CN117545182A

CN117545182A - Processing apparatus, processing method, and traceable component carrier structure

Info

Publication number: CN117545182A
Application number: CN202311407140.6A
Authority: CN
Inventors: 杜光业; 汪敏; 陈慧敏; 齐鸣贤; 莫炜翔; 李华民
Original assignee: AT&S China Co Ltd
Current assignee: AT&S China Co Ltd
Priority date: 2023-10-26
Filing date: 2023-10-26
Publication date: 2024-02-09

Abstract

An apparatus (100) and method for processing a component carrier structure (102) to enable tracking of the component carrier structure (102), the apparatus (100) comprising: a reading device (104) for reading a primary identifier (106) arranged in the interior of the component carrier structure (102) and identifying the processed component carrier structure (102); and a writing device (108) for writing a secondary identifier (110, 111) associated with the processed component carrier structure (102) and corresponding to the primary identifier (106) at an exterior of the component carrier structure (102), wherein the reading device (104) and the writing device (108) are configured for reading the primary identifier (106) and writing the secondary identifier (110, 111) while the component carrier structure (102) remains in a stationary reading and writing position. The present application also relates to a traceable component carrier structure.

Description

Processing apparatus, processing method, and traceable component carrier structure

Technical Field

The present invention relates to an apparatus and method for processing a component carrier structure to make the component carrier structure traceable, and to a component carrier structure.

Background

In the background of the increasing product functionality of component carriers equipped with one or more electronic components, the increasing miniaturization of such electronic components and the increasing number of electronic components mounted on the component carrier, such as printed circuit boards, increasingly powerful array-like components or packages with several electronic components are being employed, which have a plurality of contacts or connections, and the spacing between these contacts is increasingly smaller. Removal of heat generated by such electronic components and component carriers themselves during operation is becoming an increasingly serious problem. At the same time, the component carrier should be mechanically strong (mechanically robust) and electrically reliable in order to be able to operate even under severe conditions.

Traceability of the component carrier or its preform, i.e. the ability to track and identify the component carrier structure, e.g. during manufacture and/or use, is desired.

Disclosure of Invention

The object of the invention is to efficiently track a component carrier and/or a preform thereof.

To achieve the above object, an apparatus and a method for processing a component carrier structure to make the component carrier structure traceable and a component carrier structure according to the independent claims are provided.

According to an exemplary embodiment of the present invention, there is provided an apparatus for processing a component carrier structure to make the component carrier structure traceable, the apparatus comprising: reading means for reading a primary identifier arranged in an interior of the component carrier structure and identifying a processed component carrier structure; and a writing device for writing a secondary identifier associated with the processed component carrier structure and correspondingly associated (corridated) with the primary identifier at an exterior of the component carrier structure, wherein the reading device and the writing device are configured for reading the primary identifier and writing the secondary identifier while the component carrier structure remains at the stationary reading and writing positions.

According to another exemplary embodiment of the present invention, there is provided a method of processing a component carrier structure to enable tracking of the component carrier structure, the method comprising: reading a primary identifier disposed in an interior of the component carrier structure and identifying a processed component carrier structure; and writing a secondary identifier associated with the processed component carrier structure and corresponding associated with the primary identifier at an exterior of the component carrier structure; wherein reading the primary identifier and writing the secondary identifier is performed while the component carrier structure remains at the stationary read and write positions.

According to another exemplary embodiment of the present invention, there is provided a traceable component carrier structure, comprising: a stack comprising a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures; a primary X-ray readable identifier disposed in the interior of the stack and identifying the component carrier structure; and an optically readable secondary identifier located at or closer to the exterior of the stack than the primary identifier, the secondary identifier being associated with the component carrier structure and being correspondingly associated with the primary identifier.

In the context of the present application, the term "apparatus for processing a component carrier structure" may particularly denote a machine configured to act on the component carrier structure in order to change structural and/or functional properties of the component carrier structure. In particular, such a device may be configured to define, physically create, and/or act on a physical identifier of a component carrier structure.

In the context of the present application, the term "reading device for reading a primary identifier arranged in the interior of a component carrier" may particularly denote a device comprising a sensing element configured to sense data indicative of characteristics and/or information content of a primary identifier positioned embedded or masked in the interior of a component carrier structure instead of on an outer surface of the component carrier structure. Such a reading device may be, for example, an X-ray reader. Alternatively, such a reading device may be, for example, an MRT (magnetic resonance tomography), CT (computed tomography) or PET (positron emission tomography) device.

In the context of the present application, the term "writing means for writing a marker on the outside of the component carrier structure" may particularly denote means configured to create a physical marker on the outside surface of the component carrier structure. For example, such a writing device may create a readable pattern that may be used as a marker. Such writing means may write the marker by laser, by electron beam, by photolithography and etching, or by printing, for example.

In the context of the present application, the term "reading means and writing means configured for reading and writing while the component carrier structure is held in a stationary reading and writing position" may particularly denote that the component carrier structure may be held or held in a fixed position while the reading means reads the identifier from the component carrier structure and the writing means writes another identifier onto the component carrier structure. The stationary read and write position may be configured such that when the component carrier structure is located at the stationary read and write position, the stationary read and write position supports or allows reading and writing of the identifier of the component carrier structure.

In the context of the present application, the term "component carrier" may particularly denote any support structure capable of accommodating one or more components on and/or in the component carrier to provide mechanical support and/or electrical connection. In other words, the component carrier may be configured as a mechanical and/or electrical carrier for the component. In particular, the component carrier may be one of a Printed Circuit Board (PCB), an organic interposer, and an IC (integrated circuit) substrate. The component carrier may also be a hybrid board in which different ones of the above-mentioned types of component carriers are combined.

In the context of the present application, the term "stack" may particularly denote a flat or planar sheet-like body. For example, the stack may be a laminate, in particular a laminated laminate or a laminate. Such a laminate may be formed by joining a plurality of layer structures by applying mechanical pressure and/or heat. Preferably, the stacked layer structures may be arranged parallel to each other.

In the context of the present application, the term "layer structure" may particularly denote a continuous layer, a patterned layer or a plurality of discontinuous islands in a common plane.

In the context of the present application, the term "component carrier structure" may particularly denote a component carrier (such as a printed circuit board or an IC substrate) itself or a larger body (such as a panel or an array) of a plurality of component carriers or preforms thereof (e.g. semi-finished products obtained during manufacturing of the component carriers individually or in a batch process).

In the context of the present application, the term "trackable component carrier structure" may particularly denote a component carrier structure that the trackable component carrier structure is configured to such that it can be tracked (trace) or tracked (track) during the manufacturing process and/or during use. In particular, the trackable component carrier structure may be configured such that the component carrier structure may be (particularly uniquely) identified, more particularly by reading the secondary identifier and/or the primary identifier of the trackable component carrier. It is also possible that the traceable component carrier structure is configured to be traceable such that the at least one identifier of the component carrier structure also allows retrieving information about the manufacturing process of the component carrier structure, in particular about the manufacturing lot of the component carrier structure, its manufacturing time, its manufacturing location and/or operating parameters of the manufacturing plant (e.g. temperature, humidity, etc.) during the manufacturing of the component carrier structure. Tracking component carrier structures may allow verification of the history, location, or application of individual component carrier structures.

In the context of the present application, the term "tracking or tracing a component carrier or component carrier structure" may particularly denote an opportunity to be able to analyze a component carrier or component carrier structure of a system that is able to analyze the component carrier or component carrier structure in relation to an assigned identifier or identification code, thereby allowing identification of the component carrier or component carrier structure and/or allowing correlation of the component carrier or component carrier structure with a specific manufacturing lot or batch (e.g. for determining lot numbers) and/or manufacturing location, manufacturing process (e.g. specific customer orders), time (e.g. date) or problem (e.g. quality problem determined during product testing).

In the context of the present application, the term "identifier" may particularly denote a physical structure assigned to or related to a component carrier or a component carrier structure or a layer structure thereof, and which identifies said component carrier, said component carrier structure or said layer structure. In particular, the identifier may be a code structure. Preferably, but not necessarily, the identifier or combination of identifiers may be unique to a particular component carrier or component carrier structure. However, the identifier or combination of identifiers may also be the same for a certain number of component carriers or component carrier structures, for example for those component carriers or component carrier structures manufactured in the same batch or lot. For example, such a marker may be a QR code. In such a QR code or other identifier, information such as a link to a particular dataset in a database may be included. Additionally or alternatively, such QR codes or other identifiers may include lot numbers, panel serial numbers, dates and times when panels were produced (e.g., in photo imaging or Laser Direct Imaging (LDI) processes). In particular, the manufacturing history of the component carrier structure or a portion thereof (e.g., a layer structure) may be directly encoded in the corresponding one or more identifiers and/or may be retrieved from a dataset in a database linked to the one or more identifiers. In particular, the identifier may be an identification structure. For example, the identifier may be generated by one or more of the following processes: patterning by a photolithography process or LDI; applying the marker by gluing, cutting, scribing, casting, embossing, printing (in particular three-dimensional printing, inkjet printing, etc.); providing a tag made of a conductive or dielectric material, wherein the material of the tag should differ in respect of the properties of the tag with respect to the surrounding material, in order to enable the tag to be read by the reader device (e.g. by providing a darker tag made of a corresponding resin, the darker tag being surrounded by a lighter colored (e.g. at least partially transparent) resin, so that the tag can be read by the reader device. By means of at least one lighter colored resin (which may also be two or more transparent resins), the code or tag may be made of a variety of materials and/or high-order parts (heights), which may for example be used for establishing a multi-dimensional code (e.g. a 4D code).

In the context of the present application, the term "main surface" of the body may particularly denote one of the two largest opposing surfaces of the body. The major surfaces may be joined by a circumferential sidewall. The thickness of a body, such as a component carrier structure or stack, may be defined by the distance between two opposite major surfaces.

