CN105404715B - A kind of the high-precision borehole project file production method and system of wiring board - Google Patents
A kind of the high-precision borehole project file production method and system of wiring board Download PDFInfo
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- CN105404715B CN105404715B CN201510712831.6A CN201510712831A CN105404715B CN 105404715 B CN105404715 B CN 105404715B CN 201510712831 A CN201510712831 A CN 201510712831A CN 105404715 B CN105404715 B CN 105404715B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
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Abstract
The invention discloses the high-precision borehole project file production methods and system of a kind of wiring board, and described method includes following steps：Obtain more than one high-precision borehole area level information and multiple via hole information positioned at high-precision borehole area level periphery；Wherein, high-precision borehole area level information includes the Theoretical Design coordinate of high-precision borehole respectively to be drilled out in the circuit board in the high-precision borehole area level, and the via hole information includes the Theoretical Design coordinate of the via hole in the circuit board；More than one described high-precision borehole area level information is matched respectively with multiple via hole information positioned at high-precision borehole area level periphery and generates to obtain more than one high-precision borehole project file to be produced；More than one described high-precision borehole project file to be produced is merged into processing.The present invention can be convenient for making high-precision borehole project file, can reduce drilling error phenomenon and improving the working efficiency of drilling.
Description
Technical field
The present invention relates to a kind of production methods of the project file of wiring board, more particularly, to a kind of high-precision of wiring board
Borehole engineering documenting method and system.
Background technology
The requirement of the high-end customer device to hole position precision of traditional PCB industries is higher and higher so that conventional borehole mode is difficult
Reach requirement, CCD bore modes are gradually introduced into.
Wherein, conventional borehole project file format is:File header (including metric and English explanation and cutter inventory)+document body
(the XY coordinate values of each hole position)+end-of-file.Drilling device can be successively by the brill on wiring board according to conventional borehole project file
Hole drills out, but conventional borehole project file does not distinguish high-precision drilling bore region so that wiring board precision is relatively low.CCD drills
Project file format is:File header (including metric and English explanation and cutter inventory)+document body (via hole n and high-precision borehole n
The XY coordinate values of region apertures position)+end-of-file.CCD borehole engineering files distinguish high-precision borehole, it has high-precision drilling bore region
With via hole.Via hole first passes through X-RAY drilling machines and drills out, and the hole of high-precision drilling bore region is that via hole drills out rear, basis
Via hole harmomegathus value is drilled out by CCD drilling machines, and such CCD bore modes can improve the borehole accuracy of wiring board.
But when high-precision drilling bore region there are it is N number of when, CCD bore modes propose new want to CCD borehole engineering files
It asks, is learnt by understanding CCD borehole engineering files：Traditional borehole engineering documenting mode is needed each high-precision drilling
The hole of bore region is moved to a certain layer, and corresponding via hole, which is also required to be moved to a certain layer, does correspondence, then passes through CAM softwares
(Genes is2000) outputs it to obtain high-precision borehole file.If there are N number of, CAM softwares for high-precision drilling bore region
(Genesis2000) it can not directly export to obtain the CCD borehole engineering files with N number of high-precision drilling bore region.In this way, in order to
Making obtains CCD borehole engineering files, it is by newly-increased N*2 certain layer, (including the high-precision borehole area level per a pair of certain layer
With auxiliary aperture layer) can be used for produce board produce to obtain the drilling of a high-precision drilling bore region.And if there is N*2 is a specific
Layer, then production board needs to adjust N*2 file when making, bores n times drilling.As it can be seen that being not easy to CCD high-precision boreholes engineering text
Part makes, extreme influence boring work efficiency, is also easy to cause drilling error phenomenon.
Invention content
Based on this, the invention reside in overcoming the deficiencies of existing technologies, a kind of high-precision borehole engineering text of wiring board is provided
Part production method and system, it can be convenient for making high-precision borehole project file, can reduce error phenomenon and improving drilling
Working efficiency.
Its technical solution is as follows：
A kind of high-precision borehole project file production method of wiring board, includes the following steps：It is high-precision to obtain more than one
Degree drilling area level information and multiple via hole information positioned at high-precision borehole area level periphery；Wherein, high-precision
Drilling area level information includes the theory of high-precision borehole respectively to be drilled out in the circuit board in the high-precision borehole area level
Coordinate is designed, the via hole information includes the Theoretical Design coordinate of the via hole in the circuit board；Described in more than one
High-precision borehole area level information carries out respectively with multiple via hole information positioned at high-precision borehole area level periphery
Match and generates to obtain more than one high-precision borehole project file to be produced；By more than one high-precision borehole work to be produced
Journey file merges processing.
