CN109348621A - A kind of PCB production method and PCB - Google Patents
A kind of PCB production method and PCB Download PDFInfo
- Publication number
- CN109348621A CN109348621A CN201811059174.XA CN201811059174A CN109348621A CN 109348621 A CN109348621 A CN 109348621A CN 201811059174 A CN201811059174 A CN 201811059174A CN 109348621 A CN109348621 A CN 109348621A
- Authority
- CN
- China
- Prior art keywords
- hole
- back drill
- auxiliary
- motherboard
- aperture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Abstract
The present invention provides a kind of PCB production method and PCB, PCB production method the following steps are included: 1) providing several core plates, core plate carries out corresponding line pattern production, and is pressed into motherboard；2) back drill blind hole is carried out to master surface；3) auxiliary through hole is bored with back drill blind hole coaxial inner conductor, auxiliary through hole penetrates through two surface of motherboard, and the aperture d of auxiliary through hole is less than back drill blind hole aperture D1；4) heavy copper plating is carried out to the motherboard for completing drilling；5) back drill hole machined is carried out to auxiliary through hole in another surface opposite with back drill blind hole on motherboard, back drill hole and auxiliary through hole coaxial inner conductor, ensure the aperture D2 in the aperture d < back drill hole of auxiliary through hole, and ensures the 0 < back drill blind hole core plate number of plies≤5 Chong Die with back drill hole.The two-sided method to pressure back drill processing hole provided by the invention can maximally reduce the location dislocation in crimping hole and back drill hole.
Description
Technical field
The present invention relates to a kind of circuit board (Printed Circuit Board, PCB) production methods, more particularly to one kind
The upper two-sided method to pressure back drill processing hole of PCB.
Background technique
The design for crimping hole and back drill hole is that PCB technology is most commonly seen, with electronic product gradually develop to be miniaturized,
Multifunction, to PCB about crimping hole and back drill hole design and manufacture craft propose it is higher it is densely arranged requirement and can
It is required by property.In the industry, intensive design can bring the risk of reliability to current line, how to allow PCB both to can achieve and intensively design
It is required that and can guarantee good reliability, and it is easy to make be current research difficult point and emphasis.
Summary of the invention
In view of the above, the present invention it is necessary to provide it is a kind of meet crimping hole intensive requirement, it is ensured that reliability and
Conveniently produce the PCB production method in crimping hole and back drill hole.
A kind of PCB production method, comprising the following steps:
1) several core plates are provided, core plate carries out corresponding line pattern production, and is pressed into motherboard；
2) back drill blind hole is carried out to master surface；
3) auxiliary through hole is bored with back drill blind hole coaxial inner conductor, auxiliary through hole penetrates through two surface of motherboard, the aperture d of auxiliary through hole
Less than back drill blind hole aperture D1；
4) heavy copper plating is carried out to the motherboard for completing drilling；
5) in another surface opposite with back drill blind hole on motherboard to auxiliary through hole carry out back drill hole machined, back drill hole with it is auxiliary
Help through-hole coaxial inner conductor, it is ensured that the aperture D2 in the aperture d < back drill hole of auxiliary through hole, and ensure 0 < back drill blind hole and back drill
The core plate number of plies≤5 of hole overlapping.
Further, several core plates are provided when production motherboard in step 1), selectes core plate corresponding with drilling depth target
To bore deep target core plate, the deep target core plate surface of brill is equipped with target coating, presses after several core plates are sequentially laminated and motherboard is made,
Wherein corresponding thickness position in motherboard is correspondingly located at for controlling the deep target core plate of brill；Then back drill is bored in master surface
Hole descends drilling depth to start to calculate, drill bit of drilling machine is drilled into target coating herein when the bit contact of drill spindle presses plate surface
When, the main shaft torque sensing device for sensing drill bit of drilling machine detects corresponding torsion signal, stops drilling, it is ensured that back drill hole
Depth.
