CN104317998A - Method and device for making and compensating parameters of Gerber file - Google Patents
Method and device for making and compensating parameters of Gerber file Download PDFInfo
- Publication number
- CN104317998A CN104317998A CN201410555012.0A CN201410555012A CN104317998A CN 104317998 A CN104317998 A CN 104317998A CN 201410555012 A CN201410555012 A CN 201410555012A CN 104317998 A CN104317998 A CN 104317998A
- Authority
- CN
- China
- Prior art keywords
- manufacture
- parameter
- compensation
- gerber file
- gerber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 128
- 238000013461 design Methods 0.000 claims abstract description 68
- 238000004519 manufacturing process Methods 0.000 claims description 252
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 24
- 239000010949 copper Substances 0.000 claims description 24
- 230000008676 import Effects 0.000 claims description 15
- 238000003466 welding Methods 0.000 claims description 11
- 238000001514 detection method Methods 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 239000003086 colorant Substances 0.000 claims description 7
- 238000009826 distribution Methods 0.000 claims description 3
- 230000000717 retained effect Effects 0.000 claims description 2
- 238000012550 audit Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 16
- 238000012552 review Methods 0.000 description 10
- 238000013519 translation Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000009795 derivation Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000007849 functional defect Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Numerical Control (AREA)
Abstract
The invention discloses a method and a device for making and compensating parameters of a Gerber file. The method comprises the following steps of importing and analyzing the Gerber file; defining the properties of making elements in the Gerber file, and setting process parameters; acquiring technical parameters of the making elements and intervals between the making elements; compensating every making element of which the technical parameter and/or the interval is smaller than the corresponding process parameter; importing and analyzing the Gerber file; defining the properties of making elements in the Gerber file, and setting process parameters; acquiring technical parameters of the making elements and intervals between the making elements; compensating every making element of which the technical parameter and/or the interval is smaller than the corresponding process parameter. According to the method and the device for making and compensating the parameters of the Gerber file, the automatic compensation from parameter designing to parameter making of a printed circuit board is realized, and the audit efficiency and accuracy of design files are improved.
Description
Technical field
The present invention relates to field of printed circuit board fabrication, the method and apparatus that the manufacture particularly relating to a kind of parameter of Gerber file compensates.
Background technology
Printed circuit board (PCB) is the critical piece of various electronic product, is the basis that any electronic product realizes its Functional Design, and the quality of its performance has influence on the quality of electronic product to a great extent.In the actual production process of electronic product, because the problem of the manufacturing process of printed circuit board (PCB) itself, circuit on printed circuit board (PCB) may when designing, the design of each manufacture element is correct, design function in advance can be realized, but when the product that will manufacture and design for reality, may there is deviation in some details in design, cause finished product not meet designing requirement.Such as certain boring is separated with neighbouring certain circuit on circuit board in the design, in the design, as long as define both position relationships, this separation is exactly realizing, but in generative process, if the distance designed in advance is between the two too small, this distance may will the conducting because of the problem of manufacturing accuracy in process of production, thus causes the functional requirement of product and the design of producing inconsistent.
In existing production run, mainly manufacturer manually carries out examination & verification amendment to design, and efficiency and accuracy rate are all lower, and may occur leaking situation about examining.
Summary of the invention
The method and apparatus that the manufacture that the present invention proposes a kind of parameter of Gerber file compensates, it is by obtaining the technical parameter manufacturing element in Gerber file and the spacing manufactured between element; The manufacture element described technical parameter and/or spacing being less than corresponding process parameter compensates.Achieve the auto-compensation of parameter from design parameter to Fabrication parameter to printed circuit board (PCB), improve review efficiency and the accuracy rate of design document.
For realizing above-mentioned design, the present invention by the following technical solutions:
A kind of method adopting manufacture of parameter of Gerber file to compensate on the one hand, it comprises:
Import and resolve Gerber file;
Define the manufacture attribute of an element in described Gerber file, setting process parameter;
The technical parameter obtaining described manufacture element and the spacing manufactured between element;
The manufacture element described technical parameter and/or spacing being less than corresponding process parameter compensates.
The device adopting a kind of manufacture of parameter of Gerber file to compensate on the other hand, it comprises:
Import resolution unit, for importing and resolving Gerber file;
Definition setup unit, for defining the manufacture attribute of an element in described Gerber file, setting process parameter;
Parameter acquiring unit, for the technical parameter that obtains described manufacture element and the spacing manufactured between element;
Parametric compensation unit, compensates for the manufacture element described technical parameter and/or spacing being less than corresponding process parameter.
Beneficial effect of the present invention is: by importing and resolving Gerber file; Define the manufacture attribute of an element in described Gerber file, setting process parameter; The technical parameter obtaining described manufacture element and the spacing manufactured between element; The manufacture element described technical parameter and/or spacing being less than corresponding process parameter compensates.Achieve the auto-compensation of parameter from design parameter to Fabrication parameter to printed circuit board (PCB), improve review efficiency and the accuracy rate of design document.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing the embodiment of the present invention is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to the content of the embodiment of the present invention and these accompanying drawings.
Fig. 1 is the method flow diagram of first embodiment of the method that the manufacture of the parameter of a kind of Gerber file that the embodiment of the present invention provides compensates.
Fig. 2 is the method flow diagram of second embodiment of the method that the manufacture of the parameter of a kind of Gerber file that the embodiment of the present invention provides compensates.
Fig. 3 is the method flow diagram of the 3rd embodiment of the method that the manufacture of the parameter of a kind of Gerber file that the embodiment of the present invention provides compensates.
Fig. 4 is the method flow diagram of the 4th embodiment of the method that the manufacture of the parameter of a kind of Gerber file that the embodiment of the present invention provides compensates.
Fig. 5 is the block diagram of first embodiment of the device that the manufacture of the parameter of a kind of Gerber file that the embodiment of the present invention provides compensates.
Fig. 6 is the block diagram of second embodiment of the device that the manufacture of the parameter of a kind of Gerber file that the embodiment of the present invention provides compensates.
