CN107942978A - A kind of Intelligent closed-loop system - Google Patents
A kind of Intelligent closed-loop system Download PDFInfo
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- CN107942978A CN107942978A CN201711181527.9A CN201711181527A CN107942978A CN 107942978 A CN107942978 A CN 107942978A CN 201711181527 A CN201711181527 A CN 201711181527A CN 107942978 A CN107942978 A CN 107942978A
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32252—Scheduling production, machining, job shop
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
The embodiment of the present application discloses a kind of Intelligent closed-loop system, for automatic identification workpiece, defect, and adjust automatically process equipment.Intelligent closed-loop system in the application includes：Process equipment, for being processed to material；Detection device, for detecting the material by process equipment processing, obtains testing result；Data analytics server, for analyzing the testing result according to preset process logic, obtains analysis result, and instructed to the process equipment feedback adjustment according to the analysis result so that the process equipment is adjusted according to the adjust instruction.
Description
Technical field
This application involves closed-loop system field, more particularly to a kind of Intelligent closed-loop system.
Background technology
As the technologies such as Internet of Things/cloud computing are promoted to every profession and trade depth, the development of the Backbone Communication device bandwidth such as router
Speed surmounts Moore's Law, and the difference of complete machine-line card-key chip module-links speed development gradually widens, it is necessary to passes through veneer
Level stacks more chips to meet that the multiplication demand of line card capacity, high density/high sophisticated electronic Assembly etc. becomes key
Technology, such as high T grades of line card solder joint numbers of complexity become normality (conventional veneer solder joint number 10K-30K) more than 100K, and constantly challenge
" the complexity limit ".
Under high complicated veneer " 100K+ grade solder joint numbers " magnitude, it is difficult to establish process quality issue multiple-factor associate because
Fruit relation, due to a lack of the detailed record of whole line process management and control, the related question point in design, supplied materials, technical process fluctuation
And shortage, often flooded by solder joint complexity.
In the prior art, it is by site technology people after each operation such as printing, patch, Reflow Soldering detection device detection defect
Member's rule of thumb adjusting process parameter, can not achieve process control specification the closed-loop optimization in statistical significance；Sentence at scene
It is completely cured according to having occurred the presentation of problem and the experience of engineer, (using personal experience as Main Basiss) the reason for decision problem, leads
Cause the evidence that judges single, if be problem root it is inaccurate because holding, problem repeats, and live machining state is not remembered
Record, data flow missing；It can not in time feed back, the inducements such as equipment variation, process variation, device quality fluctuation can not be carried out in real time
Intercept.
The content of the invention
The embodiment of the present application provides a kind of Intelligent closed-loop system, and for automatic identification workpiece, defect, and adjust automatically adds
Construction equipment.
The first aspect of the embodiment of the present application provides a kind of Intelligent closed-loop system, and the Intelligent closed-loop system in the application is one
The self-correction of kind more equipment linkages, fill contact system from closed loop smart electronics, including dress connection equipment room data interchange, data acquisition and
More equipment room coordinated signals etc., process unit from closed-loop control by detection device and automated execution closed loop act；By personnel's technical ability
Experience is implanted into closed loop process logical algorithm through software definition, according to the characteristic and rule of each operation difference defect type, big data
Algorithm difference inter process defective effect factor, recommends optimal engineering parameter, specifically includes：
Process equipment, for being processed to material；
Detection device, for detecting the material by process equipment processing, obtains testing result；
Data analytics server, for analyzing the testing result according to preset process logic, obtains analysis result, and
Instructed according to the analysis result to the process equipment feedback adjustment so that the process equipment according to the adjust instruction into
Row adjustment.
Process equipment, detection device, data analytics server in the present embodiment form micro- closed loop, can be with automatic identification work
Part defect, and adjust automatically process equipment.
In a kind of possible design, in the first implementation of the embodiment of the present application first aspect, the data
Analysis server is additionally operable to according to N number of testing result, realizes workpiece, defect positioning and process equipment linkage calibration,
The N is the integer more than 1.Intelligent closed-loop system in the embodiment of the present application can also realize N points between multiple operation according to and with
And defect is self-positioning, auto-associating analysis so that it is more accurate that defective locations judge.