The high-precision borehole project file to be produced includes to exist for measuring via hole in one of the embodiments,
The measurement instruction of actual coordinate on wiring board, for obtaining the high-precision drilling bore region according to the via hole actual coordinate
The computations of the harmomegathus value of layer, and for according to the high-precision drilling in the harmomegathus value and the high-precision borehole area level
The Theoretical Design coordinate in hole determines the high-precision borehole actual coordinate in the high-precision borehole area level, and according to the height
Precision drill actual coordinate is executed instruction what the high-precision borehole on wiring board drilled out.
Rising for the high-precision borehole area level is obtained according to the via hole actual coordinate in one of the embodiments,
The method of contracting value is：By via hole actual coordinate spacing described in any two of the high-precision borehole area level periphery and this
The Theoretical Design coordinate spacing of two via holes of meaning is compared to obtain.
In one of the embodiments, to four there are two the via hole settings of the high-precision borehole area level periphery
It is a.
It is obtaining more than one high-precision borehole area level information in one of the embodiments, and is being located at described high-precision
Further include step after multiple via hole information of degree drilling area level periphery：By more than one high-precision drilling bore region of acquisition
Layer is shown with multiple via holes positioned at high-precision borehole area level periphery by display device.
It is described by more than one described high-precision borehole area level information and positioned at the height in one of the embodiments,
Multiple via hole information of precision drill area level periphery carry out matched matching process and are respectively：First by high-precision drilling bore region
Layer is placed in multiple via holes of high-precision borehole area level periphery in auxiliary area layer, then when receive will be positioned at described auxiliary
Multiple via holes of the high-precision borehole area level helped in area level and high-precision borehole area level periphery carry out matched
It, then will be outside high-precision borehole area level and the high-precision borehole area level in the auxiliary area layer after matching instruction
The multiple via holes enclosed are matched into one group.
The more of the high-precision borehole area level and high-precision borehole area level periphery are judged in one of the embodiments,
Whether a via hole is fully recessed into the auxiliary area layer, if it is, accordingly generating the matching instruction；If it is not,
It then prompts to match unsuccessful.
In one of the embodiments, by high-precision borehole area level and the high-precision drilling in the auxiliary area layer
After multiple via holes of bore region layer periphery are matched into one group, generation obtains the side of high-precision borehole project file to be produced
Method is：Obtain the high-precision borehole theoretical coordinate of the high-precision borehole area level in the auxiliary area layer and multiple via holes
Theoretical coordinate, generated to obtain high-precision to be produced according to the theoretical coordinate of high-precision borehole theoretical coordinate and multiple via holes
Borehole engineering file.
The present invention also provides a kind of high-precision borehole project file manufacturing systems of wiring board, including：Acquisition module, it is described
Acquisition module is for obtaining more than one high-precision borehole area level information and positioned at high-precision borehole area level periphery
Multiple via hole information；Wherein, high-precision borehole area level information includes respectively waiting drilling out in the high-precision borehole area level
High-precision borehole Theoretical Design coordinate in the circuit board, the via hole information include the via hole in the circuit board
Theoretical Design coordinate；Matching module, the matching module are used for more than one described high-precision borehole area level and are located at institute
The multiple via holes for stating high-precision borehole area level periphery are matched one by one respectively；Generation module, the generation module are used for
Multiple via holes that more than one described high-precision borehole area level information and the high-precision borehole area level are matched are believed
Breath generates and obtains more than one high-precision borehole project file to be produced；And merging treatment module, the merging treatment module are used
In more than one described high-precision borehole project file to be produced is merged processing.
The principle of the present invention, effect are further illustrated with reference to above-mentioned technical proposal：
The high-precision borehole project file production method of above-mentioned wiring board, by believing the high-precision borehole area level
Breath generates to obtain high-precision borehole engineering text to be produced with multiple via hole information that the high-precision borehole area level matches
Then multiple high-precision borehole project file to be produced is merged processing again and obtains high-precision borehole project file by part.
When CCD drilling machines read the high-precision borehole project file, it is successively read each high-precision borehole project file to be produced, reads and waits for
It will be high-precision corresponding to read high-precision borehole project file to be produced during making high-precision borehole project file
The high-precision borehole in degree drilling region drills out.In this way, the present invention can be convenient for making high-precision borehole project file, can reduce brill
Hole error phenomenon and the working efficiency for improving drilling.