Compared to the prior art, the present invention proposes a kind of PCB production method, especially processes hole to pressure back drill two-sided
The intensive crimping hole and back drill hole of different size design, the design and work of the PCB can be made in design method and manufacture craft simultaneously
Process can not only maximally reduce crimping hole and back under the premise of not influencing client's dense holes and back drilling design
The location dislocation of drilling, moreover it is possible to effectively increase the spacing of dense holes, i.e. guarantee good reliability, and reduce client and use
Risk.
Detailed description of the invention
The above description is only an overview of the technical scheme of the present invention, in order to illustrate more clearly of technical solution of the present invention, under
Face will a brief introduction will be made to the drawings that need to be used in the embodiment or the description of the prior art, and the attached drawing in description is only pair
Should in specific embodiments of the present invention, to those skilled in the art, without creative efforts,
It is also possible to obtain other drawings based on these drawings when needed.
Fig. 1 is PCB production method flow chart of the present invention；
Fig. 2 is the structural schematic diagram of PCB production method of the present invention；
Fig. 3 is the schematic cross-section that motherboard carries out heavy copper plating in PCB production method of the present invention；
Fig. 4 is the schematic cross-section of motherboard after back drill hole drilling in the method for PCB production method of the present invention.
Specific embodiment
In order to elaborate the technical solution that the present invention is taken to reach predetermined technique purpose, below in conjunction with this hair
Attached drawing in bright embodiment, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described
Embodiment is only section Example of the invention, instead of all the embodiments, also, before not making the creative labor
It puts, the technical means or technical features in the embodiment of the present invention can replace, below with reference to the accompanying drawings and in conjunction with the embodiments
It is next that the present invention will be described in detail.
Shown in Fig. 1, Fig. 2, the present invention provides PCB production method, especially with respect to the two-sided side to pressure back drill processing hole PCB
Method realizes that specific production step is as follows using completely new process route: 1) providing several core plates, core plate carries out corresponding route
Graphic making, and it is pressed into motherboard；2) back drill blind hole is carried out to master surface；3) to the system for carrying out auxiliary through hole in back drill blind hole
Make, bores auxiliary through hole with back drill blind hole coaxial inner conductor, it is equidirectional in back drill blind hole with back drill blind hole coaxial inner conductor in the present embodiment
Bottom bore auxiliary through hole, auxiliary through hole penetrates through another surface of motherboard, and the aperture d of auxiliary through hole is less than back drill blind hole aperture
D1；4) heavy copper plating is carried out to the motherboard for completing drilling；5) in another surface opposite with back drill blind hole is bored on motherboard to auxiliary
Through-hole carries out back drill hole machined, back drill hole and auxiliary through hole coaxial inner conductor, it is ensured that the aperture in the aperture d < back drill hole of auxiliary through hole
D2, and ensure the 0 < back drill blind hole core plate number of plies≤5 Chong Die with back drill hole.
In specific implementation process, the back drill blind hole on master surface is the crimping hole in corresponding use, in crimping hole and back
Drilling is when opening up, and is mainly concerned with content in terms of following two: first, under the same hole coordinate, back drill blind hole (crimping hole)
The design of depth and back drill hole depth；Second, how easily to be obtained on two surfaces of circuit board and crimp hole and back drill hole, and can
Ensure the spacing in intensive crimping hole, i.e. guarantee good reliability.
First, under the same hole coordinate, the depth of back drill blind hole (corresponding be made after crimping hole) and back drill hole depth
Design: so that the core plate number of plies≤5 that 0 < back drill blind hole is Chong Die with back drill hole, can maximally reduce crimping hole and back drill hole
Location dislocation.
