JP2008053443A - Method for manufacturing semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of absolutely determining the right and wrong of a child board with a simple method and without dependent on an influence of a material, a handling, and a combination or the like of the board to be able to mount components such as semiconductor chip or the like on only the good board. <P>SOLUTION: The method for manufacturing the semiconductor device of this invention comprises an IC mounting step for mounting an IC tag 3 on a board sheet 1 after imposing a plurality of piece substrates 2 to the substrate 1 to form a circuit pattern to the piece susbtrate 2, a determination step for determining the right or the wrong by inspecting the circuit pattern of each piece substrate 2 before mounting the components on each piece substrate 2, a write step for writing the determination information of the good or the wrong of each piece substrate 2 to the IC tag in response to the result of the determination step, a read step for reading the determination information from the IC tag, and a mounting step for mounting the component only on the piece substrate 2 that is determined as the good substrate on the basis of the determination information which is read out in the read step. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a semiconductor device by imposing a plurality of the same type of individual substrates (sub-substrates) on a single substrate sheet (parent substrate) and mounting components on the sub-substrate. About.

  Conventionally, various semiconductor devices equipped with semiconductor elements (semiconductor chips) have been used in a wide range of fields. As such a semiconductor device, for example, in addition to lead type semiconductor devices such as DIP (Dual Inline Package) and QFP (Quad Flat Package), recently, it is possible to mount at higher density. A CSP (Chip Size Package) type package in which a package such as a BGA (Ball Grid Array) in which ball-shaped connection terminals are arranged in a lattice pattern on the bottom surface has been developed.

  Various BGA type semiconductor devices have been proposed and commercialized. For example, one of them is a face-up structure. Then, in this BGA type semiconductor device having the face-up structure, in order to improve the production efficiency at the time of manufacture, for example, as shown in FIG. Using a multi-sided substrate 100 having a product forming region 101), semiconductor chips are mounted on each of the individualized regions 101 of the multi-sided substrate 100, and the semiconductor chips are collectively sealed with a single-sided mold by resin sealing. There is known a method (hereinafter referred to as a collective manufacturing method) (see, for example, Patent Document 1).

  In manufacturing a BGA type semiconductor device using this collective manufacturing method, a multi-sided substrate is prepared, and a circuit pattern such as an electrode pad is provided for each product forming region (hereinafter referred to as an individualized region) on the main surface of the multi-sided substrate. After the individual substrate is formed, a semiconductor chip is mounted for each individual region. Thereafter, for each individualized region, the electrode pad (connecting portion) formed on the main surface of the semiconductor chip and the electrode pad (connecting portion) formed in the individualized region are electrically connected by a bonding wire. Thereafter, the semiconductor chips mounted in the individualized regions of the multi-sided substrate are collectively sealed with a resin to form a resin sealing body on the main surface side of the multi-sided substrate. Then, ball-shaped bumps are formed on the back side of the multi-sided board for each individualized area, and then the resin sealing body is singulated (divided and cut) for each individualized area of the multi-sided board.

By the way, in the manufacture of the BGA type semiconductor device adopting the collective manufacturing method, each individual substrate provided with a circuit pattern as a product formation region may have a defective portion for some reason during the manufacturing. So it is not always good products.
Therefore, it is necessary to inspect the quality of the individual substrate before mounting the semiconductor chip. Normally, the quality inspection of a single substrate (before mounting a semiconductor chip) on a multi-sided board is performed by a checker (for example, a tester or a probe). In some cases, a multi-sided board including a single piece substrate is manufactured. Therefore, in general, a mark for distinguishing between a non-defective product and a defective product is provided to distinguish between a non-defective product and a defective product on an individual substrate.

Here, a specific method for recognizing a non-defective product and a defective product of a conventional individual substrate will be described.
In general, as a method of distinguishing good products from defective products, for example, as shown in FIG. 4A, a particularly defective piece among the individual substrates 201 provided on the multi-sided substrate 200 which is a single substrate sheet. The single substrate 201A itself is marked with an X or the like, or, as shown in FIG. 4B, a tie bar 202 which is a connecting portion between the multi-chip substrate 200 and the individual substrates 201 or a connecting portion between the individual substrates 201. For example, by marking the image recognition mark 203 that has been formed on the substrate with ink, etc., an ink marking method for discriminating between non-defective products and defective products, or marking by irradiating individual substrates with laser light using a YAG laser, etc. A laser marking method or the like is possible.