Description of the drawings
Fig. 1 is the high-precision borehole project file production method flow chart one of wiring board described in the embodiment of the present invention；
Fig. 2 is the high-precision borehole project file production method flowchart 2 of wiring board described in the embodiment of the present invention；
Fig. 3 is that the high-precision drilling bore region of wiring board described in the embodiment of the present invention carries out matched schematic diagram with via hole；
Fig. 4 is the high-precision borehole documenting system schematic of wiring board described in the embodiment of the present invention.
Reference sign：
10, wiring board, 11, high-precision borehole area level, 12, via hole, 13, auxiliary area layer, 20, acquisition module, 30,
Matching module, 40, generation module, 50, merging treatment module.
Specific implementation mode
The embodiment of the present invention is described in detail below：
Embodiment one, as shown in Figure 1, the high-precision borehole project file production method of wiring board of the present invention, packet
Include following steps：
Step 101 obtains more than one 11 information of high-precision borehole area level and is located at the high-precision drilling bore region
12 information of multiple via holes of 11 periphery of layer；Wherein, 11 information of high-precision borehole area level includes the high-precision borehole area level
The Theoretical Design coordinate of high-precision borehole respectively to be drilled out in the circuit board in 11,12 information of the via hole includes described auxiliary
Help the Theoretical Design coordinate of hole 12 in the circuit board；The Theoretical Design coordinate of drilling refers to the coordinate bit in drilling file
Set and client desired by the coordinate position that can ideally realize.
Step 102, by more than one described 11 information of high-precision borehole area level be located at the high-precision drilling bore region
12 information of multiple via holes of 11 periphery of layer is matched respectively；Referring to Fig. 3, there are six high-precision borehole area levels 11, often
There are four the settings of the via hole 12 of 11 periphery of a high-precision borehole area level, and the quantity of certain via hole 12 can also be arranged
It is two, three, five or other.It is in the purpose that corresponding via hole 12 is arranged in 11 periphery of high-precision borehole area level：It will
Before high-precision borehole in high-precision borehole area level 11 drills out, target is arranged in 12 position of via hole by line pattern transfer
Mark, and go out the target on wiring board to form via hole 12 using laser drill mode, then obtain high-precision drilling bore region
The location information of 11 periphery via hole 12 of layer, you can the harmomegathus value for calculating high-precision drilling bore region 11, according to high-precision borehole
The harmomegathus value in region 11 can calculate the high-precision borehole coordinate of accurate high-precision drilling bore region 11, obtained circuit
The quality of plate is higher.
Step 103, by more than one described 11 information of high-precision borehole area level and the high-precision borehole area level 11
12 information of multiple via holes to match generates to obtain more than one high-precision borehole project file to be produced；
The high-precision borehole project file to be produced includes for measuring the practical seat of via hole 12 in the circuit board
Target measurement instruction, the harmomegathus value for obtaining according to 12 actual coordinate of the via hole high-precision borehole area level 11
Computations, and for being set according to the harmomegathus value and the theory of the high-precision borehole in the high-precision borehole area level 11
Coordinate is counted to determine the high-precision borehole actual coordinate in the high-precision borehole area level 11, and according to the high-precision borehole
Actual coordinate is executed instruction what the high-precision borehole on wiring board drilled out.
When CCD drilling machines read CCD borehole engineering files, when reading measurement instruction, i.e. scanning gets via hole 12
Actual coordinate in the circuit board obtains described high-precision when reading computations according to 12 actual coordinate of the via hole
Degree drilling area level 11 harmomegathus value, when read execute instruction when, i.e., according to the harmomegathus value and the high-precision drilling bore region
Layer 11 in high-precision borehole Theoretical Design coordinate come determine the high-precision borehole in the high-precision borehole area level 11 reality
Border coordinate, and drill out the high-precision borehole on wiring board according to the high-precision borehole actual coordinate.
Wherein, the method that the harmomegathus value of the high-precision borehole area level 11 is obtained according to 12 actual coordinate of the via hole
For：By 12 actual coordinate spacing of via hole and any two described in any two of 11 periphery of the high-precision borehole area level
The Theoretical Design coordinate spacing of the via hole 12 is compared to obtain.
By 11 periphery of high-precision borehole area level 11 and the high-precision borehole area level in the auxiliary area layer 13
Multiple via holes 12 matched into one group after, generate obtain high-precision borehole project file to be produced method be：It obtains
The high-precision borehole theoretical coordinate of high-precision borehole area level 11 in the auxiliary area layer 13 and multiple via holes 12
Theoretical coordinate generates to obtain high-precision to be produced according to the theoretical coordinate of high-precision borehole theoretical coordinate and multiple via holes 12
Borehole engineering file.
