CN105430913B - A kind of boring method of printed circuit board - Google Patents
A kind of boring method of printed circuit board Download PDFInfo
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- CN105430913B CN105430913B CN201510852966.2A CN201510852966A CN105430913B CN 105430913 B CN105430913 B CN 105430913B CN 201510852966 A CN201510852966 A CN 201510852966A CN 105430913 B CN105430913 B CN 105430913B
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Drilling And Boring (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The present invention provides a kind of boring methods of printed circuit board, including step：Detect the thickness of printed circuit board；According to the drilling depth of the thickness control drill point of printed circuit board on a printed circuit.The thickness of printed circuit board is detected before drilling, the depth of drilling is adjusted according to the thickness of actually measured printed circuit board, namely, and then the actual drilling depth of drill point is controlled, error caused by drilling completely with the corresponding standard depth value of the standard thickness value of printed circuit board in drilling in the prior art is avoided, the precision of drilling is improved.
Description
Technical field
The present invention relates to field of circuit boards, and in particular to a kind of boring method of printed circuit board.
Background technology
With the rapid development of electronic information technology, printed circuit board (abbreviation PCB) just towards high density, it is highly integrated,
The direction of high-speed and high frequency is developed.Mutually being conducted between PCB layer can be realized by back drill technology, and back drill technology refers to pair
Level-one holes drilled through is first carried out in the graphics fields PCB, and copper electroplating layer then is carried out to the PCB after level-one holes drilled through, makes each layer all
Conducting is got up, and is then removed the extra layers of copper for not needing turning part again, is eventually formed back drill hole.
Above-mentioned extra layers of copper is generally removed by the way of drilling in the prior art, in drilling process, in order to avoid
Drilling is excessive and influences the conduction property of signals layer, often reserves a part of layers of copper, and since drill bit itself is oblique, so
There can be extra hole copper stub (abbreviation stub) above signals layer after back drill, signal is easily made to generate crosstalk, reflection, ring etc.
Problem, and then the integrality for transmitting signal is caused to be deteriorated, the influence particularly with high-frequency signal becomes apparent.The Stub values of stub
Refer to metal hole wall length of the back drill zone of fracture to destination layer, usual stub values control is in 20mil it is ensured that preferable letter
Number integrality, but just need to control stub values in 10mil in 10G or more for signal frequency, thus stub values are shadows
Ring the principal element of signal integrity.
As shown in Figure 1, generally use machine dimensions drill carries out above-mentioned drilling processing, existing machine dimensions drill in the prior art
1 ' generally comprises drilling machine body, pressure foot 12 ' and the drill point 13 ' being set on fuselage 1 '.It is carried out using this machine dimensions drill 1 '
The flow of back drill processing is generally：Printed circuit board 3 ' is positioned on board 4 ', conductive cap is above covered in printed circuit board 3 '
Plate 2 '；Pressure foot 12 ' is pushed；It is bored so that drill point 13 ' is lower, drill point 13 ' contacts conductive cover plate 2 ', controls deep starting point zero；Drill point
Formula set depth is got under 13 ', stops lower boring；Drill point 13 ' resets；Pressure foot 12 ' lifts.It is drilled using the method machining back
When, the drill point 13 ' of machine dimensions drill 1 ' gets into down same set depth (namely standard depth value) every time, still, due to difference
There may be differences with preset thickness (namely standard thickness value) for the actual (real) thickness of printed circuit board 3 ', this results in the need for processing
The actual (real) thickness in drilled region has differences with theoretic throat, if drill point is bored fully according to formula established standards depth value
It cuts, will result in the size in finally formed back drill hole, there are errors, and there is also errors for the stub values in back drill hole.
Invention content
Therefore, the technical problem to be solved in the present invention is to overcome the boring method error of the printed circuit board of the prior art
Greatly, the low technological deficiency of precision.
To achieve the goals above, the embodiment of the present invention provides a kind of boring method of printed circuit board, including walks as follows
Suddenly：
Detect the thickness of printed circuit board；
According to the drilling depth of the thickness control drill point of printed circuit board on a printed circuit.
Preferably, the drilling depth of the thickness control drill point according to printed circuit board on a printed circuit is specific
Method is：
According to it is actually detected go out the thickness value of printed circuit board and the standard thickness value of printed circuit board both calculate
Between ratio X；
The drilling depth value of drill point is calculated using the standard depth value of the ratio X and drilling.
