CN109840572A - A kind of SMT producing line management method and manufacture end - Google Patents
A kind of SMT producing line management method and manufacture end Download PDFInfo
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- CN109840572A CN109840572A CN201910061494.7A CN201910061494A CN109840572A CN 109840572 A CN109840572 A CN 109840572A CN 201910061494 A CN201910061494 A CN 201910061494A CN 109840572 A CN109840572 A CN 109840572A
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Abstract
The invention discloses a kind of SMT producing line management method and manufacture ends, receive SMT and produce work order, generate and print the neck material information got from raw material producing line to SMT material；Manufacturing Worker's ID card is read, production identity unique identification information is obtained, obtains production equipment unique identification information in the production equipment information to SMT material from for processing；Scanning obtains material information to the bar code on SMT material, records production quantity and bad data, all information are bound, and generates production information；Quality testing archives are written in production quantity, defective products quantity and bad description by the quality testing archives for logging in and matching to SMT material；And production information is written into the data about inspection, storage bar code information is generated, so that SMT material is stored in SMT temporary library.The present invention forms complete product back-tracing system, ensure that " transparence " management of production, and is convenient for subsequent bad analysis, to improve production yield.
Description
Technical field
The present invention relates to ammeter manufacturing field, in particular to a kind of SMT producing line management method and manufacture end.
Background technique
SMT is the abbreviation of Surface Mount Technology, means surface installation technique, also referred to as surface mount skill
Art or surface mounting technique.SMT producing line is the circuit assembly technology of new generation developed by hybrid-intergated-circuit technique, to adopt
With the characteristics of component surface mounting technology and reflow solder technique, become package technique of new generation in Electronic products manufacturing.
SMT producing line capital equipment has: printing machine, chip mounter, Reflow Soldering, plug-in unit, Wave soldering furnace and testing package.The extensive use of SMT,
Miniaturization, the multifunction of electronic product are promoted, provides condition for mass production, Low Defectivity production.
Under the promotion of China's electronics and IT industry fast development, Chinese surface mounting technology and SMT producing line are also obtained
Swift and violent development.Increasing for explosion type is presented using mobile phone, MP3 as the market of the consumer electronics product of representative, is further driven to
The miniaturization of Surface Mount Component and the densification of assembling product, 0201 element, CSP, flipchip etc. be small, it is thin between
In the practical application for also entering SMT away from device, the application level of SMT technology is greatly improved, while also improving technique hardly possible
Degree.
Manufacturing industry in ammeter manufacturing field about circuit board is needed by SMT process, DIP process, general assembly process, inspection
Survey process and packaging process etc..So to complete the important composition that the SMT producing line of SMT process is also ammeter manufacturing field
Part.In order to improve the production yield of SMT process, the defective products to SMT process is needed to analyze, to find out poor prognostic cause,
To be improved.But it is limited for data provided by bad analysis based on existing SMT producing line, it can not find well
Poor prognostic cause, the i.e. production yield of SMT process also need to further increase.
Summary of the invention
The technical problems to be solved by the present invention are: providing a kind of SMT producing line management method and manufacture end, it has been capable of forming
Whole product back-tracing system, to improve SMT product overall quality.
In order to solve the above-mentioned technical problem, the technical solution adopted by the present invention are as follows:
A kind of SMT producing line management method, comprising steps of
S1, SMT production work order is received, generates and prints the neck material information got from raw material producing line to SMT material；
S2, Manufacturing Worker's ID card is read, production identity unique identification information is obtained, from for processing to SMT material
Production equipment unique identification information is obtained in production equipment information；
To the bar code on SMT material described in S3, scanning, material information is obtained, records production quantity, defective products quantity
And bad description, the production quantity, the defective products quantity, the bad description, production time, the SMT are produced into work
Single, described material information, the production identity unique identification and the production equipment unique identification information are bound, and are generated
Production information；
S4, login and the quality testing archives to match to SMT material, by the production quantity, defective products quantity
And the quality testing archives are written in bad description；
S5, acceptance inspection qualification information are generated and are examined batch number；
S6, it reads and examines employee's ID card, obtain examining equipment unique identification information, from for examining to SMT material
Examine facility information in obtain examine equipment unique identification information, by the inspection batch number, the inspection card using information and
Examine facility information that the production information is written；
S7, storage bar code information is generated, so that SMT material is stored in SMT temporary library.
In order to solve the above-mentioned technical problem, the another technical solution that the present invention uses are as follows:
A kind of SMT producing line manufactures end, including memory, processor and storage can be run on a memory and on a processor
Computer program, the processor performs the steps of when executing the computer program
S1, SMT production work order is received, generates and prints the neck material information got from raw material producing line to SMT material；
S2, Manufacturing Worker's ID card is read, production identity unique identification information is obtained, from for processing to SMT material
Production equipment unique identification information is obtained in production equipment information；
To the bar code on SMT material described in S3, scanning, material information is obtained, records production quantity, defective products quantity
And bad description, the production quantity, the defective products quantity, the bad description, production time, the SMT are produced into work
Single, described material information, the production identity unique identification and the production equipment unique identification information are bound, and are generated
Production information；
S4, login and the quality testing archives to match to SMT material, by the production quantity, defective products quantity
And the quality testing archives are written in bad description；
S5, acceptance inspection qualification information are generated and are examined batch number；
S6, it reads and examines employee's ID card, obtain examining equipment unique identification information, from for examining to SMT material
Examine facility information in obtain examine equipment unique identification information, by the inspection batch number, the inspection card using information and
Examine facility information that the production information is written；
S7, storage bar code information is generated, so that SMT material is stored in SMT temporary library.
The beneficial effects of the present invention are: a kind of SMT producing line management method and manufacture end are believed by identity unique identification
The barcode scanning binding of breath, equipment unique identification information and material information, realizes the real-time record of material, equipment and personnel, then
In addition the multiple authentication of outbound, production and storage, to form complete product back-tracing system；Record production quantity, defective products number
Amount and bad description ensure that " transparence " management of production；It will be described in production quantity, defective products quantity and bad description write-in
Quality testing archives are convenient for subsequent bad analysis, to improve production yield.
Detailed description of the invention
Fig. 1 is a kind of flow diagram of SMT producing line management method of the embodiment of the present invention；
Fig. 2 is that a kind of SMT producing line of the embodiment of the present invention manufactures the structural schematic diagram at end.
Label declaration:
1, a kind of SMT producing line manufactures end；2, processor；3, memory.
Specific embodiment
To explain the technical content, the achieved purpose and the effect of the present invention in detail, below in conjunction with embodiment and cooperate attached
Figure is explained.
The most critical design of the present invention is: passing through identity unique identification information, equipment unique identification information and material
The barcode scanning of information is bound；Record production quantity, defective products quantity and bad description.
