JP2002009451A - Manufacturing method and apparatus for printed circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and apparatus for manufacturing a printed circuit board with high reliability in preventive measure against unnecessary short-circuiting at an interlayer connected position and realizing high-speed via-hole processing. SOLUTION: The manufacturing apparatus includes a feed unit 101 for feeding a substrate, a substrate transportation unit 105 for transporting the substrate, a length measuring unit 102 for measuring the position of a reference mark for via-hole process, a measurement control unit 107 for processing the measured data, a separation via-hole processing unit 103 for carrying out via hole processing for each division of the substrate on the basis of the measured data, a laser casting unit 106 for casting a laser beam for via hole process, and a substrate take-out unit 104. The position of reference mark is recognized by X-ray or by an optical method, and the via hole processing is carried out at the separation via hole processing unit 103 on the basis of the position measured data, so high-speed high-accuracy separation via hole processing is realized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for manufacturing a double-sided or multilayer printed wiring board used in electronic equipment.

[0002]

2. Description of the Related Art Conventionally, a manufacturing process of a double-sided or multilayer printed wiring board used in electronic equipment is shown in FIG. 6, and a method of forming a via hole in the manufacturing process is shown in FIG. The configuration and method are general.

FIG. 6 is a flow chart of the entire manufacturing process of a conventional printed wiring board having a multilayer structure, and FIG. 7 is a plan view of a main portion of a collective via-hole processed substrate in the manufacturing process.

In FIG. 6, reference numeral 1 denotes an attaching portion for attaching a film material 22 to both sides of a prepreg 21 to form a film laminate, and 3 denotes a via hole 23 or an alignment at a predetermined position of the film laminate by a laser or the like. Hole processing portions for forming reference holes 24a, 24b serving as references for
Is a filling part for filling the conductive paste 25 into the via holes 23 of the perforated film laminate, and 5 is a filling prepreg obtained by peeling the film material 22 from the film laminate having the conductive paste 25 filled in the via holes 23. This is a peeling portion for forming 26.

Reference numeral 6 denotes a laminating section in which a conductive foil 27 made of a copper foil is adhered to and laminated on both sides of the filled prepreg 26. Reference numeral 7 denotes a resin curing method in which a conductive foil laminated plate 28 is formed by pressing and heating by a lamination hot press or the like. Part 8 is a reference hole 24 by X-ray measurement.
Reference hole processing portions 9 for processing the exposure reference holes 29a and 29b at the positions a and 24b, and a pattern formation for exposing, developing or etching to form a circuit pattern 30a and to form a double-sided substrate 31 as an inner layer body. Department. As described above, the core forming unit 1 is formed by the pattern forming unit 9 from the attaching unit 1.
0.

Reference numeral 11 denotes a laminating portion for laminating a prepreg 21 and a film material 22 on both upper and lower surfaces to form a multilayer, and forms a prepreg laminated plate 32. In the prepreg laminated plate 32, via hole processing reference holes 29 are formed at the positions of the exposure reference holes 29a and 29b by X-ray measurement in the next reference hole processing section 18.
c and 29d are processed again to form a reference hole processed laminated plate 33. A hole processing portion 13a forms a via hole 34 on the entire surface of the substrate with reference to the via hole processing reference holes 29c and 29d, and forms a via hole processing laminated board 35.

Next, in the filling section 14, the via-hole-processed laminate 3
After the conductive paste 25 is filled in the via hole 34 of No. 5 to form a paste-filled laminated board 36, the film material 22 is removed at the peeling section 15 to form a film peeled laminated board 37.

Subsequently, the conductive foil 27 is stuck on the upper and lower surfaces of the laminated portion 16 to form a conductive foil stuck plate 38, which is then cured and compressed by the resin curing portion 17 to form a conductive foil laminated plate 39, thereby forming a pattern. Exposure, development or etching is performed in the portion 19 to form a circuit pattern 30b, and the multilayer circuit laminate 40
To form

Further, when further multi-layering is required, the steps from the laminating portion 11 to the multi-layer substrate forming portion 20 including the pattern forming portion 19 are repeated, whereby a multi-layer circuit laminate can be formed sequentially.

By performing a predetermined operation in the manufacturing process configured as described above, a multilayer circuit laminate 40 as a printed wiring board having a predetermined multilayer structure is completed.

In FIG. 7, reference numeral 29 denotes a via-hole processing area in the via-hole processing laminated board 35, and the via-holes 34 in the via-hole processing area 29 correspond to the via-hole processing reference holes 2;
With reference to 9c and 29d, processing is performed sequentially based on preset data.