Preferably, the drilling depth of the thickness control drill point according to printed circuit board on a printed circuit is specific
Method is：
It is more actually detected go out the thickness of printed circuit board and the standard thickness value of printed circuit board between relationship；
According to it is actually detected go out the thickness of printed circuit board and the standard thickness value of printed circuit board between relationship tune
The drilling depth of whole drill point；
When it is actually detected go out printed circuit board thickness be more than printed circuit board standard thickness value when, adjust drill point
Drilling depth is more than the standard depth value of drilling；
When it is actually detected go out printed circuit board thickness be less than printed circuit board standard thickness value when, adjust drill point
Drilling depth is less than the standard depth value of drilling；
When it is actually detected go out printed circuit board thickness be equal to printed circuit board standard thickness value when, need not adjust
The drilling depth of drill point, the drilling depth of drill point are equal to the standard depth value of drilling.
Preferably, the drilling depth of the thickness control drill point according to printed circuit board on a printed circuit is specific
Method is：
Calculate it is actually detected go out the thickness of printed circuit board and the standard thickness value of printed circuit board between difference S；
According to it is actually detected go out the thickness of printed circuit board and the standard thickness value of printed circuit board between difference S tune
The drilling depth of whole drill point；
When difference S values are more than 0, the drilling depth for adjusting drill point is the standard depth value+S of drilling；
When difference S values are less than 0, the drilling depth for adjusting drill point is the standard depth value-S of drilling；
When difference S values are equal to 0, the drilling depth of drill point is standard depth value.
Preferably, the specific method of the detection printed circuit plate thickness is：
Obtain the sum of the thickness of printed circuit board and conductive cover plate；
The thickness of printed circuit board is calculated using the sum of the thickness of printed circuit board and conductive cover plate；
Wherein, conductive cover plate is jointly mounted to printed circuit board close to the side of the pressure foot of drilling machine.
Preferably, the specific method of the sum of described thickness for detecting printed circuit board and conductive cover plate is：
Obtain initial distance H of the pressure foot relative to printed circuit board bottom surface；
Obtain the dropping distance h of pressure foot；
Using the dropping distance h and pressure foot of pressure foot print is calculated relative to the initial distance H of printed circuit board bottom surface
The sum of the thickness of printed circuit board and conductive cover plate.
Preferably, the specific method of the dropping distance h for obtaining pressure foot is：
The pressure foot of drilling machine is declined from initial position；
Pressure foot reach home position when stop continue to decline；
Wherein, initial position is O points position；Final position is the position that pressure foot is contacted with the upper surface of conductive cover plate；
The distance between final position and initial position value are the dropping distance h of pressure foot.
The boring method of printed circuit board provided in an embodiment of the present invention has the following advantages that：
1. the boring method of printed circuit board provided by the invention detects the thickness of printed circuit board, root before drilling
The depth of drilling is adjusted according to the thickness of actually measured printed circuit board, that is, in turn to the actual drilling depth of drill point into
Row control, avoid in the prior art drilling when completely with the corresponding standard depth value of the standard thickness value of printed circuit board into
Error caused by row drilling, improves the precision of drilling.
2. the boring method of printed circuit board provided by the invention, by calculate it is actually detected go out printed circuit board thickness
The ratio X of angle value and the standard thickness value of printed circuit board calculates drill point further according to the ratio X and the standard depth value of drilling
Drilling depth value, effectively according to the difference of the actual (real) thickness of different printing circuit board and preset thickness (namely standard thickness value)
It is different to adjust the actual grade of drilling, and then the scale error in back drill hole is substantially reduced, improve the precision of drilling.
3. the boring method of printed circuit board provided by the invention, by comparing it is actually detected go out printed circuit board thickness
Relationship between degree and the standard thickness value of printed circuit board to adjust the drilling depth of drill point, and then is reduced because of printing electricity
It is influenced caused by the otherness of road plate thickness, to reduce the scale error in back drill hole, improves the precision of drilling.
4. the boring method of printed circuit board provided by the invention, by calculate it is actually detected go out printed circuit board thickness
Difference S between degree and the standard thickness value of printed circuit board, and according to the drilling depth of difference S adjustment drill points, and then subtract
It is influenced caused by the small otherness because of printed circuit plate thickness, to reduce the scale error in back drill hole, improves brill
The precision in hole.
