CN104765344B - The methods, devices and systems of quality monitoring - Google Patents
The methods, devices and systems of quality monitoring Download PDFInfo
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- CN104765344B CN104765344B CN201510118269.4A CN201510118269A CN104765344B CN 104765344 B CN104765344 B CN 104765344B CN 201510118269 A CN201510118269 A CN 201510118269A CN 104765344 B CN104765344 B CN 104765344B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
The invention discloses a kind of methods, devices and systems of quality monitoring, belong to surface installation technique field.Methods described includes：The pictorial information of printing board PCB in process is obtained from database；The process for occurring defect is determined according to the pictorial information；The detection information of the process is obtained in the database；Analyze the reason for detection information obtains occurring the defect.Described device includes：First acquisition module, determining module, the second acquisition module and analysis module.The present invention can collect the information of various process equipments and be analyzed and be utilized, realize the quick positioning of quality problems in PCB process, the accuracy rate of PCB technology quality monitoring is improved, is easy to carry out handling and controlling accordingly in time, can effectively lift PCB product quality.
Description
Technical field
The present invention relates to surface installation technique field, more particularly to a kind of methods, devices and systems of quality monitoring.
Background technology
Surface installation technique (Surface Mount Technology, referred to as：SMT surface mount or surface peace) are also known as
Dress technology.It is that one kind will be arranged on printed circuit board (Printed Circuit without pin or short leg surface-assembled component
Board, referred to as：PCB on surface or the surface of other substrates), welding assembly is subject to by methods such as Reflow Soldering or immersed solder
Circuit load technology.The monitoring of SMT process flows serves conclusive effect to PCB processing quality.
At present, when problem occurs for PCB processing quality, generally using the method for live artificial judgment, by engineer's root
According to the presentation and the experience of itself for having occurred problem, the reason for judgement is gone wrong simultaneously is handled accordingly in time.But, it is this
Method is using personal experience as Main Basiss, and the requirement not only to personnel is higher, and easily the situation of error in judgement occurs, causes prison
The accuracy rate of control is relatively low, influences PCB processing quality.
The content of the invention
In view of this, the invention provides a kind of methods, devices and systems of quality monitoring, to improve PCB technology quality
The accuracy rate of monitoring.The technical scheme is as follows：
First aspect includes there is provided a kind of method of quality monitoring, methods described：
The pictorial information of printing board PCB in process is obtained from database；
The process for occurring defect is determined according to the pictorial information；
The detection information of the process is obtained in the database；
Analyze the reason for detection information obtains occurring the defect.
It is described to obtain printing board PCB from database and adding with reference to above-mentioned in a first aspect, under the first embodiment
Pictorial information during work, including：
Receive the PCB of user's input index information；
The pictorial informations of the PCB in process are obtained from the database according to the index information；
Wherein, the index information include bar code, either including bar code and Part Number or including bar code,
Part Number and device position number.
With reference to above-mentioned in a first aspect, under second of embodiment, methods described also includes：
Quality control is carried out to the process of the PCB according to the obtained reason.
With reference to above-mentioned in a first aspect, under the third embodiment, methods described also includes：
The defect that record is determined in real time；
The defect of display record is checked for user in real time on interface.
With reference to above-mentioned in a first aspect, under the 4th kind of embodiment, the process includes following at least one：
It is printing, solder paste thickness testing SPI, paster, stokehold automatic optics inspection AOI, reflow ovens welding, AOI after stove, automatic
On-line testing ICT or functional test FT.
Second aspect includes there is provided a kind of method of quality monitoring, methods described：
Pictorial information and the detection letter of process that the process equipment of reception printing board PCB is reported in process
Breath；
The pictorial information and detection information of the PCB are sent to database and stored；
Wherein, the pictorial information is used for the process for determining to occur defect, and the detection information occurs described for determination
The reason for defect.
With reference to above-mentioned second aspect, under the first embodiment, the process equipment for receiving printing board PCB exists
The pictorial information and the detection information of process reported in process, including following at least one：
Receive the pictorial information and detection information for the printing that printing machine equipment is reported；
Receive the pictorial information and detection information for the solder paste thickness testing that solder paste thickness testing SPI equipment is reported；
Receive the pictorial information and detection information for the paster that paster machine equipment is reported；
Receive the pictorial information and detection information for the stokehold AOI that stokehold automatic optics inspection AOI equipment is reported；
Receive the pictorial information and detection information for the reflow ovens welding that backflow furnace apparatus is reported；
Receive the pictorial information and detection information of AOI after the stove that AOI equipment is reported after stove；
Receive the pictorial information and detection information for the ICT that automatic on-line testing ICT equipment is reported；
The pictorial information and detection information for the FT that receive capabilities test FT equipment is reported.
With reference to above-mentioned second aspect, under second of embodiment, the pictorial information and detection information by the PCB
Send to database and stored, including：
The pictorial information and detection information of the PCB are sent to the database so that described in the Database
The corresponding relation of PCB index information and the PCB pictorial information and detection information simultaneously stores the corresponding relation；
Wherein, the index information include bar code, either including bar code and Part Number or including bar code,
Part Number and device position number.