[0012]

In recent years, in printed wiring boards (substrates) having a double-sided or multi-layer structure, in order to increase the number of production units, the cost is reduced by enlarging the area, and the interlayer is formed in a finer pattern. The reliability of connection and prevention of unnecessary short circuits is improved. However, when the via hole processing reference holes 29c and 29d are provided as two points on the outer periphery diagonal of the reference hole processing laminated plate 33 and the via holes are processed based on the reference holes, the circuit of the double-sided board 31 which has passed the process of the hole processing part 13a The pattern 30a is formed by the reference hole processing portion 8
Circuit pattern 3
When the position of the via hole 34a is shifted from the position of the via hole 34 which is predetermined in design, and the finer pattern is formed, and the allowable width of the shift amount becomes smaller, interlayer connection becomes impossible or unnecessary short circuit occurs. I was

SUMMARY OF THE INVENTION The present invention is intended to solve the above-mentioned problems. In a via hole forming step of a double-sided or multilayer printed wiring board, high-speed and divided via hole processing is possible, and interlayer connection with a fine pattern can be performed. It is an object of the present invention to provide a method of manufacturing a printed wiring board and an apparatus for manufacturing the same, in which reliability for preventing unnecessary short circuits is improved.

[0014]

In order to solve the above-mentioned problems, a method of manufacturing a printed wiring board according to the present invention has a plurality of divided areas previously divided into a predetermined size. A step of forming a laminate by laminating an outer layer body on at least one surface of an inner layer body provided with a reference mark at a preset position for each, and measuring a position of the reference mark of the inner layer body from outside the outer layer body And transferring based on the position measurement data of the reference mark so that the divided area of the laminate is located at a predetermined location, and a via hole of a predetermined pattern is formed for each of the divided areas of the laminate. The method includes a step of forming the laminate.

As described above, according to the method of the present invention, in the via hole forming step of a double-sided or multilayer printed wiring board,
The divided via hole processing can be performed accurately and at high speed.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention has a plurality of divided areas divided into a predetermined size in advance, and a reference is made to a location set in advance for each of the plurality of divided areas. A step of forming a laminate formed by laminating an outer layer body on at least one surface of the inner layer body provided with a mark, a step of measuring the position of the reference mark of the inner layer body from outside the outer layer body, and Transferring the divided region of the laminate based on position measurement data so that the divided region is located at a predetermined position, and forming a via hole having a predetermined pattern in the laminated body for each of the divided regions of the laminate. A method of manufacturing a printed wiring board comprising: a reference mark provided in each of the divided areas divided into a predetermined size, so that a reference mark provided in each of the divided areas and a via hole of a predetermined pattern are formed. The distance becomes shorter It has the effect of say.

According to a second aspect of the present invention, there is provided the method for manufacturing a printed wiring board according to the first aspect, wherein the inner layer body is made of a prepreg. By forming the circuit pattern on the prepreg, the circuit pattern for each of the divided regions can be formed with high precision in the via hole of the prepreg, and the double-sided board can be manufactured with high precision.

According to a third aspect of the present invention, there is provided the method for manufacturing a printed wiring board according to the first aspect, wherein the inner layer body is formed of a multilayer laminated material having a predetermined wiring pattern. By forming a via hole of a predetermined pattern in the multilayer laminated material for each layer, the via hole for each sectioned region of the outer layer body has an effect of being able to be formed with high precision with respect to the circuit pattern of the multilayer laminated material, The substrate can be manufactured with high accuracy.

According to a fourth aspect of the present invention, there is provided the method for manufacturing a printed wiring board according to the first aspect, wherein the outer layer is made of a laminated material or a film obtained by laminating a film on a prepreg. Also, by filling the conductive paste, the filling amount of the via hole can be increased, and a highly reliable double-sided or multi-layer substrate can be manufactured.

According to a fifth aspect of the present invention, the fiducial mark is
2. The method for producing a printed wiring board according to claim 1, wherein the method comprises a via hole processed by a laser or a drill, a conductive paste filled in the via hole, or a pattern of an inner layer body. By using the reference mark provided by a normal process, the generation of error factors due to the formation of the reference mark is suppressed.

According to a sixth aspect of the present invention, in the step of measuring the position of the reference mark, the position of the reference mark is measured by a length measuring device using X-ray recognition. This is a method for manufacturing a printed wiring board, and has an effect that by accurately measuring a reference mark from the outside of an outer layer body, it is possible to transfer the laminated body so that a divided region of the laminate is accurately positioned at a predetermined place. .

According to a seventh aspect of the present invention, in the step of measuring the position of the reference mark, the position of the reference mark is measured by a length measuring device using visible light recognition. This is a method for manufacturing a printed wiring board, and has the effect that the reference mark can be easily measured from the outside of the outer layer body so that the stacked body can be transferred so that the divided region is easily located at a predetermined position. .

[0023] The invention according to claim 8 is an inner layer body having a plurality of divided areas preliminarily divided into a predetermined size, and a fiducial mark provided at a preset position for each of the plurality of divided areas. A step of forming a laminated body formed by laminating an outer layer body having a hole so that the reference mark can be recognized by visible light on at least one surface, and measuring a position of the reference mark of the inner layer body from outside the outer layer body And transferring the divided area of the laminate based on the position measurement data of the reference mark so that the divided area is located at a predetermined position, and forming a via hole having a predetermined pattern for each of the divided areas of the laminate. This is a method for manufacturing a printed wiring board including a step of forming a laminated body, and has an effect that a reference mark can be measured more easily by having a hole in an outer layer body in advance.

