CN115753832A - Detection method for new energy automobile integrated circuit board - Google Patents
Detection method for new energy automobile integrated circuit board Download PDFInfo
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- CN115753832A CN115753832A CN202211405851.5A CN202211405851A CN115753832A CN 115753832 A CN115753832 A CN 115753832A CN 202211405851 A CN202211405851 A CN 202211405851A CN 115753832 A CN115753832 A CN 115753832A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
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- Y02T10/70—Energy storage systems for electromobility, e.g. batteries
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Abstract
The invention discloses a detection method for a new energy automobile integrated circuit board, which comprises the following steps: s1: and (3) counting maintenance data of the maintenance welding spots of the integrated circuit board, S2: acquiring and identifying an image of the integrated circuit board, S3: acquiring and identifying a sample drawing of the integrated circuit board, S4: through the detection module and detect according to soldering tin sample data and contrast data, through taking statistics of the number of times of maintenance of the welding point on the integrated circuit board, and distinguish the welding point that the abnormal condition is different to take the percentage, when detecting the welding point subsequently, can carry out the detection of different precision to the welding point of its different levels, thereby can reduce the operand when detecting the welding point that often appears the welding problem infrequently, and then can accelerate its speed that detects, further improve its detection rate.
Description
Technical Field
The invention relates to the technical field of circuit board detection, in particular to a detection method for an integrated circuit board of a new energy automobile.
Background
Along with the development of the technology, more and more integrated circuit boards are arranged on automobiles, and new energy automobiles relate to information such as batteries, so that the information related to the integrated circuit boards on the new energy automobiles is more, the circuits are thinner and denser, the requirements of batch production cannot be met by traditional manual visual detection, and accordingly, detection equipment for automatically detecting the integrated circuit boards comes into play.
Chinese patent discloses a method and a system for detecting a circuit board (publication No. CN 105004727A), which utilizes an optical imaging device to acquire an image of the circuit board and transmit the acquired image information to a data processing system, and processes and analyzes the acquired image information, and this way of processing all information in the image requires a long processing time, so that there is a delay time when detecting an integrated circuit board, resulting in a slow detection speed.
Disclosure of Invention
The invention aims to provide a detection method for a new energy automobile integrated circuit board, which solves the problem that the time required for processing the acquired image information is long:
the purpose of the invention can be realized by the following technical scheme:
a detection method for a new energy automobile integrated circuit board comprises the following steps:
s1: counting maintenance data of the maintenance welding points of the integrated circuit board, distinguishing and counting the welding points on the integrated circuit board to obtain layered detection data, and uploading the layered detection data to a detection module;
s2: acquiring and identifying an image of the integrated circuit board, storing the image information of the integrated circuit board as comparison data, and uploading the comparison data to a detection module;
s3: acquiring and identifying an integrated circuit board sample drawing, acquiring positioning points on the integrated circuit board and position information of welding holes through the integrated circuit board design drawing, and presetting soldering tin sample data at the positions of the welding holes according to layered detection data in a detection module;
s4: and detecting through the detection module according to the soldering tin sample data and the comparison data.
As a further scheme of the invention: the detection module comprises an integrated circuit board identification unit, a welding spot identification unit and a judgment unit;
the integrated circuit board identification unit is used for identifying an integrated circuit board image in the comparison data, the welding point identification unit is used for identifying welding point position information in the integrated circuit board image, and the judgment unit is used for judging whether the welding point is a normal welding point or an abnormal welding point.
As a further scheme of the invention: the layered detection data comprises a fine detection welding point, a rough detection welding point and a frequent detection welding point.
