CN111337079A - Test inspection method for printed circuit board production - Google Patents
Test inspection method for printed circuit board production Download PDFInfo
- Publication number
- CN111337079A CN111337079A CN202010201063.9A CN202010201063A CN111337079A CN 111337079 A CN111337079 A CN 111337079A CN 202010201063 A CN202010201063 A CN 202010201063A CN 111337079 A CN111337079 A CN 111337079A
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- Prior art keywords
- circuit board
- printed circuit
- test
- inspecting
- detection
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K7/10544—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation by scanning of the records by radiation in the optical part of the electromagnetic spectrum
- G06K7/10821—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation by scanning of the records by radiation in the optical part of the electromagnetic spectrum further details of bar or optical code scanning devices
- G06K7/10861—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation by scanning of the records by radiation in the optical part of the electromagnetic spectrum further details of bar or optical code scanning devices sensing of data fields affixed to objects or articles, e.g. coded labels
Abstract
The invention discloses a test and inspection method for printed circuit board production, which comprises the following steps: visual inspection, preliminarily inspecting the surface defects of the printed circuit board, inspecting whether a hole is in the center of a bonding pad or not, whether a welding spot has missing welding or insufficient welding, inspecting the integrity of a wire graph, measuring whether the width and the shape of a wire are in the required range or not, and inspecting whether the edge size of the printed circuit board is in the required range or not; and (4) manually and optically inspecting, namely visually inspecting the qualified printed circuit board, and then inspecting the printed circuit board by adopting an optical instrument, and further inspecting whether the surface defects and the welding quality of the printed circuit board are in the required range. According to the invention, visual detection, manual optical inspection and automatic equipment detection methods are combined, so that the detection of the printed circuit board is more comprehensive, and a large data quality tracing system is established by setting the two-dimensional code and the RFID tag, so that the printed circuit board has traceability and the use safety of the circuit board is improved.
Description
Technical Field
The invention relates to the technical field of printed circuit board production, in particular to a test inspection method for printed circuit board production.
Background
Printed Circuit Board (PCB), also known as PCB, is a provider of electrical connection of electronic components, and its development has been over 100 years old, its design is mainly a layout design, and the main advantage of using PCB is to greatly reduce errors of wiring and assembly, improve automation level and production labor rate, and can be divided into single-panel, double-panel, four-panel, six-panel and other multi-layer PCBs according to the number of layers of PCB, in recent decades, the PCB manufacturing industry in China has been rapidly developed, total output and total output are the first in the world, because the electronic products are different day by day, price changes the structure of supply chain, the Chinese industry has distribution, cost and market advantages, and has become the most important PCB production base in the world, and the PCB is developed from single-panel to double-panel, multi-panel and flexible board, the method is developed towards high precision, high density and high reliability, the volume is continuously reduced, the cost is reduced, the performance is improved, so that the printed circuit board still keeps strong vitality in the development process of future electronic products, the development trend of the production and manufacturing technology of the printed circuit board in the future is to develop towards high density, high precision, fine aperture, fine lead, small space, high reliability, multilayering, high-speed transmission, light weight and thin type in performance, and the process of producing the printed circuit board in a factory is approximately: the method comprises 15 procedures of drawing, photomechanical production, silk screen sensing, blanking, pattern transfer, etching, drilling, plate engraving, hole forming, polishing, gold and silver plating, solder resisting, soldering assisting, trimming, character printing, factory inspection and the like, wherein the testing and inspection in the production process are vital, but the existing testing and inspection method has poor traceability and single circuit board detection measure, so that the prior art needs to be improved to solve the problems.
