CN101403708A - External appearance defect examination method for circuit board - Google Patents
External appearance defect examination method for circuit board Download PDFInfo
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- CN101403708A CN101403708A CNA2008102188236A CN200810218823A CN101403708A CN 101403708 A CN101403708 A CN 101403708A CN A2008102188236 A CNA2008102188236 A CN A2008102188236A CN 200810218823 A CN200810218823 A CN 200810218823A CN 101403708 A CN101403708 A CN 101403708A
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Abstract
The invention provides a method used for testing the appearance defects of a circuit board, comprising the steps as follows: loading, collecting frontal images of the circuit board, collecting the reverse images of the circuit board, analyzing and sorting the images. The method can complete the appearance defect check on two surfaces of the circuit board extremely conveniently and quickly, can adopt a computer for automatic control, has quick check speed and high check efficiency, and can check the defects on the circuit board such as foreign matter, exposed copper, supplemented oil, scraping, poor gold-plating, character error, non-uniform green oil, non-uniform welding disc, non-uniform depth of channel, residual copper, omitted printing, developing and the like.
Description
Technical field
The present invention relates to a kind of circuit board checkout facility, specifically a kind of external appearance defect examination method for circuit board.
Background technology
At present, FINAL APPEARANCE inspection for circuit board, the method that overwhelming majority production commercial city adopts artificial visual to check, defective that has but hand inspection exists it, so the final mass of circuit board control difficulty is quite big, this test mode not only has omission, checks slow-footed problem, and along with the propelling of the circuit miniaturization of circuit board, it more and more shows incompatibility.In the industry cycle, being desirably in day by day of the demand device that visual examination is taked fast to circuit board, distinguishing ability is strong, the robotization journey is high strengthens.
Summary of the invention
The technical matters that will solve of the present invention provides a kind of external appearance defect examination method for circuit board.
In order to solve the problems of the technologies described above, the present invention takes following mode to realize:
A kind of external appearance defect examination method for circuit board, this method comprises:
Material loading: the examine circuit board is put on the travelling belt;
The circuit board direct picture is gathered: by scanister sweep circuit plate direct picture, and view data deposited to computing machine;
Circuit board reverse side image acquisition:,, and view data deposited to computing machine by scanister sweep circuit plate direct picture with circuit board upset;
Graphical analysis: the preferred circuit plate image that prestores in the image of circuit board under test and the computing machine is compared, judge whether the examine circuit board exists open defect;
Letter sorting: non-defective unit circuit board and substandard products circuit board are distinguished in the contrast by computing machine, and place respectively.
Material loading can adopt automatic charging, and circuit board is positioned on the travelling belt one by one automatically.Linear array scanning is adopted in the scanning of circuit board image.
Sort and also adopt letter sorting automatically, by the differentiation signal of circuit board under test image in the computing machine and the automatic letter sorting of preferred circuit plate image comparison result conduct.
The present invention has following having a few:
1. this method can be finished the open defect inspection to the circuit board two sides very convenient, quickly, and can adopt computer automation control, and inspection speed is fast, checking efficiency is high;
2. adopt the digital scanning technology, can be to the foreign matter on the circuit board, reveal copper, repairing, scuffing, gold-plated bad, character mistake, green oil inequality, pad inequality, groove depth inequality, residual copper, bite, defective aspect such as development checks;
3. self-feeding be can adopt, non-defective unit and substandard products sorted automatically, the board operation is by the integrated control of computing machine, improve the simplicity and the reliability of operation greatly, and can adopt powerful image processing analyzing software system that multiple portrait Treatment Analysis system is provided, dirigibility and extensibility are stronger;
4. also can be by the defective of the in good time observation examine circuit board of computing machine.
Figure of description
Accompanying drawing 1 is an embodiment of the invention synoptic diagram.
