1280082 九、發明說明： 【發明所屬之技術領域】 【0001】 本發明係有關於一種印刷電路板的製造方法，特別是指 關於可有效簡化步驟的印刷電路板之製造方法。 曰 【先前技術】 【0002】 一般，製造工業製品時，皆依順序進行複數的加工步驟 之處理後，經過檢查步驟而完成製品。例如，一般的電路板之 製造步驟係首先在絕緣基材的單面上，最少有銅箔等導電性金 屬層；使用所謂銅膜積層板，對這銅膜積層板的銅箔進行乾膜 型蝕刻堆疊，模版曝光，顯影，蝕刻，去膜等一連貫的光電構 成手法，以形成由銅箔做成的電路配線型版。 【0003】 然後，對另一面以粘著材層形成的絕緣樹脂膜，使用金 屬模加工處理等，形成零件裝載端子或與外部基板的連接端子 之開口，把這加工處理完成的絕緣樹脂膜使用粘著材將它粘在 上述電路基板之電路配線模版上的方法，或者，使用將絕緣樹 月旨印刷在電路基板的方法，或者是使用感光性絕緣樹脂皮膜形 成，曝光，顯影，去膜等處理方法等在電路板上形成電路配線 模版之表面保護絕緣層的絕緣皮膜。 【0004】 其次，回應需要，對端子部進行焊錫電鍍，金電鍍等之 端子電鍍處理，然後使用金屬模等做打穿處理進行製品外形的 加工步驟以後，經過電氣檢查步驟，外觀檢查步驟等檢查步驟 5 1280082 ；· 1 ' 而完成製品。又，在小型之電路板，一般係對一材料板進行複 數的電路板排版，然後一併進行製造步驟的處理。 【0005】 在這電路板完成的階段，有時候亦會有未進行電路零件 之裝配就出貨；還有，對上述電路板經進行焊_印刷，銅触 刻等而形成的被稱為準標（テrJ；L一シ肀クレv_ク）之定位 : 標誌，用來裝載各種能動元件，被動元件等之電路另件^使 焊掬熔解連接之回流焊步驟，檢查步驟等將電路另件實裝以後 鲁 出貨到各種電機電子機器公司進行裝配。 【0006】 於專利文獻1有記載開示，上述之i片材料板上把複數 片的電路板做排版（卜），經一併進行製造的方法。 還有’在專利文獻2亦有開示由複數個排版的電路板貼粘在離 型板上而構成的電路板，這種方式可使電路板之製造步驟或出 貨時的操作較簡單以及提高實裝時之作業性。 【0007】 、 瞻有關於電路另件實裝步驟的準標即在曰本電子機械工 業會規格中有其規定（請參照非專利文獻υ。準標有電路板 整個的定位用之準標和裝載電子另件時之電子另件定位用準 標等；要做電子另件裝載時，要先進行電路板的定位之準標確 認以後，做電路板定位，然後，確認電子另件定位之準標後， 將電路另件使用另件裝載機進行定位的技術在專利文獻3即 也有開示。 【0008】 還有，在專利文獻4有開示，複數種的生產對象電路板 6 1280082 混在其中進行生產時，使用設在一部份的基板之定位基準標誌 =行確認基準標如後加予讀取，以翻絲的麵，然後從 資料儲存裝置中讀出基板的種類，該適當之基板資料，依據該 資料裝載電路另件的方法。 〔專利文獻1〕實開平3_92067號公報 〔專利文獻2〕特開昭60-31290號公報 〔專利文獻3〕特開57-164310號公報 〔專利文獻4〕特開2003-318498號公報 〔非專利文獻1〕日本電子機械工業會規格EIAJ et—73〇2 【0009】 先前技術： 向來，於進行電路板的另件實裝前之電路板的製造步驟 中，有關檢查步驟係如第3圖流程圖，首先使用電氣檢查裝置 (A)做有否短路或斷線等的是否滿足電氣的規格之檢查，然 後，使用所謂AOI檢查裝置做外觀檢查（B)或，使用顯微鏡 或放大鏡以目視進行外觀檢查（C)等。 【0010】 在電氣檢查步驟，發現有斷線或短路等電氣的不良之電 路板上，都會做表示不良品的不良標誌（a5)。接著使用A〇I 裝置或目視做外觀檢查’而再新發現不良時之電路板則會做表 示新的不良品之不良標誌（b6) (c6)。此時，在前步驟之電氣 檢查就已發現不良而做不良標誌的電路板亦仍然進行外觀檢 查。 【0011】 為了排除這樣的浪費作業，近年來，已有對在電氣檢杳 7 1280082 ^ ? · 步驟所發_不良αα，使用攝影機將已做不良標諸的排版位置 號碼加予讀取，然後對該不良的電路板做跨越.檢查的裝 置。 【0012】 同樣亦有對電路板的實裝電路另件時，電路另件裝賴 的攝影機亦會對林良銳的電路板，讀取無版位置號碼， 备進行實裝另件時’會跨越該不良電路板，不進行裝載另件的 實裝裝置。 【0013】 可疋’至刖步驟已成為不良品的電路板再經檢出其不良 標諸以後躲另件裝載，即會產生對不良確認減次，浪費檢 查確認的工時’所以生產性會有損失。 【0014】 還有-連貫的電路板的焊构印刷，電路另件裝載 焊處理等轉後，將電路另件加π裝的倾，若電路另件的 裝載點數較多時’則完成裝載另件處理的電路板數亦會較少， 如此一來會發生印刷機等待電路板的問題。 【0015】 對於這問題’如第4 ®流程圖所示，將複數台的另件裝 載裝置串連到印峨來加以解決，使另件的裝載速度得以提高 做回應。但是，在這種情形下，各裝載裝置為了進行定位另件 裝置位置必須讀取各裝載裝置之準標（⑹（⑵後，進行定 位（b3) (c3)，讀取不良標誌（b4) (c4)，電路板單位之準標 (b5) (c5)以後才可以做電路另件的裝載（b6) (c6)。像 樣，各裝載裝置要做準標之讀取的方法，仍然與上述的檢查步 1280082 〆 t * 驟一樣會產生讀取工時之浪費。 【0016】 本發明除了可排除如上述在電路板檢查步驟所產生之 讀取不良品電路板位置時的工時之浪費以外，還可排除於電路 另件實裝步驟所浪費的讀取準標的工時，而提高生產性，降低 製造成本的目的。 【發明内容】 【0017】 本發明係提供達成上述目的者；於由複數的步驟所形成 之印刷電板製造步驟，除了對各基板賦予個體識別號碼的同 時，將製品資料記錄裝置内之各個體固有之製品資料和個體識 別號碼賦與關連加以儲存而設置記錄領域；把從複數步驟各別 取得的該個體固有之製品資料，記錄在上述製品資料記錄裝置 内所形成的該個體固有之記錄領域，於每一步驟讀出從上述製 品資料記錄裝置内之記錄領域至之前步驟所積蓄的該個體固 有之製品資料，然後依據該製品資料進行該步驟以達成提高生 產性，降低製造成本為特徵之印刷電路板的製造方法。 【0018】 還有，提供上述的製品資料記錄裝置係設有管理整個製 造步驟的主電腦之印刷電路板的製造方法。 【0019】 又，提供上述複數步驟的各控制部設有該製品資料記錄 裝置；構成該各步驟之控制部除了從之前的步驟之製品資料記 錄裝置讀出各個體之製品資料，實施該步驟的同時，將該步驟 所取得的該個體固有之製品資料，追記至該製品資料記錄裝置 9 1280082 • * ； 内之該個體固有的記錄範圍中，然後將該個體固有之製品資料 轉送至次一步驟的製品資料記錄裝置以後進行次一步驟的 刷電路板之製造方法。 【0020】 、在上述印刷電路板之製造方法中，將檢查步驟或另件裝 載步驟等所取得的不良地方之資料，或讀取準標之結果所得到 之定位資料等資料，追加到至前步驟所取得之資料中並儲存於 資料記錄裝置中，供次一步驟的裝置之利用，如此即可以降低 在各步禅反覆取得同一資料的工時。 — 【發明的效果】 【0021】 使用本發明的製造方法’因為於製造步驟，檢查步驟， 係利用至前一步驟之製品資料，因此可以排除重複讀取至前步 驟所取得的資料之浪費，所以，可以降低在製造，檢查步驟之 工時，提高生產效率。還有本發明因具有上述效果，並不限定 使用於電路板之檢查步驟與電路板的另件裝載步驟，對各種工 業製品的製造步驟、檢查步驟所產生的排除工時之浪費都很有 效。 【實施方式】 【實施本發明的最佳形態】 【0022】 本發明係於由複數的步驟構成之印刷電路板的製造步 驟，在製品資料記錄裝置内，將各個體固有的製品資料和個體 識別號碼賦與關連加以儲存而設置記錄範圍；把每一基板所賦 予之個體識別號碼，以及各檢查步雜的良否判定標準資料，或 10 1280082 ：" r · 檢查對象基板之排版配置位置資料等加以儲存，將在複數步驟 各別取得的該個體固有之製品資料記錄在上述製品資料記錄 裝置内形成的該個體固有之記錄範圍中，於每一步驟從上述談 製品資料記錄裝置内之記錄範圍中，讀出至之前步驟為止所^ 積的該個體固有之製品資料，然後依據該製品資料進行該步 驟，如此即可排除於各步驟反覆取得同一資料的浪費，達 局生產效率的目的。 【實施例1】 • 【0023】 第1圖係表示以電路板為例，在檢查步驟之一實施例的 檢查流程圖。於此的被檢查對象製品是，在一基板内有複數的 電路板被排版配置在電路板基板上。以下，將電路板複數片排 版在電路板基板上稱為檢查對象基板，這檢查對象板内之各個 電路板即稱為檢查對象電路板。 【0024】 下列的進行電氣檢查之裝置，以及AOI檢查裝置以及顯 馨 微鏡檢查裝置都設有裝載檢查對象電路板基板的裝載台，具有 將設在裝載台之檢查對象電路板基板做預設定位在裝載台用 的導梢，與讀取準標的CCD攝影機，與將裝載台自動的移動到 電氣檢查之試具’或AOI檢查攝影機，或顯微鏡下對檢查對象 電路板進行定位的裝載台驅動機構。 【0025】 在管理或監視整個檢查系統的主電腦，與各別控制電氣 檢查裝置、AOI檢查裝置以及顯微鏡檢查裝置的電腦即各別設 有製品資料記錄裝置（本機磁碟驅動器（local disk driver) 11 或資料儲存裝置等）。