CN1750740B - Method for mounting printed circuit substrate - Google Patents
Method for mounting printed circuit substrate Download PDFInfo
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- CN1750740B CN1750740B CN 200510093203 CN200510093203A CN1750740B CN 1750740 B CN1750740 B CN 1750740B CN 200510093203 CN200510093203 CN 200510093203 CN 200510093203 A CN200510093203 A CN 200510093203A CN 1750740 B CN1750740 B CN 1750740B
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Abstract
Objective of the invention is to improve productivity by omitting failure substrate information and overlapping reading of fiducial marks in the manufacturing process of a printed circuit board. There is provided a recording region in a product information recording device provided in the manufacturing apparatus of a printed circuit board for storing product data inherent to an individual product while relating the product data to an individual identification number. The individual identification number is appended for every individual substrate, and the product data inherent to the individual product obtained in each process are recorded in the recording region inherent to the individual product in the product information recording device. Product data (information or the like of a bad mark already appended) stored by the last process for every one process are read out, and on the basis of the product data the present process is implemented. There are eliminated wasteful overlapped works such as detection of a failure substrate in each process.
Description
Technical field
The present invention relates to the component mounting method of printed circuit substrate, in particular, the present invention relates to seek the component mounting method of printed circuit substrate of the simplification of step.
Background technology
Generally, when the process industry goods, carry out the processing of a plurality of procedure of processings successively, finish goods through checking step.Such as, the manufacturing step of general circuitry substrate at first adopts so-called copper-surfaced superimposed panel, the copper-surfaced superimposed panel is at least one side at insulating material, conductive metal layer with Copper Foil etc., on the Copper Foil of this copper-surfaced superimposed panel, a series of photo etching mode by overlapped layers, pattern exposure, development, etching, the resist of anti-etching dose of dry film type are peeled off etc. forms the wiring pattern that is formed by Copper Foil.
And, by following method, on circuitry substrate, form the insulating protective film of the surface protection insulating barrier of forming circuit wiring pattern, these methods are respectively: have on the insulating resin film of layer of adhesive material on a face, the splicing ear that forms component mounting terminal, external substrate according to Mould Machining processing etc. forms the opening of usefulness, is adhered to the method on the wiring pattern of foregoing circuit substrate by the adhesives insulating resin film that this processed is good; The method of printing insulating resin on circuitry substrate; The photosensitive insulating resin skin covering of the surface forms, exposes, develops, the processing method of sclerosis etc. etc.
Then, as required, scolding tin plating is coated with, terminal plating such as gold-plated is coated with processing in that portion of terminal is carried out, and then handles the goods profile is carried out after the processing steps by the punching press of mould etc., through the inspection step of electronics inspection step, visual examination step etc., finish goods.In addition, on small-sized circuitry substrate, generally on 1 material piece, arrange a plurality of circuitry substrate, carry out manufacturing step together and handle.
In the stage that this circuitry substrate is finished, also has the situation of under the situation of the installation of not carrying out circuit devcie, dispatching from the factory, but, also has following situation, promptly, relative foregoing circuit substrate, the sprocket bit that is called fiducial mark of the formation such as etching of the printing of employing by solder(ing) paste, Copper Foil, the anti-flow step of the loading of the circuit devcie of the various active elements of process, passive component etc., solder(ing) paste fusion connection usefulness, inspection step etc., circuit devcie is installed, then it is dispatched from the factory, it is assemblied in the various motor electronics.
Patent documentation 1 discloses and arranged a plurality of circuitry substrate, the method for making together on above-mentioned 1 material piece.In addition, patent documentation 2 discloses circuitry substrate according to a plurality of layouts and has been affixed on circuitry substrate on the release sheet, mentions in the document, if such formation, then carry out the manufacturing step of circuitry substrate, the processing when dispatching from the factory easily, can improve the operation when installing.
With regard to the fiducial mark of circuit devcie installation steps, it determines (with reference to non-patent literature 1) by EIAJ's specification.Following technology is disclosed in the patent documentation 3, promptly, fiducial mark comprises the fiducial mark of the location usefulness of circuitry substrate integral body, the fiducial mark of the location of the electronic device when loading electronic device usefulness etc., when loading electronic device, the fiducial mark of the location usefulness of identification circuit substrate integral body, after carrying out the circuitry substrate location, the fiducial mark of identification electronic device location usefulness, by the component mounting machine, the circuit devcie location is loaded.