Fig. 7 is the block diagram of the 3rd embodiment of the device that the manufacture of the parameter of a kind of Gerber file that the embodiment of the present invention provides compensates.
Fig. 8 is the block diagram of the 4th embodiment of the device that the manufacture of the parameter of a kind of Gerber file that the embodiment of the present invention provides compensates.
Embodiment
The technical matters solved for making the present invention, the technical scheme of employing and the technique effect that reaches are clearly, be described in further detail below in conjunction with the technical scheme of accompanying drawing to the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those skilled in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Please refer to Fig. 1, it is the method flow diagram of first embodiment of the method for the manufacture compensation of the parameter of a kind of Gerber file that the embodiment of the present invention provides.The method that the manufacture of the parameter of the Gerber file of the present embodiment compensates is mainly used in board production field, and user carries out parametric compensation to the Gerber file that client sends, to meet the accuracy requirement of production technology.
As shown in Figure 1, the method for the manufacture compensation of the parameter of this Gerber file, comprising:
Step S101: import and resolve Gerber file.
Gerber file is that a kind of light of international standard paints formatted file, has a wide range of applications in printed circuit board (PCB) manufacture and Electronic Assemblies industry.In this programme, the file layout of support comprises RS274X form and ODB++ form.
After importing Gerber file, the figure in Gerber file is resolved, obtain the figure of each manufacture element in figure.
Step S102: define the manufacture attribute of an element in described Gerber file, setting process parameter.
In Gerber file, different manufacture units have design attributes with the design object of realizing circuit, and in process of production, these attributes are a bit without the need to embodying.When carrying out manufacture and compensating, according to the rule preset, identical Attribute tuning during production is defined as same attribute, concrete as definition hole attribute, definition smd paster attribute, definition shape be copper sheet, the definition polarity that manufactures element is by just to bear or by just bearing.
Process parameter refers to the full accuracy that in actual production run, production technology can reach.Such as have that the process parameter in copper hole is 0.15mm, the process parameter of via hole is 0.05mm in boring, be 0.05mm without the process parameter in copper hole, mean the precision having copper hole, via hole and the parameter without copper hole to need to be adjusted to the parameter that process parameter can realize.The process parameter of the bee-line such as limited between boring and circuit is again 0.10mm, mean in the production run of reality, bee-line between boring and circuit must be set to 0.10mm, if be less than bee-line, the error of the product quality that may have an impact in process of production.
Step S103: the technical parameter obtaining described manufacture element and the spacing manufactured between element.
In acquisition Gerber file, figure is polar plot substantially, is easy to the function corresponding to lines obtaining figure in appropriate figure.The technical parameter manufacturing element and the spacing manufactured between element can be obtained, the distance of the live width of such as circuit, the size of boring, boring and circuit by the function at lines place.The such as distance of boring and circuit, in the angle of plane geometry, the point of holing exactly in the functional image at place is to the minimum distance of the point in the functional image of circuit.
Step S104: the manufacture element described technical parameter and/or spacing being less than corresponding process parameter compensates.
Specifically, the diameter of certain via hole such as obtained in step s 103 is 0.635mm, and the process parameter that via hole is arranged is 0.05mm, in the production run of reality, the degree of accuracy of 0.635mm cannot be realized, 0.635mm simply neither round up and obtain 0.64mm by this compensation, and the compensation result that 0.635mm compensates to the process parameter meeting 0.05mm is 0.65mm.The distance of such as boring and circuit again, in Gerber file, boring is 0.03mm with the distance of circuit, in circuit design, predetermined design effect will be realized after the connection scheme of possible circuit completes, but in actual production process, the distance of 0.03mm may just cannot realize, together with in finished product, boring finally can be linked with circuit, thus cause the circuit produced different from the circuit designed in advance, now need to compensate to this distance the requirement making to meet process parameter, also with regard to saying, the designed distance of 0.03mm is amplified, be enlarged into the minor increment 0.10mm or other value being greater than 0.10 that design in advance.
In sum, the present embodiment is by importing and resolving Gerber file; Define the manufacture attribute of an element in described Gerber file, setting process parameter; The technical parameter obtaining described manufacture element and the spacing manufactured between element; The manufacture element described technical parameter and/or spacing being less than corresponding process parameter compensates.Achieve the auto-compensation of parameter from design parameter to Fabrication parameter to printed circuit board (PCB), improve review efficiency and the accuracy rate of design document.
Please refer to Fig. 2, it is the method flow diagram of second embodiment of the method for the manufacture compensation of the parameter of a kind of Gerber file that the embodiment of the present invention provides.As shown in the figure, the method for the manufacture compensation of the parameter of this Gerber file, comprising:
Step S201: import and resolve Gerber file.
Resolve electric circuit elements all in Gerber file, obtain the design drawing of each layer in Gerber file, design drawing is shown, and from design drawing, obtain an electric circuit element position on a printed circuit.
Step S202: define the manufacture attribute of an element in described Gerber file, setting process parameter.
Wherein, the manufacture attribute of an element in the described Gerber file of described definition, comprising:
The element of the outer-layer circuit manufacture element of non-for solder mask Pad and this manufacture element comprised transfers Pad to automatically;
For copper attribute is added in copper sheet face.
The manufacture element of non-for solder mask Pad is turned Pad, and the element of the outer-layer circuit simultaneously it comprised turns Pad automatically, completes two welding resistances and two outer-layer circuit need the to rise element of ring and transfers Pad to.
Described manufacture element comprises: boring, circuit, orifice ring, welding resistance, lid line and Pad.
Various manufacture elements in printed circuit board (PCB) are compensated, ensures that the printed circuit board (PCB) produced can not cause not reaching design object because of the difference of design parameter and process parameter.
Step S203: the technical parameter obtaining described manufacture element and the spacing manufactured between element.
