CN110446334A - X-RAY technology is in the PCB application method traced and system - Google Patents

X-RAY technology is in the PCB application method traced and system Download PDF

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Publication number
CN110446334A
CN110446334A CN201910842873.XA CN201910842873A CN110446334A CN 110446334 A CN110446334 A CN 110446334A CN 201910842873 A CN201910842873 A CN 201910842873A CN 110446334 A CN110446334 A CN 110446334A
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CN
China
Prior art keywords
pcb
ray
mark
scanned
digital signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910842873.XA
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Chinese (zh)
Inventor
韩飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Shengdakang Technology Co Ltd
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Shenzhen Shengdakang Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Priority to CN201910842873.XA priority Critical patent/CN110446334A/en
Publication of CN110446334A publication Critical patent/CN110446334A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09927Machine readable code, e.g. bar code

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)

Abstract

The present invention provides a kind of application method, system and computer readable storage mediums that X-RAY technology is traced in PCB, comprising the following steps: prints on PCB inner plating mark and presses to pcb board;It is scanned by mark of the X-Ray to PCB inner plating;Digital signal is converted by the mark scanned;By converting mark for the data-signal, with laser printing in PCB lamina rara externa predeterminated position.The embodiment of the present invention is identified by printing in PCB inner plating, during being printed to pcb board, it first passes through X-Ray machine and the mark of PCB inner plating is scanned and is identified, and send MES system to, the mark scanned is carried out by MES system to be converted into digital signal, and digital signal is passed into marking mechanism, two-dimensional barcode information is translated into digital signal by marking mechanism, it prints on PCB lamina rara externa, so that the two dimensional code mark of PCB lamina rara externa is consistent with the mark on PCB inner plating, consequently facilitating pcb board printing whole process retrospect.