In addition, following method is disclosed in patent documentation 4, in the method, the occasion of mixing the ground motion at multiple production object circuitry substrate sheet, by the fiducial mark identification mechanism, the positioning reference symbol on the part that is arranged at substrate slice is read the kind of identification substrate, read the substrates data of the kind that is equivalent to this substrate by data storage device, according to this data loading circuit device.
Patent documentation 1:JP opens flat 3-92067 document in fact
Patent documentation 2:JP spy opens clear 60-31290 document
Patent documentation 3:JP spy opens clear 57-164310 document
Patent documentation 4:JP spy opens the 2003-318498 document
Non-patent literature 1: the specification EIAJ ET-7302 of EIAJ
Summary of the invention
Past, in the manufacturing step of the circuitry substrate before carrying out the foregoing circuit device mounting, just check step, as shown in the flow chart of Fig. 3, at first, by electronic inspection device (A), check the situation that whether satisfies electronic type that has or not etc. that has or not, breaks of short circuit, then, the visual examination of carrying out in appearance inspection aspect adopting automatic shape inspection apparatus, so-called AOI testing fixture (B), adopt the visual visual examination (C) of microscope or magnifying glass etc.
Check step at electronics, respectively discovery is had the circuitry substrate of the electronics rough sledding of broken string, short circuit etc., the bad symbol that is expressed as defective products is handled (a5).To by next AOI device, visual visual examination and the bad circuitry substrate goods of new discovery, the bad symbol (b6) that mark is expressed as new defective products (c6).At this moment, even in checking, find still, to carry out visual examination under the situation of bad position, the bad symbol of mark to the circuitry substrate of circuitry substrate sheet integral body as the electronics of previous step.
In order to get rid of so useless operation, in recent years, following device is known, in this device, read in electronics by camera and check the bad symbol that marks on the defective products of step discovery, the address location is arranged in identification, and the circuitry substrate that is arranged in this address is carried out the scanning that AOI checks.
People know following erecting device, wherein, above-mentioned situation also is same for the installation of the circuit devcie of circuitry substrate, the camera of circuit devcie loading machine reads in the bad symbol that marks on the bad circuitry substrate of generation, discern the layout address location of this circuitry substrate, be arranged on the circuitry substrate of locating this address, not the loading circuit device.
But, because before the previous step, after the bad symbol that becomes the circuitry substrate of defective products is detected, device is checked, loaded to another circuitry substrate, take place repeatedly the man-hour of identification bad position, causes the generation in useless man-hour, loses aspect productivity.
Again, weld to the emulsus of circuitry substrate in the installation procedure of circuit devcie in the series of processes such as printing, circuit devcie loading, the processing of anti-stream, the circuit devcie dress is cut out under the many situations of quantity, for the circuitry substrate number that can print in the unit interval, the circuitry substrate number that can carry out the component mounting processing in the unit interval tails off, and the problem of the stand-by period that printing machine takes place is arranged.
At this problem, people consider as shown in the flow chart of Fig. 4 many component mounting devices to be connected with printing machine, by many component mounting devices, share component mounting, thus, and raising component mounting speed.In such occasion, in order to carry out the location of component mounting, each loading attachment read fiducial mark (b2) (c2), position (b3) (c3), read bad symbol (b4) (c4), the fiducial mark (b5) that reads circuitry substrate unit (c5), loading circuit device (b6) is (c6).But, read the occasion of the method for fiducial mark at each loading attachment, identical with aforesaid inspection step, read the waste in man-hour.
The objective of the invention is to get rid of and check the waste that the bad substrate location of step generation reads number at substrate as described above, and in the circuit devcie installation steps, the fiducial mark of getting rid of circuit devcie loading usefulness reads the waste in man-hour, improves productivity, cuts down manufacturing cost.