In a kind of possible design, in second of implementation of the embodiment of the present application first aspect, the processing
Equipment include printing equipment, patch device, reflux furnace apparatus, plug-in component equipment, Wave soldering apparatus, crimping apparatus, assembly equipment and
Online temperature follows equipment.The present embodiment specifically illustrates the species of process equipment, increases the realizability of embodiment.
In a kind of possible design, in the third implementation of the embodiment of the present application first aspect, the detection
Equipment includes AOI equipment, automatic X-ray detection after paste solder printing detection SPI equipment, stokehold automatic visual inspection AOI equipment, stove
AXI equipment, on-line checking ICT equipment, functional test FT equipment.The present embodiment specifically illustrates the species of detection device, increase
The realizability of embodiment.
In a kind of possible design, in the 4th kind of implementation of the embodiment of the present application first aspect, the intelligence
Closed-loop system includes first micro- closed loop, second micro- closed loop, the 3rd micro- closed loop, the 4th micro- closed loop, the 5th micro- closed loop, the 6th micro- closed loop
With the 7th micro- closed loop, first micro- closed loop includes the printing equipment and institute's SPI equipment, and second micro- closed loop includes described
SPI equipment and the patch device, the 3rd micro- closed loop include the patch device and the stokehold AOI equipment, and described
Four micro- closed loops are included described in the AOI equipment of stokehold and the reflux furnace apparatus, the 5th micro- closed loop include the reflux furnace apparatus
With AOI equipment after the stove, the 6th micro- closed loop include the plug-in component equipment, the Wave soldering apparatus, the crimping apparatus,
The ICT equipment and the assembly equipment, the 7th micro- closed loop includes the FT equipment and the online temperature follows equipment.This reality
The multiple micro- closed loops being had been described in detail in example in Intelligent closed-loop system are applied, add the integrality of embodiment.
In a kind of possible design, in the 5th kind of implementation of the embodiment of the present application first aspect, the data
Analysis server includes：
Comparing unit, for the testing result and preset master pattern to be compared, draws comparison result；
Analytic unit, for analyzing the comparison result according to the process logic, is adjusted instruction；
Feedback unit, for feeding back the adjust instruction to the process equipment.
The present embodiment refines data analysis unit, enriches the specific implementation means of embodiment.
In a kind of possible design, in the 6th kind of implementation of the embodiment of the present application first aspect, the processing
Equipment includes：
First recognition unit, for identifying the identity information on the material；
Unit is processed, for being processed to the material.
The present embodiment refines data process equipment, enriches the specific implementation means of embodiment.
In a kind of possible design, in the 7th kind of implementation of the embodiment of the present application first aspect, the detection
Equipment includes：
Second recognition unit, for identifying the identity information of the material；
Detection unit, for detecting the material, obtains testing result.
The present embodiment refines data-detection apparatus, enriches the specific implementation means of embodiment.
In a kind of possible design, in the 8th kind of implementation of the embodiment of the present application first aspect, the intelligence
Closed-loop system further includes：
Display device, for showing the testing result and/or the analysis result.
The present embodiment has added display device so that staff can intuitively check testing result and/or analysis knot
Fruit.
In a kind of possible design, in the 8th kind of implementation of the embodiment of the present application first aspect, the detection
As a result the pictorial information of the real-time detection information including the material and the material.
The present embodiment specifically illustrates the type of testing result, adds the operability of embodiment.
Brief description of the drawings
Fig. 1 is one embodiment schematic diagram of the Intelligent closed-loop system in the embodiment of the present application；
Fig. 2 be in the Intelligent closed-loop system in the embodiment of the present application printing equipment and SPI equipment from closed loop logic control
Schematic diagram；
Fig. 3 be in the Intelligent closed-loop system in the embodiment of the present application SPI equipment and patch device from closed loop logic control
Schematic diagram；
Fig. 4 be in the Intelligent closed-loop system in the embodiment of the present application patch device and stokehold AOI equipment from closed loop logic
Control schematic diagram；
Fig. 5 is Optimizing Flow schematic diagram in the Intelligent closed-loop system in the embodiment of the present application；
Fig. 6 is another embodiment schematic diagram of the Intelligent closed-loop system in the embodiment of the present application；
Fig. 7 is another embodiment schematic diagram of the Intelligent closed-loop system in the embodiment of the present application；
Fig. 8 compares figure for the solder joint of the application and the prior art；
Fig. 9 is another embodiment schematic diagram of the Intelligent closed-loop system in the embodiment of the present application；
Figure 10 is another embodiment schematic diagram of the Intelligent closed-loop system in the embodiment of the present application.