More than one described high-precision borehole project file to be produced is merged processing by step 104.On wiring board
Each high-precision drilling bore region 11 obtains multiple high-precision borehole project files to be produced by step 101 to step 103 generation
Afterwards, then by multiple high-precision borehole project file to be produced processing is merged, you can obtain a high-precision borehole engineering
File when CCD drilling machines read the high-precision borehole project file, is successively read each high-precision borehole project file to be produced, reads
It will be corresponding to read high-precision borehole project file to be produced during getting high-precision borehole project file to be produced
The high-precision borehole of high-precision drilling bore region 11 drill out.
Embodiment two, referring to Fig. 2, the high-precision borehole project file production method of wiring board of the present invention, packet
Include following steps：
Step 201 obtains more than one 11 information of high-precision borehole area level and is located at the high-precision drilling bore region
12 information of multiple via holes of 11 periphery of layer；Wherein, 11 information of high-precision borehole area level includes the high-precision borehole area level
The Theoretical Design coordinate of high-precision borehole respectively to be drilled out in the circuit board in 11,12 information of the via hole includes described auxiliary
Help the Theoretical Design coordinate of hole 12 in the circuit board.
Step 202, by more than one high-precision borehole area level 11 of acquisition be located at the high-precision borehole area level
Multiple via holes 12 of 11 peripheries are shown by display device.By high-precision borehole area level 11 and the via hole 12 of periphery
After being shown, staff can be facilitated to obtain the information of high-precision borehole area level 11 and be convenient for subsequent operation.
Step 203, by more than one described 11 information of high-precision borehole area level be located at the high-precision drilling bore region
12 information of multiple via holes of 11 periphery of layer is matched respectively；
Referring to Fig. 3, by more than one described 11 information of high-precision borehole area level and being located at the high-precision drilling porose area
12 information of multiple via holes of 11 periphery of domain layer carries out matched matching process and is respectively：By high-precision borehole area level 11 and height
Multiple via holes 12 of 11 periphery of precision drill area level are placed in auxiliary area layer 13.Staff is by creating an auxiliary
Area level 13 covers the via hole 12 of high-precision borehole area level 11 and periphery by auxiliary area layer 13, you can will high-precision
Drilling 11 information of area level is matched with 12 information of multiple via holes positioned at 11 periphery of high-precision borehole area level.
Step 204, the multiple auxiliary for judging the high-precision borehole area level 11 and 11 periphery of high-precision borehole area level
Whether hole 12 is fully recessed into the auxiliary area layer 13, if it is, accordingly generating the matching instruction, enters step 205；
If it is not, then prompt matching is unsuccessful, matching need to be re-started, enters step 203.
Step 205, when receiving high-precision borehole area level 11 and the height in the auxiliary area layer 13
After multiple via holes 12 of 11 periphery of precision drill area level carry out matched matching instruction, then it will be located at the auxiliary area layer
High-precision borehole area level 11 in 13 is matched into multiple via holes 12 of 11 periphery of the high-precision borehole area level
One group；
Step 206, by more than one described 11 information of high-precision borehole area level and the high-precision borehole area level 11
12 information of multiple via holes to match generates to obtain more than one high-precision borehole project file to be produced；
More than one described high-precision borehole project file to be produced is merged processing by step 207.
Referring to Fig. 4, the high-precision borehole project file manufacturing system of wiring board of the present invention, including acquisition module
20, matching module 30, generation module 40 and merging treatment module 50.The acquisition module 20 is for obtaining more than one high-precision
11 information of area level that drills and 12 information of multiple via holes positioned at the periphery of the high-precision borehole area level 11.Wherein, high
11 information of precision drill area level includes the high-precision borehole assist side respectively to be drilled out in the high-precision borehole area level 11
On Theoretical Design coordinate, 12 information of the via hole includes the Theoretical Design coordinate of the via hole 12 in the circuit board.Institute
Matching module 30 is stated for by more than one described high-precision borehole area level 11 and positioned at the high-precision borehole area level 11
Multiple via holes 12 of periphery are matched one by one respectively.The generation module 40 is used for more than one high-precision borehole
11 information of area level generates to obtain more than one with 12 information of multiple via holes that the high-precision borehole area level 11 matches
High-precision borehole project file to be produced.The merging treatment module 50 is used for more than one high-precision borehole to be produced
Project file merges processing.