Embodiment
Describe the present invention for the ease of it will be appreciated by those skilled in the art that below in conjunction with embodiment and accompanying drawing:
As shown in Figure 1, when this method is used to realize automated production the various defectives of circuit board outward appearance are carried out the robotization inspection, this method comprises:
Material loading, the collection of circuit board direct picture, turnover panel, circuit board reverse side image acquisition, graphical analysis, letter sorting.
Wherein material loading can adopt automation mechanized operation, and the examine circuit board is put one by one to travelling belt, and travelling belt bearer circuit plate moves to scanister.
Scanister is positioned at the travelling belt top, and when circuit board to be detected passed through scanister, scanister carried out image scanning to the circuit board front, finishes the image acquisition in circuit board front, and view data is deposited to computing machine.Scanister can adopt existing common linear array scanning (Linear scanning) mode, and this scanister technology is more common, does not do detailed description at this.
Turnover panel and circuit board reverse side image acquisition: through after the front scan, circuit board need turn circuit board, deposits to computing machine again by another scanister scanning reverse side image, and with view data, finishes circuit board reverse side image acquisition.During concrete enforcement, the mechanism that realizes the turnover panel step between two scanister, the moving direction that can guarantee circuit board all the time with the travelling belt direction of transfer always, make whole process smooth more.
The preferred circuit plate image that prestores view data that computing machine will send from scanister and the computing machine compares analysis, check between examine circuit board outward appearance and the preferred circuit plate image and there are differences, when not having difference, can judge that then this face of this circuit board is qualified, when having difference, judge that then this entire circuit plate is substandard products, thereby finish image analysis step.
Separation step also can adopt automatic letter sorting to finish, computing machine is converted to the output of letter sorting control signal with the result of pattern analysis, this signal can be light signal, the operator distinguishes substandard products and non-defective unit by the light signal indication, also can the circuit board automatic distinguishing be come for the data-signal of control automation equipment.
Whole inspection method is quick, smooth, can greatly improve the efficient of inspection, and by combining with scanister and computing machine, has also improved the accuracy of checking greatly.
From such scheme as can be known, no matter the present invention, possesses the creative requirement of patent of invention from technical scheme or technique effect all has substantive distinguishing features and obvious improvement.Present embodiment need to prove for one of preferable implementation of the present invention, and any conspicuous replacement all belongs to the infringement trip and is all within protection domain of the present invention under the prerequisite that does not break away from the present invention's design.
Claims (4)
1. an external appearance defect examination method for circuit board is characterized in that, this method comprises:
Material loading: the examine circuit board is put on the travelling belt;
The circuit board direct picture is gathered: by scanister sweep circuit plate direct picture, and view data deposited to computing machine;
Circuit board reverse side image acquisition:,, and view data deposited to computing machine by scanister sweep circuit plate direct picture with circuit board upset;
Graphical analysis: the preferred circuit plate image that prestores in the image of circuit board under test and the computing machine is compared, judge whether the examine circuit board exists open defect;
Letter sorting: non-defective unit circuit board and substandard products circuit board are distinguished in the contrast by computing machine, and place respectively.
2. external appearance defect examination method for circuit board according to claim 1 is characterized in that: material loading can adopt automatic charging, and circuit board is positioned on the travelling belt one by one automatically.
3. external appearance defect examination method for circuit board according to claim 2 is characterized in that: linear array scanning is adopted in the scanning of circuit board image.