According to a ninth aspect of the present invention, there are provided a plurality of divided areas which are divided in a predetermined size in advance, and a first reference mark is provided at a preset position for each of the plurality of divided areas. Forming a laminate by laminating an outer layer on at least one side of the inner layer, and forming a second reference mark on the laminate from outside the outer layer at the position of the first reference mark; Measuring the position of the second reference mark of the inner layer body from outside the outer layer body; and positioning the divided region of the laminate at a predetermined position based on position measurement data of the second reference mark. And a step of forming via holes of a predetermined pattern in the laminated body for each of the divided areas of the laminated body, the method comprising: Form 2 fiducial marks And, the further reliably measure the reference mark, partitioned area of the laminate has an effect that it can transfer to easily positioned at a predetermined position.

According to a tenth aspect of the present invention, there is provided the method of manufacturing a printed wiring board according to the ninth aspect, wherein the second fiducial mark comprises a through hole processed by a laser or a drill. The easy recognition of the shape has the effect of facilitating measurement.

According to an eleventh aspect of the present invention, in the step of measuring the position of the second reference mark, the position of the second reference mark is measured by a length measuring device using optical recognition. A method for manufacturing a printed wiring board according to claim 9, which has an effect of easily measuring the position of the second reference mark by a simple optical recognition method.

[0027] According to a twelfth aspect of the present invention, there is provided a semiconductor device according to the first aspect, wherein the substrate has a plurality of divided areas divided into a predetermined size. Split via hole processing for transferring the substrate so that the divided region is located at a predetermined position, irradiating the substrate with laser, and forming via holes of a predetermined pattern in the substrate for each of the divided regions of the substrate. And a take-out section for taking out a substrate processed by the divided via-hole processing section. The apparatus for manufacturing a printed wiring board, wherein the via-hole processing is performed based on a reference mark provided for each divided area. Has the effect of improving the positional accuracy of the pattern.

According to a thirteenth aspect of the present invention, there is provided a supply unit for supplying a substrate for processing a via hole for each divided region, and a length measuring unit for measuring a position of a reference mark provided in advance for each divided region of the substrate. And a measurement control unit for processing position measurement data of the reference mark.
Wherein the reference mark is measured in advance so that the printed circuit board can be quickly transferred to a predetermined position in each divided area.

[0029] According to a fourteenth aspect of the present invention, the length measuring section is provided with an X
14. An X-ray generator for emitting X-rays, an X-ray image sensor for receiving X-rays, a CCD camera for capturing an image received by the X-ray image sensor, and an image processing unit. And the use of X-rays has an effect that a reference mark can be accurately measured even from outside the outer layer body.

According to a fifteenth aspect of the present invention, the length measuring unit includes a light generator, a CCD camera for capturing an optical system image, and an image processing unit. This is a plate manufacturing apparatus, and has an effect that a reference mark can be easily measured with a simple configuration by general optical means.

According to a sixteenth aspect of the present invention, a step of forming a fiducial mark at a predetermined location for each of a plurality of divided areas of an inner layer body that has been preliminarily divided into a predetermined size; Measuring, and transferring the divided area of the inner layer body so as to be located at a predetermined position based on the position measurement data of the reference mark, and forming a via hole in a predetermined pattern for each of the divided areas of the inner layer body. A method of manufacturing a printed wiring board comprising a step of forming a reference mark for each of the divided areas divided into a predetermined size, the reference mark provided for each of the divided areas and a predetermined pattern This has the effect of shortening the distance from the via hole.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an overall flowchart of a manufacturing process of a multilayer printed wiring board according to an embodiment of the present invention, FIG. 2 is an overall flowchart of a manufacturing process of a multilayer printed wiring board according to another embodiment, and FIG. FIG. 4 is a plan view of a divided via-hole processed substrate in a manufacturing process, and FIG. 4 is a plan view of a divided via-hole processed substrate in another embodiment.

The same components and members described in the related art are denoted by the same reference numerals, and detailed description is omitted.

In FIG. 1, a core forming section 10 forms and supplies a double-sided board 31 which is an inner layer body constituting a multilayer board (multi-layered printed wiring board).
It comprises a hole processing section 3, a filling section 4, a peeling section 5, a lamination section 6, a resin curing section 7, a reference hole processing section 8, a pattern forming section 9, and the like.

The multi-layer substrate forming section 20 includes the core forming section 1
This is a step of laminating on both sides of the double-sided substrate 31 formed in step 0, and further multi-layering, a lamination attaching section 11, a reference hole X-ray length measuring section 12 for measuring the position of the reference hole by X-rays, and split hole processing. It comprises a part 13, a filling part 14, a peeling part 15, a laminating part 16, a resin curing part 17, a pattern forming part 19 and the like.

In the laminating section 11, the core forming section 10
Prepregs 21 on the upper and lower surfaces of a double-sided substrate 31 formed of
The prepreg laminate 32 is formed by bonding and attaching the film material 22.