於第一步驟的電氣檢查步驟，電氣檢查 裝置的控制電腦則從主電腦之製品資料記錄裝置中讀取該^ 艘固有的製品資料來實施魏檢查步驟；雜，將在電氣檢查 步驟所取得之個體m有的製品資料，追記到自主電腦取得之製 品資料中，將該製品資料轉制下—AGI檢查裝置的控制電腦 中》在AOI檢查裝置與顯微鏡檢查裝置之間，亦和上述一樣進 行製品資料的轉送；顯微鏡檢查裝置則依據電氣檢查裝置以及 AOI檢查裝置所取得的個體固有之製品資料進行實施步驟。於 各步驟取得的製品資料’亦會轉送至主電腦中，各檢查對象電 路板基板之最終的檢查結果則會保存在主電腦之製品資料記 錄裝置中。 【0026】 還有’別的製品資料流動形態’财於各步琢的該步驟 之控制電腦中’自主電腦的製品資料記錄裝置中讀出製品資料 來進行實齡m將在各步驟新取得之製品資料追記到 主電滕的製品資料記錄裝置中，亦可以回應系統的硬體構成， 或隨意的構成資料流動的形態。 【0027】 在檢查步驟’首先，對檢查對象電路板基板設定固體識 別代碼的㈣，製作於製品記錄裝置的各製品資料做儲 用之個職案。又，在製品資料記錄裝置中要事先儲存每 品代碼號絲檢查步狀觀w標準f料或，檢查對象 板的排版配置位置資料等。 【0028】 上述的個體識別代碼要將包括製品代碼號碼和製造批 1280082 號號碼，加上基板號碼等之代碼號碼，步驟處理日期，時間， 步驟處理裝置號碼等加以適當的組合，以構成可以確保步驟的 追蹤。 【0029】 如上述在製品資料記錄裝置内製作各個體識別代碼之 個別檔案以外，在各電路板基板的製品之一部份上使用雷射標 示，或喷墨標示等之印字裝置將個體識別代碼號碼加以付記。 【0030】 其次，對各檢查對象電路板，進行斷線及短路等電氣的 機能檢查之電氣檢查（A)後，對於不良檢查對象電路板，將 印墨加以塗成斑點狀，以表示為不良品做不良標誌，同時，在 製品資料記錄裝置内製作的該檢查對象電路板基板之個別檔 案中，記載不良標誌的檢查對象電路板之號碼位置加予記載後 做保存（a5)。 【0031】 完成電氣檢查（A)以後，接著使用光學的自動外觀檢 查裝置，所謂AOI檢查裝置進行自動外觀檢查（B)。在這自動 外觀檢查步驟’首先，要從製品資料記錄裝置内讀出檢查對象 電路板基板的個體識別代碼，從該個體識別代碼引導出該製品 的座標位置資料’或AOI檢查條件等的檢查資料，和至前步驟 為止的不良基板之位置資料等（b2)。 【0032】 其次’要實施AOI檢查（b4)，此時，有關於之前的電 氣檢查（A)所發現的不良，有做不良標誌的電路板，則依據 不良電路板的號碼位置資料，將A0I檢查做跨越，對其他的檢 13 1280082 ‘ f. 查對象電路板即實施Α0Ι檢查。然後，對在這Α0Ι檢查新發現 的不良檢查對象電路板做不良標达’同時，在製品資料記錄裝 置内之該檢查對象電路板基板的個別擋案中，記載不良標諸的 檢查對象電路板之號碼位置後加以存播（b5)。 【0033】 然後，要進行使用顯微鏡的目視檢查，這檢查亦和A〇I 檢查一樣，對於在之前所做的電氣檢查（A)及Α0Ι檢查（b) 所發現的不良，有做不良標誌的電路板則依據不良回路板之號 • 碼位置資料，跨越做目視檢查，其他的檢查對象電路板則實施 目視檢查（c4)。接著，在這目視檢查新發現的不良檢查對象 電路板’則做不良標諸的同時，於製品資料記錄裝置内的該檢 查對象電路板基板之個別檔案中，將有做不良標誌的檢查對象 電路板之號碼位置記入後加以存檔（C5)。 【0034】 完成檢查後，使用金屬模等做沖切加工，若要將電路板 製品加以各個的分開時，即使用自動取出裝置，讀取檢查對象 電路板基板所記載的個鱧識別代碼，將至前步称之不良電路板 的號瑪位置資料，自製品資料記錄裝置中加予讀出，將不良電 路板製品和良品的電路板製品加予識別後而取出。此時，可以 對製品或製品上所做的不良標諸進行確認，一邊和讀出的資料 做對照，進行選別作業，因此可以做更正確的選別作業，所以 更為完美。 【實施例2】 【0035】 第2圖係表示以電路板為例，於電路另件裝載步驟做為 14 1280082 ·* /. 一實施例的步驟流程圖。這裡要裝載另件的電路板，係在一片 電路板基板之中加以做複數個排版的電路板。在電路板基板上 設有個體識職碼，對板基板本雜定㈣準標、排版配 置在這電路減板之每-電路板神標、縣録的各裝載位 置所設之準標、在檢查步驟檢出的不良之電路板上做的不良標 諸等。 【0036】 本實施例所表示的電路另件裝載步驟係有關於將複數 • ^另件做輯的步驟；—台軸焊物財2纟的另件裝載 裝置（1、2)以串連做連結構成電路另件裝載裝置。 【0037】 首先，將電路板基板載放在糊焊印刷機（A)上，以進 行掏焊的物。此時，電路板基板之定位係使科梢做預先定 位，將準標使用CCD攝影機等之畫像讀取裝置做讀取（a2)， 以自動將裝載台加予移動做最终的雜（a3)，然後進行糊 的印刷（a4)。 【0038】 _ 其次，將完成印刷糊焊的電路板基板載放在第一電路另 件裝載裝置（B)上。第-電路另件裝載裝置係使用畫像讀取 裝置’讀取電雜基板做粒神標、麵識職碼、電路板 所做的不良標誌等（b2 )，對電路板基板進行定位（b3 )。然後， 讀取設在各電路板的各種準標，取得電路板基板定位資料與各 電路板的定位資料，將這些定位資料記錄到製品資料記錄裝置 内之標案的同時，讀出表示在製品資料記錄裝置内所記錄的不 良電路板之排版位置的資料（b4)。而後，對不良電路板以外 15 1280082 ·，· ^電路板，依據另件裝載之各裝載位置所設的準標，將分配到 第-電路另件裝載裝置的電路另件加以裝載（b5)。 【0039】 然後’將電路板基板載放在第二電路另件裝 上。於第二電路另件裝載裝置上，首先，使用⑽攝影== 該電路S基板之個體識別號碼。於此，將之前在第一電路另件 裝載裝置所取得的，為了定位之準標資料、不良電路板排版位 置資料、個體識別代碼等的資料，轉送到第二電路另件裝載裝 φ 置（C)的製品資料記錄裝置中，或者從上位的主電腦之盤σ 資料記錄裝置内來加以讀入，目此，不必使用CCD聽機等= 像讀入裝置來將這些的資料加予取得，如此，即可以省掉第二 電路另件裝置（C)做和第-電路另件裝餘置⑻同樣 重複的畫像處理之浪費（C2)。然後，依據自第一電路另件裝 載裝置（B) ’或主電腦的製品資料記錄裝置所得之資料，對不 良電路板以外的電路板進行定位（c3),將分配到第二電路另 件裝載裝置（C)的電路另件加予裝載（C4)。 【0040】 暴 接著，將裝載電路另件的電路板基板，使用運送機搬送 到回流焊（U 7 口一）裝置（D)中，將糊焊加予溶解（d2) 及冷卻（d3)後，把電路另件加以焊接固定。 【0041】 以上，只針對印刷電路板之製造方法做了說明，但是本 發明係不限定於上述的實施形態，在本發明的技術的範圍内可 以做各種之改變，對於需要複數階段的製造步驟之工業製品的 製造方法’本發明可以廣泛的適用，當然可以涵蓋將本發明加 16 1280082 广* 〆、 以改變者。 【圖式簡單說明】 【0042】 第1圖係表示本發明的一實施例之電路板檢查步驟的流 程圖。 第2圖係表示本發明的一實施例之電路另件實裝步驟的 流程圖^ 第3圖係表示從來的電路板檢查步驟一例之流程圖。 第4圖係表示從來的電路另件實裝步驟一例的流程圖。 【主要元件符號說明】 17[Technical Field] [0001] The present invention relates to a method of manufacturing a printed circuit board, and more particularly to a method of manufacturing a printed circuit board which can effectively simplify the steps.