JP4196529B2 - Electronic component mounting apparatus and method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus capable of executing mounting of minute electronic components with high accuracy, and an electronic component mounting method executed by the electronic component mounting apparatus.
[0002]
[Prior art]
FIG. 7 is a schematic perspective view of a conventional electronic component mounting apparatus 1, and FIG. 8 is an operation flowchart thereof. In FIG. 7, reference numeral 2 denotes a nozzle unit that has a nozzle 21 for sucking and holding the electronic component 10, 3 is a printed circuit board, 4 is a θ rotation unit that rotates the nozzle 21 around its axis, and 5 is an XY. A table part, 6 is a board mark recognition part for recognizing the board marks 7A and 7B on the printed circuit board 3, 8 is a component supply part, and 9 is an electronic part recognition part.
[0003]
Such an electronic component mounting apparatus 1 operates as follows.
First, the conveyed printed circuit board 3 is fixed at a predetermined position of the electronic component mounting apparatus 1. Next, in step (indicated by “S” in FIG. 8) 1 shown in FIG. 8, the XY table unit 5 is moved in the X and Y directions, and the board mark recognition unit 6 installed on the XY table unit 5 is moved. Thus, the board marks 7A and 7B on the printed board 3 are imaged. The imaging information is subjected to image recognition processing, and an accurate installation position of the printed circuit board 3 is measured.
Next, in step 2, the electronic component 10 such as an IC chip is supplied by the component supply unit 8, and in the next step 3, the XY table unit 5 is moved in the X and Y directions to move the nozzle unit 2 to the component. The electronic component 10 is sucked and held by the nozzle 21 by being arranged in the supply unit 8.
[0004]
In the next step 4, the nozzle unit 2 holding the electronic component 10 is moved above the electronic component recognition unit 9 by the XY table unit 5 to measure the position of the electronic component 10 held by the nozzle 21. . Based on the position measurement result, the nozzle unit 2 is moved above the mounting position of the printed circuit board 3 while performing position correction by the θ rotation unit 4 and the XY table unit 5 in the next step 5. In the next step 6, the nozzle 21 of the nozzle portion 2 is lowered and the electronic component 10 is mounted at the mounting position of the printed board 3.
In step 7, it is determined whether or not all the electronic components 10 scheduled on the printed circuit board 3 have been mounted. If there are unmounted electronic components 10, the process returns to step 2, while all the electronic components 10 are mounted. When finished, the process proceeds to the next step 8. In step 8, the printed board 3 on which the electronic component 10 has been mounted is carried out from the electronic component mounting apparatus 1 to the next process, and a new printed board 3 is carried into the electronic component mounting apparatus 1.
[0005]
[Problems to be solved by the invention]
However, in the conventional electronic component mounting apparatus 1 as described above, it has become difficult to follow the trend toward further miniaturization, miniaturization, and higher density mounting of the electronic component 10.
That is, in recent years, chip-type electronic components 10 having a size of 1.0 mm × 0.5 mm have become mainstream in portable devices and the like, and the gap between the minute electronic components 10 on the substrate is 0. .4 mm to 0.3 mm. Recently, an electronic component having a size of 0.6 mm × 0.3 mm has appeared, and a gap between the electronic components is required to be 0.3 mm or less.
[0006]
However, in the conventional electronic component mounting apparatus 1, after recognizing the board marks 7A and 7B in step 1 and confirming the position of the printed board 3 as described above, the position correction in step 5 is performed. The component mounting is sequentially executed without confirming the mounting position of the component 10 for each mounting. Therefore, for example, even when an adjacent electronic component is arranged slightly deviated from the specified position, the electronic component is mounted without considering the positional deviation. In the case of mounting electronic parts in a narrow gap, there may be a problem in mounting. Also, when repair work is required to remove defective chip parts due to, for example, poor bonding, tools such as tweezers cannot be used if the gap between adjacent parts becomes about 0.2 mm, or solder is melted locally. It is difficult or difficult to work. Therefore, it is necessary to confirm whether or not a bonding material such as cream solder is applied to a predetermined place before mounting, but the confirmation operation cannot be performed by the conventional electronic component mounting apparatus 1.