  However, in the ink marking method, the mark may be peeled off depending on how the substrate is handled and the compatibility between the substrate and the ink, and if the cleaning is performed in a later process, the mark may be removed. There is a problem such as contamination, and there is a restriction on how to mark.

  On the other hand, the laser marking method may not be detected by image recognition depending on the combination with the substrate. In other words, the combination of the substrate material and the substrate processing method (without copper foil, with copper foil, plating on copper foil, etc.) may not be able to recognize the mark due to the lack of contrast despite the marking. I sometimes get up.

  This situation is the same when lead-type semiconductor devices such as DIP (Dual Inline Package) and QFP (Quad Flat Package) are manufactured collectively using a lead frame, and a CSP type such as BGA is used. As in the case of the semiconductor device described above, there is a demand for development of a means for reliably determining the quality of each substrate without being affected by the influence of the material of the substrate, the handling of the substrate, the combination with the substrate, and the like.

  Therefore, for example, the coordinate data of the defective part is created and the coordinate data of the defective part and the board identification data on the multi-sided board are recorded in the data file of the online server, and the board identification data on the multi-sided board is stored in the wireless tag. A method of manufacturing a semiconductor device that has been recorded and mounted on a multi-sided substrate has been proposed (for example, see Patent Document 1).

  In addition, the recognition of the substrate sheet is identified using a barcode or a two-dimensional barcode, and the information on the non-defective product, defective product, etc. in the substrate is verified by collating the database in the separately prepared data server with the recognition code of the substrate. Has been proposed (see, for example, Patent Document 2).

  Further, an IC tag chip is embedded in a parent substrate having a plurality of child substrates, and identification information of the child substrate is written in the tag chip. Separately, information unique to each child substrate, such as a position reference mark, is stored in the information management server. A method has also been proposed in which a relative position of the device is stored, information is read from the management server each time in the production stage, and a process is performed on the child board (see, for example, Patent Document 3).

JP 2004-179234 A JP 2005-332278 A JP 2004-078552 A

However, when determining the quality of a substrate by such a method, the substrate is a non-defective product using a wireless tag or barcode, a wireless tag or barcode reader, and an online server. The wireless tag and the barcode function only as a substrate ID determining means. In other words, while the board identification data and the board pass / fail information are read by the online server, the board identification data is acquired from the wireless tag or barcode by the reading apparatus, and then the information is exchanged between the online server and the reading apparatus. Then, after determining which board corresponding to the board identification data is a non-defective product by the online server, the components are mounted using the chip mounter.
Therefore, the transmission of good / bad information is complicated, and accordingly, the component mounting method in manufacturing the semiconductor device becomes complicated. Further, since additional equipment such as an online server is required, the entire system for manufacturing the semiconductor device may be complicated and enlarged, and the manufacturing cost of the semiconductor device may be increased.

  Therefore, the object of the present invention is to reliably determine the quality of a sub board by a simple method without being influenced by the influence of the material of the board, the handling of the board, the combination with the board, etc. An object of the present invention is to provide a method of manufacturing a semiconductor device capable of mounting a component such as a chip.

  A method of manufacturing a semiconductor device according to the present invention that can solve the above-described problem is a method of manufacturing a semiconductor device by imposing a plurality of child substrates on a parent substrate and mounting components on the child substrate. A mounting step of mounting an IC tag on the parent substrate after forming the circuit pattern on the child substrate, and inspecting the circuit pattern on each of the child substrates before mounting the component on the child substrate. A determination step for determining good or bad, a writing step for writing good or defective determination information of each of the sub-boards on the IC tag according to a result of the determination step, and the determination information from the IC tag. And a mounting step of mounting a component only on a good-determined sub-board based on the determination information read in the reading step.