According to an exemplary embodiment of the present invention, the component carrier structure may be processed to provide the component carrier structure with structural features that allow it to be reliably tracked in a simple manner. For this purpose, reading means may be provided for reading the primary identifier from an embedded location in the interior of the component carrier structure. The primary identifier may be configured to provide identification information for identifying the component carrier structure when read out. Advantageously, the primary identifier may be read by X-rays of an X-ray reader device. In addition, a writing device may be used to write the secondary identifier to an external location on the component carrier structure. Advantageously, the secondary identifier may be read from the outer surface of the component carrier structure by an optical reader device, such as a camera operating in the visible wavelength range. Additionally or alternatively, the secondary identifier may be read by a reading device. The secondary identifier may be read by an X-ray reader device, for example. The second identifier may be associated with the primary identifier and thus also be able to identify the component carrier structure, for example in terms of tracking the component carrier structure. However, the written second identifier may be read by a very simple reader (such as an optical camera) that only requires the ability to read information from an externally exposed surface of the physical structure. Preferably, the information content carried by the second identifier may be based at least in part on the information content carried by the primary identifier such that the information content carried by the second identifier is also associated with the processed component carrier structure and thus also able to identify the component carrier structure. Thus, the surface-positioned second identifier can support the complete traceability of the component carrier structure in a simple manner without the need to implement a more complex reading device with the ability to read hidden internal identifiers in order to track the component carrier structure. Advantageously, the reading means and the writing means may be arranged and capable of performing an identifier reading/writing task of the reading means and the writing means while the component carrier structure is resting at a fixed or rest position during reading and during writing. This may allow for fast execution of read and write tasks without the need to transfer the component carrier structure from the read location to another write location after reading and before writing. This may avoid unwanted damage or contamination of the component carrier structure, as the component carrier structure remains in a fixed or rest position during reading and during writing. This may also allow the device to be constructed in a compact manner. Advantageously, exemplary embodiments may allow for the application of a marker to a component carrier structure to allow for tracking and linking of information of all layers of a separate component carrier structure, such as a panel for manufacturing a printed circuit board or an integrated circuit substrate. Advantageously, the apparatus and method of the exemplary embodiments may allow for complete traceability of component carrier structures and component carriers separated therefrom along the entire processing chain from core processing to shipping, and also during actual use, if desired.

Further exemplary embodiments of component carrier structures, methods and apparatus will be explained below.

In an embodiment, the method comprises reading, by an X-ray reading device, the primary identifier located in the interior of the component carrier structure through at least one electrically conductive layer structure (such as a continuous or patterned metal layer). Surprisingly, the primary identifier embodied as a patterned metal structure in the interior of the component carrier structure can be read correctly by X-ray detection even through another electrically conductive layer structure of the component carrier structure between the reading device and the primary identifier.

In an embodiment, the reading device comprises an X-ray emitting unit and an X-ray detecting unit. The X-ray emitting unit may be configured to generate X-rays and direct the X-rays onto the component carrier structure to be processed to read out the primary identifier. The X-ray detection unit may be arranged relative to the X-ray emission unit and the component carrier structure for detecting X-rays that have been emitted by the X-ray emission unit and passed through the component carrier structure, and in particular for detecting X-rays that have been emitted by the X-ray emission unit and passed through the component carrier structure and the embedded first marker. The X-ray emitting unit and/or the X-ray detecting unit may be moved individually to increase the flexibility of mutual spatial adjustment of the reading operations. Alternatively, the X-ray emitting unit and/or the X-ray detecting unit may be spatially fixed.

In an embodiment, it is possible to detect a negative image at the time of reading. The metal structure may not completely allow the X-rays to pass therethrough, and thus a reduced amount of X-rays may pass through the metal portion of the PCB as compared to the portion comprising the resin.

In an embodiment, the writing means is configured for laser writing the secondary identifier. In other words, the writing device may comprise a laser source which may be controlled for emitting a laser beam which acts on the outer surface of the component carrier structure in order to write the secondary identifier on the component carrier structure. For example, the laser source may scan over an extension of the component carrier structure or a portion thereof to write the secondary identifier.

In an embodiment, the writing means comprises a first writing unit for writing a first secondary identifier on one outer main surface of the component carrier structure and comprises a second writing unit for writing a second secondary identifier on the opposite other outer main surface of the component carrier structure. In such an advantageous embodiment, two secondary identifiers may be written on two opposite major surfaces of the component carrier structure. This allows obtaining a component carrier structure that can be identified during the tracking of the tracking process by reading the second identifier from any exposed main surface of the component carrier structure. For example, each of the two writing units may be configured for laser writing a respective secondary identifier, as explained in the previous paragraph. Reliability may also be improved by forming respective secondary markers on two opposite main surfaces of the component carrier structure, since identification of the component carrier during tracking of the tracking process may also be successfully accomplished when one of the two redundant secondary markers is damaged during production or use, for example by external impact. Corresponding secondary markers may be formed on the top and bottom sides of the component carrier structure by laser processing. Such redundancy may simplify reading of the secondary identifier, for example, when one side of the component carrier structure (e.g., the panel) is not currently readable during processing (e.g., because the component carrier structure rests on the ground). Thereby, complex and time-consuming processes such as panel flipping can be avoided. This may also avoid unnecessary damage or contamination to the component carrier structure.

In an embodiment, the arrangement and configuration of the first and second writing units enables simultaneous writing of the first and second secondary identifiers. Advantageously, the first writing element may process a first exposed major surface of the component carrier structure to form a first secondary identifier thereon, while the second writing element may process a second exposed major surface of the component carrier structure to form a second secondary identifier thereon. Such completely simultaneous, quasi-simultaneous or temporally overlapping writing processes may shorten processing time and may increase throughput of the processed component carrier structure.

In an embodiment, the device comprises a primary analysis unit for analyzing information read from the primary identifier. When the reading device reads the primary identifier arranged in the interior of the component carrier structure, the primary analysis unit may be provided with detected data and may process and analyze the detected data. In particular, the primary analysis unit may be configured to retrieve identification information from the read primary identifier. This retrieved identification information identifying the assigned component carrier structure may then be used to define a secondary identifier to be written on the outside of the component carrier structure.

In an embodiment, the device comprises a generation unit for generating the secondary identifier based on the analyzed primary identifier. For example, identification information retrieved by the primary analysis unit from the read and analyzed primary identifier may be passed to the generation unit, which may determine or define the information content of the secondary identifier to be written on the outside of the component carrier structure on this basis.

In an embodiment, the generation unit is configured to generate the secondary identifier with additional information content and/or with reduced information content compared to the analyzed primary identifier. Although the information content of the first identifier and the second identifier may not be identical, there may be an overlap of the information content of the first identifier and the information content of the second identifier. In one embodiment, the information content of the second identifier includes all of the information content of the first identifier plus additional information content (e.g., additional information content reflecting additional processing steps after the formation of the primary identifier). The information content of the primary identifier may also be omitted for the secondary identifier, for example when the secondary identifier only carries a more concise information content regarding the identity of the component carrier structure and does not carry additional information, such as processing parameters. In yet another embodiment, the generation unit may be configured to generate a secondary identifier having the same information content as the analyzed primary identifier, e.g. the secondary identifier as a real copy thereof. In this case, the information content of the secondary identifier may be a fingerprint of the information content of the primary identifier. In particular, the primary and secondary identifiers may have some or all of the same information content.

In an embodiment, if the primary analysis unit determines that the primary identifier is not readable, the reading means is instructed to read another primary identifier arranged in the interior of the component carrier structure and to identify the processed component carrier structure. In undesired cases, it may happen that the primary identifier located in the interior of the component carrier structure cannot be read correctly from the outside, for example because the material between the primary identifier and the reading means (e.g. the region of the component carrier structure having a significant copper content) reduces the accuracy of the information read from the primary identifier. It may also happen that the primary identifier is subject to manufacturing errors and does not actually carry all the desired information. In such a case, it may happen that the reading device cannot correctly read the information content of the primary identifier. However, to allow meaningful creation of secondary identifiers based on at least a portion of the information content of the first identifier that cannot be read correctly, another (e.g. fully redundant) primary identifier may be arranged at another location in the interior of the component carrier structure. Then, when the ordinary primary identifier is not readable, other primary identifiers may be used to read out the identification information of the component carrier structure. This backup feature improves the robustness of the system to failure. The information content of the common primary identifier and the other primary identifiers may be identical or overlapping. In order to read the other primary identifier correctly, the reading means may be moved from a reading position for reading the common primary identifier to another reading position for reading the other primary identifier.

In an embodiment, if the primary analysis unit determines that the primary identifier and optionally the further primary identifier is readable or not readable, the suggestion unit outputs a warning that invites (e.g. the user) to provide information for identifying the component carrier structure. Thus, when another option for providing identification information about the component carrier structure is added, the fault robustness of the system can be further improved even when the primary identifier and the further primary identifier (both embedded in the interior of the component carrier structure) are not readable. In this case, the advice unit may automatically output a notification or an alarm, thereby enabling a human operator to manually provide the identification information required for creating the secondary identifier. For example, the operator may provide the identification information by holding the scanner in the hand or by entering an alphanumeric code in an input device.

In an embodiment, the device comprises a secondary analysis unit for analyzing the written secondary identifier. When at least one secondary identifier has been written or formed on the outer surface of the component carrier structure (e.g. by moving the laser beam), the secondary analysis unit may read the secondary identifier to verify that the secondary identifier has been formed correctly. Thus, the written secondary identifier can be read out and its information content can be retrieved and analyzed. The information content of the determined secondary identifier may be compared with the target information content of the secondary identifier derived from the previously read primary identifier as a basis for writing the secondary identifier. If the actual information content of the read secondary identifier corresponds to the target information content of the secondary identifier, the secondary analysis unit may conclude that the formation of the secondary identifier has succeeded and may continue the processing of the associated component carrier structure. If not, a predetermined action may be taken. Such a predetermined action may be, for example, repeating the process of writing the second identifier, performing a repair procedure, or classifying the associated component carrier structure as bad or waste.

In an embodiment, the secondary analysis unit comprises an optical camera. Such an optical camera may be, for example, a CMOS camera or a CCD camera. An optical camera operating in the visible or infrared range may be used. With such an optical camera, the secondary identifier can be read out from the outside of the component carrier structure in a simple manner.

In an embodiment, the reading device is movable relative to the stationary reading and writing positions. Such movement may be, for example, longitudinal movement and/or tilting movement. The different elements of the reading device, such as the X-ray emitting unit and the X-ray detecting unit, may also be moved relative to each other. By such a movable reading device, the reading device can be properly aligned with respect to the stationary part carrier structure to properly read the embedded primary identifier.