In the production run of reality, wherein some details of chemical reaction process is uncontrollable, if etching process can not be react perpendicular to printed circuit board (PCB) from outside to inside utterly.Such as printed wire, in design, the width of circuit is a, if by designing requirement, the xsect of circuit is a rectangle, and the length of one group of opposite side of rectangle is a; But in the production run of reality, due to the impact of course of reaction of etching, in actual product, the xsect of circuit may be up-narrow and down-wide trapezoidal, and the length of trapezoidal upper base is a, and the length of going to the bottom is slightly larger than a.Such circuit may cause the underproof situation of the product of printed circuit board (PCB) equally, if two the designed distance of parallel circuit is just minimum requirement distance, so under this production technology, article two, the distance of the upper surface of circuit just equals minimum wire distance, but due to side formed little domatic, article two, the distance of the bottom surface of circuit is less than minimum wire distance, so circuit distance seems the requirement meeting process parameter in the design, in fact this parameter should be the distance of bottom surface, the performance requirement ensureing circuit should be compensated to the distance of upper surface.
Step S204: the manufacture element described technical parameter and/or spacing being less than corresponding process parameter compensates.
In concrete compensation process, one is expand parameter value, and two is reduce precision grade.In the present embodiment, the priority expanding parameter value, higher than the priority reducing design accuracy, is also just said if the accuracy requirement of certain design parameter is too high, and parameter value is also too small simultaneously, when compensating, directly this this parameter value is compensated for as the minimal size that process parameter requires.
Further, described compensation also comprises draws copper automatically by the non-copper element chosen, and copper distance is drawn in input, and the element that distance is not enough is drawn out, to reach safe distance by system automatically.
Step S205: the Gerber file after compensating is carried out DRC detection, obtains the source of the fault in Gerber file.
Gerber file after compensating is carried out DRC detection, judges whether there is the fault part not meeting design rule in the Gerber file after compensating, if had, then the source that the Gerber document after compensation goes out to break rules.
Step S206: the Gerber file after compensation and former Gerber file are carried out network contrast, detects whether have short circuit and open circuit.
Gerber file after compensation and former Gerber file are carried out network contrast, whether change after judging to compensate design place, if the Gerber file after compensating and former Gerber file have had the change on circuit, then need to carry out adjusting to realize original design function.Meanwhile, the detection of short circuit and open circuit is also ensure that circuit performance stablizes the important means with functional realiey.
In sum, the present embodiment further illustrates the subsequent operation manufacturing and compensate, and generally speaking, the present embodiment is by importing and resolving Gerber file; Define the manufacture attribute of an element in described Gerber file, setting process parameter; The technical parameter obtaining described manufacture element and the spacing manufactured between element; The manufacture element described technical parameter and/or spacing being less than corresponding process parameter compensates.Achieve the auto-compensation of parameter from design parameter to Fabrication parameter to printed circuit board (PCB), improve review efficiency and the accuracy rate of design document.Manufacture after the subsequent operation compensated ensures to manufacture compensation and the scheme of design itself is not had an impact, can not functional defect be caused.
Please refer to Fig. 3, it is the method flow diagram of the 3rd embodiment of the method for the manufacture compensation of the parameter of a kind of Gerber file that the embodiment of the present invention provides.As shown in the figure, the method for the manufacture compensation of the parameter of this Gerber file, comprising:
Step S301: import Gerber file, identifies the layering of Gerber file, other to Hierarchical name and sequence according to the layer of described layering.
In the printed circuit boards, be the various functions of realizing circuit, be designed with multiple layering and coordinate to form an overall functional unit, each layering is silk-screen, paster, circuit such as.
Step S302: the form reading boring file, aligns boring file with layering.
By the information projection of boring that carries in boring file in each layering, boring is alignd with layering, in the process of producing printed circuit board (PCB), carries out the production process of execution correspondence according to boring file.
Step S303: add different colors for each layering and complete parsing display.
Such as top layer silk-screen, top layer of patches, top layer welding resistance, internal layer circuit (negative film) and wiring underlayer represent by white, purple, green, yellow and yellow respectively, and different colors represents can observe corresponding design proposal more clearly.
Step S304: define the manufacture attribute of an element in described Gerber file, setting process parameter.
Wherein, the manufacture attribute of an element in the described Gerber file of described definition, comprising:
The element of the outer-layer circuit manufacture element of non-for solder mask Pad and this manufacture element comprised transfers Pad to automatically;
For copper attribute is added in copper sheet face.
Described manufacture element comprises: boring, circuit, orifice ring, welding resistance, lid line and Pad.
The attribute of described boring defines according to cutter.
The minimum manufacture radius that such as some cutter can realize is determined, so the boring of its correspondence production that at least can will realize using this cutter is as the attribute of boring.
Step S305: the technical parameter obtaining described manufacture element and the spacing manufactured between element.
Step S306: delete in layering and possess manufacture element involved in the manufacture element of the relation of inclusion on position.
Specifically, the manufacture element that two positions overlap may be there is in the design.Such as when carrying out a part of circuit design, devising a circle somewhere and representing boring A; When carrying out another part circuit design, devise again a former expression boring B; The A that wherein holes is less than boring B, and the A that holes is inner at boring B, so before the compensation carrying out Fabrication parameter, the A that directly will hole deletes, it should be noted that, should not affect annexation in circuit after boring A deletes, boring A and boring B has identical annexation, and what difference was only to design varying in size.
Step S307: by the manufacture element of coincidence relation possessed in layering on position, synthesizes a combination and manufactures element.
Coincidence relation mentioned here refers to the two or more manufacture elements possessing and partially overlap.Such as two borings, it partially overlaps, be then regarded as the complex figure formed after two circular portions overlap, this complex figure is combination and manufactures element.
Step S308: the manufacture element described technical parameter and/or spacing being less than corresponding process parameter compensates.
A more meticulous compensation way, implements time not enough to the distance of circuit for Pad.By one section of just right for Pad in circuit distally translation, after translation section is connected with two end points that translation in circuit obtains.Be equivalent to the circuit of original line segment shape to carry out suitable complications, by Pad just to meanders, thus allow circuit walk around Pad, increase the distance between Pad to circuit, realize Fabrication parameter and compensate.
Step S309: the Gerber file after compensating is carried out DRC detection, obtains the source of the fault in Gerber file.
Can conveniently revise further Gerber file, to ensure that the printed circuit board (PCB) produced realizes design object after obtaining the source broken rules.