  In the method for manufacturing a semiconductor device according to the present invention, it is preferable that in the mounting step, the IC tag is mounted in a recess formed in the parent substrate.

  The semiconductor device manufacturing method according to the present invention may include a step of forming an antenna of the IC tag on the parent substrate.

  Further, in the method for manufacturing a semiconductor device according to the present invention, the array information of the child substrate in the parent substrate is stored in a mounting device used in the mounting process, and the writing process corresponds to the array information corresponding to the array information. It is preferable that identification information of the sub board is written in the IC tag together with the determination information.

  According to the present invention, a formed circuit pattern is inspected for a sub-board mounted on a plurality of substrates on the parent substrate to determine whether it is good or defective, and the determination information is provided to an IC tag mounted on the parent substrate. Therefore, by reading the determination information from the IC tag before mounting the component on the child board, the component can be mounted only on the non-defective child board. Therefore, there is no need for additional equipment such as a server for exchanging information about the good or bad of the sub board, and the sub board is good or bad regardless of the influence of the board material, board handling, combination with the board, etc. Can be reliably determined by a simple method.

Hereinafter, an example of an embodiment of a method for manufacturing a semiconductor device according to the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 shows a state of a substrate in the middle of manufacturing in the method for manufacturing a semiconductor device of the present embodiment, and a plurality of individual substrates 2 as small substrates are applied to a substrate sheet 1 as a parent substrate. .

  The substrate sheet 1 is a discarded substrate that is used in the process of manufacturing a semiconductor device by mounting components on the individual substrate 2 and then becomes unnecessary after the manufacture of the semiconductor device is completed. In other words, an insulating sheet or a plate material impregnated with an insulating resin. In order to increase the mounting efficiency when, for example, a printed board is manufactured and a chip component is mounted on the board, the board sheet 1 includes an individual board 2 used at an actual product level as shown in FIG. A plurality of sheets (5 × 2 = 10) are formed in an aligned state at the center. That is, if this board sheet 1 is used, the number of work sheets of the board sheet 1 in the mounting machine can be reduced by repeating the mounting operation of the same components by the number of individual boards 2 laid out on the board sheet 1. In addition, it is possible to increase the manufacturing efficiency by optimizing the work size of the substrate sheet 1 to be applied to the mounting machine. In the present embodiment, a case will be described in which the present invention is applied to a printed circuit board in which 10 identical individual substrates 2 are laid out on a single substrate sheet 1.

  Each individual substrate 2 is formed so as to be integrally attached to the substrate sheet 1 and is connected to the substrate sheet 1 in a state where the periphery is connected to the substrate sheet 1 by a tie bar 11 or the like. Each individual substrate 2 is provided with a region on which a semiconductor chip (for example, a chip resistor, a chip capacitor, an IC, a transistor) or the like that is a component of the semiconductor device is mounted. A circuit pattern or the like for achieving a general connection or the like is formed with a copper foil or the like at a predetermined position. For example, a solder paste is printed on the circuit pattern of the individual substrate 2 through a printing mask. Each mounted component is mounted at a predetermined position by a mounter, and the entire substrate sheet 1 is heated in a reflow furnace to melt the solder paste, and the melted solder is solidified and fixed on the individual substrate 2.

  An IC tag 3 is mounted on the substrate sheet 1. The IC tag 3 is an integrated circuit that basically includes a memory circuit that records (stores and stores) data, an RF (Radio Frequency) circuit for wireless communication, and a logic circuit that connects these circuits. Built-in or externally attached. Further, the IC tag 3 does not have a battery or other power source inside, and receives, for example, a radio wave generated by a reader (tag reader) via an antenna, and generates an electromotive force by electromagnetic induction using the received radio wave. Then, the above-described circuit is operated with the generated electric power (power supply), and the recorded board identification data is wirelessly transmitted to the reading device. One IC tag 3 of the present embodiment is mounted in a recess 1A formed in the substrate sheet 1.