In an embodiment, the writing means is movable relative to the stationary reading and writing positions. Such movement may be, for example, longitudinal movement and/or tilting movement. The different elements of the writing device, e.g. the first writing unit and the second writing unit, may also be moved separately or relative to each other. By such a movable writing means, the writing means can be correctly aligned with respect to the stationary part carrier structure for correctly writing an external secondary identifier, or even simultaneously writing a plurality of secondary identifiers.

In an embodiment, the apparatus includes at least one electrostatic discharge protection feature for protecting the component carrier structure. In the context of the present application, the term "electrostatic discharge protection feature" may particularly denote any structural arrangement of the device that improves electrostatic discharge (ESD) protection of a component carrier structure handled by the device. For example, the at least one electrostatic discharge protection feature may include an electrostatic safety chuck configured to manipulate the component carrier structure in an electrostatic discharge protected manner by suction. It is also possible that the at least one electrostatic discharge protection feature comprises an electrostatic discharge safety table top on which the component carrier structure can be placed during handling or processing of the component carrier structure by the device. Additionally or alternatively, the at least one electrostatic discharge protection feature may comprise an electrostatic discharge safety roller upon which the component carrier structure may be conveyed during handling or processing by the apparatus. Still further additionally or alternatively, the at least one electrostatic discharge protection feature may include an electrostatic discharge safety grounding device for grounding the apparatus. The electrostatic discharge safety grounding device can be realized, for example, by an electrostatic discharge safety foot by means of which the apparatus stands on the ground.

In an embodiment, the apparatus comprises a layer stack forming means for attaching and handling one or more additional layer structures to one or both opposite main surfaces of the component carrier structure. Preferably, the writing means may be configured to write at least one further secondary identifier associated with the read primary identifier correspondence on the outside of the one or more additional layer structures. Thus, the component carrier structure may comprise at least one further secondary identifier on or in the stack, which is associated with the component carrier structure and which is associated with the primary identifier, wherein the secondary identifier is arranged between the primary identifier and the at least one further secondary identifier. Such layer build-up formation may include attaching, patterning and/or depositing one or more layers (such as prepreg layers, copper foil, arrangements of deposited copper layers and/or copper vias) on one or both opposing major surfaces of the component carrier structure being processed. Further, such layer stack formation may include patterning and/or other processes of such layers. After such additional layer build-up is formed on the component carrier structure, the secondary identifier previously located on the surface may be hidden by one or more additional layers such that the secondary identifier can no longer be read by a simple optical camera or the like. In this case, it may be advantageous to write one or more further secondary markers on the outer surface of the component carrier structure with an additional outer layer on the component carrier structure. For example, the additional secondary identifier may have the same information content as the previously formed secondary identifier. Alternatively, the information content of one or more further secondary identifiers may be different from the information content of one or more previously formed secondary identifiers. In any case, the at least one further secondary identifier may comprise information allowing identification of the assigned component carrier structure. The secondary identifier may be formed at a plurality of different vertical layers or levels of the component carrier structure, such as at least six layers, at least 12 layers, or even at least 16 layers. Thus, the process of forming one or more additional secondary identifiers may be repeated one or more times, for example one or more times after each new layer is attached.

In an embodiment, the apparatus comprises a transport mechanism for transporting the component carrier structure from a loader unit for loading the component carrier structure to the read and write positions to an unloader unit for unloading the component carrier structure. For example, a source library of stacked component carrier structures may exist at the loader unit. The component carrier structures one by one may be transferred from the loader unit to the unloader unit via the read and write locations for unloading the component carrier structures processed one by one into the target library. The transport mechanism may comprise at least one conveyor belt and/or at least one robotic manipulator or the like for conveying the component carrier structure. This may simplify the handling of the component carrier structure to be handled.

In an embodiment, the device comprises a removal mechanism for removing a component carrier structure that is classified as bad, e.g. due to detection of a defect of the primary and/or secondary identifier. When the inspection of the primary and/or secondary identifier results in a defective inspected identifier or assigned component carrier structure, for example because the inspected identifier cannot be read out or does not carry the desired information content, the corresponding component carrier structure may be ejected from the processing chain of the device as a defective product. For example, a defective component carrier structure may be stacked as a defective commodity (label). This ensures proper handling of the component carrier structure and suppresses the risk of defects.

In an embodiment, the transport mechanism is configured for moving the part carrier structure to be processed between the loader unit and the unloader unit in another direction transverse to the direction in which the bad part carrier structure was removed. This allows a clear and reliable separation of good and bad component carrier structures.

In an embodiment, the device is configured as a single, unitary machine, in particular with all the constituent components arranged within a common housing. Advantageously, all the constituent components, in particular the reading device and the writing device, and the actuating mechanism for actuating the component carrier structure can be arranged inside a common housing or shell. This allows the device to be manufactured in a highly compact manner, so that space consumption in the factory is small. Furthermore, this allows to increase the safety during operation, for example when X-rays are involved in the operation. This also prevents unnecessary foreign matter from contaminating the component carrier structure.

In an embodiment, the device may comprise another component, such as a lead box, that prevents radiation from passing through and/or reaching the environment.

In an embodiment, the primary identifier that can be read by X-rays includes a QR code (or another two-dimensional code), a bar code (or another one-dimensional code), a copper pattern (e.g., forming a QR code), and/or a laser direct imaging pattern. Accordingly, the secondary identifier that is capable of being optically read may include a QR code, a bar code (or another one-dimensional code), a laser-written code (e.g., formed by laser direct imaging), and/or a human-readable code (e.g., an alphanumeric code). For example, the primary and/or secondary markers may be formed as copper patterns and thus as an integral part of the component carrier structure. This may allow for the manufacture of a corresponding identifier that is fully integrated in the component carrier manufacturing process, thus requiring substantially no additional labor.

In an embodiment, each of the primary identifier and the secondary identifier is individually configured as a unique identifier of the component carrier structure. Thus, the respective identifier may comprise or encode or carry information for identifying the component carrier structure and for distinguishing the component carrier structure from all other component carrier structures. In other words, no two component carrier structures can therefore have identifiers carrying identical identification information contents. In an embodiment, a portion of the respective marker tag (e.g., the primary marker or secondary marker) may include conductive traces, pads, bumps, and/or vias.

The component carrier, the reading device and the writing device may be fixed relative to each other, preferably in a specific direction from the loading section to the unloading section (the unloading section being used for transporting the component carrier structure). This may enable the possibility of operating the machine or the apparatus continuously, for example not only during a batch process, but also continuously. Alternatively, the device may have a plurality of such stations, either mobile or locally fixed. Advantageously, this may enable only one conveyor to be provided.

In an embodiment, the component carrier structure or the component carrier thereof comprises a stack of at least one electrically insulating layer structure and at least one electrically conducting layer structure. For example, the component carrier may be a laminate of the mentioned electrically insulating layer structure and electrically conducting layer structure, in particular formed by applying mechanical pressure and/or thermal energy. The mentioned stack may provide a plate-like component carrier that is capable of providing a large mounting surface for further components and yet is very thin and compact.

In an embodiment, the component carrier structure or its component carrier is shaped as a plate. This contributes to a compact design, wherein the component carrier still provides a large basis for mounting components thereon. In particular, a bare chip as an example of an electronic component may be surface-mounted on a thin plate such as a printed circuit board.

In an embodiment, the component carrier is configured as one of: printed circuit boards, substrates (particularly IC substrates) and interposers.

In the context of the present application, the term "printed circuit board" (PCB) may particularly denote a board-like component carrier formed by laminating a plurality of electrically conductive layer structures with a plurality of electrically insulating layer structures, e.g. by applying pressure and/or by supplying thermal energy. As a preferred material for PCB technology, the electrically conductive layer structure is made of copper, whereas the electrically insulating layer structure may comprise resin and/or glass fibres, so-called prepreg or FR4 material. The various electrically conductive layer structures may be connected to each other in a desired manner, for example by laser drilling or mechanical drilling to form vias through the laminate and by filling these vias partially or completely with an electrically conductive material, in particular copper, to form vias or any other via connections. The fill hole connects the entire stack (via connection extending through multiple layers or the entire stack), or the fill hole connects at least two electrically conductive layers, called vias. Similarly, optical interconnects may be formed through the various layers of the stack to receive an electro-optic circuit board (EOCB). The printed circuit board is typically configured to house one or more components on one or both opposing surfaces of the board-like printed circuit board. The components may be attached to the respective major surfaces by welding. The dielectric portion of the PCB may be composed of a resin with reinforcing fibers, such as glass fibers.

In the context of the present application, the term "substrate" may particularly denote a widget carrier. The substrate may be a relatively small component carrier relative to the PCB, one or more components may be mounted on the component carrier, and the substrate may serve as a connection medium between one or more chips and another PCB. For example, the substrate may have substantially the same size as the component (particularly an electronic component) to be mounted on the substrate (e.g., in the case of a Chip Scale Package (CSP)). More specifically, a substrate is understood to be a carrier for an electrical connection or electrical network as well as a component carrier comparable to a Printed Circuit Board (PCB), but with a rather high connection density in a lateral and/or vertical arrangement. The lateral connections are for example conductive paths, while the vertical connections may be for example boreholes. These lateral and/or vertical connections are arranged within the base plate and may be used to provide electrical, thermal and/or mechanical connections between housed or non-housed components (such as bare chips), in particular IC chips, and a printed circuit board or an intermediate printed circuit board. Thus, the term "substrate" also includes "IC substrate". The dielectric portion of the substrate may be composed of a resin with reinforcing particles, such as reinforcing spheres, particularly glass spheres.

The substrate or interposer (interposer) may include or consist of: at least one layer of glass, silicon (Si) or photoimageable or dry etchable organic material such as an epoxy-based build-up layer film or a polymer compound (which may or may not include photosensitive and/or thermosensitive molecules) such as polyimide or polybenzoxazole.

