CN1306244C - On-the-spot printing circuit board test based on digital image - Google Patents
On-the-spot printing circuit board test based on digital image Download PDFInfo
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- CN1306244C CN1306244C CNB2005100267992A CN200510026799A CN1306244C CN 1306244 C CN1306244 C CN 1306244C CN B2005100267992 A CNB2005100267992 A CN B2005100267992A CN 200510026799 A CN200510026799 A CN 200510026799A CN 1306244 C CN1306244 C CN 1306244C
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Abstract
The present invention relates to a printing circuit board on-the-spot test method based on digital images, which belongs to the technical field of measurement. The present invention comprises the following steps that (1) the image matching test of the integrity of a PCB board structure is carried out, the corresponding areas of a target image and a standard picture are compared, and the matching test of the integrity of the PCB board structure is realized; (2) the test technique of a rectangular frame of the size of a PCB board wire is adopted, according to the difference of grey scale after the wire and the base board are imaged, greyscale processing and edge positioning are carried out to the target image in a rectangular test frame, and the geometric size of the wire is calculated; (3) the high-precision edge position of the target image is realized, an LOG operator is adopted for fast edge localization, and the image edge positioning of minor pixel level is realized by using a gray-scale value in a neighboring region of a fitting edge of a cubic polynomial. The present invention adopts the technique of high-precision minor pixel edge test to realize the target detection of a PCB board, and simultaneously, a test data report is made.
Description
Technical field
What the present invention relates to is a kind of method of testing of printed wiring board technical field, specifically, is a kind of printed wiring board on-the-spot test method based on digitized video.
Background technology
In recent years, along with PCB abroad (printed wiring board) manufacturing industry shifts to China, the PCB industry of China had obtained flourish, had brought higher requirement for simultaneously the testing of PCB.From the development of PCB product, measuring technology now just develops towards full-automatic, high reliability direction, to reduce artificial and Effect of Environmental.Wherein, visual inspection, dimension control, lead precision, structural intergrity etc. are the Quality Identification projects of IPC (U.S. connects electronics industry association) standard code.At present, automated optical detects the online detection that has been widely used in pcb board, and this method is utilized the difference of light reflecting effect on different materials, obtains the image information of PCB by optical scanning system.For the pcb board of complexity, its amount of image information is very big, and production status is relatively also unstable, and image error is big, and automatic optical detecting system can be reported a lot of false mistakes when judging defective.According to operator's use experience, when checking complicated PCB, there is test leakage to a certain degree in automatic optical detecting system.
Through the prior art literature search is found, Chinese patent application number: 02139916.6, patent name is: image measuring system and method.The measuring method that provides according to this invention as can be seen, thereby this method is the dimensional data that obtains object by the image data of handling object.But at the specific detection requirement of pcb board, this method can not guarantee the accuracy of detection of target on the pcb board, the requirements such as integrity test of structure, can not provide to production division simultaneously and detect form to instruct production.
Summary of the invention
The objective of the invention is to overcome deficiency of the prior art, a kind of printed wiring board on-the-spot test method based on digitized video that is is provided, make it utilize the step motor drive belt wheel to regulate the optical lens multiplying power according to the test needs, image acquisition is carried out in specific region to the PCB target, and employing high precision sub-pixel edge detection technique, realize the target detection of pcb board, provide the detection data sheet simultaneously.
The present invention is achieved through the following technical solutions, the present invention includes following steps:
(1) images match of carrying out the pcb board structural intergrity detects, and the corresponding region of target image and standard picture compares, and realizes the matching detection of pcb board structural intergrity:
(2) adopt the rectangle frame measuring technology of pcb board conductor size, different according to gray scale after lead and the substrate imaging carry out to target image in the test rectangle frame that gray scale is handled and the location, edge, the physical dimension of calculating lead;
(3) locate at the high precision edge of realizing target image, adopts LOG operator (Laplce's Gauss operator) to carry out the rapid edge location, and utilize the gray-scale value in the cubic polynomial match edge neighborhood, realizes that the image border of sub-pixel is located.