Second, it realizes the two-sided process to pressure back drill: 1, completing motherboard and press and carry out back drill blind hole production；2nd,
Carry out production (the aperture D1 of the aperture d < back drill blind hole of auxiliary through hole, and the hole seat of the two of auxiliary through hole again to back drill blind hole
Mark is consistent)；3, heavy copper plating production is carried out；4, the production of back drill hole is carried out to auxiliary through hole, carries on the back boring aperture D2 > auxiliary through hole
The hole coordinate of aperture d, the two are consistent, and ensure back drill hole and back drill blind hole without the residual copper of ladder.Specific production includes following control
It is required that:
1) core plate carries out corresponding line pattern production, and is pressed into motherboard, and motherboard plate thickness is H；
2) production of back drill blind hole is carried out to motherboard, wherein back drill blind hole aperture is D1, and boring deep depth is h1；
3) production to auxiliary through hole is carried out in back drill blind hole, the wherein aperture of the aperture d < back drill blind hole of auxiliary through hole
D1, and the hole coordinate of the two is consistent；
4) production of heavy copper plating, outer layer dry film and tin plating process is carried out to the motherboard for completing drilling, wherein heavy copper plating
When guarantee back drill blind hole aperture meet two-sided crimping hole aperture require；
5) production of back drill hole is carried out to auxiliary through hole, wherein back boring aperture is D2, meets back boring aperture D2 > auxiliary
Through-hole aperture d, and auxiliary through hole is consistent with the hole coordinate in back drill hole, it is h2 that back drill, which bores depth, and back drill brill bores with back drill blind hole deep deeply
Meet the design requirement of first condition, the location dislocation in crimping hole and back drill hole can be reduced；
6) it is etched, the processes production such as outer graphics and surface treatment, completes the two-sided PCB product to pressure back drill.
1) the first back drill blind hole of the present invention bores auxiliary through hole again, and boring auxiliary through hole again after back drill blind hole has the following good
Place: 1. first back drill blind hole can reduce the radius-thickness ratio of auxiliary through hole, can be avoided breaking and improve hole position accuracy；2. back drill blind hole
Radius-thickness ratio is excessively high to be difficult to realize be electroplated, therefore the preboring auxiliary through hole after back drill blind hole, is just able to achieve back drill blind hole as crimping hole
Effect, guarantee back drill blind hole sink copper plating when hole copper meet the requirements；3. preboring auxiliary through hole can promote the back drill of the other end
The hole position accuracy in hole reduces the dislocation of crimping back drill blind hole and back drill hole.
2) when back drill blind hole and back drilling design bore deep, it is ensured that the 0 < back drill blind hole core plate number of plies Chong Die with back drill hole≤
5。
3) increase effectively the spacing of dense holes: under common process, back boring aperture is generally 6-8mil bigger than crimping hole, institute
Seem smaller due to the influence in back drill aperture with the spacing of dense holes, using this technique, back drill blind hole is crimping hole, is being assisted
Under the action of through-hole, then the production of back drill hole is carried out, the aperture in back drill hole can be made big as the aperture for crimping hole, even less than pressed
The aperture in hole is connect, therefore under same design, using technique of the invention, achievees the purpose that increase effectively pitch of holes.
The benefit analysis of the invention patent illustrates: the auxiliary through hole of subdrilling small-bore, then back drill process to plate thickness
And pore size has apparent limitation, the pcb board that need to be processed is thicker, auxiliary through hole aperture is smaller, and the probability of breaking is bigger,
And knife face hole position accuracy is poorer out, and inclined hole is more serious, so that the crimping for affecting client uses.It can using method of the invention
The problem of effective solution plate thickness restricted problem, pore size and inclined hole problem: subdrilling back drill blind hole, back drill blind hole is as pressure
Hole is connect, the depth of back drill blind hole is generally shallower, meets client and crimps use, such process reaches drilling depth not
Can be very deep, it both ensure that borehole accuracy, while to plate thickness without limitation；After bore auxiliary through hole, pair of the auxiliary through hole from back drill blind hole
Face pierces, and aperture facilitates the chip removal that drills, avoid breaking and inclined hole problem toward big hole drill.