The third aspect includes there is provided a kind of device of quality monitoring, described device：
First acquisition module, for obtaining the pictorial information of printing board PCB in process from database；
Determining module, the process for being determined to occur defect according to the pictorial information；
Second acquisition module, the detection information for obtaining the process in the database；
Analysis module, for analyzing the reason for detection information obtains occurring the defect.
With reference to the above-mentioned third aspect, under the first embodiment, first acquisition module includes：
Receiving unit, the index information of the PCB for receiving user's input；
First acquisition unit, for obtaining the PCB from the database in process according to the index information
In pictorial information；
Wherein, the index information include bar code, either including bar code and Part Number or including bar code,
Part Number and device position number.
With reference to the above-mentioned third aspect, under second of embodiment, described device also includes：
Control module, for carrying out quality control to the process of the PCB according to the obtained reason.
With reference to the above-mentioned third aspect, under the third embodiment, described device also includes：
Logging modle, for recording the defect determined in real time；
Display module, for the defect of display record to be checked for user in real time on interface.
With reference to the above-mentioned third aspect, under the 4th kind of embodiment, the process includes following at least one：
It is printing, solder paste thickness testing SPI, paster, stokehold automatic optics inspection AOI, reflow ovens welding, AOI after stove, automatic
On-line testing ICT or functional test FT.
Fourth aspect includes there is provided a kind of device of quality monitoring, described device：
Receiving module, for receive pictorial information that the process equipment of printing board PCB reports in process and
The detection information of process；
Sending module, is stored for the pictorial information and detection information of the PCB to be sent to database；
Wherein, the pictorial information is used for the process for determining to occur defect, and the detection information occurs described for determination
The reason for defect.
With reference to above-mentioned fourth aspect, under the first embodiment, the receiving module includes following at least one：
First receiving unit, pictorial information and detection information for receiving the printing that printing machine equipment is reported；
Second receiving unit, the pictorial information for receiving the solder paste thickness testing that solder paste thickness testing SPI equipment is reported
And detection information；
3rd receiving unit, pictorial information and detection information for receiving the paster that paster machine equipment is reported；
4th receiving unit, for receive the stokehold AOI that stokehold automatic optics inspection AOI equipment is reported pictorial information and
Detection information；
5th receiving unit, pictorial information and detection information for receiving the reflow ovens welding that backflow furnace apparatus is reported；
6th receiving unit, pictorial information and detection information for receiving AOI after the stove that AOI equipment is reported after stove；
7th receiving unit, pictorial information and detection for receiving the ICT that automatic on-line testing ICT equipment is reported are believed
Breath；
8th receiving unit, the pictorial information and detection information for the FT that FT equipment is reported are tested for receive capabilities.
With reference to above-mentioned fourth aspect, under second of embodiment, the sending module includes：
Transmitting element, for the pictorial information and detection information of the PCB to be sent into the database so that the number
The index information of the PCB and the pictorial information of the PCB and the corresponding relation of detection information are set up according to storehouse and store described right
It should be related to；
Wherein, the index information include bar code, either including bar code and Part Number or including bar code,
Part Number and device position number.
5th aspect is there is provided a kind of system of quality monitoring, and the system includes：Dress as described in the above-mentioned third aspect
Put and the device as described in above-mentioned fourth aspect.
The beneficial effect that the technical scheme that the present invention is provided is brought is：The figures of PCB in process are obtained from database
Piece information, the process for occurring defect is determined according to the pictorial information, and the detection letter of the process is obtained in the database
Breath, analyzes the reason for detection information obtains occurring the defect, this mode can collect the information of various process equipments
And analyzed and utilized, the quick positioning of quality problems in PCB process is realized, PCB technology quality monitoring is improved
Accuracy rate, is easy to carry out handling and controlling accordingly in time, can effectively lift PCB product quality.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, makes required in being described below to embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those of ordinary skill in the art, on the premise of not paying creative work, other can also be obtained according to these accompanying drawings
Accompanying drawing.
Fig. 1 is the network architecture schematic diagram that the present invention is provided；
Fig. 2 is the method flow diagram for the quality monitoring that one embodiment of the invention is provided；
Fig. 3 is the method flow diagram for the quality monitoring that another embodiment of the present invention is provided；
Fig. 4 is the method flow diagram for the quality monitoring that another embodiment of the present invention is provided；
Fig. 5 is the method flow diagram for the quality monitoring that another embodiment of the present invention is provided；
Fig. 6 is the structure drawing of device for the quality monitoring that another embodiment of the present invention is provided；
Fig. 7 is the structure drawing of device for the quality monitoring that another embodiment of the present invention is provided；
Fig. 8 is the system construction drawing for the quality monitoring that another embodiment of the present invention is provided；
Fig. 9 is the structure drawing of device for the quality monitoring that another embodiment of the present invention is provided；
Figure 10 is the structure drawing of device for the quality monitoring that another embodiment of the present invention is provided.
Embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing to embodiment party of the present invention
Formula is described in further detail.
The present invention relates to the methods, devices and systems of quality monitoring, it can apply in the network architecture as shown in Figure 1.