The present invention has been made to solve such problems. Electronic components that can efficiently mount minute electronic components in a narrow gap and that can improve the yield of a completed circuit board as compared to conventional ones. It is an object of the present invention to provide a mounting apparatus and an electronic component mounting method executed by the electronic component mounting apparatus.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the present invention is configured as follows.
An electronic component mounting apparatus according to a first aspect of the present invention is an electronic component mounting apparatus for mounting a first electronic component held by a component holding member that holds an electronic component on a circuit board,
An imaging device for imaging a mounting environment for the first electronic component in a region where the first electronic component is to be mounted on the circuit board;
A control device that receives imaging information from the imaging device and determines whether or not the mounting environment for the first electronic component in the planned mounting area is favorable based on the imaging information before mounting the first electronic component; With
The mounting environment is a state in which an electronic component mounted on the circuit board adjacent to the planned mounting area enters the planned mounting area .
[0008]
When determining that the mounting environment is defective, the control device corrects the mounting position of the first electronic component in the planned mounting area and determines whether or not to mount. Can do.
[0009]
The control device stores mounting position information of the first electronic component, position information of an electronic component mounted adjacent to the first electronic component, and information of the mounting environment imaged by the imaging device. A storage portion can be included.
[0010]
The mounting environment may be a coating state of a bonding material for achieving electrical connection between the circuit board and the first electronic component in the planned mounting area.
[0012]
The electronic component mounting method according to the second aspect of the present invention is an electronic component mounting method for mounting a first electronic component held by a component holding member holding an electronic component on a circuit board,
The mounting schedule of the electronic component mounted on the circuit board adjacent to the mounting area included in the mounting environment for the first electronic component in the mounting area of the first electronic component on the circuit board Image the state of entry into the area ,
Determining whether or not the mounting environment for the first electronic component in the mounting-scheduled area is favorable based on imaging information by the imaging before mounting the first electronic component;
It is characterized by that.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
An electronic component mounting apparatus according to an embodiment of the present invention and an electronic component mounting method executed by the electronic component mounting apparatus will be described below with reference to the drawings. In addition, the same code | symbol is attached | subjected about the same component in each figure.
The electronic component handled by the electronic component mounting apparatus of the present embodiment is, for example, a component having a size of 0.6 mm × 0.3 mm, and the gap between adjacent electronic components is arranged at about 0.1 mm. Take the case as an example. However, the electronic component mounting apparatus according to the present embodiment is not limited to the above-described size and arrangement gap, and becomes more effective when the size is equal to or smaller than the above-described size and arrangement gap. Of course, the present invention can be applied even in the case of dimensions exceeding the arrangement gap.
[0014]
As shown in FIG. 1, the electronic component mounting apparatus 101 of the present embodiment is roughly divided into a component holding device 120, a board transfer device 103, an XY table unit 105, a component supply device 108, and an electronic component recognition device 109. And a control device 180.
The component holding device 120 holds the electronic component 110 supplied by the component supply device 108 and mounts the held electronic component 110 on the circuit board 3 carried in by the substrate transfer device 103. The apparatus includes a nozzle unit 102, a θ rotation unit 104, and an imaging device 106. The component holding device 120 is installed on the XY table unit 105 and can be moved in the X and Y directions orthogonal to each other by the XY table unit 105. Therefore, the nozzle unit 102 and the imaging device 106 are also movable in the X and Y directions.
[0015]
The nozzle portion 102 includes a nozzle 121 that sucks and holds the electronic component 110, which is an example of a function as a component holding member, and moves the nozzle 121 up and down along the axial direction. Here, the electronic component 110 has a size of 0.6 mm × 0.3 mm as described above, and is a minute component in which a gap between adjacent electronic components is arranged at about 0.1 mm. The electronic component held by the nozzle 121 for mounting on the circuit board 3 is referred to as a first electronic component 111. The θ rotation unit 104 rotates the nozzle 121 in the direction around its axis.