5. the boring method of printed circuit board provided by the invention, opposite using the dropping distance h and pressure foot of pressure foot
Initial distance H in printed circuit board bottom surface calculates the sum of printed circuit board and the thickness of conductive cover plate, in real time to printing
The thickness of circuit board carries out the collection processing of related data, and the lower brill depth after optimization is calculated according to the data of processing
Degree, and then make drilling machine in drilling, processing is optimized to lower drilling depth in real time, in the same of the precision for improving drilling
When, bore process is optimized, and greatly shorten the duration of processing, improves the efficiency of drilling.
Description of the drawings
In order to illustrate more clearly of the technical solution of the specific embodiment of the invention, below according to the specific implementation of the present invention
Example and in conjunction with attached drawing, is described in further detail invention.
Fig. 1 is the schematic diagram that the drilling machine of the prior art drills to printed circuit board.
Fig. 2 is located at the signal of original state for drilling machine in a kind of embodiment of the boring method of printed circuit board of the present invention
Figure.
Fig. 3 is that the pressure foot of the drilling machine of the boring method of printed circuit board shown in Fig. 2 presses to the schematic diagram of conductive cover plate.
Fig. 4 is that the drill point of the drilling machine of the boring method of printed circuit board shown in Fig. 2 is displaced downwardly to the schematic diagram of conductive cover plate.
Fig. 5 is the schematic diagram that set depth is drilled under the drill point of the drilling machine of the boring method of printed circuit board shown in Fig. 2.
Fig. 6 is that the drilling machine of the boring method of printed circuit board shown in Fig. 2 is returned to the schematic diagram of initial position.
It is each in figure that the reference numerals are as follows：
1 '-machine dimensions drill；12 '-pressure foots；13 '-drill points；2 '-conductive cover plates；
3 '-printed circuit boards；4 '-boards；1- drilling machines；11- controllers；
12- pressure foots；13- drill points；2- conductive cover plates；3- printed circuit boards；31- back drills hole；
4- boards.
Specific implementation mode
Technical scheme of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
The every other embodiment that personnel are obtained without making creative work, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the orientation or positional relationship of the instructions such as term "upper", "lower" is base
It in orientation or positional relationship shown in the drawings, is merely for convenience of description of the present invention and simplification of the description, rather than indicates or imply
Signified device or element must have a particular orientation, with specific azimuth configuration and operation, therefore should not be understood as to this
The limitation of invention.
As long as in addition, technical characteristic involved in invention described below different embodiments non-structure each other
It can be combined with each other at conflict.
Embodiment 1
The present embodiment provides a kind of boring methods of printed circuit board, include the following steps：
Detect the thickness of printed circuit board 3；
According to drilling depth of the thickness control drill point 13 of printed circuit board 3 on printed circuit board 3.
The boring method of above-mentioned printed circuit board 3 detects the thickness of printed circuit board 3, according to practical survey before drilling
The thickness of printed circuit board 3 adjust the depth of drilling, that is, in turn control the actual drilling depth of drill point,
It avoids and is drilled completely with the corresponding standard depth value of the standard thickness value of printed circuit board 3 in drilling in the prior art
Caused by error, improve the precision of drilling.
As preferred embodiment, according to brill of the thickness control drill point 13 of printed circuit board 3 on printed circuit board 3
The specific method of hole depth is：
According to it is actually detected go out the thickness value of printed circuit board 3 and the standard thickness value of printed circuit board 3 calculate two
Ratio X between person；
The drilling depth value of drill point 13 is calculated using the standard depth value of the ratio X and drilling.
By calculate it is actually detected go out printed circuit board 3 thickness value and printed circuit board 3 standard thickness value ratio
Value X calculates the drilling depth value of drill point 13 further according to the standard depth value of the ratio X and drilling, that is, being made with the ratio X
For definite value, the standard depth of depth value/drilling of standard thickness value=drilling of thickness value/printed circuit board of printed circuit board
Value=X adjusts drilling depth value using ratio, effectively according to the actual (real) thickness and preset thickness of different printing circuit board
The difference of (namely standard thickness value) adjusts the actual grade of drilling, and then substantially reduces the scale error in back drill hole, carries
The high precision of drilling.