曰 [Prior Art] [0002] Generally, when manufacturing an industrial product, the processing is performed in a plurality of processing steps in sequence, and the product is completed through an inspection step. For example, a general circuit board manufacturing step is first to have at least one conductive metal layer such as copper foil on one side of the insulating substrate; the copper foil of the copper laminated board is dry-type using a so-called copper film laminate. A continuous optoelectronic forming process such as etching stacking, stencil exposure, development, etching, and film removal is performed to form a circuit wiring pattern made of copper foil. Then, the insulating resin film formed of the adhesive layer on the other surface is formed into a part load terminal or an opening of a connection terminal with the external substrate by using a metal mold processing or the like, and the insulating resin film which has been processed by this processing is used. a method in which an adhesive material is adhered to a circuit wiring stencil of the above circuit board, or a method of printing an insulating tree on a circuit substrate, or a photosensitive insulating resin film is used, exposure, development, film removal, etc. The processing method or the like forms an insulating film of the surface protective insulating layer of the circuit wiring stencil on the circuit board. [0004] Next, in response to the need, the terminal portion is subjected to terminal plating treatment such as solder plating, gold plating, etc., and then subjected to a punching process using a metal mold or the like to perform a processing step of the product shape, and after an electrical inspection step, an appearance inspection step, etc. Step 5 1280082;· 1 ' and complete the product. Further, in a small circuit board, a board layout of a plurality of material boards is generally performed, and then the manufacturing steps are performed together. [0005] At the stage of completion of the circuit board, there are occasions when the circuit components are not assembled and shipped; and the above-mentioned circuit board is formed by soldering, printing, copper, etc. Positioning of the standard (テrJ; L_シ肀クレv_ク): mark, used to load various active components, passive components, etc. circuit parts ^ reflow soldering steps for soldering melting, inspection steps, etc. After the installation, Lu was shipped to various motor and electronic equipment companies for assembly. Patent Document 1 discloses a method in which a plurality of circuit boards are typeset (b) on the above-mentioned i-piece material sheet, and are manufactured together. Further, in Patent Document 2, a circuit board in which a plurality of typesetting circuit boards are attached to a release board is disclosed, which makes the manufacturing process of the circuit board or the operation at the time of shipment simple and improved. Workability when mounting. [0007], and the standard for the installation steps of the circuit components is specified in the specifications of the Sakamoto Electromechanical Industry Association (please refer to the non-patent literature. The standard for the entire positioning of the circuit board and When the electronic components are loaded, the electronic components are positioned to be used for calibration; when the electronic components are to be loaded, the board positioning must be confirmed first, then the board positioning is performed, and then the electronic components are positioned. The technique of positioning the circuit component using the component loader is also disclosed in Patent Document 3. [0008] Further, in Patent Document 4, a plurality of production target circuit boards 6 1280082 are mixed therein for production. When using a positioning reference mark set on a part of the substrate = line confirmation reference mark, the reference is added to the surface to be turned, and then the type of the substrate is read from the data storage device, the appropriate substrate material, According to the method of the present invention, the method of the present invention is disclosed in Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. [Patent Document 4] JP-A-2003-318498 (Non-Patent Document 1) Japanese Electromechanical Industry Association Specification EIAJ et-73〇2 [0009] Prior Art: Conventionally, a circuit board before mounting of a circuit board In