  The printed circuit board having the substrate sheet 1 and the individual substrate 2 is completed after several steps such as circuit pattern printing, exposure, etching, lamination, through-hole formation, plating, and the like. A probe is applied to check the connection, insulation, short circuit, etc. of the circuit pattern, and check whether the pattern as set can be formed. Therefore, in this process, what is determined to be good and what is determined to be bad are generated.

  When manufacturing a printed circuit board having a plurality of individual substrates 2 in the substrate sheet 1, the substrate sheet 1 consisting only of those in which all the individual substrates 2 in the substrate sheet 1 are determined to be good is used. For example, it is not necessary to judge whether each of the individual substrates 2 in the substrate sheet 1 is good or defective. However, assuming that only a good number of individual substrates 2 in the substrate sheet 1 are used, if a defective individual substrate 2 is included in a part of the substrate sheet 1, all the remaining individual substrates 2 are used. Even if the individual substrate 2 is a non-defective product, the substrate sheet 1 to which these are attached is discarded. For this reason, production efficiency is very bad and the cost increases.

  Therefore, in the present embodiment, after the circuit pattern is formed on the individual substrate 2 in the substrate sheet 1, the process of mounting the IC tag 3 on the substrate sheet 1 (mounting process) is performed, and then the circuit of each individual substrate 2 is performed. The pattern is inspected to determine whether it is good or bad (determination step), and according to the determination result, the good or bad determination information of each individual substrate 2 is written to the IC tag 3 (writing step). Then, before mounting the component on the individual substrate 2, the determination information is read from the IC tag 3 (reading step), and the component is mounted only on the good determination individual substrate 2 based on the read determination information (mounting step). ).

  Next, each step of the manufacturing method of the semiconductor device of this embodiment will be specifically described. In the present embodiment, ten individual substrates 2 are laid out in the substrate sheet 1, and each individual substrate 2 is assigned in advance with an identification number of 1 to 10 in order to identify the individual. Has been.

  First, after forming a circuit pattern on the individual substrate 2 in the substrate sheet 1, a general-purpose IC tag 3 is attached to the substrate sheet 1 as shown in FIG. 1 (mounting process). The IC tag 3 has a package shape in which a chip and an antenna are integrated, and is attached to a recess 1A on the substrate sheet 1. The attachment portion of the IC tag 3 has a structure in which a recess 1A is provided by processing the substrate from the surface of the substrate sheet 1 or by laminating prepregs with open windows. Thus, by providing the depression 1A, the IC tag 3 can be installed in this depression. For example, when the solder printing mask is brought into close contact with the substrate surface, the IC tag 3 is obstructed and the mask is lifted so that it cannot be brought into good contact. Such a trouble can be avoided, and a structure that does not prevent the solder printing mask from being in close contact with the substrate surface can be realized.

  The IC tag 3 used in this embodiment has a size of about 20 mm × 5 mm and exchanges data at a radio frequency of 13.56 MHz. The memory capacity of the IC tag 3 is 128 bytes, and the antenna is provided inside the IC tag 3. For attachment to the substrate sheet 1, an elongate sheet-like IC tag 3 is attached to the recess 1A of the substrate sheet 1 by using an adhesive. The adhesive is fixed using a silicon-based adhesive, assuming that no harmful gas or the like is generated even when heated to about 300 ° C.

  If the IC tag is a type that does not incorporate an antenna, an antenna pattern dedicated to the IC tag is provided on a part of the substrate sheet 1, and the antenna pattern is connected to the IC tag so that the antenna Function can be realized. For example, as shown in FIG. 2, a general-purpose IC tag 31 may be directly mounted in a recess of the substrate sheet 1, and the antenna portion of the IC tag 31 may be formed in a copper foil pattern using the substrate sheet 1. That is, the antenna pattern 32 is provided on the inner layer or the outer layer of the substrate sheet 1, and the IC tag 31 and the antenna pattern 32 are electrically connected by a circuit pattern provided separately. The antenna pattern 32 is formed on the inner layer portion of the substrate sheet 1 on both sides of the IC tag 31 by an electric length of a certain length. Note that, unlike the IC tag 3 of FIG. 1, the IC tag 31 is molded with a resin 31A because the internal circuit is exposed in a bare state. Moreover, since the generation | occurrence | production of an electromagnetic shielding effect | action is avoided by removing copper foil, it becomes possible to prevent that antenna sensitivity falls for the part of the board | substrate sheet | seats 1 such as the back surface of IC tag.