In an embodiment, the at least one electrically insulating layer structure comprises at least one of: resins or polymers such as epoxy resins, cyanate resins, benzocyclobutene resins, melamine derivatives, polybenzoxabenzene (PBO), bismaleimide triazine resins, polyphenylene derivatives (e.g., based on polyphenylene ether, PPE), polyimide (PI), polyamide (PA), liquid Crystal Polymers (LCP), polytetrafluoroethylene (PTFE), bisbenzocyclobutene (BCB), and/or combinations thereof. Reinforcing structures made of glass (multiple layer glass), for example, such as mesh, fibers, spheres, or other types of filler particles, may also be used to form the composite. A semi-cured resin, such as a fiber impregnated with the above resin, combined with a reinforcing agent is referred to as a prepreg. These prepregs are generally named for their properties describing their flame retardant properties, such as FR4 or FR5. While prepregs, particularly FR4, are generally preferred for rigid PCBs, other materials, particularly epoxy-based buildup layer materials (such as epoxy-based buildup films) or photoimageable dielectric materials, may also be used. For high frequency applications, high frequency materials such as polytetrafluoroethylene, liquid crystal polymers, and/or cyanate ester resins may be preferred. In addition to these polymers, low Temperature Cofired Ceramics (LTCC) or other low DK materials, very low DK materials or ultra low DK materials may be applied as an electrically insulating layer structure in a component carrier.

In an embodiment, the at least one electrically conductive layer structure comprises at least one of: copper, aluminum, nickel, silver, gold, palladium, tungsten, and magnesium. Although copper is generally preferred, other materials or coated versions thereof are also possible, particularly coated with a superconducting material or conductive polymer, such as graphene or poly (3, 4-ethylenedioxythiophene) (PEDOT), respectively.

The at least one component may be surface mounted on and/or embedded in the component carrier structure. Such components may be selected from the following: a non-conductive inlay, a conductive inlay (such as a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (e.g., a heat pipe), a light guiding element (e.g., an optical waveguide or a light guiding connection), an electronic component, or a combination thereof. The inlay may be, for example, a metal block, with or without a coating of insulating material (IMS inlay), which may be surface mounted to facilitate heat dissipation. Suitable materials are defined in terms of their thermal conductivity, which should be at least 2W/mK. Such materials are typically based on, but are not limited to, metals, metal oxides, and/or ceramics, such as copper, aluminum oxide (Al ₂ O ₃ ) Or aluminum nitride (AlN). Other geometries with increased surface area are also often used in order to increase heat exchange capacity. Furthermore, the components may be active electronic components (with at least one p-n junction implemented), passive electronic components (such as resistors, inductors, or capacitors), electronic chips, memory devices (e.g., DRAM or other data storage device), filters, integrated circuits (such as Field Programmable Gate Array (FPGA), programmable Array Logic (PAL), general purpose array logic (GAL), and Complex Programmable Logic Devices (CPLD)), signal processing components, power management components (such as Field Effect Transistors (FETs), metal Oxide Semiconductor Field Effect Transistors (MOSFETs), complementary Metal Oxide Semiconductors (CMOS), junction Field Effect Transistors (JFETs), or insulated-gate field effect transistors (IGFETs), all based on semiconductor materials such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga ₂ O ₃ ) Indium gallium arsenide(InGaAs) and/or any other suitable inorganic compound), a photo-electric interface element, a light emitting diode, a photo-coupler, a voltage converter (e.g., a DC/DC converter or an AC/DC converter), a cryptographic component, a transmitter and/or receiver, an electromechanical transducer, a sensor, an actuator, a microelectromechanical system (MEMS), a microprocessor, a capacitor, a resistor, an inductance, a battery, a switch, a camera, an antenna, a logic chip, and an energy harvesting unit. However, other components may be surface mounted on the component carrier. For example, a magnetic element may be used as a component. Such a magnetic element may be a permanent magnetic element (such as a ferromagnetic element, an antiferromagnetic element, a multiferroic element or a ferrimagnetic element, e.g. a ferrite core) or may be a paramagnetic element. However, the component may also be an IC substrate, an interposer or another component carrier, for example a component carrier in a board-in-board configuration. The component may be surface mounted on the component carrier and/or may be embedded in the component carrier. In addition, other components, particularly those that generate and emit electromagnetic radiation and/or are sensitive to electromagnetic radiation propagating from the environment, may also be used as components.

In an embodiment, the component carrier structure or component carrier thereof is a laminate type component carrier structure or component carrier. In such embodiments, the component carrier is a composite of multiple layers stacked and joined together by application of compressive force and/or heat.

After processing the component carrier structure or the inner layer structure of the component carrier thereof, one or both opposite main surfaces of the processed layer structure may be symmetrically or asymmetrically covered (in particular by lamination) with one or more further electrically insulating layer structures and/or electrically conductive layer structures. In other words, stacking may continue until a desired number of layers is obtained.

After the formation of the stack with the electrically insulating layer structure and the electrically conductive layer structure is completed, the resulting layer structure or component carrier may be surface treated.

In particular, in terms of surface treatment, an electrically insulating solder resist may be applied to one or both opposite major surfaces of the layer stack or component carrier. For example, such a solder resist may be formed over the entire major surface and the solder resist layer is then patterned so as to expose one or more conductive surface portions that will serve to electrically couple the component carrier to the electronic periphery. The surface portion of the component carrier, which is still covered with the solder resist, can be effectively protected from oxidation or corrosion, and in particular the surface portion containing copper can be effectively protected from oxidation or corrosion.

As far as the surface treatment is concerned, the exposed conductive surface portions of the component carrier may also be selectively surface treated. Such a surface treatment may be an electrically conductive covering material on an exposed electrically conductive layer structure (such as a pad, an electrically conductive track, etc., in particular comprising or consisting of copper) on the surface of the component carrier. If such exposed electrically conductive layer structures are not protected, the exposed electrically conductive component carrier material (particularly copper) may oxidize, making the component carrier less reliable. The surface treatment may then be formed as a joint between, for example, a surface mounted component and a component carrier. The surface treatment has the function of protecting the exposed electrically conductive layer structure, in particular copper circuitry, and of effecting a joining process with one or more components, for example by soldering. Examples of suitable materials for the surface treatment are Organic Solderability Preservative (OSP), electroless Nickel Immersion Gold (ENIG), electroless nickel palladium immersion gold (ENIPIG), gold (particularly hard gold), electroless tin, nickel gold, nickel-palladium gold, and the like

The aspects defined above and further aspects of the invention are apparent from the examples of embodiment to be described hereinafter and are explained with reference to these examples of embodiment.

Drawings

Fig. 1 shows a three-dimensional view of an apparatus for processing a component carrier structure to make the component carrier structure traceable according to an exemplary embodiment of the invention.

Fig. 2 shows another three-dimensional view of the device of fig. 1.

Fig. 3 shows a plan view of the device of fig. 1.

Fig. 4 shows a side view of the device of fig. 1.

Fig. 5 shows another side view of the device of fig. 1.

Fig. 6 shows a three-dimensional view of an apparatus for processing a component carrier structure to make the component carrier structure traceable according to an exemplary embodiment of the invention.

Fig. 7 shows a detailed view of a portion of the interior of the device of fig. 6.

Fig. 8 shows a detailed view of another part of the interior of the device of fig. 6.

Fig. 9 shows an image of a component carrier structure according to an exemplary embodiment of the invention.

Fig. 10 shows a detailed view of a further part of the interior of the device of fig. 6.

FIG. 11 illustrates a flowchart of a method involving processing a component carrier structure to make the component carrier structure traceable according to an exemplary embodiment of the invention.

Fig. 12 shows different views of a component carrier structure handled by a method according to an exemplary embodiment of the invention.

Fig. 13 shows a cross-sectional view of a component carrier structure according to an exemplary embodiment of the invention.

Detailed Description

The illustrations in the figures are schematic. In the different drawings, similar or identical elements are provided with the same reference numerals.

The exemplary embodiments will be described in more detail before referring to the accompanying drawings, which have been developed based on some basic considerations, and which will be summarized.

Conventionally, it has not been possible to read the inner layer two-dimensional identification code with an optical device, because the code may have been covered by a new layer, e.g. by a prepreg and/or copper layer, after a layer build-up process. In addition, conventional methods of applying a marker to component carrier structures may not allow tracking and linking of all layer information for individual component carrier structures.

According to an exemplary embodiment, the component carrier structure (e.g. PCB panel) is provided with two different types of markers, allowing tracking of the marker and/or the layer of linked markers in a simple and accurate manner. The reading means of the device according to an exemplary embodiment may read the embedded primary identifier located inside the component carrier structure to obtain identification and/or characterization information identifying and/or characterizing the component carrier structure. In a preferred embodiment, the preferred embodiment may be read by an X-ray reader device capable of detecting the masked structural features. Writing means are also foreseen in the device and may be configured for writing the secondary identifier onto an outer surface area of the component carrier structure. Such surface-located secondary markers can be easily read by an optical reader device. Due to the corresponding association between the second identifier and the primary identifier, any of the identifiers may be suitable and sufficient to identify the component carrier structure when tracking the component carrier structure. The external secondary identifier can be read in a simple manner by means of an optical camera. Advantageously, both the reading means and the writing means may operate on the component carrier structure while the component carrier structure remains stationary at a fixed position during the execution of the reading and writing tasks. Thus, moving the component carrier structure from the read position and/or orientation to another write position and/or orientation may be unnecessary. Thus, the apparatus can be constructed in a highly compact manner with limited factory floor space. In this case, the compact one-piece custom machine solution provided by the exemplary embodiments may have the greatest advantage.

More specifically, an apparatus according to an exemplary embodiment may include an X-ray scanner and a multiple laser marking machine. Such a device is capable of reading and decoding a plurality of inner layer two-dimensional identifier (2 DID) codes by using an X-ray scanner, and can read and decode a plurality of inner layer two-dimensional identifier (2 DID) codes even after multi-layer lamination. Furthermore, a plurality of laser heads capable of marking a plurality of codes at the top and bottom simultaneously may be provided in the apparatus of the embodiment. For example, the codes implemented in the first identifier and/or the second identifier may include ECC200 data, matrix codes (DMC), QR codes, bar codes, and/or Human Reading (HR) codes.

In addition, the apparatus according to the exemplary embodiments may have a high degree of flexibility in laser marking code formats. For example, the device can read the incoming vendor 2DID code and laser mark it in exactly the same way, or just selectively grasp specific information from the 2DID code for marking. The device may also decode the incoming 2DID and generate a new set of 2DID code information that may be directly linked to the original incoming 2DID code. This flexible laser marking function can meet many different operational model conditions. Furthermore, exemplary embodiments may allow for self-checking of 2DID and/or plain text readability and data integrity after the laser drilling process. For example, if the marked one-dimensional code, two-dimensional code, or human reading code results in failure, the apparatus according to example embodiments is capable of isolating (e.g., panel-type) component carrier structures to defective locations that are classified as defective component carrier structures.

