CN112964737A - Double-sided appearance detection method of circuit board - Google Patents
Double-sided appearance detection method of circuit board Download PDFInfo
- Publication number
- CN112964737A CN112964737A CN202110154752.3A CN202110154752A CN112964737A CN 112964737 A CN112964737 A CN 112964737A CN 202110154752 A CN202110154752 A CN 202110154752A CN 112964737 A CN112964737 A CN 112964737A
- Authority
- CN
- China
- Prior art keywords
- point
- circuit board
- appearance
- confirmed
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N2021/0106—General arrangement of respective parts
- G01N2021/0112—Apparatus in one mechanical, optical or electronic block
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
Abstract
The invention relates to the technical field of circuit board detection, in particular to a double-sided appearance detection method of a circuit board, which comprises the following steps: step S1: shooting and acquiring image data of a first surface of a circuit board; step S2: acquiring a first report point of a specific position for the image data of the first surface; step S3: judging the appearance defects of the first report point to determine that the first report point is a first NG point or a first point to be confirmed; step S4: recording and extracting coordinates of the first NG point and the first point to be confirmed; step S5: and shooting the coordinate corresponding to the first NG point and the coordinate corresponding to the first point to be confirmed of the first surface, or only shooting the coordinate corresponding to the first point to be confirmed, acquiring an image, judging the appearance defect, finally determining whether the appearance defect exists on the first surface, and recording the coordinate of the appearance defect existing on the first surface. The double-sided appearance detection method of the circuit board is beneficial to reducing the probability of false detection and missed detection, has more accurate detection result and higher automation degree.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of circuit board detection, in particular to a double-sided appearance detection method of a circuit board.
[ background of the invention ]
At present, the appearance detection of the circuit board is mainly based on manual visual inspection, the detection method has low efficiency, too depends on the experience of workers, and has inaccurate detection result and high probability of missed detection and wrong detection; even if some AOI equipment or AVI equipment can also achieve certain appearance detection, the detection accuracy is low, so that the image of the measured circuit board is greatly different from the image of the standard circuit board, the detection result accuracy is low due to the fact that the circuit board has the factors such as chromatic aberration, deviation and size expansion and shrinkage, manual review is often needed, the probability of wrong detection and missed detection exists due to the factors such as long-time work fatigue during manual review, and certain labor cost is wasted.
Therefore, the prior art is not sufficient and needs to be improved.
[ summary of the invention ]
In order to overcome the technical problems, the invention provides a double-sided appearance detection method of a circuit board.
The invention provides a double-sided appearance detection method of a circuit board, which solves the technical problem and comprises the following steps:
step S1: shooting and acquiring image data of a first surface of a circuit board;
step S2: acquiring a first report point of a specific position for the image data of the first surface;
step S3: judging the appearance defects of the first report point to determine that the first report point is a first NG point or a first point to be confirmed;
step S4: recording and extracting coordinates of the first NG point and the first point to be confirmed;
step S5: the method comprises the steps that coordinates corresponding to a first NG point and coordinates corresponding to a first point to be confirmed of a first surface are shot, images are obtained and appearance defects are judged, whether the first surface has appearance defects or not is finally determined, and the coordinates of the first surface with the appearance defects are recorded;
step S6: turning over the circuit board;
step S7: shooting and acquiring image data of a second surface of the circuit board;
step S8: acquiring a second report point of a specific position for the image data of the second surface;
step S9: judging the appearance defects of the second report points to determine that the second report points are second NG points or second points to be confirmed;
step S10: recording and extracting coordinates of the second NG point and the second point to be confirmed;
step S11: and shooting the coordinates corresponding to the second NG point and the second point to be confirmed of the second surface, or only shooting the coordinates corresponding to the second point to be confirmed, acquiring an image, judging the appearance defect, finally determining whether the second surface has the appearance defect, and recording the coordinates of the second surface with the appearance defect.
Preferably, the appearance detection method of the circuit board further includes the steps of:
step S12: outputting and integrating the coordinates of the first surface with the appearance defects and the coordinates of the second surface with the appearance defects;
step S13: and marking or repairing the circuit board with the appearance defects.
Preferably, in steps S1 and S7, a color high definition picture is taken by a color linear CCD camera to acquire image data.
Preferably, in steps S5 and S11, a high magnification picture is acquired by the area-array camera to acquire an image.
Preferably, in step S13, the identification process may be performed manually or by an automated device.
Preferably, in step S3 and step S9, the first report and the second report are counted.