As a further scheme of the invention: the distinguishing and counting of the welding points on the integrated circuit board specifically comprises the following steps;
s11: obtaining abnormal welding points through a power-on test, and obtaining the position information of the abnormal welding points according to positioning points of the integrated circuit board;
s12: finding the position of the corresponding welding point in the integrated circuit board design drawing according to the position information and the positioning point of the abnormal welding point, and marking the corresponding abnormal welding point as a vulnerable welding point;
s13: the other welding points except the vulnerable welding points are marked as normal welding points in the design drawing of the integrated circuit board;
s14: counting the abnormal welding times of the welding points of the integrated circuit board during each maintenance, and calculating the proportion of the abnormal times of each welding point;
s15: the ratio of the abnormal welding times is N 2 Percent to 100 percent of welding points are marked as fine detection welding points, and the ratio of the occurrence frequency of the insufficient welding is 0 to N 1 % of the soldering points are marked as coarse-detection soldering points, and the ratio of the occurrence frequency of false soldering is N 1 ％-N 2 % of the welds are marked as frequent check welds.
As a further scheme of the invention: the position information is acquired in the following mode: the integrated circuit board identification unit identifies the boundary of the integrated circuit board to determine the locating point of the integrated circuit board, proposes a plane rectangular coordinate system by taking the locating point of the integrated circuit board as a reference, and acquires the horizontal coordinate and the vertical coordinate of the welding point in the plane rectangular coordinate system.
As a further scheme of the invention: the preset soldering tin sample data at the position of the welding hole according to the layered detection data in the detection module specifically comprises:
s31: carrying out one-to-one correspondence on position information of a fine detection welding point, a rough detection welding point and a frequent detection welding point in the layered detection data and position information of a welding hole on a sample drawing of the integrated circuit board;
s32: marking the welding holes corresponding to the fine detection welding points as fine detection welding holes, marking the welding holes corresponding to the rough detection welding points as rough detection welding holes, and marking the welding holes corresponding to the normal detection welding points as normal detection welding holes;
s33: marking the circle center position of a welding hole in the integrated circuit board sample drawing as a welding center;
s34: the surfaces of the fine detection welding hole, the normal detection welding hole and the rough detection welding hole are respectively preset with the diameter and the length d 1 、d 2 And d 3 The solder ring of (1);
as a further scheme of the invention: detect through detection module and according to soldering tin sample data and contrast data, specifically include:
s41: acquiring an image of the integrated circuit board, and carrying out one-to-one correspondence on welding holes on a sample drawing of the integrated circuit board, welding points and positioning points on the image of the integrated circuit board according to the position information through a detection module;
s42: a welding spot recognition unit in the detection module is called to recognize welding spots in the integrated circuit board image, the positions of the welding spots are recognized according to the integrated circuit board image, and the welding spots in the integrated circuit board image are decomposed into a plurality of welding spot pixel clusters;
s43: whether a welding spot pixel cluster exists in the unit soldering tin circle or not is judged through the detection module, if the welding spot pixel cluster covers the soldering tin circle comprehensively, the welding spot is a normal welding spot, and if the welding spot pixel cluster does not cover the soldering tin circle comprehensively, the welding spot is an abnormal welding spot.
As a further scheme of the invention: the pixel cluster is formed by m pixels in the image, and the value of m is 1 2、 2 2 ……n 2 And 1 is<m 1 <m 2 <m 3 。
The invention has the beneficial effects that:
(1) According to the invention, through counting the maintenance frequency ratio of the welding points on the integrated circuit board and distinguishing the welding points with different ratios under abnormal conditions, the welding points at different levels can be detected with different precisions in the subsequent detection of the welding points, so that the calculation amount in the detection of the welding points with infrequent welding problems can be reduced, the detection speed can be increased, and the detection speed can be further improved.
(2) According to the invention, a plurality of pixels form a pixel cluster, the pixel information of the pixel cluster is determined according to the average pixel information in the pixel cluster, the pixel information of the pixel cluster is identified and judged in the judging unit, each pixel does not need to be judged, the operation amount can be greatly reduced, the number of pixels of different pixel clusters is correspondingly set according to the layered detection data, the accurate degree of the precise detection of a welding point can be ensured, the detection speed can be improved, and the practicability of the device is further improved.
Drawings
The invention is further described below with reference to the accompanying drawings.