Thus, devices according to example embodiments can be connected to corporate internal and/or external networks for enabling data exchange, transmission and traceability from the inner core layer up to the outermost layer. Advantageously, the treatment scheme according to exemplary embodiments of the present invention may be adapted to existing production line processes without affecting existing functional processes. Furthermore, an apparatus according to an exemplary embodiment of the present invention may be configured for safe use on all Electrostatic Sensitive Devices (ESD), for example for Embedded Chip Products (ECP), more generally for manufacturing component carriers with at least one embedded component. Preferably, the apparatus according to the exemplary embodiments may be configured as a compact integrated machine to achieve a small machine footprint. An apparatus according to an exemplary embodiment, which may be embodied as a processing station, may have data record retention for panel or part carrier traceability, defect type and panel position mapping commonality analysis, and yield improvement.

According to an exemplary embodiment of the present invention, an apparatus is provided that may combine an X-ray scanner, a code decoder and a plurality of laser marking devices to link and track a panel-type component carrier structure from an inner core layer to an outermost layer of the panel-type component carrier structure by lamination of multiple layers during a panel stacking stage.

More specifically, an X-ray scanner may be provided to read the plurality of inner layer codes. Multiple laser heads (e.g., at the top and bottom) can mark multiple codes simultaneously. Such a device may operate in an ESD safe manner. Both the top and bottom sides may be marked. Advantageously, there is a high flexibility in the laser marking code format selected. Further advantageously, the apparatus according to exemplary embodiments of the present invention may be configured to link and track a component carrier structure (e.g., a panel) or a component carrier (e.g., a PCB or IC substrate) separate from the component carrier structure, and the linking and/or tracking may be from the inner core layer up to the outermost layer, and the linking and/or tracking may be achieved from the inner core layer up to the outermost layer even after the multi-layer build-up.

The apparatus according to the exemplary embodiments may utilize and incorporate an X-ray scanner, a code decoder and may be configured for laser marking. All of this can be implemented in an integrated machine for non-optically visible codes after laying of the layers to achieve complete traceability of the multi-panel layer laid-down layers. In addition, the laser marking code can be checked and the printed circuit board eliminated in case of a readability failure. The X-ray scanner, code decoder and marking machine can be run on any static-sensitive device and laser mark both on the top and bottom sides of the panel surface. In addition, the device may have the ability to check the laser marking back to eliminate the panel in case of failure of the marking code result.

More specifically, an apparatus according to an exemplary embodiment of the present invention may include a topside high power laser marker to perform code marking on a topside of a panel. Furthermore, the device may comprise a camera system for topside code inspection to check the readability and data integrity of the laser produced code located on the topside of the panel. In addition, an X-ray scanner may be provided to read the inner layer code covered by the upper layer prepreg and the copper foil. In addition to this, the device may be equipped with a high-power laser marker on its bottom side to simultaneously code mark on the bottom side of the panel. Furthermore, a camera system may be provided for bottom side code inspection to check the readability and data integrity of the laser produced code located on the bottom side of the panel. In addition, a roll of ESD material may be employed to make the device electrostatic discharge (ESD) safe. This even allows for handling of static sensitive devices with the apparatus, such as component carriers with embedded components. Further advantageously, the apparatus may comprise defective panel locations for collecting panels that have been classified as defective. If the laser marking code inspection results fail, these bad panels may temporarily remain at the defective panel locations. Further, if the laser mark code inspection result fails, a defective panel transfer arm may be provided to transfer the panel to a defective panel position.

According to an exemplary embodiment of the invention, the internal primary identifier may be detected at the component carrier structure by an X-ray reading device. The primary identifier may be decoded and may be printed as a secondary identifier on the outside of the component carrier structure. In the event that a defect is detected, the defective component carrier structure (such as a panel) may be identified and processed accordingly.

Thus, an X-ray image may be acquired from the inner core layer in order to detect the two-dimensional primary identifier. The primary identifier may then be decoded to retrieve the identification information identifying the component carrier structure. Thereafter, the laser printer may print the same or other identifying information on the top and/or bottom of the component carrier structure in the form of at least one secondary identifier located on the surface. Due to the correspondence created between the secondary identifier and the primary identifier, the secondary identifier may be read out to identify the corresponding component carrier structure.

The exemplary embodiments provide an apparatus that is capable of using an X-ray scanner to read one or more internal codes covered by one build layer of a plurality of build layers and simultaneously laser marking a flexible code on both a top side and a bottom side of a panel surface. The relationship between the read code and the laser marked code, which may be, for example, a QR code or any other code of the examples given herein, may then be linked for traceability.

In addition, the device may be configured to check the readability, level and data integrity of the laser marking code in reverse (counter check). Objects of interest that fail during laser marking or after a reverse inspection may be moved and isolated to a bad location for further action.

In addition, the device according to the exemplary embodiments of the present invention may be configured to connect to an internal or external network for data exchange and data transmission. Furthermore, the apparatus may operate on any static-sensitive device, as the design of the apparatus may be static discharge (ESD) safe.

Fig. 1 shows a three-dimensional view of an apparatus 100 for processing a component carrier structure 102 (a detailed example of which is shown in fig. 13) to make the component carrier structure 102 traceable, according to an exemplary embodiment of the invention. For example, the component carrier structure 102 may be a panel for manufacturing a component carrier, such as a printed circuit board or an integrated circuit substrate. Fig. 1 shows a front isometric view of the device 100 without a housing (see reference number 142 in fig. 6). Fig. 2 shows another three-dimensional view of the device 100 of fig. 1. Fig. 2 shows a rear isometric view of the device 100 without the housing. Fig. 3 shows a plan view of the device 100 of fig. 1. Fig. 4 shows a side view of the apparatus 100 of fig. 1. Fig. 5 shows another side view of the apparatus 100 of fig. 1.

The illustrated apparatus 100 is configured to process the component carrier structure 102 to make the component carrier structure fully traceable throughout the manufacturing process and optionally also during use of the manufactured component carrier.

For the purpose of handling the component carrier structure 102, the device 100 comprises a reading means 104 for reading the primary identifier 106, which reading means 104 is arranged inside the component carrier structure 102. Fig. 13 shows an example of such an embedded primary identifier 106, which may be embodied, for example, as a QR code formed as a copper pattern. The primary identifier 106 carries or encodes identification information that allows the currently processed component carrier structure 102 to be identified and distinguished from other component carrier structures. Preferably, the primary identifier 106 is a unique identifier that explicitly identifies only the processed component carrier structure 102. In order to allow detection of the primary identifier 106 (see again fig. 13) embedded in the interior of the component carrier structure 102, the reading device 104 comprises an X-ray emitting unit 150 for emitting an X-ray beam and an X-ray detecting unit 152 for detecting the emitted X-ray beam after the interaction of the X-rays with the component carrier structure 102. During reading, the component carrier structure 102 is arranged between the X-ray emitting unit 150 and the X-ray detecting unit 152.

Preferably, the X-ray emitting unit 150 and the X-ray detecting unit 152 create an imaginary line. The component carrier structure 102 may be positioned such that a plane created by the component carrier structure intersects an imaginary line. Preferably, the plane and the line may be perpendicular.

Thus, reference numeral 152 may be indicative of an X-ray scanner receiver, which may be motorized. When the X-ray detection unit 152 is motorized, if the common primary identifier 106 (which may be located at the long side of the panel) is defective or unreadable, the X-ray detection unit may be moved to a position corresponding to another primary identifier 107 (which may be located at the short side of the panel). Accordingly, reference numeral 150 may be indicative of an X-ray scanner emitter, which may also be motorized. Reference numeral 127 shows a moving mechanism of the X-ray scanner emitter.

Fig. 1 also shows a processor or control unit 156 for providing processing and/or control tasks. In particular, the processor or control unit 156 may control the overall operation of the device 100 or a portion thereof.

In particular, the processing or control unit 156 comprises a main analysis unit 116 for analyzing the information (in this embodiment X-ray detection data) read from the main identifier 106. In other words, data corresponding to the primary identifier 106 detected by the X-ray detection unit 152 may be provided to the primary analysis unit 116, and the primary analysis unit 116 may retrieve identification information identifying the component carrier structure 102 and/or other information related to the component carrier structure 102 and/or its manufacturing process.

The retrieved information may be forwarded from the primary analysis unit 116 to the generation unit 118, the generation unit 118 being adapted to generate the first secondary identifier 110 and the second secondary identifier 111 based on the analyzed primary identifier 106. Specifically, the generation unit 118 may generate the secondary identifiers 110, 111 as a data set that enables the writing unit 108 to physically form the secondary identifiers 110, 111 when the data set is forwarded to the writing device 108. For example, the generation unit 118 may be configured to generate or define a first secondary identifier 110 and a second secondary identifier 111, the first secondary identifier 110 and the second secondary identifier 111 having additional information content and/or having reduced information content compared to the analyzed primary identifier 106, or having the same information content as the analyzed primary identifier 106. Preferably, each of the first secondary identifier 110 and the second secondary identifier 111 should contain information that allows for an unambiguous identification of the component carrier structure 102.

However, it may also occur that the reading process of the primary identifier 106 by the reading device 104 fails, for example, because the primary identifier 106 itself is defective or a reading error occurs. In case the primary analysis unit 116 determines that the primary identifier 106 is not readable, the reading means 104 is instructed (e.g. by the primary analysis unit 116 via a data feedback loop) to read another primary identifier 107 (see again fig. 13) arranged at another location inside the component carrier structure 102 (e.g. at an edge) and also to identify the processed component carrier structure 102. Thus, in the event that a read operation of primary identifier 106 fails, another primary identifier 107 may be used as a backup or copy of primary identifier 106. Thereby, the fault robustness of the system can be improved. Furthermore, in case the primary analysis unit 116 determines that neither the primary identifier 106 nor the other primary identifier 107 is readable (e.g. because the other primary identifier 107 itself is defective or another read error occurs), the suggestion unit 154 may be triggered by the primary analysis unit 116 to output a warning inviting the user to manually provide information for identifying the component carrier structure 102. In this case, the user may use, for example, a handheld scanner or may manually enter identification information for identifying the component carrier structure 102.

