CN108152715A - IC support plate wireline inspection rejection systems - Google Patents
IC support plate wireline inspection rejection systems Download PDFInfo
- Publication number
- CN108152715A CN108152715A CN201810007569.9A CN201810007569A CN108152715A CN 108152715 A CN108152715 A CN 108152715A CN 201810007569 A CN201810007569 A CN 201810007569A CN 108152715 A CN108152715 A CN 108152715A
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- circuit boards
- information
- plate number
- workbench
- support plates
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- 238000007689 inspection Methods 0.000 title claims abstract description 16
- 238000001514 detection method Methods 0.000 claims abstract description 27
- 238000007639 printing Methods 0.000 claims abstract description 17
- 230000002159 abnormal effect Effects 0.000 claims abstract description 16
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 230000003287 optical effect Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 230000006378 damage Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007648 laser printing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
Abstract
The present invention relates to a kind of IC support plates wireline inspection rejection system, including：Rack has the workbench for carrying IC circuit boards；Plate number marks module, for being marked to each IC circuit boards being located on workbench, with the side formation identification plate number on IC circuit boards；AOI detection devices, it is whether abnormal to scan the identification plate number of the IC circuit boards, and detect the IC circuit boards being located on workbench, if IC circuit boards have exception, the position where record IC circuit boards are abnormal；It scraps information and judges logging modle, be electrically connected with the AOI detection devices, to the position according to IC circuit boards where abnormal, record IC circuit boards scrap information；Printing equipment judges that logging modle is electrically connected with the information of scrapping, and to scrap information according to, scraps mark in corresponding IC circuit boards printing.The intervention of operating personnel is reduced, other good IC circuit boards are hurt caused by avoiding operating personnel's manual operation and the manual no marking of operating personnel, wrong beat scrap information, while also increase working efficiency.
Description
Technical field
The present invention relates to automation field, more particularly to a kind of IC support plates circuit rejection system.
Background technology
IC (integrated circuit, integrated circuit) is exactly the general designation of semiconductor element product, including：Integrated electricity
Road, diode, special electronic component, then broad sense are said a bit further relates to all electronic components, and as resistance, capacitance, circuit version waits perhaps
More Related products, with the trend development that electric equipment products are light and short, the circuit board (rigid circuit board) of traditional slab has not been inconsistent
Close the specification of thickness so that thin plate development of the thickness less than 250 μm is increasingly becoming mainstream,
IC support plates carry out wireline inspection in AOI (Automatic Optic Inspection, automatic optical detection device),
If AOI detection devices detect some IC support plate exception, staff is needed to scrap processing, the tradition side of scrapping to the IC support plates
Formula picks out the golden finger of abnormal IC support plates for personnel, and the detector efficiency of the method is slower, and since IC support plates are smaller, in this way
Other IC support plates are easily hurt, another IC support plates the more do the more thin, and operating personnel choose karat gold finger using sharp stage property and easily hurt IC
Support plate.
Invention content
Based on this, it is necessary to can precocity IC support plates damage for above-mentioned staff the scrap processing mode traditional to IC support plates
Bad the problem of, provides a kind of automatic detection rejection system for scrap the IC support plate circuits of identification and processing.
A kind of IC support plates wireline inspection rejection system, including：
Rack has the workbench for carrying IC circuit boards；
Plate number marks module, for being marked to each IC circuit boards being located on workbench, on IC circuit boards
Side forms identification plate number；
AOI detection devices to scan the identification plate number of the IC circuit boards, and detect the IC circuits being located on workbench
Whether plate is abnormal, if IC circuit boards have exception, the position where record IC circuit boards are abnormal；
It scraps information and judges logging modle, be electrically connected with the AOI detection devices, to according to IC circuit boards exception institute
Position, record IC circuit boards scrap information；
Printing equipment judges that logging modle is electrically connected, to scrap information according to, right with the information of scrapping
The printing of IC circuit boards is answered to scrap mark.
It is preferably carried out in mode at wherein one, IC circuit board exception informations are recorded in institute by the AOI detection devices
State the side of identification plate number.