In addition, how the two-sided method to pressure back drill processing hole ensures back drill blind hole in back drill blind hole on PCB of the present invention
It is deep-controlled, a better embodiment is provided, when making motherboard: several core plates are provided, select with drilling depth target pair
The core plate answered is to bore deep target core plate, bores deep target core plate surface and is equipped with target coating, target coating can be for by plating processing
To the coating of preset thickness.It is pressed after several core plates are sequentially laminated and motherboard is made, wherein it is corresponding that deep target core plate is bored in control
Ground is located at corresponding thickness position in motherboard；Then back drill hole is bored in master surface, using drilling machine back drill, when the drill bit of main shaft connects
When pressing plywood surface, drilling depth is descended to start to calculate herein, when drill bit of drilling machine is drilled into target coating, is bored according to for sensing drilling machine
The main shaft torque sensing device of head detects corresponding torsion signal, and stopping drilling or setting, which are preset, extends time stopping, so
It can ensure that the depth in back drill hole.
Circuit board made from aforesaid way, wherein the back drill blind hole on a surface can be accordingly as crimping hole, Ling Yibiao
Invalid hole copper is fallen for brill in the back drill hole in face, and easy to make, avoids as traditional by the position of opening essence in two plate faces
The problem that degree does not correspond to, and the aperture in the aperture of back drill blind hole and back drill hole can not be identical, and different rule can so be made simultaneously
The intensive crimping hole and back drill hole of lattice design.
The above described is only a preferred embodiment of the present invention, be not intended to limit the present invention in any form, though
So the present invention has been disclosed as a preferred embodiment, and however, it is not intended to limit the invention, any technology people for being familiar with this profession
Member, without departing from the scope of the present invention, when the technology contents using the disclosure above are modified or are modified
For the equivalent embodiment of equivalent variations, but without departing from the technical solutions of the present invention, according to the technical essence of the invention,
Within the spirit and principles in the present invention, any simple modifications, equivalent substitutions and improvements to the above embodiments etc., still
Belong within the protection scope of technical solution of the present invention.
Claims (3)
1. a kind of PCB production method, comprising the following steps:
1) several core plates are provided, core plate carries out corresponding line pattern production, and is pressed into motherboard；
2) back drill blind hole is carried out to master surface；
3) auxiliary through hole is bored with back drill blind hole coaxial inner conductor, auxiliary through hole penetrates through two surface of motherboard, and the aperture d of auxiliary through hole is less than
Back drill blind hole aperture D1；
4) heavy copper plating is carried out to the motherboard for completing drilling；
5) back drill hole machined is carried out to auxiliary through hole in another surface opposite with back drill blind hole on motherboard, back drill hole and auxiliary are logical
Hole coaxial inner conductor, it is ensured that the aperture D2 in the aperture d < back drill hole of auxiliary through hole, and back drill hole drill through after ensure that 0 < back drill is blind
The hole core plate number of plies≤5 Chong Die with back drill hole.
2. PCB production method according to claim 1, it is characterised in that: in step 1) when production motherboard, provide several cores
Plate, selecting core plate corresponding with drilling depth target is to bore deep target core plate, bores deep target core plate surface and is equipped with target coating, will
Motherboard is made in pressing after several core plates are sequentially laminated, wherein the target core plate for controlling brill depth is correspondingly located in motherboard and corresponds to
Thickness position；Then back drill hole is bored in master surface, it is lower herein to bore deeply when the bit contact of drill spindle presses plate surface
Degree starts to calculate, and when drill bit of drilling machine is drilled into target coating, the main shaft torque sensing device for sensing drill bit of drilling machine is detected pair
The torsion signal answered stops drilling, it is ensured that the depth in back drill hole.