The high-precision borehole project file manufacturing system of above-mentioned wiring board, by by the high-precision borehole area level 11
Information generates to obtain high-precision borehole to be produced with 12 information of multiple via holes that the high-precision borehole area level 11 matches
Then multiple high-precision borehole project file to be produced is merged processing again and obtains high-precision borehole engineering by project file
File.When CCD drilling machines read the high-precision borehole project file, it is successively read each high-precision borehole project file to be produced, is read
It will be corresponding to read high-precision borehole project file to be produced during getting high-precision borehole project file to be produced
The high-precision borehole of high-precision drilling bore region 11 drill out.In this way, the present invention can be convenient for making high-precision borehole project file,
Drilling error phenomenon can be reduced and improve the working efficiency of drilling.
The high-precision borehole project file manufacturing system of above-mentioned wiring board, by believing the high-precision borehole area level
Breath generates to obtain high-precision borehole engineering text to be produced with multiple via hole information that the high-precision borehole area level matches
Then multiple high-precision borehole project file to be produced is merged processing again and obtains high-precision borehole project file by part.
When CCD drilling machines read the high-precision borehole project file, it is successively read each high-precision borehole project file to be produced, reads and waits for
It will be high-precision corresponding to read high-precision borehole project file to be produced during making high-precision borehole project file
The high-precision borehole in degree drilling region drills out.In this way, the present invention can be convenient for making high-precision borehole project file, can reduce brill
Hole error phenomenon and the working efficiency for improving drilling.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (8)
1. a kind of high-precision borehole project file production method of wiring board, which is characterized in that include the following steps：
Obtain more than one high-precision borehole area level information and positioned at the multiple auxiliary of high-precision borehole area level periphery
Help hole information；Wherein, high-precision borehole area level information includes the high-precision respectively to be drilled out in the high-precision borehole area level
The Theoretical Design coordinate of drilling in the circuit board, the via hole information includes the Theoretical Design of the via hole in the circuit board
Coordinate；
By more than one described high-precision borehole area level information with positioned at the high-precision borehole area level periphery it is multiple auxiliary
It helps hole information to be matched respectively and generates to obtain more than one high-precision borehole project file to be produced；
More than one described high-precision borehole project file to be produced is merged into processing；
Wherein, described by more than one described high-precision borehole area level information and positioned at high-precision borehole area level periphery
Multiple via hole information carry out matched matching process respectively and be：First by high-precision borehole area level and high-precision drilling bore region
In multiple via holes merging auxiliary area layer of layer periphery, then when receiving the high-precision in the auxiliary area layer
After multiple via holes of the area level that drills and high-precision borehole area level periphery carry out matched matching instruction, then it will be located at
High-precision borehole area level and multiple via holes of high-precision borehole area level periphery in the auxiliary area layer carry out
Match into one group.
2. the high-precision borehole project file production method of wiring board according to claim 1, which is characterized in that described to wait for
It includes the measurement instruction for measuring the actual coordinate of via hole in the circuit board to make high-precision borehole project file, is used for
The computations of the harmomegathus value of the high-precision borehole area level are obtained according to the via hole actual coordinate, and are used for basis
The Theoretical Design coordinate of high-precision borehole in the harmomegathus value and the high-precision borehole area level determines the high-precision
High-precision borehole actual coordinate in the area level that drills, and will be high-precision on wiring board according to the high-precision borehole actual coordinate
What degree drilled out executes instruction.
3. the high-precision borehole project file production method of wiring board according to claim 2, which is characterized in that according to institute
The method for stating the harmomegathus value that via hole actual coordinate obtains the high-precision borehole area level is：By the high-precision drilling bore region
Between the Theoretical Design coordinate of via hole described in via hole actual coordinate spacing and any two described in any two of layer periphery
Away from being compared to obtain.
4. the high-precision borehole project file production method of wiring board according to claim 1, which is characterized in that the height
There are two to four for the via hole setting of precision drill area level periphery.
5. the high-precision borehole project file production method of wiring board according to claim 1, which is characterized in that obtaining
More than one high-precision borehole area level information and multiple via hole information positioned at high-precision borehole area level periphery
Further include step later：By more than one high-precision borehole area level of acquisition and positioned at high-precision borehole area level periphery
Multiple via holes shown by display device.