As the embodiment of deformation, the thickness control drill point 13 according to printed circuit board 3 is on printed circuit board 3
The specific method of drilling depth be：
It is more actually detected go out the thickness of printed circuit board 3 and the standard thickness value of printed circuit board 3 between relationship；
According to it is actually detected go out the thickness of printed circuit board 3 and the standard thickness value of printed circuit board 3 between relationship
Adjust the drilling depth of drill point 13；
When it is actually detected go out printed circuit board 3 thickness be more than printed circuit board 3 standard thickness value when, adjust drill point
13 drilling depth is more than the standard depth value of drilling；
When it is actually detected go out printed circuit board 3 thickness be less than printed circuit board 3 standard thickness value when, adjust drill point
13 drilling depth is less than the standard depth value of drilling；
When it is actually detected go out printed circuit board 3 thickness be equal to printed circuit board 3 standard thickness value when, need not adjust
The drilling depth of whole drill point 13, the drilling depth of drill point 13 are equal to the standard depth value of drilling.
By comparing it is actually detected go out the thickness of printed circuit board 3 and the standard thickness value of printed circuit board 3 between
Relationship to adjust the drilling depth of drill point 13, and then is reduced and is influenced caused by the otherness because of 3 thickness of printed circuit board,
To reduce the scale error in back drill hole 31, the precision of drilling is improved.
As the embodiment of deformation, the thickness control drill point 13 according to printed circuit board 3 is on printed circuit board 3
The specific method of drilling depth be：
Calculate it is actually detected go out the thickness of printed circuit board 3 and the standard thickness value of printed circuit board 3 between difference
S；
According to it is actually detected go out the thickness of printed circuit board 3 and the standard thickness value of printed circuit board 3 between difference S
Adjust the drilling depth of drill point 13；
When difference S values are more than 0, the drilling depth of adjustment drill point 13 is the standard depth value+S of drilling；
When difference S values are less than 0, the drilling depth of adjustment drill point 13 is the standard depth value-S of drilling；
When difference S values are equal to 0, the drilling depth of drill point 13 is standard depth value.
By calculate it is actually detected go out the thickness of printed circuit board 3 and the standard thickness value of printed circuit board 3 between
Difference S, and according to the drilling depth of difference S adjustment drill points 13, and then reduce the otherness institute because of 3 thickness of printed circuit board
The influence brought improves the precision of drilling to reduce the scale error in back drill hole 31.
As preferred embodiment, the specific method of detection 3 thickness of printed circuit board is：
Obtain the sum of the thickness of printed circuit board 3 and conductive cover plate 2；
The thickness of printed circuit board 3 is calculated using the sum of the thickness of printed circuit board 3 and conductive cover plate 2；That is, utilizing
The thickness of the sum of printed circuit board 3 and the thickness of conductive cover plate 2 and the mathematic interpolation printed circuit board 3 of the thickness of conductive cover plate 2；
Wherein, conductive cover plate 2 is jointly mounted to printed circuit board 3 close to the side of the pressure foot 12 of drilling machine；Conductive cover plate 2
Thickness can be initially set thickness value, or actually detected thickness value.
Specifically, the specific method of the sum of described thickness for detecting printed circuit board 3 and conductive cover plate 2 is：
Obtain initial distance H of the pressure foot 12 relative to 3 bottom surface of printed circuit board；
Obtain the dropping distance h of pressure foot 12；
Difference using pressure foot 12 relative to the initial distance H of 3 bottom surface of printed circuit board and the dropping distance h of pressure foot 12
Value calculates printed circuit board 3 and the sum of the thickness of conductive cover plate 2.
As the embodiment of deformation, initial distance H can not also be obtained actually in actually detected, but be preset
A definite value in a program, the initial distance are the distance relative to printed circuit board bottom surface before drill point does not decline.
As preferred embodiment, the specific method of the dropping distance h for obtaining pressure foot 12 is：
The pressure foot 12 of drilling machine is declined from initial position；
Pressure foot 12 reach home position when stop continue to decline；
Wherein, initial position is O points position (drill point do not decline before position)；Final position is pressure foot 12 and conduction
The position of the upper surface contact of cover board 2.
The distance between final position and initial position value are the dropping distance h of pressure foot 12.
As preferred embodiment, the pressure foot 12 reach home position when, passback one signal to drilling machine, drilling machine
On the one hand stop continuing to decline, another aspect drill point 13 starts lower brill according to the drilling depth after adjustment, to form drilling.