Step S310: the Gerber file after compensation and former Gerber file are carried out network contrast, detects whether have short circuit and open circuit.
In sum, the present embodiment further illustrates the detailed process importing Gerber file and resolve, and generally speaking, the present embodiment is by importing and resolving Gerber file; Define the manufacture attribute of an element in described Gerber file, setting process parameter; The technical parameter obtaining described manufacture element and the spacing manufactured between element; The manufacture element described technical parameter and/or spacing being less than corresponding process parameter compensates.Achieve the auto-compensation of parameter from design parameter to Fabrication parameter to printed circuit board (PCB), improve review efficiency and the accuracy rate of design document.Make the displaying after the derivation of Gerber file more clear to the design of the detailed process imported and resolve.
Please refer to Fig. 4, it is the method flow diagram of the 4th embodiment of the method for the manufacture compensation of the parameter of a kind of Gerber file that the embodiment of the present invention provides.As shown in the figure, the method for the manufacture compensation of the parameter of this Gerber file, comprising:
Step S401: import Gerber file, identifies the layering of Gerber file, other to Hierarchical name and sequence according to the layer of described layering.
The name of each layering is carried out according to resolving the actual place layering obtained, and such as top layer silk-screen, top layer of patches, top line and bottom welding resistance be called after TO, TP, CS and BS respectively.Corresponding, when showing the design drawing of each layering in Gerber file, show its corresponding name in side list, background color can be added in lists further, background color is the color of this layer of corresponding layering, and when detecting that in menu, certain layering is selected, the design drawing by this layering shows.
Step S402: the form reading boring file, aligns boring file with layering.
Step S403: add different colors for each layering and complete parsing display.
Step S404: define the manufacture attribute of an element in described Gerber file, setting process parameter;
Wherein, the manufacture attribute of an element in the described Gerber file of described definition, comprising:
The element of the outer-layer circuit manufacture element of non-for solder mask Pad and this manufacture element comprised transfers Pad to automatically;
For copper attribute is added in copper sheet face.
Described manufacture element comprises: boring, circuit, orifice ring, welding resistance, lid line and Pad.
Step S405: the technical parameter obtaining described manufacture element and the spacing manufactured between element.
Step S406: delete in layering and possess manufacture element involved in the manufacture element of the relation of inclusion on position.
Step S407: by the manufacture element of coincidence relation possessed in layering on position, synthesizes a combination and manufactures element.
Step S408: the manufacture element described technical parameter and/or spacing being less than corresponding process parameter compensates.
A more meticulous compensation way, not enough and real-time when cannot be realized by translation for two distances manufactured between element, be specially adapted to the compensated distance between two Pad.The side towards the other side of two Pad is deleted slightly the distance expanded between the two.Generally speaking Pad is circular, and this processing mode is equivalent to slightly change the distance of amplifying between the two to the shape of Pad.
Wherein, described compensation comprises and being equally spaced by linear manufacture element parallel to each other.
Conveniently the operation of printed circuit board (PCB) simplifies, and by all linear manufacture elements, such as circuit, if it is parallel to each other, then adjusts the distance between parallel lines, make the distance between adjacent two parallel lines equal.Directly produce by a Fabrication parameter in process of production.
Step S409: the described manufacture element hollow out be connected to each other is retained outline.
In the printed circuit boards, each mainly circle and polygon manufacturing element, such as circuit is sayed from function can be considered as the line segment that connection two manufactures element, from the product of reality, is the polygon occupying certain area.If one section of connection is between two Pad, be so two ends by the outline obtained after its hollow out are circular arcs, centre is the closed figure of two line segments compositions.
Step S410: the Gerber file after compensating is carried out DRC detection, obtains the source of the fault in Gerber file.
Step S411: the Gerber file after compensation and former Gerber file are carried out network contrast, detects whether have short circuit and open circuit.
Step S412: import multiple Gerber file after compensating that manufactures, presses described multiple Gerber file manufactured after compensation the format jigsaw preset.
In order to enhance productivity and the utilization factor of material, in the production run of reality, after one piece of motherboard makes multiple printed circuit board (PCB), row segmentation obtains the printed circuit board (PCB) of finished product again, when motherboard carries out jigsaw, jigsaw can be carried out with regard to the design drawing in a Gerber file, also the design drawing in multiple different Gerber file can be carried out jigsaw, the format of concrete design drawing is selected according to figure and design needs, such as left-justify, level interval be equal, with one of them for reference center aligns.
In sum, the present embodiment further illustrates a kind of mode compensated and the mode of figure being carried out hollow out.Generally speaking, the present embodiment is by importing and resolving Gerber file; Define the manufacture attribute of an element in described Gerber file, setting process parameter; The technical parameter obtaining described manufacture element and the spacing manufactured between element; The manufacture element described technical parameter and/or spacing being less than corresponding process parameter compensates.Achieve the auto-compensation of parameter from design parameter to Fabrication parameter to printed circuit board (PCB), improve review efficiency and the accuracy rate of design document.
Be below the device embodiment that the manufacture of the parameter of a kind of Gerber file of the present invention compensates, the embodiment of device realizes based on the embodiment of preceding method, and explanation not most in the embodiment of device, please refer to the embodiment of the method for above-mentioned correspondence.
Please refer to Fig. 5, it is the block diagram of first embodiment of the device of the manufacture compensation of the parameter of the Gerber file that the embodiment of the present invention provides.The device of the manufacture compensation of the parameter of this Gerber file, comprises following content:
Import resolution unit 510, for importing and resolving Gerber file;
Definition setup unit 520, for defining the manufacture attribute of an element in described Gerber file, setting process parameter;
Parameter acquiring unit 530, for the technical parameter that obtains described manufacture element and the spacing manufactured between element;
Parametric compensation unit 540, compensates for the manufacture element described technical parameter and/or spacing being less than corresponding process parameter.
