification testing of DC-DC converters | |
CN104950489B (en) | A kind of liquid crystal display detection method | |
CN112798109B (en) | Detection and evaluation device for mainboard quality | |
US8564320B2 (en) | Connection device for quality testing of charge-coupled device modules | |
US7360441B2 (en) | Board deflection metrology using photoelectric amplifiers | |
JP2008256695A (en) | Processing of tantalum capacitor on assembled pwa to yield low failure rate | |
CN103134438A (en) | Compound measurement jig | |
US6774652B2 (en) | Cantilever type probe card and method for production thereof | |
CN109661162A (en) | A kind of automobile electrically-controlled ECU manufacturing process | |
CN110933278B (en) | Silver colloid resistivity control method of voice coil motor, camera module and jig | |
CN110095933A (en) | Camera module and its standardized test method | |
WO2010112976A2 (en) | Connection quality verification for integrated circuit test | |
KR101619721B1 (en) | Device testing printed circuit board | |
TW542917B (en) | Apparatus and method for testing module devices | |
US6114181A (en) | Pre burn-in thermal bump card attach simulation to enhance reliability | |
WO2004061527A2 (en) | Electrostatic imager | |
CN219715663U (en) | High-precision detection device of LED grain tester | |
JP2003194755A (en) | Method of testing semiconductor package | |
CN219799189U (en) | Universal template type CCD optical automatic detection testing station | |
US20070126447A1 (en) | Testing apparatus and method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190830 |