The present invention proposes to achieve these goals, the invention provides a kind of manufacture method of printed circuit substrate, it is characterized in that in the manufacturing step of the printed circuit substrate that forms by a plurality of steps, at each substrate, the individual identification number is provided, simultaneously in the product information tape deck, posting field is set, this posting field is stored each individual intrinsic goods data according to the mode relevant with this individual identification number, with respectively in the intrinsic posting field of intrinsic goods data record this individuality in being formed on the said products information record carrier of this individuality that a plurality of steps obtain, at each step, posting field in the said products information record carrier is read the individual intrinsic goods data of storing before previous step is rapid, according to these goods data, implement this step.
In addition, the invention provides the manufacture method that the said products information record carrier is arranged at the printed circuit substrate in the master computer of managing whole manufacturing step.
In addition, the invention provides the manufacture method of following printed circuit substrate, wherein, control corresponding portion in above-mentioned a plurality of steps, has the said products information record carrier, the product information tape deck of each step constitutes in the following manner, this mode is: read the intrinsic goods data of corresponding individuality from the rapid product information tape deck of previous step, implement this step, and will add to the intrinsic posting field of this individuality in this product information tape deck in the intrinsic goods data of this individuality that this step obtains, the goods data that this individuality is intrinsic transfer to the product information tape deck of next step, implement next step.
In the manufacture method of above-mentioned printed circuit substrate, will be in the information of checking the bad position that step, component mounting step etc. obtain, read the result and the data of the locating information that obtains etc. add in the information that obtains before the previous step as fiducial mark, it is stored in information record carrier, adopt the next step device, thus, can cut down the man-hour of obtaining same information in each step repeatedly.
According to the present invention, at manufacturing step, check step owing to can use the product information before the previous step, will arrive the useless operation that information that previous step obtains before repeatedly obtains so can get rid of, can cut down the man-hour of manufacturing, inspection step, enhance productivity.In addition, because the present invention realizes above-mentioned effect,, get rid of manufacturing step effectively, check the waste in the man-hour of step generation at various industrial products so be not limited to the inspection step of circuitry substrate and the component mounting step of circuitry substrate.
Description of drawings
Fig. 1 represents one embodiment of the present of invention, and it checks the flow chart of step for circuitry substrate;
Fig. 2 represents one embodiment of the present of invention, and it is the flow chart of circuit devcie installation steps;
Fig. 3 checks the flow chart of an example of step for expression circuitry substrate in the past;
Fig. 4 is the flow chart of an example of expression circuit devcie installation steps in the past.
Embodiment
The present invention is in the manufacturing step of the printed circuit substrate that is formed by a plurality of steps, in the product information tape deck, posting field is set, this posting field is stored the intrinsic goods data of corresponding individuality according to the mode relevant with the individual identification number, the individual identification number that storage is paid at each substrate and each are checked the good not judgment standard information of step, check the position information of object substrate etc., will be at the corresponding steps of a plurality of steps and this individuality that obtains intrinsic this individuality intrinsic posting field of goods data record in being formed at the said products information record carrier, at each step, posting field in the said products information record carrier, read into the individual intrinsic goods data of having stored before the previous step, implement this step according to these goods data, thus, eliminating obtains the useless operation of same data repeatedly in each step, realizes the purpose that production efficiency improves.
Embodiment 1
Fig. 1 is the inspection flow chart of an embodiment of the inspection step of example for the indication circuit substrate.The inspected object goods here are for being provided with the circuitry substrate sheet of a plurality of circuitry substrate in 1 sheet.In the back, the circuitry substrate sheet that a plurality of circuitry substrate are set is called inspection object sheet, the corresponding circuitry substrate in this inspection object sheet is called checks the object substrate.
Carry out the device of following electronics inspection and AOI testing fixture, microexamination device and comprise the load head of stowage survey object sheet having the guide finger that the inspection object sheet that is used for will being arranged at provisionally on the load head is positioned load head; Read the CCD camera of fiducial mark; Load head driving mechanism, this load head driving mechanism automatically make load head check under camera, the microscope and move, localization examination object substrate to electronics inspection probe, AOI.