FIG. 1 is a schematic view of the detection process in the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present invention is a method for detecting an integrated circuit board of a new energy vehicle, including:
s1: testing welding points on the integrated circuit board, counting maintenance data of the welding points on the integrated circuit board, distinguishing and counting the welding points on the integrated circuit board to obtain layered detection data, and uploading the layered detection data to the detection module;
s2: acquiring and identifying an image of the integrated circuit board, positioning the integrated circuit board to be detected in a detected area, shooting the integrated circuit board through a CCD camera, storing image information of the integrated circuit board as comparison data, and uploading the comparison data to a detection module;
s3: acquiring and identifying an integrated circuit board sample drawing, acquiring positioning points on the integrated circuit board and position information of welding holes through an integrated circuit board design drawing, and presetting soldering tin sample data at the positions of the welding holes according to layered detection data in a detection module;
s4: and detecting through a detection module according to the soldering tin sample data and the comparison data.
The detection module comprises an integrated circuit board identification unit, a welding spot identification unit and a judgment unit;
the integrated circuit board identification unit is used for identifying an integrated circuit board image in the comparison data, the welding point identification unit identifies welding point position information in the integrated circuit board image through pixel information of the image, and the judgment unit judges whether the welding point is a normal welding point or an abnormal welding point according to the pixel information.
It is worth noting in the invention that when the integrated circuit board is maintained, a maintenance worker conducts power-on inspection on the circuit board through the integrated circuit board design drawing so as to detect whether the problems of insufficient soldering, false soldering and the like occur in the soldering point and judge that the soldering point frequently occurs.
Furthermore, the layered detection data comprises a fine detection welding point, a rough detection welding point and a frequent detection welding point.
In the present application, the distinguishing and counting of the soldering points on the integrated circuit board specifically includes;
s11: obtaining abnormal welding points through a power-on test, and obtaining position information of the abnormal welding points according to positioning points of the integrated circuit board;
s12: finding the position of the corresponding welding point in the integrated circuit board design drawing according to the position information and the positioning point of the abnormal welding point, and marking the corresponding abnormal welding point as a vulnerable welding point;
s13: the other welding points except the vulnerable welding points are marked as normal welding points in the design drawing of the integrated circuit board;
s14: counting the abnormal welding times of the welding points of the integrated circuit board in each maintenance, and calculating the proportion of the abnormal times of each welding point;
s15: the ratio of the abnormal welding times is N 2 Marking the welding points with percentage to 100 percent as fine inspection welding points, wherein the ratio of the times of occurrence of insufficient welding is 0 to N 1 % of the number of solder joints is marked as a gross solder joint, and the percentage of the number of times of occurrence of a cold solder joint is N 1 ％-N 2 % of the welds are marked as frequent check welds.
In the application, different welding points can be detected with different precisions according to the abnormal occupation conditions by counting the welding points which are often abnormal, wherein 0 percent of the abnormal occupation conditions<N 1 ％<N 2 ％<100％。
Furthermore, when the integrated circuit board is subjected to the CCD camera, a planar rectangular coordinate system is suggested by taking the positioning point of the integrated circuit board as a reference, the horizontal coordinate and the vertical coordinate of the welding point in the planar rectangular coordinate system form the position information of the welding point, and the boundary of the integrated circuit board is identified by an integrated circuit board identification unit to determine the positioning point of the integrated circuit board; and finding the positions of the welding points in the integrated circuit board image and the corresponding welding holes in the integrated circuit board sample drawing according to the position information of the welding points.
In the present invention, the drawing of the sample ic board includes characteristic information such as size, shape, color, and diameter of the solder hole on the ic board.