In sum, by the cooperating of above-mentioned each unit, the present embodiment is by importing and resolving Gerber file; Define the manufacture attribute of an element in described Gerber file, setting process parameter; The technical parameter obtaining described manufacture element and the spacing manufactured between element; The manufacture element described technical parameter and/or spacing being less than corresponding process parameter compensates.Achieve the auto-compensation of parameter from design parameter to Fabrication parameter to printed circuit board (PCB), improve review efficiency and the accuracy rate of design document.
Please refer to Fig. 6, it is the block diagram of second embodiment of the method for the manufacture compensation of the parameter of a kind of Gerber file that the embodiment of the present invention provides.As shown in the figure, the device of the manufacture compensation of the parameter of this Gerber file, comprising:
Import resolution unit 510, for importing and resolving Gerber file;
Definition setup unit 520, for defining the manufacture attribute of an element in described Gerber file, setting process parameter;
Parameter acquiring unit 530, for the technical parameter that obtains described manufacture element and the spacing manufactured between element;
Parametric compensation unit 540, compensates for the manufacture element described technical parameter and/or spacing being less than corresponding process parameter.
Wherein, described definition setup unit 520, the element specifically for the outer-layer circuit manufacture element of non-for solder mask Pad and this manufacture element comprised transfers Pad to automatically;
Also for being copper sheet face interpolation copper attribute.
Wherein, described manufacture element comprises boring, circuit, orifice ring, welding resistance, lid line and Pad.
Wherein, also comprise:
Design detecting unit 550, for the Gerber file after compensation is carried out DRC detection, obtains the source of the fault in Gerber file.
Wherein, also comprise:
Network contrast unit 560, for the Gerber file after compensation and former Gerber file are carried out network contrast, detects whether have short circuit and open circuit.
In sum, the present embodiment further illustrates the subsequent operation manufacturing and compensate, and generally speaking, the present embodiment is by importing and resolving Gerber file; Define the manufacture attribute of an element in described Gerber file, setting process parameter; The technical parameter obtaining described manufacture element and the spacing manufactured between element; The manufacture element described technical parameter and/or spacing being less than corresponding process parameter compensates.Achieve the auto-compensation of parameter from design parameter to Fabrication parameter to printed circuit board (PCB), improve review efficiency and the accuracy rate of design document.Manufacture after the subsequent operation compensated ensures to manufacture compensation and the scheme of design itself is not had an impact, can not functional defect be caused.
Please refer to Fig. 7, it is the block diagram of the 3rd embodiment of the method for the manufacture compensation of the parameter of a kind of Gerber file that the embodiment of the present invention provides.As shown in the figure, the device of the manufacture compensation of the parameter of this Gerber file, comprising:
Import resolution unit 510, for importing and resolving Gerber file;
Definition setup unit 520, for defining the manufacture attribute of an element in described Gerber file, setting process parameter;
Parameter acquiring unit 530, for the technical parameter that obtains described manufacture element and the spacing manufactured between element;
Parametric compensation unit 540, compensates for the manufacture element described technical parameter and/or spacing being less than corresponding process parameter.
Wherein, described definition setup unit 520, the element specifically for the outer-layer circuit manufacture element of non-for solder mask Pad and this manufacture element comprised transfers Pad to automatically;
Also for being copper sheet face interpolation copper attribute.
Wherein, described manufacture element comprises boring, circuit, orifice ring, welding resistance, lid line and Pad.
Wherein, also comprise:
Design detecting unit 550, for the Gerber file after compensation is carried out DRC detection, obtains the source of the fault in Gerber file.
Wherein, also comprise:
Network contrast unit 560, for the Gerber file after compensation and former Gerber file are carried out network contrast, detects whether have short circuit and open circuit.
Wherein, described importing resolution unit 510, comprising:
Layering identification module 511, for importing Gerber file, identifies the layering of Gerber file, other to Hierarchical name and sequence according to the layer of described layering;
Boring document alignment module 512, for reading the form of boring file, aligns boring file with layering;
Layering manifestation module 513, completes parsing display for adding different colors for each layering.
Wherein, also comprise:
Manufacture element delete cells 570, manufacture element involved in the manufacture element deleting in layering the relation of inclusion possessed on position.
Wherein, also comprise:
Manufacture element merge cells 580, for the manufacture element of coincidence relation that will possess in layering on position, synthesize a combination manufacture element.
In sum, the present embodiment further illustrates the detailed process importing Gerber file and resolve, and generally speaking, the present embodiment is by importing and resolving Gerber file; Define the manufacture attribute of an element in described Gerber file, setting process parameter; The technical parameter obtaining described manufacture element and the spacing manufactured between element; The manufacture element described technical parameter and/or spacing being less than corresponding process parameter compensates.Achieve the auto-compensation of parameter from design parameter to Fabrication parameter to printed circuit board (PCB), improve review efficiency and the accuracy rate of design document.Make the displaying after the derivation of Gerber file more clear to the design of the detailed process imported and resolve.
Please refer to Fig. 8, it is the block diagram of the 4th embodiment of the method for the manufacture compensation of the parameter of a kind of Gerber file that the embodiment of the present invention provides.As shown in the figure, the device of the manufacture compensation of the parameter of this Gerber file, comprising:
Import resolution unit 510, for importing and resolving Gerber file;
Definition setup unit 520, for defining the manufacture attribute of an element in described Gerber file, setting process parameter;
Parameter acquiring unit 530, for the technical parameter that obtains described manufacture element and the spacing manufactured between element;
Parametric compensation unit 540, compensates for the manufacture element described technical parameter and/or spacing being less than corresponding process parameter.
Wherein, described definition setup unit 520, the element specifically for the outer-layer circuit manufacture element of non-for solder mask Pad and this manufacture element comprised transfers Pad to automatically;
Also for being copper sheet face interpolation copper attribute.
Wherein, described manufacture element comprises boring, circuit, orifice ring, welding resistance, lid line and Pad.
Wherein, also comprise:
Design detecting unit 550, for the Gerber file after compensation is carried out DRC detection, obtains the source of the fault in Gerber file.
Wherein, also comprise:
Network contrast unit 560, for the Gerber file after compensation and former Gerber file are carried out network contrast, detects whether have short circuit and open circuit.