Preferably, in step S6, the circuit board is flipped over by the flipping mechanism.
Preferably, the statistics are performed by generating NG maps or generating tables.
Preferably, in step S13, the identification process for the first side and/or the second side of the circuit board is implemented by flipping the circuit board.
Compared with the prior art, the double-sided appearance detection method of the circuit board has the following advantages:
the circuit board is subjected to appearance detection through machine vision, the detection has higher objectivity, and because the machine does not generate fatigue, the detection has higher level in the accuracy degree of a detection result compared with manual detection, the detection does not need to depend on the experience of workers, excessive rest is not needed, the production efficiency of an enterprise is favorably improved, the production benefit and the market share of the enterprise are further favorably improved, meanwhile, the two sides of the circuit board can be detected at one time, the turnover of the circuit board can be realized through a turnover mechanism and other modes in the process, and the comprehensive and higher automation degree is realized; the method can reduce the workload of manual visual inspection to the maximum extent, avoid the risk caused by manual error, reduce the probability of missed inspection and false inspection, and can reduce the point dropping processing of the report point through recheck when the acquired image quality is poor, thereby further ensuring the accuracy of defect detection while improving the intellectualization of appearance detection.
Meanwhile, whether the circuit board has appearance defects or not can be finally determined through rechecking, the accuracy of the detection result is further improved through secondary detection, the probability of false detection and missed detection is reduced, and the unnecessary workload of workers or the probability that qualified products are judged to be unqualified products due to false detection and missed detection are reduced.
Moreover, the functions of counting the defective circuit boards and identifying the defective circuit boards are provided, so that the automation degree of the appearance detection field is enhanced, the labor cost is saved, the probability of manual errors is reduced, and the detection efficiency is improved.
[ description of the drawings ]
Fig. 1 is a schematic diagram of a detailed flow structure of steps S1-S5 of the double-sided appearance inspection method of the circuit board of the present invention.
Fig. 2 is a schematic diagram of a detailed flow structure of steps S6-S11 of the double-sided appearance inspection method of the circuit board of the present invention.
Fig. 3 is a schematic diagram of a detailed flow structure of steps S12-S13 of the double-sided appearance inspection method of the circuit board of the present invention.
[ detailed description ] embodiments
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 to 3, the present invention provides a method for detecting appearance defects of a circuit board, which is used to detect appearance defects of a first surface and a second surface of the circuit board to determine whether the appearance of the circuit board has defects, wherein the appearance defects of the circuit board include the presence of foreign matters, copper exposure, scratches, poor gold plating, character errors, uneven green oil, missing printing, etc., and the method includes the following steps:
step S1: image data of the first side of the circuit board is photographed and acquired.
Specifically, the circuit board may be photographed and image data may be acquired by an AVI photographing apparatus or an AOI photographing apparatus, which includes but is not limited to this, and the image data may also be acquired by a linear scanning manner, which may be actually selected.
Step S2: a first hit at a specific position is obtained for the image data of the first side.
It is understood that the first hit points include a first OK point, a first NG point, and a first to-be-confirmed point, wherein the first OK point is filtered in the subsequent detection because the first hit point is the first hit point without defect. The first point to be confirmed and the first NG point are first report points which are found out through comparison and analysis and are different from standard comparison data, wherein the standard comparison data are image data of the circuit board which are recorded in advance and have no appearance defects.
Step S3: and judging the appearance defects of the first report point to determine that the first report point is a first NG point or a first point to be confirmed.
The first NG point is a first report point with a defect after the initial detection, and the first point to be confirmed is a first report point which is relatively blurred in the image due to factors such as the shooting light and cannot be determined to be a defect.
Step S4: recording and extracting coordinates of the first NG point and the first point to be confirmed;
step S5: and shooting the coordinate corresponding to the first NG point and the coordinate corresponding to the first point to be confirmed of the first surface, or only shooting the coordinate corresponding to the first point to be confirmed, acquiring an image, judging the appearance defect, finally determining whether the appearance defect exists on the first surface, and recording the coordinate of the appearance defect existing on the first surface.
In the present invention, the coordinates of the first NG point and the first point to be confirmed are recorded and extracted, and in step S5, an image is captured and the coordinates of the first NG point and the first point to be confirmed are subjected to secondary defect determination to finally determine whether the first NG point and the first point to be confirmed are the first report point having a defect, and the coordinates of the first report point having a defect are recorded. Including but not limited to this, it is also possible to perform defect determination only on the first point to be confirmed to finally determine whether the first point to be confirmed is a point where a defect exists.
