CN111766256A - Method for inspecting white dots on surface of circuit board substrate - Google Patents
Method for inspecting white dots on surface of circuit board substrate Download PDFInfo
- Publication number
- CN111766256A CN111766256A CN202010653865.3A CN202010653865A CN111766256A CN 111766256 A CN111766256 A CN 111766256A CN 202010653865 A CN202010653865 A CN 202010653865A CN 111766256 A CN111766256 A CN 111766256A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- white
- inspecting
- white spots
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 title abstract description 7
- 241000519995 Stachys sylvatica Species 0.000 claims abstract description 22
- 239000011521 glass Substances 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 11
- 238000007689 inspection Methods 0.000 abstract description 11
- 238000001514 detection method Methods 0.000 abstract description 6
- 238000011835 investigation Methods 0.000 abstract description 4
- 238000004458 analytical method Methods 0.000 abstract description 2
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
Abstract
The invention discloses a method for inspecting white spots on the surface of a circuit board substrate, which comprises the following steps: s1, initial examination: preliminarily checking the surface of the etched plate by using a magnifying lens, and judging whether a suspected position exists; s2, marking: marking the suspected positions detected in the step S1; s3, rechecking and detecting: and (3) placing the marked plate on a microscope objective table, aligning the objective lens with the marked position, observing the suspected position state, and judging whether the size of the white spot meets the requirements of customers. The invention relates to the technical field of circuit board quality inspection, in particular to a method for inspecting white dots on the surface of a circuit board substrate, which is characterized in that the size of the white dots is finally determined through magnifying glass pre-inspection and a metallographic microscope, so that the precision difference between the white dots and client inspection is made up; the detection precision is improved, so that the complaint feedback problem of the client is effectively improved; according to white spots appearing on the surface of the plate, reasons generated by the white spots are summarized, so that the reason investigation locking is more accurate, and the investigation analysis efficiency is effectively improved.
Description
Technical Field
The invention relates to the technical field of circuit board quality inspection, in particular to a method for inspecting white spots on the surface of a circuit board base material.
Background
With the rapid development of the electronic technology industry, the requirements of the PCB circuit tend to be fine, intensive and multifunctional, so that the requirements on the appearance of the front-end copper-clad plate are higher and higher. The appearance defect of the secondary surface of the CCL is a main factor which troubles production and quality, and the circulation condition of the CCL glue solution, particularly the dispersion condition of the filler, determines whether white spots are agglomerated on the secondary surface of the substrate.
The conventional method for detecting the white spots on the surface of the base material adopts a 10x magnifier to observe the appearance of the sub-surface of the base plate, the appearance can be clearly detected only when the thickness is larger than 0.13mm, the requirement that the AOI detection standard in the downstream PCB process is continuously improved cannot be met, the detection capability of more downstream AOI processes reaches 0.05mm, and the conventional detection means has the following defects: 1. the inspection effect is poor, the judgment is rough by using an impurity point card, the point error smaller than 0.13mm is increased, and the misjudgment is easy; 2. the problem of dispersion white points is not easy to distinguish; 3. not all customer requirements can be met.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a method for inspecting white spots on the surface of a circuit board substrate, which solves the problem of poor inspection effect in the prior art, improves the detection precision and meets the requirements of customers.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: a method for inspecting white spots on the surface of a circuit board base material comprises the following steps:
s1, initial examination: preliminarily checking the surface of the etched plate by using a magnifying lens, and judging whether a suspected position exists;
s2, marking: marking the suspected positions detected in the step S1;
s3, rechecking and detecting: and (3) placing the marked plate on a microscope objective table, aligning the objective lens with the marked position, observing the suspected position state, and judging whether the size of the white spot meets the requirements of customers.
Preferably, in step S1, the observation is performed by using a 10-fold magnifier, and the observation is performed under ambient light with a color temperature of 4500K-6000K.
Preferably, the suspected position in step S1 is a position where a white dot is present on the surface of the plate.
Preferably, in step S2, the suspected position is marked by drawing a circle with a pencil.
Preferably, the microscope used in step S3 is a metallographic microscope, and the objective lens is a 10 × lens.
Preferably, in step S3, it is observed whether a white dot exists in the board, and the maximum size of the white dot is measured.
Preferably, the maximum size of the white dots in the step S3 is less than 0.05mm, which meets the requirement of the customer.
(III) advantageous effects
The invention provides a method for inspecting white spots on the surface of a circuit board substrate, which has the following beneficial effects: the size of the white point is finally determined through magnifying glass pre-inspection and a metallographic microscope, so that the precision difference between the white point and the client-side inspection is made up; the detection precision is improved, so that the complaint feedback problem of the client is effectively improved; according to white spots appearing on the surface of the plate, the reasons generated by the white spots are summarized, so that the reason investigation locking is more accurate, the investigation and analysis efficiency is effectively improved, and more wastes are reduced.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a technical scheme that: a method for inspecting white spots on the surface of a circuit board base material comprises the following steps:
s1, initial examination: carrying out primary inspection on the surface of the etched plate by using a 10-time magnifier under the ambient light with the color temperature of 5000K, observing whether white points exist on the surface of the plate, and determining the position of the white points as a suspected position if the white points exist;
s2, marking: marking the suspected position detected in the step S1 by pencil circle-out;
s3, rechecking and detecting: the marked plate is placed on an objective table of a metallographic microscope, light rays are adjusted to align the objective table, a 10x objective lens is selected, the objective lens is aligned to the mark position, whether white dots exist in the plate or not is observed, the maximum size of the white dots is measured, and the requirement of a customer is met if the maximum size is smaller than 0.05 mm.