Next, in the reference hole X-ray length measuring section 12, X
Prepreg laminate 3 consisting of a single laminate using wires
The conductive paste 2 is inserted into the via hole of the double-sided substrate 31 inside the substrate 2.
5, the reference via holes 29a and 29b, the divided via hole processing references 29a1 and 29b1 shown in FIG.
9an and 29bn (29a1 to 29an and 29b1
２９29bn). In addition, 29a1-
29an and 29b1 to 29bn are processed simultaneously when the circuit pattern 30a is formed from the hole processing section 3 to the pattern forming section 9.

As the prepreg 21 and the film material 22 to be attached to the upper and lower surfaces of the double-sided substrate 31, those having holes beforehand at the positions of the divided via hole processing standards 29a1 to 29an and 29b1 to 29bn are used. Based on the above-mentioned divided via hole processing standards 29a1-29an
And 29b1 to 29bn may be easily measured.

As shown in FIG. 3, the via hole processing areas are divided into divided via hole processing areas 29-1, 29-2, and 2
When dividing into n by 9-n, the divided via hole processing standards 29a1 and 29b1 and the divided via hole processing standards 29a
As for n and 29bn, for one divided via hole processing area, the divided via hole processing reference is processed and provided as a paired configuration for each via hole processing area.

For one divided via hole processing area,
Like the divided via hole processing standards 29a1 to 29an, the divided via hole processing standard may be only one for each via hole processing area.

As described above, the center position of the via hole processing is calculated from the data measured as described above. Any point may be set as the coordinate origin, but for example, the reference hole 29a can be used. Here, reference holes 29a, 2
9b, the divided via hole processing standards 29a1 and 29b1, and 29an and 29bn (hereinafter, referred to as a reference mark 29n when the reference holes and the divided via hole processing standards are collectively referred to) are covered by the prepreg 21. Use X-ray recognition because they cannot be seen.

Next, the presence or absence of the reference holes 29a and 29b of the prepreg laminated board 32 conveyed to the divided hole processing section 13 is recognized by a via hole processing mechanism (not shown), and is parallelized by an XYθ table (not shown). And the position of the reference hole 29a in the via hole processing mechanism is recognized, and the first via hole processing position calculated above (for example, the divided via hole processing area 2)
In 9-1), after moving the XYθ table (for example, based on the measurement data of the divided via hole processing reference 29a1 or 29b1), the via hole processing of a predetermined pattern is performed.

Subsequently, the process moves to the next divided via hole processing area 29-2 calculated as described above, and the same via hole processing is performed. Similarly, the step operation is repeated one after another to move to the n-th divided via hole processing area 29-n, and via holes are processed in all predetermined patterns, thereby completing the via hole processing.

As described above, the prepreg laminate 3
Although it is necessary to recognize the position of the second reference mark 29n,
Movement to each divided via hole processing area is performed based on data of a movement amount measured and calculated in advance, and a recognition operation is not required each time in a via hole processing step, so that tact speed can be increased and productivity can be improved. .

Further, since the via hole processing area is divided, the influence of expansion and contraction of the double-sided board 31 is small as compared with the case where the entire via hole processing of the via hole processing area 29 described in the prior art is performed. The shift amount of the connection relative position between the conductive paste 25 and the circuit pattern 30a is reduced.

In the above embodiment, the prepreg 21 and the film material 22 as the outer layer are laminated on the double-sided substrate 31 as the inner layer, and the via hole 34 is formed based on the reference mark 29n. Also, when the via hole is formed, the productivity of the via hole processing is improved even if the via hole is formed for each section based on the reference mark 29n.

Further, in the above, the step of measuring the position of the reference mark 29n (that is, the reference hole, divided via hole processing reference) and the method of processing the divided via hole to move the substrate to a predetermined position based on the reference mark position measurement data Was explained. However, although the recognition is required every time in the via hole processing step, the position of the reference mark 29n is not measured at once,
After recognizing the positions of the divided via hole processing references 29a1 and 29b1, the processing of the via hole in the divided via hole processing area 29-1 is completed, and the next divided via hole processing reference (for example, 29a2
A method of recognizing the position of 29b2) and similarly processing the via hole in the area may be used. That is, the divided via hole processing area is repeatedly moved to the nth divided via hole processing area 29-n by repeating the step operation one after another, and all the via hole processing is performed to complete the via hole processing.

The reference mark may be a via hole formed by drilling, a conductive paste filled in the via hole, or a pattern formed on the inner layer body, in addition to the via hole processed by the laser. Is also good.

Although the divided via hole processing reference has been described as two pairs in the divided processing area, one or three or more plural holes may be formed.

Next, in the filling section 14, the conductive paste 25 is filled into the via holes 34 of the via-hole processed laminated board 35 to form a paste-filled laminated board 36. Further, the peeling part 1
5, the paste-filled laminated plate 36 is removed from the film material 22.
Is peeled off to form a film peeling laminate 37.