[0016]
The imaging device 106 is a device that images a mounting environment for the first electronic component 111 in the planned mounting area 114 of the first electronic component 111 on the circuit board 3, and sends the imaging information to the control device 180. Here, the planned mounting area 114 is an area included in the imaging area imaged by the imaging device 106 and is an area to be subjected to image processing by the control device 180. As shown in FIG. 3, in the present embodiment, the scheduled mounting area 114 is, for example, when the first electronic component 111 is mounted at a design position of the first electronic component 111 on the circuit board 3. A design gap 112 between the first electronic component 111 and each electronic component 110 disposed on the circuit board 3 adjacent to the first electronic component 111 includes a design area 112 occupied by the first electronic component 111. Is an area having a size provided around the design area 112. In the case of this embodiment, the electronic component 110 has a size of 0.6 mm × 0.3 mm as described above, and the gap between adjacent electronic components is about 0.1 mm. Since 112 is 0.6 mm × 0.3 mm, the mounting area 114 is 0.8 (= 0.6 + 0.1 × 2) mm × 0.5 (= 0.3 + 0.1 × 2) mm. This is an area consisting of dimensions.
Note that the mounting region 114 is not limited to the above-described size, but changes according to the size of the first electronic component 111 and the gap size between adjacent components. Moreover, it can be changed depending on whether the design value of the gap size is used as it is or changed.
[0017]
Further, the mounting environment is a factor that may have an influence when the first electronic component 111 is mounted on the circuit board 3. In the present embodiment, for example, in the planned mounting area 114, As shown in FIG. 4, the bonding material 115 is applied to electrically connect the circuit board 3 and the first electronic component 111. Further, as shown in FIGS. In this state, the electronic component 110 mounted on the circuit board 3 adjacent to 114 enters the planned mounting area 114. An example of performing the function of the bonding material 115 corresponds to so-called cream solder. In addition, the intrusion state of the adjacent electronic component 110 into the planned mounting area 114 is, in other words, a state where the mounting accuracy of the adjacent electronic component 110 is acceptable.
[0018]
Next, the substrate transfer device 103 is a device that carries the circuit board 3 from the previous process to the electronic component mounting apparatus 101 and carries the circuit board 3 from the electronic component mounting apparatus 101 to the next process. The circuit board 3 is moved by a driving device 1031 provided in the transport device 103.
[0019]
The component supply device 108 is a device that supplies the electronic component 110. In the present embodiment, for example, a reel-type component that supplies the electronic component 110 by winding a tape containing the electronic component 110 and feeding the tape. Using a feeding device. Of course, the component supply device 108 is not limited to the reel type, and a known type of supply device such as a tray type can be used.
[0020]
The electronic component recognition device 109 is a device that images the holding posture of the first electronic component 111 held from the component supply device 108 by the nozzle 121 of the nozzle unit 102 of the component holding device 120 before mounting the component. The imaging information is sent to the control device 180. The control device 180 obtains a position correction amount when the first electronic component 111 is mounted on the circuit board 3 based on the holding posture information and the normal posture information. Based on the obtained position correction amount, the control device 180 operates at least one of the θ rotation unit 104 and the XY table unit 105.
[0021]
The operation of the electronic component mounting apparatus 101 of the present embodiment configured as described above, that is, the electronic component mounting method will be described below. Each operation is executed under the control of the control device 180. The control device 180 includes a relationship between each component mounting position on the circuit board 3 in accordance with the mounting order and the type of the electronic component 110 mounted at the mounting position, and a component supply device 108 that supplies each electronic component 110. Mounting information necessary for the mounting operation such as the installation position is stored in advance, and the control device 180 executes the mounting operation according to the mounting information.
Similarly to the conventional electronic component mounting apparatus, the electronic component mounting apparatus 101 of the present embodiment also holds the electronic component 110 and mounts it on the circuit board 3 after carrying in the circuit board 3 after the desired mounting is completed. Then, a basic mounting operation of unloading the circuit board 3 is performed. Therefore, the basic mounting operation will be briefly described, and hereinafter, the imaging information processing operation by the imaging apparatus 106, which is one of the characteristic operations in the present embodiment, will be mainly described.
