CN112419224B - Spherical pin chip positioning method and system - Google Patents

Spherical pin chip positioning method and system Download PDF

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CN112419224B
CN112419224B CN202010689747.8A CN202010689747A CN112419224B CN 112419224 B CN112419224 B CN 112419224B CN 202010689747 A CN202010689747 A CN 202010689747A CN 112419224 B CN112419224 B CN 112419224B
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spherical pin
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ball
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CN112419224A (en
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高会军
刘伟华
孙昊
于兴虎
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Ningbo Intelligent Equipment Research Institute Co ltd
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Abstract

The invention discloses a method and a system for positioning a spherical pin chip. And then obtaining a minimum circumscribed rectangle linear equation according to the picture with the maximum relevance to the spherical pin chip binaryzation picture, calculating the distance value from the communicated region to the minimum circumscribed rectangle linear equation, simultaneously determining the minimum circumscribed rectangle of the communicated region image according to the distance value, and finally completing the positioning of the spherical pin chip according to the minimum circumscribed rectangle of the communicated region. According to the method, the spherical pin chip binary image is subjected to correlation matching and is positioned to the rough position of the spherical pin chip, and then the spherical pin chip is positioned again according to the distance value, so that the robustness of positioning the spherical pin chip in chip detection is improved, and the method has the characteristics of strong anti-interference capability, high accuracy and high speed.

Description

Spherical pin chip positioning method and system
Technical Field
The invention relates to the technical field of visual detection of chip mounters, in particular to a method and a system for positioning a spherical pin chip.
Background
In surface mount devices, visual inspection techniques are often used to position the chip. The chip types are various, so that the defects of poor anti-interference performance, poor precision, low speed and the like exist in the visual identification and positioning method of the spherical pin chip found in the application process of the chip mounter, and the traditional spherical chip positioning algorithm only has a single positioning process, so that the positioning precision is poor, and the problems of high waste rate and the like easily occur in the face of the complex spherical pin chip.
Disclosure of Invention
The invention aims to provide a method and a system for positioning a spherical pin chip, which aim to solve the problem of poor positioning accuracy of the traditional spherical chip.
In order to achieve the purpose, the invention provides the following scheme:
a method for positioning a spherical pin chip comprises the following steps:
acquiring parameter information of a spherical pin chip; the parameter information comprises the number of solder balls of the spherical pin chip in the x direction, the pin spacing of the spherical pin chip in the x direction, the number of solder balls of the spherical pin chip in the y direction and the pin spacing of the spherical pin chip in the y direction;
establishing a spherical pin chip template image according to the parameter information;
rotating the spherical pin chip template images according to different rotation angles to obtain a plurality of spherical pin chip template rotation images;
obtaining a spherical pin chip binaryzation picture;
matching the spherical pin chip binary image with a plurality of spherical pin chip template rotating images one by one to obtain a first spherical pin chip template rotating image with the maximum relevance to the spherical pin chip binary image;
obtaining a minimum circumscribed rectangle of a solder ball on the first spherical pin chip template rotation image according to the first spherical pin chip template rotation image;
obtaining a minimum circumscribed rectangle linear equation according to the minimum circumscribed rectangle; the straight line represented by the minimum circumscribed rectangle straight line equation is the side of the minimum circumscribed rectangle;
the first spherical pin chip template rotating image is overlapped with the spherical pin chip binaryzation picture, and an overlapped spherical pin chip image is determined;
carrying out 8 connected domain marking on the spherical pin chip binary image in the superposed spherical pin chip image to obtain a connected domain image with a mark number;
calculating the distance value from each connected region in the connected region image with the mark to the edge of the minimum circumscribed rectangle;
determining the minimum circumscribed rectangle of the connected region image with the mark according to the distance value; the position of the minimum external rectangle of the communication area is the position of the spherical pin chip.
Optionally, the establishing a spherical pin chip template image according to the parameter information specifically includes:
using a formula
Figure BDA0002588902520000021
Determining the length and width of the spherical pin chip template image; wherein T isxIs the length of the spherical pin chip template image, TyWidth of die plate image for ball-lead chip, BxThe edge length of the solder ball in the x-direction, Bx＝(Nx-1)PxIn which N isxDenotes the number of solder balls in the x-direction of the ball-lead chip, PxDenotes the lead pitch of the ball-lead chip in the x-direction, ByEdge length of solder ball in y-direction, By＝(Ny-1)PyIn which N isyRepresenting the number of solder balls in the y-direction of the ball-lead chip, PyRepresenting the pin pitch of the ball pin chip in the y direction;
according to the formula
Figure BDA0002588902520000022
Determining the position of the center of each solder ball in the spherical lead chip template image; wherein, Cn,xRepresents the position of the nth solder ball in the x-direction in the ball-pin chip template image, Cm,yThe position of the mth solder ball in the y direction in the image of the ball-shaped pin chip template is shown, n represents the serial number of the solder ball in the x direction, and m represents the serial number of the solder ball in the y direction;
and establishing the spherical pin chip template image according to the position of the center of each solder ball in the spherical pin chip template image and the length and the width of the spherical pin chip template image.
Optionally, the rotating the spherical pin chip template image according to different rotation angles to obtain a plurality of spherical pin chip template rotation images specifically includes:
obtaining pixel position coordinates (x) of the spherical pin chip template image1,y1)；
According to the formula
Figure BDA0002588902520000031
Determining pixel location coordinates (x) of the ball-pin chip template rotation image0,y0) (ii) a Wherein x is0Rotating the abscissa, y, of the pixel position of the image for the ball-pin chip template0For the ordinate, x, of the pixel position of the spherical pin chip template rotation image1Is the abscissa, y, of the pixel location of the ball-pin chip template image1The abscissa of the pixel position of the spherical pin chip template image is shown, and alpha is a rotation angle;
and determining pixel position coordinates of a plurality of different spherical pin chip template rotation images according to different rotation angles, and determining a plurality of spherical pin chip template rotation images according to the pixel position coordinates of the plurality of different spherical pin chip template rotation images.
Optionally, the obtaining of the spherical pin chip binarization picture further includes:
the method comprises the steps of obtaining a gray level picture of a spherical pin chip by using a single-channel black-and-white camera, and carrying out binarization processing on the gray level picture by adopting an OTSU (over the horizon) algorithm to generate a spherical pin chip binarization picture.