Before this, technical solution to facilitate the understanding of the present invention, for english abbreviation involved in the present invention, equipment
Etc. being described as follows:
(1), SMT: it is the abbreviation of Surface Mount Technology, means surface installation technique, also referred to as surface
Mounting technology or surface mounting technique, it is a kind of will to be mounted on printed circuit board without pin or short leg surface-assembled component
Surface or other substrates surface on, the circuit load technology of welding assembly is subject to by the methods of Reflow Soldering or immersed solder.
(2), AOI: it is the abbreviation of Automated Optical Inspection, means automatic optics inspection.It is base
In optical principle come the equipment that is detected to the common deficiency encountered in welding production.Upon automatic detection, machine is by taking the photograph
As head automatically scanning PCB, image is acquired, the solder joint of test is compared with the qualified parameter in database, at image
Reason, checks defect on PCB, and defect is shown/marked by display or Automatic Logos, modifies for maintenance personal.
(3), PCB: it is the abbreviation of Printed Circuit Board, means printed circuit board, also known as printed wiring board.
It is important electronic component, is the supporter of electronic component, is the carrier of electronic component electrical connection.
Please refer to Fig. 1, a kind of SMT producing line management method, comprising steps of
S1, SMT production work order is received, generates and prints the neck material information got from raw material producing line to SMT material；
S2, Manufacturing Worker's ID card is read, production identity unique identification information is obtained, from for processing to SMT material
Production equipment unique identification information is obtained in production equipment information；
To the bar code on SMT material described in S3, scanning, material information is obtained, records production quantity, defective products quantity
And bad description, the production quantity, the defective products quantity, the bad description, production time, the SMT are produced into work
Single, described material information, the production identity unique identification and the production equipment unique identification information are bound, and are generated
Production information；
S4, login and the quality testing archives to match to SMT material, by the production quantity, defective products quantity
And the quality testing archives are written in bad description；
S5, acceptance inspection qualification information are generated and are examined batch number；
S6, it reads and examines employee's ID card, obtain examining equipment unique identification information, from for examining to SMT material
Examine facility information in obtain examine equipment unique identification information, by the inspection batch number, the inspection card using information and
Examine facility information that the production information is written；
S7, storage bar code information is generated, so that SMT material is stored in SMT temporary library.
As can be seen from the above description, the beneficial effects of the present invention are: pass through identity unique identification information, equipment unique identification
Information and the barcode scanning of material information binding, realize the real-time record of material, equipment and personnel, along with outbound, production and
The multiple authentication of storage, to form complete product back-tracing system；Production quantity, defective products quantity and bad description are recorded, is protected
" transparence " management of production is demonstrate,proved；The quality testing archives are written into production quantity, defective products quantity and bad description, just
In subsequent bad analysis, to improve production yield.
Further, production equipment unique identification information includes: upper trigger unique identification information, tin cream in the step S2
Printing machine unique identification information, tin cream detection machine unique identification information, chip mounter unique identification information, AOI detection machine are uniquely marked
Know information, reflow machine unique identification information and lower trigger unique identification information；
The step S3 further include:
The PCB bar code of S31, scanning to upper plate PCB, obtains and records upper plate PCB information and upper plate time, records upper plate
The quantity of PCB information obtains PCB investment number, treats upper plate PCB and carry out automatic upper plate, obtain cream PCB to be brushed；
S32, tin cream information and steel mesh information for printing cream PCB to be brushed are recorded, transferred and the cream PCB phase to be brushed
The brush cream technique data matched carry out automatic printing tin cream to cream PCB to be brushed, obtain brush cream PCB；
S33, carry out the automatic tin cream of SPI to brush cream PCB and detect, obtain brush cream PCB tin cream information and tin to be detected
Cream data obtain standard tin cream data according to the tin cream information, tin cream data to be detected and standard tin cream data are compared
It is right, if comparison is inconsistent, the inconsistent cream of the brush PCB of tin cream comparing to be detected is rejected, to obtain to patch PCB；
To the PCB bar code of patch PCB described in S34, scanning, patch PCB information and patch time are obtained and recorded, is transferred
The paster technique data to match with the patch PCB information treat patch PCB and carry out automatic chip mounting, obtain patch PCB；
S35, AOI visual inspection is carried out to patch PCB, obtains chip data to be detected, transferred and believe with the patch PCB
The matched qualified chip data of manner of breathing, chip data to be detected and qualified chip data are compared, if comparison is inconsistent,
Chip data to be detected is compared the inconsistent PCB of patch to reject, to obtain to Reflow Soldering PCB；
To the PCB bar code of Reflow Soldering PCB described in S36, scanning, when obtaining and recording Reflow Soldering PCB information and Reflow Soldering
Between, the reflow soldering process data to match with the Reflow Soldering PCB information are transferred, Reflow Soldering PCB is treated and carries out Reflow Soldering, obtain
Reflow Soldering PCB；
S37, AOI visual inspection is carried out to Reflow Soldering PCB, obtains Reflow Soldering data to be detected, transfers and the reflux
Reflow Soldering data to be detected and qualified Reflow Soldering data are compared the qualified Reflow Soldering data that weldering PCB information matches, if
Compare inconsistent, the then PCB of the Reflow Soldering rejecting that Reflow Soldering comparing to be detected is inconsistent, to obtain to lower plate PCB；
To the PCB bar code of lower plate PCB described in S38, scanning, lower plate PCB information and lower plate time are obtained and recorded, is recorded
The quantity of lower plate PCB information obtains PCB output number, treats lower plate PCB and carries out automatic board descending, and issues information to be transported.
As can be seen from the above description, each procedure in SMT technique is all recorded in real time, it is more complete to be formed
Product back-tracing system；The verifying of brush code all is carried out to each procedure and process data assigns Instructing manufacture automatically, thus to SMT work
Each of skill process flow is all strictly managed, and defective products is prevented, to improve the overall quality of product.
Further, the step S34 further include:
Remove patch PCB information from the upper plate PCB information, to obtain the bad PCB information of brush cream, record brush cream is bad
The quantity of PCB information obtains brush cream defective products quantity；
The step S36 further include:
Remove Reflow Soldering PCB information from the patch PCB information, to obtain the bad PCB information of patch, record patch is not
The quantity of good PCB information obtains patch defective products quantity；
The step S38 further include:
Remove lower plate PCB information, from the Reflow Soldering PCB information to obtain the bad PCB information of Reflow Soldering, record reflux
The quantity for welding bad PCB information obtains Reflow Soldering defective products quantity；
After the step S38 further include:
The brush cream defective products quantity, patch defective products quantity and Reflow Soldering defective products quantity are added, with
To SMT defective products quantity.