The method changes the original 10-time magnification inspection into 100-time metallographic microscope observation and measurement, changes the rough measurement by using an impurity point card, and inspects the plate surface condition by improving the magnification and the measurement precision under the condition of not influencing the inspection efficiency so as to meet the requirements of customers.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. The term "comprising", without further limitation, means that the element so defined is not excluded from the group consisting of additional identical elements in the process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A method for inspecting white spots on the surface of a circuit board base material is characterized by comprising the following steps: the method comprises the following steps:
s1, initial examination: preliminarily checking the surface of the etched plate by using a magnifying lens, and judging whether a suspected position exists;
s2, marking: marking the suspected positions detected in the step S1;
s3, rechecking and detecting: and (3) placing the marked plate on a microscope objective table, aligning the objective lens with the marked position, observing the suspected position state, and judging whether the size of the white spot meets the requirements of customers.
2. The method for inspecting white spots on the surface of a circuit board base material according to claim 1, wherein: and in the step S1, observing by using a 10-time magnifying glass, and observing under the ambient light with the color temperature of 4500-6000K.
3. The method for inspecting white spots on the surface of a circuit board base material according to claim 1, wherein: the suspected position in step S1 is a position where a white dot is present on the surface of the plate.
4. The method for inspecting white spots on the surface of a circuit board base material according to claim 1, wherein: in step S2, the suspected position is marked by circling with a pencil.
5. The method for inspecting white spots on the surface of a circuit board base material according to claim 1, wherein: the microscope used in the step S3 is a metallographic microscope, and the objective lens is a 10 × lens.
6. The method for inspecting white spots on the surface of a circuit board base material according to claim 1, wherein: in step S3, it is observed whether a white dot exists in the sheet, and the maximum size of the white dot is measured.
7. The method for inspecting white spots on the surface of a circuit board base material according to claim 1, wherein: and in the step S3, the maximum size of the white dot is less than 0.05mm, so that the requirement of the customer is met.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010653865.3A CN111766256A (en) | 2020-07-08 | 2020-07-08 | Method for inspecting white dots on surface of circuit board substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010653865.3A CN111766256A (en) | 2020-07-08 | 2020-07-08 | Method for inspecting white dots on surface of circuit board substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111766256A true CN111766256A (en) | 2020-10-13 |
Family
ID=72725281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010653865.3A Pending CN111766256A (en) | 2020-07-08 | 2020-07-08 | Method for inspecting white dots on surface of circuit board substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111766256A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114063479A (en) * | 2021-11-12 | 2022-02-18 | 华科电子股份有限公司 | Radio frequency power supply control method and system applied to multi-output module of etching machine |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11211675A (en) * | 1998-01-30 | 1999-08-06 | Canon Inc | Crack inspection method |
| CN1861682A (en) * | 2006-04-29 | 2006-11-15 | 广东生益科技股份有限公司 | Halogenless fire retarded epoxy resin composition |
| CN101665017A (en) * | 2009-09-15 | 2010-03-10 | 广东生益科技股份有限公司 | Prepreg having nonsymmetrical resin layer thickness and application thereof |
| CN108235592A (en) * | 2018-01-30 | 2018-06-29 | 深圳市精诚达电路科技股份有限公司 | A kind of process for monitoring FPC golden finger overlay coatings |
-
2020
- 2020-07-08 CN CN202010653865.3A patent/CN111766256A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11211675A (en) * | 1998-01-30 | 1999-08-06 | Canon Inc | Crack inspection method |
| CN1861682A (en) * | 2006-04-29 | 2006-11-15 | 广东生益科技股份有限公司 | Halogenless fire retarded epoxy resin composition |
| CN101665017A (en) * | 2009-09-15 | 2010-03-10 | 广东生益科技股份有限公司 | Prepreg having nonsymmetrical resin layer thickness and application thereof |
| CN108235592A (en) * | 2018-01-30 | 2018-06-29 | 深圳市精诚达电路科技股份有限公司 | A kind of process for monitoring FPC golden finger overlay coatings |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114063479A (en) * | 2021-11-12 | 2022-02-18 | 华科电子股份有限公司 | Radio frequency power supply control method and system applied to multi-output module of etching machine |
| CN114063479B (en) * | 2021-11-12 | 2024-01-23 | 华科电子股份有限公司 | Radio frequency power supply control method and system applied to multi-output module of etching machine |
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Application publication date: 20201013 |
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