Optionally, the spherical pin chip binarization image is matched with the plurality of spherical pin chip template rotation images one by one, so as to obtain a first spherical pin chip template rotation image with the largest correlation with the spherical pin chip binarization image, and the method specifically includes:
using a formula
Figure BDA0002588902520000032
Calculating the correlation between a plurality of spherical pin chip template rotation images and the spherical pin chip binary images, wherein Cα(x, y) is a value of correlation between the spherical pin chip template rotation image and the spherical pin chip template rotation image at the (x, y) position in the spherical pin chip binarization image, M (x ', y') is a pixel value of the spherical pin chip template rotation image at the (x ', y') position, I is the spherical pin chip binarization image, x is a horizontal coordinate of the spherical pin chip binarization image pixel, y is a vertical coordinate of the spherical pin chip binarization image pixel, x 'is a horizontal coordinate of the spherical pin chip template rotation image pixel, and y' is a vertical coordinate of the spherical pin chip template rotation image pixel;
and determining the spherical pin chip template rotation image corresponding to the maximum correlation value as the first spherical pin chip template rotation image.
Optionally, the obtaining a minimum external rectangle of the solder ball on the first spherical pin chip template rotation image according to the first spherical pin chip template rotation image specifically includes:
acquiring a white pixel set formed by all white pixels in the first spherical pin chip template rotation image;
and taking the minimum circumscribed rectangle corresponding to the white pixel set as the minimum circumscribed rectangle of the solder balls on the first spherical pin chip template rotation image.
Optionally, the determining the minimum bounding rectangle of the connected region image with the mark according to the distance value specifically includes:
taking all connected areas corresponding to the distance values smaller than the diameter of the solder ball as boundary solder ball positions;
acquiring a central position set formed by the centers of all the boundary solder ball positions;
and determining the minimum circumscribed rectangle of the connected region according to the central position set.
A ball pin chip positioning system, comprising:
the chip parameter information acquisition module is used for acquiring the parameter information of the spherical pin chip; the parameter information comprises the number of solder balls of the spherical pin chip in the x direction, the pin spacing of the spherical pin chip in the x direction, the number of solder balls of the spherical pin chip in the y direction and the pin spacing of the spherical pin chip in the y direction;
the spherical pin chip template image establishing module is used for establishing a spherical pin chip template image according to the parameter information;
the spherical pin chip template rotation image determining module is used for rotating the spherical pin chip template images according to different rotation angles to obtain a plurality of spherical pin chip template rotation images;
the chip binarization image obtaining module is used for obtaining a spherical pin chip binarization image;
the chip binarization picture correlation matching module is used for matching the spherical pin chip binarization pictures with a plurality of spherical pin chip template rotation images one by one to obtain a first spherical pin chip template rotation image with the maximum correlation with the spherical pin chip binarization pictures;
the minimum external rectangle determining module is used for obtaining the minimum external rectangle of the solder ball on the first spherical pin chip template rotation image according to the first spherical pin chip template rotation image;
the minimum circumscribed rectangle linear equation determining module is used for obtaining a minimum circumscribed rectangle linear equation according to the minimum circumscribed rectangle; the straight line represented by the minimum circumscribed rectangle straight line equation is the side of the minimum circumscribed rectangle;
the spherical pin chip image overlapping module is used for overlapping the first spherical pin chip template rotating image and the spherical pin chip binaryzation picture and determining an overlapped spherical pin chip image;
a connected region image determining module, configured to perform 8-connected region labeling on the spherical pin chip binarized picture in the overlapped spherical pin chip image, to obtain a connected region image with a label;
the distance value determining module is used for calculating the distance value from each communication area in the communication area image with the mark number to the edge of the minimum circumscribed rectangle;
the minimum circumscribed rectangle determining module of the connected region is used for determining the minimum circumscribed rectangle of the connected region image with the label according to the distance value; and the position of the minimum external rectangle of the communication area is the position of the spherical pin chip.
Optionally, the spherical pin chip template image creating module specifically includes:
the spherical pin chip template image establishing unit adopts a formula
Figure BDA0002588902520000051
Determining the length and width of the spherical pin chip template image; wherein T isxIs the length of the spherical pin chip template image, TyIs the width of the spherical pin chip template image, BxThe edge length of the solder ball in the x-direction, Bx＝(Nx-1)PxIn which N isxDenotes the number of solder balls in the x-direction of the ball-lead chip, PxDenotes the lead pitch of the ball-lead chip in the x-direction, ByEdge length of solder ball in y-direction, By＝(Ny-1)PyIn which N isyRepresenting the number of solder balls in the y-direction of the ball-lead chip, PyRepresenting the pin pitch of the ball pin chip in the y direction;
according to the formula
Figure BDA0002588902520000052
Determining the position of the center of each solder ball in the spherical lead chip template image; wherein, Cn,xRepresents the position of the nth solder ball in the x-direction in the ball-pin chip template image, Cm,yThe position of the mth solder ball in the y direction in the image of the ball-shaped pin chip template is shown, n represents the serial number of the solder ball in the x direction, and m represents the serial number of the solder ball in the y direction;
and establishing the spherical pin chip template image according to the position of the center of each solder ball in the spherical pin chip template image and the length and the width of the spherical pin chip template image.
Optionally, the module for determining a rotation image of the spherical pin chip template specifically includes:
a template image pixel position obtaining unit for obtaining the pixel position coordinates (x) of the spherical pin chip template image1,y1)；
A pixel position determining unit for the spherical pin chip template rotation image according to a formula
Figure BDA0002588902520000061
Determining pixel location coordinates (x) of the spherical pin chip template rotation image0,y0) (ii) a Wherein x is0Rotating the abscissa, y, of pixel position of an image for the ball-pin chip template0For the ordinate, x, of the pixel position of the spherical pin chip template rotation image1Is the abscissa, y, of the pixel position of the spherical pin chip template image1For pixel position of said ball-pin chip template imageThe abscissa and alpha are rotation angles;
the spherical pin chip template rotation image determining unit is used for determining pixel position coordinates of a plurality of different spherical pin chip template rotation images according to different rotation angles and determining a plurality of spherical pin chip template rotation images according to the pixel position coordinates of the plurality of different spherical pin chip template rotation images.