Wherein, described importing resolution unit 510, comprising:
Layering identification module 511, for importing Gerber file, identifies the layering of Gerber file, other to Hierarchical name and sequence according to the layer of described layering;
Boring document alignment module 512, for reading the form of boring file, aligns boring file with layering;
Layering manifestation module 513, completes parsing display for adding different colors for each layering.
Wherein, also comprise:
Manufacture element delete cells 570, manufacture element involved in the manufacture element deleting in layering the relation of inclusion possessed on position.
Wherein, also comprise:
Manufacture element merge cells 580, for the manufacture element of coincidence relation that will possess in layering on position, synthesize a combination manufacture element.
Wherein, also comprise:
Manufacture element hollow-out unit 590, for the described manufacture element hollow out that will be connected to each other, retain outline.
Wherein, described parametric compensation unit 540, also comprises:
Straight line adjusting module 541, for by the parallel distribution of linear manufacture element parallel to each other.
Wherein, also comprise:
Jigsaw unit 500, for importing multiple Gerber file after compensating that manufactures, presses described multiple Gerber file manufactured after compensation the format jigsaw preset.
Wherein, the attribute of described boring defines according to cutter.
In sum, the present embodiment further illustrates a kind of mode compensated and the mode of figure being carried out hollow out.Generally speaking, the present embodiment is by importing and resolving Gerber file; Define the manufacture attribute of an element in described Gerber file, setting process parameter; The technical parameter obtaining described manufacture element and the spacing manufactured between element; The manufacture element described technical parameter and/or spacing being less than corresponding process parameter compensates.Achieve the auto-compensation of parameter from design parameter to Fabrication parameter to printed circuit board (PCB), improve review efficiency and the accuracy rate of design document.
The invention described above embodiment sequence number, just to describing, does not represent the quality of embodiment.
One of ordinary skill in the art will appreciate that all or part of step realizing above-described embodiment can have been come by hardware, the hardware that also can carry out instruction relevant by program completes, this program can be stored in a computer-readable recording medium, and storage medium can comprise storer, disk or CD etc.
Above content is only preferred embodiment of the present invention, and for those of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, this description should not be construed as limitation of the present invention.
Claims (26)
1. a method for the manufacture compensation of the parameter of Gerber file, is characterized in that, comprising:
Import and resolve Gerber file;
Define the manufacture attribute of an element in described Gerber file, setting process parameter;
The technical parameter obtaining described manufacture element and the spacing manufactured between element;
The manufacture element described technical parameter and/or spacing being less than corresponding process parameter compensates.
2. the method for the manufacture compensation of the parameter of a kind of Gerber file according to claim 1, it is characterized in that, the manufacture attribute of an element in the described Gerber file of described definition, comprising:
The element of the outer-layer circuit manufacture element of non-for solder mask Pad and this manufacture element comprised transfers Pad to automatically.
3. the method for the manufacture compensation of the parameter of a kind of Gerber file according to claim 1, it is characterized in that, the manufacture attribute of an element in the described Gerber file of described definition, comprising:
For copper attribute is added in copper sheet face.
4. the method for the manufacture compensation of the parameter of a kind of Gerber file according to claim 1, it is characterized in that, described manufacture element comprises: boring, circuit, orifice ring, welding resistance, lid line and Pad.
5. the method for the manufacture compensation of the parameter of a kind of Gerber file according to claim 1, is characterized in that, after the described manufacture element described technical parameter and/or spacing being less than corresponding process parameter compensates by the process parameter of correspondence, also comprise:
Gerber file after compensating is carried out DRC detection, obtains the source of the fault in Gerber file.
6. the method for the manufacture compensation of the parameter of a kind of Gerber file according to claim 1, is characterized in that, after the described manufacture element described technical parameter and/or spacing being less than corresponding process parameter compensates by the process parameter of correspondence, also comprise:
Gerber file after compensation and former Gerber file are carried out network contrast, detects whether have short circuit and open circuit.
7. the method for the manufacture compensation of the parameter of a kind of Gerber file according to claim 1, it is characterized in that, described importing also resolves Gerber file, comprising:
Import Gerber file, identify the layering of Gerber file, other to Hierarchical name and sequence according to the layer of described layering;
Read the form of boring file, boring file is alignd with layering;
Add different colors for each layering and complete parsing display.
8. the method for the manufacture compensation of the parameter of a kind of Gerber file according to claim 7, is characterized in that, before the described manufacture element described technical parameter and/or spacing being less than corresponding process parameter compensates, also comprise:
Delete in layering and possess manufacture element involved in the manufacture element of the relation of inclusion on position.
9. the method for the manufacture compensation of the parameter of a kind of Gerber file according to claim 7, is characterized in that, before the described manufacture element described technical parameter and/or spacing being less than corresponding process parameter compensates, also comprise:
By the manufacture element of coincidence relation possessed in layering on position, synthesize a combination and manufacture element.
10. the method for the manufacture compensation of the parameter of a kind of Gerber file according to claim 1, is characterized in that, after the described manufacture element described technical parameter and/or spacing being less than corresponding process parameter compensates, also comprise:
The described manufacture element hollow out be connected to each other is retained outline.
The method of the manufacture compensation of the parameter of 11. a kind of Gerber files according to claim 1, it is characterized in that, the described manufacture element described technical parameter and/or spacing being less than corresponding process parameter compensates, and also comprises:
By the parallel distribution of linear manufacture element parallel to each other.
The method of the manufacture compensation of the parameter of 12. a kind of Gerber files according to claim 1, is characterized in that, after the described manufacture element described technical parameter and/or spacing being less than corresponding process parameter compensates, also comprise:
Import multiple Gerber file after compensating that manufactures, described multiple Gerber file manufactured after compensation is pressed the format jigsaw preset.
The method of the manufacture compensation of the parameter of 13. a kind of Gerber files according to claim 4, it is characterized in that, the attribute of described boring defines according to cutter.
The device of the manufacture compensation of the parameter of 14. 1 kinds of Gerber files, is characterized in that, comprising:
Import resolution unit, for importing and resolving Gerber file;
Definition setup unit, for defining the manufacture attribute of an element in described Gerber file, setting process parameter;
Parameter acquiring unit, for the technical parameter that obtains described manufacture element and the spacing manufactured between element;
Parametric compensation unit, compensates for the manufacture element described technical parameter and/or spacing being less than corresponding process parameter.