Description

X-RAY technology is in the PCB application method traced and system
Technical field
The present invention relates to pcb board printing technology more particularly to a kind of application method that X-RAY technology is traced in PCB, System and computer readable storage medium.
Background technique
The typical process flow of PC B are as follows: sawing sheet-> internal layer circuit-> internal layer AOI (Automatic Optic Inspection, automatic optics inspection)-> pressing-> drilling-> heavy copper plating-> outer-layer circuit-> outer layer AOI-> resistance Weldering-> text-> surface treatment-> molding-> electrical measurement-> FQC/FQA-> packaging.PCB is influenced in order to quickly identify and correct The problem of product quality, prevents defective product from continuing along production line flow down, final to realize zero product return of goods rate, needs Retrospect is monitored to PCB technology process.PCB factory generally sprays two dimensional code using in plate face, by sweeping in each process Rifle is retouched to read two dimensional code and into the two dimensional code add the mode of new information and realize monitoring and retrospect.But in pressing working procedure In, because that can not identify that internal layer two dimensional code causes internal layer information to be lost, cause the method for spraying two dimensional code cannot be effectively to pressing work Sequence is monitored and traces.
Summary of the invention
The present invention in order to solve the technical problem, provides a kind of application method, system and meter that X-RAY technology is traced in PCB Calculation machine readable storage medium storing program for executing.
The present invention provides a kind of application methods that X-RAY technology is traced in PCB, comprising the following steps:
Mark is printed on PCB inner plating and pcb board is pressed;
It is scanned by mark of the X-Ray to PCB inner plating;
Digital signal is converted by the mark scanned;
By converting mark for the data-signal, with laser printing in PCB lamina rara externa predeterminated position.
Further, before the method also includes being located at step " being scanned by mark of the X-Ray to PCB inner plating " Following steps:
X-Ray is emitted to pcb board by X-Ray transmitter;
Tabula rasa, which is received, by X-Ray receives the X-Ray that X-Ray transmitter is emitted;
X-Ray receives tabula rasa and the mark image scanned is passed to control device.
Further, the mark uses two dimensional code;The digital signal uses character string.
Further, step " by converting mark for the data-signal " specifically includes:
Marking mechanism receives the digital signal;
The digital signal is parsed and is converted into mark.
Further, step is " default in PCB lamina rara externa with laser printing by converting mark for the data-signal It is further comprising the steps of before position ":
The mark image scanned is parsed;
The direction of pcb board is judged according to parsing result.
Further, step is " default in PCB lamina rara externa with laser printing by converting mark for the data-signal Position " specifically includes the following steps:
It adjusts printing equipment and is directed at PCB lamina rara externa predeterminated position;
Type information is converted into the digital signal;
Mark is printed on into PCB lamina rara externa predeterminated position according to type information.
Further, step " converting digital signal for the mark scanned " specifically includes:
The mark scanned is parsed;
Character string is converted by the data after parsing.
On the other hand, the present invention also provides a kind of X-RAY technologies in the retrospect internal layer panel sign identification application of pcb board whole process System, comprising:
X-Ray scanning means;For being scanned by mark of the X-Ray to PCB inner plating;
Control device;For converting digital signal for the mark scanned;
Printing equipment, for by converting the data-signal for mark laser printing in PCB lamina rara externa predeterminated position.
Further, the X-Ray scanning means specifically includes:
X-Ray trigger mechanism, for emitting X-Ray to pcb board by X-Ray transmitter;
X-Ray receiving mechanism receives the X-Ray that X-Ray transmitter is emitted for receiving tabula rasa by X-Ray;
X-Ray transmitting mechanism, the mark image for scanning X-Ray reception tabula rasa pass to control device.
In another aspect, the present invention also provides a kind of computer readable storage medium, on the computer readable storage medium The step of being stored with instruction, any one method realized when described instruction is executed by processor.
The beneficial effects of the present invention are: the embodiment of the present invention is identified by printing in PCB inner plating, then by by PCB Inner plating and PCB lamina rara externa carry out pressing and form pcb board, during printing to pcb board, first pass through X-Ray machine pair The mark of PCB inner plating is scanned and identifies, and sends MES system to, is turned the mark scanned by MES system Digital signal is turned to, and digital signal is passed into marking mechanism, two dimensional code is translated into digital signal by marking mechanism Information prints on PCB lamina rara externa, so that the two dimensional code mark of PCB lamina rara externa is consistent with the mark on PCB inner plating, thus Convenient for pcb board printing whole process retrospect, retrospect more accurate can be monitored.