Subsequently, in the laminating section 16, a conductive foil 27 made of a copper foil metal material is laminated on the film peeling laminated board 37 to form a conductive foil sticking plate 38. Conductive foil sticking plate 38 as inner layer body
And the conductive foil 27 are adhered to form a conductive foil laminated plate 39.

Next, in the pattern forming section 19, the conductive foil laminate 39 is exposed, developed or etched to form a predetermined circuit pattern 30b, and a four-layer multilayer circuit laminate 40 is formed.

Further, although not shown, when forming a multilayer circuit laminate board 40 having a six-layer structure, a four-layer board 31 is used in place of the double-sided board 31 in the lamination part 11 of the multilayer board forming part 20.
By using the multilayer circuit laminate 40 having a layer structure as an inner layer body and performing the process of the multilayer substrate forming unit 20 similarly,
A multilayer circuit laminate 40 having a six-layer structure can be formed.

In the case of forming a multilayer circuit laminate 40 having a multilayer structure of eight layers, ten layers, or the like, it can be manufactured by performing the above-described steps.

Next, another embodiment of the present invention will be described with reference to FIGS. Note that the same components and members described above are given the same reference numerals, and detailed description is omitted.

In the above embodiment, the divided via hole processing reference 2
9a1 and 29b1, and up to 29an and 29bn,
In the reference hole X-ray length measuring unit 12 shown in FIG.
It was measured with a line length measuring instrument. However, the reference mark 29n
The prepreg 21 and the film material 22 which are the upper outer layers
When the reference mark 29n can be recognized from the outside because the object is a transparent body or the like, the divided via hole processing standards 29a1 to 29an are used as the divided via hole processing standards without using the X-ray length measuring device.
Then, holes are formed in advance at the positions of 29b1 and 29bn by a laser or a drill in the reference hole processing unit 18 shown in FIG. 2 to form divided via hole processing reference holes 29c1 and 29d1 and 29cn and 29dn shown in FIG.

The divided via hole processing reference holes 29c1 and 29c
d1 to 29cn and 29dn are measured by a length measuring device with an optical system recognition mechanism, that is, the reference hole optical length measuring unit 12 in FIG.
a, and the divided via hole processing can be performed based on the measurement data as described above. In addition, the figure showing the process after the division hole processing portion 13 in FIG. 2 shows a configuration in which the section is cut by a cross section that does not pass through the via hole processing reference holes 29c and 29d.

However, in this case, it is necessary to add one step of drilling according to the divided via hole drilling reference by X-ray recognition shown and described in the above embodiment. By comparing with a reference mark formed up to the pattern forming section 9, a highly accurate via hole processing can be performed.

Although the divided via hole processing reference has been described as two pairs in the divided via hole processing area, the number may be one or three or more.

Further, the measurement is performed in the reference hole optical length measuring section 12a, and the divided via hole processing can be performed by the measurement data in the same manner as described above. First, the via hole processing in the hole processing area is performed, then the divided via hole processing reference of the next divided via hole processing area is measured, and each divided via hole processing area is similarly processed so as to perform the via hole processing. May be sequentially processed.

FIG. 5 is a perspective view of a main part of the X-ray length dividing via hole machining mechanism. The structure and operation of the mechanism will be described with reference to FIG.

As shown in FIG. 5, the X-ray length-measuring divided via hole processing mechanism includes a prepreg laminated board 3 which is a via-hole processed substrate.
2, a length measuring unit 102 for measuring a reference hole processing position and a divided via hole processing reference position at predetermined positions on the substrate, and a reference hole and a divided via hole. A measurement control unit 107 for calculating and processing processing reference position data; and a divided via hole processing unit for moving the substrate to a predetermined position based on the measurement data and performing via hole processing for each individual product within the substrate surface. 103 and a laser irradiation unit 10 for irradiating a laser beam or the like for processing the via hole
6, a take-out part 104 for taking out a substrate having a via hole, and
It comprises a unit of the substrate transport unit 105 for transporting the substrate and the substrate having been subjected to via hole processing to each of the unit units.

In the supply section 101, the via-hole-processed substrate (the prepreg laminate plate 32 in FIG. 1) transported from the previous process by the rotary table or the belt conveyor is temporarily stopped on the upper surface of the supply stage 108 to perform coarse positioning. Then, vacuum suction is performed by the suction pad 109a attached to the tip of the suction pad arm 110a, and the arm is driven by the arm transport motor 134 and the vertical drive actuators 135a, 135b, 135c to be transported and placed on the XY table 111 of the length measuring unit 102. Is done.

The XY table 111 has a driving X-axis motor 112 for moving in the X direction and a driving Y-axis motor 113 for moving in the Y direction, and measures the amount of movement of the XY table 111. X-axis length measuring device 11
4. A Y-axis measuring device 115 is also provided.

The length measuring unit 102 is provided with an X-ray generator 116 and an X-ray image detecting X-ray for detecting the reference position of the prepreg laminate 32 covered with the conductive foil as described above. It comprises a sensor 118, a CCD camera 119, an X-ray generator 116, and motors 117 and 120 for driving the X-ray image sensor 118 up and down.