Disclosure of Invention
The invention aims to provide a test and inspection method for printed circuit board production, which aims to solve the problems of poor traceability and single circuit board detection measure of the conventional test and inspection method in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: a test inspection method for printed circuit board production, the method comprising the steps of:
s1: visual inspection, preliminarily inspecting the surface defects of the printed circuit board, inspecting whether a hole is in the center of a bonding pad or not, whether a welding spot has missing welding or insufficient welding, inspecting the integrity of a wire graph, measuring whether the width and the shape of a wire are in the required range or not, and inspecting whether the edge size of the printed circuit board is in the required range or not;
s2: manual optical inspection, wherein the printed circuit board is inspected by visual inspection and then an optical instrument is adopted to inspect the printed circuit board, and whether the surface defect and the welding quality of the printed circuit board are in the required range is further inspected;
s3: machine detection, wherein the qualified printed circuit board is manually and optically detected, then the layout, distortion and compression conditions of all layers in the multilayer circuit board are detected through X-ray equipment, then the printed circuit board is detected through a high-speed three-dimensional laser scanner, automatic image analysis is carried out through the scanner, and all welding pads, leads and joints are detected;
s4: simulating the electrical performance detection of the field environment, simulating in a simulation machine according to the data of the use environment of the printed circuit board provided by the customized user, performing a connectivity test, and checking whether the printed circuit patterns are connected or not to ensure that the circuit board can meet the design requirements of customers and has no open circuit and short circuit defects;
s5: and transmitting the detection result to a big database, generating a two-dimensional code, pasting the two-dimensional code on a circuit board, inputting the detection result into an RFID label, and fixedly bonding the RFID label on the back of the printed circuit board to finish the test and inspection process.
Preferably, the visual inspection process of S1 may be assisted by using a magnifying glass of 10 times.
Preferably, the surface defects of the printed circuit board are preliminarily inspected in S1, specifically, the quality of dents, pits, scratches, surface roughness, voids, pinholes, and the like.
Preferably, the optical instrument in S2 may be configured as an optical microscope, a television camera, a scanner, and a frame grabber.
Preferably, the machine detection method of S3 is configured as a method of averaging a plurality of detections.
Preferably, in S4, the parameters of the environment in which the pcb is used are set to be temperature, humidity, and corrosive gas concentration, and the pcb can be subjected to constant temperature and humidity detection, constant temperature and humidity stress screening detection, cold and heat shock test, aging test, and salt spray test, and it is checked whether the adaptive capacity and characteristics of the pcb change under the condition of changing temperature and humidity of the climate environment.
Preferably, a transparent plastic protection plate is arranged on the surface of the two-dimensional code in the S5, and the transparent plastic protection plate is fixedly bonded at the front corner of the printed circuit board.
Compared with the prior art, the invention has the beneficial effects that:
(1) the invention combines visual detection, manual optical detection and automatic equipment detection methods, so that the detection of the printed circuit board is more comprehensive, and the surface defects, the welding quality, the layout of each layer inside the printed circuit board and the distortion and compression conditions of the printed circuit board can be thoroughly detected.
(2) According to the invention, the two-dimension code and the RFID label are arranged, the big data quality tracing system is established, so that the printed circuit board has traceability, the detection result in the big database is respectively made into the two-dimension code and the RFID label, when the circuit board has a problem, the two-dimension code can be scanned to call the specific information of the circuit board in the big database, or the specific information of the circuit board in the RFID label is read by the RFID reader-writer, so that the maintenance processing of the circuit board is facilitated, and the use safety of the circuit board is improved.