In this application, according to the layering detection data among the detection module predetermine soldering tin sample data on the position of welding hole, specifically include:
s31: carrying out one-to-one correspondence on position information of a fine detection welding point, a rough detection welding point and a frequent detection welding point in the layered detection data and position information of a welding hole on a sample drawing of the integrated circuit board;
s32: marking the welding holes corresponding to the fine detection welding points as fine detection welding holes, marking the welding holes corresponding to the rough detection welding points as rough detection welding holes, and marking the welding holes corresponding to the normal detection welding points as normal detection welding holes;
s33: marking the circle center position of a welding hole in the integrated circuit board sample drawing as a welding center;
s34: the surfaces of the fine detection welding hole, the normal detection welding hole and the rough detection welding hole are respectively preset with the diameter and the length d 1 、d 2 And d 3 The solder circle of (1).
Wherein, d 1 、d 2 And d 3 Is given as d 1 >d 2 >d 3 >And 0, the diameter length of the soldering tin circle is used for judging whether the diameter length of the welding point is qualified or not, namely the diameter of the identified welding point is qualified if being larger than the diameter of the soldering tin circle.
In this application, detect through detection module and according to soldering tin sample data and contrast data, specifically include:
s41: acquiring an image of the integrated circuit board, and carrying out one-to-one correspondence on welding holes on a sample drawing of the integrated circuit board, welding points and positioning points on the image of the integrated circuit board according to the position information through a detection module;
s42: a welding spot recognition unit in the detection module is called to recognize welding spots in the integrated circuit board image, the positions of the welding spots are recognized according to the integrated circuit board image, and the welding spots in the integrated circuit board image are decomposed into a plurality of welding spot pixel clusters;
s43: whether a welding spot pixel cluster exists in the unit soldering tin circle or not is judged through the detection module, if the welding spot pixel cluster covers the soldering tin circle comprehensively, the welding spot is a normal welding spot, and if the welding spot pixel cluster does not cover the soldering tin circle comprehensively, the welding spot is an abnormal welding spot.
In the present application, the pixel cluster is formed by m pixels in the image, and the value of m is 1 2、 2 2 ……n 2 And can be welded according to the precise detection of welding holes and the normal detectionSelecting m according to welding precision requirements of holes and rough detection welding holes 1 ，m 2 And m 3 Wherein, the pixel information of one pixel cluster is the average information of all pixel composition information in one pixel cluster, (for example, one pixel cluster comprises four pixels, wherein the first pixel information is R:100, G:100, B:100, the second pixel information is R:102, G:102, B:102, the third pixel information is R:98, G:98, B:98, the first pixel information is R:100, G:100, B:100, the pixel information of the pixel cluster is R:100, G:100, B: 100) the pixel cluster is used for ensuring the detection precision and reducing the operation amount at the same time, so as to improve the operation speed and reduce the operation cost, and 1<m 1 <m 2 <m 3 。
While one embodiment of the present invention has been described in detail, the description is only a preferred embodiment of the present invention and should not be taken as limiting the scope of the invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.
Claims (8)
1. A detection method for a new energy automobile integrated circuit board is characterized by comprising the following steps:
s1: counting maintenance data of the integrated circuit board maintenance welding spots, distinguishing and counting the welding spots on the integrated circuit board to obtain layered detection data, and uploading the layered detection data to a detection module;
s2: acquiring and identifying an image of the integrated circuit board, storing image information of the integrated circuit board as comparison data, and uploading the comparison data to a detection module;
s3: acquiring and identifying an integrated circuit board sample drawing, acquiring positioning points on the integrated circuit board and position information of welding holes through the integrated circuit board design drawing, and presetting soldering tin sample data at the positions of the welding holes according to layered detection data in a detection module;
s4: and detecting through the detection module according to the soldering tin sample data and the comparison data.
2. The method for detecting the integrated circuit board of the new energy automobile according to claim 1, wherein the detection module comprises an integrated circuit board identification unit, a welding spot identification unit and a judgment unit;
the integrated circuit board identification unit is used for identifying an integrated circuit board image in the comparison data, the welding point identification unit is used for identifying welding point position information in the integrated circuit board image, and the judgment unit is used for judging whether the welding point is a normal welding point or an abnormal welding point.