Thus, the identification information for identifying the component carrier structure 102 based on the generation of the first secondary identifier 110 and the second secondary identifier 111 may be obtained by the writing unit 108 from the generation unit 118 or obtained from the user via the suggestion unit 154.

The aforementioned identification information may be provided to a writing device 108, which writing device 108 is used to write a first secondary identifier 110 and a second secondary identifier 111 (see again fig. 13, where fig. 13 shows the component carrier structure 102 after another layer build as described in more detail below) outside the component carrier structure 102. The first secondary identifier 110 and the second secondary identifier 111 are each associated with the processed component carrier structure 102 and are each associated with the primary identifier 106. More specifically, each of the first secondary identifier 110 and the second secondary identifier 111 may be used as a unique identifier for identifying the component carrier structure 102.

Advantageously, the writing device 108 is configured for laser writing the secondary markers 110, 111 by directing a laser beam onto two opposite main surfaces of the component carrier structure 102 to physically create the first secondary marker 110 and the second secondary marker 111 as physical surface patterns or surface contours on the outer surface of the component carrier structure 102.

Alternatively, a secondary identifier comprising an Ultraviolet (UV) visible (or detectable) material may be applied (e.g., by using a printing process). This may bring the advantage of marking or marking the component carrier structure 102 without disturbing its visible optical appearance.

As shown, the writing device 108 includes a first writing unit 112 (such as a first laser head) for writing a first secondary identifier 110 on one exterior major surface of the component carrier structure 102, and includes a second writing unit 114 (such as a second laser head) for writing a second secondary identifier 111 on the opposite other exterior major surface of the component carrier structure 102. Preferably, the first writing unit 112 and the second writing unit 114 may be arranged and may be controlled by a processor or control unit 156 such that the first secondary identifier 110 and the second secondary identifier 111 may be written simultaneously onto two opposite main surfaces of the component carrier structure 102. For example, the first writing unit 112 may be implemented as a topside laser marker, which may be motorized. Accordingly, the second writing unit 114 may be implemented as a bottom side laser marker, which may be motorized. When the first writing unit 112 and/or the second writing unit 114 are motorized, the respective writing unit 112, 114 may flexibly move to a selectable target position at which the respective secondary identifier 110, 111 (or 130, 131, see the description below) should be printed.

In short, identification information for uniquely identifying the component carrier structure 102 may be communicated from the first identifier 106 to each of the first secondary identifier 110 and the second secondary identifier 111. Since the secondary identifiers 110, 111 are arranged (at least temporarily, i.e. until a further build-up is formed on the component carrier structure 102) on the outer surface of the component carrier structure 102, reading out the secondary identifiers is much simpler than reading out the embedded first identifiers 106. The redundant arrangement of identification information in the first secondary identifier 110 and the second secondary identifier 111 allows reading out identification information from the component carrier structure 102 even when one of the two secondary identifiers 110, 111 is not currently accessible to the optical reader device.

Advantageously, the reading means 104 and the writing means 108 are configured to read the primary identifier 106 and to write the secondary identifiers 110, 111 when the component carrier structure 102 is resting at a predefined constant target position (i.e. at the same predefined resting reading and writing position of the device 100). Thus, when the component carrier structure 102 is resting in the resting read and write positions, both the read device 104 and the write device 108 can reach and process the component carrier structure 102. Thus, the component carrier structure 102 need not be transferred from the read position to another write position, but can complete the reading and writing while the component carrier structure 102 remains stationary and stationary at the stationary and stationary read and write positions. Preferably, the reading device 104 and/or the writing device 108 are movable with respect to the stationary reading and writing positions. This further increases the simplicity and flexibility of operation of the apparatus 100 while avoiding undesirable damage to the component carrier structure.

Still referring to fig. 1-5, the device 100 further comprises a secondary analysis unit 120 for analyzing the written secondary identifiers 110, 111. By reading the first secondary identifier 110 and/or the second secondary identifier 111 it can be verified whether the writing process has been successful. Advantageously, the secondary analysis unit 120 may be implemented as a simple optical camera (e.g. sensitive in the Ultraviolet (UV) wavelength range) with signal processing resources. For example, the secondary analysis unit 120 may be implemented as a CCD camera system 123 for performing a topside code check and another CCD camera system 125 for performing a bottom side code check. In short, the CCD camera can check whether the laser-printed code is acceptable.

Advantageously, the apparatus 100 includes a plurality of electrostatic discharge protection features 122, 124, 126, 128 for protecting the component carrier structure 102 from electrostatic discharge (ESD) phenomena during processing of the apparatus 100. This protects the treated component carrier structure 102 from damage, which may be very advantageous, for example, when providing embedded components in the component carrier structure 102.

The various electrostatic discharge protection features 122, 124, 126, 128 implemented in accordance with fig. 1-5 are as follows: as best seen in fig. 2, the first electrostatic discharge protection feature 122 comprises an electrostatic safety chuck configured to manipulate the component carrier structure 102 in an electrostatic discharge protected manner by suction. Illustratively, the contact point between the device 100 and the component carrier structure 102 may be rendered ESD compatible by the first electrostatic discharge protection component 122. Still referring to fig. 2, the second electrostatic discharge protection feature 124 comprises an electrostatic discharge safety tabletop upon which the component carrier structure 102 may be placed during handling and processing of the component carrier structure 102 by the apparatus 100. The third electrostatic discharge protection feature 126, also shown in fig. 2, may comprise an electrostatic discharge safety roller upon which the component carrier structure 102 may be conveyed during handling and processing of the apparatus 100 by rolling. Thus, an ESD compliant material roll may be provided for this purpose. The fourth esd protection feature 128 may include an esd safe grounding device for grounding the apparatus 100, which is implemented as an esd safe foot.

Referring now again to fig. 1, the apparatus 100 includes a layer build-up forming device (layer build-up formation device) 121 schematically shown in fig. 1, the layer build-up forming device 121 being used to attach and process one or more additional layer structures (see reference numerals 146, 148 in fig. 13) to one major surface or two opposite major surfaces of the component carrier structure 102. The layer stack forming device 121, which may be controlled by the layer stack control entity 121' of the processor or control unit 156, may comprise a plurality of sub-units for subjecting the component carrier structure 102 to lamination, patterning, laser drilling, electroplating, etc. for forming another layer stack on one or both opposite major surfaces of the component carrier structure.

After the additional layer structures 146, 148 are attached to at least one of the major surfaces of the component carrier structure 102, the secondary identifiers 110, 111 are no longer located on the outer surface of the component carrier structure 102 (see fig. 13). Thus, with the secondary identifier 110, 111 it is no longer possible to read out information indicating the identity of the component carrier structure 102 using a simple optical camera. To reestablish this functionality, the writing means 108 may be configured to write further secondary identifiers 130, 131 associated with the read primary identifier 106 and/or associated with the secondary identifiers 110, 111 on the outside of the further stacked one or more additional layer structures 146, 148 (see fig. 13). The information encoded in the further secondary identifier 130, 131 may comprise identification information for identifying the component carrier structure 102, which identification information has been included in the primary identifier 106 and/or the secondary identifier 110, 111. The further secondary identifier 130, 131 may also comprise additional information related to the further stacked layers of the layer structure 146, 148. The surface-located further secondary markers 130, 131 can be read out by a simple optical camera. As for the secondary identifiers 110, 111, the written further secondary identifiers 130, 131 can also be verified by: the further secondary identifier is read out by the optical camera and evaluated whether the further secondary identifier fulfils one or more predefined criteria.

The described process of forming additional stacked layers of layer structures 146, 148 and the formation of new secondary markers 130, 131 on the outer surface of the component carrier structure 102 may be repeated one or more times until a predefined layer stack has been built up.

Furthermore, the apparatus 100 comprises a transport mechanism 132, the transport mechanism 132 being used to transport the component carrier structure 102 from the loader unit 134 to the reading and writing position and further to an unloader unit 136, the loader unit 134 being used to load the component carrier structure 102, the unloader unit 136 being used to unload the component carrier structure 102. In addition to the conveying mechanism 132, a robot arm may be installed. In addition, the apparatus 100 comprises a removal mechanism 138, the removal mechanism 138 being for removing a component carrier structure 102 that is classified as bad, e.g. due to detection of a defect of the primary identifier 106 and/or the secondary identifiers 110, 111. Thus, reference numeral 138 may be indicative of an arm and transport mechanism for a defective panel. Reference numeral 129 denotes a pickup arm for a defective panel. The defective panel buffer is denoted by reference numeral 131. Illustratively, the laser marked rear panel may be classified as good or bad. In one embodiment, the transport mechanism 132 is configured to move the part carrier structure 102 to be processed between the loader unit 134 and the unloader unit 136 in another direction transverse to the direction in which the bad part carrier structure was removed.

The device 100 according to fig. 1 to 5 is capable of decoding different incoming two-dimensional identifier code formats. Further, the device 100 may be configured to read a plurality of inner layer two-dimensional identifier codes covered by a plurality of prepregs and copper foil layers. The motorized X-ray scanner emitter may cover inner two-dimensional marker positions of different or even all panel sizes. The device 100 may also be configured for linking the inner layer two-dimensional identifier to the current layer laser marked two-dimensional identifier.

To provide the described functionality, the device 100 is provided with a topside high power laser marker. Furthermore, a camera system for topside code inspection is provided. The device 100 may flexibly operate by marking codes of different formats (such as two-dimensional identifiers, one-dimensional identifiers, human-readable codes, etc.) on the top side of the panel. The device 100 may also be configured to check the readability and data integrity of the laser marked code on the top side of the panel.

In addition, the apparatus 100 has a bottom side high power laser marker. A CCD camera system for bottom side code inspection may also be provided. The apparatus 100 provides the functionality of flexible format code marking on the underside of a panel simultaneously with a top laser marker.

In addition, the apparatus 100 is capable of checking the readability and data integrity of the laser marked code at the underside of the panel.

The apparatus 100 is safe for handling of the static sensitive component carrier structure 102. In this context, the apparatus 100 may provide the function of preventing static charge accumulation in the machine. In addition, the device 100 may prevent sudden surges (surden surges) of high power electrostatic discharges that may damage expensive chips embedded inside the panel.