(3) The invention can greatly improve the detection accuracy of products by carrying out the electrical property detection of simulating the field environment on the printed circuit board, the tolerance degree of the printed circuit board under the continuous environment of instantaneous high and low temperature, the salt spray simulation severe environment, the corrosion resistance, the stress intensity and the like of the circuit board are detected, the reliable circuit board is screened out, and the circuit board is prevented from being failed by the environment examination in the use process to cause unnecessary loss.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment provided by the invention comprises the following steps: a test inspection method for printed circuit board production includes the following steps:
s1: visual inspection, preliminarily inspecting the surface defects of the printed circuit board, inspecting whether a hole is in the center of a bonding pad or not, whether a welding spot has missing welding or insufficient welding, inspecting the integrity of a wire graph, measuring whether the width and the shape of a wire are in the required range or not, and inspecting whether the edge size of the printed circuit board is in the required range or not;
s2: manual optical inspection, wherein the printed circuit board is inspected by visual inspection and then an optical instrument is adopted to inspect the printed circuit board, and whether the surface defect and the welding quality of the printed circuit board are in the required range is further inspected;
s3: machine detection, wherein the qualified printed circuit board is manually and optically detected, then the layout, distortion and compression conditions of all layers in the multilayer circuit board are detected through X-ray equipment, then the printed circuit board is detected through a high-speed three-dimensional laser scanner, automatic image analysis is carried out through the scanner, and all welding pads, leads and joints are detected;
s4: simulating the electrical performance detection of the field environment, simulating in a simulation machine according to the data of the use environment of the printed circuit board provided by the customized user, performing a connectivity test, and checking whether the printed circuit patterns are connected or not to ensure that the circuit board can meet the design requirements of customers and has no open circuit and short circuit defects;
s5: the detection result is transmitted into the big database, the two-dimensional code is generated, the two-dimensional code is attached to the circuit board, the detection result is input into the RFID label, the RFID label is fixedly bonded to the back of the printed circuit board, the test and inspection process is completed, the big data quality tracing system is established, the product has traceability, when the circuit board goes wrong, the two-dimensional code can be scanned to call the specific information of the circuit board in the big database, or the specific information of the circuit board in the RFID label is read through the RFID reader-writer, the circuit board is convenient to maintain, and the use safety of the circuit board is improved.
Further, the visual inspection process of S1 can adopt 10 times of magnifying glasses to carry out auxiliary inspection, preliminarily inspect the printed circuit board, and discharge a part of unqualified products, so that subsequent machine inspection is facilitated, the machine inspection efficiency is improved, and the inspection cost is reduced.
Further, the surface defects of the printed circuit board, specifically, the quality of dents, pocks, scratches, surface roughness, voids, pinholes, etc., are preliminarily inspected in S1.
Further, the optical instrument in S2 may be configured as an optical microscope, a tv camera, a scanner and a frame grabber, and the quality of the printed circuit board is further inspected by performing image analysis tracking through the optical microscope, the tv camera, the scanner and the frame grabber.
Further, the machine detection method of S3 is set to be a method of taking an average value by multiple detections, which reduces random errors and improves the accuracy of detection by multiple detections.
Further, the service environment parameters of the printed circuit board in S4 are set to be temperature, humidity and corrosive gas concentration, the printed circuit board can be subjected to constant temperature and humidity detection, constant temperature and humidity stress screening detection, cold and heat shock test, aging test and salt water spraying test, whether the adaptability and characteristics of the circuit board change under the condition of constant change of the climate environment temperature and humidity is checked, simulation detection is used for testing the tolerance degree of the printed circuit board under the instantaneous high and low temperature continuous environment, salt water spraying simulation severe environment is used for detecting the corrosion resistance, stress strength and the like of the circuit board, the circuit board with reliability is screened out, and the circuit board is prevented from being failed due to environment examination in the using process and causing unnecessary loss.
Further, the surface of two-dimensional code is provided with the transparent plastic protection shield in S5, and the fixed bonding of transparent plastic protection shield is in printed circuit board' S positive corner, and the transparent plastic protection shield can avoid the wearing and tearing of two-dimensional code.