Step S6: and turning over the circuit board.
Specifically, the turnover can be performed in an automatic mode such as a turnover mechanism, and the automation degree is improved.
Step S7: and shooting and acquiring image data of the second surface of the circuit board.
Preferably, in steps S1 and S7, the image data of the first and second surfaces are acquired by taking a color high-definition picture by a color linear CCD camera.
Step S8: and acquiring a second report point of a specific position for the image data of the second surface.
It is understood that the second hit points include a second OK point, a second NG point, and a second to-be-confirmed point, wherein the second OK point is filtered in the subsequent detection because the second hit point is a second hit point without a defect. Wherein, the second point to be confirmed and the second NG point are the second report points which are found out by comparison and analysis and have difference with the standard comparison data.
Step S9: and judging the appearance defects of the second report point to determine that the second report point is a second NG point or a second point to be confirmed.
Preferably, in step S3 and step S9, the first report point and the second report point may be counted, and specifically, the counting may be performed by generating an NG map and generating a table.
Step S10: recording and extracting coordinates of the second NG point and the second point to be confirmed;
step S11: and shooting the coordinates corresponding to the second NG point and the second point to be confirmed of the second surface, or only shooting the coordinates corresponding to the second point to be confirmed, acquiring an image, judging the appearance defect, finally determining whether the second surface has the appearance defect, and recording the coordinates of the second surface with the appearance defect.
After finishing judging the appearance defects of the first report points of the first surface, finally determining whether the second surface has second report points with defects or not by turning over the circuit board and judging the appearance defects twice, and recording the coordinates of the second report points with defects. Preferably, in steps S5 and S11, a high magnification picture is acquired by the area-array camera to acquire an image.
In the present invention, the coordinates of the second NG point and the second point to be confirmed are recorded and extracted, and in step S11, an image is captured and the coordinates of the second NG point and the second point to be confirmed are subjected to secondary defect determination to finally determine whether the second NG point and the second point to be confirmed are the first report point having a defect, and the coordinates of the first report point having a defect are recorded. Including but not limited to, the defect determination may be performed only on the second point to be confirmed to finally determine whether the second point to be confirmed is a point where a defect exists.
Step S12: and outputting and integrating the coordinates of the appearance defects of the first surface and the coordinates of the appearance defects of the second surface.
It will be appreciated that the integration of coordinates facilitates accurate location of defective circuit boards for subsequent identification or repair processing.
Step S13: and marking or repairing the circuit board with the appearance defects.
And outputting and integrating coordinates corresponding to the first reporting point and the second reporting point with the defects, and performing identification processing or maintenance processing on the circuit board with the defects.
In step 13, the identification process may be performed manually or by an automated device. Specifically, in the invention, identification processing is carried out through automatic equipment, specifically, the identification processing is that circuit boards with appearance defects are extracted and scrapped by workers, and therefore, the circuit boards which cannot be maintained are processed; the maintenance treatment is that the circuit board with the appearance defects is extracted by workers and is subjected to specific maintenance treatment according to the appearance defect types so as to be qualified.
Preferably, in step S13, the identification process for the first side and/or the second side of the circuit board is realized by turning the circuit board; specifically, if the circuit board needs to carry out the one side of sign processing, first face or second face sets up with automation equipment is relative, then need not carry out the turn-over and can carry out the sign processing, if the circuit board needs to carry out the one side of sign processing, first face or second face sets up with automation equipment back of the body mutually, then need carry out the turn-over in order to carry out the sign processing, if the first face of circuit board all needs to carry out the sign processing with the second face, then carry out the turn-over after the processing is accomplished the one side and handle in order to carry out the sign to the another side.
Compared with the prior art, the double-sided appearance detection method of the circuit board has the following advantages:
the circuit board is subjected to appearance detection through machine vision, the detection has higher objectivity, and because the machine does not generate fatigue, the detection has higher level in the accuracy degree of a detection result compared with manual detection, the detection does not need to depend on the experience of workers, excessive rest is not needed, the production efficiency of an enterprise is favorably improved, the production benefit and the market share of the enterprise are further favorably improved, meanwhile, the two sides of the circuit board can be detected at one time, the turnover of the circuit board can be realized through a turnover mechanism and other modes in the process, and the comprehensive and higher automation degree is realized; the method can reduce the workload of manual visual inspection to the maximum extent, avoid the risk caused by manual error, reduce the probability of missed inspection and false inspection, and can reduce the point dropping processing of the report point through recheck when the acquired image quality is poor, thereby further ensuring the accuracy of defect detection while improving the intellectualization of appearance detection.