Embodiment
The embodiment of the present application provides a kind of Intelligent closed-loop system, and for automatic identification workpiece, defect, and adjust automatically adds
Construction equipment.
Term " first ", " second ", " the 3rd " in the description and claims of this application and above-mentioned attached drawing, "
The (if present)s such as four " are for distinguishing similar object, without for describing specific order or precedence.It should manage
The data that solution so uses can exchange in the appropriate case, so that the embodiments described herein can be with except illustrating herein
Or the order beyond the content of description is implemented.In addition, term " comprising " and " having " and their any deformation, it is intended that
Cover it is non-exclusive include, for example, containing the process of series of steps or unit, method, system, product or equipment need not limit
In those steps or unit for clearly listing, but may include not list clearly or for these processes, method, production
The intrinsic other steps of product or equipment or unit.
The Key Term of the application is explained first：
Closed loop：Based on feedback, target drives, it self could evolve, adapt to multiple-factor disturbance and change, flow is inputted to defeated
The influence gone out is not often linear.
Soldering paste：The paste mixture being made of solder powder, solder flux, solvent and additive.
Solder joint：The binding site connected between component and circuit board with welding method.It includes solder and is connected
Socket part position.
Printing：Soldering paste or Heraeus are put on using printing process the work of specific location on circuit board in circuit assembly
Sequence.
Patch：The process for picking up component and the specific location being placed with onto circuit board in plate level dress connection from loader.
It can be manual, semi- or fully automated operation.
Reflow Soldering：The paste solder being previously applied to by fusing in board pads, realizes that component (is usually
Surface Mount Component) room machine and the solder of electrical connection of welding end or pin with pad.
Wave-soldering：By the solder of fusing, through electrodynamic pump or electromagnetic pump jet flow into the solder wave of design requirement, make pre-
The printed board of component is first inserted or is pasted with by solder wave, realize component welding end or pin and pad room machine and
The solder of electrical connection.
Crimping：It is not required to, using welding, directly be pressed into component down-lead pressure mechanism in printed board in advance specially during dress connection
So as to fulfill the method mechanically and electrically interconnected in the hole of door design.
Scraper：Relative to stencil angled installation for the sheet metal that scrapes.
Scraper pressure：Scraper head is applied downwardly to total power in printed board；
PCB：Printed circuit board, containing the printed element or printed wiring to be formed by being pre-designed and
The printed board for the conductive pattern that both combine；
Paste solder printing detects (Solder Printing Inspection, SPI)；
Automatic visual inspection (automated optical inspection, AOI)；
Automatic X-ray examination (automated x ray inspection, AXI)；
On-line testing (in-circuit test, ICT)；
Functional test (functional test, FT).
The Intelligent closed-loop system of the application, can realize that high quality is manufactured by establishing Digitized Closed Loop manufacture system, people
Work, it is semi-automatic to full-automation change, the influence of people is reduced to it is minimum, realize parameters numberization measure；Realize printing, patch
The partial function automated closed-loop management and control of the multiple processes of the circuit assemblies such as piece, reflux, assembling, test, realizes the optimal weldering of processing quality
Point；Lifted circuit assembly defect online can interception rate, realize that the points of the N between the multiple operation such as SPI+AOI+ICT shine and ＆ defects are made by oneself
Position, and auto-associating analysis, the system include：Process equipment, for being processed to material；Detection device, for examining
The material by process equipment processing is surveyed, obtains testing result；Data analytics server, for according to preset process logic point
Analyse testing result, obtain analysis result, and instructed according to analysis result to process equipment feedback adjustment so that process equipment according to
Adjust instruction is adjusted.Wherein, process equipment includes printing equipment, patch device, reflux furnace apparatus, plug-in component equipment, wave crest
Soldering equipment, crimping apparatus, assembly equipment and online temperature follow equipment.Detection device includes paste solder printing detection SPI equipment, stokehold certainly
AOI equipment, automatic X-ray detection AXI equipment, on-line checking ICT equipment, functional test FT after dynamic optical check AOI equipment, stove
Equipment.It should be noted that process equipment and detection device can also include other equipment, do not limit herein specifically.