In the corresponding control computer of management or the master computer that monitors check system integral body and electronic inspection device, AOI testing fixture, microexamination device, has product information tape deck (local disk driving or data storage device etc.) respectively, check step at electronics as the 1st step, the control computer of electronic inspection device reads the intrinsic goods data of this individuality from the product information tape deck of master computer, implements electronics and checks step.In addition, the goods data that obtain from master computer, write troactively at electronics and check the individual intrinsic goods data that step obtains, these goods data are transferred to the control computer of next AOI testing fixture.Between AOI testing fixture and microexamination device, carry out passing on of goods data equally, the individual intrinsic goods data implementation step that the microexamination device is obtained according to electronic inspection device and AOI testing fixture according to mode same as described above.The goods data that obtain in each step also transfer to master computer, check that accordingly the final check result of object sheet remains in the product information tape deck of master computer.
In addition, as another goods data flow form, can be in each step, the control computer of this step is read the goods data from the product information tape deck of master computer, implementation step, to add in the goods data that each step newly obtains in the product information tape deck of master computer, can be corresponding to the hardware configuration of system, or composition data stream form at random.
Checking step, at first, determining the individual identification code to checking the object sheet, and be produced in the product information tape deck, the file separately that storage corresponding articles information is used.In addition, in the product information tape deck, store in advance each goods code number the good not judgment standard information of respectively checking step, check object substrate positional information etc. is set.
Above-mentioned individual code number according to can will comprise goods code number and make lot number, and appropriate combination such as the code number of sheet number etc., time on step process date, step process device number guarantee that the mode of step follow-up control constitutes.
As above-mentioned, in the product information tape deck, make the file separately of each individual identification code, on the other hand, the part outside the goods of each sheet is by the printer mark individual identification code number of laser symbol device, ink jet type symbol device etc.
Then, check object substrate at each, break and (A) looked in electric-examination that the electrical property of short circuit etc. is used, check on the object substrate in rough sledding, be the processing of point-like coating symbol China ink etc., be expressed as the symbol of the situation of defective products, in the time of promptly so-called bad symbol at mark, charge to and preserve the address location (a5) of checking the object substrate, mark bad symbol in the file separately of this inspection object sheet that this inspection object substrate is made in the product information tape deck.
In electronics inspection (A), then,, carry out automatic shape inspection (B) by optics automatic shape inspection apparatus, so-called AOI testing fixture.In this automatic shape inspection (B) step, at first, read the individual identification code that marks in checking on the object sheet, in the product information tape deck, (b2) such as position datas of the inspection data of the coordinate position data that the goods that reading derives according to this individual identification code are used, AOI inspection condition etc., the bad substrate before the previous step.
Then, implement AOI and check (b4), still, at this moment, with regard in electronics inspection (A) before, finding the circuitry substrate of rough sledding, the bad symbol of mark, according to the address location data of bad substrate, skip AOI and check, other inspection object substrate is implemented AOI check.In addition, the bad inspection object substrate of new discovery marks bad symbol at checking by this AOI, and in the file separately of the inspection object sheet in the product information tape deck, charge to and the address location (b5) of preserving the inspection object substrate that has marked bad symbol.
Then, adopt microscopical visual examination (C), but, even check also identical at this with the AOI inspection, just check discovery rough sledding in (B) in formerly electronics inspection (A) and AOI, marked the circuitry substrate of bad symbol, according to the address location data of unfavorable substrate, skip visual examination, other inspection object substrate is implemented visual examination (c4).In addition, on inspection object substrate by this visual examination and new discovery rough sledding, mark bad symbol, and in the product information tape deck this check in the file separately of object sheet, charge to and the address location (c5) of preserving the inspection object substrate that has marked bad symbol.
After checking end, in punch process by mould, the occasion that the circuitry substrate goods are separated respectively, pass through automatic device for taking out, read in and check the individual identification code that marks on the object sheet, read into the address location data of the bad substrate of previous step before rapid from the product information tape deck, bad circuitry substrate goods and non-defective unit circuitry substrate goods are discerned, taken out.At this moment, if really allow mark near on goods or the goods bad symbol in, carry out above-mentioned action, owing to can in the collation process of carrying out with these data that read, implement separation operation, so also can carry out correct separation operation.
Fig. 2 is the flow chart of steps that the circuit devcie of example loads an embodiment of step with the circuitry substrate for expression.The circuitry substrate of loading device here is arranged in 1 circuitry substrate sheet and disposes according to a plurality of, on this circuitry substrate sheet, the individual identification code is set, is used for fiducial mark circuitry substrate sheet body location, be arranged at the fiducial mark of each circuitry substrate on this circuitry substrate sheet, be arranged at the fiducial mark of each " loaded " position of loading device, checking that the bad symbol that is provided with on the bad circuitry substrate etc. is taking place step.