It is preferably carried out in mode at wherein one, the information of scrapping judges that logging modle further includes：
Plate recognition unit has the corresponding identification plate number of the IC circuit boards for scrapping information to identify and record.
It is preferably carried out in mode at wherein one, the information of scrapping judges that IC circuit boards are scrapped information by logging modle
It is recorded in the side of the identification plate number.
It is preferably carried out in mode at wherein one, the printing equipment scraps mark by laser printing.
It is preferably carried out in mode at wherein one, the IC circuit boards are on array arrangement and the workbench.
Above-mentioned IC support plates wireline inspection rejection system can detect IC circuit boards automatically by AOI detection devices, to obtain
Whether the IC circuit boards detected there is exception, then judge logging modle to IC electricity abnormal at detection by scrapping information
Whether road plate there is exception, judges whether to scrap processing and forms record, and finally, above-mentioned printing equipment is according to above-mentioned judgement knot
Fruit prints on corresponding IC circuit boards and scraps mark.And IC support plates detection rejection system can scrap letter according to what is recorded
Breath, formation scrap archives, reduce the intervention of operating personnel, other good IC are hurt caused by avoiding operating personnel's manual operation
Circuit board and the manual no marking of operating personnel, wrong beat scrap information, while also increase working efficiency,
Description of the drawings
Fig. 1 is the module diagram of the detection rejection system of the IC support plate circuits of a preferred embodiment of the invention.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, it is right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
It should be noted that when element is referred to as " being set to " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
For illustrative purposes only, it is unique embodiment to be not offered as " right side " and similar statement.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The normally understood meaning of technical staff is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " including one or more phases
The arbitrary and all combination of the Listed Items of pass.
As shown in Figure 1, a preferred embodiment of the invention discloses a kind of IC support plates wireline inspection rejection system 100, it should
IC support plate wireline inspections rejection system 100 includes rack 110, plate number marking module 120, AOI detection devices 130, scraps information
Judge logging modle 140 and printing equipment 150.
Above-mentioned rack 110 has a workbench, the workbench for carrying IC circuit boards, above-mentioned AOI detection devices to
Detection is located at the IC circuit boards on workbench.
In present embodiment, above-mentioned IC circuit boards can be on array arrangement and the workbench.
Above-mentioned plate number marking module 120 is for marking each IC circuit boards being located on workbench, in IC electricity
It is formed on the plate of road and uniquely identifies plate number.
In detail, there is plate number to mark module 120 in the top of above-mentioned workbench, the plate number marking module 120 can root
According to presetting, the IC circuit boards being located on workbench are marked, an identification plate number is formed on the edges of boards of IC circuit boards,
Usually, which is that the identification plate number of unique, different IC circuit boards between each other will not be identical, in this way, work
Personnel can identify each piece of IC circuit board according to the identification plate number.
Above-mentioned AOI detection devices 130 are detected and are located on workbench to scan the identification plate number of the IC circuit boards
Whether IC circuit boards are abnormal, if IC circuit boards have exception, the position where record IC circuit boards are abnormal.
Specifically, above-mentioned AOI detection devices are based primarily upon optical principle and carry out optical scanner to being located at carrying IC circuit boards,
Also, show that scanned IC circuit boards form optical imagery on a display interface, to detect on the circuit in IC circuit boards
Solder joint etc. whether there is exception.
The identification plate number of the above-mentioned IC circuit boards of above-mentioned AOI detection devices also automatically scanning, if the AOI detection devices detect
The solder joint of certain occurs abnormal on the circuit of above-mentioned IC circuit boards, then records the IC circuit boards and abnormal position occur.
The exception information that abnormal position occur in above-mentioned recorded IC circuits can record under above-mentioned identification plate number.When
So, IC circuit board exception informations are recorded in the side of the identification plate number by above-mentioned AOI detection devices.
Above-mentioned information of scrapping judges that logging modle 140 is electrically connected with the AOI detection devices, to according to IC circuit boards
Position and other exception informations where abnormal, judge whether the IC circuit boards are scrapped, if the IC circuit boards are scrapped, record
IC circuit boards scrap information.