In addition, the apparatus 100 is provided with a defective panel transfer arm and a positioning box. If the laser marked code inspection results fail, the apparatus 100 may transfer the panel to a defective panel location. In addition, the apparatus 100 may be adapted to temporarily store the panel in case the result of the code inspection of the laser mark fails. Moreover, the apparatus 100 may prevent any defective panels from being automatically rejected without an engineer confirmation.

Referring to fig. 5, reference numeral 190 denotes a pickup shaft for a defective panel, 192 denotes a transfer shaft for a defective panel, and 194 denotes a moving mechanism for a bottom side laser marker.

Fig. 6 shows a three-dimensional view of an apparatus 100 for processing a component carrier structure 102 to make the component carrier structure 102 traceable according to an exemplary embodiment of the invention. Fig. 6 shows that the apparatus 100 may be configured as a single, unitary machine 140, the single, unitary machine 140 having all of the constituent components shown and described with reference to fig. 1-5 disposed within a common housing 142. This achieves a compact design of the device 100 and a moderate space consumption in the factory.

Fig. 7 shows a detailed view of a portion of the interior of the device 100 of fig. 6. Fig. 8 shows a detailed view of another part of the interior of the apparatus 100 of fig. 6, wherein reference numeral 163 indicates a defective panel location. Fig. 9 shows an X-ray image of the component carrier structure 102 according to an exemplary embodiment of the invention, wherein reference numeral 167 indicates decoding information from a two-dimensional marker. Fig. 10 shows a detailed view of yet another part of the interior of the device 100 of fig. 6.

Referring now in more detail to fig. 9, a test panel is shown after a two-layer paving process. More specifically, X-ray images of two inner panel two-dimensional markers (see reference numerals 106, 107) are shown, which are covered with two layers of prepreg and copper foil. Further, the decoded information from the two-dimensional identifier is shown at 167, the two-dimensional identifier corresponding to the inner core layer panel two-dimensional identifier (see reference numeral 106) and the inner DIP1 layer panel two-dimensional identifier (see reference numeral 107). Thus, the corresponding device 100 is able to decode different incoming two-dimensional identifier code formats. Further, the device 100 may be configured to read a plurality of inner layer two-dimensional identifier codes covered by a plurality of prepregs and copper foil layers. The motorized X-ray scanner emitter can cover all panel-sized interior two-dimensional marker locations. Further, the corresponding device 100 may also be configured to link the inner layer two-dimensional identifier to the current layer laser marked two-dimensional identifier.

The apparatus 100 has a topside high power laser marker and a camera system for topside code inspection. This may provide the function of performing a flexible format code marking on the top side of the panel. In addition, the apparatus 100 is capable of checking the readability and data integrity of the laser-produced code on the top side of the panel. For example, the device 100 may operate based on a two-dimensional DMC code and a human reading code marked by a laser marker.

Advantageously, the apparatus 100 may be completely enclosed by radiation protective material to ensure that the X-ray scanner and laser marker operate safely and are able to meet ecological and safety requirements.

Fig. 11 shows a flowchart 200 relating to a method of processing a component carrier structure 102 to make the component carrier structure 102 traceable according to an exemplary embodiment of the invention.

As shown in block 202, the method may include moving a component carrier structure 102 (such as a panel) into the apparatus 100.

As shown in block 204, the method may include reading a primary identifier 106 disposed inside the component carrier structure 102 and identifying the processed component carrier structure 102. Thus, the inner layer code can be read with an X-ray scanner.

As shown in block 206, the method may include determining whether the primary identifier 106 has been correctly read.

As shown in block 208, the method may include writing, outside of the component carrier structure 102, a secondary identifier 110, 111 associated with the processed component carrier structure 102 and correspondingly associated with the primary identifier 106 if the determination in block 206 is affirmative. More specifically, block 208 may include marking the top and bottom sides with respective codes for both opposite major surfaces of the panel simultaneously using a high power laser marker.

Advantageously, the reading of the primary identifier 106 in block 204 and the writing of the secondary identifiers 110, 111 in block 208 are performed while the component carrier structure 102 remains in the stationary read and write positions of the device 100.

As shown in block 210, the method may include analyzing the written secondary identifier 110, 111 using the secondary analysis unit 120. Illustratively, the top and bottom codes may be inspected with a CCD camera.

As indicated at block 212, the method may include determining whether the secondary identifier 110, 111 is correctly readable. Illustratively, it can be checked whether the written code is readable and the data integrity is correct. If the result of this determination is affirmative, the method proceeds to block 214. If the result of this determination is negative, the method proceeds to block 222.

As shown in block 214, the method may include, if the determination in block 212 is affirmative, moving the processed component carrier structure 102 out of the device 100. Thus, the properly processed panel can be removed.

As indicated at block 216, the method may include continuing the process for the next component carrier structure 102 (e.g., for the next panel) in the apparatus 100. The process may return to block 202.

As indicated in block 218, the method may include, if the determination in block 206 is negative (i.e., in the event that the primary analysis unit 116 determines that the primary identifier 106 is unreadable), instructing the reading device 104 to read another primary identifier 107 disposed inside the component carrier structure 102 and identifying the processed component carrier structure 102. Thus, it can be determined whether the inner layer backup code can be correctly read. If the result of this determination is affirmative, the method proceeds to block 208 and uses the identification information provided by the other primary identifier 107 for further processing. If the result of this determination is negative, the method proceeds to block 220.

As indicated at block 220, the method may include inviting the user to manually provide information identifying the component carrier structure 102 if the primary analysis unit 116 determines that the primary identifier 106 and the other primary identifiers 107 are not readable. In block 220, it may also be determined whether the manual input was successful. If the result of this determination is affirmative, the method proceeds to block 208 and further processing is performed using the manually provided identification information. If the result of this determination is negative, the method proceeds to block 222.

As indicated at block 222, the method may include classifying the component carrier structure 102 for which identification information has not been retrieved as defective or bad. The failed panel may continue to the defective panel location.

Fig. 12 shows different views of a component carrier structure 102 handled by a method according to an exemplary embodiment of the invention.

More specifically, fig. 12 shows that the primary identifier 106 may be formed on the layer structures 146, 148, such as on the core. The primary identifier 106 is readable by the X-ray reading device 104 from outside the component carrier structure 102 even after performing a process 161 of forming a further layer stack in the form of laminating the additional layer structures 146, 148, thereby embedding the primary identifier 106 in the interior of the stack 144. The identification information read from the embedded primary identifier 106 may then be used to define a secondary identifier 110 located at the surface and the secondary identifier 110 located at the surface may then be formed by the writing means 108, the secondary identifier 110 comprising, for example, the same identification information.

Fig. 13 shows a cross-sectional view of a component carrier structure 102 according to an exemplary embodiment of the invention. The component carrier structure 102 shown may be a panel for simultaneously manufacturing multiple component carriers (such as printed circuit boards or integrated circuit substrates) by a batch manufacturing process. Alternatively, the component carrier structure 102 may be a single component carrier (such as a PCB or IC substrate) or an array of several component carriers, for example an array of six PCBs or IC substrates. After the component carrier structure 102 is handled as a whole, the component carrier structure may be separated into individual component carriers (not shown). It may be desirable to track the component carrier structure 102 and/or individual component carriers during the manufacturing process as well as during use. This may be achieved by various markers 106, 107, 110, 111, 130, 131, which may be physically connected or integrally formed with the component carrier structure 102 and/or the individual component carriers, as described below.

For example, component carrier structure 102 may include a laminate layer stack 144, laminate layer stack 144 including a plurality of electrically conductive layer structures 146 and electrically insulating layer structures 148, see also detail 149. Electrically conductive layer structure 146 may include a patterned copper layer that may form horizontal pads and/or horizontal wiring structures. Additionally or alternatively, electrically conductive layer structure 146 may include vertical through-connections, such as copper pillars and/or copper-filled laser vias. Further, the stack 144 of component carrier structures 102 may include one or more electrically insulating layer structures 148 (such as prepregs or resin sheets). Further, a surface treatment (e.g., ENIG or ENEPIG, etc.) may be applied on the top and/or bottom sides of stack 144 (not shown). The uppermost and/or lowermost electrically insulating layer structure may be a solder mask or a solder resist. Such a solder mask may support proper intermetallic connections, such as solder, of the component carrier structure 102 on a surface mounted component (not shown) and an underlying mounting base (not shown, such as another printed circuit board). Components that may be embedded in the component carrier structure 102 (such as semiconductor die and/or capacitive-like passive components) have not been shown.

As already mentioned, the component carrier structure 102 may be manufactured to be traceable based on the readable markers 106, 107, 110, 111, 130, 131. For this purpose, the stack 144 comprises not only a plurality of electrically conductive layer structures 146 and a plurality of electrically insulating layer structures 148, but additionally also readable markers 106, 107, 110, 111, 130, 131, which may be formed in or on the stack 144. Furthermore, at least a portion of the readable identifier 106, 107, 110, 111, 130, 131 may be formed as an integrated part of the layer structure 146, 148. For example, the readable identifier 106 may be a patterned copper structure that forms a QR code inside the stack 144. More generally, the readable identifier 106 may be a patterned metal structure that encodes identification information about the component carrier structure 102.

More specifically, the following types of readable markers 106, 107, 110, 111, 130, 131 are envisioned in the component carrier structure 102 of fig. 13:

the primary identifier 106 may be disposed in the interior of the stack 144, such as in or on a central core, and may be configured for identifying the component carrier structure 102. In other words, reading out the primary identifier 106 may provide identity information that is unique only to the particular component carrier structure 102 or group of component carrier structures (e.g., a common manufacturing lot). Due to the arrangement of the primary identifier embedded in the interior of the stack 144, the primary identifier 106 may be read out by X-ray detection. For example, the primary identifier 106 may be a buried copper pattern (buried copper pattern) forming a readable QR code.

As shown in fig. 13, another primary identifier 107 is formed at the same vertical level as the primary identifier 106, which provides backup information and is usable when the primary identifier 106 cannot be read correctly.