6. the high-precision borehole project file production method of wiring board according to claim 5, which is characterized in that judge institute
It states high-precision borehole area level and whether multiple via holes of high-precision borehole area level periphery is fully recessed into the auxiliary area
In layer, if it is, accordingly generating the matching instruction；If it is not, then prompt matching is unsuccessful.
7. the high-precision borehole project file production method of wiring board according to claim 5, which is characterized in that will be described
High-precision borehole area level in auxiliary area layer is matched with multiple via holes of high-precision borehole area level periphery
After one group, generating the method for obtaining high-precision borehole project file to be produced is：It obtains high-precision in the auxiliary area layer
The high-precision borehole theoretical coordinate of degree drilling area level and the theoretical coordinate of multiple via holes, sit according to high-precision borehole theory
It is marked with and the theoretical coordinate of multiple via holes generates to obtain high-precision borehole project file to be produced.
8. a kind of high-precision borehole project file manufacturing system of wiring board, which is characterized in that including：
Acquisition module, the acquisition module is for obtaining more than one high-precision borehole area level information and positioned at described high-precision
Multiple via hole information of degree drilling area level periphery；Wherein, high-precision borehole area level information includes the high-precision drilling porose area
The Theoretical Design coordinate of high-precision borehole respectively to be drilled out in the circuit board in the layer of domain, the via hole information includes described auxiliary
Help the Theoretical Design coordinate of hole in the circuit board；
Matching module, the matching module are used for more than one described high-precision borehole area level and are located at the high-precision drilling
Multiple via holes of bore region layer periphery are matched one by one respectively；
Generation module, the generation module are used for more than one described high-precision borehole area level information and the high-precision drilling
Multiple via hole information that bore region layer matches generate to obtain more than one high-precision borehole project file to be produced；And
Merging treatment module, the merging treatment module be used for by more than one described high-precision borehole project file to be produced into
Row merging treatment；
Wherein, by more than one described high-precision borehole area level information and positioned at the more of high-precision borehole area level periphery
A via hole information carries out matched matching process one by one respectively：First by high-precision borehole area level and high-precision drilling bore region
In multiple via holes merging auxiliary area layer of layer periphery, then when receiving the high-precision in the auxiliary area layer
After multiple via holes of the area level that drills and high-precision borehole area level periphery carry out matched matching instruction, then it will be located at
High-precision borehole area level and multiple via holes of high-precision borehole area level periphery in the auxiliary area layer carry out
Match into one group.
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| CN201510712831.6A CN105404715B (en) | 2015-10-27 | 2015-10-27 | A kind of the high-precision borehole project file production method and system of wiring board |
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| CN201510712831.6A CN105404715B (en) | 2015-10-27 | 2015-10-27 | A kind of the high-precision borehole project file production method and system of wiring board |
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| CN105404715A CN105404715A (en) | 2016-03-16 |
| CN105404715B true CN105404715B (en) | 2018-09-21 |
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| CN108787910B (en) * | 2018-04-28 | 2021-09-10 | 广州广汽荻原模具冲压有限公司 | Method for prefabricating auxiliary datum in mold machining |
| CN111992752B (en) * | 2020-10-27 | 2021-01-26 | 维嘉数控科技（苏州）有限公司 | Drilling control method and device based on drill zone division and drilling equipment |
| CN112650504A (en) * | 2020-12-31 | 2021-04-13 | 鹤山市世安电子科技有限公司 | Method, device and storage medium for converting common gong machine program into CCD gong machine program |
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| CN101947659A (en) * | 2010-08-31 | 2011-01-19 | 广州杰赛科技股份有限公司 | Method for transverse shaft-crossing drilling of drilling machine |
| CN103895061A (en) * | 2012-12-27 | 2014-07-02 | 中国航空工业集团公司第六三一研究所 | Method for machining holes in printed boards |
| CN104317998A (en) * | 2014-10-17 | 2015-01-28 | 深圳市百能信息技术有限公司 | Method and device for making and compensating parameters of Gerber file |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6003630B2 (en) * | 2012-12-27 | 2016-10-05 | 富士通株式会社 | Wiring design support apparatus, wiring design support method, and program |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101947659A (en) * | 2010-08-31 | 2011-01-19 | 广州杰赛科技股份有限公司 | Method for transverse shaft-crossing drilling of drilling machine |
| CN103895061A (en) * | 2012-12-27 | 2014-07-02 | 中国航空工业集团公司第六三一研究所 | Method for machining holes in printed boards |
| CN104317998A (en) * | 2014-10-17 | 2015-01-28 | 深圳市百能信息技术有限公司 | Method and device for making and compensating parameters of Gerber file |
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