As can be seen from the above description, passing through the PCB information of two procedures, the PCB information being removed can be learnt, due to being picked
The pcb board removed is defective products, so the PCB information being removed is bad PCB information, so as to obtain each process stream
The process rate of the defective products of journey, the process rate of each process flow and entire SMT producing line, in order to subsequent bad system
Meter analysis.
Further, the step S33 further include:
From first of detection brush cream PCB counted, obtain brush cream detection sequence, obtain and compare inconsistent brush
Bad position information of the cream PCB in the brush cream detection sequence, finds location information from upper plate sequence and bad position is believed
Identical upper plate PCB information is ceased, bad brush cream PCB information is labeled as, the bad brush cream PCB information is added to obtain
Brush cream defective products quantity, the upper plate sequence are the upper plate PCB information being arranged successively according to the upper plate time；
The step S35 further include:
From first of inspection patch PCB counted, obtain patch and check sequence, obtain and compare inconsistent patch
Piece PCB checks the bad position information in sequence in the patch, and location information is found from patch sequence and bad position is believed
Identical patch PCB information is ceased, bad patch PCB information is labeled as, the bad patch PCB information is added to obtain
Patch defective products quantity, the patch sequence are the patch PCB information being arranged successively according to the patch time；
The step S37 further include:
From first of inspection Reflow Soldering PCB counted, obtain Reflow Soldering and check sequence, it is inconsistent to obtain comparison
Bad position information of the Reflow Soldering PCB in the Reflow Soldering detection sequence, found from Reflow Soldering sequence location information with
The identical Reflow Soldering PCB information of bad position information is labeled as bad Reflow Soldering PCB information, and the bad Reflow Soldering PCB is believed
Breath is added to obtain Reflow Soldering defective products quantity, and the Reflow Soldering sequence is the reflux being arranged successively according to the Reflow Soldering time
Weld PCB information；
After the step S38 further include:
The brush cream defective products quantity, patch defective products quantity and Reflow Soldering defective products quantity are added, with
To SMT defective products quantity.
As can be seen from the above description, providing the technical solution of another statistics defective products, production is manufactured in SMT producing line,
Each pcb board successively carries out completing various processes, so bad Reflow Soldering PCB letter is found out by the same position in two sequences
Breath, so as to obtain defective products, the process rate of each process flow and the system of entire SMT producing line of each process flow
Journey yield, in order to subsequent bad statistical analysis.
Further, the step S32 further include:
Obtain and prestore every in tin cream amount and current brush cream technique data with cream amount, by every with cream amount multiply in it is described
The quantity of brush cream PCB obtains tin cream consumption, and the tin cream amount that prestores is subtracted tin cream consumption to obtain real-time tin cream amount, is sentenced
Whether the real-time tin cream amount of breaking reaches default tin cream lower limit value, if reaching, issues tin cream and lacks material alarm；
The step S34 further include:
The every material quantity prestored in patch inventory and current paster technique data is obtained, every material quantity is multiplied in institute
The quantity for stating patch PCB obtains patch consumption, and the patch amount that prestores is subtracted patch consumption to obtain real-time patch
Amount, judges whether the real-time patch amount reaches default patch material lower limit value, if reaching, issues patch material and lacks material report
It is alert；
The step S36 further include:
The every consumable quantity prestored in Reflow Soldering inventory and current reflow soldering process data is obtained, every consumable quantity is multiplied
Reflow Soldering consumption is obtained in the quantity of the PCB of Reflow Soldering, the Reflow Soldering consumable quantity that prestores is subtracted into Reflow Soldering consumption
Amount judges whether the real-time Reflow Soldering consumable quantity reaches default Reflow Soldering consumptive material lower limit to obtain real-time Reflow Soldering consumable quantity
Value issues Reflow Soldering consumptive material and lacks material alarm if reaching.
As can be seen from the above description, being monitored in real time to tin cream amount, patch inventory and Reflow Soldering consumable quantity, occurring
Lack material before just carry out real-time early warning, to avoid because lack expect due to caused by stop line, so as to improve production efficiency.
As shown in Fig. 2, a kind of SMT producing line manufactures end, including memory, processor and storage on a memory and can located
The computer program run on reason device, the processor perform the steps of when executing the computer program
S1, SMT production work order is received, generates and prints the neck material information got from raw material producing line to SMT material；
S2, Manufacturing Worker's ID card is read, production identity unique identification information is obtained, from for processing to SMT material
Production equipment unique identification information is obtained in production equipment information；
To the bar code on SMT material described in S3, scanning, material information is obtained, records production quantity, defective products quantity
And bad description, the production quantity, the defective products quantity, the bad description, production time, the SMT are produced into work
Single, described material information, the production identity unique identification and the production equipment unique identification information are bound, and are generated
Production information；
S4, login and the quality testing archives to match to SMT material, by the production quantity, defective products quantity
And the quality testing archives are written in bad description；
S5, acceptance inspection qualification information are generated and are examined batch number；
S6, it reads and examines employee's ID card, obtain examining equipment unique identification information, from for examining to SMT material
Examine facility information in obtain examine equipment unique identification information, by the inspection batch number, the inspection card using information and
Examine facility information that the production information is written；
S7, storage bar code information is generated, so that SMT material is stored in SMT temporary library.
As can be seen from the above description, the beneficial effects of the present invention are: pass through identity unique identification information, equipment unique identification
Information and the barcode scanning of material information binding, realize the real-time record of material, equipment and personnel, along with outbound, production and
The multiple authentication of storage, to form complete product back-tracing system；Production quantity, defective products quantity and bad description are recorded, is protected
" transparence " management of production is demonstrate,proved；The quality testing archives are written into production quantity, defective products quantity and bad description, just
In subsequent bad analysis, to improve production yield.