Detailed description of the invention
Fig. 1 is step flow chart of the X-RAY technology of the present invention in PCB application method one embodiment traced.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached The embodiment of figure description is exemplary, it is intended to is used to explain the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside", " up time The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of The description present invention and simplified description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spy Fixed orientation construction and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or Implicitly include one or more of the features.In the description of the present invention, the meaning of " plurality " is two or more, Unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc. Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected;It can be machine Tool connection, is also possible to be electrically connected;It can be directly connected, two members can also be can be indirectly connected through an intermediary Connection inside part.For the ordinary skill in the art, above-mentioned term can be understood in this hair as the case may be Concrete meaning in bright.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower" It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above " Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of First feature horizontal height is less than second feature.
Below by specific embodiment combination attached drawing, invention is further described in detail.
As shown in Figure 1, the present invention provides a kind of application methods that X-RAY technology is traced in PCB, comprising the following steps:
Mark is printed on PCB inner plating and pcb board is pressed;
It is scanned by mark of the X-Ray to PCB inner plating;
Digital signal is converted by the mark scanned;
By converting mark for the data-signal, with laser printing in PCB lamina rara externa predeterminated position.
The embodiment of the present invention is identified by printing in PCB inner plating, then by by PCB inner plating and PCB lamina rara externa into Row pressing forms pcb board, during printing to pcb board, first passes through X-Ray machine and carries out to the mark of PCB inner plating Scanning and identification, and send MES system to, the mark scanned is carried out by MES system to be converted into digital signal, and will count Word signal passes to marking mechanism, translates into two-dimensional barcode information to digital signal by marking mechanism, prints on PCB lamina rara externa On, so that the two dimensional code mark of PCB lamina rara externa is consistent with the mark on PCB inner plating, consequently facilitating pcb board printing whole process chases after It traces back, more accurate can be monitored retrospect.
In one alternate embodiment, the method also includes being located at step " by X-Ray to the mark of PCB inner plating Be scanned " before following steps:
X-Ray is emitted to pcb board by X-Ray transmitter;
Tabula rasa, which is received, by X-Ray receives the X-Ray that X-Ray transmitter is emitted;
X-Ray receives tabula rasa and the mark image scanned is passed to control device.
In the present embodiment, X-Ray is emitted by X-Ray transmitter, tabula rasa is then received by X-Ray and receives X-Ray, is made The identification information of inner plating can effectively be identified by obtaining X-Ray reception tabula rasa, consequently facilitating control device (i.e. MES system) carries out Conversion and transmission.
In one alternate embodiment, the mark using the combination of two dimensional code or number+letter plain code or two dimensional code+ The combination of the plain code of letter;The digital signal uses character string.The content of the two dimensional code includes: the production sequence etc. of product Grade, production date, production work order serial number, production work order number amount serial number, production ectonexine primary and secondary work order number, production work It is single to split series number, the number amount number for producing plate, work order feed supplement quantity series number, produce reserved number, reserved number of production letter, life Produce check code area.
In one alternate embodiment, step " by converting mark for the data-signal " specifically includes:
Marking mechanism receives the digital signal;
The digital signal is parsed and is converted into mark.
In the present embodiment, specifically, the marking mechanism can use laser marking machine or drilling machine;By believing number Number parsing and execution, the mark of PCB inner plating can be printed on PCB lamina rara externa, convenient for the subsequent whole process to pcb board Retrospect.
In one alternate embodiment, step is " by converting mark for the data-signal, with laser printing in PCB It is further comprising the steps of before lamina rara externa predeterminated position ":
The mark image scanned is parsed;
The direction of pcb board is judged according to parsing result.
In the present embodiment, since the mark of PCB inner plating includes all information of pcb board, and be print on it is specific Region, so the direction of motion of pcb board can be judged by the parsing to PCB internal layer panel sign, consequently facilitating marking machine pair PCB lamina rara externa carries out mark operation.