The measurement control unit 107 further includes an image processing unit 136 for performing image processing on the detected X-ray signal, a TV monitor 139 for displaying the processed image, and the image processing data and the X-axis length measuring unit 114. And Y-axis length measuring device 115
And a control unit 138 for controlling the entire mechanism of the present invention.

The via-hole-processed substrates conveyed and placed on the XY table 111 include the reference holes 29a and 29b and the divided via-hole processing standards 29a1 and 29b1 to 29an and 29an.
In order to measure the coordinate position up to bn, the XY table 111 is first moved so that the X-ray is located immediately below the reference hole 29a.

At this time, the X-ray generator 116
The X-ray image sensor 118 is moved downward so as to be separated from the substrate by driving the motor, and the X-ray image sensor 118 is also moved upward so as to be separated from the substrate by driving the motor 120.

Then, the visual field range detected by the CCD camera 119 is expanded, and the reference hole 29a can be detected even if the via hole processed substrate itself is slightly displaced.

Further, the XY table 111 is moved so that the reference hole 29a at the approximate position detected by expanding the visual field range is substantially at the position of the irradiation center of the X-ray generator 116. Is moved upward by the driving of the motor 117 so as to approach the substrate, and further, the motor 12 is moved in order to bring the X-ray image sensor 118 closer to the substrate.
The center of the reference hole 29a on the image is obtained by performing the image processing by moving the reference hole 29a in the downward direction by the drive of 0 to enlarge the image of the reference hole 29a.

Then, the coordinates of the center of the reference hole 29a are obtained by the image data position and the X-axis length measuring device 114 and the Y-axis length measuring device 115 provided in the XY table 111, and input to the computer 137. Remember.

Similarly, the coordinate position of the reference hole 29b is measured, and
Furthermore, the division via hole processing standards 29a1 and 29b1 to 29
The coordinates of the reference via hole processing reference up to an and 29bn are measured, and all of the reference holes to be measured and the necessary coordinate data in the divided via hole processing reference are input to the computer 137 and stored.

Although the X-ray generator was used to measure the reference mark 29n here, if the reference mark 29n provided on the prepreg laminate 32 can be recognized from outside without using X-rays, it is necessary to use visible light or the like. The same effect can be obtained with a simple configuration even when the measurement is performed using the light generator described above.

As described above, the position of the via hole to be processed in the via hole processing area is calculated from the measured coordinate data. Although any point may be set as the coordinate origin, the reference hole 29a may be set as the point, for example. The via hole processed substrate whose length has been measured is transported and placed on the XYθ table 121 of the divided via hole processing unit 103.

It should be noted that the divided via hole processing section 103 has an XYθ
X for driving the table 121 and the XYθ table 121
Axis motor 122, Y axis motor 123, θ axis motor 12
4. A CCD camera 127 for detecting and correcting the position of the via-hole-processed substrate in the XYθ table 121 and for performing parallel alignment, an X-axis length measuring device 125 for measuring the position of the XYθ table 121, and a Y-axis length measurement It is constituted by a vessel 126 and the like.

A laser irradiating section 106 for processing a via hole generates a laser beam from a laser oscillator 131, and outputs a mirror, a lens (not shown), and an X-axis galvanometer 12.
9, a Y-axis galvanometer 130, an f · θ lens 132, and the like.

The substrate to be processed with via holes is an XYθ table 121.
Table 121 moves so that the measurement origin, for example, the reference hole 29a reaches immediately below the CCD camera 127, and detects the origin position.

Further, the XYθ table 121 is moved and the reference hole 29
b is moved to reach just below the CCD camera 127 and is detected.
By moving the Yθ table 121, the via hole processed substrate is parallelized.

As described above, one of the read positions, for example, the reference hole 29a is newly set as the origin of the new divided via hole processing section 103, and the divided via hole processing areas 29-1 to 29-2 measured by the length measuring section 102 are used. Is converted back into coordinates relative to the divided via hole processing origin. Based on this data, the position coordinates of each divided via hole processing area to which the XYθ table 121 is to be moved are set.

Next, the XYθ table 121 moves to the processing point of the first divided via hole processing area 29-1 calculated as described above, and the laser beam 128 of the laser irradiation unit 106 is moved to a predetermined position on the via hole processing substrate. Via holes are formed in the area.

When the predetermined via hole processing of the first divided via hole processing area 29-1 is completed, the position is moved to the position of the second divided via hole processing area 29-2 based on the calculation data, and Via hole processing is performed.

As described above, predetermined via hole processing can be sequentially performed up to the n-th divided via hole processing area 29-n in the same manner, and their movement positions are moved based on the calculation data. Can be saved, tact speed can be increased, and productivity can be improved.

When all the predetermined via hole processing is completed, the via-hole processed substrate is transported to and transferred from the take-out table 133, and is transported to a subsequent process by a rotating table or a belt conveyor.