According to the specific embodiment provided by the invention, the invention discloses the following technical effects:
the invention discloses a method and a system for positioning a spherical pin chip. And then obtaining a minimum circumscribed rectangle linear equation according to the picture with the maximum relevance to the spherical pin chip binaryzation picture, calculating the distance value from the communicated region to the minimum circumscribed rectangle linear equation, simultaneously determining the minimum circumscribed rectangle of the communicated region image according to the distance value, and finally completing the positioning of the spherical pin chip according to the minimum circumscribed rectangle of the communicated region. According to the invention, the spherical pin chip is positioned to the rough position of the spherical pin chip by performing correlation matching on the binary image of the spherical pin chip, and then the spherical pin chip is positioned again according to the distance value, so that the robustness of positioning the spherical pin chip in chip detection is improved, and the method has the characteristics of strong anti-interference capability, high accuracy and high speed.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.
FIG. 1 is a flow chart of a method for positioning a ball-lead chip according to the present invention;
FIG. 2 is a schematic diagram of a method for positioning a ball-lead chip according to the present invention;
FIG. 3 is a schematic diagram of an exemplary ball-pin chip provided by the present invention;
FIG. 4 is a schematic diagram of a spherical pin chip template image provided by the present invention;
FIG. 5 is a schematic diagram of a spherical pin chip template image provided by the present invention;
FIG. 6 is a binary diagram of a ball-lead chip according to the present invention;
FIG. 7 is a binary diagram of a ball-lead chip reduced by 8 times according to the present invention;
FIG. 8 is a schematic diagram of a minimum circumscribed rectangle of a connected region provided by the present invention;
FIG. 9 is a schematic diagram of a boundary solder ball in a ball-lead chip according to the present invention;
FIG. 10 is a schematic diagram of a ball-lead chip test positioning according to the present invention;
fig. 11 is a schematic diagram of a ball-lead chip positioning system according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention aims to provide a method and a system for positioning a spherical pin chip, which aim to solve the problem of poor positioning accuracy of the traditional spherical chip.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
FIG. 1 is a flow chart of a method for positioning a ball-lead chip according to the present invention; fig. 2 is a schematic diagram of a ball-lead chip positioning method according to the present invention. As shown in fig. 1 and 2, a method for positioning a ball-lead chip includes:
step 101: acquiring parameter information of a spherical pin chip; the parameter information comprises the number of solder balls of the spherical pin chip in the x direction, the pin pitch of the spherical pin chip in the x direction, the number of solder balls of the spherical pin chip in the y direction and the pin pitch of the spherical pin chip in the y direction.
Step 102: establishing a spherical pin chip template image according to the parameter information;
FIG. 3 is a diagram of a typical ball-pin chip; fig. 4 is a schematic diagram of a ball pin chip template image. Referring to fig. 3 and 4, the establishing a spherical pin chip template image according to the parameter information specifically includes:
using a formula
Figure BDA0002588902520000081
Determining the length and width of the spherical pin chip template image; wherein T isxIs the length of the spherical pin chip template image, TyWidth of die plate image for ball-lead chip, BxThe edge length of the solder ball in the x-direction, Bx＝(Nx-1)PxIn which N isxDenotes the number of solder balls in the x-direction of the ball-lead chip, PxDenotes the lead pitch of the ball-lead chip in the x-direction, ByEdge length of solder ball in y-direction, By＝(Ny-1)PyIn which N isyRepresenting the number of solder balls in the y-direction of the ball-lead chip, PyRepresenting the pin pitch of the ball pin chip in the y direction;
according to the formula
Figure BDA0002588902520000082
Determining the position of the center of each solder ball in the spherical lead chip template image; wherein, Cn,xRepresents the position of the nth solder ball in the x-direction in the ball-pin chip template image, Cm,yShowing the position of the mth solder ball in the y direction in the ball-pin chip template image, and n showing the solder ball in the x directionThe sequence number of the solder ball is upward, and m represents the sequence number of the solder ball in the y direction;
establishing a spherical pin chip template image according to the position of the center of each solder ball in the spherical pin chip template image and the length and width of the spherical pin chip template image;
in practical application, a chip template with the same size as a spherical pin chip is constructed according to the spherical pin chip parameter information, and then pyramid scaling is adopted to reduce the template image. Drawing a chip template image according to information such as the number, the spacing, the camera scale and the like of the pins of the spherical chip, then reducing the template image to 1/8 with a normal size by adopting pyramid scaling, namely, the spherical pin chip template image reduced by 8 times is obtained, specifically, according to the chip parameter information, the number and the spacing of the pins of the solder balls in the x direction of the chip are respectively known to be NxAnd PxThe number of solder balls and the pitch of pins in the y direction of the chip are NyAnd PyFirst, the lengths of the edges in the x and y directions of the solder ball are calculatedx＝(Nx-1)PxAnd By＝(Ny-1)PyThe length and width of the template image are set to be equal to the length of the diagonal of the solder ball.
Namely:
Figure BDA0002588902520000083
according to the solder ball distribution rule obtained from the teaching information, the position (C) of the center of each solder ball in the template image is obtainedn, xCm,y) Where n and m represent the solder ball sequence numbers in the x and y directions, respectively, then:
Figure BDA0002588902520000091
in (C)n,xCm,y) And drawing a solid circle with the diameter of the solder ball r, and finishing the drawing process of the template after drawing all the solder balls.