Meanwhile, whether the circuit board has appearance defects or not can be finally determined through rechecking, the accuracy of the detection result is further improved through secondary detection, the probability of false detection and missed detection is reduced, and the unnecessary workload of workers or the probability that qualified products are judged to be unqualified products due to false detection and missed detection are reduced.
Moreover, the functions of counting the defective circuit boards and identifying the defective circuit boards are provided, so that the automation degree of the appearance detection field is enhanced, the labor cost is saved, the probability of manual errors is reduced, and the detection efficiency is improved.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and any modifications, equivalents, improvements, etc. made within the spirit of the present invention should be included in the scope of the present invention.
Claims (9)
1. A double-sided appearance detection method of a circuit board is characterized by comprising the following steps: the appearance detection method of the circuit board comprises the following steps:
step S1: shooting and acquiring image data of a first surface of a circuit board;
step S2: acquiring a first report point of a specific position for the image data of the first surface;
step S3: judging the appearance defects of the first report point to determine that the first report point is a first NG point or a first point to be confirmed;
step S4: recording and extracting coordinates of the first NG point and the first point to be confirmed;
step S5: the method comprises the steps that coordinates corresponding to a first NG point and coordinates corresponding to a first point to be confirmed of a first surface are shot, images are obtained and appearance defects are judged, whether the first surface has appearance defects or not is finally determined, and the coordinates of the first surface with the appearance defects are recorded;
step S6: turning over the circuit board;
step S7: shooting and acquiring image data of a second surface of the circuit board;
step S8: acquiring a second report point of a specific position for the image data of the second surface;
step S9: judging the appearance defects of the second report points to determine that the second report points are second NG points or second points to be confirmed;
step S10: recording and extracting coordinates of the second NG point and the second point to be confirmed;
step S11: and shooting the coordinates corresponding to the second NG point and the second point to be confirmed of the second surface, or only shooting the coordinates corresponding to the second point to be confirmed, acquiring an image, judging the appearance defect, finally determining whether the second surface has the appearance defect, and recording the coordinates of the second surface with the appearance defect.
2. The double-sided appearance inspection method of a circuit board according to claim 1, characterized in that: the appearance detection method of the circuit board further comprises the following steps:
step S12: outputting and integrating the coordinates of the first surface with the appearance defects and the coordinates of the second surface with the appearance defects;
step S13: and marking or repairing the circuit board with the appearance defects.
3. The double-sided appearance inspection method of a circuit board according to claim 1, characterized in that: in steps S1 and S7, a color high definition picture is taken by a color linear CCD camera to acquire image data.
4. The double-sided appearance inspection method of a circuit board according to claim 1, characterized in that: in steps S5 and S11, a high magnification picture is acquired by the area-array camera to acquire an image.
5. The double-sided appearance inspection method of a circuit board according to claim 2, characterized in that: in step S13, the identification process may be performed manually or by an automated device.
6. The double-sided appearance inspection method of a circuit board according to claim 1, characterized in that: in steps S3 and S9, the first report and the second report are counted.
7. The double-sided appearance inspection method of a circuit board according to claim 1, characterized in that: in step S6, the circuit board is turned over by the turning mechanism.
8. The double-sided appearance inspection method of a circuit board according to claim 6, characterized in that: and counting by generating an NG map or generating a form.