The circuit devcie that provides in the present embodiment loads step and relates to the step of loading a plurality of chip devices, on 1 paste solder printing machine, and 2 the component mounting devices (1,2) of connecting, forming circuit component mounting device.
At first, go up the loading circuit substrate slice, printing emulsus scolding tin at emulsus solder printing machine (A).At this moment, the orientating as of circuitry substrate sheet: the interim location by guide finger, the cis by CCD camera etc. reads fiducial mark (a2), and automatically mobile load head carries out final location (a3), carries out the printing (a4) of emulsus scolding tin.
Then, the circuitry substrate sheet that is printed with emulsus scolding tin is loaded into the 1st circuit devcie loading attachment (B).The 1st circuit devcie loading attachment is by image read-out, reads fiducial mark, the individual identification code of circuitry substrate sheet location usefulness, is arranged at (b2) such as bad symbols on the circuitry substrate, with circuitry substrate sheet location (b3).Then, read the various fiducial marks that are arranged on the corresponding circuitry substrate, obtain the locator data of circuitry substrate sheet spacer and corresponding circuitry substrate, these locator datas are recorded in the file of product information tape deck, and read the information (b4) that expression is recorded in the position of the bad circuitry substrate in the product information tape deck.In addition, on the circuitry substrate beyond the bad circuit, be arranged at fiducial mark, load the circuit devcie (b5) of distributing to the 1st circuit devcie loading attachment at each " loaded " position of loading device.
Then, at the 2nd circuit devcie loading attachment (C), load this circuitry substrate sheet.At the 2nd circuit devcie loading attachment, at first, by the individual identification number of CCD camera acquisition cuicuit substrate slice.Here, the fiducial mark information of the location usefulness that the 1st circuit devcie loading attachment is formerly obtained, bad circuitry substrate position information, the information of individual identification code etc. transfers to the product information tape deck of the 2nd circuit devcie loading attachment (C) from the product information tape deck of the 1st circuit devcie loading attachment (B), or in the product information tape deck of upper master computer, read in this information, thus, need not to obtain these information, save the useless operation (c2) that the 2nd circuit devcie loading attachment (C) carries out the image processing identical with the 1st circuit devcie loading attachment (B) repeatedly by the image read-out of CCD camera etc.In addition, according to the information that obtains from the product information tape deck of the 1st circuit devcie loading attachment (B) or master computer, circuitry substrate beyond the bad relatively circuitry substrate positions (c3), loads the circuit devcie (c4) of distributing to the 2nd circuit devcie loading attachment (C).
Afterwards, the circuitry substrate sheet of loading circuit device by conveyer, is transported the inside to anti-stream device (D), with emulsus scolding tin fusion (d2) and cooling (d3), with welding manner permanent circuit device.
More than be limited to the manufacture method of printed circuit substrate and be described, but, the present invention is not limited to the foregoing description, in technical scope of the present invention, can carry out various changes, the present invention can be widely used for requiring the manufacture method and the manufacturing equipment of the industrial product of multistage manufacturing step, certainly, the present invention can reach changing form in these schemes.