the manufacturing step, the inspection procedure is as shown in the flow chart of Fig. 3. First, the electrical inspection device (A) is used to check whether the electrical specifications are met, whether or not the short-circuit or disconnection is satisfied, and then the appearance is performed using a so-called AOI inspection device. Check (B) or use a microscope or a magnifying glass to visually inspect the appearance (C), etc. [0010] In the electrical inspection procedure, it is found that there is an electrical failure such as a wire break or a short circuit, and the defective product is defective. Mark (a5). Then use the A〇I device or visually check the appearance' and the circuit board that is newly found to be defective will be a bad mark indicating the new defective product (b6) (c6). At this time, the previous step In the electrical inspection, the circuit board that has been found to be defective and the bad mark is still inspected. [0011] In order to eliminate such wasteful work, in recent years, there have been pairs in the electrical inspection 7 1280082 ^ ? · The step _ bad αα, using the camera to add the misplaced typesetting position number to the reading, and then the device for crossing the bad board. [0012] There are also pairs of boards When the circuit is installed, the camera that is attached to the circuit will also read the plateless position number of Lin Liangrui's circuit board. When the component is installed, it will cross the bad circuit board and will not load the component. [0013] The circuit board that can be used as a defective product can be used to hide the defective parts and then the parts are loaded, which will result in the reduction of the bad confirmation and the wasteful inspection. 'There is a loss of productivity. [0014] There is also a coherent circuit board printing, after the circuit is loaded and soldered, the circuit component is tilted by π, if the circuit is loaded. When the number is large, the number of boards that complete the loading of the parts will be less, and as a result, the printing machine will wait for the board. [0015] For this problem, as shown in the 4th flow chart, a plurality of other loading devices are connected in series to the printing press to solve the problem, so that the loading speed of the parts can be improved. However, in this case, each loading device must read the calibration of each loading device in order to position the component device ((6) ((2), then perform positioning (b3) (c3), read the bad flag (b4) ( C4), the board unit's standard (b5) (c5) can only be used to load the circuit components (b6) (c6). Decent, each loading device to do the standard reading method, still with the above The inspection step 1280082 〆t* will result in waste of the reading man-hours. [0016] The present invention can eliminate the waste of man-hours when reading the defective board position as described above in the board inspection step. It is also possible to eliminate the man-hour of reading the standard waste which is wasted by the mounting step of the circuit, thereby improving the productivity and reducing the manufacturing cost. [Invention] [0017] The present invention provides a person who achieves the above object; In the step of manufacturing the printed circuit board formed by the steps, in addition to assigning the individual identification number to each substrate, the product data and the individual identification number inherent in each body in the product data recording device are associated and stored. Recording the field; the product data inherent to the individual obtained from the plurality of steps is recorded in the record field inherent to the individual formed in the product data recording device, and is read out from the product data recording device at each step Recording the product data inherent to the individual