That is, above-mentioned boring method, pressure foot 12 can calculate during dropping to final position from initial position
The dropping distance h for going out pressure foot 12 can calculate printing electricity according to the difference of the initial distance H of pressure foot and dropping distance h
The sum of the thickness of road plate and conductive cover plate, the actual (real) thickness of printed circuit board can be calculated according to the sum of thickness of the two, so
Afterwards according to the standard of depth value/drilling of standard thickness value=drilling of thickness value/printed circuit board of formula printed circuit board
Depth value=X calculates drilling depth value, this process can be completed during the pushing of pressure foot 12, is bored calculating
After hole depth angle value, drill point 13 starts to drill according to drilling depth value, to substantially reduce technological process, improves work effect
Rate.
As preferred embodiment, there is the drilling machine of the above embodiment controller 11, the pressure foot 12 to reach end
When point position, one signal of passback is to the controller 11 of drilling machine 1, and on the one hand controller 11, which controls drilling machine, to be stopped continuing to decline, separately
On the one hand to the signal of 13 1 specific lower drilling depth values of drill point, drill point 13 starts lower brill according to the lower drilling depth signal, to
Form drilling.
As preferred embodiment, operation and the adjustment programme of above-mentioned drilling depth are integrated in the controller 11,
By according to the thickness of above-mentioned H, h, conductive cover plate, the standard thickness of printed circuit board, drilling standard depth value and ratio X in terms of
Drilling depth is calculated, and controls the lower drilling depth of drill point 13 according to calculated drilling depth value.
In conclusion the boring method of the printed circuit board of the present embodiment, utilizes the dropping distance h and pressure of pressure foot 12
Foot 12 calculates printed circuit board 3 and the sum of the thickness of conductive cover plate 2 relative to the initial distance H of 3 bottom surface of printed circuit board, real
When the collection that related data is carried out to the thickness of printed circuit board 3 handle, and optimization is calculated according to the data of processing
Lower drilling depth afterwards, and then make drilling machine 1 in drilling, processing is optimized to lower drilling depth in real time, to improve brill
While the precision in hole, bore process is optimized, and greatly shortens the duration of processing, improves the efficiency of drilling.
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be said that
The specific implementation of the present invention is confined to these explanations.For the ordinary person of technical field of the present invention, do not taking off
Under the premise of from present inventive concept, several simple deductions or replacement can also be made, all shall be regarded as belonging to the guarantor of the present invention
Protect range.
Claims (5)
1. a kind of boring method of printed circuit board, which is characterized in that include the following steps：
Detect the thickness of printed circuit board (3)；
According to drilling depth of the thickness control drill point (13) of printed circuit board (3) on printed circuit board (3)；
It is described detection printed circuit board (3) thickness specific method be：
Obtain the sum of the thickness of printed circuit board (3) and conductive cover plate (2)；
The thickness of printed circuit board (3) is calculated using the sum of the thickness of printed circuit board (3) and conductive cover plate (2)；
Wherein, conductive cover plate (2) is jointly mounted to printed circuit board (3) close to the side of the pressure foot (12) of drilling machine；
The specific method of the sum of the thickness of the detection printed circuit board (3) and conductive cover plate (2) is：
Obtain initial distance H of the pressure foot (12) relative to printed circuit board (3) bottom surface；
Obtain the dropping distance h of pressure foot (12)；
Using the dropping distance h and pressure foot (12) of pressure foot (12) based on the initial distance H of printed circuit board (3) bottom surface
The sum of the thickness of printed circuit board (3) and conductive cover plate (2) is calculated, the pressure foot (12) is positioned close to the drill point (13)
Position.
2. the boring method of printed circuit board according to claim 1, it is characterised in that：It is described according to printed circuit board
(3) specific method of drilling depth of the thickness control drill point (13) on printed circuit board (3) is：
According to it is actually detected go out the thickness value of printed circuit board (3) and the standard thickness value of printed circuit board (3) calculate two
Ratio X between person；
The drilling depth value of drill point (13) is calculated using the standard depth value of the ratio X and drilling.
3. the boring method of printed circuit board according to claim 1, which is characterized in that described according to printed circuit board
(3) specific method of drilling depth of the thickness control drill point (13) on printed circuit board (3) is：
It is more actually detected go out printed circuit board (3) thickness and the standard thickness value of printed circuit board (3) between relationship；
According to it is actually detected go out printed circuit board (3) thickness and the standard thickness value of printed circuit board (3) between relationship
Adjust the drilling depth of drill point (13)；
When it is actually detected go out printed circuit board (3) thickness be more than printed circuit board (3) standard thickness value when, adjust drill point
(13) drilling depth is more than the standard depth value of drilling；
When it is actually detected go out printed circuit board (3) thickness be less than printed circuit board (3) standard thickness value when, adjust drill point
(13) drilling depth is less than the standard depth value of drilling；
When it is actually detected go out printed circuit board (3) thickness be equal to printed circuit board (3) standard thickness value when, need not adjust
The drilling depth of whole drill point (13), the drilling depth of drill point (13) are equal to the standard depth value of drilling.