Further, production equipment unique identification information includes: upper trigger unique identification information, tin cream in the step S2
Printing machine unique identification information, tin cream detection machine unique identification information, chip mounter unique identification information, AOI detection machine are uniquely marked
Know information, reflow machine unique identification information and lower trigger unique identification information；
When the processor realizes the step S3 when executing the computer program further include:
The PCB bar code of S31, scanning to upper plate PCB, obtains and records upper plate PCB information and upper plate time, records upper plate
The quantity of PCB information obtains PCB investment number, treats upper plate PCB and carry out automatic upper plate, obtain cream PCB to be brushed；
S32, tin cream information and steel mesh information for printing cream PCB to be brushed are recorded, transferred and the cream PCB phase to be brushed
The brush cream technique data matched carry out automatic printing tin cream to cream PCB to be brushed, obtain brush cream PCB；
S33, carry out the automatic tin cream of SPI to brush cream PCB and detect, obtain brush cream PCB tin cream information and tin to be detected
Cream data obtain standard tin cream data according to the tin cream information, tin cream data to be detected and standard tin cream data are compared
It is right, if comparison is inconsistent, the inconsistent cream of the brush PCB of tin cream comparing to be detected is rejected, to obtain to patch PCB；
To the PCB bar code of patch PCB described in S34, scanning, patch PCB information and patch time are obtained and recorded, is transferred
The paster technique data to match with the patch PCB information treat patch PCB and carry out automatic chip mounting, obtain patch PCB；
S35, AOI visual inspection is carried out to patch PCB, obtains chip data to be detected, transferred and believe with the patch PCB
The matched qualified chip data of manner of breathing, chip data to be detected and qualified chip data are compared, if comparison is inconsistent,
Chip data to be detected is compared the inconsistent PCB of patch to reject, to obtain to Reflow Soldering PCB；
To the PCB bar code of Reflow Soldering PCB described in S36, scanning, when obtaining and recording Reflow Soldering PCB information and Reflow Soldering
Between, the reflow soldering process data to match with the Reflow Soldering PCB information are transferred, Reflow Soldering PCB is treated and carries out Reflow Soldering, obtain
Reflow Soldering PCB；
S37, AOI visual inspection is carried out to Reflow Soldering PCB, obtains Reflow Soldering data to be detected, transfers and the reflux
Reflow Soldering data to be detected and qualified Reflow Soldering data are compared the qualified Reflow Soldering data that weldering PCB information matches, if
Compare inconsistent, the then PCB of the Reflow Soldering rejecting that Reflow Soldering comparing to be detected is inconsistent, to obtain to lower plate PCB；
To the PCB bar code of lower plate PCB described in S38, scanning, lower plate PCB information and lower plate time are obtained and recorded, is recorded
The quantity of lower plate PCB information obtains PCB output number, treats lower plate PCB and carries out automatic board descending, and issues information to be transported.
As can be seen from the above description, each procedure in SMT technique is all recorded in real time, it is more complete to be formed
Product back-tracing system；The verifying of brush code all is carried out to each procedure and process data assigns Instructing manufacture automatically, thus to SMT work
Each of skill process flow is all strictly managed, and defective products is prevented, to improve the overall quality of product.
Further, when realizing the step S34 when processor executes the computer program further include:
Remove patch PCB information from the upper plate PCB information, to obtain the bad PCB information of brush cream, record brush cream is bad
The quantity of PCB information obtains brush cream defective products quantity；
When the processor realizes the step S36 when executing the computer program further include:
Remove Reflow Soldering PCB information from the patch PCB information, to obtain the bad PCB information of patch, record patch is not
The quantity of good PCB information obtains patch defective products quantity；
When the processor realizes the step S38 when executing the computer program further include:
Remove lower plate PCB information, from the Reflow Soldering PCB information to obtain the bad PCB information of Reflow Soldering, record reflux
The quantity for welding bad PCB information obtains Reflow Soldering defective products quantity；
After the step S38, the processor also performs the steps of when executing the computer program
The brush cream defective products quantity, patch defective products quantity and Reflow Soldering defective products quantity are added, with
To SMT defective products quantity.
As can be seen from the above description, passing through the PCB information of two procedures, the PCB information being removed can be learnt, due to being picked
The pcb board removed is defective products, so the PCB information being removed is bad PCB information, so as to obtain each process stream
The process rate of the defective products of journey, the process rate of each process flow and entire SMT producing line, in order to subsequent bad system
Meter analysis.
Further, when realizing the step S33 when processor executes the computer program further include:
From first of detection brush cream PCB counted, obtain brush cream detection sequence, obtain and compare inconsistent brush
Bad position information of the cream PCB in the brush cream detection sequence, finds location information from upper plate sequence and bad position is believed
Identical upper plate PCB information is ceased, bad brush cream PCB information is labeled as, the bad brush cream PCB information is added to obtain
Brush cream defective products quantity, the upper plate sequence are the upper plate PCB information being arranged successively according to the upper plate time；
When the processor realizes the step S35 when executing the computer program further include:
From first of inspection patch PCB counted, obtain patch and check sequence, obtain and compare inconsistent patch
Piece PCB checks the bad position information in sequence in the patch, and location information is found from patch sequence and bad position is believed
Identical patch PCB information is ceased, bad patch PCB information is labeled as, the bad patch PCB information is added to obtain
Patch defective products quantity, the patch sequence are the patch PCB information being arranged successively according to the patch time；
When the processor realizes the step S37 when executing the computer program further include:
From first of inspection Reflow Soldering PCB counted, obtain Reflow Soldering and check sequence, it is inconsistent to obtain comparison
Bad position information of the Reflow Soldering PCB in the Reflow Soldering detection sequence, found from Reflow Soldering sequence location information with
The identical Reflow Soldering PCB information of bad position information is labeled as bad Reflow Soldering PCB information, and the bad Reflow Soldering PCB is believed
Breath is added to obtain Reflow Soldering defective products quantity, and the Reflow Soldering sequence is the reflux being arranged successively according to the Reflow Soldering time
Weld PCB information；
After the step S38, the processor also performs the steps of when executing the computer program
The brush cream defective products quantity, patch defective products quantity and Reflow Soldering defective products quantity are added, with
To SMT defective products quantity.
As can be seen from the above description, providing the technical solution of another statistics defective products, production is manufactured in SMT producing line,
Each pcb board successively carries out completing various processes, so bad Reflow Soldering PCB letter is found out by the same position in two sequences
Breath, so as to obtain defective products, the process rate of each process flow and the system of entire SMT producing line of each process flow
Journey yield, in order to subsequent bad statistical analysis.
Further, when realizing the step S32 when processor executes the computer program further include:
Obtain and prestore every in tin cream amount and current brush cream technique data with cream amount, by every with cream amount multiply in it is described
The quantity of brush cream PCB obtains tin cream consumption, and the tin cream amount that prestores is subtracted tin cream consumption to obtain real-time tin cream amount, is sentenced
Whether the real-time tin cream amount of breaking reaches default tin cream lower limit value, if reaching, issues tin cream and lacks material alarm；
When the processor realizes the step S34 when executing the computer program further include:
The every material quantity prestored in patch inventory and current paster technique data is obtained, every material quantity is multiplied in institute
The quantity for stating patch PCB obtains patch consumption, and the patch amount that prestores is subtracted patch consumption to obtain real-time patch
Amount, judges whether the real-time patch amount reaches default patch material lower limit value, if reaching, issues patch material and lacks material report
It is alert；
When the processor realizes the step S36 when executing the computer program further include:
The every consumable quantity prestored in Reflow Soldering inventory and current reflow soldering process data is obtained, every consumable quantity is multiplied
Reflow Soldering consumption is obtained in the quantity of the PCB of Reflow Soldering, the Reflow Soldering consumable quantity that prestores is subtracted into Reflow Soldering consumption
Amount judges whether the real-time Reflow Soldering consumable quantity reaches default Reflow Soldering consumptive material lower limit to obtain real-time Reflow Soldering consumable quantity
Value issues Reflow Soldering consumptive material and lacks material alarm if reaching.