Referring to Fig. 1, the network architecture includes：Process equipment S1, server S 2, database S3 and client S4.Wherein, server S 2 is gone back
It can be replaced by Cloud Server S5.Wherein, process equipment S1 refers to that PCB implements the equipment of every process in process,
Including but not limited to：Printing machine equipment, solder paste thickness testing (Solder Paste Inspection, abbreviation：SPI) equipment, patch
Piece machine equipment, stokehold automatic optics inspection (Automatic Optic Inspection, abbreviation：AOI) equipment, reflow ovens are set
AOI equipment, automatic on-line test (In Circuit Tester, abbreviation after standby, stove：ICT) equipment and functional test
(Function Test, referred to as：FT) equipment etc..Server S 2 is used for receiving the various information that process equipment S1 is reported, and
The various information are sent to database S3, database is arranged and stored to these information.Client S4 is used for PCB
Processing quality be monitored, the various information can be obtained from database, and analyzed and utilized, it was therefore concluded that and do
Corresponding processing and control.User can use special-purpose software or Web network accesses to use the client, so as to enter line number
It is investigated that the operation such as seeing and handling.In addition, the various information that process equipment S1 is reported can also be stored in Cloud Server S5, by cloud
Server S 5 is sent to database and is arranged and stored.The various information include but is not limited to：Pictorial information and detection
Information.Wherein, pictorial information refers to the pictorial information that process equipment is obtained after being taken pictures to the PCB of processing, can reflect and work as
When machining state.Detection information refers to the various process datas that process equipment is related to when performing process operation.
Referring to Fig. 2, one embodiment of the invention provides a kind of method of quality monitoring, and for client, this method includes：
101：The pictorial informations of PCB in process are obtained from database.
102：The process for occurring defect is determined according to the pictorial information.
Wherein, the process for occurring defect can be one or more.
103：The detection information of the process is obtained in the database.
104：Analyze the reason for detection information obtains occurring the defect.
Wherein, if multiple process existing defects, then the reason for analysis obtains each defect, and make for every kind of reason
Go out corresponding processing.
Wherein, optionally, the pictorial information of printing board PCB in process is obtained from database, including：
Receive the PCB of user's input index information；
The pictorial informations of the PCB in process are obtained from the database according to the index information；
Wherein, the index information includes bar code, either including bar code and Part Number or including bar code, device
Part is encoded and device position number.
Wherein, optionally, the above method also includes：
Quality control is carried out to the process of the PCB according to the obtained reason.
Wherein, optionally, the above method also includes：
The defect that record is determined in real time；
The defect of display record is checked for user in real time on interface.
In the present embodiment, optionally, the process includes following at least one：
AOI, ICT or FT after printing, SPI, paster, stokehold AOI, reflow ovens welding, stove.
The above method that the present embodiment is provided, obtains the pictorial informations of PCB in process, according to described from database
Pictorial information determines the process for occurring defect, and the detection information of the process is obtained in the database, analyzes the detection
The reason for information obtains occurring the defect, this mode can collect the information of various process equipments and be analyzed and profit
With, realize the quick positioning of quality problems in PCB process, improve the accuracy rate of PCB technology quality monitoring, be easy in time
Handle and control accordingly, can effectively lift PCB product quality.This method is efficient, flexible, extendible, can effectively carry
High organization management efficiency, solves the process quality issue found in actual production, in time backtracking, controls bad source, contracting
The short sawn timber production cycle, and yield, efficiency in the use of funds, the comprehensive production cost of reduction can be effectively improved, bring huge to enterprise
Economy and social benefit.
Referring to Fig. 3, another embodiment of the present invention provides a kind of method of quality monitoring, for server, this method bag
Include：
201：Pictorial information and the detection information of process that reception PCB process equipment is reported in process.
202：The pictorial information and detection information of the PCB are sent to database and stored.
Wherein, the pictorial information is used for the process for determining to occur defect, and the detection information is used to determine occur the defect
Reason.
Wherein, optionally, pictorial information and work that the process equipment of printing board PCB is reported in process are received
The detection information of sequence, including following at least one：
Receive the pictorial information and detection information for the printing that printing machine equipment is reported；
Receive the pictorial information and detection information for the solder paste thickness testing that solder paste thickness testing SPI equipment is reported；
Receive the pictorial information and detection information for the paster that paster machine equipment is reported；
Receive the pictorial information and detection information for the stokehold AOI that stokehold automatic optics inspection AOI equipment is reported；
Receive the pictorial information and detection information for the reflow ovens welding that backflow furnace apparatus is reported；
Receive the pictorial information and detection information of AOI after the stove that AOI equipment is reported after stove；
Receive the pictorial information and detection information for the ICT that automatic on-line testing ICT equipment is reported；
The pictorial information and detection information for the FT that receive capabilities test FT equipment is reported.
Wherein, optionally, the pictorial information and detection information of the PCB are sent to database and stored, including：
The pictorial information and detection information of the PCB are sent to the database so that the Database PCB
Index information and the PCB pictorial information and the corresponding relation of detection information and store the corresponding relation；
Wherein, the index information includes bar code, either including bar code and Part Number or including bar code, device
Part is encoded and device position number.
The above method that the present embodiment is provided, the picture reported in process by receiving PCB process equipment is believed
The detection information of breath and process, the pictorial information and detection information is stored in database, in order to which client is according to the figure
Piece information determines the process for occurring defect, and the reason for determining to occur the defect according to the detection information effectively summarizes various
The information of process equipment is simultaneously analyzed and utilized, and is realized the quick positioning of quality problems in PCB process, is improved
The accuracy rate of PCB technology quality monitoring, is easy to carry out handling and controlling accordingly in time, can effectively lift PCB product quality.