[0022]
In step 201 shown in FIG. 2, the circuit board 3 is placed and fixed at a predetermined position of the electronic component mounting apparatus 101 from the previous step by the board transfer device 103. In the next step 202, the nozzle 121 of the nozzle unit 102 is arranged at the component supply position in the component supply device 108 by the operation of the XY table unit 105, and the nozzle 121 is further lowered by the nozzle unit 102 to hold the electronic component 110. . As described above, the electronic component 110 held by the nozzle 121 is referred to as the first electronic component 111. After holding the parts, the nozzle 121 rises to the raised position.
In the next step 203, after the nozzle 121 is arranged above the electronic component recognition device 109 by the operation of the XY table unit 105, the holding posture of the first electronic component 111 is imaged by the electronic component recognition device 109, and the control device In 180, the position correction amount is obtained based on the holding posture information.
[0023]
In the next step 204, the component holding device 120 is moved by the operation of the XY table unit 105, and the imaging device 106 is arranged above the range including the planned mounting area 114 on the circuit board 3. Then, the imaging device 106 images the range including the planned mounting area 114 and sends the imaging information to the control device 180. The control device 180 performs image processing so that the mounting environment for the first electronic component 111 can be determined for the mounting planned area 114 in the imaging information in the range including the mounting planned area 114. That is, in the present embodiment, image processing is performed so that it is possible to determine the application state of the bonding material 115 and whether or not the adjacent electronic component 110 has entered.
[0024]
In the next step 205, the control device 180 determines whether or not the application state of the bonding material 115 is good based on the post-image processing information in the planned mounting area 114 obtained in step 204. If the application state is good, the process proceeds to the next step 206, and if not, the process proceeds to step 207.
In the next step 206, based on the post-image processing information of the planned mounting area 114 obtained in step 204, the control device 180 determines whether or not the adjacent electronic component 110 has entered the planned mounting area 114. . If there is no intrusion, the process proceeds to the next step 208, and if there is an intrusion, the process proceeds to step 207.
These determination methods will be specifically described below with reference to FIGS. 4 to 6 are image examples obtained by performing the above image processing. In these drawings, the hatched portion indicates the bonding material 115, and the position indicated by P is the position of the first electronic component. This corresponds to the center position of the designed mounting position, that is, the center position of the mounting area 114.
[0025]
In the post-image processing image shown in FIG. 4, it can be seen that the adjacent mounted electronic component 110 has not entered the planned mounting area 114. That is, there is no problem in the mounting accuracy of the adjacent electronic components 110. However, it can be seen that the bonding material 115 is missing at the T portion of the electrode land 3 a of the circuit board 3. Therefore, even if the first electronic component 111 is mounted with the P position as the center in such a situation, it is inevitable that a soldering failure will occur. Therefore, in such a case, it is determined to stop mounting the first electronic component 111 and the process proceeds to step 207. In the present embodiment, for example, when the bonding material 115 is applied to only 50% or less of the electrode land 3a, it is determined that the mounting is stopped.
[0026]
In step 207, the control device 180 associates the post-image processing image information, the P-position position information, and the adjacently mounted electronic component 110 position information with each other. Then, the data is stored in the storage unit 181. The storage unit 181 also stores determination information as to whether or not to perform mounting as described above. By storing these pieces of information in the storage unit 181, the inspection data after mounting is compared with the above stored information, and the situation of the bonding material 115 and the mounting accuracy of the adjacent electronic component 110 are poor. It is possible to analyze what kind of causal relationship there is. Therefore, in order to reduce the occurrence of defects, for example, it is possible to correct the determination level as to whether or not to mount based on the degree of missing of the bonding material 115.
[0027]
In the image after image processing shown in FIG. 5, it can be seen that the application state of the bonding material 115 is good. However, it can be seen that the mounting accuracy of the electronic component 110 adjacent to the right side is slightly worse, and a part 110a of the right adjacent electronic component 110 has entered the mounting planned area 114. Therefore, if the first electronic component 111 is mounted with the P position as the center, there may be a case where a specified gap dimension cannot be satisfied with the adjacent electronic component 110. It is determined that it is necessary to shift the P position, which is the planned mounting position of 111, to the Q position, and the first electronic component 111 is mounted by shifting the planned mounting position to the Q position.