3. a kind of PCB, it is characterised in that: method according to claim 1 or 2 is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811059174.XA CN109348621A (en) | 2018-09-12 | 2018-09-12 | A kind of PCB production method and PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811059174.XA CN109348621A (en) | 2018-09-12 | 2018-09-12 | A kind of PCB production method and PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109348621A true CN109348621A (en) | 2019-02-15 |
Family
ID=65305415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811059174.XA Pending CN109348621A (en) | 2018-09-12 | 2018-09-12 | A kind of PCB production method and PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109348621A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110475432A (en) * | 2019-08-08 | 2019-11-19 | 沪士电子股份有限公司 | A kind of pcb board and its manufacture and back drilling method |
| CN110831326A (en) * | 2019-10-21 | 2020-02-21 | 鹤山市世安电子科技有限公司 | Method, device and equipment for controlling tolerance of crimping hole and storage medium |
| CN111683456A (en) * | 2020-03-17 | 2020-09-18 | 深圳市昶东鑫线路板有限公司 | Method for manufacturing back-drilled printed circuit board |
| CN112188742A (en) * | 2020-10-19 | 2021-01-05 | 东莞森玛仕格里菲电路有限公司 | Manufacturing method of circuit board with back drilling structure with equal size |
| CN113245789A (en) * | 2021-04-27 | 2021-08-13 | 江阴华力胜工程材料有限公司 | Manufacturing method of taper hole reinforced anchor plate |
| CN114423161A (en) * | 2021-12-27 | 2022-04-29 | 生益电子股份有限公司 | PCB processing method and PCB |
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| CN103002674A (en) * | 2012-09-03 | 2013-03-27 | 杭州华三通信技术有限公司 | PCB (printed circuit board) back drilling method and PCB through hole structure |
| US20150173201A1 (en) * | 2013-12-17 | 2015-06-18 | International Business Machines Corporation | Adding test access to a back-drilled via |
| CN107580426A (en) * | 2016-07-04 | 2018-01-12 | 北大方正集团有限公司 | The preparation method and PCB interconnected between PCB layer |
| CN108323019A (en) * | 2018-03-28 | 2018-07-24 | 生益电子股份有限公司 | The upper back drilling methods of PCB |
-
2018
- 2018-09-12 CN CN201811059174.XA patent/CN109348621A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103002674A (en) * | 2012-09-03 | 2013-03-27 | 杭州华三通信技术有限公司 | PCB (printed circuit board) back drilling method and PCB through hole structure |
| US20150173201A1 (en) * | 2013-12-17 | 2015-06-18 | International Business Machines Corporation | Adding test access to a back-drilled via |
| CN107580426A (en) * | 2016-07-04 | 2018-01-12 | 北大方正集团有限公司 | The preparation method and PCB interconnected between PCB layer |
| CN108323019A (en) * | 2018-03-28 | 2018-07-24 | 生益电子股份有限公司 | The upper back drilling methods of PCB |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110475432A (en) * | 2019-08-08 | 2019-11-19 | 沪士电子股份有限公司 | A kind of pcb board and its manufacture and back drilling method |
| CN110831326A (en) * | 2019-10-21 | 2020-02-21 | 鹤山市世安电子科技有限公司 | Method, device and equipment for controlling tolerance of crimping hole and storage medium |
| CN110831326B (en) * | 2019-10-21 | 2021-07-09 | 鹤山市世安电子科技有限公司 | Method, device and equipment for controlling tolerance of crimping hole and storage medium |
| CN111683456A (en) * | 2020-03-17 | 2020-09-18 | 深圳市昶东鑫线路板有限公司 | Method for manufacturing back-drilled printed circuit board |
| CN112188742A (en) * | 2020-10-19 | 2021-01-05 | 东莞森玛仕格里菲电路有限公司 | Manufacturing method of circuit board with back drilling structure with equal size |
| CN113245789A (en) * | 2021-04-27 | 2021-08-13 | 江阴华力胜工程材料有限公司 | Manufacturing method of taper hole reinforced anchor plate |
| CN114423161A (en) * | 2021-12-27 | 2022-04-29 | 生益电子股份有限公司 | PCB processing method and PCB |
| WO2023123909A1 (en) * | 2021-12-27 | 2023-07-06 | 生益电子股份有限公司 | Pcb processing method and pcb |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190215 |
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| RJ01 | Rejection of invention patent application after publication |