The working principle is as follows: the surface defect, welding quality, layout of each layer inside, distortion and compression condition of the printed circuit board are comprehensively checked by visual detection, manual optical inspection and automatic equipment detection methods, then the printed circuit board is subjected to electrical property detection simulating a field environment, the printed circuit board is placed in an instantaneous high and low temperature continuous environment or sprayed with salt mist to simulate a severe environment, a connectivity test is carried out on the printed circuit board, the corrosion resistance, stress intensity and the like of the circuit board are detected, a reliable circuit board is screened out, a large data quality tracing system is established according to the detection result, the generated two-dimensional code and the RFID label enable the printed circuit board to have traceability, when the circuit board has problems, the two-dimensional code can be scanned to call specific information of the circuit board in a large database, or a RFID reader-writer is used for reading the specific information of the circuit board in the RFID label, therefore, the circuit board can be maintained conveniently, a printed circuit board user can master the test information of the circuit board at any time, and the use safety of the circuit board is improved.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A test inspection method for printed circuit board production is characterized in that: the method comprises the following steps:
s1: visual inspection, preliminarily inspecting the surface defects of the printed circuit board, inspecting whether a hole is in the center of a bonding pad or not, whether a welding spot has missing welding or insufficient welding, inspecting the integrity of a wire graph, measuring whether the width and the shape of a wire are in the required range or not, and inspecting whether the edge size of the printed circuit board is in the required range or not;
s2: manual optical inspection, wherein the printed circuit board is inspected by visual inspection and then an optical instrument is adopted to inspect the printed circuit board, and whether the surface defect and the welding quality of the printed circuit board are in the required range is further inspected;
s3: machine detection, wherein the qualified printed circuit board is manually and optically detected, then the layout, distortion and compression conditions of all layers in the multilayer circuit board are detected through X-ray equipment, then the printed circuit board is detected through a high-speed three-dimensional laser scanner, automatic image analysis is carried out through the scanner, and all welding pads, leads and joints are detected;
s4: simulating the electrical performance detection of the field environment, simulating in a simulation machine according to the data of the use environment of the printed circuit board provided by the customized user, performing a connectivity test, and checking whether the printed circuit patterns are connected or not to ensure that the circuit board can meet the design requirements of customers and has no open circuit and short circuit defects;
s5: and transmitting the detection result to a big database, generating a two-dimensional code, pasting the two-dimensional code on a circuit board, inputting the detection result into an RFID label, and fixedly bonding the RFID label on the back of the printed circuit board to finish the test and inspection process.
2. A test inspection method for printed circuit board production according to claim 1, characterized in that: the visual inspection process of S1 may be assisted by using a magnifying glass of 10 times.
3. A test inspection method for printed circuit board production according to claim 1, characterized in that: in S1, the surface defects of the pcb are preliminarily inspected, specifically, the quality of dents, pits, scratches, surface roughness, voids, pinholes, etc.
4. A test inspection method for printed circuit board production according to claim 1, characterized in that: the optical instruments in the S2 may be configured as an optical microscope, a television camera, a scanner, and a frame grabber.
5. A test inspection method for printed circuit board production according to claim 1, characterized in that: the machine detection method of S3 is set as a method of averaging a plurality of detections.
6. A test inspection method for printed circuit board production according to claim 1, characterized in that: and S4, setting the use environment parameters of the printed circuit board to be temperature, humidity and corrosive gas concentration, carrying out constant temperature and humidity detection, constant temperature and humidity stress screening detection, cold and hot shock test, aging test and salt water spraying test on the printed circuit board, and checking whether the adaptive capacity and the characteristics of the printed circuit board change under the condition that the temperature and the humidity of the climate environment change continuously.
7. A test inspection method for printed circuit board production according to claim 1, characterized in that: and transparent plastic protection plates are arranged on the surfaces of the two-dimension codes in the S5 and fixedly bonded at the corners of the front side of the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010201063.9A CN111337079A (en) | 2020-03-20 | 2020-03-20 | Test inspection method for printed circuit board production |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010201063.9A CN111337079A (en) | 2020-03-20 | 2020-03-20 | Test inspection method for printed circuit board production |
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| CN111337079A true CN111337079A (en) | 2020-06-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010201063.9A Pending CN111337079A (en) | 2020-03-20 | 2020-03-20 | Test inspection method for printed circuit board production |
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Cited By (2)
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| CN113418561A (en) * | 2021-06-30 | 2021-09-21 | 南通海舟电子科技有限公司 | Intelligent detection system and method for double-layer circuit board |
| CN117007946A (en) * | 2023-10-07 | 2023-11-07 | 深圳市拓普泰克技术股份有限公司 | Automatic test management method and related device for PCBA |
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Application publication date: 20200626 |
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