Referring to Fig. 4, another embodiment of the present invention provides a kind of method of quality monitoring, for client, this method bag
Include：
301：Receive the PCB of user's input index information.
302：The pictorial informations of the PCB in process are obtained from the database according to the index information.
Wherein, the index information includes bar code, either including bar code and Part Number or including bar code, device
Part is encoded and device position number.
The bar code can be with one PCB of unique mark.Can there are multiple devices, such as resistance, electric capacity, electricity on one PCB
Sense etc..Part Number can be with identification device, but not uniquely, therefore, passes through the combination of Part Number and device position number
Can be with one device of unique mark.The device position number identifies position of the device on PCB.
303：The process for occurring defect is determined according to the pictorial information.
Further, this method can also comprise the following steps：
The defect that record is determined in real time；
The defect of display record is checked for user in real time on interface.
Wherein, the display format of the defect can have a variety of, include but is not limited to：First-pass yield, ratio of defects, output capacity etc.
Deng, can also temporally, the dimension such as wire body, order of classes or grades at school draws line chart, point diagram etc. to embody, and further divided automatically
Analysis.
304：The detection information of the process is obtained in the database.
Wherein, the detection information of acquisition can be the detection information during being currently processed, i.e., believe in real time
Breath, can also further include the detection information of historical record.
305：Analyze the reason for detection information obtains occurring the defect.
Wherein, when the detection information includes SPI detection data, big data function can be used to be analyzed, than
Such as, by calling conventional detection data, automatically analyze out the printing quality distribution of a certain device, including tin cream height, volume,
Area, skew etc., or CPK, dispersion degree, maximin, average value etc. are analyzed, determine whether abnormity point, processing procedure
Whether data are sufficiently stable, if need optimization etc..
Wherein, when the detection information includes the detection data of chip mounter, big data function can be used to be analyzed,
Such as, automatically analyze out some to fly up to contrast in former crudy performance and present progress, if variant, if
There is trend of deterioration etc., to judge, whether fly up in normal work；Other data can also be analyzed, such as a certain suction nozzle,
A certain material etc., analysis method is identical.
Wherein, when the detection information includes AOI detection data behind stokehold or stove, big data function can be used to enter
Row analysis, such as, the detection data conventional by calling automatically analyze out the paster quality (skew, winged material etc.) of a certain device
Whether the quality of welding spot situation after distribution and CPK, dispersion degree and analysis welding is stablized, and determines whether abnormity point, if need
Optimize.
Analyzed furthermore it is also possible to which history detection information and real-time detection information are combined, count a time
All data in section analyze PCB quality problems or the quality problems of device.The ratio of defects of some device is such as counted, can
With the ratio of defects or overall fault rate of each manufacturer for counting the device, can also by some or several PCB to this
The crudy situation of device does across comparison, analyzes which PCB applies the ratio of defects highest of this device, and find out corresponding
Solution.
306：Quality control is carried out to the process of the PCB according to the obtained reason.
In the present embodiment, optionally, the process includes following at least one：
AOI, ICT or FT after printing, SPI, paster, stokehold AOI, reflow ovens welding, stove.
Wherein, the detection information that printing process is obtained includes but is not limited to：Real-time printing checking picture and printing parameter
Information, such as print speed printing speed, squeegee pressure, wiping pattern and frequency.
The detection information that SPI processes are obtained includes but is not limited to：Real-time tin cream detection picture, the height of tin cream, volume,
Area and skew etc..
The detection information that paster process is obtained includes but is not limited to：Real-time device attachment data, such as paster pressure, absorption
Position, vacuum degree measurement result etc..
The detection information that stokehold AOI processes are obtained includes but is not limited to：Picture, position of device etc. are detected in real time.
The detection information that reflow ovens welding sequence is obtained includes but is not limited to：Picture, the temperature of reflow ovens are detected in real time
Deng.
The detection information that AOI processes are obtained after stove includes but is not limited to：The data that detection picture, device are welded in real time
Deng.
The detection information that ICT processes are obtained includes but is not limited to：Break-make information of device etc..The detection letter that FT processes are obtained
Breath includes but is not limited to：Picture, function information of each device etc. are detected in real time.
The above method that the present embodiment is provided, obtains the pictorial informations of PCB in process, according to described from database
Pictorial information determines the process for occurring defect, and the detection information of the process is obtained in the database, analyzes the detection
The reason for information obtains occurring the defect, this mode can collect the information of various process equipments and be analyzed and profit
With, realize the quick positioning of quality problems in PCB process, improve the accuracy rate of PCB technology quality monitoring, be easy in time
Handle and control accordingly, can effectively lift PCB product quality.
Referring to Fig. 5, another embodiment of the present invention provides a kind of method of quality monitoring, for server, this method bag
Include：
401：Pictorial information and the detection of process that the process equipment of reception printing board PCB is reported in process
Information.
Wherein, the pictorial information is used for the process for determining to occur defect, and the detection information is used to determine occur the defect
Reason.
402：The pictorial information and detection information of the PCB are sent to database.