Step 103: rotating the spherical pin chip template images according to different rotation angles to obtain a plurality of spherical pin chip template rotation images;
fig. 5 is a schematic diagram of a ball pin chip template image. Referring to fig. 5, the rotating the spherical lead chip template image according to different rotation angles to obtain a plurality of spherical lead chip template rotation images specifically includes:
obtaining pixel position coordinates (x) of the spherical pin chip template image1,y1)；
According to the formula
Figure BDA0002588902520000092
Determining pixel location coordinates (x) of the ball-pin chip template rotation image0,y0) (ii) a Wherein x is0Rotating the abscissa, y, of the pixel position of the image for the ball-pin chip template0For the ordinate, x, of the pixel position of the spherical pin chip template rotation image1Is the abscissa, y, of the pixel location of the ball-pin chip template image1The abscissa of the pixel position of the spherical pin chip template image is shown, and alpha is a rotation angle;
determining pixel position coordinates of a plurality of different spherical pin chip template rotation images according to different rotation angles, and determining a plurality of spherical pin chip template rotation images according to the pixel position coordinates of the plurality of different spherical pin chip template rotation images;
in practical application, a spherical pin chip template image reduced by 8 times is obtained according to the spherical pin chip template image, the spherical pin chip template image reduced by 8 times is rotated according to angle change, the rotation is carried out at an interval of 1 degree from-30 degrees to 30 degrees, and a total of 61 template images are obtained and recorded as Mα(x, y), where α ═ 30, -29,. 0.. 29,30, the template rotation angle is α, and the pixel position in the template is (x, y)1,y1) The rotated template pixel position is (x)0,y0) And the rotation transformation among the chip templates meets the following relation:
Figure BDA0002588902520000101
step 104: obtaining a spherical pin chip binaryzation picture; FIG. 6 is a spherical pin chip binarization picture; as shown in fig. 6. The method comprises the steps of obtaining a gray picture of a spherical pin chip by using a single-channel black-and-white camera, and carrying out binarization on the gray picture by adopting an OTSU algorithm to obtain a binarization picture.
Step 105: matching the spherical pin chip binary image with a plurality of spherical pin chip template rotating images one by one to obtain a first spherical pin chip template rotating image with the maximum relevance to the spherical pin chip binary image; the method comprises the following steps of matching the spherical pin chip binarization picture with a plurality of spherical pin chip template rotation images one by one to obtain a first spherical pin chip template rotation image with the maximum correlation with the spherical pin chip binarization picture, and specifically comprises the following steps:
using a formula
Figure BDA0002588902520000102
Calculating the correlation between a plurality of spherical pin chip template rotation images and the spherical pin chip binary images, wherein Cα(x, y) is a value of correlation between the spherical pin chip template rotation image and the spherical pin chip template rotation image at the (x, y) position in the spherical pin chip binarization image, M (x ', y') is a pixel value of the spherical pin chip template rotation image at the (x ', y') position, I is the spherical pin chip binarization image, x is a horizontal coordinate of the spherical pin chip binarization image pixel, y is a vertical coordinate of the spherical pin chip binarization image pixel, x 'is a horizontal coordinate of the spherical pin chip template rotation image pixel, and y' is a vertical coordinate of the spherical pin chip template rotation image pixel;
and determining the spherical pin chip template rotation image corresponding to the maximum correlation value as the first spherical pin chip template rotation image.
In practical application, firstly, the spherical pin chip is binaryThe transformed picture is scaled to 1/8, and is recorded as a binarized picture of ball-lead chip with 8 times of reduction, as shown in fig. 7. Respectively matching the 8-time reduced spherical pin chip binary images by using a plurality of 8-time reduced spherical pin chip template rotating images to obtain 61 correlation images Cα(x, y), calculating the pixel value corresponding to the minimum point in each image to obtain 61 minimum value sets. Then, the minimum value in 61 minimum value sets is calculated, and the template image corresponding to the value is recorded as Mr(x, y), the template rotation angle r is the rough chip rotation angle. Specifically, a plurality of spherical pin chip template rotating images reduced by 8 times are used for respectively matching spherical pin chip binary images reduced by 8 times, and the specific matching mode is a sliding window method. Traversing the binary image of the spherical pin chip reduced by 8 times by using a sliding window, wherein the moving step length of the sliding window is 1, then calculating the correlation between a plurality of spherical pin chip template rotating images reduced by 8 times and window images, and storing the correlation image C into a correlation image CαAnd (x, y) corresponding to the position, and obtaining a maximum correlation image after traversing the chip picture.
The calculation formula of the correlation between the template and the window image is as follows:
Figure BDA0002588902520000111
step 106: and obtaining the minimum external rectangle of the solder ball on the first spherical pin chip template rotation image according to the first spherical pin chip template rotation image.
The obtaining of the minimum external rectangle of the solder ball on the first spherical pin chip template rotation image according to the first spherical pin chip template rotation image specifically includes:
acquiring a white pixel set formed by all white pixels in the first spherical pin chip template rotation image;
and taking the minimum circumscribed rectangle corresponding to the white pixel set as the minimum circumscribed rectangle of the solder balls on the first spherical pin chip template rotation image.
Step 107: obtaining a minimum circumscribed rectangle linear equation according to the minimum circumscribed rectangle; and the straight line expressed by the minimum circumscribed rectangle straight line equation is the side of the minimum circumscribed rectangle.
In practical application, the first ball pin chip template rotation image M reduced by 8 timesrAnd (x, y) amplifying by 8 times to obtain a template image with a normal size, solving the minimum circumscribed rectangle of the solder balls in the template image to obtain the position of the solder balls tangent to the minimum circumscribed rectangle, and deriving a linear equation of four sides of the rectangle according to the minimum circumscribed rectangle. Specifically, firstly, an interpolation method is adopted to rotate an image M of a first spherical pin chip templateα(x, y) is multiplied by 8 times to obtain a template image M 'with the normal size of the spherical pin chip binary image'α(x, y). And at the moment, the solder balls in the template image are all white pixels, all white pixel points are extracted to form a white pixel set, and the minimum external rectangle of all the white pixel points is obtained to be used as the minimum external rectangle of the template image. The minimum circumscribed rectangle vertex is A (x)a,ya),B(xb,yb),C(xc,yc),D(xd,yd)。
Constructing a linear edge equation by a two-point method according to the positions of four vertexes of the minimum circumscribed rectangle, and knowing two points (x)1,y1),(x2,y2) The equation of the straight line formed by the two points is (x)1-x2)(y-y2)＝(y1-y2)(x1-x2)
Two vertex positions AB, BC, CD and DA adjacent to the minimum circumscribed rectangle are taken to form four groups of edge straight line square paths lAB,lBC,lCD,lDA。
Step 108: and superposing the first spherical pin chip template rotation image and the spherical pin chip binary image, and determining the superposed spherical pin chip image.
In practical application, find the first spherical pin chip template rotation image M with normal sizerCorrelation image C corresponding to (x, y)r(x, y), finding the position of the pixel point with the minimum relevance value in the image, and marking as (x)0,y0) And then, reducing and translating the first spherical pin chip template rotating image with the normal size, firstly reducing the first spherical pin chip template rotating image to the size which is the same as the binaryzation image of the spherical pin chip with the size reduced by 8 times, and then dividing the reduced first spherical pin chip template rotating image into x translation along the x axis0Translating y along the y-axis0And approximately coinciding the reduced first spherical pin chip template rotation image with the spherical pin chip binaryzation image reduced by 8 times.