  In the form of FIG. 2, the antenna pattern 32 is formed at the same time as the circuit pattern of the individual substrate 2 of the substrate sheet 1 is formed, and the circuit pattern for connecting the antenna pattern 32 and the IC tag 31 is formed at the same time. This is convenient because the man-hours need not be increased.

  Subsequent to the mounting process, probing is performed on the substrate sheet 1 on which the IC tag 3 is mounted, and the connection of the circuit pattern of each individual substrate 2, confirmation of insulation, short circuit, etc. is performed, thereby determining whether the product is good or defective. (Determination step), for example, it is assumed that No. 3 and No. 5 of the individual substrates 2 are determined to be defective. In this case, 20-byte data “1101011111” is output to the control device of the inspection machine as the non-defective product or defective product information of the individual substrate 2 from the inspection machine that has performed probing. Here, “1” is a non-defective product and is an individual substrate 2 on which a mounting component can be mounted. On the other hand, “0” represents an individual substrate 2 that is defective and incapable of mounting a mounting component.

  A data writer for writing data to the IC tag 3 is prepared adjacent to the probing equipment, whereby the IC tag 3 on the substrate sheet 1 is judged as good or bad for each individual substrate 2. Data is written on the result (writing process). In the present embodiment, as described above, writing of 20 bytes of data “1101011111” is performed.

If there is a margin in the memory capacity of the IC tag 3, not only the quality information and defective product information of the individual substrate 2 but also the type of the individual substrate 2, the manufacturing lot number, etc. can be written. For example, if the symbol (substrate sheet name) representing the type of the substrate sheet 1 is SUB1234 and the lot number is 060522,
“SUB1234 □ 060522 □ 1101011111” (□ represents a space)
Such data can also be written.

  Next, the process proceeds to a process of mounting mounted components such as a chip resistor, a chip capacitor, an IC, and a transistor on the substrate sheet 1 (a mounting process). In the mounting process, each substrate sheet 1 is sequentially conveyed, and after each solder paste is printed on each substrate sheet 1 via a metal mask, the mounted component is mounted on a chip mounter (automatic mounting). Machine). Then, the reading device (tag reader) reads the non-defective product or defective product information of each individual substrate 2 from the IC tag 3 of each substrate sheet 1 being conveyed, and in the mounting program prepared in the control device of the chip mounter, It is taken in as information on good or defective products of the individual substrate 2 (reading process).

For example, in this embodiment,
“SUB1234 □ 060522 □ 1101011111”
The data up to the first space (□), the information on the type of the individual substrate 2, the information up to the next space (□), the production lot number information, and the remaining parts are non-defective and defective products of the substrate 2. Since there are 10 ASCII characters, the number of the boards 2 is 10, and among the identification numbers for the boards 2, 1, 2, 4, 6, 7, 8, 9, 10 The data shows that the sheet is a non-defective product and the two of 3 and 5 are defective products. According to the data of the non-defective product and the defective product, the chip mounter skips the mounting work of the mounting parts corresponding to the identification numbers 3, 3 and 5 of the individual pieces of the board 2, and from the 1st to the 10th. The mounting components are sequentially mounted on each individual substrate 2 (mounting process).

  The solder paste used here is the same as that used in normal component mounting, such as Sn-Ag-Cu solder or Sn-Pb solder. The substrate transfer device is provided with a reading device (tag reader) for the IC tag 3, and the memory information of the IC tag 3 mounted on the substrate sheet 1 is read during the transfer of the substrate sheet 1. In the chip mounter, all necessary components are prepared with chip components, chip capacitors, ICs, transistors, and other mounted components in a reel or bulk case. The quantity of the substrates 2 and the coordinate data of the individual substrates 2 in the substrate sheet 1 are prepared according to a separately created mounting program and read into the control device of the chip mounter.