Referring to Fig. 1, Fig. 1 is one embodiment schematic diagram of the Intelligent closed-loop system in the embodiment of the present application.
The Intelligent closed-loop system includes multiple micro- closed loops, wherein, first micro- closed loop includes printing equipment 101 and SPI equipment
102, second micro- closed loop includes SPI equipment 102 and patch device 103, and the 3rd micro- closed loop includes patch device 103 and stokehold AOI
Equipment 104, the 4th micro- closed loop include stokehold AOI equipment 104 and reflux furnace apparatus 105, and the 5th micro- closed loop includes reflux furnace apparatus
105 and stove after AOI equipment 106, the 6th micro- closed loop includes plug-in component equipment 108, Wave soldering apparatus 109, crimping apparatus 110, ICT are set
Standby 111 and assembly equipment 112, the 7th micro- closed loop includes FT equipment 113 and online temperature follows equipment 114.Within the system, more equipment
The self-correction of linkage, is implanted into closed loop process logical algorithm, process logic is the core of closed-loop system, wherein technique by the experience of people
In logic embedding data Analysis server 115；The application by detection unit from closed-loop control processing unit, automated execution closed loop
Action, (is improved) without manpower intervention based on fluctuation analysis and known defect；Process logic algorithm source technical research result
With process big data analysis；The application by processing the analyses of bad Y=f (X1, X2, X3) data, the foundation of model, from
Dynamic identification risk, and return and confirm bad defect, Early-warning Model is continued to optimize until optimal.
The mentality of designing of process logic is to ensure processing quality result in a relatively steady state by various methods
In window ranges, the process stability logical design of procedure for processing can also be called, including monitor, analyze, correcting three rings
Section.Process logic closed-loop policy flow：
1st, to be composed the defects of each detection device as entrance, such as：
Printing defects：Few tin, even more tin, tin, off normal；
Patch defect：Patch is inclined, set up a monument, flies material；
Weld defect：Few tin, even tin, off normal；
2nd, for each defect, the possibility of its producing cause, or the weight of factor of influence are analyzed, such as：
The few tin possible cause of printing；
Patch off normal possible cause；
3rd, these possible causes are investigated one by one, are presented in the form of score value, fraction is higher, and the possibility that represents is bigger, such as：
The few tin of printing may be because that steel mesh plug-hole causes：X points；
The few tin of printing may be because that parameter setting causes extremely：Y points；
4th, certain possible cause of integrated judgment, provides unique consequence and is pushed to process equipment, optimizes action, if result
Uniquely related technical personnel are not pushed to then manually to judge.
The function of various closed loops is described below：
102 process closed loop of printing equipment 101+SPI equipment：Printing quality inspection data is analyzed by SPI equipment 102,
101 parameter of adjust automatically printing equipment narrows print process of tin window, reaches consistent sex expression optimum state, and to data message at
Reason is stored.
103 process closed loop of SPI equipment 102+ patch devices：Establish micro- closed loop between patch device 103 and patch device 103
Logic, realizes that the adjustment patch location instruction drawn by SPI data analyses adjusts patch coordinate in real time, reduces failure welding.
104 process closed loop of patch device 103+ stokeholds AOI equipment：The adjustment patch location drawn by AOI data analyses refers to
Order adjusts patch coordinate in real time, lifts welding quality.
Stokehold AOI equipment 104+ reflux 105 process closed loops of furnace apparatus：By installing 26 additional on reflux furnace apparatus 105
The parameters such as temperature, track vibration, rotation speed of the fan, chain speed fluctuation are monitored in real time sensor and data acquisition, to every money list
Plate establishes Optimal Temperature data model, opens data when monitoring and gather every veneer reflux in real time and is analyzed, contrasted, real
Dynamic self-calibration in existing process.
Whole line multiple spot shines conjunction+defect self aligning system：By to preceding operation printing SPI equipment 102+ patch devices 103, stove
View data in micro- closed loops such as preceding AOI equipment 104+ reflux furnace apparatus 105 and printing, patch, 105 parameter of reflux furnace apparatus,
Material information and MES system association carry out information processing, and result is exported same interface and carries out display comparison, realize and lack
Fall into fast positioning and linkage self calibration.