accumulated in the previous step, and then performing the step based on the product data to achieve a method of manufacturing a printed circuit board characterized by improved productivity and reduced manufacturing cost. [0018] The product data recording device described above is provided with a method of manufacturing a printed circuit board of a host computer that manages the entire manufacturing process. [0019] Further, each of the control units providing the plurality of steps is provided with the product data recording device; The control unit reads the product data of each body from the product data recording device of the previous step, and performs the step, and writes the product data inherent to the individual obtained in the step to the product data recording device 9 1280082 • * Within the inherent record range of the individual, then the individual The method of manufacturing the brush circuit board after the product data is transferred to the product data recording device of the next step, and the next step is performed. [0020] In the method for manufacturing the printed circuit board, the inspection step or the component loading step is obtained. The information of the bad place or the location data obtained by reading the result of the standard calibration is added to the data obtained in the previous step and stored in the data recording device for use by the device in the next step, thus It is possible to reduce the number of man-hours in which the same material is repeatedly obtained in each step. - [Effects of the Invention] [0021] The manufacturing method of the present invention is used because the manufacturing steps are used in the manufacturing process, and the inspection steps are used. Excluding the waste of data obtained by repeating the reading to the previous step, the production efficiency can be reduced during the manufacturing and inspection steps. Further, the present invention has the above-described effects, and is not limited to the inspection step for the circuit board and the component loading step of the circuit board, and is effective for eliminating the man-hours of the manufacturing steps and inspection steps of various industrial products. [Embodiment] [Best Mode for Carrying Out the Invention] [0022] The present invention relates to a manufacturing process of a printed circuit board comprising a plurality of steps, and in the product data recording device, product data and individual identification inherent to each body The number is assigned and stored to set the recording range; the individual identification number given to each substrate, and the quality judgment criteria of each inspection step, or 10 1280082 :" r · the layout of the target substrate is checked. And storing the product data inherent to the individual obtained in the plurality of steps in the record range inherent to the individual formed in the product data recording device, and recording the range from the above-mentioned product data recording device at each step In the process, the product data inherent to the individual accumulated in the previous step is read, and then the step is performed according to the product data, so that the waste of the same data can be repeatedly obtained in each step to achieve the purpose of production efficiency. [Embodiment 1] [0023] Fig. 1 is a flow chart showing an inspection of an embodiment of an inspection step using a circuit board as an example. The object to be inspected here is that a plurality of circuit boards in a substrate are arranged on the circuit board substrate. Hereinafter, the plurality of boards are arranged on the board substrate as the inspection target substrate, and each of the boards in the inspection target board is referred to as an inspection target board. [0024] The following apparatus for performing an electrical inspection, and