  After mounting components are mounted in the mounting process, visual inspection is performed, and if there is a need for reworking, the reworking is performed, and then the individual board 2 on which the mounting components are mounted is transported to the solder reflow device. It will be fixed to the individual substrate 2 with solder. In the case of a double-sided board, the same solder reflow mounting process is performed on the back surface, and mounting components are mounted on the individual board 2.

  After finishing the solder mounting (reflow) process of the mounted component, next, necessary visual inspection or visual inspection by X-ray observation or the like is performed, and the board sheet 1 that has passed this inspection is obtained from the board sheet 1 to the individual board 2. Are cut and divided using a die or a router or other equipment. At this stage, the individual substrate 2, the substrate sheet 1, and the IC tag 3 mounted thereon are separated.

  As described above, according to the semiconductor device manufacturing method of the present embodiment, all the position information such as the component mounting position and the coordinate information of the individual substrate 2 are taken into the program of the control device of the chip mounter. . On the other hand, the non-defective product and defective product information of the individual substrate 2 in the substrate sheet 1 which is a discarded substrate is stored in the memory of the IC tag 3 on the substrate sheet 1 together with the ID information (individual piece information) of the individual substrate 2. ing. Therefore, by adding only the reading device (tag reader) for the IC tag 3 to the existing chip mounter, the ID information of the individual substrate 2 can be taken in, and the non-defective / unusable information of the individual substrate 2 is managed. There is no need to prepare additional equipment such as a server for the purpose.

  In addition, when a mark for optical reading indicating good and defective as in the conventional case is provided on the substrate sheet 1 or the individual substrate 2 itself, there is a problem of reading accuracy, a difference in reading standard depending on the substrate material, etc. However, in this embodiment, by reading information from the IC tag 3, the reading method is uniquely determined by electromagnetic means, and as digital information. Can be captured. Accordingly, advantages such as improvement of reading accuracy and elimination of the difference in reading standards depending on the substrate material are born, and the present invention provides a large-scale additional equipment such as a data server except for the equipment for reading / writing the IC tag 3. Do not need.

It is the schematic which shows the state of the board | substrate in the middle of manufacture in the manufacturing method of the semiconductor device which concerns on this invention, (A) is a top view, (B) is the II sectional view taken on the line in (A). It is the schematic which shows the state of the board | substrate in the middle of manufacture in the manufacturing method of the semiconductor device which concerns on this invention, (A) is a top view, (B) is the II-II sectional view taken on the line in (A). It is a top view which shows the board | substrate sheet | seat and board | substrate used when manufacturing a semiconductor device with the conventional manufacturing method. It is a schematic plan view which shows the display method by the conventional mark which shows the defective board | substrate when manufacturing a semiconductor device.

Explanation of symbols

1 Board sheet (parent board)
1A hollow 2 piece substrate (small substrate)
3,31 IC tag 32 Antenna pattern

Claims (4)

A method of manufacturing a semiconductor device by imposing a plurality of child substrates on a parent substrate and mounting components on the child substrate,
After forming a circuit pattern on the child substrate, a mounting step of mounting an IC tag on the parent substrate;
A determination step of inspecting the circuit pattern of each of the sub-boards to determine whether it is good or bad before mounting the component on the sub-board;
In accordance with the result of the determination step, a writing step for writing determination information on whether each of the child boards is good or bad on the IC tag;
A reading step of reading the determination information from the IC tag;
A mounting step of mounting a component only on a good determination sub-board based on the determination information read in the reading step;
A method for manufacturing a semiconductor device, comprising: A method of manufacturing a semiconductor device according to claim 1,
In the mounting step, the IC tag is mounted in a recess formed in the parent substrate. A method of manufacturing a semiconductor device according to claim 1 or 2,
A method of manufacturing a semiconductor device, comprising: forming an antenna of the IC tag on the parent substrate. A method for manufacturing a semiconductor device according to any one of claims 1 to 3,
The arrangement information of the child board in the parent board is stored in the mounting apparatus used in the mounting process,
In the writing step, the identification information of the sub board corresponding to the arrangement information is written to the IC tag together with the determination information.

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