The images match of described pcb board structural intergrity detects, and is meant: in order to improve the accuracy of detection, test macro directly produces the standard image data of pcb board from CAD/CAM (computer-aided design (CAD) and manufacturing system); The multiplying power of optical lens is regulated by the step motor drive belt wheel in the test macro, size and distribution density according to target on the pcb board, regulate the optical system multiplying power image acquisition and storage are carried out in the target area of detected PCB, the X-axis of mobile and horizontal worktable and Y-axis realize the image acquisition and the storage of whole pcb board; Standard picture is amplified or dwindle according to the multiplying power of optical system, the corresponding region of target image that collects and standard picture relatively, thereby realize the defects detection of pcb board structural intergrity.
The rectangle frame measuring technology of described pcb board conductor size, be meant: according to the requirement of PCB design and manufacturing process, the project that the pcb board conductor size is measured comprises: the deviation of conductor width, wire pitch, lead mean breadth, drilled diameter, pad maximum gauge, drill center and pad center.In testing process, different according to gray scale after lead and the substrate imaging are utilized the sub-pixel edge location algorithm of image, calculate the physical dimension of lead.
The distance between centers of tracks of conductor width, parallel wire and lead mean breadth are measured and are adopted the test rectangle frame, promptly set up a rectangle sign frame in the image measurement zone with mouse, the size of test block is regulated according to the picture size size of measurement target, system carries out gray scale processing and location, edge in test block, calculate the current line thickness of testing, and on image, mark.
The test rectangle frame is adopted in the measurement of boring and pad maximum gauge, and the size of test block is regulated according to the picture size size of boring or pad, and system carries out gray scale processing and location, edge in test zone; In initial position, system can detect the best tangent line in two borders of boring or pad circumference, the diameter when calculating this position along the parallel direction of test block; Test block is around equivalent of its center rotation, and the rotation equivalent determines that according to measuring accuracy every rotation primary system can detect the best tangent line in two borders of boring or pad circumference, the diameter when drawing this position along the parallel direction of test block; Behind the Rotate 180 °, all diameter values that obtain are compared, draw maximum gauge value and corresponding inclination angle, and mark in image upper edge maximum gauge direction.
Two test rectangle frames are adopted in the measurement of the deviation of drill center and pad center, and according to the size adjustment of boring and pad, system carries out gray scale processing and location, edge respectively to the size of two test block in two test block respectively; Identical with the method for test diameter, obtain the boring and the maximum gauge position of pad respectively, calculate again and hole and the pad home position, utilize distance between two points to calculate the centre deviation value.
System generates data sheet to the test result of every width of cloth image, provides examining report by printer, and the guiding work personnel carry out process modification.
The location, high precision edge of described target image is meant: for improving the accuracy of detection of test macro, according to the density size of pcb board lead and the thickness of lines, set two and measured the visual field; When thin and density is big when lead, adopt the less measurement visual field with the raising accuracy of detection; Thick and require simultaneously-measured target more for a long time when lead, adopt the bigger measurement visual field; The size in the visual field is regulated by stepper motor.
Measuring under the certain situation of the visual field and ccd video camera resolution, the accuracy of detection key that improves test macro is how to improve the edge precision of target image, if can just be equivalent to improve accuracy of measurement system with the feature target localization on the image in the sub-pix rank.For this reason, the present invention proposes to adopt the LOG operator to carry out the rapid edge location and cubic polynomial is come the gray-scale value at match edge, thereby realizes the location, image border of sub-pixel.Be implemented as follows:
At first, original image is carried out convolution algorithm with Gaussian function, LOG template and the zero cross point after the image convolution after the discretize promptly are edge of image, thereby realize the rapid edge location of LOG operator;
Secondly, in the edge neighborhood of locating fast, utilize cubic polynomial to come the gray-scale value at match edge, getting its flex point is marginal position, realizes the method for sub-pixel positioning precision.
The present invention tests the production scene that the digitized image detection technique is applied to printed wiring board, has solved the defective of traditional automated optical test macro, provides examining report to improve manufacturing process etc. for the staff simultaneously.This method adopts the images match detection technique of pcb board structural intergrity, the rectangle frame measuring technology of pcb board conductor size, and utilize the LOG operator to carry out rapid edge location and cubic polynomial comes the algorithm of the gray-scale value at match edge that the edge of target image is positioned at sub-pixel.This test macro not only has the higher detection precision, and loss is extremely low.