3. The method for detecting the integrated circuit board of the new energy automobile according to claim 1, wherein the hierarchical detection data comprises fine detection welding points, rough detection welding points and frequent detection welding points.
4. The method for detecting the integrated circuit board of the new energy automobile according to claim 1, wherein the distinguishing and counting of the welding points on the integrated circuit board specifically comprises;
s11: obtaining abnormal welding points through a power-on test, and obtaining the position information of the abnormal welding points according to positioning points of the integrated circuit board;
s12: finding the position of the corresponding welding point in the integrated circuit board design drawing according to the position information and the positioning point of the abnormal welding point, and marking the corresponding abnormal welding point as a vulnerable welding point;
s13: the other welding points except the vulnerable welding points are marked as normal welding points in the design drawing of the integrated circuit board;
s14: counting the abnormal welding times of the welding points of the integrated circuit board in each maintenance, and calculating the proportion of the abnormal times of each welding point;
s15: the ratio of the abnormal welding times is N 2 Percent to 100 percent of welding points are marked as fine detection welding points, and the ratio of the occurrence frequency of the insufficient welding is 0 to N 1 % of the number of solder joints is marked as a gross solder joint, and the percentage of the number of times of occurrence of a cold solder joint is N 1 ％-N 2 % of the welds are marked as frequent check welds.
5. The method for detecting the integrated circuit board of the new energy automobile according to claim 1, wherein the position information is obtained in a manner that: the integrated circuit board identification unit identifies the boundary of the integrated circuit board to determine the locating point of the integrated circuit board, proposes a plane rectangular coordinate system by taking the locating point of the integrated circuit board as a reference, and acquires the horizontal coordinate and the vertical coordinate of the welding point in the plane rectangular coordinate system.
6. The method according to claim 1, wherein the presetting of solder sample data at the position of the solder hole according to layered detection data in the detection module specifically comprises:
s31: carrying out one-to-one correspondence on position information of a fine detection welding point, a rough detection welding point and a frequent detection welding point in the layered detection data and position information of a welding hole on a sample drawing of the integrated circuit board;
s32: marking the welding holes corresponding to the fine detection welding points as fine detection welding holes, marking the welding holes corresponding to the coarse detection welding points as coarse detection welding holes, and marking the welding holes corresponding to the normal detection welding points as normal detection welding holes;
s33: marking the circle center position of a welding hole in the integrated circuit board sample drawing as a welding center;
s34: the diameter and the length of the surface of the fine detection welding hole, the surface of the normal detection welding hole and the surface of the rough detection welding hole are respectively preset as d 1 、d 2 And d 3 The solder ring of (3).
7. The method according to claim 1, wherein the detection is performed by the detection module according to solder sample data and comparison data, and specifically comprises:
s41: acquiring an image of the integrated circuit board, and carrying out one-to-one correspondence on welding holes on a sample drawing of the integrated circuit board, welding points and positioning points on the image of the integrated circuit board according to position information through a detection module;
s42: calling a welding spot identification unit in the detection module, identifying welding spots in the integrated circuit board image, identifying welding spot positions according to the integrated circuit board image, and decomposing the welding spots in the integrated circuit board image into a plurality of welding spot pixel clusters;
s43: whether a welding spot pixel cluster exists in the unit soldering tin circle or not is judged through the detection module, if the welding spot pixel cluster covers the soldering tin circle comprehensively, the welding spot is a normal welding spot, and if the welding spot pixel cluster does not cover the soldering tin circle comprehensively, the welding spot is an abnormal welding spot.
8. The method for detecting the integrated circuit board of the new energy automobile according to claim 1, wherein the pixel cluster consists of m pixels in an image, wherein the value of m is 1 2、 2 2 ……n 2 And 1 is<m 1 <m 2 <m 3 。
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Cited By (1)
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| CN117139910A (en) * | 2023-10-23 | 2023-12-01 | 江苏华讯电子技术有限公司 | Electronic element welding quality detection method and system based on big data |
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