Although the transfer method of the via hole processed substrate or the via hole processed substrate has been described sequentially, the suction pad arms 110a, 110b are used to simplify the mechanism and operation of the substrate transfer unit 105. 110b, 1
10c are connected and connected at predetermined intervals, and have a structure that simultaneously moves during the transport operation.

For this reason, in order to transport and place the substrate, it is natural that all the measurements have been completed in the length measuring section 102 and that all the predetermined via holes have been processed in the divided via hole processing section 103. It is needless to say that the transfer operation is performed after it is confirmed that the substrate having been processed with via holes is not placed on the extraction table 133.

During the measurement and the processing of the via hole, the suction pads 109a, 109b, and 109c are set on the XY table 111.
Since it is inconvenient to be located above the XYθ table 121, after the via-hole-processed substrate or via-hole processed substrate has been transported and the mounting has been completed, the substrate is waited at an intermediate position so as not to be present above them.

In the description of the present embodiment, X
Although the mechanism configuration in which the line length measuring unit 102 and the divided via hole processing unit 103 are connected has been described, the same effect can be obtained even if the X-ray length measuring unit 102 and the divided via hole processing unit 103 are separated and independent. .

[0088]

As described above, according to the present invention, a reference mark on a substrate whose outer layer is covered with a conductive foil made of a metal material of copper foil is recognized by X-rays. Since the step of performing the processing can be omitted and the error factor due to the processing can be reduced, there is an effect that the recognition accuracy of the reference mark can be improved.

Further, by performing the divided via hole processing,
The amount of circuit pattern shift due to expansion and contraction of the board is reduced, and holes can be drilled at predetermined positions with high accuracy.Furthermore, simultaneous detection of split via hole processing reference position detection is performed in parallel with a unit separate from the via hole processing unit. Therefore, it is not necessary to re-recognize each time when moving to the divided via hole processing area at the time of processing the divided via hole, and the effect is larger as the number of divisions is larger, and the productivity can be further improved. Has an effect.

[Brief description of the drawings]

FIG. 1 is an overall flow chart of a manufacturing process of a multilayer printed wiring board according to an embodiment of the present invention.

FIG. 2 is an overall flowchart of a manufacturing process of a multilayer printed wiring board according to another embodiment.

FIG. 3 is a plan view of a divided via-hole processed substrate in the same manufacturing process.

FIG. 4 is a plan view of a divided via hole processing substrate according to another embodiment.

FIG. 5 is a perspective view of a main part configuration of an X-ray measurement divided via hole machining mechanism according to the embodiment of the present invention.

FIG. 6 is a flowchart of the whole manufacturing process of a conventional printed wiring board having a multilayer structure.

FIG. 7 is a plan view of an essential part of the substrate for processing a collective via hole in the same manufacturing process.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Pasting part 3 Hole processing part 4 Filling part 5 Peeling part 6 Lamination part 7 Resin hardening part 8 Reference hole processing part 9 Pattern formation part 10 Core formation part 11 Lamination sticking part 12 Reference hole X-ray length measurement part 12a Reference hole optical measurement Long part 13 Divided hole processing part 13a Hole processing part 14 Filling part 15 Peeling part 16 Stacking part 17 Resin hardening part 18 Reference hole processing part 19 Pattern forming part 20 Multilayer substrate forming part 21 Prepreg 22 Film material 23 Via hole 24a Reference hole 24b Reference hole 25 Conductive paste 26 Filled prepreg 27 Conductive foil 28 Conductive foil laminate 29 Via hole processing area 29a Reference hole 29b Reference hole 29a1 to 29an Divided via hole processing standard 29b1 to 29bn Divided via hole processing standard 29c1 to 29cn Divided via hole Processing reference hole 29d1 to 29dn Divided via hole processing reference hole 29-1 to 29-n min Via hole processing area 29c Via hole processing reference hole 29d Via hole processing reference hole 30a Circuit pattern 30b Circuit pattern 31 Double-sided board 32 Prepreg laminated board 33 Reference hole processed laminated board 34 Via hole 35 Via hole processed laminated board 36 Paste filled laminated board 37 Film peeling laminate 38 Conductive foil laminating plate 39 Conductive foil laminate 40 Multilayer circuit laminate 101 Supply unit 102 Length measurement unit 103 Divided via hole processing unit 104 Extraction unit 105 Substrate transport unit 106 Laser irradiation unit 107 Measurement control unit 108 Supply stage 109a, 109b, 109c Suction pad 110a, 110b, 110c Suction pad arm 111 XY table 112 X-axis motor 113 Y-axis motor 114 X-axis measuring device 115 Y-axis measuring device 116 X-ray generator 117 Motor 118 X-ray image sensor 119 CD camera 120 Motor 121 XYθ table 122 X-axis motor 123 Y-axis motor 124 θ-axis motor 125 X-axis length measuring device 126 Y-axis length measuring device 127 CCD camera 128 Laser beam 129 X-axis galvano 130 Y-axis galvano 131 Laser oscillator 132 f • θ lens 133 Take-out table 134 Arm transport motor 135a, 135b, 135c Vertical drive actuator 136 Image processing unit 137 Computer 138 Control unit 139 TV monitor