In one alternate embodiment, step is " by converting mark for the data-signal, with laser printing in PCB Lamina rara externa predeterminated position " specifically includes the following steps:
It adjusts printing equipment and is directed at PCB lamina rara externa predeterminated position;
Type information is converted into the digital signal;
Mark is printed on into PCB lamina rara externa predeterminated position according to type information.
In the present embodiment, specifically, the printing equipment uses laser marking machine or drilling machine;By the way that digital signal is turned Type information is turned to, executes mark operation convenient for printing equipment, and adjusts the position of printing equipment, is printed on convenient for that will identify The specific position of PCB lamina rara externa.
In one alternate embodiment, step " converting digital signal for the mark scanned " specifically includes:
The mark scanned is parsed;
Character string is converted by the data after parsing.
In the present embodiment, the digital signal uses character string, carries out information reading and identification convenient for machine.
On the other hand, the present invention also provides a kind of X-RAY technologies in the retrospect internal layer panel sign identification application of pcb board whole process System, comprising:
X-Ray scanning means;For being scanned by mark of the X-Ray to PCB inner plating;
Control device;For converting digital signal for the mark scanned;
Printing equipment, for by converting the data-signal for mark laser printing in PCB lamina rara externa predeterminated position.
The embodiment of the present invention is identified by printing in PCB inner plating, then by by PCB inner plating and PCB lamina rara externa into Row pressing forms pcb board, during printing to pcb board, first passes through X-Ray machine and carries out to the mark of PCB inner plating Scanning and identification, and send MES system to, the mark scanned is carried out by MES system to be converted into digital signal, and will count Word signal passes to marking mechanism, translates into two-dimensional barcode information to digital signal by marking mechanism, prints on PCB lamina rara externa On, so that the two dimensional code mark of PCB lamina rara externa is consistent with the mark on PCB inner plating, consequently facilitating pcb board printing whole process chases after It traces back, more accurate can be monitored retrospect.
In one alternate embodiment, the X-Ray scanning means specifically includes:
X-Ray trigger mechanism, for emitting X-Ray to pcb board by X-Ray transmitter;
X-Ray receiving mechanism receives the X-Ray that X-Ray transmitter is emitted for receiving tabula rasa by X-Ray;
X-Ray transmitting mechanism, the mark image for scanning X-Ray reception tabula rasa pass to control device.
In the present embodiment, X-Ray is emitted by the X-Ray transmitter of X-Ray trigger mechanism, is then received by X-Ray The X-Ray of mechanism receives tabula rasa and receives X-Ray, and X-Ray is enabled to receive the identification information that tabula rasa effectively identifies inner plating, It is converted and is sent consequently facilitating X-Ray transmitting mechanism sends information to control device (i.e. MES system).
In another aspect, the present invention also provides a kind of computer readable storage medium, on the computer readable storage medium The step of being stored with instruction, any one method realized when described instruction is executed by processor.
The embodiment of the present invention is identified by printing in PCB inner plating, then by by PCB inner plating and PCB lamina rara externa into Row pressing forms pcb board, during printing to pcb board, first passes through X-Ray machine and carries out to the mark of PCB inner plating Scanning and identification, and send MES system to, the mark scanned is carried out by MES system to be converted into digital signal, and will count Word signal passes to marking mechanism, translates into two-dimensional barcode information to digital signal by marking mechanism, prints on PCB lamina rara externa On, so that the two dimensional code mark of PCB lamina rara externa is consistent with the mark on PCB inner plating, consequently facilitating pcb board printing whole process chases after It traces back, more accurate can be monitored retrospect.
In the description of this specification, reference term " embodiment ", " some embodiments ", " an implementation The description of example ", " some embodiments ", " example ", " specific example " or " some examples " etc. means to combine the embodiment or example Particular features, structures, materials, or characteristics described are included at least one embodiment or example of the invention.In this explanation In book, schematic expression of the above terms be may not refer to the same embodiment or example.Moreover, the specific spy of description Sign, structure, material or feature can be combined in any suitable manner in any one or more of the embodiments or examples.
The above content is specific embodiment is combined, further detailed description of the invention, and it cannot be said that this hair Bright specific implementation is only limited to these instructions.For those of ordinary skill in the art to which the present invention belongs, it is not taking off Under the premise of from present inventive concept, a number of simple deductions or replacements can also be made.