The device of the manufacture compensation of the parameter of 15. a kind of Gerber files according to claim 14, it is characterized in that, described definition setup unit, the element for the outer-layer circuit manufacture element of non-for solder mask Pad and this manufacture element comprised transfers Pad to automatically.
The device of the manufacture compensation of the parameter of 16. a kind of Gerber files according to claim 14, is characterized in that, described definition setup unit is also for being copper sheet face interpolation copper attribute.
The device of the manufacture compensation of the parameter of 17. a kind of Gerber files according to claim 14, it is characterized in that, described manufacture element comprises boring, circuit, orifice ring, welding resistance, lid line and Pad.
The device of the manufacture compensation of the parameter of 18. a kind of Gerber files according to claim 14, is characterized in that, also comprise:
Design detecting unit, for the Gerber file after compensation is carried out DRC detection, obtains the source of the fault in Gerber file.
The device of the manufacture compensation of the parameter of 19. a kind of Gerber files according to claim 14, is characterized in that, also comprise:
Network contrast unit, for the Gerber file after compensation and former Gerber file are carried out network contrast, detects whether have short circuit and open circuit.
The device of the manufacture compensation of the parameter of 20. a kind of Gerber files according to claim 14, it is characterized in that, described importing resolution unit, comprising:
Layering identification module, for importing Gerber file, identifies the layering of Gerber file, other to Hierarchical name and sequence according to the layer of described layering;
Boring document alignment module, for reading the form of boring file, aligns boring file with layering;
Layering manifestation module, completes parsing display for adding different colors for each layering.
The device of the manufacture compensation of the parameter of 21. a kind of Gerber files according to claim 20, is characterized in that, also comprise:
Manufacture element delete cells, manufacture element involved in the manufacture element deleting in layering the relation of inclusion possessed on position.
The device of the manufacture compensation of the parameter of 22. a kind of Gerber files according to claim 20, is characterized in that, also comprise:
Manufacture element merge cells, for the manufacture element of coincidence relation that will possess in layering on position, synthesize a combination manufacture element.
The device of the manufacture compensation of the parameter of 23. a kind of Gerber files according to claim 14, is characterized in that, also comprise:
Manufacture element hollow-out unit, for the described manufacture element hollow out that will be connected to each other, retain outline.
The device of the manufacture compensation of the parameter of 24. a kind of Gerber files according to claim 14, it is characterized in that, described parametric compensation unit, also comprises:
Straight line adjusting module, for by the parallel distribution of linear manufacture element parallel to each other.
The device of the manufacture compensation of the parameter of 25. a kind of Gerber files according to claim 14, is characterized in that, also comprise:
Jigsaw unit, for importing multiple Gerber file after compensating that manufactures, presses described multiple Gerber file manufactured after compensation the format jigsaw preset.
The device of the manufacture compensation of the parameter of 26. a kind of Gerber files according to claim 17, it is characterized in that, the attribute of described boring defines according to cutter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410555012.0A CN104317998B (en) | 2014-10-17 | 2014-10-17 | A kind of method and apparatus of the manufacture compensation of the parameter of Gerber files |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410555012.0A CN104317998B (en) | 2014-10-17 | 2014-10-17 | A kind of method and apparatus of the manufacture compensation of the parameter of Gerber files |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104317998A true CN104317998A (en) | 2015-01-28 |
| CN104317998B CN104317998B (en) | 2018-11-09 |
Family
ID=52373229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410555012.0A Active CN104317998B (en) | 2014-10-17 | 2014-10-17 | A kind of method and apparatus of the manufacture compensation of the parameter of Gerber files |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104317998B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105183971A (en) * | 2015-08-31 | 2015-12-23 | 深圳崇达多层线路板有限公司 | PCB borehole enlargement method |
| CN105404715A (en) * | 2015-10-27 | 2016-03-16 | 广州兴森快捷电路科技有限公司 | Method and system for making high-precision borehole engineering file of circuit board |
| CN107229013A (en) * | 2017-06-27 | 2017-10-03 | 奥士康精密电路（惠州）有限公司 | Pin prints bad method in a kind of golden face tests of improvement PCB |
| CN105792521B (en) * | 2016-03-25 | 2018-12-04 | 柏承科技(昆山)股份有限公司 | Pcb board pad Compensation Design technique and its application |
| CN109121303A (en) * | 2018-09-28 | 2019-01-01 | 广州兴森快捷电路科技有限公司 | In advance at the scoreboard method of plate, in advance at the boring method of plate and wiring board |
| WO2020103385A1 (en) * | 2018-11-23 | 2020-05-28 | 上海望友信息科技有限公司 | Method and system for detecting open/short circuit on pcb design layout, and electronic device |
| CN112580290A (en) * | 2020-12-25 | 2021-03-30 | 广州兴森快捷电路科技有限公司 | PCB manufacturing method, PCB manufacturing device and storage medium |
| TWI743918B (en) * | 2020-07-31 | 2021-10-21 | 牧德科技股份有限公司 | Electrical test method of circuit board |
| CN114025487A (en) * | 2021-10-22 | 2022-02-08 | 广州兴森快捷电路科技有限公司 | PCB manufacturing method, PCB manufacturing system, electronic device and storage medium |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03118664A (en) * | 1989-09-29 | 1991-05-21 | Yokogawa Electric Corp | Trimming data generating method |
| CN102214261A (en) * | 2011-07-11 | 2011-10-12 | 西安电子科技大学 | Method for automatic check of process data of printed circuit board |