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/00 H05K 3/00 NMP X // B23K 101: 42 B23K 101: 42 (72) Inventor Akio Ochi 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture F term in Matsushita Electric Industrial Co., Ltd. (reference)

Claims (16)

[Claims] An outer layer body is laminated on at least one surface of an inner layer body having a plurality of divided areas divided in a predetermined size in advance, and a fiducial mark provided at a location set in advance for each of the plurality of divided areas. Forming a laminated body, and measuring the position of the reference mark of the inner layer body from outside of the outer layer body, and the divided region of the laminated body based on the position measurement data of the reference mark. A method for manufacturing a printed wiring board, comprising a step of transferring a semiconductor device so as to be located at a predetermined location and forming a via hole having a predetermined pattern in the laminate for each of the divided regions of the laminate. 2. The method according to claim 1, wherein the inner layer is made of a prepreg. 3. The method for manufacturing a printed wiring board according to claim 1, wherein the inner layer body is made of a multilayer laminated material on which a predetermined wiring pattern is formed. 4. The method for manufacturing a printed wiring board according to claim 1, wherein the outer layer body is made of a laminated material or a film obtained by laminating a film on a prepreg. 5. The printed wiring board according to claim 1, wherein the reference mark is formed of a via hole processed by a laser or a drill, a conductive paste filled in the via hole, or an inner layer pattern. Production method. 6. The step of measuring the position of the fiducial mark comprises:
The method according to claim 1, wherein the position of the reference mark is measured by a length measuring device using line recognition. 7. The method according to claim 1, wherein in the step of measuring the position of the reference mark, the position of the reference mark is measured by a length measuring device using visible light recognition. 8. A reference mark is provided on at least one surface of an inner layer body having a plurality of divided areas which are divided in a predetermined size in advance, and a reference mark is provided at a place set in advance for each of the plurality of divided areas. A step of forming a laminate formed by laminating an outer layer having holes so that visible light can be recognized, a step of measuring the position of the reference mark of the inner layer from outside the outer layer, and Transferring the divided region of the laminate based on position measurement data so that the divided region is located at a predetermined position, and forming a via hole having a predetermined pattern in the laminated body for each of the divided regions of the laminate. A method for manufacturing a printed wiring board comprising: 9. An outer layer on at least one side of an inner layer body having a plurality of divided areas divided in a predetermined size in advance, wherein a first reference mark is provided at a location set in advance for each of the plurality of divided areas. Forming a laminated body by laminating the bodies; forming a second reference mark on the laminated body from outside the outer layer body at the position of the first reference mark; Measuring the position of the second fiducial mark of the inner layer body, and transferring the divided area of the laminate based on the position measurement data of the second fiducial mark so as to be located at a predetermined position; A method for manufacturing a printed wiring board, comprising a step of forming a via hole having a predetermined pattern in the laminated body for each of the divided regions of the laminated body. 10. The method for manufacturing a printed wiring board according to claim 9, wherein the second reference mark is formed by a through hole processed by a laser or a drill. 11. The print of claim 9, wherein the step of measuring the position of the second fiducial mark comprises measuring the position of the second fiducial mark with a length measuring device using optical recognition. Manufacturing method of wiring board. 12. A method according to claim 1, wherein the divided area is set to a predetermined position based on measurement data of a reference mark provided at a predetermined position for each of the divided areas of the substrate having a plurality of divided areas divided in a predetermined size. Transferring the substrate so as to be positioned, irradiating the substrate with a laser, and forming a via hole of a predetermined pattern in the substrate for each of the divided areas of the substrate; An apparatus for manufacturing a printed wiring board, comprising a take-out section for taking out a substrate processed by a processing section. 13. A supply unit for supplying a substrate for processing a via hole for each divided region, a length measuring unit for measuring a position of a reference mark provided in advance for each divided region of the substrate, and a position of the reference mark. 13. The apparatus for manufacturing a printed wiring board according to claim 12, further comprising a measurement control unit for processing the measurement data. 14. An X-ray generator that emits X-rays, an X-ray image sensor that receives X-rays, a CCD camera that captures an image received by the X-ray image sensor, and an image processing unit. The apparatus for manufacturing a printed wiring board according to claim 13, further comprising: 15. The printed wiring board manufacturing apparatus according to claim 13, wherein the length measuring unit includes a light generator, a CCD camera for capturing an optical system image, and an image processing unit. 16. A step of forming a fiducial mark at a preset location for each of a plurality of divided areas of an inner layer body that is preliminarily divided into a predetermined size, a step of measuring a position of the fiducial mark, A step of transferring the inner layer body so that the divided area is located at a predetermined position based on mark position measurement data, and forming a via hole in a predetermined pattern for each of the divided areas of the inner layer body. Manufacturing method of printed wiring board.