In order to make it easy to understand, the Intelligent closed-loop system of the application is described with reference to concrete application embodiment：
When printing board PCB enters circuit assembly equipment printing equipment 101 by track, the bar shaped on PCB is scanned
Code；Printing equipment 101 performs standard printing action, record scraper pressure/speed, steel mesh stripping room away from etc. process parameter,
Veneer printing real-time parameter information is generated in database and uploads to data analytics server 115；Set when PCB enters SPI
When standby 102, the bar code on PCB is scanned；Then standard SPI detection operations are carried out, are generated in SPI databases on current PC B
The real-time detection information of tin cream and detection picture of all pads；When SPI equipment 102 has detected PCB1, by all test datas
Pass in data analytics server 115 and judge according to the analysis for being set for process stability of monitored object；The result of judgement
The Agent of printing equipment 101 is pushed to, Agent sends command adapted thereto according to result to printing equipment 101, after instruction performs,
PCB3 can just enter printing equipment 101, and otherwise PCB3, which is constantly in, waits into board status, and PCB2 can be normally carried out printing；Instruction
Control is distinguished according to front and rear scraper, such as the information of PCB1, control PCB3 into plate (parameter real-time optimization)；The information of PCB2,
Control PCB4 into plate (parameter real-time optimization)；The information of PCB3, control PCB5 into plate (parameter real-time optimization), with such
Push away.As shown in Fig. 2, Fig. 2 is printing equipment 101 and SPI equipment 102 from closed loop logic control schematic diagram.
When PCB enters patch device 103, the bar code on PCB is scanned；PCB1 completes SPI Data Detections → analysis
As a result Agent → Agent is uploaded to carry out the data analysis → triggering process logic → reception of patch device 103 instruction and be saved in finger
Make list (obtain PCB1 bar codes Barcode and correct correction instructions) → patch device 103 to identify and navigate to
PCB1barcode → execution process logic, from instruction list remove executed instructions (cross n blocks plate (quantity can configure) if
Instruction in temporary list is not triggered, automatic to remove)；Standard patch action is carried out, is generated in 103 database of patch device
The real-time patch machined parameters information of current PC B simultaneously uploads to data analytics server 115；As shown in figure 3, Fig. 3 is SPI equipment
102 with patch device 103 from closed loop logic control schematic diagram；
When PCB enters stokehold AOI equipment 104, the bar code scanned on PCB carries out standard AOI detection operations, in stove
The real-time detection information of all devices and detection picture on current PC B are generated in preceding AOI databases and uploads to data analysis clothes
Business device 115；When stokehold AOI equipment 104 has detected PCB1, by all test datas upload in data analytics server 115 by
The analysis for being set for process stability according to monitored object judges that PCB2 etc. is same to be handled, when the result of push in need
The Agent of patch device 103 can be given to, Agent sends command adapted thereto according to result to patch device 103, and it is anti-only to receive Agent
The information of feedback and on the screen pop-up are shown；As shown in figure 4, Fig. 4 is patch device 103 and stokehold AOI equipment 104 from closed loop
Logic control schematic diagram.
When PCB enters reflux furnace apparatus 105, the reflow soldering that the bar code on PCB carries out standard is scanned, is being flowed back
The real time temperature information on current PC B is generated in the database of furnace apparatus 105 and uploads to data analytics server 115；
When AOI equipment 106 after PCB enters stove, the bar code on PCB is scanned；Carry out standard AOI detection operations,
The real-time detection information of all devices and detection picture on current PC B are generated after stove in the database of AOI equipment 106 and is uploaded to
Data analytics server 115；
The action such as plug-in unit, wave-soldering, crimping, assembling is carried out, the highly dense connector normotopia degree of on-line checking is realized, lacks pin, is curved
Pin kneels the supplied materials quality such as foot, avoids supplied materials defect from flowing into crimping process；And tie under full different connector pin and hole mated condition,
The reliable pre-inserted and controlling curve of pressure, realizes crimping closed-loop control；And the process data such as equipment record crimp force/speed
And upload to data analytics server 115；
When PCB enters ICT equipment 111, the bar code on PCB is scanned；Carry out standard ICT test actions, set in ICT
During standby 111 detection defect, record the corresponding detection information of each defect and picture and upload to data analytics server 115
In.
When PCB enters FT equipment 113, the bar code on PCB is scanned；Carry out standard FT test actions, in FT equipment
During 113 detection defect, record the corresponding detection information of each defect and picture and upload onto the server；By processing bad Y
The analysis, the foundation of model of=f (X1, X2, X3) data, automatic identification risk, and return and confirm bad defect, continue to optimize pre-
Model is warned up to optimal, wherein, Optimizing Flow is as shown in Figure 5.