403：Database is received after the pictorial information and detection information of the PCB, sets up the index information and the PCB of the PCB
Pictorial information and detection information corresponding relation and store the corresponding relation.
Wherein, the index information includes bar code, either including bar code and Part Number or including bar code, device
Part is encoded and device position number.
In the present embodiment, optionally, the picture that the process equipment of the reception printing board PCB is reported in process
The detection information of information and process, including following at least one：
Receive the pictorial information and detection information for the printing that printing machine equipment is reported；
Receive the pictorial information and detection information for the solder paste thickness testing that solder paste thickness testing SPI equipment is reported；
Receive the pictorial information and detection information for the paster that paster machine equipment is reported；
Receive the pictorial information and detection information for the stokehold AOI that stokehold automatic optics inspection AOI equipment is reported；
Receive the pictorial information and detection information for the reflow ovens welding that backflow furnace apparatus is reported；
Receive the pictorial information and detection information of AOI after the stove that AOI equipment is reported after stove；
Receive the pictorial information and detection information for the ICT that automatic on-line testing ICT equipment is reported；
The pictorial information and detection information for the FT that receive capabilities test FT equipment is reported.
Wherein, when PCB enters printing machine equipment, the printing machine equipment can scan the bar code on PCB, carry out standard
Printing is acted, and generates the real-time parameter information of current PC B printings, is uploaded onto the server.
When PCB enters SPI equipment, the SPI equipment can scan the bar code on PCB, carry out standard SPI detections dynamic
Make, the real-time detection information of tin cream of all pads and detection picture, upload onto the server on generation current PC B.
When PCB enters paster machine equipment, paster machine equipment can scan the bar code on PCB, carry out Standard patch and move
Make, generation current PC B mounts parameter information in real time, and uploads onto the server.
When PCB enters stokehold AOI equipment, stokehold AOI equipment can scan the bar code on PCB, carry out standard AOI
The real-time detection information and detection picture of all devices, upload onto the server on detection operation, generation current PC B.
When PCB enters reflow ovens, the reflow ovens can scan the bar code on PCB, carry out the reflow soldering of standard, raw
Real time temperature information on detection picture and current PC B, uploads onto the server.
When PCB enters AOI equipment after stove, AOI equipment can scan the bar code on PCB after the stove, carry out standard AOI
The real-time detection information and detection picture of all devices, upload onto the server on detection operation, generation current PC B.
When PCB enters ICT equipment, the ICT equipment can scan the bar code on PCB, carry out standard ICT tests dynamic
Make, when ICT detects defect, record the corresponding detection information of each defect and detection picture, upload onto the server.
When PCB enters FT equipment, the FT equipment can scan the bar code on PCB, carry out standard FT test actions,
When FT detects defect, the corresponding detection information of each defect and detection picture are recorded, is uploaded onto the server.
The above method that the present embodiment is provided, the picture reported in process by receiving PCB process equipment is believed
The detection information of breath and process, the pictorial information and detection information is stored in database, in order to which client is according to the figure
Piece information determines the process for occurring defect, and the reason for determining to occur the defect according to the detection information effectively summarizes various
The information of process equipment is simultaneously analyzed and utilized, and is realized the quick positioning of quality problems in PCB process, is improved
The accuracy rate of PCB technology quality monitoring, is easy to carry out handling and controlling accordingly in time, can effectively lift PCB product quality.
Referring to Fig. 6, another embodiment of the present invention provides a kind of device of quality monitoring, for client, the device bag
Include：
First acquisition module 61, for obtaining the pictorial information of printing board PCB in process from database；
Determining module 62, the process for being determined to occur defect according to the pictorial information；
Second acquisition module 63, the detection information for obtaining the process in the database；
Analysis module 64, for analyzing the reason for detection information obtains occurring the defect.
In the present embodiment, optionally, the first acquisition module 61 includes：
Receiving unit, the index information of the PCB for receiving user's input；
First acquisition unit, for obtaining the figures of the PCB in process from the database according to the index information
Piece information；
Wherein, the index information includes bar code, either including bar code and Part Number or including bar code, device
Part is encoded and device position number.
In the present embodiment, optionally, the device also includes：
Control module, for carrying out quality control to the process of the PCB according to the obtained reason.
In the present embodiment, optionally, the device also includes：
Logging modle, for recording the defect determined in real time；
Display module, for the defect of display record to be checked for user in real time on interface.
In the present embodiment, optionally, the process includes following at least one：
It is printing, solder paste thickness testing SPI, paster, stokehold automatic optics inspection AOI, reflow ovens welding, AOI after stove, automatic
On-line testing ICT or functional test FT.
The said apparatus that the present embodiment is provided can perform the method provided in any of the above-described client approach embodiment, in detail
The description that thin process is shown in embodiment of the method, is not repeated herein.
The said apparatus that the present embodiment is provided, obtains the pictorial informations of PCB in process, according to described from database
Pictorial information determines the process for occurring defect, and the detection information of the process is obtained in the database, analyzes the detection
The reason for information obtains occurring the defect, this mode can collect the information of various process equipments and be analyzed and profit
With, realize the quick positioning of quality problems in PCB process, improve the accuracy rate of PCB technology quality monitoring, be easy in time
Handle and control accordingly, can effectively lift PCB product quality.The device is efficient, flexible, extendible, can effectively carry
High organization management efficiency, solves the process quality issue found in actual production, in time backtracking, controls bad source, contracting
The short sawn timber production cycle, and yield, efficiency in the use of funds, the comprehensive production cost of reduction can be effectively improved, bring huge to enterprise
Economy and social benefit.