Furthermore, the first secondary identifier 110 and the second secondary identifier 111, which are optically readable, are also provided inside the stack 144, but closer to the outside of the stack 144 than the primary identifier 106. Each of the first secondary identifier 110 and the second secondary identifier 111 is also associated with the processed component carrier structure 102, e.g. allowing identification information for identifying the component carrier structure 102 to be provided when read out. Each of the first secondary identifier 110 and the second secondary identifier 111 may be formed by laser direct imaging, and may be, for example, a QR code. Each of the first secondary identifier 110 and the second secondary identifier 111 is correspondingly associated with the primary identifier 106 such that the information content at the identifiers 106, 110, 111 are all indicative of the same identifying information uniquely identifying only the particular component carrier structure 102. In a stage of the process of manufacturing the component carrier structure 102 according to fig. 13, the first secondary identifier 110 and the second secondary identifier 111 still form part of the outer surface of the corresponding preform of the component carrier structure 102 (i.e. before forming the outer layer stacks 153, 155), the first secondary identifier 110 and the second secondary identifier 111 may be formed on the respective outer main surfaces of the preform of the component carrier structure 102 by Laser Direct Imaging (LDI). The first secondary identifier 110 and the second secondary identifier 111 may be defined and formed to carry or encode information content for uniquely identifying the component carrier structure 102. This may be advantageous because the internal primary identifier 106 cannot be read by an optical camera, because the primary identifier is embedded inside the stack 144 and can only be read by more complex techniques such as X-ray analysis. By copying the identity information about the component carrier structure 102 in the form of the first secondary identifier 110 and the second secondary identifier 111 to the respective exposed main surfaces of the preform of the component carrier structure 102, the identity information which can be used for tracking or tracing the component carrier structure 102 can be read out from the outside of the preform of the component carrier structure 102 in a simple manner by means of an optical camera.

However, the first secondary identifier 110 and the second secondary identifier 111 may be covered by the additional layer structures 146, 148 during formation of the buildup layers 153, 155, such that the first secondary identifier 110 and the second secondary identifier 111 can no longer be read by a simple optical camera from outside the component carrier structure 102. However, to allow for complete traceability of the component carrier structure 102 in a simple manner, a first further secondary identifier 130 and a second further secondary identifier 131 may be formed on the outer surface of the stack 144 after the formation of the further buildup layers 153, 155. Corresponding to the association of the first secondary identifier 110 and the second secondary identifier 111 with the primary identifier 106, the first further secondary identifier 130 and the second further secondary identifier 131 may be associated not only with the component carrier structure 102, but also with the primary identifier 106 and/or the first secondary identifier 111 and the second secondary identifier 112. The association of the first further secondary identifier 130 and the second further secondary identifier 131 with the component carrier structure 102 may be such that each of the three carries information indicative of the identity of the component carrier structure 102. As shown, each of the first secondary identifier 110 and the second secondary identifier 111 is arranged between the primary identifier 106 on the one hand and a respective one of the first further secondary identifier 130 and the second further secondary identifier 131 on the other hand.

The process of copying identification information from the previously exposed and now internal secondary identifier onto the more external and now exposed further secondary identifier on the additional build-up layer may be repeated one or more times until the entire build-up layer of the component carrier structure 102 is completed. This ensures that the manufactured component carrier structure 100 is always traceable by means of an optical camera or the like.

It should be noted that the term "comprising" does not exclude other elements or steps and the "a" or "an" does not exclude a plurality. Elements described in association with different embodiments may also be combined.

It should also be noted that reference signs in the claims shall not be construed as limiting the scope of the claims.

The implementation of the invention is not limited to the preferred embodiments shown in the figures and described above. Alternatively, many variations are possible using the shown solution and the principle according to the invention, even in the case of radically different embodiments.

Claims

1. A processing apparatus (100) for processing a component carrier structure (102) to enable the component carrier structure (102) to be tracked, the processing apparatus (100) comprising:

-reading means (104) for reading a primary identifier (106) arranged in the interior of the component carrier structure (102) and identifying the processed component carrier structure (102); and

-writing means (108) for writing, at the exterior of the component carrier structure (102), a secondary identifier associated with the processed component carrier structure (102) and correspondingly associated with the primary identifier (106);

wherein the reading means (104) and the writing means (108) are configured for reading the primary identifier (106) and writing the secondary identifier while the component carrier structure (102) remains at a stationary reading and writing position.

2. The processing device (100) according to claim 1, wherein the reading means (104) comprises an X-ray emitting unit (150) and an X-ray detecting unit (152).

3. A processing device (100) according to claim 1 or 2, wherein the writing means (108) is configured for laser writing the secondary identifier.

4. A processing device (100) according to any one of claims 1 to 3, wherein the writing means (108) comprises a first writing unit (112) for writing a first secondary identifier (110) on one outer main surface of the component carrier structure (102), and comprises a second writing unit (114) for writing a second secondary identifier (111) on the opposite further outer main surface of the component carrier structure (102).

5. The processing device (100) according to claim 4, wherein the arrangement and configuration of the first writing unit (112) and the second writing unit (114) enables simultaneous writing of the first secondary identifier (110) and the second secondary identifier (111).

6. The processing device (100) according to any one of claims 1 to 5, comprising a main analysis unit (116) for analyzing information read from the main identifier (106).

7. The processing device (100) according to claim 6, comprising a generation unit (118) for generating the secondary identifier based on the analyzed primary identifier (106).

8. The processing device (100) according to claim 7, wherein the generating unit (118) is configured for generating the secondary identifier with additional information content and/or with reduced information content compared to the analyzed primary identifier (106).

9. The processing apparatus (100) according to any one of claims 6 to 8, wherein, in case the primary analysis unit (116) determines that the primary identifier (106) cannot be read, the reading device (104) is instructed to read another primary identifier (107) arranged in the interior of the component carrier structure (102) and to identify the processed component carrier structure (102).

10. The processing device (100) according to any one of claims 6 to 9, wherein in case the primary analysis unit (116) determines that the primary identifier (106) cannot be read, the suggestion unit (154) outputs a warning to invite provision of information for identifying the component carrier structure (102), optionally in case the primary analysis unit (116) determines that the primary identifier (106) and the further primary identifier (107) cannot be read, the suggestion unit (154) outputs a warning to invite provision of information for identifying the component carrier structure (102).

11. The processing device (100) according to any one of claims 1 to 10, comprising a secondary analysis unit (120) for analyzing the written secondary identifier.

12. The processing device (100) according to claim 11, wherein the secondary analysis unit (120) comprises an optical camera.

13. The processing apparatus (100) according to any one of claims 1 to 12, wherein the reading device (104) is movable relative to the stationary reading and writing position.

14. A processing device (100) according to any one of claims 1 to 13, wherein the writing means (108) is movable relative to the stationary reading and writing position.

15. The processing apparatus (100) according to any one of claims 1 to 14, wherein the processing apparatus (100) comprises at least one electrostatic discharge protection feature (122, 124, 126, 128) for protecting the component carrier structure (102).

16. The processing device (100) according to any one of claims 1 to 15,

comprises a layer stack forming device (121) for attaching and handling one or more additional layer structures (146, 148) to one main surface or opposite main surfaces of the component carrier structure (102);

wherein the writing means (108) are configured for writing at least one further secondary identifier (130, 131) associated with the read primary identifier (106) onto the outside of the one or more additional layer structures (146, 148).

17. The processing apparatus (100) according to any one of claims 1 to 16, comprising a conveyor mechanism (132) for conveying the component carrier structure (102) from a loader unit (134) for loading the component carrier structure (102) to the stationary read and write position and further to an unloader unit (136) for unloading the component carrier structure (102).

18. The processing apparatus (100) according to any one of claims 1 to 17, comprising a removal mechanism (138) for removing a component carrier structure (102) classified as bad due to a defect of the primary identifier (106) and/or a defect of the secondary identifier.

19. The processing apparatus (100) according to claim 17, wherein the transport mechanism (132) is configured for moving the component carrier structure (102) to be processed between the loader unit (134) and the unloader unit (136) in another direction transverse to the direction in which the defective component carrier structure was removed.

20. The processing device (100) according to any one of claims 1 to 19, configured as a single, integral machine (140), in particular with all constituent components thereof being arranged inside a common housing (142).

21. A method of processing a component carrier structure (102) to enable the component carrier structure (102) to be tracked, the method comprising:

-reading a primary identifier (106) arranged in the interior of the component carrier structure (102) and identifying the processed component carrier structure (102); and

Writing a secondary identifier associated with the processed component carrier structure (102) and correspondingly associated with the primary identifier (106) at an exterior of the component carrier structure (102);

wherein the reading of the primary identifier (106) and the writing of the secondary identifier are performed while the component carrier structure (102) remains at the stationary read and write positions.

22. A traceable component carrier structure (102), comprising:

a stack (144) comprising a plurality of electrically conductive layer structures (146) and a plurality of electrically insulating layer structures (148);

-a primary identifier (106) readable by X-rays, arranged in the interior of the stack (144) and identifying the component carrier structure (102); and

-an optically readable secondary identifier located at the outside of the stack (144) or closer to the outside of the stack (144) than the primary identifier (106), the secondary identifier being associated with the component carrier structure (102) and being associated with the primary identifier (106).

23. The component carrier structure (102) according to claim 22, configured as a panel, an array or a component carrier, for example configured as a printed circuit board or an integrated circuit substrate.

24. The component carrier structure (102) according to claim 22 or 23, wherein the primary identifier (106) readable by X-rays comprises a QR code, a bar code, a copper pattern and/or a laser direct imaging formed pattern.

25. The component carrier structure (102) according to any one of claims 22 to 24, wherein the secondary identifier that is optically readable comprises a QR code, a bar code, a laser written code, and/or a human readable code.

26. The component carrier structure (102) according to any one of claims 22 to 25, wherein each of the primary identifier (106) and the secondary identifier is individually configured as a unique identifier for the component carrier structure (102).

27. The component carrier structure (102) according to any one of claims 22 to 26, wherein the primary identifier (106) and the secondary identifier have partly or completely identical information content.

28. The component carrier structure (102) according to any one of claims 22 to 27, comprising at least one further secondary identifier (130, 131) on or in the stack (144), the at least one further secondary identifier (130, 131) being associated with the component carrier structure (102) and being correspondingly associated with the primary identifier (106), wherein the secondary identifier is arranged between the primary identifier (106) and the at least one further secondary identifier (130, 131).