Step 109: and 8, carrying out connected domain marking on the spherical pin chip binary image in the superposed spherical pin chip image to obtain a connected domain image with a mark.
Step 110: and calculating the distance value from each connected region in the connected region image with the mark number to the edge of the minimum circumscribed rectangle.
FIG. 8 is a schematic diagram of a minimum circumscribed rectangle of a connected region. As shown with reference to fig. 8. Determining the minimum circumscribed rectangle of the connected region image with the mark according to the distance value; the determining the minimum bounding rectangle of the connected region image with the mark according to the distance value specifically includes:
taking all connected areas corresponding to the distance values smaller than the diameter of the solder ball as boundary solder ball positions;
acquiring a central position set formed by the centers of all the boundary solder ball positions;
and determining the minimum circumscribed rectangle of the connected region according to the central position set.
Fig. 9 is a schematic diagram of a boundary solder ball in a ball-lead chip. Referring to fig. 9, in practical application, four straight lines l from the center of each connected region in the connected region image with the mark to the minimum circumscribed rectangle are calculated in a traversal mannerAB,lBC,lCD,lDAIf the minimum value of the distance is smaller than the diameter of the solder ball, the distance is assigned to the boundary solder ball, and the center coordinates of the boundary solder ball are stored to the edge point set. Determining from a set of edge pointsAnd determining the minimum circumscribed rectangle of the communication area.
FIG. 10 is a schematic diagram of a ball-lead chip test positioning. Referring to fig. 10, the position of the minimum circumscribed rectangle of the connected region is the position of the ball-lead chip. In practical application, the center position of the minimum circumscribed rectangle of the communication region is the center position of the spherical pin chip, and the rotation angle of the minimum circumscribed rectangle of the communication region is the rotation angle of the spherical pin chip.
Fig. 11 is a schematic diagram of a ball-lead chip positioning system according to the present invention. As shown in fig. 11, a ball-pin chip positioning system includes:
a chip parameter information obtaining module 1201, configured to obtain parameter information of the ball pin chip; the parameter information comprises the number of solder balls of the spherical pin chip in the x direction, the pin spacing of the spherical pin chip in the x direction, the number of solder balls of the spherical pin chip in the y direction and the pin spacing of the spherical pin chip in the y direction;
a spherical pin chip template image establishing module 1202, configured to establish a spherical pin chip template image according to the parameter information;
a spherical pin chip template rotation image determining module 1203, configured to rotate the spherical pin chip template image according to different rotation angles, so as to obtain a plurality of spherical pin chip template rotation images;
a chip binarization image obtaining module 1204, configured to obtain a spherical pin chip binarization image;
a chip binarization picture correlation matching module 1205, configured to match the spherical pin chip binarization picture with the plurality of spherical pin chip template rotation images one by one, to obtain a first spherical pin chip template rotation image with a maximum correlation with the spherical pin chip binarization picture;
a minimum circumscribed rectangle determining module 1206, configured to obtain a minimum circumscribed rectangle of the solder ball on the first ball-pin chip template rotation image according to the first ball-pin chip template rotation image;
a minimum circumscribed rectangle linear equation determining module 1207, configured to obtain a minimum circumscribed rectangle linear equation according to the minimum circumscribed rectangle; the straight line represented by the minimum circumscribed rectangle straight-line equation is the side of the minimum circumscribed rectangle;
the spherical pin chip image overlapping module 1208 is used for overlapping the first spherical pin chip template rotating image and the spherical pin chip binaryzation picture to determine an overlapped spherical pin chip image;
a connected region image determining module 1209, configured to perform 8 connected region labeling on the spherical pin chip binarized picture in the overlapped spherical pin chip image, to obtain a connected region image with a label;
a distance value determining module 1210, configured to calculate a distance value from each connected region in the connected region image with the mark to the edge of the minimum bounding rectangle;
a connected region minimum bounding rectangle determining module 1211, configured to determine a minimum bounding rectangle of the connected region image with the reference number according to the distance value; and the position of the minimum external rectangle of the communication area is the position of the spherical pin chip.
The spherical pin chip template image creating module 1202 specifically includes:
the spherical pin chip template image establishing unit adopts a formula
Figure BDA0002588902520000141
Determining the length and width of the spherical pin chip template image; wherein T isxIs the length of the spherical pin chip template image, TyIs the width of the spherical pin chip template image, BxThe edge length of the solder ball in the x-direction, Bx＝(Nx-1)PxIn which N isxDenotes the number of solder balls in the x-direction of the ball-lead chip, PxDenotes the lead pitch of the ball-lead chip in the x-direction, ByEdge length of solder ball in y-direction, By＝(Ny-1)PyIn which N isyIndicating bonding of ball-lead chips in the y-directionNumber of balls, PyRepresenting the pin pitch of the ball pin chip in the y direction;
according to the formula
Figure BDA0002588902520000142
Determining the position of the center of each solder ball in the spherical lead chip template image; wherein, Cn,xRepresents the position of the nth solder ball in the x-direction in the ball-pin chip template image, Cm,yThe position of the mth solder ball in the y direction in the image of the ball-shaped pin chip template is shown, n represents the serial number of the solder ball in the x direction, and m represents the serial number of the solder ball in the y direction;
and establishing the spherical pin chip template image according to the position of the center of each solder ball in the spherical pin chip template image and the length and the width of the spherical pin chip template image.
The spherical pin chip template rotation image determining module 1203 specifically includes:
a template image pixel position obtaining unit for obtaining the pixel position coordinates (x) of the spherical pin chip template image1,y1)；
A pixel position determining unit for the spherical pin chip template rotation image according to a formula
Figure BDA0002588902520000151
Determining pixel location coordinates (x) of the spherical pin chip template rotation image0,y0) (ii) a Wherein x is0Rotating the abscissa, y, of pixel position of an image for the ball-pin chip template0For the ordinate, x, of the pixel position of the spherical pin chip template rotation image1Is the abscissa, y, of the pixel position of the spherical pin chip template image1The abscissa of the pixel position of the spherical pin chip template image is taken as the abscissa, and alpha is a rotation angle;
the spherical pin chip template rotation image determining unit is used for determining pixel position coordinates of a plurality of different spherical pin chip template rotation images according to different rotation angles and determining a plurality of spherical pin chip template rotation images according to the pixel position coordinates of the plurality of different spherical pin chip template rotation images.