Referring to Fig. 7, another embodiment of the present invention provides a kind of device of quality monitoring, for server, the device bag
Include：
Receiving module 71, for receiving the pictorial information that the process equipment of printing board PCB is reported in process
With the detection information of process；
Sending module 72, is stored for the pictorial information and detection information of the PCB to be sent to database；
Wherein, the pictorial information is used for the process for determining to occur defect, and the detection information is used to determine occur the defect
Reason.
In the present embodiment, optionally, the receiving module 71 includes following at least one：
First receiving unit, pictorial information and detection information for receiving the printing that printing machine equipment is reported；
Second receiving unit, the pictorial information for receiving the solder paste thickness testing that solder paste thickness testing SPI equipment is reported
And detection information；
3rd receiving unit, pictorial information and detection information for receiving the paster that paster machine equipment is reported；
4th receiving unit, for receive the stokehold AOI that stokehold automatic optics inspection AOI equipment is reported pictorial information and
Detection information；
5th receiving unit, pictorial information and detection information for receiving the reflow ovens welding that backflow furnace apparatus is reported；
6th receiving unit, pictorial information and detection information for receiving AOI after the stove that AOI equipment is reported after stove；
7th receiving unit, pictorial information and detection for receiving the ICT that automatic on-line testing ICT equipment is reported are believed
Breath；
8th receiving unit, the pictorial information and detection information for the FT that FT equipment is reported are tested for receive capabilities.
In the present embodiment, optionally, the sending module 72 includes：
Transmitting element, for the pictorial information and detection information of the PCB to be sent into the database so that the number
The corresponding relation of the index information of the PCB and the pictorial information of the PCB and detection information is set up according to storehouse and stores the corresponding relation；
Wherein, the index information includes bar code, either including bar code and Part Number or including bar code, device
Part is encoded and device position number.
The said apparatus that the present embodiment is provided can perform the method provided in any of the above-described player method embodiment, in detail
The description that thin process is shown in embodiment of the method, is not repeated herein.
The said apparatus that the present embodiment is provided, the picture reported in process by receiving PCB process equipment is believed
The detection information of breath and process, the pictorial information and detection information is stored in database, in order to which client is according to the figure
Piece information determines the process for occurring defect, and the reason for determining to occur the defect according to the detection information effectively summarizes various
The information of process equipment is simultaneously analyzed and utilized, and is realized the quick positioning of quality problems in PCB process, is improved
The accuracy rate of PCB technology quality monitoring, is easy to carry out handling and controlling accordingly in time, can effectively lift PCB product quality.
Referring to Fig. 8, another embodiment of the present invention provides a kind of system of quality monitoring, including：Implementation as shown in Figure 6
The device 82 for the quality monitoring that the device 81 for the quality monitoring that example is provided and embodiment as shown in Figure 7 are provided.
Wherein, the device 81 of the quality monitoring can apply in client, function and retouching in the embodiment shown in Fig. 6
State identical, the device 82 of the quality monitoring can apply in server, function and the description phase in the embodiment shown in Fig. 7
Together, do not repeat herein.
The said system that the present embodiment is provided, obtains the pictorial informations of PCB in process, according to described from database
Pictorial information determines the process for occurring defect, and the detection information of the process is obtained in the database, analyzes the detection
The reason for information obtains occurring the defect, this mode can collect the information of various process equipments and be analyzed and profit
With, realize the quick positioning of quality problems in PCB process, improve the accuracy rate of PCB technology quality monitoring, be easy in time
Handle and control accordingly, can effectively lift PCB product quality.The system high efficiency, it is flexible, extendible, can effectively carry
High organization management efficiency, solves the process quality issue found in actual production, in time backtracking, controls bad source, contracting
The short sawn timber production cycle, and yield, efficiency in the use of funds, the comprehensive production cost of reduction can be effectively improved, bring huge to enterprise
Economy and social benefit.
Referring to Fig. 9, a kind of device of quality monitoring is present embodiments provided, including：
Receiver 91, for obtaining the pictorial information of printing board PCB in process from database；
Processor 92, the process for being determined to occur defect according to the pictorial information；
The receiver 91, is additionally operable to obtain the detection information of the process in the database；
The processor 92, is additionally operable to analyze the reason for detection information obtains occurring the defect.
Wherein, optionally, the receiver is used for：
Receive the PCB of user's input index information；
The pictorial informations of the PCB in process are obtained from the database according to the index information；
Wherein, the index information include bar code, either including bar code and Part Number or including bar code,
Part Number and device position number.
Wherein, optionally, the processor 92 is additionally operable to：
Quality control is carried out to the process of the PCB according to the obtained reason.
Wherein, optionally, the processor 92 is additionally operable to：
The defect that record is determined in real time；
The defect of display record is checked for user in real time on interface.