As can be seen from the above description, being monitored in real time to tin cream amount, patch inventory and Reflow Soldering consumable quantity, occurring
Lack material before just carry out real-time early warning, to avoid because lack expect due to caused by stop line, so as to improve production efficiency.
Please refer to Fig. 1, the embodiment of the present invention one are as follows:
A kind of SMT producing line management method, comprising steps of
S1, SMT production work order is received, generates and prints the neck material information got from raw material producing line to SMT material；
S2, Manufacturing Worker's ID card is read, production identity unique identification information is obtained, from for processing to SMT material
Production equipment unique identification information is obtained in production equipment information；
S3, scanning obtain material information to the bar code on SMT material, record production quantity, defective products quantity and not
Good description, by production quantity, defective products quantity, bad description, production time, SMT production work order, material information, production identity
Unique identification and production equipment unique identification information are bound, and production information is generated；
S4, log in the quality testing archives that match to SMT material, by production quantity, defective products quantity and bad retouch
State write-in quality testing archives；
S5, acceptance inspection qualification information are generated and are examined batch number；
S6, it reads and examines employee's ID card, obtain examining equipment unique identification information, from for examining to SMT material
It examines to obtain in facility information and examines equipment unique identification information, batch number will be examined, examine card using information and examine equipment
Production information is written in information；
S7, storage bar code information is generated, so that SMT material is stored in SMT temporary library.
Wherein, in step S2 production equipment unique identification information include: upper trigger unique identification information, stencil printer only
One identification information, chip mounter unique identification information, AOI detection machine unique identification information, returns at tin cream detection machine unique identification information
Fluid welding machine unique identification information and lower trigger unique identification information；
Step S3 further include:
The PCB bar code of S31, scanning to upper plate PCB, obtains and records upper plate PCB information and upper plate time, records upper plate
The quantity of PCB information obtains PCB investment number, treats upper plate PCB and carry out automatic upper plate, obtain cream PCB to be brushed；
S32, tin cream information and steel mesh information for printing cream PCB to be brushed are recorded, transfers and matches with cream PCB to be brushed
Brush cream technique data carry out automatic printing tin cream to cream PCB to be brushed, obtain brush cream PCB；
S33, carry out the automatic tin cream of SPI to brush cream PCB and detect, obtain brush cream PCB tin cream information and tin to be detected
Cream data obtain standard tin cream data according to tin cream information, and tin cream data to be detected are compared with standard tin cream data, if
Compare inconsistent, the then cream of the brush PCB rejecting that tin cream comparing to be detected is inconsistent, to obtain to patch PCB；
The PCB bar code of S34, scanning to patch PCB, obtains and records patch PCB information and patch time, transfer and paste
The paster technique data that piece PCB information matches treat patch PCB and carry out automatic chip mounting, obtain patch PCB；
S35, AOI visual inspection is carried out to patch PCB, obtains chip data to be detected, transfers and patch PCB information phase
Matched qualification chip data, chip data to be detected and qualified chip data are compared, will be to if comparison is inconsistent
Detection chip data compares the inconsistent PCB of patch and rejects, to obtain to Reflow Soldering PCB；
The PCB bar code of S36, scanning to Reflow Soldering PCB, obtains and records Reflow Soldering PCB information and Reflow Soldering time, adjusts
The reflow soldering process data to match with Reflow Soldering PCB information are taken, Reflow Soldering PCB is treated and carries out Reflow Soldering, obtain Reflow Soldering
PCB；
S37, AOI visual inspection is carried out to Reflow Soldering PCB, obtains Reflow Soldering data to be detected, transfers and Reflow Soldering PCB
Reflow Soldering data to be detected and qualified Reflow Soldering data are compared the qualified Reflow Soldering data that information matches, if comparing
It is inconsistent, then the inconsistent PCB of Reflow Soldering of Reflow Soldering comparing to be detected is rejected, to obtain to lower plate PCB；
The PCB bar code of S38, scanning to lower plate PCB, obtains and records lower plate PCB information and lower plate time, records lower plate
The quantity of PCB information obtains PCB output number, treats lower plate PCB and carries out automatic board descending, and issues information to be transported.
Please refer to Fig. 1, the embodiment of the present invention two are as follows:
A kind of SMT producing line management method, on the basis of the above embodiment 1, step S34 further include:
Remove patch PCB information from upper plate PCB information, to obtain the bad PCB information of brush cream, records the bad PCB of brush cream
The quantity of information obtains brush cream defective products quantity；
Step S36 further include:
Remove Reflow Soldering PCB information from patch PCB information, to obtain the bad PCB information of patch, record patch is bad
The quantity of PCB information obtains patch defective products quantity；
Step S38 further include:
Remove lower plate PCB information from Reflow Soldering PCB information, to obtain the bad PCB information of Reflow Soldering, record Reflow Soldering is not
The quantity of good PCB information obtains Reflow Soldering defective products quantity；
After step S38 further include:
Brush cream defective products quantity, patch defective products quantity and Reflow Soldering defective products quantity are added, to obtain SMT
Defective products quantity.
Please refer to Fig. 1, the embodiment of the present invention three are as follows:
A kind of SMT producing line management method, on the basis of the above embodiment 1, step S33 further include:
From first of detection brush cream PCB counted, obtain brush cream detection sequence, obtain and compare inconsistent brush
Bad position information of the cream PCB in brush cream detection sequence, finds location information and bad position information phase from upper plate sequence
Same upper plate PCB information is labeled as bad brush cream PCB information, bad brush cream PCB information is added bad to obtain brush cream
Product quantity, upper plate sequence are the upper plate PCB information being arranged successively according to the upper plate time；
Step S35 further include:
From first of inspection patch PCB counted, obtain patch and check sequence, obtain and compare inconsistent patch
Piece PCB checks the bad position information in sequence in patch, and location information and bad position information phase are found from patch sequence
Same patch PCB information is labeled as bad patch PCB information, bad patch PCB information is added bad to obtain patch
Product quantity, patch sequence are the patch PCB information being arranged successively according to the patch time；
Step S37 further include:
From first of inspection Reflow Soldering PCB counted, obtain Reflow Soldering and check sequence, it is inconsistent to obtain comparison
Bad position information of the Reflow Soldering PCB in Reflow Soldering detection sequence, found from Reflow Soldering sequence location information with it is bad
The identical Reflow Soldering PCB information of location information is labeled as bad Reflow Soldering PCB information, and bad Reflow Soldering PCB information is carried out phase
Reflow Soldering defective products quantity is obtained, Reflow Soldering sequence is the Reflow Soldering PCB information being arranged successively according to the Reflow Soldering time；
After step S38 further include:
Brush cream defective products quantity, patch defective products quantity and Reflow Soldering defective products quantity are added, to obtain SMT
Defective products quantity.