Claims (3)
1. the component mounting method of a printed circuit substrate, this installation method relate to emulsus solder printing machine (A) go up two circuit devcie loading attachments of series connection (B C), loads the installation method of a plurality of chip devices, it is characterized in that, comprise,
Emulsus solder printing step in this step, goes up the loading circuit substrate slice at emulsus solder printing machine (A), the interim location by guide finger, read fiducial mark (a2) by image read-out, automatically position (a3), carry out the printing (a4) of emulsus scolding tin;
The 1st circuit devcie loads step, in this step, the circuitry substrate sheet that is printed with emulsus scolding tin is loaded into the 1st circuit devcie loading attachment (B), the 1st circuit devcie loading attachment (B) reads the fiducial mark of the circuitry substrate sheet being located usefulness by image read-out, the individual identification code, be arranged at the bad symbol (b2) on the circuitry substrate, with circuitry substrate sheet location (b3), then, read the various fiducial marks that are arranged on the corresponding circuitry substrate, obtain the locator data of circuitry substrate sheet spacer and corresponding circuitry substrate, these locator datas are recorded in the file of product information tape deck, and read the information (b4) that expression is recorded in the position of the bad circuitry substrate in the product information tape deck, on the circuitry substrate beyond the bad circuit, be arranged at fiducial mark, load the circuit devcie (b5) of distributing to the 1st circuit devcie loading attachment at each " loaded " position of loading device;
The 2nd circuit devcie loads step, in this step, load this circuitry substrate sheet at the 2nd circuit devcie loading attachment (C), at first, individual identification number by image read-out acquisition cuicuit substrate slice, from the said products information record carrier, obtain the fiducial mark information of the location usefulness that the 1st circuit devcie loading attachment (B) formerly obtains, bad circuitry substrate position information, the information of individual identification code, information according to above-mentioned acquisition, circuitry substrate beyond the bad relatively circuitry substrate positions (c3), loads the circuit devcie (c4) of distributing to the 2nd circuit devcie loading attachment (C);
The circuit devcie fixing step in this step, by conveyer, is transported the inside to anti-stream device with the circuitry substrate sheet of loading circuit device, with emulsus scolding tin fusion (d2) and cooling (d3), with welding manner permanent circuit device.
2. the component mounting method of printed circuit substrate according to claim 1 is characterized in that, in above-mentioned the 1st circuit devcie loading attachment described product information tape deck is set.
3. the component mounting method of printed circuit substrate according to claim 1 is characterized in that, described product information tape deck is set in above-mentioned master computer.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004-268464 | 2004-09-15 | ||
| JP2004268464A JP4446845B2 (en) | 2004-09-15 | 2004-09-15 | Printed circuit board manufacturing method and manufacturing apparatus |
| JP2004268464 | 2004-09-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1750740A CN1750740A (en) | 2006-03-22 |
| CN1750740B true CN1750740B (en) | 2010-05-26 |
Family
ID=36164541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510093203 Active CN1750740B (en) | 2004-09-15 | 2005-08-19 | Method for mounting printed circuit substrate |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4446845B2 (en) |
| CN (1) | CN1750740B (en) |
| TW (1) | TWI280082B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101034326B1 (en) | 2010-09-02 | 2011-05-16 | 주식회사 지오네트 | Electronic card module having the storage function of product manufacturing/maintenance/operation information |
| JP6873732B2 (en) | 2017-02-15 | 2021-05-19 | 日本メクトロン株式会社 | Flexible printed circuit board manufacturing method and flexible printed circuit board manufacturing system |
| CN108152715A (en) * | 2018-01-04 | 2018-06-12 | 苏州统硕科技有限公司 | IC support plate wireline inspection rejection systems |
| JP7316072B2 (en) | 2019-03-22 | 2023-07-27 | Juki株式会社 | Production system and production method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86104342A (en) * | 1985-12-04 | 1987-06-10 | Tdk株式会社 | Detect and revise the method and the device thereof of electronic unit assembly failure on substrate |
| CN1519570A (en) * | 2003-01-29 | 2004-08-11 | 株式会社东芝 | Measured reault displaying system for printed circuit substrate, and measured result displaying method |
-
2004
- 2004-09-15 JP JP2004268464A patent/JP4446845B2/en active Active
-
2005
- 2005-07-28 TW TW94125676A patent/TWI280082B/en not_active IP Right Cessation
- 2005-08-19 CN CN 200510093203 patent/CN1750740B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86104342A (en) * | 1985-12-04 | 1987-06-10 | Tdk株式会社 | Detect and revise the method and the device thereof of electronic unit assembly failure on substrate |
| CN1519570A (en) * | 2003-01-29 | 2004-08-11 | 株式会社东芝 | Measured reault displaying system for printed circuit substrate, and measured result displaying method |
Non-Patent Citations (2)
| Title |
|---|
| JP特开2001-308600A 2001.11.02 |
| JP特开平11-150398A 1999.06.02 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1750740A (en) | 2006-03-22 |
| TW200610459A (en) | 2006-03-16 |
| JP4446845B2 (en) | 2010-04-07 |
| TWI280082B (en) | 2007-04-21 |
| JP2006086281A (en) | 2006-03-30 |
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