Wherein, optionally, the process includes following at least one：
It is printing, solder paste thickness testing SPI, paster, stokehold automatic optics inspection AOI, reflow ovens welding, AOI after stove, automatic
On-line testing ICT or functional test FT.
The said apparatus that the present embodiment is provided, obtains the pictorial informations of PCB in process, according to described from database
Pictorial information determines the process for occurring defect, and the detection information of the process is obtained in the database, analyzes the detection
The reason for information obtains occurring the defect, this mode can collect the information of various process equipments and be analyzed and profit
With, realize the quick positioning of quality problems in PCB process, improve the accuracy rate of PCB technology quality monitoring, be easy in time
Handle and control accordingly, can effectively lift PCB product quality.
Referring to Figure 10, a kind of device of quality monitoring is present embodiments provided, including：
Receiver 1001, for receiving the pictorial information that the process equipment of printing board PCB is reported in process
With the detection information of process；
Emitter 1002, is stored for the pictorial information and detection information of the PCB to be sent to database；
Wherein, the pictorial information is used for the process for determining to occur defect, and the detection information occurs described for determination
The reason for defect.
In the present embodiment, optionally, the function of the receiver includes following at least one：
Pictorial information and detection information for receiving the printing that printing machine equipment is reported；
Pictorial information and detection information for receiving the solder paste thickness testing that solder paste thickness testing SPI equipment is reported；
Pictorial information and detection information for receiving the paster that paster machine equipment is reported；
Pictorial information and detection information for receiving the stokehold AOI that stokehold automatic optics inspection AOI equipment is reported；
Pictorial information and detection information for receiving the reflow ovens welding that backflow furnace apparatus is reported；
Pictorial information and detection information for receiving AOI after the stove that AOI equipment is reported after stove；
Pictorial information and detection information for receiving the ICT that automatic on-line testing ICT equipment is reported；
The pictorial information and detection information for the FT that FT equipment is reported are tested for receive capabilities.
In the present embodiment, optionally, the emitter is used for：
The pictorial information and detection information of the PCB are sent to the database so that described in the Database
The corresponding relation of PCB index information and the PCB pictorial information and detection information simultaneously stores the corresponding relation；
Wherein, the index information include bar code, either including bar code and Part Number or including bar code,
Part Number and device position number.
The said apparatus that the present embodiment is provided, the picture reported in process by receiving PCB process equipment is believed
The detection information of breath and process, the pictorial information and detection information is stored in database, in order to which client is according to the figure
Piece information determines the process for occurring defect, and the reason for determining to occur the defect according to the detection information effectively summarizes various
The information of process equipment is simultaneously analyzed and utilized, and is realized the quick positioning of quality problems in PCB process, is improved
The accuracy rate of PCB technology quality monitoring, is easy to carry out handling and controlling accordingly in time, can effectively lift PCB product quality.
One of ordinary skill in the art will appreciate that realizing that all or part of step of above-described embodiment can be by hardware
To complete, the hardware of correlation can also be instructed to complete by program, described program can be stored in a kind of computer-readable
In storage medium, storage medium mentioned above can be read-only storage, disk or CD etc..
The foregoing is only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all the present invention spirit and
Within principle, any modification, equivalent substitution and improvements made etc. should be included in the scope of the protection.
Claims (17)
1. a kind of method of quality monitoring, it is characterised in that methods described includes：
The pictorial information of printing board PCB in process is obtained from database；
The process for occurring defect is determined according to the pictorial information；
Obtain the detection information of the process in the database, the detection information of the process is process equipment to described
PCB performs the process data during process；
Analyze the reason for detection information obtains occurring the defect.
2. according to the method described in claim 1, it is characterised in that described to obtain printing board PCB in processing from database
During pictorial information, including：
Receive the PCB of user's input index information；
The pictorial informations of the PCB in process are obtained from the database according to the index information；
Wherein, the index information includes bar code, either including bar code and Part Number or including bar code, device
Coding and device position number.
3. according to the method described in claim 1, it is characterised in that methods described also includes：
Quality control is carried out to the process of the PCB according to the obtained reason.
4. according to the method described in claim 1, it is characterised in that methods described also includes：
The defect that record is determined in real time；
The defect of display record is checked for user in real time on interface.
5. according to the method described in claim 1, it is characterised in that the process includes following at least one：
AOI, automatic on-line after printing, solder paste thickness testing SPI, paster, stokehold automatic optics inspection AOI, reflow ovens welding, stove
Test ICT or functional test FT.
6. a kind of method of quality monitoring, it is characterised in that methods described includes：
Pictorial information and the detection information of process that the process equipment of reception printing board PCB is reported in process；
The pictorial information and detection information of the PCB are sent to database and stored；
Wherein, the pictorial information is used for the process for determining to occur defect, and the detection information is used to determine occur the defect
The reason for.
7. method according to claim 6, it is characterised in that the process equipment of the reception printing board PCB is adding
The pictorial information and the detection information of process reported during work, including following at least one：
Receive the pictorial information and detection information for the printing that printing machine equipment is reported；
Receive the pictorial information and detection information for the solder paste thickness testing that solder paste thickness testing SPI equipment is reported；
Receive the pictorial information and detection information for the paster that paster machine equipment is reported；
Receive the pictorial information and detection information for the stokehold AOI that stokehold automatic optics inspection AOI equipment is reported；
Receive the pictorial information and detection information for the reflow ovens welding that backflow furnace apparatus is reported；
Receive the pictorial information and detection information of AOI after the stove that AOI equipment is reported after stove；
Receive the pictorial information and detection information for the ICT that automatic on-line testing ICT equipment is reported；
The pictorial information and detection information for the FT that receive capabilities test FT equipment is reported.