9. The double-sided appearance inspection method of a circuit board according to claim 2, characterized in that: in step S13, the identification process for the first side and/or the second side of the circuit board is implemented by flipping the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110154752.3A CN112964737A (en) | 2021-02-04 | 2021-02-04 | Double-sided appearance detection method of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110154752.3A CN112964737A (en) | 2021-02-04 | 2021-02-04 | Double-sided appearance detection method of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112964737A true CN112964737A (en) | 2021-06-15 |
Family
ID=76275477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110154752.3A Pending CN112964737A (en) | 2021-02-04 | 2021-02-04 | Double-sided appearance detection method of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112964737A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114580454A (en) * | 2022-02-24 | 2022-06-03 | 发明之家(北京)科技有限公司 | Method and system for identifying poor chip appearance |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11230917A (en) * | 1998-02-12 | 1999-08-27 | Nikon Corp | Defect inspection apparatus |
| CN101403708A (en) * | 2008-10-31 | 2009-04-08 | 广东正业科技有限公司 | External appearance defect examination method for circuit board |
| JP2013024666A (en) * | 2011-07-20 | 2013-02-04 | Panasonic Corp | Defect detection method and defect detection device |
| CN107367682A (en) * | 2017-06-26 | 2017-11-21 | 王俊 | Printed circuit board repair method and system |
| JP2018146492A (en) * | 2017-03-08 | 2018-09-20 | 東レエンジニアリング株式会社 | Defect inspection system and inspection device and review device used for the same |
| CN110455822A (en) * | 2019-07-10 | 2019-11-15 | 苏州卓融新能源科技有限公司 | A kind of detection method of pcb board defect |
| CN110579479A (en) * | 2019-08-09 | 2019-12-17 | 康代影像科技(苏州)有限公司 | PCB maintenance system and maintenance method based on false point defect detection |
| CN112945986A (en) * | 2021-02-04 | 2021-06-11 | 鼎勤科技(深圳)有限公司 | Double-sided appearance detection method of circuit board |
-
2021
- 2021-02-04 CN CN202110154752.3A patent/CN112964737A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11230917A (en) * | 1998-02-12 | 1999-08-27 | Nikon Corp | Defect inspection apparatus |
| CN101403708A (en) * | 2008-10-31 | 2009-04-08 | 广东正业科技有限公司 | External appearance defect examination method for circuit board |
| JP2013024666A (en) * | 2011-07-20 | 2013-02-04 | Panasonic Corp | Defect detection method and defect detection device |
| JP2018146492A (en) * | 2017-03-08 | 2018-09-20 | 東レエンジニアリング株式会社 | Defect inspection system and inspection device and review device used for the same |
| CN107367682A (en) * | 2017-06-26 | 2017-11-21 | 王俊 | Printed circuit board repair method and system |
| CN110455822A (en) * | 2019-07-10 | 2019-11-15 | 苏州卓融新能源科技有限公司 | A kind of detection method of pcb board defect |
| CN110579479A (en) * | 2019-08-09 | 2019-12-17 | 康代影像科技(苏州)有限公司 | PCB maintenance system and maintenance method based on false point defect detection |
| CN112945986A (en) * | 2021-02-04 | 2021-06-11 | 鼎勤科技(深圳)有限公司 | Double-sided appearance detection method of circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114580454A (en) * | 2022-02-24 | 2022-06-03 | 发明之家(北京)科技有限公司 | Method and system for identifying poor chip appearance |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI757825B (en) | System and method for pcb inspection based on false defect detection | |
| CN106651857B (en) | A kind of printed circuit board patch defect inspection method | |
| CN112053318A (en) | Two-dimensional PCB defect real-time automatic detection and classification device based on deep learning | |
| WO2017177717A1 (en) | Element positioning method and system based on color and gradient | |
| CN113325001A (en) | Automatic distinguishing and detecting equipment and method for surface appearance flaws of copper foil | |
| CN111812103A (en) | Image acquisition device, visual detection system and detection point extraction method | |
| WO2017071406A1 (en) | Method and system for detecting pin of gold needle element | |
| WO2017107529A1 (en) | Positioning method and device for diodes arranged side by side | |
| WO2017050088A1 (en) | Method and device for locating electronic component | |
| CN112964737A (en) | Double-sided appearance detection method of circuit board | |
| CN114820439A (en) | PCB bare board defect detection system and method based on AOI | |
| CN113176275B (en) | Method, device and system for retesting display panel | |
| CN112945986A (en) | Double-sided appearance detection method of circuit board | |
| CN110658215B (en) | PCB automatic splicing detection method and device based on machine vision | |
| CN115375679B (en) | Edge-finding and point-searching positioning method and device for defective chip | |
| WO2018068414A1 (en) | Detection method and device for resistor having color bands, and automated optical inspection system | |
| CN115598136A (en) | Detection apparatus for screen rubber coating quality | |
| CN115753832A (en) | Detection method for new energy automobile integrated circuit board | |
| CN114758158A (en) | Quality inspection method and system for PCB | |
| TW201522949A (en) | Inspection method for image data | |
| TWI634308B (en) | 2d solder paste printing inspection method | |
| KR20200126921A (en) | A method for inspecting a skeleton wafer | |
| CN112837285A (en) | Edge detection method and device for panel image | |
| CN111539933B (en) | Direct-insert element detection method and system | |
| KR101017332B1 (en) | Method for Optical Test of PCB |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210615 |
|
| RJ01 | Rejection of invention patent application after publication |