In Intelligent closed-loop system in the present embodiment, process logic is computing and execution in data analytics server.
I.e. after the completion of data acquisition, corresponding logic analysis and processing are carried out according to the rule of setting, the data after processing are uploaded
Corresponding process equipment is returned into database, and by the data feedback after partial analysis, carries out the adjustment of parameter.
Various Lower level logicals and non-individual support certain application function, but a logic complete or collected works, the various of functional layer answer
Realized with being calling and the corresponding logic of combination, and visualization of the closed-loop system IT circles face equivalent to functional layer is shown, is patrolled
The intermediate conversion links that part can be understood as data acquisition and IT circles face is shown are collected, are the backstage branch in closed-loop system IT circles face
Support, various logic are included to reference data source, analysis mode, logical algorithm, result judgement and push embedded location explanation
Deng.
Referring to Fig. 6, Fig. 6 is a system architecture schematic diagram of the Intelligent closed-loop system in the embodiment of the present application, this
Structure schematic diagram includes client layer, data analysis layer, data prediction layer, protocol layer, interface layer and mechanical floor.
Referring to Fig. 7, Fig. 7 is another embodiment schematic diagram of the Intelligent closed-loop system in the embodiment of the present application, this reality
The core of closed loop manufacture in application is by controlling all procedure parameter fluctuations to reach superelevation processing quality, being existed by increase
Line automation data acquisition；Specification automatic comparison；Data result realizes that auto-associating is analyzed with closed loop logic algorithm, and under
The management and control of row closed loop reduces man's activity；By to process big data analysis and technical study, by process results and technique mistake
Relation Y=f (X1, X2, X3, X4 ...) whitepack of journey, realizes Intelligent closed-loop.
Referring to Fig. 8, Fig. 8 compares for the solder joint of the application and the prior art.
" micro- closed loop " theory of Intelligent closed-loop system in the application, by technique know how modulation techniques by independently opening
The part that feels like jelly is encapsulated into equipment, realizes that (adaptive, self-adjusting, self study, problem are self-closing for intelligent management and control of the machine to technical process
Ring, can trace), discrete type random defect world-famous puzzle is solved, realizes the high complicated veneer assembling DPMO of T grades of 100k solder joints of router
<2ppm, working ability are horizontal up to 6.25sigma Best of Breed.
Intelligent closed-loop system in the application includes, process equipment, for being processed to material；Detection device,
For detecting the material by process equipment processing, testing result is obtained；Data analytics server, for according to preset technique
Logic analysis testing result, obtains analysis result, and is instructed according to analysis result to process equipment feedback adjustment so that processing is set
It is standby to be adjusted according to adjust instruction.The embodiment of the present application can be used for automatic identification workpiece, defect, and adjust automatically processing is set
It is standby.
Referring to Fig. 9, Fig. 9 is another embodiment schematic diagram of Intelligent closed-loop equipment in the embodiment of the present application.
Process equipment 901, for being processed to material；
Detection device 902, for detecting the material by process equipment processing, obtains testing result；
Data analytics server 903, for analyzing testing result according to preset process logic, obtains analysis result, and
Instructed according to analysis result to process equipment feedback adjustment so that process equipment is adjusted according to adjust instruction.
Referring to Fig. 10, Figure 10 is another embodiment schematic diagram of Intelligent closed-loop equipment in the embodiment of the present application.
Process equipment 1001, for being processed to material；
Wherein, process equipment 1001 includes：
First recognition unit 10011, for identifying the identity information on material；
Unit 10012 is processed, for being processed to material.
Detection device 1002, for detecting the material by process equipment processing, obtains testing result；
Wherein, detection device 1002 includes：
Second recognition unit 10021, for identifying the identity information of material；
Detection unit 10022, for detecting material, obtains testing result.
Data analytics server 1003, for analyzing testing result according to preset process logic, obtains analysis result, and
Instructed according to analysis result to process equipment feedback adjustment so that process equipment is adjusted according to adjust instruction.
Wherein, data analytics server 1003 includes：
Comparing unit 10031, for testing result and preset master pattern to be compared, draws comparison result；
Analytic unit 10032, for being analysed and compared according to process logic as a result, being adjusted instruction；
Feedback unit 10033, for being instructed to process equipment feedback adjustment.