In another preferred embodiment of the present invention, above-mentioned information of scrapping judges that logging modle 140 can also be sentenced according to operating personnel
The judging result whether disconnected detected IC circuit boards are scrapped, record IC circuit boards scrap information.Therefore, it is scrapped for above-mentioned
Information judges the mode for judging IC circuit boards of logging modle 140, and this is not limited by the present invention.
It is described scrap information judge logging modle 140 by IC circuit boards scrap information be recorded in it is described identification plate number one
Side.
In more detail, above-mentioned information of scrapping judges that logging modle 140 further includes plate recognition unit, and the plate number identification is single
Member is mainly identifying and record the identification plate number that above-mentioned plate number marking module 120 is marked on IC circuit boards.
In this way, above-mentioned information of scrapping judges that logging modle 140 can be according to above-mentioned plate recognition unit, by each IC circuit boards
On the judging result whether scrapped with the IC circuit boards detected of identification plate number it is corresponding, and form corresponding record.
Above-mentioned printing equipment 150 judges that logging modle 140 is electrically connected with above-mentioned information of scrapping, to be scrapped according to
Information scraps mark in corresponding IC circuit boards printing.
Specifically, above-mentioned printing equipment 150 is according to the above-mentioned IC circuit boards scrapped information and judge that logging modle 140 detected
The judging result whether scrapped and other scrap information, on corresponding IC circuit boards printing scrap mark, such operating personnel
It can quickly identify which IC circuit board is to scrap processing during follow-up work.It and can be according to scrapping information
Judge that logging modle 140 found corresponding IC circuit boards scraps information.
In present embodiment, above-mentioned printing equipment 150 can scrap mark by the way that laser printing is above-mentioned.Staff can be reduced
The injury of dust, detritus to plate caused by due to manual operation.
Above-mentioned IC support plates wireline inspection rejection system 100 can detect IC circuit boards automatically by AOI detection devices 130,
Whether there is exception with the IC circuit boards for obtaining detected, then by scrapping at information judges logging modle 140 to detection
Whether abnormal IC circuit boards there is exception, judge whether to scrap processing and form record, finally, above-mentioned printing equipment 150
According to above-mentioned judging result, printed on corresponding IC circuit boards and scrap mark.And IC support plates detection rejection system 100 can root
According to the information of scrapping recorded, formation scraps archives, reduces the intervention of operating personnel, avoids operating personnel's manual operation and causes
Hurt other good IC circuit boards and the manual no marking of operating personnel, wrong beat scraps information, while also increase working efficiency,
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Embodiment described above only expresses the several embodiments of the present invention, and description is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that those of ordinary skill in the art are come
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (6)
1. a kind of IC support plates wireline inspection rejection system, which is characterized in that including：
Rack has the workbench for carrying IC circuit boards；
Plate number marks module, for being marked to each IC circuit boards being located on workbench, with the side on IC circuit boards
Form identification plate number；
AOI detection devices, to scan the identification plate number of the IC circuit boards, and the IC circuit boards detected on workbench are
No exception, if IC circuit boards have exception, the position where record IC circuit boards are abnormal；
It scraps information and judges logging modle, be electrically connected with the AOI detection devices, to according to the abnormal place of IC circuit boards
Position, record IC circuit boards scrap information；
Printing equipment judges that logging modle is electrically connected, to scrap information according to, in corresponding IC with the information of scrapping
Mark is scrapped in circuit board printing.
2. IC support plates wireline inspection rejection system according to claim 1, which is characterized in that the AOI detection devices will
IC circuit board exception informations are recorded in the side of the identification plate number.
3. IC support plates wireline inspection rejection system according to claim 1, which is characterized in that the information of scrapping judges note
Record module further includes：
Plate recognition unit has the corresponding identification plate number of the IC circuit boards for scrapping information to identify and record.
4. IC support plates wireline inspection rejection system according to claim 1, which is characterized in that the information of scrapping judges note
IC circuit boards are scrapped information and are recorded in the side for identifying plate number by record module.
5. IC support plates wireline inspection rejection system according to claim 1, which is characterized in that the printing equipment is by swashing
Mark is scrapped in light printing.