The invention firstly uses the chip information of the spherical pin chip to construct the spherical pin chip template, and then reduces the spherical pin chip template by 8 times. And (4) carrying out binarization processing on the gray-scale image of the spherical pin chip, and then reducing the image by 8 times to obtain the spherical pin chip binarization image reduced by 8 times. And then carrying out template matching on the 2-piece zoomed pictures and positioning to the rough position of the chip. The method comprises the steps of obtaining a boundary linear equation of a template with the maximum correlation by using a minimum external rectangle, comparing the distance from a chip solder ball to a boundary linear, classifying the minimum distance as a boundary solder ball if the minimum value of the distance is smaller than the diameter of the solder ball, finally fitting the minimum external rectangle of the boundary solder ball, and taking the position of the minimum external rectangle as the accurate position of the chip.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. For the system disclosed by the embodiment, the description is relatively simple because the system corresponds to the method disclosed by the embodiment, and the relevant points can be referred to the method part for description.
The principles and embodiments of the present invention have been described herein using specific examples, which are provided only to help understand the method and the core concept of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the invention.

Claims (8)

1. A method for positioning a spherical pin chip is characterized by comprising the following steps:
acquiring parameter information of a spherical pin chip; the parameter information comprises the number of solder balls of the spherical pin chip in the x direction, the pin spacing of the spherical pin chip in the x direction, the number of solder balls of the spherical pin chip in the y direction and the pin spacing of the spherical pin chip in the y direction;
establishing a spherical pin chip template image according to the parameter information, specifically comprising:
using a formula
Figure FDA0003137976330000011
Determining the length and width of the spherical pin chip template image; wherein T isxIs the length of the spherical pin chip template image, TyIs the width of the spherical pin chip template image, BxThe edge length of the solder ball in the x-direction, Bx＝(Nx-1)PxIn which N isxDenotes the number of solder balls in the x-direction of the ball-lead chip, PxDenotes the lead pitch of the ball-lead chip in the x-direction, ByEdge length of solder ball in y-direction, By＝(Ny-1)PyIn which N isyRepresenting the number of solder balls in the y-direction of the ball-lead chip, PyRepresenting the pin pitch of the ball pin chip in the y direction;
according to the formula
Figure FDA0003137976330000012
Determining the position of the center of each solder ball in the spherical pin chip template image; wherein, Cn,xRepresents the position of the nth solder ball in the x-direction in the ball-pin chip template image, Cm,yThe position of the mth solder ball in the y direction in the image of the ball-shaped pin chip template is shown, n represents the serial number of the solder ball in the x direction, and m represents the serial number of the solder ball in the y direction;
establishing a spherical pin chip template image according to the position of the center of each solder ball in the spherical pin chip template image and the length and width of the spherical pin chip template image;
rotating the spherical pin chip template images according to different rotation angles to obtain a plurality of spherical pin chip template rotation images;
obtaining a spherical pin chip binaryzation picture;
matching the spherical pin chip binarization picture with a plurality of spherical pin chip template rotation images one by one to obtain a first spherical pin chip template rotation image with the maximum relevance to the spherical pin chip binarization picture;
obtaining a minimum circumscribed rectangle of a solder ball on the first spherical pin chip template rotation image according to the first spherical pin chip template rotation image;
obtaining a minimum circumscribed rectangle linear equation according to the minimum circumscribed rectangle; the straight line represented by the minimum circumscribed rectangle straight-line equation is the side of the minimum circumscribed rectangle;
the first spherical pin chip template rotating image is overlapped with the spherical pin chip binaryzation picture, and an overlapped spherical pin chip image is determined;
carrying out 8 connected domain marking on the spherical pin chip binary image in the superposed spherical pin chip image to obtain a connected domain image with a mark number;
calculating the distance value from each connected region in the connected region image with the mark number to the edge of the minimum circumscribed rectangle;
determining the minimum circumscribed rectangle of the connected region image with the mark according to the distance value; the position of the minimum external rectangle of the communication area is the position of the spherical pin chip.
2. The method according to claim 1, wherein the step of rotating the ball-shaped pin chip template image according to different rotation angles to obtain a plurality of ball-shaped pin chip template rotation images comprises:
obtaining thePixel position coordinates (x) of spherical pin chip template image1,y1)；
According to the formula
Figure FDA0003137976330000021
Determining pixel location coordinates (x) of the spherical pin chip template rotation image0,y0) (ii) a Wherein x is0Rotating the abscissa, y, of pixel position of an image for the ball-pin chip template0For the ordinate, x, of the pixel position of the spherical pin chip template rotation image1Is the abscissa, y, of the pixel position of the spherical pin chip template image1The abscissa of the pixel position of the spherical pin chip template image is taken as the abscissa, and alpha is a rotation angle;
and determining pixel position coordinates of a plurality of different spherical pin chip template rotation images according to different rotation angles, and determining a plurality of spherical pin chip template rotation images according to the pixel position coordinates of the plurality of different spherical pin chip template rotation images.
3. The method according to claim 1, wherein the obtaining a binarized picture of the ball-lead chip further comprises:
the method comprises the steps of obtaining a gray level picture of a spherical pin chip by using a single-channel black-and-white camera, and carrying out binarization processing on the gray level picture by adopting an OTSU (over the horizon) algorithm to generate a spherical pin chip binarization picture.
4. The method according to claim 1, wherein the step of matching the binarized image of the ball-shaped pin chip with the plurality of template rotation images of the ball-shaped pin chip one by one to obtain a first template rotation image of the ball-shaped pin chip having a maximum correlation with the binarized image of the ball-shaped pin chip comprises:
using a formula
Figure FDA0003137976330000031
Calculating the correlation between a plurality of spherical pin chip template rotation images and the spherical pin chip binary images, wherein Cα(x, y) is a value of correlation between the spherical pin chip template rotation image and the spherical pin chip template rotation image at the (x, y) position in the spherical pin chip binarization image, M (x ', y') is a pixel value of the spherical pin chip template rotation image at the (x ', y') position, I is the spherical pin chip binarization image, x is an abscissa of the spherical pin chip binarization image pixels, y is an ordinate of the spherical pin chip binarization image pixels, x 'is an abscissa of the spherical pin chip template rotation image pixels, and y' is an ordinate of the spherical pin chip template rotation image pixels;
and determining the spherical pin chip template rotation image corresponding to the maximum correlation value as the first spherical pin chip template rotation image.