[0028]
However, when there is a possibility that the prescribed gap dimension between the adjacent electronic component 110 on the left side and the first electronic component 111 cannot be satisfied as a result of shifting the planned mounting position to the Q position, the mounting of the first electronic component 111 is performed. The cancellation is determined, the process proceeds to step 207, and the post-image processing image information and the position information of the P position are stored in the storage unit 181 in a state where they are associated with each other.
[0029]
In the image after image processing shown in FIG. 6, it can be seen that the mounting accuracy of the adjacent electronic component 110 is remarkably poor. Therefore, the control device 180 decides to stop mounting the first electronic component 111, proceeds to step 207, and associates the post-image processing image information and the P point position information with each other. And stored in the storage unit 181.
In the present embodiment, for example, in the first electronic component 111 having a length of 0.6 mm and a width of 0.3 mm, a mounting scheduled area 114 having a length of 0.8 mm and a width of 0.5 mm is set, and the mounting is planned. For example, when the adjacent electronic component 110 enters the planned mounting area 114 at 0.05 mm or more along the width direction of the area 114, that is, 1/10 or more of the dimension in the width direction of the planned mounting area 114, for example. It is determined that the mounting accuracy of 110 is poor.
[0030]
In the next step 208, based on the position correction amount obtained in step 203, the control device 180 operates at least one of the XY table unit 105 and the θ rotation unit 104 to determine the mounting position of the first electronic component 111. In the next step 209, the first electronic component 111 is mounted in the planned mounting area 114.
In the next step 210, it is determined whether or not all the planned electronic components 110 have been mounted on the circuit board 3. When all the electronic components 110 have been mounted, the process proceeds to the next step 211. If there is, the process returns to step 201 again.
In step 211, the circuit board 3 on which all planned electronic components 110 are mounted is unloaded from the electronic component mounting apparatus 101, and then a new circuit board 3 is loaded into the electronic component mounting apparatus 101.
[0031]
As described above, according to the electronic component mounting apparatus 101 of the present embodiment, before the first electronic component 111 is mounted on the circuit board 3, whether or not the application state of the bonding material 115 is good and the mounting accuracy in the adjacent mounted component 110. Therefore, based on the confirmation result, the mounting position of the first electronic component 111 can be shifted from the design position in advance, or the mounting of the first electronic component 111 can be stopped. Therefore, for example, a small electronic component having a size of 0.6 mm × 0.3 mm or less can be efficiently mounted with a gap between the electronic components of 0.1 mm or less. The yield of the circuit board 3 can be improved as compared with the prior art.
[0032]
In the above-described embodiment, the case where the nozzle portion 102 of the component holding device 120 is provided with one nozzle 121 is taken as an example, but the present invention is not limited to this, and a plurality of nozzles may be provided.
[0033]
【The invention's effect】
As described above in detail, according to the electronic component mounting apparatus of the first aspect and the electronic component mounting method of the second aspect of the present invention, the first electronic component is scheduled to be mounted on the circuit board, including the imaging device and the control device. A mounting environment for the first electronic component in the area is imaged, and whether or not the mounting environment for the first electronic component in the planned mounting area is good is determined based on the imaging information before mounting the first electronic component. I tried to do it. Therefore, the first electronic component is not mounted on the circuit board while the mounting environment is poor. Therefore, it is possible to efficiently mount the minute electronic components in a narrow gap, and it is possible to improve the yield of the completed circuit board as compared with the related art.
[0034]
When it is determined that the mounting environment is defective, the mounting position of the first electronic component can be corrected or the mounting can be stopped to efficiently mount the minute electronic component in a narrow gap. The yield can be improved as compared with the conventional method.
[0035]
A storage unit for storing mounting position information of the first electronic component, position information of an electronic component mounted adjacent to the first electronic component, and information of a mounting environment imaged by an imaging device; By installing it in the control device, the inspection data after the mounting is compared with the stored information, and what kind of causal relationship the status of the mounting environment and the mounting accuracy of the adjacent electronic components have with the quality defect after mounting Can be analyzed. Therefore, in order to reduce the occurrence of defects, for example, it is possible to correct the determination level as to whether or not to mount based on the missing degree of the bonding material.