Display device 1004, for showing testing result and/or analysis result.
In Intelligent closed-loop system in the application, process equipment 1001 is processed material；Detection device 1002
Material of the detection by process equipment processing, obtains testing result；Data analytics server 1003 is according to preset process logic
Testing result is analyzed, obtains analysis result, and instructed to process equipment feedback adjustment according to analysis result so that process equipment root
It is adjusted according to adjust instruction.The embodiment of the present application can be used for automatic identification workpiece, defect, and adjust automatically process equipment.
More than, above example is only to illustrate the technical solution of the application, rather than its limitations；Although with reference to foregoing reality
Example is applied the application is described in detail, it will be understood by those of ordinary skill in the art that：It still can be to foregoing each
Technical solution described in embodiment is modified, or carries out equivalent substitution to which part technical characteristic；And these are changed
Or replace, the essence of appropriate technical solution is departed from the spirit and scope of each embodiment technical solution of the application.
Claims (10)
- A kind of 1. Intelligent closed-loop system, it is characterised in that including：Process equipment, for being processed to material；Detection device, for detecting the material by process equipment processing, obtains testing result；Data analytics server, for analyzing the testing result according to preset process logic, obtains analysis result, and according to The analysis result is instructed to the process equipment feedback adjustment so that the process equipment is adjusted according to the adjust instruction It is whole.
- 2. Intelligent closed-loop system according to claim 1, it is characterised in that the data analytics server is additionally operable to basis N number of testing result, realizes that workpiece, defect positioning and process equipment linkage calibration, the N are the integer more than 1.
- 3. Intelligent closed-loop system according to claim 1, it is characterised in that the process equipment includes printing equipment, patch Piece equipment, reflux furnace apparatus, plug-in component equipment, Wave soldering apparatus, crimping apparatus, assembly equipment and online temperature follow equipment.
- 4. Intelligent closed-loop system according to claim 3, it is characterised in that the detection device is detected including paste solder printing AOI equipment, automatic X-ray detection AXI equipment, on-line checking ICT after SPI equipment, stokehold automatic visual inspection AOI equipment, stove Equipment, functional test FT equipment.
- 5. Intelligent closed-loop system according to claim 4, it is characterised in that the Intelligent closed-loop system includes first and micro- closes Ring, second micro- closed loop, the 3rd micro- closed loop, the 4th micro- closed loop, the 5th micro- closed loop, the 6th micro- closed loop and the 7th micro- closed loop, described One micro- closed loop includes the printing equipment and institute's SPI equipment, and second micro- closed loop includes the SPI equipment and the patch is set Standby, the 3rd micro- closed loop includes the patch device and the stokehold AOI equipment, and the 4th micro- closed loop includes stokehold AOI Described in equipment and the reflux furnace apparatus, the 5th micro- closed loop include AOI equipment after the reflux furnace apparatus and the stove, institute Stating the 6th micro- closed loop includes the plug-in component equipment, the Wave soldering apparatus, the crimping apparatus, the ICT equipment and the dress With equipment, the 7th micro- closed loop includes the FT equipment and the online temperature follows equipment.
- 6. Intelligent closed-loop system according to any one of claim 1 to 5, it is characterised in that the data analysis service Device includes：Comparing unit, for the testing result and preset master pattern to be compared, draws comparison result；Analytic unit, for analyzing the comparison result according to the process logic, is adjusted instruction；Feedback unit, for feeding back the adjust instruction to the process equipment.
- 7. Intelligent closed-loop system according to any one of claim 1 to 5, it is characterised in that the process equipment includes：First recognition unit, for identifying the identity information on the material；Unit is processed, for being processed to the material.
- 8. Intelligent closed-loop system according to any one of claim 1 to 5, it is characterised in that the detection device includes：Second recognition unit, for identifying the identity information of the material；Detection unit, for detecting the material, obtains testing result.
- 9. Intelligent closed-loop system according to any one of claim 1 to 5, it is characterised in that the Intelligent closed-loop system Further include：Display device, for showing the testing result and/or the analysis result.
- 10. Intelligent closed-loop system according to any one of claim 1 to 5, it is characterised in that the testing result includes The real-time detection information of the material and the pictorial information of the material.
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