4. the boring method of printed circuit board according to claim 1, which is characterized in that described according to printed circuit board
(3) specific method of drilling depth of the thickness control drill point (13) on printed circuit board (3) is：
Calculate it is actually detected go out printed circuit board (3) thickness and the standard thickness value of printed circuit board (3) between difference
S；
According to it is actually detected go out printed circuit board (3) thickness and the standard thickness value of printed circuit board (3) between difference S
Adjust the drilling depth of drill point (13)；
When difference S values are more than 0, the drilling depth of adjustment drill point (13) is the standard depth value+S of drilling；
When difference S values are less than 0, the absolute value of difference S is taken | S |, the drilling depth of adjustment drill point (13) is the standard depth of drilling
Angle value-| S |；
When difference S values are equal to 0, the drilling depth of drill point (13) is standard depth value.
5. the boring method of printed circuit board according to claim 1, which is characterized in that the acquisition pressure foot (12)
The specific method of dropping distance h is：
The pressure foot (12) of drilling machine is declined from initial position；
Pressure foot (12) reach home position when stop continue to decline；
Wherein, initial position is 0 position；Final position is the position that pressure foot (12) is contacted with the upper surface of conductive cover plate (2)
It sets；
The distance between final position and initial position value are the dropping distance h of pressure foot (12).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510852966.2A CN105430913B (en) | 2015-11-30 | 2015-11-30 | A kind of boring method of printed circuit board |
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|---|---|---|---|
| CN201510852966.2A CN105430913B (en) | 2015-11-30 | 2015-11-30 | A kind of boring method of printed circuit board |
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| CN105430913B true CN105430913B (en) | 2018-10-09 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106851989A (en) * | 2017-03-20 | 2017-06-13 | 汕头超声印制板（二厂）有限公司 | It is a kind of to leak the heavy processing method for boring backboard |
| CN110893629B (en) * | 2018-09-13 | 2022-05-20 | 健鼎（无锡）电子有限公司 | Method for manufacturing circuit board and drilling machine |
| CN112672502A (en) * | 2019-10-15 | 2021-04-16 | 苏州维嘉科技股份有限公司 | PCB (printed circuit board), deep forming processing method thereof and numerical control device |
| CN113079638B (en) * | 2020-01-03 | 2023-04-07 | 重庆方正高密电子有限公司 | Back drilling method and device for PCB |
| CN112203426B (en) * | 2020-09-29 | 2022-05-17 | 广州兴森快捷电路科技有限公司 | Back drilling method, device and equipment for printed circuit board and storage medium |
| CN112804825B (en) * | 2021-04-09 | 2021-09-14 | 苏州维嘉科技股份有限公司 | Depth-controlled borehole compensation method and drilling apparatus |
| US20230026067A1 (en) * | 2021-07-21 | 2023-01-26 | R&D Circuits | Method for detecting and adjusting poor back drills in printed circuit boards |
| CN116095962A (en) * | 2023-01-04 | 2023-05-09 | 广州广合科技股份有限公司 | Back drilling processing method and device for circuit board via hole and circuit board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103302329A (en) * | 2013-06-04 | 2013-09-18 | 广州兴森快捷电路科技有限公司 | PCB (printed circuit board) back drilling method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN100531519C (en) * | 2007-05-11 | 2009-08-19 | 沪士电子股份有限公司 | Method for deep drilling print circuit board |
| CN102007826B (en) * | 2009-05-08 | 2013-07-10 | 联能科技（深圳）有限公司 | Back drilling method of through via, circuit board and manufacturing method of circuit board |
| CN105643711A (en) * | 2014-12-03 | 2016-06-08 | 北大方正集团有限公司 | Backdrill method for PCB and drilling machine |
-
2015
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103302329A (en) * | 2013-06-04 | 2013-09-18 | 广州兴森快捷电路科技有限公司 | PCB (printed circuit board) back drilling method |
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