5. The method according to claim 1, wherein obtaining the minimum circumscribed rectangle of the solder balls on the first ball-pin chip template rotation image according to the first ball-pin chip template rotation image comprises:
acquiring a white pixel set formed by all white pixels in the first spherical pin chip template rotation image;
and taking the minimum circumscribed rectangle corresponding to the white pixel set as the minimum circumscribed rectangle of the solder balls on the first spherical pin chip template rotation image.
6. The method according to claim 1, wherein the determining the minimum bounding rectangle of the connected region of the labeled connected region image according to the distance value specifically comprises:
taking all connected areas corresponding to the distance values smaller than the diameter of the solder ball as boundary solder ball positions;
acquiring a central position set formed by the centers of all the boundary solder ball positions;
and determining the minimum circumscribed rectangle of the connected region according to the central position set.
7. A ball pin chip positioning system, comprising:
the chip parameter information acquisition module is used for acquiring the parameter information of the spherical pin chip; the parameter information comprises the number of solder balls of the spherical pin chip in the x direction, the pin spacing of the spherical pin chip in the x direction, the number of solder balls of the spherical pin chip in the y direction and the pin spacing of the spherical pin chip in the y direction;
the spherical pin chip template image establishing module is used for establishing a spherical pin chip template image according to the parameter information, and specifically comprises the following steps:
the spherical pin chip template image establishing unit adopts a formula
Figure FDA0003137976330000041
Determining the length and width of the spherical pin chip template image; wherein T isxIs the length of the spherical pin chip template image, TyIs the width of the spherical pin chip template image, BxThe edge length of the solder ball in the x-direction, Bx＝(Nx-1)PxIn which N isxDenotes the number of solder balls in the x-direction of the ball-lead chip, PxDenotes the lead pitch of the ball-lead chip in the x-direction, ByEdge length of solder ball in y-direction, By＝(Ny-1)PyIn which N isyRepresenting the number of solder balls in the y-direction of the ball-lead chip, PyRepresenting the pin pitch of the ball pin chip in the y direction;
according to the formula
Figure FDA0003137976330000051
Determining the position of the center of each solder ball in the spherical pin chip template image; wherein, Cn,xRepresents the position of the nth solder ball in the x-direction in the ball-pin chip template image, Cm,yThe position of the mth solder ball in the y direction in the image of the ball-shaped pin chip template is shown, n represents the serial number of the solder ball in the x direction, and m represents the serial number of the solder ball in the y direction;
establishing a spherical pin chip template image according to the position of the center of each solder ball in the spherical pin chip template image and the length and width of the spherical pin chip template image;
the spherical pin chip template rotation image determining module is used for rotating the spherical pin chip template images according to different rotation angles to obtain a plurality of spherical pin chip template rotation images;
the chip binarization image obtaining module is used for obtaining a spherical pin chip binarization image;
the chip binarization picture correlation matching module is used for matching the spherical pin chip binarization pictures with a plurality of spherical pin chip template rotation images one by one to obtain a first spherical pin chip template rotation image with the maximum correlation with the spherical pin chip binarization pictures;
the minimum external rectangle determining module is used for obtaining the minimum external rectangle of the solder ball on the first spherical pin chip template rotation image according to the first spherical pin chip template rotation image;
the minimum circumscribed rectangle linear equation determining module is used for obtaining a minimum circumscribed rectangle linear equation according to the minimum circumscribed rectangle; the straight line represented by the minimum circumscribed rectangle straight-line equation is the side of the minimum circumscribed rectangle;
the spherical pin chip image overlapping module is used for overlapping the first spherical pin chip template rotating image and the spherical pin chip binaryzation picture and determining an overlapped spherical pin chip image;
a connected region image determining module, configured to perform 8-connected region labeling on the spherical pin chip binarized picture in the overlapped spherical pin chip image, to obtain a connected region image with a label;
the distance value determining module is used for calculating the distance value from each connected region in the connected region image with the mark number to the edge of the minimum circumscribed rectangle;
the minimum circumscribed rectangle determining module of the connected region is used for determining the minimum circumscribed rectangle of the connected region image with the mark according to the distance value; the position of the minimum external rectangle of the communication area is the position of the spherical pin chip.
8. The ball-pin chip positioning system of claim 7, wherein the ball-pin chip template rotation image determination module specifically comprises:
a template image pixel position obtaining unit for obtaining the pixel position coordinates (x) of the spherical pin chip template image1,y1)；
A pixel position determining unit for the spherical pin chip template rotation image according to a formula
Figure FDA0003137976330000061
Determining pixel location coordinates (x) of the spherical pin chip template rotation image0,y0) (ii) a Wherein x is0Rotating the abscissa, y, of pixel position of an image for the ball-pin chip template0For the ordinate, x, of the pixel position of the spherical pin chip template rotation image1Is the abscissa, y, of the pixel position of the spherical pin chip template image1The abscissa of the pixel position of the spherical pin chip template image is taken as the abscissa, and alpha is a rotation angle;
the spherical pin chip template rotation image determining unit is used for determining pixel position coordinates of a plurality of different spherical pin chip template rotation images according to different rotation angles and determining a plurality of spherical pin chip template rotation images according to the pixel position coordinates of the plurality of different spherical pin chip template rotation images.