8. method according to claim 6, it is characterised in that described to send out the pictorial information of the PCB and detection information
Database is delivered to be stored, including：
The pictorial information and detection information of the PCB are sent to the database so that PCB described in the Database
The corresponding relation of index information and the PCB pictorial information and detection information simultaneously stores the corresponding relation；
Wherein, the index information includes bar code, either including bar code and Part Number or including bar code, device
Coding and device position number.
9. a kind of device of quality monitoring, it is characterised in that described device includes：
First acquisition module, for obtaining the pictorial information of printing board PCB in process from database；
Determining module, the process for being determined to occur defect according to the pictorial information；
Second acquisition module, the detection information for obtaining the process in the database, the detection information of the process
For process data of the process equipment when performing the process to the PCB；
Analysis module, for analyzing the reason for detection information obtains occurring the defect.
10. device according to claim 9, it is characterised in that first acquisition module includes：
Receiving unit, the index information of the PCB for receiving user's input；
First acquisition unit, for obtaining the PCB from the database in process according to the index information
Pictorial information；
Wherein, the index information includes bar code, either including bar code and Part Number or including bar code, device
Coding and device position number.
11. device according to claim 9, it is characterised in that described device also includes：
Control module, for carrying out quality control to the process of the PCB according to the obtained reason.
12. device according to claim 9, it is characterised in that described device also includes：
Logging modle, for recording the defect determined in real time；
Display module, for the defect of display record to be checked for user in real time on interface.
13. device according to claim 9, it is characterised in that the process includes following at least one：
AOI, automatic on-line after printing, solder paste thickness testing SPI, paster, stokehold automatic optics inspection AOI, reflow ovens welding, stove
Test ICT or functional test FT.
14. a kind of device of quality monitoring, it is characterised in that described device includes：
Receiving module, for receiving pictorial information and the process that the process equipment of printing board PCB is reported in process
Detection information；
Sending module, is stored for the pictorial information and detection information of the PCB to be sent to database；
Wherein, the pictorial information is used for the process for determining to occur defect, and the detection information is used to determine occur the defect
The reason for.
15. device according to claim 14, it is characterised in that the receiving module includes following at least one：
First receiving unit, pictorial information and detection information for receiving the printing that printing machine equipment is reported；
Second receiving unit, pictorial information and inspection for receiving the solder paste thickness testing that solder paste thickness testing SPI equipment is reported
Measurement information；
3rd receiving unit, pictorial information and detection information for receiving the paster that paster machine equipment is reported；
4th receiving unit, pictorial information and detection for receiving the stokehold AOI that stokehold automatic optics inspection AOI equipment is reported
Information；
5th receiving unit, pictorial information and detection information for receiving the reflow ovens welding that backflow furnace apparatus is reported；
6th receiving unit, pictorial information and detection information for receiving AOI after the stove that AOI equipment is reported after stove；
7th receiving unit, pictorial information and detection information for receiving the ICT that automatic on-line testing ICT equipment is reported；
8th receiving unit, the pictorial information and detection information for the FT that FT equipment is reported are tested for receive capabilities.
16. device according to claim 14, it is characterised in that the sending module includes：
Transmitting element, for the pictorial information and detection information of the PCB to be sent into the database so that the database
Set up the index information of the PCB and the pictorial information of the PCB and the corresponding relation of detection information and store described corresponding close
System；
Wherein, the index information includes bar code, either including bar code and Part Number or including bar code, device
Coding and device position number.
17. a kind of system of quality monitoring, it is characterised in that the system includes：As any one of claim 9-13
Device and the device as any one of claim 14-16.
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| CN201510118269.4A CN104765344B (en) | 2015-03-18 | 2015-03-18 | The methods, devices and systems of quality monitoring |
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| CN201510118269.4A CN104765344B (en) | 2015-03-18 | 2015-03-18 | The methods, devices and systems of quality monitoring |
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| CN106079892B (en) * | 2016-07-12 | 2019-01-25 | 重庆大学 | A kind of PCB paste solder printing procedure quality intelligent monitor system and method |
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| CN108037739A (en) * | 2017-11-09 | 2018-05-15 | 广州兴森快捷电路科技有限公司 | The process management and control method and system of PCB product |
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| CN108882550A (en) * | 2018-08-27 | 2018-11-23 | 郑州云海信息技术有限公司 | A method of it improving PCBA and manufactures AOI yield |
| CN109693459B (en) * | 2018-12-25 | 2021-01-19 | 深圳和而泰数据资源与云技术有限公司 | Information processing method and device |
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| CN112444678B (en) * | 2019-09-02 | 2022-11-22 | 深南电路股份有限公司 | Monitoring method, monitoring system and device for insertion loss of PCB (printed circuit board) |
| CN112584694B (en) * | 2020-12-28 | 2022-05-13 | 雅达电子(罗定)有限公司 | Screening and isolating method for surface mounting defective products |
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