Embodiment
Provide following examples in conjunction with content of the present invention:
Present embodiment carries out on the digitized image detector of independent development, and specific implementation process is as follows:
Measured target is the lead physical dimension of PCB inner plating, and test event is conductor width, lead distance between centers of tracks and drilled diameter, and the test system hardware configuration is as follows:
| Ccd video camera | COSTAR C400，1/2”Color CCD 752×582 |
| Optical lens | Navitar Zoom 6000，C-Mount，1X Adapter |
| Image pick-up card | Imagenation PCX200 Frame Grabber Card |
| Light source | Ose Vision Light Source，BIN-50-2R-60G，BT68*118FR |
| Stepper motor | 35BYG007 |
| Computing machine | Pentium (R) 4, CPU 2.00GHz, 256 MB of memory |
(1) determine that according to the thickness and the distribution density of pcb board lead measuring the visual field is 12mm * 9mm, the multiplying power that the size in the visual field is regulated optical lens by the step motor drive belt wheel realizes.
(2) target area is by the image acquisition subsystem imaging, and the vision signal after the imaging deposits computing machine in by image pick-up card.
(3) original image that collects is carried out convolution algorithm with Gaussian function, LOG template and the zero cross point after the image convolution after the discretize promptly are edge of image, thereby realize the rapid edge location of LOG operator; In the edge neighborhood of locating fast, utilize cubic polynomial to come the gray-scale value at match edge then, getting its flex point is marginal position, realizes the sub-pixel edge location of image.
(4) distance between centers of tracks of conductor width, parallel wire is measured and is adopted the test rectangle frame, promptly set up a rectangle sign frame in the image measurement zone with mouse, the size of test block is regulated according to the picture size size of measurement target, system carries out gray scale processing and location, edge in test block, calculate the current line thickness of testing, and on image, mark.
(5) the test rectangle frame is adopted in the measurement of drilled diameter, and the size of test block is regulated according to the picture size size of boring, and system carries out gray scale processing and location, edge in test zone; In initial position, system can detect the best tangent line in two borders of boring circumference, the diameter when calculating this position along the parallel direction of test block; Test block is around equivalent of its center rotation, and rotation is when measuring 1 °, and every rotation primary system can detect the best tangent line in two borders of boring circumference, the diameter when drawing this position along the parallel direction of test block; Behind the Rotate 180 °, all diameter values that obtain are compared, draw maximum gauge value and corresponding inclination angle, and mark in image upper edge maximum gauge direction.
(6) the examining report analysis of providing by test macro draws, printed wiring board on-site test system based on digitized video has the higher detection precision, solved the defective of traditional automatic optical detecting system, significantly reduced the loss of printed wiring board, simultaneously testing result provides reference frame for the staff to the improvement of manufacturing process and design thereof.