the AOI inspection apparatus and the sensitized micromirror inspection apparatus are provided with a loading table on which a circuit board substrate to be inspected is mounted, and has a board substrate to be inspected on the loading table as a preset. A CCD camera that is positioned at the loading station, a CCD camera that reads the standard, a tester that automatically moves the loading table to an electrical inspection, or an AOI inspection camera, or a loading table that positions the inspection target circuit under the microscope. mechanism. [0025] In the main computer that manages or monitors the entire inspection system, and each computer that controls the electrical inspection device, the AOI inspection device, and the microscopic inspection device, respectively, a product data recording device (local disk driver) ) 11 or data storage device, etc.). In the electrical inspection step of the first step, the control computer of the electrical inspection device reads the inherent product data from the product data recording device of the host computer to implement the Wei inspection step; the miscellaneous, which will be obtained in the electrical inspection step. The product information of the individual m is recorded in the product data obtained by the independent computer, and the product data is converted into the control computer of the AGI inspection device. Between the AOI inspection device and the microscopic inspection device, the product data is also processed as described above. The microscopy device performs the implementation steps based on the individual product data obtained by the electrical inspection device and the AOI inspection device. The product data obtained at each step will also be forwarded to the main computer. The final inspection results of the circuit board substrates of each inspection object will be stored in the product data recording device of the main computer. [0026] There is also a 'other product data flow form' in the control computer of this step in the step of the step of reading the product information in the product data recording device of the independent computer to carry out the actual age m will be newly obtained in each step The product data is recorded in the product data recording device of the main electric power, and can also respond to the hardware composition of the system, or form a random flow of data. [0027] In the inspection step, first, (4) the solid identification code is set to the inspection target circuit board substrate, and each product data of the product recording device is prepared for storage. Further, in the product data recording device, it is necessary to store in advance the code number of each product code check, or to check the layout configuration information of the target board. [0028] The above-mentioned individual identification code should include the product code number and the manufacturing lot number 1280082, plus the code number such as the substrate number, the step processing date, the time, the step processing device number, etc., and the appropriate combination, so as to ensure Tracking of steps. [0029] In addition to the individual files of the respective body identification codes in the product data recording device, the individual identification code is used on a part of the products of each circuit board substrate by using a laser marking device or a printing device such as an inkjet marking device. The number is paid. [0030] Next, after performing an electrical inspection (A) for electrical functional inspection such as disconnection or short-circuit on each of the inspection target circuit boards, the ink is applied to the printed circuit board of the defective inspection object in a spot shape to indicate that it is not In the individual file of the board substrate to be inspected which is produced in the product