Please refer to Fig. 1, the embodiment of the present invention four are as follows:
A kind of SMT producing line management method, on the basis of the above embodiment 1, step S32 further include:
It obtains and prestores every in tin cream amount and current brush cream technique data with cream amount, every is multiplied with cream amount in brush cream
The quantity of PCB obtains tin cream consumption, will prestore tin cream amount and subtracts tin cream consumption to obtain real-time tin cream amount, judges real-time tin
Whether cream amount reaches default tin cream lower limit value, if reaching, issues tin cream and lacks material alarm；
Step S34 further include:
The every material quantity prestored in patch inventory and current paster technique data is obtained, every material quantity is multiplied in
The quantity of patch PCB obtains patch consumption, will prestore patch amount and subtracts patch consumption to obtain real-time patch amount, judges reality
When patch amount whether reach default patch material lower limit value, if reaching, issue patch material lack material alarm；
Step S36 further include:
The every consumable quantity prestored in Reflow Soldering inventory and current reflow soldering process data is obtained, every consumable quantity is multiplied
Reflow Soldering consumption is obtained in the quantity of Reflow Soldering PCB, Reflow Soldering consumable quantity will be prestored and subtract Reflow Soldering consumption to obtain
Real-time Reflow Soldering consumable quantity, judges whether real-time Reflow Soldering consumable quantity reaches default Reflow Soldering consumptive material lower limit value and send out if reaching
Reflow Soldering consumptive material lacks material alarm out.
Referring to figure 2., the embodiment of the present invention five are as follows:
A kind of SMT producing line manufactures end 1, including memory 3, processor 2 and is stored on memory 3 and can be in processor 2
The step of computer program of upper operation, processor 2 realizes above-described embodiment one when executing computer program.
Referring to figure 2., the embodiment of the present invention six are as follows:
A kind of SMT producing line manufacture end 1, on the basis of above-described embodiment five, processor 2 is realized when executing computer program
The step of above-described embodiment two.
Referring to figure 2., the embodiment of the present invention seven are as follows:
A kind of SMT producing line manufacture end 1, on the basis of above-described embodiment five, processor 2 is realized when executing computer program
The step of above-described embodiment three.
Referring to figure 2., the embodiment of the present invention eight are as follows:
A kind of SMT producing line manufacture end 1, on the basis of above-described embodiment five, processor 2 is realized when executing computer program
The step of above-described embodiment four.
In conclusion a kind of SMT producing line management method provided by the invention and manufacture end, are believed by identity unique identification
The barcode scanning binding of breath, equipment unique identification information and material information, realizes the real-time record of material, equipment and personnel, together
When each procedure in SMT technique is all recorded in real time, to form complete product back-tracing system；To each procedure
All carry out the verifying of brush code and process data assign Instructing manufacture automatically, thus to each of SMT technique process flow all into
The stringent control of row, prevents defective products, to improve the overall quality of product；Production quantity, defective products quantity and bad description are recorded,
It ensure that " transparence " management of production；The quality testing archives are written into production quantity, defective products quantity and bad description,
By the record of bad behavior of two kinds of different schemes, the processing procedure of the defective products of available each process flow, each process flow
The process rate of yield and entire SMT producing line is convenient for subsequent bad analysis, to improve production yield.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalents made by bright specification and accompanying drawing content are applied directly or indirectly in relevant technical field, similarly include
In scope of patent protection of the invention.
Claims (10)
1. a kind of SMT producing line management method, which is characterized in that comprising steps of
S1, SMT production work order is received, generates and prints the neck material information got from raw material producing line to SMT material；
S2, Manufacturing Worker's ID card is read, production identity unique identification information is obtained, from for processing the production to SMT material
Production equipment unique identification information is obtained in facility information；
To the bar code on SMT material described in S3, scanning, material information is obtained, record production quantity, defective products quantity and not
The production quantity, the defective products quantity, the bad description, production time, the SMT are produced work order, institute by good description
It states material information, the production identity unique identification and the production equipment unique identification information to be bound, generates production
Information；
S4, log in the quality testing archives to match to SMT material, by the production quantity, defective products quantity and not
The quality testing archives are written in good description；
S5, acceptance inspection qualification information are generated and are examined batch number；
S6, it reads and examines employee's ID card, obtain examining equipment unique identification information, from for examining the inspection to SMT material
It is obtained in facility information and examines equipment unique identification information, by the inspection batch number, the inspection card using information and inspection
The production information is written in facility information；
S7, storage bar code information is generated, so that SMT material is stored in SMT temporary library.
2. a kind of SMT producing line management method according to claim 1, which is characterized in that production equipment in the step S2
Unique identification information includes: upper trigger unique identification information, stencil printer unique identification information, tin cream detection machine unique identification
Information, chip mounter unique identification information, AOI detection machine unique identification information, reflow machine unique identification information and lower trigger
Unique identification information；
The step S3 further include:
The PCB bar code of S31, scanning to upper plate PCB, obtains and records upper plate PCB information and upper plate time, records upper plate PCB
The quantity of information obtains PCB investment number, treats upper plate PCB and carry out automatic upper plate, obtain cream PCB to be brushed；
S32, tin cream information and steel mesh information for printing cream PCB to be brushed are recorded, transfers and matches with the cream PCB to be brushed
Brush cream technique data carry out automatic printing tin cream to cream PCB to be brushed, obtain brush cream PCB；
S33, carry out the automatic tin cream of SPI to brush cream PCB and detect, obtain brush cream PCB tin cream information and tin cream number to be detected
According to, standard tin cream data are obtained according to the tin cream information, tin cream data to be detected are compared with standard tin cream data, if
Compare inconsistent, the then cream of the brush PCB rejecting that tin cream comparing to be detected is inconsistent, to obtain to patch PCB；
To the PCB bar code of patch PCB described in S34, scanning, patch PCB information and patch time are obtained and recorded, is transferred and institute
The paster technique data that patch PCB information matches are stated, patch PCB is treated and carries out automatic chip mounting, obtain patch PCB；
S35, AOI visual inspection is carried out to patch PCB, obtains chip data to be detected, transfers and the patch PCB information phase
Matched qualification chip data, chip data to be detected and qualified chip data are compared, will be to if comparison is inconsistent
Detection chip data compares the inconsistent PCB of patch and rejects, to obtain to Reflow Soldering PCB；
To the PCB bar code of Reflow Soldering PCB described in S36, scanning, Reflow Soldering PCB information and Reflow Soldering time are obtained and recorded, is adjusted
The reflow soldering process data to match with the Reflow Soldering PCB information are taken, Reflow Soldering PCB is treated and carries out Reflow Soldering, returned
Fluid welding PCB；
S37, AOI visual inspection is carried out to Reflow Soldering PCB, obtains Reflow Soldering data to be detected, transfers and the Reflow Soldering PCB
Reflow Soldering data to be detected and qualified Reflow Soldering data are compared the qualified Reflow Soldering data that information matches, if comparing
It is inconsistent, then the inconsistent PCB of Reflow Soldering of Reflow Soldering comparing to be detected is rejected, to obtain to lower plate PCB；
To the PCB bar code of lower plate PCB described in S38, scanning, lower plate PCB information and lower plate time are obtained and recorded, records lower plate
The quantity of PCB information obtains PCB output number, treats lower plate PCB and carries out automatic board descending, and issues information to be transported.