6. IC support plates wireline inspection rejection system according to claim 1, which is characterized in that the IC circuit boards are in array
In arrangement and the workbench.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810007569.9A CN108152715A (en) | 2018-01-04 | 2018-01-04 | IC support plate wireline inspection rejection systems |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810007569.9A CN108152715A (en) | 2018-01-04 | 2018-01-04 | IC support plate wireline inspection rejection systems |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108152715A true CN108152715A (en) | 2018-06-12 |
Family
ID=62460719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810007569.9A Pending CN108152715A (en) | 2018-01-04 | 2018-01-04 | IC support plate wireline inspection rejection systems |
Country Status (1)
| Country | Link |
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| CN (1) | CN108152715A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110991569A (en) * | 2019-11-26 | 2020-04-10 | 惠州市德赛西威汽车电子股份有限公司 | Method for automatically printing PCBA packaging label based on AOI equipment integration |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3433457A1 (en) * | 1984-09-12 | 1986-03-20 | Roland 4815 Schloß Holte-Stukenbrock Smyczek | Device for marking printed-circuit board defects, and a method of operation for said device |
| JP2006086281A (en) * | 2004-09-15 | 2006-03-30 | Nippon Mektron Ltd | Manufacturing method and apparatus for printed circuit board |
| TW201039703A (en) * | 2009-04-16 | 2010-11-01 | Unimicron Technology Corp | Quality control and inspection process flow for printed circuit board manufacturing |
| CN103837539A (en) * | 2012-11-22 | 2014-06-04 | 景硕科技股份有限公司 | Terminal inspection system |
| CN104494313A (en) * | 2014-12-18 | 2015-04-08 | 深圳市五株科技股份有限公司 | Method for manufacturing IC (Integrated Circuit) carrier identifier and marking device thereof |
| CN104889520A (en) * | 2015-04-14 | 2015-09-09 | 东莞市合易自动化科技有限公司 | Intelligent AOI welding selecting system and method |
| CN105654160A (en) * | 2016-01-08 | 2016-06-08 | 沛顿科技（深圳）有限公司 | Method for preparing unique identification code of memory chip |
| TWM543461U (en) * | 2017-03-14 | 2017-06-11 | Micron Laser Co Ltd | Appearance inspection device of integrated circuit carrier board |
| CN207866976U (en) * | 2018-01-04 | 2018-09-14 | 苏州统硕科技有限公司 | IC support plate wireline inspection rejection systems |
-
2018
- 2018-01-04 CN CN201810007569.9A patent/CN108152715A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3433457A1 (en) * | 1984-09-12 | 1986-03-20 | Roland 4815 Schloß Holte-Stukenbrock Smyczek | Device for marking printed-circuit board defects, and a method of operation for said device |
| JP2006086281A (en) * | 2004-09-15 | 2006-03-30 | Nippon Mektron Ltd | Manufacturing method and apparatus for printed circuit board |
| TW201039703A (en) * | 2009-04-16 | 2010-11-01 | Unimicron Technology Corp | Quality control and inspection process flow for printed circuit board manufacturing |
| CN103837539A (en) * | 2012-11-22 | 2014-06-04 | 景硕科技股份有限公司 | Terminal inspection system |
| CN104494313A (en) * | 2014-12-18 | 2015-04-08 | 深圳市五株科技股份有限公司 | Method for manufacturing IC (Integrated Circuit) carrier identifier and marking device thereof |
| CN104889520A (en) * | 2015-04-14 | 2015-09-09 | 东莞市合易自动化科技有限公司 | Intelligent AOI welding selecting system and method |
| CN105654160A (en) * | 2016-01-08 | 2016-06-08 | 沛顿科技（深圳）有限公司 | Method for preparing unique identification code of memory chip |
| TWM543461U (en) * | 2017-03-14 | 2017-06-11 | Micron Laser Co Ltd | Appearance inspection device of integrated circuit carrier board |
| CN207866976U (en) * | 2018-01-04 | 2018-09-14 | 苏州统硕科技有限公司 | IC support plate wireline inspection rejection systems |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110991569A (en) * | 2019-11-26 | 2020-04-10 | 惠州市德赛西威汽车电子股份有限公司 | Method for automatically printing PCBA packaging label based on AOI equipment integration |
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