4. external appearance defect examination method for circuit board according to claim 3 is characterized in that: sort and also adopt letter sorting automatically, by the differentiation signal of circuit board under test image in the computing machine and the automatic letter sorting of preferred circuit plate image comparison result conduct.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102188236A CN101403708A (en) | 2008-10-31 | 2008-10-31 | External appearance defect examination method for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102188236A CN101403708A (en) | 2008-10-31 | 2008-10-31 | External appearance defect examination method for circuit board |
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| Publication Number | Publication Date |
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| CN101403708A true CN101403708A (en) | 2009-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNA2008102188236A Pending CN101403708A (en) | 2008-10-31 | 2008-10-31 | External appearance defect examination method for circuit board |
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| CN (1) | CN101403708A (en) |
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| CN102074031A (en) * | 2011-01-13 | 2011-05-25 | 广东正业科技股份有限公司 | Standard establishment method for observational check machine of printed circuit board |
| CN102183215A (en) * | 2011-03-11 | 2011-09-14 | 杭州新三联电子有限公司 | Detection method and detection system of PCB (printed circuit board) aperture contour |
| CN102284431A (en) * | 2011-04-28 | 2011-12-21 | 河南科技大学 | On-line detection grading device for lithium ion battery pole piece and method thereof |
| CN102445648A (en) * | 2010-10-13 | 2012-05-09 | 富葵精密组件(深圳)有限公司 | Method for detecting skip printing of characters of circuit board |
| CN102539441A (en) * | 2011-12-29 | 2012-07-04 | 中国科学院长春光学精密机械与物理研究所 | Inspection method for inspecting welding correctness of the device of device on circuit board in batch |
| CN102589600A (en) * | 2012-03-09 | 2012-07-18 | 北京元陆鸿远电子技术有限公司 | Capacitor appearance inspection support |
| CN102788799A (en) * | 2012-07-27 | 2012-11-21 | 昆山微容电子企业有限公司 | Automatic appearance screening device |
| CN103240230A (en) * | 2013-05-20 | 2013-08-14 | 上海东方磁卡工程有限公司 | Non-damage detection system and method for coil outgoing line of intelligent card |
| CN103676868A (en) * | 2013-12-09 | 2014-03-26 | 华南理工大学 | Automatic monitoring and intelligent analyzing system used in FPC manufacturing critical process |
| CN103728309A (en) * | 2013-11-27 | 2014-04-16 | 周俊雄 | Visual detection equipment of circuit board |
| CN104853539A (en) * | 2015-04-14 | 2015-08-19 | 中山市智牛电子有限公司 | Method for fully automatically detecting surface-mounting precision of electronic elements |
| CN104949991A (en) * | 2015-05-19 | 2015-09-30 | 东莞市威力固电路板设备有限公司 | Printed circuit board (PCB) automated optical inspection (AOI) system and PCB objective table suitable for same |
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| CN105772976A (en) * | 2016-04-18 | 2016-07-20 | 黄雪位 | Device used for comprehensively scanning workpiece and conducting welding and implementation method of device |
| CN106404782A (en) * | 2016-09-06 | 2017-02-15 | 凌云光技术集团有限责任公司 | PCB online detecting method |
| CN106814066A (en) * | 2015-11-30 | 2017-06-09 | 富泰华工业（深圳）有限公司 | Appearance delection device and method |
| CN107024184A (en) * | 2016-02-01 | 2017-08-08 | 致茂电子(苏州)有限公司 | Systems for optical inspection is with applying its optical detecting method |
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| CN110715942A (en) * | 2018-07-11 | 2020-01-21 | 皓琪科技股份有限公司 | Automatic detection method and system for circuit board |
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| CN112945986A (en) * | 2021-02-04 | 2021-06-11 | 鼎勤科技(深圳)有限公司 | Double-sided appearance detection method of circuit board |
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-
2008
- 2008-10-31 CN CNA2008102188236A patent/CN101403708A/en active Pending
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|---|---|---|---|---|
| CN102445648A (en) * | 2010-10-13 | 2012-05-09 | 富葵精密组件(深圳)有限公司 | Method for detecting skip printing of characters of circuit board |
| CN102445648B (en) * | 2010-10-13 | 2013-10-30 | 富葵精密组件(深圳)有限公司 | Method for detecting skip printing of characters of circuit board |
| CN102074031A (en) * | 2011-01-13 | 2011-05-25 | 广东正业科技股份有限公司 | Standard establishment method for observational check machine of printed circuit board |
| CN102183215A (en) * | 2011-03-11 | 2011-09-14 | 杭州新三联电子有限公司 | Detection method and detection system of PCB (printed circuit board) aperture contour |
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Application publication date: 20090408 |