data recording device, the number position of the board to be inspected which indicates the defective flag is added and stored (a5). [0031] After the electrical inspection (A) is completed, an optical automatic visual inspection device is used, and an AOI inspection device performs an automatic visual inspection (B). In this automatic visual inspection step, 'first, the individual identification code of the inspection target circuit board substrate is read from the product data recording device, and the inspection information such as the coordinate position data of the product or the AOI inspection condition is guided from the individual identification code. And the position data of the defective substrate up to the previous step (b2). [0032] Secondly, 'the AOI inspection (b4) is to be carried out. At this time, there is a defect found in the previous electrical inspection (A). If there is a circuit board with a bad mark, the A0I will be based on the number position information of the bad circuit board. Check to do the traverse, check the other board 13 1280082 ' f. Check the object board that is implemented Α 0 Ι check. Then, in the case of detecting the newly discovered defective inspection target circuit board, the defective component is inspected at the same time, and the defective inspection target circuit board is described in the individual file of the inspection target circuit board substrate in the product data recording device. The number position is stored and broadcasted (b5). [0033] Then, a visual inspection using a microscope is performed. This inspection is also the same as the A〇I inspection. For the defects found in the previous electrical inspection (A) and Α0 inspection (b), there is a bad mark. The circuit board is visually inspected according to the number of the bad circuit board and the code position data, and the other inspection object boards are visually inspected (c4). Then, in the visual inspection of the newly discovered defective inspection target circuit board, the defective inspection target circuit is provided in the individual files of the inspection target circuit board substrate in the product data recording device. The number of the board is recorded and archived (C5). [0034] After the inspection is completed, a punching process is performed using a metal mold or the like. If the circuit board products are to be separated from each other, the automatic identification device is used to read the identification code of the substrate to be inspected, and The position information of the defective circuit board referred to in the previous step is read from the product data recording device, and the defective circuit board product and the good circuit board product are recognized and taken out. At this time, the defective items on the product or the product can be confirmed, and the sorted work can be performed in comparison with the read data, so that a more accurate sorting operation can be performed, so that it is more perfect. [Embodiment 2] [0035] Fig. 2 is a flow chart showing the steps of a circuit board as an example, in which the circuit component loading step is 14 1280082.*. Here, the board to be loaded is used to make a plurality of typesetting boards in a circuit board substrate. An individual identification code is provided on the circuit board substrate, and the board substrate is miscellaneously set (4), and the typesetting is arranged in each of the circuit board goddess and the loading position of the county record. Check the bad parameters on the bad board that were detected in the step. [0036] The circuit loading step shown in this embodiment is a step of making a complex number of parts; the other parts loading device (1, 2) of the shaft welding material is made in series. The connection constitutes a circuit component loading device. [0037] First, the board