| CN102819552A (en) * | 2012-06-26 | 2012-12-12 | 深圳市百能信息技术有限公司 | Method and system for automatically examining and verifying Printed Circuit Board (PCB) project files |
| CN103279861A (en) * | 2013-06-04 | 2013-09-04 | 深圳市百能信息技术有限公司 | PCB engineering problem contrastive analysis and PCB engineering problem contrastive analysis result sending method and device |
| CN103823882A (en) * | 2014-03-03 | 2014-05-28 | 深圳市百能信息技术有限公司 | Method and system for automatically auditing PCB project files |
-
2014
- 2014-10-17 CN CN201410555012.0A patent/CN104317998B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03118664A (en) * | 1989-09-29 | 1991-05-21 | Yokogawa Electric Corp | Trimming data generating method |
| CN102214261A (en) * | 2011-07-11 | 2011-10-12 | 西安电子科技大学 | Method for automatic check of process data of printed circuit board |
| CN102819552A (en) * | 2012-06-26 | 2012-12-12 | 深圳市百能信息技术有限公司 | Method and system for automatically examining and verifying Printed Circuit Board (PCB) project files |
| CN103279861A (en) * | 2013-06-04 | 2013-09-04 | 深圳市百能信息技术有限公司 | PCB engineering problem contrastive analysis and PCB engineering problem contrastive analysis result sending method and device |
| CN103823882A (en) * | 2014-03-03 | 2014-05-28 | 深圳市百能信息技术有限公司 | Method and system for automatically auditing PCB project files |
Non-Patent Citations (1)
| Title |
|---|
| 孙煜晴: "印制电路板制造中加工数据自动审查技术研究", 《中国优秀硕士学位论文全文数据库 信息科技辑》 * |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105183971A (en) * | 2015-08-31 | 2015-12-23 | 深圳崇达多层线路板有限公司 | PCB borehole enlargement method |
| CN105404715A (en) * | 2015-10-27 | 2016-03-16 | 广州兴森快捷电路科技有限公司 | Method and system for making high-precision borehole engineering file of circuit board |
| CN105404715B (en) * | 2015-10-27 | 2018-09-21 | 广州兴森快捷电路科技有限公司 | A kind of the high-precision borehole project file production method and system of wiring board |
| CN105792521B (en) * | 2016-03-25 | 2018-12-04 | 柏承科技(昆山)股份有限公司 | Pcb board pad Compensation Design technique and its application |
| CN107229013A (en) * | 2017-06-27 | 2017-10-03 | 奥士康精密电路（惠州）有限公司 | Pin prints bad method in a kind of golden face tests of improvement PCB |
| CN109121303A (en) * | 2018-09-28 | 2019-01-01 | 广州兴森快捷电路科技有限公司 | In advance at the scoreboard method of plate, in advance at the boring method of plate and wiring board |
| WO2020103385A1 (en) * | 2018-11-23 | 2020-05-28 | 上海望友信息科技有限公司 | Method and system for detecting open/short circuit on pcb design layout, and electronic device |
| US11604916B2 (en) | 2018-11-23 | 2023-03-14 | Vayo (Shanghai) Technology Co., Ltd. | Method, system, and electronic device for detecting open/short circuit of PCB design layout |
| TWI743918B (en) * | 2020-07-31 | 2021-10-21 | 牧德科技股份有限公司 | Electrical test method of circuit board |
| CN112580290A (en) * | 2020-12-25 | 2021-03-30 | 广州兴森快捷电路科技有限公司 | PCB manufacturing method, PCB manufacturing device and storage medium |
| CN114025487A (en) * | 2021-10-22 | 2022-02-08 | 广州兴森快捷电路科技有限公司 | PCB manufacturing method, PCB manufacturing system, electronic device and storage medium |
| CN114025487B (en) * | 2021-10-22 | 2024-03-08 | 广州兴森快捷电路科技有限公司 | PCB manufacturing method, PCB manufacturing system, electronic equipment and storage medium |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104317998B (en) | 2018-11-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104317998A (en) | Method and device for making and compensating parameters of Gerber file | |
| EP3530463A1 (en) | Apparatus and method of generating control parameter of screen printer | |
| CN103687315B (en) | Designing method of punching alignment target | |
| CN106525861B (en) | AOI test parameter adjusting method and device | |
| JP2013181807A (en) | Area classification device, program thereof, substrate inspection device, and area classification method | |
| CN110267437B (en) | Printed circuit board expansion and shrinkage control method and device | |
| CN110458196B (en) | Database construction method suitable for artificial intelligence detection of PCB | |
| CN101782931B (en) | Processing method and system of constraint areas of circuit board wiring | |
| CN107092757B (en) | Method for checking through hole pressure dividing line in PCB design | |
| JP2010020644A (en) | Printed circuit board design support program, recording medium and printed circuit board design support method | |
| CN105916301A (en) | PCB impedance verification matching method and system | |
| TWI661394B (en) | Image recognion method for soldered dot | |
| US9372950B2 (en) | Circuit layout method and circuit layout apparatus | |
| JP4223412B2 (en) | Plating lead evaluation program, evaluation apparatus provided with a computer-readable recording medium recording this plating lead evaluation program, and printed wiring board designed using these plating lead evaluation program or evaluation apparatus | |
| JP6162043B2 (en) | Electrical design apparatus, electrical design method, program, and computer-readable recording medium for electronic substrate using three-dimensional space | |
| JP2015219141A (en) | Printed substrate inspection device and inspection method of the same | |
| JPH11143917A (en) | Check device and method for printed board | |
| US10618144B2 (en) | Grinding method and OGS substrate | |
| CN112739044A (en) | Method for manufacturing anti-welding test line through automatic script | |
| CN206517662U (en) | Edges of boards wad cutter error-proof structure | |
| JPH11234000A (en) | Component mounting simulation method and component mounting simulator | |
| JP2021023982A (en) | Soldering condition learning device, soldering condition decision device and soldering device | |
| JP2006119877A (en) | Design method of printed circuit board | |
| CN114828418B (en) | Automatic line shifting processing method for PCB | |
| US20080210461A1 (en) | Circuit board with a three-terminal jumber and method for fabricating the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A method and device for manufacturing compensation of parameters in Gerber files Granted publication date: 20181109 Pledgee: Shenzhen small and medium sized small loan Co.,Ltd. Pledgor: SHENZHEN PARTNER INFORMATION TECHNOLOGY Co.,Ltd. Registration number: Y2024980020611 |