Claims (10)

1. a kind of application method that X-RAY technology is traced in PCB, which comprises the following steps:
Mark is printed on PCB inner plating and pcb board is pressed;
It is scanned by mark of the X-Ray to PCB inner plating;
Digital signal is converted by the mark scanned;
By converting mark for the data-signal, with laser printing in PCB lamina rara externa predeterminated position.
2. the application method that X-RAY technology as described in claim 1 is traced in PCB, which is characterized in that the method also includes Following steps before step " being scanned by mark of the X-Ray to PCB inner plating ":
X-Ray is emitted to pcb board by X-Ray transmitter;
Tabula rasa, which is received, by X-Ray receives the X-Ray that X-Ray transmitter is emitted;
X-Ray receives tabula rasa and the mark image scanned is passed to control device.
3. the application method that X-RAY technology as described in claim 1 is traced in PCB, which is characterized in that the mark uses two Tie up code;The digital signal uses character string.
4. the application method that X-RAY technology as described in claim 1 is traced in PCB, which is characterized in that step is " by by institute State data-signal and be converted into mark " it specifically includes:
Marking mechanism receives the digital signal;
The digital signal is parsed and is converted into mark.
5. the application method that X-RAY technology as described in claim 1 is traced in PCB, which is characterized in that step is " by by institute State data-signal and be converted into mark, with laser printing in PCB lamina rara externa predeterminated position " further comprising the steps of before:
The mark image scanned is parsed;
The direction of pcb board is judged according to parsing result.
6. the application method that X-RAY technology as described in claim 1 is traced in PCB, which is characterized in that step is " by by institute State data-signal and be converted into mark, with laser printing in PCB lamina rara externa predeterminated position " specifically includes the following steps:
It adjusts printing equipment and is directed at PCB lamina rara externa predeterminated position;
Type information is converted into the digital signal;
Mark is printed on into PCB lamina rara externa predeterminated position according to type information.
7. the application method that X-RAY technology as described in claim 1 is traced in PCB, which is characterized in that step " arrives scanning Mark be converted into digital signal " specifically include:
The mark scanned is parsed;
Character string is converted by the data after parsing.
8. a kind of X-RAY technology is in the system of pcb board whole process retrospect internal layer panel sign identification application characterized by comprising
X-Ray scanning means;For being scanned by mark of the X-Ray to PCB inner plating;
Control device;For converting digital signal for the mark scanned;
Printing equipment, for by converting the data-signal for mark laser printing in PCB lamina rara externa predeterminated position.
9. the system that X-RAY technology as claimed in claim 8 is applied in the retrospect internal layer panel sign identification of pcb board whole process, It is characterized in that, the X-Ray scanning means specifically includes:
X-Ray trigger mechanism, for emitting X-Ray to pcb board by X-Ray transmitter;
X-Ray receiving mechanism receives the X-Ray that X-Ray transmitter is emitted for receiving tabula rasa by X-Ray;
X-Ray transmitting mechanism, the mark image for scanning X-Ray reception tabula rasa pass to control device.
10. a kind of computer readable storage medium, instruction is stored on the computer readable storage medium, which is characterized in that The step of any one method described in claim 1~7 is realized when described instruction is executed by processor.
CN201910842873.XA 2019-09-06 2019-09-06 X-RAY technology is in the PCB application method traced and system Pending CN110446334A (en)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111612110A (en) * 2020-05-18 2020-09-01 瑞茂光学(深圳)有限公司 Circuit board two-dimensional code reading and collecting system based on X-ray tomography technology
CN112113791A (en) * 2020-09-22 2020-12-22 三角轮胎股份有限公司 Method for automatically sampling banburying film and tracing information code spraying mark in tire production
CN112418366A (en) * 2020-11-11 2021-02-26 奥士康科技股份有限公司 Monitoring method for tracing PCB (printed Circuit Board) by using drilling pattern
CN113260161A (en) * 2021-06-29 2021-08-13 惠州市大亚湾科翔科技电路板有限公司 Traceable circuit board manufacturing method
CN113573506A (en) * 2021-06-09 2021-10-29 深圳市升达康科技有限公司 PCB production process and PCB circuit board
CN116227517A (en) * 2023-01-31 2023-06-06 深圳市日联科技有限公司 Code scanning system and scanning method for printed circuit board
WO2024098506A1 (en) * 2022-11-10 2024-05-16 惠州市金百泽电路科技有限公司 Method for ink-jet printing of solder resist on pcb

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CN109933033A (en) * 2019-04-23 2019-06-25 深圳镭霆激光科技有限公司 The process for pressing section retroactive method of PCB whole process retrospect

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111612110A (en) * 2020-05-18 2020-09-01 瑞茂光学(深圳)有限公司 Circuit board two-dimensional code reading and collecting system based on X-ray tomography technology
CN112113791A (en) * 2020-09-22 2020-12-22 三角轮胎股份有限公司 Method for automatically sampling banburying film and tracing information code spraying mark in tire production
CN112418366A (en) * 2020-11-11 2021-02-26 奥士康科技股份有限公司 Monitoring method for tracing PCB (printed Circuit Board) by using drilling pattern
CN113573506A (en) * 2021-06-09 2021-10-29 深圳市升达康科技有限公司 PCB production process and PCB circuit board
CN113260161A (en) * 2021-06-29 2021-08-13 惠州市大亚湾科翔科技电路板有限公司 Traceable circuit board manufacturing method
WO2024098506A1 (en) * 2022-11-10 2024-05-16 惠州市金百泽电路科技有限公司 Method for ink-jet printing of solder resist on pcb
CN116227517A (en) * 2023-01-31 2023-06-06 深圳市日联科技有限公司 Code scanning system and scanning method for printed circuit board

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Application publication date: 20191112