substrate is placed on the paste-printing press (A) to perform the soldering. At this time, the positioning of the board substrate is such that the front end of the board is pre-positioned, and the image reading device such as a CCD camera is used for reading (a2) to automatically move the loading table to the final miscellaneous (a3). Then, the paste is printed (a4). [0038] Next, the board substrate on which the printing paste is completed is placed on the first circuit component loading device (B). The first-circuit component loading device uses the image reading device to read the miscellaneous substrate, the surface identification code, the defective flag of the circuit board, and the like (b2), and locates the circuit board substrate (b3). . Then, reading various calibration standards set on each circuit board, obtaining positioning data of the circuit board substrate and positioning data of each circuit board, and recording the positioning data into the standard data in the product data recording device, and reading and indicating the in-process product Information on the typesetting position of the defective circuit board recorded in the data recording device (b4). Then, on the circuit board other than the defective circuit board, the circuit component assigned to the first-circuit component loading device is loaded (b5) according to the standard set by each loading position of the component loading. [0039] Then the board substrate is placed on the second circuit component. On the second circuit component loading device, first, (10) photography == the individual identification number of the circuit S substrate. Here, the data obtained by the first circuit component loading device for the positioning of the quasi-standard data, the bad circuit board layout position data, the individual identification code, and the like are transferred to the second circuit component loading device ( In the product data recording device of C), or read from the disk data recording device of the host computer of the upper position, it is not necessary to use a CCD camera or the like to read the data. In this way, it is possible to dispense with the waste of the image processing (C2) which is repeated in the same manner as the second circuit component device (C) and the first circuit component mounting (8). Then, based on the data obtained from the first circuit component loading device (B)' or the product data recording device of the host computer, the circuit board other than the defective circuit board is positioned (c3), and the second circuit component is loaded. The circuit component of device (C) is loaded (C4). [0040] After the storm, the circuit board substrate on which the circuit is mounted is transported to the reflow soldering (U 7 port one) device (D) using a conveyor, and the paste solder is added to dissolve (d2) and after cooling (d3). , the circuit components are soldered and fixed. [0041] Although the manufacturing method of the printed circuit board has been described above, the present invention is not limited to the above-described embodiments, and various changes can be made within the scope of the technology of the present invention, and manufacturing steps requiring a plurality of stages are required. The present invention can be widely applied, and it is of course possible to cover the invention by adding 16 1280082 to a wide variety. BRIEF DESCRIPTION OF THE DRAWINGS [0042] Fig. 1 is a flow chart showing a circuit board inspection step of an embodiment of the present invention. Fig. 2 is a flow chart showing the steps of mounting a circuit component according to an embodiment of the present invention. Fig. 3 is a flow chart showing an example of a circuit board inspection step. Fig. 4 is a flow chart showing an example of a conventional circuit mounting step. [Main component symbol description] 17