3. a kind of SMT producing line management method according to claim 2, which is characterized in that the step S34 further include:
Remove patch PCB information from the upper plate PCB information, to obtain the bad PCB information of brush cream, records the bad PCB of brush cream
The quantity of information obtains brush cream defective products quantity；
The step S36 further include:
Remove Reflow Soldering PCB information from the patch PCB information, to obtain the bad PCB information of patch, record patch is bad
The quantity of PCB information obtains patch defective products quantity；
The step S38 further include:
Remove lower plate PCB information from the Reflow Soldering PCB information, to obtain the bad PCB information of Reflow Soldering, record Reflow Soldering is not
The quantity of good PCB information obtains Reflow Soldering defective products quantity；
After the step S38 further include:
The brush cream defective products quantity, patch defective products quantity and Reflow Soldering defective products quantity are added, to obtain SMT
Defective products quantity.
4. a kind of SMT producing line management method according to claim 2, which is characterized in that the step S33 further include:
From first of detection brush cream PCB counted, obtain brush cream detection sequence, obtain and compare inconsistent brush cream
Bad position information of the PCB in the brush cream detection sequence, finds location information and bad position information from upper plate sequence
Identical upper plate PCB information is labeled as bad brush cream PCB information, the bad brush cream PCB information is added to be brushed
Cream defective products quantity, the upper plate sequence are the upper plate PCB information being arranged successively according to the upper plate time；
The step S35 further include:
From first of inspection patch PCB counted, obtain patch and check sequence, obtain and compare inconsistent patch
PCB checks the bad position information in sequence in the patch, and location information and bad position information are found from patch sequence
Identical patch PCB information is labeled as bad patch PCB information, the bad patch PCB information is added to be pasted
Piece defective products quantity, the patch sequence are the patch PCB information being arranged successively according to the patch time；
The step S37 further include:
From first of inspection Reflow Soldering PCB counted, obtain Reflow Soldering and check sequence, obtain that comparison is inconsistent to have returned
Bad position information of the fluid welding PCB in the Reflow Soldering detection sequence, found from Reflow Soldering sequence location information with it is bad
The identical Reflow Soldering PCB information of location information, be labeled as bad Reflow Soldering PCB information, by the bad Reflow Soldering PCB information into
Row is added to obtain Reflow Soldering defective products quantity, and the Reflow Soldering sequence is the Reflow Soldering being arranged successively according to the Reflow Soldering time
PCB information；
After the step S38 further include:
The brush cream defective products quantity, patch defective products quantity and Reflow Soldering defective products quantity are added, to obtain SMT
Defective products quantity.
5. a kind of SMT producing line management method according to claim 2, which is characterized in that the step S32 further include:
It obtains and prestores every in tin cream amount and current brush cream technique data with cream amount, every is multiplied with cream amount in the brush cream
The quantity of PCB obtains tin cream consumption, and the tin cream amount that prestores is subtracted tin cream consumption to obtain real-time tin cream amount, judges institute
It states whether real-time tin cream amount reaches default tin cream lower limit value, if reaching, issues tin cream and lack material alarm；
The step S34 further include:
Obtain and prestore every material quantity in patch inventory and current paster technique data, by every material quantity multiply in it is described
The quantity of patch PCB obtains patch consumption, and the patch amount that prestores is subtracted patch consumption to obtain real-time patch amount, is sentenced
Whether the real-time patch amount of breaking reaches default patch material lower limit value, if reaching, issues patch material and lacks material alarm；
The step S36 further include:
The every consumable quantity prestored in Reflow Soldering inventory and current reflow soldering process data is obtained, every consumable quantity is multiplied in institute
The quantity for stating Reflow Soldering PCB obtains Reflow Soldering consumption, by it is described prestore Reflow Soldering consumable quantity subtract Reflow Soldering consumption with
Real-time Reflow Soldering consumable quantity is obtained, judges whether the real-time Reflow Soldering consumable quantity reaches default Reflow Soldering consumptive material lower limit value, if
Reach, then issues Reflow Soldering consumptive material and lack material alarm.
6. a kind of SMT producing line manufactures end, can be run on a memory and on a processor including memory, processor and storage
Computer program, which is characterized in that the processor performs the steps of when executing the computer program
S1, SMT production work order is received, generates and prints the neck material information got from raw material producing line to SMT material；
S2, Manufacturing Worker's ID card is read, production identity unique identification information is obtained, from for processing the production to SMT material
Production equipment unique identification information is obtained in facility information；
To the bar code on SMT material described in S3, scanning, material information is obtained, record production quantity, defective products quantity and not
The production quantity, the defective products quantity, the bad description, production time, the SMT are produced work order, institute by good description
It states material information, the production identity unique identification and the production equipment unique identification information to be bound, generates production
Information；
S4, log in the quality testing archives to match to SMT material, by the production quantity, defective products quantity and not
The quality testing archives are written in good description；
S5, acceptance inspection qualification information are generated and are examined batch number；
S6, it reads and examines employee's ID card, obtain examining equipment unique identification information, from for examining the inspection to SMT material
It is obtained in facility information and examines equipment unique identification information, by the inspection batch number, the inspection card using information and inspection
The production information is written in facility information；
S7, storage bar code information is generated, so that SMT material is stored in SMT temporary library.