Claims (3)
1. printed wiring board on-the-spot test method based on digitized video, it is characterized in that, may further comprise the steps: the images match that (1) carries out the pcb board structural intergrity detects, and the corresponding region of target image and standard picture compares, and realizes the matching detection of pcb board structural intergrity; (2) adopt the rectangle frame measuring technology of pcb board conductor size, different according to gray scale after lead and the substrate imaging carry out to target image in the test rectangle frame that gray scale is handled and the location, edge, the physical dimension of calculating lead; (3) locate at the high precision edge of realizing target image, adopts the LOG operator to carry out the rapid edge location, and utilize the gray-scale value in the cubic polynomial match edge neighborhood, realizes that the image border of sub-pixel is located;
The images match of described pcb board structural intergrity detects, and is meant: test macro directly produces the standard image data of pcb board from CAD/CAM; The multiplying power of optical lens is regulated by the step motor drive belt wheel in the test macro, size and distribution density according to target on the pcb board, regulate the optical system multiplying power image acquisition and storage are carried out in the target area of detected PCB, the X-axis of mobile and horizontal worktable and Y-axis realize the image acquisition and the storage of whole pcb board; Standard picture is amplified or dwindle according to the multiplying power of optical system, the corresponding region of target image that collects and standard picture relatively, thereby realize the defects detection of pcb board structural intergrity;
The rectangle frame measuring technology of described employing pcb board conductor size, be meant: the distance between centers of tracks of conductor width, parallel wire and lead mean breadth are measured and are adopted the test rectangle frame, promptly set up a rectangle sign frame in the image measurement zone with mouse, the size of test block is regulated according to the picture size size of measurement target, system carries out gray scale processing and location, edge in test block, calculate the current line thickness of testing, and on image, mark;
The location, high precision edge of described realization target image, its method is: according to the density size of pcb board lead and the thickness of lines, set two and measure the visual field; When thin and density is big when lead, adopt the less measurement visual field with the raising accuracy of detection; Thick and require simultaneously-measured target more for a long time when lead, adopt the bigger measurement visual field; The size in the visual field is regulated by stepper motor;
Described employing LOG operator carries out the rapid edge location, its method is: original image is carried out convolution algorithm with Gaussian function, LOG template and the zero cross point after the image convolution after the discretize promptly are edge of image, thereby realize the rapid edge location of LOG operator;
The described gray-scale value that utilizes in the cubic polynomial match edge neighborhood, its method is: in the edge neighborhood of locating fast, utilize cubic polynomial to come the gray-scale value at match edge, getting its flex point is marginal position, realizes the method for sub-pixel positioning precision.
2. the printed wiring board on-the-spot test method based on digitized video according to claim 1, it is characterized in that, the rectangle frame measuring technology of described employing pcb board conductor size, be meant: the test rectangle frame is adopted in the measurement of boring and pad maximum gauge, the size of test block is regulated according to the picture size size of boring or pad, and system carries out gray scale processing and location, edge in test zone; In initial position, system can detect the best tangent line in two borders of boring or pad circumference, the diameter when calculating this position along the parallel direction of test block; Test block is around equivalent of its center rotation, and the rotation equivalent determines that according to measuring accuracy every rotation primary system can detect the best tangent line in two borders of boring or pad circumference, the diameter when drawing this position along the parallel direction of test block; Behind the Rotate 180 °, all diameter values that obtain are compared, draw maximum gauge value and corresponding inclination angle, and mark in image upper edge maximum gauge direction.
3. the printed wiring board on-the-spot test method based on digitized video according to claim 1 and 2, it is characterized in that, the rectangle frame measuring technology of described employing pcb board conductor size, be meant: two test rectangle frames are adopted in the measurement of the deviation of drill center and pad center, according to the size adjustment of boring and pad, system carries out gray scale processing and location, edge respectively to the size of two test block in two test block respectively; Identical with the method for test diameter, obtain the boring and the maximum gauge position of pad respectively, calculate again and hole and the pad home position, utilize distance between two points to calculate the centre deviation value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CNB2005100267992A CN1306244C (en) | 2005-06-16 | 2005-06-16 | On-the-spot printing circuit board test based on digital image |
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| CNB2005100267992A CN1306244C (en) | 2005-06-16 | 2005-06-16 | On-the-spot printing circuit board test based on digital image |
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| CN1712887A CN1712887A (en) | 2005-12-28 |
| CN1306244C true CN1306244C (en) | 2007-03-21 |
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| CN102162722A (en) * | 2010-12-30 | 2011-08-24 | 广东万濠精密仪器股份有限公司 | Method for searching edge of image of dense multi-side measurement workpiece |
| CN102183206B (en) * | 2011-03-16 | 2013-02-13 | 昆山市正业电子有限公司 | Line width measuring method for line on printed circuit board (PCB) |
| CN103185560A (en) * | 2011-12-29 | 2013-07-03 | 鸿富锦精密工业（深圳）有限公司 | System and method for detecting circuit width of printed circuit board (PCB) |
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| CN107992694A (en) * | 2017-12-08 | 2018-05-04 | 魏延福 | A kind of PCB circuit board calculation system method and its data presentation system |
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| CN112129227B (en) * | 2020-11-23 | 2021-03-02 | 维嘉数控科技（苏州）有限公司 | Method, device, equipment and medium for scanning printed circuit board |
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