[0036]
By selecting the application state of the bonding material as the mounting environment, it is possible to detect a state of bonding failure even before mounting before mounting. Therefore, it is possible to efficiently mount the minute electronic components in a narrow gap, and it is possible to improve the yield of the completed circuit board as compared with the conventional one.
[0037]
By selecting entry of an adjacent electronic component into the mounting planned area as the mounting environment, the mounting position of the first electronic component can be shifted from the design position so that the gap between the adjacent electronic components is within a specified value. It becomes possible. Therefore, it is possible to efficiently mount the minute electronic components in a narrow gap, and it is possible to improve the yield of the completed circuit board as compared with the conventional one.
[Brief description of the drawings]
FIG. 1 is a schematic perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.
2 is an operation flowchart of the electronic component mounting apparatus shown in FIG.
FIG. 3 is a diagram for explaining a mounting expected area used in the electronic component mounting apparatus shown in FIG. 1;
FIG. 4 is a sample image of a planned mounting area obtained by the electronic component mounting apparatus shown in FIG. 1 and showing a bonding material missing state;
5 is a view showing another sample image of a mounting scheduled area obtained by the electronic component mounting apparatus shown in FIG. 1 and showing a state in which adjacent electronic components have entered the mounting planned area. FIG.
6 is another sample image of the planned mounting area obtained by the electronic component mounting apparatus shown in FIG. 1, and shows a state in which adjacent electronic components have remarkably intruded into the planned mounting area.
FIG. 7 is a schematic perspective view of a conventional electronic component mounting apparatus.
FIG. 8 is an operation flowchart of a conventional electronic component mounting apparatus.
[Explanation of symbols]
3 ... Circuit board,
101 ... Electronic component mounting device, 106 ... Imaging device, 110 ... Electronic component,
111 ... 1st electronic component, 114 ... mounting plan area,
121... Nozzle, 180... Control device, 181.

Claims (6)

An electronic component mounting apparatus for mounting a first electronic component (111) held by a component holding member (121) holding an electronic component (110) on a circuit board (3),
An imaging device (106) for imaging the mounting environment for the first electronic component in the mounting region (114) of the first electronic component on the circuit board;
A control device (180) for determining whether or not the mounting environment for the first electronic component in the planned mounting area is favorable based on the imaging information supplied from the imaging device before mounting the first electronic component. ) And
The electronic component mounting apparatus , wherein the mounting environment is an intrusion state of an electronic component mounted on the circuit board adjacent to the planned mounting area into the planned mounting area .   The control device, when determining that the mounting environment is defective, determines whether or not to mount the first electronic component by correcting the mounting position of the first electronic component in the planned mounting area. The electronic component mounting apparatus according to 1.   The control device stores mounting position information of the first electronic component, position information of an electronic component mounted adjacent to the first electronic component, and information of the mounting environment imaged by the imaging device. The electronic component mounting apparatus according to claim 2, further comprising a storage unit (181). The above implementations are also at the prospective mounting region, a coating state of the bonding material to achieve electrical connection (115) between the circuit board and the first electronic component, in any one of claims 1 to 3 The electronic component mounting apparatus described. An electronic component mounting method for mounting a first electronic component (111) held by a component holding member (121) holding an electronic component (110) on a circuit board (3),
  The electronic component mounted on the circuit board adjacent to the planned mounting area included in the mounting environment for the first electronic component in the first electronic component mounting planned area (114) on the circuit board. Take an image of the intrusion state into the mounting area,
  Determining whether or not the mounting environment for the first electronic component in the mounting-scheduled area is favorable based on imaging information by the imaging before mounting the first electronic component;
An electronic component mounting method characterized by the above. 6. The electronic component according to claim 5, wherein when it is determined that the mounting environment is defective, the mounting position of the first electronic component in the planned mounting area is corrected to determine whether to mount or not to mount. Implementation method.

Images