7. a kind of SMT producing line according to claim 6 manufactures end, which is characterized in that production equipment is only in the step S2
One identification information includes: upper trigger unique identification information, stencil printer unique identification information, tin cream detection machine unique identification letter
Breath, chip mounter unique identification information, AOI detection machine unique identification information, reflow machine unique identification information and lower trigger are only
One identification information；
When the processor realizes the step S3 when executing the computer program further include:
The PCB bar code of S31, scanning to upper plate PCB, obtains and records upper plate PCB information and upper plate time, records upper plate PCB
The quantity of information obtains PCB investment number, treats upper plate PCB and carry out automatic upper plate, obtain cream PCB to be brushed；
S32, tin cream information and steel mesh information for printing cream PCB to be brushed are recorded, transfers and matches with the cream PCB to be brushed
Brush cream technique data carry out automatic printing tin cream to cream PCB to be brushed, obtain brush cream PCB；
S33, carry out the automatic tin cream of SPI to brush cream PCB and detect, obtain brush cream PCB tin cream information and tin cream number to be detected
According to, standard tin cream data are obtained according to the tin cream information, tin cream data to be detected are compared with standard tin cream data, if
Compare inconsistent, the then cream of the brush PCB rejecting that tin cream comparing to be detected is inconsistent, to obtain to patch PCB；
To the PCB bar code of patch PCB described in S34, scanning, patch PCB information and patch time are obtained and recorded, is transferred and institute
The paster technique data that patch PCB information matches are stated, patch PCB is treated and carries out automatic chip mounting, obtain patch PCB；
S35, AOI visual inspection is carried out to patch PCB, obtains chip data to be detected, transfers and the patch PCB information phase
Matched qualification chip data, chip data to be detected and qualified chip data are compared, will be to if comparison is inconsistent
Detection chip data compares the inconsistent PCB of patch and rejects, to obtain to Reflow Soldering PCB；
To the PCB bar code of Reflow Soldering PCB described in S36, scanning, Reflow Soldering PCB information and Reflow Soldering time are obtained and recorded, is adjusted
The reflow soldering process data to match with the Reflow Soldering PCB information are taken, Reflow Soldering PCB is treated and carries out Reflow Soldering, returned
Fluid welding PCB；
S37, AOI visual inspection is carried out to Reflow Soldering PCB, obtains Reflow Soldering data to be detected, transfers and the Reflow Soldering PCB
Reflow Soldering data to be detected and qualified Reflow Soldering data are compared the qualified Reflow Soldering data that information matches, if comparing
It is inconsistent, then the inconsistent PCB of Reflow Soldering of Reflow Soldering comparing to be detected is rejected, to obtain to lower plate PCB；
To the PCB bar code of lower plate PCB described in S38, scanning, lower plate PCB information and lower plate time are obtained and recorded, records lower plate
The quantity of PCB information obtains PCB output number, treats lower plate PCB and carries out automatic board descending, and issues information to be transported.
8. a kind of SMT producing line according to claim 7 manufactures end, which is characterized in that the processor executes the calculating
When realizing the step S34 when machine program further include:
Remove patch PCB information from the upper plate PCB information, to obtain the bad PCB information of brush cream, records the bad PCB of brush cream
The quantity of information obtains brush cream defective products quantity；
When the processor realizes the step S36 when executing the computer program further include:
Remove Reflow Soldering PCB information from the patch PCB information, to obtain the bad PCB information of patch, record patch is bad
The quantity of PCB information obtains patch defective products quantity；
When the processor realizes the step S38 when executing the computer program further include:
Remove lower plate PCB information from the Reflow Soldering PCB information, to obtain the bad PCB information of Reflow Soldering, record Reflow Soldering is not
The quantity of good PCB information obtains Reflow Soldering defective products quantity；
After the step S38, the processor also performs the steps of when executing the computer program
The brush cream defective products quantity, patch defective products quantity and Reflow Soldering defective products quantity are added, to obtain SMT
Defective products quantity.
9. a kind of SMT producing line according to claim 7 manufactures end, which is characterized in that the processor executes the calculating
When realizing the step S33 when machine program further include:
From first of detection brush cream PCB counted, obtain brush cream detection sequence, obtain and compare inconsistent brush cream
Bad position information of the PCB in the brush cream detection sequence, finds location information and bad position information from upper plate sequence
Identical upper plate PCB information is labeled as bad brush cream PCB information, the bad brush cream PCB information is added to be brushed
Cream defective products quantity, the upper plate sequence are the upper plate PCB information being arranged successively according to the upper plate time；
When the processor realizes the step S35 when executing the computer program further include:
From first of inspection patch PCB counted, obtain patch and check sequence, obtain and compare inconsistent patch
PCB checks the bad position information in sequence in the patch, and location information and bad position information are found from patch sequence
Identical patch PCB information is labeled as bad patch PCB information, the bad patch PCB information is added to be pasted
Piece defective products quantity, the patch sequence are the patch PCB information being arranged successively according to the patch time；
When the processor realizes the step S37 when executing the computer program further include:
From first of inspection Reflow Soldering PCB counted, obtain Reflow Soldering and check sequence, obtain that comparison is inconsistent to have returned
Bad position information of the fluid welding PCB in the Reflow Soldering detection sequence, found from Reflow Soldering sequence location information with it is bad
The identical Reflow Soldering PCB information of location information, be labeled as bad Reflow Soldering PCB information, by the bad Reflow Soldering PCB information into
Row is added to obtain Reflow Soldering defective products quantity, and the Reflow Soldering sequence is the Reflow Soldering being arranged successively according to the Reflow Soldering time
PCB information；
After the step S38, the processor also performs the steps of when executing the computer program
The brush cream defective products quantity, patch defective products quantity and Reflow Soldering defective products quantity are added, to obtain SMT
Defective products quantity.
10. a kind of SMT producing line according to claim 7 manufactures end, which is characterized in that the processor executes the calculating
When realizing the step S32 when machine program further include:
It obtains and prestores every in tin cream amount and current brush cream technique data with cream amount, every is multiplied with cream amount in the brush cream
The quantity of PCB obtains tin cream consumption, and the tin cream amount that prestores is subtracted tin cream consumption to obtain real-time tin cream amount, judges institute
It states whether real-time tin cream amount reaches default tin cream lower limit value, if reaching, issues tin cream and lack material alarm；
When the processor realizes the step S34 when executing the computer program further include:
Obtain and prestore every material quantity in patch inventory and current paster technique data, by every material quantity multiply in it is described
The quantity of patch PCB obtains patch consumption, and the patch amount that prestores is subtracted patch consumption to obtain real-time patch amount, is sentenced
Whether the real-time patch amount of breaking reaches default patch material lower limit value, if reaching, issues patch material and lacks material alarm；
When the processor realizes the step S36 when executing the computer program further include:
The every consumable quantity prestored in Reflow Soldering inventory and current reflow soldering process data is obtained, every consumable quantity is multiplied in institute
The quantity for stating Reflow Soldering PCB obtains Reflow Soldering consumption, by it is described prestore Reflow Soldering consumable quantity subtract Reflow Soldering consumption with
Real-time Reflow Soldering consumable quantity is obtained, judges whether the real-time Reflow Soldering consumable quantity reaches default Reflow Soldering consumptive material lower limit value, if
Reach, then issues Reflow Soldering consumptive material and lack material alarm.
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