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Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5895554A (en) * 1997-02-21 1999-04-20 Gordon; Thomas A. Alignment method and apparatus for mounting electronic components
JP2004228163A (en) * 2003-01-20 2004-08-12 On Denshi Kk Method and apparatus for collecting inspection data of respective solder ball locations
CN101840572A (en) * 2010-04-13 2010-09-22 河海大学常州校区 QFP element position error visual inspection method based on region segmentation
CN103729632A (en) * 2014-01-22 2014-04-16 哈尔滨工业大学 Round Mark point positioning method based on connected region filtering
CN103745475A (en) * 2014-01-22 2014-04-23 哈尔滨工业大学 Detection and positioning method used for spherical pin element
CN103761534A (en) * 2014-01-22 2014-04-30 哈尔滨工业大学 Method for detecting vision localization of QFP element
CN104700085A (en) * 2015-03-10 2015-06-10 华中科技大学 Template matching-based chip positioning method
CN104915963A (en) * 2015-06-25 2015-09-16 哈尔滨工业大学 Detection and positioning method for PLCC component
CN105005997A (en) * 2015-08-05 2015-10-28 哈尔滨工业大学 Multi-type BGA chip visual identification method based on row and column linear clustering
CN105046271A (en) * 2015-06-25 2015-11-11 哈尔滨工业大学 MELF (Metal Electrode Leadless Face) component positioning and detecting method based on match template
CN105066892A (en) * 2015-08-05 2015-11-18 哈尔滨工业大学 BGA element detecting and positioning method based on linear clustering analysis
CN105184770A (en) * 2015-08-05 2015-12-23 哈尔滨工业大学 Solder ball positioning and parameter identification method for ball grid array pin chip
CN105809705A (en) * 2016-03-30 2016-07-27 广东工业大学 Patch element positioning identification method based on minimum enclosing rectangle
CN106447673A (en) * 2016-09-30 2017-02-22 哈尔滨工业大学 Chip pin extraction method under non-uniform illumination condition
CN106485749A (en) * 2016-10-19 2017-03-08 哈尔滨工业大学 A kind of rectangular pins element rough localization method based on angle point
CN106485284A (en) * 2016-10-19 2017-03-08 哈尔滨工业大学 A kind of element localization method based on template matching
US9704232B2 (en) * 2014-03-18 2017-07-11 Arizona Board of Regents of behalf of Arizona State University Stereo vision measurement system and method
CN107451370A (en) * 2017-08-11 2017-12-08 哈尔滨工业大学 A kind of method for drafting of the symmetrical pin cake core of robustness
CN107464240A (en) * 2017-08-11 2017-12-12 哈尔滨工业大学 A kind of location algorithm with rectangular pins chip based on template matches
CN107484341A (en) * 2017-08-11 2017-12-15 哈尔滨工业大学 A kind of method for drafting of adaptive asymmetric pin cake core
CN109785316A (en) * 2019-01-22 2019-05-21 湖南大学 A kind of apparent defect inspection method of chip
CN107504896B (en) * 2017-08-11 2019-07-16 哈尔滨工业大学 A kind of location algorithm based on the matched spherical pin element of point

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5895554A (en) * 1997-02-21 1999-04-20 Gordon; Thomas A. Alignment method and apparatus for mounting electronic components
JP2004228163A (en) * 2003-01-20 2004-08-12 On Denshi Kk Method and apparatus for collecting inspection data of respective solder ball locations
CN101840572A (en) * 2010-04-13 2010-09-22 河海大学常州校区 QFP element position error visual inspection method based on region segmentation
CN103729632A (en) * 2014-01-22 2014-04-16 哈尔滨工业大学 Round Mark point positioning method based on connected region filtering
CN103745475A (en) * 2014-01-22 2014-04-23 哈尔滨工业大学 Detection and positioning method used for spherical pin element
CN103761534A (en) * 2014-01-22 2014-04-30 哈尔滨工业大学 Method for detecting vision localization of QFP element
US9704232B2 (en) * 2014-03-18 2017-07-11 Arizona Board of Regents of behalf of Arizona State University Stereo vision measurement system and method
CN104700085A (en) * 2015-03-10 2015-06-10 华中科技大学 Template matching-based chip positioning method
CN104915963A (en) * 2015-06-25 2015-09-16 哈尔滨工业大学 Detection and positioning method for PLCC component
CN105046271A (en) * 2015-06-25 2015-11-11 哈尔滨工业大学 MELF (Metal Electrode Leadless Face) component positioning and detecting method based on match template
CN105066892A (en) * 2015-08-05 2015-11-18 哈尔滨工业大学 BGA element detecting and positioning method based on linear clustering analysis
CN105184770A (en) * 2015-08-05 2015-12-23 哈尔滨工业大学 Solder ball positioning and parameter identification method for ball grid array pin chip
CN105005997A (en) * 2015-08-05 2015-10-28 哈尔滨工业大学 Multi-type BGA chip visual identification method based on row and column linear clustering
CN105809705A (en) * 2016-03-30 2016-07-27 广东工业大学 Patch element positioning identification method based on minimum enclosing rectangle
CN106447673A (en) * 2016-09-30 2017-02-22 哈尔滨工业大学 Chip pin extraction method under non-uniform illumination condition
CN106485749A (en) * 2016-10-19 2017-03-08 哈尔滨工业大学 A kind of rectangular pins element rough localization method based on angle point
CN106485284A (en) * 2016-10-19 2017-03-08 哈尔滨工业大学 A kind of element localization method based on template matching
CN107451370A (en) * 2017-08-11 2017-12-08 哈尔滨工业大学 A kind of method for drafting of the symmetrical pin cake core of robustness
CN107464240A (en) * 2017-08-11 2017-12-12 哈尔滨工业大学 A kind of location algorithm with rectangular pins chip based on template matches
CN107484341A (en) * 2017-08-11 2017-12-15 哈尔滨工业大学 A kind of method for drafting of adaptive asymmetric pin cake core
CN107504896B (en) * 2017-08-11 2019-07-16 哈尔滨工业大学 A kind of location algorithm based on the matched spherical pin element of point
CN109785316A (en) * 2019-01-22 2019-05-21 湖南大学 A kind of apparent defect inspection method of chip

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
A Line-Based-Clustering Approach for Ball Grid Array Component Inspection in Surface-Mount Technology;huijun gao et al.;《 IEEE Transactions on Industrial Electronics》;20161222;第64卷(第4期);1-11 *
Locating and checking of BGA pins’ position using gray level;Ching Long Shih et al.;《Int J Adv Manuf Technol》;20050727;1-8 *
Precise Positioning of Circular Mark Points and Transistor Components in Surface Mounting Technology Applications;chao xu et al.;《 IEEE Transactions on Industrial Informatics》;20200601;第17卷(第4期);1-9 *
典型封装芯片表面贴装在线视觉识别与定位的研究;寸毛毛;《中国优秀硕士学位论文全文数据库信息科技辑》;20180115(第12期);全文 *

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